Work equipment analysis system

Abstract

To provide a working device analysis system that can appropriately analyze the state of a working device.SOLUTION: A working device analysis method includes: acquiring work history information from a working device having working units mounted thereon which perform work for manufacturing an electronic circuit board (ST1); generating, from the acquired work history information, a first file including an operation event log of the working device, and a second file including an electronic circuit board manufacturing log (ST2-ST4); determining whether maintenance of the working units is required from the first file (ST5); and estimating the condition of the working units from the second file (ST6).SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a working device analysis system for analyzing the state of a working device for manufacturing an electronic circuit board.

Background Art

[0002] Working units such as suction nozzles and component mounting heads used in working devices such as component mounting devices for manufacturing electronic component circuit boards become dirty, worn, or deformed during the process of repeating manufacturing operations, resulting in problems such as deterioration and a decrease in mounting accuracy. Therefore, the working unit is periodically inspected or maintained. Inspections or maintenance are performed by interrupting the manufacturing operation. Therefore, in order to suppress a decrease in production efficiency, it is desirable that inspections or maintenance be performed less frequently and at an appropriate time.

[0003] In Patent Document 1, during the operation of a component mounting device, log data such as the correction amount of the suction position when the suction nozzle picks up an electronic component and error occurrence events where the suction nozzle fails to pick up a component are collected. When a certain amount of log data has been accumulated, it is disclosed that an equipment diagnosis system diagnoses whether there is a malfunction in the working device. Then, based on the diagnosis result, it is determined whether maintenance is necessary, and a maintenance operation is instructed. As a result, it is possible to appropriately diagnose a malfunction in the working device and perform maintenance without interrupting the manufacturing operation.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, while the prior art, including Patent Document 1, allows for the diagnosis of malfunctions in work equipment without interrupting manufacturing operations, the log data used for diagnosis is enormous. Therefore, when the diagnostic equipment is installed in a different facility from the work equipment, there is a problem in that sending and receiving data becomes a heavy burden.

[0006] Therefore, the purpose of this disclosure is to provide a work equipment analysis system that can appropriately analyze the condition of work equipment.

[0007] The work equipment analysis system of this disclosure includes a manufacturing control device and a maintenance control device installed in a facility different from the factory where the work equipment is installed, wherein the manufacturing control device receives work history information from the work equipment equipped with a work unit that performs work for manufacturing electronic circuit boards. and implementation data used for work with the aforementioned work device An acquisition unit that acquires the work history information, and a first file containing the operation event log of the work device and the manufacturing log of the electronic circuit board from the acquired work history information. and the size of the components mounted on the electronic circuit board based on the aforementioned mounting data. The maintenance management device comprises a file generation unit that generates a second file including the first file and a transmission unit that transmits the first file and the second file, and the maintenance management device comprises a maintenance necessity determination unit that determines whether maintenance is necessary for the work unit from the first file and a condition estimation unit that estimates the condition of the work unit from the second file. The file generation unit extracts information regarding the size of components mounted on the electronic circuit board from the acquired work history information, excluding customer information, and includes the extracted information regarding the size of the components in the second file. . [Effects of the Invention]

[0008] According to this disclosure, the condition of the work equipment can be appropriately analyzed. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is an explanatory diagram illustrating the configuration of a work apparatus analysis system according to one embodiment of the present disclosure. [Figure 2] Figure 2 is an explanatory diagram illustrating the configuration of a component mounting apparatus according to one embodiment of the present disclosure. [Figure 3] Figure 3 is a block diagram showing the configuration of a work apparatus analysis system according to one embodiment of the present disclosure. [Figure 4]Figure 4 is a flowchart of a work apparatus analysis method according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0010] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the work apparatus analysis system, component mounting line, component mounting apparatus, and component supply apparatus. In the following, the same or corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 2, the X-axis (direction perpendicular to the plane of the paper in Figure 2) and the Y-axis (left-right direction in Figure 2), which are perpendicular to the substrate transport direction, are shown as two mutually orthogonal axes in the horizontal plane. The Z-axis (up-down direction in Figure 2) is shown as the height direction perpendicular to the horizontal plane.

[0011] First, the configuration of the work equipment analysis system 1 will be explained with reference to Figure 1. Figure 1 is an explanatory diagram of the configuration of the work equipment analysis system 1 according to one embodiment of the present disclosure. The work equipment analysis system 1 consists of a factory F and a support center S located away from factory F. Factory F is equipped with two component mounting lines L1 and L2, each consisting of multiple component mounting devices M1 to M3 connected together. Each component mounting line L1 and L2 has the function of manufacturing electronic circuit boards by sequentially mounting electronic components (hereinafter referred to as "components D"; see Figure 2) onto the circuit board using component mounting devices M1 to M3.

[0012] Each component mounting device M1 to M3 is connected to the manufacturing control device 3 via an internal communication network 2 such as a LAN (Local Area Network). Factory F is also equipped with a mail receiving device 4 that receives emails sent from the support center S. Note that the component mounting lines L1 and L2 installed in Factory F do not necessarily have to be two; they may be one, three, or more. Furthermore, the component mounting devices M1 to M3 constituting component mounting lines L1 and L2 do not necessarily have to be three; they may be one, two, or four or more. In addition to the manufacturing control device 3, each component mounting line L1 and L2 may also be equipped with a line management device to manage the manufacturing of electronic circuit boards in those lines.

[0013] In Figure 1, the support center S is located in a position that allows for efficient analysis of the maintenance requirements for work units at multiple factories F (customers) and various support services to personnel at each factory F. The support center S is equipped with a maintenance management device 5 and a mail server 6.

[0014] The mail server 6 is connected to the maintenance and management device 5 via an on-premises communication network 7, such as a LAN. The manufacturing management device 3 and the maintenance and management device 5 exchange information via an off-premises communication network 8, such as the Internet or a mobile communication line. The mail receiving device 4 and the mail server 6 exchange information, such as email, via an off-premises communication network 9.

[0015] Furthermore, the off-site communication network 8 and the off-site communication network 9 may share the same off-site communication network. In addition, the manufacturing management device 3 and the maintenance management device 5 may exchange information via the cloud instead of directly. That is, information transmitted from the manufacturing management device 3 and the maintenance management device 5 may be stored in the cloud, and the information may be transmitted from the cloud to the manufacturing management device 3 and the maintenance management device 5 upon request. In addition to email, information may also be notified using a communication tool that utilizes a data communication line, or information may be exchanged by accessing it from the touch panel 22 (see Figure 2) of the manufacturing management device 3 or the component mounting devices M1 to M3.

[0016] Next, the configurations of component mounting devices M1 to M3 will be described with reference to Figure 2. Figure 2 is an explanatory diagram of the configuration of component mounting devices M1 (M2, M3) according to one embodiment of the present disclosure. Component mounting devices M1 to M3 have similar configurations. The component mounting device M1 will be described below.

[0017] The component mounting device M1 is a work device that has the function of mounting components D onto a circuit board B. A board transport mechanism 12 provided on the upper surface of the base 11 transports the circuit board B from the positive to the negative direction of the X axis to position and hold it. A head moving mechanism 13 provided above the base 11 moves the mounting head 14, which is detachably mounted via a plate 13a, in the positive and negative directions of the X axis and the Y axis. A suction nozzle 15 is detachably mounted on the lower end of the mounting head 14.

[0018] On the upper part of the carriage 17 coupled to the base 11 on the side of the substrate transfer mechanism 12, a plurality of tape feeders 16 are mounted side by side along the X-axis on the feeder base 17a. The feeder base 17a is provided with a plurality of slots for mounting the tape feeders 16. A feeder address is set in each of the plurality of slots for mounting the tape feeders 16. In the component mounting apparatus M1, the carriages 17 are respectively mounted at the feeder arrangement positions provided front and rear (the positive and negative directions of the Y-axis in FIG. 2). In the component mounting apparatus M1, the mounting position of the tape feeder 16 can be specified by the feeder arrangement positions provided front and rear and the feeder address.

[0019] On the carriage 17, a carrier tape 18 for storing the components D supplied to the component mounting apparatus M1 is wound around and held on a reel 19. The carrier tape 18 inserted into the tape feeder 16 is pitch-fed at regular intervals by a tape feed mechanism 16a built into the tape feeder 16. As a result, the components D stored in the carrier tape 18 are sequentially supplied toward a component supply port 16b provided above the tape feeder 16.

[0020] In the component mounting operation, the mounting head 14 moves above the tape feeder 16 by the head movement mechanism 13, and vacuum-sucks and picks up the component D supplied to the component supply port 16b of the tape feeder 16 by the suction nozzle 15 (arrow a in FIG. 2). The mounting head 14 holding the component D moves above the circuit board B held by the substrate transfer mechanism 12 by the head movement mechanism 13, and mounts the component D at a predetermined component mounting position Ba on the circuit board B (arrow b in FIG. 2).

[0021] In FIG. 2, a substrate recognition camera 20 with its optical axis directed in the negative direction of the Z axis is attached to the plate 13a. The substrate recognition camera 20 is moved in the positive and negative directions of the X axis and the positive and negative directions of the Y axis integrally with the mounting head 14 by the head movement mechanism 13. The substrate recognition camera 20 moves above the tape feeder 16 and images the component D supplied to the component supply port 16b. The recognition processing unit 36 (see FIG. 3) performs image recognition on the imaging result and calculates the amount of deviation of the supply position of the component D supplied to the component supply port 16b from the normal supply position (predetermined) where the component D is expected to be supplied. Based on the calculated amount of deviation of the supply position, the adsorption position (the stop position of the mounting head 14) when the suction nozzle 15 picks up the component D is corrected. Also, the recognition processing unit 36 detects a supply error in which the component D cannot be recognized because the component D is not supplied to the component supply port 16b.

[0022] In FIG. 2, the mounting head 14 includes a flow rate sensor 14a that measures the flow rate of air flowing in from the suction nozzle 15. When the suction nozzle 15 normally adsorbs the component D, the air flowing in from the suction nozzle 15 decreases, and the vacuum pressure of the suction nozzle 15 decreases. On the other hand, when a suction error occurs in which the suction nozzle 15 cannot hold the component D or adsorbs it in an abnormal posture, air flows in from the suction nozzle 15. Therefore, the vacuum pressure of the suction nozzle 15 does not decrease.

[0023] Based on the measurement result of the air flow rate by the flow rate sensor 14a, the presence or absence of a suction error (adsorption error) is detected. Instead of the flow rate sensor 14a, a vacuum gauge (pressure gauge) may be provided, and the presence or absence of a suction error (adsorption error) may be determined based on the measurement result of the vacuum pressure by the vacuum gauge. Also, by measuring the flow rate of air flowing in from the suction nozzle 15 after component mounting by the flow rate sensor 14a, a mounting error in which the mounting head 14 cannot mount the component D on the circuit board B and brings it back is detected.

[0024] In Figure 2, a component recognition camera 21 with its optical axis pointed upward is mounted on the upper surface of the base 11 between the substrate transport mechanism 12 and the tape feeder 16. The component recognition camera 21 images the underside of the component D held by the suction nozzle 15 (or the suction nozzle 15 that failed to hold the component D) as the suction nozzle 15 passes above after picking up the component D. The recognition processing unit 36 ​​performs image recognition on the image results to determine whether the orientation of the component D held by the suction nozzle 15 is normal or abnormal, or whether a recognition error has occurred in which the component D that should be held by the suction nozzle 15 cannot be recognized. The component recognition camera 21 may also image the side of the component D in addition to its underside.

[0025] Furthermore, the recognition processing unit 36 ​​performs image recognition on the imaging results and calculates the amount of suction position deviation from the normal holding position, which is the expected (pre-defined) normal suction position of the component D held by the suction nozzle 15 attached to the component mounting device M1 (working device). When mounting component D to the component mounting position Ba on the circuit board B, mounting position correction and mounting orientation correction are performed based on the amount of suction position deviation.

[0026] In Figure 2, a touch panel 22 is installed at the front of the component mounting device M1 where the worker works. Various information is displayed on the touch panel 22. The worker also uses the operation buttons and other input units displayed on the touch panel to input data or operate the component mounting device M1.

[0027] The mounting head 14, the suction nozzle 15, and the tape feeder 16 are appropriately selected according to the type of component D to be mounted on the circuit board B and attached to the component mounting device M1. Thus, the mounting head 14 for mounting the component D on the circuit board B, the suction nozzle 15 attached to the mounting head 14 for picking up the component D, or the tape feeder 16 (component supply device) for supplying the component D to the mounting head 14 are work units that are attached to the component mounting device M1 (working device) and perform work for manufacturing electronic circuit boards.

[0028] Next, with reference to Figure 3, the configuration of the work equipment analysis system 1 will be described. Figure 3 is a block diagram showing the configuration of the work equipment analysis system 1. The component mounting devices M1 to M3 (work equipment) provided in component mounting lines L1 and L2 have a similar configuration. Below, the component mounting device M1 of component mounting line L1 will be described.

[0029] In Figure 3, the component mounting device M1 includes a mounting control unit 30, a substrate transport mechanism 12, a head movement mechanism 13, a mounting head 14, a tape feeder 16, a substrate recognition camera 20, a component recognition camera 21, and a touch panel 22. The mounting control unit 30 includes a mounting storage unit 31, a recognition processing unit 36, a mounting operation processing unit 37, a suitability determination unit 38, and an in-house communication unit 39. The in-house communication unit 39 transmits and receives data with other component mounting devices M2, M3 and the manufacturing management device 3 via the in-house communication network 2. The mounting storage unit 31 is a storage device that stores mounting data 32, operation parameters 33, positional misalignment information 34, and malfunction list information 35, etc.

[0030] The mounting data 32 is created for each type of electronic circuit board to be manufactured and includes data such as the component type, size, and component mounting position Ba (XY coordinates) of the component D to be mounted on the circuit board B. The mounting data 32 stored in the mounting storage unit 31 of the component mounting device M1 includes at least the data necessary for component mounting work on that device. The recognition processing unit 36 ​​performs image recognition on the component supply port 16b of the tape feeder 16 captured by the board recognition camera 20, calculates a correction value for the suction position of the suction nozzle 15, and stores it in the mounting storage unit 31 as an operation parameter 33.

[0031] In Figure 3, the recognition processing unit 36 ​​performs image recognition on the image of the component D held by the suction nozzle 15 by the component recognition camera 21, calculates the amount of suction position deviation from the normal holding position, and stores it as position deviation information 34 in the mounting storage unit 31. The recognition processing unit 36 ​​also calculates correction values ​​for the component mounting position Ba and mounting orientation when mounting the component D on the circuit board B based on the amount of suction position deviation, and stores them as operation parameters 33 in the mounting storage unit 31.

[0032] Furthermore, the recognition processing unit 36 ​​performs image recognition on the imaging results to detect supply errors or recognition errors. The recognition processing unit 36 ​​creates a manufacturing log that associates the detected supply error with information identifying the tape feeder 16 where the supply error was detected, the type of component D that was being supplied, and the carrier tape 18, and transmits this as work history information to the manufacturing management device 3. The recognition processing unit 36 ​​also creates a manufacturing log that associates the detected recognition error with information identifying the component D that was not held, the suction nozzle 15 that was not held, and the mounting head 14, and transmits this as work history information to the manufacturing management device 3.

[0033] In Figure 3, the mounting operation processing unit 37 controls the substrate transport mechanism 12, head movement mechanism 13, mounting head 14, and tape feeder 16 based on the mounting data 32, operation parameters 33, and positional misalignment information 34 stored in the mounting memory unit 31 to execute the component mounting operation. In addition, each time a component D is mounted on the circuit board B, the mounting operation processing unit 37 transmits a manufacturing log, which is associated with the component D, the correction values ​​(operation parameters 33) used in the component mounting operation, the flow rate value of the flow sensor 14a when the component D was picked up, the pressure value of the vacuum gauge when the component D was picked up, and the current value when the tape feeder 16 was operated, to the manufacturing management device 3 as work history information.

[0034] Furthermore, when the mounting operation processing unit 37 detects a work error during component mounting, it transmits a manufacturing log, which associates the content of the work error and the time of its occurrence, to the manufacturing management device 3 as work history information. Examples of work errors include suction errors where the suction nozzle 15 fails to pick up component D, recognition errors where the component recognition camera 21 fails to recognize component D held by the suction nozzle 15, mounting errors where the mounting head 14 fails to mount component D onto the circuit board B and returns it, and supply errors where the board recognition camera 20 fails to recognize component D supplied by the tape feeder 16 (component supply device). If component mounting lines L1 and L2 are equipped with mounting inspection devices that inspect component D mounted on the circuit board B in addition to component mounting devices M1 to M3, the mounting operation processing unit 37 may detect mounting errors based on the presence or absence or misalignment of component D inspected by the mounting inspection device.

[0035] Furthermore, when an operation event occurs, such as a work stop event that temporarily suspends component mounting operations due to a work error or a work restart event that resumes component mounting operations after an error recovery operation by the operator, the mounting operation processing unit 37 transmits an operation event log, which associates the content and time of occurrence of the operation event, to the manufacturing management device 3 as work history information. The operation event log for a work stop event includes information that identifies the relevant work units, such as the tape feeder 16, mounting head 14, and suction nozzle 15, as details of the work error that caused the work stop.

[0036] In Figure 3, the manufacturing management device 3 includes a manufacturing processing unit 40. The manufacturing processing unit 40 includes a manufacturing storage unit 41, an acquisition unit 47, a file generation unit 48, a transmission processing unit 49, an in-house communication unit 50, and an out-of-house communication unit 51.

[0037] The on-premises communication unit 50 transmits and receives data with component mounting devices M1 to M3 on component mounting lines L1 and L2 via the on-premises communication network 2. The off-premises communication unit 51 transmits and receives data with the maintenance management device 5 installed at the support center S via the off-premises communication network 8. The manufacturing memory unit 41 is a storage device that stores mounting data 42, work history information 43, first file 44, second file 45, and malfunction list information 46, etc.

[0038] In Figure 3, the mounting data 42 stored in the manufacturing memory unit 41 is the same data as the mounting data 32 stored in the mounting memory unit 31 of the component mounting device M1 described above. However, the mounting data 42 includes all the data necessary for the component mounting work of component mounting devices M1 to M3 provided in component mounting lines L1 and L2.

[0039] The acquisition unit 47 sequentially acquires work history information transmitted from the component mounting devices M1 to M3 (working devices) of the component mounting lines L1 and L2, and stores it in the manufacturing storage unit 41 as work history information 43.

[0040] The acquisition unit 47 collects work history information from line management devices at predetermined intervals, such as when the type of electronic circuit board being manufactured changes or when workers change shifts, from devices other than component mounting devices M1 to M3. Examples of devices from which information is collected other than component mounting devices M1 to M3 include line management devices that have the function of collecting work history information for each component mounting line L1, L2, a production scheduler that stores production plans or worker shifts, or a production simulator that estimates the optimal production plan. In other words, the acquisition unit 47 acquires work history information 43 while the work device is in operation or at predetermined intervals.

[0041] Furthermore, the acquisition unit 47 collects maintenance history information, which is the result of maintenance performed on the work unit. Maintenance history information may be entered by an operator, or it may be collected as maintenance history information from an automated maintenance work unit (not shown) that performs maintenance work automatically. In addition, maintenance results performed at a support center S located away from the factory F may be acquired as maintenance history information. Examples of automated maintenance work units include a nozzle cleaning unit that cleans the nozzles provided on the mounting head 14, a feeder maintenance unit that adjusts the feeding mechanism of the tape feeder 16, or a head maintenance unit that inspects or adjusts the sliding properties of the mounting head 14. In addition to the work results, the maintenance history information may also include identification information of the work unit, the date and time of maintenance, the location of maintenance, the number of times maintenance has been performed, and a clearing of the work history information.

[0042] In Figure 3, the file generation unit 48 creates a first file 44 containing operation event logs and maintenance history information for component mounting devices M1 to M3 (working devices) from the mounting data 42 and work history information 43 stored in the manufacturing storage unit 41. The file generation unit 48 also generates a second file 45 containing the manufacturing log of the electronic circuit board from the mounting data 42 and work history information 43 stored in the manufacturing storage unit 41.

[0043] The manufacturing log of the electronic circuit board, included in the work history information 43 collected from component mounting devices M1 to M3, includes the number of times component D was mounted, the number of recognition errors, suction errors, mounting errors, and supply errors that occurred when component D was not mounted, etc., in the component mounting devices M1 to M3 that mounted component D onto the electronic circuit board. The manufacturing log of the electronic circuit board also includes positional deviation information 34 from the normal holding position of component D held by the suction nozzle 15 attached to the component mounting devices M1 to M3. Furthermore, the manufacturing log of the electronic circuit board includes the size of component D mounted on the electronic circuit board.

[0044] In Figure 3, the file generation unit 48 generates a second file 45 containing a manufacturing log of the electronic circuit board. For example, the file generation unit 48 generates a second file 45 containing information that aggregates the number of times component D was mounted and the number of times component D was mounted incorrectly for each combination of work units such as the tape feeder 16, mounting head 14, and suction nozzle 15. The second file 45 may also include an error rate calculated based on the number of errors and the number of suctions, in addition to the total values ​​of various counts for each predetermined period (e.g., every day).

[0045] Furthermore, the file generation unit 48 statistically processes the correction amount for the suction position of the suction nozzle 15 when picking up component D from the tape feeder 16 and the correction amount for the mounting position of the suction nozzle 15 when mounting component D on the circuit board B, and generates a second file 45 containing information such as a moving average or standard deviation. In other words, the file generation unit 48 statistically processes the manufacturing log of the electronic circuit board and generates the second file 45. The manufacturing log of the electronic circuit board is created for each component mounting position Ba on the circuit board B of an electronic circuit board manufactured with hundreds to thousands of components mounted. For this reason, the amount of data in the manufacturing log of the electronic circuit board is enormous. On the other hand, the amount of data in the information created by statistically processing the manufacturing log of the electronic circuit board is significantly less than the amount of the original data.

[0046] In Figure 3, the file generation unit 48 creates a second file 45 containing information aggregated from the mounting data 42, including the length, width, and thickness of the components D mounted on the electronic circuit board. Similar to the information generated by statistically processing the manufacturing logs of the electronic circuit board, the amount of data on the size of components D collected from the mounting data 42 is significantly less than the amount of data from the original. Furthermore, by creating a second file by extracting only the information on the size of components D necessary for the work unit condition estimation process from the mounting data 42, which includes customer information, the leakage of customer information can be prevented.

[0047] In Figure 3, the transmission processing unit 49 causes the first file 44 and the second file 45 generated by the file generation unit 48 to be transmitted to the maintenance management device 5 via the off-site communication unit 51. In other words, the transmission processing unit 49 and the off-site communication unit 51 are transmission units that transmit the first file 44 and the second file 45 to the maintenance management device 5. The file generation unit 48 generates the first file 44 and the second file 45 at a predetermined time, such as once a week. The transmission processing unit 49 transmits the generated first file 44 and the second file 45 to the maintenance management device 5. That is, the first file 44 and the second file 45 are transmitted to the maintenance management device 5 at a predetermined time (for example, 8:00 every Wednesday).

[0048] In Figure 3, the maintenance management device 5 comprises a maintenance processing unit 60, an external communication unit 61, an internal communication unit 62, and a display unit 63. The maintenance processing unit 60 comprises a maintenance storage unit 64, a maintenance necessity determination unit 67, a condition estimation unit 68, a report creation unit 69, and a malfunction list creation unit 70. The maintenance storage unit 64 is a storage device that stores the first file 65 and the second file 66, etc.

[0049] The external communication unit 61 transmits and receives data with the manufacturing control device 3 installed in factory F via the external communication network 8. The internal communication unit 62 transmits and receives data with the mail server 6 via the internal communication network 7. The display unit 63 is a display device such as an LCD panel, which displays various data and information.

[0050] The first file 44 and the second file 45 transmitted from the manufacturing control device 3 at factory F are received by the maintenance storage unit 64 via the off-site communication unit 61. The received first file 44 and the second file 45 are associated with information identifying the source factory F or manufacturing control device 3 and stored in the maintenance storage unit 64 as the first file 65 and the second file 66. The maintenance storage unit 64 stores information for a predetermined period, including not only the latest information transmitted from the manufacturing control device 3 but also the previously transmitted information. In addition, the maintenance control device 5 installed at the support center S receives the first file 44 and the second file 45 periodically from multiple factories F, not just one factory F.

[0051] In Figure 3, the maintenance necessity determination unit 67 determines whether maintenance is necessary for the work unit (tape feeder 16, mounting head 14, and suction nozzle 15, etc.) from the first file 65 stored in the maintenance storage unit 64. Specifically, the maintenance necessity determination unit 67 determines that maintenance is necessary for work units in which the cumulative number of times work stop events have occurred or the total number of times over a predetermined period has exceeded a predetermined judgment criterion number.

[0052] In Figure 3, the condition estimation unit 68 performs a condition estimation process to estimate the condition of the work unit from the second file 66 stored in the maintenance memory unit 64. Specifically, the condition estimation unit 68 estimates from the various information contained in the second file 66 that the work unit is malfunctioning or becoming malfunctioning, and determines whether an inspection is necessary to determine whether maintenance of the work unit is required. For example, the condition estimation unit 68 determines that an inspection of the work unit is necessary when the error rate for a predetermined period is increasing, when the error rate is not increasing but the correction amount is increasing, or when the variability (standard deviation) of the correction amount becomes larger than the judgment criterion. The predetermined period is, for example, the number of days that have elapsed since the last maintenance execution date and time or the time of shipment (delivery). This number of days is set in units of days, weeks, months, or years for each work unit.

[0053] Furthermore, the condition estimation unit 68 may estimate the malfunction of the work unit using a malfunction diagnosis model created in advance by machine learning, based on the parameters and error occurrence status (such as the number or frequency) contained in the second file 66. In addition, the condition estimation unit 68 may associate information on the size of part D (such as a recommended size range) with the determined work unit inspection information, for example, if the tendency for malfunction becomes apparent when part D is large or small, based on the size of part D contained in the second file 66.

[0054] In Figure 3, the report creation unit 69 creates a report to be sent to the manager of Factory F based on information about work units requiring maintenance determined by the maintenance necessity determination unit 67 or information about work units requiring inspection due to malfunctions estimated by the condition estimation unit 68. The report includes information identifying the work unit requiring maintenance or inspection, the reason for the maintenance or inspection, and, in the case of inspection, recommended inspection methods such as cleaning. The report created by the report creation unit 69 is sent to the mail server 6 via the premises communication unit 62. The mail server 6 sends the report as an email to the specified recipient at a pre-set time. The email sent from the mail server 6 is received by the mail receiving device 4 installed in Factory F.

[0055] In Figure 3, the malfunction list creation unit 70 creates a list of malfunctioning work units (malfunction list) based on information about work units requiring maintenance determined by the maintenance necessity determination unit 67 or information about work units requiring inspection due to malfunctions estimated by the condition estimation unit 68. The malfunction list includes information identifying the work unit requiring inspection or maintenance, the reason for the estimated malfunction, and usage restrictions such as the recommended size range of part D. The malfunction list created by the malfunction list creation unit 70 is transmitted to the factory F's manufacturing management device 3 via the off-site communication unit 61.

[0056] Furthermore, if a work unit requiring inspection or maintenance is provided in component mounting machines M1 to M3, the location of the work unit, identified from the manufacturing log information from component mounting machines M1 to M3, is also included in the malfunction list information. In addition, there may be separate malfunction lists: one created based on the maintenance necessity determination unit 67 and another created based on the condition estimation unit 68. In this case, the malfunction list created based on the condition estimation unit 68 can be used to create a maintenance plan because the work unit will soon require inspection or maintenance. The malfunction list created based on the maintenance necessity determination unit 67 can be used to create a production plan that does not use the work unit in production because it requires inspection or maintenance.

[0057] The manufacturing control device 3 stores the received malfunction list as malfunction list information 46 in the manufacturing storage unit 41 and transmits it to the component mounting devices M1 to M3 (working devices) on the component mounting lines L1 and L2. The malfunction list received by the component mounting devices M1 to M3 is stored as malfunction list information 35 in the mounting storage unit 31.

[0058] In Figure 3, the suitability determination unit 38 of the component mounting machines M1 to M3 determines whether the work unit attached to the component mounting machines M1 to M3 is included in the malfunction list information 35 when changing the type of electronic circuit board to be manufactured, starting or ending production, etc. If the attached work unit is included in the malfunction list information 35, the suitability determination unit 38 displays a warning on the touch panel 22. The warning may include, for example, the reason why the work unit is presumed to be malfunctioning, recommended inspection procedures, and a recommendation to replace it with another work unit. Alternatively, the operator may be allowed to decide whether to use the unit after the warning is issued, or an automatic interlock may be applied to prevent use. Furthermore, by using multiple analyses, such as maintenance necessity and malfunction estimation, production stoppages due to work unit malfunctions can be further suppressed.

[0059] As described above, the manufacturing management device 3 is a data collection device comprising: an acquisition unit 47 that acquires work history information 43 from work devices (component mounting devices M1 to M3) equipped with work units (tape feeder 16, mounting head 14, suction nozzle 15) that perform work for manufacturing electronic circuit boards; a file generation unit 48 that generates a first file 44 containing operation event logs and maintenance history information of the work devices and a second file 45 containing manufacturing logs of electronic circuit boards from the acquired work history information 43; and a transmission unit (transmission processing unit 49, external communication unit 51) that transmits the first file 44 and the second file 45.

[0060] Furthermore, the maintenance management device 5, which includes a maintenance necessity determination unit 67, is a maintenance necessity determination device that determines whether a work unit requires maintenance from the first file 65. Also, the maintenance management device 5, which includes a condition estimation unit 68, is a condition estimation device that estimates the condition of a work unit from the second file 66. The transmission unit of the data acquisition device (manufacturing management device 3) transmits the first file 44 to the maintenance necessity determination device and the second file 45 to the condition estimation device.

[0061] In this way, the manufacturing control device 3 extracts and processes the information necessary for analysis, creates the first file 44 and the second file 45, which have a small amount of data, and then transmits them to the maintenance control device 5 (maintenance necessity determination device and condition estimation device), thereby reducing the burden required for sending and receiving data. As a result, the maintenance necessity determination device and condition estimation device, which analyze the status of the work equipment and work units, can appropriately analyze the status of the work equipment even if they are installed in a different facility from the factory F where the work equipment is installed.

[0062] Next, a method for analyzing the state of work units attached to work devices (component mounting devices M1 to M3) will be described, following the flow chart in Figure 4. Figure 4 is a flowchart of a work device analysis method according to one embodiment of the present disclosure.

[0063] First, the acquisition unit 47 acquires work history information 43 and mounting data 32 from the work devices (component mounting devices M1 to M3) equipped with work units (tape feeder 16, mounting head 14, and suction nozzle 15) (ST1).

[0064] Work history information 43 is acquired while the work device is in operation or at predetermined intervals. The file generation unit 48 then generates a first file 44 from the acquired work history information 43, which includes the operation event log and maintenance history information of the work device (ST2).

[0065] Next, the file generation unit 48 performs statistical processing on the manufacturing logs of the electronic circuit boards included in the acquired work history information 43 (ST3).

[0066] Next, the file generation unit 48 generates a second file 45 containing the manufacturing log of the electronic circuit board from the acquired work history information 43, the implementation data 32, and the statistical processing results (ST4). The first file 44 and the second file 45 are transmitted to the maintenance management device 5 and stored in the maintenance storage unit 64 as the first file 65 and the second file 66.

[0067] Next, the maintenance necessity determination unit 67 determines whether the work unit requires maintenance from the first file 65 (ST5).

[0068] Next, the condition estimation unit 68 estimates the condition of the work unit from the second file 66 (ST6). This allows for an appropriate analysis of the condition of the work device.

[0069] In Figure 4, the report generation unit 69 then creates a report (ST7) that includes information identifying the work units requiring maintenance or inspection, as well as recommended inspection methods, based on the information of the work units requiring maintenance and the information of the work units requiring inspection due to the estimated malfunction. The created report is sent as an email to the mail receiving device 4 at factory F.

[0070] Next, the malfunction list creation unit 70 creates a malfunction list (ST8) that includes information identifying the work units that require inspection or maintenance, based on the information of the work units that have been determined to require maintenance and the information of the work units that require inspection due to the estimated malfunction. The malfunction list is transmitted to the manufacturing control device 3 of the factory F and is used for warnings, etc., when work units included in the malfunction list are mounted on work equipment (component mounting devices M1 to M3).

[0071] As described above, the work equipment analysis system 1 of this embodiment includes: an acquisition unit 47 that acquires work history information 43 from work equipment (component mounting devices M1 to M3) equipped with work units (tape feeder 16, mounting head 14, suction nozzle 15) that perform work for manufacturing electronic circuit boards; a file generation unit 48 that generates a first file 44 containing operation event logs and maintenance history information of the work equipment and a second file 45 containing manufacturing logs of electronic circuit boards from the acquired work history information 43; a maintenance necessity determination unit 67 that determines whether maintenance is necessary for the work unit from the first file 65 (first file 44); and a condition estimation unit 68 that estimates the condition of the work unit from the second file 66 (second file 45). This makes it possible to appropriately analyze the condition of the work equipment.

[0072] The machine learning methods related to this embodiment include, for example, supervised learning, which learns the relationship between input and output using training data in which labels (output information) are assigned to input information; unsupervised learning, which constructs the data structure from inputs without labels only; semi-supervised learning, which handles both labeled and unlabeled data; and reinforcement learning, which learns the action that can obtain the most feedback by obtaining feedback on selected actions from the observation results of the state. Specific machine learning techniques include neural networks (including deep learning using multi-layered neural networks), genetic programming, decision trees, Bayesian networks, and support vector machines (SVMs).

[0073] In the above description, an embodiment was described in which work history information is transmitted from a work device equipped with a work unit that performs work for manufacturing electronic circuit boards to a maintenance necessity determination unit 67 to determine whether maintenance is necessary for the work unit, and then transmitted to a condition estimation unit 68 to estimate the condition of the work unit. However, other embodiments can also be applied as long as work history information is transmitted from a work device equipped with a work unit that performs work for manufacturing electronic circuit boards to multiple devices. For example, there may be an operation analysis device that makes decisions regarding operation analysis and an operation estimation device that estimates the operating status.

[0074] In the flow diagram of the work apparatus analysis method according to one embodiment of the present disclosure shown in Figure 4 above, some steps may be performed in a different order. For example, in the steps of first file creation (ST2), statistical processing of manufacturing logs (ST3), and second file creation (ST4), ST2 may be performed after ST4. Also, the order of determining whether maintenance is necessary for the work unit from the first file (ST5) and estimating the condition of the work unit from the second file (ST6) may be reversed.

[0075] Furthermore, the terms defined in the above explanation are not limited to those terms alone. For example, the condition of a work unit may include the degree of signs or risks of failure, the degree of occurrence of work errors, and the degree of deterioration.

[0076] Furthermore, the maintenance requirement determination unit 67 may determine whether maintenance is required for a work unit (such as a tape feeder 16, mounting head 14, and suction nozzle 15) by including the first file 65 stored in the maintenance memory unit 64 and the operating specification value data measured at the time of shipment or installation of each work unit. Examples of operating specification value data measured at the time of shipment or installation include the flow rate value of the flow sensor 14a when a component is picked up, the pressure value of the vacuum gauge when a component is picked up, and the current value when the tape feeder 16 is operated. [Industrial applicability]

[0077] The work equipment analysis system, work equipment analysis method, and data acquisition device of this disclosure have the effect of being able to appropriately analyze the condition of work equipment and are useful in the field of mounting electronic components onto substrates. [Explanation of Symbols]

[0078] 1. Work Equipment Analysis System 3. Manufacturing control equipment (data acquisition equipment) 5 Maintenance management device (maintenance necessity determining device, condition estimation device) 14. Mounting head (working unit) 15. Suction nozzle (working unit) 16 Tape feeder (working unit) D parts M1-M3 Component mounting equipment (working equipment)

Claims

1. This includes manufacturing control equipment and maintenance control equipment installed in a facility different from the factory where the work equipment is installed. The aforementioned manufacturing control device is An acquisition unit that acquires work history information and mounting data used for work on the work device from the work device equipped with a work unit that performs work for manufacturing electronic circuit boards, A file generation unit generates a first file containing the operation event log of the work device from the acquired work history information, and a second file containing the manufacturing log of the electronic circuit board and the size of the components mounted on the electronic circuit board from the mounting data. The system comprises a transmission unit that transmits the first file and the second file, The aforementioned maintenance management device is A maintenance necessity determination unit that determines whether the work unit requires maintenance from the first file, The system includes a condition estimation unit that estimates the condition of the work unit from the second file, The file generation unit extracts information regarding the size of components mounted on the electronic circuit board from the acquired work history information, excluding customer information, and includes the extracted information regarding the size of the components in the second file. Work equipment analysis system.

2. The manufacturing log of the electronic circuit board includes the number of times the component mounting was incorrect in the work apparatus used to mount components onto the electronic circuit board. The work apparatus analysis system according to claim 1.

3. The manufacturing log of the electronic circuit board includes information on the positional deviation of the component held by the suction nozzle attached to the work device from its normal holding position. The work apparatus analysis system according to claim 1 or 2.

4. The file generation unit generates the second file by statistically processing the manufacturing log of the electronic circuit board. A work apparatus analysis system according to any one of claims 1 to 3.

5. The acquisition unit acquires the work history information while the work device is in operation or at predetermined intervals. A work apparatus analysis system according to any one of claims 1 to 4.

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