Retention structure and retention method

Abstract

A holding structure according to one aspect of the present invention is for installing a target object on a substrate on which an inertial sensor is disposed, the holding structure comprising two or more connection structure parts. The two or more connection structure parts are formed in two or more places of the substrate and connect the substrate to the target object. In addition, the two or more connection structure parts are each formed by an adhesion structure in which an adhesive material is provided between the target object and the substrate which are disposed so as to be spaced apart from each other. Alternatively, one among the two or more connection structure parts is formed by a pressing structure which presses and fixes the substrate to the target object, and the other is formed by the adhesion structure.

Description

Technical Field

[0001] The present technology relates to a holding structure and a holding method applicable when installing an inertial sensor.

Background Art

[0002] Patent Document 1 discloses a vibration isolation system for an inertial sensor. In this vibration isolation system, an elastomer member is disposed around the inertial sensor. Thereby, it is possible to suppress the influence of impact energy, vibration energy, and acoustic energy on the inertial sensor (paragraphs

[0001] and

[0024] of the specification of Patent Document 1, FIG. 7, etc.).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Thus, there is a need for a technology capable of improving the measurement accuracy of an inertial sensor.

[0005] In view of the above circumstances, an object of the present technology is to provide a holding structure and a holding method capable of improving the measurement accuracy of an inertial sensor.

Means for Solving the Problems

[0006] To achieve the above object, a holding structure according to one aspect of the present technology is a holding structure for installing a substrate on which an inertial sensor is disposed on an object, and includes two or more connection structure portions. The two or more connection structure portions are formed at two or more locations on the substrate and connect the substrate to the object. Furthermore, each of the two or more connecting structures is configured as an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other, or one of the two or more connecting structures is configured as a pressing structure that presses and fixes the substrate to the object, and the others are configured as the adhesive structure.

[0007] In this holding structure, two or more connection structures are provided at two or more locations on the substrate for connecting the substrate to an object. Each of the two or more connection structures is configured as an adhesive structure in which adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other. Alternatively, one of the two or more connection structures is configured as a pressing structure that presses and fixes the substrate to the object, while the others are configured as adhesive structures. This makes it possible to improve the measurement accuracy of the inertial sensor.

[0008] The pressing structure may include a structure that fixes the substrate to the object via a fastening member.

[0009] The fastening member may be a screw.

[0010] The pressing structure may include a structure that clamps and fixes the substrate with the object.

[0011] The object may have a first fixing part and a second fixing part that sandwich and fix the substrate. In this case, at least one of the first fixing part or the second fixing part may fix the substrate via an elastic body.

[0012] The adhesive structure may include a structure in which the adhesive material is provided with respect to the position of the hole when the insertion portion of the substrate is inserted into the hole of the object.

[0013] The aforementioned hole may be a through hole.

[0014] The adhesive material may be provided so as to cover at least a portion of the opening of the hole.

[0015] The adhesive material may be filled into the inside of the hole.

[0016] The adhesive structure may include a structure in which the adhesive material is provided with respect to the position of the hole when the insertion portion of the object is inserted into the hole of the substrate.

[0017] Each of the two or more connecting structures may be made of the adhesive structure.

[0018] One of the two or more connecting structures may be made up of the pressing structure, and the others may be made up of the adhesive structure.

[0019] The inertial sensor may be configured to include at least one of an acceleration sensor or an angular velocity sensor.

[0020] The position of each of the two or more connection structures may be set with reference to the position of the inertial sensor on the substrate.

[0021] The position of the inertial sensor may be set based on the position of each of the two or more connection structures.

[0022] The inertial sensor may be positioned at the center of gravity of each of the two or more connection structures.

[0023] The holding structure may be configured to mount the substrate so as to rotate integrally with a rotating part that is configured to rotate around a predetermined axis of rotation, which is the object to be mounted. In this case, an imaging unit may be mounted on the rotating part so as to rotate integrally with the rotating part.

[0024] A holding method according to one embodiment of this technology is a holding method for installing a substrate on which an inertial sensor is arranged on an object, and includes connecting each of two or more locations on the substrate to the object by an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other.

[0025] A holding method according to one embodiment of the present technology is a holding method for installing a substrate on which an inertial sensor is disposed on an object, and includes connecting one of two or more locations of the substrate to the object by a pressing structure that presses and fixes the substrate to the object. The other of the two or more locations is connected to the object by an adhesion structure in which an adhesive material is provided between the object and the substrate that are arranged to be spaced apart from each other.

Brief Description of the Drawings

[0026] [Figure 1] It is a perspective view showing an external appearance example of an imaging device. [Figure 2] It is a functional block diagram for explaining the basic operation of an imaging device. [Figure 3] It is a side view of the imaging device seen from the positive direction side in the Z direction. [Figure 4] It is a side view of the imaging device seen from the negative direction side in the Y direction. [Figure 5] It is a cross-sectional view taken along line B-B in FIG. 4. [Figure 6] It is a perspective view showing the internal configuration of the imaging device. [Figure 7] It is a cross-sectional view taken along line A-A in FIG. 3. [Figure 8] It is a schematic diagram showing an overview of the holding structure. [Figure 9] It is a schematic diagram showing an example of a variation of the adhesion structure. [Figure 10] It is a schematic diagram showing an example of a variation of the adhesion structure. [Figure 11] It is a schematic diagram showing an example of a variation of the adhesion structure. [Figure 12] It is a schematic diagram showing an example of a variation of the adhesion structure. [Figure 13] It is a schematic diagram showing an example of a variation of the adhesion structure. [Figure 14] It is a schematic diagram showing an example of a pressing structure. [Figure 15] It is a schematic diagram showing an example of a pressing structure. [Figure 16] This is a schematic diagram showing an example of the arrangement configuration of the connecting structure. [Figure 17] This is a schematic diagram showing an example of the arrangement configuration of the connecting structure. [Modes for carrying out the invention]

[0027] The embodiments of this technology will be described below with reference to the drawings.

[0028] [Overview of the imaging device] Figure 1 is a perspective view showing an example of the external appearance of the imaging device according to this embodiment. As shown in Figure 1, the imaging device 100 has a roughly cylindrical shape. Figure 1 shows the external appearance of the imaging device 100, with the bottom 2a (of which there are two bottom parts 2, 2a and 2b) and the side part 3 visible.

[0029] In the following explanation, we will view the bottom 2a of the imaging device 100 from the front, with the depth direction (the direction perpendicular to the bottom 2a) being the X direction, the left-right direction being the Y direction, and the up-down direction being the Z direction. Additionally, the positive and negative X directions shown in Figure 1 may be described as the front direction and the back direction. The positive and negative Y directions may be described as the right direction and the left direction. The positive and negative Z directions may be described as the up direction and the down direction. Furthermore, the above expressions may be used to indicate the direction in which the imaging device 100 is viewed. For example, the expression "view the imaging device 100 from the positive X-direction side" means "view the imaging device 100 from the tip of the arrow indicating the X-axis." Of course, the orientation in which the imaging device 100 is used is not limited when applying this technology.

[0030] The imaging device 100 has a rotating part 1 that is configured to rotate around a predetermined axis of rotation. In this embodiment, the rotating part 1 has a bottom part 2 (2a and 2b) and a side part 3, and is configured to be rotatable about a rotation axis 5 that passes through the center of the bottom part 2 and extends in the X direction. The rotating part 1 can rotate around the rotation axis 5 in either a clockwise or counterclockwise direction when viewed from the X direction. In Figure 1, the rotation direction of the rotating part 1 is indicated by a thick arrow. Furthermore, the rotating part 1 can also function as the housing for the imaging device 100.

[0031] As shown in Figure 1, a window portion 4 is provided on the side portion 3 of the rotating portion 1. Specifically, a recess 6 is formed on the side 3 of the rotating part 1, and a window 4 is positioned on the bottom surface of the recess 6. The window 4 has a roughly rectangular shape when viewed from the front. The shape of the window 4 is not limited. The window portion 4 is constructed as a transparent material. In this disclosure, transparency includes not only complete transparency but also translucency and colored transparency.

[0032] Inside the rotating section 1, a camera module 21 (see Figure 5) is installed in a position opposite the window section 4. The camera module 21 is installed on the rotating part 1 such that the imaging direction 7 faces outward from the rotating part 1. As shown in Figure 1, the camera module 21 is installed so that the imaging direction 7 is perpendicular to the window part 4. The imaging direction 7 is the axial direction of the imaging optical axis of the camera module 21. The camera module 21 corresponds to one embodiment of the imaging unit according to this technology.

[0033] As will be explained in more detail later, the camera module 21 is installed on the rotating part 1 so as to rotate integrally with the rotating part 1. Therefore, the imaging direction of the camera module 21 changes in accordance with the rotation of the rotating part 1. For example, by controlling the rotation of the rotating part 1, the imaging direction of the camera module 21 can be arbitrarily set over the entire 360-degree circumference around the rotation axis 5.

[0034] [Rotation control] Figure 2 is a functional block diagram illustrating the basic operation of the imaging device 100. As shown in Figure 2, the imaging device 100 includes an inertial sensor 10, a controller 11, and a rotational drive unit 12.

[0035] The inertial sensor 10 is a sensor capable of measuring inertial force. In this embodiment, the inertial sensor 10 is configured to include at least one of an acceleration sensor or an angular velocity sensor. In this embodiment, an IMU (Inertial Measurement Unit) sensor is used as the inertial sensor 10. An IMU sensor is also called an inertial measuring device. The IMU sensor is capable of detecting (sensing) the acceleration and angular velocity of the imaging device 100. For example, the IMU sensor can detect the acceleration and angular velocity of the imaging device 100 in relation to three mutually orthogonal axes. Of course, the inertial sensor 10 may consist of only an acceleration sensor, or only an angular velocity sensor. Furthermore, any configuration may be adopted for the inertial sensor 10.

[0036] The controller 11 has hardware necessary for the configuration of a computer, such as a CPU, ROM, RAM, and HDD. For example, the CPU loads a program related to this technology, which is pre-recorded in the ROM, into the RAM and executes it, thereby executing processing related to rotation control, etc., related to this technology. As the controller 11, a device such as an FPGA or other PLD, or an ASIC, may be used. Alternatively, any computer, such as a PC (Personal Computer), may function as the controller 11. As shown in Figure 2, in this embodiment, the rotation control unit 13 is configured as a functional block by the CPU executing a predetermined program. Of course, dedicated hardware such as an IC (integrated circuit) may be used to realize the functional block. The program may be installed, for example, via various storage media. Alternatively, the program may be installed via the internet or similar means. The type of recording medium on which the program is stored is not limited; any computer-readable recording medium may be used. For example, any non-transient storage medium that is computer-readable may be used. Typically, the controller 11 is configured inside the imaging device 100. However, it is not limited to this configuration; the controller 11 may be configured outside the imaging device 100 and connected to communicate with the inertial sensor 10, the rotary drive unit 12, etc.

[0037] The rotary drive unit 12 rotates the rotating part 1. In this embodiment, a motor 16 (see Figure 5) is used as the rotary drive unit 12. The motor 16 is connected to the bottom 2b of the rotating part 1, which is opposite to the bottom 2a. The specific configuration of the motor 16 is not limited. Furthermore, a device other than the motor 16 may be used as the rotary drive unit 12.

[0038] The rotation control unit 13 controls the rotation of the rotating part 1 based on the detection results of the inertial sensor 10. For example, an operator (user) of the imaging device 100 inputs an operation to control the imaging direction of the camera module 21. The rotation control unit 13 controls the imaging direction 7 of the camera module 21 according to the operator's operation. In this process, the rotation control unit 13 controls the rotational movement of the rotation drive unit 12 based on the detection results (sensing results) of the inertial sensor 10. This makes it possible to control the rotation of the rotating unit 1 with high precision, and to control the imaging direction 7 of the camera module 21 with high precision.

[0039] For example, the imaging device 100 can be mounted on a mobile device such as a drone. Based on the detection results of the inertial sensor 10, it is also possible to acquire information regarding the position and orientation of the imaging device 100 (camera module 21), enabling high-precision imaging by the imaging device 100. As a result, it becomes possible to capture high-quality images. Furthermore, the specific algorithm for rotation control by the rotation control unit 13 is not limited.

[0040] [Configuration of the imaging device] Referring to Figures 3 to 7, a specific example of the configuration of the imaging device 100 will be described. First, the explanation of each figure will be provided. Figure 3 is a side view of the imaging device 100 as seen from the positive Z-direction side. Figure 4 is a side view of the imaging device 100 as seen from the negative direction in the Y direction. Figure 5 is a cross-sectional view along line BB in Figure 4. Figure 6 is a perspective view showing the internal configuration of the imaging device 100. Figure 6 is a perspective view of the front holder 18 as seen from the inside. Figure 7 is a cross-sectional view along line AA in Figure 3.

[0041] As shown in Figures 5 and 6, the imaging device 100 includes a window section 4, a motor 16, a flexible circuit board for the motor 17, a front holder 18, a camera module 21, a flexible circuit board for the camera 22, an IMU circuit board 26, a circuit board screw 27, and a rear holder 29.

[0042] The front holder 18 can function as the housing for the imaging device 100. The front holder 18 has a semi-cylindrical portion 30 and a bottom portion 31. The semi-cylindrical portion 30 and the bottom portion 31 are made of, for example, a rigid material. This protects the various components of the imaging device 100 from external impacts. Of course, the specific material and shape of the front holder 18 are not limited.

[0043] In this embodiment, the semi-cylindrical portion 30 has a shape that is substantially equivalent to one of the two halves of a cylinder (i.e., a hollow cylinder) when it is divided into two by a plane containing the central axis of the cylinder. In other words, as shown in Figure 6, the semi-cylindrical portion 30 has a shape like a cylinder cut in half. The semi-cylindrical portion 30 is positioned such that the central axis of the cylinder coincides with the axis of rotation 5.

[0044] The semi-cylindrical portion 30 has an inner surface 32 on the side facing the rotation axis 5, and an outer surface 33 on the opposite side of the inner surface 32. The semi-cylindrical portion 30 also has two semi-ring-shaped arcuate surfaces 34 (34a and 34b) facing each other along the X direction.

[0045] As shown in Figure 7, an internal space 61 is formed on the inner surface 32 side of the semi-cylindrical portion 30. The inner surface 32 of the semi-cylindrical portion 30 is configured with a mechanism for holding various components, such as the camera module 21 and the IMU substrate 26, which are arranged in the internal space 61.

[0046] The bottom portion 31 has a roughly disc shape. The bottom portion 31 is positioned such that half of its circumference lies along the inner surface 32 of the semi-cylindrical portion 30, and is located inside the arcuate surface 34b on the negative X-direction side (i.e., on the positive X-direction side).

[0047] A motor 16 is fixed to the bottom 31. The motor 16 is fixed to the bottom 31, for example, by screwing, gluing, or press-fitting. Alternatively, the inside of the motor 16 may be directly attached to the front holder 18. The method of fixing the motor 16 is not limited to these methods.

[0048] The rear holder 29, together with the front holder 18, can function as the housing of the imaging device 100. The rear holder 29 has a semi-cylindrical portion 40 and a bottom portion 41. The semi-cylindrical portion 40 and the bottom portion 41 are made of, for example, a rigid material. Of course, the specific material and shape are not limited. The semi-cylindrical portion 40 of the rear holder 29 has a shape that is generally the same as the semi-cylindrical portion 30 of the front holder 18. Similarly, the bottom portion 41 of the rear holder 29 has a shape that is generally the same as the bottom portion 31 of the front holder 18. The inner surface 42 of the semi-cylindrical portion 40 is configured with a mechanism for holding various components of the imaging device 100, similar to the inner surface 32 of the semi-cylindrical portion 30 of the front holder 18.

[0049] A cylindrical portion 46 is formed at the base 41. As shown in Figure 3, the cylindrical portion 46 is configured to protrude from the base 41 in the positive direction of the X-axis. A circular opening is formed at the tip of the cylindrical portion 46.

[0050] The bottom portion 41 is configured such that half of its circumference aligns with the inner surface 42 of the semi-cylindrical portion 40. Furthermore, the bottom portion 41 is positioned approximately equal to the end of the semi-cylindrical portion 40 (the part closest to the positive direction in the X direction) when viewed from the Y direction.

[0051] In Figure 3, the portion below the position of the rotation axis 5 becomes the semi-cylindrical portion 30 of the front holder 18. The portion above the position of the rotation axis 5 becomes the semi-cylindrical portion 40 of the rear holder 29.

[0052] The front holder 18 is positioned on the positive side of the Y-direction of the imaging device 100. The rear holder 29 is positioned on the negative side of the Y-direction. Furthermore, other components are arranged in the internal space 61 inside the front holder 18 and the rear holder 29. In other words, by fitting the front holder 18 and the rear holder 29 together, various components are held inside the front holder 18 and the rear holder 29, and the imaging device 100 is assembled as shown in Figure 1.

[0053] The semi-cylindrical portion 30 of the front holder 18 and the semi-cylindrical portion 40 of the rear holder 29 constitute the side portion 3 shown in Figure 1. Furthermore, the bottom portion 2b is formed by the bottom portion 31 of the front holder 18, and the bottom portion 2a is formed by the bottom portion 41 of the rear holder 29. In other words, the entire rotating portion 1 shown in Figure 1 is formed by the front holder 18 and the rear holder 29. The front holder 18 and the rear holder 29 correspond to one embodiment of the rotating part according to this technology.

[0054] The camera module 21 performs imaging outside the imaging device 100. Any camera may be used as the camera module 21. For example, a digital camera capable of capturing still images or moving images, or an infrared camera may be used. Alternatively, a camera with a distance-measuring function, such as a ToF (Time Of Flight) camera, a stereo camera, or a monocular camera, may be used. The camera module 21 has various mechanisms for imaging, such as a lens system. The camera module 21 corresponds to one embodiment of the imaging unit according to this technology. The specific shape of the camera module 21 is not limited.

[0055] The camera module 21 rotates integrally with the front holder 18 and the rear holder 29 in accordance with the rotation of the front holder 18 and the rear holder 29. In addition, the imaging direction 7 of the camera module 21 changes in accordance with the rotation of the front holder 18 and the rear holder 29.

[0056] The flexible circuit board 22 for the camera is a circuit board for driving the camera module 21. In this embodiment, the flexible circuit board 22 for the camera is connected to the IMU circuit board 26. The camera flexible circuit board 22 has a rectangular shape and is bendable. One end of the camera flexible circuit board 22 is connected to the camera module 21. The other end of the camera flexible circuit board 22 is connected to the IMU circuit board 26. In this embodiment, as shown in Figure 5, the flexible circuit board 22 for the camera is folded into three sections along the Z direction and connected. When viewed from the Z direction, the folded flexible circuit board 22 for the camera has a roughly U-shape. In this embodiment, the operation of the camera module 21 is controlled by the controller 11. Power is supplied and control signals are output via the camera's flexible circuit board 22. The method of connecting the camera module 21 and the IMU board 26 is not limited, and any method can be used. For example, the camera module 21 and the IMU board 26 may be connected by a harness or the like.

[0057] The motor 16 rotates the front holder 18. In this embodiment, a power supply (not shown) is connected to the motor 16, and the motor 16 is driven by the power supplied from the power supply. Of course, the method of driving the motor 16 is not limited, and any method may be used. When the motor 16 is driven, the front holder 18 and the rear holder 29 rotate together. In addition, each component constituting the imaging device 100, such as the IMU substrate 26, rotates together as a single unit.

[0058] Furthermore, in this embodiment, the motor 16 is fixed to the outside of the imaging device 100. Specifically, for example, the motor 16 is fixed to the mobile body on which the imaging device 100 is mounted. In this case, the imaging device 100 will rotate relative to the moving object. In this way, the rotation of the imaging device 100 is achieved.

[0059] The flexible circuit board 17 for the motor is a circuit board for driving the motor 16. The flexible circuit board 17 for the motor is bendable. As shown in Figure 5, one end of the flexible circuit board 17 for the motor is connected to the motor 16. The other end is connected to the negative side in the Y direction (the side not facing the camera module 21) of the IMU circuit board 26. In this embodiment, the operation of the motor 16 is controlled by the rotation control unit 13 of the controller 11. Power is supplied and control signals are output via the motor flexible circuit board 17. The method of connecting the motor 16 and the IMU board 26 is not limited, and any method can be used. For example, the motor 16 and the IMU board 26 may be connected by a harness or the like.

[0060] As shown in Figure 6, the IMU sensor 60 is placed on the IMU substrate 26. The IMU substrate 26 is a substrate having a roughly rectangular plate shape. The IMU substrate 26 corresponds to one embodiment of the substrate according to this technology. As shown in Figure 6, the upper right and lower right corners of the IMU substrate 26 are each provided with a protrusion 55 that projects in the negative direction of the X-axis. The protrusions 55 are provided for insertion into the front holder 18.

[0061] Furthermore, a through-hole 56 is formed near the upper left corner. The IMU substrate 26 is screwed to the front holder 18 through the through-hole 56. Specifically, as shown in Figure 6, the front holder 18 has a protrusion 57 positioned in the Y direction that extends into the through hole 56. A screw hole is also provided in the protrusion 57.

[0062] As shown in Figure 6, the substrate screw 27 passes through the through hole 56 and is fitted into the screw hole formed in the protrusion 57. This fastens the IMU substrate 26 with screws. In this embodiment, a screw having a head and a threaded portion is used as the circuit board screw 27. Of course, the specific material and shape of the circuit board screw 27 are not limited.

[0063] Furthermore, a through-hole 58 is provided in the bottom portion 31 of the front holder 18 at a position corresponding to the protrusion 55 of the IMU substrate 26. In other words, two through-holes 58 are provided in the bottom portion 31. A protrusion 55 is inserted into each through-hole 58. Furthermore, adhesive 59 is applied at the insertion position to bond the IMU substrate 26 to the front holder 18.

[0064] In this embodiment, the IMU board 26 is connected to the front holder 18 by one screw and two adhesive points.

[0065] As shown in Figure 6, the IMU sensor 60 is positioned on the negative side of the Y-direction of the IMU substrate 26 (the side opposite to the camera module 21). The IMU sensor 60 corresponds to one embodiment of the inertial sensor according to this technology. Additionally, a flexible circuit board 22 for the camera and a flexible circuit board 17 for the motor (not shown) are connected. Furthermore, the specific configuration of the IMU board 26 is not limited. For example, if the controller 11 is provided on the IMU board 26, hardware such as the CPU, ROM, RAM, and HDD may also be arranged on the IMU board 26.

[0066] [Layout of IMU board and camera module] The specific arrangement of the IMU board 26 and the camera module 21 will be described below. In this embodiment, the IMU substrate 26 is installed on the front holder 18 so as to be spaced apart from the camera module 21.

[0067] In Figure 7, the camera module 21 is installed on the positive Y-direction side of the imaging device 100. The IMU board 26 is installed near the rotation axis 5, on the negative Y-direction side of the rotation axis 5. In this way, the IMU substrate 26 and the camera module 21 are arranged so as to be spaced apart from each other, and a space is formed between the IMU substrate 26 and the camera module 21. Furthermore, in this embodiment, the IMU substrate 26 and the camera module 21 are arranged opposite each other with the rotation axis 5 in between. Specifically, the front holder 18 and the rear holder 29 have an internal space 61 in which the rotation axis 5 is located. The IMU substrate 26 is installed in the front holder 18 such that, when the internal space 61 is divided into a first divided space including the center of gravity of the camera module 21 and a second divided space not including the center of gravity of the camera module 21 by a plane perpendicular to the perpendicular from the center of gravity of the camera module 21 to the rotation axis 5 and including the rotation axis 5, the center of gravity is included in the second divided space.

[0068] Here, the internal space 61 is the space enclosed by the front holder 18 and the rear holder 29. As shown in Figure 7, an internal space 61 is formed as a roughly cylindrical space surrounded by the front holder 18 and the rear holder 29. The rotating shaft 5 is located inside the internal space 61.

[0069] The center of gravity 62 of the camera module 21 is the mass center of gravity of the camera module 21 (i.e., the center of gravity considering density). In Figure 7, the center of gravity 62 of the camera module 21 is shown as a black rectangle. The perpendicular line 63 from the center of gravity 62 of the camera module 21 to the axis of rotation 5 passes through the center of gravity 62 of the camera module 21 and is a straight line parallel to the Y-axis. In Figure 7, the perpendicular line 63 is shown as a solid line.

[0070] The plane perpendicular to the perpendicular line 63 and containing the axis of rotation 5 is, in other words, the plane perpendicular to the Y-axis and containing the axis of rotation 5 (parallel to the Z-axis). Therefore, it is a plane that contains the axis of rotation 5 and is parallel to the XZ plane. Hereafter, this plane will be referred to as the dividing plane 64. Figure 7 schematically illustrates the dividing plane 64 as a vertically elongated rectangle.

[0071] Furthermore, the dividing plane 64 divides the internal space 61 into two spaces. In other words, as shown in Figure 7, the internal space 61 is divided into the space on the right side of the dividing plane 64 and the space on the left side. The space on the right includes the center of gravity of the camera module 21. In other words, the space on the right corresponds to the first divided space 65 that includes the center of gravity of the camera module 21. Furthermore, the space on the left does not include the center of gravity of the camera module 21. In other words, the space on the left corresponds to a second divided space 66 that does not include the center of gravity of the camera module 21.

[0072] When the internal space 61 is divided in this way, the IMU substrate 26 is placed on the front holder 18 such that its center of gravity is included in the second divided space 66. The center of gravity of the IMU substrate 26 is also the mass center of gravity of the IMU substrate 26. In Figure 7, the center of gravity 67 of the IMU substrate 26 is shown as a black rectangle. As shown in Figure 7, the centroid 67 of the IMU substrate 26 is contained within the second divided space 66.

[0073] Thus, when the internal space 61 of the front holder 18 and the rear holder 29 is divided into two spaces by a plane that includes the rotation axis 5 and is parallel to the XZ plane, the center of gravity of the IMU substrate 26 and the center of gravity of the camera module 21 are located in different spaces (on opposite sides).

[0074] For example, if the center of mass and the center of position are different in the camera module 21 and the IMU board 26, an arrangement configuration may be adopted in which the centers of mass are located in different spaces, but the centers of position are located in the same space.

[0075] Furthermore, in this embodiment, the camera module 21 is installed so as to be included in the first divided space 65. The IMU substrate 26 is installed so as to be included in the second divided space 66. In other words, the camera module 21 is installed so that not only its center of gravity 62, but the entire camera module 21 is included in the first divided space 65. Similarly, the IMU substrate 26 is installed so that not only its center of gravity 67, but the entire IMU substrate 26 is included in the second divided space 66. As shown in Figure 7, in this embodiment, the entire camera module 21 is included in the first divided space 65, and the entire IMU substrate 26 is also included in the second divided space 66.

[0076] Of course, an arrangement configuration may be adopted in which, for example, only the center of gravity of the camera module 21 is included in the first divided space 65, and the entire camera module 21 is not included in the first divided space 65. For example, if only the end of the camera module 21 is included in the second divided space 66, and the majority of the rest is included in the first divided space 65, the center of gravity 62 is located in the first divided space 65, and thus such an arrangement configuration is possible. The same applies to the IMU board 26.

[0077] Furthermore, in this embodiment, the IMU substrate 26 is arranged in a direction perpendicular to the imaging direction 7 of the camera module 21. In other words, the surface of the IMU substrate 26 is oriented perpendicular to the imaging direction 7. As shown in Figure 7, the imaging direction 7 is parallel to the Y-axis. Furthermore, the plane of the IMU substrate 26 is positioned parallel to the XZ plane. In other words, the imaging direction 7 and the plane of the IMU substrate 26 are orthogonal. Of course, the orientation of the IMU substrate 26 is not limited. For example, the surface of the IMU substrate 26 may be positioned at an angle (not parallel) to the XZ plane.

[0078] In this way, by arranging the IMU substrate 26 and the camera module 21 at a distance from each other, it becomes possible to suppress the transfer of heat from the camera module 21 to the IMU substrate 26. In other words, it becomes possible to improve the measurement accuracy of the IMU sensor 60.

[0079] Furthermore, in this embodiment, the IMU substrate 26 and the camera module 21 are arranged in different spaces (the first divided space 65 and the second divided space 66). As a result, the center of gravity of the entire imaging device 100 is located near the rotation axis 5.

[0080] The IMU substrate 26 and the camera module 21 are components with a certain amount of mass. When these are placed in the same space (for example, when the camera module 21 is placed on the IMU substrate 26), the mass will be unevenly distributed in one of the spaces. In other words, the center of gravity of the entire imaging device 100 is located away from the rotation axis 5 (towards one side of space). If the center of gravity of the entire imaging device 100 is farther from the rotation axis 5, the torque required to rotate the imaging device 100 increases. In other words, the required output from the motor 16 increases. Consequently, a load is placed on the motor 16, and the amount of heat generated from the motor 16 increases.

[0081] In this embodiment, since the center of gravity of the entire imaging device 100 is located near the rotation axis 5, the torque required for rotation is reduced, and heat generation by the motor 16 can be suppressed. This makes it possible to suppress the transfer of heat to the IMU substrate 26 and the like. Furthermore, since the required output of the motor 16 is reduced, it becomes possible to miniaturize the entire imaging device 100, including the motor 16. In addition, it becomes possible to reduce power consumption during rotation. Furthermore, since the center of gravity is adjusted by utilizing the arrangement of the IMU board 26 and the camera module 21, no other mechanism for adjusting the center of gravity is required, and the imaging device 100 is made lighter.

[0082] These effects appear when the centers of gravity of the IMU board 26 and the camera module 21 are located in different spaces. However, if not only the centers of gravity but also the entire IMU board 26 and the entire camera module 21 are placed in different spaces, an even greater effect can be obtained.

[0083] [Substrate holding structure] The following describes the general structure for holding the substrate. Figure 8 is a schematic diagram showing an overview of the holding structure 200 related to this technology.

[0084] As shown in Figures 8A and 8B, the holding structure 200 is a structure for installing the substrate 81 on which the inertial sensor 10 is located onto the object 80. The holding structure 200 is configured at two or more locations on the substrate 81 and includes two or more connecting structure parts 82 for connecting the substrate 81 to the object 80. Figures 8A and 8B show two connection structures 82 configured at two locations on the substrate 81, but three or more connection structures 82 may be configured at three or more locations on the substrate 81. Note that the inertial sensor 10, which is placed on the substrate 81, is not shown in Figures 8 to 15.

[0085] In the example shown in Figure 8A, each of the two or more connecting structures 82 is composed of an adhesive structure 83. The adhesive structure 83 is a structure in which an adhesive material is provided between the objects 80 and the substrate 81, which are arranged to be spaced apart from each other. In the example shown in Figure 8B, one of the two or more connecting structures 82 is composed of a pressing structure 84, while the others are composed of adhesive structures 83. The pressing structure 84 is a structure that presses the substrate 81 against the object 80 to fix it in place.

[0086] The examples shown in Figures 8A and 8B are not the only ones; any number of connection structures 82, such as three or four, may be configured. Furthermore, all of the connection structures 82 may be adhesive structures 83, or one may be a pressing structure 84 and all the others may be adhesive structures 83. The adhesive structure 83 and the pressing structure 84 can be composed of, for example, the following combinations of numbers. (1) When there are two connection structures 82 Two adhesive structures 83 One adhesive structure 83 and one pressing structure 84 (2) When there are three connection structures 82 Three adhesive structures 83 There are two adhesive structures 83 and one pressing structure 84. (3) When there are four connection structures 82 There are four adhesive structures 83. There are three adhesive structures 83 and one pressing structure 84. In other words, two or more connecting structures 82 are formed, of which at most one is a pressing structure 84, and all the others are adhesive structures 83. Furthermore, if the adhesive structure 83 is configured in multiple locations, each adhesive structure 83 may have a different structure and shape.

[0087] As described above, the adhesive structure 83 or the pressing structure 84 enables the connection of the substrate 81 to the object 80. In other words, the substrate 81 is installed on the object 80.

[0088] [Holding structure in imaging device] In the imaging device 100 according to this embodiment, the front holder 18 (rotating part 1) is used as the object 80, and the holding structure 200 shown in Figure 8 is employed. That is, the holding structure 200 is configured to install the IMU substrate 26 so as to rotate integrally with the front holder 18 (rotating part 1).

[0089] As shown in Figure 6, in this embodiment, the IMU substrate 26 is screwed to the protrusion 57 of the front holder 18. This enables a pressing structure 84 that presses and fixes the IMU substrate 26 to the front holder 18. In this embodiment, the pressing structure 84 employs a structure in which the IMU substrate 26 is fixed to the front holder 18 via substrate screws 27 (fastening members).

[0090] In this embodiment, the protrusions 55 of the IMU substrate 26 are inserted into two through holes 58 formed in the bottom portion 31 of the front holder 18 and bonded together with adhesive 59. This realizes an adhesive structure 83 in which an adhesive material is provided between the front holder 18 and the IMU substrate 26, which are arranged to be spaced apart from each other. In this embodiment, the adhesive structure 83 is designed such that, with the protrusion 55 (insertion portion) of the IMU substrate 26 inserted into the through hole 58 of the front holder 18, adhesive material is provided with reference to the position of the through hole 58.

[0091] In other words, in this embodiment, the holding structure 200 comprises three connection structures 82 configured at three locations on the IMU substrate 26. Of the three connecting structures 82, one is composed of a pressing structure 84. The other two connecting structures 82 are composed of adhesive structures 83.

[0092] Furthermore, the parts to which the IMU substrate 26 is connected, such as the protrusion 57 and the base 31, are sometimes referred to as holders.

[0093] In the imaging device 100, the IMU substrate 26 is connected to the front holder 18 by being screwed in at one location and bonded at two locations. Therefore, three connection structures 82 are configured. Of course, the order of screwing and gluing the IMU board 26 is not limited. For example, gluing may be done after screwing. Alternatively, the screwing points may be temporarily fastened, then glued, and then the temporarily fastened points may be screwed. Other methods of screwing and gluing may also be used.

[0094] The bonding location between the through-hole 58 formed in the bottom portion 31 and the protrusion 55 of the IMU substrate 26 corresponds to one embodiment of the adhesive structure according to this technology. In other words, in the imaging device 100, two adhesive structures 83 are configured. In this embodiment, the protrusion 55 is inserted so as to be spaced apart from the through hole 58. That is, the protrusion 55 is located within the space formed by the through hole 58 (inside the hole), but is inserted so as not to come into contact with the surface of the bottom portion 31 that forms the through hole 58. Adhesive 59 is provided in the gap formed between the protrusion 55 and the through hole 58, and in its vicinity. In other words, the separated protrusion 55 and the through hole 58 are bonded together in a way that bridges them with the adhesive 59. The adhesive 59 corresponds to one embodiment of the adhesive material according to this technology. Of course, the adhesive structure 83 is not limited to this type.

[0095] The location where the protrusion 57 of the front holder 18 and the IMU substrate 26 are screwed together corresponds to one embodiment of the pressing structure according to this technology. In other words, the imaging device 100 has one pressing structure 84. In this embodiment, the pressing structure 84 is a structure that fixes the IMU substrate 26 to the front holder 18 via substrate screws 27. Specifically, the IMU substrate 26 has through holes 56, and the threaded portion of the substrate screw 27 passes through these holes 56. Furthermore, a screw hole is formed in the protrusion 57, and the screw hole and the threaded portion engage with each other. In this way, the IMU substrate 26 is secured with screws. The substrate screw 27 corresponds to one embodiment of the fastening member and screw according to this technology.

[0096] The screw-fastened IMU board 26 is sandwiched between the heads of the board screws 27 and the protrusions 57 of the front holder 18. In other words, the IMU substrate 26 is pressed against and fixed to the front holder 18 by the heads of the substrate screws 27. Of course, the pressing structure 84 is not limited to this. That is, pressing and fixing methods other than the screw method may be employed.

[0097] By connecting the substrate 81 with two or more connection structures 82, such that one is a pressing structure 84 and all the others are adhesive structures 83, it becomes possible to improve the measurement accuracy of the IMU sensor 60 placed on the IMU substrate 26.

[0098] Specifically, the pressing structure 84 first makes it possible to stably fix the IMU substrate 26. For example, in the imaging device 100, the IMU substrate 26 is sandwiched between the head of the substrate screw 27 and the protrusion 57 of the front holder 18, and the threaded portion of the substrate screw 27 is fitted into the screw hole. As a result, even if the IMU substrate 26 is subjected to continuous vibration, the holding of the IMU substrate 26 will not weaken. In other words, the IMU substrate 26 is stably fixed.

[0099] Furthermore, the adhesive structure 83 makes it possible to fix the IMU substrate 26 without applying stress to it. Due to design errors and other factors, variations in height occur at the screw-fastened fixing points (receiving surfaces) of the circuit board. When the IMU circuit board 26 is connected in close contact (without separation) to each of the multiple receiving surfaces of different heights, the IMU circuit board 26 comes into contact with the receiving surface, and a force acts on the IMU circuit board 26 that deforms it as it tries to conform to the receiving surface. Furthermore, if the IMU substrate 26 is slightly warped due to a relative misalignment between the IMU substrate 26 and the fixing point, a force that deforms the IMU substrate 26 will similarly act upon it. This causes the IMU substrate 26 to deform, resulting in a shift in the position and angle of the IMU sensor 60 on the substrate. In other words, the measurement accuracy of the IMU sensor 60 decreases. In this embodiment, the IMU substrate 26 and the front holder 18 are spaced apart at the bonding location of the adhesive structure 83, and adhesive 59 is provided between them. Therefore, no force acts from the receiving surface, and no force acts that deforms the IMU substrate 26 due to height variations.

[0100] If the IMU substrate 26 is fixed by only one screw (pressure structure 84), the IMU sensor 60 will be greatly affected by vibrations caused by the movement of the imaging device 100 or the moving body. In other words, the IMU sensor 60 installed on the IMU substrate 26 will also vibrate. This will reduce the measurement accuracy of the IMU sensor 60.

[0101] In this embodiment, the IMU substrate 26 is fixed by one pressing structure 84 and one or more adhesive structures 83. In other words, the IMU substrate 26 is fixed at multiple points. This makes it possible to suppress the effects of vibration on the IMU substrate 26. Therefore, the measurement accuracy of the IMU sensor 60 does not decrease.

[0102] As described above, with a configuration in which one is a pressing structure 84 and all the others are adhesive structures 83, it becomes possible to stably fix the IMU substrate 26 while suppressing the force that deforms the IMU substrate 26. Furthermore, it becomes possible to suppress the effects of vibration on the IMU substrate 26. This makes it possible to improve the measurement accuracy of the IMU sensor 60.

[0103] Furthermore, the measurement accuracy of the IMU sensor 60 can also be improved by using a fixing method in which all of the connecting structure 82 are adhesive structures 83. Specifically, each adhesive structure 83 suppresses the stress acting on the IMU substrate 26 while fixing the IMU substrate 26, so no force that deforms the substrate acts upon it. Furthermore, since the IMU substrate 26 is fixed at two or more points, the effects of vibration are suppressed. This makes it possible to improve the measurement accuracy of the IMU sensor 60.

[0104] [Variations of adhesive structures] Figures 9-13 are schematic diagrams showing variations of the adhesive structure 83. In addition, on the right side of Figures 9-13, an example of a pressing structure 84 is shown, illustrating a connection point using screws.

[0105] The adhesive structure 83 includes a structure in which, with the insertion portion of the substrate 81 inserted into the hole of the object 80, adhesive 59 is applied with reference to the position of the hole. In the example shown in Figure 9, a portion of the substrate 81 is inserted into a through-hole 58 of the object 80. That is, the through-hole 58 corresponds to one embodiment of a hole in the object according to this technology. Of course, the shape of the hole in the object 80 is not limited. For example, instead of a through-hole, a recess may be provided, into which a portion of the substrate 81 may be inserted.

[0106] Furthermore, the portion of the substrate 81 inserted into the through-hole 58 corresponds to one embodiment of the insertion portion of the substrate according to this technology. In Figure 9, the insertion portion 86 is shown as a dot pattern. In the imaging device 100, the protrusion 55 formed on the IMU substrate 26 corresponds to one embodiment of the insertion portion of the substrate according to this technology.

[0107] The adhesive 59 is applied based on the position of the hole. In the example shown in Figure 9, the adhesive 59 is provided so as to cover at least a portion of the opening of the through hole 58. Specifically, adhesive material 59 is provided between the object 80 and the substrate 81 so as to cover a portion of the opening on the right side of the through hole 58. Typically, the adhesive 59 is provided such that at least a portion of the opening on the side into which the protrusion 55 is inserted is covered. Of course, this is not the only option, and the adhesive 59 may be provided so as to cover both openings.

[0108] In the example shown in Figure 10, the object 80 has a flat surface, and the substrate 81 is placed near this surface. The substrate 81 is placed spaced apart from the object 80 such that the surface of the substrate 81 is perpendicular to the flat surface of the object 80. As shown in Figure 10, adhesive 59 is applied to the upper surface of the substrate 81 in the vicinity of the object 80. In this way, the substrate 81 is bonded to the surface of the object 80.

[0109] In the example shown in Figure 11, the object 80 and the substrate 81 are placed spaced apart, and adhesive 59 is provided between the edge of the object 80 and the edge of the substrate 81. In this way, the object 80 and the substrate 81 may be bonded together by bridging each other's edges with adhesive 59.

[0110] In the example shown in Figure 12, the adhesive 59 is filled into the through hole 58. In Figure 12, the adhesive 59 is filled into all the spaces inside the through-hole 58 except for the area occupied by the insertion portion 86. That is, the adhesive 59 is filled into the space above and below the insertion portion 86 so as to completely fill any gaps. Of course, adhesive 59 may be filled into a portion of the space inside the through hole 58.

[0111] A method of providing adhesive 59 that covers at least a portion of the opening of the through hole 58 as shown in Figure 9, etc., and a method of filling the inside of the through hole 58 with adhesive 59 as shown in Figure 12 may be implemented simultaneously. In other words, a configuration may be adopted in which the adhesive 59 filled inside the through hole 58 overflows to the outside of the through hole 58 and covers the opening. Of course, the shape of the holes in the substrate 81 is not limited. For example, recesses may be provided as holes.

[0112] As shown in Figure 13, the adhesive structure may be such that, with the insertion portion of the object 80 inserted into the hole in the substrate 81, the adhesive material is applied based on the position of the hole. On the left side of Figure 13, the object 80 is shown. The object 80 has an insertion portion 88 at its upward-facing tip. In Figure 13, the insertion portion 88 is shown as a dotted pattern. The insertion portion 88 corresponds to one embodiment of the insertion portion of the object according to this technology. For example, a boss formed on the object 80 functions as an insertion part 88. Of course, the specific shape of the insertion part 88 is not limited.

[0113] The adhesive 59 is applied based on the position of the hole. In the example shown in Figure 13, the insertion portion 88 is inserted so as to protrude upward into the through hole 87. Adhesive 59 is also provided to cover the opening at the top of the through hole 87. The adhesive 59 is provided in contact with the upper part of the insertion portion 88 and the upper part of the substrate 81 near the through hole 87. This causes the substrate 81 and the object 80 to be bonded together.

[0114] Thus, various variations of the adhesive structure 83, as shown in Figures 9 to 13, can be adopted depending on the configuration of the object 80, the substrate 81, etc. For example, in the imaging device 100, if it is advantageous from a design perspective to provide through holes in the IMU substrate 26, effective bonding can be achieved by employing an adhesive structure 83 as shown in Figure 13.

[0115] In particular, in the example shown in Figure 13, the through-hole 87 may function as a positioning hole for the substrate 81. In this case, it becomes possible to accurately position the substrate 81 relative to the object 80. Furthermore, the specific structure of the adhesive structure 83 is not limited, and any structure may be adopted. For example, adhesive bonding may be performed over a wide area, such as bonding the entire edge of the substrate 81.

[0116] [Variations of pressing structures] In the imaging device 100, the IMU substrate 26 is fixed by screws, but the pressing structure 84 is not limited to this structure. The variations of the pressing structure 84 are described below.

[0117] Figures 14 and 15 are schematic diagrams showing an example of the pressing structure 84. Figures 14 and 15 illustrate different examples of the pressing structure 84. In addition, in Figures 14 and 15, the object 80 and the substrate 81 are bonded by the adhesive structure 83 in parts that are not shown.

[0118] In the example shown in Figure 14, the pressing structure 84 is a structure that clamps and fixes the substrate 81 with the object 80. As shown in Figure 14, the object 80 has a first fixing portion 89 that protrudes to the right, and a second fixing portion 90 that protrudes to the left. The substrate 81 is sandwiched between the first fixing portion 89 and the second fixing portion 90. Specifically, the first fixing portion 89 abuts against the left side surface of the substrate 81, and the second fixing portion 90 abuts against the right side surface, thereby sandwiching and pressing the substrate 81 into place.

[0119] In the imaging device 100, when such a pressing structure 84 is implemented, for example, protrusions are provided on each of the front holder 18 and the rear holder 29, and the IMU substrate 26 is sandwiched and fixed by these protrusions. In this case, the front holder 18 and the rear holder 29 correspond to the object 80. Also, for example, the protrusion on the front holder 18 corresponds to the first fixing part 89, and the protrusion on the rear holder 29 corresponds to the second fixing part 90. Of course, the specific shapes of the first fixing part 89 and the second fixing part 90 are not limited. Furthermore, the method of clamping and fixing the object 80 is also not limited, and any method may be employed.

[0120] Furthermore, at least one of the first fixing portion 89 or the second fixing portion 90 may fix the substrate 81 via an elastic body. In the example shown in Figure 15, a plate-shaped elastic body 91 is sandwiched between the first fixing part 89 and the substrate 81. Therefore, the substrate 81 is sandwiched and pressed in place so that its left side is in contact with the right side of the elastic body 91 and its right side is in contact with the second fixing part 90.

[0121] In this example, the substrate 81 is fixed via the elastic body 91 by only the first fixing part 89, but of course, the elastic body 91 may be sandwiched only between the second fixing part 90 and the substrate 81. Alternatively, the elastic body 91 may be sandwiched both between the first fixing part 89 and the substrate 81, and between the second fixing part 90 and the substrate 81.

[0122] As the elastic body 91, any material with elasticity may be used, such as rubber or a spring. Furthermore, the method of fixing the substrate 81 via the elastic body 91 is not limited. For example, the substrate 81 may be fixed by a method other than the elastic body 91 being sandwiched between the substrate 81 and the fixing part.

[0123] The pressing structure 84, which clamps and fixes the substrate 81 with the object 80, makes it possible to stably fix the substrate 81. Specifically, because the substrate 81 is strongly pressed down by the forces applied from the first fixing part 89 and the second fixing part 90, it becomes less likely that the substrate 81 will shift from its fixing point or come loose from its fixing point when an external force is applied to the substrate 81.

[0124] Furthermore, when the substrate 81 is fixed via the elastic body 91, the elasticity of the elastic body 91 can be appropriately adjusted to enable pressing and fixing with a desired force. For example, by using an elastic body 91 with high elasticity, it becomes possible to fix the substrate 81 stably with a strong force.

[0125] [Arrangement and configuration of the connection structure] In this embodiment, the position of each of the two or more connection structures 82 is set with reference to the position of the inertial sensor 10 on the substrate 81. The following describes variations in the arrangement configuration of the connecting structure 82.

[0126] Figures 16 and 17 are schematic diagrams showing an example of the arrangement configuration of the connecting structure 82. In the example shown in Figure 16, connection structures 82 are configured at three locations on the substrate 81: the upper left corner, the lower left corner, and the upper right corner. Furthermore, the inertial sensor 10 is positioned so as to be surrounded by three connection structures 82.

[0127] In the imaging device 100, the inertial sensor 10 is positioned so as to be surrounded by three connection structures 82. Specifically, in Figure 6, adhesive structures 83 are formed at two locations on the corner of the IMU substrate 26, on the negative side in the X direction and the positive side in the Z direction, and on the negative side in the X direction and the negative side in the Z direction. In addition, a pressing structure 84 is formed at the corner on the positive side in the X direction and the positive side in the Z direction. The IMU sensor 60 is positioned near the center of the IMU substrate 26, surrounded by the three connection structures 82.

[0128] In the example shown in Figure 17, connection structures 82 are configured at four locations on the substrate 81: the upper left corner, the lower left corner, the upper right corner, and near the center of the bottom edge. In this example as well, the inertial sensor 10 is positioned so as to be surrounded by four connection structures 82.

[0129] In this way, the inertial sensor 10 is positioned so as to be surrounded by, for example, two or more connection structures 82. That is, the position of the inertial sensor 10 is set based on the position of each of the two or more connection structures 82. In other words, the positions of the two or more connection structures 82 are set so as to surround the inertial sensor 10, with the position of the inertial sensor 10 as the reference point.

[0130] The method for setting the positions of the two or more connection structures 82 with respect to the position of the inertial sensor 10 is not limited. For example, the connection structure 82 may be located at a location other than the corner of the substrate 81. Furthermore, if there are two connection structures 82, for example, the connection structures 82 may be arranged such that the inertial sensor 10 is located between them. The position may be determined by any other method. Furthermore, the combination of the adhesive structure 83 and the pressing structure 84 of each connecting structure 82 is not limited.

[0131] Furthermore, in this example, the inertial sensor 10 is positioned at the center of gravity of each of the two or more connection structures 82. In Figure 16, the inertial sensor 10 is positioned at the centroid of the triangle formed by the three connecting structures 82. Furthermore, in Figure 17, the inertial sensor 10 is positioned at the centroid of the rectangle formed by the four connecting structures 82. In addition, if there are two connection structures 82, for example, the center of gravity will be the midpoint of the two connection structures 82. Therefore, the inertial sensor 10 will be positioned at the midpoint.

[0132] By setting the position of the connection structure 82 in this way, the inertial sensor 10 is stably positioned on the substrate 81. For example, as shown in Figure 16, if the connection structure 82 is configured at three locations: the upper left corner, the lower left corner, and the upper right corner, the lower right corner will not be fixed to the object 80. Therefore, when the substrate 81 vibrates, the lower right corner will be greatly affected by the vibration. In other words, if, for example, the inertial sensor 10 is placed in the lower right corner, the inertial sensor 10 will vibrate, and the accuracy of sensing will decrease.

[0133] On the other hand, the area on the substrate 81 surrounded by the connection structure 82 is less susceptible to vibration. In this embodiment, since the inertial sensor 10 is placed in the area surrounded by the connection structure 82, it is possible to suppress the effect of vibration on the inertial sensor 10. This makes it possible to improve the measurement accuracy of the inertial sensor 10.

[0134] Furthermore, among the areas enclosed by the connecting structure 82, the center of gravity of each connecting structure 82 is a location that is particularly less susceptible to vibration. In this embodiment, since the inertial sensor 10 is positioned at the center of gravity, it is possible to significantly suppress the effect of vibration on the inertial sensor 10. This makes it possible to improve the measurement accuracy of the inertial sensor 10.

[0135] Furthermore, if the substrate 81 is small, it is less susceptible to vibration. In such cases, even if the inertial sensor 10 is not surrounded by the connection structure 82, the effect of vibration on the inertial sensor 10 will not be very significant. Therefore, for example, a configuration in which connection structures 82 are formed at two locations, the upper left corner and the upper right corner of the substrate 81, and the inertial sensor 10 is positioned in the center of the substrate 81, is also possible.

[0136] In the holding structure 200 according to this embodiment, two or more connection structures 82 are provided at two or more locations on the substrate 81 for connecting the substrate 81 to the object 80. Each of the two or more connection structures 82 is composed of an adhesive structure 83 in which an adhesive material 59 is provided between the object 80 and the substrate 81, which are arranged to be spaced apart from each other. Alternatively, one of the two or more connection structures 82 is composed of a pressing structure 84 that presses and fixes the substrate 81 to the object 80, and the others are composed of adhesive structures 83. This makes it possible to improve the measurement accuracy of the inertial sensor 10.

[0137] With a configuration in which one is a pressing structure 84 and all the others are adhesive structures 83, it becomes possible to stably fix the substrate 81 while suppressing the force that deforms the substrate 81. In addition, it becomes possible to suppress the effect of vibration on the substrate 81. This makes it possible to improve the measurement accuracy of the inertial sensor 10.

[0138] Furthermore, by configuring the connection structure 82 to be entirely an adhesive structure 83, the substrate 81 is fixed while suppressing the stress acting on the substrate 81. In addition, since the substrate 81 is fixed at two or more points, the effects of vibration are suppressed. This makes it possible to improve the measurement accuracy of the inertial sensor 10.

[0139] The imaging device, holding structure, and other configurations described with reference to the drawings are merely embodiments and can be modified as needed without departing from the spirit of this technology. In other words, other arbitrary configurations may be adopted to implement this technology.

[0140] Where the word "abbreviated" is used in this disclosure, it is used solely to facilitate understanding of the explanation, and there is no special meaning in whether or not the word "abbreviated" is used. In other words, in this disclosure, concepts that define shape, size, positional relationships, state, etc., such as "center," "central," "uniform," "equal," "same," "orthogonal," "parallel," "symmetrical," "extending," "axial," "cylindrical," "ring," "annular," "rectangular," and "disk," are considered to include concepts such as "substantially centered," "substantially central," "substantially uniform," "substantially equal," "substantially the same," "substantially orthogonal," "substantially parallel," "substantially symmetrical," "substantially extending," "substantially axial," "substantially cylindrical," "substantially cylindrical," "substantially ring," "substantially annular," "substantially rectangular," and "substantially disk." For example, this includes states that fall within a predetermined range (e.g., a range of ±10%) based on criteria such as "perfectly centered," "perfectly central," "perfectly uniform," "perfectly equal," "perfectly the same," "perfectly orthogonal," "perfectly parallel," "perfectly symmetrical," "perfectly extending," "perfectly axial," "perfectly cylindrical," "perfectly cylindrical shape," "perfectly ring-shaped," "perfectly annular shape," "perfectly rectangular," and "perfectly disc-shaped." Therefore, even if the word "abbreviated" is not added, the concept may still be included in what is typically expressed with "abbreviated" added. Conversely, the state expressed with "abbreviated" does not mean that the complete state is excluded.

[0141] In this disclosure, expressions using "greater than A" such as "greater than A" and "less than A" are expressions that comprehensively include both concepts that include cases where something is equivalent to A and concepts that do not include cases where something is equivalent to A. For example, "greater than A" is not limited to cases where something is not equivalent to A, but also includes "greater than or equal to A". Similarly, "less than A" is not limited to "less than A", but also includes "less than or equal to A". When implementing this technology, you should appropriately adopt specific settings and other elements from the concepts included in "greater than A" and "less than A" so that the effects described above are achieved.

[0142] It is also possible to combine at least two of the feature features of the present technology described above. In other words, the various feature features described in each embodiment may be combined arbitrarily, regardless of the specific embodiment. Furthermore, the various effects described above are merely examples and not limiting, and other effects may also be exhibited.

[0143] Furthermore, this technology can also be configured as follows. (1) A holding structure for installing a substrate on which an inertial sensor is arranged onto an object, The substrate is configured at two or more locations and comprises two or more connection structures for connecting the substrate to the object, Each of the two or more connecting structures is configured with an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other. Alternatively, one of the two or more connecting structures may be configured as a pressing structure that presses and fixes the substrate to the object, while the others may be configured as adhesive structures. holding structure. (2) The retaining structure described in (1), The pressing structure includes a structure that fixes the substrate to the object via a fastening member. holding structure. (3)(2) The retaining structure described above, The fastening member is a screw. holding structure. (4) The retaining structure described in (1), The pressing structure includes a structure that clamps and fixes the substrate with the object. holding structure. (5)(4) The retaining structure described above, The object has a first fixing part and a second fixing part that sandwich and fix the substrate, At least one of the first fixing part or the second fixing part fixes the substrate via an elastic body. holding structure. (6) A retaining structure described in any one of (1) to (5), The adhesive structure includes a structure in which the adhesive material is provided with respect to the position of the hole, with the insertion portion of the substrate inserted into the hole of the object. holding structure. (7)(6) The retaining structure described above, The aforementioned hole is a through hole. holding structure. (8)(6) or (7) The retaining structure described above, The adhesive material is provided so as to cover at least a portion of the opening of the hole. holding structure. A retaining structure described in any one of (9)(6) to (8), The adhesive material is filled inside the hole. holding structure. (10) A retaining structure described in any one of (1) to (9), The adhesive structure includes a structure in which the adhesive material is provided with respect to the position of the hole, with the insertion portion of the object being inserted into the hole in the substrate. holding structure. A retaining structure according to any one of (11)(1) or (6) to (10), Each of the two or more connecting structures is composed of the adhesive structure. holding structure. (12) A retaining structure described in any one of (1) to (11), One of the two or more connecting structures is composed of the pressing structure, and the others are composed of the adhesive structure. holding structure. (13) A retaining structure described in any one of (1) to (12), The inertial sensor is configured to include at least one of an acceleration sensor or an angular velocity sensor. holding structure. (14) A retaining structure described in any one of (1) to (13), The position of each of the two or more connection structures is set with reference to the position of the inertial sensor on the substrate. holding structure. (15) A retaining structure described in any one of (1) to (14), The position of the inertial sensor is set based on the position of each of the two or more connection structures. holding structure. The retaining structure described in (16)(15), The inertial sensor is positioned at the center of gravity of each of the two or more connection structures. holding structure. (17) A retaining structure described in any one of (1) to (16), The substrate is configured to be installed so as to rotate integrally with the rotating part, which is the object being targeted and is configured to rotate around a predetermined axis of rotation. An imaging unit is installed on the rotating unit so as to rotate integrally with the rotating unit. holding structure. (18) A method for holding a substrate on which an inertial sensor is placed, to be installed on an object, Each of two or more locations on the substrate is connected to the object by an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged so as to be spaced apart from each other. How to hold it. (19) A method for holding a substrate on which an inertial sensor is placed, to be installed on an object, One of two or more locations on the substrate is connected to the object by a pressing structure that presses and fixes the substrate to the object. The other two or more locations mentioned above are connected to the object by an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other. How to hold it. [Explanation of Symbols]

[0144] 1... Rotating part 5…Rotation axis 7…Imaging direction 10…Inertial sensor 12…Rotating drive unit 13…Rotation control unit 16…motor 18…Front holder 21...Camera module 26…IMU board 27... Screws for circuit boards 29... Rear holder 59…Adhesive 60…IMU sensor 61…Interior space 62...Center of gravity 63... Perpendicular line 64…Dividing plane 65...First partitioned space 66...Second partitioned space 67...center of gravity 80...Target object 81... Circuit board 82...Connection structure 83...Adhesive structure 84…Pressure structure 86... Insertion part 87…Through hole 88... Insertion part 89...First fixing part 90...Second fixing part 91...Elastic body 100…Imaging device 200...retention structure

Claims

1. A holding structure for installing a substrate on which an inertial sensor is arranged onto an object, The substrate is provided with two or more connection structures configured at two or more locations on the substrate, for connecting the substrate to the object, One of the two or more connecting structures is configured as a pressing structure that presses and fixes the substrate to the object, and the others are configured as adhesive structures in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other. The pressing structure includes a structure that clamps and fixes the substrate with the object. holding structure.

2. The retaining structure according to claim 1, The pressing structure includes a structure that fixes the substrate to the object via a fastening member. holding structure.

3. The retaining structure according to claim 2, The fastening member is a screw. holding structure.

4. The retaining structure according to claim 1, The object has a first fixing part and a second fixing part that sandwich and fix the substrate, At least one of the first fixing part or the second fixing part fixes the substrate via an elastic body. holding structure.

5. The retaining structure according to claim 1, The adhesive structure includes a structure in which the adhesive material is provided with respect to the position of the hole, with the insertion portion of the substrate inserted into the hole of the object. holding structure.

6. The retaining structure according to claim 5, The aforementioned hole is a through hole. holding structure.

7. The retaining structure according to claim 5, The adhesive material is provided so as to cover at least a portion of the opening of the hole. holding structure.

8. The retaining structure according to claim 5, The adhesive material is filled inside the hole. holding structure.

9. The retaining structure according to claim 1, The adhesive structure includes a structure in which the adhesive material is provided with respect to the position of the hole, with the insertion portion of the object being inserted into the hole in the substrate. holding structure.

10. The retaining structure according to claim 1, The inertial sensor is configured to include at least one of an acceleration sensor or an angular velocity sensor. holding structure.

11. The retaining structure according to claim 1, The position of each of the two or more connection structures is set with reference to the position of the inertial sensor on the substrate. holding structure.

12. The retaining structure according to claim 1, The position of the inertial sensor is set based on the position of each of the two or more connection structures. holding structure.

13. The retaining structure according to claim 12, The inertial sensor is positioned at the center of gravity of each of the two or more connection structures. holding structure.

14. The retaining structure according to claim 1, The substrate is configured to be installed so as to rotate integrally with the rotating part, which is the object being targeted and is configured to rotate around a predetermined axis of rotation. An imaging unit is installed on the rotating unit so as to rotate integrally with the rotating unit. holding structure.

15. A method for holding a substrate on which an inertial sensor is placed, to be installed on an object, One of two or more locations on the substrate is connected to the object by a pressing structure that presses and fixes the substrate to the object. The other two or more locations mentioned above are connected to the object by an adhesive structure in which an adhesive material is provided between the object and the substrate, which are arranged to be spaced apart from each other. The pressing structure includes a structure that clamps and fixes the substrate with the object. How to hold it.

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