Cutting blade

Abstract

To provide a cutting blade that can cut off a fragile material with a high quality over a long time.SOLUTION: A cutting blade 100 is configured so that a blade main body 10 that is rotated around an axis line cuts off a material to be cut, with a cutting edge 11A. The blade main body 10 comprises a resin bond phase 20 formed in a discoid shape and made of resin, abrasive grains 30 that is dispersed in the resin bond phase 20; fillers 40 that are dispersed in the resin bond phase 20; and the cutting edge 11A arranged at an outer periphery part 11 of the resin bond phase 20. The fillers 40 include fillers made of titanium boride (TiB2).SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a cutting blade used for cutting brittle materials such as glass and ceramics.

Background Art

[0002] Conventionally, in the processing of cutting a workpiece made of a brittle material (hard and brittle material) such as glass and ceramics (used for semiconductor products, etc.) by performing grooving or cutting to fragment it (in this specification, these processes are collectively referred to as cutting or simply cutting), high quality is required.

[0003] In order to perform such cutting with high quality, for example, a cutting blade (thin grinding wheel) in which abrasive grains are dispersed in a resin bond phase is used. The cutting blade includes, for example, a blade body having a circular plate shape, and a cutting edge formed on the outer peripheral edge of the blade body. The blade body includes a resin bond phase made of resin, and abrasive grains (superabrasive grains) made of diamond or cBN (cubic boron nitride) dispersed in the resin bond phase.

[0004] By the way, as electronic material components cut and manufactured by the above cutting blade, those cut from a semiconductor wafer like the above semiconductor element, divided, mounted on a lead frame, and resin molded, or, for example, a large number of elements are collectively mounted on a lead frame, molded, and then collectively cut and fragmented into individual pieces, such as QFN (quad flat non - leaded package), or an IrDA (Infrared Data Association) standard optical transmission module (hereinafter simply abbreviated as IrDA) having a substrate formed on the inner peripheral surface of through - holes formed in a glass epoxy resin substrate and plated with Ni, Au, Cu, etc., and fragmented by cutting is known.

[0005] When cutting such electronic material components, for example, with QFNs, it is necessary to cut a highly ductile metal lead frame such as Cu placed in the molding resin. This presents a problem in that metal burrs are easily generated on the lead frame depending on the feed direction and rotation direction of the cutting blade during cutting.

[0006] Therefore, to improve the wear resistance of cutting blades, materials such as SiC or Al2O3 are sometimes added. However, cutting blades that only contain SiC or Al2O3 have the problem that when cutting electronic material components, the superabrasive grains tend to fall off, causing the cutting edge to be lost quickly, and it has been difficult to suppress burr formation over the long term.

[0007] Furthermore, as the cutting edge of a cutting blade deteriorates due to the shedding of superabrasive grains, cutting resistance increases. Therefore, frequent dressing of the cutting blade is necessary, such as performing intermediate dressing during the cutting process or initial dressing to maintain the initial cutting edge. Such dressing work can lead to a decrease in operating rate and work efficiency.

[0008] On the other hand, in cutting devices used to cut electronic material components, zero-point detection is common, and conductivity is sometimes required in order to reliably detect the zero point using electrical means by making the cutting blade conductive. On the other hand, since the resin bond phase is generally insulating, conductive materials such as carbon are sometimes added to the cutting blade to impart conductivity. However, adding carbon to the resin bond phase reduces wear resistance, resulting in further deterioration of cutting performance due to the shedding of superabrasive grains.

[0009] Therefore, for example, when cutting electronic material components such as QFN and IrDA, a cutting blade has been disclosed that incorporates WC (tungsten carbide) powder to improve wear resistance, reliably prevent burr formation over a long period of time, and impart conductivity (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] Japanese Patent Publication No. 2006-062009 [Overview of the project] [Problems that the invention aims to solve]

[0011] However, while the cutting blade described in Patent Document 1 above has improved wear resistance and can be easily imparted conductivity by using WC (tungsten carbide), it is difficult to rotate it at high speed due to the weight of the WC, which may reduce cutting performance. Furthermore, for example, using water during the cutting process can cause the abrasive grains to easily fall off, making it difficult to maintain sufficient cutting performance.

[0012] This invention has been made in view of these circumstances, and aims to provide a cutting blade that can cut brittle materials with high quality even when nearing the end of its lifespan. [Means for solving the problem]

[0013] To solve these problems and achieve the aforementioned objectives, the present invention proposes the following means. (1) A first aspect of the present invention is a cutting blade in which a blade body rotated around an axis cuts a material to be cut with a cutting edge, wherein the blade body comprises a resin bond phase formed in the shape of a disc and made of resin, abrasive grains dispersed in the resin bond phase, a filler dispersed in the resin bond phase, and a cutting edge arranged on the outer circumference of the resin bond phase, wherein the filler contains a filler made of titanium boride (TiB2).

[0014] According to the cutting blade of the present invention, the blade body comprises a resin bond phase made of resin, abrasive grains dispersed in the resin bond phase, and fillers dispersed in the resin bond phase. In this embodiment, the fillers are all made of titanium boride (TiB2). Titanium boride (TiB2) has excellent wear resistance, maintaining its wear resistance over long periods of time, and can suppress the increase in cutting resistance during cutting processes when cutting brittle materials. Furthermore, because titanium boride (TiB2) has excellent water resistance, even when cutting the material while applying water, the detachment of abrasive grains and fillers made of titanium boride (TiB2) from the resin bond phase is suppressed, making it possible to cut brittle materials with high quality even near the end of its lifespan. In other words, it is possible to extend the lifespan of the cutting blade. As a result, the cutting resistance when cutting brittle materials is reduced, suppressing chipping of the cut material's corners (e.g., chipping of the back surface corners) and other damage, and enabling stable, high-quality cutting over a long period of time.

[0015] Furthermore, the titanium boride (TiB2) filler possesses both wear resistance and conductivity, making it possible to impart conductivity to the blade body by dispersing it. Furthermore, electrical conductivity can be easily ensured even without the inclusion of carbon, and the position of the cutting blade relative to the material being cut can be easily detected.

[0016] Furthermore, titanium boride (TiB2) is lighter than WC (tungsten carbide), and the superabrasive grains are less likely to fall off even when water is applied during cutting. This suppresses damage to the blade body even when cutting at high rotational speeds, allowing for efficient cutting of the material to be cut.

[0017] Also, even when the manufacturing process of the cutting blade includes a step (sintering step) in which the blade body (blade body material) is heated to about 250 °C, titanium boride (TiB2) does not deteriorate and does not diffuse (bond) into the resin bond phase. Therefore, the above-described actions and effects can be obtained stably and reliably.

[0018] (2) For the cutting blade described in (1) above, the content rate of the entire filler containing titanium boride (TiB2) is preferably 20 vol% or more and 50 vol% or less with respect to the blade body.

[0019] According to the cutting blade of the present invention, since the content rate of the entire filler containing titanium boride (TiB2) is 20 vol% or more and 50 vol% or less with respect to the blade body, an appropriate bonding force is ensured and the abrasives can be prevented from falling off. Note that setting the content rate of the filler to 20% or more enables sufficient bonding force to be provided to the resin bond phase, suppressing the abrasives and the filler from falling off from the blade body, and maintaining high-quality cutting over a long period of time. As a result, brittle materials can be cut with high quality over a long period of time. On the other hand, when the content rate of the filler exceeds 5%, the bonding force of the resin bond phase decreases, the abrasives are likely to fall off, and the machining performance and wear resistance decrease. Therefore, the content rate of the filler is preferably 50 vol% or less with respect to the blade body.

[0020] (3) For the cutting blade described in (1) or (2) above, the average particle size of the filler made of titanium boride (TiB2) is preferably 1 μm or more and 15 μm or less.

[0021] According to the cutting blade of the present invention, since the average particle size of the filler made of titanium boride (TiB2) is 1 μm or more and 15 μm or less, the abrasives are sufficiently dispersed in the resin bond phase in the blade body. As a result, sufficient durability is ensured and good machining performance can be obtained. Making the average particle size of the filler composed of titanium boride (TiB2) 1 μm or more enables the filler to be stably obtained and a cutting blade with stable quality to be manufactured. Also, making the average particle size larger than 15 μm is not preferable because it becomes difficult to sufficiently disperse the abrasive grains in the blade body and it becomes difficult to stably ensure sufficient machining performance.

Advantages of the Invention

[0022] According to the cutting blade of the present invention, since the filler contains a filler composed of titanium boride (TiB2), the falling off of the abrasive grains from the resin bond phase is suppressed, and even when the life is approaching, a brittle material can be cut with high quality over a long period of time.

Brief Description of the Drawings

[0023] [Figure 1] It is a side view for explaining the schematic configuration of the cutting blade according to an embodiment of the present invention. [Figure 2] It is a cross-sectional view taken along the line II-II in FIG. 1 for explaining the schematic configuration of the cutting blade according to an embodiment. [Figure 3] It is an enlarged view of the portion indicated by III in FIG. 2 for explaining the schematic configuration of the cutting blade according to an embodiment. [Figure 4] It is a conceptual diagram for explaining the outline of evaluation items in an example related to the cutting blade of the present invention, where (A) shows the schematic configuration of the evaluation object and (B) shows the definition of evaluation items.

Modes for Carrying Out the Invention

[0024] Hereinafter, referring to FIGS. 1 to 3, a cutting blade according to an embodiment of the present invention will be described. FIG. 1 is a side view for explaining the schematic configuration of the cutting blade according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1 for explaining the schematic configuration of the cutting blade. Also, FIG. 3 is an enlarged view of the portion indicated by III in FIG. 2 for explaining the schematic configuration of the cutting blade.

[0025] In Figures 1 to 3, reference numeral 100 denotes the cutting blade, reference numeral 10 denotes the blade body, reference numeral 11 denotes the outer surface, reference numeral 11A denotes the cutting edge, reference numeral 20 denotes the resin bond phase, reference numeral 30 denotes the superabrasive grains (abrasive grains), and reference numeral 40 denotes the filler.

[0026] In one embodiment, as shown in Figures 1 and 2, the cutting blade 100 is a cutting blade in which, for example, a blade body 10 that rotates around an axis O cuts a material to be cut (not shown) with a cutting edge 11A. Furthermore, the cutting blade 100 is used for precision cutting of brittle materials (hard and brittle materials) such as glass, ceramics, and quartz, which are used in semiconductor devices (electronic material components).

[0027] Furthermore, although not specifically shown, the cutting blade 100 has a blade body 10 attached to the main shaft of the cutting device via a flange, and as it rotates around the central axis O of the blade body 10 and moves in a direction perpendicular to the central axis O (for example, in the height direction), the cutting edge 11A of the outer peripheral edge of the blade body 10 that protrudes radially outward from the flange cuts the material to be cut. In this specification, the direction along the central axis O of the blade body 10 is sometimes referred to as the width direction, the direction perpendicular to the central axis O is sometimes referred to as the radial direction, and the direction that circles around the central axis O is sometimes referred to as the circumferential direction.

[0028] Note that in Figure 2, the thickness of the blade body 10 is shown to be thicker than it actually is for illustrative purposes. Also, a circular mounting hole 13 is formed in the radial center of the blade body 10 (on the central axis O), with the central axis O as the center and penetrating the blade body 10 in the width direction. Therefore, the blade body 10 is specifically an annular plate shape. In other words, the term "circular plate-shaped blade body 10" as used herein includes the meaning of an annular plate shape.

[0029] As shown in Figures 1 and 2, the cutting blade 100 comprises, for example, a resin bond phase 20 formed in the shape of a disc and made of resin, superabrasive grains 30 dispersed in the resin bond phase 20, a filler 40 dispersed in the resin bond phase 20, and a cutting edge 11A positioned on the outer circumference of the resin bond phase 20. The dimensions of the cutting blade 100 can be set arbitrarily, but in this embodiment, the cutting blade 100 is set to, for example, an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of φ40 mm, and a thickness of t0.15 mm (for example, 0.1 mm or more and 0.3 mm or less).

[0030] As shown in Figure 3, the cutting edge 11A of the blade body 10 is formed by an outer peripheral surface 11 of the blade body 10 which has an extremely small width equal to the thickness of the blade body 10, the outer peripheral edges of both sides 12 facing in the width direction of the blade body 10, and the edge portion that forms an intersecting ridge line between these outer peripheral edges of the sides 12 and the outer peripheral surface 11.

[0031] The resin bond phase 20 is made of a thermosetting resin, such as a phenolic resin. As shown in Figures 1 and 2, the resin bond phase 20 is an annular plate shape with a central axis O. That is, the disc shape of the "disc-shaped resin bond phase 20" in this embodiment includes an annular plate shape having a hole in the center of the disc.

[0032] The resin bond phase 20 has mounting holes 13. The mounting holes 13 are located on the central axis O of the resin bond phase 20. The mounting holes 13 penetrate the resin bond phase 20 in the thickness direction. In other words, the mounting holes 13 open into a pair of side surfaces 12 of the resin bond phase 20 that face in the thickness direction. The mounting holes 13 are circular holes centered on the central axis O.

[0033] The thickness dimension (hereinafter referred to as "thickness") of the resin bond phase 20 is, for example, 0.15 mm (for example, 0.1 mm or more and 0.3 mm or less). The cutting edge 11A is annular in shape with a central axis O. The cutting edge 11A is positioned on the outer circumferential surface of the resin bond phase 20. The cutting edge 11A has a cutting width equal to the thickness of the resin bond phase 20.

[0034] The abrasive grains 30 consist of, for example, diamond and cBN. However, a hard material other than diamond and cBN (provided it is harder than the resin bond phase 20) may be used as the abrasive grains 30. The average particle size of the abrasive grains 30 is, for example, 0.5 to 100 μm. The ratio of the volume of the abrasive grains 30 to the total volume of the blade body 10 (abrasive grain content) is, for example, 2.5 to 35%. Although not specifically shown in the figures, the outer surface (surface) of the abrasive grains 30 may be coated with a metallic material such as Ti.

[0035] The "average particle size" mentioned above represents the average particle size of a large number of superabrasive grains 30. For example, superabrasive grains 30 with a certain particle size range can be measured using a Microtrac (registered trademark) model MT3300EXII-SDC, and the average particle size can be calculated using a particle size representation based on the mesh size (see JIS B 4130:1998). In addition, the resin bond phase 20 contains fillers 40 dispersed in addition to the superabrasive grains 30.

[0036] Furthermore, the filler 40 in this embodiment is composed entirely of particulate titanium boride (TiB2) in the form of granules or powder. The titanium boride (TiB2) only needs to be formed in particulate form; its shape is not particularly limited. The average particle size of the filler 40, which is made of titanium boride (TiB2), can be set arbitrarily, but it is preferable that it be between 1 μm and 15 μm. In this embodiment, the average particle size of the titanium boride (TiB2) is, for example, 5 μm.

[0037] The reason for using titanium boride (TiB2) with an average particle size of 1 μm or more is that it allows for stable supply and enables the manufacture of cutting blades with consistent quality. Furthermore, if the average particle size is larger than 15 μm, it becomes difficult to adequately disperse the abrasive grains within the blade body, making it difficult to consistently ensure sufficient processing performance. Therefore, it is desirable to keep the average particle size at 15 μm or less. However, there are no particular problems with using titanium boride (TiB2) with an average particle size of less than 1 μm; in this respect, an average particle size of 15 μm or less is sufficient.

[0038] Furthermore, the content (vol%) (vol ratio) of the filler 40 made of titanium boride (TiB2) relative to the total volume of the blade body 10 can be set arbitrarily, for example, 20 vol% to 50 vol% is preferred. Moreover, the titanium boride (TiB2) content is more preferably 30 vol% to 50 vol%. In this embodiment, the titanium boride (TiB2) content is, for example, 35 vol%.

[0039] According to one embodiment of the cutting blade 100, the blade body 10 comprises a resin bond phase 20 made of phenolic resin, superabrasive grains 30 dispersed in the resin bond phase 20, and a filler 40 dispersed in the resin bond phase 20. Since the filler 40 contains a filler made of titanium boride (TiB2), the shedding of the superabrasive grains 30 from the resin bond phase 20 is suppressed, and wear resistance is maintained over a long period of time. As a result, according to one embodiment of the cutting blade 100, brittle materials can be cut with high quality (to processed products) over a long period of time. In other words, even near the end of its lifespan, it can cut brittle materials with high quality, thus achieving a long service life.

[0040] Furthermore, according to the cutting blade 100 of one embodiment, since titanium boride (TiB2) has excellent water resistance, even when cutting the material to be cut while applying water, the shedding of superabrasive grains 30 and filler 40 made of titanium boride (TiB2) from the resin bond phase 20 is suppressed, and the material to be cut can be cut with high quality over a long period of time.

[0041] Furthermore, according to the cutting blade 100 of one embodiment, conductivity can be imparted to the blade body 10 by titanium boride (TiB2), so that zero-point detection can be accurately performed in a cutting device for cutting electronic material components. Furthermore, since the cutting blade 100 can impart conductivity without the addition of carbon, abrasive grain shedding due to carbon addition does not occur, and high-quality cutting can be achieved while maintaining wear resistance over a long period of time.

[0042] Furthermore, according to the cutting blade 100 of one embodiment, the titanium boride (TiB2) content in the blade body 10 is set to 35 vol%, so that an appropriate bonding force is ensured and the shedding of abrasive grains can be suppressed.

[0043] As described above, according to the cutting blade 100 of one embodiment, even when water is used during cutting, wear resistance is maintained for a long period of time, the cutting resistance when cutting the material to be cut is reduced, chipping and other damage to the back corners of the material to be cut are suppressed, and high-quality cutting can be stably maintained. In addition, the tool life can be extended.

[0044] It should be noted that the present invention is not limited to the embodiments described above, and can be implemented with various modifications without departing from the spirit of the invention, as illustrated below.

[0045] For example, in the above embodiment, the case in which all of the filler 40 dispersed in the resin bond phase 20 is titanium boride (TiB2) was described, but it is sufficient that the filler 40 contains at least one filler made of titanium boride (TiB2), and it is possible to arbitrarily set whether or not to include substances other than titanium boride (TiB2) as filler 40. For example, in addition to titanium boride (TiB2), SiC, Al2O3, etc. (one or more types) may be dispersed in the resin bond phase 20.

[0046] Furthermore, although the above embodiment described the case where the average particle size of titanium boride (TiB2) is 5 μm or more and 20 μm or less, the average particle size of titanium boride (TiB2) may be set to be smaller than 5 μm or larger than 20 μm.

[0047] Furthermore, although the above embodiment described a case where the titanium boride (TiB2) content in the blade body 10 is 20 vol% or more and 50 vol% or less, the content in the blade body 10 may be set to less than 20 vol% or higher than 50 vol%.

[0048] Furthermore, although the above embodiment described the case where the abrasive grains 30 are diamond superabrasive grains, the abrasive grains 30 can be arbitrarily set, and for example, other abrasive grains such as cBN may be dispersed in the resin bond phase 20 instead of diamond superabrasive grains. Furthermore, the average particle size and content of the abrasive grains can be set arbitrarily.

[0049] Furthermore, although the above embodiment described the case in which the resin constituting the resin bond phase 20 is a phenolic resin, the resin constituting the resin bond phase 20 can be arbitrarily set, and instead of phenolic resin, for example, polyimide or the like may be used.

[0050] Furthermore, although the above embodiment described a case in which the cutting blade 100 is formed with an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.15 mm, the outer diameter, inner diameter, and thickness of the cutting blade 100 may be set arbitrarily.

[0051] Furthermore, while the above-described embodiment described a case in which the cutting blade 100 is used to cut hard and brittle materials such as glass and quartz (ceramics) as the material to be cut, it may also be used to cut optical transmission modules conforming to QFN (quadflat non-leaded package) or IrDA (Infrared Data Communications Association) standards, or other electronic component materials.

[0052] Furthermore, without departing from the spirit of the present invention, the configurations (components) described in the above embodiments, modifications, and notes may be combined, and additions, omissions, substitutions, and other modifications of the configurations are permitted. Moreover, the present invention is not limited to the above embodiments. [Examples]

[0053] The effects of the average particle size of titanium boride (TiB2) filler (Example 1) and the content of titanium boride (TiB2) filler (Example 2) on the processing quality of the material to be cut will be explained below with reference to Figure 4 and Tables 1 to 6. However, this example is just one example, and the present invention is not limited to this example.

[0054] Figure 4 shows the cutting blade of the present invention. This is a conceptual diagram illustrating the general evaluation criteria in the embodiment described herein. Figure 4(A) shows the general configuration of the object to be evaluated, and Figure 4(B) shows the definition of the evaluation items. In Figure 4, the symbol W represents the material to be cut, the symbol A represents back surface corner chipping, the symbol B represents surface chipping, and the symbol C represents back surface chipping. Furthermore, the symbols LA1 and LA2 represent the dimensions of the back surface corner chipping in the cutting direction and the direction perpendicular to the cutting direction, the symbol LB represents the chipping size (dimension) of the surface chipping (hereinafter referred to as the surface chipping size), and the symbol LC represents the chipping size (dimension) of the back surface chipping (hereinafter referred to as the back surface chipping size).

[0055] Corner chipping on the back surface A refers to a chip formed at the corner of a rectangularly cut chip (workpiece), as shown in Figure 4(A). Furthermore, the size (dimension) of the corner chip A on the back surface is represented by dimension LA1 in the cutting direction and dimension LA2 in the direction perpendicular to the cutting, as shown in Figure 4(B).

[0056] Furthermore, as shown in Figure 4(A), surface chipping B is chipping that occurs on the surface of the chip (workpiece) as a result of the cutting process, starting from the kerf end face and extending inward along the chip surface. Furthermore, the surface chipping size LB is the size (dimension) from the kerf end face of the surface chipping B that occurs on the chip (workpiece), as shown in Figure 4(B).

[0057] Similarly, backside chipping C, as shown in Figure 4(A), is chipping that occurs inward along the backside of the chip, starting from the kerf end face that forms on the surface of the chip (workpiece) due to the cutting process. Furthermore, the back surface chipping size LC is the size (dimension) from the kerf end face of the back surface chipping that occurs on the chip (workpiece) to the tip of the back surface chipping C, as shown in Figure 4(B).

[0058] <Example 1> (1) Influence of average particle size of titanium boride (TiB2) filler on cutting quality In Example 1, the average particle size of titanium boride (TiB2) dispersed as a filler in the resin bond phase 20 was varied, and the relationship between the average particle size and the cutting quality (presence or size of chipping on the back surface corners, presence or absence of chipping on the back surface, or their dimensions) and the spindle current value (magnitude of cutting resistance) was confirmed.

[0059] Specifically, a cutting test was conducted using a cutting blade 100 having a blade body 10 with an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.15 mm, in which abrasive grains 30 made of diamond with a grit size of #600 were dispersed in a resin bond phase 20. Of these cutting blades, the one without titanium boride (TiB2) filler 40 was used as the comparative example (base blade). Furthermore, examples 1 to 6 of the present invention included a mixture in which titanium boride (TiB2) was dispersed as filler 40. In Example 1, only titanium boride (TiB2) was used as filler 40.

[0060] The average particle size of titanium boride (TiB2) in the comparative example evaluated in Example 1 and in Examples 1 to 6 of the present invention is as follows. Comparison example: Base blade (#600 resin blade (56D / 40H / 0.15)) Example 1 of the present invention: Base blade + titanium boride (TiB2) filler (1 μm) Example 2 of the present invention: Base blade + titanium boride (TiB2) filler (5 μm) Example 3 of the present invention: Base blade + titanium boride (TiB2) filler (10 μm) Example 4 of the present invention: Base blade + titanium boride (TiB2) filler (15 μm) Example 5 of the present invention: Base blade + titanium boride (TiB2) filler (20 μm) Example 6 of the present invention: Base blade + titanium boride (TiB2) filler (30 μm) In Examples 1 to 6 of the present invention, the content of the filler 40 was set to 35 vol% by volume relative to the blade body 10.

[0061] Here, the base blade is a resin blade in which #600 diamond superabrasive grains are dispersed as superabrasive grains (abrasive grains) 30 in a resin bond phase 20 made of phenolic resin. The diamond superabrasive grain content relative to the blade body is 12.5 vol%.

[0062] Furthermore, the cutting conditions are as follows: [Cutting conditions] Workpiece (material to be cut): Quartz (100mm x 100mm x t0.5mm) Flange: φ49.6mm Spindle speed: 20000 min- 1 Feed rate: 5mm / sec

[0063] Furthermore, regarding the chips obtained by cutting the material W, the presence or absence of a back corner chip A at one of the four corners of the rectangular shape of the cut chip is recorded. If a back corner chip A is present, the larger of the cutting direction dimension LA1 and the perpendicular cutting dimension LA2 of the back corner chip A is recorded. Furthermore, if there are multiple backside chipping areas C, the largest chipping size (dimension) LC among them is listed. Furthermore, the spindle current value during the cutting process was examined as an indicator of cutting resistance. In Example 1, since the chip (material to be cut) is quartz, it is generally the case that the back surface chipping size LC > the front surface chipping size LB, and therefore only the back surface chipping size LC was examined.

[0064] Table 1 shows the cutting quality and spindle current value of the material to be cut W in the initial stages of processing (first blade) when the cutting blade 100 was first used in Example 1. Table 2 shows the cutting quality and spindle current value of the material to be cut W when the cutting blade 100 has been worn radially by 2 mm due to the cutting process. Table 3 also shows the difference in cutting quality and spindle current value of the material W to be cut between the stage when the cutting blade 100 has worn radially by 2 mm and the initial stage of processing.

[0065] The results of the cutting test regarding the average particle size of the titanium boride (TiB2) filler in Example 1 will be described below with reference to Tables 1 to 3. The results of the cutting test for Example 1 are shown in Tables 1 to 3.

[0066] [Table 1]

[0067] [Table 2]

[0068] [Table 3]

[0069] [Corners on the back are chipped] As shown in Tables 1 and 2, in the comparative example, there was no chipping on the back corners in the initial stages of processing, but a chip of 150 μm on the back corners was found at the 2 mm wear stage. On the other hand, in Examples 1 to 4 of the present invention, no chipping occurred on the back corners. Furthermore, in Example 5 of the present invention, although there was no chipping on the back surface corner in the initial stage of processing, a 30 μm chip was found on the back surface corner at the 2 mm wear stage. Furthermore, in Example 6 of the present invention, a 25 μm chip occurred at the back corner in the initial stages of processing, and by the 2 mm wear stage, the chip had grown to 33 μm. Considering that the general tolerance standard for back corner chipping is 30 μm, Example 6 of the present invention slightly exceeds the tolerance standard. As described above, in Examples 1 to 6 of the present invention, chipping of the back surface corners is kept to a minimum, and good processing quality is ensured.

[0070] Furthermore, as shown in Table 3, the difference between the initial state of processing and the stage where the cutting blade 100 has worn down by 2 mm is 150 μm in the comparative example, but it is 0 to 30 μm in Examples 1 to 5 of the present invention, and 8 μm in Example 6 of the present invention. Therefore, in Examples 1 to 6 of the present invention, the amount of change when transitioning from the initial state of processing to the stage where the blade has worn down by 2 mm is very small, and it can be seen that high-quality cutting is possible even when the blade is nearing the end of its lifespan.

[0071] Considering that the acceptable standard for chipping at the back corners is 30 μm, in the example of this invention, the cutting quality at the 2 mm wear stage is not ensured. However, it is presumed that the acceptable standard can be fully satisfied by shortening the lifespan standard or reviewing the cutting conditions. Therefore, it can be seen that the cutting blades of Examples 1 to 6 of the present invention show a significant improvement in processing quality when cutting for a long period of time compared to the comparative examples.

[0072] [Chipping on the reverse side] As shown in Tables 1 and 2, in the comparative example, the back surface chipping size was 11 μm at the initial stage of processing and 25 μm at the 2 mm wear stage. On the other hand, in Examples 1 to 6 of the present invention, the chipping size on the back surface was 7 to 20 μm in the initial stages of processing, and the maximum chipping size was 8 to 18 μm at the 2 mm wear stage. As described above, in the comparative example, the back surface chipping size was small in the initial stage of processing, but it was large at 25 μm at the 2 mm wear stage. In contrast, in Examples 1 to 6 of the present invention, the back surface chipping sizes at the initial stage of processing and at the 2 mm wear stage were 20 μm and 18 μm, respectively, indicating that the back surface chipping size was kept small and good processing quality was ensured. Furthermore, as shown in Table 3, the difference in cutting blade 100's wear from its initial state to the stage where it has worn down by 2 mm is 14 μm in the comparative example, but -2 to 2 μm in Examples 1 to 6 of the present invention. This confirms that Examples 1 to 6 of the present invention show no significant change in cutting quality even near the end of their lifespan compared to the comparative example, and that the cutting quality is significantly improved.

[0073] [Main shaft current value] As shown in Tables 1 and 2, in the comparative example, the spindle current value was 2.5A at the beginning of machining, but it was 3.3A at the 2mm wear stage. Therefore, in the comparative example, the spindle current value increased by 0.8A at the 2mm wear stage compared to the beginning of machining. On the other hand, in Examples 1 to 6 of the present invention, the spindle current value at the start of machining is 2.3 to 3.1 A, and the spindle current value is 2.3 to 3.1 A when the material is worn by 2 mm. In Example 5 of the present invention, although the spindle current value is high at 3.1 A both at the start of machining and when the material is worn by 2 mm in the radial direction, it does not change from the start of machining and the cutting resistance is maintained. In other words, while the cutting resistance of the cutting blade increased significantly in the comparative example, it was maintained in Example 5 of the present invention, confirming that the cutting resistance did not change significantly even as it approached the end of its lifespan. Furthermore, if the allowable range for change in the main spindle current value (breaking resistance) is set to 0.5A, the comparative example can be said to be non-compliant. As described above, the cutting resistance at the 2mm wear stage of Examples 1 to 6 of the present invention is smaller compared to the comparative example, and the change in cutting resistance is also small, indicating a significant improvement in wear resistance.

[0074] From the above, it was confirmed that the average particle size of titanium boride (TiB2) was good in all respects, including back surface corner chipping, back surface chipping, and spindle current value (cutting resistance), within the range of Examples 1 to 6 of the present invention, and that setting the average particle size of the filler made of titanium boride (TiB2) to 5 μm or more and 30 μm or less produced exceptional results.

[0075] <Example 2> Influence of titanium boride (TiB2) filler content on cutting quality In Example 2, the volume ratio (content (volume ratio)) of titanium boride (TiB2) dispersed as a filler in the resin bond phase 20 to the blade body 10 was changed, and the relationship between the titanium boride (TiB2) filler content and cutting quality (chip backside corner chipping, surface chipping size, backside chipping size, and spindle current value (cutting resistance)) was confirmed.

[0076] Specifically, a cutting test was conducted using a cutting blade 100 having a blade body 10 with an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.1 mm, in which abrasive grains 30 made of diamond with a grit size of #800 were dispersed in a resin bond phase 20. Of these cutting blades, the one without titanium boride (TiB2) filler 40 was used as the comparative example (base blade). Furthermore, in which titanium boride (TiB2) was dispersed as filler 40, examples 7 to 12 of the present invention were used. Furthermore, in Examples 7 to 12 of the present invention, the ratio of the volume of filler 40 to the total volume of the blade body 10 (filler 40 content) was set to 15 to 60 vol%. The specific amounts are as follows: In this embodiment, only titanium boride (TiB2) was used as filler 40.

[0077] Comparison example: Base blade (#800 resin blade (56D / 40H / 0.1t)) Example 7 of the present invention: Base blade + filler content 15 vol% Example 8 of the present invention: Base blade + filler content 20 vol% Example 9 of the present invention: Base blade + filler content 30 vol% Example 10 of the present invention: Base blade + filler content 40 vol% Example 11 of the present invention: Base blade + filler content 50 vol% Example 12 of the present invention: Base blade + filler content 60 vol% The average particle size of the filler 40 in Examples 7 to 12 of this invention was set to 5 μm.

[0078] Here, the base blade is a resin blade in which #800 diamond superabrasive grains are dispersed as superabrasive grains (abrasive grains) 30 in a resin bond phase 20 made of phenolic resin. The average particle size of the diamond superabrasive grains relative to the blade body is 5 μm.

[0079] The cutting conditions are as follows: [Cutting conditions] Workpiece (material to be cut): Alkali glass (100mm x 100mm x t0.5mm) Flange: φ52mm Spindle speed: 15000 min- 1 Feed speed: 10 mm / sec

[0080] Furthermore, regarding the chips obtained by cutting the material W, the presence or absence of a back corner chip A at one of the four corners of the rectangular shape of the cut chip is recorded. If a back corner chip A is present, the larger of the cutting direction dimension LA1 and the perpendicular cutting dimension LA2 of the back corner chip A is recorded. Furthermore, if there are multiple surface chipping B sections, the largest surface chipping size (dimension) LB among them is listed. Furthermore, if there are multiple back-side chipping areas C, the largest back-side chipping area size (dimension) LC among them is listed. Furthermore, the spindle current value during the cutting process was examined as an indicator of cutting resistance. In Example 2, since the chip (material to be cut) is alkali glass, the back surface chipping size LC is not necessarily greater than the front surface chipping size LB. Therefore, both the front surface chipping size LB and the back surface chipping size LC were examined.

[0081] Table 4 shows the initial state of the cutting blade 100 in Example 2. Table 4 also shows the state of the cutting blade 100 after 2 mm of wear due to the cutting process. Table 6 shows the difference between the initial state and the state after 2 mm of wear of the cutting blade 100.

[0082] [Table 4]

[0083] [Table 5]

[0084] [Table 6]

[0085] The results of the cleavage test regarding the titanium boride (TiB2) filler content in Example 2 will be explained below with reference to Tables 4 to 6. The cutting results for Example 2 are shown in Tables 4 to 6.

[0086] [Corners on the back are chipped] As shown in Tables 4 and 5, in the comparative example, although there was no chipping on the back corners in the initial stages of processing, a chip of 180 μm on the back corners was found at the 2 mm wear stage. Furthermore, in Example 7 of the present invention, a 53 μm chip in the back corner occurred in the initial stages of processing, and a 49 μm chip in the back corner was found at the 2 mm wear stage. Furthermore, in Example 12 of the present invention, a 41 μm chip occurred on the back corner in the initial stages of processing, and a 51 μm chip occurred on the back corner at the 2 mm wear stage. On the other hand, in Examples 8 to 11 of the present invention, no chipping of the back corner occurred at either the initial machining stage or the 2 mm wear stage. As described above, in Examples 8 to 11 of the present invention, there was no chipping on the back corners, and good processing quality was ensured. However, as shown in Table 6, the size of the chipping on the back surface corners in Examples 7 and 12 of the present invention did not change much, and was very small compared to the comparative example of 180 μm. This confirmed that there was no significant change in the processed quality of Examples 7 and 12 of the present invention even as the lifespan approached.

[0087] [Surface chipping] As shown in Tables 4 and 5, in the comparative example, the surface chipping size was 20 μm at the initial stage of processing and 36 μm at the 2 mm wear stage. As described above, in the comparative example, although the surface chipping size was small in the initial stages of processing, it increased by approximately 1.8 times at the 2mm wear stage. On the other hand, in Examples 7 to 12 of the present invention, the surface chipping size was 15 to 24 μm in the initial stages of processing and 18 to 24 μm at the 2 mm wear stage, which was found to fully satisfy the general tolerance standard of 30 μm. As described above, in the comparative example, the surface chipping size was small in the initial stages of processing, but it became large at the 2mm wear stage, and it was confirmed that the rate of change at the 2mm wear stage was also large. Furthermore, in Examples 7-12 of the present invention, the surface chipping size was kept small both in the initial processing stage and at the 2mm wear stage, and it was confirmed that there was no significant change in the cutting quality even near the end of the lifespan, indicating a substantial improvement in cutting quality.

[0088] [Chipping on the reverse side] As shown in Tables 4 and 5, in the comparative example, the back surface chipping size was 30 μm at the initial stage of processing and 61 μm at the 2 mm wear stage. As described above, in the comparative example, although the general tolerance standard of 30 μm was satisfied in the initial stages of processing, it was not possible to satisfy the tolerance standard of 30 μm at the 2 mm wear stage, and it was confirmed that the rate of change at the 2 mm wear stage was approximately twice as large. Furthermore, in Example 7 of the present invention, the thickness was 29 μm at the initial stage of processing and 31 μm at the 2 mm wear stage, which slightly falls short of the general tolerance standard of 30 μm at the 2 mm wear stage. Furthermore, in Example 9 of the present invention, the thickness was 32 μm at the initial stage of processing and 30 μm at the 2 mm wear stage, which slightly falls short of the acceptable standard of 30 μm at the initial stage of processing. Furthermore, in Example 12 of the present invention, the thickness was 39 μm at the initial processing stage and 40 μm at the 2 mm wear stage, which slightly falls short of the acceptable standard of 30 μm at both the initial processing stage and the 2 mm wear stage. On the other hand, in Examples 8, 10, and 11 of the present invention, surface chipping was 25-26 μm in the initial stages of processing and 28-29 μm at the 2 mm wear stage, satisfying the acceptable standard of 30 μm. As described above, in the comparative example, the surface chipping size was small in the initial stages of processing, but it became large at the 2mm wear stage, and it was confirmed that the rate of change at the 2mm wear stage was also large. Furthermore, in Examples 7-12 of the present invention, although the back surface chipping size may slightly exceed the limit at both the initial processing stage and the 2mm wear stage, it was confirmed that there was no significant change in the cutting quality even near the end of the lifespan, and that the cutting quality was significantly improved.

[0089] [Main shaft current value] As shown in Tables 3 and 4, in the comparative example, the spindle current value was 2.4A at the beginning of machining, but it was 3.3A at the 2mm wear stage. Therefore, in the comparative example, the current increased by 0.9A (32%) at the 2mm wear stage compared to the beginning of machining, and it was confirmed that this exceeded the acceptable standard of 0.5. On the other hand, in Examples 7 to 12 of the present invention, the spindle current value is 2.3 to 3.0 A at the beginning of machining, and 2.3 to 2.9 A when the wear reaches 2 mm. Furthermore, as shown in Table 6, in Examples 7 to 12 of the present invention, the change in the spindle current value (cutting resistance) was -0.1 to 0.1A, showing almost no change, and it was confirmed that there was no significant change in the cutting resistance even as the lifespan approached. As described above, it was confirmed that, compared to the comparative examples, Examples 7 to 12 of the present invention exhibited lower cutting resistance at the 2mm wear stage, and that there was no significant change in cutting resistance even as the lifespan approached.

[0090] From the above, it was confirmed that when the average particle size of titanium boride (TiB2) was changed, the range of Examples 7 to 12 of the present invention was good in terms of back surface corner chipping, front surface chipping, back surface chipping, and spindle current value (cutting resistance), and that setting the titanium boride (TiB2) content to 20% to 60% produced particularly remarkable effects. [Industrial applicability]

[0091] The cutting blade according to the present invention can cut brittle materials with high quality over a long period of time, making it suitable for industrial use. [Explanation of symbols]

[0092] 10 Blade body 11 Outer surface (outer part) 11A Cutting edge 20 Resin bond phase 30 abrasive grains 40 Filler 100 Cutting Blades

Claims

[Claim 1] A cutting blade in which the blade body rotates around an axis and cuts the material to be cut by the cutting edge, The aforementioned blade body is A resin bond phase formed in a disc shape and made of resin, Abrasive particles dispersed in the resin bond phase, The filler dispersed in the resin bond phase, A cutting edge is positioned on the outer periphery of the resin bond phase, Equipped with, The aforementioned filler is titanium boride (TiB ２ ) including, The aforementioned titanium boride (TiB ２ The average particle size of the filler consisting of ) is 5 μm or more and 15 μm or less. The aforementioned titanium boride (TiB ２ The total content of the filler, including the above, is 40 vol% or more and 50 vol% or less relative to the blade body. Cutting blade.

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