Laser processing machine

Abstract

To further suppress a molten material from scattering.SOLUTION: A laser beam machine 10 according to the disclosure comprises a laser emitting part 200 that emits a laser beam to a processing point 500 and a chamber 100 having a hollow part through which the laser emitting part 200 is communicated with the processing point 500. The chamber 100 comprises an air inflow path 130 into which air is flown through an air inflow ports 110 formed in an inner wall 150 forming the hollow part and an air absorption path 140 that absorbs air through an air absorption port 120 formed on a surface opposing to a surface on which the air inflow port 110 is formed. The hollow part has a rectangular shape cross section. Two or more of air inflow ports 110 are formed at a long side portion 150a of the inner wall 150. In a long side portion 150b opposing to the long side portion 150a, portions corresponding to the air inflow ports 110 are walls. In the long side portion 150a, a portion corresponding to the air absorption port 120 is a wall. The air absorption path 140 rises from the air absorption port 120 toward an end at an outer side.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This disclosure relates to a laser processing machine.

Background Art

[0002] In a laser processing machine that irradiates a workpiece with a laser, the melt generated by the laser irradiation may scatter and adhere to an optical system such as a lens. For example, Patent Document 1 discloses a technique for protecting an optical system from the scattering of the melt by supplying gas into a nozzle and generating a negative pressure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The inventors have found the following problems with respect to a laser processing machine. If the melt remains without being completely recovered, there is a risk of deterioration of the laser processing efficiency due to contamination of the optical system and the workpiece. In addition, there is a risk of shortening the equipment life due to contamination of the inside of the nozzle and peripheral equipment. Therefore, further suppression of the scattering of the melt is required.

[0005] This disclosure has been made in view of such problems, and an object thereof is to provide a laser processing machine capable of further suppressing the scattering of the melt.

Means for Solving the Problems

[0006] One aspect for achieving the above object is a laser processing machine, a laser irradiation unit that irradiates a workpiece with a laser, The system comprises a chamber having a hollow portion that connects the laser irradiation section to the processing point of the workpiece, The aforementioned chamber contains, An air inlet passage is provided in the middle of the inner wall forming the hollow portion of the chamber, and air flows into the chamber through the air inlet. An air intake passage that communicates with an air intake port provided on the inner wall surface facing the inner wall surface on which the air inlet is provided, and draws air from inside the chamber through the air intake port, A system is in place, The hollow portion of the chamber has a rectangular cross-section when cut in a direction perpendicular to the direction of laser propagation. At least two of the air inlets are provided on the longer side portion of the inner wall of the chamber. In the inner wall of the chamber opposite to the inner wall where the air inlet is provided, the portion corresponding to the air inlet is a wall, In the inner wall of the chamber facing the air intake, the portion corresponding to the air intake is a wall. The air intake passage has an inclination that rises from the air intake port toward the outer end. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide a laser processing machine that can further suppress the scattering of molten material. [Brief explanation of the drawing]

[0008] [Figure 1] This is a plan view of the chamber provided in the laser processing machine according to the embodiment. [Figure 2] This diagram shows the configuration of a laser processing machine according to an embodiment. [Figure 3] This is a diagram showing the shape of the chamber. [Figure 4] This graph shows the relationship between the shape of the chamber and the number of residual particles. [Modes for carrying out the invention]

[0009] Embodiments of the present disclosure will be described in detail below with reference to the drawings. In each drawing, identical or corresponding elements are denoted by the same reference numerals, and redundant explanations are omitted where necessary for clarity. In this specification, "substantially identical" means that they appear to have the same shape and dimensions to a human eye.

[0010] First, the configuration of the laser processing machine 10 according to this embodiment will be described with reference to Figures 1 and 2. As shown in Figure 1, the laser processing machine 10 comprises at least a chamber 100 and a laser irradiation unit 200. The laser processing machine 10 may further include peripheral members such as 600 and 700. In addition to the laser processing machine 10, Figure 1 also shows workpieces 300 and 400.

[0011] The laser processing machine 10 is a device that processes a workpiece by irradiating it with a laser. In the example shown in Figure 1, the laser processing machine 10 joins two workpieces 300 and 400 by laser irradiation. The processing point 500 shown in Figure 1 is the laser irradiation position. The laser irradiation unit 200 irradiates the laser toward the processing point 500. The workpieces 300 and 400 are melted and joined by the laser near the processing point 500. When the workpieces 300 and 400 receive the laser light, they are rapidly heated, momentarily exceeding their melting or boiling points, and the molten material and molten vapor may diffuse into the surrounding area. Hereinafter, the molten material and molten vapor will be referred to as "molten material". Note that the laser processing machine 10 may perform processing other than joining workpieces. For example, the laser processing machine 10 may perform drilling or other similar operations.

[0012] The peripheral members 600 and 700 are components positioned around the chamber 100 and the workpieces 300 and 400, and have various functions. In the example shown in Figure 1, the peripheral members 600 and 700 are components that position the chamber 100 and the workpieces 300 and 400.

[0013] The chamber 100 connects the laser irradiation unit 200 to the processing point 500. As shown in Figure 1, the chamber 100 is a hollow member, and the laser passes through the hollow portion provided in the chamber 100. Figure 2 is a view of the chamber 100 from the laser irradiation unit 200 side. As shown in Figure 2, the chamber 100 has a rectangular hollow. Specifically, the chamber 100 has a hollow whose cross-section is rectangular when cut in a direction perpendicular to the direction of laser propagation. That is, the inner wall 150 of the chamber 100 has two opposing long side portions 150a and 150b, and two short side portions (not shown) connecting the ends of the long side portions.

[0014] Chamber 100 is provided with at least two air inlet passages 130. In the example shown in Figure 2, chamber 100 is provided with two air inlet passages 130a and 130b. The air inlet passages 130 communicate with an air inlet 110, and air flows into chamber 100 through the air inlet 110. The air inlet 110 is provided in the middle of the inner wall 150 of chamber 100, as shown in Figure 1. Specifically, at least two air inlets 110 are provided on the long side portion of the inner wall 150. In the example shown in Figure 2, two air inlets 110a and 110b are provided on the long side portion 150a of the inner wall 150.

[0015] At least one air inlet passage 140 is provided in the chamber 100. In the example shown in FIG. 2, one air inlet passage 140 is provided in the chamber 100. The air inlet passage 140 communicates with the air inlet 120 and sucks the air in the chamber 100 through the air inlet 120. As shown in FIG. 1, the air inlet 120 is provided in the middle part of the inner wall 150 of the chamber 100. Specifically, the air inlet 120 is provided in the long side portion facing the long side portion where the air inlet 110 of the inner wall 150 is provided. In the example shown in FIG. 2, one air inlet 120 is provided in the long side portion 150b of the inner wall 150. As shown in FIG. 1, the air inlet passage 140 has an inclination rising from the air inlet 120 toward the outer end of the chamber 100. In other words, the air inlet passage 140 is angled such that the air inlet 120 faces the processing point 500. Further, as shown in FIG. 1, the air inlet 120 is preferably provided at substantially the same height as the air inlets 110a and 110b. By providing the air inlet 120 at substantially the same height as the air inlets 110a and 110b, it is possible to suppress the short circuit of the air flow in the chamber 100 and accurately generate a vertical swirling flow in the chamber 100.

[0016] In the long side portion 150b facing the long side portion 150a where the air inlets 110a and 110b are provided, the portions corresponding to the air inlets 110a and 110b are walls. In other words, no air inlet 120 is provided at the portions corresponding to the air inlets 110a and 110b in the long side portion 150b. Also, in the long side portion 150a facing the long side portion 150b where the air inlet 120 is provided, the portion corresponding to the air inlet 120 is a wall. In other words, no air inlets 110a and 110b are provided at the portions corresponding to the air inlet 120 in the long side portion 150a. In the example shown in FIG. 2, the air inlet 120 is provided at a position corresponding to the portion between the two air inlets 110a and 110b in the long side portion 150b.

[0017] The arrows shown in FIGS. 1 and 2 indicate the air flow in the chamber 100. As shown in FIGS. 1 and 2, the air flowing in from the air inflow paths 130a and 130b through the air inlet ports 110a and 110b generates a swirling flow that rotates in the vertical and horizontal directions within the chamber 100. The swirling air within the chamber 100 is sucked into the air suction path 140 through the air suction port 120. Since the swirling flow extends in the vertical direction, i.e., the direction of laser travel, the air flow reaches the processing point 500. Since the swirling flow extends in the horizontal direction, i.e., the direction perpendicular to the direction of laser travel, even when the processing point 500 is linear, the melt can be discharged from within the chamber 100.

[0018] The melt generated when the laser irradiates the processing point 500 rides on the swirling flow generated within the chamber 100 and is discharged from the air suction path 140 together with the air. Therefore, adhesion of the melt to the workpieces 300 and 400 and each member constituting the laser processing machine 10 can be suppressed. Since the laser processing machine 10 discharges the melt by the air flow, the running cost can be reduced compared to a device that discharges the melt using an inert gas or the like. Further, since the laser processing machine 10 does not require a mechanism for supplying an inert gas, its structure is simple and control is easy. Since the melt contained in the air has a larger mass than the air, there is a risk of deviating from the air flow due to inertial force within the air suction path 140 or the like. Therefore, from the viewpoint of suppressing adhesion of the melt to the inside of the air suction path 140, it is preferable to provide the air suction path 140 in a straight line.

Example

[0019] Next, an example of the present invention will be described. Models of the chambers according to Example 1 and Comparative Examples 1 to 3 are shown in FIG. 3. FIG. 3 is a schematic diagram showing a model of the chamber cut along the direction in which the air inflow paths 130a and 130b extend. The models of the chambers according to Example 1 and Comparative Examples 1 to 3 are all provided with two air inflow paths 130a and 130b and one air suction path 140.

[0020] Example 1 is a model in which air inlet passages 130a, 130b and air intake passage 140 are provided on the long side portion of the inner wall of the chamber, and the air intake passage 140 has an inclination from the air intake port 120 toward the outer end. That is, it is a model corresponding to the chamber 100 described in the above embodiment. Comparative Example 1 is a model in which air inlet passages 130a, 130b and air intake passage 140 are provided on the long side portion of the inner wall of the chamber, and the air intake passage 140 extends substantially horizontally from the air intake port 120 toward the outer end. Comparative Example 2 is a model in which air inlet passages 130a, 130b and air intake passage 140 are provided on the short side portion of the inner wall of the chamber, and the air intake passage 140 extends substantially horizontally from the air intake port 120 toward the outer end. Comparative Example 3 is a model in which air inlet passages 130a, 130b and an air intake passage 140 are provided on the short side portion of the inner wall of the chamber, and the air intake passage 140 has a slope from the air intake port 120 toward the outer end.

[0021] The discharge performance was evaluated using the model shown in Figure 3. During the evaluation, virtual particles simulating molten material were placed near the laser processing point in the chamber, air was drawn in, and the number of virtual particles remaining in the chamber was measured. Initially, the virtual particles were assumed to be floating and to adhere to the inner wall surface upon impact. The evaluation results are shown in Figure 4. Comparing Example 1 and Comparative Example 1 with Comparative Examples 2 and 3, it was found that by providing air inlets 110 and air intakes 120 on the long side of the inner wall of the chamber, many virtual particles could be discharged by the airflow. Furthermore, comparing Example 1 with Comparative Example 1, it was found that providing a slope in the air intake passage 140 could further discharge virtual particles. Thus, Example 1 demonstrated superior discharge performance compared to Comparative Examples 1-3, as it could discharge many virtual particles in a shorter time.

[0022] This disclosure is not limited to the embodiments described above, and may be modified as appropriate without departing from its spirit. [Explanation of Symbols]

[0023] 10 Laser processing machines 100 chambers 110 (110a, 110b) Air inlet 120 Air intake 130 (130a, 130b) Air inlet 140 Air intake passage 150 Inner wall 150a, 150b Long side portion 200 Laser irradiation section 300,400 work 500 processing points 600,700 Peripheral components

Claims

1. A laser irradiation unit that irradiates the workpiece with a laser, The system comprises a chamber having a hollow portion that connects the laser irradiation section to the processing point of the workpiece, The aforementioned chamber contains, An air inlet passage is provided in the middle of the inner wall forming the hollow portion of the chamber, and air flows into the chamber through the air inlet. An air intake passage that communicates with an air intake port provided on the inner wall surface facing the inner wall surface on which the air inlet is provided, and draws air from inside the chamber through the air intake port, A system is in place, The hollow portion of the chamber has a rectangular cross-section when cut in a direction perpendicular to the direction of laser propagation. At least two of the air inlets are provided on the longer side portion of the inner wall of the chamber. In the inner wall of the chamber opposite to the inner wall where the air inlet is provided, the portion corresponding to the air inlet is a wall, In the inner wall of the chamber facing the air intake, the portion corresponding to the air intake is a wall. The air intake passage has an inclination that rises from the air intake port toward the outer end. Laser processing machine.

2. The laser processing machine according to claim 1, wherein the air inlet is provided at approximately the same height as the air intake port.

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