Thermosetting resin compositions, resin-metal composites, electrical components, and housing components.

Abstract

To provide a thermosetting resin composition capable of obtaining a cured product which has excellent adhesion to a metal member, has low anisotropy and suppresses peeling of a bonding material.SOLUTION: There is provided a thermosetting resin composition for forming a resin-metal composite which comprises (A) a thermosetting resin, (B) calcium hydroxide and (C) calcium carbonate and contains 4.3 pts.mass or more and 7.0 pts.mass or less of calcium hydroxide (B) based on 100 pts.mass of the thermosetting resin (A) and 20 mass% or more and 60 mass% or less of calcium carbonate (C) in 100 mass% of the thermosetting resin composition.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a thermosetting resin composition, a resin-metal composite, an electrical component, and a housing member.

Background Art

[0002] Phenolic resins are excellent in mechanical strength, heat resistance, chemical resistance, dimensional stability, etc., and are widely used as packaging materials for electrical and electronic components, etc. where electrical insulation and mechanical strength are required. Patent Document 1 discloses a phenolic resin composition containing a phenolic resin containing a benzoxazine resin and a predetermined disulfide compound, and sodium hydroxide, sodium carbonate, etc. are exemplified as curing agents. According to this phenolic resin composition, it is described that the metal adhesion and the heat resistance of the cured product are excellent.

[0003] Patent Document 2 discloses a thermoplastic resin composition obtained by blending polyphenylene sulfide, liquid crystalline polyester, and elastomer in a predetermined amount. According to this thermoplastic resin composition, it is described that it has an adhesive strength between the resin and the metal and can maintain high metal adhesion even after high-temperature treatment.

[0004] Patent Document 3 discloses a phenolic resin composition containing a phenolic resin and calcium carbonate, and it is described that it is used for a resin molded body whose surface is subjected to a plating treatment. Further, calcium hydroxide is exemplified as a curing aid. According to this document, it is described that the adhesion between the resin molded body and the plating film when the surface of the resin molded body is subjected to a plating treatment can be improved. A phenolic resin composition containing the following components (A) and (B) and used for a resin molded body whose surface is subjected to a plating treatment, and which can improve the adhesion between the resin molded body and the plating film when the surface of the resin molded body is subjected to a plating treatment. Calcium hydroxide (slaked lime) and other curing aids. ??(A) Phenolic resin (B) A phenolic resin composition used in a resin molded article in which a calcium carbonate surface is plated, comprising the following components (A) and (B). ??(A) Phenolic resin ??(B) Calcium carbonate

[0005] Patent Document 4 discloses a molding material comprising a phenolic resin and a filler containing a predetermined amount of fiber filler and spherical filler. Calcium carbonate is given as an example of the spherical filler, and calcium hydroxide as a curing aid. The document states that this molding material can suppress the development of anisotropy in the molded article. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2016-164270 [Patent Document 2] Japanese Patent Publication No. 2013-227366 [Patent Document 3] International Publication No. 2021 / 025124 [Patent Document 4] Japanese Patent Publication No. 2016-88987 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] However, the conventional compositions described in Patent Documents 1 to 4 still had room for improvement in terms of adhesion to metals. In addition, anisotropy could occur, which could cause the bonding material to peel off. [Means for solving the problem]

[0008] The inventors of the present invention have found that a thermosetting resin composition containing calcium hydroxide and calcium carbonate in predetermined amounts can solve the above-mentioned problems, and have completed the present invention. In other words, the present invention can be described as follows.

[0009] According to the present invention, a thermosetting resin composition for forming a resin-metal composite, (A) Thermosetting resin and (B) Calcium hydroxide and (C) Contains calcium carbonate, The thermosetting resin (A) contains 4.3 parts by mass or more and 7.0 parts by mass or less of calcium hydroxide (B) per 100 parts by mass. A thermosetting resin composition can be provided, which contains 20% to 60% by mass of calcium carbonate (C) in 100% by mass of the aforementioned thermosetting resin composition.

[0010] According to the present invention, A resin-metal composite can be provided, comprising a resin member formed by curing the aforementioned thermosetting resin composition and a metal member.

[0011] According to the present invention, An electrical component made of the aforementioned resin-metal composite can be provided.

[0012] According to the present invention, A housing component made of the aforementioned resin-metal composite can be provided. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a thermosetting resin composition that yields a cured product with excellent adhesion to metal members, low anisotropy, and suppressed delamination of the bonding material. In other words, the thermosetting resin composition of the present invention can provide a cured product with an excellent balance of these physical properties. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 is a schematic cross-sectional view of an automotive electrical component that incorporates the resin-metal composite of this embodiment as part of its housing. [Modes for carrying out the invention]

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. Also, for example, "1 to 10" represents "1 or more" to "10 or less" unless otherwise specified.

[0016] The thermosetting resin composition of this embodiment forms a resin-metal composite, and contains (A) a thermosetting resin, (B) calcium hydroxide, and (C) calcium carbonate. Based on 100 parts by mass of the thermosetting resin (A), it contains 4.3 parts by mass or more and 7.0 parts by mass or less of calcium hydroxide (B), and in 100% by mass of the thermosetting resin composition, it contains 20% by mass or more and 60% by mass or less of calcium carbonate (C). According to the thermosetting resin composition of this embodiment, it has excellent adhesion to metal members containing copper, nickel, etc., and furthermore, a cured product with small anisotropy and suppression of peeling of the bonding material (other resin members) can be obtained.

[0017] [Thermosetting resin (A)] In this embodiment, the thermosetting resin composition contains a thermosetting resin (A). Examples of the thermosetting resin (A) include phenol resin, furan resin, epoxy resin, polyacrylonitrile, etc., and one kind or two or more kinds can be mixed and used. In this embodiment, from the viewpoint of the effects of the present invention, it is more preferable to use a phenol resin, and it is more preferable to be a resol type phenol resin.

[0018] The resol type phenol resin is a resin obtained by reacting phenols and aldehydes in a reaction solvent under a basic catalyst under the predetermined conditions described below.

[0019] The phenols used for the synthesis of the resol-type phenolic resin used in this embodiment include: phenols; dihydroxybenzenes such as o-dihydroxybenzene (i.e., catechol), m-dihydroxybenzene (i.e., resorcinol, i.e., resorcinol), and p-dihydroxybenzene (i.e., hydroquinone); trihydroxybenzenes such as 1,2,3-trihydroxybenzene (i.e., pyrogallol); cresols such as o-cresol, m-cresol, p-cresol, and oxocresol; alkylphenols such as ethylphenol, butylphenol, octylphenol, and nonylphenol; xylenol; 3-pentadecylphenol, 3-pentadecylphenol monoene, 3-pentadecylphenoldiene, and 3-pentadecylphenoltriene Examples include components of cashew oil such as: components of cardol such as 1,3-dihydroxy-5-pentadecylbenzene, 1,3-dihydroxy-5-pentadecylbenzene monoene, 1,3-dihydroxy-5-pentadecylbenzenediene, and 1,3-dihydroxy-5-pentadecylbenzenetriene; components of methyl cardol such as 2-methyl-1,3-dihydroxy-5-pentadecylbenzene, 2-methyl-1,3-dihydroxy-5-pentadecylbenzene monoene, 2-methyl-1,3-dihydroxy-5-pentadecylbenzenediene, and 2-methyl-1,3-dihydroxy-5-pentadecylbenzenetriene; urushiol; bisphenols such as bisphenol A, bisphenol F, and bisphenol S; p-phenylphenol; and styrene-phenol. These may be used individually or in combination of two or more.

[0020] Examples of aldehydes used for the synthesis of the resol-type phenolic resin used in this embodiment include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, caproaldehyde, allylaldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, and the like. These may be used individually or in combination of two or more. It is also possible to use precursors of these aldehydes or solutions of these aldehydes. Among these, from the viewpoint of manufacturing cost, it is preferable to use an aqueous solution of formaldehyde.

[0021] Examples of basic catalysts used for the synthesis of the resol-type phenolic resin used in this embodiment include alkali metal or alkaline earth metal hydroxides such as sodium hydroxide, potassium hydroxide, and calcium hydroxide; carbonates such as sodium carbonate and calcium carbonate; oxides such as lime; sulfites such as sodium sulfite; phosphates such as sodium phosphate; and amines such as ammonia, trimethylamine, triethylamine, monoethanolamine, diethanolamine, triethanolamine, hexamethylenetetramine, and pyridine.

[0022] Water is commonly used as the reaction solvent for the synthesis of the resol-type phenolic resin used in this embodiment, but organic solvents may also be used. Specific examples of such organic solvents include alcohols, ketones, and aromatics. Specific examples of alcohols include methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, and glycerin. Specific examples of ketones include acetone and methyl ethyl ketone. Specific examples of aromatics include toluene and xylene.

[0023] Resol-type phenolic resins can be in the form of solids, aqueous solutions, solvent solutions, and aqueous dispersions. Among these, solvent solutions of methanol, ethanol, methyl ethyl ketone, and acetone are preferred due to their good workability.

[0024] The resol-type phenolic resin used in this embodiment is obtained by mixing phenols (P) and aldehydes (F) in a ratio such that the molar ratio (F / P) is 1.5 or higher, preferably 1.5 to 2.0, and more preferably 1.6 to 1.9, and then adding the above-mentioned basic catalyst as a polymerization catalyst, and refluxing for an appropriate time (for example, 3 to 6 hours). The reaction temperature is, for example, 40°C to 120°C, preferably 60°C to 100°C. This suppresses gelation and allows for the acquisition of a resol-type phenolic resin with the desired molecular weight.

[0025] The thermosetting resin composition (100% by mass) of this embodiment may contain thermosetting resin (A) in an amount of 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and more preferably 20% by mass or more and 40% by mass or less, from the viewpoint of the effects of the present invention.

[0026] [Calcium hydroxide (B)] The thermosetting resin composition of this embodiment contains 4.3 parts by mass to 7.0 parts by mass, preferably 4.8 parts by mass to 7.0 parts by mass, of calcium hydroxide (B) per 100 parts by mass of thermosetting resin (A). When the amount of calcium hydroxide (B) is within the above range, the cured product obtained from the thermosetting resin composition exhibits excellent adhesion to metal components, low anisotropy, and suppressed delamination, resulting in a molded article. It exhibits particularly excellent adhesion to metal components.

[0027] Calcium hydroxide (B) can be used as a hardening aid, and other hardening aids may include magnesium oxide, etc.

[0028] [Calcium carbonate (C)] The thermosetting resin composition of this embodiment may contain 20% to 60% by mass of calcium carbonate (C) in 100% by mass, preferably 30% to 60% by mass, and more preferably 40% to 60% by mass. When the amount of calcium carbonate (C) is within the above range, the cured product obtained from the thermosetting resin composition exhibits excellent adhesion to metal components, low anisotropy, and suppressed peeling. In particular, it exhibits excellent adhesion to metal components.

[0029] Furthermore, from the viewpoint of the effects of the present invention, it is preferable to combine the above-mentioned ranges for the amounts of calcium hydroxide (B) and calcium carbonate (C) added.

[0030] [Fiber filler (D)] Examples of fiber fillers (D) include glass fibers, wollastonite fibers, carbon fibers, and plastic fibers. For example, aramid fibers (aromatic polyamides) are used as plastic fibers. Inorganic fibers such as basalt fibers and metallic fibers such as stainless steel fibers can also be used as fiber fillers. Among these, it is preferable to select from the group consisting of glass fiber, wollastonite fiber, and carbon fiber, with glass fiber being more preferable, because it can increase the mechanical strength of the molded product and also contribute to reducing the weight of the molded product.

[0031] When using glass fibers as fiber filler (D), specific examples of glass constituting the glass fibers include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, and H glass. Among these, E glass, A glass, T glass, or S glass are preferred. By using such glass, high elasticity can be achieved and the coefficient of thermal expansion can be reduced.

[0032] The number-average fiber diameter of the fiber filler (D) can be appropriately set depending on the intended use of the molded product, but is preferably 3 μm to 50 μm, more preferably 5 μm to 30 μm, and even more preferably 8 μm to 20 μm. By using a fiber filler (D) having such a number-average fiber diameter, the mechanical strength of the molded product can be improved.

[0033] This number-average fiber diameter can be determined by measuring the fibers appearing in the cross-section of the molded product using a scanning electron microscope, transmission electron microscope, atomic force microscope, etc. For example, when measuring with a scanning electron microscope, any number of the above-mentioned fiber filler (D) can be measured from the cross-section of the molded product, and the average value can be calculated. More specifically, after measuring 100 fiber fillers (D) whose cross-sections can be observed, the average of the minimum diameters of each fiber cross-section can be calculated as the number-average fiber diameter.

[0034] The thermosetting resin composition of this embodiment may preferably contain 5% to 40% by mass, more preferably 6% to 30% by mass, of fiber filler (D) per 100% by mass of the composition. By including the fiber filler within the above range, it is possible to improve the strength of the molded product, enhance product reliability, and more effectively improve fluidity and fillability.

[0035] [Spherical filler (E)] In this embodiment, the spherical filler (E) does not include spherical fillers made of calcium carbonate. The thermosetting resin composition of this embodiment can use, for example, spherical inorganic fillers, such as glass spherical fillers (glass beads), glass powder, silica, aluminum hydroxide, or clay. Among these, glass spherical fillers are preferred due to their high heat resistance and ease of availability.

[0036] The average particle size of the spherical filler (E) can be set appropriately depending on the intended use of the molded product, but is preferably 12 μm to 100 μm, more preferably 15 μm to 90 μm, and even more preferably 20 μm to 80 μm. By using spherical fillers (E) with such average particle size, it is possible to ensure the fluidity of the molding material while suppressing the occurrence of anisotropy in the resulting molded product.

[0037] The average particle size of the spherical filler (E) can be measured and determined by observation using a scanning electron microscope, transmission electron microscope, atomic force microscope, etc., similar to the fibrous filler (D). Furthermore, when measuring with a scanning electron microscope, it is possible to measure any number of spherical fillers (E) from the residue obtained by firing the molded product in an inert atmosphere to remove organic components, and then calculate the average value. More specifically, the average particle size can be determined by taking measurements at 50 points on a sample of spherical filler (E).

[0038] The thermosetting resin composition of this embodiment may preferably contain 3% to 30% by mass, more preferably 5% to 20% by mass, of spherical filler (E) in 100% by mass of the composition. While ensuring the fluidity of the thermosetting resin composition, the orientation of fibrous filler (D) during molding can be made random, and the occurrence of anisotropy in the resulting molded product can be further suppressed. While ensuring the fluidity of the molding material, the orientation of (B1) fibrous filler during molding can be made random, and the occurrence of anisotropy in the resulting molded product can be suppressed.

[0039] [Other ingredients] The thermosetting resin composition of this embodiment may optionally contain various additives, such as release agents like stearic acid, calcium stearate, and polyethylene; curing aids like magnesium oxide, calcium hydroxide, and triphenylphosphine; colorants like carbon black; adhesion enhancers; coupling agents; solvents; and so on.

[0040] [Method for producing thermosetting resin compositions] The thermosetting resin composition of this embodiment can be manufactured, for example, by blending the above-mentioned components, uniformly mixing them, then heating, melting, and kneading them using a kneading device such as a roll, cone kneader, or twin-screw extruder alone, or in combination with a roll and other mixing device, followed by granulation or pulverization.

[0041] <Thermosetting resin composition> The thermosetting resin composition of this embodiment can preferably have a TD / MD coefficient of linear expansion of 1.8 or less, more preferably 1.6 or less, and even more preferably 1.5 or less, as measured under the following conditions. In this way, the thermosetting resin composition of this embodiment has low anisotropy and can suppress the peeling of other resin materials (such as encapsulants). The lower limit of TD / MD is not particularly limited, but it is around 0.6. (conditions) Using the aforementioned curable resin composition, an 80 × 10 × 4 mm molded body was produced by injection molding under the following conditions: gate dimensions: 8 × 3 mm, injection pressure: 150 MPa, mold temperature: 175 °C, and filling time: 4 seconds, with the longitudinal direction being the flow direction. A 10 × 10 × 4 mm test piece was then cut from the molded body. Subsequently, using a thermomechanical analyzer (TMA), the linear expansion coefficient MD in the flow direction and the linear expansion coefficient TD in the direction perpendicular to the flow direction were calculated in the range of 25 °C to 150 °C under a compression condition of 5 °C / min.

[0042] Furthermore, the thermosetting resin composition of this embodiment preferably has a peel strength of 10 MPa or higher, more preferably 12 MPa or higher, and even more preferably 15 MPa or higher, as measured under the following conditions. Thus, the thermosetting resin composition of this embodiment exhibits excellent adhesion to metal components and superior product reliability. While there is no particular upper limit to the peel strength, it is approximately 40 MPa. (conditions) A glass epoxy copper-clad laminate (Panasonic R-1705, substrate thickness 1.6 mm) is cut to 20 mm x 10 mm, and the thermosetting resin composition is molded onto its surface at a mold temperature of 175 °C, injection time of 20 seconds, injection pressure of 10 MPa, and curing time of 120 seconds to form a cylindrical molded product with a contact surface of φ3.6 mm and a height of 3.0 mm with the copper. The peel strength of the molded product is measured using a bond tester (Dage4000, Nordson Advanced Technologies) under the conditions of a load range of 50 kg, test height of 150 μm, descent rate of 0.3 mm / s, test speed of 300 μm / s, and under the conditions of a load range of 20 kg, test height of 150 μm, descent rate of 0.5 μm / s, test speed of 100 μm / s, and displacement of 100 μm.

[0043] [Molded products (resin components)] The molded product (resin member) according to this embodiment consists of a cured product obtained by using the thermosetting resin composition described above and going through a molding process. As for the specific molding method, appropriate conditions can be selected from known molding methods such as compression molding and transfer molding.

[0044] The resin component obtained from the thermosetting resin composition of this embodiment has high flexural strength and excellent mechanical strength. When the thermosetting resin composition of this embodiment is cured at 175°C for 120 seconds, the cured product (resin component) has a flexural strength of 60 MPa or more, preferably 80 MPa or more, and more preferably 100 MPa or more at room temperature (25°C). The upper limit is not particularly limited, but it can be 200 MPa or less.

[0045] [Application] The resin component obtained from the thermosetting resin composition of this embodiment exhibits excellent adhesion to metal and low anisotropy, and can therefore be used in a resin-metal composite comprising the resin component and a metal component.

[0046] Resin-metal composites exhibit excellent adhesion between metal and resin components, allowing for strong bonding. Furthermore, they can utilize the properties of both components, including mechanical strength, heat dissipation, heat resistance, insulation, and antistatic properties, making them suitable for a variety of applications. They are particularly suitable for automotive applications where high bonding strength and heat dissipation are required.

[0047] Because the resin-metal composite container of this embodiment possesses the above-mentioned characteristics, it can be used as a component (enclosure component) for the housing of electrical and electronic components (housings, cases, covers, connectors, etc.) incorporated into general home appliances and office automation equipment, mechanical components, and automotive electrical components (various control units, ignition coil components, sensor components, motor components, power modules, boost DC / DC converters, step-down DC / DC converters, capacitors, insulators, motor terminal blocks, batteries, electric compressors, battery current sensors, and junction blocks, etc.).

[0048] Figure 1 shows a schematic cross-sectional view of an automotive electrical component 10 that incorporates the resin-metal composite of this embodiment as a housing member. The automotive electrical component 10 is an insulated gate bipolar transistor (IGBT) and is used for power control applications.

[0049] The vehicle electrical component 10 comprises a laminate consisting of an insulating substrate 14 and a semiconductor chip 18 mounted on one surface of a copper substrate 12, a resin case 20 made of a cured product of the thermosetting resin composition of this embodiment surrounding the laminate, and a housing-shaped cooler 30 provided on the other surface of the copper substrate 12.

[0050] The copper substrate 12 may be nickel-plated. The semiconductor chip 18 is mounted on the insulating substrate 14 via solder 16 and electrically connected to electrodes 26 of the resin case 20 by wires 25. The electrodes 26 may be wiring patterns. The semiconductor chip 18 is further electrically connected to a lead frame 27 provided on the resin case 20 via solder 16.

[0051] The electrode 26 and lead frame 27 are connected to a gate terminal 24 for external extraction, and are configured to transmit signals from the semiconductor chip 18 to the outside. The area enclosed by the resin case 20 is sealed with a sealing material 28. Examples of sealing materials 28 include epoxy resin sealing material. The resin case 20 can be fixed to the copper substrate 12 and the cooler 30 by bolts 22, and the resin cases 20 can be fastened to each other or to other components.

[0052] A water jacket can be used as the cooler 30. The cooler 30 is in the shape of a housing and is installed so as to cover the other side of the copper substrate 12. The cooler 30 is equipped with a cooling fan 32 inside the housing and is configured to dissipate heat from the semiconductor chip 18.

[0053] Since the resin case 20 is made from a cured product of the thermosetting resin composition of this embodiment, it exhibits excellent adhesion to metal members (copper substrate 12, electrode 26, lead frame 27, etc.), and further exhibits low anisotropy, suppressing peeling of the bonding material (sealant 28, etc.). As a result, it is possible to provide an automotive electrical component 10 with excellent thermal rigidity and product reliability. The resin-metal composite in Figure 1 consists of a resin case 20 and metal members (copper substrate 12, electrode 26, lead frame 27, etc.).

[0054] Although embodiments of the present invention have been described above, these are merely examples, and various other configurations can be adopted as long as they do not impair the effects of the present invention. [Examples]

[0055] The present invention will be described in more detail below with reference to examples, but the present invention is not limited thereto. [Examples 1-8, Comparative Examples 1-2] The raw materials shown in Table 1 below were mixed at room temperature using a mixer, and then roll-kneaded at 70-100°C. Next, the resulting mixture was cooled and then pulverized to obtain a granular thermosetting resin composition. Subsequently, a tablet-shaped thermosetting resin composition was obtained by tablet molding under high pressure.

[0056] ·Thermosetting resin Novolac-type phenolic resin: PR-53194 (manufactured by Sumitomo Bakelite Co., Ltd., weight-average molecular weight: 700) Resol-type phenolic resin: PR-53529 (manufactured by Sumitomo Bakelite Co., Ltd., weight-average molecular weight: 700)

[0057] • Hardening agent Calcium hydroxide (manufactured by Kawai Lime Industry Co., Ltd.) • Fiber filler Glass fiber filler: CS3E479 (manufactured by Nitto Boseki Co., Ltd., fibrous filler with an average fiber diameter of 11 μm and an average fiber length of 3 mm) • Spherical filler Glass spherical filler: UB-13LA (manufactured by Unitika Corporation, average particle size 45 μm) ·silica Silica: (SIDISTAR (manufactured by ELKEM, average particle size 0.15 μm)) Calcium carbonate Calcium carbonate: SS#80 (manufactured by Nitto Funka Kogyo Co., Ltd.) ·wax Stearic acid (manufactured by NOF Corporation) Sanwax E250P (manufactured by Sanyo Chemical Industries, Ltd.) Pigments Carbon Black #750 (manufactured by Mitsubishi Chemical Corporation)

[0058] [Bending strength] The obtained thermosetting resin composition was injected into a mold using a low-pressure transfer molding machine (TEP50-70, manufactured by Towa Seiki Co., Ltd.) under the conditions of a mold temperature of 175°C, injection pressure of 10.0 MPa, and curing time of 120 seconds. This yielded a molded product with a width of 10 mm, a thickness of 4 mm, and a length of 80 mm. The obtained molded product was then post-cured at 175°C for 4 hours. This prepared a test specimen for evaluating mechanical strength. The bending strength (MPa) of the test specimen at room temperature (25°C) was then measured in accordance with JIS K 6911.

[0059] [anisotropy] Using the obtained thermosetting resin composition, an 80 × 10 × 4 mm molded body was produced by injection molding under the following conditions: gate dimensions: 8 × 3 mm, injection pressure: 150 MPa, mold temperature: 175 °C, and filling time: 4 seconds, with the longitudinal direction being the flow direction. A 10 × 10 × 4 mm test piece was then cut from the molded body. Subsequently, using a thermomechanical analyzer (TMA), the linear expansion coefficient MD in the flow direction and the linear expansion coefficient TD in the direction perpendicular to the flow direction were calculated in the range of 80 °C to 120 °C under a compression condition of 5 °C / min, and the TD / MD ratio was determined.

[0060] [Cu adhesion strength] A glass epoxy copper-clad laminate (Panasonic R-1705, substrate thickness 1.6 mm) was cut into 20 mm x 10 mm sections. The obtained thermosetting resin composition was molded onto the surface at a mold temperature of 175°C, injection time of 20 seconds, injection pressure of 10 MPa, and curing time of 120 seconds, resulting in a cylindrical molded product with a contact surface of φ3.6 mm and a height of 3 mm that adhered tightly to the copper. Using a bond tester (Dage4000, Nordson Advanced Technologies), the peel strength of the molded product was measured under the following conditions: load range 50 kg, test height 150 μm, descent speed 0.3 mm / s, test speed 300 μm / s, load range 20 kg, test height 150 μm, descent speed 0.5 μm / s, test speed 100 μm / s, and displacement 100 μm. The obtained peel strength was evaluated as the adhesion strength to copper.

[0061] [Table 1]

[0062] As shown in Table 1, the thermosetting resin composition of the example contained 4.3 to 7.0 parts by mass of calcium hydroxide per 100 parts by mass of thermosetting resin, and further contained 20% to 60% by mass of calcium carbonate (C) in 100% by mass of the thermosetting resin composition, resulting in a well-balanced and excellent anisotropy and metal adhesion strength. From this, it became clear that the resin-metal composite containing the thermosetting resin composition of the present invention is suitably used as a housing component for various electrical components. [Explanation of symbols]

[0063] 10. Vehicle electrical components 12 Copper substrate 14 Insulating substrate 16 solder 18 Semiconductor chips 20 resin cases 22 volts 24 Gate terminal for external output 25 wires 26 electrodes 27 Lead Frame 28. Sealing material 30 Cooler 32 heat dissipation fins

Claims

1. A thermosetting resin composition that forms a resin-metal composite, (A) Thermosetting resin and (B) Calcium hydroxide and (C) Calcium carbonate and (D) Fiber filler, (E) containing a spherical filler, The spherical filler (E) is at least one selected from glass spherical filler, glass powder, silica, aluminum hydroxide, and clay. The thermosetting resin (A) contains 4.3 parts by mass or more and 7.0 parts by mass or less of calcium hydroxide (B) per 100 parts by mass. A thermosetting resin composition comprising 20% ​​to 60% by mass of calcium carbonate (C) in 100% by mass of the aforementioned thermosetting resin composition.

2. The thermosetting resin composition according to claim 1, wherein the thermosetting resin (A) contains a phenolic resin.

3. The thermosetting resin composition according to claim 2, wherein the phenol resin comprises a resol-type phenol resin.

4. In 100% by mass of the aforementioned thermosetting resin composition, A thermosetting resin composition according to any one of claims 1 to 3, comprising 5% by mass or more and 40% by mass or less of fiber filler (D), and 3% by mass or more and 30% by mass or less of spherical filler (E).

5. The thermosetting resin composition according to any one of claims 1 to 4, wherein the fiber filler (D) comprises a glass fiber filler.

6. The thermosetting resin composition according to any one of claims 1 to 5, wherein the spherical filler (E) comprises a glass spherical filler.

7. A thermosetting resin composition according to any one of claims 1 to 6, wherein the TD / MD of the coefficient of linear expansion measured under the following conditions is 1.8 or less. (conditions) Using the thermosetting resin composition, an 80 × 10 × 4 mm molded body was produced by injection molding under the following conditions: gate dimensions: 8 × 3 mm, injection pressure: 150 MPa, mold temperature: 175°C, and filling time: 4 seconds, with the longitudinal direction being the flow direction. A 10 × 10 × 4 mm test piece was then cut from the molded body. Subsequently, using a thermomechanical analyzer (TMA), the linear expansion coefficient MD in the flow direction and the linear expansion coefficient TD in the direction perpendicular to the flow direction were calculated in the range of 25°C to 150°C under a compression condition of 5°C / min.

8. A thermosetting resin composition according to any one of claims 1 to 7, wherein the peel strength measured under the following conditions is 10 MPa or more. (conditions) A glass epoxy copper-clad laminate (Panasonic R-1705, substrate thickness 1.6 mm) is cut to 20 mm x 10 mm, and the thermosetting resin composition is molded onto its surface at a mold temperature of 175°C for 20 seconds, with an injection pressure of 10 MPa and a curing time of 120 seconds, forming a cylindrical molded product with a contact surface of φ3.6 mm with the copper. The peel strength of the molded product is measured using a bond tester (Dage 4000, Nordson Advanced Technologies).

9. A resin-metal composite comprising a resin member obtained by curing a thermosetting resin composition according to any one of claims 1 to 8, and a metal member.

10. An electrical component comprising the resin-metal composite described in claim 9.

11. A housing component made of the resin-metal composite described in claim 9.

12. A housing member for an electrical component for a vehicle, comprising the resin-metal composite described in claim 9.

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