Information processing device and three-dimensional molding device

The information processing device classifies slice layers in three-dimensional printing to facilitate easy removal of raft and support layers without sintering, addressing the challenge of resin-based printing by generating modeling data that enhances object creation efficiency and accuracy.

JP7835100B2Active Publication Date: 2026-03-25SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-04-26
Publication Date
2026-03-25

AI Technical Summary

Technical Problem

Existing three-dimensional printing methods using resin materials face difficulties in easily removing the raft layer and support from the printed object without a sintering process, as interface layers used in metal-based printing are not applicable.

Method used

An information processing device generates three-dimensional modeling data that includes slice layer type information and correspondence information to facilitate the generation of modeling paths, allowing for easy removal of the raft layer and support without sintering, by classifying slice layers into types such as first and second solid layers, build layers, and support layers.

Benefits of technology

Enables the creation of three-dimensional objects with resin materials where the raft layer and support can be easily removed without a sintering process, improving manufacturing efficiency and accuracy.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide an information processing device capable of generating three-dimensional molding data that allows each of a raft layer and a support to be easily removed from a molded object without a sintering process.SOLUTION: An information processing device includes: a molded object that has a shape of a three-dimensional object; a storage part that stores object data indicating at least an object including the molded object, among supports that support the molded object; and a generation part that slices an object into multiple slice layers, generates a molding path for each of the multiple slice layers, and generates data for three-dimensional molding that includes molding path information indicating the molding path for each of the multiple slice layers generated. When generating the molding path for a second slice layer, the generation part generates the molding path for the second slice layer based on a type of a first slice layer and the type of the second slice layer.SELECTED DRAWING: Figure 7
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Description

Technical Field

[0005] ,

[0001] This invention relates to an information processing apparatus and a three-dimensional shaping apparatus.

Background Art

[0002] Research and development have been carried out on a three-dimensional shaping apparatus that shapes a three-dimensional object by laminating a shaping material in which at least a part is melted.

[0003] Regarding this, as a three-dimensional shaping apparatus that laminates a shaping material containing a metal material to shape a three-dimensional object, there is known a three-dimensional shaping apparatus including a stage on which the shaping material is laminated, a raft layer is laminated on the stage, and a shaped body and a support are formed on the raft layer (see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] A three-dimensional printing apparatus, such as the one described in Patent Document 1, forms an interface layer at the interface between the raft layer, the support, and the printed object, which is made of a material that is difficult to bond to the printed object by sintering. This makes it easier to remove the raft layer and support from the printed object after the printing material has been sintered. Here, the ability to easily remove the raft layer and support from the printed object is also desired in the fabrication of three-dimensional objects by laminating resin materials. However, methods using such interface layers require a sintering process to sinter the printing material. On the other hand, the fabrication of three-dimensional objects by laminating resin materials does not include a sintering process. For this reason, it has been difficult to easily remove the raft layer or support from the three-dimensional object by applying this method to the fabrication of three-dimensional objects by laminating resin materials. [Means for solving the problem]

[0006] To solve the above problems, one aspect of the present invention is an information processing device for generating three-dimensional modeling data for stacking a plurality of slice layers as a three-dimensional model of a predetermined shape on a three-dimensional modeling device, comprising: a storage unit that stores object data indicating an object that includes at least the molded body, which is a molded body having the shape of the three-dimensional modeling object and a support that supports the molded body; slice condition information indicating slice conditions for virtually slicing the object indicated by the object data into the plurality of slice layers; and model path generation condition information indicating model path generation conditions for generating model paths for each of the plurality of slice layers, and generating model paths for each of the sliced ​​plurality of slice layers, and generating the plurality of slices The information processing device comprises a generation unit that generates three-dimensional modeling data including modeling path information indicating the modeling path for each of several slice layers, wherein the slice condition information includes first slice layer type information indicating the type of first slice layer among the plurality of slice layers, and second slice layer type information indicating the type of second slice layer stacked on top of the first slice layer among the plurality of slice layers, and the modeling path generation condition information includes correspondence information including information relating the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the modeling path for the second slice layer, and when the generation unit generates the modeling path for the second slice layer, it generates the modeling path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer.

[0007] Furthermore, one aspect of the present invention is a three-dimensional molding apparatus comprising an information processing apparatus that generates three-dimensional molding data for stacking a plurality of slice layers as a three-dimensional molded object of a predetermined shape in a three-dimensional molding apparatus, wherein the information processing apparatus stores object data indicating an object that includes at least the molded body, among the molded body having the shape of the three-dimensional molded object and a support that supports the molded body, slice condition information indicating slice conditions for virtually slicing the object indicated by the object data into the plurality of slice layers, and mold path generation condition information indicating mold path generation conditions for generating a mold path for each of the plurality of slice layers, and generates a mold path for each of the sliced ​​plurality of slice layers, and generates The three-dimensional molding apparatus comprises a generation unit that generates three-dimensional molding data including molding path information indicating the molding path for each of the plurality of slice layers, wherein the slice condition information includes first slice layer type information indicating the type of first slice layer among the plurality of slice layers, and second slice layer type information indicating the type of second slice layer that is stacked on top of the first slice layer among the plurality of slice layers, and the molding path generation condition information includes correspondence information including information that associates the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the molding path for the second slice layer, and when the generation unit generates the molding path for the second slice layer, it generates the molding path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows an example of the configuration of the three-dimensional modeling apparatus 1. [Figure 2] This figure shows an example of the hardware configuration of the data generation device 50. [Figure 3] This figure shows an example of the functional configuration of the data generation device 50. [Figure 4]This figure shows an example of the process flow in which the data generation device 50 generates data for three-dimensional modeling. [Figure 5] This figure shows an example of the contact area between a first slice layer LL1 and a second slice layer LL2 when the build path P1 of a first slice layer LL1 and the build path P2 of a second slice layer LL2 stacked on top of the first slice layer LL1 completely overlap in the vertical direction. [Figure 6] This figure shows an example of a cross-sectional view obtained when the first slice layer LL1 and the second slice layer LL2 are cut along the line A-A' shown in Figure 5. [Figure 7] This figure shows an example of the contact area between a first slice layer LL3 and a second slice layer LL4 when the build path P3 of a first slice layer LL3 and the build path P4 of a second slice layer LL4 stacked on top of the first slice layer LL3 do not substantially overlap in the vertical direction. [Figure 8] This figure shows an example of a cross-sectional view obtained when the first slice layer LL3 and the second slice layer LL4 are cut along the line B-B' shown in Figure 7. [Figure 9] This figure shows an example of the process flow in which the control device 40 causes the three-dimensional printing device 1 to print a three-dimensional object. [Modes for carrying out the invention]

[0009] <Embodiment> Embodiments of the present invention will be described below with reference to the drawings.

[0010] <Overview of 3D printing equipment> First, an overview of the three-dimensional molding apparatus according to this embodiment will be described.

[0011] The three-dimensional molding apparatus according to the embodiment includes an information processing device that generates three-dimensional molding data for stacking multiple slice layers on the three-dimensional molding apparatus as a three-dimensional object of a predetermined shape. The information processing device includes a storage unit and a generation unit. The storage unit stores object data that indicates an object including at least the molded body, which is one of a molded body having the shape of a three-dimensional object and a support that supports the molded body. The generation unit virtually slices the object indicated by the object data into multiple slice layers based on slice condition information indicating slice conditions for virtually slicing the object into multiple slice layers and build path generation condition information indicating build path generation conditions for generating a build path for each of the multiple slice layers. For each of the sliced ​​multiple slice layers, it generates a build path for the slice layer and generates three-dimensional molding data that includes build path information indicating the build path for each of the generated multiple slice layers. As a result, the three-dimensional molding apparatus can generate three-dimensional molding data that makes it easy to remove the raft layer and support from the molded body without a sintering process.

[0012] The following describes in detail the configuration of the three-dimensional molding apparatus according to the embodiment, the configuration of the information processing device provided in the three-dimensional molding apparatus, and the processing performed by the information processing device.

[0013] <Configuration of a 3D printing device> The configuration of the three-dimensional molding apparatus according to the embodiment will be described below, with the three-dimensional molding apparatus 1 as an example.

[0014] Figure 1 shows an example of the configuration of the three-dimensional molding apparatus 1.

[0015] Here, the three-dimensional coordinate system TC is a three-dimensional orthogonal coordinate system indicating directions in a figure in which the three-dimensional coordinate system TC is drawn. Hereinafter, for convenience of explanation, the X-axis in the three-dimensional coordinate system TC will be simply referred to as the X-axis. Also, hereinafter, for convenience of explanation, the Y-axis in the three-dimensional coordinate system TC will be simply referred to as the Y-axis. Further, hereinafter, for convenience of explanation, the Z-axis in the three-dimensional coordinate system TC will be simply referred to as the Z-axis. Also, hereinafter, as an example, the case where the negative direction of the Z-axis coincides with the gravitational direction will be described. For this reason, hereinafter, for convenience of explanation, the positive direction of the Z-axis will be referred to as the upward direction or simply up, and the negative direction of the Z-axis will be referred to as the downward direction or simply down.

[0016] The three-dimensional shaping apparatus 1 includes a discharge unit 10 having a nozzle Nz, a stage 20 having a shaping surface 21 on which a three-dimensional shaped object is shaped, a moving unit 30, a control device 40, and a data generation device 50. In the three-dimensional shaping apparatus 1, the data generation device 50 may be integrally configured with the control device 40. Also, the three-dimensional shaping apparatus 1 may be configured not to include the data generation device 50. In this case, the data generation device 50 is communicably connected to the three-dimensional shaping apparatus 1 from the outside. Also, the three-dimensional shaping apparatus 1 may be configured not to include the control device 40 and the data generation device 50. In this case, the data generation device 50 is communicably connected to the three-dimensional shaping apparatus 1 via the control device 40.

[0017] The three-dimensional 3D printing apparatus 1 changes the relative position between the extrusion unit 10 and the stage 20 while extruding a printing material X (not shown) from the extrusion unit 10 toward the printing surface 21 of the stage 20. In this way, the three-dimensional 3D printing apparatus 1 creates a three-dimensional object of a predetermined shape by stacking N slice layers. Here, N can be any integer greater than or equal to 1. In this case, the first slice layer from the bottom of the N slice layers is stacked on the printing surface 21. Each of the N slice layers stacked on the printing surface 21 is a layer of printing material X extruded along a printing path parallel to the printing surface 21. The printing path is the scanning path of the nozzle Nz as it moves while extruding the printing material X relative to the stage 20. That is, the three-dimensional 3D printing apparatus 1 extrudes the printing material X from the extrusion unit 10 along the printing path of the nth slice layer, stacking the nth slice layer on top of the (n-1)th slice layer. Each of the N slice layers may consist of a single layer or multiple stacked layers, where n is an integer between 1 and N. Furthermore, the build path of a slice layer includes an outline, which is the scanning path of the nozzle Nz along the contour of the slice layer, and an infill, which is the scanning path of the nozzle Nz within the region enclosed by the outline. That is, a slice layer is composed of build material X extruded along the outline of the slice layer and build material X extruded along the infill of the slice layer.

[0018] The three-dimensional shaping device 1 performs the shaping of such three-dimensional shaped objects based on three-dimensional shaping data. Here, the three-dimensional shaping device 1 generates three-dimensional shaping data according to the received operation. The three-dimensional shaping data is data for laminating N slice layers on the three-dimensional shaping device 1 as a three-dimensional shaped object having a predetermined shape. Shape data indicating the shape is stored in the three-dimensional shaping device 1. The shape data may be any data as long as it indicates the shape, for example, STL (Stereolithography) data. Based on the received operation and the shape data, the three-dimensional shaping device 1 generates object data indicating a virtual object including at least the shaped body among a virtual shaped body having the shape indicated by the shape data and a virtual support added to the shaped body to support the shaped body. The shaped body is a part separated from the N slice layers as one three-dimensional shaped object among the parts of the N slice layers to be laminated. Further, the support is a part of the N slice layers that supports the shaped body among the parts of the layers.

[0019] After generating object data, the 3D modeling apparatus 1 stores the generated object data. After storing the object data, the 3D modeling apparatus 1 virtually slices the object indicated by the stored object data into N layers based on the slicing condition information. Each of the N layers into which the object is virtually sliced ​​by the 3D modeling apparatus 1 corresponds to each of the aforementioned N slice layers. For the sake of explanation, in the following, the nth layer among these N layers will be referred to as slice layer VLn, and the nth slice layer among the aforementioned N slice layers will be referred to as slice layer Ln. In this case, for example, the first slice layer VL1 corresponds to the first slice layer L1. In the following, for the sake of explanation, unless it is necessary to distinguish between the first slice layer VL1 to the Nth slice layer VLN, they will simply be referred to as slice layer VL. Also, in the following, for the sake of explanation, unless it is necessary to distinguish between the first slice layer L1 to the Nth slice layer LN, they will simply be referred to as slice layer L. Here, the slice condition information refers to information indicating the slice conditions for virtually slicing the object indicated by the object data stored in the three-dimensional modeling apparatus 1 into N slice layers VL. The slice condition information includes information such as N, which is the number of N slice layers VL, and information indicating the thickness of each of the N slice layers VL.

[0020] After virtually slicing the object, the 3D printing apparatus 1 generates a printing path for each of the N sliced ​​layers VL based on the printing path generation condition information. The printing path is the scanning path of the nozzle Nz as it moves while extruding the printing material X to the stage 20. Therefore, the printing material X extruded along the printing path of the nth slice layer VLn is the actual slice layer Ln that corresponds to slice layer VLn.

[0021] Here, the nth slice layer VLn is one of the slice layers from which at least one of the printed body and the support contained in the object has been sliced. Therefore, the nth slice layer VLn contains at least one of the sliced ​​portion of the printed body and the sliced ​​portion of the support. In other words, the nth slice layer VLn contains at least one of the sliced ​​layer of the printed body and the sliced ​​layer of the support. The sliced ​​layers of the printed body are classified into two types: the first solid layer and the build layer. The first solid layer is the solid layer of the printed body. The printed body is composed of the first solid layer and the build layer which is stacked between the first solid layer and the first solid layer. In other words, the printed body is created by stacking the first solid layer and the build layer. The sliced ​​layers of the support are classified into three types: the second solid layer, the support layer, and the raft layer. The second solid layer is the solid layer of the support. The raft layer is the base layer on which the first solid layer, build layer, second solid layer, and support layer are each stacked. The support is composed of the second solid layer, the support layer stacked between the second solid layers, and the raft layer. In other words, the support is formed by stacking the second solid layer, the support layer, and the raft layer. For example, if the shape of a certain object has an overhang, the overhang portion of the object is supported by such a support. From the above, the type of the nth slice layer VLn is classified by the layers contained in the nth slice layer VLn. For example, if the nth slice layer VLn contains only the first solid layer, the type of the nth slice layer VLn is the first solid layer. Also, for example, if the nth slice layer VLn contains both the first and second solid layers, the type of the nth slice layer VLn is the type of layer from which the object was sliced ​​among the layers contained in the nth slice layer VLn. 、nThe nth slice layer VLn is represented by a combination of the types of layers from which the support was sliced, i.e., the combination of the first solid layer and the second solid layer. Furthermore, the type of the nth slice layer VLn is also the type of the nth slice layer Ln. Therefore, the three-dimensional molding apparatus 1 can identify the type of the nth slice layer VLn and the type of slice layer Ln based on the slicing condition information.

[0022] Based on the build path generation condition information, the three-dimensional printing apparatus 1 generates a build path for each of the N slice layers VL, and then generates three-dimensional printing data that includes build path information indicating the build path for each of the generated N slice layers VL. Here, the build path generation condition information is information that indicates the build path generation conditions for generating the build path for each of the N slice layers VL. The build path generation condition information includes information indicating the shape of the build path for each type of N slice layer VL, information indicating the width of the build path for each type of N slice layer VL, and information indicating the movement speed of the nozzle Nz when the printing material X is ejected along the build path for each type of N slice layer VL. In addition, the build path information indicating a certain build path includes other information such as information indicating the width of the build path and information indicating the movement speed of the nozzle Nz when the printing material X is ejected along the build path.

[0023] Furthermore, in the 3D printing apparatus 1, the slice condition information includes n-1th slice layer type information indicating the type of the (n-1)th slice layer VLn-1 out of N slice layers VL, and nth slice layer type information indicating the type of the nth slice layer VLn that is stacked on top of the (n-1)th slice layer VLn-1 out of N slice layers VL. Furthermore, in the 3D printing apparatus 1, the printing path generation condition information includes correspondence information that associates the type of the (n-1)th slice layer VLn-1, the type of the nth slice layer VLn, and information indicating the conditions for generating the printing path for the nth slice layer VLn. When the 3D printing apparatus 1 generates the printing path for the nth slice layer VLn, it generates the printing path for the nth slice layer VLn based on the correspondence information, the type of the (n-1)th slice layer VLn-1, and the type of the nth slice layer VLn. As a result, the 3D modeling apparatus 1 can generate 3D modeling data that makes it easier to remove the raft layer and support from the modeled body, without the need for a sintering process.

[0024] Here, the raft layer L, one of the N slice layers L, is a layer formed between the build surface 21 and the other layers as a base for the slice layers L of the other layers, and is a layer filled with build material X. The other layers are the individual slice layers L that are stacked on top of the raft layer among the N slice layers L, and specifically refer to some or all of the slice layers L of the first solid layer, build layer, second solid layer, and support layer. When the other layers are stacked on the build surface 21 so as to be in contact with the build surface 21, they may become difficult to peel off from the build surface 21. Also, in this case, the other layers may not be able to be fixed with good accuracy. Furthermore, residual stress may remain in the other layers. To solve these problems, the raft layer L is a layer that is stacked between the other layers and the build surface 21. Furthermore, the slice layers L of the solid layer, build layer, and support layer are formed by an outline, which is the build material X extruded along a predetermined outer shape contour, and an infill, which is the build material X extruded within the area enclosed by the outline. The slice layer L of the solid layer is a layer in which the area enclosed by the outline of the solid layer's slice layer L is filled almost completely with infill. In other words, the slice layer L of the solid layer is a layer in which the infill filling rate within that area is 100%. It can also be said that the slice layer L of the first solid layer is one or more layers containing the build material X that form the surface of the build object. Similarly, the slice layer L of the build layer is one or more layers containing the build material X that form the interior of the build object. Similarly, the slice layer L of the second solid layer is one or more layers containing the build material X that form the surface of the support. On the other hand, the slice layer L of the build layer is a layer in which infill is included within the area enclosed by the outline of the build layer, and there are areas within that area that are not filled with infill. In other words, the slice layer L of the build layer is a layer in which the infill filling rate within that region is less than 100%. Alternatively, the slice layer L of the build layer can be said to be one or more layers containing the build material X that form the interior of the build object.Furthermore, a slice layer L of the support layer is a layer in which infill is included within the region enclosed by the outline of the support layer, and there is a region within that region in which the infill is not filled. In other words, a slice layer L of the support layer is a layer in which the infill filling rate within that region is less than 100%. Also, a slice layer of the support layer. L is This can also be rephrased as one or more layers containing the molding material X that forms the interior of the support.

[0025] Based on the three-dimensional printing data generated as described above, the three-dimensional printing apparatus 1 stacks N slice layers L on the printing surface 21. Each of the N slice layers L is extruded onto the printing surface 21 by the extrusion unit 10, representing a type of slice layer L that is part or all of the raft layer, first solid layer, printing layer, second solid layer, and support layer. The N slice layers L are stacked to form a single three-dimensional object. As a result, the three-dimensional printing apparatus 1 can create a three-dimensional object in which the raft layer and support are easily removed, without the need for a sintering process. In other words, the three-dimensional printing apparatus 1 can create a three-dimensional object in which the raft layer and support are easily removed by stacking a printing material X containing a resin material.

[0026] The extrusion unit 10 extrudes the molding material X onto the molding surface. 2 1. This is an extrusion device that extrudes material upwards. More specifically, the extrusion unit 10 has, along with the nozzle Nz described above, a material melting section 11 that melts one or more types of material to form a molding material X, and a material supply section 12. In the extrusion unit 10, the material supply section 12 and the material melting section 11 are connected by a supply passage 13. The material melting section 11 and the nozzle Nz are connected by a communication hole 14. Therefore, the nozzle Nz is in communication with the material melting section 11. The nozzle Nz extrudes the molding material X supplied from the material melting section 11 through the communication hole 14 from its tip.

[0027] Here, when the 3D printing apparatus 1 stacks the nth slice layer Ln on top of the nth-1th slice layer Ln-1, it changes the width of the printing material X extruded onto the top surface of the nth-1th slice layer Ln-1 by changing the distance between the top surface of the nth-1th slice layer Ln-1 and the tip of the nozzle Nz. However, the maximum width of the printing material X extruded onto the top surface of the nth slice layer Ln by the 3D printing apparatus 1 is the outer diameter of the tip of the nozzle Nz. This is because if the distance between the top surface of the nth-1th slice layer Ln-1 and the tip of the nozzle Nz is made shorter than the inner diameter Dn of the tip of the nozzle Nz, the printing material X extruded from the tip of the nozzle Nz will be crushed by the tip of the nozzle Nz while stacking the nth-1th slice layer Ln on top of the nth-1th slice layer Ln-1. slice layer Ln-1 This is because it will be discharged onto the upper surface.

[0028] The material supply unit 12 contains one or more types of materials in the form of pellets, powder, etc. Below, as an example, we will describe the case where the material contained in the material supply unit 12 is pelletized ABS (acrylonitrile butadiene styrene) resin. Note that the material contained in the material supply unit 12 may be one or more other materials instead of ABS resin. The material supply unit 12 is composed of, for example, a hopper. The material contained in the material supply unit 12 is supplied to the material melting unit 11 via a supply passage 13 located below the material supply unit 12.

[0029] The material melting section 11 comprises a screw case 111, a flat screw 112 housed within the screw case 111, a drive motor 113 for driving the flat screw 112, and a barrel 114 fixed below the flat screw 112 within the screw case 111.

[0030] The flat screw 112 has a flattened cylindrical shape, and a spiral groove is formed on the bottom surface of the cylinder, extending from the outer circumference toward the central axis AX of the cylinder.

[0031] The barrel 114 is provided with a communication hole 14. The barrel 114 also has a built-in heater. The heater temperature is controlled by the control device 40.

[0032] The material supplied between the rotating flat screw 112 and the barrel 114 is melted, at least partially, by the rotation of the flat screw 112 and heating by a heater built into the barrel 114, becoming a fluid paste-like molding material X. The molding material X is supplied to the nozzle Nz through a communication hole 14 provided in the barrel 114 by the rotation of the flat screw 112. The molding material X supplied to the nozzle Nz is then extruded from the tip of the nozzle Nz toward the stage 20.

[0033] The moving unit 30 changes the relative position between the nozzle Nz of the discharge unit 10 and the stage 20. More specifically, the moving unit 30 changes the relative position between the nozzle Nz of the discharge unit 10 and the stage 20 by moving either the discharge unit 10 or the stage 20, or both. Below, as an example, we will describe the case in which the moving unit 30 changes the relative position between the nozzle Nz of the discharge unit 10 and the stage 20 by moving the stage 20. For example, the moving unit 30 is composed of a three-axis positioner that moves the stage 20 in directions parallel to the X, Y, and Z axes, respectively, by the driving force of three motors. In this case, these three motors are controlled by a control device 40. For the sake of explanation below, the relative speed of the discharge unit 10 with respect to the stage 20 will be simply referred to as the moving speed.

[0034] The control device 40 controls the entire three-dimensional molding apparatus 1. The control device 40 acquires the three-dimensional molding data generated by the data generation device 50 via a network or recording medium. The control device 40 manufactures a three-dimensional object by executing a pre-stored three-dimensional molding program and performing molding control that controls the operation of the ejection unit 10 and the moving unit 30 according to the three-dimensional molding data. Note that the control device 40 may be composed of a combination of multiple circuits rather than a computer.

[0035] The molding control refers to the control of the extrusion unit 10 and the moving unit 30. Specifically, the molding control refers to the control of creating a single three-dimensional object of a predetermined shape by stacking N slice layers L on the molding surface 21. Here, the nth slice layer Ln of the N slice layers L is stacked on top of the (n-1)th slice layer Ln-1. In this case, the nth slice layer Ln is stacked on top of the (n-1)th slice layer Ln -1 When stacked on top of the nth slice layer Ln, the heat of the nth slice layer Ln melts a portion of the (n-1)th slice layer Ln-1. As a result, the nth slice layer Ln is joined to the (n-1)th slice layer Ln-1. Consequently, on the build surface 21, the N slice layers L are stacked as a single three-dimensional object. Therefore, in this embodiment, the 0th slice layer L0 refers to the build surface 21. That is, in this embodiment, the 1st slice layer L1 is stacked on top of the 0th slice layer L0, i.e., the build surface 21.

[0036] When stacking the nth slice layer Ln on top of the (n-1)th slice layer Ln-1, the control device 40 controls the ejection unit 10 and the moving unit 30, and the ejection unit 10 ejects the molding material X along the molding path of the nth slice layer VLn corresponding to the nth slice layer Ln. In this way, the control device 40 can stack the nth slice layer Ln on top of the (n-1)th slice layer Ln-1. By performing the above control as molding control, the control device 40 sequentially ejects the molding material X, stacking N slice layers L on the molding surface 21 to create one three-dimensional object.

[0037] Here, the control device 40 is composed of a computer equipped with one or more processors, memory, and an input / output interface for inputting and outputting signals to and from the outside. The control device 40 includes a three-dimensional molding device control unit 41. The three-dimensional molding device control unit 41 acquires three-dimensional molding data generated by the data generation device 50, controls the three-dimensional molding device 1 based on the acquired three-dimensional molding data, and stacks N slice layers L on the molding surface 21 of the stage 20 to fabricate one three-dimensional object. The three-dimensional molding device control unit 41 is realized by the processor provided in the control device 40 executing a predetermined program stored in memory. This program may be recorded on a tangible, non-temporary recording medium that is readable by the computer.

[0038] The data generation device 50 is a device that generates three-dimensional modeling data used by the three-dimensional modeling device 1 to create three-dimensional objects. The data generation device 50 generates three-dimensional modeling data using the method by which the three-dimensional modeling device 1 generates three-dimensional modeling data as described above. For this reason, the explanation of this method will be omitted here. The data generation device 50 also stores the shape data mentioned above in accordance with the received operation. The data generation device 50 may or may not be capable of generating shape data. If the data generation device 50 is not capable of generating shape data, the data generation device 50 acquires shape data from another device via a network or storage medium.

[0039] The data generation device 50 is, for example, an information processing device such as a workstation, desktop PC (Personal Computer), notebook PC, tablet PC, multifunction mobile phone terminal (smartphone), mobile phone terminal, or PDA (Personal Digital Assistant), but is not limited to these.

[0040] Figure 2 shows an example of the hardware configuration of the data generation device 50.

[0041] The data generation device 50 comprises a processor 51, a storage unit 52, an input receiving unit 53, a communication unit 54, and a display unit 55. As mentioned above, the data generation device 50 may be an information processing device configured separately from the three-dimensional molding device 1. In this case, the three-dimensional molding device 1 is connected to this information processing device via the control device 40 in a communicative manner and is controlled by this information processing device.

[0042] The processor 51 is, for example, a CPU (Central Processing Unit). However, the processor 51 may also be another type of processor, such as an FPGA (Field Programmable Gate Array). Furthermore, the processor 51 may be composed of multiple processors. The processor 51 implements various functions of the data generation device 50 by executing various programs, instructions, etc., stored in the storage unit 52.

[0043] The storage unit 52 includes HDD (Hard Disk Drive), SSD (Solid State Drive), EEPROM (Electrically Erasable Programmable Read Only Memory), ROM (Read Only Memory), RAM (Random Access Memory), etc. Note that the storage unit 52 may be an external storage device connected via a digital input / output port such as USB (Universal Serial Bus) instead of being built into the data generation device 50. The storage unit 52 stores various programs, instructions, and information processed by the data generation device 50. For example, the storage unit 52 stores 3D modeling data, slice condition information, modeling path generation condition information, correspondence information, etc.

[0044] The input receiving unit 53 accepts user operations performed while viewing the image displayed on the display unit 55. The input receiving unit 53 is an input device including, for example, a keyboard, mouse, or touchpad. The input receiving unit 53 may also be a touch panel integrated with the display unit 55.

[0045] The communication unit 54 is comprised of, for example, digital input / output ports such as USB, and Ethernet (registered trademark) ports.

[0046] The display unit 55 displays an image. The display unit 55 is a display device that includes, for example, a liquid crystal display panel, an organic EL (ElectroLuminescence) display panel, etc., as a display provided by the data generation device 50.

[0047] Figure 3 shows an example of the functional configuration of the data generation device 50.

[0048] The data generation device 50 includes a storage unit 52, an input receiving unit 53, a communication unit 54, a display unit 55, and a control unit 56.

[0049] The control unit 56 controls the entire data generation device 50. The control unit 56 comprises a display control unit 561, a reception unit 562, and a generation unit 563. These functional units of the control unit 56 are realized, for example, by the processor 51 executing various programs stored in the storage unit 52. Some or all of these functional units may be hardware functional units such as LSIs (Large Scale Integration) or ASICs (Application Specific Integrated Circuits).

[0050] The display control unit 561 generates various images for the data generation device 50 to display on the display unit 55. The display control unit 561 displays the generated images on the display unit 55.

[0051] The reception unit 562 receives various types of information in response to operations received by the data generation device 50 via the input reception unit 53. This information includes, for example, the shape data, slice condition information, molding path generation condition information, and correspondence information mentioned above.

[0052] The generation unit 563 generates three-dimensional modeling data based on the shape data, slice condition information, and modeling path generation condition information received by the reception unit 562. The generation unit 563 stores the generated three-dimensional modeling data in the storage unit 52. The generation unit 563 also outputs the generated three-dimensional modeling data to other devices such as the control device 40 via the communication unit 54.

[0053] <Process by which the data generation device generates data for 3D modeling> The following describes the process by which the data generation device 50 generates data for three-dimensional modeling, with reference to Figure 4. Figure 4 is a diagram showing an example of the flow of the process by which the data generation device 50 generates data for three-dimensional modeling. In the following, as an example, we will describe the case in which the shape data is stored in the storage unit 52 at a timing prior to the processing of step S110 shown in Figure 4. Furthermore, in the following, as an example, we will describe the case in which the data generation device 50 receives a data generation process start operation at that timing to start generating data for three-dimensional modeling based on the shape data previously stored in the storage unit 52.

[0054] After receiving the operation to start the data generation process, the display control unit 561 reads the shape data that has been previously stored in the storage unit 52 from the storage unit 52 (step S110).

[0055] Next, the display control unit 561 generates an operation reception image and displays the generated operation reception image on the display unit 55 (step S120). Here, the operation reception image is an image that accepts input to the data generation devices 50 for slice condition information, build path generation condition information, and corresponding information. The operation reception image can be any image as long as it is capable of accepting input to the data generation devices 50 for slice condition information, build path generation condition information, and corresponding information. For example, the operation reception image is an image that includes a GUI (Graphical User Interface) that accepts input to the data generation devices 50 for slice condition information, build path generation condition information, and corresponding information. The operation reception image also displays a virtual model having the shape indicated by the shape data read by the display control unit 561 from the storage unit 52 in step S110, and accepts editing of the displayed model. Editing of the model is, for example, the addition of a virtual support, but is not limited to this. Furthermore, the operation reception image is an image that accepts an operation to generate object data that shows the molded body as an object after the support has been attached.

[0056] Next, the reception unit 562 waits until it receives an operation via the operation reception image (step S130).

[0057] If the reception unit 562 determines that it has received an operation via the operation reception image (step S130-YES), it determines whether or not to terminate the input of information to the data generation device 50 in the operation reception image (step S140). Here, in step S140, for example, if the operation received in step S130 was an operation indicating that the input has been completed, the reception unit 562 determines to terminate the input of information to the data generation device 50 in the operation reception image. On the other hand, in step S140, if the operation received in step S130 was an operation different from an operation indicating that the input has been completed, the reception unit 562 determines not to terminate the input of information to the data generation device 50 in the operation reception image.

[0058] If the reception unit 562 determines that the display control unit 561 and the generation unit 563 have not finished inputting information to the data generation device 50 in the operation reception image (step S140-NO), they perform processing according to the operation received in step S130 (step S150). This processing may include, but is not limited to, processing to receive information such as slice condition information, molding path generation condition information, and correspondence information, or processing to have the generation unit 563 generate object data. After the processing in step S150 is performed, the reception unit 562 transitions to step S130 and waits again until it receives an operation via the operation reception image.

[0059] In this way, the data generation device 50 receives slice condition information, molding path generation condition information, and correspondence information through the processing of steps S130 to S150, and generates object data.

[0060] On the other hand, when the receiving unit 562 determines that input of information to the data generation device 50 in the operation reception image has been completed (step S140-YES), the generation unit 563 slices the object indicated by the object data into N slice layers VL based on the object data generated by the processing in steps S130 to S150 and the slice condition information received by the processing (step S160).

[0061] Next, the generation unit 563 selects slice layers VL one by one from the N slice layers VL sliced ​​in step S160, starting with slice layer VL1, and repeats the process in step S180 for each selected slice layer VL (step S170).

[0062] Based on the slice condition information, build path generation condition information, and correspondence information received in steps S130 to S150, the generation unit 563 generates a build path for the slice layer VL selected in step S170 (step S180).

[0063] Here, we will explain the process in step S180 in detail. For the sake of explanation, in the following, the slice layer VL selected in step S170 will be referred to as the second slice layer, and the slice layer VL located directly below the second slice layer will be referred to as the first slice layer.

[0064] In step S180, if the first slice layer is a build layer and the second slice layer is a build layer, the generation unit 563 generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased. In this case, the correspondence information includes information indicating the type of build layer for the first slice layer, information indicating the type of build layer for the second slice layer, and information corresponding to the first build path generation condition information. The first build path generation condition information is an example of information indicating the conditions for generating the build path for the second slice layer, and it is information indicating that the build path for the second slice layer is generated such that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased.

[0065] The contact area between the build path of the first slice layer and the build path of the second slice layer is proportional to the contact area between the slice layer L corresponding to the first slice layer and the slice layer L corresponding to the second slice layer. Therefore, increasing the contact area between the build path of the first slice layer and the build path of the second slice layer means increasing the interlayer strength between the slice layer L corresponding to the first slice layer and the slice layer L corresponding to the second slice layer. Furthermore, the contact area between the build path of the first slice layer and the build path of the second slice layer changes depending on the degree of overlap between the build paths of the first and second slice layers. More specifically, the contact area increases as the degree of overlap increases. On the other hand, the contact area decreases as the degree of overlap decreases. The degree of overlap is determined by the orientation of the build path of the first slice layer and the orientation of the build path of the second slice layer. Therefore, generating the build path for the second slice layer in such a way that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased can be achieved, for example, by adjusting the orientation of the build path for the second slice layer relative to the orientation of the build path for the first slice layer.

[0066] Here, the orientation of the build path for a slice layer VL is defined at each position on that build path. Furthermore, the orientation of the build path at a certain position on that build path is defined as the direction in which the nozzle Nz moves to the next position at that position. For example, if the direction in which the nozzle Nz at position X1 on the build path moves to the next position X2 is the positive direction of the X axis, then the orientation of the build path at position X1 is the direction facing the positive direction of the X axis.

[0067] The degree of overlap between the build path of the first slice layer and the build path of the second slice layer increases as the orientations of the two build paths at each of the one or more overlapping locations where they overlap increases. On the other hand, the degree of overlap between the build path of the first slice layer and the build path of the second slice layer decreases as the orientations of the two build paths at each of the one or more overlapping locations where they overlap decreases as the orientations of the two build paths at each of the one or more overlapping locations where they overlap decreases.

[0068] Figure 5 shows an example of the contact area between a first slice layer LL1 and a second slice layer LL2 when the build path P1 of a first slice layer LL1 and the build path P2 of a second slice layer LL2 stacked on top of the first slice layer LL1 completely overlap in the vertical direction. The arrows shown in Figure 5 indicate the build paths P1 and P2, respectively, which completely overlap in the vertical direction. That is, each of the build paths P1 and P2 extends along the arrow from its starting point to its ending point. Figure 6 shows... 5This figure shows an example of a cross-sectional view when the first slice layer LL1 and the second slice layer LL2 are cut along the line A-A' shown. In Figures 5 and 6, the areas hatched with dots indicate the areas where the first slice layer LL1 and the second slice layer LL2 are in contact. The area of ​​the planes in this region that are parallel to the XY plane represents the contact area between the first slice layer LL1 and the second slice layer LL2. As shown in Figures 5 and 6, when the build path P1 and the build path P2 completely overlap in the vertical direction, that is, when the first slice layer LL1 and the second slice layer LL2 overlap so that the orientation of the build path P1 and the orientation of the build path P2 are parallel at each position on the build path P1, the area where the first slice layer LL1 and the second slice layer LL2 are in contact extends along the two build paths, P1 and P2. Therefore, in this case, the degree of overlap of the build paths between the first slice layer LL1 and the second slice layer LL2 is maximized. As a result, in this case, as shown in Figures 5 and 6, the contact area between the first slice layer LL1 and the second slice layer LL2 is maximized.

[0069] On the other hand, Figure 7 shows an example of the contact area between the first slice layer LL3 and the second slice layer LL4 when the build path P3 of a first slice layer LL3 and the build path P4 of the second slice layer LL4, which is stacked on top of the first slice layer LL3, do not overlap substantially in the vertical direction. The solid arrows in Figure 7 indicate the build path P3. That is, the build path P3 extends along the arrow from its starting point to its ending point. The dotted arrows in Figure 7 indicate the build path P4. That is, the build path P4 extends along the arrow from its starting point to its ending point. Figure 8 shows an example of a cross-sectional view when the first slice layer LL3 and the second slice layer LL4 are cut along the line B-B' shown in Figure 7. At multiple overlapping locations where the build paths P3 and P4 overlap, the build paths P3 and P4 are perpendicular to each other. Furthermore, in Figures 7 and 8, the areas hatched with dots indicate the areas where the first slice layer LL3 and the second slice layer LL4 are in contact. The area of ​​the surfaces in these areas that are parallel to the XY plane represents the contact area between the first slice layer LL3 and the second slice layer LL4. As shown in Figures 7 and 8, when the build path P3 and build path P4 are orthogonal at the multiple overlapping positions, the areas where the first slice layer LL3 and the second slice layer LL4 are in contact are scattered at each of these multiple overlapping positions. Therefore, in this case, the degree of overlap of the build paths between the first slice layer LL3 and the second slice layer LL4 is minimized. As a result, in this case, as shown in Figures 7 and 8, the contact area between the first slice layer LL3 and the second slice layer LL4 is minimized.

[0070] As described above, generating the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is increased can be achieved, for example, by adjusting the orientation of the build path of the second slice layer relative to the orientation of the build path of the first slice layer. For this reason, in step S180, if the first slice layer is a build layer and the second slice layer is a build layer, the generation unit 563 generates the build path of the second slice layer in such a way that the orientations of the two build paths become nearly parallel at one or more overlapping positions where the build paths of the first slice layer and the build paths of the second slice layer overlap. In this case, the generation unit 563 can generate the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is increased. As a result, the data generation device 50 can generate three-dimensional build data that can strengthen the interlayer strength between the build layers. In other words, the three-dimensional molding apparatus 1 can increase the interlayer strength between the molded layers.

[0071] Furthermore, if the first slice layer is a build layer and the second slice layer is also a build layer, the generating unit 563 can generate the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is increased by slowing down the movement speed of the nozzle Nz when extruding the build material X along the build path of the second slice layer. This is because when the movement speed of the nozzle Nz is slowed down, the volume of build material X extruded from the tip of the nozzle Nz per unit time increases.

[0072] Furthermore, if the first slice layer is a build layer and the second slice layer is also a build layer, the generation unit 563 can increase the width of the build path of the second slice layer by increasing the width of the build path of the second slice layer, thereby increasing the contact area between the build path of the first slice layer and the build path of the second slice layer.

[0073] Furthermore, in step S180, if the first slice layer is a solid layer and the second slice layer is a solid layer, the generation unit 563 generates a build path for the second slice layer such that the orientation of the build path for the first slice layer and the orientation of the build path for the second slice layer intersect at one or more overlapping positions where the build path for the first slice layer and the build path for the second slice layer overlap. For example, in step S180, the generation unit 563 generates a build path for the second slice layer such that the orientation of the build path for the first slice layer and the orientation of the build path for the second slice layer are orthogonal at one or more overlapping positions. In these cases, the correspondence information includes information indicating the type of the first slice layer, which is a solid layer, information indicating the type of the second slice layer, which is a solid layer, and information indicating the second build path generation conditions. The second build path generation condition information is information indicating that, for each of the one or more overlapping positions where the build path of the first slice layer and the build path of the second slice layer overlap, the build path of the second slice layer should be generated so that the orientation of the build path of the first slice layer and the orientation of the build path of the second slice layer intersect. In this case, the data generation device 50 can generate three-dimensional build data that can suppress the reduction in the aesthetic appearance of the three-dimensional object caused by the visibility of the shading of the build material X in the solid layer. In other words, the three-dimensional build device 1 can suppress the reduction in the aesthetic appearance of the three-dimensional object caused by the visibility of the shading of the build material X in the solid layer.

[0074] Furthermore, in step S180, if the first slice layer is a raft layer and the second slice layer is a raft layer, the generation unit 563 generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased. In this case, the correspondence information includes information indicating the type of the first slice layer, which is a raft layer, information indicating the type of the second slice layer, which is a raft layer, and the aforementioned first build path generation condition information. As a result, the data generation device 50 can generate three-dimensional modeling data that can increase the interlayer strength between raft layers. In other words, the three-dimensional modeling device 1 can increase the interlayer strength between raft layers.

[0075] Furthermore, in step S180, if the first slice layer is a support layer and the second slice layer is a support layer, the generation unit 563 generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased. In this case, the correspondence information includes information indicating the type of the first slice layer, which is a support layer, information indicating the type of the second slice layer, which is a support layer, and the aforementioned first build path generation condition information. As a result, the data generation device 50 can generate three-dimensional molding data that can strengthen the interlayer strength between support layers. In other words, the three-dimensional molding device 1 can strengthen the interlayer strength between support layers.

[0076] Furthermore, in step S180, if the first slice layer is a solid layer and the second slice layer is a build layer, the generation unit 563 generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is increased. In this case, the correspondence information includes information indicating the type of the first slice layer, which is a solid layer, information indicating the type of the second slice layer, which is a build layer, and the aforementioned first build path generation condition information. As a result, the data generation device 50 can generate three-dimensional molding data that can strengthen the interlayer strength between the first solid layer and the build layer. In other words, the three-dimensional molding device 1 can strengthen the interlayer strength between the first solid layer and the build layer.

[0077] Furthermore, in step S180, if the first slice layer is a raft layer and the second slice layer is a solid layer, the generation unit 563 generates the build path for the second slice layer in such a way that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced. In this case, the correspondence information includes information indicating the type of the first slice layer, which is a raft layer, information indicating the type of the second slice layer, which is a solid layer, and information corresponding to the third build path generation condition information. The third build path generation condition information is an example of information indicating the conditions for generating the build path for the second slice layer, and it is information indicating that the build path for the second slice layer is generated in such a way that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced. Here, in step S180, the generation unit 563 generates the printing path for the second slice layer such that, for example, at one or more overlapping locations where the printing path for the first slice layer and the printing path for the second slice layer overlap, the orientations of these two printing paths become nearly orthogonal. As a result, the generation unit 563 can generate the printing path for the second slice layer such that the contact area between the printing path for the first slice layer and the printing path for the second slice layer is reduced. As a result, the data generation device 50 can generate three-dimensional printing data that can weaken the interlayer strength between the raft layer and the first solid layer. In other words, the data generation device 50 can generate three-dimensional printing data that makes it easier to remove the raft layer from the printed body without a sintering process. Also, the three-dimensional printing device 1 can weaken the interlayer strength between the raft layer and the first solid layer. In other words, the three-dimensional molding apparatus 1 can easily remove the raft layer from the molded object without involving a sintering process.

[0078] Furthermore, when the first slice layer is a raft layer and the second slice layer is a solid layer, the generating unit 563 can also generate the printing path of the second slice layer in such a way that the contact area between the printing path of the first slice layer and the printing path of the second slice layer is reduced by increasing the movement speed of the nozzle Nz when extruding the printing material X along the printing path of the second slice layer. This is because when the movement speed of the nozzle Nz is increased, the volume of printing material X extruded from the tip of the nozzle Nz per unit time decreases.

[0079] Furthermore, if the first slice layer is a raft layer and the second slice layer is a solid layer, the generation unit 563 can also generate the build path for the second slice layer in such a way that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced by narrowing the width of the build path for the second slice layer.

[0080] Furthermore, in step S180, if the first slice layer is a support layer and the second slice layer is a solid layer, the generation unit 563 generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced. In this case, the correspondence information includes information indicating the type of the first slice layer, which is a support layer, information indicating the type of the second slice layer, which is a solid layer, and the aforementioned third build path generation condition information. As a result, the generation unit 563 can generate the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced. As a result, the data generation device 50 can generate three-dimensional modeling data that can weaken the interlayer strength between the support layer and the first solid layer. In other words, the data generation device 50 can generate three-dimensional modeling data that makes it easier to remove the support from the modeled body without a sintering process. Furthermore, the three-dimensional molding apparatus 1 can reduce the interlayer strength between the support layer and the first solid layer. In other words, the three-dimensional molding apparatus 1 can easily remove the support from the molded body without the need for a sintering process.

[0081] After the processing in step S180 is completed, the generation unit 563 selects the current second slice layer as the next first slice layer, then proceeds to step S170, where it selects the next slice layer VL as the second slice layer. If there is no unselected slice layer VL in step S170, the generation unit 563 terminates the repeated processing from step S170 to step S180.

[0082] After repeating the process from steps S170 to S180, the generation unit 563 generates the aforementioned three-dimensional modeling data based on the modeling paths of each of the N slice layers VL generated by the repeating process (step S190).

[0083] Next, the generation unit 563 outputs the three-dimensional modeling data generated in step S190 to the control device 40 (step S200), and stores the three-dimensional modeling data in the control device 40.

[0084] Next, the generation unit 563 stores the three-dimensional modeling data generated in step S190 in the storage unit 52 (step S210), and the process shown in the flowchart in Figure 4 is completed.

[0085] As described above, when the data generation device 50 generates a printing path for the second slice layer in step S180, it generates the printing path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. As a result, the data generation device 50 can generate three-dimensional printing data that makes it easier to remove the raft layer and support from the printed body without the need for a sintering process.

[0086] Furthermore, in step S160, that is, when slicing an object into N slice layers VL, if the 11th slice layer located on the lower side of two adjacent slice layers VL in the vertical direction is a solid layer, and the 12th slice layer located on the upper side of the two slice layers VL is a molded layer, the generation unit 563 may configure the 12th slice layer to be thicker than the thickness of each of the multiple solid layers including the 11th slice layer. In this case, the generation unit 563, for example, reduces the thickness of each of the multiple solid layers including the 11th slice layer by the amount by which the thickness of the 12th slice layer has been increased. As a result, the data generation device 50 can speed up the formation of the molded layer, and as a result, the manufacturing efficiency of the three-dimensional object can be improved.

[0087] Furthermore, in step S160, that is, when slicing an object into N slice layers VL, if the 11th slice layer located on the lower side of two adjacent slice layers VL in the vertical direction is a molded layer, and the 12th slice layer located on the upper side of the two slice layers VL is a solid layer, the generation unit 563 may configure the 12th slice layer to be thinner than the average thickness of each of the multiple molded layers, including the 11th slice layer. In this case, the generation unit 563, for example, increases the thickness of each of the multiple molded layers, including the 11th slice layer, by the amount by which the thickness of the 12th slice layer has been reduced. As a result, the data generation device 50 can reduce the light transmittance at the points where the molded paths come into contact, and as a result, it can suppress a decrease in the aesthetic appearance of the three-dimensional molded object.

[0088] Furthermore, if the generation unit 563 in step S180 contains two types of layers, a solid layer and a build layer, it may be configured to generate the build path such that an outline indicating the boundary between the solid layer and the build layer is included in the build path of the slice layer VL. This allows the data generation device 50 to generate three-dimensional build data that can suppress the occurrence of curling of the solid layer at the boundary between the solid layer and the build layer in the slice layer L corresponding to the slice layer VL. In other words, the three-dimensional build device 1 can suppress the occurrence of curling of the solid layer at the boundary between the solid layer and the build layer in the slice layer L corresponding to the slice layer VL.

[0089] <Process in which the control device causes the 3D printing device to create a 3D object> The following describes the process by which the control device 40 causes the three-dimensional object to be fabricated by the three-dimensional printing device 1, with reference to Figure 9. Figure 9 is a diagram showing an example of the flow of the process by which the control device 40 causes the three-dimensional object to be fabricated by the three-dimensional printing device 1. In the following, as an example, we will describe the case in which the three-dimensional printing data generated by the flowchart shown in Figure 4 is stored in the memory of the control device 40 at a timing prior to the processing of step S310 shown in Figure 9. Furthermore, in the following, as an example, we will describe the case in which the control device 40 receives a printing start operation to initiate the said process at that timing.

[0090] After receiving the operation to start the molding process, the 3D molding apparatus control unit 41 reads the 3D molding data that has been pre-stored in the memory of the control device 40 from that memory (step S310).

[0091] Next, the three-dimensional molding apparatus control unit 41 selects slice layers VL one by one from the N slice layers VL, starting with slice layer VL1, based on the three-dimensional molding data read in step S310, and repeats the process in step S330 for each selected slice layer VL (step S320).

[0092] In step S320, the 3D printing apparatus control unit 41 extrudes the printing material X along the printing path of the selected slice layer VL, and stacks the slice layer L corresponding to the slice layer VL (step S330). As a result, the 3D printing apparatus control unit 41, for example, if the slice layer VL is designated as the fourth slice layer, and the slice layer VL located directly below it is designated as the third slice layer, and the third slice layer is a printing layer, and the fourth slice layer is a printing layer, then the fourth slice layer is positioned such that the contact area with the printing path of the fourth slice layer is increased. 3 Layers can be stacked on top of slice layers. In other words, the three-dimensional molding apparatus 1 can increase the interlayer strength between the molded layers in this case.

[0093] Furthermore, the three-dimensional molding apparatus control unit 41 can, for example, when the third slice layer is a solid layer and the fourth slice layer is a solid layer, stack the fourth slice layer on top of the third slice layer so that the orientation of the printing path of the third slice layer and the orientation of the printing path of the fourth slice layer intersect at one or more overlapping positions where the printing path of the third slice layer and the printing path of the fourth slice layer overlap. In other words, in this case, the three-dimensional molding apparatus 1 can suppress the deterioration of the appearance of the three-dimensional molded object due to the visibility of the density of the molding material X in the solid layer.

[0094] Furthermore, the three-dimensional printing apparatus control unit 41 can, for example, if the third slice layer is a raft layer and the fourth slice layer is also a raft layer, stack the fourth slice layer on top of the third slice layer so that the contact area of ​​the fourth slice layer with the printing path is increased. In other words, in this case, the three-dimensional printing apparatus 1 can increase the interlayer strength between the raft layers.

[0095] Furthermore, the three-dimensional molding apparatus control unit 41 can, for example, if the third slice layer is a support layer and the fourth slice layer is also a support layer, stack the fourth slice layer on top of the third slice layer so that the contact area of ​​the fourth slice layer with the molding path is increased. In other words, in this case, the three-dimensional molding apparatus 1 can increase the interlayer strength between the support layers.

[0096] Furthermore, the three-dimensional molding apparatus control unit 41 can, for example, if the third slice layer is a solid layer and the fourth slice layer is a molding layer, stack the fourth slice layer on top of the third slice layer so as to increase the contact area of ​​the fourth slice layer with the molding path. In other words, the three-dimensional molding apparatus 1 in this case , so This allows for increased interlayer strength between the lid layer and the build layer.

[0097] Furthermore, the 3D printing apparatus control unit 41 can, for example, if the third slice layer is a raft layer and the fourth slice layer is a solid layer, stack the fourth slice layer on top of the third slice layer in such a way that the contact area of ​​the fourth slice layer with the printing path is reduced. In other words, in this case, the 3D printing apparatus 1 can stack the raft layer and So The interlayer strength between the lid layer and the raft layer can be weakened. In other words, the three-dimensional molding apparatus 1 can easily remove the raft layer from the molded body without the need for a sintering process.

[0098] Furthermore, the 3D printing apparatus control unit 41 can, for example, if the third slice layer is a support layer and the fourth slice layer is a solid layer, stack the fourth slice layer on top of the third slice layer such that the contact area of ​​the fourth slice layer with the printing path is reduced. In other words, in this case, the 3D printing apparatus 1 can stack the support layer and So The interlayer strength between the lid layer and the main body can be weakened. In other words, the three-dimensional molding apparatus 1 can easily remove the support from the molded body without the need for a sintering process.

[0099] After the processing in step S330 is completed, the 3D printing apparatus control unit 41 proceeds to step S320 and selects the next slice layer VL. If there are no unselected slice layers VL in step S320, the 3D printing apparatus control unit 41 terminates the repeated processing from step S320 to step S330 and ends the process shown in the flowchart in Figure 9.

[0100] Furthermore, the elements described above may be combined in any way.

[0101] As described above, the information processing apparatus according to the embodiment is an information processing apparatus that generates three-dimensional modeling data for stacking a plurality of slice layers as a three-dimensional model of a predetermined shape on a three-dimensional modeling apparatus, and includes a storage unit that stores object data indicating an object that includes at least the molded body, which is one of a molded body having the shape of a three-dimensional model and a support that supports the molded body, slice condition information indicating slice conditions for virtually slicing the object indicated by the object data into a plurality of slice layers, and model path generation condition information indicating model path generation conditions for generating model paths for each of the plurality of slice layers, and for each of the sliced ​​plurality of slice layers, model path generation conditions for the slice layer The information processing device comprises a generation unit that generates slices and generates three-dimensional modeling data including modeling path information indicating the modeling path for each of the generated slice layers. The slice condition information includes first slice layer type information indicating the type of the first slice layer among the multiple slice layers, and second slice layer type information indicating the type of the second slice layer stacked on top of the first slice layer among the multiple slice layers. The modeling path generation condition information includes correspondence information that associates the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the modeling path for the second slice layer. When the generation unit generates the modeling path for the second slice layer, it generates the modeling path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. As a result, the information processing device can generate three-dimensional modeling data that makes it easier to remove the raft layer and support from the modeled body without a sintering process. Here, in the example described above, the three-dimensional modeling apparatus 1 is an example of the three-dimensional modeling apparatus. Furthermore, in the example described above, the data generation device 50 is an example of the information processing device. Furthermore, in the example described above, the storage unit 52 is an example of the storage unit. Furthermore, in the example described above, the N slice layers VL are an example of the plurality of slice layers. Furthermore, in the example described above, the generation unit 563 is an example of the generation unit.Furthermore, in the example described above, the first solid layer, the build layer, the second solid layer, the support layer, and the raft layer are all examples of the types of the first slice layer, as well as examples of the types of the second slice layer.

[0102] Furthermore, in an information processing device, if the first slice layer is a build layer and the second slice layer is a build layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generation unit may be configured to generate the build path of the second slice layer such that, when the first slice layer is a build layer and the second slice layer is a build layer, the contact area between the build path of the first slice layer and the build path of the second slice layer is large.

[0103] Furthermore, in an information processing device, if the first slice layer is a solid layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the orientation of the build path of the first slice layer and the orientation of the build path of the second slice layer intersect at one or more overlapping positions where the build path of the first slice layer and the build path of the second slice layer overlap. The generation unit may be configured such that, if the first slice layer is a solid layer and the second slice layer is a solid layer, the build path of the second slice layer intersects at one or more overlapping positions where the build path of the first slice layer and the build path of the second slice layer overlap.

[0104] Furthermore, in an information processing device, if the first slice layer is a raft layer and the second slice layer is a raft layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generation unit may be configured to generate the build path of the second slice layer in such a way that, when the first slice layer is a raft layer and the second slice layer is a raft layer, the contact area between the build path of the first slice layer and the build path of the second slice layer is large.

[0105] Furthermore, in an information processing device, if the first slice layer is a support layer and the second slice layer is a support layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generation unit may be configured such that, when the first slice layer is a support layer and the second slice layer is a support layer, the build path of the second slice layer is generated in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is large.

[0106] Furthermore, in an information processing device, if the first slice layer is a solid layer and the second slice layer is a build layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generation unit may be configured such that, when the first slice layer is a solid layer and the second slice layer is a build layer, the build path of the second slice layer is generated in such a way that the contact area between the build path of the first slice layer and the build path of the second slice layer is large.

[0107] Furthermore, in an information processing device, when the generation unit slices an object into multiple slice layers, if the first slice layer is a solid layer and the second slice layer is a molded layer, a configuration may be used in which the thickness of the second slice layer is greater than the thickness of each of the multiple solid layers including the first slice layer.

[0108] Furthermore, in an information processing device, when the generation unit slices an object into multiple slice layers, if the first slice layer is a build layer and the second slice layer is a solid layer, a configuration may be used in which the thickness of the second slice layer is thinner than the average thickness of each of the multiple build layers, including the first slice layer.

[0109] Furthermore, in an information processing device, if the first slice layer is a raft layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced. The generation unit may be configured such that, when the first slice layer is a raft layer and the second slice layer is a solid layer, the build path of the second slice layer is generated such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced.

[0110] Furthermore, in an information processing device, if the first slice layer is a support layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced. The generation unit may be configured such that, when the first slice layer is a support layer and the second slice layer is a solid layer, the build path of the second slice layer is generated such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced.

[0111] Furthermore, the three-dimensional molding apparatus according to the embodiment is a three-dimensional molding apparatus that includes an information processing apparatus that generates three-dimensional molding data for stacking a plurality of slice layers on the three-dimensional molding apparatus as a three-dimensional molded object of a predetermined shape, wherein the information processing apparatus stores object data indicating an object that includes at least the molded body, among the molded body having the shape of a three-dimensional molded object and a support that supports the molded body, slice condition information indicating slice conditions for virtually slicing the object indicated by the object data into the plurality of slice layers, and mold path generation condition information indicating mold path generation conditions for generating a mold path for each of the plurality of slice layers, and for each of the sliced ​​plurality of slice layers, The three-dimensional modeling apparatus includes a generation unit that generates a raft layer build path and generates three-dimensional modeling data that includes build path information indicating the build path for each of the generated slice layers. The slice condition information includes first slice layer type information indicating the type of the first slice layer among the multiple slice layers, and second slice layer type information indicating the type of the second slice layer that is stacked on top of the first slice layer among the multiple slice layers. The build path generation condition information includes correspondence information that associates the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the build path for the second slice layer. When the generation unit generates a build path for the second slice layer, it generates the build path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. As a result, the three-dimensional modeling apparatus can generate three-dimensional modeling data that makes it easier to remove the raft layer and support from the modeled body without a sintering process.

[0112] Although embodiments of this invention have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments and may be modified, substituted, deleted, etc., as long as it does not depart from the spirit of this invention.

[0113] Furthermore, a program to realize the function of any component in the apparatus described above may be recorded on a computer-readable recording medium, and that program may be loaded into a computer system and executed. Here, the apparatus is, for example, a three-dimensional molding apparatus 1, a control device 40, a data generation apparatus 50, etc. The term "computer system" here includes hardware such as an OS (Operating System) and peripheral devices. The term "computer-readable recording medium" refers to portable media such as flexible disks, magneto-optical disks, ROMs, CD (Compact Disk)-ROMs, and storage devices such as hard disks built into a computer system. In addition, the term "computer-readable recording medium" also includes volatile memory inside a computer system that acts as a server or client when a program is transmitted via a network such as the Internet or a communication line such as a telephone line, which retains the program for a certain period of time.

[0114] Furthermore, the above program may be transmitted from a computer system that stores the program in a memory device or the like to another computer system via a transmission medium or by transmission waves within the transmission medium. Here, the "transmission medium" used to transmit the program refers to a medium that has the function of transmitting information, such as a network like the Internet or a communication line like a telephone line. Furthermore, the above program may be intended to implement some of the functions described above. In addition, the above program may be one that can implement the functions described above in combination with a program already recorded in the computer system, a so-called differential file or differential program. [Explanation of Symbols]

[0115] 1...3D printing device, 10...Ejection unit, 11...Material melting unit, 12...Material supply unit, 13...Supply path, 14...Communication hole, 20...Stage, 21...Printing surface, 30...Moving unit, 31...Printing surface, 40...Control device, 41...3D printing device control unit, 50...Data generation device, 51...Processor, 52...Storage unit, 53...Input receiving unit, 54...Communication unit, 55...Display unit, 56...Control unit, 111...Screw case, 112...Flat screw, 113...Drive motor, 114...Barrel, 561...Display control unit, 562...Receiving unit, 563...Generating unit, Nz...Nozzle, TC...3D coordinate system, X...Printing material

Claims

1. An information processing device that generates three-dimensional modeling data for stacking multiple slice layers as a three-dimensional object of a predetermined shape on a three-dimensional modeling device, A storage unit that stores object data indicating an object including at least the three-dimensional object, which comprises a molded body having the shape of the three-dimensional object and a support that supports the molded body. A generation unit generates three-dimensional modeling data that includes slice condition information indicating slice conditions for virtually slicing the object shown in the object data into the plurality of slice layers, and model path generation condition information indicating model path generation conditions for generating model paths for each of the plurality of slice layers, based on slice condition information indicating slice conditions for virtually slicing the object into the plurality of slice layers, generates model paths for each of the sliced ​​plurality of slice layers, and generates three-dimensional modeling data that includes model path information indicating the model paths for each of the generated plurality of slice layers. Equipped with, The slice condition information includes first slice layer type information indicating the type of the first slice layer among the plurality of slice layers, and second slice layer type information indicating the type of the second slice layer that is stacked on top of the first slice layer among the plurality of slice layers. The aforementioned build path generation condition information includes correspondence information that associates the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the build path for the second slice layer, for each combination of the type of the first slice layer and the type of the second slice layer. When generating the fabrication path for the second slice layer, the generation unit generates the fabrication path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. Information processing device.

2. When the first slice layer is a build layer and the second slice layer is a build layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generation unit generates the build path of the second slice layer such that, when the first slice layer is a build layer and the second slice layer is a build layer, the contact area between the build path of the first slice layer and the build path of the second slice layer is increased. The information processing apparatus according to claim 1.

3. When the first slice layer is a solid layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that, at one or more overlapping positions where the build path of the first slice layer and the build path of the second slice layer overlap, the orientation of the build path of the first slice layer and the orientation of the build path of the second slice layer intersect. When the first slice layer is a solid layer and the second slice layer is a solid layer, the generation unit generates the build path for the second slice layer such that the orientation of the build path for the first slice layer and the orientation of the build path for the second slice layer intersect at one or more overlapping positions where the build path for the first slice layer and the build path for the second slice layer overlap. The information processing apparatus according to claim 1.

4. When the first slice layer is a raft layer and the second slice layer is a raft layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generating unit generates the build path of the second slice layer such that, when the first slice layer is a raft layer and the second slice layer is a raft layer, the contact area between the build path of the first slice layer and the build path of the second slice layer is increased. The information processing apparatus according to claim 1.

5. When the first slice layer is a support layer and the second slice layer is a support layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. The generating unit generates the build path of the second slice layer such that, when the first slice layer is a support layer and the second slice layer is a support layer, the contact area between the build path of the first slice layer and the build path of the second slice layer is increased. The information processing apparatus according to claim 1.

6. When the first slice layer is a solid layer and the second slice layer is a build layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is large. When the first slice layer is a solid layer and the second slice layer is a molded layer, the generation unit generates the molded path of the second slice layer such that the contact area between the molded path of the first slice layer and the molded path of the second slice layer is increased. The information processing apparatus according to claim 1.

7. When the generating unit slices the object into the plurality of slice layers, if the first slice layer is a solid layer and the second slice layer is a molded layer, the thickness of the second slice layer is greater than the thickness of each of the plurality of solid layers including the first slice layer. The information processing apparatus according to claim 1 or 6.

8. When the generating unit slices the object into the plurality of slice layers, if the first slice layer is a molded layer and the second slice layer is a solid layer, the thickness of the second slice layer is made thinner than the average value of the thicknesses of each of the plurality of molded layers including the first slice layer. The information processing apparatus according to claim 1.

9. When the first slice layer is a raft layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced. When the first slice layer is a raft layer and the second slice layer is a solid layer, the generation unit generates the build path for the second slice layer such that the contact area between the build path for the first slice layer and the build path for the second slice layer is reduced. The information processing apparatus according to claim 1.

10. When the first slice layer is a support layer and the second slice layer is a solid layer, the condition for generating the build path of the second slice layer is to generate the build path of the second slice layer such that the contact area between the build path of the first slice layer and the build path of the second slice layer is reduced. When the first slice layer is a support layer and the second slice layer is a solid layer, the generating unit generates the build path for the second slice layer such that the contact area between the build path for the first slice layer, the build path for the second slice layer, and P.3 is reduced. The information processing apparatus according to claim 1.

11. A three-dimensional molding apparatus comprising an information processing device that generates three-dimensional molding data for stacking multiple slice layers into a three-dimensional object of a predetermined shape on a three-dimensional molding apparatus, The aforementioned information processing device is A storage unit that stores object data indicating an object including at least the three-dimensional object, which comprises a molded body having the shape of the three-dimensional object and a support that supports the molded body. A generation unit generates three-dimensional modeling data that includes slice condition information indicating slice conditions for virtually slicing the object shown in the object data into the plurality of slice layers, and model path generation condition information indicating model path generation conditions for generating model paths for each of the plurality of slice layers, based on slice condition information indicating slice conditions for virtually slicing the object into the plurality of slice layers, generates model paths for each of the sliced ​​plurality of slice layers, and generates three-dimensional modeling data that includes model path information indicating the model paths for each of the generated plurality of slice layers. Equipped with, The slice condition information includes first slice layer type information indicating the type of the first slice layer among the plurality of slice layers, and second slice layer type information indicating the type of the second slice layer that is stacked on top of the first slice layer among the plurality of slice layers. The aforementioned build path generation condition information includes correspondence information that associates the type of the first slice layer, the type of the second slice layer, and information indicating the conditions for generating the build path for the second slice layer, for each combination of the type of the first slice layer and the type of the second slice layer. When generating the fabrication path for the second slice layer, the generation unit generates the fabrication path for the second slice layer based on the correspondence information, the type of the first slice layer, and the type of the second slice layer. Three-dimensional printing equipment.

Citation Information

Patent Citations

  • Program, three-dimensional molding apparatus, and three-dimensional molding system

    JP2019155881A

  • Additive manufacturing with support structures

    JP2019522105A

  • Stress relief in additively manufactured parts

    JP2020501019A