Contact probe and its contact element, method for manufacturing the contact element, probe system using the contact element, method for testing an unpackaged semiconductor device, and tested semiconductor device and method for manufacturing the same.

Abstract

Used for a probe system for performing a functional test on a measurement object , a contact of the contact probe is provided. 【Solution means】The contact includes a main body portion, a contact tip portion, and a tip end transition section located between the main body portion and the contact tip portion. In the contact, when performing a functional test on the measurement object, the bottom side facing the measurement object includes a lower surface located on the main body portion, a tip end bottom surface located on the contact tip portion, and a tip end transition surface located on the tip end transition section. At the contact tip portion, the contact end used to contact the measurement object is located on the front side of the tip end bottom surface. There is a step between the rear side of the tip end bottom surface and the lower surface. The tip end transition surface has a gradually changing height and extends from the lower surface to the rear side of the tip end bottom surface. Thus, the contact of the present invention has good accuracy and structural strength.

Description

Technical Field

[0001] The present invention relates to a contact probe used for inspecting and measuring electronic components, and particularly to a contact probe having a three-dimensional tip (3D tip), its contactor, a method for manufacturing the contactor, a probe system using the contactor, a test method for an unpackaged semiconductor device, and a tested semiconductor device and a method for manufacturing the same.

Background Art

[0002] The contactors of current contact probes having three-dimensional tips are made by microelectromechanical technology, and a three-dimensional tip structure is constructed. Or, a three-dimensional tip structure is formed by bending a planar contactor. The contactors made by these methods have problems in accuracy and structural strength. Specifically, the contactors made by microelectromechanical technology are formed by stacking materials layer by layer. Particularly, in the case of the contact tip portion of the contactor directly formed in this way, in this stacking process, it is difficult to accurately align the positions between the layers. Therefore, problems occur in the accuracy of the tip (

[0003] that is, the contact tip portion). More specifically, it is ensured that the final structure is accurately formed by accurately aligning each layer with the previous layer. Any inaccurate alignment will lead to a decrease in accuracy. However, in the stacking process of the microelectromechanical manufacturing process, it is difficult to accurately align the positions between the layers. Thus, it leads to a decrease in the accuracy of the final product.

[0004] Furthermore, the manufacturing method of forming a three-dimensional needle tip structure by bending a flat contactor is The folds and curves in the curved areas (bonding wires and tiny slits) are quite pronounced, depending on the material. Force concentration occurs, reducing the structural integrity of the contact, decreasing the structural strength of the contact, and thus shortening its lifespan. It will become shorter. [Overview of the project] [Problems that the invention aims to solve]

[0005] This invention was made to solve the above-mentioned problems, and the contact probe The present invention provides a contactor and a method for manufacturing the same, eliminating the need for micro-electromechanical technology or bending of the contactor. Therefore, the contactor has good accuracy, high structural strength, and a relatively long lifespan. The purpose is to achieve this. [Means for solving the problem]

[0006] To achieve the above objective, the contact element of the contact probe according to the present invention is used to measure the object It is used in probe systems for conducting functional tests on [the target organism]. The contactor consists of a main body, a contact tip, and a tip located between the main body and the contact tip. It comprises a transition section and the contact tip portion is a contact used to contact the object to be measured. It has an end. The contactor has a top side and a bottom side, and the contactor is in contact with the object to be measured. When performing a functional test, the bottom side of the contact is facing the object being measured. The bottom side of the contactor consists of the lower surface located on the main body and the bottom surface of the tip located on the contact tip. and includes the tip transition surface located in the tip transition section. The contact end is the tip Located on the front side of the bottom surface, with a step between the rear side of the bottom surface of the tip and the lower surface, the tip The transitional surface of the part changes in height gradually and extends from the lower surface to the rear side of the bottom surface of the tip.

[0007] As a result, the bottom side of the contactor of the present invention (i.e., the side facing the object being measured) is the contact point There is a step between the end and the main body. That is, it has a so-called three-dimensional needle tip structure, and the contact tip The contact end is advantageous for contacting the contact pad of the object being measured, and the accuracy of the test is improved. This can improve reliability. Furthermore, it has a tip transition section between the contact tip and the main body. The transitional surface at the tip gradually changes in height, extending from the lower surface to the bottom surface of the tip. In other words, the transition surface at the tip is not a vertical surface or has other abrupt transitions, but has a step. The lower surface and the bottom surface of the tip are smoothly connected. Such contacts are made using micro-electromechanical technology. Therefore, it is not possible to stack layers or form it by folding. It is formed by other processing methods. Therefore, precision is achieved by micro-electromechanical technology or bending. Problems with poor construction, problems with stress concentration, problems with poor structural strength, and problems with short lifespan. This can avoid problems. Also, the smooth tip transition surface mentioned above prevents stress concentration. This reduces noise, improves structural integrity, and further enhances the durability and reliability of the contacts.

[0008] Preferably, the contact is formed by the substrate having the step through a cutting process. In other words, the step in the contact is the original step in the substrate, and the layer is created by micro-electromechanical technology. These are not contacts formed by stacking them one by one. Such contacts are integrally molded. Therefore, there is no need to bend it, and the shape of the contactor can be defined by the cutting process. Therefore, stress concentration is reduced, structural integrity is improved, and structural strength and long life are achieved. It has. The cutting process includes, for example, laser cutting, electrical discharge machining cutting, etc., and can accurately cut the desired shape of the contact. In particular, the positional accuracy of the contact end of the contact tip is good. That is, it can be accurately aligned with the contact pad of the object to be measured, which is advantageous for conducting tests. Specifically, it can accurately cut the desired shape of the contact. In particular, the positional accuracy of the contact end of the contact tip is good. That is, it can be accurately aligned with the contact pad of the object to be measured, which is advantageous for conducting tests.

[0009] Preferably, the tip transition surface includes a gradually changing transition curved surface and / or an inclined plane.

[0010] Thereby, the gradually changing transition curved surface can gradually change the radius of curvature according to the extending length and smoothly realize a step without a sharp change in curvature. The inclined plane can also obtain an effect of realizing a smooth step to a certain extent. Both can reduce the stress concentration, improve the structural integrity, and further improve the structural strength of the contact. According to different manufacturing processes, the tip transition surface may be a gradually changing transition curved surface, an inclined plane, or may simultaneously include a gradually changing transition curved surface and an inclined plane. Thereby, the gradually changing transition curved surface can gradually change the radius of curvature according to the extending length and smoothly realize a step without a sharp change in curvature. The inclined plane can also obtain an effect of realizing a smooth step to a certain extent. Both can reduce the stress concentration, improve the structural integrity, and further improve the structural strength of the contact. According to different manufacturing processes, the tip transition surface may be a gradually changing transition curved surface, an inclined plane, or may simultaneously include a gradually changing transition curved surface and an inclined plane. Both can reduce the stress concentration, improve the structural integrity, and further improve the structural strength of the contact. According to different manufacturing processes, the tip transition surface may be a gradually changing transition curved surface, an inclined plane, or may simultaneously include a gradually changing transition curved surface and an inclined plane. According to different manufacturing processes, the tip transition surface may be a gradually changing transition curved surface, an inclined plane, or may simultaneously include a gradually changing transition curved surface and an inclined plane.

[0011] Preferably, the surface roughness of the lower surface and the tip transition surface is different from the surface roughness of the tip bottom surface.

[0012] Thus, the step can be formed by performing a surface sedimentation process on one plane. For example, when the contact having the step is formed through a cutting process on a substrate, the substrate is formed from a single flat plate through a surface sedimentation process. Therefore, a relatively low surface and a transition surface with a gradually changing height are formed. The surface sedimentation process includes chemical etching, laser etching, etc., and the relatively low surface Thus, the step can be formed by performing a surface sedimentation process on one plane. For example, when the contact having the step is formed through a cutting process on a substrate, the substrate is formed from a single flat plate through a surface sedimentation process. Therefore, a relatively low surface and a transition surface with a gradually changing height are formed. That is, a relatively low surface and a transition surface with a gradually changing height are formed. The surface sedimentation process includes chemical etching, laser etching, etc., and the relatively low surface includes chemical etching, laser etching, etc., and the relatively low surface​​​ The surface roughness of the transition surface is made different from the surface roughness of the original flat plate. After being processed into a contactor via a process, the relatively low surface and the transition surface are, respectively This becomes the lower surface of the contactor and the transition surface of the tip. This results in a desirable step and The manufacturing of substrates with transition surfaces is facilitated, and the accuracy and structural strength of the resulting contacts are excellent. It will become.

[0013] Preferably, the main body portion comprises a thin-walled section, a thick-walled section, and the thin-walled section and the thick-walled section It includes a main body transition section located between the two. The lower surface is located in the thin-walled section. The bottom side of the contactor is located on the bottom surface of the main body, which is situated in the thickened section of the main body, and the transition of the main body. It further includes a transition surface of the main body located in the transition section. Between the bottom surface of the main body and the lower surface The aforementioned step difference is present. The transition surface of the main body has a gradually changing height, and from the lower surface to the main body It extends to the bottom surface.

[0014] As a result, the main body of the contactor also has a step, and its thin section is located close to the contact tip. It is positioned as such. Therefore, it is still possible to form a so-called three-dimensional needle tip structure. The contact tip is advantageous for the contact end to contact the contact pad of the object being measured. This can improve the accuracy and reliability of the test. The main body of the contactor is separated from the contact tip. The section that is formed is relatively thick, increasing the structural strength of the main body of the contactor. This allows for the construction of a contact probe by fixing the main body of the contactor to other components. This is advantageous. Furthermore, the step in the main body of the contactor arises from the inherent step in the circuit board. A method for manufacturing contacts like this does not require micro-electromechanical technology or bending of the contacts. The contacts are designed to have good accuracy, high structural strength, and a relatively long lifespan. The main body has a transition section between the thin-walled section and the thick-walled section, and the transition surface of the main body has a height of The gradually changing, stepped lower surface and the bottom surface of the main body are smoothly connected, reducing stress concentration. This improves structural integrity and further enhances the durability and reliability of the contacts.

[0015] Preferably, the transition surface of the main body includes a gradually changing transition surface and / or an inclined plane.

[0016] This allows for a smooth transition surface on the main body, reducing stress concentration. Reduces, improves structural integrity, and further enhances the structural strength of the contacts. Different manufacturing processes Depending on the context, the transition surface of the main body may be a gradually changing transition surface, or an inclined plane. This is also acceptable, and it may include both a gradually changing transition surface and an inclined plane simultaneously.

[0017] Preferably, the surface roughness of the lower surface, the tip transition surface, and the main body transition surface is This differs from the surface roughness of the bottom surface of the main body.

[0018] As a result, the step between the contact tip and the main body, and the step within the main body itself, become one flat surface. It can be formed by performing a surface sedimentation process on the surface. For example, the contactor is When a substrate with the aforementioned steps is formed through a cutting process, the substrate is similarly flat. The plate is formed through a surface sedimentation process. Therefore, the surface is relatively low, and the layers are relative to each other. Two transition surfaces are formed on opposite sides, with gradually changing heights, and the relatively low surface The surface roughness of the surface and transition surface is made different from the surface roughness of the original flat plate. After being processed into a contactor through the process, the relatively low surface and the transition surface are These become the lower surface of the contactor, the tip transition surface, and the main body transition surface, respectively. This facilitates the manufacture of substrates with desirable steps and transition surfaces, and improves the accuracy of the contacts created. This results in good structural strength.

[0019] Preferably, the device further comprises an extension section located between the main body and the tip transition section. The main body portion is greater than the width of the extended section, the tip transition section, and the contact tip portion. It has a wide width. A portion of the lower surface is located in the extended section.

[0020] This means that the transition section at the tip is not limited to being directly connected to the main body. An extended section may exist. Part of the lower surface is located within the extended section. That is, At the bottom of the contactor, the extended section and the main body share the same plane. However, the extended section is the main body It is narrower than the main body. In such extended sections, the contact tip contacts the contact pad of the object being measured. This provides greater elasticity, which is advantageous for the progress of the test.

[0021] Preferably, the lower surface is flat.

[0022] As a result, as mentioned above, the step undergoes a surface settlement process on a single plane. It can be formed by the above. The surface sedimentation process forms the above relatively low surface. This can be done. The aforementioned relatively low surface is used to form the lower surface of the contactor. By making the relatively low surface flat, the lower surface of the contactor can be made flat. It is not only easy to manufacture, but also possesses good structural integrity and structural strength.

[0023] Preferably, the top side of the contactor is the upper surface located on the main body and the contact tip. It has a tip surface located in the part. The tip surface is inclined with respect to the upper surface. The extension extends from the upper surface to the contact end.

[0024] As a result, the tip of the contact is originally flat, and then, for example, polished, the tip A surface is formed. For example, the contactor is formed when the substrate having the step undergoes a cutting process. If done, the top side of the contact is formed by the plane of the substrate. Contact is made by the cutting process. After the shape of the child is defined, the tip of the contactor is polished, for example by a polishing method. A top surface can be formed. This allows for shaping of the contact tip, resulting in a desirable contact end. It can be positioned to accurately align with the contact pad of the object being measured. This allows for testing, which is advantageous.

[0025] Furthermore, the contact probe according to the present invention performs functional tests on the object to be measured. Used in probe systems for the purpose of, a coaxial cable and a plurality of the aforementioned contacts, The coaxial cable comprises an inner electrical conductor, an outer electrical conductor, and the inner electrical conductor It includes a dielectric material provided between the conductor and the outer electrical conductor. Multiple contacts The top side of each contact has an upper surface located on the main body. A portion of the upper surface is fixed to the coaxial cable, so that the main body of each contactor It extends from the position where it is fixed to the coaxial cable and passes over the end of the coaxial cable. Each contact includes a cantilever segment extending from the end of the coaxial cable. The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tip portions of the contactors are flush with each other. Of the plurality of contactors, one first contact It includes a child and at least one second contact. The upper surface of the first contact is the coaxial cable The upper side of the second contact is electrically connected to and fixed to the inner electrical conductor of the cable. The surface is electrically connected to and fixed to the outer electrical conductor of the coaxial cable.

[0026] This allows the coaxial cable to be tested through the inner and outer electrical conductors. It transmits signal and ground signals and electrically connects to the inner and outer electrical conductors. The first and second contacts, which are connected, achieve good impedance matching. To do so. Such contact probes can be used for high-frequency testing. Also, contact Because the child has good precision and high structural strength, it has a long lifespan and improves the accuracy and reliability of the test. .

[0027] Furthermore, the contact probe according to the present invention performs functional tests on the object to be measured. A probe system used for this purpose, comprising a circuit board and a plurality of the aforementioned contacts. The circuit board includes a plurality of electrical conduction circuits. In the plurality of contacts, each contact The top side of the child has an upper surface located on the main body. A part of the upper surface of each of the contactors. Since each of the connections is electrically connected and fixed to the electrical conduction circuit of the circuit board, The main body of the contactor extends from the position where it is fixed to the circuit board and the end of the circuit board Passing through, each contact includes a cantilever segment extending from the end of the circuit board. The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tip portions of the aforementioned contacts are flush with each other.

[0028] As a result, the circuit board transmits test signals and ground signals via different electrical conduction circuits. The signal is transmitted, and the first and second contacts, which are electrically connected to the electrical conduction circuit, are in good condition. To achieve impedance matching. Such contact probes are It can be used for high-frequency testing. Furthermore, the contacts have high precision and structural strength. It has a longer lifespan and improves the accuracy and reliability of the tests.

[0029] Furthermore, the method for manufacturing a contactor according to the present invention includes the following steps 1 and 2. The contactor This is used as a contact probe for performing functional tests on the object being measured.

[0030] Step 1: Provide the circuit board. The substrate is made of an electrically conductive material and consists of a thin-walled block and at least one thick-walled block. The material is stretched from the thin-walled block to the thick-walled block, with the thickness gradually increasing. It includes at least one transition block. The upward side of the substrate is located in the thin-walled block. The first surface, at least one second surface located in the thick-walled block, and the transition It includes at least one transition surface located in the block. The second surface is more than the first surface. It is high. The transition surface extends from the first surface to the second surface with a gradually changing height. To extend.

[0031] Step 2: Define the multiple contacts by removing some of the material from the substrate. The step of defining a plurality of contacts is to define each contact in the thick block of the substrate The steps include defining the contact tip and the body of each contact on the thin block of the substrate. The steps of defining the part and cutting the substrate based on the outer contour of the plurality of contacts This includes the step of performing the ting.

[0032] Thus, the aforementioned manufacturing method is used to manufacture the aforementioned contactor provided by the present invention. Therefore, the contactor has high precision and structural strength, resulting in a long lifespan and accurate testing. The degree and reliability will improve.

[0033] Preferably, the method for manufacturing the contactor involves shaping the contact tip of each contactor, and each From the contact tip, the tip top surface, the tip bottom surface, and the tip top surface and the tip bottom surface A contact end is formed at the point of intersection and used to contact the object to be measured. It also includes steps.

[0034] Thus, after the shape of the contactor is defined, the contact member is polished, for example, to the tip of the contactor. A surface and a bottom surface of the tip are formed. Therefore, the shape of the contact tip is adjusted, and the contact end is in the desired position. This ensures that the contact end is positioned correctly, improving accuracy and precisely aligning with the contact pad of the object being measured. This makes testing easier.

[0035] Preferably, the substrate consists of two of the thin-walled blocks located on opposite sides of the thin-walled block. A transition block, and two thick-walled blocks connected to each of the two transition blocks, respectively. Including a lock. The upward side of the substrate is located at two of the two thick blocks. The second surface, and the two transition surfaces located in each of the two transition blocks. The step of defining a plurality of contactors is performed on one of the two thick blocks. The steps include defining the contact tip of each contactor, and the thin-walled block and two The step includes defining the main body portion of each contactor in the other of the thickened blocks.

[0036] In other words, the upward side of the substrate has two relatively high second surfaces, and between the two second surfaces It has one relatively low first surface located there. Between the two second surfaces and the one first surface Each of these has a transition surface where the height gradually decreases. The contact tip of each defined contact can form a so-called three-dimensional needle-tip structure, and the contact tip The contact ends of the end are advantageous for contacting the contact pad of the object being measured, and the accuracy of the test and improve reliability. Each contact in the thin-walled block and the other of the two thick-walled blocks By defining the main body, the main body of the contactor has a relatively large portion that is far from the contact tip. It is formed thickly, which increases the structural strength of the main body of the contactor, and the main body of the contactor is made thicker. It is advantageous to construct a contact probe by fixing it to the component.

[0037] Preferably, the substrate is formed from a single flat plate through a surface sedimentation process. The first surface and the transition surface are formed by the surface sedimentation process, The surface roughness of the transition surface is different from the surface roughness of the second surface. The process involves defining a plurality of contacts by removing a portion of the material from the substrate. It will be done first.

[0038] As a result, the surface deposition process can be chemical etching, laser etching, etc. The surface roughness of the first surface and the transition surface generated is the same as the surface roughness of the original second plane of the flat plate. This differs from surface roughness. Such a method easily provides substrates with desirable steps and transition surfaces. It can be manufactured, and the precision and structural strength of the manufactured contacts can be increased.

[0039] Furthermore, the probe system according to the present invention provides functional information to the object to be measured formed on the substrate. Used to conduct tests. The object to be measured includes multiple contact pads. The probe system comprises a mounting base and a contact probe. The mounting base is the base It is positioned to support the plate. The contact probe is the same as the one described in claim 1. The device includes multiple contacts, the contact ends of the contacts being connected to the contact pad of the object being measured. By making contact, the contact probe and the object to be measured are electrically connected, and the object to be measured It is used to conduct functional tests on a fixed substance.

[0040] As a result, the aforementioned probe system employs the aforementioned contact provided by the present invention, It has good quality, high structural strength, a long service life, and accuracy in testing probe systems. This can increase trust.

[0041] Furthermore, the test method according to the present invention is a test method for unpackaged semiconductor devices. This is a law and includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe. The contact probe is It includes multiple of the aforementioned contactors. Step 2: The contacts are connected to multiple contacts of an unpackaged semiconductor device. The pad is made to make mechanical and electrical contact. Step 3: At least one of the contact probes not packaged Tests are performed on the semiconductor device.

[0042] As a result, the contact probe used in the aforementioned test method is the same as the aforementioned book It includes a contact element based on the invention, has good precision, high structural strength, and a long service life. This can improve the accuracy and reliability of testing semiconductor devices that are not packaged. .

[0043] Furthermore, the tested semiconductor device manufacturing method according to the present invention is as follows: Steps 1 and 2 Includes 3. Step 1: Provide at least one contact probe. The contact probe is It includes multiple of the aforementioned contactors. Step 2: Connect the multiple contacts to the multiple contacts of the unpackaged semiconductor device. The tact pad is made to make mechanical and electrical contact. Step 3: At least one of the contact probes not packaged Tests are performed on the semiconductor device.

[0044] Therefore, the semiconductor devices manufactured using the aforementioned manufacturing method have been tested. The device utilizes a contact element according to the present invention, resulting in good accuracy, high structural strength, and a long service life. This can improve the accuracy and reliability of test results for semiconductor devices.

[0045] Furthermore, the tested semiconductor device according to the present invention comprises a plurality of contact pads, Test probes by mechanical and electrical contact with at least one contact probe A test is performed. The contact probe includes a plurality of the aforementioned contacts. The test procedure The set is such that the contact ends of the multiple contactors contact the multiple contact pads. It will be done there.

[0046] Thus, the aforementioned semiconductor device has been tested. The test involved the contacts according to the present invention. It is used, has good accuracy, high structural strength, a long service life, and the test results of semiconductor equipment are Accuracy and reliability can be improved.

[0047] The present invention relates to a contact probe and its contact element, a method for manufacturing the contact element, and a method for using the contact element. Probe systems, methods for testing unpackaged semiconductor devices, and, Detailed structure, features, assembly, or use of tested semiconductor devices and their manufacturing methods. The method will be described in the description of embodiments for carrying out the invention, which will be discussed later. However, the technology of the present invention A person with general knowledge in the field would understand such a detailed description and how to implement the present invention. The specific embodiments listed for this purpose are merely for illustrating the present invention, and the present invention It should be understood that this is not intended to limit the scope of the patent claims. [Brief explanation of the drawing]

[0048] [Figure 1] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 2] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 3] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 4] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 5] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 6]This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 7] This is a schematic diagram showing a method for manufacturing a contactor according to the first embodiment of the present invention. [Figure 8] This is a schematic diagram showing a side view of a probe system according to the first embodiment of the present invention. [Figure 9] This is a schematic diagram showing the bottom surface of the coaxial cable of the contact probe of the probe system according to the first embodiment of the present invention. [Figure 10] This is a schematic diagram showing a contact element and a local part of the object to be measured according to the first embodiment of the present invention. [Figure 11] This is a schematic diagram showing a side view of a probe system according to a second embodiment of the present invention. [Figure 12] This is a schematic diagram showing the bottom surface of the circuit board of the contact probe of the probe system according to the second embodiment of the present invention. [Figure 13] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 14] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 15] This is a schematic diagram showing a method for manufacturing a contactor according to a third embodiment of the present invention. [Figure 16] This is a schematic diagram showing a contact element and a local part of the object to be measured according to a third embodiment of the present invention. [Figure 17] This is a schematic three-dimensional view showing a local portion of a contactor according to the fourth embodiment of the present invention. [Modes for carrying out the invention]

[0049] In the embodiments and drawings described below, the applicant states that the same reference numerals indicate the same or similar components. This section explains how to represent constituent elements or their structural features. Components and structures in drawings. For the sake of illustrative convenience, these are not illustrated based on actual proportions and quantities, and It should be noted that, where feasible, features of different embodiments may be mutually applicable. Furthermore, when referring to the fact that one component is placed on top of another component, as mentioned above The fact that one component is placed directly on top of another component, or that the aforementioned component is It is indirectly placed on top of another component, that is, one or more components between two components. This means that other components are further arranged. If installed "directly", it means that no other component is installed between the two components. It means.

[0050] (First Embodiment) As shown in Figures 1 to 8, the method for manufacturing a contactor according to the first embodiment of the present invention is Used to manufacture the contacts 40A and 40B of the probe 30 (see Figure 5). The method includes steps a) through c) below.

[0051] Step a): As shown in Figures 1 to 3, a single substrate 50 is provided. The substrate 50 is made of an electrically conductive material. It is made from. The substrate 50 consists of one thin-walled block 51, one thick-walled block 52, and A single transition block that extends while gradually increasing in thickness from a thin-walled block 51 to a thick-walled block 52. Includes lock 53. One upward side 54 of the substrate 51 is located on one of the thin-walled blocks 51. A first surface 541, a second surface 542 located in the thick-walled block 52, and a transition block It includes one transition surface 543 located at the top 53. The second surface 542 is from the first surface 541. It is high. The transition surface 543 has a gradually changing height from the first surface 541 to the second surface 542. It will be extended.

[0052] Furthermore, the substrate 50 provided in this step is shown in Figures 2 and 3. As shown in Figure 1, a single flat plate 61 is formed through a surface sedimentation process. Examples of etching methods include chemical etching and laser etching, which affect the local thickness of the flat plate 61. Used to reduce sinking, a local surface of one plane 611 facing upwards on the flat plate 61 sinks. By lowering the substrate, the first surface 541 and the transition surface 543 of the substrate 50 are formed. The portion of the flat surface 611 of the plate 61 that has not settled forms the second surface 542 of the substrate 50. Therefore, the first surface 541 and the transition surface 543 formed through the surface sedimentation process The surface roughness differs from that of the second surface 542 obtained from the flat surface 611 of the original flat plate 61. This surface sedimentation process allows for the rapid and easy production of the desired substrate 50. The first surface 541 and the second surface 542 have a predetermined step difference, and the transition surface 543 is the first surface. Surface 541 and the second surface 542 are smoothly connected. For example, The thin-walled block 51 has a thickness of 60 microns, and the thick-walled block 52 has a thickness of 80 microns. The step d is 20 microns. Surface roughness refers to the step (roughness) of the surface contour. Specifically, the absolute deviation of the actual surface contour is the mean value (R) relative to the mean line. a) Therefore, when viewed under a microscope, differences in the surface of objects become clearly visible. For example, gloss These differences include brightness and other factors. Furthermore, differences in surface roughness are due to the surface coating (Coatin g) Even after going through the process (for example, after going through the plating process), it is not clearly visible under a microscope. This includes differences in the surface of the object (for example, differences in gloss, brightness, etc.).

[0053] Step b): As shown in Figures 4 and 5, by removing a portion of the material from the substrate 50, multiple contacts 40A are formed. Define 40B. The step of defining contacts 40A and 40B is to define the thick block of the substrate 50 Steps include defining the contact tip portion 41 of each contactor 40A, 40B in the 52 and the thin of the substrate 50 The steps include defining the main body portion 42 of each contactor 40A, 40B in the meat block 51, and the contactor 4 Steps to cut the substrate 50 based on one external contour C of 0A, 40B Includes "Pu".

[0054] As shown in Figures 4 and 5, the manufacturing method according to this embodiment involves three contactors 40A and 40B They are manufactured simultaneously. In this step, the three contacts 40A and 40B jointly form the external Cutting is performed based on contour C, and each contact 40A, 40B is made into the desired shape. Cutting is performed based on this. In the cutting step, the main body is used as needed. The position of the contact tip portion 41 relative to portion 42 can be adjusted, and not necessarily the contact tip portion 41 It is not necessary to position it in the center of one end face of the main body 42. As shown in Figure 5, three connections Of the contactors 40A and 40B, one relatively short contactor 40A (in this invention, the first contactor and (also referred to as the second contact), and two relatively long contacts 40B (also referred to as the second contact in this invention) ) is included, and contactor 40A is located between contactor 40B. In this step, three contacts The contact tip portions 41 of children 40A and 40B are connected by a single connecting portion 62, and the contact child 4 The main body 42 of 0B is connected by a single connecting part 63. Contacts 40A and 40B are manufactured When the construction is complete, the connecting portion 62 is removed by the step of shaping the contact tip, which will be described later. The three are separated, and the contact tips 41 of the contactors 40A and 40B are spaced apart from each other. Figure 5 shows three The contacts 40A and 40B constitute a single probe having three probe tips. Depending on the needs of the user, the probe can contain any appropriate number of probe tips. For example, one probe tip, two probe tips, three probe tips, or three or more The upper probe tip can be included. Generally, if there are two probe tips, one Includes a signal probe tip and one ground probe tip, GS (Ground-Signal) probe Also called a probe tip configuration. Generally, it includes three probe tips (as shown in Figure 5). , the signal probe tip located in the center (i.e., contactor 40A), and located on both sides thereof It includes a pair of grounding probe tips (i.e., two contacts 40B) and GSG (Grounding-Signal) Also called the probe tip arrangement (grounding). Figure 4 shows the three contacts 4 on the substrate 50. This example illustrates a single GSG probe having an external contour C jointly formed by 0A and 40B. However, it is not limited to this. For example, in substrate 50, the same and / or It is also possible to define multiple probes with different external contours C.

[0055] When step b) is completed, the contacts 40A and 40B will have a side shape as shown in Figure 6. It has the shape. Each contact 40A, 40B is formed by a thick block 52 of the substrate 50. The contact tip portion 41, the main body portion 42 formed by the thin-walled block 51 of the substrate 50, and the base It is formed by the transition block 53 of the plate 50 and is located between the main body portion 42 and the contact tip portion 41. It includes one tip transition section 43.

[0056] Step c): As shown in Figures 6 and 7, the shape of the contact tip portion 41 of the contacts 40A and 40B is adjusted (sha Step rp) For example, one step is to polish with an abrasive cloth (lapping), and each contact The tip portion 41 has a tip top surface 411, a tip bottom surface 412, and the tip top surface 411 and the tip A contact end 413 is formed where the end bottom surfaces 412 intersect. This contacts one contact pad 231 (see Figure 10) of one object to be measured 23. It is used for this purpose.

[0057] Here, the arrangement direction of the contacts 40A and 40B in the manufacturing process shown in Figure 7, and the actual The orientation of the contacts during use is as shown in Figure 10. To explain more clearly, the contacts 40A and 40B have one top side 44 and one bottom side 45. Figure 7 shows the bottom side 45 at the top. This indicates a state that is oriented toward the object being measured. Contacts 40A and 40B perform a functional test on the object being measured 23. When this happens, as shown in Figure 10, the bottom side 45 of the contacts 40A and 40B faces the object to be measured 23. .

[0058] As shown in Figures 7 and 10, the bottom side 45 of the contacts 40A and 40B is located on the main body 42. One lower surface 421, a tip bottom surface 412 located at the contact tip 41, and a tip transition It includes a tip transition surface 431 located in section 43. The contact end 413 is the tip bottom surface 412 It is located on one front side 412a. One rear side 412b and lower surface 42 of the tip bottom surface 412 There is a step d between 1. The tip transition surface has a gradually changing height from the lower surface 421 to the tip. It extends to the rear side 412b of the bottom surface 412. The top side 44 of the contacts 40A and 40B is the main body 4 One upper surface 422 located at 2, and the tip top surface 411 located at the contact tip 41 It has. The tip top surface 411 is inclined with respect to the upper surface 422. It extends to the contact end 413. The lower surface 421 of the main body 42 and the tip transition section 43 The leading transition surface 431 is the first surface 541 of the substrate 50 shown in Figure 3, and the transition surface 431 is the same as the transition surface 431 of the substrate 50 shown in Figure 3. Because it is formed by surface 543, the surface roughness of the lower surface 421 and the tip transition surface 431 This is different from the surface roughness of the bottom surface 412 of the tip, the top surface 411 of the tip, or the upper surface 422. Furthermore, in the step of shaping the contact tip as described above, the virtual lines 415 and 41 shown in Figure 6 Polishing is performed on the contact tip 41 of the contacts 40A and 40B along line 6. First, the imaginary line Polish along 415 to align the contact tips 413 of contacts 40A and 40B. Then, Polishing is performed along the virtual line 416, and the bottom surface 412 of the tip of the contacts 40A and 40B is similar. Ensure that it has flatness.

[0059] After the shapes of the contacts 40A and 40B are defined in step b), this step c) is performed. This is done in order to further shape the contact tip portion 41. This will make the contact end portion 413 The contact pad 231 of the object to be measured can be easily brought into contact with the object to be measured 23, and the contact end Further adjust the position of end 413 so that the contact end 413 is precisely positioned in the desired location. Furthermore, the precision of the contact end 413 is further improved, and the contact pad 231 of the object to be measured is accurately It can be adjusted to suit the test, which is advantageous for conducting tests. The tip formed in step c) The bottom surface 412 does not necessarily have to be connected to the tip transition surface 431, and the contact tip portion 41 shown in Figure 6 The plane 414 is partially retained, and the bottom surface of the tip is the surface and plane 4 formed in step c). To include a portion of 14. Alternatively, the method for manufacturing the contactor of the present invention may include step c). It is not necessary. Contacts 40A and 40B that have not gone through step c) of shaping are shown in Figure 6. As shown, such contacts 40A and 40B are still straight as shown in the upper right of Figure 6. The corners are positioned as contact ends, allowing them to contact the contact pad 231 of the object to be measured 23. In this case, the plane 414 is the bottom surface of the tip. As shown in Figure 10, the front side of the bottom surface 412 of the tip When 12a comes into contact with the contact pad 231 of the object to be measured 23, the distance of each contact tip 41 The tip surface 411 of the end is inclined at a predetermined angle of 450 degrees backward from the vertical. As shown in Figure 10, the tip top surface 411 is 90 degrees relative to the upper surface 422 of the main body 42. It extends at an internal obtuse angle of 460 degrees, which is larger than a degree. Therefore, workers use microscopes and video cameras. When observing the contact tip 41 from top to bottom through a laser or similar device, the contact end 413 and the contact The relative positional relationship of the contact pad 231 can be observed, and the contact pad 231 The relative positions of each contact tip 41 can be determined, which is advantageous for alignment. be.

[0060] As shown in Figure 8, the probe system 11 according to this embodiment has one mounting base 21, It also includes one contact probe 30. The contact probe 30 has one base Section 31, a coaxial coupling 32 fixed to the base section 31, base section 31 and coaxial coupling The coaxial cable 33 is electrically connected to the hand 32, and the three contacts 4 mentioned above. It has 0A and 40B. The three contacts 40A and 40B are arranged in parallel, However, only one contact 40B is shown in Figure 8, and the other two contacts 40A and 40B are... In Figure 8, it is obscured and not visible by the contactor 40B.

[0061] Furthermore, the coaxial cable 33 is cut to have an obliquely cut surface 331, and the coaxial cable The internal structure of 33 is exposed over a relatively large area on the obliquely cut surface 331. (See Figure 9) As shown, the coaxial cable 33 has one inner electrical conductor 332 and one outer electrical conductor 333, and dielectric provided between the inner electrical conductor 332 and the outer electrical conductor 333 Includes body 334. The upper surfaces 422 of contactors 40A and 40B are, respectively, connected to coaxial cable 3. It is partially fixed to the angled cutting surface 331 of 3. For example, the angled cutting of the coaxial cable 33. The machined surface 331 has a 45-degree angle to the horizontal plane, and the contacts 40A and 40B are connected to the coaxial cable 33 The mounting angle when fixed is 45 degrees. That is, contactor 40A, The upper surface 422 of 40B has a 45-degree angle with respect to the horizontal plane. To explain further: The upper surface 422 of the contact 40A (first contact) is electrically connected to the inner electrical conductor 332. And it is fixed. The upper surface 422 of the two contacts 40B (second contact) is the outer electrical The conductor 333 is electrically connected and fixed, and each of the two inner electrical conductors 332 It is located in the opposing blocks 333a and 333b. The three contacts 40A and 40B Each body portion 42 extends to the left in Figure 9 from the position where it is fixed to the oblique cutting surface 331. And, by passing through the end 335 of the coaxial cable 33, each contact 40A, 40B is coaxial The cable 33 includes a cantilever segment 46 extending from its end 335. (See Figure 8). The cantilever segment 46 is part of the main body 42, and all of the tip It includes an end transition section 43 and a contact tip 41. The contact tip 41 is a cantilever segment. It is located at one end 461 of T 46. The bottom surface 412 of the tip of the three contacts 40A and 40B. They are flush with each other. The manufacturing method described above manufactures the three contacts 40A and 40B simultaneously. Therefore, flush alignment of contacts 40A and 40B can be easily achieved.

[0062] As shown in Figure 8, the probe system 11 is formed on a single substrate 22. It is used to perform functional tests on object 23 (see Figure 10). The substrate 22 is The probe system 11 is supported by the mounting stage 21. For example, the substrate 22 is a single wafer. The object under measurement 23 is an unpackaged semiconductor device on a wafer. Since object 23 is actually very small, it is not shown in Figure 8, but in Figure 10. The object to be measured 23 is schematically illustrated. The object to be measured 23 consists of multiple contact pads 231. There are, and in Figure 10, only one of them, the contact pad 231, is schematically shown. The probe 30 has the bottom surface 412 of the tip of the contacts 40A and 40B making contact with the object to be measured 23. By making contact with the pad 231, an electrical connection is made with the object to be measured 23. At this time, the contact The bottom surface 412 of the tip portions 40A and 40B is in contact with the surface of the contact pad 231 of the object to be measured 23. It tilts slightly upward (for example, at an angle of less than 7 degrees) (see Figure 10). Contact The coaxial coupling 32 of the probe 30 is connected to the test device (not shown) via another coaxial cable (not shown). When electrically connected (without being connected), contacts 40A and 40B make contact with the contact pad of the object 23 being measured. By contacting the device 231, a functional test of the object 23 to be measured can be performed. In the coaxial cable 33, the inner electrical conductor 332 is used to transmit a test signal. The outer electrical conductor 333 is used to transmit the ground signal, and the contact 40A is used for testing. A signal is transmitted, causing contactor 40B to transmit a ground signal. A test signal is transmitted. Contacts 40B, which transmit ground signals, are arranged parallel to and spaced apart from contact 40A. By placing it, a transmission line with a desirable impedance matching effect is formed. This allows for good impedance matching effects, and contacts Lobe 30 can be used for high-frequency testing.

[0063] As a result, the bottom side 45 of the contacts 40A and 40B of the present invention (i.e., facing the object to be measured 23) The side that is facing the object has a step d between the contact tip portion 41 and the main body portion 42. That is, the so-called three It has a dimensional needle tip structure, and the contact end 413 of the contact tip portion 41 is in contact with the object to be measured 23. This is advantageous for contacting the 231 and can improve the accuracy and reliability of the test. Furthermore, there is a tip transition section 43 between the contact tip portion 41 and the main body portion 42, and the tip transition The surface 431 has a gradually changing height, from the lower surface 421 of the main body 42 to the bottom surface 412 of the tip. It extends. That is, the tip transition surface 431 has a vertical plane or other abrupt transition. Rather than being a simple design, it smoothly connects the lower surface 421 with a step d to the bottom surface 412 of the tip. This reduces stress concentration, improves structural integrity, and ensures good structural integrity for contacts 40A and 40B. To ensure it has appropriate strength, good durability, and good reliability.

[0064] Furthermore, the contacts 40A and 40B are formed from a substrate 50 having a step d through a cutting process. This is achieved. That is, in the contactors 40A and 40B, between the contact tip portion 41 and the main body portion 42 The step d is the original step of the substrate 50, and it is stacked layer by layer using micro-electromechanical technology. These are not steps formed by the contacts. Such contacts 40A and 40B are integrally molded. Therefore, there is no need to bend them, and the shape of the contacts 40A and 40B is defined by the cutting process. Therefore, stress concentration is reduced, structural integrity is improved, and contacts 40A, 4 To ensure that 0B has high structural strength and a long lifespan. Also, the cutting process (for example) Examples include laser cutting and electrical discharge machining.) Desired contacts are 40A, 40 The shape of B can be cut precisely. In particular, the contact tip portion 41 and the contact end portion 41 The positional accuracy of 3 is good. That is, it is accurately positioned on the contact pad 231 of the object 23 being measured. This allows for compatibility and is advantageous for conducting tests.

[0065] As shown in Figure 10, in this embodiment, the tip transition surface 431 of the contacts 40A and 40B This includes one gradual transition surface 432 and one inclined plane 433. Gradual transition The curved surface 432 is directly connected to the lower surface 421 of the main body 42, and the rear side of the tip bottom surface 412 It extends toward 12b. The gradually changing transition surface 432 has a curvature that increases with the length of extension. The diameter changes gradually, and the curvature does not change abruptly, allowing for a smooth step to be created. The inclined plane 433 is a gradually changing transition surface 432 and the rear side 412b of the tip bottom surface 412. It is connected in between and has the effect of creating a step that is somewhat smooth. In other words, The transition surface 432 of the next change has a relatively smooth effect in creating a step, and reduces stress concentration. The reduction effect is better than that of the inclined plane 433. Gradual change transition surface 432 and inclined plane 4 33 in all cases reduces stress concentration and improves structural integrity, contactor 40A, 40 Further improve the structural strength of B. Depending on the manufacturing process, the tip transition surface 431 This may be a gradually changing transition surface 432 (e.g., generated by chemical etching). It may be an inclined plane 433, or a gradually changing transition surface as shown in this embodiment. The 432 and the inclined plane 433 may be included simultaneously.

[0066] Furthermore, in this embodiment, the step between the contact tip portion 41 and the main body portion 42 of the contactors 40A and 40B The difference d is obtained by performing a surface sedimentation process on the flat surface 611 of the plate 61 as shown in Figure 1. This surface sedimentation process forms a planar first surface 541 (see Figure 3). (See reference). Subsequently, the lower surfaces 421 of the contacts 40A and 40B are formed by the first surface 541. Therefore, the lower surface 421 of each contact 40A, 40B is a single plane. First surface By making 541 flat, the lower surface 421 of the contacts 40A and 40B is made flat. This can be done. This manufacturing method is easy, and the main body 42 of the contacts 40A and 40B has a good structure. To ensure structural integrity and structural strength.

[0067] (Second embodiment) The contacts 40A and 40B according to the present invention are applied to the probe system 11 shown in Figure 8. It is not limited to this. For example, the application of the probe system 12 according to the second embodiment shown in Figure 11. It is also possible. Probe system 12 is similar to probe system 11, but different. The difference is that a different type of contact probe 70 is being used. , one base portion 71, one coaxial coupling 72 fixed to the base portion 71, base portion 7 Circuit board 73 electrically connected to 1 and coaxial coupling 72, and the first embodiment It has three similar contacts 40A and 40B. The three contacts 40A and 40B are located on the circuit board. They are arranged parallel to one of the base surfaces 731 of 73, and of these, only one contact 40B is shown in the figure. As shown in Figure 11, the other two contacts 40A and 40B are contacts 40 It is obscured by B and cannot be seen.

[0068] Furthermore, as shown in Figure 12, the bottom surface 731 of the circuit board 73 has one electrical conductive circuit 7 32, and two electrical conduction circuits located on opposite sides of the electrical conduction circuit 732 733 is provided. The upper surface 422 of the contact 40A (first contact) is an electrical conductive circuit. It is electrically connected to and partially fixed to 732. Two contacts 40B (second contact). The upper surfaces 422 are each electrically connected to and partially fixed to the electrical conduction circuit 733. The main bodies 42 of the three contacts 40A and 40B are all fixed to the circuit board 73. From the position shown, it extends to the left side of Figure 12, passing through the end 735 of the circuit board 73. Thus, each contact 40A, 40B extends from the end 735 of the circuit board 73, forming a cantilever Ensure that it includes the joint 46 (see Figure 11). The cantilever segment 46 is part It includes the main body portion 42, as well as the entire tip transition section 43 and the contact tip portion 41. The tip 41 is located at one end 461 of the cantilever segment 46. Three contacts The bottom surfaces 412 of the tip portions 40A and 40B are flush with each other.

[0069] In other words, compared to the contact probe 30 according to the first embodiment, the according to this embodiment The main difference in the contact probe 70 is that the coaxial cable 33 is replaced with a circuit board 73. This is the point. Such a contact probe 70 also functions with respect to the object to be measured 23. Tests can be performed. In the circuit board 73, the electrical conduction circuit 732 is a test signal The electrical conduction circuit 733 is used to transmit the signal, and the ground signal is used to transmit the ground signal. The contact 40A transmits a test signal and the contact 40B transmits a ground signal. The contact 40A that transmits the test signal has contacts 40B that transmit the ground signal on both sides. By arranging them parallel and spaced apart, the desired impedance matching effect can be achieved. It is possible to form a transmission line having this property and obtain a good impedance matching effect. This allows the contact probe 70 to be used for high-frequency testing.

[0070] (Third embodiment) As shown in Figures 13 to 16, in the third embodiment of the present invention, another form of contactor 40C, 4 The present invention provides 0D (which are also referred to as the first contactor and the second contactor, respectively).

[0071] The manufacturing method for contacts 40C and 40D is similar to that for contacts 40A and 40B, and is the same. This includes steps a) through c). The main difference is that in this embodiment, the substrate shown in Figure 2 is used. 50 thin-walled blocks 51, thin-walled blocks 55, thick-walled blocks 56, and transition blocks The point is that it was replaced with 57. As shown in Figures 13 and 14, step a) of this embodiment The substrate 50 provided consists of one thin-walled block 55 and two thin-walled blocks 55 facing each other. The transition blocks 53 and 57 located on both sides, and the transition blocks 53 and 57 are respectively connected It includes two connected thick-walled blocks 52 and 56. The transition blocks 53 and 57 are each Then, the thickness gradually increases as the block is stretched, from the thin-walled block 55 to the thick-walled blocks 52 and 56. Therefore, the upward side 54 of the substrate 50 is the first surface 541 located on the thin block 55, each Two second surfaces 542 located in the thick-walled blocks 52 and 56, and each transition block It includes two transition surfaces 543 located at 53 and 57. The two second surfaces 542 are Both are higher than the first surface 541 and have the same step difference d between them and the first surface 541. Surface 543 has the same shape, and the height gradually increases from the first surface 541 to the second surface 542. It extends while changing.

[0072] Furthermore, in this embodiment, the substrate 50 provided in step a) of this embodiment is similarly, The flat plate 61 shown in Figure 1 is formed through a surface sedimentation process. The difference is that in this embodiment, The area of ​​the subsided surface 611 of the plate 61 is relatively small. The substrate 50 is subjected to a settling process to form the first surface 541 and the transition surface 543. In the plane 611, the surface that has not been subsided becomes the second surface 542 of the substrate 50.

[0073] As shown in Figures 13 and 15, in step b) of this embodiment, contacts 40C, 40 The step of defining D is to define the contact tip 4 of each contact 40C, 40D in the thick-walled block 53. The steps of defining 1, thin-walled block 55, and transition block 57, and thick-walled block The lock 56 includes the step of defining the body portion 42 of each contact 40C, 40D. After that, in step c), the shape of the contact tip 41 of each contact 40C, 40D is adjusted, and the contact Ensure that 40C and 40D are as shown in Figure 16.

[0074] Thus, the contacts 40C and 40D in this embodiment are the same as the contacts 40A and 4 described above. It has a contact tip portion 41 and a tip transition section 43 similar to 0B. However, in this implementation The main body portion 42 of the contactors 40C and 40D, depending on their shape, is formed by a thin block 55 of the substrate 50. The thin-walled section 423 is formed, and the thick-walled section 42 is formed by the thick-walled block 56 of the substrate 50. 4 and the transition block 57 of the substrate 50, which is formed by a thin section 423 and a thick section 42 It includes a main body transition section 425 located between 4 and 4. The bottom side 45 of the contacts 40C and 40D , the bottom surface 412 of the tip located at the contact tip 41, and the tip located at the tip transition section 43 The transition surface 431, the lower surface 421 located in the thin-walled section 423 of the main body 42, and the transition surface of the main body The transition surface 426 of the main body located in the transition section 425 and the thick section 424 of the main body 42 The main body has a bottom surface 427. The rear side 412b of the tip bottom surface 412 and the lower surface 421 In addition to the step d between the two surfaces, another step d is also formed between the bottom surface 427 of the main body and the lower surface 421. The transitional surface 426 of the main body gradually changes in height from the lower surface 421 to the bottom surface 427 of the main body. It extends while doing so. Furthermore, the main body transition surface 426 has a gradually changing transition surface 428 and a tilt It has an oblique plane 429, which is the gradually changing transition surface 432 of the tip transition surface 431 and the inclination Similar to the oblique plane 433. Tip transition surface 431, main body transition surface 426, and lower side surface Surface 421 is formed by the transition surface 543 and the first surface 541 shown in Figure 14, respectively. Therefore, the tip is formed by a surface formed by a surface sedimentation process. The surface roughness of the transition surface 431, the main body transition surface 426, and the lower surface 421 is the same as the surface roughness of the tip bottom The surface roughness of surface 412, tip top surface 411, upper surface 422, or main body bottom surface 427 is different. ru.

[0075] Thus, the contacts 40C and 40D in this embodiment are the same as the contacts 40A and 4 described above. It has the same effect as 0B. Also, the main body 42 of the contactor 40C, 40D is the contact tip 41 Because the thickness of the section away from the main body is large (i.e., thick section 424), contacts 40C, 40 The structural strength of the main body portion 42 of D is improved, and the main body portion 42 of the contacts 40C and 40D is connected to other members. Fixing it in place is advantageous for constructing a contact probe. For example, contact element 40C, In 40D, the thickened section 424 of the main body 42 is obliquely cut as shown in Figure 9 for the coaxial cable 33. By being fixed to surface 331, the contact probe 30 shown in Figure 8 can be constructed. Alternatively, the thickened section 424 of the main body portion 42 of the contacts 40C and 40D is shown in Figure 12. By being fixed to the circuit board 73, it constitutes the contact probe 70 shown in Figure 11. This is possible. In the main body 42 of the contactor 40C, 40D, the thin-walled section 423 and the thick-walled section The step d between 424 is the original step d of the substrate 50. Such contacts 40C, 40D The manufacturing method does not require micro-electromechanical technology or bending of the contactor, and the contactor 40C, The 40D is designed to have good precision, high structural strength, and a relatively long lifespan. Furthermore, between the thin-walled section 423 and the thick-walled section 424 of the main body 42, there is a main body transition section 425. The main body transition surface 426 has a gradually changing height and a lower surface 421 having a step d. The bottom surface 427 of the main body is smoothly connected, reducing stress concentration and improving structural integrity. Further improve the durability and reliability of contacts 40C and 40D.

[0076] (Fourth embodiment) As shown in Figure 17, a fourth embodiment of the present invention provides another form of contactor 40E. Here, Figure 17 shows the case where six contacts 40E are manufactured simultaneously. Six contacts 40 E is in a state where the contact tip 41 remains connected to the connecting part 62. Six contacts 40E These may be two sets of contacts shown in Figure 5, or two sets of contacts shown in Figure 15. i. That is, the main body 42 of the contactor 40E is not limited to a single thickness, but has a step d. That's good too.

[0077] Compared to the contacts 40A to D in the previously described embodiment, the contact 40E in this embodiment The difference is that the extension section 47 located between the main body section 42 and the tip section transition section 43 is further equipped The main body 42 consists of an extended section 47, a tip transition section 43, and a contact tip section It has a width wider than 41. The lower surface 421 is partially located in the extended section 47. When you change it, at the bottom side 45 of the contactor 40E (i.e., the side facing the object to be measured 23) The extended section 47 shares the same plane as the main body 42, that is, between it and the contact tip 41, It has a step d as shown in Figure 6. However, the extension section 47 is narrower than the main body section 42. The width of the gap 47 is close to the width of the contact tip 41. In contrast to the embodiment described above in which the tip transition section 43 is directly connected to the main body section 42, In this embodiment, there is an extension section 47 between the tip transition section 43 and the main body section 42. This occurs when the contact tip 41 of the contact element 40E contacts the contact pad of the object being measured. It provides great elasticity, which is advantageous for the progress of the test.

[0078] As mentioned above, the contacts 40A to E, contact probes 30, 70, and The probe systems 11 and 12 are unpackaged semiconductor devices (object under test 2 3) is used to conduct functional tests. Therefore, the present invention is used to perform the described, Testing methods for semiconductor devices that are not packaged, manufacturing methods for tested semiconductor devices, And we will also provide tested semiconductor devices.

[0079] The testing method for unpackaged semiconductor devices includes the following steps 1, 2, and 3. nothing. Step 1: At least one contact probe (for example, contact probe 30) , or a contact probe 70) is provided, and the contact probe is the aforementioned contactor ( For example, it includes multiple contacts (40A, 40B or 40C, 40D). Step 2: Contact multiple contact pads of the unpackaged semiconductor device. The child is brought into mechanical and electrical contact. Step 3: Semi-semi Tests are performed on the conductive device. Therefore, the contact probe used in this test method is as described above in the present invention. It includes a contact element, has good precision, high structural strength, and a long service life, and the packaging This can improve the accuracy and reliability of testing non-G-type semiconductor devices.

[0080] The tested semiconductor device manufacturing method includes the following steps 1, 2, and 3. Step 1: At least one contact probe (for example, contact probe 30) The contact probe (or contact probe 70) is provided. For example, it includes multiple contacts (40A, 40B or 40C, 40D). Step 2: Contact multiple contact pads of the unpackaged semiconductor device. The child is brought into mechanical and electrical contact. Step 3: Contact probes for unpackaged semiconductor devices Perform the test. Semiconductor devices manufactured using this manufacturing method have been tested. This test is conducted by the manufacturer. Using contacts made by Mei, it has good accuracy, high structural strength, a long service life, and is suitable for semiconductor equipment. This can improve the accuracy and reliability of the test results.

[0081] The tested semiconductor device had multiple contact pads 231, and at least one Contact probe (for example, contact probe 30 or contact probe 70) A test process is performed using mechanical and electrical contact via a contact probe. The B consists of multiple contacts (for example, contacts 40A, 40B or contacts 40C, 40D). The number is included. The test process is to check that the contact end 431 of the contactor makes contact with the contact pad 231. To do it by doing so.

[0082] Thus, the aforementioned semiconductor device has been tested. The test involved the contacts according to the present invention. It is used, has good accuracy, high structural strength, a long service life, and the test results of semiconductor equipment are Accuracy and reliability can be improved.

[0083] Finally, the components disclosed in the embodiments of the present invention are for illustrative purposes only. This does not limit the scope of the rights of the present invention, nor does it mean the substitution or modification of other equivalent components. It should be explained again that this should be included in the claims of the present invention. [Explanation of Symbols]

[0084] 11, 12: Probe system 21: Mounting platform 22: Substrate 23: Measured object 231: Contact pad 30: Contact probe 31: Base portion 32: Coaxial joint 33: Coaxial cable 331: Oblique cutting surface 332: Inner electrical conductor 333: Outer electrical conductor 333a, 333b: Block 334: Dielectric 335: End 40A, 40B, 40C, 40D, 40E: Contact 41: Contact tip 411: Top surface of the tip 412: Bottom surface of the tip 412a: Front side 412b: Rear side 413: Contact end 414: Plane 415, 416: Virtual line 42: Body portion 421: Lower surface 422: Upper surface 423: Thin section 424: Thick section 425: Body portion transition section 426: Body portion transition surface 427: Bottom surface of the body portion 428: Gradually changing transition surface 429: Inclined plane 43: Tip portion transition section 431: Tip portion transition surface 432: Gradually changing transition surface 433: Inclined plane 44: Top side 45: Bottom side 450: Angle 46: Cantilever segment 460: Inner obtuse angle 461: End 47: Extension section 50: Substrate 51: Thin block 52: Thick-walled block 53: Transition Block 54: Upward side 541: First surface 542:Second surface 543:Transition surface 55: Thin-walled block 56: Thick-walled block 57: Transition Block 61: Flat plate 611: Plane 62, 63: Connection part 70: Contact probe 71: Base section 72: Coaxial coupling 73: Circuit board 731: Bottom 732, 733: Electrical Conduction Circuits 735: Terminal C: Outer contour d: step

Claims

1. A contact element of a contact probe, Used in probe systems for performing functional tests on objects under test. The main body and A contact tip having a contact end used to contact the object to be measured, It comprises a tip transition section located between the main body and the contact tip, The contactor has a top side and a bottom side, and the contactor performs a functional test on the object being measured. When performing the test, the bottom side of the contact is facing the object to be measured. The bottom side of the contactor consists of the lower surface located on the main body and the tip located on the contact tip. Including the bottom surface of the part and the tip transition surface located in the tip transition section, The contact end is located on the front side of the bottom surface of the tip portion. There is a step between the rear side of the bottom surface of the tip and the lower surface, The aforementioned tip transition surface has a gradually changing height, from the lower surface to the rear of the tip bottom surface. It extends to A contact element of a contact probe characterized by the following features.

2. A contactor for a contact probe according to claim 1, The contact is formed when the substrate having the step is cut through a cutting process. A contact element of a contact probe characterized by the following features.

3. A contactor for a contact probe according to claim 1, The aforementioned tip transition surface includes at least one of a gradually changing transition surface and an inclined plane. A contact element of a contact probe characterized by the following features.

4. A contactor for a contact probe according to claim 1, The surface roughness of the lower surface and the tip transition surface differs from the surface roughness of the tip bottom surface. Naru A contact element of a contact probe characterized by the following features.

5. A contactor for a contact probe according to claim 1, The main body portion comprises a thin-walled section, a thick-walled section, and a section located between the thin-walled section and the thick-walled section. Includes the main body transition section, The lower surface is located in the thin-walled section. The bottom side of the contactor is located on the bottom surface of the main body, which is situated in the thickened section of the main body, and the The main body transition surface located in the main body transition section further includes the main body bottom surface and the lower surface There is a step between them, The transitional surface of the main body has a gradually changing height and extends from the lower surface to the bottom surface of the main body. do A contact element of a contact probe characterized by the following features.

6. A contactor for a contact probe according to claim 5, The transition surface of the main body includes at least one of a gradually changing transition surface and an inclined plane. A contact element of a contact probe characterized by the following features.

7. A contactor for a contact probe according to claim 5, The surface roughness of the lower surface, the tip transition surface, and the main body transition surface is Different from the surface roughness of the bottom of the body. A contact element of a contact probe characterized by the following features.

8. A contactor for a contact probe according to claim 1, The extension section located between the main body and the tip transition section is further provided, The main body portion is wider than the width of the extended section, the tip transition section, and the contact tip portion. It has a wide width, The lower surface is partially located within the extended section. A contact element of a contact probe characterized by the following features.

9. A contactor for a contact probe according to claim 1, The aforementioned lower surface is flat. A contact element of a contact probe characterized by the following features.

10. A contactor for a contact probe according to claim 1, The top side of the contactor is located on the upper surface of the main body and the contact tip Having a tip-shaped top surface, The tip surface is inclined with respect to the upper surface, from the upper surface to the contact tip. Extend to the end A contact element of a contact probe characterized by the following features.

11. It is a contact probe, Used in probe systems for performing functional tests on objects under test, coaxial cable A cable and the contactor described in claim 1, The coaxial cable comprises an inner electrical conductor, an outer electrical conductor, and the inner electrical conductor and Includes a dielectric material provided between the outer electrical conductors, The aforementioned contactors are multiple, Each of the aforementioned contacts has an upper surface located on the main body, Since a portion of the upper surface of each contact is fixed to the coaxial cable, Each of the contacts extends from the position where it is fixed to the coaxial cable. Passing the end of the coaxial cable, Each contact includes a cantilever segment extending from the end of the coaxial cable. fruit, The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tips of the multiple contacts are flush with each other. Among the plurality of contactors, one first contactor and at least one second contactor are included. fruit, The upper surface of the first contact is electrically connected to the inner electrical conductor of the coaxial cable. And it is fixed, The upper surface of the second contact is electrically connected to the outer electrical conductor of the coaxial cable. and fixed A contact probe characterized by the following features.

12. It is a contact probe, Used in probe systems for performing functional tests on objects under test, and circuit base The plate and the contactor described in claim 1 are provided, The circuit board includes a plurality of electrical conduction circuits, The aforementioned contactors are multiple, Each of the aforementioned contacts has an upper surface located on the main body, A portion of the upper surface of each contact is electrically connected to the electrical conduction circuit of the circuit board. Being continuous and fixed, Each of the contacts extends from the position where it is fixed to the circuit board and Passing the end of the roadbed, Each contact includes a cantilever segment extending from the end of the circuit board, The contact tip of each contact is located at the end of the cantilever segment. The bottom surfaces of the tips of the multiple contacts are flush with each other. A contact probe characterized by the following features.

13. A method for manufacturing a contactor, The aforementioned contactor is a contact probe for performing a functional test on an object to be measured. Used, The method for manufacturing the contactor is as follows: The steps include providing a substrate and The step of defining a plurality of contacts by removing a portion of the material of the substrate includes: fruit, The aforementioned substrate is Made of electrically conductive material, thin-walled block, at least one thick-walled block, and and at least Includes one transition block, The upward side of the substrate is located on the first surface of the thin-walled block and on the thick-walled block. At least one second surface to be placed, and at least one located in the transition block Includes a transition surface, The second surface is higher than the first surface. The transition surface extends from the first surface to the second surface, with its height gradually changing. death, The step of defining a plurality of contactors is: The steps include defining the contact tip portion of each contactor in the thick block of the substrate, The steps include defining the main body portion of each contact in the thin-walled block of the substrate, Based on the external contours of the multiple contacts, cutting is performed on the substrate. Includes A method for manufacturing a contactor, characterized by the above.

14. A method for manufacturing a contactor according to claim 13, The shape of the contact tip of each contact is adjusted, and from each contact tip, the tip top surface, tip The bottom surface of the part, and the part to be measured, located where the top surface of the tip and the bottom surface of the tip intersect. The process further includes the step of forming contact ends that are used to make contact with an object. A method for manufacturing a contactor, characterized by the above.

15. A method for manufacturing a contactor according to claim 13, The substrate consists of two transition blocks located on opposite sides of the thin-walled block. and includes two thick-walled blocks connected to the two transition blocks, respectively. 、 The upward side of the substrate consists of two second surfaces located in the two thick blocks. , and including two transition surfaces located in each of the two transition blocks, The step of defining a plurality of contactors is: One of the two thick blocks defines the contact tip of each contactor. Steps and In the thin-walled block and the other of the two thick-walled blocks, each of the contacts The steps include defining the main body of and A method for manufacturing a contactor, characterized by the above.

16. A method for manufacturing a contactor according to claim 13, The substrate is formed from a single flat plate through a surface sedimentation process. The first surface and at least one of the transition surfaces are formed by the surface sedimentation process. And so, The surface roughness of the first surface and at least one of the transition surfaces is at least one Unlike the surface roughness of the second surface, The surface sedimentation process removes a portion of the material from the substrate to define the multiple contacts. This takes place before the corrective step. A method for manufacturing a contactor, characterized by the above.

17. Probes used to perform functional tests on objects formed on a substrate. It is a stem, The object to be measured includes a plurality of contact pads, The probe system comprises a mounting base and a contact probe. The mounting platform is positioned to support the substrate, The contact probe includes a plurality of the contactors described in claim 1, and in front of the contactors When the contact end comes into contact with the contact pad of the object being measured, the contact pad The rope and the object to be measured are electrically connected, and a functional test is performed on the object to be measured. Used for A probe system characterized by the following features.

18. A method for testing unpackaged semiconductor devices, The present invention provides at least one contact probe comprising a plurality of the contactors described in claim 1. The steps, The contacts are placed on multiple contact pads of an unpackaged semiconductor device. The steps of making mechanical and electrical contact, A semiconductor device not packaged by at least one of the aforementioned contact probes. The steps include performing tests against A test method characterized by the following features.

19. A tested method for manufacturing a semiconductor device, The present invention provides at least one contact probe comprising a plurality of the contactors described in claim 1. The steps, Multiple contacts are connected to multiple contact pads of an unpackaged semiconductor device. The steps include making mechanical and electrical contact, A semiconductor device not packaged by at least one of the aforementioned contact probes. The steps include performing tests against A manufacturing method characterized by the following features.

20. A tested semiconductor device, Equipped with multiple contact pads, Test probes are mechanically and electrically contacted by at least one contact probe. The process is carried out. The contact probe includes a plurality of the contactors described in claim 1, The test process involves the contact ends of a plurality of contactors being connected to a plurality of contact pads This is done by making contact with the dot. A semiconductor device characterized by the following features.

Images