IC card

Abstract

To provide an IC card which can select the validity / invalidity of communication in accordance with the intention of a user, can be designed or manufactured easily, and can suppress reduction in design property or operation reliability.SOLUTION: An IC card 1 includes a card substrate 2, and an IC module 70 arranged in a recess 9 of the card substrate 2 and equipped with an external connection terminal 71 and an IC chip 74a. The external connection terminal 71 is arranged so as to be exposed to a surface of the card substrate 2, wherein a first terminal, a second terminal, and a third terminal insulated from each other are sectioned. One of the first terminal and the second terminal is electrically connected to a pad of the IC chip 74a and the other one is electrically connected to the third terminal. The third terminal is a terminal related to power supply for a contact IC card or input / output of signals. Only when the first terminal and the second terminal are short circuited, the IC chip 74a and the third terminal are electrically connected to enable contact communication with an external device.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an IC card capable of contact communication with an external device through an external connection terminal.

Background Art

[0002] Conventionally, as IC cards, contact IC cards that perform input / output of electrical signals through external connection terminals on the card surface and non-contact IC cards that perform input / output of electrical signals by electromagnetic induction or the like through an antenna have become widespread. In addition to these, dual interface IC cards that combine the functions of a contact IC card and a non-contact IC card using a single IC chip provided in the card are also used.

[0003] By the way, although the number of non-contact communication type credit cards and the like has been increasing, unauthorized reading (skimming) of card information by a malicious third party has become a problem. For this reason, contact-type IC cards with relatively high security in which input / output data is difficult to leak to the outside and dual interface IC cards having both a contact communication function and a non-contact communication function are still used at a high rate for bank cash cards and credit card applications.

[0004] However, recently, there has been an increasing number of cases where handwritten signatures and input of PINs are omitted during in-store settlement of contact-type IC cards. In the event that a user loses an IC card and does not notice it for some time, there is a risk that an unauthorized high-value settlement may be made by a third party who picks it up.

[0005] Regarding this, for example, Patent Document 1 describes a contact-type IC card having a short-circuiting wire that short-circuits a plurality of external electrodes and an on / off switch mechanism composed of an elastic material that controls the disconnection and on / off of the external electrodes and the short-circuiting wire. In this case, the short-circuiting wire is opened when the needle pressure of the electrode terminals of the reader / writer is above a certain level, enabling contact communication. When not inserted into the reader / writer, the external electrodes and the short-circuiting wire are conductive, and contact communication is not possible. Patent Document 2 also describes an IC card comprising a card base material, a switching unit body, a switching unit having a plurality of contact parts, and a plurality of IC chips. The switching unit body is provided so as to penetrate the card base material and be rotatable, and the switching unit has a plurality of contact parts mounted so as to extend perpendicular to the rotation axis of the switching unit body. Furthermore, the plurality of connection terminals of one of the plurality of IC chips and the plurality of contact parts are selectively connected via wiring by rotating the switching unit. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2000-231619 [Patent Document 2] Japanese Patent Publication No. 2006-127483 [Overview of the project] [Problems that the invention aims to solve]

[0007] Thus, it is conceivable to configure the system to allow contact-type IC cards to be used only when the user intends to use them, by incorporating some kind of mechanical switch. However, adding a new switch mechanism to the card would increase the design and manufacturing burden and reduce its aesthetic appeal. Furthermore, the complex configuration would lead to a decrease in operational reliability against repeated bending and twisting of the card.

[0008] This disclosure is made in light of the circumstances described above, and aims to provide a contact-type IC card, etc., that allows users to select whether or not to enable communication according to their intentions, is easy to design and manufacture, and suppresses a decline in design quality and operational reliability. [Means for solving the problem]

[0009] The first configuration of the IC card according to this embodiment comprises a card base and an IC module disposed in a recess of the card base and equipped with an external connection terminal and an IC chip. The external connection terminal is arranged to be exposed on the surface of the card base and is divided into a first terminal, a second terminal and a third terminal which are insulated from each other. Either the first terminal or the second terminal is electrically connected to a pad of the IC chip, and the other is electrically connected to the third terminal. The third terminal is a terminal related to power supply and signal input / output of the contact IC card. Only when the first terminal and the second terminal are short-circuited does the IC chip and the third terminal become conductive, enabling contact communication with an external device.

[0010] Furthermore, in the IC card relating to the second configuration according to another form of this implementation, in the first configuration, the first terminal and the second terminal may be terminals that are designated as unused terminals in the contact-type IC card standard, or terminals that are not assigned as Vcc, RST, CLK, GND, or I / O.

[0011] Furthermore, in an IC card relating to a third configuration according to another form of this implementation, the third terminal in the first or second configuration may be a terminal assigned as Vcc, RST, CLK, GND, or I / O in the contact-type IC card standard.

[0012] Furthermore, the IC card relating to the fourth configuration in another form of this implementation may be a dual-interface IC card in any of the first to third configurations.

[0013] Furthermore, an IC card relating to a fifth configuration in another form of this embodiment may further include a conductive member that can be arranged to span from the first terminal to the second terminal in any of the first to fourth configurations, and which can be arranged to short-circuit the first terminal and the second terminal and to insulate from other terminals arranged between the first terminal and the second terminal. [Effects of the Invention]

[0014] According to this embodiment, it is possible to provide a contact-type IC card, etc., that allows users to select whether or not to enable communication according to their intentions, is easy to design and manufacture, and suppresses a decline in design and operational reliability. [Brief explanation of the drawing]

[0015] [Figure 1] This is a plan view illustrating the structure of a contact-type IC card according to the first embodiment, and an enlarged view of the IC module. [Figure 2] This is a view of the IC module from the opposite side compared to Figure 1(b). [Figure 3] This is a cross-sectional view showing the section cut along line AA in Figure 1(a). [Figure 4] This is an explanatory diagram relating to a conductive member according to the second embodiment. [Figure 5] This diagram shows a plan view and an enlarged view of the IC module illustrating the structure of a dual-interface IC card according to the third embodiment. [Figure 6] This is an enlarged view corresponding to Figure 1(b), which shows a conventional IC module. [Modes for carrying out the invention]

[0016] An example of a contact-type IC card according to this disclosure will be described below with reference to the drawings, etc. However, the contact-type IC card according to this disclosure is not limited to the embodiments and examples described below.

[0017] Note that each of the figures shown below is presented schematically. Therefore, the sizes and shapes of each part are exaggerated as appropriate for ease of understanding. Also, in each figure, hatching indicating the cross-section of members is omitted as appropriate. Numerical values such as the dimensions of each member described in this specification and material names are examples as an embodiment and are not limited thereto, and can be appropriately selected and used. In this specification, terms specifying shapes and geometric conditions, such as terms like parallel, orthogonal, and perpendicular, include not only the strictly defined meaning but also substantially the same state.

[0018] 1. First Embodiment An example of the first embodiment of the contact-type IC card of the present disclosure will be described. The IC card 1 is a contact-type IC card. Here, for convenience of explanation, an XYZ coordinate system is set for the IC card 1. First, as shown in Fig. 1(a), Fig. 3, etc., the Z-axis is taken in the normal direction of the main surface of the IC card 1. Then, from the main surface on the side where the external connection terminal of the IC module 70 is not arranged to the main surface on the side where the external connection terminal 71 is arranged, the direction is taken as the +Z direction or upward in the thickness direction, and the opposite direction is taken as the -Z direction or downward in the thickness direction.

[0019] Also, when the IC card 1 is viewed from the +Z direction, a straight line perpendicular to both short sides of the IC card 1 and the Z-axis is taken as the X-axis. Also, the direction from one short side closer to the external connection terminal 71 to the other short side is taken as the +X direction or the right direction, and the opposite direction is taken as the -X direction or the left direction. Further, an axis perpendicular to the X-axis and the Z-axis is taken as the Y-axis, and the direction from one long side farther from the external connection terminal 71 to the other long side is taken as the +Y direction or upward, and the opposite direction is taken as the -Y direction or downward.

[0020] Fig. 1(a) is a plan view of the IC card 1 seen from the +Z direction. Fig. 1(b) is an enlarged view for explaining the internal structure of the IC module 70 in the IC card 1 of Fig. 1(a), and the IC chip 74a, the mold part 74b, the wire 75, etc. arranged on the -Z direction side of the external connection terminal 71, that is, the back side of the paper surface, are shown by broken lines. Fig. 2 is a view of the IC module 70 of Fig. 1(b) seen from the -Z direction side which is the back side excluding the card substrate 2. Fig. 3 is a view of a cross-section of the IC card 1 of Fig. 1(a) cut along the plane of line A-A parallel to the X axis seen from the -Y direction.

[0021] As shown in Fig. 1(a), the IC card 1 has a form of a substantially rectangular thin plate with rounded corners in a plan view from the +Z direction side. Also, on the surface of the IC card 1 on the +Z direction side, an IC module 70 including external connection terminals 71 is arranged slightly to the upper left from the center, that is, closer to the -X direction and closer to the +Y direction than the center. As shown in Fig. 1(b) and Fig. 3, the IC module 70 is embedded in a recess 9 formed in the card substrate 2, and is arranged such that the surface on the +Z direction side of the external connection terminal 71 is substantially flush with the surface on the +Z direction side of the card substrate 2. Such a form of the IC card 1 conforms to ISO / IEC7816-1 which is an international standard for IC cards. Also, as shown in Fig. 1(b), each section of the external terminals defined in the ISO / IEC7816-2 standard and the ISO / IEC7816-3 standard is defined for the external connection terminals 71.

[0022] In this standard, as external terminals, a C1 terminal (supply voltage input terminal), a C2 terminal (reset signal input terminal), a C3 terminal (clock signal input terminal), a C5 terminal (signal ground terminal), and a C7 terminal (input or output terminal for serial data) are defined. Note that the C6 terminal is a standard or individual use terminal and is usually not used, and the C4 and C8 terminals are reserved for future use as unused terminals. Note that each of the terminals C1, C2, C3, C5, and C7 can be abbreviated as VCC, RST, CLK, GND, and I / O, respectively. [[ID=⑨]] [[ID=⑩]]

[0023] [[ID=⑪]] The detailed configuration will be described later, but each of the multiple pads 74p of the IC chip 74a is electrically connected to terminals C1, C2, C3, and C5 of the external connection terminal 71 via conductive wires 75, as well as to the unused terminal C4. In addition, terminal C7 of the external connection terminal 71 and the unused terminal C8 are electrically connected via conductive wires 75. In this state, since the pads 74p of the IC chip 74a and terminal C7 are not connected by wire 75, the IC chip 74a cannot input or output signals through terminal C7 and therefore cannot operate as a contact IC card.

[0024] However, the pad 74p of the IC chip 74a and the C4 terminal are electrically connected via the wire 75, and the C7 terminal and the C8 terminal are electrically connected via the wire 75. In this state, if the C4 terminal and the C8 terminal are electrically connected to each other, the IC card 1 has electrical connections between the C1, C2, C3, and C5 terminals necessary for contact-type IC card communication and the respective pads 74p of the IC chip 74a. By further electrically connecting the pad 74p of the IC chip 74a and the C7 terminal, contact communication becomes possible.

[0025] Conversely, if terminals C4 and C8 are open, i.e., insulated, then the IC chip 74a and each terminal of the external connection terminal 71 are disconnected at least at terminal C7. In this case, IC card 1 cannot perform contact communication, and only by short-circuiting terminals C4 and C8 can IC card 1 intentionally perform contact communication. Short-circuiting terminals C4 and C8 can be easily achieved by methods such as attaching a seal-like conductive material across both terminals.

[0026] As described above, the IC card 1, which is a contact-type IC card according to the first embodiment, comprises a card base 2 and an IC module 70 located in a recess 9 of the card base 2 and equipped with an external connection terminal 71 and an IC chip 74a. The external connection terminal 71 is arranged so as to be exposed on the surface of the card base 2 and is divided into terminals C4, C8, and C7, which are insulated from each other. Here, the C4 and C8 terminals exemplified in this embodiment act as switches that connect or disconnect the wiring between the IC chip 74a and the C7 terminal, and such different terminals can be referred to as the first terminal and the second terminal. Furthermore, terminals such as the C7 terminal, which are the target of such switching and are related to power supply and signal input / output during contact communication of a contact IC card or dual-interface IC card, can be referred to as the third terminal.

[0027] Either the first or second terminal is electrically connected to a pad on the IC chip 74a, and the other is electrically connected to the third terminal. Furthermore, only when the first and second terminals are short-circuited does the IC chip 74a and the third terminal become conductive, enabling contact communication with external devices.

[0028] Because the IC card 1 according to the first embodiment has the above configuration, the user can select whether or not to enable contact communication according to their intentions by simply short-circuiting terminals C4 and C8 at the external connection terminal 71 of the IC module 70. Furthermore, since the IC card 1 does not have a configuration that adds any special mechanical switches, its design and manufacturing are easier compared to ordinary IC cards, and a decrease in design quality and operational reliability can be suppressed.

[0029] The configuration of the IC card 1 of this embodiment and the details of its manufacturing method are described below.

[0030] (a) Card base Card base 2 refers to the card body of IC card 1, excluding the IC module 70. As shown in Figure 3, card base 2 typically has a configuration in which an oversheet layer 6, core layers 5 and 4, and oversheet layer 3 are stacked in this order from one end on the -Z side in the thickness direction. Card base 2 may refer to both the card before the recess 9 is formed and the card base after the recess 9 is formed.

[0031] Furthermore, the layer configuration of the card substrate 2 is not limited to those described above; it may also be a three-layer configuration of an oversheet layer, a core layer, and another oversheet layer, or a two-layer configuration of a core layer and another core layer. Alternatively, the layer configuration of the card substrate 2 may be a multilayer configuration of six or more layers, such as an oversheet layer, a second core layer, a first core layer, another first core layer, a second core layer, and an oversheet layer. In addition, printing or embedding of a magnetic stripe may be applied to the surface of the oversheet layer 3 or 6 of the card substrate 2 that is opposite to the core layer 4 or 5, and printing may be applied to the surface of the core layer 4 or 5 adjacent to the oversheet layer 3 or 6.

[0032] From the standpoint of conforming to standards such as ISO / IEC 7816-1, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but it may be outside this range.

[0033] (i) Core layer For core layers 4 and 5, a wide variety of white or colored plastic sheets can be used, including the following single films or composite films thereof. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene-based materials, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, etc. The thickness of core layers 4 and 7 can be appropriately selected considering the overall thickness of the card, but can be, for example, between 0.10 mm and 0.38 mm.

[0034] (ii) Oversheet layer For the oversheet layers 3 and 6, the same material as the core layer is usually used, but transparent materials with a thickness of approximately 0.05 mm or more and 0.10 mm or less are often used. From the viewpoint of preventing curling when the laminate of the core layer and oversheet layers is integrated by heat pressing or the like, it is preferable that the thicknesses of the oversheet layers 3 and 6 are the same, but they do not necessarily have to be the same. This point also applies to the core layers 4 and 5 mentioned above.

[0035] The material of the oversheet layer can be any material that adheres when heated, but even if the oversheet layer itself does not adhere when heated, the two can be integrated by adding a layer of a known adhesive that generates adhesive force when heated between the core layer and the oversheet layer. Furthermore, when the IC card 1 is used as a magnetic card, a magnetic stripe may be pre-embedded in either or both of the oversheet layers 3 and 6 on the main surface side opposite to either or both of the core layers 4 and 5 by thermal transfer or the like.

[0036] (b) IC module Next, the main components of the IC module 70 will be described, primarily based on Figures 1(b), 2, and 3. The IC module 70 is embedded in a recess 9 formed in the card base 2, and is fixed to the card base 2 by bonding the substrate 72 of the IC module 70 to the core layer 4 via an adhesive layer 11.

[0037] The substrate 72 is formed by bonding copper foil to both sides of a flexible insulating resin film, such as glass epoxy resin or polyimide resin, via an adhesive, and leaving some of the copper foil bonded to the resin film to form a predetermined pattern. Specifically, to form an external connection terminal 71 on one of the copper foil surfaces of the resin film, the process involves sequentially applying a photosensitive material, placing a film plate with the predetermined pattern, exposure, and etching away the non-photosensitive areas. This forms a substrate 72 in which some of the copper foil with the predetermined pattern remains on both the front and back surfaces of the resin film. In addition, the substrate 72 is pre-provided with multiple bonding holes 76, which are through holes for wire bonding to the external connection terminal 71.

[0038] As shown in Figure 1(b), the external connection terminal 71 has defined sections for each external terminal as defined by the ISO / IEC 7816-2 standard. Specifically, as mentioned above, the external connection terminal 71 is defined as having terminal C1 (supply voltage input terminal), terminal C2 (reset signal input terminal), terminal C3 (clock signal input terminal), terminal C5 (signal ground terminal), and terminal C7 (series data input or output terminal). Terminal C6 is a standard or individually used terminal and is not normally used, while terminals C4 and C8 are reserved as unused terminals for future use. Each of these terminal areas is demarcated by an insulating groove 71a. Specifically, the external connection terminal 71 has terminal areas of a predetermined pattern formed on one surface of an insulating substrate 72 using copper foil or the like, and the insulating groove 71a is the area where the copper foil is interrupted and the substrate 72 is exposed.

[0039] As shown in Figure 1(b), terminals C1 to C4 are partitioned from top to bottom in the area to the left of the external connection terminal 71 when viewed from the +Z direction, and terminals C5 to C8 are partitioned from top to bottom in the area to the right. Terminal C5 extends downwards from the center of the external connection terminal 71, but this arrangement is not necessarily required, and areas insulated from any of terminals C1 to C8 may be partitioned. Note that in Figures 1(b), 5(b), and 6, the lead wires to the IC chip 74a, molded part 74b, bonding hole 76, pad 74p, and antenna connection terminals 73a and 73b, which are located further back on the page than the external connection terminal 71 and are shown with dashed lines, should ideally be dashed. However, in order to clearly distinguish between wire 75 and lead wires, all lead wires are deliberately shown as solid lines.

[0040] The side of the IC chip 74a facing away from the substrate 72 is the circuit side, and a circuit pattern and multiple pads 74p, which are electrodes, are provided on this surface. The back surface of the external connection terminals 71 can be seen from the -Z direction through bonding holes 76 formed in the substrate 72 at locations corresponding to each section of the external connection terminals 71. In other words, the pads 74p of the IC chip 74a and the predetermined sections of the external connection terminals 71 can be made electrically connected by connecting them with a wire 75 such as a gold wire through the bonding holes 76.

[0041] Taking Figures 1(b) and 2 as examples, the multiple pads 74p of the IC chip 74a are connected to terminals C1, C2, C3, C5, and C4, respectively, by wires 75. In addition, terminals C7 and C8 are connected by wires 75. These bonding holes 76 and wires 75 are covered and protected by the molded portion 74b. In this embodiment, five pads 74p are provided on the IC chip 74a, but the number and arrangement are merely examples, and any number and arrangement may be used.

[0042] Here, we will explain the difference in the wiring configuration between the IC chip and the external connection terminals 71 via wires 75 between the IC module 70 of this embodiment and the IC module of the prior art. Figure 6 is a diagram corresponding to Figure 1(b) showing the configuration of the IC module 70a of the prior art. In the IC module 70a of the prior art, multiple pads 74p of the IC chip 74a are connected to terminals C1, C2, C3, C5, and C7, respectively, by wires 75. In addition, unused terminals C4 and C8 are not connected to the pads 74p of the IC chip 74a or other terminals.

[0043] Therefore, in the conventional IC module 70a, each pad 74p of the IC chip 74a is electrically connected to terminals C1, C2, C3, C5, and C7, which are necessary for contact communication. As a result, by inserting the IC card into a designated external device such as a reader / writer, contact communication with the external device in accordance with the ISO / IEC 7816 standard is possible.

[0044] In contrast, in the IC module 70 of this embodiment, each pad 74p of the IC chip 74a is electrically connected to terminals C1, C2, C3, and C5, which are necessary for contact communication, but terminal C7, which is also necessary for contact communication, is not connected. However, if terminals C4 and C8 are made conductive to each other, then the IC chip 74a and terminal C7 can be made conductive, enabling contact communication with external devices. In other words, the IC card 1 can only perform contact communication if terminals C4 and C8, which are normally insulated from each other, are intentionally made conductive.

[0045] The connections between the multiple pads 74p of the IC chip 74a in this embodiment and each terminal are not limited to those described above. For example, the multiple pads 74p of the IC chip 74a may be connected to each of the C1, C2, C3, C7, and C4 terminals by wire 75. In this case, the C5 terminal and the C8 terminal are further connected by wire 75. Alternatively, the multiple pads 74p of the IC chip 74a may be connected to each of the C1, C2, C5, C7, and C4 terminals by wire 75. In this case, the C3 terminal and the C8 terminal are further connected by wire 75.

[0046] Furthermore, multiple pads 74p of the IC chip 74a may be connected to terminals C1, C3, C5, C7, and C4 by wires 75. In this case, terminals C2 and C8 are further connected by wires 75. Alternatively, multiple pads 74p of the IC chip 74a may be connected to terminals C2, C3, C5, C7, and C4 by wires 75. In this case, terminals C1 and C8 are further connected by wires 75.

[0047] Furthermore, under the above conditions, terminals C4 and C8 may be replaced with terminals C4 and C6, C6 and C8, or C8 and C4, respectively. In any case, the third terminal, which is one of the terminals C1, C2, C3, C5, and C7 necessary for contact communication, will not conduct to the multiple pads 74p of the IC chip 74a, while the terminals other than the third terminal will conduct. In this case, the objective of this embodiment can be achieved, which is that contact communication with an external device becomes possible only when the unused first and second terminals are short-circuited, and the IC chip 74a and the third terminal conduct to it. Note that the first and second terminals may be any terminals related to power supply or signal input / output of the contact IC card, and may be terminals for special communications not specified in ISO / IEC7816-2 or ISO / IEC7816-3.

[0048] The IC chip body 74 is positioned on the side of the substrate 72 opposite to the surface where the external connection terminals 71 are formed. The IC chip body 74 consists of an IC chip 74a bonded and fixed to the substrate 72 via adhesive, bonding wires 75 for connection, and a molded part 74b which is a sealing resin to protect them. The IC chip 74a includes a CPU for controlling the operation of both contact and contactless communication, and a storage device such as RAM, ROM, EEPROM, or flash memory. Furthermore, the IC chip 74a includes various circuits such as an interface circuit and a power generation circuit for decoding input signals and generating output signals for contact and contactless communication. Note that these various circuits may be provided as separate elements from the IC chip 74a.

[0049] The molded portion 74b is provided as a protruding part that covers the IC chip 74a and wire 75 in order to protect them from external forces and environmental loads. A UV-curable resin or a thermosetting resin is used for the molded portion 74b.

[0050] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a inside and the shape of the bonded wires, but can be, for example, 0.45 mm or more and 0.75 mm or less. The total thickness of the IC module 70 can be, for example, 0.35 mm or more and 1.0 mm or less, preferably 0.40 mm or more and 0.65 mm or less. The latter range allows the maximum depth of the recess 9 to be 0.7 mm or less, and the overall thickness of the IC card 1 can be kept below 0.84 mm as defined in the ISO / IEC 7816-1 standard.

[0051] (c) Adhesive layer After forming a recess 9 in the card base 2 for embedding the IC module 70 by cutting with an end mill or the like, the adhesive layer 11 for embedding and fixing the IC module 70 in the recess 9 will be described. As shown in Figure 3, the adhesive layer 11 is a liquid or tape-like material that is placed between the substrate 72 of the IC module 70 and the core layer 4 of the card base 2.

[0052] The adhesive layer 11 may be applied and attached in advance to the side of the IC module 70 substrate 72 opposite to the external connection terminals 71, or it may be applied and attached to the bottom surface of the card base 2 after cutting the recess 9. As the adhesive layer 11, adhesives containing thermoplastic resins can be selected, such as vinyl chloride-based, vinyl acetate-based, acrylic-based adhesives, hot melt adhesives, and rubber-based adhesives. Alternatively, adhesives containing thermosetting resins can be selected, such as polyester resin-based, phenol resin-based, polyurethane resin-based, and epoxy resin-based adhesives.

[0053] (d) Method for manufacturing contact IC cards Next, an example of a method for manufacturing an IC card 1 using the card base 2, IC module 70, and adhesive layer 11 described above will be explained.

[0054] First, as shown in Figure 3, the oversheet layer 6, core layers 5 and 4, and oversheet layer 3 are stacked in this order from the bottom in the thickness direction. Then, the laminate of large sheets in which the cards are arranged in multiple directions is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate through the stainless steel plates.

[0055] By going through this hot pressing process, a large-format sheet-type card base can be obtained in which each layer of the laminate is integrated. Furthermore, if either the oversheet layer or the core layer has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heats together at a predetermined temperature is sandwiched between each layer, or an adhesive is applied. Then, by subjecting these to a hot pressing process, an integrated large-format sheet-type card base can be obtained.

[0056] The large sheet of card base material obtained as described above, in which cards are arranged in multiple rows vertically and horizontally, is punched out using a die-cutting machine as card base material 2 with a card size according to ISO / IEC 7816-1. In addition, recesses 9 for embedding IC modules 70 are formed in the card base material 2 by cutting with an end mill. This gives the cut card base material 2. The recesses 9 consist of two stages: a first recess 91 with a first depth for housing the flat substrate 72 of the IC module 70, and a second recess 92 with a second depth deeper than the first recess 91 for housing the convex IC chip body 74.

[0057] On the other hand, separate from the manufacturing of the card base 2 and the cutting process to form the recess 9, the adhesive layer 11 is applied to the IC module 70. Typically, a module tape is used as the IC module 70, in which the IC modules 70 are formed continuously on a long tape in one or two rows. The tape-shaped adhesive layer 11 is applied to the side of this module tape opposite to the side where the external connection terminals 71 are formed, while applying a certain amount of heat and pressure. After that, the module tape with the adhesive layer 11 applied is punched out with a punching machine as a roughly rectangular IC module 70 with rounded corners, thereby obtaining an IC module 70 with the adhesive layer 11 applied.

[0058] Subsequently, the IC module 70, with the adhesive layer 11 attached, is embedded in the card base 2 where the recess 9 is formed. A predetermined heat block is then pressed against the external connection terminal 71, and a predetermined amount of heat and pressure is applied toward the card base 2 for a predetermined time. This melts the adhesive layer 11, thereby creating a mechanical connection between the substrate 72 of the IC module 70 and the core layer 4. The application time and heat and pressure conditions for the adhesive layer 11 vary depending on its type and composition, but as an example, the time can be 0.5 seconds or more and 10.0 seconds or less, the temperature 150°C or more and 250°C or less, and the pressure 20 MPa or more and 100 MPa or less.

[0059] (e) Regarding the IC card of the first embodiment In summary, the IC card 1, which is a contact-type IC card according to the first embodiment, comprises a card base 2 and an IC module 70 located in a recess 9 of the card base 2 and equipped with an external connection terminal 71 and an IC chip 74a. The external connection terminal 71 is arranged to be exposed on the surface of the card base 2 and is divided into a first terminal, a second terminal and a third terminal which are insulated from each other. The first and second terminals are terminals that are not assigned as Vcc, RST, CLK, GND or I / O, for example, terminals C4 and C8. The third terminal is a terminal that is assigned as Vcc, RST, CLK, GND or I / O, for example.

[0060] Either the first or second terminal is electrically connected to a pad on the IC chip 74a, and the other is electrically connected to the third terminal. The third terminal is related to power supply and signal input / output for the contact IC card, and only when the first and second terminals are short-circuited does the IC chip 74a and the third terminal become conductive, enabling contact communication with external devices.

[0061] Because the IC card 1 according to the first embodiment has the above configuration, the user can select whether or not to enable contact communication according to their intentions by simply short-circuiting terminals C4 and C8 at the external connection terminal 71 of the IC module 70. Furthermore, since the IC card 1 does not have a configuration that adds any special mechanical switches, its design and manufacturing are easier compared to ordinary IC cards, and a decrease in design quality and operational reliability can be suppressed.

[0062] 2. Second Embodiment Next, a contact-type IC card according to the second embodiment of this disclosure will be described.

[0063] The IC card of the second embodiment is further provided with a detachable conductive member on the external connection terminal 71 of the IC module 70, in addition to the IC card 1 of the first embodiment. The conductive member can be positioned on the external connection terminal 71 of the IC module 70 so as to span from terminal C4 to terminal C8, short-circuit terminals C4 and C8, and insulate from other terminals positioned between terminals C4 and C8. Figure 4(a) shows the conductive member 210 positioned on the external connection terminal 71 of the IC module 70 so as to span terminals C4 and C8.

[0064] Figure 4(b) is a side view of the conductive member 210 shown in Figure 4(a) as seen from the -Y direction. As shown in Figure 4(b), the conductive member 210 consists of a conductive layer 211 whose entire surface is conductive, and an insulating layer 212 and an adhesive layer 213 that are partially arranged on one side thereof. The conductive layer 211 includes conductive materials such as copper foil, aluminum foil, stainless steel plate, and graphite sheet, and when arranged to span from terminal C4 to terminal C8, the conductive portion can be brought into direct contact with terminals C4 and C8. This allows for a short circuit between terminals C4 and C8.

[0065] Furthermore, the external connection terminal 71 is partitioned such that the area between terminals C4 and C8 is electrically connected to terminal C5. Therefore, if only the conductive layer 211 is arranged to span from terminal C4 to terminal C8, not only terminals C4 and C8, but terminals C4, C8, and C5 will all be short-circuited. In this case, for example, terminal C7 may become electrically connected to the GND terminal of the IC chip 74a, potentially causing problems with contact communication. To avoid this, the conductive member 210 has an insulating layer 212 on a part of the surface of the conductive layer 211 facing the external connection terminal 71, so that terminals other than terminals C4 and C8 do not short-circuit with them.

[0066] Furthermore, an adhesive layer 213 is provided on a portion of the surface of the conductive layer 211 of the conductive member 210 that faces the external connection terminal 71, for example, on both ends of the conductive layer 211, to prevent the conductive member 210 from detaching from the external connection terminal 71. The adhesive layer 213 may be made of a re-peelable and re-adhesive so that the user can attach and detach it from the external connection terminal 71 as many times as needed.

[0067] The IC card of the second embodiment can be positioned to span from the first terminal to the second terminal, as exemplified by either terminal C4 or terminal C8, in addition to the IC card 1 of the first embodiment. It further includes a conductive member 210 that can be positioned to short-circuit the first and second terminals and to insulate from other terminals positioned between the first and second terminals. This allows the user to perform contact communication with the IC card 1 by attaching such a conductive member 210 to a predetermined position on the external connection terminal 71 of the IC card 1 as needed. The conductive member 210 can be easily formed as a flexible label-like member, and when not in use, it can be attached to any location other than the external connection terminal 71 of the IC card 1, and when in use, it can be easily selected whether or not to enable contact communication by simply reattaching it to the predetermined position without performing any complex operations.

[0068] However, the conductive member is not limited to the configuration of the conductive member 210 described above. For example, as shown in the side view of Figure 5(c), the conductive member 220 may have an adhesive layer 223 that also serves as an insulating layer in the center, and conductive protrusions 222 on the same surface as the adhesive layer 223 at both ends of the conductive layer 221. In this case, the conductive layer 221, adhesive layer 223, and protrusions 222 are arranged to form a roughly E shape when viewed from the side, and the conductive member 220 can be brought into contact with the external connection terminal 71 without the conductive layer 221 coming into contact with terminals other than the C4 and C8 terminals.

[0069] In this embodiment as well, the conductive member 210 or 220 that can be arranged to span from the first terminal to the second terminal is not limited to the combination of terminals C4 and C8, but can also be applied to combinations such as terminals C4 and C6, or terminals C6 and C8.

[0070] 3. Third Embodiment Next, an example of a third embodiment of the IC card of this disclosure will be described. Figures 5(a) and 5(b) are diagrams showing an IC card 1a according to the third embodiment, corresponding to Figures 1(a) and 1(b). The IC card 1a is a dual-interface IC card capable of contact and contactless communication.

[0071] As shown in Figure 5(a), IC card 1a has the same external shape as IC card 1, and IC module 70b also has the same design as IC card 1, at least in terms of the shape of the external connection terminal 71. That is, as shown in Figure 1(b), the external connection terminal 71 has defined sections for the external terminals, similar to those of IC card 1, as defined in ISO / IEC 7816-2 and ISO / IEC 7816-3 standards.

[0072] Inside the card base 2, as shown in Figure 5(a), an antenna 80 is arranged, wound in a loop shape and formed from insulated conductors or the like. Both ends of the antenna wire of the antenna 80 are electrically connected to the roughly H-shaped antenna connection terminals 73a and 73b shown in Figure 5(b). Multiple pads 74p are formed on the IC chip 74a, and each of the multiple pads 74p on the IC chip 74a is electrically connected to terminals C1, C2, C3, and C5 of the external connection terminal 71 via conductive wires 75. It is also electrically connected to the unused terminal C4. In addition, two other pads 74p on the IC chip 74a are electrically connected via conductive wires 75 to antenna connection terminals 73a and 73b formed on the side of the substrate 72 opposite to the external connection terminal 71. Furthermore, terminal C7 and the unused terminal C8 are electrically connected via conductive wires 75.

[0073] At this time, one pad 74p of the IC chip 74a and the antenna connection terminal 73b are electrically connected via the wire 75, so the IC chip 74a and one end of the antenna 80 are electrically connected via the antenna connection terminal 73b. Also, the other pad 74p of the IC chip 74a and the antenna connection terminal 73a are electrically connected via the wire 75, so the IC chip 74a and the other end of the antenna 80 are electrically connected via the antenna connection terminal 73a. As a result, the IC chip 74a and the antenna 80 form a closed communication circuit, enabling contactless communication for the IC card 1a.

[0074] On the other hand, each of the multiple pads 74p of the IC chip 74a is electrically connected to terminals C1, C2, C3, and C5 of the external connection terminal 71 via conductive wires 75, and is also electrically connected to the unused terminal C4. Furthermore, terminal C7 and the unused terminal C8 are electrically connected via conductive wires 75. This connection relationship is the same as that of the IC card 1 in the first embodiment. Therefore, when terminals C4 and C8 are electrically connected to each other, the IC card 1 has electrical connections between terminals C1, C2, C3, and C5, which are necessary for contact-type IC card communication, and each of the pads 74p of the IC chip 74a. By further connecting pad 74p of the IC chip 74a to terminal C7, contact communication becomes possible.

[0075] Thus, the IC card 1a, which is a dual-interface IC card of the third embodiment, includes an antenna 80 internally, and since the IC chip 74a and the antenna 80 form a communication circuit, contactless communication is possible. In addition, the IC card 1a, like the IC card 1 of the first embodiment, allows the user to select whether or not to enable contact communication according to their intentions by a simple method of whether or not to short-circuit the C4 terminal and the C8 terminal at the external connection terminal 71 of the IC module 70b. Furthermore, since the IC card 1a does not have a configuration that adds any special mechanical switches, its design and manufacturing are as easy as those of a normal dual-interface IC card, and a decrease in design quality and operational reliability can be suppressed. It goes without saying that the conductive member of the second embodiment is also applicable to the IC card 1a of the third embodiment. [Explanation of symbols]

[0076] 1. 1a IC card 2 card bases 3, 6 Oversheet Layers 4, 5 core layers 9 recesses 11 Adhesive layer 70, 70a, 70b IC modules 71 External connection terminals 71a Insulation groove 72 circuit boards 73a, 73b Antenna connection terminals 74 IC chip units 74a IC chip 74b Molding section 75 wires 76 Bonding Holes 80 Antenna 91 First recess 92 Second recess 210, 220 Conductive members 211, 221 conductive layer 212 Insulating layer 213, 223 adhesive layer 222 Protrusion

Claims

1. Card base and, The card base comprises an IC module disposed in a recess and equipped with an external connection terminal and an IC chip, The external connection terminal is arranged so as to be exposed on the surface of the card base and is divided into a first terminal, a second terminal, and a third terminal which are insulated from each other. Either the first terminal or the second terminal is electrically connected to a pad of the IC chip, and the other is electrically connected to a third terminal. The third terminal is a terminal related to power supply and signal input / output for the contact IC card. An IC card in which the IC chip and the third terminal conduct electricity and enable contact communication with an external device only when the first and second terminals are short-circuited.

2. The IC card according to claim 1, wherein the first terminal and the second terminal are terminals that are designated as unused terminals in the contact-type IC card standard, or terminals that are not assigned as Vcc, RST, CLK, GND, or I / O.

3. The IC card according to claim 1, wherein the third terminal is a terminal assigned as Vcc, RST, CLK, GND, or I / O in the contact-type IC card standard.

4. The IC card according to claim 1, which is a dual-interface IC card.

5. It can be arranged to span from the first terminal to the second terminal, The IC card according to any one of claims 1 to 4, further comprising a conductive member that can be arranged to short-circuit the first terminal and the second terminal and to insulate from other terminals located between the first terminal and the second terminal.

Images