socket

Abstract

To provide a socket which reduces the kinds of components and improves mounting position accuracy of an electronic component.SOLUTION: A socket 10 comprises a housing 20, a number of contacts (not shown in the figure) and a spring member 30. The housing 20 is a mold in which a bottom plate part 21 and a frame body part 22 are integrally molded from the same material. A plurality of contact support holes (Not shown in the figure) penetrating a first face 211 and a second face 212 is arrayed on the bottom plate part 21 and contacts are inserted one by one. The frame body part 22 is erected at an edge of the first face 211, extends along the edge and is in charge of positioning the first face 211 in an in-plane direction when mounting an electronic component. The spring member 30 includes a supported part 31 and a spring part 32. The supported part 31 is supported by a support part 226 provided on a first side of the frame body part 22. The spring part 32 is pushed and elastically deformed by the mounted electronic component and presses the electronic component to a second side opposed with the first side.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a socket on which an electronic component having contact pads two-dimensionally arranged on the bottom surface is mounted.

Background Art

[0002] When mounting large-scale electronic components on a circuit board, they are often mounted via a socket rather than directly soldered to the circuit board. That is, the socket is placed on the circuit board, and an electronic component is often mounted on the socket. In the socket, a number of contacts that contact each of the contact pads arranged on the bottom surface of the electronic component are arranged so as to protrude from the first surface of the flat housing.

[0003] Here, Patent Document 1 discloses a socket having a structure in which a frame body that extends along the edge of a flat housing and contacts the side surface of an electronic component mounted thereon to position the electronic component is attached to the flat housing on which a number of contacts are arranged. In the socket of this Patent Document 1, a spring member is arranged on one side of the frame body, and the mounting position accuracy of the electronic component is improved by pressing the mounted electronic component against the side opposite to the side on which the spring member is arranged.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The socket of the above-mentioned Patent Document 1 has a structure in which a frame body is attached to a flat housing. Therefore, it is necessary to consider the tolerance of the attachment of the frame body to the housing, and due to that tolerance, a decrease in the mounting position accuracy of the electronic component cannot be avoided.

[0006] Furthermore, in the socket described in Patent Document 1, the electronic component cannot be directly pressed against the first surface of the housing. Instead, a seating member must be placed on top of the housing to mount the electronic component at an appropriate distance from the housing. As a result, the positional accuracy of the electronic component in the height direction is reduced by the tolerance of the height of the seating member.

[0007] Furthermore, in the socket described in Patent Document 1, solder balls must be arranged on the second surface of the housing, and it is not possible to bring the second surface of the housing and the circuit board to be soldered into close contact. Therefore, it is necessary to place a standoff member on the second surface of the housing to maintain an appropriate distance between the second surface of the housing and the circuit board.

[0008] Thus, the socket described in Patent Document 1 has a structure with many types of parts and many assembly steps.

[0009] In view of the above circumstances, the present invention aims to provide a socket that reduces the number of parts and improves the mounting position accuracy of electronic components. [Means for solving the problem]

[0010] The socket of the present invention, which achieves the above objective, A housing integrally molded comprising a flat base plate having a first and second surface parallel to each other and a plurality of contact support holes arranged through the first and second surfaces, and a frame portion erected on the edge of the first surface of the base plate and extending along that edge, which serves to position the first surface in the in-plane direction when mounting an electronic component having a plurality of contact pads formed on its lower surface. Numerous contacts are supported on the bottom plate while inserted into the contact support holes, and The device is characterized by comprising a spring member having a supported portion supported by a first side of the frame and a spring portion that is elastically deformed when pressed by the mounted electronic component, pressing the electronic component against a second side facing the first side.

[0011] The socket of the present invention has a housing in which the bottom plate portion and the frame portion are integrally molded. This reduces the number of parts and improves the mounting accuracy of electronic components by pressing the second side with a spring member.

[0012] In the socket of the present invention, it is preferable that the housing has a recess on the first surface of the bottom plate portion where the spring member is placed, and that the spring member is supported by the frame portion such that a part of the spring member fits into the recess.

[0013] By adopting a structure that has the aforementioned recess and supports the spring member in a state where a part of the spring is inserted into the recess, even thin electronic components can be pressed against the second side with sufficient spring force.

[0014] Furthermore, in the socket of the present invention, The contact has an insertion portion that is inserted into a contact support hole, a first contact portion that protrudes to the first surface side and is responsible for contacting electronic components, and a second contact portion that protrudes to the second surface side and is responsible for contacting the circuit board. Preferably, the bottom plate has a first recess on the first surface side that accommodates a first contact portion that is elastically deformed by being pressed by mounted electronic components, and a second recess on the second surface side that accommodates a second contact portion that is elastically deformed by being pressed by a circuit board.

[0015] By adopting this structure, the bottom surface of the electronic component can be directly pressed against the first surface of the base plate, and the second surface of the base plate can be directly pressed against the circuit board. Therefore, by adopting this structure, the seating member and standoff member described in Patent Document 1 above become unnecessary, and the number of types of components can be further reduced.

[0016] Here, in the socket of the present invention, A spring member having a shape in which it extends to the left and right, has supported portions on both the left and right sides, and has a spring portion in the center, with the spring portion protruding from the supported portion toward the second side, It is preferable that the frame portion has a support portion that supports the portion to be supported.

[0017] By making the spring member have this shape, i.e., a double - supported beam - shaped spring member, the spring member can be easily and surely supported by the frame portion.

[0018] Alternatively, the spring member may extend in the left - right direction in a cantilever beam shape and have a spring portion on the free - end side.

Advantages of the Invention

[0019] According to the socket of the present invention as described above, the types of components can be reduced, and the mounting position accuracy of electronic components can be improved.

Brief Description of the Drawings

[0020] [Figure 1] It is a perspective view (A) of a socket as a first embodiment of the present invention and an enlarged view (B) of a portion of circle R1. [Figure 2] It is an exploded perspective view (A) of the socket of the first embodiment and an enlarged view (B) of a portion of circle R2. [Figure 3] It is a plan view (A) of the socket shown in FIG. 1 and an enlarged view (B) of a portion of circle R3. [Figure 4] It is a plan view (A) of a state where an electronic component is mounted on the socket and an enlarged view of a portion of circle R4. [Figure 5] It is an enlarged perspective view (A) of a part of the socket and a cross - sectional view (B) taken along arrow X - X. [Figure 6] It is a plan view (A) showing a part of the bottom plate portion of the housing enlarged and a perspective view (B). [Figure 7] It is a front view (A), a side view (B), and a cross - sectional view (C) taken along arrow Y - Y shown in FIG. 6(A) of the portion of the bottom plate portion of the housing shown in FIG. 6. [Figure 8] It is an enlarged perspective view (A) of a part of the socket corresponding to FIG. 5 of the first embodiment of the socket of the second embodiment and a cross - sectional view (B) taken along arrow Z - Z. [Figure 9] It is a perspective view showing a part of one spring member of the third embodiment. [Figure 10] This is a perspective view showing a portion of one spring member of the fourth embodiment. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below.

[0022] Figure 1 shows a perspective view (A) of a socket as a first embodiment of the present invention and an enlarged view (B) of the circle R1.

[0023] Figure 2 shows an exploded perspective view (A) of the socket of the first embodiment and an enlarged view (B) of the circle R2 portion.

[0024] In Figures 1 and 2, the contact support holes and contacts of the housing are omitted from the illustration.

[0025] The socket 10 comprises a housing 20 and a spring member 30. The housing 20 has a bottom plate portion 21 and a frame portion 22, and these bottom plate portion 21 and frame portion 22 are molded integrally, preferably from the same material or with the same component composition. However, the bottom plate portion 21 and frame portion 22 may be molded in two colors from different materials or with different component compositions.

[0026] The base plate portion 21 has a first surface 211 and a second surface 212 (see Figure 7) that extend parallel to each other. Only the first surface 211 is shown in Figures 1 and 2. The second surface 212 is the reverse side of the first surface 211. Multiple, for example, as many as 10,000, contact support holes 213 (see Figure 7) are arranged on this base plate portion 21, and one contact 40 is inserted into each of at least one of the multiple contact support holes 213.

[0027] Furthermore, the frame portion 22 is erected on the edge of the first surface 211 of the bottom plate portion 21 and extends along that edge for almost a full circumference. However, notches 221 are formed in two places on the left and right sides where the frame portion 22 is absent, for the convenience of removing the mounted electronic components 50 (see Figure 4).

[0028] This frame portion 22, together with the spring member 30 described below, acts as a positioning element for the in-plane direction of the first surface 211 when mounting the electronic component 50. Furthermore, at least one side of this frame portion 22, preferably two or more sides 223, 225, has inwardly protruding projections 228. The formation of these projections 228 ensures that the electronic component 50 can only be mounted when it is in the correct orientation (see Figure 4).

[0029] Of the four sides of this frame portion 22, at least one, preferably two, spring members 30 are arranged on at least one of the left side 222 and the upper side 223 in Figures 1 and 2. Slit-shaped support portions 226 for supporting the spring members 30 are formed on these sides 222 and 223, corresponding to each spring member 30.

[0030] Furthermore, on the four sides of the frame portion 22, the sides (224, 225) facing the sides (222, 223) where the spring members 30 are located have inwardly bulging receiving portions 227 formed at positions facing each spring member 30. The mounted electronic components 50 are pressed against these receiving portions 227 by the spring members 30.

[0031] The spring member 30 has an overall shape that extends to the left and right, and has supported portions 31 on both the left and right sides that are inserted into and supported by the slit-shaped support portions 226 of the frame portion 22, and has a spring portion 32 in the center that protrudes toward the opposite sides (224, 225). Furthermore, the spring member 30 has a guide portion 33 that rises diagonally so as to rest on the sides (222, 223) of the frame portion 22 on which the spring member 30 is supported, and an extended portion 34 that extends toward the outside of the frame portion 22. Correspondingly, the frame portion 22 has a mounting portion 230 having an inclined surface 231 and an upward-facing surface 232.

[0032] The guide portion 33 has the function of guiding the mounted electronic component 50 into the inside of the frame portion 22, thereby facilitating the mounting of the electronic component 50.

[0033] Figure 3 shows a plan view (A) of the socket shown in Figure 1 and an enlarged view (B) of the circle R3.

[0034] Figure 4 shows a plan view (A) of the socket with electronic components mounted, and an enlarged view of the circle R4.

[0035] As shown in Figure 4(A), the electronic component 50 has a long groove 51 formed at a position corresponding to the projection 228 of the frame portion 22. When mounting the electronic component 50 in the socket 10, the electronic component 50 is mounted in a direction such that the projection 228 of the frame portion 22 fits into the long groove 51 of the electronic component 50, and it is prevented from being mounted in any other incorrect direction.

[0036] Furthermore, as can be seen by comparing Figure 3(B) and Figure 4(B), when the electronic component 50 is mounted, the spring portion 33 of the spring member 30 is pushed toward the edge of the frame portion 22 that supports the spring member 30, causing it to elastically deform. The electronic component 50 is then pushed toward the opposite edge by the reaction force and pressed against the receiving portion 227. As a result, the electronic component 50 is positioned with high precision in the in-plane direction of the first surface 211.

[0037] Here, the sides (222, 223) of the frame portion 22 that support the spring member 30 correspond to an example of the first side as referred to in the present invention, and the sides (224, 225) facing these sides (222, 223) and on which the receiving portion 227 is formed correspond to an example of the second side as referred to in the present invention.

[0038] Figure 5 shows an enlarged perspective view of a part of the socket (A) and a cross-sectional view along arrow XX (B).

[0039] Figure 5(B) shows a cross-section of the spring member 30. Figure 5(B) also shows the contacts 40 protruding vertically from the bottom plate portion 21 of the housing 20. When mounted, the electronic component 50 directly contacts the first surface 211 of the bottom plate portion 21. In contrast, the spring member 30 does not contact the first surface 211, but is positioned slightly above it. Figure 5 will be used for comparison when describing the second embodiment (see Figure 8).

[0040] Figure 6 shows a plan view (A) and a perspective view (B) of a magnified portion of the bottom plate of the housing.

[0041] Figure 7 also shows a front view (A), a side view (B), and a cross-sectional view (C) along the arrow YY shown in Figure 6(A) of the bottom plate portion of the housing. Figure 7(C) shows the lower surface of the electronic component 50 when mounted on the socket 10 and the upper surface of the circuit board 60 when the socket 10 is placed on it, so that the positional relationship with the bottom plate portion 21 of the housing 20 can be seen.

[0042] For example, 10,000 contact support holes 213 are formed in the bottom plate portion 21 of the housing 20, and one contact 40 is inserted into each contact support hole 213 and supported by the wall of the contact support hole 213.

[0043] Each contact 40 has an insertion portion 41 inserted into a contact support hole 213, a first contact portion 42 protruding from the first surface 211 side of the bottom plate portion 21, and a second contact portion 43 protruding from the second surface 212 side of the bottom plate portion 21. The insertion portion 41 is the part that is inserted into the contact support hole 213 and supported by the bottom plate portion 21. The first contact portion 42 is responsible for electrical contact with the electronic component 50 mounted on this socket 10. The second contact portion 43 is responsible for electrical contact with the circuit board 60 on which this socket 10 is placed.

[0044] When the electronic component 50 is mounted in the socket 10, the bottom surface of the electronic component 50 directly contacts the first surface 211 of the bottom plate portion 21. For this reason, a first recess 214 is formed in the bottom plate portion 21 at a position adjacent to the contact support hole 213 on the first surface 211 side. When the electronic component 50 is mounted in the socket 10, the first contact portion 42, which is elastically deformed by being pressed by the mounted electronic component 50, is accommodated in the first recess 214. As a result, there is no need to place a seating member or the like on the bottom plate portion 21 to leave a certain distance between the electronic component 50 and the bottom plate portion 21, and the electronic component 50 is positioned with high precision in the vertical direction as well.

[0045] Similarly, when the socket 10 is placed on the circuit board 60, the second surface 212 of the bottom plate portion 21 directly contacts the circuit board 60. For this reason, a second recess 215 is formed in the bottom plate portion 21 at a position adjacent to the contact support hole 213 on the second surface 212 side. When the socket 10 is placed on the circuit board 60, the second contact portion 43, which is elastically deformed by being pressed by the circuit board 60, is accommodated in the second recess 215.

[0046] This concludes the description of the first embodiment, and the second and subsequent embodiments will now be described. For the second and subsequent embodiments, only the differences from the first embodiment will be illustrated and described. However, the same reference numerals used in the description of the first embodiment will be retained.

[0047] Figure 8 shows an enlarged perspective view (A) of a part of the socket of the second embodiment, corresponding to Figure 5 of the first embodiment, and a cross-sectional view (B) along the arrow ZZ.

[0048] In the first embodiment, as shown in Figure 5(B), the spring member 30 is positioned slightly above the first surface 211 of the base plate 21, without contacting it. In contrast, in this second embodiment, a recess 216 is formed on the first surface 211 of the base plate 21 where the spring member 30 is positioned. The spring member 30 is supported by the frame 22 with a portion of it embedded in the recess 216. The height h2 of the frame 22 from the first surface 211 is lower than the height h1 of the frame 22 in the first embodiment shown in Figure 5. However, the width w of the spring member 32 is the same as the width w of the spring member 32 in the first embodiment.

[0049] In the case of a socket 10 that mounts an electronic component 50 with a thin thickness in the height direction, a socket 10 with a low frame height h2 is adopted. In this case, if a spring member 30 with a narrow width w is used, the spring force may be weakened. Therefore, in this second embodiment, by forming a recess 216 and positioning a part of the spring member 30 to fit into the recess 216, it is possible to use the same spring member 30 as in the first embodiment to ensure sufficient spring force while making a socket 10 with a low frame height 22.

[0050] Figure 9 is a perspective view showing a portion of one spring member of the third embodiment. Here, Figure 9(A) is a perspective view of the spring member 30 supported by the housing 20, and Figure 9(B) is an exploded perspective view.

[0051] The spring member 30 in the first and second embodiments described above is a cantilevered beam-shaped spring member with supported portions 31 on both the left and right sides. However, the spring member 30 in this third embodiment is a cantilevered beam-shaped spring member with a supported portion 31 on one side. For example, as shown in Figure 9, a supported portion 31 is provided on the left side, and a spring portion 32 is provided on the free end side of the frame portion 22, away from the side where the spring member 30 is supported, extending diagonally inward to the right side. An inducting portion 33 is provided above the spring portion 32, oriented diagonally upward.

[0052] In this third embodiment, a slit 233 is formed in the frame portion 22, and a support hole 217 is formed in the bottom plate portion 21 adjacent to the frame portion 22. Correspondingly, the supported portion 31 of the spring member 30 is provided with a bent portion 311 and a protruding portion 312. The spring member 30 is supported by the housing 20 by the bent portion 311 being inserted into the slit 233 and the protruding portion 312 being inserted into the support hole 217. Furthermore, a notch 234 is formed in the frame portion 22 so as not to interfere with the elastic deformation of the spring member 30 when electronic components are mounted on the socket 10.

[0053] Figure 10 is a perspective view showing a portion of one spring member of the fourth embodiment. Here, Figure 10(A) is a perspective view of the spring member 30 supported by the housing 20, and Figure 10(B) is an exploded perspective view.

[0054] In this fourth embodiment, the spring member 30 has a supported portion 31 on the left side of Figure 10, extends to the right along the side of the frame portion 22 where the spring member 30 is supported, and the right free end is further bent inward to form a spring portion 32. Above the spring portion 32, there is a guide portion 33 formed diagonally upward. The support structure of the spring member 30 in this fourth embodiment is the same as that of the third embodiment, and therefore its explanation is omitted.

[0055] As shown in the third embodiment in Figure 9 and the fourth embodiment in Figure 10, the spring member 30 may have a cantilevered beam shape. [Explanation of symbols]

[0056] 10 sockets 20 Housing 21 Bottom plate part 211 Page 1 212 2nd page 213 Contact support holes 214 First recess 215 Second recess 216 Recessed area 217 Support hole 22 Frame body part 221 Notch 222,223,224,225 Sides of the frame 226 Support part 227 Receiving part 228 Protrusion 230 Mounting section 231 Slope 232 Upward-facing surface 233 Slits 234 Notch 30 Spring component 31 Supported part 311 Bent section 312 Protrusion 32 Spring section 33. The enticing part 34 Extension 40 Contacts 41 Insertion part 42 1st contact part 43 Second contact part 50 Electronic Components 51 Long groove 60 Circuit boards

Claims

1. A housing integrally molded comprising a flat bottom plate having a first and second surface parallel to each other and a plurality of contact support holes arranged through the first and second surfaces, and a frame portion erected on the edge of the first surface, extending along the edge, and having a plurality of contact pads formed on its lower surface, which serves to position the electronic component in the in-plane direction of the first surface when it is mounted. Numerous contacts supported on the bottom plate are inserted into the contact support holes, and The spring member comprises a supported portion supported on the first side of the frame, and a spring portion that is elastically deformed when pressed by the mounted electronic component, causing the electronic component to press against the second side facing the first side. The aforementioned spring member is It extends to the left and right, has the supported portion on both the left and right sides, and has the spring portion in the center, and has an inducting portion connected to the spring portion and extending diagonally with respect to the first surface, and an extending portion connected to the inducting portion and extending in a direction intersecting with the spring portion, The frame portion is formed with guide grooves that can guide the extended portion in the direction in which the electronic component is pressed against it. The housing has a recessed portion on the first surface of the bottom plate where the spring member is positioned, which is recessed from the first surface toward the second surface and has a bottom surface between the first surface and the second surface. A socket characterized in that the spring member is supported by the frame such that a part of the spring member is inserted into the recess.

2. The contact has an insertion portion inserted into the contact support hole, a first contact portion that protrudes toward the first surface and is responsible for contacting the electronic component, and a second contact portion that protrudes toward the second surface and is responsible for contacting the circuit board. The bottom plate portion has a first recess on the first surface side for accommodating the first contact portion which is elastically deformed by being pressed by the mounted electronic component, and a second recess on the second surface side for accommodating the second contact portion which is elastically deformed by being pressed by the circuit board, as described in claim 1. The socket.

3. The spring member is a spring member having an extension to the left and right, with the supported portion on both the left and right sides and the spring portion in the center, wherein the spring portion protrudes from the supported portion toward the second side, The socket according to claim 1 or 2, characterized in that the frame portion has a support portion that supports the supported portion.

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