IC tag-attached backing paper stack for books

Abstract

To provide a stack of backing boards with an IC tag which generates less misalignment of the shape while having an IC tag.SOLUTION: In a stack of backing boards 1 with an IC tag for books formed by stacking backing boards with an IC tag with an IC chip for books on one another in a thickness direction of the backing boards, the positions of the IC chip of stack of backing boards with an IC tag for books are different from the positions of the IC chips of backing boards with an IC tag for books adjacent to each other in a stacking position so that they do not overlap in planer view of the stack of backing boards with an IC tag for books.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a stack of IC tag-equipped mounts for books, in which a plurality of IC tag-equipped mounts for books are stacked, and also to a method for manufacturing the stack. [Background technology]

[0002] By attaching IC tags using IC inlets to books, magazines, and other booklets, it is becoming possible to carry out general logistics management, including production history management and sales management at retail stores. This will enable more detailed management and is expected to increase convenience for consumers who purchase booklets.

[0003] Patent Document 1 discloses that a mount with an IC tag, which has a non-contact IC tag with an IC chip and an antenna, is attached to a book. By placing the IC chip near the center of a notch in a flat sheet of paper with a flexible portion, excessive pressure load on the IC chip is prevented when books are stacked. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-014611 Summary of the Invention [Problem to be solved by the invention]

[0005] When attaching IC tag-equipped backing sheets to booklets, it is necessary to continuously supply IC tag-equipped backing sheets to the binding machine. In this case, multiple IC tag-equipped backing sheets are stacked on the feeder. If the IC chips on the IC tag-attached mounts are all in the same position when viewed in plan, they will be stacked without gaps where the IC chips are located. On the other hand, gaps will form between the mounts in areas where there are no IC chips, which increases the likelihood that the mounts will droop without support and cause the stack to become irregular in shape. If the shape of the stack becomes irregular, the IC tag-attached backing paper may not be fed smoothly into the binding machine, which may reduce the efficiency of the attachment work.

[0006] In view of the above circumstances, the present invention aims to provide a collection of IC tag-attached mounts that are less likely to have irregular shapes while still carrying IC tags. [Means for solving the problem]

[0007] The first aspect of the present invention is a card having an IC tag with an IC chip attached to a mount. Multiple Includes IC tag for books The backing sheets are separated and the IC tag attached side is on the same side. This is a collection of mounts with IC tags for books, stacked in the thickness direction of the mounts. In this stack, the position of the IC chip on each IC tag mount for books is different so that it does not overlap with the position of the IC chip on an adjacent IC tag mount for books in the stacking direction when viewed in a plane of the stack. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a collection of IC tag-attached mounts that are less likely to have irregular shapes while carrying IC tags. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view showing a collection of IC tag-attached mount sheets for books according to a first embodiment of the present invention; [Figure 2] 10(a) and 10(b) are plan views showing IC tag-attached mounts for books that constitute the same IC tag-attached mount-sheet collection for books. [Figure 3] 10 is a plan view showing a book IC tag-attached mount according to a modified example of the same stack of book IC tag-attached mounts. FIG. [Figure 4] FIG. 10 is a plan view showing a mount with an IC tag for books according to a modified example. [Figure 5] FIG. 10 is a plan view showing an IC tag-attached mount for books according to a second embodiment of the present invention. [Figure 6] 10A to 10C are diagrams showing a process for manufacturing the IC tag-attached mount for a book according to an example. [Figure 7] FIG. 10 is a schematic cross-sectional view showing a modified example of an IC tag-attached mount for books according to the present invention. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a modified example of an IC tag-attached mount for books according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view showing a collection 1 of IC tag-attached mount sheets for books (hereinafter simply referred to as "the collection") according to this embodiment. The collection 1 is formed by stacking a large number of IC tag-attached mount sheets for books of the same shape and size in the thickness direction.

[0011] Fig. 2 shows an IC tag-attached mount for books (hereinafter simply referred to as "tagged mount") according to this embodiment. In this embodiment, two types of tag-attached mounts are used: a tag-attached mount 10A shown in Fig. 2(a) and a tag-attached mount 10B shown in Fig. 2(b). Below, the configuration of the tag-attached mount in this embodiment will be described using the tag-attached mount 10A as an example.

[0012] The tag-attached mount 10A has a mount 11 and an IC tag 20A attached to the mount 11. Various types of paper can be used for the mount 11, and the dimensions of each part, including the planar shape and thickness, can be determined appropriately depending on the booklet or the like to be attached.

[0013] The basic configuration of the IC tag 20A is well known, and includes a substrate 21 having an antenna 22 provided on one surface thereof, and an IC chip 25 electrically connected to the antenna. A sheet made of paper, plastic, or the like can be used as the base material 21. The antenna 22 can be formed by etching a metal layer or arranging metal wires, etc. Various information including basic information about the booklet to be attached and individual information for identifying each booklet is selected and stored in the IC chip 25 as appropriate according to the management mode, management purpose, etc.

[0014] 2(a), the IC chip 25 is attached to a position spaced to the left of the longitudinal center of the IC tag 20A, so that the position where the IC chip 25 is attached is spaced apart from the center of the IC tag 20A in a plan view. The IC tag 20B differs from the IC tag 20A only in the attachment position of the IC chip 25, which is attached to a position away to the right from the longitudinal center of the IC tag 20B as shown in Fig. 2(b). Therefore, the attachment position of the IC chip 25 is away from the center of the IC tag 20B in a plan view.

[0015] In IC tags 20A and 20B, antenna 22 extends along the center line in the width direction, and the distance between the longitudinal center and IC chip 25 is the same, so that when one is rotated 180 degrees, it becomes the same as the other. Therefore, by manufacturing only IC tag 20A and attaching it to mount 11 as is to produce a tag-attached mount, and by rotating it 180 degrees and attaching it to mount 11, two types of tag-attached mounts 10A and 10B that make up the aggregate can be easily manufactured. There are no particular limitations on the manner in which the IC tags 20A and 20B may be attached to the mount 11, but a simple method is to provide an adhesive layer on one side of the base material 21 to form a label and attach it to the mount 11.

[0016] The stack 1 is formed by alternately stacking tag-attached mounts 10A and tag-attached mounts 10B in the position shown in FIG. In the formed assembly 1, all IC tags are in the same position and overlap each other in a plan view, but the position of IC chip 25 is different from that of any tag-attached mount adjacent to it in the thickness direction (stacking direction). In other words, in assembly 1, a positional relationship is ensured in which the IC chip of any tag-attached mount does not overlap with the IC chip of the tag-attached mount adjacent to it above or below in a plan view.

[0017] Therefore, there is no continuous area of ​​IC chips 25 in the thickness direction of the stack 1, and each mount 11 is appropriately supported by the IC chip 25 located below it. As a result, the phenomenon of a portion of the mount 11 drooping significantly is suppressed, and even when installed in a feeder, tagged mounts can be continuously and optimally supplied to a bookbinding machine. Furthermore, since the IC chips in the attached booklets have multiple patterns of position in a plan view, they are less likely to become unstable when stacked during distribution or in stores.

[0018] In this embodiment, the configuration of the IC tag can be modified in various ways. In IC tags 20C and 20D attached to modified tag-attached mounts 10C and 10D shown in Fig. 3, the antenna 22 extends at a position spaced apart in the width direction from the center line of the IC tag, and the IC chip 25 is disposed on the longitudinal center line. In IC tag 20C, the antenna 22 is positioned above the center line of the IC tag in the width direction, while in IC tag 20D, the antenna 22 is positioned below the center line of the IC tag in the width direction.

[0019] In this modification, IC tags 20C and 20D are also in a relationship where one becomes identical to the other when rotated 180 degrees. Therefore, as in the above embodiment, two types of tag-attached mounts that make up the assembly can be easily manufactured.

[0020] 4, the tag-attached mounts 10E and 10F are attached so that the centers of the IC tags 10A and 10B, respectively, coincide with the center of mount 11. As a result, tag-attached mounts 10E and 10F are in a relationship whereby when one is rotated 180 degrees, it becomes identical to the other. Therefore, by mass-producing tag-attached mounts 10E and rotating half of them 180 degrees, the two types of tag-attached mounts required to form aggregate 1 can be easily prepared.

[0021] The number of types of tag-attached mounts constituting the collection is not limited to two, but may be any number of types equal to or greater than three. Furthermore, although the manufacturing advantages described above would be lost, the multiple IC tags used do not have to include two types of tags that are identical to each other when rotated 180 degrees. In this case, one of the multiple IC tags may be one whose IC chip position does not change in a planar view even when rotated.

[0022] A second embodiment of the present invention will be described with reference to Figures 5 and 6. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0023] 5 shows tag-attached mounts 10G and 10H according to this embodiment. The IC tags 120 attached to the tag-attached mounts 10G and 10H each have the same base material 21, antenna 22, and IC chip 25 as the IC tag 20A of the first embodiment, but because the IC chip 25 is attached to the center of the IC tag 120 in a plan view, the position of the IC chip 25 does not change even if the IC tag 120 is rotated. As shown in FIG. 5, the tag-attached mounts 10G and 10H are common in that they include a mount 11 and an IC tag 120, and differ only in the position where the IC tag 120 is attached.

[0024] The stack according to this embodiment is formed by alternately stacking tag-attached mounts 10G and tag-attached mounts 10H in the position shown in FIG. The aggregate of this embodiment, like the aggregate of the first embodiment, has a positional relationship such that the IC chips on any tagged mount do not overlap in a planar view with the IC chips on adjacent tagged mounts in the stacking direction, thereby achieving the same effect as the first embodiment.

[0025] An example of a manufacturing procedure for the tag-attached mount 10G and the tag-attached mount 10H will be described. A label roll or the like on which a large number of IC tags 120 with adhesive layers are formed is set in a labeler 100 as shown in Fig. 6, and a backing sheet 11 is fed from a feeder 101. A first sensor 102 and a second sensor 103 are arranged to detect the edges of the backing sheet 11, and when the first sensor 102 detects the edge of the backing sheet 11, the labeler 100 attaches the IC tag 120 to the backing sheet, producing a tagged backing sheet 10G, and when the second sensor 103, located downstream of the first sensor 102, detects the edge of the backing sheet 11, the labeler 100 attaches the IC tag 120 to the backing sheet, producing a tagged backing sheet 10H. Therefore, by operating the labeler 100 so as to alternately produce the tag-attached mounts 10G and the tag-attached mounts 10H, a stack can be automatically formed in a stocker where the produced tag-attached mounts are piled up.

[0026] In the above-described manufacturing method, it is not necessary to use multiple sensors. For example, by providing only one sensor and having the labeler 100 alternately attach the IC tag 120 to the mount immediately after detecting the edge of the mount 11 and then attaching the IC tag 120 to the mount after a predetermined time (e.g., 0.1 seconds) has elapsed since detecting the edge of the mount 11, multiple types of tag-attached mounts with different IC tag 120 attachment positions can be produced, and an aggregate can be similarly formed.

[0027] Although each embodiment of the present invention has been described, the specific configuration is not limited to this embodiment, and configuration changes and combinations within the scope of the gist of the present invention are also included. Some examples of changes are shown below, but these are not all inclusive, and other changes are also possible. Two or more of these changes may be combined as appropriate.

[0028] In the tag-attached mount of the present invention, a paper layer may be attached to cover the IC tag. This allows various printing and other printing to be performed on the area where the IC tag is attached, making it easier to adapt to booklets. If the formed printing layer is covered with an overcoat layer made of resin or the like, it is possible to prevent show-through when other pages of the booklet come into contact with the printed layer. As another method, the base material 21 of the IC tag can be made of paper, and an adhesive layer 30 can be provided on the surface on which the antenna 22 and IC chip 25 are arranged, as shown in Fig. 7, thereby enabling printing on the part where the IC tag is attached without providing a paper layer. This configuration also has the advantage of enabling printing, etc., without increasing the thickness of the IC tag.

[0029] When an adhesive layer is provided on an IC tag, a non-adhesive portion 40 may be provided on the peripheral edge of the surface of the substrate 21 on which the adhesive layer 30 is provided, as shown in Figure 8. In this way, the adhesive layer 30 is surrounded by the non-adhesive portion 40 in a planar view of the IC tag. Therefore, even if the area of ​​the adhesive layer 30 in a planar view increases and spreads over the non-adhesive portion 40 due to pressure when attaching the IC tag, the adhesive layer 30 does not adhere to the non-adhesive portion 40, and when the pressure is released, the area in a planar view returns to its original size. As a result, the adhesive layer 30 is prevented from protruding from the substrate 21 in a planar view of the IC tag, and problems such as the protruding adhesive layer sticking to other pages can be effectively prevented. The non-adhesive portion 40 can be formed by applying and drying an easy-release agent, or by a known adhesive-killing treatment. This effect can be further enhanced by making the area where the adhesive layer is provided slightly smaller than the planar dimensions of the substrate, so that the adhesive layer 30 does not protrude from the substrate 21 when viewed in plan, even when the maximum expected pressure is applied.

[0030] The shape of the antenna of the IC tag is not limited to that shown in the above embodiment, but can be set appropriately depending on the required communication characteristics, etc.

[0031] The effects of the present invention are achieved when adjacent IC chips in the stacking direction are offset by at least one IC chip so that they do not overlap in a planar view. Specifically, the IC chips are preferably spaced apart by 0.5 mm or more in a planar view of the assembly. Furthermore, considering ease of manufacture, it is more preferable that the IC chips be spaced apart by a distance of at least 5 mm plus the dimensions of the IC tag (particularly the short side). For example, if the dimensions of the IC tag are 20 mm x 75 mm, it is more preferable that the IC chips be spaced apart by 25 mm or more, which is 20 mm plus 5 mm. [Explanation of symbols]

[0032] 1. Collection of IC tag-equipped backing sheets for books 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H IC tag mount for books 11 Mount 20A, 20B, 20C, 20D, 120 IC tag 21 Base material 22 Antenna 25 IC chip

Claims

1. A collection of IC tagged mounts for books, each of which has an IC tag having an IC chip attached to the mount, is stacked in a thickness direction of the mount in a separated state with the surfaces to which the IC tags are attached being on the same side, The position of the IC chip of each of the IC tag-attached mounts for books is different so as not to overlap with the position of the IC chip of an IC tag-attached mount for books adjacent in the stacking direction in a plan view of the collection of IC tag-attached mounts for books. A collection of backing sheets with IC tags for books.

2. The IC tag has a substrate and an antenna formed on the substrate, and the IC chip is electrically connected to the antenna.

2. The IC tag-attached mount collection for books according to claim 1.

3. a plurality of IC tag-attached mounts for books, each mount having an IC tag attached at a different position; 3. The IC tag-attached mount collection for books according to claim 2.

4. a plurality of IC tag-attached mounts for books, each having the IC tag attached at the same position on the mount and the IC chip at a different position on the IC tag; 3. The IC tag-attached mount collection for books according to claim 2.

5. the IC chip is attached at a position away from the center of the IC tag in a plan view; The collection of IC tag-attached mount sheets for books according to any one of claims 2 to 4.

6. An assembly of IC tagged backing sheets for books, in which IC tagged backing sheets for books, each having an IC tag with an IC chip attached to the backing sheet, are stacked in the thickness direction of the backing sheet, The position of the IC chip of each of the IC tag-attached mounts for books is different so as not to overlap with the position of the IC chip of an IC tag-attached mount for books adjacent in the stacking direction in a plan view of the aggregate of IC tag-attached mounts for books, the IC tag has a paper layer covering the IC chip; The paper layer has a printing layer and an overcoat layer that covers the printing layer. A collection of backing sheets with IC tags for books.

7. An assembly of IC tagged mounts for books, in which IC tagged mounts for books, each having an IC tag with an IC chip attached to the mount, are stacked in the thickness direction of the mount, The position of the IC chip of each of the IC tag-attached mounts for books is different so as not to overlap with the position of the IC chip of an IC tag-attached mount for books adjacent in the stacking direction in a plan view of the aggregate of IC tag-attached mounts for books, The IC tag is The sheet is bonded to the mount by an adhesive layer provided on one surface thereof, a non-adhesive layer surrounding the adhesive layer in a plan view is provided on the one surface; A collection of backing sheets with IC tags for books.

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