Heat-sensitive stretchable device

Abstract

To provide a heat-sensitive flexible-moving device that allows increased difference in thermal expansion coefficient between constituent materials of a heat-sensitive member and can achieve larger flexible amounts using reduced heat-sensitive members.SOLUTION: A heat-sensitive flexible-moving device comprises a heat-sensitive member comprising one material composed of a resin and the other material composed of a metal or a resin having a lower thermal expansion coefficient than that of the resin of the one material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat-sensitive stretchable movable device, and more specifically to a heat-sensitive stretchable movable device made of a heat-sensitive member formed by bonding together two materials with different thermal expansion coefficients, one of which is made of resin and the other of which is made of metal or resin with a low thermal expansion coefficient, thereby achieving a large amount of expansion and contraction with a smaller number of heat-sensitive members. [Background technology]

[0002] Existing technology includes a heat-sensitive expansion and contraction moving part made of bimetal (two metals with different thermal expansion coefficients bonded together). However, since the difference in the thermal expansion coefficients of the two metals is not that great, the number of sheets increases in order to obtain a large expansion amount, making miniaturization difficult. For example, an alloy of iron and nickel has a thermal expansion coefficient of 1 to 2 (×10 -6 / ℃), and the thermal expansion coefficient of copper is 16.5 (×10 -6 / ℃), and the difference is 14.5 to 15.5 (×10 -6 / ℃), and multiplying this by the temperature difference gives the amount of expansion and contraction per meter, but it is not a very large value. The only way to obtain a large amount of expansion and contraction is to increase the number of sheets. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 7-317945 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a heat-sensitive stretchable movable device that can increase the difference in thermal expansion coefficients of the members that make up the heat-sensitive member, thereby achieving a large amount of stretch with fewer heat-sensitive members. [Means for solving the problem]

[0005] The heat-sensitive expandable movable device according to the present invention is characterized in that it is composed of a heat-sensitive member made of one material which is resin and another material which is metal having a thermal expansion coefficient lower than that of the resin.

[0006] The heat-sensitive expandable movable device according to the present invention is characterized in that it is composed of a heat-sensitive member made of one material which is a resin and another material which is a resin having a thermal expansion coefficient lower than that of the resin. [Effects of the Invention]

[0007] According to the heat-sensitive stretchable movable device of the present invention, one material is made of resin and the other material is a heat-sensitive member made of metal or resin with a low thermal expansion coefficient, so a large amount of warping can be expected. A larger amount of expansion and contraction can be obtained compared to conventional bimetals, and the number of parts in the heat-sensitive stretchable movable device can be reduced. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing an embodiment of a heat-sensitive member according to the present invention, in which one heat-sensitive member is made of a resin material and the other heat-sensitive member is made of a resin or metal material and bonded together. [Figure 2] 1 is a diagram showing an embodiment of a heat-sensitive member according to the present invention, in which one side is made of a resin material and the other side is made of a resin material and bonded together. [Figure 3] 10 is an explanatory diagram showing that the warpage width of the heat-sensitive member 9 varies depending on the difference in thermal expansion coefficient. FIG. [Figure 4] 1 is an explanatory diagram showing that a heat-sensitive expandable movable device according to the present invention is configured by arranging a plurality of disc-shaped heat-sensitive members. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, the heat-sensitive stretchable movable device of the present invention will be described in detail with reference to the drawings. [Example]

[0010] FIG. 1 shows an embodiment of a heat-sensitive member 9 according to the present invention, in which one side is made of a resin material and the other side is made of a resin or metal material, bonded together. For the heat-sensitive member 9, PI, PEEK, or a similar resin with a large linear thermal expansion coefficient is selected as the material with a large linear thermal expansion coefficient. Metals (SUS304, SUS316, Hastelloy C22, SS400, S45C, tungsten, or similar metals with a small linear thermal expansion coefficient) are selected as the material with a small linear thermal expansion coefficient.

[0011] For example, if one material has a thermal expansion coefficient of 56 (×10 -6 / ℃), and the other material has a thermal expansion coefficient of 17.3 (×10 -6 / ℃) for SUS304, the difference is 38.7 (×10 -6 / °C). In another example, if one material has a thermal expansion coefficient of 47 (×10 -6 / ℃), and the other material has a thermal expansion coefficient of 17.3 (×10 -6 / ℃) for SUS304, the difference is 29.7 (×10 -6 / ℃).

[0012] As shown in Figure 1, one material can be resin and the other material can be resin instead of metal. The (resin, metal) bond is not a bimetal bonded (metal, metal), but a "half metal (resin, metal)" because only one side is metal. As shown in the lower part of Figure 1, the heat-sensitive member 9 is made by bonding materials with different thermal expansion coefficients, so it bends when heated.

[0013] FIG. 2 shows an example of a heat-sensitive member 9 according to the present invention, in which one material is made of a resin and the other is also made of a resin, and they are bonded together. FIG. 1 specifically explains the "half-metal (resin, metal)" configuration, in which one material is PI, PEEK, or an equivalent resin with a large linear thermal expansion coefficient, and the other material is metal. However, FIG. 2 shows the (resin, resin) configuration of FIG. 1, i.e., an example of "biplastic (resin, resin)." In this case, PI, PEEK, or an equivalent resin with a small linear thermal expansion coefficient is used for one material with a small thermal expansion coefficient, and PTFE, PFA, or an equivalent resin with a large linear thermal expansion coefficient is used for the other material with a large thermal expansion coefficient. As an example, one material has a thermal expansion coefficient of 120 (×10 -6 / ℃), and the other material has a thermal expansion coefficient of 47 (×10 -6 / ℃), the difference is 73(×10 -6 / ℃), and an even greater warpage can be expected compared to "bimetal" and "half metal".

[0014] FIG. 3 is an explanatory diagram showing that the warpage width of a heat-sensitive member 9 varies depending on the linear thermal expansion coefficient. FIG. 3(A) shows a conventional heat-sensitive member 9 made by bonding two metals together. FIG. 3(B) shows a heat-sensitive member 9 made by bonding resin to metal, or resin to resin. FIG. 4(B), which shows two heat-sensitive members 9 with a large difference in linear thermal expansion coefficient, bends more than FIG. 4(A), which shows two heat-sensitive members 9 with a small difference in linear thermal expansion coefficient.

[0015] FIG. 4 is an explanatory diagram showing a heat-sensitive, stretchable, movable device 3 configured by arranging a plurality of disc-shaped heat-sensitive members 9. FIG. 4(A) shows a case where the heat-sensitive, stretchable, movable device 3 is configured by a heat-sensitive member (bimetal) with a small warping width, and FIG. 4(B) shows a case where the heat-sensitive, stretchable, movable device 3 is configured by a heat-sensitive member 9 (half-metal or biplastic) with a large warping width. Compared to FIG. 4(A), FIG. 4(B) has fewer heat-sensitive members. When the heat-sensitive member 9 receives heat and its temperature rises, its central portion expands outward. Therefore, the number of heat-sensitive members 9 with a small warping width (A) is greater than the number of heat-sensitive members 9 with a large warping width (B). Therefore, a heat-sensitive member with a large warping width reduces the number of parts in the heat-sensitive, stretchable, movable device, allowing for miniaturization. [Industrial Applicability]

[0016] The present invention is used as a heat-sensitive expandable movable device made of a plurality of heat-sensitive members bonded together, each of which is made of resin and metal, or resin and resin, and is therefore suitable for use as a drain valve for a steam pipe that has a large amount of expansion and contraction. [Explanation of symbols]

[0017] 3. Heat-sensitive stretchable device 9 Heat-sensitive material

Claims

1. A heat-sensitive expandable movable device in which a plurality of disc-shaped heat-sensitive members are stacked so that their central portions expand outward when the temperature rises, the heat-sensitive member is made of a resin as one material and a resin having a thermal expansion coefficient lower than that of the resin as the other material, A heat-sensitive stretchable movable device, characterized in that one of the resins is made of PFA (perfluoroalkoxyalkane) or PTFE (polytetrafluoroethylene), and the other resin is PEEK (polyether ether ketone).

2. A heat-sensitive expandable movable device comprising a plurality of stacked disc-shaped heat-sensitive members arranged facing each other so that their central portions expand outward when the temperature rises, the heat-sensitive member is made of a resin as one material and a resin having a thermal expansion coefficient lower than that of the resin as the other material, A heat-sensitive stretchable movable device, characterized in that one of the resins is PFA (perfluoroalkoxyalkane) with a thermal expansion coefficient of 120 (×10 −6 / °C), and the other resin is PEEK (polyether ether ketone) with a thermal expansion coefficient of 47 (×10 −6 / °C).

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