Curable organopolysiloxane compositions and their cured products, protective agents or adhesives, and electrical and electronic equipment.

A one-component curable organopolysiloxane composition with specific catalysts and inhibitors achieves low-temperature curing and strong adhesion to diverse substrates, addressing storage stability and adhesion challenges in existing technologies.

JP7841886B2Active Publication Date: 2026-04-07DOW TORAY CO LTD +1
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2020-12-23
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

Existing curable organopolysiloxane compositions face issues with storage stability, require high-temperature curing, and lack sufficient adhesion to difficult-to-bond substrates such as polycarbonate and polyphenylene sulfide, as well as metal substrates, particularly when used in thin film forms.

Method used

A one-component curable organopolysiloxane composition containing organopolysiloxanes with alkenyl and silicon-bonded hydrogen groups, hydrosilylation and condensation catalysts, and a hardening inhibitor, allowing for low-temperature curing and improved adhesion to various substrates, including difficult-to-bond resins and metals.

Benefits of technology

The composition exhibits excellent storage stability, curability at 80°C or below, and strong adhesion to challenging substrates, enhancing the reliability and durability of electrical and electronic components.

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Abstract

[Problem] To provide a curable organopolysiloxane composition having excellent preservation stability in a single liquid, favorable curability and adhesiveness even at relatively low temperatures, and a suitable usable lifespan. Specifically, to provide a curable organopolysiloxane composition having excellent curability at temperatures of 80℃ and below and having excellent adhesiveness to resins such as polyester and polyphenylene sulfide. [Solution] A single-liquid type curable organopolysiloxane composition containing the following components (A)-(E): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst, (D) a condensation reaction catalyst, or condensation reaction product thereof, selected from the group consisting of tetra-tert-butoxy titanium, di(isopropoxy)bis(ethylacetoacetate) titanium, and aluminum chelate complexes, and (E) a curing inhibitor. Curing results in a silicone rubber composition having a JIS A hardness of 5 or greater. The composition may also contain a large amount of an arbitrary (H) inorganic filler or the like.
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Citation Information

Patent Citations

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    JP1992178461A

  • Adhesive silicone rubber composition

    JP2005290312A

  • Curable organopolysiloxane composition

    JP2006348119A

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    JP2010248410A

  • Self-adhesiveness silicone gel composition, and cured product of the same

    JP2018119021A