Ion trap loading assembly

Abstract

To provide a loading assembly configured for providing atomic objects to a nuclear object containment device.SOLUTION: In a loading assembly 200 including one or more ovens 205A and 205B having oven nozzles 208A and 208B that generate respective atomic fluxes of atomic species, when optical beams are provided to a mirror array 214 and a magnet array 212, a two-dimensional magneto-optical trap (2DMOT) configured to generate substantially parallel beams of atoms from their respective atomic fluxes is generated and a differential exhaust tube 230 provides a substantially parallel atomic beam along a beam path 235. Each oven nozzle 208 A, 208 B is offset from a beam path axis 250, and 2DMOT is configured to provide an atomic beam substantially parallel to the beam path axis 250.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] Cross-reference of related applications This application claims priority to U.S. Patent Application No. 63 / 200,834, filed on 31 March 2021, which is incorporated herein by reference in its entirety.

[0002] Various embodiments relate to apparatus, systems, and methods for loading atomic objects, such as ions, into atomic object containment devices, such as ion traps. Various embodiments relate to loading various atomic objects into atomic object containment devices using two-dimensional (2D) magneto-optical traps. [Background technology]

[0003] Conventional atomic sources for loading into ion traps provide a cloud of atoms, some of which are ionized and trapped by the ion trap. However, a considerable number of atoms remain untrapped and become background gas in the vacuum chamber where the ion trap is located. Consequently, conventional atomic sources load relatively slowly and impair the performance of the vacuum in the vacuum chamber. Through considerable effort, ingenuity, and technological innovation, many of the shortcomings of prior ion trap loading techniques have been resolved by developing solutions structured according to embodiments of the present invention, many of which are described in detail herein. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] U.S. Patent Application No. 16 / 717,602 [Patent Document 2] U.S. Patent Application No. 63 / 199,279 [Overview of the Initiative] [Means for solving the problem]

[0005] Examples of embodiments provide methods, systems, apparatus, computer program products, etc., for loading atomic objects into an atomic object containment device. In various embodiments, two or more types of atomic objects are loaded into the atomic object containment device. In various embodiments, the loading assembly comprises an oven configured to provide a bundle of atomic objects. In various embodiments, the loading assembly comprises multiple ovens, each oven configured to provide a bundle of each type of atomic object. In various embodiments, each oven is offset from the atomic object containment device and / or the loading position of the atomic object containment device. In various embodiments, the loading assembly is configured to generate parallel multi-atomic beams directed toward and / or aligned with the atomic object containment device and / or the loading position of the atomic object containment device.

[0006] In various embodiments, the loading assembly includes a 2D magneto-optical trap (MOT). In various embodiments, atomic flux generated by one or more ovens of the loading assembly exits each oven and flows into the 2D MOT. As described above, the ovens are eccentric from the atomic object confinement device and / or the loading position of the atomic object confinement device. The 2D MOT collimates and redirects the incident atomic flux so that the loading device delivers parallel multi-atom beams to the loading position of the atomic object confinement device and / or the loading position of the atomic object confinement device.

[0007] In various embodiments, the loading assembly comprises a differential exhaust pipe. In such embodiments, the oven may remain on while the atomic object confinement device is used to perform one or more functions (e.g., executing quantum algorithms and / or circuits as a quantum processor, etc.). For example, the loading assembly may be configured to contain a multi-atomic cloud (e.g., within the MOT and / or within the chamber of the loading assembly) so that multi-atomic beams can be supplied to the vicinity of the atomic object confinement device on demand without introducing a significant amount of background gas to the vicinity of the atomic object confinement device. For example, atomic objects confined by the atomic object confinement device experience the same or lower frequency of background collisions (e.g., collisions with background gas) as ions trapped by ion traps loaded using conventional loading means.

[0008] In various embodiments, the loading assembly is installed and / or positioned at a distance from the atomic object containment device. For example, in one embodiment, the loading assembly is installed and / or positioned more than 0.25 meters (e.g., about 0.4 meters) from the atomic object containment device. Therefore, the loading assembly does not introduce a significant amount of thermal energy near the atomic object containment device. In various embodiments, one or more thermal and / or radiation shields are placed between the loading assembly and the atomic object containment device.

[0009] In various embodiments, as a multi-atom beam approaches an atomic object containment device and / or the loading position of the atomic object containment device, an ionizing beam (e.g., a laser beam) ionizes the atomic objects within the beam. The ionized atomic objects consist of various ions and are then captured by the trapping potential of the atomic object containment device.

[0010] In various embodiments, the atomic object confinement device is an ion trap, such as a surface pulse trap. In various embodiments, the atomic object confinement device is configured to be a quantum processor of a quantum computer for performing and / or executing quantum circuits and / or algorithms. In one embodiment, the variety of atomic objects includes atomic species used as qubits in a quantum computer. In one embodiment, the variety of atomic objects includes atomic species used as co-cooling ions in a quantum computer.

[0011] According to one aspect of the present disclosure, a loading assembly is provided for supplying an atomic object to an atomic object containment device. In one embodiment, the loading assembly comprises one or more ovens. Each of the one or more ovens is configured to (a) provide a respective oven nozzle and (b) generate a respective atomic flux of a respective atomic species through the respective oven nozzle. The loading assembly further comprises a mirror array and a magnet array configured to generate a two-dimensional magneto-optical trap (2D MOT) when an optical beam is supplied to the mirror array. The 2D MOT is configured to generate substantially parallel atomic beams from the respective atomic fluxes generated by the one or more ovens. The loading assembly further comprises a differential exhaust pipe that defines the beam path. The differential exhaust pipe is configured to provide substantially parallel atomic beams through the beam path. Each of the oven nozzles of each of the one or more ovens is offset from the beam path and the 2D MOT is configured to provide substantially parallel atomic beams in conjunction with the beam path.

[0012] In one embodiment, one or more ovens consist of a first oven and a second oven, the first oven is configured to generate a first atomic flux of a first atomic species, and the second oven is configured to generate a second atomic flux of a second atomic species, and the substantially parallel atomic beams consist of atomic objects of both the first and second atomic species.

[0013] In one embodiment, the 2D MOT consists of a first laser beam of a first wavelength and a second laser beam of a second wavelength, and at least one mirror of the mirror array is configured to reflect both the first and second wavelengths.

[0014] In one embodiment, the difference between the first wavelength and the second wavelength is greater than 100 nm or greater than 50 nm.

[0015] In one embodiment, the loading assembly further comprises a differential exhaust pipe, and the loading assembly is configured such that substantially parallel atomic beams pass through the differential exhaust pipe after exiting the 2D MOT and before entering the beam path of the differential exhaust pipe.

[0016] In another embodiment, a quantum computer is provided. In one embodiment, the quantum computer comprises an atomic object confinement device and a loading assembly configured to provide atomic objects to the atomic object confinement device. The loading assembly comprises one or more ovens. Each of the one or more ovens comprises (a) a respective oven nozzle and (b) is configured to generate a respective atomic flux of a respective atomic species through the respective oven nozzle. The loading assembly further comprises a mirror array and a magnet array configured to generate a 2D MOT when an optical beam is supplied to the mirror array. The 2D MOT is configured to generate substantially parallel atomic beams from the respective atomic fluxes generated by one or more ovens. The loading assembly further comprises a differential exhaust pipe that defines the beam path. The differential exhaust pipe is configured to provide substantially parallel atomic beams through the beam path. Each oven nozzle of each of the one or more ovens is offset from the beam path and the 2D MOT is configured to provide substantially parallel atomic beams in conjunction with the beam path.

[0017] In one embodiment, each of the oven nozzles of one or more ovens does not have a direct line of sight to the atomic object containment device.

[0018] In one exemplary embodiment, the distance between the loading assembly and the atomic object confinement device is greater than 0.25 meters.

[0019] In one exemplary embodiment, the atomic object confinement device and the loading assembly are at least partially disposed within a cryostat and / or a vacuum chamber.

[0020] In one exemplary embodiment, the quantum computer further comprises one or more thermal shields disposed between the atomic object confinement device and the loading assembly.

[0021] In one exemplary embodiment, each of the one or more thermal shields includes an aperture that mates with a differential exhaust pipe.

[0022] In one exemplary embodiment, the one or more ovens consist of a first oven and a second oven, the first oven being configured to generate a first atomic beam of a first atomic species, the second oven being configured to generate a second atomic beam of a second atomic species, and the substantially parallel atomic beam consisting of atomic objects of both the first atomic species and the second atomic species.

[0023] In one exemplary embodiment, the 2D MOT consists of a first laser beam of a first wavelength and a second laser beam of a second wavelength, and at least one mirror of the mirror array is configured to reflect both the first and second wavelengths.

[0024] In one exemplary embodiment, each mirror of the mirror array is configured to reflect both the first and second wavelengths while preserving the power and polarization of the optical beam of the first wavelength and the optical beam of the second wavelength.

[0025] In one exemplary embodiment, the first wavelength is set to cool the atomic object of the first atomic species, and the second wavelength is set to cool the atomic object of the second atomic species.

[0026] In one embodiment, the difference between the first wavelength and the second wavelength is greater than 100 nm or greater than 50 nm.

[0027] In one embodiment, an atomic object of a first atomic species confined within an atomic object confinement device is used as a qubit in a quantum computer, and an atomic object of a second atomic species confined within the atomic object confinement device is used to co-cool the qubit in the quantum computer.

[0028] In one embodiment, the loading assembly further comprises a differential exhaust pipe, and the loading assembly is configured such that substantially parallel atomic beams pass through the differential exhaust pipe after exiting the 2D MOT and before entering the beam path of the differential exhaust pipe.

[0029] In one embodiment, the quantum computer further comprises one or more lasers configured to generate and provide an optical beam.

[0030] In one embodiment, the quantum computer further comprises a controller configured to control the operation of one or more lasers.

[0031] In one embodiment, the quantum computer further comprises a controller configured to control the trapping potential generated by electrodes of one or more ovens and atomic object containment devices.

[0032] The present invention is described in general terms, and the attached drawings are referenced here, but they are not necessarily drawn to a fixed ratio. [Brief explanation of the drawing]

[0033] [Figure 1] This is a schematic diagram illustrating an example of a quantum computing system that includes an atomic object confinement device having a metamaterial structure on its surface, according to one embodiment. [Figure 2] This is a side view of an example of a loading assembly configured to provide various atomic beams to the loading position of an atomic object containment device, according to one embodiment. [Figure 3] This is a cross-sectional view of an example of a loading assembly shown in Figure 2, along line AA, according to one embodiment. [Figure 4] This is a schematic diagram of an example of a quantum computer controller configured to perform one or more deterministic shaping and / or rearrangement functions according to various embodiments. [Figure 5] This is a schematic diagram of an example of a computational entity of a quantum computer system that may be used according to one embodiment. [Modes for carrying out the invention]

[0034] The present invention will now be fully described below with reference to the accompanying drawings, although only some, not all, embodiments of the invention are illustrated. In fact, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein, but rather these embodiments are provided so as to satisfy the legal requirements to which this disclosure is applicable. The terms “or” (also represented as “ / ”) are used herein in both disjunctive and conjunctive senses unless otherwise indicated. The terms “exemplary” and “exemplary” are used to mean examples without a specified level of quality. The terms “abbreviated,” “substantially,” and “about” mean within work and / or manufacturing tolerances and / or within user measurement capabilities unless otherwise indicated. Similar figures refer to similar elements throughout.

[0035] Examples of embodiments provide methods, systems, apparatus, computer program products, etc., for loading atomic objects into an atomic object containment device. In various embodiments, two or more types of atomic objects are loaded into the atomic object containment device. In various embodiments, the loading assembly comprises ovens configured to provide bundles of atomic objects. In various embodiments, the loading assembly comprises multiple ovens, each oven configured to provide bundles of each type of atomic object. In various embodiments, each oven is offset from the atomic object containment device and / or the loading position of the atomic object containment device. In various embodiments, the loading assembly is configured to generate substantially parallel single-type atomic beams.

[0036] In various embodiments, the loading assembly is configured to generate a first substantially parallel single-type atomic beam (e.g., a qubit atomic-object type beam) and a second single-type atomic beam (e.g., a co-cooled atomic-object type beam) at different and / or alternating times. In various embodiments, the loading assembly is configured to generate a substantially parallel multi-type atomic beam directed toward and / or aligned with the atomic-object confinement device and / or the loading position of the atomic-object confinement device.

[0037] For example, in various embodiments, the loading assembly comprises two or more ovens, each configured to provide an atomic flux of a specific atomic object species (e.g., qubit atomic object species and / or co-cooled atomic object species), and the atomic object species present in substantially parallel atomic beams are controlled via the operation of the operating source 60. For example, when a co-cooled species cooling beam is supplied to the loading assembly 200 (e.g., to the mirror array 214 via the optical coupler 210), the atomic objects of the co-cooled atomic object species in the MOT chamber 216 experience 2D MOT with the MOT axis 256, and the substantially parallel atomic object beams contain atomic objects of the co-cooled atomic object species. However, if a co-cooled species cooling beam is not supplied to the loading assembly 200, the atomic objects of the co-cooled atomic object species in the MOT chamber 216 do not experience 2D MOT, and the substantially parallel atomic object beams contain substantially no atomic objects of the co-cooled atomic object species. For example, when a qubit species-cooled beam is supplied to the loading assembly 200 (e.g., to the mirror array 214 via the optical coupler 210), atomic objects of the qubit atomic object species in the MOT chamber 216 experience 2D MOT with the MOT axis 256, and a substantially parallel atomic object beam containing atomic objects of the qubit atomic object species. However, if a qubit species-cooled beam is not supplied to the loading assembly 200, atomic objects of the qubit atomic object species in the MOT chamber 216 do not experience 2D MOT, and a substantially parallel atomic object beam substantially does not contain atomic objects of the qubit atomic object species. Therefore, each of the ovens 205 may normally be operated and / or left on so that a substantially parallel atomic object beam consisting of atomic objects of the qubit atomic object species and / or co-cooled atomic object species can be provided quickly (e.g., in less than 10 milliseconds).

[0038] In various embodiments, the loading assembly includes a 2D magneto-optical trap (MOT). In various embodiments, atomic flux generated by one or more ovens of the loading assembly exits each oven and flows into the 2D MOT. As described above, the ovens are eccentric from the atomic object confinement device and / or the loading position of the atomic object confinement device. The 2D MOT collimates and redirects the incident atomic flux so that the loading device delivers parallel multi-atom beams to the loading position of the atomic object confinement device and / or the loading position of the atomic object confinement device.

[0039] In various embodiments, the loading assembly comprises a differential exhaust pipe. In such embodiments, the oven may remain on while the atomic object confinement device is used to perform one or more functions (e.g., executing quantum algorithms and / or circuits as a quantum processor, etc.). For example, the loading assembly may be configured to contain a multi-atomic cloud (e.g., within the MOT and / or within the chamber of the loading assembly) so that multi-atomic beams can be supplied to the atomic object confinement device on demand without introducing a significant amount of background gas near the atomic object confinement device. For example, atomic objects confined by the atomic object confinement device experience the same or lower frequency of background collisions (e.g., collisions with background gas) as ions trapped by ion traps loaded using conventional loading means.

[0040] In various embodiments, the loading assembly is installed and / or positioned at a distance from the atomic object containment device. For example, in one embodiment, the loading assembly is installed and / or positioned more than 0.25 meters (e.g., about 0.4 meters) from the atomic object containment device. Therefore, the loading assembly does not introduce a significant amount of thermal energy near the atomic object containment device. In various embodiments, one or more thermal and / or radiation shields are placed between the loading assembly and the atomic object containment device.

[0041] In various embodiments, as a multi-atom beam approaches an atomic object containment device and / or the loading position of the atomic object containment device, an ionizing beam (e.g., a laser beam) ionizes the atomic objects within the beam. The ionized atomic objects consist of various ions and are then captured by the trapping potential of the atomic object containment device.

[0042] In various embodiments, the atomic object confinement device is an ion trap, such as a surface pulse trap. In various embodiments, the atomic object confinement device is configured to be a quantum processor of a quantum computer for performing and / or executing quantum circuits and / or algorithms. In one embodiment, the variety of atomic objects includes atomic species used as qubits in a quantum computer. In one embodiment, the variety of atomic objects includes atomic species used as co-cooling ions in a quantum computer.

[0043] Exemplary quantum computing system with loading assembly Figure 1 provides a schematic diagram of an example quantum computing system 100 comprising an atomic object confinement device 300 (e.g., an ion trap) and a loading assembly 200, according to one embodiment. As shown in Figure 2, the loading assembly 200 is configured to provide an atomic beam 5 substantially parallel to the atomic object confinement device 300. For example, in various embodiments, the loading assembly 200 is configured to provide an atomic beam 5 substantially parallel to the loading position of the atomic object confinement device 300. In various embodiments, the quantum computing system 100 comprises an ionization laser and corresponding optical elements configured to provide an ionization laser beam that ionizes the atomic objects of the substantially parallel atomic beam 5. The ionized atomic objects are then trapped and / or confined by a trapping potential generated by the electrodes of the atomic object confinement device 300. An example of a linear atomic object confinement device is described in Patent Document 1, filed December 17, 2019, but various other linear atomic object confinement devices may be used in various embodiments. An example of a two-dimensional atomic object containment device is described in Patent Document 2, filed December 17, 2020, but various other two-dimensional atomic object containment devices may be used in various embodiments.

[0044] In various embodiments, the loading assembly 200 and the atomic object containment device 300 (and / or the loading position 305 of the atomic object containment device) are separated from each other by a distance D. In various embodiments, the distance D is at least 0.25 meters (e.g., in the range of 0.25 to 1.0 meter). In one embodiment, the distance D is substantially equal to 0.4 meters.

[0045] In various embodiments, one or more radiation and / or thermal shields 45 (e.g., 45A, 45B) are positioned between the loading assembly 200 and the atomic object containment device 300. In various embodiments, each of the one or more radiation and / or thermal shields 45 is provided with an opening 48. The opening 48 is aligned with the loading position 305 of the differential exhaust pipe 230 and / or the atomic object containment device 300 so that substantially parallel atomic beams 5 can travel from the differential exhaust pipe 230 through the opening 48 of the radiation and / or thermal shield 45 to the loading position 305 of the atomic object containment device 300.

[0046] In various embodiments, the quantum computing system 100 comprises a computing entity 10 and a quantum computer 110. In various embodiments, the quantum computer 110 comprises a controller 30, a cryostat and / or vacuum chamber 40 enclosing at least a portion of an atomic object confinement device 300 (e.g., an ion trap) and a loading assembly 200, and one or more operating sources 60. For example, the cryostat and / or vacuum chamber 40 may be an exhaust and / or temperature control chamber. In one embodiment, an operating signal generated by the operating source 60 is provided to the inside of the cryostat and / or vacuum chamber 40 (where the atomic object confinement device 300 is installed) via a corresponding optical path 66 (e.g., 66A, 66B, 66C). In one embodiment, one or more operating sources 60 may comprise one or more lasers (e.g., optical lasers, microwave sources, etc.). In various embodiments, each operating source 60 is configured to generate an operating signal having its respective characteristic wavelength in the microwave, infrared, visible, or ultraviolet region of the electromagnetic spectrum.

[0047] In various embodiments, one or more manipulators 60 are configured to manipulate and / or induce controlled quantum state evolution of one or more atomic objects within the atomic object confinement device 300, to ionize the atomic objects with substantially parallel atomic beams 5, to generate and provide laser beams for generating 2D MOT, to cool one or more types of atomic objects, etc. For example, in various embodiments, one or more manipulators 60 comprises one or more lasers and, in some embodiments, corresponding optical elements that define optical paths for sending one or more manipulator signals to appropriate locations within the cryostat and / or vacuum chamber 40. For example, the manipulators 60 may be configured to generate one or more beams that can be used to initialize the atomic objects to a state in qubit space so that they can be used as qubits in a confined atomic object quantum computer, to perform one or more gates on one or more qubits in the confined atomic object quantum computer, to read out and / or determine the state of one or more qubits in the confined atomic object quantum computer, to ionize the atomic objects, etc. In one embodiment, the operating source 60 comprises one or more lasers configured to generate an optical beam used to form a 2D MOT.

[0048] In various embodiments, the 2D MOT consists of an optical beam generated by the operating source 60. In various embodiments, the optical beam consists of three beam types: a co-cooled type cooled beam, a co-cooled type re-pumped beam, and a qubit type cooled beam. The three beams are coupled into a vacuum to generate the MOT.

[0049] In various embodiments, the co-cooled species cooling beam has a characteristic wavelength corresponding to the laser cooling of the co-cooled species atomic species (e.g., an atomic object of the species that would act as a co-cooled ion in an atomic object confinement device and / or quantum processor). In one embodiment, the co-cooled species is barium (Ba), and the characteristic wavelength of the co-cooled species cooling beam is 553.7 nm. In one embodiment, the co-cooled species cooling beam is generated by a corresponding operating source 60 (e.g., a laser), transmitted from the operating source to a plate via an optical fiber, where the beam is split into cooling and probe beams with independent fine-frequency control, and then both beams are transmitted to the MOT via the fiber.

[0050] In various embodiments, the co-cooled species repump beam has a characteristic wavelength corresponding to a repump transition set to maintain the atomic object of the co-cooled species within the photocooling cycle. In one embodiment, multiple co-cooled species repump beams (e.g., having different characteristic wavelengths) are used. In one embodiment, the co-cooled species is barium (Ba), and the characteristic wavelengths of the co-cooled species repump beams are 1500.4 nm and 1130.6 nm. In one embodiment, the co-cooled species repump beam is generated by a corresponding operating source 60 (e.g., a laser) and transmitted from the operating source to a coupling plate via an optical fiber, where the co-cooled species repump beam is coupled into a single fiber for transmission to the MOT.

[0051] In various embodiments, the qubit species cooling beam has a characteristic wavelength corresponding to the laser cooling of the qubit species atomic species (e.g., an atomic object of the species that will act as a qubit in an atomic object confinement device and / or quantum processor). In one embodiment, the qubit species is ytterbium (Yb), and the characteristic wavelength of the qubit species cooling beam is 398.9 nm. In one embodiment, the qubit species cooling beam is generated by a corresponding operating source 60 (e.g., a laser) and transmitted directly from the operating source to the MOT (e.g., via an optical fiber).

[0052] In various embodiments, the quantum computer 110 includes an optical collection system configured to collect and / or detect photons generated by qubits (e.g., during a readout procedure). The optical collection system may include one or more optical elements (e.g., lenses, mirrors, waveguides, optical fiber cables, etc.) and one or more photodetectors. In various embodiments, the photodetectors may be photodiodes, photomultiplier tubes, charge-coupled device (CCD) sensors, complementary metal-oxide-semiconductor (CMOS) sensors, microelectromechanical system (MEMS) sensors, and / or other photodetectors capable of sensing light at the expected fluorescence wavelength of the qubits of the quantum computer. In various embodiments, the detectors may electronically communicate with the controller 30 via one or more A / D converters 425 (see Figure 4), etc. For example, an atomic object being readout and / or whose quantum state is being determined may emit an emission signal, at least a portion of which is incident on a collection array of metamaterial structures formed and / or placed on the surface of the atomic object containment device 300. The emission signal incident on the collection array of the metamaterial structure prompts the metamaterial structure to emit a detection signal directed towards and / or focused to the collection optics of the atomic object containment device. The collection optics are configured to provide the collection signal to a photodetector.

[0053] In various embodiments, the quantum computer 110 comprises one or more voltage sources 50. For example, the voltage sources 50 may comprise a plurality of voltage drivers and / or voltage sources and / or at least one RF driver and / or voltage source. In one embodiment, the voltage sources 50 may be electrically coupled to the corresponding potential generating elements (e.g., electrodes) of the confinement device 300. In various embodiments, the application of voltage provided by the voltage sources 50 to the electrodes of the confinement device 300 generates a trapping and / or confinement potential, which is set to confine the ionized atomic object by the atomic object confinement device 300.

[0054] In various embodiments, the computational entity 10 is configured to allow a user to provide input to the quantum computer 110 (for example, through the user interface of the computational entity 10) and to receive, view, etc., outputs from the quantum computer 110. The computational entity 10 may communicate with the controller 30 of the quantum computer 110 via one or more wired or wireless networks 20 and / or via direct wired and / or wireless communication. In one embodiment, the computational entity 10 may convert, configure, formalize, etc., information / data, quantum computation algorithms and / or circuits, etc., into a computational language, executable instructions, command set, etc., that the controller 30 can understand and / or implement.

[0055] In various embodiments, the controller 30 is configured to control a voltage source 50, a cryostat system and / or vacuum system that controls the temperature and exhaust within the cryostat and / or vacuum chamber 40, an operating source 60, and / or other systems that control various environmental conditions (e.g., temperature, exhaust, etc.) within the cryostat and / or vacuum chamber 40, and / or to manipulate and / or induce a controlled evolution of the quantum state of one or more atomic objects within the containment device. For example, the controller 30 may cause a quantum circuit and / or algorithm to be executed by the controlled evolution of the quantum state of one or more atomic objects within the containment device. For example, the controller 30 may cause a readout procedure consisting of coherent shelving to be performed as part of the execution of a quantum circuit and / or algorithm. In various embodiments, the atomic objects confined within the containment device are used as qubits in a quantum computer 110.

[0056] Loading Assembly Example In various embodiments, the atomic object confinement device comprises a plurality of electrodes configured to generate a confinement potential. For example, a controller 30 may control a voltage source 50 to provide electrical signals to the electrodes of the atomic object confinement device so that they generate a confinement potential. The confinement potential is set to confine a plurality of atomic objects within a confinement volume defined by the atomic object confinement device. For example, in one embodiment, the atomic object confinement device is a surface ion trap, and the confinement volume is a volume located close to the surface of the surface ion trap. For example, the electrodes and / or confinement potential are configured to define the positions of a plurality of atomic objects within the confinement volume.

[0057] In various embodiments, an atomic object containment device provides an atomic beam substantially parallel to the loading position of the atomic object containment device, and is then loaded by ionizing the atomic object via an ionization beam (e.g., a laser beam configured to ionize the atomic object) when the atomic object in the substantially parallel atomic beam is close enough to the atomic object containment device to be trapped by the containment potential generated by the atomic object containment device. Figures 2 and 3 provide side and cross-sectional views of an example loading assembly 200 configured to generate a substantially parallel atomic beam 5.

[0058] In various embodiments, the loading assembly 200 comprises a housing 215. In various embodiments, the housing 215 comprises a coupler 240 configured to couple the housing 215 to, for example, a flange of a cryostat and / or vacuum chamber 40 containing an atomic object containment device 300. In various embodiments, the housing 215 provides a structure (e.g., one or more optical couplers 210) to which optical elements (e.g., optical fibers) can be coupled to provide an optical beam (e.g., a co-cooled species cooled beam, a co-cooled species re-pumped beam, and a qubit species cooled beam) to form a MOT.

[0059] In various embodiments, the housing 215 further provides a structure into which the mirror array 214 is coupled. In various embodiments, the mirror array comprises a plurality of mirrors configured to form an optical field of a 2D MOT when a cooled beam is reflected from there. In various embodiments, the mirrors of the mirror array 214 are configured to reflect optical beams of different wavelengths. In various embodiments, the mirror array 214 comprises four or more mirrors (e.g., five mirrors) configured to form a 2D MOT by intersecting a co-cooled species beam and / or a qubit species cooled beam with the MOT axis 256 four times and from four different directions. Furthermore, the mirrors are configured to store the power and polarization of the beam when the co-cooled species beam and / or qubit species cooled beam is reflected from the mirrors.

[0060] In various embodiments, the mirror is provided with a multilayer coating containing multiple layers (e.g., three or more layers) of different types of glass so that the mirror can reflect both co-cooled and qubit-cooled beams along a defined path while maintaining and / or preserving the beam's power and polarization. For example, when the beam is reflected from the mirror by the multilayer coating, the mirror absorbs little to no power of the co-cooled and / or qubit-cooled beams.

[0061] To give the mirrors the appropriate properties for reflecting both Ba-cooled and Yb-cooled light, specially designed multilayer coatings (consisting of multiple layers of different types of glass) are used. This coating must have good reflectivity to both wavelengths (398.9 nm and 553.7 nm) in addition to preserving polarization. Ba repump does not need to be reflected by these mirrors.

[0062] For example, in one embodiment, the co-cooled species cooling beam has a characteristic wavelength of 553.7 nm, and the qubit species cooling beam has a characteristic wavelength of 398.9 nm. Therefore, in various embodiments, the wavelength difference between the co-cooled species beam and the qubit species cooling beam is at least 50 nm. In various embodiments, the wavelength difference between the co-cooled species beam and the qubit species cooling beam is greater than 100 nm. One or more mirrors in the mirror array 214 are configured to efficiently reflect each of these optical beams despite the wide range of characteristic wavelengths of the optical beams.

[0063] In various embodiments, the housing 215 provides a structure further configured to connect one or more components of a vacuum system. For example, the housing 215 includes an ion pump 262 and / or a non-evaporative getter 264 and / or a coupler for mounting such to the housing 215. The ion pump and / or non-evaporative getter are part of a pump-out device and / or vacuum pump system configured to generate a vacuum within the loading assembly 200 (e.g., within the MOT chamber 216 and / or distribution chamber 236). For example, the pump-out device and / or vacuum pump system is configured to remove background gas and / or atomic gas that are not part of a substantially parallel atomic object beam from inside the loading assembly 200 (e.g., the MOT chamber 216 and / or distribution chamber 236). This reduces the amount of background gas present in the cryostat and / or vacuum chamber 40 given by the loading assembly 200. In one embodiment, the housing 215 further includes a valve 266 for use when connecting an external pump to the housing 215. For example, the external pump may be attached to the housing 215 during a bake-out procedure used to clean the oven 205 prior to the operation of the loading assembly 200. In one embodiment, when the loading device 200 is operated to provide a substantially parallel atomic object beam, the valve 266 is closed and the external pump is not attached to it.

[0064] In various embodiments, the housing 215 provides a structure in which a mirror array 214 and a magnet array 212 are fixed and / or mounted inside such that when an optical beam is supplied through one or more optical couplers 210, the electromagnetic field in the MOT chamber 216 forms a 2D MOT. For example, the housing 215 may provide a frame in which the mirror array 214 and the magnet array 212 are mounted.

[0065] In various embodiments, the mirror array 214 and / or the magnet array 212, and / or the frame on which they are mounted, are mounted on and / or supported by a support structure 218. For example, the support structure 218 may be fixed to a coupler 240 at a first end and extend from the coupler 240 into the MOT chamber 216. The mirror array 214 and / or the magnet array 212, and / or the frame on which they are mounted, are mounted at a second end of the support structure 218 located within the MOT chamber 216. In one embodiment, the support structure 218 includes a beam path 235, a beam path axis 250, and / or a MOT axis 256, which are aligned so that substantially parallel atomic object beams generated by the 2D MOT can pass through the support structure 218 to the distribution chamber 236.

[0066] In various embodiments, the mirror array 214 is configured and / or positioned so that the MOT-cooled beam (e.g., a qubit atomic-type-cooled beam or a co-cooled atomic-type-cooled beam) enters the chamber through the optical coupler 210 and passes through the MOT chamber 216 (e.g., intersecting the MOT axis 256 in the MOT region 226) before encountering any of the mirrors in the mirror array 214. The MOT-cooled beam then makes three 90-degree turns by reflecting off three mirrors at 45 degrees each in their respective incident beam propagation directions. The MOT-cooled beam then intersects itself at the MOT location (e.g., in the MOT region 226 along the MOT axis 256, including the original MOT axis 256 intersection), is retroreflected by the direct-incident mirrors, and returns along its original beam path traveling in the opposite direction. The magnets of the magnet array 212 are arranged symmetrically around the MOT location and oriented to generate a magnetic field gradient with a zero magnetic field within the MOT region 226.

[0067] In one embodiment, the magnet array 212 is part of a frame configured to mount the mirrors of the mirror array 214. In various embodiments, the mirror array comprises a plurality of mirrors configured to generate a 2D MOT optical field within the MOT chamber 216. In various embodiments, the magnet array 212 is an array of one or more magnets configured to generate a magnetic field within the MOT chamber 216, together with the optical field within the MOT chamber 216, so as to generate a 2D MOT capable of generating substantially parallel atomic object beams from the atomic flux supplied to the MOT chamber 216 by the oven 205.

[0068] In various embodiments, the 2D MOT defines a MOT axis 256. For example, the electromagnetic field of the 2D MOT (e.g., within the MOT chamber 216) is configured to cool the atomic objects (e.g., affect the kinetic energy of the atomic objects) so that their velocity aligns with the MOT axis 256. For example, atomic objects traveling through the MOT chamber 216 may gather around the MOT axis 256 and move in a direction along the MOT axis 256. In one embodiment, the electromagnetic field within the MOT chamber 216 is substantially the same in a first plane taken substantially perpendicular to the MOT axis 256 and in a second plane taken substantially perpendicular to the MOT axis 256 at another point within the MOT chamber 216. In various embodiments, the electromagnetic potential of the 2D MOT (e.g., within the MOT chamber 216) has a stable minimum extending along the MOT axis 256.

[0069] In various embodiments, the MOT axis 256 is aligned with the beam path axis 250 of the loading assembly 200. In various embodiments, the beam path axis 250 is defined by a beam path 235 defined by a differential exhaust pipe 230. For example, the MOT axis 256 is substantially parallel to and overlaps with the beam path axis 250.

[0070] In various embodiments, the loading assembly 200 includes one or more ovens 205 (e.g., 205A, 205B). For example, the exemplary embodiments include one oven for each of the various atomic objects to be loaded into the two oven-atomic object confinement devices 300. For example, in one exemplary embodiment, the loading assembly 200 includes a first oven and a second oven. The first oven is configured to generate a first atomic beam of a first atomic species, and the second oven is configured to generate a second atomic beam of a second atomic species. The substantially parallel atomic beam 5 consists of atomic objects of both the first atomic species and the second atomic species. In the exemplary embodiment, the loading assembly 200 includes a qubit species oven 205A and a co-cooling species oven 205B. In various embodiments, each of the one or more ovens 205A, 205B defines an oven axis 255A, 255B, respectively. In various embodiments, each oven axis 255A, 255B is substantially transverse and / or non-parallel to the MOT axis 256 and / or the beam path axis 250. In other words, each of the one or more ovens 205 is offset from the beam path 235. In the exemplary embodiment, the qubit species oven 205A defines a qubit species oven axis 255A that forms an angle φ A with the beam path axis 250, and the co-cooling species oven 205B defines a co-cooling species oven axis 255B that forms an angle φ B with the beam path axis 250. In various embodiments, the angles φ A and φ B are substantially equal. In one exemplary embodiment, the angles φ A and φ B are different. In various embodiments, the angles φ A and φ B are each in the range of 5 to 45 degrees. In one exemplary embodiment, the angles φ A and φ B are substantially equal to 10 degrees and / or approximately 10 degrees.

[0071] In various embodiments, each oven 205A, 205B is equipped with a heating control line 206. The heating control line passes through one of the feedthroughs 202A, 202B and communicates electrically with the heating element in the corresponding heating chamber. For example, in various embodiments, the heating control line 206 is configured to supply current to the heating element in the heating chamber 204 (e.g., 204A, 204B) of the corresponding oven 205. In various embodiments, a controller 30 controls the current supplied via the heating control line 206. The heating element is configured to heat a material (e.g., film, filament, solid, etc.) made of atomic objects placed in the heating chamber 204. For example, a qubit species oven 205A is configured to hold a material made of atomic objects containing qubit species atomic objects, and a co-cooling species oven 205B is configured to hold a material made of atomic objects containing co-cooling species atomic objects. Heating the material made of atomic objects causes the corresponding species atomic objects to be converted from a solid state to a gaseous state within the heating chamber 204. Atomic matter in a gaseous state exits the corresponding oven 205 through oven nozzles 208 (e.g., 208A, 208B). In various embodiments, oven nozzles 208A, 208B are configured to direct the gaseous atomic matter into the MOT chamber 216. For example, the atomic matter exits ovens 205A, 205B through their respective oven nozzles 208A, 208B and enters the MOT chamber 216, where they experience the electromagnetic field of the 2D MOT. For example, each oven 205 is configured to generate its respective atomic flux of its respective atomic species through its respective oven nozzle 208. In various embodiments, each oven nozzle 208A, 208B is a microcapillary array. For example, oven nozzle 208 comprises multiple microcapillaries or microtubes.

[0072] As described above, the 2D MOT is configured to influence the kinetic energy of the atomic objects so that their velocity aligns with the MOT axis 256. In particular, a cloud of atomic objects (e.g., consisting of both qubit and co-cooled species of atomic objects) enters the MOT chamber 216. The electromagnetic field of the 2D MOT (generated by the magnet array 212 and the optical field formed by reflecting the optical beam from the mirror array 214) deforms the cloud of atomic objects into a substantially parallel atomic object beam. For example, the 2D MOT is configured to generate substantially parallel atomic beams from each atomic flux generated by one or more ovens 205. In various embodiments, the substantially parallel atomic object beam 5 has a beam diameter of less than 10 millimeters (e.g., about 5 millimeters or less).

[0073] In various embodiments, substantially parallel atomic object beams are distributed from the loading assembly 200 via a differential exhaust pipe 230. In various embodiments, the substantially parallel atomic object beams exiting the through-path of the support structure 218 continue to flow along the beam path axis 250 along the beam path 235 defined by the differential exhaust pipe 230. In one embodiment, the differential exhaust pipe 230 may be further used to collimate the substantially parallel atomic object beams, adjust the velocity of the atomic objects in the substantially parallel atomic object beams (e.g., adjust the velocity component in the direction along the beam path axis 250), etc. For example, atomic objects with velocities not aligned with the beam path axis 250 are likely to collide with the walls of the differential exhaust pipe 230 and will not be distributed as part of the substantially parallel atomic object beam 5. For example, the differential exhaust pipe 230 reduces and / or prevents background gas generated by the heating and / or operation of the oven 205 from entering the cryostat and / or vacuum chamber 40.

[0074] The substantially parallel atomic object beams 5 exit the loading assembly 200 via the differential exhaust pipe 230 and continue to travel in a direction aligned with the beam path axis 250. In various embodiments, the differential exhaust pipe 230 is positioned and / or configured so that the substantially parallel atomic object beams 5 exiting the differential exhaust pipe 230 are directed toward the loading position 305 of the atomic object containment device 300. For example, the beam path axis 250 may be aligned with the loading position 305 of the atomic object containment device 300.

[0075] The housing 215 of the loading assembly 200 also includes several diagnostic windows 225 (e.g., 225A-E) and a gate valve 220, allowing for the independent inspection of the MOT assembly 201 as a module and the servicing of either the cryostat and / or the vacuum chamber 40 and / or its contents or the MOT assembly 201 without disrupting the vacuum in the rest of the complete assembly. In various embodiments, the MOT assembly comprises an optical coupler 210, a mirror array 214, a magnet array 212, a frame on which the mirror array and / or magnet array is mounted, a MOT chamber 216, a filter tube 218, a distribution chamber 236, a differential exhaust pipe 230, and / or an oven 205.

[0076] In various embodiments, the loading assembly 200 is configured to selectively provide substantially parallel atomic object beams 5. In various embodiments, the 2D MOT enables the loading assembly 200 to selectively provide substantially parallel atomic object beams 5. For example, in various embodiments, if an optical beam forming a 2D MOT exists (e.g., one or more operating sources 60 generate and provide the optical beam), the loading assembly 200 provides substantially parallel atomic object beams 5. However, if an optical beam forming a 2D MOT does not exist (e.g., one or more operating sources 60 do not generate and provide the optical beam and / or a modulator prevents the optical beam from being coupled to the loading assembly 200 via the optical coupler 210), the atomic objects in the MOT chamber 216 are not captured and / or cooled in such a way as to form substantially parallel atomic object beams 5. Rather, the atomic objects in the MOT chamber 216 are discharged via an ion pump and / or other vacuum pump (e.g., coupled to the MOT chamber 216 via a connector 262, for example). In various embodiments, the effective switching time is in the range of 2 to 10 milliseconds (e.g., about 5 milliseconds). As used herein, the effective switching time is the length of time between when a command to stop or start providing a substantially parallel atomic object beam 5 is executed by a processing device (e.g., of the controller 30) and / or provided to the driver of the operating source 60, and when the substantially parallel atomic object beam 5 is stopped or started being distributed by the loading assembly 200 and / or stopped or started being incident on the loading position 305 of the atomic object containment device 300. This allows for a faster response to various events, such as the need to rearrange the atomic object population in the atomic object containment device due to atomic object loss caused by collision with the background gas.

[0077] Technical advantages Various embodiments provide technical solutions for the accurate and efficient supply of atomic objects to atomic object containment devices. Prior art for supplying atomic objects to atomic object containment devices includes having a small-mass oven installed within a few centimeters of the atomic object containment device. These small-mass ovens radiate a significant amount of heat near the atomic object containment device, provide a significant amount of background gas near the atomic object containment device, and provide low-flux atomic objects leading to long loading times for loading a sufficient number of atomic objects into the atomic object containment device. Various embodiments provide technical improvements to such prior art. In particular, various embodiments allow loading devices to be installed beyond 0.25 meters (e.g., to about 0.4 meters) from the atomic object containment device, thereby reducing the amount of heat radiated from the loading device near the atomic object containment device compared to conventional loading techniques. Furthermore, the increased distance between the loading device and the atomic object containment device allows for further reduction of excess heat near the atomic object containment device by arranging a thermal shield between the loading device and the atomic object containment device. Additionally, since the ovens of various embodiments of the loading assembly do not have a direct line of sight to the atomic object containment device, less background gas is emitted from the loading device towards the atomic object containment device compared to conventional loading techniques. Moreover, a substantially parallel atomic object beam allows the atomic object containment device to be loaded quickly and efficiently (for example, a higher proportion of atomic objects in a substantially parallel atomic object beam will be confined by the atomic object containment device compared to atomic objects supplied to the atomic object containment device using conventional techniques). Thus, the various embodiments provide technical improvements to various fields relating to the confinement of atomic objects within atomic object containment devices.

[0078] Additionally, the loading assembly can respond to events such as repositioning the atomic object containment device by providing a substantially parallel atomic object beam when the collection of atomic objects in the containment device becomes small, or by stopping the provision of a substantially parallel atomic object beam when the collection of atomic objects in the containment device becomes sufficient. In various embodiments, the loading assembly can respond to such events with a switching time of about 5 milliseconds by maintaining the oven at or near the distribution temperature and turning the 2D MOT on or off via the presence or absence of the optical beam. Conventional techniques for supplying atomic objects to atomic object containment devices require significantly longer switching times (e.g., 1-2 minutes to start supplying atomic objects and 30 seconds-5 minutes to stop supplying atomic objects and / or background gas) because the oven must be kept at a lower temperature due to its proximity to the atomic object containment device. Thus, conventional ovens require significantly longer switching times, which depend on the oven heating and / or cooling time. Therefore, various embodiments offer technical improvements by reducing both the time required to position and / or rearrange the atomic object within the atomic object containment device, while also reducing the amount of background gas introduced into the cryostat and / or vacuum chamber by the loading assembly.

[0079] As quantum computers with an increasing number of qubits are desired and built, a technical problem arises: how to efficiently load such a number of atomic objects (e.g., at least two atomic objects per qubit of a quantum computer in a system that facilitates the cooling of qubit ions using co-cooled ions). Various embodiments of the present invention provide a technical solution to this technical problem, while also reducing the computational errors of the quantum computer by reducing the background gas around the atomic object containment device and minimizing the heat radiated around the atomic object containment device. Thus, various embodiments provide improvements to the field of trapped-ion quantum computing.

[0080] Exemplary controller In various embodiments, the atomic object confinement device 300 is incorporated into a system (e.g., a quantum computer 110) comprising a controller 30. In various embodiments, the controller 30 is configured to control various elements of the system (e.g., a quantum computer 110). For example, the controller 30 may be configured to control a voltage source 50, a cryostat system and / or a vacuum system that controls the temperature and exhaust within the cryostat and / or vacuum chamber 40, an operating source 60, a cooling system, and / or other systems that control environmental conditions (e.g., temperature, humidity, exhaust, etc.) within the cryostat and / or vacuum chamber 40, and / or to manipulate and / or induce a controlled evolution of the quantum state of one or more atomic objects confined by the atomic object confinement device 300. In various embodiments, the controller 30 may be configured to receive signals from one or more optical collection systems.

[0081] As illustrated in Figure 4, in various embodiments, the controller 30 may comprise various controller elements, including a processing element 405, a memory 410, a driver controller element 415, a communication interface 420, an analog-to-digital converter element 425, and so on. For example, the processing element 405 may consist of a programmable logic device (CPLD), a microprocessor, a coprocessing entity, an application-specific instruction set processor (ASIP), an integrated circuit, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a programmable logic array (PLA), a hardware accelerator, other processing devices and / or a network, and / or a controller. The term "network" may refer to a complete hardware embodiment or a combination of hardware and computer program products. In one embodiment, the processing element 405 of the controller 30 includes and / or communicates with a clock.

[0082] For example, memory 410 may consist of non-temporary memories such as volatile and / or non-volatile memory storage devices, such as one or more volatile and / or non-volatile memory storage devices, such as hard disks, ROMs, PROMs, EPROMs, EEPROMs, flash memory, MMCs, SD memory cards, memory sticks, CBRAMs, PRAMs, FeRAMs, RRAMs, SONOS, racetrack memory, RAMs, DRAMs, SRAMs, FPM DRAMs, EDO DRAMs, SDRAMs, DDR SDRAMs, DDR2 SDRAMs, DDR3 SDRAMs, RDRAMs, RIMMs, DIMMs, SIMMs, VRAMs, cache memory, register memory, etc. In various embodiments, memory 410 may store a queue of commands to be executed in order for quantum algorithms and / or circuits to be executed (e.g., an executable queue), a qubit record corresponding to the qubits of a quantum computer (e.g., in a qubit record datastore, a qubit record database, a qubit record table, etc.), calibration tables, computer program code (e.g., one or more computer languages, a dedicated controller language, etc.), etc. In one embodiment, the execution of at least a portion of the computer program code stored in memory 410 (for example, by processing element 405) causes the controller 30 to perform one or more steps, operations, processes, procedures, etc. described herein to provide an operation signal to load an atomic object into the atomic object containment device 300, to form a 2D MOT in the containment potential of the atomic object containment device and / or to ionize the atomic object, to operate the oven, etc.

[0083] In various embodiments, the driver controller element 415 may include one or more drivers and / or controller elements configured to control one or more drivers, respectively. In various embodiments, the driver controller element 415 may consist of drivers and / or driver controllers. For example, a driver controller may be configured to operate one or more corresponding drivers according to executable instructions, commands, etc., scheduled and executed by the controller 30 (e.g., by the processing element 405). In various embodiments, the driver controller element 415 may enable the controller 30 to operate a voltage source 50 (e.g., for controlling the confinement potential of an atomic object confinement device, operating an oven, etc.), an operating source 60, a cooling system, etc. In various embodiments, the driver may be a laser driver, a vacuum component driver, a driver for controlling the flow of current and / or voltage applied to electrodes used to maintain and / or control the trapping and / or confinement potential of the atomic object confinement device 300 (and / or other drivers for providing a driver action sequence to the potential generating element of the atomic object confinement device), a cryostat and / or vacuum system component driver, a cooling system driver, etc. In various embodiments, the controller 30 includes means for communicating and / or receiving signals from one or more optical receiver components (e.g., photodetectors of an optical acquisition system). For example, the controller 30 may include one or more analog-to-digital converter elements 425 configured to receive signals from one or more optical receiver components (e.g., photodetectors of an optical acquisition system), calibration sensors, etc.

[0084] In various embodiments, the controller 30 may include a communication interface 420 for interfaceing with and / or communicating with the computing entity 10. For example, the controller 30 may include a communication interface 420 for receiving executable instructions, command sets, etc., from the computing entity 10 and providing the computing entity 10 with outputs received from the quantum computer 110 (e.g., from an optical collection system) and / or the results of processing those outputs. In various embodiments, the computing entity 10 and the controller 30 may communicate directly via wired and / or wireless connections and / or via one or more wired and / or wireless networks 20.

[0085] Exemplary Computational Entities Figure 5 provides an exemplary schematic diagram representing an example of a computational entity 10 that can be used in conjunction with embodiments of the present invention. In various embodiments, the computational entity 10 is configured to allow a user to provide input to a quantum computer 110 (for example, through the user interface of the computational entity 10), and to receive, display, analyze, etc., the output from the quantum computer 110.

[0086] As illustrated in Figure 5, the computing entity 10 may include an antenna 512, a transmitter 504 (e.g., wireless), a receiver 506 (e.g., wireless), and a processing element 508 that provides signals to the transmitter 504 and receives signals from the receiver 506. The signals provided to the transmitter 504 and received from the receiver 506 may include signal information / data that conforms to an applicable wireless system air interface standard for communicating with various entities such as the controller 30, other computing entities 10, etc. In this regard, the computing entity 10 may be capable of operating in one or more air interface standards, communication protocols, modulated and access types. For example, the computing entity 10 may be configured to receive and / or provide communications using a wired data transmission protocol such as Fiber Distributed Data Interface (FDDI), Digital Subscriber Line (DSL), Ethernet, Asynchronous Transfer Mode (ATM), Frame Relay, Data Over Cable Service Interface Specification (DOCSIS), or any other wired transmission protocol.Similarly, the computation entity 10 is a general-purpose packet radio service (GPRS), Universal Mobile Communications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 It may be configured to communicate over a wireless external communication network using any of the following protocols: 1X (1xRTT), Wideband Code Division Multiple Access (WCDMA®), Global System for Mobile Communications (GSM), Enhanced Data Rate for GSM Evolution (EDGE), Time Division Synchronous Code Division Multiple Access (TD-SCDMA), Long-Term Evolution (LTE), Evolutionary Universal Terrestrial Radio Access Network (E-UTRAN), Evolutionary Data Optimization (EVDO), High-Speed ​​Packet Access (HSPA), High-Speed ​​Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi Direct, 802.16 (WiMAX), Ultra-Wideband (UWB), Infrared (IR) Protocol, Near Field Communication (NFC) Protocol, Wibree, Bluetooth® Protocol, Wireless Universal Serial Bus (USB) Protocol, and / or any other wireless protocol. Computational entity 10 may communicate using such protocols and standards, including Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), HTTP, HTTP over TLS / SSL / Secure, Internet Message Access Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transmission Protocol (SCTP), Hypertext Markup Language (HTML), etc.

[0087] Through these communication standards and protocols, the computing entity 10 can communicate with various other entities using concepts such as unstructured additional service information / data (USSD), short message service (SMS), multimedia message service (MMS), dual-tone multi-frequency signaling (DTMF), and / or subscriber identification module dialer (SIM dialer). The computing entity 10 can also download changes, add-ons, and updates to its firmware, software (including, for example, executable instructions, applications, and program modules) and operating system.

[0088] The computational entity 10 may also include a user interface device comprising one or more user input / output interfaces (e.g., a display 516 and / or speaker / speaker driver coupled to the processing element 508, and a touchscreen, keyboard, mouse, and / or microphone coupled to the processing element 508). For example, the user output interface may be configured to run on and / or be accessible through the computational entity 10, bring about the display or audible presentation of information / data, and provide an application, browser, user interface, interface, dashboard, screen, web page, page, and / or similar terms used herein interchangeably for interaction with it via one or more user input interfaces. The user input interface may consist of any of several devices that enable the computational entity 10 to receive data, such as a keypad 518 (hard or soft), a touch display, an audio / language or motion interface, a scanner, a reader, or other input device. In embodiments including a keypad 518, the keypad 518 may include (or display) conventional numeric keys (0-9) and associated keys (#, *), as well as other keys used to operate the computational entity 10, and may include a set of keys that can be activated to provide a set of alphabetic keys or a set of alphanumeric keys. In addition to providing input, the user input interface can be used to activate or deactivate certain functions, such as a screen saver and / or sleep mode. Through such input, the computational entity 10 can collect information / data, user interaction / input, etc.

[0089] The computation entity 10 may also include a volatile memory or memory 522 and / or a non-volatile memory or memory 524, which may be embedded and / or removable. For example, non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, etc. Volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, etc. The volatile and non-volatile memory or memory can store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, bytecode, compiled code, interpreted code, machine code, executable instructions, etc., and implement the functions of the computation entity 10.

[0090] conclusion Many modifications and other embodiments of the invention described herein will be conducive to those skilled in the art who benefit from the teachings presented in the above description and the accompanying drawings. It should therefore be understood that the invention is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. Specific terms are used herein, but they are used only in a general and descriptive sense and not for limiting purposes. [Explanation of symbols]

[0091] 5. Approximately parallel atomic beams 10 Computation Entities 20 Networks 30 controllers 40 Cryostat and / or vacuum chamber 45, 45A, 45B Radiation and / or heat shielding 48 Aperture 50 Voltage source 60 Operation source 66, 66A~66C optical path 100 Quantum Computing Systems 110 Quantum Computers 200 Loading Assemblies 201 MOT Assembly 202A, 202B feedthrough 204, 204A, 204B heating chamber 205, 205A, 205B Oven 206 Heating control line 208, 208A, 208B Oven Nozzles 210 Optical Coupler 212 Magnet Array 214 Mirror Array 215 Housing 216 MOT Chamber 218 Support structure 218 Filtration tube 220 Gate valve 225, 225A~225E Diagnostic window 226 MOT area 230 Differential exhaust pipe 235 Beampath 236 Distribution Chamber 240 couplers 250 Beam path axis 255A, 255B Oven shaft 256 MOT axis 262 Ion pump 262 connectors 264 Non-evaporative getter 266 valves 300 Atomic Object Confinement Device 305 Load location 405 Processing element 410 memory 415 Driver Controller Elements 420 Communication Interfaces 425 Analog-to-Digital Converter Element 504 Transmitter 506 Receiver 508 processing elements 512 Antenna 516 displays 518 Keypad 522 Volatile storage devices, volatile memory 524 Non-volatile storage devices, non-volatile memory

Claims

1. A system comprising a loading assembly configured to supply an atomic object to an atomic object containment device, wherein the loading assembly is One or more ovens, each oven having (a) a respective oven nozzle and (b) configured to generate a respective atomic bundle of a respective atomic species through the respective oven nozzle, A mirror array and magnet array configured to generate a two-dimensional magneto-optical trap (2D MOT) when an optical beam is supplied to the mirror and magnet assembly, wherein the 2D MOT is configured to generate substantially parallel atomic beams from the respective atomic fluxes generated by the one or more ovens, A differential exhaust pipe that defines a beam path, wherein the differential exhaust pipe is configured to provide the substantially parallel atomic beam through the beam path, Each of the oven nozzles of the one or more ovens is offset from the beam path, and the 2D MOT is configured to provide the substantially parallel atomic beam in conjunction with the beam path. The atomic object containment device is an ion trap system that confines ionized atomic objects.

2. The system according to claim 1, further comprising the atomic object containment device, wherein each of the oven nozzles of each of the one or more ovens does not have a direct line of sight to the atomic object containment device.

3. (a) the one or more ovens comprises a first oven and a second oven; (b) the first oven is configured to generate a first atomic flux of a first atomic species; (c) the second oven is configured to generate a second atomic flux of a second atomic species; (d) the substantially parallel atomic beams include atomic objects of one or both of the first and second atomic species; (e) the 2D MOT includes a first laser beam of a first wavelength and a second laser beam of a second wavelength; (f) at least one mirror of the mirror array is configured to reflect both the first and second wavelengths; (g) the first wavelength is set to cool the atomic objects of the first atomic species; and (h) the second wavelength is set to cool the atomic objects of the second atomic species.

Images