Wireless IC metal card with clad metal structure and method for manufacturing the same

Abstract

The wireless IC metal card according to an embodiment of the present invention includes a first metal layer that houses a wireless IC chip on an upper surface, an antenna layer that is disposed in a partial region on a lower surface of the first metal layer and is electrically connected to the wireless IC chip, a second metal layer that is disposed below the first metal layer with the antenna layer interposed therebetween, and a third metal layer that is disposed below the second metal layer, and the first metal layer, the second metal layer, and the third metal layer are joined to each other to form a clad metal structure.

Description

Technical Field

[0001] The present invention relates to a metal card and a method for manufacturing a metal card. More specifically, the present invention relates to a wireless IC metal card having a clad metal structure and a method for manufacturing the same.

Background Art

[0002] Generally, credit cards can be used not only as a substitute for cash, but recently, they have been developed as smart cards incorporating IC chips capable of recording a large amount of information, and are actively used not only for settlement but also as various membership cards.

[0003] In such a smart card market, efforts have been made to develop special cards using various materials. In particular, efforts have been made to develop credit cards made of metal materials differentiated for VIP customers, and metal cards have been provided to special customers by realizing high-quality credit cards with a metallic luster.

[0004] In particular, recently, a method of manufacturing a metal card by using a thin film metal sheet or thinly coating metal powder has been proposed. However, such a thin film metal card is vulnerable to bending and warping, and also has a problem of poor durability such as corrosion.

[0005] Also, at present, using duralumin, which is used as a material for manufacturing aircraft, on the surface of a metal card has been proposed. This has the characteristics of being light and strong. However, due to its difficulty in processing, the manufacturing cost is high, and it is difficult to perform processing such as patterning. Therefore, from the aspects of usability and design, inconvenience in the manufacturing process is caused. Also, because it is too light, it is difficult to actually give a metallic weight feeling, and it is currently difficult to distinguish it from plastic cards.

[0006] Furthermore, when wireless IC cards are constructed from metal materials, an antenna layer connected to the wireless IC chip is provided, but this presents a problem in that the communication performance is reduced due to interference from the radio waves caused by the metal material.

[0007] Therefore, there is a need to develop high-quality metal cards that overcome the limitations of such metal cards, are easy to process, can effectively express aesthetic design, and possess durability and corrosion resistance while still offering the weight characteristic of metal. [Overview of the project] [Problems that the invention aims to solve]

[0008] The present invention was created to solve the above-mentioned problems, and aims to provide a wireless IC metal card and a method for manufacturing the same, thereby overcoming the limitations of metal card communication, making it easy to process and allowing for a good aesthetic design, and providing a high-quality metal card that offers the weight characteristic of metal while also possessing durability and corrosion resistance. [Means for solving the problem]

[0009] A wireless IC metal card according to an embodiment of the present invention for solving the above-mentioned problems comprises: a first metal layer housing a wireless IC chip on its upper surface; an antenna layer disposed in a portion of the lower surface of the first metal layer and electrically connected to the wireless IC chip; a second metal layer disposed below the first metal layer with the antenna layer in between; and a third metal layer disposed below the second metal layer, wherein the first metal layer, the second metal layer, and the third metal layer are joined to each other to form a clad metal structure.

[0010] Furthermore, a method for manufacturing a wireless IC metal card according to an embodiment of the present invention for solving the above-mentioned problems includes the steps of: providing a first metal layer on its upper surface for housing a wireless IC chip; arranging an antenna layer electrically connected to the wireless IC chip in a portion of the area of ​​the lower surface of the first metal layer; arranging a second metal layer below the first metal layer with the antenna layer in between; arranging a third metal layer below the second metal layer; and aligning and pressing the first metal layer, the second metal layer and the third metal layer to form a clad metal structure by joining the first metal layer, the second metal layer and the third metal layer to each other. [Effects of the Invention]

[0011] According to embodiments of the present invention, a wireless IC metal card may include a clad metal structure of a first metal layer, a second metal layer, and a third metal layer formed by joining them together, and an antenna layer electrically connected to the wireless IC chip may be configured to be located between the first metal layer and the second metal layer. This supports the construction of various forms of bonded multi-metal material layers using the first metal layer, the second metal layer, and the third metal layer, and enables the processing of wireless IC metal cards using these bonded structures.

[0012] As a result, the wireless IC metal card according to the embodiment of the present invention, by forming a complex bond using a clad metal structure of various metal materials, allows for easy processing of the surface and a well-expressed aesthetic design, while the intermediate layer provides the weight characteristic of metal. Furthermore, by overcoming the communication limitations of metal cards through the antenna connection configuration between layers, and by performing layer-specific pre-treatment, it is possible to quickly and easily develop a high-quality metal card that also enhances durability and corrosion resistance. [Brief explanation of the drawing]

[0013] [Figure 1] This figure shows the front view of a wireless IC card according to an embodiment of the present invention. [Figure 2] This is an exploded perspective view of a wireless IC card according to an embodiment of the present invention. [Figure 3] This is a side view of a wireless IC card according to an embodiment of the present invention. [Figure 4] This figure illustrates corrosion and corrosion prevention in a wireless IC card according to an embodiment of the present invention. [Figure 5] This diagram shows the possible corrosion conditions that can occur when clad metal is applied to wireless IC cards. [Figure 6] This figure illustrates the array pattern of the antenna layer according to an embodiment of the present invention. [Figure 7] This figure illustrates the case in which the joining position of the slit portion according to the present invention is formed. [Figure 8] This is a flowchart illustrating a method for manufacturing a wireless IC card according to an embodiment of the present invention. [Modes for carrying out the invention]

[0014] The following is merely illustrative of the principles of the present invention. Therefore, those skilled in the art can invent various apparatuses and methods that realize the principles of the present invention and fall within the concept and scope of the present invention, even if they are not explicitly described or illustrated herein. All conditional terms and embodiments listed herein are, in principle, explicitly intended only for the purpose of enabling understanding of the concepts of the present invention and should be understood as not being limiting to such specifically listed embodiments and states.

[0015] For example, throughout the specification, when a certain part is "connected" to another part, this includes not only the case where it is "directly connected", but also the case where it is "indirectly connected" with other members interposed therebetween. Note that when a certain part "comprises" a certain component, this means that, unless otherwise specified, it does not exclude other components, and it may further comprise other components.

[0016] Moreover, it should be understood that all the detailed descriptions listing specific embodiments, not only the principles, aspects and embodiments of the present invention, are intended to include structural and functional equivalents of such matters. Note that these equivalents include not only currently known equivalents, but also equivalents to be developed in the future, that is, all elements invented to perform the same function regardless of structure.

[0017] The above-described objects, features and advantages should become even more apparent from the following detailed description taken in conjunction with the accompanying drawings, whereby those of ordinary skill in the technical field to which the present invention pertains should be able to easily implement the technical idea of the present invention. In implementing the present invention, if it is recognized that a specific description of known technology related to the present invention may obscure the gist of the present invention, the detailed description thereof is omitted.

[0018] FIG. 1 is a diagram showing the front surface of a wireless IC card according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the wireless IC card according to an embodiment of the present invention.

[0019] Referring to FIGS. 1 and 2, as the wireless IC card 100 according to an embodiment of the present invention, a credit card on which a wireless IC chip 112 is mounted on the front surface can be exemplified, and characters for identifying the card company and the like may be formed on the front and back surfaces by various methods (printing or marking or etching, NC machining, laser machining, etc.).

[0020] In addition, the wireless IC card 100 according to an embodiment of the present invention includes a first metal layer 110 that houses a wireless IC chip 112 on its upper surface, an antenna layer 120 that is disposed in a partial region on the lower surface of the first metal layer 110 and is electrically connected to the wireless IC chip 112, and a second metal layer 130 that is disposed below the first metal layer 110 with the antenna layer 120 interposed therebetween and a third metal layer 140 that is disposed below the second metal layer 130. The first metal layer 110, the second metal layer 130, and the third metal layer 140 can be joined to each other to form a clad metal structure.

[0021] Here, the clad metal is a structure that is difficult to be artificially peeled off and is formed such that the structures of the bonding force interfaces penetrate each other, and the bonding force becomes stronger as time passes.

[0022] Here, the second metal layer 130 located in the middle may be different from the metal materials of the first metal layer 110 and the third metal layer 140 and may be formed such that its weight is even higher than the weight of the first metal layer 110 and the weight of the third metal layer 140.

[0023] In addition, the thickness of the second metal layer 130 may be formed to be even thicker than the first metal layer 110 and the third metal layer 140, and its weight may be formed to be even higher than the weight of the first metal layer 110 and the weight of the third metal layer 140.

[0024] According to such combinations of the materials and weights of the first metal layer 110, the second metal layer 130, and the third metal layer 140, it is possible to realize a metal processing method that enables various surface treatments while improving the sense of weight.

[0025] In other words, each metal layer 110, 130, and 140 of the wireless IC card 100 according to the embodiment of the present invention can be selected not only considering the material specific to metal cards, but also considering durability to withstand the manufacturing process, degree of wear, degree of deformation, and so on.

[0026] As a result, for example, the metal card can be manufactured from at least one metal material that has good elastic resilience and conductivity, such as super titanium, scandium, titanium, duralumin, stainless steel (SUS), aluminum-based materials, copper-based materials, etc.

[0027] Preferably, the first metal layer 110 and the third metal layer 140 are formed from either aluminum or duralumin, and the second metal layer 130 may be formed from either cupronickel or stainless steel.

[0028] In the case of aluminum, its high flexibility makes it easy to perform surface processing using roll patterns, and the surface-processed aluminum layers can be anodized before joining to prevent corrosion.

[0029] Preferably, the first metal layer 110 and the third metal layer 140 are formed from stainless steel, and the second metal layer 130 is formed from cupronickel.

[0030] Stainless steel offers high durability and is easy to process, such as by creating patterns using NC machining.

[0031] Furthermore, if the second metal layer 130 is made of cupronickel, it can provide a high weight, and it is also possible to adjust the thickness to further increase the weight.

[0032] In one embodiment, a metal card composed of SUS as the base layer may be made of a material that is resistant to corrosion and can be heat-treated. Heat treatment refers to a process of heating a metal to a certain temperature and improving its properties or structure to a desired level depending on the cooling rate.

[0033] Furthermore, the SUS can be processed by performing a heat treatment process during the manufacturing of the wireless IC card 100 to improve its strength and resilience.

[0034] In contrast, as explained above, the first metal layer 110 and the third metal layer 140 may be made of aluminum. A metal card with an aluminum front and back is lightweight and highly durable, easier to process than other materials, and can be manufactured in a wide variety of shapes. Furthermore, since the aluminum material can undergo a wide variety of surface treatments and is highly versatile, a metal card made of aluminum is easy to apply a wide variety of patterns and characters to.

[0035] On the other hand, as shown in Figure 2, the wireless IC card 100 according to an embodiment of the present invention comprises a first metal layer 110, a wireless IC chip 112, an antenna layer 120, a second metal layer 130, and a third metal layer 140.

[0036] First, in the first metal layer 110 of the wireless IC card 100 according to the embodiment of the present invention, an IC chip housing portion 111 may be formed in a certain area of ​​the first metal layer 110 so as to house the wireless IC chip 112.

[0037] Here, the IC chip housing portion 111 may be formed by punching, etching, or NC machining of the first metal layer 110, so that the opening in the first metal layer 110 corresponds to the area and depth corresponding to the position and shape of the wireless IC chip 112.

[0038] Furthermore, the first metal layer 110 according to an embodiment of the present invention may be provided with a slit portion 150 formed by cutting from one side of the IC chip housing portion 111 toward the outer edge of the wireless IC card 100, and configured such that at least one of the metal layers 110, 130, and 140 extends the winding pattern of the antenna layer 120, while reducing interference with the shielding of the wireless signal of the metal card.

[0039] As a result, the slit portion 150 may be formed by cutting from one side of the IC chip housing portion 111 toward the outer edge of the first metal layer 110, a first slit portion 150a formed by cutting toward the outer edge of the second metal layer 130 corresponding to the first slit portion 150a, and a second slit portion 150b formed by cutting toward the outer edge of the third metal layer 140 corresponding to the second slit portion 150b, thereby forming separate slit portions 150a, 150b, and 150c for each of the metal layers 110, 130, and 140.

[0040] As shown in Figure 2, in the embodiments of the present invention, the cutting width and direction of each slit portion 150a, 150b, and 150c are exemplified as being the same. However, in order to adjust the wireless characteristics, wireless sensitivity, and resonant frequency, the cutting width and direction of one or more slit portions may be formed to be different from those of the other slit portions.

[0041] For example, the slit portions 150a, 150b, and 150c may be formed to a predetermined width corresponding to the width of the IC chip housing portion 111 up to the outer edge of the wireless IC card 100, and the slit structures having a wide variety of shapes, such as straight lines, staggered patterns, diagonal lines, and sawtooth structures, may be formed identically or differently for each of the slit portions 150a, 150b, and 150c.

[0042] Furthermore, the pre-set width may be set to be narrower, wider, or equal in width to the width of the IC chip housing section 111.

[0043] Here, the slit portions 150a, 150b, and 150c may be regions formed by cutting out the outer edge of the wireless IC card 100 so that the first metal layer 110, the second metal layer 130, and the third metal layer 140 do not obstruct wireless signals, and a finishing member made of an electrically insulating material may be inserted into at least one of the remaining spaces formed by each of the slit portions 150a, 150b, and 150c.

[0044] For example, reinforcing pins or joints made of PVC material, or rubber reinforcing materials can be inserted as finishing members to maintain the overall shape and durability of the wireless IC card 100, and to prevent dust from accumulating in the remaining space.

[0045] Here, the cutting structure of the slit portions 150a, 150b, and 150c causes each of the metal layers 110, 130, and 140 of the wireless IC card 100 to have a predetermined inductance corresponding to the wireless magnetic signal. As a result, the first metal layer 110, the second metal layer 130, and the third metal layer 140 can function as a single winding coil deployed on the antenna layer 120 when one end or the other end of the antenna of the antenna layer 120 according to an embodiment of the present invention is connected.

[0046] Therefore, the first metal layer 110, the second metal layer 130, and the third metal layer 140 themselves can be used as a single coil for the antenna layer 120, thereby improving the transmission and reception performance of the wireless antenna of the wireless IC card 100 while efficiently manufacturing wireless IC metal cards without the need for a separate shielding layer or the like.

[0047] The antenna layer 120 may be positioned in a specific area on the lower surface of the first metal layer 110 and electrically connected to the wireless IC chip 112, enabling the transmission and reception of wireless signals with external devices such as a card reader.

[0048] Here, the antenna layer 120 may include one or more antenna patterns formed by winding around the IC chip housing 111 so as to be electrically connected to the wireless IC chip 112 and perform communication functions while transmitting and receiving wireless signals with an external device.

[0049] Furthermore, the first metal layer 110 and the third metal layer 140 may be made of a first metal material that causes patterns and characters to be formed on the surface of the wireless IC card 100, and the second metal layer 130 may be made of a second metal material intended to increase the weight of the wireless IC card 100.

[0050] Furthermore, the second metal layer 130 may be formed to be thicker than the first metal layer 110 or the third metal layer 140 in order to increase the weight of the wireless IC card 100.

[0051] As a result, the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be formed in a variety of ways depending on the laminated structure and material, and the wireless IC card 100 composed of a clad metal assembly can be manufactured by applying adhesive and performing bonding press processes between each metal layer.

[0052] Here, examples of bonding methods between the metal layers include using thermoplastic or thermosetting adhesives having ethylene vinyl acetate (EVA, ethylene vinyl acetate copolymer), polyolefin, polyamide, polyester, cellulose, nylon, or rubber (naturally synthesized) components.

[0053] As a result, Table 1 below shows a wide variety of embodiments in which at least one metal can be used in the first metal layer 110, the second metal layer 130, and the third metal layer 140 according to the embodiment of the present invention.

[0054] [Table 1]

[0055] As shown in Table 1 above, the total weight of the metal can be adjusted using the properties of the available metals.

[0056] Furthermore, by changing the applicable metal thickness of the first metal layer 110, the second metal layer 130, and the third metal layer 140, it is possible to design metal cards with a greater range of thicknesses and weights.

[0057] For example, as in the first and second embodiments, aluminum can be used as the material for the first metal layer 110 and the third metal layer 140, and cupronickel or stainless steel can be used as the material for the second metal layer 130.

[0058] In the first and second embodiments, the thickness ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 is preferably 1:2:1, and the weight ratio is preferably 1:6:1.

[0059] More specifically, the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be calculated as the ratio of the product of the thickness of each metal layer and the specific gravity of the metal.

[0060] For example, in the first embodiment, when a thickness ratio of 1:2:1 is applied to the first metal layer 110, the second metal layer 130, and the third metal layer 140, the specific gravity of aluminum is 2.7 and the specific gravity of cupronickel is 8.8, so the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can preferably be calculated as 1:6:1.

[0061] Furthermore, as in the third embodiment, stainless steel (SUS) can be used as the material for the first metal layer 110 and the third metal layer 140, and cupronickel or stainless steel can be used as the material for the second metal layer 130.

[0062] For example, in the third embodiment, a thickness ratio of 1:2:1 can be applied to the first metal layer 110, the second metal layer 130, and the third metal layer 140, and the weight ratio may be approximately 1:2:1. For example, when applying a thickness ratio of 1:2:1 to the first metal layer 110, the second metal layer 130, and the third metal layer 140, the specific gravity of stainless steel is 7.9 and the specific gravity of cupronickel is 8.8, so the weight ratio of the first metal layer 110, the second metal layer 130, and the third metal layer 140 can be calculated as approximately 1:2:1.

[0063] Figure 3 shows a side view of a wireless IC card according to an embodiment of the present invention.

[0064] First, referring to Figure 3(a) as an example of conventional technology, a metal card utilizing duralumin, which has the characteristics of being lightweight and strong, is formed by opening a certain area of ​​the metal layer on the top surface of a duralumin material with a thickness of D1 to accommodate a wireless IC chip. The wireless IC chip is connected to an intermediate antenna circuit, and the metal layer on the bottom surface of the duralumin material and the back finishing member are arranged and joined in a continuous manner on the bottom surface. Typically, the thickness of D1 is formed to be 0.8T (0.8 mm) or more in order to provide a sense of weight and other characteristics of metal.

[0065] However, with this type of metal card, the high hardness of duralumin makes it difficult to pattern the front and back surfaces. Furthermore, when processing the IC chip housing, the thickness of the upper metal layer requires high energy to penetrate it, resulting in reduced productivity and an increased defect rate.

[0066] In contrast, referring to Figure 3(b), the wireless IC card 100 according to an embodiment of the present invention may have a first metal layer 110 and a third metal layer 140 made of aluminum material having a thickness of D2, and a certain area of ​​the first metal layer 110 may be formed with an opening to accommodate a wireless IC chip 112.

[0067] Furthermore, since the thickness of D2 can be formed in a thin form, such as 0.2T (0.2 mm), the IC chip housing portion 111 to be opened can be formed with very little energy by punching, etching, or NC machining, thereby increasing processing efficiency.

[0068] As a result, the wireless IC card 100 according to the embodiment of the present invention, as proposed in Figure 3(b), is easier to process than conventional technology, and the thickness of the NC machining required to form the IC chip housing portion 111 is also reduced.

[0069] Nevertheless, in the embodiment of the present invention, the wireless IC card 100 can be designed with improved weight by placing a weighty second metal layer 130 between the antenna layer 120 and the third metal layer 140, so that the user can feel the weight characteristic of metal even more.

[0070] Furthermore, by using a flexible material such as aluminum for the first metal layer 110 and the third metal layer 140, it becomes easier to form patterns and characters through the rolling process, and a wide variety of colors can be achieved.

[0071] Figure 4 is a diagram illustrating corrosion and corrosion prevention of a wireless IC card according to an embodiment of the present invention.

[0072] Figure 4(a) shows typical contact corrosion caused by the potential difference between two dissimilar metals in contact.

[0073] Referring to Figure 4(a), for example, aluminum can be used for the first and third metal layers that are joined to each other, and a copper-based material can be joined to the intermediate second metal layer to increase the weight, thereby creating a clad metal.

[0074] Here, as a result of electrons from the negatively charged copper concentrating on the positively charged aluminum, there is a risk that dissimilar metal contact corrosion (galvanic corrosion) may occur at the junction of the first metal layer and the third metal layer, where aluminum is used as the first metal, due to the potential difference between the two different metals, as shown in the illustrated corrosion region 10, and that uneven coloring may result.

[0075] Furthermore, in another embodiment, if stainless steel (SUS) is used as the material for the first and third metal layers as the first metal, and copper is used as the material for the second metal layer as the second metal, electrons from the relatively negatively charged stainless steel (SUS) may concentrate on the positively charged copper, resulting in galvanic corrosion of the copper, which is the second metal layer. Alternatively, electrons from the relatively negatively charged first or third metal, stainless steel, may concentrate on the positively charged second metal, copper, resulting in corrosion of the copper.

[0076] To prevent contact corrosion, the surfaces of the first metal layer 110 and the third metal layer 140, which are made of aluminum or stainless steel, may be subjected to anodizing or other insulating treatment for insulation before laminating the first metal layer 110, the second metal layer 130, and the third metal layer 140.

[0077] Figure 4(b) shows a layer of metals that have been treated with an insulating process to prevent contact corrosion between dissimilar metals.

[0078] For example, as shown in Figure 4(b), the first metal layer 110 and the third metal layer 140, indicated by the dotted lines, are a type of aluminum coating that enhances corrosion resistance by applying an anodizing treatment to the surface of the aluminum for insulation, thereby preventing contact corrosion between dissimilar metals.

[0079] As a result, the anodized first metal layer 110 and the third metal layer 140, when in contact with the second metal layer 130 which increases the weight of the wireless IC card 100, reduce the occurrence of oxidation, prevent contact corrosion between dissimilar metals, and reduce the possibility of discoloration due to the surrounding environment.

[0080] Furthermore, the anodized aluminum retains the natural feel and texture of the metal, allows for a wider variety of color choices, and ensures a consistent and uniform color distribution on the anodized surface.

[0081] In another embodiment, the first metal layer 110 and the third metal layer 140, which are made of stainless steel (SUS), may be insulated to prevent contact corrosion with the second metal layer 130, which is made of copper.

[0082] This prevents corrosion from occurring in the second metal layer 130, and makes it possible to manufacture a wireless IC card 100 that employs a design in which the stainless steel (SUS), which is the material of the first metal layer 110, is laser-processed.

[0083] Figure 5 shows the possible corrosion conditions that can occur when clad metal is applied to wireless IC cards.

[0084] Referring to Figure 5, if the wireless IC card 100 uses aluminum as the material for the first metal layer 110 and the third metal layer 140, and copper as the material for the second metal layer 130, then electrons from the relatively negatively charged copper will concentrate on the positively charged aluminum, which may result in corrosion of the aluminum.

[0085] Furthermore, as shown in Figure 5, corrosion may occur in the first and third metal layers made of aluminum, and the wireless IC card 100 may be formed with uneven coloring overall.

[0086] Therefore, it is preferable to apply an insulating treatment such as anodizing to at least one of the two metal layers to prevent contact corrosion (galvanic corrosion) between dissimilar metals caused by the potential difference between the two different metals.

[0087] Figure 6 is a diagram illustrating the array pattern of an antenna layer according to an embodiment of the present invention.

[0088] Referring to Figure 6, the antenna layer 120 is positioned on the lower surface of the first metal layer 110 and is electrically connectable to the wireless IC chip 112, enabling it to transmit and receive wireless signals with external devices such as a card reader.

[0089] Here, the antenna layer 120 may include one or more antenna patterns formed by winding around the IC chip housing 111 so as to be electrically connected to the wireless IC chip 112 and perform communication functions while transmitting and receiving wireless signals with an external device.

[0090] Furthermore, since the antenna layer 120 is connectable so that the wireless IC card 100 can form one turn of the antenna pattern, the antenna layer 120 may have one end and the other end of each pattern connected to at least one of the first joining position 121 of the first metal layer 110 and the second joining position 122 of the second metal layer 130.

[0091] More specifically, the antenna layer 120 may be connected to the first joining position 121 of the first metal layer 110, where one end of the first pattern is adjacent to the slit portion 150 by a predetermined first distance.

[0092] Furthermore, the other end of the first pattern may be electrically connected to a second joining position 122 of the second metal layer 130 or the third metal layer 140 adjacent to the slit portion 150 by a predetermined second distance, so that the first pattern extends in a direction that is connected to the winding direction of the antenna layer 120 via at least one of the first metal layer 110, the second metal layer 130, and the third metal layer 140.

[0093] Furthermore, one end and the other end of each pattern can be connected to the first bonding position 121 of the first metal layer 110 and the second bonding position 122 of the second metal layer 130 or the third metal layer 140 by an electrical bonding method, and adhesive materials having anisotropic conductivity can be used. Examples include anisotropic conductive film (ACF), anisotropic conductive paste (ACP), conductive adhesives, and surface mount technology (SMT).

[0094] Furthermore, for such winding connections, the first joining position 121 may be predetermined to a position where at least a portion of the first metal layer 110 on which the first slit portion 150a is provided constitutes the winding of the first pattern.

[0095] Furthermore, the second joining position 122 may be predetermined as a position where at least a portion of the joint of the second metal layer 130 and the third metal layer 140 constitutes the winding of the first pattern.

[0096] As a result, in the embodiment of the present invention, the metal card 100 with each slit formed on it can be used as a winding pattern extending from the antenna pattern of the antenna layer 120, so that the metal layers 110, 130, 140 with each slit formed on it can function as an extended antenna pattern.

[0097] Therefore, the wireless IC metal card 100 according to the embodiment of the present invention can achieve efficient wireless communication sensitivity by using a clad metal bond so that its body functions as a single antenna without the need for a separate shielding layer, thereby overcoming the communication limitations of metal cards.

[0098] Figure 7 is a diagram illustrating the case in which the joining position of the slit portion according to the present invention is formed.

[0099] Referring to Figure 7, the other end of the first pattern connected to the first bonding position 121 of the first metal layer 110 and the other end of the second pattern connected to the second bonding position 122 of the second metal layer 130 may be connected to the lower end of the wireless IC chip 112, respectively.

[0100] The antenna layer 120 is formed such that one or more antenna patterns are wound around the IC chip housing 111, but one end of the first pattern may be electrically connected to a first joining position 121 of the first metal layer 110 that is adjacent to the first slit portion 150a by a predetermined first distance, and may extend in a direction that is continuous with the winding direction of the antenna.

[0101] Here, the first joining position 121 may be a position that is pre-set such that at least a portion of the first metal layer 110 on which the first slit portion 150a is provided constitutes the winding of the first pattern.

[0102] Furthermore, the antenna layer 120 may be electrically connected to a second joining position 122 of the second metal layer 130, where one end of the second pattern is adjacent to the second slit portion 150b by a predetermined first distance, and may extend in a direction that is continuous with the winding direction of the antenna.

[0103] Here, the second joining position 122 may be a position that is pre-set such that at least a portion of the second metal layer 130 on which the second slit portion 150b is provided constitutes the winding of the second pattern.

[0104] More specifically, as described above, the antenna layer 120 may be connected to the first joining position 121 of the first metal layer 110, where one end of the first pattern is adjacent to the slit portion 150 by a predetermined first distance.

[0105] Furthermore, one end of the second pattern may be electrically connected to a second joining position 122 of the second metal layer 130 that is adjacent to the slit portion 150 by a predetermined second distance, and each first pattern and the second pattern may be configured to extend in a direction that is continuous with the winding direction of the antenna layer 120.

[0106] As a result, as shown in Figure 7, at least a portion of the antenna layer 120 below the first metal layer 110 can be joined and connected to the slit portion 150.

[0107] Here, the position and direction of the first joint position 121 of the first metal layer 110 or the position and direction of the second joint position 122 of the second metal layer 130 may be formed in a direction that extends the direction of the current in the winding pattern of the antenna layer 120.

[0108] Furthermore, the first metal layer 110, the second metal layer 130, and the third metal layer 140 may be configured to function as a single coil, enabling wireless signals to be sent and received from external devices such as card readers on both sides of the wireless IC card 100.

[0109] Furthermore, good antenna characteristics can be obtained without providing a separate shielding layer to the wireless IC card 100 or going through a complex manufacturing process.

[0110] Figure 8 is a flowchart illustrating a method for manufacturing a wireless IC card according to an embodiment of the present invention.

[0111] Figure 8 is a flowchart showing the first and second embodiments of the method for manufacturing a wireless IC card according to the present invention.

[0112] In the first embodiment, a pattern resembling a design is first applied to the surfaces of the first metal layer 110 and the third metal layer 140 of the aluminum material by a rolling process (S101).

[0113] Then, an IC chip housing portion 111 is processed in a certain area of ​​the first metal layer 110 (S103).

[0114] Here, the IC chip housing portion 111 may be formed by punching, etching, or NC machining of the first metal layer 110, so that the opening in the first metal layer 110 corresponds to the area and depth corresponding to the position and shape of the wireless IC chip 112.

[0115] Furthermore, the first metal layer 110 and the third metal layer 140, which are made of aluminum, have the characteristic of being highly flexible, which makes it possible to realize a wide variety of patterns.

[0116] Next, a slit portion 150 is machined from one side of the IC chip housing portion 111 toward the outer edge of the wireless IC card 100 (S107).

[0117] Here, the slit portion 150 may include a first slit portion 150a formed by cutting from one side of the IC chip housing portion 111 toward the outer edge of the first metal layer 110, a second slit portion 150b formed by cutting toward the outer edge of the second metal layer 130 so as to be opposite to the first slit portion 150a, and a third slit portion 150c formed by cutting toward the outer edge of the third metal layer 140 so as to be opposite to the second slit portion 150b, respectively.

[0118] Furthermore, the slit portions 150a, 150b, and 150c may be formed to a predetermined width corresponding to the width of the IC chip housing portion 111 up to the outer edge of the wireless IC card 100, and the predetermined width may be set to be narrower, wider, or equal to the width of the IC chip housing portion 111.

[0119] Subsequently, the first metal layer 110 and the third metal layer 140 are subjected to anodizing for insulation (S107).

[0120] Here, in order to prevent contact corrosion occurring in the first metal layer 110 and the third metal layer 140 due to the potential difference between the first metal layer 110 and the third metal layer 140, which are made of aluminum, and the second metal layer 130, an anodizing treatment for insulation may be performed.

[0121] Then, a metal adhesive for forming clad metal is applied between the wireless IC chip 112, the first metal layer 110, the antenna layer 120, the second metal layer 130, and the third metal layer 140, and they are aligned in order and pressed (S109).

[0122] On the other hand, in a second embodiment, first, an IC chip housing portion 111 is processed in a certain area of ​​the first metal layer 110 of stainless steel material (S201).

[0123] Here, the IC chip housing portion 111 may be formed by punching, etching, or NC machining of the first metal layer 110, so that the opening in the first metal layer 110 corresponds to the area and depth corresponding to the position and shape of the wireless IC chip 112.

[0124] After this, a slit portion 150 is machined from one side of the IC chip housing portion 111 toward the outer edge of the wireless IC card 100 (S203).

[0125] Here, as described above, the slit portion 150 may include a first slit portion 150a formed by cutting from one side of the IC chip housing portion 111 toward the outer edge of the first metal layer 110, a second slit portion 150b formed by cutting toward the outer edge of the second metal layer 130 so as to be opposite to the first slit portion 150a, and a third slit portion 150c formed by cutting toward the outer edge of the third metal layer 140 so as to be opposite to the second slit portion 150b.

[0126] Then, the design is applied to the surfaces of the first metal layer 110 and the third metal layer 140 (S205).

[0127] Here, since stainless steel, which is the material for the first metal layer 110 and the third metal layer 140, is difficult to apply patterns to by a rolling process like the aluminum material in the first embodiment, it is preferable to apply the design by a laser process.

[0128] After this, the first metal layer 110 and the third metal layer 140 are subjected to insulation treatment (S207).

[0129] Here, the first metal layer 110 and the third metal layer 140, which are made of stainless steel, may be insulated to prevent contact corrosion with the second metal layer 130, which is made of another metal.

[0130] Then, as described in step S109 above, an adhesive for forming clad metal is applied between the wireless IC chip 112, the first metal layer 110, the antenna layer 120, the second metal layer 130, and the third metal layer 140, and they are aligned in order and pressed (S109).

[0131] While preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited in any way to the specific embodiments described above. It goes without saying that various modifications can be made by persons with ordinary skill in the art to which the invention belongs without departing from the gist of the invention as claimed in the claims, and these modified embodiments should not be understood individually from the technical idea or outlook of the present invention.

Claims

1. In wireless IC metal cards, A first metal layer housing a wireless IC chip is located on the top surface, An antenna layer is arranged in a portion of the lower surface of the first metal layer and is electrically connected to the wireless IC chip, A second metal layer is positioned below the first metal layer, with the antenna layer in between, A third metal layer is positioned below the second metal layer, Equipped with, A wireless IC metal card in which the first metal layer, the second metal layer, and the third metal layer are joined together to form a clad metal structure.

2. The wireless IC metal card according to claim 1, characterized in that the second metal layer is made of a different metal material than the first metal layer and the third metal layer, and is formed such that its weight is even higher than the weight of the first metal layer and the third metal layer.

3. The first metal layer and the third metal layer are formed from either aluminum or duralumin. The wireless IC metal card according to claim 2, characterized in that the second metal layer is formed from either cupronickel or stainless steel.

4. The first metal layer and the third metal layer are formed from stainless steel material. The wireless IC metal card according to claim 2, characterized in that the second metal layer is formed from a cupronickel material.

5. The wireless IC metal card according to claim 1, characterized in that the thickness of the second metal layer is formed to be greater than that of the first metal layer and the third metal layer, and its weight is formed to be greater than that of the first metal layer and the third metal layer.

6. The wireless IC metal card according to claim 5, characterized in that the thickness ratio of the first metal layer, the second metal layer, and the third metal layer is 1:2:

1.

7. The first metal layer includes an IC chip housing portion formed by opening a certain area to accommodate the wireless IC chip, The wireless IC metal card according to claim 1, wherein the first metal layer, the second metal layer, and the third metal layer each have a slit portion formed by cutting away from the IC chip housing portion toward the outer edge of the wireless IC metal card.

8. The aforementioned slit portion is A first slit portion is formed by cutting open from one side of the IC chip housing portion toward the outer edge of the first metal layer, A second slit portion is formed by cutting in the direction of the outer edge of the second metal layer, corresponding to the cutting direction of the first slit portion, A third slit portion is formed by cutting in the direction of the outer edge of the third metal layer, corresponding to the cutting direction of the second slit portion, A wireless IC metal card according to claim 7, comprising the features described above.

9. The wireless IC metal card according to claim 8, further comprising one or more finishing members having electrical insulating properties and inserted into at least one of the first slit portion, the second slit portion, or the third slit portion.

10. The aforementioned antenna layer is One or more antenna patterns are formed so as to be wound around the IC chip housing, but one end of the first pattern is electrically connected to a first bonding position of the first metal layer adjacent to the first slit portion by a predetermined first distance, and extends in a direction that is continuous with the winding direction of the antenna layer. The wireless IC metal card according to claim 8, wherein the first bonding position is a position preset such that at least a portion of the first metal layer on which the first slit portion is provided constitutes a winding of the first pattern.

11. The aforementioned antenna layer is The other end of the first pattern is electrically connected to a second joining position of the second or third metal layer that is adjacent to the second or third slit portion by a predetermined second distance, and extends in a direction that is continuous with the winding direction of the antenna layer. The wireless IC metal card according to claim 10, wherein the second joining position is a position preset such that at least a portion of the joining body of the second metal layer and the third metal layer constitutes the winding of the first pattern.

12. In a method for manufacturing wireless IC metal cards, The steps include providing a first metal layer on the upper surface for housing a wireless IC chip, The steps include: arranging an antenna layer electrically connected to the wireless IC chip in a portion of the area of ​​the lower surface of the first metal layer; The steps include placing the second metal layer below the first metal layer with the antenna layer in between, The steps include placing a third metal layer below the second metal layer, The steps include: aligning the first metal layer, the second metal layer, and the third metal layer and pressing them together to form a clad metal structure by joining the first metal layer, the second metal layer, and the third metal layer to each other; A method for manufacturing a wireless IC metal card, including the method described above.

13. The step of forming the clad metal structure is: A method for manufacturing a wireless IC metal card according to claim 12, further comprising the step of pre-applying a thermoplastic or thermosetting adhesive to the bonding region between the first metal layer, the second metal layer, and the third metal layer.

14. Before the step of forming the clad metal structure, The method for manufacturing a wireless IC metal card according to claim 12, further comprising the step of applying a pattern using a roll pattern processing method when the first metal layer or the third metal layer is made of aluminum.

15. Before the step of forming the clad metal structure, A method for manufacturing a wireless IC metal card according to claim 12, further comprising the step of performing an anodizing treatment on the upper and lower surfaces of the first metal layer or the third metal layer, if the first metal layer or the third metal layer is made of aluminum and the second metal layer includes a copper material.

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