Coating apparatus, coating method, electronic component mounting apparatus, and electronic component mounting method

Abstract

The present invention provides a coating apparatus, a coating method, an electronic component mounting apparatus, and an electronic component mounting method that are less likely to generate air bubbles between the mounting material and the component to be mounted. [Solution] The system comprises an application means for applying an adhesive to a component to be mounted, which is a component to be mounted; a first moving body for moving the application means in a first direction; a first driving force applying means for applying a driving force to the first moving body; a second moving body supported by the first moving body for moving the application means in a second direction different from the first direction; a second driving force applying means for applying a driving force to the second moving body; and a control means for controlling the first driving force applying means and the second driving force applying means. The control means adjusts the gain or command value of either the first driving force applying means or the second driving force applying means based on a feedback waveform or the paste application result.

Description

Technical Field

[0001] The present invention relates to a coating device, a coating method, an electronic component mounting device, and an electronic component mounting method.

Background Art

[0002] When manufacturing a semiconductor device using an electronic component mounting device (chip mounting device), a chip bonding method is adopted in which a wafer in which a large number of elements are built in a batch is diced into individual semiconductor chips, and these are bonded one by one to predetermined positions such as a lead frame. And a die bonder (manufacturing device for semiconductor devices) is used for this chip bonding.

[0003] As shown in FIG. 17, a lead frame (substrate) 61 has a plurality of islands 62 at a predetermined pitch (constant pitch) along its longitudinal direction, and a die 63 (such as a semiconductor chip) is disposed and bonded to these islands 62. Therefore, in the die bonder, an adhesive 64 is supplied to the plurality of islands 62 of the substrate 61, and the die 63 (such as a semiconductor chip) is bonded to the islands 62 to which the adhesive 64 is supplied. As a means for supplying the adhesive 64, there is a coating method described in Patent Document 1, Patent Document 2, etc.

[0004] The paste forming method described in Patent Document 1 shows a method of forming a drawing shape with a linear paste (adhesive) on an adherend by a drawing line. In what is described in this Patent Document 1, since one figure can be drawn in a so-called one-stroke method, a highly accurate figure is completed. <>

[0005] Further, the paste coating device and coating method described in Patent Document 2 select a drawing pattern according to the size of the chip, and set a moving pattern of the nozzle based on the selected drawing pattern, and it is not necessary to set drawing data every time the type and size of the chip change.

Prior Art Documents

Patent Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2000-140742 [Patent Document 2] Japanese Patent Publication No. 2001-135651 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Patent Document 1 describes two cases: one in which a nozzle for applying adhesive (paste) is moved in the XYZ directions, and another in which a lead frame is moved in the XYZ directions. When the nozzle is moved, it is moved horizontally (on the XY plane) and vertically. In this case, the head having the nozzle is operated horizontally (on the XY plane) by motor drive (servo motor drive). Since the Y-direction drive unit is supported on top of the X-direction drive unit, the X-direction drive unit and the Y-direction drive unit will have different masses and rigidity.

[0008] Furthermore, as shown in References 1 and 2, when performing paste drawing by moving a nozzle, a method is known in which two drawing lines formed by moving the drawing line back and forth form one line segment. In such cases where drive axes in different directions cooperate to move the coating means, it has been necessary to control the deviation of the trajectory of the coating means.

[0009] Therefore, the present invention provides a coating apparatus, a coating method, an electronic component mounting apparatus, and an electronic component mounting method that can suppress deviations in the trajectory of the coating means when driving forces in different directions work together to move the coating means. [Means for solving the problem]

[0010] The coating apparatus of the present invention comprises a coating means for applying an adhesive for joining components, which are mounting members, to a mounting member; a first moving body for moving the coating means in a first direction; a first driving force applying means for applying a driving force to the first moving body; a second moving body supported by the first moving body for moving the coating means in a second direction different from the first direction; a second driving force applying means for applying a driving force to the second moving body; and a control means for controlling the first driving force applying means and the second driving force applying means, wherein the control means can adjust the gain or command value of either the first driving force applying means or the second driving force applying means based on the feedback waveform of the first driving force applying means and the second driving force applying means, or the drawn paste coating result. Gain is a numerical value that adjusts the ratio of input to output (gain) when controlling the rotation of a motor, and is adjusted to perform optimal control according to the load, and includes servo gain and position gain. Command values ​​include current command values ​​and torque command values, and there are also command timings that control the rotation speed of the motor.

[0011] By adjusting the gain or command value of either the first driving force application means or the second driving force application means, even if the mass and rigidity of the first moving body and the second moving body are different, the peak time of the first directional feedback waveform of the first driving force application means and the peak time of the second directional feedback waveform of the second driving force application means can be matched. Here, the difference in mass and rigidity between the first moving body and the second moving body means that the second moving body is supported by the first moving body, so when the first moving body is driven, the weight of the second moving body is added to the weight of the first moving body itself. For this reason, when the first moving body is driven alone or the second moving body is driven alone, the peak time of the first directional feedback waveform of the first moving body and the peak time of the second directional feedback waveform of the second moving body will be out of sync. If this sync is sync, the coating nozzle of the coating means will not move in a straight line, and there is a risk that a gap (space) will be formed between the forward and return paths. However, by matching the peak time of the first directional feedback waveform of the first driving force application means with the peak time of the second directional feedback waveform of the second driving force application means, the coating nozzle of the coating means can be moved linearly even if the first directional drive unit and the second directional drive unit have different masses and rigidities, and the formation of a gap (space) between the forward and return paths can be suppressed. [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a coating apparatus, a coating method, an electronic component mounting apparatus, and an electronic component mounting method that can suppress deviations in the trajectory of the coating means even when drive shafts in different directions cooperate to move the coating means. [Brief explanation of the drawing]

[0013] [Figure 1] This is a simplified perspective view showing the overall configuration of an electronic component mounting apparatus equipped with a coating apparatus according to the present invention. [Figure 2] This is a simplified block diagram of the coating apparatus according to the present invention. [Figure 3] This is a simplified perspective view of the coating apparatus according to the present invention. [Figure 4] It is a schematic plan view of a coating device according to the present invention. [Figure 5] It is a schematic configuration diagram of a control means. [Figure 6] It shows a paste drawing state, (a) is a schematic diagram before adjustment, and (b) is a schematic diagram after adjustment. [Figure 7] It is a graph showing the X-axis motor command waveform, the X-axis motor feedback waveform, the Y-axis motor command waveform, and the Y-axis motor feedback waveform before adjustment. [Figure 8] It shows the X-axis motor command waveform, the X-axis motor feedback waveform, the Y-axis motor command waveform, and the Y-axis motor feedback waveform after adjustment. (a) is a graph in which the feedback waveform is adjusted by servo gain, and (b) is a graph in which the feedback waveform is adjusted by command timing. [Figure 9] It is a flowchart diagram when adjusting with the servo gain of the first coating device. [Figure 10] It is a flowchart diagram when adjusting with the command timing of the first coating device. [Figure 11] It is a schematic block diagram of the main part of the second coating device according to the present invention. [Figure 12] It is a flowchart diagram of the first half when adjusting with the servo gain of the second coating device. [Figure 13] It is a flowchart diagram of the second half when adjusting with the servo gain of the second coating device. [Figure 14] It is a flowchart diagram of the first half when adjusting with the command timing of the second coating device. [Figure 15] It is a flowchart diagram of the second half when adjusting with the command timing of the second coating device. [Figure 16] It is a schematic diagram showing a method of implementing a chip. [Figure 17] It is an explanatory diagram of a method of bonding a chip to a lead frame. [Figure 18] It is an explanatory diagram of a drawing procedure of an X-shaped figure.

Mode for Carrying Out the Invention

[0014] Embodiments of the present invention will be described below with reference to Figures 1 to 18.

[0015] Figure 1 shows an electronic component mounting apparatus equipped with a coating apparatus according to an embodiment, for mounting mounting members, which are electronic components, onto a mounting member. Here, the electronic component is, for example, a semiconductor (semiconductor chip), but is not limited to semiconductor chips; it may also be an electronic component such as a resistor or capacitor. The mounting member may be a printed circuit board, a flexible circuit board, a lead frame, etc.

[0016] The electronic component mounting apparatus comprises a component mounting section 1 and a coating apparatus 2 for applying adhesive (paste) P (see Figure 3). Furthermore, it includes a substrate supply section 5 for housing substrates (components to be mounted) 3 and a substrate housing section 7 for housing substrates (components to be mounted) 3 on which mounting components (chips) 6 are mounted, and a substrate transport section 8 is provided between the substrate supply section 5 and the substrate housing section 7.

[0017] Here, the direction in which the substrate 3 is transported horizontally (from left to right in Figure 1) is called the +X direction, and in this case, the opposite direction, from right to left in Figure 1, is called the -X direction. For this reason, the X-axis is defined as the axis extending in both the +X and -X directions, and the direction perpendicular to the X-axis within the horizontal plane containing the X-axis is called the Y-axis. Of the Y-axis, the direction from the front to the back in Figure 1 is called the +Y direction, and the opposite direction to the +Y direction (from the back to the front in Figure 1) is called the -Y direction. Furthermore, the axis perpendicular to the X and Y axes is defined as the Z-axis, and of the Z-axis, the upward direction in Figure 1 is called the +Z direction, and the opposite direction to the +Z direction (the direction of gravity) is called the -Z direction.

[0018] The substrate supply unit 5 is equipped with a substrate storage unit (substrate storage chamber) 10 capable of accommodating multiple substrates 3 that do not have mounting components mounted on them. The substrate storage unit 10 is provided with a lifting device (elevator mechanism) (not shown), which can sequentially move the substrates 3 stored in the substrate storage unit 10 to predetermined positions. Once the substrates 3 have been moved to the predetermined positions, they are pushed out toward the substrate transport unit 8 by an extrusion mechanism 11 and supplied to the substrate transport unit 8. A component supply unit 12 is provided next to the substrate transport unit 8 (in this case, on the front side in Figure 1). The component supply unit 12 is for supplying mounting components and holds, for example, electronic components or semiconductor wafers diced into numerous semiconductor chips. The substrate transport unit 8 and the component supply unit 12 are provided on the main body 13a of the stand 13, the substrate supply unit 5 is provided on the sub-part 13b on the upstream side in the transport direction of the stand 13, and the substrate storage unit 7 is provided on the sub-part 13c on the downstream side in the transport direction of the stand 13. Furthermore, although the illustrated example shows only one substrate storage section 10 for the substrate supply section 5, it may also have multiple substrate storage sections 10.

[0019] The substrate transport unit 8 is equipped with multiple substrate transfer units 8a, 8b, and 8c for chucking the substrate 3, and the substrate transfer units 8a, 8b, and 8c sequentially transport the substrate 3 from the substrate supply unit 5 to the substrate storage unit 7.

[0020] The substrate transport unit 8 is provided with a coating stage 14 on which substrates 3 without adhesive P applied are placed and held, and a mounting stage 15 on which substrates 3 with adhesive applied are placed and held. On this mounting stage 15, chips 6 (see Figure 16) are mounted on the substrates 3 via the component mounting unit 1. The component mounting unit 1 includes a collet 16 capable of picking up actual components (such as semiconductor chips) and a drive mechanism 17 that moves the collet 16 along the XYZ axes.

[0021] Therefore, the method of mounting a chip on the substrate 3 will be explained using Figure 16. First, the chip 6 to be picked up is observed using a confirmation camera (not shown) located above the component supply unit 12. The collet 16 is then positioned above the chip 6 to be picked up, and the collet 16 is lowered as shown by arrow Z1 to pick up the chip 6. After that, the collet 16 is raised as shown by arrow Z2.

[0022] Next, an inspection camera (not shown) positioned above the bonding position observes the island portion 18 of the substrate (lead frame) 3 to be bonded. The collet 16 is then moved in the direction of arrow X1 and / or arrow Y1 to position it above the island portion 18. After that, the collet 16 is moved downward as shown by arrow Z3 to supply the chip 6 to the island portion 18. After supplying the chip 6 to the island portion 18, the collet 16 is raised as shown by arrow Z4, and then moved in the direction of arrow X2 and / or arrow Y2 to return to the standby position above the pickup position. Here, the direction of arrow X1 and / or arrow Y1 refers to at least one of the directions of arrow X1 and arrow Y1, and the direction of arrow X2 and / or arrow Y2 refers to at least one of the directions of arrow X2 and arrow Y2.

[0023] The substrate housing section 7 has a substrate storage section 19 capable of housing substrates 3 on which the mounting work has been completed and components (chips 6) have been mounted. Substrates 3 transported from the substrate transport section 8 are stored in the substrate storage section 19. The substrate housing section 7 is also provided with a lifting device (elevator mechanism) (not shown), which can sequentially move the substrates 3 stored in the substrate housing section 7 to predetermined positions. In the illustrated example, there is one substrate storage section 19 in the substrate housing section 7, but multiple sections may be provided.

[0024] Next, the coating apparatus 2 will be described. As shown in Figure 2, the coating apparatus 2 includes a coating means 20 for applying adhesive P for joining components, which are mounting members, to a mounting member 3; a first moving body 21 for moving the coating means 20 in a first direction; a first driving force applying means 22 for applying driving force to the first moving body 21; a second moving body 23 supported by the first moving body 21 for moving the coating means 20 in a second direction different from the first direction; a second driving force applying means 24 for applying driving force to the second moving body 23; a third moving body 29 for moving the coating means 20 in a third direction; a third driving force applying means 33 for applying driving force to the third moving body 29; and a control means 25 for controlling each of the driving force applying means 22, 24, and 33. The control means 25 may be common to both coating apparatuses 2, or there may be one for each coating apparatus 2.

[0025] Incidentally, as shown in Figures 3 and 4, the coating apparatus 2 is provided in two units in this embodiment. The coating means 20, as shown in Figure 3, includes a dispensing unit 26, which has a syringe 27 and a nozzle 28 attached to the tip of the syringe 27, and is mounted on the Z-moving body (third moving body) 29 via a frame 30. A camera 31a, which serves as an imaging means 31, is attached to this frame 30. That is, a window 30a is provided in the frame 30, and the adhesive application area can be imaged through this window 30a.

[0026] Syringe 27 is filled with adhesive (paste). Adhesives include solder paste, resin paste, and resin film. Various epoxy and polyamide resin bonding materials can be used as resin pastes and resin films.

[0027] By applying a pressing force to the syringe 27 using a pressing force application means (not shown), such as an air supply device, the adhesive is extruded from the nozzle 28.

[0028] Furthermore, as shown in Figure 5, the first driving force application means 22 is composed of an X-axis motor 22a and the second driving force application means 24 is composed of a Y-axis motor 24a. The third moving body 29 is also driven by a third driving force application means 33, which is composed of a Z-axis motor 29a. Each of the axis motors 22a, 24a, and 29 is composed of a servo motor. Here, a servo motor is a motor used in a servo mechanism that accurately realizes position, speed, rotational force (torque), etc., as instructed. In this case, the second driving body 23 is supported by the first moving body 21, and the third moving body 29 is supported by the second driving body 23.

[0029] The control means 25 adjusts the gain or command value of either the first driving force application means 22 or the second driving force application means 24 based on the feedback waveform or the paste application result. Here, the feedback waveform is the feedback waveform between the first driving force application means and the second driving force application means, and the paste application result is the drawn paste application result. In this case, the control means 32 is provided to match at least one of the servo gain (gain) or command timing (command value) of either the first driving force application means 22 or the second driving force application means 24 to the other means. Here, the servo gain is a numerical value that adjusts the reaction (response) and deviation when controlling a servo motor, and in a servo motor, it is a parameter that determines the responsiveness and stability of operation. The command timing is the timing that takes into account the delay (setup time) between the position command and the actual operation of the servo motor. Since there is a delay between the position command and the actual operation of the servo motor, the actual positioning time is obtained by adding the setup time to the positioning time calculated from the operation pattern.

[0030] As shown in Figure 5, the control means 25 includes a control / arithmetic unit 35, a storage device 36, an input / output device 37, a power supply unit 38, etc. The control / arithmetic unit (CPU) 35 interprets the program, issues commands to other devices, and performs calculations (processing) according to the instructions in the program. The storage device 36 is a device that stores data and instructions, and consists of main memory and auxiliary memory. The main memory can directly exchange data with the control / arithmetic unit (CPU) 35, while the auxiliary memory is a device that stores data as an auxiliary to the main memory, and includes hard disks, CD-Rs, CD-RWs, SSDs, USB flash memory, etc.

[0031] The input / output device 37 comprises an input device 40, a display device 41 as an output device, an image acquisition device 42, and a motor control device 43. Here, the input device 40 is a device that inputs data and information from the outside into the main memory of the storage device 36. The output device is a device that outputs data (processing results) from the main memory to the outside (display, print, etc.). The image acquisition device 42 is a device that acquires images acquired by the optical system 44. Here, the optical system 44 includes a wafer recognition camera, a substrate recognition camera, and a paste application area recognition camera 31a, etc. Note that the paste application area recognition camera (adhesive application recognition camera) 31a is not used when creating the paste drawing diagram 50 (see Figure 6) with the first application device 2 according to the present invention, but is used when creating the paste drawing diagram 50 with the second application device 2 according to the present invention, which will be described later.

[0032] The motor control device 43 includes an X-axis servo driver 46, a Y-axis servo driver 47, and a Z-axis servo driver 48. Each servo driver 46, 47, and 48 supplies power to the servo motors 22a, 24a, and 33a according to drive settings such as rotational speed, position, and output. The servo gain is a value that adjusts the response and deviation when controlling the servo motors 22a, 24a, and 33a. This is the timing at which power is supplied to the servo motors 22a, 24a, and 33a based on a value set by the controller (CPU). For this reason, the motor control device 43 constitutes the adjustment means 32 shown in Figure 2.

[0033] Next, a method for applying adhesive (paste) using the first coating device 2 configured as described above will be explained. First, the nozzle 28 is positioned above the area to be coated (island portion 18) to which the adhesive P is to be applied. In this case, the X-axis motor 22a, Y-axis motor 24a, and Z-axis motor 33a are driven to move the first mobile body 21 and the second mobile body 23. In this case, the Z-drive unit, which is composed of the third mobile body 29, is not moved (driven).

[0034] In this state, the Z-axis drive unit, which is the third moving body 29, is lowered, and pressure (extrusion force) is applied into the syringe 27 while maintaining a constant distance between the nozzle 28 and the member to be mounted 3. At the same time, the X-axis drive unit, which is the first moving body 21, and the Y-axis drive unit, which is the second moving body 23, are moved to paste the design onto the member to be mounted 3.

[0035] By the way, when drawing a cross-shaped character (X-shaped character) as shown in Figure 18 in a single stroke by moving the nozzle with a coating device, for example, starting from the midpoint 65 of the character, moving towards A1, returning from A1 to the midpoint 65, moving from midpoint 65 towards C1, returning from C1 to the midpoint 65, moving from midpoint 65 towards D1, returning from D1 to the midpoint 65, and moving from midpoint 65 towards B1, returning from B1 to the midpoint 65. The nozzle 28 moves in the order of arrows 1 → 2 → 3 → 4 → 5 → 6 → 7 → 8 in Figure 18. In other words, the nozzle 28 moves back and forth between midpoint 65 and A1, midpoint 65 and B1, midpoint 65 and C1, and midpoint 65 and D1.

[0036] However, the mass and rigidity of the components driven by the X-axis motor 22a and the Y-axis motor 24a are different. Therefore, when the X-axis motor 22a and the Y-axis motor 24a are driven with the same parameters by the X-axis servo driver 46 and the Y-axis servo driver 47, as shown in Figure 7, a difference in response time S (the difference between the response time of peak P1 of the X-axis feedback waveform fh1 and the response time of peak P2 of the Y-axis feedback waveform fh2) occurs between the X-axis feedback waveform fh1 of the X-axis command waveform Sh1 and the Y-axis feedback waveform fh2 of the Y-axis command waveform Sh2. If a difference in response time S occurs in this way, as shown in Figure 6(a), the forward path 51 and the return path 52 in the drawing 50 will not be straight, and a gap (space) 53 will be formed between the forward path 51 and the return path 52. If a gap (space) 53 is formed in this way, air bubbles will be generated between the paste joint between the chip and the lead frame, making stable bonding (adhesion) impossible and degrading product quality.

[0037] Therefore, as an example of a coating apparatus in the present invention, as shown in Figure 6(b), the apparatus is controlled so that no gap (space) 53 is formed between the forward path 52 and the return path 52. This control method will be explained using Figures 9 to 10 below. First, as shown in step S1, paste drawing is performed on the X and Y axes. That is, the X-axis drive unit, which is the first moving body 21 (the weight of this X-axis drive unit is the sum of the weight of the first moving body and the weight of the second moving body), and the Y-axis drive unit, which is the second moving body 23, are moved (driven) to draw paste P on the lead frame (substrate 3), which is the component to be mounted. At this time, it is not necessary to actually apply paste P. In other words, the X-axis drive unit and the Y-axis drive unit are operated in the same drive path as when drawing, without dispensing adhesive P. After that, the command waveform and FB (feedback) waveform of the X and Y axes are acquired (step S2). That is, waveforms as shown in Figure 7 are acquired. After that, the process moves to step S3 to determine whether the X and Y axis feedback waveforms match. In other words, as shown in Figure 8(a), it is determined whether the X-axis feedback waveform and the Y-axis feedback waveform match. In this case, it is determined whether the time of peak P1 of the feedback waveform of the X-axis motor 22a matches the time of peak P2 of the feedback waveform of the Y-axis motor 24a. Note that in the specification and drawings, "feedback waveform" may be referred to as "FB waveform".

[0038] If they match in step S3, the process proceeds to step S4; otherwise, it proceeds to step S5. In step S5, the gain parameter value is changed. In this case, as shown in Figure 7, when P1, the peak of the X-axis feedback waveform fh1, is later than P2, the peak of the Y-axis feedback waveform fh2, that is, when the X-axis drive unit takes longer to reach the peak coordinate than the Y-axis drive unit, the servo gain parameter value of the Y-axis servo driver 47 is adjusted. However, contrary to Figure 7, when P2, the peak of the Y-axis feedback waveform fh2, is later than P1, the peak of the X-axis feedback waveform fh1, the servo gain parameter value of the X-axis servo driver 46 is adjusted. Normally, as shown in Figure 7, the response time of the larger mass X-axis side is delayed, and P1 is later than P2. Therefore, the faster Y-axis side is adjusted to match the X-axis side. When making adjustments, for example, the gain parameter value is displayed on the display device 41, and this displayed gain parameter value is changed using the input device 40. Furthermore, the modified gain parameter values ​​will be displayed on the display device 41. The waveform after this adjustment will be as shown in Figure 8(a). In other words, the servo gain of the first driving force application means 22 and the servo gain of the second driving force application means 24 can be matched. Matching them means not only making them completely identical, but also making them substantially identical, that is, including a difference of, for example, about 10%.

[0039] Specifically, the difference (time difference) S between P1 and P2 before adjustment, as shown in Figure 7, was 3.0 ms, but the difference S between P1 and P2 after adjustment, as shown in Figure 8(a), became 0.3 ms or less. In this case, P1 ≈ P2, but it is more preferable for P1 = P2. Specifically, after adjustment, the time of P1 and the time of P2 are synchronized. Synchronization means not only making them completely identical, but also making them substantially identical, that is, including a difference of about 10%, for example. It was also possible to reduce the difference (time difference) S between P1 and P2 before adjustment from 3.1 ms to 0.2 ms or less after adjustment.

[0040] Thus, when P1 ≈ P2 (i.e., the difference is 0.2 ms or less), the waveform becomes as shown in Figure 8(a), and as a pasted drawing figure 50, the forward path 51 and the return path 52 are in a straight line, and no gap (space) 53 is formed between the forward path and the return path.

[0041] Thus, if a paste drawing diagram 50 can be drawn in which no gap (space) 53 is formed between the forward path 51 and the return path 52, voids are less likely to form between the mounted component and the component to be mounted, which is less likely to lead to a deterioration of product quality.

[0042] In step S4, a decision is made as to whether or not to terminate the work. If it is decided to terminate the work in step S4, the work is terminated. If it is decided not to terminate the work in step S4, the process returns to step S1, and the work (operation) from step S1 onward continues.

[0043] In Figure 9, gain parameters were used for adjustment, but in Figure 10, command parameters are used for adjustment. In this case as well, when P1, the peak of the X-axis feedback waveform fh1, is slower than P2, the peak of the Y-axis feedback waveform fh2, the servo gain parameter value of the Y-axis servo driver 47 is adjusted. Conversely, when P2, the peak of the Y-axis feedback waveform fh2, is slower than P1, the peak of the X-axis feedback waveform fh1, the servo gain parameter value of the X-axis servo driver 47 is adjusted. Note that the other steps are the same as those shown in Figure 9, so their explanations are omitted.

[0044] Thus, even when adjusting using command parameters, the peak times P1 and P2 can be made approximately P1 ≈ P2, as shown in Figure 8(b). In this case as well, the difference between the adjusted P1 and P2 can be made 0.2 ms or less, as shown in Figure 8(a).

[0045] If P1 ≈ P2 (i.e., the difference is 0.2 ms or less), the waveform will be as shown in Figure 8(b), and when pasted and drawn, the forward path 51 and the return path 52 will be in a straight line, and no gap (space 53) will be formed between the forward path 51 and the return path 52.

[0046] Next, a second coating apparatus will be described. The second coating apparatus uses the optical system shown in Figure 5. That is, in the second embodiment, compared to the first embodiment, an imaging means 31 and an optimized image input means 56 are provided, as shown in Figure 11. In this case, the imaging means 31 uses the paste coating area recognition camera 31a of the optical system 44. Also, the optimized image input means 56 in Figure 11 can use the control means 25 in Figure 5.

[0047] A paste application method using the paste application recognition camera 31a will be explained with reference to Figures 12 and 13. In this case, first, the X-axis drive unit, which is the first moving body 21, and the Y-axis drive unit, which is the second moving body 23, are driven to draw paste P on the lead frame (substrate) 3, which is the component to be mounted, and an optimized image is obtained (step S10). After drawing in this manner, the optimized image is obtained by the recognition camera 31a. In this case, either a newly created drawing may be obtained, or a previously created drawing may be used as the optimal image. That is, it is drawn or read from the memory unit (storage device 36). Here, the optimized image is an image in which the forward path 51 and the return path 52 overlap and no gap 53 is formed between the forward path 51 and the return path 52, as shown in Figure 6(b). The optimized image is input to the storage device 36 from the optimized image input means 56 and stored.

[0048] Next, the process moves to step S11 to perform paste drawing. That is, the X-axis drive unit, which is the first moving body 21, and the Y-axis drive unit, which is the second moving body 23, are driven to draw paste P on other parts (island parts 18) on the lead frame 3, which is the mounted component, and this paste drawing image is acquired (step S12). After that, the process moves to step S13, where the optimized image stored in the storage device 36 is compared with the image acquired in step S12 to determine whether the image acquired in step S12 falls within the threshold of the optimized image. In this case, a threshold of, for example, ±10% is set for the number of pixels in the paste portion of the optimized image, and it is determined whether the number of pixels in the paste portion of the paste drawing image acquired in step S12 falls within this range. That is, it is determined whether the paste drawing area falls within the threshold of the optimized image area (the ±10% threshold).

[0049] If the threshold is met in step S13, the paste drawing figure 50 will not have a gap (space 53) between the forward path 51 and the return path 52, as shown in Figure 6(b), and the process will proceed to step S14. Therefore, if the threshold is not met in step S13, the process will proceed to step S15 to change the parameter value of the servo gain of the X-axis servo driver 46 (changed to the -X direction). After that, the process will proceed to step S16 to drive the X-axis drive unit and the Y-axis drive unit to draw the paste P on the lead frame 3, which is the component to be mounted, and to acquire the paste drawing image (step S17).

[0050] In step S14, a decision is made as to whether or not to terminate the work. If it is decided in step S14 to terminate the work, the work (action) is terminated. If it is decided not to terminate the work in step S14, the process returns to step S11 and continues the work (action) from step S11 onward.

[0051] From step S17, the process moves to A in Figure 13. From A, the process moves to step S18 to determine if the pasted area has approached the optimized image area. If it has approached in step S18, the process moves to step S19; if it has not approached in step S18, the process moves to step S20. Here, the pasted area approaching the optimized image area means that the number of pixels in the pasted portion of the pasted image approaches the number of pixels in the pasted portion of the optimized image.

[0052] In step S19, the servo gain parameter value of the X-axis servo driver 46 is changed by the same amount as in step S15. (In this case, the paste application pressure or time may also be adjusted.) The servo gain parameter value of the X-axis servo driver 46 is changed (changed in the -X direction). In this case, it is changed in small increments in the -X direction. Here, small increments means, for example, about 5% of the servo gain parameter value. After that, the process moves to step S21, where the first moving body 21, which is the X-axis drive unit, and the second moving body 23, which is the Y-axis drive unit, are driven to draw paste P on the lead frame 3, which is the component to be mounted, and the image of the drawn paste is acquired (step S22). Next, the process moves to step S23, where it is determined whether the drawing area of ​​the drawn paste acquired in step S22 falls within the threshold of the optimized image area. If it does in step S23, the process moves to step S24, where it is determined whether to terminate the work or not. If it does not fall within the threshold in step S23, the process returns to step S19 and continues with the work (operation) from step S19 onward. If it is determined in step S24 to terminate the work, the work (operation) will end. If it is determined not to terminate the work in step S24, the process will return to B in Figure 12 and continue the work (operation) from step S11 onwards.

[0053] In step S20, the servo gain parameter value of the Y-axis servo driver 47 is changed by a predetermined amount. That is, the gain parameter value is changed in the -Y direction. In this case, the servo gain parameter value of the X-axis servo driver that was changed in step S15 is returned to its original value (reset). Here, the predetermined amount is, for example, about 5% of the servo gain parameter value. Step S20 is followed by step S25. In step S25, the X-axis drive unit, which is the first moving body 21, and the Y-axis drive unit, which is the second moving body 23, are driven to draw paste P on the lead frame 3, which is the component to be mounted, and then the process moves to step S26 to acquire the drawn paste image.

[0054] After that, the process moves to step S27 to determine whether the area of ​​the pasted drawing obtained in step S26 falls within the threshold for the optimized image area. If it does, the process moves to step S28; otherwise, the process moves to step S20 and continues with the operations from step 20 onward.

[0055] In step S28, a decision is made as to whether or not to terminate the work. If it is decided in step S28 to terminate the work, the work (operation) is terminated. If it is decided not to terminate the work in step S28, the process returns to B in Figure 12 and continues the work (operation) from step S11 onwards.

[0056] Incidentally, the adjustments in steps S15, S19, and S20 are performed by changing the gain parameter values ​​displayed on the display device 41 using the control / calculation device 35, and the changed gain parameter values ​​are displayed on the display device 41. Furthermore, the predetermined amount is set in advance by the user in the parameter setting unit (not shown). The determined (set) predetermined amount can be input to the control / calculation device 35 using the input device. For this reason, the process is performed automatically during operation without user intervention.

[0057] The coating method shown in Figures 14 and 15 differs from the coating method shown in Figures 12 and 13 in steps S15, S19, and S20. Specifically, it uses command parameter values ​​for adjustment, with step S15 becoming step S30, step S19 becoming step S31, and step S20 becoming step S32.

[0058] In step S30 shown in Figure 14, the command parameter value of the X-axis servo driver 46 is changed by a predetermined amount. That is, the command parameter value is changed in the -X direction. After that, the process proceeds to step S16. Here, the predetermined amount is, for example, about 1.0 ms. In step S31 in Figure 15, the command parameter value of the X-axis servo driver 46 is changed by the same amount as in step S30, and the process proceeds to step S21. In this case, the change is actually made in small increments in the -X direction. Here, small increments means, for example, about 0.1 ms. In step S32 in Figure 15, the command parameter value of the Y-axis servo driver 47 is changed by a predetermined amount. That is, the command parameter value is changed in the -Y direction. At this time, the command parameter value of the X-axis servo driver 46 that was changed in step S30 is returned to its original value. After that, the process proceeds to step S25. Furthermore, step S17 in Figure 14 is followed by step C in Figure 15, step S24 NO in Figure 15 is followed by step D in Figure 14 and then step S11, and step S28 NO in Figure 15 is followed by step D in Figure 14 and then step S11. Note that the other steps shown in Figures 14 and 15 are the same as the steps shown in Figures 12 and 13, so their explanations are omitted.

[0059] Furthermore, in the coating method shown in Figures 14 and 15, the adjustments in steps S30, S31, and S32 are made by changing the command parameter values ​​displayed on the display device 41 using the control / calculation device 35, and the changed command parameter values ​​are displayed on the display device 41. In addition, the predetermined amount is set in advance by the user in the parameter setting unit (not shown). The determined (set) predetermined amount can be input into the control / calculation device 35 using the input device. Therefore, the process is performed automatically during operation without user intervention.

[0060] Therefore, whether using the application method shown in Figures 12 and 13, or the application method shown in Figures 14 and 15, it is possible to create a paste drawing without forming a gap (space) between the forward path 51 and the return path 52, as shown in Figure 6(a). When only the paste application motion is performed, the amount of paste used can be reduced. When actually applying paste, defects caused by the viscosity of the paste can also be eliminated.

[0061] Thus, by drawing the paste pattern 50 using this coating device, it is possible to suppress the formation of a gap (space) between the forward path 51 and the return path 52, even if the first moving body 21 and the second moving body 23 have different masses and rigidities.

[0062] The adjustment means 32 acquires the command waveforms from the first driving force application means 22 and the second driving force application means 24, as well as a feedback waveform indicating the response time corresponding to the command waveform, and allows the response time of the feedback waveform to the command waveform to be adjusted by a parameter. With this configuration, the peak time of the feedback waveform of the first driving force application means 22 and the peak time of the feedback waveform of the second driving force application means 24 can be stably matched.

[0063] In terms of the difference in response time between the command waveform and the feedback waveform, if the peak of the feedback waveform of the first driving force application means 22 is slower than the feedback waveform of the second driving force application means 24, it is preferable to adjust the parameters of the second driving force application means 24. Conversely, if the second driving force application means 24 is slower than the feedback waveform of the first driving force application means 21, it is preferable to adjust the parameters of the first driving force application means 21.

[0064] When the difference in response time between the command waveform and the feedback waveform is smaller for the first drive force application means 21 than for the second drive force application means 24, it is preferable to adjust the parameters of the first drive force application means 22. When the difference for the second drive force application means 24 is smaller than for the first drive force application means 22, it is preferable to adjust the parameters of the second drive means 24. In other words, adjusting to the smaller difference in response time provides better adjustability.

[0065] The system may include an imaging means 31 for imaging the adhesive P applied to the mounted component, and may adjust either the first driving force application means 22 or the second driving force application means 24 by comparing the first image captured by the imaging means 31 with a previously acquired optimized image of the applied adhesive. In this way, by comparing the first image captured by the imaging means 31 with a previously acquired optimized image of the applied adhesive P and making adjustments, the formation of a gap (space) 53 between the forward path 51 and the return path 52 can be effectively suppressed.

[0066] The system may also be equipped with a display means 41 that displays either the adjusted gain or the command value. In this embodiment, the gain is the servo gain and the command value is the command timing. With the display means 41 in this way, the operator can grasp the adjustment amount and the work becomes more stable.

[0067] Furthermore, the above-described electronic component mounting apparatus is an electronic component mounting apparatus for holding an electronic component, which is a mounting member 6, and mounting it onto a member to be mounted 3, and is equipped with a coating device 2. Therefore, the coating device 2 can suppress the formation of a gap (space) 53 between the forward path 51 and the return path 52, making it less likely for voids to form between the mounting member 6 and the member to be mounted 3, and thus less likely to lead to deterioration of product quality.

[0068] In the coating method described above, even if the mass and rigidity of the first moving body 21 and the second moving body 23 are different, by matching the time of the peak P1 of the first directional feedback waveform fh1 of the first driving force applying means 22 with the time of the peak P2 of the second directional feedback waveform fh2 of the second driving force applying means, the coating nozzle 28 of the coating means 20 can be moved linearly, and the formation of a gap (space) 53 between the forward path 51 and the return path 52 can be suppressed.

[0069] The present invention is not limited to the above-described embodiments and can be modified in various ways. It can be widely used not only for manufacturing semiconductors on which electronic components are mounted, but also for manufacturing articles on which components such as semiconductor chips are mounted. Incidentally, although three types of paste drawing diagrams 50 are shown in Figure 4, the invention is not limited to these. It can be a figure that can be drawn in a single stroke, and not only straight lines but also arcs and circular shapes can be drawn. In other words, it can be changed in various ways depending on the size and shape of the mounted material (chip, etc.). Incidentally, in the embodiments, the parameter value of the servo gain to be adjusted or the parameter value of the command timing to be adjusted was adjusted by the adjustment means 32, but both the parameter value of the servo gain and the parameter value of the command timing may be used for adjustment.

[0070] Furthermore, although the above embodiment included two coating devices, only one may be used. In addition, the number of substrate islands, the island arrangement pitch, etc., can be changed as desired, and the arrangement pitch does not have to be at equal intervals.

[0071] In this embodiment, servo gain was used as the gain adjusted by the control means 25. However, in addition to servo gain, other types of gains include position gain (a parameter that determines the position response to load disturbances in a position control system such as a servo motor), speed gain (a parameter that determines the response of the speed control loop), torque gain (a numerical value that adjusts the ratio (gain) of input to output in torque control), speed loop comparison gain (a parameter that determines the response of the speed control loop), speed loop integral gain (a parameter that affects the steady-state speed error of the motor and the stability of the system in the speed control loop of a servo motor), and position loop comparison gain (a value that represents the performance of a servo motor or servo driver, which is the ratio of the operating speed to the accumulated amount of the deviation counter), and these gains may also be used in this invention.

[0072] Furthermore, in this embodiment, the command timing was used as the command value adjusted by the control means 25. However, in addition to the command timing, other command values ​​may include position commands (commands that specify the rotation angle and position of the motor), speed commands (commands that specify the rotation speed of the motor), torque commands (commands that specify the torque (rotational force) generated by the motor), and current commands (commands that control the current flowing through the motor). In this invention, these command values ​​may also be used. [Explanation of Symbols]

[0073] 20 Coating means 21 First Mobile Unit 22 First driving force application means 23 Second Mobile Unit 24 First driving force application means 25 Control means 32 Adjustment means 55 Imaging means 56 Optimized Image Input Means

Claims

1. A coating means for applying an adhesive to a component to be mounted for joining components that are mounting members, A first moving body moves the coating means in a first direction, A first driving force applying means for applying driving force to the first moving body, A second moving body supported by the first moving body moves the coating means in a second direction different from the first direction, A second driving force application means for applying driving force to the second moving body, The system comprises a control means for controlling the first driving force application means and the second driving force application means, The control means is controlled to adjust the gain or command value of either the first driving force application means or the second driving force application means based on the command waveforms of the first driving force application means and the second driving force application means and the feedback waveform thereto. The aforementioned gain is a value that adjusts the ratio of input to output when controlling the rotation of the motor, and is adjusted to perform optimal control according to the load. It is a control parameter that determines the responsiveness and operational stability of the servo motor. The coating apparatus is characterized in that the command value is a command value related to current or torque, or a command timing that takes into account the delay between the command and the actual operation of the servo motor.

2. A means for applying an adhesive to a component to be mounted for joining components that are mounting members, A first moving body moves the coating means in a first direction, A first driving force applying means for applying driving force to the first moving body, A second moving body supported by the first moving body moves the coating means in a second direction different from the first direction, A second driving force application means for applying driving force to the second moving body, The system comprises a control means for controlling the first driving force application means and the second driving force application means, The control means is capable of adjusting the gain or command value of either the first driving force application means or the second driving force application means based on the drawn paste application result. The aforementioned gain is a value that adjusts the ratio of input to output when controlling the rotation of the motor, and is adjusted to perform optimal control according to the load. It is a control parameter that determines the responsiveness and operational stability of the servo motor. The coating apparatus is characterized in that the command value is a command value related to current or torque, or a command timing that takes into account the delay between the command and the actual operation of the servo motor.

3. The coating apparatus according to claim 1, characterized in that the peak of the feedback waveform of the first driving force application means and the peak of the feedback waveform of the second driving force application means are matched.

4. The control means acquires the command waveform in the first driving force application means and the second driving force application means, and a feedback waveform indicating the response time corresponding to the command waveform, and in the difference between the response time of the command waveform and the feedback waveform, The coating apparatus according to claim 1, characterized in that when the difference in response time between the command waveform and the feedback waveform of the first driving force providing means is smaller than the difference in response time between the command waveform and the feedback waveform of the second driving force providing means, the parameters of the first driving force providing means are adjusted, and when the difference in response time between the command waveform and the feedback waveform of the second driving force providing means is smaller than the difference in response time between the command waveform and the feedback waveform of the first driving force providing means, the parameters of the second driving force providing means are adjusted.

5. The coating apparatus according to claim 1, further comprising a display means for displaying either the adjusted gain or the adjusted command value.

6. The system includes an imaging means for imaging the adhesive applied to the component to be mounted, The first image captured by the imaging means and the previously acquired optimized image of the applied adhesive By comparing the two, adjust either the first driving force application means or the second driving force application means. The coating apparatus according to claim 2, characterized in that it does so.

7. A coating means for applying an adhesive to a component to be mounted for joining components that are mounting members, A first moving body moves the coating means in a first direction, A first driving force applying means for applying driving force to the first moving body, Supported by the first moving body, the coating means moves in a second direction different from the first direction. The second mobile body, Using a coating means that includes a second driving force applying means for applying driving force to the second moving body, The gain and command value of either the first driving force application means or the second driving force application means are adjusted to match the other means. The aforementioned gain is a value that adjusts the ratio of input to output when controlling the rotation of the motor, and is adjusted to perform optimal control according to the load. It is a control parameter that determines the responsiveness and operational stability of the servo motor. The coating method is characterized in that the command value is a command value related to current or torque, or a command timing that takes into account the delay between the command and the actual operation of the servo motor.

8. An electronic component mounting apparatus for holding an electronic component which is a mounting member and mounting it onto the member to be mounted, An electronic component mounting apparatus characterized by comprising a coating apparatus according to any one of claims 1 to 5.

9. An electronic component mounting method for holding an electronic component which is a mounting member and mounting it on the member to be mounted, An electronic component mounting method characterized by mounting the electronic component on the adhesive application site using the application method described in claim 7.

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