Electronic component storage container

Abstract

Provided is an electronic-component accommodation container with which it is possible to reduce the quantity of electronic components that attach to an inner wall part of the electronic-component accommodation container, by adjusting the surface roughness of the inner wall part. An electronic-component accommodation container 1 according to the present invention is provided with a component accommodation space 11 that accommodates a plurality of electronic components M, and a discharging port 19 for externally discharging the electronic components M accommodated in the component accommodation space 11, the component accommodation space 11 being surrounded by an inner wall part that has a skewness Rsk of -0.8 to -0.3 inclusive. The inner wall part may be at least one of all inner wall parts surrounding the component accommodation space 11, and preferably includes an inner wall part having the largest area contacting the electronic components M among all the inner wall parts surrounding the component accommodation space 11.

Description

Technical Field

[0001] The present invention relates to an electronic component storage container for storing electronic components such as chip components.

Background Art

[0002] When mounting an electronic component housed in an electronic component storage container on a substrate, the electronic component is discharged from the discharge port of the electronic component storage container. For example, Patent Document 1 discloses an electronic component storage container that collectively stores electronic components in a scattered state in the electronic component storage container and drops the stored electronic components from the discharge port at the bottom to a feeder.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, conventionally, when transporting a storage container in which electronic components are stored, there has been a problem that the electronic components adhere to the inner wall portion of the electronic component storage container and remain in the electronic component storage container when taken out. As a result of intensive studies, the inventors of the present invention have found that the surface roughness of the inner wall portion forming the component storage space of the electronic component storage container affects the remaining number of electronic components.

[0005] An object of the present invention is to provide an electronic component storage container capable of reducing the amount of adhesion of electronic components to the inner wall portion by adjusting the surface roughness of the inner wall portion of the electronic component storage container.

Means for Solving the Problems

[0006] To solve the above problems, the present invention provides an electronic component storage container comprising a component storage space for accommodating a plurality of electronic components, and an outlet for discharging the electronic components housed in the component storage space to the outside, wherein the skewness Rsk of the inner wall surrounding the component storage space is -0.8 or more and -0.3 or less. [Effects of the Invention]

[0007] According to the present invention, by adjusting the surface roughness of the inner wall of the electronic component storage container, it is possible to provide an electronic component storage container that can reduce the amount of electronic components adhering to the inner wall. [Brief explanation of the drawing]

[0008] [Figure 1] This is a front view of the electronic component housing 1, seen from the front. [Figure 2] This is a bottom view of the electronic component housing container 1, seen from below. [Figure 3] This is a view of the inside of the electronic component housing 1 from one side. [Figure 4] This graph shows the relationship between the skewness Rsk of the electronic component housing container 1 and the number of electronic components M that remain in the component housing space 11, adhering to the inner wall. [Figure 5] This graph shows the relationship between the arithmetic mean roughness Ra of the electronic component housing container 1 and the number of electronic components M that adhere to the inner wall and remain in the component housing space 11. [Figure 6] This graph shows the relationship between the root mean square roughness Rq of the electronic component housing container 1 and the number of electronic components M that adhere to the inner wall and remain in the component housing space 11. [Modes for carrying out the invention]

[0009] [Electronic component housing 1] Hereinafter, an embodiment of the electronic component housing container 1 of the present invention will be described with reference to the drawings. Figure 1 is a front view of the electronic component housing container 1 as seen from the front. Figure 2 is a bottom view of the electronic component housing container 1 as seen from below. Figure 3 is a view of the inside of the electronic component housing container 1 as seen from one side.

[0010] The electronic component housing container 1 houses multiple electronic components M in a loose state. The electronic component housing container 1 containing the multiple electronic components M is set on a feeder (not shown), and the electronic components M are discharged from the electronic component housing container 1 by vibration of the feeder and supplied to a mounting device or the like. The electronic components M in this embodiment are, for example, tiny rectangular parallelepiped electronic components M with a longitudinal length of 1.2 mm or less. Examples of such electronic components M include capacitors and inductors, but this embodiment is not limited to these.

[0011] The arrows W, L, and H shown in the reference drawing indicate the left-right direction W, the front-back direction L, and the up-down direction H of the electronic component housing container 1 in its operating state when set on the feeder, respectively.

[0012] The electronic component housing container 1 has a first member 2 and a second member 3 that are divided into left and right halves. The first member 2 and the second member 3 are molded bodies made of resin such as ABS resin. The first member 2 and the second member 3 are combined and joined together to form the electronic component housing container 1. The joining of the first member 2 and the second member 3 is by means of ultrasonic bonding or bonding with adhesive, but is not limited to these means.

[0013] Figure 3 shows the interior of the second member 3 on the right side, with the first member 2 on the left side absent. The electronic component housing container 1 has a flattened box shape, being long in the front-to-back direction L and thin in the left-to-right direction W. In the following description, unless necessary, the first member 2 and the second member 3 will not be described individually, but rather the configuration will be described in the state in which the first member 2 and the second member 3 are joined together.

[0014] The electronic component housing container 1 includes a container body 10 for housing a plurality of electronic components M, a discharge port 19 as an opening for housing or discharging the electronic components M into and from the electronic component housing container 1, a shutter member 30 for opening and closing the discharge port 19, and a slide operation member 35 for performing a slide operation of the shutter member 30.

[0015] [Container body 10] The container body 10 has a top plate portion 12 and a bottom plate portion 13 extending in the front-rear direction L, a front wall portion 14 and a rear wall portion 15 extending in the vertical direction H, a pair of left and right side wall portions 16, and an inclined plate portion 17 for vertically partitioning the inside of the container body 10. The rear wall portion 15 includes an outer rear wall portion 15a forming an outer surface and an inner rear wall portion 15b in front of the outer rear wall portion. Inside the container body 10, a component housing space 11 for housing a plurality of electronic components M in a scattered state is formed.

[0016] The discharge port 19 is provided at the lower part of the front wall portion 14. The discharge port 19 is a rectangular opening. Note that the discharge port 19 is not limited to a rectangle and may be, for example, circular, elliptical, etc. The discharge port 19 is opened and closed by the shutter member 30.

[0017] The inclined plate portion 17 is a plate member extending between the left and right side wall portions 16 and extending from the inner rear wall portion 15b to the lower part of the discharge port 19. The inclined plate portion 17 is disposed below the center of the container body 10 in the vertical direction H inside. Inside the container body 10, the upper side of the inclined plate portion 17 is the component housing space 11, and the lower side is the lower space 18.

[0018] The inclined plate portion 17 is inclined downward toward the discharge port 19, and its upper surface is an inclined surface 17i inclined downward toward the discharge port 19. In the present embodiment, the inclination angle θ1 of the inclined surface 17i is about 5° with respect to the horizontal direction when the electronic component housing container 1 is set in the feeder. The inclination angle θ1 of the inclined surface 17i is preferably 3° or more and 10° or less. Note that the inclination angle θ1 of the inclined surface 17i is appropriately adjusted according to the vibration conditions of the feeder and the like.

[0019] A hole 16a extending in the front-to-back direction is formed in the lower and rear part of the lower space 18, and a long, strip-shaped RFID tag 27 in the front-to-back direction L is arranged on the upper surface of the hole 16a. The RFID tag 27 has a known configuration including a transmitting / receiving unit, memory, and antenna. For example, a reader / writer for reading and writing information to the RFID tag 27 is arranged in the feeder into which the electronic component housing container 1 is set.

[0020] The container body 10 has an upper gripping portion 28A and a rear gripping portion 28B. The upper gripping portion 28A is a pair of front and rear recesses provided at both the front and rear ends of the upper side of the container body 10. The rear gripping portion 28B is a pair of upper and lower recesses provided at both the upper and lower ends of the rear side of the container body 10. The upper gripping portion 28A and the rear gripping portion 28B are each gripped by a robot hand, for example, when transporting the electronic component container 1 by a robot hand.

[0021] The container body 10 has a plurality of claws on its bottom surface for detachably setting onto the feeder. In this embodiment, the first claw 61, the second claw 62, and the third claw 63 are provided on the bottom surface at intervals in the front-rear direction L. Each of the first claw 61, the second claw 62, and the third claw 63 is integrally molded with the container body 10. The first claw 61 and the second claw 62 are each composed of a T-shaped slot that forms an inverted T shape in cross-section in a plane along the top, bottom, left, and right directions. The third claw 63 is a plate portion that extends to the rear and has an L-shape in side view.

[0022] The shutter member 30 opens and closes the discharge port 19 by sliding. The shutter member 30 extends continuously from the bottom plate portion 13 to the front wall portion 14 and is slidable along its extending direction. The shutter member 30 is an elongated strip-shaped film member. The shutter member 30 is made of a flexible material that has a certain degree of rigidity and can be bent, such as PET (Polyethylene terephthalate). The thickness of the shutter member 30, which is made of such a film-like material, is not limited, but it is preferable to have a thickness of 0.1 mm or more and 0.5 mm or less. The width of the shutter member 30 is slightly larger than the width of the discharge port 19 and has a width that can cover the discharge port 19 without gaps. An opening 31 which is substantially the same shape as the discharge port 19 is provided at the front end of the shutter member 30.

[0023] The shutter member 30 is slidable along the lower guide portion 5 and the upper guide portion 4 provided on the container body 10. The lower guide portion 5 is located above the bottom plate portion 13, and the upper guide portion 4 is located above the discharge port 19. The rear side of the shutter member 30 slides along the lower guide portion 5 in a generally horizontal front-to-back direction L, and the front side slides along the upper guide portion 4 in a vertical direction H. The lower guide portion 5 and the upper guide portion 4 each form a passage that holds the shutter member 30 in a slidable position while maintaining the surface direction of the shutter member 30 along the left-to-right direction W.

[0024] The lower guide portion 5 includes a first lower guide portion 51 positioned below the discharge port 19 and a second lower guide portion 52 positioned behind the first lower guide portion 51. The second lower guide portion 52 consists of a convex portion 17c that protrudes downward at the front end of the inclined plate portion 17 and a gap formed between it and the bottom plate portion 13. The first lower guide portion 51 consists of the front end surface 17b of the inclined plate portion 17 and the front end portion 29 of the bottom plate portion 13.

[0025] The rear portion of the shutter member 30 passes through the gap between the protrusion 17c and the bottom plate portion 13 at the second lower guide portion 52. As a result, the rear portion of the shutter member 30 slides in the front-rear direction L directly above the bottom plate portion 13. At the first lower guide portion 51, the shutter member 30 slides along the front end portion 29 of the bottom plate portion 13, which is concavely curved in the front-rear direction L, and further slides along the front end surface 17b of the inclined plate portion 17, thereby bending upward at an angle of approximately 90° from the horizontal and changing to a posture that extends in the vertical direction H.

[0026] The upper guide portion 4 includes a guide slit 41 formed in the front wall portion 14 and extending in the vertical direction H. The front end of the shutter member 30 is inserted into the guide slit 41 from the lower end of the front wall portion 14 and slides within the guide slit 41 along the vertical direction H.

[0027] The slide operating member 35 is a component for sliding the shutter member 30 to open and close the discharge port 19. The slide operating member 35 is located at the rear end of the shutter member 30.

[0028] The bottom plate portion 13 of the container body 10 has a protruding plate portion 21 on its front side. The protruding plate portion 21 protrudes downward and extends in the front-rear direction L. The protruding plate portion 21 is provided with an elongated hole 21a that extends in the front-rear direction L. Above the protruding plate portion 21, a plate portion 26 is arranged with a predetermined space 22 between it and the protruding plate portion 21. The plate portion 26 is substantially parallel to the protruding plate portion 21 and is molded integrally with the bottom plate portion 13. The space 22 is surrounded by the protruding plate portion 21, the plate portion 26 and the left and right side wall portions 16. The slide operating member 35 is arranged within the space 22. The front end of the plate portion 26 is provided with a front projection 26a that protrudes downward. The rear end of the plate portion 26 is provided with a rear projection 26b that protrudes downward.

[0029] The slide operating member 35 is a rectangular plate that is long in the front-to-back direction L. The slide operating member 35 has a circular operating hole 36 that penetrates in the vertical direction H. The operating hole 36 communicates with the elongated hole 21a of the container body 10 and is exposed to the outside through the elongated hole 21a.

[0030] A slit 37 is formed in the middle of the slide operating member 35 in the vertical direction H, extending along the front-rear direction L and opening to the front. The rear end of the shutter member 30 is inserted into the slit 37 through the front opening. The slit 37 opens to the front of the slide operating member 35 and not to the rear. The slit 37 may also open to the left and right sides of the slide operating member 35. The rear end of the shutter member 30 is inserted into the slit 37 through the front opening. The shutter member 30 is fixed to the slide operating member 35 by means of adhesive or other means. As a result, the shutter member 30 can slide together with the slide operating member 35 within the space 22. It slides in the front-rear direction L, guided by sliding against the protruding plate portion 21, plate portion 26 and left and right side wall portions 16 of the bottom plate portion 13.

[0031] On the upper surface of the slide operating member 35, a front recess 32a is provided at the front end and a rear recess 32b is provided at the rear end. When the slide operating member 35 slides forward, the front convex portion 26a of the plate portion 26 engages with the front recess 32a, restricting further forward sliding. At this time, the opening 31 of the shutter member 30 is positioned above the discharge port 19, and the lower portion of the opening 31 of the shutter member 30 closes the discharge port 19.

[0032] On the other hand, when the slide operating member 35 slides backward, the rear convex portion 26b of the plate portion 26 engages with the rear recess 32b, restricting further backward sliding. At this time, the opening 31 of the shutter member 30 aligns with the discharge port 19, causing the discharge port 19 to open.

[0033] In the electronic component storage container 1, after a predetermined number of electronic components M are placed in the component storage space 11 through the discharge port 19, the slide operating member 35 is slid forward to close the discharge port 19 with the shutter member 30, and the container is then shipped to the supplier of the electronic components M. Figure 3 shows the inside of the electronic component storage container 1 at the time of shipment. The user who receives the electronic component storage container 1 can open the discharge port 19, for example, as follows.

[0034] An operating pin (not shown) is inserted into the operating hole 36 of the slide operating member 35, and the operating pin is moved in the opening direction of the shutter member, i.e., backward. As a result, the shutter member 30 slides backward in conjunction with the slide operating member 35, and the opening 31 of the shutter member 30 aligns with the discharge port 19, causing the discharge port 19 to open.

[0035] Furthermore, the mechanism for sliding the shutter member 30 to open and close the discharge port 19 is not limited to the configuration in which the slide operating member 35 is integrally provided with the shutter member 30 as described above, and other mechanisms may be adopted.

[0036] [Roughness of contact surfaces of electronic components] In this embodiment, at least a portion of the electronic component contact surface in the electronic component housing container 1, which is the surface that comes into contact with the electronic component M, has a predetermined range of surface roughness. The surface roughness is expressed as skewness Rsk, arithmetic mean roughness Ra, or root mean square roughness Rq.

[0037] [Range of contact surface of electronic components] The electronic component contact surface includes the inner wall portion forming the component housing space 11 and the inner surface of the outlet 19, and may also include the outer wall surface of the component housing space 11. The inner wall portion includes the inner side wall portions 16i of the pair of left and right side wall portions 16, the inclined surface 17i of the inclined plate portion 17, the inner rear wall portion 15i of the inner rear wall portion 15b, the inner front wall portion 14i of the front wall portion 14, and the inner top plate portion 12i of the top plate portion 12.

[0038] At least a portion of the electronic component contact surface having a predetermined range of surface roughness includes the portion of the inner wall that has the largest contact area with the electronic component M. In the electronic component housing container 1 of the embodiment, the inner wall portion with the largest contact area with the electronic component M is the side wall inner wall portion 16i, so the inner wall portion having a predetermined range of surface roughness includes the side wall inner wall portion 16i.

[0039] Furthermore, it is preferable that at least a portion of the inner wall portion having a predetermined range of surface roughness includes an inclined surface 17i in addition to the side wall inner wall portion 16i. Furthermore, it is more preferable that at least a portion of the inner wall portion having a predetermined range of surface roughness includes, in addition to the side wall inner wall portion 16i and the inclined surface 17i, the rear wall inner wall portion 15i and the front wall inner wall portion 14i. Furthermore, it is even more preferable that at least a portion of the inner wall portion having a predetermined range of surface roughness includes the top plate inner wall portion 12i, in addition to the side wall inner wall portion 16i, the inclined surface 17i, the rear wall inner wall portion 15i, and the front wall inner wall portion 14i.

[0040] Furthermore, in at least a portion of the inner wall having a predetermined range of surface roughness, it is preferable that the portion having the predetermined range of surface roughness covers the entire surface of each respective surface. For example, it is preferable that the entire surfaces of the two side wall portions 16 have the predetermined surface roughness. However, it is not limited to the entire surface; it may be only a portion, in which case it is preferable to include a portion that is likely to come into contact with the electronic component M.

[0041] [Specified range of surface roughness] When the outlet 19 is opened, the electronic components M slide down the inclined surface 17i and flow out of the component storage space 11 of the electronic component storage container 1. However, some electronic components M remain attached to the inner wall of the electronic component storage container 1 and do not flow out. As the surface roughness of the inner wall increases, the number of these remaining components tends to increase, so the upper limit of the surface roughness was set to the value at which the number of remaining components reaches the upper limit of the acceptable value. Furthermore, as the surface roughness of the inner wall of the component housing space 11 of the electronic component housing container 1 decreases, the number of manufacturing processes and manufacturing costs increase. For this reason, a lower limit was set for the value that is acceptable from a manufacturing perspective.

[0042] [Skewness Rsk] In the embodiment, the skewness Rsk, which is one of the predetermined ranges of surface roughness possessed by at least a portion of the inner wall portion forming the component housing space 11, is preferably in the range of -0.8 to -0.3, and more preferably in the range of -0.76 to -0.38. The skewness Rsk represents the symmetry between peaks and troughs when the moving average is centered on it. When Rsk=0, relative to the moving average... Symmetry It follows a normal distribution and can be calculated using the formula shown in Figure 4. The definition of Rsk is based on the standard described in JIS B 0601. Rsk represents the mean cube of the height curve Z(x), which is the amplitude around the mean line at a reference length, obtained by cube the root mean square roughness Rq (described later) of the contour curve (height curve). Rsk indicates the degree of asymmetry in the probability density function of the height curve. l (L) in the formula shown in Figure 4 is the length in the X-axis direction of the height curve used to determine the characteristics of the height curve. Z(x) is the height at an arbitrary position x and is a vertical coordinate value. When Rsk > 0, it is biased downwards with respect to the mean line, and when Rsk < 0, it is biased upwards with respect to the mean line. Note that skewness Rsk is a parameter closely related to tribology (friction).

[0043] [Arithmetic mean roughness Ra] Furthermore, the arithmetic mean roughness Ra, which is one of the predetermined ranges of surface roughness possessed by at least a portion of the inner wall portion forming the component housing space 11, is preferably in the range of 1.5 μm to 3.5 μm in the embodiment. The arithmetic mean roughness Ra is the average value of the average height difference from the mean surface. When a reference length is extracted from the height curve in the direction of the mean line, and the X-axis is drawn in the direction of the mean line of this extracted portion, and the Z-axis is drawn in the direction of the vertical scaling, and the height curve is represented as Z(x), it can be calculated using the formula shown in Figure 5.

[0044] [Root Mean Square Roughness Rq] Furthermore, the root mean square roughness Rq, which is one of the predetermined ranges of surface roughness possessed by at least a portion of the inner wall portion forming the component housing space 11, is preferably in the range of 1.8 μm to 4.5 μm in the embodiment. The root mean square roughness Rq corresponds to the standard deviation of the height distribution, which represents the root mean square of Z(x), the height at an arbitrary position x on the surface, and is calculated by the formula shown in Figure 6. It is easy to handle statistically and is less affected by disturbances such as dust, scratches, and noise, so stable results can be obtained. Furthermore, Rq is preferably greater than Ra. In this case, the surface roughness is coarser.

[0045] [Verification Results] Multiple electronic component housing containers 1 (A, B, C, D, E, F) made of ABS resin with different surface roughness were prepared. Surface roughness was adjusted by blasting the surface of the molding die, controlling the particle size and time during blasting. Skewness Rsk was adjusted by performing two blasting treatments with different particle sizes to control the depth of the grooves. The skewness Rsk, arithmetic mean roughness Ra, and root mean square roughness Rq were measured for each electronic component housing 1 (A, B, C, D, E, F). The surface resistance of the electronic component housing 1 (A, B, C, D, E, F) was 10 8 Ω / cm 2 The above 10 10 Ω / cm 2 The following applies: As a resin, it is relatively resistant to static electricity.

[0046] The surface roughness is defined by JIS B 0601-2001, as established by the Japanese Industrial Standards Committee. In the embodiment, a shape measuring laser microscope VK-X100 (manufactured by KEYENCE) was used as the equipment, with an observation magnification of 200x (objective 10x, 1350x10¹² μm), a resolution of 1.36 μm / pixel measurement, and the mode based on JIS B0601-2001 (ISO4287:1997).

[0047] [Measurement location] The surface roughness of the inner wall portion forming the component housing space 11 was measured at the inner wall portion with the largest contact area with the electronic component M. In this embodiment, the inner wall portion with the largest contact area with the electronic component M is one of the two side wall inner wall portions 16i, and the measurement was performed at one of them. In this embodiment, all the inner wall portions forming the component housing space 11 are manufactured in the same way, so all the inner wall portions have approximately the same surface roughness.

[0048] Then, the average value of the surface roughness (skewness Rsk, arithmetic mean roughness Ra, and root mean square roughness Rq) measured at any three locations on the inner wall portion 16i of the side wall was defined as the surface roughness of that surface. Any three locations, though not limited to these, are defined in the embodiment as shown in Figure 3, where three lines L1, L2, and L3 are drawn at equal intervals in the H direction on the inner wall portion 16i of the side wall. Here, the distances in the Y direction between the front inner wall portion 14i and L1, between L1 and L2, between L2 and L3, and between L3 and the rear inner wall portion 15i are approximately equal. On the three lines L1, L2, and L3, lines m1, m2, and m3, each 4 mm long, are drawn parallel to the inclined surface 17i, centered at a point approximately 1 / 3 of the distance between the inclined surface 17i and the inner wall portion 12i of the top plate. The surface roughness of these lines m1, m2, and m3 is measured, and the average of these measured surface roughness values ​​is taken as the surface roughness of each electronic component housing container 1 (A, B, C, D, E, F).

[0049] Next, 10,000 electronic components measuring 0.4 x 0.2 x 0.2 mm are placed into the component storage spaces 11 of each of the electronic component storage containers 1 (A, B, C, D, E, F), and the electronic component storage containers 1 are mounted on a feeder. The shutter member 30 is slid open to open the discharge port 19. The electronic components M then slide down along the inclined surface 17i and are released from the discharge port 19. At this time, some electronic components M remain attached to the inner wall of the component storage space 11 without being released from the discharge port 19. The number of these remaining electronic components M is counted. In this embodiment, a remaining number of 50 or fewer is considered acceptable.

[0050] Figure 4 is a graph showing the relationship between the skewness Rsk of the electronic component housing containers 1 (A, B, C, D, E, F) and the number of electronic components M remaining in the component housing space 11 attached to the inner wall (PCS). The horizontal axis represents the skewness Rsk of the inner wall of the component housing space 11 of the electronic component housing containers 1 (A, B, C, D, E, F), and the vertical axis represents the number of electronic components M remaining in the component housing space 11. The straight lines shown in the graph are approximate straight lines for the number of remaining components in each of the electronic component housing containers 1 (A, B, C, D, E, F). As shown in the graph, along the approximate straight line, when the skewness Rsk is -0.5 or less, which is within the range of the embodiment, the number of electronic components M remaining in the component housing space 11 was 50 or less, which is within the acceptable range. By making Rsk a negative value, the plane often exists as a valley bottom, making it less likely for the electronic components M to adhere to the inner wall of the component housing container.

[0051] Figure 5 is a graph showing the relationship between the arithmetic mean roughness Ra of the electronic component housing containers 1 (A, B, C, D, E, F) and the number of electronic components M remaining in the component housing space 11 attached to the inner wall (PCS). The horizontal axis represents the arithmetic mean roughness Ra (μm) of the inner wall of the component housing space 11 of the electronic component housing containers 1 (A, B, C, D, E, F), and the vertical axis represents the number of electronic components M remaining in the component housing space 11. The straight line shown in the graph is an approximate straight line that passes through PCS=0 when Ra=0 for each of the remaining component counts in the electronic component housing containers 1 (A, B, C, D, E, F). As shown in the graph, when the arithmetic mean roughness Ra was 2.5 or less, which is within the range of the embodiment, the number of electronic components M remaining in the component housing space 11 was 50 or less, which is within the acceptable range.

[0052] Figure 6 is a graph showing the relationship between the root mean square roughness Rq of the electronic component housing containers 1 (A, B, C, D, E, F) and the number of electronic components M remaining in the component housing space 11 attached to the inner wall (PCS). The horizontal axis represents the root mean square roughness Rq (μm) of the inner wall of the component housing space 11 of the electronic component housing containers 1 (A, B, C, D, E, F), and the vertical axis represents the number of electronic components M remaining in the component housing space 11. The straight line shown in the graph is an approximate straight line that passes through PCS=0 when Rq=0 for each of the remaining component counts in the electronic component housing containers 1 (A, B, C, D, E, F). As shown in the graph, when the root mean square roughness Rq is 2.5 or less, which is within the range of the embodiment, the number of electronic components M remaining in the component housing space 11 was 50 or less, which is within the acceptable range.

[0053] As described above, by setting the skewness Rsk of the inner wall portion forming the component housing space 11 to a range of -0.3 or less in the embodiment, the number of electronic components M remaining in the component housing space 11 can be kept within the allowable range of 70 or less. Furthermore, by setting the skewness Rsk to -0.8 or higher in the embodiment, the component housing space 11 can be easily manufactured.

[0054] Furthermore, by setting the arithmetic mean roughness Ra of the inner wall portion forming the component housing space 11 to 3.5 μm or less, which is within the range of the embodiment, the number of electronic components M remaining in the component housing space 11 can be kept within the allowable range of 70 or less. And by setting the arithmetic mean roughness Ra to 1.5 μm or more, as in the embodiment, the component housing space 11 can be easily manufactured.

[0055] Furthermore, by setting the root mean square roughness Rq of the inner wall portion forming the component housing space 11 to 4.5 μm or less, which is within the range of the embodiment, the number of electronic components M remaining in the component housing space 11 can be kept within the acceptable range of 70 or less. And by setting the root mean square roughness Rq to 1.8 μm, as in the embodiment, the component housing space 11 can be easily manufactured.

[0056] Furthermore, the surface resistance value of the inner wall portion forming the component housing space 11 is 10 8 Ω / cm 2 The above 10 10 Ω / cm 2 Therefore, the inner wall portion forming the component housing space 11 is less prone to power outages, and the adhesion of electronic components M to the inner wall portion due to static electricity can be prevented.

[0057] Although embodiments have been described above, the present invention is not limited to these embodiments, and any modifications, improvements, etc., that can achieve the objectives of the present invention are included in the present invention. [Explanation of Symbols]

[0058] M Electronic parts 1. Electronic component housing 10 Container body 11. Component storage space 12 Top panel 12i Top panel inner wall 13 Bottom plate part 14 Front wall 14i Front inner wall 15 Rear wall 15i Rear wall inner wall 16 Side wall section 16i Side wall inner wall 17 Inclined plate part 17i Slope 19 Outlet 30 Shutter component

Claims

1. A component housing space that accommodates multiple electronic components, An electronic component housing container comprising an outlet for discharging the electronic components housed in the component housing space to the outside, The skewness Rsk of the inner wall surrounding the component housing space is -0.8 or more and -0.3 or less, and the arithmetic mean roughness Ra of the inner wall is 1.5 μm or more and 3.5 μm or less. Electronic component housing.

2. The electronic component housing container according to claim 1, wherein the skewness Rsk of the inner wall surrounding the component housing space is -0.76 or more and -0.38 or less.

3. The root mean square roughness Rq of the inner wall portion is 1.8 μm or more and 4.5 μm or less. An electronic component housing container according to claim 1 or claim 2.

4. The surface resistance is between 10⁸ Ω / cm² and 10¹¹ Ω / cm². An electronic component housing container according to any one of claims 1 to 3.

5. The aforementioned inner wall portion is at least a part of all the inner wall portions surrounding the component housing space. An electronic component housing container according to any one of claims 1 to 4.

6. The inner wall portion includes the inner wall portion with the largest surface area in contact with the electronic component among all the inner wall portions surrounding the component housing space. An electronic component housing container according to any one of claims 1 to 5.

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