Speaker module structure and electronic device including the same

Abstract

A speaker module structure according to various embodiments of the present disclosure includes a first structure, a second structure capable of being coupled to the first structure, and a speaker coupled to at least one of the first structure or the second structure, the second structure includes at least one groove that forms a resonant space by coupling the first structure and the second structure, the resonant space is connected to the speaker, an adsorption material is injected into the resonant space, and when the first structure and the second structure are coupled, one end of the groove includes an opening formed in a closed loop including a portion of the first structure and a portion of the second structure.

Description

Technical Field

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[0001] The present disclosure relates to a speaker module structure and an electronic device including the same.

Background Art

[0002] Generally, an electronic device includes a speaker device for providing an acoustic service to a user, and the speaker device is fixed in the internal space of the electronic device.

[0003] The speaker device requires a resonance space for the quality of the sound output from the speaker unit. Therefore, the speaker device can include a case for accommodating the speaker unit to secure the resonance space.

[0004] With the trend of slimming and miniaturization of electronic devices, the speaker devices arranged inside the electronic devices are also required to be miniaturized. That is, the case for accommodating the speaker unit for securing the resonance space comes to have a limited size, and as a result, the resonance space for the quality of the sound can also have a limited size.

[0005] The above information is provided only as background information to help understand the present disclosure. No determination has been made as to whether any of the above matters can be applied as prior art related to the present disclosure, nor has any claim been made.

Summary of the Invention

Problems to be Solved by the Invention

[0006] When an adsorption material is injected into the resonant space of a speaker device from the height direction of the speaker device, if the speaker device is not tall enough, the passage for the adsorption material may be narrow, making it difficult for the adsorption material to move smoothly into the resonant space. As a result, the time required for the adsorption material to move from the injection point to the resonant space at a predetermined distance may increase, potentially raising the production cost. In addition, the structure of the device may create a narrow path for the adsorption material to move, hindering its injection.

[0007] The size of the speaker module may increase to secure an inlet or movement path for injecting the adsorbed material. Therefore, a structure is required that allows for miniaturization of the speaker module and secure an inlet or movement path for injecting the adsorbed material.

[0008] Aspects of the present disclosure solve at least the problems and / or disadvantages mentioned above and provide at least the advantages described below. Accordingly, aspects of the present disclosure can provide a speaker module structure and an electronic device including the same, in which a case for housing a speaker unit is formed by the joining of independently separable structures, and an adsorbent material can be injected through an opening formed in the side of the case.

[0009] Additional aspects are partially described in the following description, partially evident from the description, or can be learned by performing the presented embodiments. [Means for solving the problem]

[0010] A speaker module structure according to various embodiments of the present disclosure includes a first structure, a second structure connectable to the first structure, and a speaker connected to at least one of the first structure or the second structure, wherein the second structure includes at least one groove that forms a resonant space by the connection of the first structure and the second structure, the resonant space is connected to the speaker and injected with an adsorption material, and one end of the groove may include an opening formed in a closed loop including a portion of the first structure and a portion of the second structure when the first structure and the second structure are connected.

[0011] An electronic device comprising a speaker assembly according to various embodiments of the present disclosure, comprising a first carrier, a second carrier coupletable to the first carrier, and a speaker coupled to at least one of the first carrier or the second carrier, wherein the second carrier comprises at least one groove that forms a resonant space by coupling with the first carrier and the second carrier, the resonant space is connected to the speaker and injected with an adsorption material, and one end of the groove may include an opening formed in a closed loop including a portion of the carrier and a portion of the second carrier, with the first carrier and the second carrier coupled together. [Effects of the Invention]

[0012] According to the various embodiments disclosed herein, adsorbent material can be smoothly injected into the resonant space within the speaker device through openings formed on the side of the speaker device by the joining of separable structures.

[0013] According to the various embodiments disclosed herein, by forming an opening for injecting the adsorbent material on the side of the speaker device, the height of the speaker device can be reduced compared to when the material is injected from the height direction of the speaker device, thereby reducing the space lost.

[0014] Other aspects, advantages, and distinguishing features of this disclosure will become apparent to those skilled in the art from the following detailed description, which discloses various embodiments of this disclosure together with the accompanying drawings. [Brief explanation of the drawing]

[0015] [Figure 1] This is a front perspective view of an electronic device according to one embodiment. [Figure 2] This is a rear perspective view of an electronic device according to one embodiment. [Figure 3] This is a projection view showing the arrangement of internal components of an electronic device according to one embodiment. [Figure 4] This is a cross-sectional view showing a portion of the line A-A' in Figure 3, according to one embodiment. [Figure 5A] This figure shows the first and second states of a speaker module according to one embodiment. [Figure 5B] This diagram shows a speaker module according to another embodiment. [Figure 6A] This is a cross-sectional view showing the cross-section of line B-B' in the second state of the speaker module in Figure 5A according to one embodiment. [Figure 6B] This is a cross-sectional view showing the cross-section of line C-C' of the speaker module in Figure 5B according to another embodiment. [Figure 7] This figure shows an opening formed in a speaker module according to one embodiment. [Figure 8] This figure shows a first sealing member attached to a region of a speaker module according to one embodiment. [Figure 9] This figure shows a second sealing member attached to a speaker module according to one embodiment. [Figure 10] This figure shows an opening formed in a speaker module according to another embodiment. [Figure 11]A diagram showing an area to which a first sealing member is attached and an area to which a second sealing member is attached according to another embodiment. [Figure 12] A block diagram of an electronic device in a network environment according to various embodiments.

[0016] Throughout the drawings, it will be understood that like reference numerals indicate like parts, components, and structures.

Mode for Carrying Out the Invention

[0017] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the content of the present disclosure defined by the claims and their equivalents. Although various specific details are included herein for the purpose of assistance, these should be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the content and spirit of the present disclosure. Also, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0018] The terms and words used in the following description and claims are not limited to bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the following description of the various embodiments of the present disclosure is not for the purpose of limiting the invention as defined by the appended claims and their equivalents, but is provided for merely illustrative purposes.

[0019] The singular form is understood to include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to "component surface" includes a reference to one or more of such surfaces.

[0020] FIG. 1 is a front perspective view of an electronic device 101 according to one embodiment. FIG. 2 is a rear perspective view of the electronic device 101 according to one embodiment.

[0021] The electronic device 101 in Figure 1 can correspond to the electronic device 1201 in Figure 12, which will be described later. For example, the electronic device 101 may include some or all of the components that make up the electronic device 1201 in Figure 12.

[0022] Referring to Figures 1 and 2, the speaker device according to the embodiments of this disclosure is disclosed as being equipped in a bar-type electronic device, but it can also be applied to, and is not limited to, electronic devices equipped with a speaker device, such as slidable, rollable, and foldable types.

[0023] Referring to Figures 1 and 2, an electronic device 101 according to one embodiment may include a housing 110 that includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface (or side wall) 110C that surrounds the space between the first surface 110A and the second surface 110B. In another embodiment, the housing 110 may show a structure that forms part of the first surface 110A, the second surface 110B, and the side surface 110C.

[0024] According to one embodiment, the first surface 110A may be formed by a front plate 121 that is at least partially substantially transparent (e.g., a glass plate or polymer plate including various coating layers). In one example, the front plate 121 may include a curved portion that extends seamlessly from the first surface 110A toward the rear plate 111 at at least one side edge portion.

[0025] In one embodiment, the second surface 110B may be formed by a substantially opaque rear plate 111. In one example, the rear plate 111 may be formed from coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In one example, the rear plate 111 may include a curved portion that curves seamlessly from the second surface 110B toward the front plate 121 at at least one side end.

[0026] In one embodiment, the side surface 110C may be formed by a side member (or side bezel structure or side wall) containing metal and / or polymer, in conjunction with the front plate 121 and the rear plate 111. In one example, side surface 110C may include a first side surface 1111 located to the right of the electronic device 101 (e.g., in the +x direction in Figure 1) and extending along a first direction (e.g., in the +y direction in Figure 1), a second side surface 1112 parallel to the first side surface 1111 and extending along the first direction, a third side surface 1113 extending along a second direction perpendicular to the first direction (e.g., in the +x direction in Figure 1) and connecting one end of the first side surface 1111 (e.g., one end in the +y direction in Figure 1) to one end of the second side surface 1112 (e.g., one end in the +y direction in Figure 1), and / or a fourth side surface 1114 parallel to the third side surface 1113 and connecting the other end of the first side surface 1111 (e.g., one end in the -y direction in Figure 1) to the other end of the second side surface 1112 (e.g., one end in the -y direction in Figure 1).

[0027] According to one embodiment, the electronic device 101 may include at least one of the following: a display 120, a first optical sensor (e.g., a sensor module and / or a camera module) 103, a connector hole 104, or an audio module 105. In one example, the electronic device 101 may omit at least one or include additional components. For example, the electronic device 101 may further include a sensor module not shown. The electronic device 101 may omit the key input device 107.

[0028] In one embodiment, sensors such as proximity sensors, illuminance sensors, image sensors, or iris sensors may be integrated into the display 120 or positioned adjacent to the display 120 within the area provided by the front plate 121.

[0029] In one embodiment, the display 120 may be visually exposed through a substantial portion of the front plate 121. In one example, the display 120 may be coupled to, or adjacent to, a touch-sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a digitizer for detecting an electromagnetic stylus pen. In one example, the corners of the display 120 may be formed substantially identical to the adjacent outer edge shape (e.g., a curved surface) of the front plate 121.

[0030] In one embodiment, the connector hole 104 can accommodate a connector for transmitting and receiving power and / or data with an external electronic device (e.g., electronic devices 1202 and 1204 in Figure 12), and / or a connector for transmitting and receiving audio signals with the external electronic device. For example, the connector hole 104 may include a USB connector or an earphone jack (not shown) (or an "earphone interface"). In one embodiment, the USB connector and the earphone jack can be mounted in a single hole, and in another embodiment, the electronic device 101 may transmit and receive power and / or data with an external device or transmit and receive audio signals without a separate connector hole.

[0031] In one embodiment, the audio module 105 may include a microphone hole and a speaker hole. The microphone hole may house a microphone for acquiring external sounds, and multiple microphones may be housed inside to sense the direction of sound. In another example, the speaker hole and microphone hole may be implemented in a single hole, or a speaker (e.g., a piezo speaker) may be included without a separate speaker hole. The speaker hole may include an external speaker hole and a receiver hole for calls.

[0032] In one embodiment, the key input device 107 may be located on the side surface 110C of the housing 110. In one embodiment, the electronic device 101 may not include some or all of the key input devices 107 mentioned above, and the not included key input devices 107 may be implemented in other forms, such as soft keys, on the display 120. In one example, the key input device 107 may include at least a portion of a fingerprint sensor located on the second surface 110B of the housing 110.

[0033] In one embodiment, the second optical sensor 130 and the third optical sensor 106 may be arranged on the second surface 110B of the electronic device 101. The second optical sensor 130 may include multiple cameras. In one example, the third optical sensor 106 may include a flash. In one example, the first optical sensor 103, the second optical sensor 130, and the third optical sensor 106 may include one or more lenses, an image sensor, and / or an image processor. The third optical sensor 106 may include a light-emitting diode or a xenon lamp. In one example, two or more lenses (e.g., an infrared camera, a wide-angle and / or telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101.

[0034] In one embodiment, the electronic device 101 can generate electronic signals or data values ​​corresponding to internal operating states or external environmental conditions by including a sensor module (not shown). The electronic device 101 may further include at least one of the following sensor modules (not shown): a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0035] Figure 3 is a projection view showing the arrangement of internal components of an electronic device 101 according to one embodiment.

[0036] At least one component of the electronic device 101 may be identical or similar to at least one component of the electronic device 101 shown in Figures 1 and 2, and redundant explanations will be omitted below.

[0037] Referring to Figure 3, in one embodiment, a first optical sensor 103, a second optical sensor 130, a circuit board 210, a motor 220, and a speaker module 300 may be arranged in the internal space of the electronic device 101.

[0038] In one embodiment, the circuit board 210 may be located on at least a portion of the housing 110. The circuit board 210 may include a processor (e.g., processor 1220 in Figure 12), memory (e.g., memory 1230 in Figure 12), communication circuits (e.g., communication module 1290 in Figure 12), a power management module (e.g., power management module 1288 in Figure 12), and / or interfaces (e.g., interface 1277 in Figure 12) necessary for the operation of the electronic device 101.

[0039] In one embodiment, the circuit board 210 may include at least one of a PBA (printed board assembly), a PCB (printed circuit board), or an FPCB (flexible printed circuit board).

[0040] In one embodiment, the circuit board 210 may be electrically connected to the speaker module 300 and configured to output audio data or voice / sound signals via a speaker (e.g., the speaker unit 301 in Figure 4, described later).

[0041] In one embodiment, the speaker module 300 can convert an electrical signal into an acoustic signal and output sound through an output unit (e.g., a diaphragm).

[0042] Figure 4 shows a cross-sectional view of a portion of line A-A' in Figure 3, according to one embodiment.

[0043] Referring to Figure 4, the z-axis can indicate the thickness direction of the electronic device 101. In one example, the z-axis can include a first direction (e.g., the +z direction) and a second direction (e.g., the -z direction).

[0044] Referring to Figure 4, the electronic device 101 may include a rear plate 111, a side bezel structure 131, a support member 132, a display 120, or a speaker module 300. In one example, at least a portion of the speaker module 300 may be positioned between the support member 132 and the rear plate 111. In one embodiment, the speaker module 300 may be referred to as a speaker module structure or speaker assembly.

[0045] In one embodiment, the side bezel structure 131 can be formed to at least partially enclose the space between the front (e.g., the first surface 110A in Figure 1) and the rear (e.g., the second surface 110B in Figure 2) of the electronic device 101. In one example, the side bezel structure 131 can form at least a portion of the side of the electronic device 101 (e.g., the side surface 110C in Figure 1). In one example, the side bezel structure 131 may include metal and / or polymer and may have a frame that substantially forms the side of the electronic device 101. In one example, if the side bezel structure 131 includes a metal material, a portion of the metal material can be insulated from other portions and used as an antenna for transmitting and receiving radio signals.

[0046] In one embodiment, the support member 132 may be positioned within the internal space of the electronic device 101. For example, the support member 132 may be positioned within a region or space enclosed by the side bezel structure 131. In one example, the support member 132 may be formed as a flat plate, with one side substantially facing the inner surface of the display 120.

[0047] In one embodiment, the side bezel structure 131 is described separately from the support member 132, but the support member 132 can be formed integrally with the side bezel structure 131. For example, the side bezel structure 131 and the support member 132 can be integrally formed by combining multiple metallic material parts and synthetic resin material parts through processes such as die casting, insert injection, or turning. In one example, a part of the metallic portion of the side bezel structure 131 or the support member 132 can function as an antenna. In another example, the support member 132 can be manufactured separately from the side bezel structure 131 and assembled and mounted inside the side bezel structure 131.

[0048] In one embodiment, the support member 132 may include an opening 132a. In one example, the opening 132a may be formed to penetrate from one side of the support member 132 (e.g., the side facing the inner surface of the display 120) to the other side of the support member 132 (e.g., the side facing the opposite direction from the one side of the support member 132). In one example, the support member 132 may include a flange 132b extending from the other side of the support member 132. In one example, sound output from the speaker unit 301 may be output to the outside through the opening 132a.

[0049] In one embodiment, the speaker module 300 may include a structure 310, a speaker unit 301, a protective member 302, and a resonance space RS. In one embodiment, at least a portion of the resonance space RS may be filled with an adsorbent material.

[0050] In one embodiment, the structure 310 may include a first structure 311 and a second structure 312. The structure 310 may be referred to as a carrier 310 or a housing 310.

[0051] Referring to Figure 4, the speaker module 300 can be a separate structure 310 including a speaker unit 301, and can be provided in a structure that shields the rear sound of the speaker unit 301 via the first structure 311 and the second structure 312.

[0052] Referring to Figure 4, the protective member 302, speaker unit 301, first structure 311, and second structure 312 can be arranged in order from the support member 132 of the electronic device 101 in a first direction (e.g., the +z direction).

[0053] In one embodiment, the second structure 312 may be formed as a flat plate that is positioned opposite the inner surface of the rear plate 111. The first structure 311 is flat and can be positioned and coupled opposite at least a portion of the second structure 312. In one example, the first structure 311 may include a first groove formed in a first direction (e.g., the +z direction). In another example, the second structure 312 may include a second groove formed in a second direction (e.g., the -z direction). In one example, when the first structure 311 and the second structure 312 are coupled, the first groove and / or the second groove may form a resonant space RS.

[0054] In one embodiment, an adsorption material can be injected into the resonance space RS. The resonance space RS into which the adsorption material is injected will be described in detail with reference to Figures 5A to 10, which will be described later.

[0055] In one embodiment, the first structure 311 may include a rib structure formed in a second direction (e.g., -z direction) to which a speaker unit 301 can be mounted.

[0056] In one embodiment, the first structure 311 may include an opening 311a such that one surface of the mounted speaker unit 301 corresponds to a resonant space RS. In one example, the opening 311a may be formed to penetrate from one surface of the first structure 311 (e.g., the surface facing the second structure 312) to the other surface of the first structure 311 (e.g., the surface facing the opposite direction from the surface of the first structure 311). In one example, the rib structure of the first structure 311 may be formed in regions adjacent to one and the other side of the opening 311a. In one example, the speaker unit 301 may be mounted on the rib structure, and one surface of the speaker unit 301 can form a resonant space RS together with the first structure 311 and the second structure 312.

[0057] In one embodiment, the speaker unit 301 may be arranged in a substantially hexahedral shape. In one example, the speaker unit 301 may include components such as a magnetic circuit including a yoke and a magnet, a voice coil located in the air gap of the magnetic circuit, side diaphragms vibrating by the voice coil, a center diaphragm, a suspension that guides the movement of the voice coil and diaphragms, and terminal pads that receive electrical signals from the outside so that electrical signals can be transmitted to the voice coil via the suspension. However, the configuration or form of the speaker unit 301 is not limited thereto.

[0058] In one embodiment, the protective member 302 may be attached to and / or bonded to the other side of the speaker unit 301 (e.g., the side opposite to the side of the speaker unit 301 that forms the resonance space RS). In one example, the protective member 302 may allow the sound of the speaker unit 301 to pass through. In one example, the protective member 302 may be a cover that protects the speaker unit 301 from the outside. In one example, the protective member 302 may be a member of an elastic material having a structure that prevents foreign matter from entering the inside of the electronic device 101 in which the speaker module 300 is located. For example, the protective member 302 may include at least one of LSR (liquid injection silicone rubber), silicone, or rubber. The protective member 302 is not limited to these and may include a rigid material or stainless steel (STS).

[0059] In one embodiment, the display 120 is positioned on one surface of the support member 132 and can output a screen toward the front of the electronic device 101.

[0060] Figure 5A shows the first state 300a and the second state 300b of the speaker module 300 according to one embodiment.

[0061] Referring to Figure 5A, the first state 300a of the speaker module 300 is a state in which the first structure 311 and the second structure 312 are separated. The second state 300b of the speaker module 300 is a state in which the first structure 311 and the second structure 312 are connected.

[0062] In one embodiment, the first structure 311 may have a first size, and the second structure 312 may have a second size larger than the first size, but is not limited thereto. In one example, the second structure 312 may include a first region corresponding to the first structure 311 and a second region excluding the first region.

[0063] In one embodiment, the first structure 311 and the second structure 312 can be joined together. In one example, the first structure 311 and the second structure 312 may include projections, grooves and / or grooves. For example, the second structure 312 may include at least one projection in the direction facing the first structure 311. The first structure 311 may include at least one groove for accommodating at least one projection of the second structure 312.

[0064] In one embodiment, the first structure 311 and the second structure 312 can be fixed together by at least one of the following steps: ultrasonic welding, double-sided tape application, and bonding.

[0065] In one embodiment, a groove formed in the first structure 311 or the second structure 312 can form a resonant space in the second state 300b of the speaker module 300.

[0066] Referring to Figure 5A, the speaker module 300 may include an opening 500 for injecting an adsorption material (e.g., the adsorption material 803 shown in Figure 8, described later) into the resonance space RS formed by the coupling of one surface of the first structure 311, the second structure 312, and the speaker unit 301.

[0067] Figure 5B shows a speaker module 300-1 according to one embodiment.

[0068] The speaker module 300-1 in Figure 5B differs from the speaker module 300 in Figure 5A in some structural aspects, but other components and functions can be applied similarly.

[0069] Referring to Figure 5B, in one embodiment, the speaker module 300-1 may include a first structure 311-1, a second structure 312-1, a speaker unit 301-1, and a protective member 305.

[0070] In one embodiment, the speaker unit 301-1, in a coupled state of the first structure 311-1 and the second structure 312-1, may have a resonant space RS formed by grooves formed in the first structure 311-1 or the second structure 312-1. In one example, the speaker unit 301-1 may be placed within the resonant space RS. In one embodiment, the speaker unit 301-1 may be placed in at least one region of the resonant space RS.

[0071] In one embodiment, the first structure 311-1 may include an opening 311-1a such that a speaker unit 301-1 can be positioned in at least one region of the resonant space RS. In one example, at least a portion of the speaker unit 301-1 may be positioned in the region of the first structure 311-1 corresponding to the opening 311-1a. In one example, the opening 311-1a may be formed to penetrate from one face of the first structure 311-1 (e.g., the face facing the second structure 312-1) to the other face of the first structure 311-1 (e.g., the face facing the opposite direction from the face of the first structure 311-1).

[0072] Figure 6A shows a cross-sectional view of line B-B' in the second state 300b of the speaker module 300 shown in Figure 5A, according to one embodiment.

[0073] Referring to Figure 6A, in one embodiment, the speaker module 300 may include a sound-absorbing sheet 303 and an opening 500.

[0074] In one embodiment, a resonance space RS may be formed in the second state 300b of the speaker module 300 by at least one groove formed in the first structure 311 and / or the second structure 312. In one example, an adsorbent material may be injected into the resonance space RS. For example, the adsorbent material may be a porous material for discharging, condensing, or adsorbing a portion of the air inside the resonance space RS. For example, the adsorbent material may be composed of a mixture of a binder and at least one of activated carbon-based materials of various sizes, such as granular activated carbon, powdered activated carbon, or ARCP. In another example, the adsorbent material may be composed of a mixture of a binder and Cu, Po1, Zr1, Zr2, or Al particles having a metal-organic frameworks structure. In yet another example, the adsorbent material may be composed of a binder and at least one of diatomaceous earth-based elements, perlite or silicon dioxide-based elements, or zeolite-based elements.

[0075] In one embodiment, the speaker module 300 may include an opening 500 for injecting adsorbent material. In one example, the opening 500 may be defined as a closed loop formed by the joining of a first structure 311 and a second structure 312. In one example, the area of ​​the opening 500 may be determined considering the size of the adsorbent material. For example, the area of ​​the opening 500 may be approximately 1.15 mm² or larger. In one example, the shape of the closed loop of the opening 500, including part of the first structure 311 and part of the second structure 312, will be described in detail with reference to Figure 7.

[0076] In one embodiment, the opening 500 may be a through-hole connecting the resonant space RS in the space outside the resonant space RS. In one example, adsorbent material may be injected through the opening 500 located on the left side (e.g., -x direction) of the speaker module 300. In one example, the adsorbent material injected through the opening 500 may be injected into the resonant space RS formed by one surface of the speaker unit 301 mounted in the region corresponding to the opening 311a of the first structure 311.

[0077] In one embodiment, an allophone may be generated by the repeated flow of an adsorbent material 803 (e.g., the adsorbent material 803 in Figure 8) placed in the resonant space RS. In one example, an allophone may be generated by friction between the adsorbent material 803 and at least one region of the first structure 311, the second structure 312, and / or the speaker unit 301 that form the resonant space RS.

[0078] In one embodiment, a sound-absorbing sheet 303 may be attached to at least one surface of a first structure 311 and a second structure 312 forming a resonant space RS. In one example, the sound-absorbing sheet 303 may be attached to at least one surface of the first structure 311 and / or the second structure 312 in the resonant space RS so as to be substantially horizontal with respect to the direction in which the adsorbent material is injected (e.g., the +x direction). In one example, the sound-absorbing sheet 303 may include poron or sponge.

[0079] In one embodiment, the sound-absorbing sheet 303 can prevent abnormal noise generated by the adsorbed material. In one example, the adsorbed material can be smoothly filled into the resonance space RS by positioning the sound-absorbing sheet 303 substantially horizontally to the direction in which the adsorbed material is injected, thereby minimizing its influence on the movement of the adsorbed material.

[0080] In one embodiment, the sound-absorbing sheet 303 can form part of the resonance space RS. That is, the sound-absorbing sheet 303 can be attached to at least one region of the first structure 311 or the second structure 312 that constitutes the resonance space RS.

[0081] Figure 6B shows a cross-sectional view of line C-C' of speaker module 300-1 in Figure 5B according to another embodiment.

[0082] Figure 6B shows the state in which the first structure 311-1 and the second structure 312-1 are connected.

[0083] In one embodiment, the first structure 311-1 may include a rib structure formed in a first direction (e.g., the +z direction in Figure 6B) so that the speaker unit 301-1 can be mounted.

[0084] In one embodiment, a protective member 305 may be placed on the upper surface of the speaker unit 301-1 (e.g., in the +z direction in Figure 6B). In one example, the protective member 305 may include a material such as sponge or cotton.

[0085] Referring to Figure 6B, the speaker module 300-1 may include an opening 500-1 for injecting adsorbent material into a resonant space RS formed by the coupling of the first structure 311-1 and the second structure 312-1. In one example, the opening 500-1 may be defined as a closed loop formed by the coupling of the first structure 311-1 and the second structure 312-1. In one embodiment, a support member 132-1 may be coupled to or formed integrally with the first structure 311-1 to protect the speaker module 300-1. In one example, the support member 132-1 may be formed as a flat plate such that one side of the support member 132-1 is substantially facing the inner surface of a display (e.g., display 120 in Figure 1).

[0086] Figure 7 shows an opening 500 formed in a speaker module 300 according to one embodiment.

[0087] Referring to Figure 7, the first structure 311 and / or the second structure 312 may include at least one groove for forming a resonant space RS, and one end of the groove formed in the first structure 311 and / or the second structure 312 in the second state 300b of the speaker module 300 may include an opening 500 formed in a closed loop.

[0088] In one embodiment, the opening 500 formed in a closed loop may include a part of the first structure 311 and a part of the second structure 312. In one example, the shape of the opening 500 may be determined by the coupling structure of the first structure 311 and the second structure 312, the open loop of the first structure 311 forming the opening 500, and / or the open loop of the second structure 312 forming the opening 500. In one example, the opening 500 may be formed by the coupling of the open loop of the first structure 311 corresponding to the upper part of the opening 500 and the open loop of the second structure 312 corresponding to the lower part of the opening 500. The open loop of the first structure 311 may have the shape of the first part 701. The open loop of the second structure 312 may have the shape of the second part 702. For example, the open loop of the first structure 311 may have a shape in which the lower part of a rectangle is cut off, i.e.,

number

number

[0089] Figure 8 shows a first sealing member 800 attached to a region of a speaker module 300 according to one embodiment.

[0090] In one embodiment, a first sealing member 800 can be positioned along the periphery of the opening 500 formed by the joining of the first structure 311 and the second structure 312 to seal the resonant space RS. In one example, the first sealing member 800 can be attached to or fixed to the area of ​​the speaker module 300 corresponding to the opening 500 via an adhesive member (e.g., double-sided tape). In one example, the adhesive member may include a closed loop formed along the periphery of the opening 500.

[0091] In one embodiment, the first sealing member 800 can either block the adsorbed substance injected into the resonance space RS from leaking into areas other than the resonance space RS, or prevent foreign matter from flowing in from areas other than the resonance space RS.

[0092] In one embodiment, the first sealing member 800 may be made of an elastic material. For example, the first sealing member 800 may be made of rubber.

[0093] Figure 8(a) is a cross-sectional view of the speaker module 300 along line C-C' in a region where the first sealing member 800 is attached. Figure 8(b) is a cross-sectional view of the speaker module 300 along line D-D' in a region where the first sealing member 800 is not attached.

[0094] In one embodiment, the first structure 311 and the second structure 312 are joined by assembling and attaching the first structure 311 to one surface of the second structure 312, and the joint between the first structure 311 and the second structure 312 can be fixed by a process such as ultrasonic bonding.

[0095] Referring to Figure 8(a), the adsorbent material 803 can be injected into the resonant space RS formed by the coupling of the first structure 311 and the second structure 312. In one example, the resonant space RS may include the residual space 801 remaining after the adsorbent material 803 has been injected. In one example, a space compensating material (not shown) may be injected into the residual space 801 remaining after the adsorbent material 803 has been injected. In one example, the space compensating material may include a material that prevents the adsorbent material 803 from flowing in order to reduce allophone noises generated by the flow of the adsorbent material 803. The material that prevents the adsorbent material 803 from flowing may include sponge or cotton. In another example, the space compensating material may be the same material as the adsorbent material 803 but with a different particle size, or it may be an air adsorbent made of a different material than the adsorbent material 803.

[0096] Referring to Figure 8(b), when the first structure 311 and the second structure 312 are joined and / or fixed, errors in the manufacturing or assembly processes of the first structure 311 and / or the second structure 312 may result in a separation space or a step difference in the area 802 where the first structure 311 and the second structure 312 are in contact.

[0097] In one embodiment, if a separation space or step occurs in the area 802 where the first structure 311 and the second structure 312 are in contact, the bond or welding horn placed between the first structure 311 and the second structure 312 to fix and / or join them may overflow through the separation space or step.

[0098] In one embodiment, a second sealing member (e.g., the second sealing member 900 in Figure 9, described later) may be placed in the speaker module 300 to compensate for the separation space or step difference caused by the joining of the first structure 311 and the second structure 312.

[0099] Figure 9 shows a second sealing member 900 attached to a speaker module 300 according to one embodiment.

[0100] Referring to Figure 9, a second sealing member 900 may be placed in at least one area of ​​the speaker module 300 to compensate for the separation space and / or step difference resulting from the coupling of the first structure 311 and the second structure 312.

[0101] In one embodiment, a second sealing member 900 may be positioned in a region surrounding a first sealing member 800, which is attached to or fixed to a region corresponding to the opening 500 in order to seal the resonance space RS. In one example, the second sealing member 900 can prevent the adsorbed material or space compensating material placed in the resonance space RS from leaking through the separation space or step between the first sealing member 800 and the opening 500.

[0102] In one embodiment, the second sealing member 900 may include a eutectic bond and / or a polymer adhesive.

[0103] Figure 10 shows an opening formed in the speaker module 400 according to another embodiment.

[0104] Referring to Figure 10, speaker module 400 differs from speaker module 300 in Figure 7 in that it has an opening that forms a closed loop, but other components can be applied similarly.

[0105] In one embodiment, the speaker module 400 may include a first structure 411, a second structure 412, and an opening 501.

[0106] Referring to Figure 10, the first state 400a of the speaker module 400 is a state in which the first structure 411 and the second structure 412 are separated. The second state 400b of the speaker module 400 is a state in which the first structure 411 and the second structure 412 are connected.

[0107] In one embodiment, the speaker module 400 may include an opening 501 that forms a closed loop for injecting adsorbent material by joining a first structure 411 and a second structure 412. In one example, the opening 501 may include a part of the first structure 411 and a part of the second structure 412. In one example, the opening 501 may be formed by joining an open loop of the first structure 411 corresponding to the upper part of the opening 501 and an open loop of the second structure 412 corresponding to the lower part of the opening 501. The open loop of the first structure 411 may be in the shape of a first part 1001. The open loop of the second structure 412 may be in the shape of a second part 1002. For example, the open loop of the first structure 411 may be in the shape of the letter "T", i.e.,

number

number

[0108] Figure 11 shows a region 1101 to which the first sealing member 800a is attached and a region 1102 to which the second sealing member 900a is attached, according to another embodiment.

[0109] In one embodiment, the speaker module 400 may include a first sealing member 800a and a second sealing member 900a.

[0110] Referring to Figure 11, a first sealing member 800a may be positioned along the periphery of the opening 501 formed by the joining of the first structure 411 and the second structure 412. In one example, the first sealing member 800a may be attached to or fixed to the area corresponding to the opening 501 via an adhesive member (e.g., double-sided tape). In one example, the adhesive member may be attached to the area 1101 formed along the periphery of the first structure 411, thereby joining the first sealing member 800a to the area corresponding to the opening 501.

[0111] In one example, the first sealing member 800a may be formed to correspond to the shape of the opening 501. For example, if the opening 501 is "T" shaped, the first sealing member 800a may be "T" shaped to correspond to the shape of the opening 501.

[0112] In one embodiment, when the first structure 411 and the second structure 412 are joined and / or fixed, a gap or step may occur at the point where the first structure 411 and the second structure 412 meet. In one example, the speaker module 400 may have a second sealing member 900a placed in the speaker module 400 to compensate for the gap or step caused by the joining of the first structure 411 and the second structure 412. In one example, the second sealing member 900a may be placed in the area 1102 where the first structure 411 and the second structure 412 meet.

[0113] Figure 12 is a block diagram of an electronic device 1201 in a network environment 1200 according to various embodiments.

[0114] Referring to Figure 12, in the network environment 1200, the electronic device 1201 can communicate with the electronic device 1202 via a first network 1298 (e.g., a short-range wireless communication network), or with the electronic device 1204 or the server 1208 via a second network 1299 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 1201 can communicate with the electronic device 1204 via the server 1208. According to one embodiment, the electronic device 1201 may include a processor 1220, memory 1230, input module 1250, acoustic output module 1255, display module 1260, audio module 1270, sensor module 1276, interface 1277, connection terminal 1278, haptics module 1279, camera module 1280, power management module 1288, battery 1289, communication module 1290, subscriber identification module 1296, or antenna module 1297. In some embodiments, the electronic device 1201 may omit at least one of these components (e.g., connection terminal 1278) or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module 1276, camera module 1280, or antenna module 1297) may be integrated into a single component (e.g., display module 1260).

[0115] The processor 1220 can, for example, execute software (e.g., program 1240) to control at least one other component (e.g., hardware or software component) of the electronic device 1201 connected to the processor 1220, and can perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1220 can store instructions or data received from other components (e.g., sensor module 1276 or communication module 1290) in volatile memory 1232, process the instructions or data stored in volatile memory 1232, and store the resulting data in non-volatile memory 1234. According to one embodiment, the processor 1220 may include a main processor 1221 (e.g., central processing unit or application processor) or an auxiliary processor 1223 (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, if the electronic device 1201 includes a main processor 1221 and an auxiliary processor 1223, the auxiliary processor 1223 may use less power than the main processor 1221 or be configured to specialize in a particular function. The auxiliary processor 1223 may be implemented separately from or as part of the main processor 1221.

[0116] The auxiliary processor 1223 can, for example, control at least some of the functions or states associated with at least one component of the electronic device 1201 (e.g., display module 1260, sensor module 1276, or communication module 1290) on behalf of the main processor 1221 when the main processor 1221 is inactive (e.g., sleep), or together with the main processor when the main processor 1221 is active (e.g., application execution). According to one embodiment, the auxiliary processor 1223 (e.g., image signal processor or communication) may be implemented as part of another functionally related component (e.g., camera module 1280 or communication module 1290). According to one embodiment, the auxiliary processor 1223 (e.g., neural processing unit) may include hardware structures specialized for processing artificial intelligence models. Artificial intelligence models can be generated by machine learning. Such learning can be performed, for example, on the electronic device 1201 itself where the artificial intelligence is performed, or it can be performed through a separate server (e.g., server 1208). Learning algorithms can include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models can include multiple artificial neural network layers. Artificial neural networks can be, but are not limited to, deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), deep Q-networks, or any combination of two or more of the above.In addition to hardware structures, artificial intelligence models may also include software structures, either additionally or alternatively.

[0117] Memory 1230 can store various data used by at least one component of the electronic device 1201 (e.g., processor 1220 or sensor module 1276). The data may include, for example, software (e.g., program 1240) and input or output data for associated instructions. Memory 1230 may include volatile memory 1232 or non-volatile memory 1234.

[0118] The program 1240 can be stored as software in memory 1230 and may include, for example, an operating system 1242, middleware 1244, or an application 1246.

[0119] The input module 1250 can receive instructions or data used by components of the electronic device 1201 (e.g., processor 1220) from outside the electronic device 1201 (e.g., user). The input module 1250 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus pen).

[0120] The acoustic output module 1255 can output an acoustic signal to the outside of the electronic device 1201. The acoustic output module 1255 may include, for example, a speaker or a receiver. The speaker may be used for general applications such as multimedia playback or recording and playback. The receiver may be used to receive incoming telephone calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

[0121] The display module 1260 can visually provide information to an external party (e.g., a user) outside of the electronic device 1201. The display module 1260 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling such device. According to one embodiment, the display module 1260 may include a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by such touches.

[0122] The audio module 1270 can convert sound into electrical signals, or conversely, convert electrical signals into sound. In one embodiment, the audio module 1270 can acquire sound through the input module 1250, or output sound through the sound output device 1255, or through an external electronic device (e.g., electronic device 1202) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 1201.

[0123] The sensor module 1276 can sense the operating state of the electronic device 1201 (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 1276 may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0124] Interface 1277 can support one or more predetermined protocols that can be used for the electronic device 1201 to connect directly or wirelessly to an external electronic device (e.g., electronic device 1202). According to one embodiment, interface 1277 may include, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, or audio interface.

[0125] The connection terminal 1278 may include a connector through which the electronic device 1201 can be physically connected to an external electronic device (e.g., electronic device 1202). According to one embodiment, the connection terminal 1278 may include, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0126] The haptics module 1279 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be perceived by the user through touch or kinesthetic sense. According to one embodiment, the haptics module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0127] The camera module 1280 can capture still images and videos. According to one embodiment, the camera module 1280 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0128] The power management module 1288 can manage the power supplied to the electronic device 1201. According to one embodiment, the power management module 1288 can be implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0129] The battery 1289 can supply power to at least one component of the electronic device 1201. According to one embodiment, the battery 1289 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0130] The communication module 1290 can support the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 1201 and an external electronic device (e.g., electronic device 1202, electronic device 1204, or server 1208), and the execution of communication over the established communication channel. The communication module 1290 operates independently of the processor 1220 (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 1290 may include a wireless communication module 1292 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 1294 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module can communicate with external electronic devices 1204 via a first network 1298 (e.g., a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 1299 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented in multiple different components (e.g., multiple chips). The wireless communication module 1292 can verify or authenticate electronic devices 1201 within a communication network such as the first network 1298 or the second network 1299 using subscriber information (e.g., International Mobile Subscriber Identification Number (IMSI)) stored in the subscriber identification module 1296.

[0131] The wireless communication module 1292 can support 5G networks and next-generation communication technologies beyond 4G networks, such as NR connection technology (new radio access technology). NR connection technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of a large number of terminals (mMTC (massive machine type communications)), or ultra-reliable and low-latency communications (URLLC (ultra-reliable and low-latency communications)). For example, the wireless communication module 1292 can support high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates. The wireless communication module 1292 can support various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 1292 can support various requirements specified in the electronic device 1201, external electronic devices (e.g., electronic device 1204), or network system (e.g., second network 1299). According to one embodiment, the wireless communication module 1292 can support a peak data rate for eMBB implementation (e.g., 20 Gbps or more), loss coverage for mMTC implementation (e.g., 164 dB or less), or U-plane latency for URLLC implementation (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less).

[0132] The antenna module 1297 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 1297 may include an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 1297 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 1298 or a second network 1299 may be selected from the plurality of antennas by, for example, the communication module 1290. Signals or power may be transmitted or received between the communication module 1290 and an external electronic device via the selected at least one antenna. According to one embodiment, other components (e.g., an RFIC (radio frequency integrated circuit)) may be additionally formed as part of the antenna module 1297 in addition to the radiator.

[0133] According to various embodiments, the antenna module 1297 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a predetermined high-frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the predetermined high-frequency band.

[0134] At least some of the above components are connected to each other by a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., instructions or data) with each other.

[0135] According to one embodiment, commands or data may be transmitted or received between the electronic device 1201 and an external electronic device 1204 via a server 1208 connected to a second network 1299. Each of the external electronic devices 1202 or 1204 may be the same type of device as the electronic device 1201 or a different type of device. According to one embodiment, all or part of the operation performed by the electronic device 1201 may be performed by one or more external electronic devices from among the external electronic devices 1202, 1204, or 1208. For example, if the electronic device 1201 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1201 may, instead of performing the function or service autonomously, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive such a request may perform at least part of the requested function or service, or any additional function or service associated with the request, and transmit the result of the execution to the electronic device 1201. The electronic device 101 can process the above results as is or additionally and provide them as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 1201 can provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1204 may include IoT (Internet of Things) devices. The server 1208 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 1204 or the server 1208 may be included within the second network 1299. The electronic device 1201 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0136] The electronic devices disclosed in this document may be of various forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices disclosed in this document are not limited to the aforementioned devices.

[0137] The various embodiments described herein and the terminology used therein should be understood not to limit the technical features described herein to any particular embodiment, but to include various modifications, equivalents, or substitutes of the applicable embodiment. In the description of the drawings, similar or related components may be referred to by similar reference numerals. The singular form of a noun corresponding to an item may include one or more of the above items unless it is clearly indicated that they are different in the relevant context. In this document, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one of the items listed with the applicable phrase in that phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish the applicable component from other components and not to limit the applicable component in any other respect (e.g., importance or order). When one component (e.g., component 1) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically" with another component (e.g., component 2), it means that the aforementioned component may be connected directly (e.g., by wire), wirelessly, or via component 3.

[0138] As used in various embodiments of this document, the term “module” may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component configured as a whole, or the smallest unit or part thereof of such component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0139] Various embodiments of this document may be implemented as software (e.g., program 1240) containing one or more instructions stored in a machine (e.g., electronic device 1201)-readable storage medium (e.g., internal memory 1236 or external memory 1238). For example, the processor (e.g., processor 1220) of the machine (e.g., electronic device 1201) can call and execute at least one of the one or more instructions stored in the storage medium. This allows the machine to be operated to perform at least one function according to the one or more instructions called above. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily on the storage medium.

[0140] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. The computer program product may be traded as a commodity between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or delivered online (e.g., downloaded or uploaded) via an application store (e.g., Play Store®) or directly between two user devices (e.g., smartphones). In the case of online delivery, at least a portion of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0141] In various embodiments, each of the components described above (e.g., a module or a program) may include one or more individuals, and some of the individuals may be separated and placed in other components. In various embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Additionally or alternatively, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the respective components of the multiple components prior to the integration. In various embodiments, the operations performed by the module, program or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0142] A speaker module structure according to various embodiments includes a first structure (e.g., first structure 311), a second structure (e.g., second structure 312) that can be coupled to the first structure (e.g., first structure 311), and a speaker (e.g., speaker unit 301) coupled to at least one of the first or second structures, wherein the second structure includes at least one groove that forms a resonant space (e.g., resonant space RS) by coupling with the first and second structures, the resonant space is connected to the speaker, and an adsorption material (e.g., adsorption material 803) is injected into it, and with the first and second structures coupled, one end of the groove may include an opening (e.g., opening 500) formed in a closed loop including a part of the first structure and a part of the second structure.

[0143] In one embodiment, the speaker module structure may further include a first sealing member (e.g., a first sealing member 800) that seals the opening.

[0144] In one embodiment, the speaker module structure may further include a second sealing member (e.g., a second sealing member 900) that seals the recess formed by the joining of the first structure and the second structure.

[0145] In one embodiment, the second sealing member may include at least one of a eutectic bond or a polymer adhesive.

[0146] In one embodiment, the speaker module structure may further include a sound-absorbing sheet (e.g., sound-absorbing sheet 303) placed on at least one surface of the first structure or the second structure within the resonance space.

[0147] In one embodiment, the sound-absorbing sheet may include at least one of poron, rubber, or silicone.

[0148] In one embodiment, a portion of the first structure may include a "T"-shaped open loop.

[0149] In one embodiment, a part of the second structure may be placed in the open portion of the open loop to form the opening.

[0150] In one embodiment, the adsorbent material may be placed in the resonance space, and a space-compensating material may be placed in the remaining space.

[0151] In one embodiment, the space-compensating material may include at least one of zeolite, sponge, cotton, or foamed resin.

[0152] An electronic device including a speaker assembly in various embodiments may include a speaker assembly comprising a first carrier (e.g., a first structure 311), a second carrier (e.g., a second structure 312) that can be coupled with the first carrier, and a speaker (e.g., a speaker unit 301) coupled with at least one of the first or second carrier, wherein the second carrier includes at least one groove that forms a resonant space (e.g., resonant space RS) by coupling with the first and second carriers, the resonant space is connected to the speaker, an adsorption material (e.g., adsorption material 803) is injected into it, and with the first and second carriers coupled, one end of the groove includes an opening (e.g., opening 500) formed in a closed loop including a portion of the first carrier and a portion of the second carrier.

[0153] In one embodiment, the electronic device may include a speaker assembly that further includes a first sealing member for sealing the opening.

[0154] In one embodiment, the electronic device may further include a second sealing member that seals the recess formed by the coupling of the first carrier and the second carrier.

[0155] In one embodiment, the second sealing member may include at least one of a eutectic bond or a polymer adhesive.

[0156] In one embodiment, the electronic device may further include a sound-absorbing sheet disposed on at least one surface of the first carrier or the second carrier within the resonance space.

[0157] In one embodiment, the sound-absorbing sheet may include at least one of poron, rubber, or silicone.

[0158] In one embodiment, a portion of the first carrier may include a "T"-shaped open loop.

[0159] In one embodiment, a portion of the second carrier may be placed in the open portion of the open loop to form the opening.

[0160] In one embodiment, the adsorbent material may be placed in the resonance space, and a space-compensating material may be placed in the remaining space.

[0161] In one embodiment, the space-compensating material may include at least one of zeolite, sponge, cotton, or foamed resin.

[0162] While this disclosure has been illustrated and described with reference to various embodiments, a person with ordinary skill in the art to which this disclosure belongs will understand that various modifications in form and details may be made without departing from the spirit and scope of this disclosure as defined herein. [Explanation of Symbols]

[0163] 101 Electronic equipment 103 First Optical Sensor 104 connector holes 105 Audio Module 106 Third Optical Sensor 107 Key Input Device 110 Housing 110A 1st side (front) 110B 2nd side (rear side) 110C Side (side wall) 111 Rear plate 120 displays 121 Front plate 130 Second Optical Sensor 131 Side bezel structure 132 Support member 132a opening 132b Flange 210 Circuit board 220 motor 300 speaker modules 300a First state 300b Second state 301 Speaker Unit 302 Protective component 303 Sound-absorbing sheet 305 Protective component 310 Structures (housing, carriers) 311 1st structure 311a opening 312 Second structure 400 speaker module 400a First state 400b Second state 411 1st structure 412 Second structure 500, 501 aperture 701 Part 1 702 Part 2 800, 800a First sealing member 801 Residual space 802 area 803 Adsorbed substances 900, 900a Second sealing member 1001 Part 1 1002 Part 2 1101 area 1102 area 1111 1st side 1112 Second side 1113 Third aspect 1114 Fourth aspect 1200 Network Environment 1201, 1202 Electronic equipment 1202, 1204 External electronic equipment 1208 Server 1220 processors 1221 Main Processor 1223 Auxiliary processor 1230 memory 1232 Volatile memory 1234 Non-volatile memory 1236 internal memory 1238 memory 1240 programs 1242 Operating Systems 1244 Middleware 1246 Applications 1250 Input Module 1255 Audio Output Module 1260 Display Module 1270 Audio Module 1276 Sensor Module 1277 Interface 1278 Connection terminals 1279 Haptics Module 1280 Camera Module 1288 Power Management Module 1289 Battery 1290 Communication Module 1292 Wireless Communication Module 1294 Wired communication module 1296 Subscriber Identification Module 1297 Antenna Module 1298 First Network 1299 Second Network

Claims

1. A speaker module structure, first structure; A second structure coupled to the first structure so as to form a resonant space; A speaker connected to the resonance space and coupled to at least one of the first structure or the second structure; and Includes an opening connected to the aforementioned resonance space, At least one of the first structure and the second structure includes at least one groove that forms the resonance space, The adsorbent material is placed within the resonance space. The opening is configured such that the adsorbent material is injected into the resonance space through the opening. The speaker module structure is formed by the connection of the first structure and the second structure, with the aforementioned opening being formed by the connection of the first structure and the second structure.

2. The speaker module structure according to claim 1, further comprising a first sealing member for sealing the opening.

3. The speaker module structure according to claim 2, wherein the first sealing member is arranged along the periphery of the opening.

4. The speaker module structure according to claim 2, further comprising a second sealing member configured to surround the first sealing member.

5. The speaker module structure according to claim 4, wherein the second sealing member comprises at least one of a eutectic bond or a polymer adhesive.

6. The speaker module structure according to claim 1, further comprising a sound-absorbing sheet disposed on at least one surface of the first structure or the second structure within the resonance space.

7. The speaker module structure according to claim 6, wherein the sound-absorbing sheet comprises at least one of poron, rubber, or silicone.

8. The speaker module structure according to claim 1, wherein a part of the first structure forms the opening including a "T" shape.

9. The first portion of the opening formed by the first structure includes the T-shaped horizontal portion and the first portion of the T-shaped vertical portion connected to the horizontal portion, The speaker module structure according to claim 8, wherein the second portion of the opening formed by the second structure includes the second portion of the vertical portion connected to the first portion of the vertical portion.

10. The remaining space after the adsorbent material has been injected into the resonance space contains a space-compensating material. The speaker module structure according to claim 1, wherein the spatial compensation material includes a material that prevents the flow of the adsorbent material, and the material that prevents the flow of the adsorbent material is for reducing abnormal noise generated by the movement of the adsorbent material.

11. The speaker module structure according to claim 10, wherein the space compensation material comprises at least one of zeolite, sponge, cotton, or foamed resin.

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