Phosphor devices and light-emitting devices

Abstract

To provide a high efficiency and high brightness phosphor device, and a light emitting device.SOLUTION: A phosphor device 1 includes: a fluorescent part 20 that has a main surface and emits fluorescence when the main surface is irradiated with an excitation light; a support part 60 provided around the fluorescent part 20; a dielectric multilayer film 10 provided on the main surface, which transmits excitation light and reflects fluorescence; and a connecting part 30 that is provided between the fluorescent part 20 and the support part 60, connects the fluorescent part 20 and the support part 60, and reflects excitation light and fluorescence. The thermal conductivity of the connecting portion 30 is higher than that of the fluorescent portion 20.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a phosphor device and a light-emitting device. [Background technology]

[0002] Projectors, endoscopes, automotive headlamps, lighting devices, and liquid crystal displays utilize light-emitting devices that use solid-state light-emitting elements such as LEDs or semiconductor lasers as light sources. This type of light-emitting device comprises, for example, a light source and a phosphor device that emits fluorescence using the light emitted by the light source as excitation light. In this case, since high brightness is required for light-emitting devices used in projectors or endoscopes, semiconductor lasers are used as the light source.

[0003] As an example of this type of phosphor device, Patent Document 1 discloses an optical component comprising a light-transmitting member and a fluorescent portion and a light-reflecting portion disposed on the light-transmitting member. In the optical component disclosed in Patent Document 1, a space is provided between the fluorescent portion and the light-transmitting member, and the fluorescent portion and the light-reflecting portion are in contact. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2019-53130 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] In phosphor devices, when excitation light is shone on the fluorescent portion, light of a predetermined color is emitted from the fluorescent portion. At this time, the fluorescent portion generates heat when it is shone with excitation light.

[0006] However, in the phosphor device disclosed in Patent Document 1, since a space is provided between the high-temperature portion in the phosphor part and the light-transmitting member, and the thermal conductivity of the light-reflecting part in contact with the phosphor part is not sufficiently high, the heat dissipation of the heat generated in the phosphor part is poor. For this reason, the luminous efficiency of the phosphor part decreases, and the efficiency and luminance of the phosphor device decrease.

[0007] The present invention has been made in view of such problems, and an object thereof is to provide a phosphor device and a light-emitting device with high efficiency and high luminance.

Means for Solving the Problems

[0008] In order to achieve the above object, one aspect of the phosphor device according to the present invention has a main surface, a phosphor part that emits fluorescence when excited light is irradiated on the main surface, a support part provided around the phosphor part in a plan view of the main surface, a dielectric multilayer film provided on the main surface that transmits the excitation light and reflects the fluorescence, and a connection part provided between the phosphor part and the support part that connects the phosphor part and the support part and reflects the excitation light and the fluorescence. The thermal conductivity of the connection part is higher than the thermal conductivity of the phosphor part.

[0009] Also, one aspect of the light-emitting device according to the present invention includes the phosphor device described above and a light source that irradiates the excitation light on the main surface of the phosphor part included in the phosphor device.

Effects of the Invention

[0010] A phosphor device and a light-emitting device with high efficiency and high luminance can be realized.

Brief Description of the Drawings

[0011] [Figure 1] FIG. 1 is a diagram showing the configuration of a phosphor device according to an embodiment. [Figure 2] FIG. 2 is a plan view and a side view of a support part according to an embodiment. [Figure 3]Figure 3 shows the configuration of a light-emitting device according to an embodiment. [Figure 4] Figure 4 shows the configuration of a conventional phosphor device. [Figure 5] Figure 5 illustrates what happens when excitation light is incident on a conventional phosphor device. [Figure 6] Figure 6 is a diagram illustrating the state when excitation light is incident on the phosphor device according to the embodiment. [Figure 7] Figure 7 shows the configuration of a phosphor device according to a modified example 1 of the embodiment. [Figure 8] Figure 8 is a cross-sectional view showing the configuration of a phosphor device according to a modified example 2 of the embodiment. [Figure 9] Figure 9 is a cross-sectional view showing the configuration of a phosphor device according to a modified example 3 of the embodiment. [Figure 10] Figure 10 shows the configuration of a phosphor device according to a modified example 4 of the embodiment. [Figure 11] Figure 11 shows a plan view and a side view of the fluorescent part and support part according to a modified example 4 of the embodiment. [Figure 12] Figure 12 is a cross-sectional view showing the configuration of a phosphor device according to a modified example 5 of the embodiment. [Modes for carrying out the invention]

[0012] The embodiments of the present invention will be described below. The embodiments described below are all preferred examples of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions of components, and connection configurations shown in the following embodiments are examples and are not intended to limit the present invention. Accordingly, components in the following embodiments that are not described in an independent claim will be described as optional components.

[0013] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. In each figure, substantially identical components are denoted by the same reference numerals, and redundant explanations are omitted or simplified.

[0014] Furthermore, in this specification, terms describing the shape of elements such as rectangles or circles, and numerical ranges, do not represent only strict meanings, but also include substantially equivalent ranges, such as differences of a few percent.

[0015] Furthermore, in this specification, the terms "upper" and "lower" do not refer to the upward (vertically upward) and downward (vertically downward) directions in absolute spatial perception, but rather are used as terms defined by the relative positional relationship based on the stacking order in a stacked configuration. Moreover, the terms "upper" and "lower" apply not only when two components are spaced apart and another component exists between them, but also when two components are placed in close proximity and touching each other.

[0016] Furthermore, in this specification and drawings, the x-axis, y-axis, and z-axis represent the three axes of a three-dimensional Cartesian coordinate system. In embodiments and modifications, the two axes parallel to the main surface of the fluorescent portion are defined as the x-axis and y-axis, and the direction perpendicular to the main surface is defined as the z-axis direction. In addition, the positive z-axis direction may be described as upward, and the negative z-axis direction may be described as downward. Furthermore, the upper surface may be described as the top surface, and the lower surface may be described as the bottom surface.

[0017] (Embodiment) First, the configuration of the phosphor device 1 according to the embodiment will be explained using Figure 1.

[0018] Figure 1 shows the configuration of the phosphor device 1 according to this embodiment. Figure 1(a) is a plan view of the phosphor device 1, and Figure 1(b) is a cross-sectional view of the phosphor device 1 along the Ib-Ib line in Figure 1(a).

[0019] As shown in Figure 1, the phosphor device 1 according to this embodiment comprises a fluorescent portion 20, a support portion 60, a dielectric multilayer film 10, and a connecting portion 30.

[0020] The fluorescent portion 20 is a light-emitting layer that emits light and, when irradiated with excitation light, is excited and emits fluorescence at a predetermined wavelength in the visible light region. As an example, the fluorescent portion 20 is a yellow phosphor layer composed of a yellow phosphor. In this case, the fluorescent portion 20, which is a yellow phosphor layer, emits fluorescence when excited by light with a shorter wavelength than yellow light (for example, ultraviolet light to blue light). In other words, the yellow phosphor layer converts the wavelength of the excitation light to yellow light with a longer wavelength than the excitation light.

[0021] The fluorescent portion 20 is a phosphor layer consisting solely of phosphor. Specifically, the fluorescent portion 20 is a phosphor ceramic layer composed of a sintered single crystalline phase phosphor. In other words, the fluorescent portion 20 is a component consisting solely of phosphor ceramic, and the main component material of the fluorescent portion 20 is phosphor ceramic. By using a phosphor ceramic layer as the fluorescent portion 20 in this way, heat resistance and heat dissipation can be improved. Furthermore, by using a phosphor ceramic layer as the fluorescent portion 20, light loss due to fluorescence scattering can be suppressed, thereby improving the conversion efficiency of the fluorescent portion. In this embodiment, the fluorescent portion 20 is a phosphor ceramic layer consisting solely of a single crystalline phase.

[0022] Furthermore, the fluorescent portion 20 can be a phosphor layer formed by encapsulating phosphors with a binder, or a phosphor layer made of a single crystal.

[0023] As the fluorescent part 20, which consists of a phosphor layer to which phosphors are bound by a binder, a phosphor-containing resin layer in which the phosphors are sealed with a transparent resin (refractive index approximately 1.5), a phosphor-containing glass layer in which the phosphors are sealed with liquid glass (refractive index approximately 1.5), a phosphor-containing inorganic layer in which the phosphors are sealed with a transparent inorganic material such as ZnO (refractive index approximately 2.0), or a phosphor ceramic layer in which the phosphors are bound with a ceramic sintered body (single crystal with a refractive index approximately 1.8) made of ceramics such as alumina can be used. In this case, from the viewpoint of heat resistance and heat dissipation, the phosphor ceramic layer is preferable for the fluorescent part 20. When the fluorescent part 20 is a phosphor layer made of a single crystal, the fluorescent part 20 does not contain air, so the thermal conductivity of the fluorescent part 20 is improved.

[0024] The fluorescent portion 20 includes a crystalline phase having a garnet structure. More specifically, in this embodiment, the fluorescent portion 20 is composed solely of a crystalline phase having a garnet structure. In other words, the fluorescent portion 20 according to this embodiment does not include a crystalline phase having a structure different from the garnet structure. The garnet structure is A3B2C3O 12 This is a crystal structure represented by the general formula . Element A is a rare earth element such as Ca, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, and Lu; element B is a rare earth element such as Mg, Al, Si, Ga, and Sc; and element C is a rare earth element such as Al, Si, and Ga. Examples of such garnet structures include YAG (Yttrium Aluminum Garnet), LuAG (Lutetium Aluminum Garnet), and Lu2CaMg2Si3O 12 Examples include (Lutetium Calcium Magnesium Silicon Garnet) and TAG (Terbium Aluminum Garnet). In this embodiment, the fluorescent part 20 is composed of The material of the phosphor is (Y 1-x Ce x )3Al2Al3O12 (That is, (Y 1-x Ce x )3Al5O 12 )(0.0001 ≦ x < 0.1), which is a crystal phase represented by, i.e., an example of a phosphor ceramic, YAG, and the phosphor part 20 is a phosphor ceramic layer composed only of sintered YAG. Specifically, the phosphor part 20 is a yellow phosphor layer made of a YAG phosphor.

[0025] Note that the crystal phase constituting the phosphor part 20 may be a solid solution of a plurality of garnet crystal phases having different chemical compositions. Such solid solutions include (Y 1-x Ce x )3Al2Al3O 12 (0.00001 ≦ x < 0.1) and (Lu 1-d Ce d )3Al2Al3O 12 (0.00001 ≦ d < 0.1), a solid solution ((1 - a)(Y 1-x Ce x )3Al5O 12 ·a(Lu 1-d Ce d )3Al2Al3O 12 )(0 < a < 1)). Also, such solid solutions include (Y 1-x Ce x )3Al2Al3O 12 (0.00001 ≦ x < 0.1) and (Lu 1-z Ce z )2CaMg2Si3O 12 (0.00001 ≦ z < 0.15), a solid solution ((1 - b)(Y 1-x Ce x )3Al2Al3O 12 ·b(Lu 1-z Ce z )2CaMg2Si3O 12Examples include (0 < b < 1). Since the fluorescent part 20 is composed of a solid solution of a plurality of garnet crystal phases with different chemical compositions, the fluorescence spectrum of the fluorescence emitted by the fluorescent part 20 becomes broader, and the green light component and the red light component increase. Therefore, a phosphor device that emits output light with a wide color gamut can be provided.

[0026] Further, the crystal phase constituting the fluorescent part 20 may contain a crystal phase with a chemical composition shifted from the crystal phase represented by the above general formula A3B2C3O 12 . Examples of such a crystal phase include (Y 1-x Ce x )3Al2Al3O 12 (Y 1-x Ce x )3Al 2+δ Al3O 12 (δ is a positive number), which is rich in Al with respect to the crystal phase represented by (0.00001 ≤ x < 0.1). Examples of such a crystal phase also include (Y 1-x Ce x )3Al2Al3O 12 (Y 1-x Ce x ) 3+ζ Al2Al3O 12 (ζ is a positive number), etc., which is rich in Y with respect to the crystal phase represented by (0.00001 ≤ x < 0.1). These crystal phases have a chemical composition shifted from the crystal phase represented by the general formula A3B2C3O 12 , but maintain the garnet structure. Since the fluorescent part 20 is composed of a crystal phase with a shifted chemical composition, regions with different refractive indices occur in the fluorescent part 20, so that the excitation light and fluorescence are more scattered, and the light-emitting area of the fluorescent part 20 becomes smaller.

[0027] The density of the fluorescent portion 20 should be between 95% and 100% of the theoretical density, and preferably between 97% and 100%. Here, the theoretical density is the density assuming that the atoms in the layer are ideally arranged. In other words, the theoretical density is the density assuming there are no voids in the fluorescent portion 20, and is a value calculated using the crystal structure. For example, if the density of the fluorescent portion 20 is 99%, the remaining 1% corresponds to voids. That is, the higher the density of the fluorescent portion 20, the fewer voids there are. When the density of the fluorescent portion 20 is within the above range, the total amount of fluorescence emitted by the fluorescent portion 20 increases, thus providing a phosphor device with a greater amount of emitted light. The density of the fluorescent portion 20 is 4.32 g / cm³. 3 More than 4.55g / cm 3 The following is acceptable: 4.41 g / cm³ 3 More than 4.55g / cm 3 The following is preferable. As shown in this embodiment, when the fluorescent portion 20 is composed of YAG, if the density of the fluorescent portion 20 is within the above range, the density of the fluorescent portion 20 will be 95% to 100% and 97% to 100% of the theoretical density, respectively. By having the density of the fluorescent portion 20 within the above range, the excitation light absorbed by the fluorescent portion 20 can be efficiently converted into fluorescence. In other words, a fluorescent portion 20 with high luminescence efficiency is realized. Note that if the density of the fluorescent portion 20 is less than 100% of the theoretical density, the fluorescent portion 20 contains voids (i.e., air bubbles).

[0028] The plan view shape of the fluorescent part 20 is rectangular, but is not limited to this. The shape may be circular. Also, in this embodiment, the thickness of the fluorescent portion 20 is constant, but is not limited to this. The thickness of the fluorescent portion 20 is, for example, several tens of micrometers or more and several millimeters or less, and in this embodiment, it is 500 micrometers. Although the fluorescent portion 20 is described above as a light-emitting layer and is layered, the fluorescent portion 20 in this embodiment is sufficiently thick and can therefore be described as being plate-shaped.

[0029] Furthermore, the fluorescent portion 20 has a first main surface 21 as its main surface. More specifically, the fluorescent portion 20 has a first main surface 21 and a second main surface 22 facing away from the first main surface 21. The first main surface 21 is the lower surface of the fluorescent portion 20, and the second main surface 22 is the upper surface of the fluorescent portion 20. When excitation light is irradiated onto the first main surface 21, the fluorescent portion 20 emits fluorescence.

[0030] Next, the connection part 30 will be described.

[0031] The connecting portion 30 is provided between the fluorescent portion 20 and the support portion 60. As shown in Figure 1, in this embodiment, the connecting portion 30 surrounds the entire periphery of the fluorescent portion 20 in a plan view of the first main surface 21 of the fluorescent portion 20. Specifically, since the plan view shape of the fluorescent portion 20 is rectangular, the connecting portion 30 has a rectangular opening. Specifically, the plan view shape of the connecting portion 30 is a rectangular frame shape with a rectangular opening and a rectangular outer shape. Note that the plan view shape of the connecting portion 30 is not limited to a rectangular frame shape, and may be annular or the like.

[0032] The connecting portion 30 is in thermal contact with the fluorescent portion 20. In other words, the fluorescent portion 20 and the connecting portion 30 are arranged so that the heat generated in the fluorescent portion 20 is conducted to the connecting portion 30. Therefore, the connecting portion 30 is a heat conductive member that conducts the heat generated in the fluorescent portion 20. Furthermore, the thermal conductivity of the connecting portion 30 is higher than that of the fluorescent portion 20. As mentioned above, the fluorescent portion 20 is a yellow phosphor layer made of YAG phosphor, and since the thermal conductivity of YAG phosphor is 10 W / (m·K), the thermal conductivity of the fluorescent portion 20 is also 10 W / (m·K). In other words, in this embodiment, the thermal conductivity of the connecting portion 30 is higher than 10 W / (m·K).

[0033] In this embodiment, the connecting portion 30 is in physical contact with the fluorescent portion 20. Specifically, the entire inner surface of the connecting portion 30 is in contact with the outer surface of the fluorescent portion 20. In other words, the fluorescent portion 20 is provided to fill the opening of the connecting portion 30.

[0034] The thickness (height) of the connecting portion 30 is the same as the thickness (height) of the fluorescent portion 20, but this is not limited to this. In other words, the thickness of the connecting portion 30 may be lower than or higher than the thickness of the fluorescent portion 20. However, it is preferable that the connecting portion 30 is provided so as not to overlap the second main surface 22 of the fluorescent portion 20. In other words, it is preferable that the connecting portion 30 is formed so that the material constituting the connecting portion 30 does not protrude onto the second main surface 22 of the fluorescent portion 20.

[0035] The connecting portion 30 connects the fluorescent portion 20 and the support portion 60. The connecting portion 30 also serves as an adhesive member for bonding the fluorescent portion 20 and the support portion 60 together. Therefore, problems such as the fluorescent portion 20 detaching from the support portion 60 that supports it are less likely to occur. Furthermore, the connecting portion 30 also serves as a light reflecting member that reflects the excitation light and the fluorescence emitted from the fluorescent portion 20.

[0036] Thus, the connecting portion 30, which is a heat conductive member, an adhesive member, and a light reflecting member, is composed of a plurality of metal parts 35 and a resin part 37.

[0037] The resin part 37 is a component having a resin material, and in this embodiment, it is a component made of a resin material. The resin material is, for example, a thermosetting resin or a thermoplastic resin. The connecting part 30 can be formed, for example, by using the resin part 37 as a binder and dispersing the metal part 35 in this binder. The insulating resin material constituting the resin part 37 is a silicone resin. A resin such as phenolic resin or epoxy resin can be used. For example, a connecting portion 30 can be formed by applying a paste in which multiple metal parts 35 are dispersed on a resin part 37 that serves as a binder and then curing it.

[0038] Since the connecting portion 30 has a resin portion 37, the connecting portion 30 can connect, or in other words, bond, the fluorescent portion 20 and the support portion 60.

[0039] The metal part 35 is a component having a metallic material, and in this embodiment, it is a component made of a metallic material. As shown in Figure 1, the connecting part 30 has a plurality of metal parts 35 inside the resin part 37. The plurality of metal parts 35 are provided to reflect fluorescence and excitation light, and also to conduct heat generated in the fluorescent part 20.

[0040] Each of the multiple metal parts 35 is preferably made of a metallic material capable of reflecting fluorescence and excitation light. Furthermore, each of the multiple metal parts 35 is preferably made of a metallic material with a higher thermal conductivity than the fluorescent part 20, although metallic materials generally have high thermal conductivity. For example, each of the multiple metal parts 35 is preferably made of at least one of silver and aluminum, and in this case, it is made of silver. Silver and aluminum have high reflectivity of light in the visible light region and also have very high thermal conductivity, with values ​​of 427 W / (m·K) and 237 W / (m·K), respectively.

[0041] Furthermore, each of the multiple metal parts 35 is a metal particle in a granular shape. Here, each of the multiple metal parts 35 is a metal particle made of silver. The average particle diameter of the above metal particles is not particularly limited, but for example, it may be between 50 nm and 50 μm, and it is better if it is between 100 nm and 20 μm. Moreover, for example, it is even better if the average particle diameter of some of the above metal particles is between 100 nm and 1 μm, and the average particle diameter of other parts of the above metal particles is between 5 μm and 20 μm. The multiple metal parts 35 may consist of multiple metal particles of different sizes.

[0042] Each of the multiple metal parts 35 is made of silver metal particles, and the average particle size of these metal particles is 2 μm. In this embodiment, the thermal conductivity of the connection part 30 is 20 W / (m·K). As described above, the thermal conductivity of the connection part 30 (20 W / (m·K)) is higher than the thermal conductivity of the fluorescent part 20 (10 W / (m·K)).

[0043] As the connection portion 30 has multiple metal parts 35, the connection portion 30 can be used as a heat conductive member and a light reflective member.

[0044] Each of the multiple metal parts 35 was, but is not limited to, a metal particle made of silver. For example, some of the multiple metal parts 35 may be metal particles made of silver, and other parts of the multiple metal parts 35 may be metal particles made of aluminum. Alternatively, each of the multiple metal parts 35 may be a metal particle made of a mixture of silver and aluminum.

[0045] Furthermore, while the shape of the metal particles is spherical, it is not limited to this. For example, the shape of the metal particles may be ellipsoidal or flaky. When the shape of the metal particles is flaky, when a paste containing multiple metal parts 35 dispersed in it is applied to the resin part 37 during the manufacturing of the connecting part 30, the surfaces of the flaky particles are oriented along the z-axis direction in Figure 1, that is, nearly parallel to the z-axis direction. Because the connecting part 30 is manufactured in this oriented state, the connecting part 30 can reflect fluorescence and excitation light with high reflectivity.

[0046] For example, each of the multiple metal parts 35 is a metal particle made of silver, and these metal particles If the average particle size of the children is 50 nm, the thermal conductivity of the connection part 30 can be set to 240 W / (m·K).

[0047] Furthermore, the connecting portion 30 may have an inorganic portion instead of a metal portion 35. In this case, the connecting portion 30 is composed of a plurality of inorganic portions and a resin portion 37.

[0048] The inorganic part is a component having an inorganic material, and more specifically, it is a component made of an inorganic material. In this case, the connecting part 30 has multiple inorganic parts inside the resin part 37. The multiple inorganic parts are provided to scatter and reflect fluorescence and excitation light, and also to conduct heat generated in the fluorescence part 20.

[0049] Each of the multiple inorganic parts is capable of scattering and reflecting fluorescence and excitation light, and is preferably composed of an inorganic material with a higher thermal conductivity than the fluorescence part 20. For example, each of the multiple inorganic parts may be an inorganic particle composed of a ceramic material. The ceramic material may be composed of at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide. The average particle size of the above inorganic particles may be, for example, 0.1 μm or more and 50 μm or less, but is not limited to this. When the connecting part 30 has an inorganic part, the connecting part 30 reflects light of wavelengths in the visible light region and is therefore white. In other words, the connecting part 30 becomes a white resin layer.

[0050] Furthermore, an example of the thermal conductivity of ceramic materials is given. The thermal conductivity of aluminum oxide is 30 W / (m·K), which shows high thermal conductivity.

[0051] Thus, since multiple inorganic parts scatter and reflect light and have high thermal conductivity, even when the connection part 30 has multiple inorganic parts, the connection part 30 can be used as a heat conducting member and a light reflecting member.

[0052] Next, the support portion 60 will be explained.

[0053] The support portion 60 is provided around the fluorescent portion 20 in a plan view. In this embodiment, the support portion 60 surrounds the entire area around the fluorescent portion 20 and the connecting portion 30 in a plan view. The support portion 60 is a member that supports the fluorescent portion 20. The support portion 60 can support the fluorescent portion 20 because the fluorescent portion 20 and the support portion 60 are connected (bonded) by the connecting portion 30.

[0054] Here, the shape of the support portion 60 will be explained using Figure 2.

[0055] Figure 2 shows a plan view and a side view of the support portion 60 according to this embodiment. More specifically, Figure 2(a) is a plan view of the support portion 60, and Figure 2(b) is a side view of the support portion 60. Since the fluorescent portion 20 and the connecting portion 30 have a rectangular shape in plan view, the support portion 60 has a rectangular opening 61. Specifically, the plan view shape of the support portion 60 is a rectangular frame shape with a rectangular opening 61 and a rectangular outer shape. Note that the plan view shape of the support portion 60 is not limited to a rectangular frame shape, and may be an annular shape, etc.

[0056] Furthermore, as shown in Figure 2, the length of the support portion 60 in the x-axis direction is length A1, the length of the support portion 60 in the y-axis direction is length B1, the length of the opening 61 in the y-axis direction is length C1, the length of the opening 61 in the x-axis direction is length D1, and the thickness of the support portion 60 in the z-axis direction is thickness E1. Lengths A1 and B1 can each be, for example, several millimeters or more and several tens of millimeters or less, and in this embodiment, they are 7 mm. Length C1 is shorter than length B1, and length D1 is shorter than length A1, and lengths C1 and D1 can each be, for example, several hundred micrometers or more and several tens of millimeters or less, and in this embodiment In this form, the thickness is 800 μm. The thickness E is, for example, between several tens of μm and several millimeters, and in this embodiment, it is 500 μm.

[0057] The support portion 60 is in thermal contact with the connecting portion 30. In other words, the fluorescent portion 20 and the connecting portion 30 and the support portion 60 are arranged so that the heat generated in the fluorescent portion 20 is conducted to the support portion 60. In this embodiment, the support portion 60 is in physical contact with the connecting portion 30. Specifically, the entire inner surface of the support portion 60 is in contact with the outer surface of the connecting portion 30. In other words, the fluorescent portion 20 and the connecting portion 30 are arranged to fill the opening 61 of the support portion 60.

[0058] The support portion 60 is a component made of a metal material. The support portion 60 is preferably made of a metal material with a higher thermal conductivity than the fluorescent portion 20, but as mentioned above, metal materials generally have high thermal conductivity. In this case, the support portion 60 is made of copper. That is, the support portion 60 in this embodiment is a metal plate made of copper. However, the material constituting the support portion 60 is not limited to this, and other metal materials such as aluminum may also be used.

[0059] The thermal conductivity of aluminum and copper is very high, at 237 W / (m·K) and 370 W / (m·K), respectively. Therefore, the heat generated in the fluorescent part 20 can be easily conducted to the support part 60 via the connection part 30.

[0060] The support portion 60 has a plate shape, and its thickness (height) is the same as the thickness (height) of the fluorescent portion 20 and the connecting portion 30. However, the thickness (height) of the support portion 60 and the thickness (height) of the fluorescent portion 20 and the connecting portion 30 are not limited to this. In other words, the thickness of the support portion 60 may be lower than the thickness of the fluorescent portion 20 and the connecting portion 30, or it may be higher than the thickness of the fluorescent portion 20 and the connecting portion 30.

[0061] The dielectric multilayer film 10 is provided on the first main surface 21 of the fluorescent portion 20.

[0062] The dielectric multilayer film 10 has a structure in which multiple dielectric films are stacked, and it reflects certain light while transmitting other specific light. In this embodiment, the dielectric multilayer film 10 reflects the fluorescence emitted by the phosphor of the fluorescent part 20 and transmits the excitation light incident on the phosphor device 1. For example, if the fluorescent part 20 is made of a yellow phosphor and the excitation light incident on the phosphor device 1 is ultraviolet light or blue light, the dielectric multilayer film 10 reflects at least the yellow light emitted by the fluorescent part 20 and transmits the ultraviolet light or blue light that is the excitation light.

[0063] By providing the dielectric multilayer film 10 on the first main surface 21 in this way, the dielectric multilayer film 10 can reflect the light from the fluorescence emitted by the fluorescent portion 20 that is directed toward the negative z-axis. This increases the amount of light from the fluorescent portion 20 that can be extracted from the phosphor device 1.

[0064] Next, the configuration of the light-emitting device 100 using the phosphor device 1 according to this embodiment and the optical operation of the phosphor device 1 will be explained with reference to Figure 3. Figure 3 is a diagram showing the configuration of the light-emitting device 100 according to this embodiment.

[0065] The light-emitting device 100 according to this embodiment comprises a phosphor device 1 and a light source 2 that emits light incident on the phosphor device 1.

[0066] Light source 2 is an excitation light source that emits excitation light to cause the fluorescent part 20 to emit light. The phosphor contained in the fluorescent part 20 is excited by the excitation light emitted from light source 2 and emits fluorescence. In this embodiment, the light-emitting device 100 is a transmission-type light-emitting device in which the excitation light incident on the phosphor device 1 passes through the phosphor device 1. In other words, the excitation light incident on the phosphor device 1 passes through the fluorescent part 20. Therefore, the light emitted from light source 2 passes through the phosphor device It is positioned to allow light to pass through 1. Specifically, the light source 2 is positioned on the negative z-axis side (dielectric multilayer film 10 side) of the phosphor device 1.

[0067] As light source 2, for example, a semiconductor laser that emits ultraviolet or blue laser light can be used. Since laser light has excellent directional properties, by using a semiconductor laser as light source 2, laser light (excitation light) can be incident on the fluorescent part 20 at a desired incident angle. Note that light source 2 is not limited to a semiconductor laser, but may also be other solid-state light-emitting elements such as LEDs, or an excitation light source other than a solid-state light-emitting element.

[0068] In the light-emitting device 100 configured in this way, light emitted from the light source 2 is incident on the phosphor device 1, causing the phosphor device 1 to emit light of a predetermined color.

[0069] Specifically, in this embodiment, the light emitted from the light source 2 is incident on the negative z-axis surface of the dielectric multilayer film 10. The light from the light source 2 incident on the dielectric multilayer film 10 passes through the dielectric multilayer film 10 and reaches the fluorescent part 20. At this time, the external size of the fluorescent part 20 should be equivalent to the spot size (excitation light spot size) when the light emitted from the light source 2 is incident on the fluorescent part 20.

[0070] In this embodiment, the excitation light from the light source 2 is blue light, and the fluorescent part 20 is a yellow phosphor layer. In this case, the blue light from the light source 2 is incident on the fluorescent part 20. As a result, the yellow phosphor (YAG phosphor) of the fluorescent part 20 absorbs a portion of the blue light from the light source 2, is excited, and emits yellow light as fluorescence. Then, in the fluorescent part 20, this yellow light and the blue light from the light source 2 that was not absorbed by the yellow phosphor mix to form white light, and white light is emitted from the fluorescent part 20. In other words, white light is extracted from the fluorescent part 20.

[0071] At this time, a dielectric multilayer film 10 is formed on the first main surface 21 of the fluorescent part 20, which reflects the yellow light emitted by the fluorescent part 20 and transmits the purple-blue light that is the excitation light. With this configuration, the yellow light emitted by the fluorescent part 20 that is directed toward the light source 2 is reflected by the dielectric multilayer film 10 and proceeds toward the opposite side of the light source 2 (the second main surface 22 side).

[0072] Furthermore, a connection portion 30 is formed around the fluorescent portion 20. With this configuration, the white light (blue light + yellow light) emitted from the fluorescent portion 20 that travels in the x-axis direction and the y-axis direction is reflected by the connection portion 30, returns to the fluorescent portion 20, and is radiated to the outside from the second main surface 22 of the fluorescent portion 20. This increases the amount of light that can be extracted from the fluorescent portion 20.

[0073] Furthermore, in this embodiment, the phosphor device 1 is a remote phosphor type, and the phosphor device 1 and the light source 2 are spatially separated. This makes it possible to suppress the phosphor device 1 (especially the fluorescent part 20) from being affected by the heat generated by the light source 2.

[0074] In Figure 3, the light emitted from the light source 2 is incident perpendicularly to the negative z-axis surface of the dielectric multilayer film 10, but it may also be incident obliquely to the negative z-axis surface of the dielectric multilayer film 10.

[0075] Next, the effects of the phosphor device 1 according to this embodiment will be explained, along with the process that led to obtaining one aspect of the present invention, while comparing it with a conventional phosphor device 1x. Figure 4 is a diagram showing the configuration of a conventional phosphor device 1x, and Figure 5 is a diagram illustrating what happens when excitation light is incident on the conventional phosphor device 1x. Figure 6 is a diagram illustrating what happens when excitation light is incident on the phosphor device 1 according to this embodiment.

[0076] As shown in Figure 4, a conventional phosphor device 1x comprises a substrate member 13x and a fluorescent portion 20x and a light-reflecting portion 30x positioned above the substrate member 13x. The substrate member 13x is composed of a light-transmitting substrate 11x, a dielectric multilayer film 10x, and an anti-reflective film 12x. Inside the light-reflecting portion 30x, there is a light-scattering portion 31x for scattering and reflecting light.

[0077] The light-transmitting substrate 11x is a light-transmitting substrate having an upper surface which is the positive z-axis side and a lower surface which is the negative z-axis side. The light-transmitting substrate 11x is a substrate with high light transmittance, for example, a sapphire substrate. The dielectric multilayer film 10x has the same configuration as the dielectric multilayer film 10, except that it is provided on the upper surface of the light-transmitting substrate 11x. The anti-reflective film 12x is provided on the lower surface of the light-transmitting substrate 11x. The anti-reflective film 12x may be a single layer or a multilayer film. The anti-reflective film 12x suppresses the reflection of light incident on the phosphor device 1x from the lower surface of the light-transmitting substrate 11x.

[0078] The fluorescent section 20x has the same configuration as the fluorescent section 20. The light-reflecting section 30x surrounds the entire periphery of the fluorescent section 20x in a plan view. The light-reflecting section 30x is in thermal contact with the fluorescent section 20x. In other words, the fluorescent section 20x and the light-reflecting section 30x are arranged so that the heat generated in the fluorescent section 20x is conducted to the light-reflecting section 30x. The light-reflecting section 30x is composed of a ceramic layer made of a ceramic material such as alumina. Inside the light-reflecting section 30x there are countless light-scattering sections 31x for scattering and reflecting excitation light and fluorescence. Inside the ceramic layer of the light-reflecting section 30x there are countless voids (air layers) that act as light-scattering sections 31x to scatter and reflect light. Because countless voids are provided inside, the thermal conductivity of the alumina-based light-reflecting section 30x is low, about 10 W / (m·K), which is about the same as the thermal conductivity of the fluorescent section 20x.

[0079] The light-reflecting portion 30x and the substrate member 13x are connected by a connecting member 50x, but the fluorescent portion 20x and the substrate member 13x are not connected. In other words, the fluorescent portion 20x is not in contact with the dielectric multilayer film 10x of the substrate member 13x, and there is a space 40x between the fluorescent portion 20x and the substrate member 13x with a thickness equal to the thickness of the connecting member 50x.

[0080] As shown in Figure 5, the conventional phosphor device 1x configured in this way emits white light when excitation light is incident on the fluorescent portion 20x, similar to the phosphor device 1 in the above embodiment.

[0081] When excitation light is shone on the fluorescent portion 20x, the fluorescent portion 20x generates heat. At this time, the lower part of the fluorescent portion 20x on the side where the excitation light is incident becomes hotter than the upper part.

[0082] However, in conventional phosphor devices 1x, a space 40x is provided between the high-temperature portion (lower portion) of the fluorescent part 20x and the substrate member 13x, making it difficult for the heat generated in the fluorescent part 20x to be conducted to the substrate member 13x. Furthermore, the thermal conductivity of the light-reflecting part 30x is 10 W / (m·K), which is about the same as the thermal conductivity of the fluorescent part 20x and is low. Therefore, the heat generated in the fluorescent part 20x is also difficult to conduct to the light-reflecting part 30x. In other words, the heat dissipation of the heat generated in the fluorescent part 20x is poor. As a result, in conventional phosphor devices 1x, the luminescence efficiency of the fluorescent part 20x decreases, and the efficiency and brightness of the phosphor device 1x decrease.

[0083] Thus, the conventional phosphor device 1x structure has poor heat dissipation capabilities for the heat generated in the fluorescent portion 20x.

[0084] In contrast, in the phosphor device 1 according to this embodiment, as shown in Figure 6, the fluorescent portion 20 is connected to a connection portion 30 which has a higher thermal conductivity than the fluorescent portion 20.

[0085] This configuration allows the heat generated in the fluorescent section 20 when excitation light is incident on it to be efficiently conducted to the connection section 30. In other words, the heat dissipation of the heat generated in the fluorescent section 20 can be improved. As a result, the luminescence efficiency of the fluorescent section 20 can be improved, and thus the efficiency and brightness of the phosphor device 1 can be improved.

[0086] Furthermore, the support portion 60 is made of a metal material. If a material with high thermal conductivity is used as the metal material constituting the support portion 60, the heat generated in the fluorescent portion 20 is easily conducted to the support portion 60 via the connecting portion 30. The support portion 60 is made of copper or aluminum, and in this case, it is made of copper. The thermal conductivity of aluminum and copper is very high, at 237 W / (m·K) and 370 W / (m·K), respectively. Therefore, the heat generated in the fluorescent portion 20 can be easily conducted to the support portion 60 via the connecting portion 30. Accordingly, in this embodiment, the heat dissipation of the heat generated in the fluorescent portion 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0087] Furthermore, in this embodiment, the connection portion 30 is composed of a plurality of metal parts 35 and a resin part 37. If a material with high thermal conductivity is used as the metal material constituting each of the plurality of metal parts 35, a connection portion 30 with higher thermal conductivity than the fluorescent part 20 can be easily realized. As described above, it is preferable to use one of silver and aluminum as the metal material constituting each of the plurality of metal parts 35. Silver and aluminum are materials with high reflectivity of fluorescence and excitation light and high thermal conductivity. Therefore, the reflectivity of the connection portion 30 can be improved, and the heat dissipation of heat generated in the fluorescent part 20 can be improved, thereby improving the efficiency and brightness of the phosphor device 1.

[0088] Even when multiple inorganic parts are used instead of multiple metal parts 35, the fluorescence and excitation light are scattered and reflected by the multiple inorganic parts, and if materials with high thermal conductivity are used as the materials constituting each of the multiple inorganic parts, a similar effect can be expected.

[0089] As described above, at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide is preferably used as the metallic material constituting each of the multiple inorganic parts. In particular, aluminum oxide is a material that diffusely reflects fluorescence and excitation light and has high thermal conductivity. Therefore, it is possible to improve the reflectivity of the connection part 30 and improve the heat dissipation of heat generated in the fluorescence part 20, thereby improving the efficiency and brightness of the phosphor device 1.

[0090] Furthermore, in this embodiment, the connecting portion 30 is composed of a metal portion 35 and a resin portion 37, but it is not limited to this. For example, a glass portion made of glass material may be used instead of the resin portion 37. The glass portion may be made of glass material, and for example, the connecting portion 30 can be formed by applying a paste in which a plurality of metal portions 35 are dispersed to a glass portion that serves as a binder and then curing it. In addition, frit glass materials such as SiO2, B2O5, ZnO, Al2O3, Bi2O3, P2O5, and ZrO2 may be used as the glass material.

[0091] By using a glass part made of glass material instead of a resin part 37 made of resin material, the thermal conductivity of the connection part 30 can be improved.

[0092] Furthermore, when glass is used, it is preferable that one of silver, aluminum, and copper be used as the metal material constituting each of the multiple metal parts 35. Silver, aluminum, and copper are materials with high reflectivity for fluorescence and excitation light, and high thermal conductivity. Therefore, it is possible to improve the reflectivity of the connection part 30 and improve the heat dissipation of heat generated in the fluorescent part 20. This allows for improvements in the efficiency and brightness of the phosphor device 1.

[0093] For example, when the connecting portion 30 consists of multiple metal parts 35 and a glass part, each of the multiple metal parts 35 is made of silver metal particles. Some of the multiple metal parts 35 are made of silver metal particles with an average particle diameter of 100 nm to 1 μm, and the other parts of the multiple metal parts 35 are made of silver metal particles with an average particle diameter of 5 μm to 20 μm. In this way, the multiple metal parts 35 consist of multiple metal particles of different sizes, and in this case, the thermal conductivity of the connecting portion 30 can be 50 W / (m·K).

[0094] Furthermore, the shape of the metal particles may be in the form of flakes. When the shape of the metal particles is in the form of flakes, when a paste containing multiple metal parts 35 dispersed in it is applied to the resin part 37 during the manufacturing of the connecting part 30, the surfaces of the flakes will be oriented along the z-axis direction in Figure 1, that is, nearly parallel to the z-axis direction. Since the connecting part 30 is manufactured in this oriented state, the connecting part 30 can reflect fluorescence and excitation light with high reflectivity.

[0095] Furthermore, the phosphor device 1 according to this embodiment does not include a substrate member 13x (particularly a light-transmitting substrate 11x). This point will be explained further.

[0096] In phosphor device 1 and phosphor device 1x, dielectric multilayer films 10 and 10x are provided to improve efficiency and brightness.

[0097] Here, if we were to attempt to provide a dielectric multilayer film 10x on the lower surface of the fluorescent portion 20x in the phosphor device 1x, as in the phosphor device 1 of this embodiment, the following problems would arise in the manufacturing of the phosphor device 1x. Two methods for manufacturing the phosphor device 1x will be described here.

[0098] First, we will explain the problems in a manufacturing method in which a fluorescent portion 20x is fabricated, then a dielectric multilayer film 10x is fabricated on the underside of the fluorescent portion 20x, and then a light-reflecting portion 30x is fabricated around the fluorescent portion 20x. Since the light-reflecting portion 30x is composed of a ceramic layer made of a ceramic material such as alumina, high-temperature treatment exceeding 1000°C is required when fabricating the light-reflecting portion 30x. Therefore, in this manufacturing method, the dielectric multilayer film 10x provided on the underside of the fluorescent portion 20x is also subjected to the same high-temperature treatment, which leads to problems such as the destruction of the dielectric multilayer film 10x.

[0099] Next, we will explain the problems in a manufacturing method in which a fluorescent portion 20x is fabricated, a light-reflecting portion 30x is then fabricated around the fluorescent portion 20x, and a dielectric multilayer film 10x is then fabricated on the underside of the fluorescent portion 20x. Since the light-reflecting portion 30x is connected to the connecting member 50x, the underside of the light-reflecting portion 30x must be flat. Therefore, after the dielectric multilayer film 10x is fabricated, it is necessary to polish the underside of the light-reflecting portion 30x to make it flat. In this manufacturing method, since the fluorescent portion 20x and the light-reflecting portion 30x are polished simultaneously, the dielectric multilayer film 10x provided on the underside of the fluorescent portion 20x is also subjected to the same polishing process. Consequently, problems such as the destruction of the dielectric multilayer film 10x occur in this manufacturing method as well.

[0100] To prevent such problems, the phosphor device 1x requires that the dielectric multilayer film 10x be provided on a separate component from the fluorescent portion 20x. In the phosphor device 1x, a substrate component 13x is used as this separate component.

[0101] However, in the phosphor device 1 according to this embodiment, the first main surface 21 has a dielectric The fluorescent portion 20, on which the dielectric multilayer film 10 is provided, and the support portion 60, which is a copper plate, are connected (bonded) by a connecting portion 30 made of, for example, silver and a resin material. Therefore, the dielectric multilayer film 10 provided on the first main surface 21 is not subjected to high-temperature treatment or polishing treatment, and the dielectric multilayer film 10 is not destroyed. The phosphor device 1 according to this embodiment does not require a substrate member 13x or the like, even though it is equipped with a dielectric multilayer film 10.

[0102] Furthermore, since the fluorescent portion 20 is supported from all sides by the support portion 60, and the fluorescent portion 20 is sufficiently thick at 500 μm, the phosphor device 1 does not need to include a substrate member 13x to support the fluorescent portion 20.

[0103] Incidentally, the light-transmitting substrate 11x of the substrate member 13x is a sapphire substrate, which is a very expensive material. Therefore, since the phosphor device 1 does not have the substrate member 13x, which is a very expensive material, a low-cost phosphor device 1 can be realized.

[0104] [Modified Example 1 of the Embodiment] The following describes Modification 1 of the embodiment. In the following description, the differences from the embodiment will be the main focus, and the similarities will be omitted or simplified.

[0105] Figure 7 shows the configuration of the phosphor device 1a according to Modification 1 of the embodiment. Figure 7(a) is a plan view of the phosphor device 1a, and Figure 7(b) is a cross-sectional view of the phosphor device 1a along the VIIb-VIIb line in Figure 7(a).

[0106] The phosphor device 1a according to this modified example has the same configuration as the phosphor device 1 according to the embodiment, except that it further comprises a silver thin film 70.

[0107] The silver thin film 70 is a thin film made of silver. The silver thin film 70 is a thin film provided between the fluorescent part 20 and the connecting part 30.

[0108] The silver thin film 70 is provided around the fluorescent part 20 in a plan view. In this modified example, the silver thin film 70 completely surrounds the fluorescent part 20 in a plan view. As described above, the connecting part 30 has a rectangular opening, and the silver thin film 70 is provided inside this opening in a plan view. The plan view shape of the silver thin film 70 is a rectangular frame shape with a rectangular opening and a rectangular outer shape. Note that the plan view shape of the connecting part 30 is not limited to a rectangular frame shape, but may be annular or the like.

[0109] The silver thin film 70 is in thermal contact with the fluorescent part 20 and the connecting part 30. In other words, the fluorescent part 20, the silver thin film 70, and the connecting part 30 are arranged so that the heat generated in the fluorescent part 20 can be conducted to the silver thin film 70 and the connecting part 30. Therefore, the silver thin film 70 is a heat conductive member that conducts the heat generated in the fluorescent part 20. Furthermore, the thermal conductivity of the silver thin film 70, which is a thin film made of silver, is higher than that of the fluorescent part 20. For this reason, the heat generated in the fluorescent part 20 when excitation light is incident on the fluorescent part 20 can be efficiently conducted to the silver thin film 70 and the connecting part 30. In other words, the heat dissipation of the heat generated in the fluorescent part 20 can be improved.

[0110] Furthermore, the silver thin film 70 is a thin film that reflects excitation light and fluorescence. Because the silver thin film 70 is a thin film made of silver, it can efficiently reflect excitation light and fluorescence. With this configuration, the white light (blue light + yellow light) emitted from the fluorescent part 20 that travels in the x-axis direction and the y-axis direction is reflected by the silver thin film 70, returns to the fluorescent part 20, and is radiated to the outside from the second main surface 22 of the fluorescent part 20. This increases the amount of light that can be extracted from the fluorescent part 20.

[0111] The silver thin film 70 is formed around the fluorescent portion 20, for example, by a silver mirror reaction. The thickness d1 of the silver thin film 70 is, for example, several nanometers to several tens of micrometers, for example 20 nm, but is not limited to this.

[0112] [Modified Example 2 of the Embodiment] The following describes a modified example 2 of the embodiment. In the following description, the differences from the embodiment will be the main focus, and the similarities will be omitted or simplified.

[0113] Figure 8 is a cross-sectional view showing the configuration of the phosphor device 1b according to a modified example 2 of the embodiment.

[0114] The phosphor device 1b according to this modified example has the same configuration as the phosphor device 1 according to the embodiment, except that it includes a connecting portion 30b instead of a connecting portion 30, and further includes metal heat dissipation components 91 and 92, and joint portions 81 and 82.

[0115] The connecting portion 30b has a first connecting portion 31b, a second connecting portion 32b, and a solder portion 33.

[0116] The first connecting portion 31b is a member provided between the fluorescent portion 20 and the support portion 60 so as to be in contact with the fluorescent portion 20. The second connecting portion 32b is a member provided between the fluorescent portion 20 and the support portion 60 so as to be in contact with the support portion 60. The solder portion 33 is a member provided between the first connecting portion 31b and the second connecting portion 32b.

[0117] The first connection portion 31b, the second connection portion 32b, and the solder portion 33 are each provided around the fluorescent portion 20 in a plan view. In this modified example, the first connection portion 31b, the second connection portion 32b, and the solder portion 33 each surround the entire perimeter of the fluorescent portion 20 in a plan view. The plan view shapes of the first connection portion 31b, the second connection portion 32b, and the solder portion 33 are rectangular frames with rectangular openings and rectangular outer shapes. The solder portion 33 is provided to fill the gap between the first connection portion 31b and the second connection portion 32b.

[0118] The solder portion 33 and the first connection portion 31b are in thermal contact, and the solder portion 33 and the second connection portion 32b are in thermal contact. Furthermore, the fluorescent portion 20 and the first connection portion 31b are in thermal contact, and the support portion 60 and the second connection portion 32b are in thermal contact. Therefore, the arrangement is such that the heat generated in the fluorescent portion 20 can be conducted to the support portion 60.

[0119] Each of the first connecting portion 31b and the second connecting portion 32b is composed of a metal portion 352 and a glass portion 372. More specifically, each of the first connecting portion 31b and the second connecting portion 32b is a component consisting of multiple metal portions 352 and glass portions 372.

[0120] The multiple metal parts 352 of the first connecting part 31b and the second connecting part 32b have the same configuration as the multiple metal parts 35 of the embodiment. That is, each of the multiple metal parts 352 of the first connecting part 31b and the second connecting part 32b is a metal particle composed of at least one of silver and copper, and in this case, it is a metal particle composed of silver.

[0121] Furthermore, the glass portions 372 of the first connecting portion 31b and the second connecting portion 32b have the same configuration as the glass portions described in the embodiment.

[0122] Next, I will explain the soldering section 33.

[0123] The soldered part 33 is a component made of solder material. The solder material is tin-lead solder. Materials and lead-free solder materials can be used. Since the solder portion 33 is made of solder material, i.e., a metallic material, it has high thermal conductivity. Therefore, when excitation light is incident on the fluorescent portion 20, the heat generated in the fluorescent portion 20 can be efficiently conducted to the connection portion 30b.

[0124] The solder portion 33 protrudes from the first main surface 21 on the negative side of the z axis and from the second main surface 22 on the positive side of the z axis, but is not limited to this. In other words, the thickness of the solder portion 33 (thickness in the z axis direction) may be lower than the thickness of the fluorescent portion 20 and the support portion 60, or it may be the same as the thickness of the fluorescent portion 20 and the support portion 60. However, it is preferable that the solder portion 33 is provided so as not to overlap the second main surface 22 of the fluorescent portion 20. In other words, it is preferable that the solder portion 33 is formed so as not to protrude onto the second main surface 22 of the fluorescent portion 20.

[0125] Next, we will describe the metal heat dissipation components 91 and 92.

[0126] Each of the metal heat dissipation components 91 and 92 is a component made of a metal material. Each of the metal heat dissipation components 91 and 92 is made of copper, but they may be made of other metals such as aluminum.

[0127] Each of the metal heat dissipation components 91 and 92 is located on the negative z-axis side of the fluorescent portion 20, the connecting portion 30b, and the support portion 60, that is, on the side to which the excitation light is incident. The shape of each of the metal heat dissipation components 91 and 92 is not particularly limited, but is a shape that does not block the excitation light incident on the dielectric multilayer film 10. As shown in Figure 8, a gap is provided between the metal heat dissipation components 91 and 92 for the excitation light to pass through. The shape of each of the metal heat dissipation components 91 and 92 is, for example, a rectangular parallelepiped shape with a rectangular cross-section, but is not limited to this.

[0128] In this modified example, the metal heat dissipation components 91 and 92 are joined to the support portion 60 by joints 81 and 82, respectively. The joints 81 and 82 are each made of solder material. Joint 81 joins the metal heat dissipation component 91 to the support portion 60, and joint 82 joins the metal heat dissipation component 92 to the support portion 60. Joint 81 is located above the metal heat dissipation component 91, and joint 82 is located above the metal heat dissipation component 92.

[0129] The joint 81 is in thermal contact with the support 60 and the metal heat dissipation component 91, and the joint 82 is in thermal contact with the support 60 and the metal heat dissipation component 92. Therefore, the heat generated in the fluorescent part 20 can be conducted to the connection part 30b, the support 60, the joints 81 and 82, and the metal heat dissipation components 91 and 92.

[0130] The phosphor device 1b related to this modified example can be fabricated, for example, by the following method.

[0131] First, a first connection portion 31b is formed on the fluorescent portion 20, which has a dielectric multilayer film 10 on its first main surface 21, and a second connection portion 32b is formed on the support portion 60.

[0132] Next, the fluorescent part 20 with the first connection part 31b formed on it and the support part 60 with the second connection part 32b formed on it are arranged, and heated solder material is poured into the gap between the first connection part 31b and the second connection part 32b to form the solder part 33. Because heated solder material is poured into this gap, it is difficult for a gap to form between the first connection part 31b and the second connection part 32b.

[0133] Therefore, when the phosphor device 1b is fabricated using this method, the first connection part 31b This makes it easier for heat to be conducted to the second connection part 32b. In other words, because the connection part 30b of the phosphor device 1b has a solder part 33, the heat generated in the fluorescent part 20 when excitation light is incident on the fluorescent part 20 can be efficiently conducted in the order of the first connection part 31b, the solder part 33, and the second connection part 32b. In other words, the heat dissipation of the heat generated in the fluorescent part 20 can be improved. As a result, the luminescence efficiency of the fluorescent part 20 can be improved, and thus the efficiency and brightness of the phosphor device 1b can be improved.

[0134] As described above, each of the first connection part 31b and the second connection part 32b has a glass part 372. Since glass material has higher heat resistance than, for example, resin material, the glass part 372 is less likely to deteriorate even if heated solder material is used in the above manufacturing method.

[0135] As described above, each of the multiple metal parts 352 of the first connection part 31b and the second connection part 32b is a metal particle composed of at least one of silver and copper. Because silver and copper have high adhesion to solder material, the first connection part 31b and the second connection part 32b and the solder part 33 are joined more firmly.

[0136] Furthermore, in this embodiment, the connecting portion 30b has a first connecting portion 31b, a second connecting portion 32b, and a solder portion 33, but it is not limited to this. For example, the connecting portion 30b may have a solder portion instead of a solder portion 33.

[0137] The solder portion is a component made of solder material. Silver solder, nickel solder, copper solder, and gold solder can be used as solder materials. Because the solder portion is composed of solder material, i.e., a metallic material, it has high thermal conductivity. Therefore, when excitation light strikes the fluorescent portion 20, the heat generated in the fluorescent portion 20 can be efficiently conducted to the connection portion 30b having the solder portion. In other words, even when the connection portion 30b of the phosphor device 1b has a solder portion, the heat generated in the fluorescent portion 20 when excitation light strikes the fluorescent portion 20 can be efficiently conducted in the order of the first connection portion 31b, the solder portion, and the second connection portion 32b. This improves the heat dissipation of the heat generated in the fluorescent portion 20. As a result, the luminescence efficiency of the fluorescent portion 20 can be improved, thereby improving the efficiency and brightness of the phosphor device 1b.

[0138] Furthermore, if the connection portion 30b has a solder portion instead of a solder portion 33, the multiple metal portions 352 of the first connection portion 31b and the second connection portion 32b should be made of the following materials. In this case, each of the multiple metal portions 352 of the first connection portion 31b and the second connection portion 32b should be metal particles made of at least one of aluminum and nickel. Since aluminum and nickel have high adhesion to solder material, the first connection portion 31b and the second connection portion 32b and the solder portion are joined more firmly.

[0139] [Modified Example 3 of the Embodiment] The following describes a third modification of the embodiment. The following description will focus on the differences from the second modification of the embodiment, omitting or simplifying the explanation of the common points.

[0140] Figure 9 is a cross-sectional view showing the configuration of the phosphor device 1c according to a modified example 3 of the embodiment.

[0141] The phosphor device 1c according to this modified example has the same configuration as the phosphor device 1b according to modified example 2 of the embodiment, except that it has a connecting portion 30c instead of a connecting portion 30b and that it does not have bonding portions 81 and 82.

[0142] The connecting portion 30c has the same configuration as the connecting portion 30b according to the modified example 2 of the embodiment, except that it has a solder portion 33c instead of a solder portion 33.

[0143] The solder portion 33c is the same as the solder portion 33 in that it is a component provided between the first connection portion 31b and the second connection portion 32b. However, the solder portion 33c in this modified example is provided so as to be in contact with the lower surface 64 of the support portion 60. In other words, the solder portion 33c is a continuous component that fills the space between the first connection portion 31b and the second connection portion 32b and covers the lower surface 64 of the support portion 60.

[0144] Furthermore, the solder portion 33c joins the support portion 60 to the metal heat dissipation components 91 and 92. In other words, compared to the modified example 2 of the embodiment, in this modified example, the solder portion 33c joins the support portion 60 to the metal heat dissipation components 91 and 92 instead of the joint portions 81 and 82. Thus, the metal heat dissipation components 91 and 92 in this modified example are components to which the connecting portion 30c (solder portion 33c) is connected.

[0145] In this embodiment, the connection portion 30c (solder portion 33c) is connected to the metal heat dissipation components 91 and 92, respectively. Therefore, when excitation light is incident on the fluorescent portion 20, the heat generated in the fluorescent portion 20 can be efficiently conducted to the connection portion 30c and the metal heat dissipation components 91 and 92. In other words, the heat dissipation performance of the heat generated in the fluorescent portion 20 can be improved. As a result, the luminescence efficiency of the fluorescent portion 20 can be improved, and thus the efficiency and brightness of the phosphor device 1c can be improved.

[0146] [Modification of the embodiment 4] The following describes a modified example 4 of the embodiment. In the following description, the differences from the embodiment will be the main focus, and the similarities will be omitted or simplified.

[0147] Figure 10 shows the configuration of the phosphor device 1d according to modified example 4 of the embodiment. Figure 10(a) is a plan view of the phosphor device 1d, Figure 10(b) is a cross-sectional view of the phosphor device 1d along the Xb-Xb line in Figure 10(a), and Figure 10(c) is a cross-sectional view of the phosphor device 1d along the Xc-Xc line in Figure 10(a). Note that in Figure 10(a), the dielectric multilayer film 10d is omitted for clarity.

[0148] As shown in Figure 10, the phosphor device 1d according to this modified example comprises a fluorescent portion 20d, a support portion 60d, a dielectric multilayer film 10d, and two connecting portions 30d.

[0149] The phosphor device 1d differs from the phosphor device 1 according to the embodiment in the following three points. Specifically, these three points are that the fluorescent portion 20d and the support portion 60d are made of the same material, the bridging portion 62d of the support portion 60d is connected to the fluorescent portion 20d, and the position in which the dielectric multilayer film 10d is installed is different.

[0150] First, let's describe the fluorescent portion 20d. The area inside the dotted circle shown in Figure 10(a) corresponds to the fluorescent portion 20d in this modified example. In other words, the area inside the dotted rectangle sandwiched between the two bridging portions 62d shown in Figure 10(c) corresponds to the fluorescent portion 20d. The fluorescent portion 20d, like the fluorescent portion 20 in the embodiment, is a component made of YAG, which is an example of a phosphorescent ceramic. The fluorescent portion 20d has a first main surface 21d and a second main surface 22d.

[0151] Next, we will explain the support portion 60d.

[0152] In the embodiment, the support portion 60 was made of a metal material, more specifically copper, but the support portion 60d in this modified example is made of a ceramic material. The support portion 60d is made of phosphor ceramic, which is an example of a ceramic material. The type of phosphor ceramic used in part 60d is not particularly limited, but it is often the same as the phosphor ceramic used in the fluorescent part 20d, and in this case, YAG is used. In other words, the fluorescent part 20d and the support part 60d are made of the same material.

[0153] For example, the support portion 60d may be made of aluminum oxide, which is an example of a ceramic material. As mentioned above, aluminum oxide has a thermal conductivity of 30 W / (m·K) and exhibits high thermal conductivity.

[0154] The support portion 60d in this modified example has two bridging portions 62d and a support body portion 63d.

[0155] In Figure 10(a), each of the inner regions of the two dotted rectangles corresponds to each of the two bridging sections 62d. In other words, each of the inner regions of the two dotted rectangles touching the fluorescent section 20d in Figure 10(c) corresponds to each of the two bridging sections 62d. Also, the region between the dotted circle and rectangle in Figure 10(a) corresponds to the support body 63d. In Figure 10(c), the support body 63d is shown as the inner regions of the two dotted rectangles, each touching the bridging section 62d.

[0156] Each of the two bridging sections 62d connects the fluorescent section 20d to the support body section 63d.

[0157] The fluorescent portion 20d and the support portion 60d will be explained in more detail with reference to Figure 11.

[0158] Figure 11 shows a plan view and a side view of the fluorescent part 20d and the support part 60d according to a modified example 4 of the embodiment. More specifically, Figure 11(a) is a plan view of the fluorescent part 20d and the support part 60d, and Figure 11(b) is a side view of the fluorescent part 20d and the support part 60d. Each of the support parts 60d has two arc-shaped openings 61d.

[0159] Furthermore, as shown in Figure 11, the length of the support portion 60d in the x-axis direction is length A2, the length of the support portion 60d in the y-axis direction is length B2, the diameter of the fluorescent portion 20d is diameter C2, the length of the bridging portion 62d in the x-axis direction is length D2, the length of the bridging portion 62d in the y-axis direction is length E2, and the thickness of the support portion 60d in the z-axis direction is thickness F2. Lengths A2 and B2 can be, for example, several millimeters or more and several tens of millimeters or less, and in this modified example, they are 5 mm. Diameter C2 is shorter than lengths A2 and B2, and for example, diameter C2 can be, for example, several hundred μm or more and several tens of millimeters or less, and in this modified example, it is 800 μm. Length D2 can be, for example, several tens of μm or more and several millimeters or less, and in this modified example, it is 200 μm. Length E2 can be, for example, several tens of μm or more and several millimeters or less, and in this modified example, it is 300 μm. The thickness F2 is typically between several tens of micrometers and several millimeters, and in this modified example, it is 200 micrometers.

[0160] Next, the dielectric multilayer film 10d will be described. The dielectric multilayer film 10d has the same configuration as the dielectric multilayer film 10 according to the embodiment, except that it is provided on the first main surface 21d (bottom surface) of the fluorescent portion 20d and on the bottom surface 64d of the support portion 60.

[0161] Here, the manufacturing method for the fluorescent portion 20d, the support portion 60d, and the dielectric multilayer film 10d will be briefly explained. In this manufacturing method, first, a phosphor ceramic layer (phosphor ceramic plate) with a length A2 in the x-axis direction, a length B2 in the y-axis direction, and a thickness E2 in the z-axis direction is manufactured. Next, a dielectric multilayer film 10d is manufactured on the main surface of the phosphor ceramic plate. Subsequently, the phosphor ceramic plate is subjected to a hole-punching process to provide two openings 61d. The hole-punching process may be performed using, for example, a laser beam, but is not limited to this. From this, the fluorescent part 20d, the support part 60d, and the dielectric multilayer film 10d are manufactured. The fluorescent part 20d and the support part 60d in this modified example can be manufactured simultaneously, that is, they can be manufactured simply.

[0162] Next, we will explain the two connection points 30d again using Figure 10.

[0163] Each of the two connecting parts 30d in this modified example has the same configuration as the connecting part 30 in the embodiment, except for its shape. Like the connecting part 30, each of the two connecting parts 30d consists of a plurality of metal parts 35 and resin parts 37, and is a member that connects the fluorescent part 20d and the support part 60d.

[0164] Each of the two connecting parts 30d is provided between the fluorescent part 20d and the support part 60d. As shown in Figure 10, the plan view shape of each of the two connecting parts 30d is arc-shaped. One connecting part 30d is provided such that the inner circle of its arc-shaped connecting part 30d is in contact with the circular fluorescent part 20d. The other connecting part 30d is similar. Furthermore, the two connecting parts 30d and the two bridging parts 62d surround the entire perimeter of the fluorescent part 20d in a plan view and are annular in shape.

[0165] Each of the two connecting parts 30d can be formed by pouring a paste, in which multiple metal parts 35 are dispersed in a resin part 37 that acts as a binder, into the two openings 61d shown in Figure 11 and allowing it to harden.

[0166] As shown in the modified embodiment 4, if the support portion 60d is made of a ceramic material, and furthermore, if the fluorescent portion 20d and the support portion 60d are made of the same material, the fluorescent portion 20d and the support portion 60d can be manufactured simultaneously. In other words, the phosphor device 1d according to this modified embodiment can be manufactured easily.

[0167] [Modification of Embodiment 5] The following describes Modification 5 of the embodiment. In the following description, the differences from Modification 4 of the embodiment will be the main focus, and the explanation of the common points will be omitted or simplified.

[0168] Figure 12 is a cross-sectional view showing the configuration of the phosphor device 1f according to a modified example 5 of the embodiment.

[0169] The phosphor device 1f according to this modified example has the same configuration as the phosphor device 1d according to modified example 4 of the embodiment, except that it has two connection parts 30f instead of two connection parts 30d, and also has metal heat dissipation components 91 and 92.

[0170] The phosphor device 1f, like the phosphor device 1d, has a dielectric multilayer film 10d. As described above, this dielectric multilayer film 10d is provided on the first main surface 21d (bottom surface) of the phosphor portion 20d and on the bottom surface 64d of the support portion 60d. The bottom surface of the dielectric multilayer film 10d provided below the first main surface 21d will be referred to as bottom surface 101d, and the bottom surface of the dielectric multilayer film 10d provided below bottom surface 64d will be referred to as bottom surface 102d.

[0171] Each of the two connecting portions 30f has the same configuration as the connecting portion 30c according to the modified example 3 of the embodiment, except for its shape. Each of the two connecting portions 30f has a first connecting portion 31f, a second connecting portion 32f, and a solder portion 33f.

[0172] First, let me briefly explain the fact that each of the two connection points 30f is the same as connection point 30c.

[0173] Each of the two first connecting parts 31f and the two second connecting parts 32f is composed of a metal part 352 and a glass part 372. More specifically, each of the two first connecting parts 31f and the two second connecting parts 32f is a component consisting of multiple metal parts 352 and glass parts 372.

[0174] One of the two soldered parts 33f is a component provided between one first connection part 31f and one second connection part 32f. The other soldered part 33f is a component provided between another first connection part 31f and another second connection part 32f.

[0175] Each of the two soldered sections 33f is a component made of solder material. As the solder material, tin-lead solder material and lead-free solder material can be used. Since each of the two soldered sections 33f is made of solder material, i.e., a metallic material, it has high thermal conductivity. Furthermore, one soldered section 33f joins the support section 60d and the metal heat dissipation component 91, and the other soldered section 33f joins the support section 60d and the metal heat dissipation component 92.

[0176] Next, we will briefly explain the differences between the two connection points 30f and connection point 30c.

[0177] Each of the two second connecting portions 32f is located between the fluorescent portion 20d and the support portion 60d, and also covers the area below the support portion 60d. More specifically, each of the two second connecting portions 32f covers the lower surface 102d of the dielectric multilayer film 10d. In other words, each of the two second connecting portions 32f is a continuous component that fills the space between the fluorescent portion 20d and the support portion 60d and covers the lower surface 102d of the dielectric multilayer film 10d. Note that each of the two second connecting portions 32f does not cover the lower surface 101d of the dielectric multilayer film 10d.

[0178] Furthermore, one solder portion 33f fills the space between the first connection portion 31f and the second connection portion 32f, and covers the lower surface 321f of one of the second connection portions 32f. More specifically, one solder portion 33f covers a portion of the lower surface 321f. The same applies to the other solder portion 33f.

[0179] Furthermore, in this modified example, a portion of each of the two connecting portions 30f connects the fluorescent portion 20d and the support portion 60d. Each of the areas inside the dashed lines of the two rectangles shown in Figure 12 corresponds to the portion connecting the fluorescent portion 20d and the support portion 60d.

[0180] In this modified example, the plan view shape of each of the two openings 61d of the support portion 60d is arc-shaped. Therefore, the plan view shape of the part connecting the fluorescent portion 20d and the support portion 60d is arc-shaped.

[0181] [Effects, etc.] Invention 1 is a phosphor device 1 having a fluorescent part 20, a support part 60, a dielectric multilayer film 10, and a connecting part 30. The fluorescent part 20 has a main surface (first main surface 21) and emits fluorescence when excitation light is irradiated onto the main surface. The support part 60 is provided around the fluorescent part 20 in a plan view of the main surface. The dielectric multilayer film 10 is provided on the main surface and transmits excitation light and reflects fluorescence. The connecting part 30 is provided between the fluorescent part 20 and the support part 60 and connects the fluorescent part 20 and the support part 60, and reflects excitation light and fluorescence. The thermal conductivity of the connecting part 30 is higher than that of the fluorescent part 20.

[0182] As a result, as shown in the embodiment, when excitation light is incident on the fluorescent part 20, the fluorescent part The heat generated in section 20 can be efficiently conducted to section 30. In other words, the heat dissipation of the heat generated in section 20 can be improved. As a result, the luminescence efficiency of section 20 can be improved, and thus the efficiency and brightness of the phosphor device 1 can be improved. Therefore, a highly efficient and highly bright phosphor device 1 can be realized.

[0183] Invention 2 is a phosphor device 1 of Invention 1, wherein the connecting portion 30 is composed of a metal portion 35 having a metallic material or an inorganic portion having an inorganic material and a resin portion 37 having a resin material.

[0184] For example, the connection portion 30 is composed of a metal portion 35 (multiple metal portions 35 in this embodiment) and a resin portion 37. With this configuration, as shown in the embodiment, if a material with high thermal conductivity is used as the metal material constituting each of the multiple metal portions 35, a connection portion 30 with higher thermal conductivity than the fluorescent portion 20 can be easily realized. In this case, the heat dissipation of the heat generated in the fluorescent portion 20 of the connection portion 30 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0185] Furthermore, even when multiple inorganic parts are used instead of multiple metal parts 35, a similar effect can be expected if materials with high thermal conductivity are used as the constituent materials for each of the multiple inorganic parts.

[0186] Invention 3 is a phosphor device 1 of Invention 2, wherein the metal part 35 (or multiple metal parts 35 in the embodiment) is composed of metal particles made of at least one of silver and aluminum, or the inorganic part is composed of inorganic particles made of at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide.

[0187] As shown in the embodiment, silver and aluminum are materials with high reflectivity for fluorescence and excitation light, as well as high thermal conductivity. Therefore, with the above configuration, the reflectivity of the connection part 30 can be improved, and the heat dissipation of heat generated in the fluorescence part 20 can be improved, thereby improving the efficiency and brightness of the phosphor device 1.

[0188] Furthermore, as described above, at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide is preferably used as the metallic material constituting each of the multiple inorganic parts. For example, aluminum oxide is a material that diffusely reflects fluorescence and excitation light and has high thermal conductivity. Therefore, with the above configuration, the reflectivity of the connection part 30 can be improved, and the heat dissipation of heat generated in the fluorescence part 20 can be improved, thereby improving the efficiency and brightness of the phosphor device 1.

[0189] Invention 4 is a phosphor device 1 of Invention 1, wherein the connecting portion 30 is composed of a metal portion 35 having a metallic material or an inorganic portion having an inorganic material and a glass portion having a glass material.

[0190] As a result, as shown in the embodiment, the efficiency and brightness of the phosphor device 1 can be improved by providing a metal part 35 (multiple metal parts 35 in the embodiment) or an inorganic part, similar to the effect of Invention 2. Furthermore, by using a glass part made of glass material instead of a resin part 37 made of resin material in the connection part 30, the thermal conductivity of the connection part 30 can be improved. As a result, the heat dissipation of the heat generated in the phosphor part 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0191] Invention 5 is a metal part 35 composed of metal particles made of at least one of silver, aluminum, and copper, or an inorganic part composed of aluminum oxide, aluminum nitride, titanium oxide, and phosphorus oxide. The phosphor device 1 of Invention 4 is an inorganic particle composed of at least one of lead and zirconium oxide.

[0192] As shown in the embodiment, silver, aluminum, and copper are materials with high reflectivity for fluorescence and excitation light, as well as high thermal conductivity. Therefore, with the above configuration, the heat dissipation of heat generated in the fluorescent part 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0193] Furthermore, as described above, at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide is preferably used as the metallic material constituting each of the multiple inorganic parts. For example, aluminum oxide is a material that diffusely reflects fluorescence and excitation light and has high thermal conductivity. Therefore, with the above configuration, the heat dissipation of heat generated in the fluorescence part 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0194] Invention 6 is a phosphor device 1 of Invention 3 or 5, wherein the metal particles are flaky particles.

[0195] As a result, as shown in the embodiment, when a paste containing multiple metal parts 35 dispersed on the resin part 37 is applied during the manufacturing of the connecting part 30, the surfaces of the scale-shaped parts are oriented along the z-axis direction in Figure 1, that is, nearly parallel to the z-axis direction. Since the connecting part 30 is manufactured in this oriented state, the connecting part 30 can reflect fluorescence and excitation light with high reflectivity. As a result, the efficiency and brightness of the phosphor device 1 can be improved.

[0196] Invention 7 is a phosphor device 1 according to any one of Inventions 1 to 6, provided between the fluorescent part 20 and the connecting part 30, which reflects excitation light and fluorescence, and comprises a silver thin film 70 made of silver.

[0197] As a result, the silver thin film 70 can efficiently reflect excitation light and fluorescence, as shown in Modification 1 of the embodiment. This improves the efficiency and brightness of the phosphor device 1a.

[0198] Invention 8 is a phosphor device 1b according to any one of Inventions 1 to 7, wherein the connecting portion 30b has a first connecting portion 31b, a second connecting portion 32b, and a solder portion 33. The first connecting portion 31b is provided between the phosphor portion 20 and the support portion 60 so as to be in contact with the phosphor portion 20. The second connecting portion 32b is provided between the phosphor portion 20 and the support portion 60 so as to be in contact with the support portion 60. The solder portion 33 is provided between the first connecting portion 31b and the second connecting portion 32b. Each of the first connecting portion 31b and the second connecting portion 32b is composed of a metal portion 35 which is a metal particle made of at least one of silver and copper, and a glass portion 372 which is made of glass material.

[0199] As a result, as shown in the modified example 2 of the embodiment, the heat generated in the fluorescent part 20 when excitation light is incident on the fluorescent part 20 can be efficiently conducted in the order of the first connection part 31b, the solder part 33, and the second connection part 32b. In other words, the heat dissipation of the heat generated in the fluorescent part 20 can be improved. This improves the luminescence efficiency of the fluorescent part 20, and therefore improves the efficiency and brightness of the phosphor device 1b.

[0200] Invention 9 is a phosphor device 1 according to any one of Inventions 1 to 7, wherein the connecting portion 30 has a first connecting portion 31b, a second connecting portion 32b, and a wax portion. The first connecting portion 31b is provided so as to be in contact with the phosphor portion 20 between the phosphor portion 20 and the support portion 60. The second connecting portion 32b is provided between the fluorescent part 20 and the support part 60 so as to be in contact with the support part 60. The wax part is provided between the first connecting part 31b and the second connecting part 32b.

[0201] Each of the first connecting portion 31b and the second connecting portion 32b is composed of a metal portion which is made up of metal particles composed of at least one of aluminum and nickel, and a glass portion which is made up of glass material.

[0202] As a result, as shown in the modified example 2 of the embodiment, the heat generated in the fluorescent part 20 when excitation light is incident on the fluorescent part 20 can be efficiently conducted in the order of the first connection part 31b, the wax part, and the second connection part 32b. In other words, the heat dissipation of the heat generated in the fluorescent part 20 can be improved. This improves the luminescence efficiency of the fluorescent part 20, and therefore improves the efficiency and brightness of the phosphor device 1b.

[0203] Invention 10 is a phosphor device 1c according to any one of Inventions 1 to 9, comprising metal heat dissipation components (metal heat dissipation components 91 and 92) made of a metal material to which the connecting portion 30c is connected.

[0204] As a result, as shown in Modification 3 of the Embodiment, the heat generated in the fluorescent part 20 when excitation light is incident on the fluorescent part 20 can be efficiently conducted to the connection part 30c and the metal heat dissipation components 91 and 92. In other words, the heat dissipation performance of the heat generated in the fluorescent part 20 can be improved. This improves the luminescence efficiency of the fluorescent part 20, and therefore improves the efficiency and brightness of the phosphor device 1c.

[0205] Invention 11 is a phosphor device according to any one of Inventions 1 to 10, wherein the support portion is made of a metal material or a ceramic material.

[0206] As a result, as shown in the embodiment, if the support portion 60 is made of a metal material and a material with high thermal conductivity is used as the metal material constituting the support portion 60, the heat generated in the fluorescent portion 20 is easily conducted to the support portion 60 via the connecting portion 30. Therefore, in this case, the heat dissipation performance of the heat generated in the fluorescent portion 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0207] Furthermore, as shown in the modified example 4 of the embodiment, if the support portion 60d is made of a ceramic material, and the fluorescent portion 20d and the support portion 60d are made of the same material, then the fluorescent portion 20d and the support portion 60d can be manufactured simultaneously. In other words, the phosphor device 1d according to this modified example can be manufactured easily.

[0208] Invention 12 is a phosphor device of Invention 11, wherein the metal material constituting the support portion is copper or aluminum, or the ceramic material constituting the support portion 60 is phosphor ceramic.

[0209] As shown in the embodiment, when the metal material constituting the support portion 60 is copper or aluminum, the thermal conductivity of aluminum and copper is very high, so the heat generated in the fluorescent portion 20 can be easily conducted to the support portion 60 via the connecting portion 30. Therefore, with the above configuration, the heat dissipation of the heat generated in the fluorescent portion 20 can be improved, and the efficiency and brightness of the phosphor device 1 can be improved.

[0210] Furthermore, as shown in the modified example 4 of the embodiment, if the ceramic material constituting the support portion 60d is a phosphor ceramic, and the fluorescent portion 20d and the support portion 60d are made of the same material, then the fluorescent portion 20d and the support portion 60d can be manufactured simultaneously. In other words, the phosphor device 1d can be manufactured easily.

[0211] Invention 13 is a light-emitting device 100 comprising a phosphor device 1 according to Inventions 1 to 12, and a light source 2 that irradiates the main surface of the fluorescent part 20 of the phosphor device 1 with excitation light.

[0212] As shown in the embodiment, the phosphor device 1 is a highly efficient and high-brightness device. The light-emitting device 100 equipped with such a phosphor device 1 is also a highly efficient and high-brightness device.

[0213] (Other embodiments) Although the phosphor device according to the present invention has been described above based on embodiments and various modifications, the present invention is not limited to these embodiments and modifications. As long as it does not depart from the spirit of the present invention, various modifications that a person skilled in the art can conceive of are applied to the embodiments, and other forms constructed by combining some of the components of the embodiments and various modifications are also included in the scope of the present invention.

[0214] Furthermore, the above embodiments may be modified, replaced, added, or omitted in various ways within the scope of the claims or equivalent thereof. [Explanation of Symbols]

[0215] 1, 1a, 1b, 1c, 1d, 1f, 1x Phosphor device 2 light source 10, 10d, 10x dielectric multilayer films 20, 20d, 20x fluorescent area 30, 30b, 30c, 30d, 30f connection points 31b, 31f First connection section 32b, 32f Second connection section 33, 33c, 33f solder joints 35, 352 Metal parts 37 Resin part 60, 60d support part 70 Silver Thin Film 91, 92 Metal heat dissipation components 100 Light-emitting devices 372 Glass part

Claims

1. A fluorescent portion having a main surface, which emits fluorescence when excitation light is irradiated onto the main surface, In a plan view of the main surface, a support portion is provided around the fluorescent portion, A dielectric multilayer film provided on the main surface, which transmits the excitation light and reflects the fluorescence, A connecting portion is provided between the fluorescent portion and the support portion to connect the fluorescent portion and the support portion, and to reflect the excitation light and the fluorescence, Equipped with, The thermal conductivity of the connection portion is higher than that of the fluorescent portion. The aforementioned connecting portion is composed of a metal portion having a metallic material or an inorganic portion having an inorganic material, and a glass portion having a glass material. Phosphor device.

2. The metal portion is composed of metal particles made up of at least one of silver, aluminum, and copper, or the inorganic portion is composed of inorganic particles made up of at least one of aluminum oxide, aluminum nitride, titanium oxide, zinc oxide, and zirconium oxide. The phosphor device according to claim 1.

3. The aforementioned metal particles are scale-shaped particles. The phosphor device according to claim 2.

4. A silver thin film made of silver is provided between the fluorescent portion and the connecting portion, reflects the excitation light and the fluorescence. The phosphor device according to claim 1 or 2.

5. A fluorescent portion having a main surface which emits fluorescence when excitation light is irradiated onto the main surface, In a plan view of the main surface, a support portion is provided around the fluorescent portion, A dielectric multilayer film provided on the main surface, which transmits the excitation light and reflects the fluorescence, A connecting portion is provided between the fluorescent portion and the support portion to connect the fluorescent portion and the support portion, and to reflect the excitation light and the fluorescence, Equipped with, The thermal conductivity of the connection portion is higher than that of the fluorescent portion. The aforementioned connection part is A first connecting portion is provided between the fluorescent portion and the support portion so as to be in contact with the fluorescent portion, A second connecting portion is provided between the fluorescent portion and the support portion so as to be in contact with the support portion, It has a solder portion provided between the first connection portion and the second connection portion, Each of the first and second connecting parts is composed of a metal part which is made up of metal particles composed of at least one of silver and copper, and a glass part which is made up of glass material. Phosphor device.

6. A fluorescent portion having a main surface which emits fluorescence when excitation light is irradiated onto the main surface, In a plan view of the main surface, a support portion is provided around the fluorescent portion, A dielectric multilayer film provided on the main surface, which transmits the excitation light and reflects the fluorescence, A connecting portion is provided between the fluorescent portion and the support portion to connect the fluorescent portion and the support portion, and to reflect the excitation light and the fluorescence, Equipped with, The thermal conductivity of the connection portion is higher than that of the fluorescent portion. The aforementioned connection part is A first connecting portion is provided between the fluorescent portion and the support portion so as to be in contact with the fluorescent portion, A second connecting portion is provided between the fluorescent portion and the support portion so as to be in contact with the support portion, It has a solder portion provided between the first connecting portion and the second connecting portion, Each of the first and second connecting parts is composed of a metal part which is made up of metal particles composed of at least one of aluminum and nickel, and a glass part which is made up of glass material. Phosphor device.

7. It comprises a metal heat dissipation component made of a metal material to which the connecting portion is connected. The phosphor device according to claim 1.

8. The support portion is made of a metal or ceramic material. The phosphor device according to claim 1.

9. The metal material constituting the support portion is copper or aluminum, or the ceramic material constituting the support portion is phosphorescent ceramic. The phosphor device according to claim 8.

10. A phosphor device according to any one of claims 1, 2, and 5 to 9, The phosphor device comprises a light source that irradiates the main surface of the fluorescent portion of the phosphor device with the excitation light. Light-emitting device.

Images