Resin compositions, films, cards, and passports
A resin composition with a specific compound structure addresses eye irritation from antistatic agents, ensuring effective antistatic performance and a safer working environment for manufacturing cards and passports.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- MITSUBISHI CHEM CORP
- Filing Date
- 2022-01-11
- Publication Date
- 2026-04-14
AI Technical Summary
Existing antistatic agents used in resin compositions for cards and passports, such as trihexyltetradecylphosphonium bis(trifluoromethanesulfonyl)imide and tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide, cause eye irritation and deteriorate the working environment during manufacturing due to decomposition at high temperatures.
A resin composition comprising a thermoplastic resin and a compound represented by the general formula (R11)4P+(R12SO2)2N-, where R11 contains 1 to 4 carbon atoms and R12 contains a fluorine atom, with a content of less than 2 parts by mass per 100 parts by mass of resin, which suppresses the generation of eye-irritating compounds even at high temperatures.
The composition provides good antistatic performance without eye irritation, improving the working environment and handling properties, suitable for manufacturing cards and passports.
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Abstract
Description
Technical Field
[0001] The present invention relates to a resin composition used for cards or passports, a film formed from the resin composition, a card, and a passport.
Background Art
[0002] Cards such as credit cards, cash cards, ID cards, tag cards, and insurance cards are generally manufactured by stacking a plurality of resin films, heat-sealing them by heat pressing or the like, and punching them. Similarly, data pages of passports are generally manufactured by stacking a plurality of resin films. Polycarbonate resins, polyester resins, etc. are often used for the resin films used in cards or passports.
[0003] When resin films for cards or passports are transported or stacked on other films, charging may occur, and when heat pressing or the like is performed, they may adhere to the press plate, resulting in a decrease in handling properties. Also, when manufacturing cards, passports, etc., static electricity is likely to be generated when the film is unwound from the roll, and charged films may stick together or misalignment may occur during film alignment, leading to a decrease in handling and processing properties. In addition, floating dust may be attracted by static electricity and adhere to the surface of the film, etc., and there is also a possibility that foreign matter may be mixed into the resulting film, card, or passport. Therefore, a resin composition for forming a resin film for a card or a passport may contain an antistatic agent. As the antistatic agent, for example, as disclosed in Patent Document 1, trihexyltetradecylphosphonium bis(trifluoromethanesulfonyl)imide is known to be used. Patent Document 1 discloses that the above antistatic agent has high dispersibility in a thermoplastic resin, can be sufficiently dispersed in the resin composition, and can lower the surface resistance value of the resin composition.
[0004] In addition, Patent Document 2 discloses that tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide is blended into a resin composition containing a polycarbonate resin.
Prior Art Documents
Patent Documents
[0005]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0006] However, an antistatic agent composed of a salt of a phosphonium cation and a sulfonimide anion may be a factor in deteriorating the working environment. For example, trihexyltetradecylphosphonium bis(trifluoromethanesulfonyl)imide and tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide used in Patent Documents 1 and 2 were found to be factors in irritating the eyes and deteriorating the working environment during the process of manufacturing films and the like, according to the study by the present inventors.
[0007] Therefore, an object of the present invention is to provide a resin composition that has good antistatic performance, causes no irritation to the eyes during the process of manufacturing films and the like, can improve the working environment, and can be suitably used, for example, for cards or passports.
Means for Solving the Problems
[0008] The inventor has studied compounds such as trihexyltetradecylphosphonium bis(trifluoromethanesulfonyl)imide and tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide used in Patent Documents 1 and 2. As a result, it was found that when these compounds are heated at high temperatures, some of them decompose to generate compounds having irritating effects on the eyes, such as trihexylphosphine and 1-dodecene, and the decomposed compounds may be the cause of eye irritation. Therefore, the inventor further studied and found that even a compound composed of a salt of a phosphonium cation and a sulfonimide anion containing a fluorine atom can suppress the generation of compounds having irritating effects on the eyes even when heated without impairing the antistatic property, and thus completed the following invention.
[0009] The present invention provides the following [1] to
[12] . [1] A resin composition for cards or passports, comprising a resin (A) and a compound (B) represented by the following general formula (1). (R 11 , 11 , 12 , , , 11 , , - , 11 , + , 12 )4P + ·(R 12 SO2)2N<00The number of carbon atoms is 1 to 4, and there is one R 11 The number of carbon atoms is 1 to 7. 12 Each of these independently represents a hydrocarbon group containing a fluorine atom. [3] A resin composition comprising a resin (A) and a compound (B) represented by the following general formula (1), wherein the content of compound (B) is less than 2 parts by mass per 100 parts by mass of resin (A). (R 11 )4P + ·(R 12 SO2)2N - (1) (In the above equation (1), R 11 Each of these independently represents a hydrocarbon group, and the three R 11 The number of carbon atoms is 1 to 4, and there is one R 11 The number of carbon atoms is 1 to 7. 12 Each of these independently represents a hydrocarbon group containing a fluorine atom. [4] The resin composition according to [1] or [3] above, wherein the resin (A) comprises at least one of a polycarbonate resin and a polyester resin. [5] The resin composition according to any one of [1], [2], and [4] above, wherein the content of compound (B) is less than 2 parts by mass per 100 parts by mass of resin (A). [6] In the above general formula (1), all R 11 A resin composition according to any of the above [1] to [5], wherein the carbon atoms have 1 to 4 carbon atoms. [7] The resin composition according to any one of [1] to [6] above, wherein the content of compound (B) is 0.1 parts by mass or more and 1 part by mass or less per 100 parts by mass of resin (A). [8] A film comprising a resin layer (I) made of any of the resin compositions described in [1] to [7] above. [9] The film according to [8] above, comprising a middle layer containing resin (A) and two surface layers provided on both sides of the middle layer, wherein the two surface layers are the resin layer (I).
[10] Surface resistance value is 1 × 10 14 The film described in [8] or [9] above, wherein the Ω / □ is less than Ω.
[11] A card comprising the film described in any of [8] to
[10] above.
[12] A passport having one of the films described in any of [8] to
[10] above. [Effects of the Invention]
[0010] According to the present invention, a resin composition can be provided that has good antistatic performance, does not irritate the eyes during the film manufacturing process, improves the working environment, and can be suitably used for, for example, cards or passports. [Modes for carrying out the invention]
[0011] The present invention will be described in detail below with reference to embodiments. However, the present invention is not limited to the embodiments described below. Furthermore, the terms "film" and "sheet" used in the following description are not clearly distinguished, and the term "film" includes "sheet," and the term "sheet" includes "film."
[0012] <Resin composition (I)> The resin composition of the present invention (hereinafter sometimes referred to as "resin composition (I)") contains a resin (A) and a compound (B) having a specific structure described later.
[0013] [Resin (A)] In the present invention, resin (A) is preferably a thermoplastic resin. By using a thermoplastic resin, a film made from the resin composition of the present invention can be used to easily form cards or passports by heat pressing or the like. Furthermore, in the present invention, even if a thermoplastic resin is used as resin (A) and heated during the manufacturing process of the resin composition (I) or during film molding, the use of a compound (B) having a specific structure described later can suppress the decomposition of the antistatic agent and the generation of eye-irritating compounds, thereby improving workability.
[0014] Specific examples of resin (A) include, for example, polycarbonate resin, polyester resin, polyolefin resin, acrylic resin, polystyrene resin, polyamide resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl alcohol resin, ethylene-vinyl alcohol resin, polycycloolefin resin, ethylene vinyl acetate copolymer resin, ethylene (meth)acrylate copolymer resin, polyphenylene ether resin, polyacetal resin, acrylonitrile-butadiene-styrene copolymer resin, polyaryl ether ketone resin, polyimide resin, polyphenylene sulfide resin, polyarylate resin, polysulfone resin, polyethersulfone resin, and fluororesin. These resins may be used individually or in combination of two or more types.
[0015] In one embodiment of the present invention, the resin (A) preferably contains at least one of polycarbonate resin and polyester resin. The resin composition (I) has good durability and processability when it contains at least one of polycarbonate resin and polyester resin. Furthermore, it is more preferable to use polycarbonate resin for resin (A) from the viewpoint of having excellent impact resistance and heat resistance, as well as good bending resistance. Furthermore, when using polycarbonate resin or polyester resin, particularly polycarbonate resin, as resin (A), it is necessary to heat the resin composition (I) to relatively high temperatures during the manufacturing process and film molding. However, even when heated to high temperatures, the use of compound (B), described later, prevents the formation of compounds that are irritating to the eyes due to the antistatic agent. In addition, using polycarbonate resin or polyester resin makes it easier to disperse compound (B), described later, in resin (A), thereby improving the various properties of the resin composition (I).
[0016] (Polycarbonate resin) The polycarbonate resin used in resin (A) is not particularly limited, but examples include bisphenol-based polycarbonate, or polycarbonate resins containing structural units derived from dihydroxy compounds having a part of the structure represented by formula (2) described later. The polycarbonate resin may be used alone, or two or more may be used in combination. Of the polycarbonate resins mentioned above, bisphenol-based polycarbonate is preferred. Using bisphenol-based polycarbonate makes it easier to achieve excellent impact resistance and heat resistance, as well as good bending resistance.
[0017] Bisphenol-based polycarbonate refers to a material in which 50 mol% or more, preferably 70 mol% or more, and more preferably 90 mol% or more of the structural units derived from dihydroxy compounds are derived from bisphenol. Bisphenol-based polycarbonate may be either a homopolymer or a copolymer. Furthermore, bisphenol-based polycarbonate may have a branched structure, a linear structure, or a mixture of a resin with a branched structure and a resin with only a linear structure.
[0018] Specific examples of bisphenols include 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 1,1-bis(4-hydroxyphenyl)-1-phenylethane (bisphenol AP), 2,2-bis(4-hydroxyphenyl)hexafluoropropane (bisphenol AF), 2,2-bis(4-hydroxyphenyl)butane (bisphenol B), bis(4-hydroxyphenyl)diphenylmethane (bisphenol BP), 2,2-bis(3-methyl-4-hydroxyphenyl)propane (bisphenol C), 1,1-bis(4-hydroxyphenyl)ethane (bisphenol E), bis(4-hydroxyphenyl)methane (bisphenol F), 2,2-bis( Examples include 4-hydroxy-3-isopropylphenyl)propane (bisphenol G), 1,3-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (bisphenol M), bis(4-hydroxyphenyl)sulfone (bisphenol S), 1,4-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (bisphenol P), 5,5'-(1-methylethylidene)-bis[1,1'-(bisphenyl)-2-ol]propane (bisphenol PH), 1,1-bis(4-hydroxyphenyl)3,3,5-trimethylcyclohexane (bisphenol TMC), and 1,1-bis(4-hydroxyphenyl)cyclohexane (bisphenol Z). Bisphenols may be used individually or in combination of two or more types.
[0019] As the bisphenol, 2,2-bis(4-hydroxyphenyl)propane, i.e., bisphenol A, is preferably used, but a portion of bisphenol A may be replaced with other bisphenols. In the structural units derived from the dihydroxy compound, the structural units derived from bisphenol A are preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 90 mol% or more, and most preferably 100 mol%. Therefore, bisphenol A homopolycarbonate is the most preferred polycarbonate resin.
[0020] The above-mentioned method for producing bisphenol-based polycarbonates may be any known method, such as the phosgene method (also known as the interfacial polymerization method), the transesterification method, or the pyridine method. For example, the transesterification method is a manufacturing method that involves molten transesterification polymerization of bisphenol and diester carbonate by adding a basic catalyst and an acidic substance to neutralize the basic catalyst. Specific examples of diester carbonates include diphenyl carbonate, ditrile carbonate, bis(chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis(biphenyl) carbonate, diethyl carbonate, dimethyl carbonate, dibutyl carbonate, and dicyclohexyl carbonate, with diphenyl carbonate being particularly preferred.
[0021] Furthermore, as described above, polycarbonate resins may also be used that contain structural units derived from dihydroxy compounds having a portion represented by the following formula (2) in part of their structure (hereinafter sometimes referred to as structural unit (A1)). Polycarbonate resins containing structural unit (A1) can be manufactured from plant-derived raw materials, thereby reducing the environmental impact.
[0022] [ka] However, this excludes cases where the part represented by formula (2) is part of -CH2-OH. That is, the dihydroxy compound is defined as one that contains two hydroxyl groups and at least the part represented by formula (2).
[0023] Dihydroxy compounds having a moiety represented by formula (2) as part of their structure are not particularly limited as long as they have the structure represented by formula (2) in their molecule, but specifically include 9,9-bis(4-(2-hydroxyethoxy)phenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isopropylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isobutylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-tert-butylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isobutylphenyl)fluorene Examples include compounds having aromatic groups in the side chain and ether groups bonded to the aromatic groups in the main chain, such as 9,9-(4-(2-hydroxyethoxy)-3-phenylphenyl)fluorene, 9,9-(4-(2-hydroxyethoxy)-3,5-dimethylphenyl)fluorene, 9,9-(4-(2-hydroxyethoxy)-3-tert-butyl-6-methylphenyl)fluorene, and 9,9-(4-(3-hydroxy-2,2-dimethylpropoxy)phenyl)fluorene, as well as dihydroxy compounds having a cyclic ether structure, such as dihydroxy compounds represented by formula (3) below and spiroglycols represented by formula (4) below.
[0024] Among the above, dihydroxy compounds having a cyclic ether structure are preferred, and anhydrous sugar alcohols represented by formula (3) are particularly preferred. More specifically, dihydroxy compounds represented by formula (3) include isosorbide, isomannide, and isoidette, which are stereoisomers. In addition, dihydroxy compounds represented by the following formula (4) include 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane (common name: spiroglycol), 3,9-bis(1,1-diethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, and 3,9-bis(1,1-dipropyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane. These can be used individually, or two or more can be used in combination.
[0025] [ka] [ka] In formula (4), R1 to R4 are each independently alkyl groups having 1 to 3 carbon atoms.
[0026] The dihydroxy compound represented by formula (3) is an ether diol that can be produced from carbohydrates using plant-derived materials as raw materials. In particular, isosorbide can be produced inexpensively by hydrogenating and then dehydrating D-glucose obtained from starch, and it is readily available as a resource. For these reasons, isosorbide is the most preferred choice.
[0027] A polycarbonate resin containing structural unit (A1) may further contain structural units other than structural unit (A1) as structural units derived from dihydroxy compounds. For example, it is preferable to contain structural units derived from at least one dihydroxy compound selected from aliphatic dihydroxy compounds and alicyclic dihydroxy compounds (hereinafter sometimes referred to as structural unit (A2)).
[0028] The aliphatic dihydroxy compounds used in polycarbonate resins containing structural unit (A1) are not particularly limited in terms of the number of carbon atoms, but preferably aliphatic dihydroxy compounds having about 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms. Specifically, examples include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 2-ethyl-1,6-hexanediol, 2,2,4-trimethyl-1,6-hexanediol, 1,10-decanediol, 1,12-dodecanediol, hydrogenated dilinoleyl glycol, hydrogenated dioleyl glycol, and the like. Preferably, at least one selected from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, 1,10-decanediol, and 1,12-dodecanediol is used, and more preferably, at least one selected from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexanediol is used. In addition, structural units derived from aliphatic dihydroxy compounds can be used, for example, those described in International Publication No. 2004 / 111106.
[0029] The structural unit (A1) derived from the alicyclic dihydroxy compound used in the polycarbonate resin preferably includes at least one of a five-membered ring structure or a six-membered ring structure, and the six-membered ring structure may be fixed in a chair-like or boat-like shape by covalent bonds. By including structural units derived from alicyclic dihydroxy compounds of these structures, the heat resistance of the resulting polycarbonate resin can be improved. The number of carbon atoms in the alicyclic dihydroxy compound is, for example, 5 to 70, preferably 6 to 50, and more preferably 8 to 30. The above alicyclic dihydroxy compounds are preferably at least one selected from cyclohexanedimethanol, tricyclodecanedimethanol, adamantanediol, and pentacyclopentadecanedimethanol. From the viewpoint of economy and heat resistance, cyclohexanedimethanol or tricyclodecanedimethanol is more preferred, and cyclohexanedimethanol is even more preferred. Of the cyclohexanedimethanol, 1,4-cyclohexanedimethanol is particularly preferred because it is readily available industrially. Furthermore, structural units derived from alicyclic dihydroxy compounds, as described in International Publication No. 2007 / 148604, can also be used.
[0030] In polycarbonate resins containing structural unit (A1), the content of structural unit (A1) is preferably 30 mol% or more, more preferably 40 mol% or more, even more preferably 45 mol% or more, and preferably 75 mol% or less, more preferably 70 mol% or less, and even more preferably 65 mol% or less, of the structural units derived from dihydroxy compounds. By keeping it within this range, discoloration caused by the carbonate structure and discoloration caused by trace amounts of impurities due to the use of plant resource materials can be effectively suppressed. Furthermore, it tends to be possible to achieve a suitable balance of physical properties such as moldability, mechanical strength, and heat resistance, which is difficult to achieve with polycarbonate resins composed only of structural unit (A1). On the other hand, the content of structural unit (A2) in the polycarbonate resin containing structural unit (A1) is preferably 25 mol% or more, more preferably 30 mol% or more, even more preferably 35 mol% or more, and also preferably 70 mol% or less, more preferably 60 mol% or less, and even more preferably 55 mol% or less, among the structural units derived from the dihydroxy compound.
[0031] Polycarbonate resins containing structural unit (A1) preferably consist of structural unit (A1) and structural unit (A2) derived from dihydroxy compounds, but may also contain structural units derived from other dihydroxy compounds. Specifically, this can involve copolymerizing a small amount of aromatic ring-containing dihydroxy compounds, such as bisphenols like 2,2-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A). Using aromatic ring-containing dihydroxy compounds is expected to efficiently improve heat resistance and moldability, but excessive amounts tend to cause problems with weather resistance, so it is best to use them in an amount that does not cause problems with weather resistance. Examples of aromatic ring-containing dihydroxy compounds other than bisphenol A include α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF), and 1,1-bis(4-hydroxyphenyl)decane.
[0032] Polycarbonate resins containing the above-described structural unit (A1) can be produced by commonly used polymerization methods, including the phosgene method and the transesterification method involving reaction with diester carbonate. Among these, the transesterification method is preferred, in which a dihydroxy compound having a part of its structure represented by formula (2) reacts with another dihydroxy compound in the presence of a polymerization catalyst and a diester carbonate. The transesterification method is a polymerization method in which a dihydroxy compound, a diester carbonate, a basic catalyst, and an acidic substance to neutralize the catalyst are mixed and a transesterification reaction is carried out. Specific examples of diester carbonates are as described above, with diphenyl carbonate being particularly preferred.
[0033] The mass-average molecular weight of polycarbonate resin is typically 10,000 or more, preferably 30,000 or more, more preferably 38,000 or more, and even more preferably 40,000 or more, while also typically in the range of 120,000 or less, preferably 100,000 or less, and more preferably 80,000 or less, considering the balance between mechanical properties and moldability. The mass-average molecular weight can be measured using gel permeation chromatography (GPC) with polystyrene as the standard substance.
[0034] Furthermore, the viscosity-average molecular weight of polycarbonate resin is typically 12,000 or more, preferably 15,000 or more, more preferably 20,000 or more, even more preferably 22,000 or more, even more preferably 26,000 or more, particularly preferably 29,000 or more, and also typically in the range of 50,000 or less, preferably 45,000 or less, more preferably 40,000 or less, and even more preferably 35,000 or less, considering the balance between mechanical properties and moldability. The viscosity-average molecular weight was measured using dichloromethane as the solvent, and the intrinsic viscosity ([η]) (unit: dl / g) at 20°C was determined using an Ubbelohde viscometer, based on Schnell's viscosity formula: η = 1.23 × 10⁻⁶ -4 M 0.83 It can be calculated from the formula.
[0035] The melt flow rate (300°C, 1.2 kgf) of the polycarbonate resin is preferably 1 g / 10 min or more, more preferably 3 g / 10 min or more, preferably 50 g / 10 min or less, more preferably 40 g / 10 min or less, even more preferably 30 g / 10 min or less, even more preferably 25 g / 10 min or less, and even more preferably 20 g / 10 min or less, from the viewpoint of mechanical properties and moldability. The melt flow rate of the polycarbonate resin can be measured in accordance with ISO 1133.
[0036] The glass transition temperature of the polycarbonate resin is preferably 110°C or higher, more preferably 125°C or higher, even more preferably 135°C or higher, even more preferably 140°C or higher, and also preferably 200°C or lower, more preferably 175°C or lower, even more preferably 170°C or lower, and even more preferably 165°C or lower. By setting the glass transition temperature above the lower limit mentioned above, it becomes easier to impart appropriate heat resistance and reduce dimensional changes when manufacturing cards or passports. Furthermore, setting it below the upper limit also improves moldability. In addition, while a higher glass transition temperature requires heating to relatively high temperatures during the manufacturing process of the resin composition (I) and during film molding, even when the resin composition (I) is heated to high temperatures, the use of compound (B), described later, prevents the generation of eye-irritating compounds due to the antistatic agent. The glass transition temperature can be obtained by using a viscoelastic spectrometer and performing dynamic viscoelastic temperature dispersion measurements in tensile mode with a strain of 0.07%, a frequency of 1 Hz, and a heating rate of 3°C / min, in accordance with JIS K7244-4:1999, to determine the temperature of the peak of the loss modulus.
[0037] (Polyester resin) Examples of polyester resins used in resin (A) include polyesters obtained by polycondensation of a dicarboxylic acid and a dihydroxy compound. Dicarboxylic acid derivatives such as esters and acid halides may also be used as the dicarboxylic acid in the synthesis of the polyester resin. Using a polyester resin for resin (A) results in good low-temperature fusion properties, making it easier to adhere the film of the present invention (hereinafter also referred to as "this film"), described later, to other films by heat fusion at relatively low temperatures. Furthermore, it facilitates improvements in processability and other properties.
[0038] From the viewpoint of heat resistance, aromatic dicarboxylic acids are preferred as the dicarboxylic acids used to obtain polyester resins, and therefore, it is preferable that the polyester resin contains structural units derived from aromatic dicarboxylic acids. There are no particular restrictions on the aromatic dicarboxylic acid, and examples include terephthalic acid, isophthalic acid, naphthalene-1,4-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, naphthalene-1,5-dicarboxylic acid, anthracenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 5-sulfoisophthalic acid, sodium 3-sulfoisophthalate, 2-chloroterephthalic acid, 2,5-dichloroterephthalic acid, 2-methylterephthalic acid, etc. Among these, terephthalic acid and isophthalic acid are preferred, and terephthalic acid is more preferred. Aromatic dicarboxylic acids may be used individually or in combination of two or more.
[0039] It is even more preferable that the structural units derived from aromatic dicarboxylic acids are present in the polyester resin at a concentration of, for example, 60 mol% or more, preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 90 mol% or more. Furthermore, there is no particular upper limit, and it is acceptable as long as it is 100 mol% or less, but most preferably 100 mol%.
[0040] Furthermore, the polyester resin may contain a small amount of structural units derived from aliphatic dicarboxylic acids (usually 40 mol% or less, for example 30 mol% or less, preferably 20 mol% or less) in addition to structural units derived from aromatic dicarboxylic acids. There are no particular restrictions on the aliphatic dicarboxylic acids, and examples include oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, sebacic acid, azelaic acid, dodecanedionic acid, dimer acid, 1,3 or 1,4-cyclohexanedicarboxylic acid, cyclopentanedicarboxylic acid, and 4,4'-dicyclohexyldicarboxylic acid. The aliphatic dicarboxylic acid may be used alone or in combination of two or more.
[0041] The polyester resin preferably contains structural units derived from chain-like dihydroxy compounds. The inclusion of these structural units in the polyester resin tends to result in good low-temperature fusion properties for the film. The chain-like dihydroxy compounds used in polyester resins may be linear or have a branched structure. Specific examples of chain-like dihydroxy compounds include chain-like dihydroxy compounds with approximately 2 to 18 carbon atoms, such as ethylene glycol (EG), diethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 2,2-dimethyl-1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,10-decanediol, 1,12-dodecanediol, triethylene glycol, 1,2-hexadecanediol, and 1,18-octadecanediol, as well as polyglycols such as polytetramethylene ether glycol, polypropylene glycol, and polyethylene glycol. Among these, chain-type dihydroxy compounds having 2 to 12 carbon atoms are preferred, and more preferably one or more selected from ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexanediol, with ethylene glycol (EG) being particularly preferred. The chain-type dihydroxy compounds may be used individually or in combination of two or more.
[0042] The polyester resin is preferably a copolymer polyester resin obtained by using two or more dihydroxy compounds as copolymer components. Specifically, it is preferable to use alicyclic dihydroxy compounds in addition to chain-type dihydroxy compounds as the dihydroxy compounds used to obtain the polyester resin. Therefore, it is preferable that the polyester resin has structural units derived from alicyclic dihydroxy compounds in addition to structural units derived from chain-type dihydroxy compounds. Using alicyclic dihydroxy compounds tends to result in good heat resistance, solvent resistance, etc. Specific examples of alicyclic dihydroxy compounds include tetramethylcyclobutanediol, cyclohexanedimethanol (CHDM), tricyclodecanedimethanol, adamantanediol, and pentacyclopentadecanedimethanol. Among these, tetramethylcyclobutanediol and cyclohexanedimethanol are preferred. Of the cyclohexanedimethanol compounds available, there are 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, and 1,4-cyclohexanedimethanol, but 1,4-cyclohexanedimethanol is preferred due to its easy industrial availability. Generally, 2,2,4,4-tetramethyl-1,3-cyclobutanediol is used as the tetramethylcyclobutanediol. The alicyclic dihydroxy compound may be used alone or in combination of two or more. At least cyclohexanedimethanol is preferred as the alicyclic dihydroxy compound, and from the viewpoint of flexibility, tetramethylcyclobutanediol and cyclohexanedimethanol are preferred in combination.
[0043] In polyester resins, the proportion of structural units derived from alicyclic dihydroxy compounds is, for example, 5 mol% or more, preferably 15 mol% or more, more preferably 20 mol% or more, and also, for example, 99 mol% or less, preferably 95 mol% or less, more preferably 90 mol% or less, and even more preferably 80 mol% or less, out of a total of 100 mol% of structural units derived from chain-type dihydroxy compounds. In polyester resins, particularly in terms of heat resistance such as storage modulus and thermal expansion coefficient under high-temperature environments, and solvent resistance, the proportion of structural units derived from alicyclic dihydroxy compounds is preferably more than 65 mol%, more preferably 70 mol% or more, even more preferably 80 mol% or more, and even more preferably 90 mol% or more, out of a total of 100 mol% of structural units derived from chain-type dihydroxy compounds and structural units derived from alicyclic dihydroxy compounds. Furthermore, in terms of low-temperature fusion properties, the proportion of structural units derived from alicyclic dihydroxy compounds is preferably 65 mol% or less, more preferably 55 mol% or less, even more preferably 45 mol% or less, and even more preferably 40 mol% or less, out of a total of 100 mol% of structural units derived from chain-type dihydroxy compounds and structural units derived from alicyclic dihydroxy compounds.
[0044] As the dihydroxy compound used in the polyester resin, dihydroxy compounds other than chain-type dihydroxy compounds and alicyclic dihydroxy compounds (also referred to as "other dihydroxy compounds") may be used, as long as they do not impair the effects of the present invention. In the polyester resin, the content of structural units derived from other dihydroxy compounds is, for example, 20 mol% or less, preferably 10 mol% or less, more preferably 5 mol% or less, and most preferably 0 mol% per 100 moles of structural units derived from dihydroxy compounds in the polyester resin. Other dihydroxy compounds include p-xylenediol, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), tetrabromobisphenol A, tetrabromobisphenol A-bis(2-hydroxyethyl ether), α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF), and 1,1-bis(4-hydroxyphenyl)decane.
[0045] Among the above, the polyester resin preferably contains structural units derived from ethylene glycol and structural units derived from cyclohexanedimethanol, from the viewpoint of low-temperature fusion properties, heat resistance, and solvent resistance, and also preferably contains structural units derived from ethylene glycol, structural units derived from cyclohexanedimethanol, and structural units derived from tetramethylcyclobutanediol.
[0046] The polyester resin is preferably amorphous polyester. Using amorphous polyester tends to improve the adhesion of this film to other components such as resin films. The amorphous polyester can be any polyester that is substantially non-crystalline. Examples of substantially non-crystalline polyesters (including those with low crystallinity) include polyesters that do not show a clear crystallization peak when heated by differential scanning calorimeter (DSC), polyesters that have crystalline properties but have a slow crystallization rate and do not become highly crystalline when molded by extrusion or other methods, and polyesters that have crystalline properties but whose crystallization heat (ΔHm) observed when heated by differential scanning calorimeter (DSC) is low, at 10 J / g or less. In other words, amorphous polyester in this invention also includes "crystalline polyester that is in a non-crystalline state".
[0047] As described above, the resin composition (I) preferably uses polycarbonate resin as resin (A). However, when using polycarbonate resin, it may be used alone or in combination with other resins. As such, it is preferable to use a commonly used, well-known resin, but for example, polyester resin is preferred. Details of the polyester resin used in combination with polycarbonate resin are as described above. Resin (A) preferably contains polycarbonate resin as its main component, and the amount of polycarbonate resin is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin (A) contained in resin composition (I).
[0048] [Compound (B)] The resin composition (I) contains compound (B) represented by the following general formula (1). (R 11 )4P + ·(R 12 SO2)2N - (1) (In the above equation (1), R 11Each of these independently represents a hydrocarbon group, and the three R 11 The number of carbon atoms is 1 to 4, and there is one R 11 The number of carbon atoms is 1 to 7. 12 Each of these independently represents a hydrocarbon group containing a fluorine atom.
[0049] Compound (B) preferably functions as an antistatic agent, thereby lowering the electrical resistance of the resin composition (I) and the film obtained from the resin composition (I), preventing static charge buildup in the resin composition (I) and the film, and improving handling and processability. Specifically, it suppresses static charge buildup when transporting the film obtained from the resin composition (I) or when stacking the film on top of other films, and also reduces adhesion to the press plate during heat pressing. Furthermore, it reduces the generation of static electricity when unwinding the film from the film roll, effectively preventing charged films from sticking together or misalignment during film alignment. In addition, it reduces the likelihood of airborne dust being attracted by static electricity and adhering to the surface of the film, thus reducing the risk of foreign matter contamination in products such as cards and passports, and improving dust resistance. On the other hand, salts of phosphonium cations and sulfonimide anions containing fluorine atoms can decompose when heated, generating compounds that are irritating to the eyes. However, compound (B) shown in formula (1) above suppresses the generation of compounds that are irritating to the eyes even when heated, thus improving the working environment.
[0050] In equation (1), R 11 Each of these is preferably independently selected from a linear, branched, or cyclic alkyl group, a linear, branched, or cyclic alkenyl group, and an aryl group, with linear or branched alkyl groups being more preferred, and linear alkyl groups being even more preferred. R 11 Of these, three R's 11 As mentioned above, the carbon atom has 1 to 4 carbon atoms, preferably 2 to 4. Also, R 11 Of these, the remaining one R11 As mentioned above, the number of carbon atoms should be 1 to 7, preferably 1 to 5, more preferably 1 to 4, and even more preferably 2 to 4. Therefore, in formula (1), all R 11 The carbon atoms are preferably 1 to 4, and more preferably 2 to 4. Furthermore, as mentioned above, the hydrocarbon group is preferably an alkyl group, and in formula (1), all R 11 Alkyl alkyl groups having 1 to 4 carbon atoms are more preferred, and alkyl groups having 2 to 4 carbon atoms are even more preferred. Multiple R groups within a single molecule 11 They may be the same as each other, or they may be different. Furthermore, multiple R molecules within a single molecule 11 Preferably, all of them have the same number of carbon atoms, but at least one R 11 The number of carbon atoms in other R 11 The number of carbon atoms may be different. For example, three R 11 The number of carbon atoms is the same, and the remaining one R 11 The number of carbon atoms in this atom may be different from the other three.
[0051] R 12 Preferably, each is independently selected from a linear, branched, or cyclic alkyl group containing a fluorine atom, a linear, branched, or cyclic alkenyl group containing a fluorine atom, and an aryl group containing a fluorine atom, with linear or branched alkyl groups containing a fluorine atom being more preferred, and linear alkyl groups containing a fluorine atom being even more preferred. Each R 12 In this, the number of carbon atoms constituting the hydrocarbon group is preferably 1 to 10, more preferably 1 to 6, even more preferably 1 to 4, even more preferably 1 to 3, and particularly preferably 1 to 2. More specifically, R 12Each of these groups is preferably a perfluorohydrocarbon group, and more preferably a perfluoroalkyl group. Examples of perfluoroalkyl groups include trifluoromethyl, pentafluoroethyl, heptafluoropropyl, and nonafluorobutyl groups, among which trifluoromethyl and pentafluoroethyl groups are more preferred, and trifluoromethyl is even more preferred. Compound (B), by containing a fluorine atom, particularly a perfluoroalkyl group, tends to improve surface migration in the film obtained from resin composition (I). Therefore, it becomes possible to impart high antistatic performance with a lower amount of additive. Multiple Rs within a single molecule 12 They may be the same as each other, or they may be different.
[0052] Compound (B) is preferably an ionic liquid. Ionic liquids have high conductivity and are liquid at around room temperature, resulting in excellent dispersibility and superior antistatic performance. They also have excellent heat resistance, making it possible to impart excellent antistatic performance while suppressing the thermal decomposition of compound (B). An ionic liquid is a compound consisting only of ions and having a melting point of 100°C or lower.
[0053] Compound (B) represented by formula (1) is a salt of a phosphonium cation and a sulfonimide anion. Examples of phosphonium cations include tetraalkylphosphonium cations and those in which part of the alkyl group is substituted with an alkenyl group or an aryl group, with tetraalkylphosphonium cations being preferred among these. Specific examples of tetraalkylphosphonium cations include tetramethylphosphonium cation, tetraethylphosphonium cation, tetrapropylphosphonium cation, tetrabutylphosphonium cation, and tributylmethylphosphonium cation. Examples of sulfonimide anions include bis(trifluoromethanesulfonyl)imide ion, bis(pentafluoroethanesulfonyl)imide ion, bis(heptafluoropropanesulfonyl)imide ion, bis(nonafluorobutanesulfonyl)imide ion, and [(trifluoromethanesulfonyl)(pentafluoroethanesulfonyl)]imide ion.
[0054] Specific examples of compounds represented by formula (1) include tetrabutylphosphonium=bis(trifluoromethanesulfonyl)imide, tetrabutylphosphonium=bis(pentafluoroethanesulfonyl)imide, and tetraethylphosphonium=bis(trifluoromethanesulfonyl)imide. Among these, tetrabutylphosphonium=bis(trifluoromethanesulfonyl)imide represented by the following formula (1-1) is preferred. Compound (B) may be used alone or in combination of two or more compounds. [ka]
[0055] In one embodiment of the resin composition (I), the content of compound (B) in the resin composition (I) is preferably less than 2 parts by mass per 100 parts by mass of resin (A). When the content of compound (B) is less than 2 parts by mass, compound (B) is easily dispersed appropriately in the resin composition (I), and the deterioration of various properties that occurs when compound (B) is added in large quantities tends to be suppressed. Therefore, for example, when the resin composition (I) is used in a transparent film, it becomes easy to improve antistatic properties without impairing properties such as transparency. The above content of compound (B) is preferably 1.8 parts by mass or less, more preferably 1.5 parts by mass or less, even more preferably 1.2 parts by mass or less, and even more preferably 1 part by mass or less. The content of compound (B) in resin composition (I) is preferably 0.05 parts by mass or more per 100 parts by mass of resin (A). By setting the content of compound (B) to 0.05 parts by mass or more, the antistatic properties can be sufficiently improved by compound (B). The above content of compound (B) is more preferably 0.1 parts by mass or more, even more preferably 0.3 parts by mass or more, and still more preferably 0.5 parts by mass or more.
[0056] [Antistatic agents other than compound (B)] The resin composition (I) may contain antistatic agents other than compound (B) as long as it does not contradict the spirit of the present invention. Examples of antistatic agents other than compound (B) include low molecular weight antistatic agents and high molecular weight antistatic agents. These may be ion-conducting or electron-conducting types. Examples of low-molecular-weight antistatic agents include anionic antistatic agents, cationic antistatic agents, nonionic antistatic agents, amphoteric antistatic agents, complex compounds, metal alkoxides such as alkoxysilanes, alkoxytitanium, and alkoxyzirconium, and their derivatives, and coated silica. The amphoteric antistatic agent may be of the betaine type, but may also be of a different type, and may be any antistatic agent composed of a cation and anion, and may also be an ionic liquid. The polymeric antistatic agent may be various polymers, such as vinyl copolymers containing metal sulfonic acid salts, such as alkyl sulfonic acid metal salts or alkylbenzene sulfonic acid metal salts, within the molecule, or it may be a betaine type. Polyamide elastomers, polyester elastomers, etc., can also be used. Other antistatic agents besides compound (B) can be used individually or in combination of two or more.
[0057] Among the antistatic agents other than compound (B), those composed of a cation and anion are preferred. Specifically, antistatic agents composed of an anion selected from sulfonimide anions containing a fluorine atom and sulfonate anions containing a fluorine atom, and a cation selected from phosphonium cation, ammonium cation, imidazolium cation, and pyridinium cation are mentioned. Here, the anion selected from sulfonimide anions containing a fluorine atom and sulfonate anions containing a fluorine atom preferably includes an anion selected from perfluoroalkyl sulfonimide anions and perfluoroalkyl sulfonate anions.
[0058] Other preferred antistatic agents besides compound (B) include compounds represented by the following general formula (5). Using compounds represented by general formula (5) makes it easier to achieve high antistatic performance with a small amount of antistatic agent. (R 21 )4P + ·(R 22 SO2)2N - (5) (In the above equation (5), R 21 Each independently represents a hydrocarbon group, and at least one R 21 The number of carbon atoms is 8 or more. 22 Each of these independently represents a hydrocarbon group containing a fluorine atom.
[0059] In equation (5), R 21Each of these is preferably independently selected from a linear, branched, or cyclic alkyl group, a linear, branched, or cyclic alkenyl group, and an aryl group, with alkyl groups being more preferred, linear or branched alkyl groups being even more preferred, and linear alkyl groups being even more preferred. R 21 The number of carbon atoms constituting the hydrocarbon group is, for example, 1 to 20, but preferably 3 R 21 The number of carbon atoms is 1 to 6, more preferably 2 to 4, and preferably the remaining 1 R 21 The number of carbon atoms is 8 to 20, more preferably 10 to 18, even more preferably 11 to 16, and even more preferably 12 to 14. Furthermore, the three R values mentioned above within a single molecule 21 They may be the same or different, but it is preferable that they be the same. R in equation (5) 22 R in equation (1) 12 It is similar to the above, and the details are as explained above.
[0060] Specific examples of compounds represented by general formula (5) include trihexyltetradecylphosphonium bis(trifluoromethanesulfonyl)amide and tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide. Other antistatic agents besides compound (B) may be used individually or in combination of two or more.
[0061] When using an antistatic agent other than compound (B), its content is not particularly limited, but is, for example, 2 parts by mass or less, preferably 1 part by mass or less, more preferably 0.7 parts by mass or less, and even more preferably 0.5 parts by mass or less, per 100 parts by mass of resin (A). Furthermore, the content of the antistatic agent shown in formula (5) above is preferably less than 0.5 parts by mass per 100 parts by mass of resin (A). By limiting the content of the antistatic agent shown in formula (5) to less than 0.5 parts by mass, it is possible to prevent the generation of eye-irritating compounds in the film manufacturing process, etc., caused by the antistatic agent, and to improve the working environment. From the viewpoint of further improving the working environment, the content of the antistatic agent shown in formula (5) is more preferably 0.4 parts by mass or less, and even more preferably 0.2 parts by mass or less, per 100 parts by mass of resin (A). In addition, the content of the antistatic agent shown in formula (5) is only required to be 0 parts by mass or more, and it is also preferable that the antistatic agent shown in formula (5) above is not contained in the resin composition (I).
[0062] The total content of compound (B) and antistatic agents other than compound (B) is, for example, 3 parts by mass or less, preferably 2 parts by mass or less, more preferably 1.8 parts by mass or less, even more preferably 1.5 parts by mass or less, even more preferably 1.2 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.8 parts by mass or less, per 100 parts by mass of resin (A). By keeping the total content below the above upper limit, the resin composition (I) can exhibit effects commensurate with its content without impairing its various properties. Furthermore, the above total content is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and more preferably 0.5 parts by mass or more, per 100 parts by mass of resin (A). By keeping the total content above these amounts, the resin composition (I) can be sufficiently imparted with antistatic performance.
[0063] [Other additives] (Laser colorant) The resin composition (I) may further contain additives other than antistatic agents as appropriate. The resin composition (I) may contain, for example, a laser colorant. By containing a laser colorant, the film using the resin composition (I) can be used as a laser marking sheet that develops color when irradiated with a laser. The resin composition (I) may contain a laser colorant when forming a single-layer film, as will be described later. The resin composition (I) may also contain a laser colorant when forming a middle layer in a laminated film, as will be described later. When the resin composition (I) contains a laser colorant, the film, as will be described later, may constitute a transparent film.
[0064] The laser colorant may be a metal oxide or a compound other than a metal oxide. The metal oxide is not limited to those that have a laser coloring effect, and examples include iron oxide, copper oxide, tin oxide, cobalt oxide, nickel oxide, bismuth oxide, indium oxide, tungsten oxide, neodymium oxide, hydrotalcite, montmorillonite, and smectite. Furthermore, laser colorants other than metal oxides may also be used, including metals such as iron, copper, zinc, tin, gold, silver, cobalt, nickel, bismuth, antimony, and aluminum; metal salts such as iron chloride, iron nitrate, iron phosphate, copper chloride, copper nitrate, copper phosphate, zinc chloride, zinc nitrate, nickel chloride, nickel nitrate, bismuth subcarbonate, and bismuth nitrate; metal hydroxides such as magnesium hydroxide, lanthanum hydroxide, nickel hydroxide, and bismuth hydroxide; and metal borides such as zirconium boride, titanium boride, and lanthanum boride. Among metal borides, hexaborides have near-infrared absorption ability, and lanthanum hexaboride is preferred because it has excellent laser light absorption efficiency. In addition, dyes such as leuco dyes such as fluorane, phenothiazine, spiropyran, triphenyl metaphthalide, and rhodamine lactam, as well as carbon black, can also be used. As the laser colorant, it is preferable to use bismuth oxide or a bismuth-based metal oxide such as a metal oxide containing bismuth and at least one metal selected from Zn, Ti, Al, Zr, Sr, Nd, and Nb. Laser colorants may be used individually or in combination of two or more types.
[0065] In resin composition (I), if a laser colorant is included, the content of the laser colorant is not particularly limited, but from the viewpoint of printability, it is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, and even more preferably 0.06 parts by mass or more, per 100 parts by mass of resin (A). Furthermore, from the viewpoint of ensuring transparency and mechanical properties of resin composition (I) and the film obtained from resin composition (I), the above content of the laser colorant is preferably 3 parts by mass or less, more preferably 2 parts by mass or less, even more preferably 1 part by mass or less, and particularly preferably 0.8 parts by mass or less. Furthermore, in resin composition (I), when carbon black is used as a laser colorant, the carbon black content is not particularly limited, but from the viewpoint of printability, it is preferably 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of resin (A). From the viewpoint of transparency, it is preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, even more preferably 0.01 parts by mass or less, and particularly preferably 0.005 parts by mass or less.
[0066] (filling material) The resin composition (I) may contain a filler. By containing a filler, the light transmittance of the resin composition (I) is reduced, and it can exhibit opacity. Furthermore, when the resin composition (I) is used in a film such as a card or passport, and the film is laminated onto a laser marking sheet and comes into contact with the laser marking sheet, the printability of the laser marking sheet can be easily improved. The resin composition (I) can be suitably used in core sheets, printed sheets, and the like by containing a filler. As described later, the resin composition (I) may contain a filler when forming a single-layer film, or it may contain a filler when forming at least one of the resin layers of a laminated film.
[0067] The filler can be either an inorganic or organic filler, but examples include talc, mica, carbon black, silica, calcium carbonate, magnesium carbonate, barium oxide, zinc oxide, titanium oxide, zircon oxide, antimony oxide, magnesium oxide, aluminum oxide, calcium oxide, lead titanate, potassium titanate, barium titanate, zinc sulfide, barium sulfate, boron nitride, and aluminum nitride. Among these, at least one filler with a refractive index of 2 or higher is preferred, more preferably 2.2 or higher, and even more preferably 2.4 or higher. Examples of fillers with a refractive index of 2 or higher include titanium oxide, lead titanate, potassium titanate, barium titanate, zircon oxide, magnesium oxide, calcium oxide, zinc sulfide, antimony oxide, zinc oxide, aluminum oxide, boron nitride, aluminum nitride, calcium carbonate, magnesium carbonate, and barium sulfate. Using a filler with a refractive index of 2 or higher further improves opacity and laser printability on the laser marking sheet laminated on this film. Furthermore, this film can be colored white. From these viewpoints, titanium dioxide is more preferable as a filler. The titanium dioxide is not particularly limited, but examples include rutile-type titanium dioxide and anatase-type titanium dioxide. The refractive index of the filler can be measured by the Becke line method.
[0068] The average particle size of the filler is not particularly limited, but is, for example, 0.01 μm or more and 1 μm or less, preferably 0.05 μm or more and 0.8 μm or less, more preferably 0.08 μm or more and 0.6 μm or less, even more preferably 0.1 μm or more and 0.5 μm or less, and even more preferably 0.12 μm or more and 0.4 μm or less. Note that the average particle size refers to the average primary particle size observed with a scanning electron microscope.
[0069] Furthermore, in resin composition (I), the filler content is, for example, 10 parts by mass or more, preferably 20 parts by mass or more, more preferably 30 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 50 parts by mass or more, and even more preferably 60 parts by mass or more, per 100 parts by mass of resin (A). The higher the filler content, the better the opacity can be, and the easier it is to improve the printability of the laser marking sheet laminated on this film. Also, from the viewpoint of maintaining good mechanical properties such as bending resistance, the filler content in resin composition (I) is, for example, 150 parts by mass or less, preferably 120 parts by mass or less, more preferably 100 parts by mass or less, and even more preferably 90 parts by mass or less, per 100 parts by mass of resin (A).
[0070] (Impact-resistant additive) The resin composition (I) may contain an impact-resistant modifier. If the resin composition (I) contains a filler, it is preferable that it further contains an impact-resistant modifier. By containing an impact-resistant modifier, even if the resin composition (I) contains a large amount of filler, such as titanium dioxide, it is easier to mitigate the effects of external impacts such as bending and impact during actual use, and to maintain good bending resistance when made into a film. In addition, it is easier to maintain good processability by preventing a decrease in softening and fluidity when heated, which can occur due to the use of a specific resin, such as polycarbonate resin, as the resin (A). Therefore, even if the resin composition (I) contains a filler and is used as an inlet sheet, problems such as difficulty in embedding IC chips are less likely to occur. When the resin composition (I) constitutes a single-layer film or the surface layer of a laminated film, as described later, it is preferable that it contains an impact-resistant agent.
[0071] Examples of impact-resistant modifiers include soft styrene resins and elastomers. The elastomer may be a core-shell type elastomer. The impact-resistant modifier may be used alone or in combination of two or more types. Among the above, core-shell type elastomers are preferred as impact-resistant modifiers. By using a core-shell type elastomer, impact resistance is further improved and bending resistance is further enhanced.
[0072] Examples of flexible styrene resins include block copolymers containing styrene polymer blocks and conjugated diene polymer blocks, and block copolymers containing styrene polymer blocks and acrylonitrile blocks. The styrene content in the flexible styrene resin is, for example, 5% by mass or more and 80% by mass or less, but preferably 10% by mass or more and 50% by mass or less, and more preferably 15% by mass or more and 30% by mass or less. Having a styrene content within the above range further improves the effect of imparting impact resistance.
[0073] As conjugated diene polymer blocks used in flexible styrene resins, homopolymers such as butadiene, isoprene, and 1,3-pentadiene, copolymers thereof, or copolymers containing monomers copolymerizable with conjugated diene monomers within the block can be used. Specific examples of flexible styrene-based resins include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), silicone-acrylic composite rubber-acrylonitrile-styrene copolymer (SAS), methyl methacrylate-maleic anhydride-styrene copolymer (SMM), acrylonitrile-styrene copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-styrene-acrylic rubber copolymer (ASA), and acrylonitrile-ethylene propylene rubber-styrene copolymer (AES). Specific products include the "Krayton D" series from Kraton Polymers, the "AR-100" series from Aron Kasei Co., Ltd., the "Dialac" series from UMG ABS, and the "Delpet" series from Asahi Kasei Chemicals. Furthermore, flexible styrene-based resins can also be used, such as the styrene-based elastomers described later, including the "Dynalon" series from JSR Corporation, the "Toughtech" series from Asahi Kasei Chemicals Corporation, and the "Hybral" series from Kuraray Corporation.
[0074] The block copolymer includes pure blocks, random blocks, tapered blocks, etc., and the form of copolymerization is not particularly limited. Furthermore, the block units themselves may consist of multiple repeating units. Specifically, in the case of styrene-butadiene block copolymers, the block units may be repeated multiple times, such as styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, and styrene-butadiene-styrene-butadiene block copolymer.
[0075] Furthermore, hydrogenated styrene-butadiene-styrene block copolymers (SEBS) and hydrogenated styrene-isoprene-styrene block copolymers (SEPS), in which some or all of the double bonds of the conjugated diene polymer blocks of SBS or SIS are hydrogenated, can also be used. Specific examples of such products include Asahi Kasei Chemicals' "ToughTec H" series and Kraton Polymers' "Kraton G" series.
[0076] It is also possible to impart polar functional groups to flexible styrene resins. Specific examples of polar functional groups include acid anhydride groups, carboxylic acid groups, carboxylic acid ester groups, carboxylic acid chloride groups, carboxylic acid amide groups, carboxylic acid bases, sulfonic acid groups, sulfonic acid ester groups, sulfonate chloride groups, sulfonic acid amide groups, sulfonic acid bases, epoxy groups, amino groups, imide groups, and oxazoline groups. Among these, it is preferable to impart acid anhydride groups or epoxy groups. Modified forms of SEBS and SEPS are preferred as soft styrene resins to which polar functional groups are added. Specifically, examples include maleic anhydride-modified SEBS, maleic anhydride-modified SEPS, epoxy-modified SEBS, and epoxy-modified SEPS. Specific products include the "ToughTec M" series from Asahi Kasei Chemicals, the "Dynalon" series from JSR Corporation, and the "Epofriend" series from Daicel Chemical Industries, Ltd.
[0077] The elastomer may be anything other than a styrene-based elastomer, and known examples include polyester-based elastomers, polyolefin-based elastomers, diene-based elastomers, acrylic-based elastomers, polyamide-based elastomers, polyurethane-based elastomers, fluorine-based elastomers, and silicone-based elastomers. The elastomer is generally a thermoplastic elastomer. Preferably, the elastomer is a polyester-based elastomer or one of the styrene-based elastomers described above.
[0078] A core-shell type elastomer consists of an innermost layer (i.e., a core) and one or more outer layers (i.e., a shell) covering it. Preferably, the core-shell type elastomer is a core-shell type graft copolymer in which monomer components capable of graft copolymerization with respect to the core are graft copolymerized as the shell.
[0079] Core-shell type graft copolymers typically have a polymer component called a rubber component as the core. In core-shell type graft copolymers, it is preferable that the polymer component constituting the core and monomer components copolymerizable with this polymer component are graft copolymerized as the shell. The method for producing the core-shell type graft copolymer may be any of the following methods: bulk polymerization, solution polymerization, suspension polymerization, or emulsion polymerization. The copolymerization method may be single-stage grafting or multi-stage grafting. However, commercially available core-shell type elastomers can usually be used as is. Examples of commercially available core-shell type elastomers will be given later.
[0080] Specific examples of polymer components that form the core include butadiene-based rubbers such as polybutadiene and styrene-butadiene copolymers, isoprene-based rubbers, acrylic-based rubbers such as polybutyl acrylate, poly(2-ethylhexyl acrylate), and butyl acrylate-2-ethylhexyl acrylate copolymers, silicone-based rubbers such as polyorganosiloxane rubber, butadiene-acrylic composite rubbers, silicone-acrylic composite rubbers such as IPN (Interpenetrating Polymer Network) type composite rubbers consisting of polyorganosiloxane rubber and polyalkyl acrylate rubber, ethylene-α-olefin-based rubbers such as ethylene-propylene copolymers, ethylene-butene copolymers, and ethylene-octene copolymers, ethylene-acrylic rubbers, and fluororubber. These may be used individually or in combination of two or more types. Among these, at least one selected from butadiene rubber, acrylic rubber, silicone rubber, and silicone-acrylic composite rubber is preferred in terms of mechanical properties and surface appearance, and at least one selected from butadiene rubber and silicone-acrylic composite rubber is more preferred.
[0081] Specific examples of monomer components that can be graft copolymerized with the polymer component of the core and constitute the shell include aromatic vinyl compounds; vinyl cyanide compounds; (meth)acrylic compounds such as (meth)acrylic acid ester compounds, (meth)acrylic acid compounds, and epoxy group-containing (meth)acrylic acid ester compounds such as glycidyl (meth)acrylate; maleimide compounds such as maleimide, N-methylmaleimide, and N-phenylmaleimide; and α,β-unsaturated carboxylic acid compounds such as maleic acid, phthalic acid, and itaconic acid, and their anhydrides (e.g., maleic anhydride). These monomer components may be used individually or in combination of two or more. Among these, aromatic vinyl compounds, vinyl cyanide compounds, and (meth)acrylic compounds are preferred in terms of mechanical properties and surface appearance, and more preferably aromatic vinyl compounds, (meth)acrylic compounds, and especially (meth)acrylic acid ester compounds. Specific examples of aromatic vinyl compounds include styrene, α-methylstyrene, 1-vinylnaphthalene, 4-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene, 4-dodecylstyrene, 2-ethyl-4-benzylstyrene, 4-(phenylbutyl)styrene, or halogenated styrene, with styrene or α-methylstyrene being more preferred. Specific examples of (meth)acrylic acid ester compounds include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, and octyl (meth)acrylate. Among these, methyl (meth)acrylate and ethyl (meth)acrylate are preferred because they are relatively easy to obtain, with methyl (meth)acrylate being more preferred. Note that "(meth)acrylic" is a general term for "acrylic" and "methacrylic".
[0082] As the core-shell type elastomer, a core-shell type graft copolymer is particularly preferred, which consists of a core made of at least one polymer component selected from butadiene rubber, acrylic rubber, silicone rubber, and silicone-acrylic composite rubber, and a shell formed by graft copolymerizing a (meth)acrylic compound such as a (meth)acrylic acid ester or an aromatic vinyl compound around the core. The content of the polymer component in the core of the core-shell type graft copolymer is preferably 40% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. Furthermore, the total content of (meth)acrylic compounds (especially (meth)acrylic acid esters) and aromatic vinyl compounds in the shell of the core-shell type graft copolymer is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, and even more preferably 70% by mass or more. In the shell, either the (meth)acrylic compound or the aromatic vinyl compound may be used alone, or they may be used in combination.
[0083] Preferred specific examples of core-shell type elastomers include methyl methacrylate-butadiene-styrene copolymer (MBS), methyl methacrylate-acrylonitrile-butadiene-styrene copolymer (MABS), methyl methacrylate-butadiene copolymer (MB), methyl methacrylate-acrylic rubber copolymer (MA), methyl methacrylate-acrylic rubber-styrene copolymer (MAS), methyl methacrylate-acrylic / butadiene rubber copolymer, methyl methacrylate-acrylic / butadiene rubber-styrene copolymer, and methyl methacrylate-(acrylic / silicone composite rubber) copolymer.
[0084] Examples of commercially available core-shell type graft copolymers include "Paraloid EXL2602", "Paraloid EXL2603", "Paraloid EXL2690", "Paraloid EXL2691J", "Paraloid EXL2650J", "Paraloid EXL2655", "Paraloid EXL2311", "Paraloid EXL2313", "Paraloid EXL2315", "Paraloid KM330", "Paraloid KM336P", and "Paraloid KCZ201", all manufactured by Dow Chemical Japan. Examples include Mitsubishi Chemical's "Metablen C-223A," "Metablen E-901," "Metablen S-2001," "Metablen W-450A," "Metablen SRK-200," and "Metablen E-870A," and Kaneka's "Kaneace M-210," "Kaneace M-511," "Kaneace M-600," "Kaneace M-400," "Kaneace M-580," "Kaneace M-590," "Kaneace M-711," "Kaneace MR-01," and "Kaneace M-300." These impact-resistant modifiers, such as core-shell type graft copolymers, may be used individually or in combination of two or more types.
[0085] In the resin composition (I), the content of the impact-resistant modifier is preferably 1 part by mass or more and 40 parts by mass or less per 100 parts by mass of resin (A). A content of 1 part by mass or more of the impact-resistant modifier moderately mitigates the effects of external impacts, making it easier to improve properties such as bending resistance. Furthermore, it helps prevent a decrease in softening and fluidity during heating, which can occur due to the type of resin (A) used or the amount of filler added, thus maintaining good processability. By limiting the content to 40 parts by mass or less, the modifier can exert an effect commensurate with its content, and it also prevents a decrease in various physical properties of the resin composition (I), such as heat resistance. From these viewpoints, the content of the impact-resistant modifier in the resin composition is more preferably 2.5 parts by mass or more, even more preferably 5 parts by mass or more, and even more preferably 7 parts by mass or more, per 100 parts by mass of resin (A). Furthermore, it is more preferably 30 parts by mass or less, even more preferably 20 parts by mass or less, even more preferably 17 parts by mass or less, and particularly preferably 15 parts by mass or less.
[0086] (Heat stabilizer / antioxidant (additive (X))) The resin composition (I) may contain at least one additive (X) selected from heat stabilizers and antioxidants. If the resin composition (I) contains a large amount of the above-mentioned filler, foaming may occur and an appearance defect may occur. However, even if a large amount of filler is included, the inclusion of additive (X) can suppress foaming and improve the appearance of the film or the like obtained from the resin composition (I). The resin composition (I) may contain either a heat stabilizer or an antioxidant, or both, as additive (X). However, if additive (X) is included, it is preferable to include at least a heat stabilizer, and it is more preferable to use both a heat stabilizer and an antioxidant in combination.
[0087] (Heat stabilizer) Examples of heat stabilizers include phosphorus compounds. Known phosphorus compounds can be used. Specific examples include phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, polyphosphate and other phosphorus oxoacids, acidic pyrophosphate metal salts such as sodium acidic pyrophosphate, potassium acidic pyrophosphate, and calcium acidic pyrophosphate, phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate, organic phosphite compounds, organic phosphate compounds, and organic phosphonite compounds. In addition, metal salts of organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds may also be used.
[0088] Examples of organic phosphite compounds include triphenyl phosphite, tris(mononylphenyl) phosphite, tris(mononyl / dinonylphenyl) phosphite, tris(2,5-di-tert-butylphenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, tris[2,4-bis(1,1-dimethylpropyl)phenyl] phosphite, tris(mono / di-tert-butylphenyl) phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, and didecylmonophenyl phosphate. Examples of various phosphite esters include tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, 4,4'-butylidene-bis(3-methyl-6-t-butylphenyl-di-tridecyl phosphite), cyclic neopentanetetraylbis(2,6-di-t-butyl-4-methylphenyl phosphite), and 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane. Among these, trialkyl phosphites such as tristearyl phosphite are preferred.
[0089] Furthermore, as the organic phosphite compound, a phosphite ester having at least one oxetane group can also be used. Such an oxetane-containing phosphite ester may have one, two, or three oxetane groups. Examples of oxetane group-containing phosphite esters include tris[(3-ethyloxetan-3-yl)methyl]phosphite, bis[(3-ethyloxetan-3-yl)methyl]phosphite, mono[(3-ethyloxetan-3-yl)methyl]phosphite, tris[(3-pentyloxetan-3-yl)methyl]phosphite, bis[(3-pentyloxetan-3-yl)methyl]phosphite, and tris[(3-hexa Decyloxetan-3-yl)methyl]phosphite, bis[(3-hexadecyloxetan-3-yl)methyl]phosphite, tris[(3-phenyloxetan-3-yl)methyl]phosphite, bis[(3-phenyloxetan-3-yl)methyl]phosphite, tris[(3-p-tolyloxetan-3-yl)methyl]phosphite, bis[(3-p-tolyloxetan-3-yl)methyl]phosphite Tris[(3-benzyloxetan-3-yl)methyl]phosphite, bis[(3-benzyloxetan-3-yl)methyl]phosphite, phenylbis[(3-ethyloxetan-3-yl)methyl]phosphite, 2-phenoxyspiro(1,3,2-dioxaphospholinane-5,3'-oxetane), 3,3-bis[spiro(oxetane-3',5”-(1,3,2”-dioxa-2”-phospholinane)) These are [-oxymethyl]oxetane and P,P'-[(1-methylethylidene)-di-4,1-phenylene]-P,P,P',P'-tetrakis[(3-ethyl-3-oxetanyl)methyl]phosphite. Additionally, oxetane group-containing phosphite esters described in U.S. Patent No. 3,209,013 can be used as appropriate. Using oxetane group-containing phosphite esters makes it easier to increase the color intensity after the dye has developed.
[0090] The organic phosphate compound is preferably an organic phosphate ester compound or a metal salt of an organic phosphate ester compound, and the metal is more preferably at least one metal selected from Ia, IIa, IIb, IIIa and IIIb of the periodic table, with magnesium, barium, calcium, zinc and aluminum being even more preferred, and magnesium, calcium or zinc being particularly preferred. Furthermore, as organic phosphate ester compounds, acidic organic phosphate esters and their metal salts are preferred. Examples of acidic organic phosphate esters include dialkyl acid phosphates, monoalkyl acid phosphates, diaryl acid phosphates, and monoalkylmonoaryl acid phosphates. The alkyl group in the acidic organic phosphate ester is, for example, an alkyl group having 1 to 30 carbon atoms, but the number of carbon atoms is preferably 2 to 25, more preferably 6 to 23. The number of carbon atoms in the aryl group may be around 6 to 30.
[0091] Preferred specific examples of organophosphate ester compounds include, as acidic organophosphate esters, distearyl acid phosphate and monostearyl acid phosphate. Furthermore, examples of metal salts of acidic organophosphate esters include bis(distearyl acid phosphate) zinc salt, monostearyl acid phosphate zinc salt, tris(distearyl acid phosphate) aluminum salt, a salt of monostearyl acid phosphate and two monostearyl acid phosphate aluminum salts, monostearyl acid phosphate, and distearyl acid phosphate. Among these, distearyl acid phosphate and monostearyl acid phosphate are even more preferred.
[0092] Examples of organic phosphonite compounds include tetrakis(2,4-di-iso-propylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,4-di-n-butylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,3'-biphenylenediphosphonite, and tetrakis(2,4-di-tert-butylphenyl)-3,3'-biphenylenediphosphonite. Examples include tetrakis(2,6-di-iso-propylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,6-di-n-butylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,4'-biphenylenediphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,3'-biphenylenediphosphonite, and tetrakis(2,6-di-tert-butylphenyl)-3,3'-biphenylenediphosphonite.
[0093] Among the phosphorus compounds mentioned above, at least one selected from organic phosphite compounds and organic phosphate ester compounds is preferred from the viewpoint of improving thermal stability, inhibiting oxidation, and inhibiting foaming. Furthermore, it is preferable to use organic phosphite compounds in combination with antioxidants described later, and more specifically, it is preferable to use them in combination with phenolic antioxidants. By using them in combination with phenolic antioxidants, foaming that occurs in resin composition (I) can be effectively suppressed. In addition, it is possible to effectively suppress the decrease in molecular weight and yellowing of the resin during extrusion film formation, and to achieve both stability during extrusion film formation and long-term stability as a molded product.
[0094] Furthermore, the phosphorus-based compound can also be used as a transesterification inhibitor to suppress the transesterification reaction between polyester resin and polycarbonate resin. Therefore, when resin composition (I) contains both polyester resin and polycarbonate resin as resin (A), transesterification in resin composition (I) can also be prevented. In addition, when resin composition (I) contains either polyester resin or polycarbonate resin, transesterification with polycarbonate resin or polyester resin contained in layers adjacent to resin layer (I) can also be prevented in a laminated film including a resin layer (I) formed from resin composition (I). The resin composition (I) may use one of the above-mentioned heat stabilizers alone, or two or more may be used in combination.
[0095] (Antioxidant) Examples of antioxidants that can be used include phenolic antioxidants and sulfur-based antioxidants. Among these, phenolic antioxidants are preferred.
[0096] Examples of phenolic antioxidants include α-tocopherol, 4-methoxyphenol, 4-hydroxyphenyl (meth)acrylate, β-tocopherol, 2,6-di-tert-butylphenol, 2,6-di-tert-4-methoxyphenol, 2-tert-butyl-4-methoxyphenol, 2,4-dimethyl-6-tert-butylphenol, 2,6-di-tert-butyl-4-methylphenol (dibutylhydroxytoluene, BHT), and stearyl-β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate. Among these, 2,6-di-tert-butyl-4-methylphenol (dibutylhydroxytoluene, BHT) is preferred.
[0097] Examples of sulfur-based antioxidants include thiodipropionic acid, dilauryl thiodipropionate, distearyl thiodipropionate, lauryl stearyl thiodipropionate, dimyristyl thiodipropionate, distearyl-β,β'-thiodibutyrate, thiobis(β-naphthol), thiobis(N-phenyl-β-naphthylamine), 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, tetramethylthiuram monosulfide, tetramethylthiuram disulfide, and nickel dibutyldithiocarbamate.
[0098] The foaming described above is more likely to occur when a polycarbonate resin with a high molecular weight is used as resin (A). Therefore, it is preferable that the resin composition (I) uses a high molecular weight polycarbonate resin with a high molecular weight as resin (A), and also contains an additive (X) when it contains a filler. Specifically, a high molecular weight polycarbonate resin is a polycarbonate resin with a mass average molecular weight of 58,000 or more, preferably a polycarbonate resin with a mass average molecular weight of 60,000 or more, and more preferably a polycarbonate resin with a mass average molecular weight of 63,000 to 120,000. On the other hand, when using a low molecular weight polycarbonate resin as the polycarbonate resin in the resin composition (I), foaming is less likely to occur, so even if it contains a filler, it does not need to contain additive (X). Specifically, the low molecular weight polycarbonate resin is a polycarbonate resin with a mass average molecular weight of less than 58,000, preferably a polycarbonate resin with a mass average molecular weight of 56,000 or less, and more preferably a polycarbonate resin with a mass average molecular weight of 20,000 or more and 54,000 or less.
[0099] The content of additive (X) in the resin composition (I) is preferably 0.01 parts by mass or more and 3 parts by mass or less per 100 parts by mass of resin (A). By having an additive (X) content of 0.01 parts by mass or more, the effect of including additive (X) can be appropriately exerted, for example, foaming can be effectively suppressed. Also, by having an additive (X) content of 3 parts by mass or less, an effect commensurate with the content can be exerted. From these viewpoints, the content of additive (X) is more preferably 0.05 parts by mass or more, even more preferably 0.07 parts by mass or more, even more preferably 2 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.6 parts by mass or less. In the resin composition (I), as described above, a heat stabilizer and an antioxidant may be used in combination as additive (X). In this case, the mass ratio of the antioxidant to the heat stabilizer (antioxidant / heat stabilizer) is preferably 1 / 9 or more and 9 / 1 or less, more preferably 2 / 8 or more and 8 / 2 or less, and even more preferably 3 / 7 or more and 7 / 3 or less.
[0100] The resin composition (I) may contain additives other than those listed above. Examples of such additives include colorants, lubricants, process stabilizers, UV absorbers, light stabilizers, matting agents, processing aids, metal deactivators, residual polymerization catalyst deactivators, antibacterial and antifungal agents, antiviral agents, and flame retardants. These additives may be used individually or in combination of two or more.
[0101] The resin composition (I) may be obtained by mixing the raw materials constituting the resin composition (I), such as resin (A), compound (B), and additives other than compound (B). The mixing of the raw materials may be carried out by melt-kneading while heating in an extruder, plast mill, etc. Here, the temperature during kneading should be, for example, 180°C to 320°C, preferably 200°C to 310°C. More preferably, the temperature is between 220°C and 300°C.
[0102] In one embodiment, resin composition (I) is used for cards or passports. When resin composition (I) is used for cards or passports, it is necessary to heat it to a relatively high temperature during film molding, etc. However, even when heated to a high temperature, the use of compound (B) described above prevents the generation of eye-irritating compounds due to the antistatic agent. However, resin composition (I) may be used for purposes other than cards or passports. Also, while resin composition (I) may be used in films as described later, it may also be used in purposes other than films.
[0103] <film> The film of the present invention (this film) has a resin layer (I) made of the resin composition (I) described above. This film may be a single-layer film consisting of a single resin layer (I), or a multilayer film having at least one resin layer (I). In a multilayer film, it is preferable that the resin layer (I) constitutes at least one surface layer of this film. The surface layer is the outermost layer in a multilayer structure. In a multilayer film, by having a resin layer (I) containing compound (B) constitute the surface layer, antistatic performance can be efficiently imparted to this film.
[0104] The laminated film may contain a resin layer (II) other than resin layer (I). Resin layer (II) is a layer containing resin (A), and it is preferable that resin (A) in resin layer (II) is a thermoplastic resin. Therefore, it is preferable that both resin layer (I) and resin layer (II) use a thermoplastic resin as resin (A). By having resin layer (II) also contain a thermoplastic resin in addition to resin layer (I), cards or passports can be easily formed by heat pressing using the laminated film. Furthermore, the molding of the laminated film itself becomes easier.
[0105] The resin (A) used in the resin layer (II) can be appropriately selected from the resins listed in the resin composition (I), but it is preferable to include either polycarbonate resin or polyester resin. Using these resins in the resin layer (II) improves the durability and processability of the laminated film. Furthermore, from the viewpoint of impact resistance, heat resistance, and bending resistance, it is preferable that the resin (A) in the resin layer (II) contains polycarbonate resin. Therefore, it is preferable that both resin layer (I) and resin layer (II) in the laminated film contain either polycarbonate resin or polyester resin, and more preferably polycarbonate resin. Details of the polycarbonate resin and polyester resin used in resin layer (II) are as described above. Furthermore, the resin (A) in resin layer (I) and the resin (A) in resin layer (II) may be the same or different.
[0106] The resin layer (II) may consist of resin (A) alone, or it may consist of a resin composition (II) containing additives in addition to resin (A). The additives used in the resin layer (II) are not particularly limited, but include additives other than compound (B) described above, such as antistatic agents other than compound (B), laser colorants, fillers, impact modifiers, and additive (X). Other examples include colorants, lubricants, process stabilizers, ultraviolet absorbers, light stabilizers, matting agents, processing aids, metal deactivators, residual polymerization catalyst deactivators, antibacterial and antifungal agents, antiviral agents, and flame retardants. These additives may be used individually or in combination of two or more. These additives are as described in the above-mentioned resin composition (I), and the content of each additive relative to resin (A) is also as described above, so their description is omitted. In resin composition (II), resin (A) preferably contains polycarbonate resin as the main component, and the amount of polycarbonate resin is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin (A) contained in resin composition (II).
[0107] The layer structure of the laminated film is not particularly limited and may consist of two or more layers, but it is preferable to have a surface layer / middle layer / surface layer structure in which surface layers are provided on both sides of the middle layer. When the laminated film has a surface layer / middle layer / surface layer structure, it may consist of these three layers, but it may also have a structure of three or more layers, such as having an adhesive layer between the surface layer and the middle layer, or having two or more middle layers. In a laminated film having a surface layer / middle layer / surface layer structure, it is preferable that at least one of the surface layers is the resin layer (I), and more preferable that both surface layers are the resin layer (I). Having both surface layers be the resin layer (I) further improves the antistatic properties of the film. On the other hand, the middle layer may be any layer containing resin layer (A), and may be resin layer (I) or resin layer (II), but resin layer (II) is preferred. By using resin layer (II) in the middle layer, the content of compound (B) in the entire film can be reduced while providing the film with appropriate antistatic performance.
[0108] In the case of a laminated film, if two or more resin layers (I) are provided, the resin compositions (I) forming each resin layer (I) may have the same composition or different compositions. The same applies to resin layer (II). Furthermore, in a laminated film, if a resin layer (I) and a resin layer (II) are provided, the resin compositions (I) and (II) forming them may contain the same additive or may contain different additives. Also, if resin composition (I) and resin composition (II) contain the same additive, the amounts of that additive may be the same or different.
[0109] When a laminated film is used, for example, as a laser marking sheet and has a surface layer / middle layer / surface layer structure, it is preferable that the middle layer contains a laser colorant. Therefore, it is preferable that both surface layers are resin layers (I) containing resin (A) and compound (B), and the middle layer is a resin layer (II) containing resin (A) and a laser colorant.
[0110] Furthermore, when the laminated film is used as, for example, a core sheet or a printed sheet, and has a surface layer / middle layer / surface layer structure, it is preferable that both the surface layer and the middle layer contain a filler in order to ensure opacity. Therefore, when used as, for example, a core sheet or a printed sheet, it is preferable that both surface layers are resin layers (I) containing resin (A), a filler, and a compound (B), and the middle layer is a resin layer (II) containing resin (A) and a filler. In this case, it is preferable that both surface layers further contain an impact absorber, and further additives (X) may be contained in both surface layers and the middle layer.
[0111] The thickness of this film is not particularly limited and can be adjusted as appropriate depending on the intended use, but for example, it is 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, even more preferably 20 μm or more, and even more preferably 40 μm or more. Alternatively, it may be 1000 μm or less, preferably 500 μm or less, more preferably 300 μm or less, and even more preferably 200 μm or less. Setting the thickness of this film above a certain level makes it easier for the film to perform its appropriate function. For example, it makes it easier to ensure opacity when a filler is included. Also, having a laser colorant makes it easier to perform laser marking appropriately. On the other hand, setting the thickness below a certain level makes it easier to make cards and passports thinner, and makes it easier to ensure transparency when used as a transparent film, for example.
[0112] Furthermore, the thickness of the resin layer (I) in this film is not particularly limited and can be adjusted as appropriate depending on the purpose of use, but for example, it is 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 20 μm or more. Alternatively, for example, it may be 800 μm or less, preferably 400 μm or less, more preferably 200 μm or less, and even more preferably 150 μm or less. Setting the thickness of the resin layer (I) to be above the lower limit makes it easier to impart appropriate antistatic performance to the film. Also, setting the thickness of the resin layer (I) to be below the upper limit prevents the film from becoming unnecessarily thick. Note that the thickness of the resin layer (I) in the film refers to the total thickness if two or more resin layers (I) are provided in the film.
[0113] Furthermore, when this film has a surface layer / middle layer / surface layer structure, the thickness ratio of each surface layer to the middle layer (each surface layer / middle layer) is preferably 0.03 to 0.85, more preferably 0.05 to 0.7, even more preferably 0.1 to 0.5, and even more preferably 0.15 to 0.35. By keeping the thickness ratio within the above range, the surface layer and middle layer can each perform their appropriate functions more easily, and the laminated film can more easily exhibit antistatic properties.
[0114] This film has a surface resistance of 1 × 10 14 It is preferable that the surface resistance is less than Ω / □. 14 A value less than Ω / □ makes it easier to impart appropriate antistatic properties to this film. To further enhance the antistatic properties, the surface resistance of this film should be 5 × 10 13 It is preferable that the value is Ω / □ or less, and 2 × 10 13 It is even more preferable that the ratio is less than or equal to Ω / □, and 7 × 10 12 It is even more preferable that the ratio be less than or equal to Ω / □. The surface resistance of this film is not particularly limited, but practically, for example, 1 × 10⁻⁶ 9 It is Ω / □ or greater, and from the perspective that it does not require excessive amounts of compound (B), etc., 1 × 10 10 A value of Ω / □ or greater is preferable, and 1 × 10 11A ratio of Ω / □ or greater is preferable. The surface resistance of this film is preferably such that the surface resistance of one of its two surfaces is as described above, but it is preferable that the surface resistance of both surfaces is as described above.
[0115] (Method of manufacturing this film) This film can be manufactured by known methods, but it is preferable to obtain a resin composition (I) for forming the film as described above and then make the resin composition (I) into a film. The method for making the resin composition (I) into a film is not particularly limited, and may be press molding or extrusion molding, but extrusion molding is preferred in terms of productivity and cost.
[0116] Furthermore, if the film is a laminated film, resin compositions for forming each layer may be prepared, and multiple resin layers may be laminated by a known lamination method while forming each resin layer from each resin composition. Alternatively, a resin composition for forming another resin layer may be melt-extruded and laminated onto a resin layer formed from any of the resin compositions. A multilayer structure may also be formed by co-extrusion. From the viewpoint of productivity and cost, it is preferable to adopt the co-extrusion method. Here, the extrusion temperature is, for example, 180°C to 320°C, preferably 200°C to 310°C, and more preferably 220°C to 300°C. In a laminated film, the resin composition for forming each layer is preferably obtained by mixing components for forming each layer according to the composition of each layer. For example, in a laminated film comprising a resin layer (I) and a resin layer (II), a resin composition (I) for forming the resin layer (I) and a resin composition (II) for forming the resin layer (II) are prepared, and the laminated film is formed using the resin compositions (I) and (II).
[0117] The resin composition (I) may also be molded into shapes other than film. For example, it can be molded into various shapes such as plates, fibers, rods, bottles, tubes, etc., or into various shapes by injection molding, etc.
[0118] <Card or passport> In one embodiment, this film is used for cards or passports. Examples of cards include IC cards, magnetic cards, driver's licenses, residence cards, qualification certificates, employee IDs, student IDs, My Number cards, seal registration certificates, vehicle registration certificates, tag cards, prepaid cards, cash cards, credit cards, ETC cards, SIM cards, and B-CAS cards.
[0119] A card or passport (more specifically, the data pages of a passport) may include a core sheet. In addition to the core sheet, the card or passport may include at least one of a laser-marked sheet, a printed sheet, and a protective sheet. The passport or card may be manufactured by overlapping the core sheet and one or more sheets selected from the sheets other than the core sheet, pressing and heat-fusing them, and then performing die-cutting or similar processes. Alternatively, instead of heat-fusing, adhesives or the like may be used to bond the sheets together as appropriate.
[0120] In one embodiment of the present invention, a card or passport comprises the above-described film. A card or passport is usually composed of multiple resin films, at least one of which may be the above-described film. Therefore, in a card or passport, the above-described film may be used in at least one of, for example, a core sheet, a laser marking sheet, a printing sheet, and a protective sheet.
[0121] The core sheet preferably constitutes an inlet sheet that incorporates inlets such as IC chips and antennas. The inlet sheet is preferably constructed by laminating two or more resin films. By forming the inlet sheet with multiple resin films, it becomes easier to embed inlets such as IC chips and antennas, and the inlets such as IC chips can be properly concealed. In the core sheet, each resin film may consist of a single layer film or a laminated film consisting of multiple resin layers. The core sheet may contain a filler in the resin layers that make up the single layer film or in each resin layer that makes up the laminated film. At least one of the resin films that make up the core sheet may be made of the above-described film.
[0122] The thickness of the core sheet is not particularly limited, but is preferably 100 μm to 500 μm, more preferably 200 μm to 460 μm, even more preferably 250 μm to 440 μm, and even more preferably 280 μm to 420 μm. By making the core sheet thickness 100 μm or more, inlets such as IC chips can be properly concealed by the inlet sheet. Furthermore, by making it 500 μm or less, it becomes easier to add various functions to the data pages and cards by making the parts other than the core sheet thicker without making the passport data pages and cards unnecessarily thick.
[0123] In the case of a passport or card, a laser marking sheet may be further laminated on one or both sides of the core sheet. The laser marking sheet is a sheet on which personal information is printed by laser printing. Personal information is information used to identify the passport or cardholder, and includes personal name, personal ID, card number, etc.
[0124] Laser marking sheets are often formed from a resin film, which may be a single-layer film or a laminated film having two or more resin layers. Preferably, the laser marking sheet includes a resin layer containing a laser colorant; in the case of a single-layer film, the single resin layer may contain the laser colorant. In the case of a laminated film, the laser marking sheet may have a structure in which, for example, surface layers are provided on both sides of a middle layer, and the middle layer may contain the laser colorant. Laser marking sheets are typically transparent films. The laser marking sheet may be composed of the film described above. The thickness of the laser marking sheet is not particularly limited, but is preferably 15 μm to 400 μm, more preferably 30 μm to 300 μm, even more preferably 40 μm to 250 μm, and even more preferably 60 μm to 200 μm. A thickness of 15 μm or more allows for appropriate printing of various information by laser. A thickness of 400 μm or less prevents the passport or card from becoming excessively thick.
[0125] A printing sheet is a sheet on which fixed information is printed before multiple sheets are laminated and integrated. Fixed information is information other than the personal information mentioned above, and is information that does not change even if the card or passport is different. The fixed information may be printed on the printing sheet with known inks such as photocuring or thermocuring inks. The printing sheet may consist of a single-layer film or a laminated film consisting of multiple resin layers. The resin layers constituting the single-layer film or each resin layer constituting the laminated film may contain a filler. The printing sheet is a sheet placed on the outside of the core sheet. If a laser marking sheet is also provided, the printing sheet may be placed between the inlet sheet and the laser marking sheet.
[0126] The protective sheet used in passports or cards, also known as an oversheet, generally forms the outermost layer on the data pages of the card or passport. Therefore, when laser-marked sheets or printed sheets are laminated, the protective sheet should be laminated on the outside of these. When the protective sheet is laminated on the outside of the laser-marked sheet, it suppresses the so-called "blistering" that occurs when the laser-printed area is exposed to laser light. The protective sheet may be made of a resin film, but it may also be made of the aforementioned film. Furthermore, the protective sheet may be made of a single-layer film or a laminated film. Typically, the protective sheet is made of a transparent film.
[0127] The resin films used in the core sheet, laser marking sheet, printed sheet, and cover sheet may be composed of the present film as described above, but other resin films may be used as long as the card or passport has at least one of the present film. Other resin films may be single-layer films or laminated films as described above. The resin used in each resin layer constituting the resin film is not particularly limited and may be polyester resin, polycarbonate resin, or a combination of these, but other resins may also be used.
[0128] The stacked structure of the data pages or card in a passport is not particularly limited, but may have one of the following stacked structures, for example (1) to (6). (1) Protective sheet / Laser marking sheet / Core sheet / Printed sheet / Protective sheet (2) Protective sheet / Laser marking sheet / Core sheet / Laser marking sheet / Protective sheet (3) Protective sheet / Laser marking sheet / Printed sheet / Core sheet / Printed sheet / Laser marking sheet / Protective sheet (4) Protective sheet / Laser marking sheet / Printed sheet / Core sheet / Laser marking sheet / Protective sheet (5) Protective sheet / Laser marking sheet / Core sheet / Protective sheet (6) Protective sheet / Laser marking sheet / Printed sheet / Core sheet / Protective sheet The passport or card preferably has the laminated structure of (1) above. In the laminated structures of (1) to (6) above, protective sheets are provided on both outermost surfaces, but one or both of the protective sheets may be omitted as appropriate.
[0129] Furthermore, the data pages and cards of the passport may be equipped with security features such as lenticular printing, hologram printing, and security threads, which may be appropriately placed, for example, between the protective sheet and the laser marking sheet, between the laser marking sheet and the printing sheet, or between the laser marking sheet and the inlet sheet.
[0130] Furthermore, a hinge sheet may be provided in the passport. The hinge sheet is a sheet that serves to securely bind the data pages together with the passport cover and other visa sheets, etc. The hinge sheet may be positioned to protrude from the inlet sheet, for example, so as to be connected to the core sheet. Alternatively, the hinge sheet may be placed, for example, between the inlet sheet and the printing sheet, laser marking sheet, or protective sheet, and laminated within the data pages so that a portion of it protrudes from the inlet sheet. [Examples]
[0131] Examples and comparative examples are shown below, but these do not limit the present invention in any way.
[0132] The evaluation method is as follows: (1) Surface resistance Under conditions of 23±2℃ and relative humidity (RH) 50±10%, the surface resistivity was measured by applying a voltage of 500V for 30 seconds using the following measuring device. Measurement device: Highresta UP (manufactured by Mitsubishi Chemical Analytech Co., Ltd.) Upper limit for resistance measurement: 9.99 × 10⁻⁶ 13 Ω / □
[0133] (2) Eye irritation during film manufacturing The presence or absence of eye irritation was assessed near the nozzle from which the film is extruded. If eye irritation occurred after being in the vicinity for 5 minutes, it was rated as "yes," and if no eye irritation occurred after being in the vicinity for 5 minutes, it was rated as "no."
[0134] The raw materials used in this embodiment are as follows: PC: Bisphenol A homopolycarbonate (interfacial polymerization method), mass-average molecular weight: approx. 72,000, melt flow rate (300°C, 1.2 kgf): 4 g / 10 min, glass transition temperature: 150°C Antistatic agent 1 (compound (B)): The compound shown in formula (1-1). Antistatic agent 2: The compound shown by the following formula (5-1). [ka] Antistatic agent 3: A compound represented by the following formula (5-2). [ka]
[0135] [Example 1] Each component constituting the resin layer (I) was dry-blended according to the formulations shown in Table 1, kneaded at 290°C using an extruder, extruded through a die at 290°C, and cooled on a casting roll at approximately 120°C to obtain a 100 μm thick film consisting of a single layer of resin layer (I). The evaluation results of the obtained film are shown in Table 1.
[0136] [Example 2, Comparative Example 1] The procedure was carried out in the same manner as in Example 1, except that the composition of the resin layer (I) was changed as shown in Table 1.
[0137] [Example 3] Each component constituting resin layer (I) was blended according to the formulations shown in Table 1, kneaded at 280°C using an extruder, and extruded at 280°C as resin layer (I) (surface layer) through a 2-type, 3-layer multi-manifold die. Similarly, the polycarbonate resin constituting resin layer (II) was kneaded at 280°C using an extruder and extruded at 280°C as resin layer (II) (middle layer) through the same die. The laminate formed by stacking the extruded layers was cooled on a casting roll at approximately 120°C to obtain a laminated film consisting of a surface layer / middle layer / surface layer with a thickness ratio of 1 / 4 / 1 and a total thickness of 100 μm. The evaluation results of the obtained laminated film are shown in Table 1.
[0138] [Examples 4, 5, Comparative Example 2] The procedure was carried out in the same manner as in Example 3, except that the composition of the resin layer (I) was changed as shown in Table 1.
[0139] [Comparative Example 3] The procedure was carried out in the same manner as in Example 3, except that the composition of the resin layer (I) was changed as shown in Table 1, and the total thickness was changed to 105 μm.
[0140] [Table 1]
[0141] As described above, in Examples 1 to 5, by using compound (B) having a specific chemical structure in the resin composition (I), the surface resistance value was lowered, resulting in good antistatic performance, while also reducing eye irritation during film manufacturing and improving the working environment. Furthermore, as shown in Examples 3 to 5, by incorporating compound (B) into the surface layer of the laminated film, it was possible to obtain good antistatic performance while reducing the amount of compound (B) used in the film. On the other hand, in Comparative Examples 1 to 3, although phosphonium and bissulfonylimide salts were used as antistatic agents, compound (B) having a specific chemical structure was not used, and therefore it was not possible to improve the working environment while maintaining good antistatic performance.
Claims
1. A laminated film comprising a middle layer containing resin (A) and two surface layers provided on both sides of the middle layer, Both surface layers are resin layers (I) made of a resin composition containing resin (A), compound (B) represented by the following general formula (1), and a laser colorant. The aforementioned middle layer is a resin layer (II) containing resin (A), The thickness ratio of each surface layer to the middle layer (each surface layer / middle layer) is 0.15 or more and 0.35 or less. The content of compound (B) is 0.1 parts by mass or more and 1 part by mass or less per 100 parts by mass of resin (A). The aforementioned resin (A) contains 90% by mass or more of polycarbonate resin. The surface resistance of the aforementioned film is 9.9 × 10 11 Ω / □ or more 1×10 14 A film for cards or passports that is less than Ω / □. (R 11 ) 4 P + ・(R 12 SO 2 ) 2 N - (1) (In the above formula (1), R 11 Each of these independently represents a hydrocarbon group, and there are three R's. 11 The number of carbon atoms is 1 to 4, and there is one R 11 The number of carbon atoms is 1 to 7. 12 Each of these independently represents a hydrocarbon group containing a fluorine atom.
2. In the above general formula (1), all R 11 The card or passport film according to claim 1, wherein the carbon atoms have 1 to 4.
Citation Information
Patent Citations
Roof backing
JP1977075024A
Display element
JP2007334006A
Adhesive composition and adhesive film
JP2011006595A
Polycarbonate resin composition and compact thereof
JP2014129488A
Negative electrode for secondary batteries, secondary battery, battery pack, electric vehicle, energy storage system, electric tool and electronic device
WO2019022044A1