Probe for probe card

Abstract

This probe (1) for a probe card has, on a reference surface (1SB) perpendicular to a buckling direction (X), a plurality of deformed regions (8) which are arranged with intervals therebetween, the outer edge of which is circular, oval, or polygonal, and which has a recessed shape or a protruding shape, and a framework region (9), which is provided at the boundary of adjacent deformed regions (8). A plurality of the deformed regions (8) are arranged with intervals therebetween in rows in a prescribed direction relative to the lengthwise direction (Z) of the probe, and a plurality of the rows are arranged with intervals therebetween in the lengthwise direction (Z) of the probe (1).

Description

Technical Field

[0001] This application relates to a probe for a probe card.

Background Art

[0002] A probe card is an electrical connection device used to perform an operation test on individual semiconductor devices formed on a wafer by bringing probes into contact with electrode pads of the semiconductor devices to supply power, input / output signals, and ground. The probes are provided on the surface of the probe card and are configured such that the tips are pressed against the electrode pads of the semiconductor devices with a predetermined pressing force. In order to increase the number of semiconductor devices formed on a wafer, it is necessary to reduce the size of the semiconductor devices. For this reason, the electrode pads of the semiconductor devices are designed to be small, and the distance (pitch) between the electrode pads is designed to be small. As the semiconductor devices are miniaturized, it is necessary to make the probes finer. However, when the probes are made finer, there is a problem that the mechanical strength of the probes becomes weak.

[0003] For this reason, in order to ensure good electrical and mechanical contact with the electrode pads of the semiconductor devices, for example, in Patent Document 1, a configuration using a multilayer metal sheet for the probes has been proposed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 discloses a contact probe having at least one multilayer structure including the superposition of a core and a first inner coating layer, and an outer coating layer made of a material harder than the core that completely covers the multilayer structure. As shown in Patent Document 1, a configuration consisting of multiple layers of different materials stacked together is preferable to achieve good electrical and mechanical contact. However, there are limitations to meeting the requirement of reducing the thickness of the probe's cross-section, and further breakthroughs were needed.

[0006] In the testing process using probe cards, to ensure contact with the electrode pads of the semiconductor device, the probe is pressed further against the electrode pads of the semiconductor device by moving the probe card closer to the semiconductor wafer (overdrive) after the probe has made contact with the electrode pads. Therefore, the probe needs to have sufficient strength to withstand contact pressure exceeding a predetermined value without mechanical failure. To prevent the probe from failing, it is necessary to avoid localized stress concentration on the probe. And to prevent this stress concentration, the probe needed to have as smooth and scratch-free a surface as possible.

[0007] However, there are limits to how smooth the metal surface can be, and there was a problem that the thinner the thickness of the probe's cross-section, the lower its mechanical strength became, making it more susceptible to deformation under external forces.

[0008] This application discloses a technology that solves the above-mentioned problems, and aims to provide a probe that, even when miniaturized, can contact the electrode pads of a semiconductor device with appropriate needle pressure and possesses strength that prevents damage even when a contact pressure exceeding a predetermined value is applied. In other words, the purpose of the probe for probe cards of this invention is not to prevent stress concentration from occurring, but rather to provide a probe for probe cards that can withstand large stresses (high mechanical strength) by having a structure that intentionally disperses the locations where stress concentration occurs. [Means for solving the problem]

[0009] The probe for probe cards disclosed herein is A vertical probe which is a metal plate of a conductive member and buckles in the longitudinal direction perpendicular to the metal plate Perpendicular to the buckling direction new on the board surface The reference plane has a plurality of spaced deformation regions, the outer edges of which are circular, elliptical, or polygonal, and which are recessed or protruding, and a framework region provided at the boundary between adjacent plurality of deformation regions, wherein the plurality of deformation regions are arranged in rows spaced apart in a predetermined direction with respect to the longitudinal direction of the probe, and the rows are , between They are arranged in multiple rows with space between them. Occasionally, The plurality of deformation regions in the Nth column and the plurality of deformation regions in the N+1th column are arranged alternately along the predetermined direction. It is. [Effects of the Invention]

[0010] The probe for probe cards disclosed in this application provides a probe for probe cards and a method for manufacturing a probe for probe cards that have high mechanical strength by dispersing the locations where stress concentration occurs, even when the plate thickness is reduced. [Brief explanation of the drawing]

[0011] [Figure 1] This is a perspective view showing the schematic configuration of a probe for a probe card according to Embodiment 1. [Figure 2] This figure shows the relationship between the probe overdrive amount and the tracking force according to Embodiment 1. [Figure 3] This figure shows the relationship between the probe overdrive amount and the stress acting on the probe according to Embodiment 1. [Figure 4] This is a cross-sectional view showing the frame region when many recesses are provided according to Embodiment 1. [Figure 5A] This figure shows the manufacturing process of a probe by electroforming according to Embodiment 1. [Figure 5B] This figure shows the manufacturing process of a probe by electroforming according to Embodiment 1. [Figure 6] It is a diagram showing a method for manufacturing a probe by pressing according to Embodiment 1. [Figure 7] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 2. [Figure 8] It is a diagram showing a plane for providing a deformation region of the probe according to Embodiment 2. [Figure 9] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 3. [Figure 10] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 4. [Figure 11] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 5. [Figure 12] It is a diagram showing a modification example of Embodiment 5. [Figure 13] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 6. [Figure 14] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 7. [Figure 15A] It is an enlarged view of a main part of a plane perpendicular to the buckling direction X of the probe according to Embodiment 8. [Figure 15B] It is a cross-sectional view taken along the line B - B of FIG. 15A. [Figure 16] It is a diagram showing a partial cross-sectional shape of the probe according to Embodiment 9.

Mode for Carrying Out the Invention

[0012] Embodiment 1. Hereinafter, the probe for a probe card according to Embodiment 1 will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals. FIG. 1 is a perspective view showing the structure of the probe 1 for a probe card. FIG. 2 is a diagram showing the relationship between the overdrive amount of the probe 1 and the needle pressure. FIG. 3 is a diagram showing the relationship between the overdrive amount of the probe and the stress acting on the probe. Figure 4 is a partial cross-sectional view of the deformation region 8 and the frame region 9.

[0013] Probe 1 is a so-called vertical probe, held almost vertically by an upper first guide plate 2 and a lower second guide plate 3. The tip portion 4 of probe 1 is guided by the second guide plate 3 to contact the electrode pad 5 of the semiconductor device. The rear end portion 6 (upper side of Figure 1) of probe 1 is guided by the first guide plate 2 to connect to an electrode (not shown) that connects to the circuit board of the probe card.

[0014] The probe 1 is made of a thin metal plate of conductive material, and at least one surface 1S (front or back surface) of the central portion 7 of the probe 1 perpendicular to the buckling direction X has multiple deformation regions 8 and framework regions 9 formed thereon. The buckling direction X is the direction in which the probe 1 bends when the probe card is overdriven. Deformation region 8 refers to the area where the original plane of the probe card, the reference plane 1SB, is deformed and a depression is formed. Furthermore, the framework region 9 represents the region that connects multiple deformation regions 8. The boundary between the deformation regions 8 and the framework region 9 is represented as a ridge line 10.

[0015] Figure 1 shows an example where a rectangular prism-shaped recess is created in the original plane, the reference plane 1SB, as the deformation region 8. Therefore, when viewed in the buckling direction X of the probe 1, its outer edge is rectangular. The framework region 9 corresponds to the planar portion between the deformation regions 8. Multiple deformation regions 8 are arranged in a row with intervals P between them in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. multiple They are arranged in a series. The interval P is the width of the framework area 9. In this embodiment 1, direction D1 is perpendicular to the longitudinal direction Z of probe 1.

[0016] Here, comparing a probe with no deformation region 8 and a probe with deformation regions 8 on both the front and back surfaces, the following results were obtained. Specifically, let A represent the measurement results of the probe without a deformation region 8 on the surface, and B represent the measurement results of the characteristics of probe 1 with a deformation region 8. In the state where the tip portion 4 of probe 1 contacts the electrode pad 5 and then a load is applied to press probe 1 against the electrode pad 5 (overdrive state), the relationship between the amount of overdrive and the needle pressure is shown in Figure 2. Furthermore, the relationship between the amount of overdrive and the stress is shown in Figure 3.

[0017] As shown in Figure 2, the tracking force when the overdrive amount was 70 μm was 1.72 gf for the probe without the recessed deformation region 8, compared to 1.19 gf for probe 1 with the recessed deformation region 8. Furthermore, as shown in Figure 3, the maximum stress when the overdrive amount was 110 μm was 670 MPa for the probe without the recess, compared to 891 MPa for probe 1 with the recessed deformation region 8, confirming that the probe satisfies the mechanical properties required for a probe.

[0018] Upon investigating the factors contributing to the increased maximum stress, it was concluded that a structural singularity might be the difference in the surface area of ​​probe 1. In other words, the surface area is increased by providing a deformed region 8 in the shape of a rectangular prism recess on the surface of probe 1. In the case of a recessed shape created by indenting a rectangular plane (i.e., representing a rectangular prism-shaped recess), the rectangular prism shape bottom The surface area of ​​the section remains unchanged because it is merely a matter of pushing down the original surface. In contrast, the area of ​​the inner wall surface created by the depression has increased.

[0019] In Figure 1, the dimensions of the indentations on the front and back of the probe are as follows: each indentation is a square with sides of 20 μm, with a depth of 3.5 μm on the front side and 2.5 μm on the back side. 429 indentations of this size are provided on both the front and back sides. As a result, on the front side, there are 120-120 μm2 The area increased, reaching 85,800 μm on the reverse side. 2 The surface area is increasing. The surface area increases by the amount of the inner wall surface area of ​​the depression caused by the sinkhole. Here, since a large depression affects the thickness of probe 1, it is desirable to increase the surface area by creating many small depressions. By designing the size and arrangement of these depression shapes, the surface area can be changed arbitrarily.

[0020] Furthermore, we analyzed what effects could be obtained from the deformation region 8. For probe A, which had no depressions (smooth surface), probe B, which had rectangular prism-shaped depressions arranged in a matrix, probe C, which had rectangular prism-shaped depressions arranged in a staggered pattern, and probe D, which had circular depressions arranged in a staggered pattern, the probe needle pressure and maximum stress were determined based on the finite element method (FEM), and the results are shown in Table 1.

[0021] [Table 1]

[0022] As shown in Table 1, for probe A, the tracking force was 1.72 gf when the overdrive was 70 μm, and the maximum stress was 670 MPa when the overdrive was 110 μm. In contrast, under the same conditions, probe B had a tracking force of 1.19 gf and a maximum stress of 891 MPa, probe C had a tracking force of 1.18 gf and a maximum stress of 899 MPa, and probe D had a tracking force of 1.18 gf and a maximum stress of 1164 MPa.

[0023] Furthermore, when stress contour plots (contour plots are diagrams that display calculation results as contour lines) were created for probes A, B, C, and D, it was found that in probe A, the maximum stress was 670 MPa and was distributed almost uniformly. In probe B, the stress was 74 MPa in the flat part of the bottom surface of deformation region 8 and 668 MPa in the frame region 9, with a maximum stress of 891 MPa. In probe C, the stress was 74 MPa in the flat part of the bottom surface of deformation region 8 and 674 MPa in the frame region 9, with a maximum stress of 899 MPa. In probe D, the stress was 97 MPa in the spherical part of the bottom surface of deformation region 8 and 873 MPa in the frame region 9, with a maximum stress of 1164 MPa.

[0024] From these results, it is estimated that when external forces are applied to probes A, B, C, and D, the stress is concentrated at the ridge line 10 at the boundary between the deformation region 8 and the frame region 9. Furthermore, by making the bottom surface of the deformation region 8 planar or spherical, the stress will be concentrated at the ridge line 10 at the boundary between the deformation region 8 and the frame region 9. This indicates that if the deformation region 8 is formed by a depression in a polygonal prism, stress concentration will occur at each vertex of the polygon, and therefore, when an external force is applied, the stress will be distributed to each vertex.

[0025] Therefore, if the deformation region 8 is formed by a conical or pyramidal depression, the stress can be distributed not only at each vertex of the outer circumference, but also at the vertices of the cone or pyramid. In this case, the stress concentration occurring at the ridge line 10 at the boundary between the deformation region 8 and the frame region 9 can be reduced.

[0026] Furthermore, if the ridge line 10 is a polygon, stress concentration occurs at each vertex, but the more sides there are, the smaller the stress concentration borne by each individual vertex becomes. From this, it can be inferred that if the periphery of the depression is circular, the stress will be distributed to that periphery. Therefore, as explained for probe D, a structure with a spherical depression shape as the deformation region 8 is the structure that distributes the stress the most, and thus is presumed to be a probe with high mechanical strength.

[0027] Next, we will explain the manufacturing method of the probe 1 shown in Figure 1. There are three methods for manufacturing probe 1. The first manufacturing method is electroforming. Figures 5A and 5B show the manufacturing process of probe 1 by electroforming. A protruding shape corresponding to the recessed shape formed by the conductive layer 42 is formed on the surface of the substrate 41, and then a metal layer 43, which will be a component of the probe 1, is provided on the surface of the conductive layer 42 to form a deformation region 8. This metal layer 43 can be formed, for example, by electroforming. After that, the surface is processed to be flat, a mask is provided, and etching is performed to create the target probe. Then, the probe 1 is removed from the substrate 41 by removing the conductive layer 42.

[0028] The second manufacturing method is by pressing. Figure 6 shows the method for manufacturing probe 1 by pressing. The metal plate 53 is pressed from both sides by a first mold 51 and a second mold 52, each having a surface corresponding to the recessed shape, to form a recessed deformation region 8 on its surface. In this case, compared to forming a metal layer by electroforming, it has the advantage of reducing manufacturing time.

[0029] In Embodiment 1, a structure in which the deformation region 8 is recessed was described, but the same effect can be obtained even if this shape is a protruding shape. The manufacturing method is simply to reverse the recess and protrusion.

[0030] Embodiment 2. The probe for the probe card according to Embodiment 2 will be described below, focusing on the differences from Embodiment 1. Figure 7 is a magnified view of the main part of the surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8. Figure 8 shows the surface on which the deformation region 8 of probe 1 is provided. Similar to Embodiment 1, the deformation region 8 is provided on at least one of the surfaces 1S perpendicular to the buckling direction X of the probe 1.

[0031] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D2 relative to the longitudinal direction Z of probe 1. multiple They are arranged in a sequence. Here, direction D2 is oblique to the longitudinal direction Z of probe 1.

[0032] Each deformation region 8 has a quadrilateral edge 10 (outer edge) when viewed in the buckling direction X. Therefore, the actual shape is a depression or protrusion in the shape of a square prism, square pyramid, or truncated square pyramid. The deformation region 8 is arranged such that two opposing sides of the quadrilateral edge 10 are parallel to a predetermined direction D2, and the other two sides are perpendicular to direction D2. The spacing between adjacent deformation regions 8 aligned perpendicular to direction D2 is the same as the spacing P. In this embodiment 2, the deformation regions 8 are also aligned straight and at equal intervals in the longitudinal direction Z of the probe 1. The shape of the deformation region 8 for truncated cones, truncated ellipses, and truncated polygons is such that the cross-sectional area gradually increases toward the reference plane 1SB.

[0033] According to the probe for probe cards of Embodiment 2, similar to Embodiment 1, by regularly arranging deformation regions 8 of the same shape, stress is regularly distributed, and a probe for probe cards with high mechanical strength can be provided.

[0034] Embodiment 3. The probe for the probe card according to Embodiment 3 will be described below, focusing on the differences from Embodiment 1. Figure 9 is a magnified view of the main part of the surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8.

[0035] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. multiple They are arranged in a series. Here, direction D1 is perpendicular to the longitudinal direction Z of probe 1.

[0036] Each deformation region 8, when viewed in the buckling direction X, has a circular (or elliptical) edge 10 (outer edge). Therefore, the actual shape is a depression or protrusion of a cylindrical, conical, truncated cone, or spherical shape. The spacing between adjacent deformation regions 8 in the longitudinal direction Z of probe 1 is the same as the spacing P described above.

[0037] According to the probe for probe cards of Embodiment 3, similar to Embodiments 1 and 2, by regularly arranging deformation regions 8 of the same shape, stress is regularly distributed, and a probe for probe cards with high mechanical strength can be provided.

[0038] Embodiment 4. The probe for the probe card according to Embodiment 4 will be described below, focusing on the differences from Embodiment 2. Figure 10 is a magnified view of the main part of the surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8. Similar to Embodiment 2, the deformation region 8 is provided on at least one of the planes 1S perpendicular to the buckling direction X.

[0039] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D2 relative to the longitudinal direction Z of probe 1. multiple They are arranged in a sequence. Here, direction D2 is oblique to the longitudinal direction Z of probe 1.

[0040] Each deformation region 8 has a quadrilateral edge 10 (outer edge) when viewed in the buckling direction X. Therefore, the actual shape is a depression or protrusion in the shape of a quadrilateral prism, quadrilateral pyramid, or frustoconical pyramid. The deformation region 8 is arranged such that two opposing sides of the quadrilateral edge 10 (outer edge) are parallel to a predetermined direction D2, and the other two sides are perpendicular to direction D2. The spacing between adjacent deformation regions 8 in a direction perpendicular to direction D2 is the same as the spacing P. The difference from Embodiment 2 is that in Embodiment 2, the deformation regions 8 were aligned straight and at equal intervals along the longitudinal direction Z of the probe 1, whereas in Embodiment 4, the deformation regions 8 are not aligned straight along the longitudinal direction Z of the probe 1.

[0041] As shown in Figure 10, the first row L1, second row L2, third row L3, and fourth row L4 each consist of four (actually more) deformation regions, but the deformation regions 8 of the first row L1 and the deformation regions 8 of the second row L2 are arranged alternately along direction D2. The same applies to the deformation regions of the second row L2 and the third row L3. Furthermore, the centers S of all the deformation regions 8 in the first row L1 are not aligned straight with the centers S of any of the deformation regions 8 in the second row L2 in the longitudinal direction Z of probe 1.

[0042] When the deformation regions 8 are arranged in this manner, one side of the deformation region 8 in the Nth column that forms the edge 10 of the deformation region 8 from the second to the first in the Nth column, and which is opposite the edge 10 of the deformation region 8 in the (N+1)th column, will be parallel to and opposite each of the sides that form the edge 10 of the two deformation regions 8 in the (N+1)th column. In other words, the corners K of the two deformation regions 8 will be close together and adjacent. Note that the spacing between adjacent deformation regions 8 is the same as in Embodiment 2.

[0043] In the probe for the probe card according to Embodiment 4, two corners K of the deformation region 8 where stress is concentrated are located close together. Compared to Embodiment 2, where four corners K were located close together, the number of locations where stress is concentrated can be increased by approximately double. This further distributes the stress and provides a probe for the probe card with high mechanical strength.

[0044] Embodiment 5. The probe for the probe card according to Embodiment 5 will be described below, focusing on the differences from Embodiment 3. Figure 11 is a magnified view of the main part of the surface 1S perpendicular to the buckling direction X of the probe 1, and shows another example of the arrangement of the deformation region 8. Similar to Embodiment 3, the deformation region 8 is provided on at least one of the planes 1S perpendicular to the buckling direction X.

[0045] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. multiple They are arranged in a series. Here, direction D1 is perpendicular to the longitudinal direction Z of probe 1.

[0046] Each deformation region 8 has a circular edge 10 (outer edge) when viewed in the buckling direction X. Therefore, the actual shape is a depression or protrusion in the shape of a cylinder, cone, or frustocone. The spacing between adjacent deformation regions 8 is the same as the spacing P described above. The difference from Embodiment 3 is that in Embodiment 3, the centers of the deformation regions 8 were aligned straight and at equal intervals along the longitudinal direction Z of the probe 1, whereas in Embodiment 4, the deformation regions 8 are not aligned straight along the longitudinal direction Z of the probe 1.

[0047] As shown in Figure 11, the first column L1 consists of two deformation regions (actually more), the second column L2 consists of three deformation regions 8, and the third column L3 consists of two deformation regions 8. Thus, the number of deformation regions 8 that make up adjacent columns differs. As shown in Figure 11, the deformation regions 8 of the first column L1 and the deformation regions 8 of the second column L2 are arranged alternately along direction D1. The same applies to each deformation region of the second column L2 and the third column L3. Note that the spacing between adjacent deformation regions 8 is the same as in Embodiment 3, but as can be seen by comparing Figure 9 and Figure 11, Embodiment 5 allows for a higher density arrangement of deformation regions 8 for the same area.

[0048] Figure 12 shows a modified example of Embodiment 5. The deformation region 8 may have an elliptical edge 10 (outer edge) when viewed in the buckling direction X.

[0049] According to the probe for probe cards of Embodiment 5, the deformation regions 8 can be arranged at a high density, which further distributes stress and provides a probe for probe cards with high mechanical strength.

[0050] Embodiment 6. The probe for the probe card according to Embodiment 6 will be described below, focusing on the differences from Embodiments 1 to 5. Figure 13 is a magnified view of the main part of the surface 1S of probe 1, perpendicular to the buckling direction X, and shows another example of the arrangement of the deformation region 8.

[0051] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D2 relative to the longitudinal direction Z of probe 1. multiple They are arranged in a sequence. Here, direction D2 is oblique to the longitudinal direction Z of probe 1. In this example, the deformation region 8 in each column has a rectangular edge 10. The center S of the deformation region 8 in each column is aligned with the longitudinal direction Z of the probe 1, but there are a maximum of two adjacent corners K. This example achieves the same effect as in Embodiment 4.

[0052] Embodiment 7. The probe for the probe card according to Embodiment 7 will be described below, focusing on the differences from Embodiments 1 to 6. Figure 14 is an enlarged view of the main part of the surface 1S perpendicular to the buckling direction X of the probe 1, which has a truncated triangular pyramidal recess.

[0053] The deformation region 8 is formed by arranging multiple units in a row with intervals P between them in a predetermined direction D1 relative to the longitudinal direction Z of the probe 1. multiple They are arranged in a series. Here, direction D1 is perpendicular to the longitudinal direction Z of probe 1.

[0054] The deformation regions 8 constituting the first column L1 and the second column L2 are arranged inverted vertically in the plane of Figure 14. Furthermore, the deformation regions 8 are recessed in a truncated triangular shape from the reference plane 1SB.

[0055] According to the probe for probe cards of Embodiment 7, the deformation regions 8 can be arranged at a high density, which further distributes stress and provides a probe for probe cards with high mechanical strength. Furthermore, the strength of the frame region 9 can be enhanced.

[0056] Embodiment 8. Figure 15A is a magnified view of the main part of the probe, which has a frustoconical recess in addition to a frustoconical projection. Figure 15B is a cross-sectional view of BB in Figure 15A. As shown in Figures 15A and 15B, the probe 1 has a structure in which a first deformation region 91 is a frustoconical depression with a large diameter, and a second deformation region 92 is a frustoconical protrusion with a small diameter, on the reference surface 1SB.

[0057] On the surface of this probe 1, first deformation regions 91 are arranged in a staggered pattern, and second deformation regions 92 are positioned in the spaces between the first deformation regions 91. This arrangement of the first deformation regions 91 and the second deformation regions 92 ensures uniform stress distribution, resulting in a probe with high mechanical strength. Thus, the deformation regions may be in the shape of protrusions from the reference surface 1SB, or they may be a mixture of deformable and recessed shapes.

[0058] Embodiment 9. Figure 16 shows a partial cross-sectional shape of the probe 1 of Embodiment 10. As shown in Figure 16, in this Embodiment 9, a coating layer 13 is provided to prevent foreign matter from adhering to the surface of the metal plate of the probe 1 shown in Embodiments 1 to 8. Furthermore, even if foreign matter does adhere, the surface of the metal plate is smoothly covered so that it can be easily removed. This configuration can solve the problem of foreign matter adhesion for any probe that has a recessed or protruding deformation area on the surface of the metal plate by similarly providing a coating layer.

[0059] As for the material of the coating layer 13, a resin layer that does not hinder the deformation of the metal plate is preferable. In particular, in embodiments 1 to 5, since multiple deformation regions 8 in the shape of depressions or protrusions are provided on the surface, there is a concern about the adhesion of foreign matter, so a coating layer 13 to smooth the surface is effective in eliminating this concern. By having multiple deformation regions 8 in the shape of depressions or protrusions and a framework region 9 on the surface of the conductor and providing a coating layer 13 on that surface, a probe 1 with high mechanical strength and no adhesion of foreign matter can be obtained. Note that a material other than resin may be used to cover the probe 1, and the material may be different from the material of the structure of the probe 1.

[0060] Although this application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but can be applied individually or in various combinations to the embodiments. Accordingly, countless variations not illustrated are conceivable within the scope of the art disclosed herein. These include, for example, modifying, adding or omitting at least one component, or even extracting at least one component and combining it with components of other embodiments. [Explanation of symbols]

[0061] 1 Probe, 1SB Reference plane, 10 Edge line, 101 Area expansion pattern region, 102 Stress concentration region, 13 Coating layer, 2 First guide plate, 3 Second guide plate, 4 Tip portion, 41 Substrate, 42 Conductive layer, 43 Metal layer, 5 Electrode pad, 51 First mold, 52 Second mold, 53 Metal plate, 6 Rear end portion, 7 Central portion, 8 Deformation region, 9 Framework region, 91 First deformation region, 92 Second deformation region, 1S Surface, X Buckling direction, L1 First row, L2 Second row, L3 Third row, L4 Fourth row, K Corner, P Spacing, D1, D2 Predetermined directions.

Claims

1. A vertical probe that buckles in the longitudinal direction perpendicular to the longitudinal direction, wherein a reference surface included in the plate surface perpendicular to the buckling direction of the metal plate has a plurality of spaced deformation regions, the outer edges of which are circular, elliptical, or polygonal, and which are recessed or protruding, and a framework region provided at the boundary between adjacent plurality of deformation regions, wherein a plurality of deformation regions are arranged in rows spaced apart in a predetermined direction with respect to the longitudinal direction of the probe, and the rows are arranged in multiple rows spaced apart. The probes for the probe card are arranged alternately along the predetermined direction, with the plurality of deformation regions in the Nth column and the plurality of deformation regions in the (N+1)th column being the same.

2. The probe for a probe card according to claim 1, wherein the predetermined direction is oblique to the longitudinal direction of the probe.

3. The probe for a probe card according to claim 1, wherein the predetermined direction is perpendicular to the longitudinal direction of the probe.

4. The probe for a probe card according to claim 1, wherein the deformation region is any of the following: polygonal prism shape, polygonal pyramidal shape, cylindrical shape, elliptical prism shape, cone shape or elliptical cone shape, or a frustum of polygonal pyramidal shape, frustum of cone shape or frustum of elliptical pyramidal shape with a cross-sectional area that gradually increases toward the reference plane.

5. The probe for a probe card according to any one of claims 1 to 4, wherein the deformation region is covered with a member made of a different material from the material of the probe structure.

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