EUV photogeneration system and method for manufacturing electronic devices

Abstract

To provide an EUV light generation system capable of generating stable EUV light, even immediately after transfer from an idle period to an irradiation period.SOLUTION: An EUV light generation system includes: a chamber; a target supply device that supplies a target to a plasma generation region in the chamber; a laser device that outputs pulsed laser light; a beam sensor that measures one of a position and an angle of an optical axis of the laser light as a first optical performance; a first reflection control mirror whose angle is controlled so that the first optical performance becomes the first target value; and a processor that controls the laser device such that the laser light irradiates the target, wherein the processor, during idle time where the output of the laser light is stopped, determines a first correction angle the angle θ1b based on an angle Mc1b of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror in the cold state, a lapse time t from start of the idle period, and a first decay curve determined as a first time constant, and changes an angle of the first reflection control mirror to the first correction angle.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present disclosure relates to an EUV light generation system and a method for manufacturing an electronic device.

Background Art

[0002] In recent years, with the miniaturization of semiconductor processes, the miniaturization of transfer patterns in optical lithography of semiconductor processes has been rapidly progressing. In the next generation, microfabrication of 10 nm or less will be required. For this reason, development of a semiconductor exposure apparatus that combines an apparatus for generating extreme ultraviolet (EUV) light with a wavelength of about 13 nm and a reduction projection reflective optical system is expected.

[0003] As an EUV light generation apparatus, development of a Laser Produced Plasma (LPP) type apparatus that uses plasma generated by irradiating a target with laser light has been progressing.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

[0005] An EUV light generation system relating to one aspect of this disclosure is an EUV light generation system that generates EUV light by irradiating a target with pulsed laser light to create a plasma, and comprises a chamber, a target supply device that supplies a target to a plasma generation region in the chamber, a laser device that outputs pulsed laser light, a beam sensor that measures one of the position and angle of the optical axis of the pulsed laser light as a first optical performance, a first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value, and a processor that controls the laser device so that the pulsed laser light is irradiated onto the target, wherein during a pause period in which the output of the pulsed laser light is paused, the processor calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror during the cold period, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle.

[0006] A method for manufacturing an electronic device according to one aspect of the present disclosure includes: a chamber; a target supply device for supplying a target to a plasma generation region within the chamber; a laser device for outputting pulsed laser light; a beam sensor for measuring one of the position or angle of the optical axis of the pulsed laser light as a first optical performance; a first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value; and a processor for controlling the laser device so that the pulsed laser light is irradiated onto the target, wherein the processor, during a pause period in which the output of the pulsed laser light is paused, calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror when cold, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle; generating EUV light with an EUV light generation system, outputting the EUV light to an exposure apparatus, and exposing a photosensitive substrate with EUV light in the exposure apparatus in order to manufacture an electronic device.

[0007] A method for manufacturing an electronic device relating to one aspect of this disclosure includes: a chamber; a target supply device for supplying a target to a plasma generation region within the chamber; a laser device for outputting pulsed laser light; a beam sensor for measuring one of the position and angle of the optical axis of the pulsed laser light as a first optical performance; a first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value; and a processor for controlling the laser device so that the pulsed laser light is irradiated onto the target, wherein the processor, during a pause period in which the output of the pulsed laser light is paused, calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror when cold, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle; irradiating a mask with EUV light generated by an EUV light generation system to inspect the mask for defects; selecting a mask using the inspection results; and exposing and transferring the pattern formed on the selected mask onto a photosensitive substrate. [Brief explanation of the drawing]

[0008] Some embodiments of this disclosure are described below, merely as examples, with reference to the accompanying drawings. [Figure 1] Figure 1 is a schematic diagram showing the configuration of an LPP-type EUV light generation system. [Figure 2] Figure 2 shows the configuration of an EUV light generation system related to a comparative example. [Figure 3] Figure 3 shows an example of the operation of an EUV light generator. [Figure 4] Figure 4 is a flowchart showing the flow of optical axis control in the comparative example. [Figure 5] Figure 5 illustrates the challenges of the EUV light generation system in the comparative example. [Figure 6] Figure 6 is a flowchart showing the flow of optical axis control according to the first embodiment. [Figure 7] Figure 7 is a flowchart showing the flow of optical axis control during pause of prepulsed laser light. [Figure 8] Figure 8 is a flowchart showing the flow of optical axis control during pauses of the main pulse laser beam. [Figure 9] Figure 9 is a diagram illustrating the operation of the EUV light generation system according to the first embodiment. [Figure 10] Figure 10 is a graph showing an example of the change in the angle of the reflection control mirror over time. [Figure 11] Figure 11 shows the configuration of the EUV light generation system according to the second embodiment. [Figure 12] Figure 12 is a flowchart showing the flow of optical axis control according to the second embodiment. [Figure 13] Figure 13 is a flowchart showing the flow of optical axis control during pause of prepulsed laser light. [Figure 14] Figure 14 is a flowchart showing the flow of optical axis control during pauses of the main pulse laser beam. [Figure 15] Figure 15 is a diagram illustrating the operation of the EUV light generation system according to the second embodiment. [Figure 16] Figure 16 is a schematic diagram showing the configuration of an exposure apparatus connected to an EUV light generation system. [Figure 17] Figure 17 is a schematic diagram showing the configuration of an inspection device connected to an EUV light generation system. Embodiment

[0009] <Contents> 1. Overall description of the EUV light generation system 1.1 Configuration 1.2 Operation 2. EUV light generation system related to the comparative example 2.1 Configuration 2.2 Operation 2.3 Challenges 3. EUV light generation system according to the first embodiment 3.1 Configuration 3.2 Operation 3.3 Action and Effects 3.4 How to determine the time constant 3.5 Modified Examples of the First Embodiment 4. EUV light generation system according to the second embodiment 4.1 Configuration 4.2 Operation 4.3 Action and Effects 5. Others

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. The embodiments described below are examples of the disclosure and are not intended to limit the scope of this disclosure. Furthermore, not all configurations and operations described in each embodiment are necessarily essential to the configurations and operations of this disclosure. The same reference numerals are used for identical components, and redundant descriptions are omitted.

[0011] 1. Overall description of the EUV light generation system 1.1 Configuration Figure 1 schematically shows the configuration of an LPP-type EUV light generation system 11. The EUV light generator 1 is used together with a laser device 3. In this disclosure, the system including the EUV light generator 1 and the laser device 3 is referred to as the EUV light generation system 11. The EUV light generator 1 includes a chamber 2 and a target supply device 25. The chamber 2 is a sealable container. The target supply device 25 supplies droplet-shaped targets 27 into the chamber 2. The material of the target 27 may include tin, terbium, gadolinium, lithium, xenon, or any combination of two or more of these.

[0012] The wall of chamber 2 is provided with a through-hole. This through-hole is blocked by a window 21, and the pulsed laser light 31 output from the laser device 3 passes through the window 21. Inside chamber 2, an EUV focusing mirror 23 with a spheroidal reflective surface is positioned. The EUV focusing mirror 23 has a first and a second focal point. A multilayer reflective film is formed on the surface of the EUV focusing mirror 23, in which molybdenum and silicon are alternately layered. The EUV focusing mirror 23 is positioned such that its first focal point is located in the plasma generation region R1 and its second focal point is located in the intermediate focal point IF. A through-hole 24 is formed in the center of the EUV focusing mirror 23, and the pulsed laser light 31 passes through the through-hole 24.

[0013] The EUV light generator 1 includes a processor 5, a target sensor 4, and the like. The target sensor 4 detects at least one of the following: the presence, trajectory, position, and velocity of the target 27. The target sensor 4 may also have an imaging function.

[0014] Furthermore, the EUV light generation apparatus 1 includes a connecting section 29 that connects the inside of the chamber 2 with the inside of the external device 6. Inside the connecting section 29, there is a wall 291 in which an aperture 293 is formed. The wall 291 is positioned such that its aperture 293 is located at the second focal point of the EUV focusing mirror 23. For example, the external device 6 is an exposure apparatus.

[0015] Furthermore, the EUV light generation device 1 includes a laser light transmission device 50, a laser light focusing optical system 60, and a target retrieval unit 28 for retrieving the target 27. The laser light transmission device 50 includes an optical element for defining the transmission state of the laser light and an actuator for adjusting the position, orientation, etc., of the optical element.

[0016] 1.2 Operation Referring to Figure 1, the operation of an exemplary LPP-type EUV light generation system will be explained. The pulsed laser light 31 output from the laser device 3 passes through the laser light transmission device 50 and enters the chamber 2 through the window 21. The pulsed laser light 31 that enters the chamber 2 travels along the laser light path within the chamber 2, is focused by the laser light focusing optical system 60, and irradiates the target 27.

[0017] The target supply device 25 outputs the target 27 toward the plasma generation region R1 in the chamber 2. The target 27 is irradiated with pulsed laser light 31. The target 27 irradiated with pulsed laser light 31 becomes plasma, and synchrotron radiation 32 is emitted from the plasma. The EUV light 33 contained in the synchrotron radiation 32 is selectively reflected by the EUV focusing mirror 23. The EUV light 33 reflected by the EUV focusing mirror 23 is focused at the intermediate focusing point IF and output to the external device 6. Note that multiple pulses contained in the pulsed laser light 31 may be irradiated onto a single target 27.

[0018] The processor 5 controls the entire EUV light generation system 11. Based on the detection results of the target sensor 4, the processor 5 controls the timing of the output of the target 27, the output direction of the target 27, etc. Furthermore, the processor 5 controls the oscillation timing of the laser device 3, the direction of propagation of the pulsed laser light 31, the focusing position, etc. The various controls described above are merely examples, and other controls may be added as needed.

[0019] 2. EUV light generation system related to the comparative example 2.1 Configuration

[0020] Figure 2 shows the configuration of the EUV light generation system 11 according to the comparative example. The EUV light generation apparatus 1 according to the comparative example includes a chamber 2, a target supply device 25, a processor 5, a target sensor 4, a laser light transmission device 50, and a laser light focusing optical system 60, in addition to a beam sensor 70.

[0021] The laser device 3 outputs multiple pulsed laser beams 31 to irradiate a single target 27 supplied to the plasma generation region R1. The laser device 3 outputs, for example, a pre-pulse laser beam 31a and a main-pulse laser beam 31b as these multiple pulsed laser beams 31, in that order.

[0022] The laser device 3 comprises a pre-pulse laser device 3a that outputs pre-pulse laser light 31a and a main-pulse laser device 3b that outputs main-pulse laser light 31b. The pre-pulse laser device 3a is composed of a YAG laser device or a laser device using Nd:YVO4. The main-pulse laser device 3b is composed of, for example, a CO2 laser device. The main-pulse laser device 3b may also be composed of a YAG laser device or a laser device using Nd:YVO4.

[0023] The processor 5 includes an EUV photogeneration processor 5a and a target processor 5b. The EUV photogeneration processor 5a controls the laser device 3, the laser light transmission device 50, etc. The target processor 5b controls the target supply device 25. The EUV photogeneration processor 5a and the target processor 5b may be composed of a computer combining hardware and software.

[0024] The target supply device 25 includes a tank 251, a nozzle 252, a heater 253, a pressure regulator 254, and a piezoelectric element 255. The heater 253, the pressure regulator 254, and the piezoelectric element 255 are controlled by the target processor 5b.

[0025] The target sensor 4 includes an illumination unit 41 and a detection unit 42. The illumination unit 41 and the detection unit 42 are arranged to face each other across a target detection region R2 located on the trajectory of the target 27.

[0026] The illumination unit 41 consists of a light source 41a and an illumination optical system 41b. The illumination unit 41 outputs illumination light toward the target 27 as it passes through the target detection region R2. The detection unit 42 consists of a light sensor 42a and a light receiving optical system 42b. The detection unit 42 detects the target 27 as it passes through the target detection region R2 by detecting the light intensity of the illumination light output from the illumination unit 41.

[0027] The output of the target sensor 4 is input to the EUV photogeneration processor 5a. The EUV photogeneration processor 5a outputs light emission triggers to the pre-pulse laser device 3a and the main-pulse laser device 3b.

[0028] The laser light transmission device 50 includes reflection control mirrors 51 and 52, high-reflection mirrors 53, 54, and 55, a combiner element 56, and a beam splitter 57. The reflection control mirrors 51 and 52 correspond to the "first reflection control mirror" related to the technology of this disclosure.

[0029] The reflection control mirror 51 includes a high-reflection mirror 511 and a stage 512. The high-reflection mirror 511 is mounted on the stage 512 and positioned where pre-pulse laser light 31a output from the pre-pulse laser device 3a is incident. The stage 512 is an actuator that changes the angle of the high-reflection mirror 511. The reflection control mirror 52 includes a high-reflection mirror 521 and a stage 522. The high-reflection mirror 521 is mounted on the stage 522 and positioned where main-pulse laser light 31b output from the main-pulse laser device 3b is incident. The stage 522 is an actuator that changes the angle of the high-reflection mirror 521. Stages 512 and 522 are controlled by the EUV photogeneration processor 5a.

[0030] The high-reflection mirror 53 is positioned to reflect the pre-pulse laser light 31a reflected by the reflection control mirror 51 and direct it into the combiner element 56. The high-reflection mirrors 54 and 55 are positioned to reflect the main-pulse laser light 31b reflected by the reflection control mirror 52 and direct it into the combiner element 56.

[0031] The reflection control mirror 51 and the high-reflection mirror 53 are positioned so that the pre-pulse laser beam 31a is incident on the laser beam focusing optical system 60 with the target optical performance. The reflection control mirror 52 and the high-reflection mirror 54 are positioned so that the main-pulse laser beam 31b is incident on the laser beam focusing optical system 60 with the target optical performance. Here, optical performance refers to either the position or angle of the optical axis. Note that "optical performance" in this comparative example corresponds to "first optical performance" in the technology of this disclosure.

[0032] The combiner element 56 is an element that reflects the pre-pulse laser light 31a and transmits the main-pulse laser light 31b. The combiner element 56 is, for example, a polarized beam combiner, and it combines the optical paths of the pre-pulse laser light 31a and the main-pulse laser light 31b, whose polarization directions are orthogonal. The optical path of the pre-pulse laser light 31a reflected by the combiner element 56 and the optical path of the main-pulse laser light 31b transmitted through the combiner element 56 are combined so that they substantially coincide. The combiner element 56 may also be configured to reflect the main-pulse laser light 31b and transmit the pre-pulse laser light 31a.

[0033] The pre-pulse laser beam 31a and the main-pulse laser beam 31b, whose optical paths are coupled by the combiner element 56, are incident on the beam splitter 57. The beam splitter 57 reflects a portion of the pre-pulse laser beam 31a and the main-pulse laser beam 31b and directs it into the laser beam focusing optical system 60, while transmitting the other portion and directing it into the beam sensor 70. The beam splitter 57 may also be configured to transmit a portion of the pre-pulse laser beam 31a and the main-pulse laser beam 31b and direct it into the laser beam focusing optical system 60, while reflecting the other portion and directing it into the beam sensor 70. For the sake of convenience in this explanation, the pre-pulse laser beam 31a and the main-pulse laser beam 31b may be referred to simply as pulse laser beam 31 without distinction.

[0034] The laser beam focusing optical system 60 is located inside the chamber 2. The laser beam focusing optical system 60 is located on the optical path of the pulsed laser beam 31 that has passed through the window 21, and is positioned between the window 21 and the plasma generation region R1. The laser beam focusing optical system 60 includes a laser beam focusing mirror 221 and a manipulator 224.

[0035] The laser beam focusing mirror 221 reflects the pulsed laser beam 31 that has passed through the window 21 and focuses it into the plasma generation region R1. The laser beam focusing mirror 221 is mounted on the manipulator 224. The laser beam focusing mirror 221 consists of an off-axis parabolic mirror 222 and a planar mirror 223. Here, the off-axis parabolic mirror 222 is a concave mirror. Alternatively, the off-axis parabolic mirror 222 may be a convex mirror, and a spheroidal mirror may be used instead of the planar mirror 223.

[0036] The manipulator 224 is a stage that adjusts at least one of the position and orientation of the laser beam focusing mirror 221 so that the pulsed laser beam 31 is directed onto the target 27. The manipulator 224 is controlled by the EUV light generation processor 5a.

[0037] The beam sensor 70 includes a beam splitter 71, a first optical axis sensor 72, and a second optical axis sensor 73. The beam splitter 71 is an element that reflects the pre-pulse laser light 31a and transmits the main pulse laser light 31b. The beam splitter 71 is, for example, a polarizing beam splitter, which separates the optical paths of the pre-pulse laser light 31a and the main pulse laser light 31b, whose polarization directions are orthogonal. The pre-pulse laser light 31a separated by the beam splitter 71 is incident on the first optical axis sensor 72, and the main pulse laser light 31b is incident on the second optical axis sensor 73.

[0038] The first optical axis sensor 72 is a sensor that detects the optical performance of the pre-pulse laser light 31a. The second optical axis sensor 73 is a sensor that detects the optical performance of the main pulse laser light 31b. The outputs of the first optical axis sensor 72 and the second optical axis sensor 73 are input to the EUV photogeneration processor 5a.

[0039] The first optical axis sensor 72 and the second optical axis sensor 73 are, respectively, position sensors that detect the position of the optical axis, or angle sensors that detect the angle of the optical axis. In this comparative example, the first optical axis sensor 72 and the second optical axis sensor 73 are both considered position sensors. In other words, in this comparative example, the optical performance is "position of the optical axis".

[0040] Alternatively, a beam splitter may be placed in the optical path through which only the pre-pulse laser light 31a propagates, and the first optical axis sensor 72 may be positioned so that a portion of the pre-pulse laser light 31a transmitted or reflected by the beam splitter becomes incident. Alternatively, a beam splitter may be placed in the optical path through which only the main-pulse laser light 31b propagates, and the second optical axis sensor 73 may be positioned so that a portion of the main-pulse laser light 31b transmitted or reflected by the beam splitter becomes incident.

[0041] The beam sensor 70 measures the optical performance of the pulsed laser beam 31 immediately before it enters the chamber 2, so that the pulsed laser beam 31 enters the chamber 2 with the target optical performance. In this comparative example, the beam sensor 70 measures the optical performance of the pulsed laser beam 31 immediately before it enters the laser beam focusing optical system 60.

[0042] 2.2 Operation The operation of the EUV light generation system 11 in the comparative example will now be explained. First, the EUV light generation processor 5a outputs set values ​​such as pulse energy, pulse width, and pulse waveform of the prepulse laser light 31a to the prepulse laser device 3a. The EUV light generation processor 5a also outputs set values ​​such as pulse energy, pulse width, and pulse waveform of the main pulse laser light 31b to the main pulse laser device 3b.

[0043] The target processor 5b controls the heater 253 of the target supply device 25 to heat the target material 27 in the tank 251 to a temperature higher than its melting point and melt it. In this comparative example, the target material 27 is tin, and the tank 251 is filled with molten liquid tin.

[0044] When the EUV light generator 1 receives a signal from the external device 6 requesting the generation of EUV light, it sends a droplet generation signal to the target processor 5b. Upon receiving the droplet generation signal, the target processor 5b controls the pressure in the tank 251 via the pressure regulator 254 to reach a predetermined pressure. As a result, a jet of liquid tin is output from the nozzle 252 at a constant speed.

[0045] The target processor 5b applies a voltage of a predetermined waveform to a piezoelectric element 255 fixed to the nozzle 252 so that droplet-shaped targets 27 are generated from the liquid tin jet at a predetermined frequency. As a result, targets 27 are generated at a constant frequency.

[0046] The target sensor 4 detects the timing when the target 27 passes through the target detection region R2 and outputs a passage timing signal representing the detected timing to the EUV photogeneration processor 5a.

[0047] The EUV light generation processor 5a outputs a signal, which is the pass-through timing signal delayed by a first delay time, as the first emission trigger signal to the prepulse laser device 3a. In response to the first emission trigger signal, the prepulse laser device 3a outputs prepulse laser light 31a having the target pulse energy, pulse width, and pulse waveform.

[0048] The prepulse laser beam 31a is reflected by the reflection control mirror 51, high-reflection mirror 53, combiner element 56, and beam splitter 57 in the laser beam transmission device 50 and incident on the laser beam focusing optical system 60. The prepulse laser beam 31a is focused by the laser beam focusing optical system 60 and irradiated onto the target 27. The droplet-shaped target 27 irradiated by the prepulse laser beam 31a is also called the primary target.

[0049] The primary target is destroyed by irradiation with the pre-pulse laser light 31a, becoming a secondary target that spreads out in a mist-like form. Here, "mist-like form" refers to the state in which microdroplets, clusters, etc., are diffused as a result of the primary target being destroyed by the pre-pulse laser light 31a.

[0050] The EUV light generation processor 5a outputs a signal, which is the pass-through timing signal delayed by a second delay time, to the main pulse laser device 3b as a second emission trigger signal. In response to the second emission trigger signal, the main pulse laser device 3b outputs main pulse laser light 31b having the target pulse energy, pulse width, and pulse waveform.

[0051] The main pulse laser beam 31b is reflected by the reflection control mirror 52 and high-reflection mirrors 54 and 55 in the laser beam transmission device 50, passes through the combiner element 56, and is reflected by the beam splitter 57 before entering the laser beam focusing optical system 60. The main pulse laser beam 31b is focused by the laser beam focusing optical system 60 and irradiated onto the target 27, which serves as a secondary target. As a result, the secondary target becomes plasma, generating synchrotron radiation 32, which includes EUV light 33.

[0052] The prepulse laser light 31a that has passed through the beam splitter 57 is incident on the beam sensor 70, reflected by the beam splitter 71, and incident on the first optical axis sensor 72. The first optical axis sensor 72 measures the optical performance of the prepulse laser light 31a and outputs the measured value to the EUV light generation processor 5a.

[0053] The main pulse laser light 31b that has passed through the beam splitter 57 enters the beam sensor 70, passes through the beam splitter 71, and enters the second optical axis sensor 73. The second optical axis sensor 73 measures the optical performance of the main pulse laser light 31b and outputs the measured value to the EUV light generation processor 5a.

[0054] The EUV light generation processor 5a controls the angle of the reflection control mirror 51 so that the optical performance of the prepulse laser light 31a measured by the first optical axis sensor 72 reaches a target value. The EUV light generation processor 5a also controls the angle of the reflection control mirror 52 so that the optical performance of the main pulse laser light 31b measured by the second optical axis sensor 73 reaches a target value. Hereinafter, the control of the reflection control mirrors 51 and 52 by the EUV light generation processor 5a is referred to as optical axis control. In this comparative example, the "target value" corresponds to the "first target value" related to the technology of this disclosure.

[0055] Figure 3 shows an example of the operation of the EUV light generator 1. In Figure 3, the vertical axis of the graph represents the energy of the EUV light 33, and the horizontal axis represents time.

[0056] The operation of the EUV light generator 1 consists of an irradiation period TA during which EUV light 33 is output, and a rest period TB during which EUV light 33 is not output. During the irradiation period TA, the EUV light generator 1 performs a so-called burst emission operation, outputting multiple pulses of EUV light 33 at a high repetition frequency. During the rest period TB, the EUV light generator 1 stops outputting pulsed laser light 31 from the laser device 3.

[0057] For example, if the external device 6 is an exposure device, the EUV light generator 1 alternately repeats the irradiation period TA and the rest period TB based on the repeating pattern signal supplied from the external device 6, as shown in Figure 3. If the external device 6 is an inspection device, the EUV light generator 1 performs the operation of irradiating or resting the EUV light 33 in response to a command from the external device 6.

[0058] Figure 4 shows the flow of optical axis control for the comparative example. First, in step S10, the EUV light generation processor 5a determines whether the current time is the irradiation period TA. If the EUV light generation processor 5a determines that it is the irradiation period TA, it proceeds to step S11; if it determines that it is not the irradiation period TA, it proceeds to step S12.

[0059] In step S11, the EUV light generation processor 5a performs the optical axis control described above based on the measurement values ​​from the beam sensor 70. In step S12, the EUV light generation processor 5a stops the optical axis control. When step S11 or step S12 is completed, the process moves on to step S13.

[0060] In step S13, the EUV light generation processor 5a determines whether the termination condition is met. For example, the termination condition is that the EUV light generation device 1 has received a command to terminate operation from the external device 6. If the EUV light generation processor 5a determines that the termination condition is not met, it returns to step S10. If the EUV light generation processor 5a determines that the termination condition is met, it terminates the process.

[0061] Through the above process, optical axis control is performed during the irradiation period TA, and optical axis control is stopped during the rest period TB.

[0062] 2.3 Challenges Figure 5 illustrates the challenges of the EUV light generation system 11 in the comparative example. For ease of explanation, Figure 5 shows only the optical axis control of the pre-pulse laser beam 31a. The same applies to the optical axis control of the main-pulse laser beam 31b.

[0063] During the irradiation period TA, the temperature of the optical elements in the laser light transmission device 50 rises due to the pre-pulse laser light 31a and the main-pulse laser light 31b, causing thermal load deformation in the optical elements. For example, wavefront distortion occurs in the optical elements as a thermal load deformation. During the irradiation period TA, the EUV light generation processor 5a performs optical axis control, controlling the angles of the reflection control mirrors 51 and 52 to correct the deviation of the optical performance from the target value caused by thermal load deformation.

[0064] When the irradiation period TA ends and the rest period TB begins, the temperature of the optical elements in the laser light transmission device 50 decreases, and as the temperature decreases, the thermal load deformation returns to normal. For example, the wavefront distortion of the optical elements decreases as the temperature decreases. However, since optical axis control is not performed during the rest period TB, the angles of the reflection control mirrors 51 and 52 are maintained at angles that take into account the thermal load deformation at the end of the irradiation period TA.

[0065] Then, when the pause period TB ends and the irradiation period TA begins, immediately after irradiation resumes, even though the thermal load deformation has returned to normal, the angles of the reflection control mirrors 51 and 52 remain at the angle that takes into account the thermal load deformation at the end of the previous irradiation period TA. As a result, the pre-pulse laser beam 31a and the main-pulse laser beam 31b are incident on the laser beam focusing optical system 60 with optical performance deviating from the target value. Consequently, the pre-pulse laser beam 31a is not properly irradiated onto the primary target, and furthermore, the main-pulse laser beam 31b is not properly irradiated onto the secondary target.

[0066] Therefore, the EUV light generation system 11 in the comparative example has the problem that stable EUV light 33 is not generated immediately after transitioning from the rest period TB to the irradiation period TA.

[0067] 3. EUV light generation system according to the first embodiment The EUV light generation system 11 according to the first embodiment will now be described. Components similar to those described above will be denoted by the same reference numerals, and redundant descriptions will be omitted unless otherwise specified.

[0068] 3.1 Configuration The configuration of the EUV light generation system 11 according to the first embodiment is the same as that of the EUV light generation system 11 according to the comparative example. In the first embodiment, the EUV light generation processor 5a performs optical axis control even during the idle period TB. Hereinafter, optical axis control during the idle period TB will also be referred to as idle optical axis control.

[0069] 3.2 Operation The operation of the EUV light generation system 11 according to the first embodiment will now be described. The operation of the EUV light generation system 11 according to the first embodiment is the same as that of the EUV light generation system 11 according to the comparative example, except for the optical axis control by the EUV light generation processor 5a.

[0070] Figure 6 shows the flow of optical axis control according to the first embodiment. In the first embodiment, if the EUV photogeneration processor 5a determines in step S10 that the current time is not the irradiation period TA, it executes steps S20 and S30 instead of step S12 shown in Figure 4. In step S20, the EUV photogeneration processor 5a performs pause optical axis control of the prepulse laser beam 31a. In step S30, the EUV photogeneration processor 5a performs pause optical axis control of the main pulse laser beam 31b. As will be described in detail later, pause optical axis control is a control that changes the angles of the reflection control mirrors 51 and 52 to counteract the change in the optical axis due to the return of thermal load deformation during the pause period TB. The EUV photogeneration processor 5a changes the angles of the reflection control mirrors 51 and 52 at regular intervals.

[0071] Figure 7 shows the flow of optical axis control during pause of prepulse laser light 31a. In step S21, the EUV photogeneration processor 5a determines whether the current time is immediately after the start of the pause period TB. If the EUV photogeneration processor 5a determines that it is immediately after the start of the pause period TB, it proceeds to step S22; otherwise, it proceeds to step S23. Note that "immediately after the start of the pause period TB" refers to the time when the process in step S21 is performed for the first time after the start of the pause period TB.

[0072] In step S22, the EUV light generation processor 5a adjusts the angle M of the reflection control mirror 51 at the end of the preceding irradiation period TA. c1a Load the data. Here, angle M c1a This is the command value of the angle that the EUV light generation processor 5a gave to the reflection control mirror 51 at the end of the immediately preceding irradiation period TA.

[0073] In step S23, the EUV light generation processor 5a reads the elapsed time t from the start of the pause period TB from a timer (not shown).

[0074] In step S24, the EUV light generation processor 5a applies the angle M read in step S22 c1a and the elapsed time t read in step S23 to the following formula (1) to calculate the correction angle θ 1a

[0075]

Equation

[0076] Here, M i1a is the angle of the reflection control mirror 51 at cold time. Note that the angle M<00​​​​​​​​​​​​​​​​​​​​​​​​ In step S32, the EUV light generation processor 5a adjusts the angle M of the reflection control mirror 52 at the end of the preceding irradiation period TA. c1b The data is read. In step S34, the EUV light generation processor 5a reads the angle M in step S32. c1b Then, by applying the elapsed time t read in step S33 to the following equation (2), the correction angle θ is obtained. 1b Calculate.

[0080]

number

[0081] Here, M i1b τ is the angle of the reflection control mirror 52 when cold. 1b This is the time constant obtained by the method described later. Equation (2) above is the decay curve corresponding to the change in the optical axis of the main pulse laser beam 31b during the pause period TB. Note that the correction angle θ 1b This corresponds to the "first correction angle" relating to the technology of this disclosure. Also, the time constant τ 1b This corresponds to the "first time constant" relating to the technology of this disclosure.

[0082] In step S35, the EUV light generation processor 5a corrects the angle of the reflection control mirror 52 to an angle θ 1b This will be changed. Other aspects are the same as the optical axis control of the prepulse laser beam 31a described above.

[0083] 3.3 Action and Effects Figure 9 illustrates the operation of the EUV light generation system 11 according to the first embodiment. For the sake of explanation, Figure 9 shows only the optical axis control of the pre-pulse laser beam 31a and the optical axis control during pause. The same applies to the optical axis control of the main pulse laser beam 31b and the optical axis control during pause.

[0084] Similar to the comparative example, during the irradiation period TA, the EUV light generation processor 5a performs optical axis control by controlling the angles of the reflection control mirrors 51 and 52 to compensate for deviations from the target value of optical performance caused by thermal load deformation.

[0085] When the irradiation period TA ends and the system transitions to the rest period TB, the EUV light generation processor 5a performs rest-time optical axis control by changing the angles of the reflection control mirrors 51 and 52 to compensate for the change in the optical axis caused by the return of thermal load deformation.

[0086] Then, when the pause period TB ends and the irradiation period TA begins, irradiation is resumed. In this embodiment, since optical axis control is performed during the pause period TB, even immediately after irradiation resumes, the pre-pulse laser beam 31a and the main-pulse laser beam 31b are incident on the laser beam focusing optical system 60 with their optical performance maintained at the target value. As a result, the pre-pulse laser beam 31a is properly irradiated onto the primary target, and furthermore, the main-pulse laser beam 31b is also properly irradiated onto the secondary target.

[0087] Therefore, the EUV light generation system 11 according to the first embodiment can generate stable EUV light 33 even immediately after transitioning from the rest period TB to the irradiation period TA.

[0088] 3.4 How to determine the time constant Next, the time constant τ 1a The method for determining this will be explained. The angle M of the reflection control mirror 51 when the thermal load deformation is saturated after operating the EUV light generation system 11. c1a The command value for the angle of the reflection control mirror 51 at the end of the irradiation period TA is determined as angle M. c1a Let's assume that.

[0089] To measure the change in the optical axis during the pause, the position of the optical axis is measured by the first optical axis sensor 72 while outputting a pre-pulse laser beam 31a with a low duty cycle. The low duty cycle is used to prevent thermal load deformation of the reflection control mirror 51. For example, the repetition frequency is set to 20 kHz and the duty cycle to 2%. For example, the duty cycle is set to 2% by setting the on period of the burst pulse to 250 ms and the off period to 12250 ms.

[0090] Measurement by the first optical axis sensor 72 is continued until the position of the optical axis stops changing (cold state). Here, the amount of change in the position of the optical axis ΔPL pos and the angle change amount ΔM of the reflection control mirror 51 pos There is a linear relationship between them, as shown in equation (3) below, where A is the coefficient.

[0091]

number

[0092] Using equation (3) above, the change in the position of the optical axis measured by the first optical axis sensor 72 is converted into the angle of the reflection control mirror 51. This conversion calculates the angle of the reflection control mirror 51 when cold, and the calculated value is given by angle M. i1a Let's assume that.

[0093] Next, the horizontal axis represents the elapsed time t since the start of the low-duty output, and the angle M of the reflection control mirror 51. h1a Create a graph with angle M as the vertical axis. h1a This is the value obtained by converting the position of the optical axis measured by the first optical axis sensor 72 using the above equation (3) into the angle of the reflection control mirror 51. Figure 10 shows an example of the created graph. And the angle M with respect to elapsed time t h1a The change is approximated by the damping curve in equation (4) below.

[0094]

number

[0095] The τ obtained by this approximation 1a However, the time constant τ 1a This is the time constant τ. 1a , angle M c1a , and angle M i1a Equation (1) above is determined using this.

[0096] Note that the angle change amount of the optical axis is ΔPL. poi and the angle change amount ΔM of the reflection control mirror 51 poi There is a linear relationship between them, as shown in equation (5) below, where B is the coefficient.

[0097]

number

[0098] When the first optical axis sensor 72 measures the angle of the optical axis, the change in the optical axis angle measured by the first optical axis sensor 72 can be converted to the angle of the reflection control mirror 51 using the above equation (5).

[0099] Also, the time constant τ 1b is the time constant τ 1a Since it can be obtained using a similar method, the explanation will be omitted.

[0100] 3.5 Modified Examples of the First Embodiment Next, a modified example of the first embodiment will be described. In the first embodiment, the EUV light generation processor 5a has a correction angle θ 1a The above formula (1) is used to calculate the correction angle θ, but in this modified example, the below formula (6) is used to correct the correction angle θ. 1a Calculate.

[0101]

number

[0102] Here, τ 1ai is the time constant. i is a positive integer between 1 and n. C i is the time constant τ 1aiThe coefficient of contribution is such that it satisfies the relationship shown in equation (7) below.

[0103]

number

[0104] In this modified example, the time constant τ 1a This is a set of multiple time constants τ 1ai This includes multiple time constants τ. Equation (6) above is a multiple time constant τ 1ai This is a function obtained by adding up multiple damping curves represented by [formula].

[0105] Multiple time constants τ 1ai When calculating each of these, instead of equation (4) above, use the damping curve in equation (8) below, and the elapsed time t and angle M. h1a We just need to approximate the relationship between them.

[0106]

number

[0107] The above is the correction angle θ. 1a We have explained how to calculate the correction angle θ. 1b A similar transformation can be applied to the calculation of .

[0108] According to this modified example, the approximation error of the damping curve can be reduced, so the correction angle θ 1a ,θ 1b This allows for more accurate calculation. As a result, the pre-pulse laser light 31a and the main-pulse laser light 31b can be appropriately irradiated onto the primary and secondary targets, and a more stable EUV light 33 can be generated immediately after irradiation is resumed.

[0109] 4. EUV light generation system according to the second embodiment Next, the EUV light generation system 11A according to the first embodiment will be described. Components similar to those described above will be denoted by the same reference numerals, and redundant explanations will be omitted unless otherwise specified.

[0110] 4.1 Configuration Figure 11 shows the configuration of the EUV light generation system 11 according to the second embodiment. The configuration of the laser light transmission device 50 and the beam sensor 70 in the EUV light generation system 11 according to the second embodiment differs from that of the EUV light generation system 11 according to the first embodiment.

[0111] In the laser light transmission device 50 according to the second embodiment, a reflection control mirror 58 is provided in place of the high-reflection mirror 53, and a reflection control mirror 59 is provided in place of the high-reflection mirror 54. The reflection control mirror 58 is provided downstream of the reflection control mirror 51 in the propagation direction of the pre-pulse laser light 31a. The reflection control mirror 59 is provided downstream of the reflection control mirror 52 in the propagation direction of the main-pulse laser light 31b. The other configurations are the same as those of the laser light transmission device 50 according to the first embodiment.

[0112] In this embodiment, the reflection control mirror 51 is referred to as the "first reflection control mirror 51," and the reflection control mirror 58 is referred to as the "second reflection control mirror 58." Also, the reflection control mirror 52 is referred to as the "first reflection control mirror 52," and the reflection control mirror 59 is referred to as the "second reflection control mirror 59."

[0113] The second reflection control mirror 58 includes a high-reflection mirror 581 and a stage 582. The high-reflection mirror 581 is mounted on the stage 582 and positioned where the pre-pulse laser light 31a reflected by the first reflection control mirror 51 is incident. The second reflection control mirror 59 includes a high-reflection mirror 591 and a stage 592. The high-reflection mirror 591 is mounted on the stage 592 and positioned where the main-pulse laser light 31b reflected by the first reflection control mirror 52 is incident.

[0114] In the beam sensor 70 according to the second embodiment, in addition to the beam splitter 71, beam splitters 81 and 82 are provided. Furthermore, the beam sensor 70 is provided with a first position sensor 83 and a first angle sensor 84 instead of the first optical axis sensor 72, and with a second position sensor 85 and a second angle sensor 86 instead of the second optical axis sensor 73. The first position sensor 83 and the second optical axis sensor 73 are each configured to include, for example, two lenses and one CCD (Charge Coupled Device) camera. The first angle sensor 84 and the second angle sensor 86 are each configured to include, for example, one lens and one CCD camera.

[0115] In this embodiment, the beam sensor 70 measures a first optical performance and a second optical performance. The first optical performance is the "position of the optical axis," and the second optical performance is the "angle of the optical axis." In this embodiment, the angles of the first reflection control mirrors 51 and 52 are controlled so that the first optical performance is a first target value. The angles of the second reflection control mirrors 58 and 59 are controlled so that the second optical performance is a second target value.

[0116] The beam sensor 70 measures the first and second optical performance of the pulsed laser beam 31 immediately before it enters the chamber 2, so that the pulsed laser beam 31 enters the chamber 2 with the target first and second optical performance. In this embodiment, the beam sensor 70 measures the first and second optical performance of the pulsed laser beam 31 immediately before it enters the laser beam focusing optical system 60.

[0117] 4.2 Operation The operation of the EUV light generation system 11 according to the second embodiment will now be described. In this embodiment, the prepulse laser light 31a incident on the laser light transmission device 50 is reflected by the first reflection control mirror 51, the second reflection control mirror 58, the combiner element 56, and the beam splitter 57, and then incident on the laser light focusing optical system 60. The main pulse laser light 31b incident on the laser light transmission device 50 is reflected by the first reflection control mirror 52, the second reflection control mirror 59, and the high-reflection mirror 55, passes through the combiner element 56, and is reflected by the beam splitter 57, and then incident on the laser light focusing optical system 60.

[0118] The prepulse laser light 31a that has passed through the beam splitter 57 is incident on the beam sensor 70, reflected by the beam splitter 71, and incident on the beam splitter 81. A portion of the prepulse laser light 31a passes through the beam splitter 81 and is incident on the first position sensor 83, while another portion is reflected by the beam splitter 81 and is incident on the first angle sensor 84. The first position sensor 83 measures the position of the optical axis of the prepulse laser light 31a and outputs the measured value to the EUV light generation processor 5a. The first angle sensor 84 measures the angle of the optical axis of the prepulse laser light 31a and outputs the measured value to the EUV light generation processor 5a.

[0119] The main pulse laser beam 31b, having passed through the beam splitter 57, enters the beam sensor 70, passes through the beam splitter 71, and enters the beam splitter 82. A portion of the main pulse laser beam 31b passes through the beam splitter 82 and enters the second position sensor 85, while another portion is reflected by the beam splitter 82 and enters the second angle sensor 86. The second position sensor 85 measures the position of the optical axis of the main pulse laser beam 31b and outputs the measured value to the EUV light generation processor 5a. The second angle sensor 86 measures the angle of the optical axis of the main pulse laser beam 31b and outputs the measured value to the EUV light generation processor 5a.

[0120] The EUV light generation processor 5a controls the angle of the first reflection control mirror 51 so that the position of the optical axis measured by the first position sensor 83 becomes a first target value, and controls the angle of the second reflection control mirror 58 so that the angle of the optical axis measured by the first angle sensor 84 becomes a second target value. In this embodiment, the position of the optical axis of the prepulse laser beam 31a is adjusted by the upstream first reflection control mirror 51, and the angle of the optical axis of the prepulse laser beam 31a is adjusted by the downstream second reflection control mirror 58.

[0121] The EUV light generation processor 5a controls the angle of the first reflection control mirror 52 so that the position of the optical axis measured by the second position sensor 85 becomes a first target value, and controls the angle of the second reflection control mirror 59 so that the angle of the optical axis measured by the second angle sensor 86 becomes a second target value. In this embodiment, the position of the optical axis of the main pulse laser beam 31b is adjusted by the upstream first reflection control mirror 52, and the angle of the optical axis of the main pulse laser beam 31b is adjusted by the downstream second reflection control mirror 59.

[0122] The EUV light generation processor 5a changes the angles of the first reflection control mirrors 51, 52 and the second reflection control mirrors 58, 59 at regular intervals.

[0123] Figure 12 shows the flow of optical axis control according to the second embodiment. The optical axis control according to the second embodiment differs from the first embodiment in that the position and angle of the optical axis are controlled in step S11. In addition, in the optical axis control according to the second embodiment, the EUV photogeneration processor 5a executes steps S40 and S50 instead of steps S20 and S30 shown in Figure 6.

[0124] Figure 13 shows the flow of optical axis control during pause of prepulse laser light 31a. In step S41, the EUV photogeneration processor 5a determines whether the current time is immediately after the start of the pause period TB. If the EUV photogeneration processor 5a determines that it is immediately after the start of the pause period TB, it proceeds to step S42; otherwise, it proceeds to step S43.

[0125] In step S42, the EUV light generation processor 5a adjusts the angle M of the first reflection control mirror 51 at the end of the preceding irradiation period TA. c1a and the angle M of the second reflection control mirror 58 c2a The data is read. In step S43, the EUV photogenerating processor 5a reads from the timer the elapsed time t from the start of the rest period TB.

[0126] In step S44, the EUV light generation processor 5a reads the angle M in step S42. c1a Then, by applying the elapsed time t read in step S43 to the first damping curve represented by the above equation (1) described in the first embodiment, the correction angle θ is obtained. 1a Calculate the correction angle θ below. 1a The first correction angle θ 1a " and the time constant τ 1a The first time constant τ 1a " and the first time constant τ 1a This is the time constant related to the change in the position of the optical axis, calculated using the measurement values ​​from the first position sensor 83.

[0127] In step S45, the EUV light generation processor 5a reads the angle M in step S42. c2a Then, by applying the elapsed time t read in step S43 to the second damping curve represented by equation (9) below, the second correction angle θ is obtained. 2a Calculate.

[0128]

number

[0129] Here, M i2a τ is the angle of the second reflection control mirror 58 during cold conditions. 2a This is the second time constant obtained by the method described above. The second time constant τ 2a This is the time constant related to the change in the angle of the optical axis, calculated using the measurement value from the first angle sensor 84. Equation (9) above is the attenuation curve corresponding to the change in the angle of the optical axis of the prepulse laser light 31a during the pause period TB.

[0130] In step S46, the EUV light generation processor 5a adjusts the angle of the first reflection control mirror 51 to a first correction angle θ. 1a The angle of the second reflection control mirror 58 is changed to the second correction angle θ. 2a Change it.

[0131] Figure 14 shows the flow of optical axis control during pause of the main pulse laser beam 31b. Steps S51 to S56 shown in Figure 8 perform the same processing as steps S41 to S46 shown in Figure 13.

[0132] In step S52, the EUV light generation processor 5a adjusts the angle M of the first reflection control mirror 52 at the end of the preceding irradiation period TA. c1b and the angle M of the second reflection control mirror 59 c2b Load the data.

[0133] In step S54, the EUV light generation processor 5a reads the angle M in step S52. c1b Then, by applying the elapsed time t read in step S53 to the first damping curve represented by equation (2) described in the first embodiment, the correction angle θ is obtained. 1b Calculate the correction angle θ below. 1b The first correction angle θ 1b " and the time constant τ 1b The first time constant τ 1b " and the first time constant τ 1b This is the time constant related to the change in the position of the optical axis, calculated using the measurement values ​​from the second position sensor 85.

[0134] In step S55, the EUV light generation processor 5a reads the angle M in step S52. c2b Then, by applying the elapsed time t read in step S53 to the second damping curve represented by the following equation (10), the second correction angle θ is obtained. 2b Calculate.

[0135]

number

[0136] Here, M i2b τ is the angle of the second reflection control mirror 59 during cold conditions. 2b This is the second time constant obtained by the method described above. The second time constant τ 2b This is the time constant related to the change in the angle of the optical axis, calculated using the measurement value from the second angle sensor 86. Equation (10) above is the attenuation curve corresponding to the change in the angle of the optical axis of the main pulse laser light 31b during the pause period TB.

[0137] 4.3 Action and Effects Figure 15 illustrates the operation of the EUV light generation system 11 according to the second embodiment. For the sake of explanation, Figure 15 shows only the optical axis control of the pre-pulse laser beam 31a and the optical axis control during pause. The same applies to the optical axis control of the main pulse laser beam 31b and the optical axis control during pause.

[0138] In this embodiment, during the irradiation period TA, optical axis control is performed by controlling the angles of the first reflection control mirrors 51 and 52 and the angles of the second reflection control mirrors 58 and 59 to correct deviations from target values ​​of the optical axis position and angle caused by thermal load deformation.

[0139] When the irradiation period TA ends and the system transitions to the rest period TB, the EUV light generation processor 5a performs rest-time optical axis control by changing the angles of the first reflection control mirrors 51, 52 and the second reflection control mirrors 58, 59 to compensate for the changes in the position and angle of the optical axis due to the return of thermal load deformation.

[0140] Then, when the pause period TB ends and the irradiation period TA begins, irradiation is resumed. In this embodiment, pause-time optical axis control is performed to cancel out changes in the position and angle of the optical axis during the pause period TB, so that the pre-pulse laser light 31a and the main pulse laser light 31b can be appropriately irradiated to the primary target and the secondary target, and a more stable EUV light 33 can be generated immediately after irradiation resumes.

[0141] Furthermore, modifications similar to those of the first embodiment can also be applied to the second embodiment. This reduces the approximation error of the first and second attenuation curves, making it possible to generate even more stable EUV light 33 immediately after resuming irradiation.

[0142] 5. Others Figure 16 schematically shows the configuration of an exposure apparatus 6a connected to an EUV light generation system 11. In Figure 16, the exposure apparatus 6a, as an external device 6, includes a mask irradiation unit 100 and a workpiece irradiation unit 102. The mask irradiation unit 100 illuminates the mask pattern on the mask table MT via a reflective optical system with EUV light 33 incident from the EUV light generation system 11. The workpiece irradiation unit 102 images the EUV light 33 reflected by the mask table MT onto a workpiece (not shown) placed on a workpiece table WT via a reflective optical system. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with photoresist. The exposure apparatus 6a exposes the workpiece with EUV light 33 reflecting the mask pattern by synchronously moving the mask table MT and the workpiece table WT in parallel. By transferring a device pattern to a semiconductor wafer through the exposure process described above, an electronic device can be manufactured.

[0143] Figure 17 schematically shows the configuration of the inspection device 6b connected to the EUV light generation system 11. In Figure 17, the inspection device 6b, as an external device 6, includes an illumination optical system 110 and a detection optical system 112. The EUV light generation system 11 outputs EUV light 33 to the inspection device 6b as an inspection light source. The illumination optical system 110 reflects the EUV light 33 incident from the EUV light generation system 11 and irradiates the mask 116 placed on the mask stage 114. The mask 116 here includes mask blanks before a pattern is formed. The detection optical system 112 reflects the EUV light 33 from the illuminated mask 116 and images it onto the light-receiving surface of the detector 118. The detector 118, having received the EUV light 33, acquires an image of the mask 116. The detector 118 is, for example, a TDI (Time Delay Integration) camera. The image of the mask 116 obtained through the above process is used to inspect for defects in the mask 116, and the results of the inspection are used to select a mask suitable for the manufacture of an electronic device. Then, the pattern formed on the selected mask is exposed and transferred onto a photosensitive substrate using an exposure apparatus 6a, thereby enabling the manufacture of an electronic device.

[0144] The above description is intended to be illustrative and not restrictive. It will therefore be apparent to those skilled in the art that modifications can be made to each embodiment of this disclosure without departing from the scope of the attached claims.

[0145] Terms used throughout this specification and the accompanying claims should be interpreted as “non-limiting” terms. For example, the terms “includes” or “contains” should be interpreted as “not limited to what is described as included.” The term “has” should be interpreted as “not limited to what is described as having.” Furthermore, the modifying phrase “one” as used throughout this specification and the accompanying claims should be interpreted as “at least one” or “one or more.” Also, the term “at least one of A, B, and C” should be interpreted as “A,” “B,” “C,” “A+B,” “A+C,” “B+C,” or “A+B+C,” and further, should be interpreted as including combinations of these with anything other than “A,” “B,” and “C.”

Claims

1. An EUV light generation system that generates EUV light by irradiating a target with pulsed laser light to create a plasma, Chamber and, A target supply device that supplies the target to the plasma generation region within the chamber, A laser device that outputs the pulsed laser light, A beam sensor that measures either the position or angle of the optical axis of the pulsed laser beam as the first optical performance, A first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value, The laser device comprises a processor that controls the laser device so that the pulsed laser light is irradiated onto the target, During a pause period in which the output of the pulsed laser light is suspended, the processor calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror during the cold period, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle. EUV light generation system.

2. An EUV light generation system according to claim 1, The pulsed laser light includes pre-pulsed laser light.

3. An EUV light generation system according to claim 1, The pulsed laser light includes the main pulsed laser light.

4. An EUV light generation system according to claim 1, The processor changes the angle of the first reflection control mirror at regular intervals.

5. An EUV light generation system according to claim 1, The angle of the first reflection control mirror at the end of the immediately preceding irradiation period is M. ｃ１ , the angle of the first reflection control mirror during cold conditions is M ｉ１ , where t is the elapsed time and τ is the first time constant １ , the first correction angle is θ １ In this case, the first damping curve is represented by the following equation (1). [Math 1]

6. An EUV light generation system according to claim 1, The first time constant is a plurality of time constants τ １ｉ Includes, Let the angle of the first reflection control mirror at the end of the immediately preceding irradiation period be M ｃ１ and the angle of the first reflection control mirror when cold be M ｉ１ Let the elapsed time be t, the first correction angle be θ １ ; Let the time constant be τ １ｉ and the contribution coefficient be C ｉ In this case, the first attenuation curve is represented by the following formula (2). [Math 2]

7. An EUV light generation system according to claim 1, In addition to the first optical performance, the beam sensor measures the other of the position and angle of the optical axis as a second optical performance. A second reflection control mirror is provided downstream of the first reflection control mirror in the propagation direction of the pulsed laser light, and its angle is controlled so that the second optical performance becomes a second target value. During the pause period, the processor calculates a second correction angle based on a second decay curve determined by the angle of the second reflection control mirror at the end of the previous irradiation period, the angle of the second reflection control mirror during the cold period, the elapsed time, and a second time constant, and changes the angle of the second reflection control mirror to the second correction angle.

8. An EUV light generation system according to claim 7, The first optical performance is the position of the optical axis, The second optical performance is the angle of the optical axis.

9. An EUV light generation system according to claim 7, The pulsed laser light includes pre-pulsed laser light.

10. An EUV light generation system according to claim 7, The pulsed laser light includes the main pulsed laser light.

11. An EUV light generation system according to claim 7, The processor changes the angle of the second reflection control mirror at regular intervals.

12. An EUV light generation system according to claim 7, The angle of the second reflection control mirror at the end of the immediately preceding irradiation period is M. ｃ２ , the angle of the second reflection control mirror during cold conditions is M ｉ２ , where the elapsed time is t and the second time constant is τ １ , the second correction angle is θ ２ In this case, the second damping curve is represented by the following equation (3). [Math 3]

13. An EUV light generation system according to claim 1, The beam sensor measures the first optical performance of the pulsed laser light immediately before it enters the chamber.

14. An EUV light generation system according to claim 7, The beam sensor measures the first and second optical performance of the pulsed laser light immediately before it enters the chamber.

15. A method for manufacturing electronic devices, Chamber and, A target supply device that supplies a target to the plasma generation region within the chamber, A laser device that emits pulsed laser light, A beam sensor that measures either the position or angle of the optical axis of the pulsed laser beam as the first optical performance, A first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value, The laser device comprises a processor that controls the laser device so that the pulsed laser light is irradiated onto the target, During a pause period in which the output of the pulsed laser light is suspended, the processor calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror during the cold period, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle. EUV light is generated by an EUV light generation system, The aforementioned EUV light is output to the exposure apparatus, To manufacture an electronic device, expose a photosensitive substrate to EUV light in the exposure apparatus. A method for manufacturing electronic devices including

16. A method for manufacturing electronic devices, Chamber and, A target supply device that supplies a target to the plasma generation region within the chamber, A laser device that emits pulsed laser light, A beam sensor that measures either the position or angle of the optical axis of the pulsed laser beam as the first optical performance, A first reflection control mirror whose angle is controlled so that the first optical performance becomes a first target value, The laser device comprises a processor that controls the laser device so that the pulsed laser light is irradiated onto the target, During a pause period in which the output of the pulsed laser light is suspended, the processor calculates a first correction angle based on a first decay curve determined by the angle of the first reflection control mirror at the end of the immediately preceding irradiation period, the angle of the first reflection control mirror during the cold period, the elapsed time from the start of the pause period, and a first time constant, and changes the angle of the first reflection control mirror to the first correction angle. The mask is irradiated with EUV light generated by the EUV light generation system to inspect for defects in the mask. Using the results of the above inspection, select a mask. The pattern formed on the selected mask is exposed and transferred onto a photosensitive substrate. A method for manufacturing electronic devices including

Images