Liquid dispensing head and recording device

Abstract

To increase connection reliability between a discharge member and a flexible substrate.SOLUTION: A liquid discharge head includes a discharge member, a flexible substrate, and a relay substrate. The discharge member includes a plurality of nozzles for discharging a liquid, a plurality of elements for discharging the liquid from the plurality of nozzles, and a plurality of terminals electrically connected to the plurality of elements respectively. The flexible substrate includes a plurality of signal lines corresponding to the plurality of terminals. The relay substrate connects the discharge member and the flexible substrate electrically. The relay substrate includes a plurality of first pads, a plurality of second pads, and a plurality of wiring lines. The plurality of first pads are joined to the plurality of terminals of the discharge member. The plurality of second pads are joined to the plurality of signal lines of the flexible substrate. The plurality of wiring lines connect the plurality of first pads and the plurality of second pads. An area of each of the plurality of second pads is larger than an area of each of the plurality of first pads.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The disclosed embodiments relate to a liquid ejection head and a recording apparatus.

Background Art

[0002] As printing apparatuses, inkjet printers and inkjet plotters that utilize an inkjet recording method are known. Such inkjet printing apparatuses are equipped with a liquid ejection head for ejecting a liquid.

[0003] In such a liquid ejection head, for example, a plurality of individual electrodes provided on a liquid ejection member are each joined to a plurality of signal lines of a flexible substrate by an anisotropic conductive bonding material, whereby the ejection member and the flexible substrate are electrically connected.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in a conventional liquid ejection head, there is still room for further improvement in terms of improving the connection reliability between the ejection member and the flexible substrate.

[0006] One aspect of the embodiment has been made in view of the above, and an object thereof is to provide a liquid ejection head and a recording apparatus capable of improving the connection reliability between the ejection member and the flexible substrate.

Means for Solving the Problems

[0007] A liquid dispensing head according to one embodiment comprises a dispensing member, a flexible substrate, and a relay substrate. The dispensing member has a plurality of nozzles for dispensing liquid, a plurality of elements for dispensing liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements. The flexible substrate has a plurality of signal lines corresponding to the plurality of terminals. The relay substrate electrically connects the dispensing member and the flexible substrate. The relay substrate has a plurality of first pads, a plurality of second pads, and a plurality of wirings. The plurality of first pads are joined to a plurality of terminals of the dispensing member. The plurality of second pads are joined to a plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of ​​each of the plurality of second pads is larger than the area of ​​each of the plurality of first pads. [Effects of the Invention]

[0008] According to one embodiment, the connection reliability between the discharge member and the flexible substrate can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic front view showing a general front view of the printer according to this embodiment. [Figure 2] Figure 2 is a schematic plan view showing a general plan of the printer according to this embodiment. [Figure 3] Figure 3 is a schematic side view showing the internal configuration of the liquid dispensing head according to the embodiment. [Figure 4] Figure 4 is a schematic diagram showing a side cross-section of the discharge member and support substrate according to the embodiment. [Figure 5] Figure 5 is a schematic side view showing the configuration of the discharge member, relay substrate, and flexible substrate according to the embodiment. [Figure 6] Figure 6 is a schematic plan view showing an example of the configuration of the connection between the relay board and the flexible board according to the embodiment. [Figure 7] Figure 7 is a schematic plan view showing another example of the configuration of the connection between the relay board and the flexible board according to the embodiment. [Figure 8] Figure 8 is a schematic side view showing the configuration of the discharge member, relay substrate, and flexible substrate according to Modification 1. [Figure 9] Figure 9 is a schematic side view showing the configuration of the discharge member, relay substrate, and flexible substrate according to Modification 2. [Figure 10] Figure 10 is a schematic side view showing the configuration of the discharge member, relay substrate, and flexible substrate according to Modification 3. [Figure 11] Figure 11 is a schematic side view showing the configuration of the discharge member, relay substrate, and flexible substrate according to Modification 4. [Figure 12] Figure 12 is a schematic side view showing the internal configuration of the liquid discharge head according to Modification 5. [Figure 13] Figure 13 is a schematic side view showing the internal structure of the liquid dispensing head according to Modification 6. [Figure 14] Figure 14 is a schematic side view showing the internal configuration of the liquid discharge head according to Modification 7. [Figure 15] Figure 15 is a schematic plan view showing an example of the placement of the relay board. [Modes for carrying out the invention]

[0010] The embodiments of the liquid dispensing head and recording device disclosed herein will be described below with reference to the attached drawings. However, the embodiments described below do not limit this disclosure. Furthermore, it should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from reality. Additionally, there may be differences in dimensional relationships and ratios between different parts of the drawings.

[0011] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "constant," "orthogonal," "perpendicular," or "parallel" conditions. In other words, each of the above expressions allows for deviations such as manufacturing accuracy or installation accuracy.

[0012] Also, each embodiment can be appropriately combined within a range that does not conflict with the processing content. Also, in the following embodiments, the same parts are denoted by the same reference numerals, and redundant descriptions are omitted.

[0013] <Configuration of Printer> First, referring to FIGS. 1 and 2, an overview of a printer 1, which is an example of a recording apparatus according to an embodiment, will be described. FIG. 1 is a front view schematically showing a schematic front of the printer 1 according to the embodiment. FIG. 2 is a plan view schematically showing a schematic plan of the printer 1 according to the embodiment. The printer 1 according to the embodiment is, for example, a color inkjet printer.

[0014] As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, an applicator 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, a transport roller 11, a sensor unit 12, and a recovery roller 13. The transport roller 6 is an example of a transport unit.

[0015] Furthermore, the printer 1 has a control unit 14 that controls each part of the printer 1. The control unit 14 controls the operations of the paper feed roller 2, the guide roller 3, the applicator 4, the head case 5, the plurality of transport rollers 6, the plurality of frames 7, the plurality of liquid ejection heads 8, the transport roller 9, the dryer 10, the transport roller 11, the sensor unit 12, and the recovery roller 13.

[0016] The printer 1 records an image or characters on the printing paper P by landing droplets on the printing paper P. The printing paper P is an example of a recording medium. The printing paper P is in a state of being wound around the paper feed roller 2 before use. The printer 1 transports the printing paper P from the paper feed roller 2 through the guide roller 3 and the applicator 4 into the head case 5.

[0017] The coating machine 4 uniformly applies the coating agent to the printing paper P. This allows the printing paper P to undergo surface treatment, thereby improving the print quality of the printer 1.

[0018] The head case 5 houses multiple transport rollers 6, multiple frames 7, and multiple liquid discharge heads 8. Inside the head case 5, a space is formed that is isolated from the outside, except for some parts such as the area where the printing paper P enters and exits.

[0019] The internal space of the head case 5 is controlled by the control unit 14, as needed, by at least one of the control factors such as temperature, humidity, and atmospheric pressure. The transport rollers 6 transport the printing paper P within the head case 5 to the vicinity of the liquid ejection head 8.

[0020] The frame 7 is a rectangular flat plate positioned close above the printing paper P being transported by the transport rollers 6. Furthermore, as shown in Figure 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the transport direction of the printing paper P. Inside the head case 5, multiple (for example, four) frames 7 are positioned at predetermined intervals along the transport direction of the printing paper P.

[0021] The liquid ejection head 8 is supplied with a liquid, such as ink, from a liquid tank (not shown). The liquid ejection head 8 ejects the liquid supplied from the liquid tank.

[0022] The control unit 14 controls the liquid ejection head 8 based on data such as images and characters, and ejects liquid toward the printing paper P. The distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.

[0023] The liquid dispensing head 8 is fixed to the frame 7. The liquid dispensing head 8 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is transported.

[0024] In other words, the printer 1 according to this embodiment is a so-called line printer in which a liquid ejection head 8 is fixed inside the printer 1. However, the printer 1 according to this embodiment is not limited to a line printer, and may be a so-called serial printer.

[0025] A serial printer is a type of printer that alternates between recording data while moving a liquid ejection head 8 in a direction intersecting the transport direction of the printing paper P, for example, in a nearly perpendicular direction, and transporting the printing paper P.

[0026] As shown in Figure 2, multiple (for example, five) liquid discharge heads 8 are fixed to a single frame 7. Figure 2 shows an example where three liquid discharge heads 8 are located in front of the printing paper P in the transport direction and two are located behind it, and the liquid discharge heads 8 are positioned so that the centers of each liquid discharge head 8 do not overlap in the transport direction of the printing paper P.

[0027] A head group 8A is formed by multiple liquid ejection heads 8 located on a single frame 7. The four head groups 8A are positioned along the transport direction of the printing paper P. Four colors of ink are supplied to the liquid ejection heads 8 belonging to the same head group 8A. As a result, the printer 1 can perform printing with four colors of ink using the four head groups 8A.

[0028] The ink colors ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 controls each liquid ejection head 8 to eject multiple colors of ink onto the printing paper P, thereby enabling the printing of a color image on the printing paper P.

[0029] Furthermore, in order to treat the surface of the printing paper P, a coating agent may be dispensed onto the printing paper P from the liquid ejection head 8.

[0030] Furthermore, the number of liquid ejection heads 8 included in one head group 8A, and the number of head groups 8A installed in printer 1, can be changed as appropriate depending on the object to be printed and the printing conditions. For example, if the printing is limited to the area that can be printed with one liquid ejection head 8, then printer 1 may only have one liquid ejection head 8 installed.

[0031] The printed paper P, which has been processed inside the head case 5, is transported to the outside of the head case 5 by the transport roller 9 and passes through the inside of the dryer 10. The dryer 10 dries the printed paper P. The dried printed paper P is transported by the transport roller 11 and collected by the recovery roller 13.

[0032] In printer 1, drying the printing paper P in the dryer 10 prevents the overlapping printing paper P from sticking together or from being rubbed by the recovery roller 13.

[0033] The sensor unit 12 is composed of position sensors, speed sensors, temperature sensors, and the like. The control unit 14 can determine the state of each part of the printer 1 based on the information from the sensor unit 12 and control each part of the printer 1.

[0034] The printer 1 described so far has shown the case where printing paper P is used as the printing target (i.e., the recording medium), but the printing target in printer 1 is not limited to printing paper P; a roll of cloth or other material may also be used as the printing target.

[0035] Alternatively, the printer 1 may transport the printing paper P on a conveyor belt instead of directly transporting it. By using a conveyor belt, the printer 1 can print on sheets of paper, cut cloth, wood, tiles, etc.

[0036] The printer 1 may also print wiring patterns for electronic devices by ejecting a liquid containing conductive particles from the liquid ejection head 8. Alternatively, the printer 1 may produce chemical products by ejecting a predetermined amount of liquid chemical agent or a liquid containing a chemical agent from the liquid ejection head 8 toward a reaction vessel or the like.

[0037] The printer 1 may also include a cleaning unit for cleaning the liquid ejection head 8. The cleaning unit cleans the liquid ejection head 8, for example, by wiping or capping.

[0038] Wiping is a process that removes liquid adhering to the liquid discharge head 8 by wiping the surface of the part where the liquid is discharged with a flexible wiper, for example.

[0039] Furthermore, the capping process is carried out, for example, as follows: First, a cap is placed over the part from which the liquid is discharged, for example, the second surface 20b of the discharge member 20 (see Figure 3) (this is called capping). This creates a substantially sealed space between the second surface 20b and the cap.

[0040] Next, the liquid is repeatedly discharged in this sealed space. This removes any liquid with a higher viscosity than standard, as well as foreign matter, that may have been clogging the discharge port (nozzle) 163 (see Figure 4).

[0041] <Configuration of the liquid dispensing head> Next, the configuration of the liquid discharge head 8 according to the embodiment will be described with reference to Figure 3. Figure 3 is a schematic side view showing the internal configuration of the liquid discharge head 8 according to the embodiment. In Figure 3, a side view perpendicular to the longitudinal direction of the liquid discharge head 8 is shown.

[0042] The liquid dispensing head 8 comprises a dispensing member 20, a support substrate 30, a relay substrate 40, a flexible substrate 50, a drive IC 60, and a liquid supply member (not shown). The dispensing member 20, support substrate 30, relay substrate 40, flexible substrate 50, drive IC 60, and liquid supply member are housed in a housing (not shown).

[0043] In the following explanation, for convenience, the direction in which the discharge member 20 is provided in the liquid discharge head 8 may be referred to as "down," and the direction in which the support substrate 30 is provided relative to the discharge member 20 may be referred to as "up."

[0044] The discharge member 20 is substantially flat in shape and has a first surface 20a and a second surface 20b located on the opposite side of the first surface 20a. The first surface 20a has an opening (not shown), and liquid is supplied to the inside of the discharge member 20 from the support substrate 30 through this opening.

[0045] The second surface 20b has multiple discharge holes 22 (see Figure 4) for discharging liquid onto the printing paper P. The discharge member 20 has a flow path inside that allows liquid to flow from the first surface 20a to the second surface 20b.

[0046] The discharge member 20 has a plurality of displacement elements 23 (see Figure 4). The plurality of displacement elements 23 are located on the first surface 20a of the discharge member 20.

[0047] The support substrate 30 is located on the first surface 20a of the discharge member 20. The support substrate 30 has a flow path inside and supplies liquid supplied from the liquid supply member to the discharge member 20. In addition, the support substrate 30 has a predetermined thickness that is greater than the discharge member 20 and has the function of reinforcing the discharge member 20.

[0048] A liquid supply member is located on the support substrate 30. The liquid supply member has openings (not shown) at both ends in the main scanning direction, which is perpendicular to the sub-scanning direction, which is the transport direction of the printing paper P, and parallel to the printing paper P. The liquid supply member has a flow path inside, and liquid is supplied from the outside through the openings. The liquid supply member supplies liquid to the support substrate 30. The liquid supply member also stores the liquid supplied to the support substrate 30.

[0049] The relay board 40 is located at two positions on the first surface 20a of the discharge member 20, flanking the support board 30. One end of the relay board 40 is electrically connected to the discharge member 20, and the other end is electrically connected to the flexible board 50. The relay board 40 has the function of relaying signals transmitted by the flexible board 50 to the discharge member 20. The relay board 40 is lower in height from the first surface 20a of the discharge member 20 than the support board 30. This reduces the possibility of interference between the relay board 40 and the liquid supply member when the liquid supply member is installed on the support board 30, thereby improving the flexibility of the layout of the liquid supply member.

[0050] The flexible circuit board 50 is a flexible wiring board that transmits signals sent from the outside to the relay board 40. One end of the flexible circuit board 50 is electrically connected to the relay board 40, and the other end of the flexible circuit board 50 is extended above the support board 30 and is electrically connected to a wiring board (not shown).

[0051] The drive IC 60 is mounted on the flexible substrate 50. Based on the drive signals sent from the control unit 14 (see Figure 1), the drive IC 60 drives each displacement element 23 in the discharge member 20. This allows the drive IC 60 to control the drive of the liquid discharge head 8.

[0052] Note that Figure 3 shows an example of the configuration of the liquid dispensing head 8, and may include other components besides those shown in Figure 3.

[0053] <Configuration of the discharge member and support substrate> Next, the configuration of the discharge member 20 and support substrate 30 according to the embodiment will be described with reference to Figure 4. Figure 4 shows a side cross-section of the discharge member 20 and support substrate 30 according to the embodiment. This is a schematic diagram illustrating this.

[0054] As shown in Figure 4, the discharge member 20 has a plurality of pressurizing chambers 21, a plurality of discharge holes 22, a plurality of displacement elements 23, and a plurality of terminals 24.

[0055] Multiple pressurized chambers 21 are each connected to multiple flow channels 31 in the support substrate 30. Multiple discharge holes 22 are each connected to multiple pressurized chambers 21. Multiple displacement elements 23 are located on the first surface 20a of the discharge member 20, at multiple positions corresponding to each of the multiple pressurized chambers 21.

[0056] Multiple terminals 24 are located on the first surface 20a of the discharge member 20, sandwiching the support substrate 30. Each of the multiple terminals 24 is electrically connected to each of the multiple displacement elements 23 via electrodes and wiring (not shown). Multiple signal lines on the flexible substrate 50 are electrically connected to each of these terminals 24. When a signal transmitted by the flexible substrate 50 is input from the terminals 24 to the displacement element 23, the displacement element 23 is displaced.

[0057] The support substrate 30 is located on the first surface 20a of the discharge member 20. The support substrate 30 has multiple spaces on its lower surface for housing multiple displacement elements 23. The support substrate 30 has multiple flow channels 31 inside. Each of the multiple flow channels 31 is connected to a multiple pressurized chamber 21. The multiple flow channels 31 open to the upper surface of the support substrate 30. A liquid supply member (not shown) is located on the upper surface of the support substrate 30. The multiple flow channels 31 are connected to the liquid supply member.

[0058] Then, liquid is supplied from the liquid supply member to the inside of the discharge member 20 via the flow path 31, and the corresponding displacement element 23 is displaced, which pressures the pressurizing chamber 21 and discharges the liquid from the discharge hole 22. In other words, the multiple displacement elements 23 function as multiple elements that discharge liquid from the multiple discharge holes 22.

[0059] As shown in Figure 4, the discharge member 20 has a laminated structure in which a nozzle plate 20A and an actuator plate 20B are stacked. The nozzle plate 20A is provided with a plurality of discharge holes 22. The actuator plate 20B is provided with a plurality of pressurizing chambers 21, a plurality of displacement elements 23, and a plurality of terminals 24. By aligning and stacking the nozzle plate 20A and the actuator plate 20B, the plurality of pressurizing chambers 21 and the plurality of discharge holes 22 communicate with each other to form the discharge member 20.

[0060] <Connection configuration of discharge member, relay substrate and flexible substrate> Next, the connection configuration of the discharge member 20, the relay substrate 40, and the flexible substrate 50 will be described with reference to Figures 5 and 6. Figure 5 is a schematic side view showing the configuration of the discharge member 20, the relay substrate 40, and the flexible substrate 50 according to the embodiment. Figure 6 is a schematic plan view showing an example of the configuration of the connection between the relay substrate 40 and the flexible substrate 50 according to the embodiment. In Figure 6, the lower surface of the relay substrate 40 (i.e., the surface facing the discharge member 20) is shown.

[0061] As shown in Figure 5, multiple terminals 24 (see Figure 4) are located on the first surface 20a of the discharge member 20, and multiple signal lines 51 (see Figure 6) corresponding to the multiple terminals 24 are located on the surface of the flexible substrate 50. One end of the relay substrate 40 is connected to the multiple terminals 24 of the discharge member 20, and the other end of the relay substrate 40 is connected to the multiple signal lines 51 of the flexible substrate 50. Specifically, multiple first pads 41 (see Figure 6) are formed on one end of the relay substrate 40, and these multiple first pads 41 and the multiple terminals 24 of the discharge member 20 are joined by a conductive bonding material 401. In addition, multiple second pads 42 (see Figure 6) are formed on the other end of the relay substrate 40, and these multiple second pads 42 and the multiple signal lines 51 of the flexible substrate 50 are joined by a conductive bonding material 402. The multiple first pads 41 and the multiple second pads 42 are connected to each other by multiple wirings 43. For example, an anisotropic conductive film (ACF) can be used as the conductive bonding material 401, 402.

[0062] As shown in Figure 6, in the relay board 40, the area of ​​each of the multiple second pads 42 is larger than the area of ​​each of the multiple first pads 41. By increasing the area of ​​each of the multiple second pads 42 that are joined to the multiple signal lines 51 of the flexible board 50, connection failures between the flexible board 50 and the relay board 40 can be suppressed. That is, when connecting the flexible board 50 to the relay board 40, a mechanical load is applied to the signal lines 51 from the second pads 42 as the flexible board 50 bends, but by increasing the area of ​​the second pads 42, the mechanical load on the signal lines 51 can be reduced. Also, when connecting the flexible board 50 to the relay board 40, the conductive bonding material 402 is melted by heating, causing thermal expansion of the flexible board 50, which can easily cause misalignment of the signal lines 51 from the second pads 42. Even in such cases, by increasing the area of ​​the second pads 42, electrical connection between the second pads 42 and the signal lines 51 can be ensured even if the signal lines 51 are misaligned. Since connection failures between the flexible substrate 50 and the relay substrate 40 can be suppressed, the relay substrate 40 can stably connect the flexible substrate 50 and the discharge member 20. As a result, the liquid discharge head 8 according to this embodiment can improve the reliability of the connection between the discharge member 20 and the flexible substrate 50. The areas of the first pad 41 and the second pad 42 are the planar area of ​​the relay substrate 40 when viewed from above.

[0063] Furthermore, the multiple second pads 42 are positioned in multiple (in this case, two) regions 421 that are aligned along the direction from one end of the relay substrate 40 towards the other end on the discharge member 20 side (hereinafter referred to as the "first direction"), and are not adjacent to each other in the second direction that intersects with the first direction. This allows the size of the second pads 42 along the second direction to be increased within the range where the second pads 42 do not interfere with each other, thereby increasing the area of ​​the second pads 42.

[0064] Furthermore, as shown in Figures 5 and 6, the multiple first pads 41, the multiple second pads 42, and the multiple wirings 43 are located on the lower surface of the relay substrate 40 facing the discharge member 20. By having the multiple first pads 41, the multiple second pads 42, and the multiple wirings 43 located on the same plane on the lower surface of the relay substrate 40, the length of the multiple wirings 43 can be minimized, thereby reducing the electrical resistance of the relay substrate 40.

[0065] In Figure 6, an example is shown where the area of ​​the second pads 42 is increased by positioning multiple second pads 42 so that they are not adjacent to each other. However, the structure for increasing the area of ​​the second pads 42 in the relay board 40 is not limited to this. For example, as shown in Figure 7, the area of ​​the second pads 42 may be increased by performing a pitch conversion on multiple wirings 43 on the relay board 40. Figure 7 is a schematic plan view showing another example of the configuration of the connection between the relay board 40 and the flexible board 50 according to the embodiment. The multiple wirings 43 shown in Figure 7 have their pitch converted on the relay board 40, so that the pitch (spacing) between the wirings 43 is small on the side of the multiple first pads 41, but the pitch (spacing) is large on the side of the multiple second pads 42. As a result, the size of the second pads 42 along the second direction can be increased within the range where the second pads 42 do not interfere with each other, thereby increasing the area of ​​the second pads 42.

[0066] <Manufacturing method for liquid dispensing heads> Next, a method for manufacturing the liquid dispensing head 8 according to the embodiment will be described. First, a support substrate 30 is placed on the first surface 20a of the dispensing member 20. Then, the nozzle plate 20A and the actuator plate 20B are aligned and stacked to create a stacked structure of the dispensing member 20. Next, the relay substrate 40 and the dispensing member 20 are electrically connected by joining the plurality of first pads 41 of the relay substrate 40 and the plurality of terminals 24 of the dispensing member 20 with a conductive bonding material 401. Next, the relay substrate 40 and the flexible substrate 50 are electrically connected by joining the plurality of second pads 42 of the relay substrate 40 and the plurality of signal lines 51 of the flexible substrate 50 with a conductive bonding material 402. After that, a liquid supply member is placed on the support substrate 30, and the dispensing member 20 and other components (and other components as needed) are housed in a housing. This gives rise to the liquid dispensing head 8 according to the embodiment.

[0067] <Various variations> Figure 8 is a schematic side view showing the configuration of the discharge member 20, relay board 40, and flexible board 50 according to Modification 1. The flexible board 50 shown in Figure 8 does not have a drive IC 60 mounted on it, and the drive IC 60 is located on the lower surface of the relay board 40 (i.e., the surface facing the discharge member 20). By positioning the drive IC 60 on the lower surface of the relay board 40 in this way, the wiring length between the drive IC 60 and the discharge member 20 can be shortened, thereby reducing the resistance loss between the drive IC 60 and the discharge member 20. In addition, the possibility of disconnection between the drive IC 60 and the discharge member 20 can be reduced, thereby improving the connection reliability between the drive IC 60 and the discharge member 20.

[0068] In Figure 8, a heat dissipation member may be provided on the upper surface of the relay board 40 opposite to the drive IC 60. This improves the heat dissipation of the drive IC 60. The heat dissipation member may be a heat fin, a Peltier element, or the like. The drive IC 60 may also be covered with a protective cover. This prevents the liquid discharged from the discharge member 20 from adhering to the drive IC 60.

[0069] Figure 9 is a schematic side view showing the configuration of the discharge member 20, relay board 40, and flexible board 50 according to Modification 2. In the relay board 40 shown in Figure 9, a plurality of first pads 41 are located on the lower surface of the relay board 40 facing the discharge member 20. A plurality of second pads 42 are located on the upper surface of the relay board. A plurality of wires 43 are routed through the side surface of the relay board 40 to the upper and lower surfaces of the relay board 40. In this way, by having a plurality of first pads 41 and a plurality of second pads 42 located on the lower and upper surfaces of the relay board 40, the discharge member 20 and the flexible board 50 can be electrically connected on different surfaces of the relay board 40. As a result, even if the width of the relay board 40 from one end to the other on the discharge member 20 side is reduced, interference between the discharge member 20 and the flexible board 50 is avoided, thus promoting miniaturization of the liquid discharge head 8.

[0070] In Figure 9, the multiple wires 43 may be positioned to penetrate the lower and upper surfaces of the relay board 40. This allows the length of the multiple wires 43 to be shortened, thereby reducing the electrical resistance in the relay board 40.

[0071] Figure 10 is a schematic side view showing the configuration of the discharge member 20, relay substrate 40, and flexible substrate 50 according to Modification 3. Modification 3 differs from Modification 2 in the structure of the relay substrate 40. In the relay substrate 40 shown in Figure 10, the multiple second pads 42 are positioned to overlap with the multiple first pads 41 in a plan view. This minimizes the width of the relay substrate 40 from one end to the other on the discharge member 20 side, further promoting miniaturization of the liquid discharge head 8.

[0072] Figure 11 is a schematic side view showing the configuration of the discharge member 20, relay board 40, and flexible board 50 according to Modification 4. The flexible board 50 shown in Figure 11 does not have a drive IC 60 mounted on it, and the drive IC 60 is located on the upper surface of the relay board 40 (i.e., the surface opposite to the surface facing the discharge member 20). By positioning the drive IC 60 on the upper surface of the relay board 40 in this way, the drive IC 60 can be protected from the liquid discharged from the discharge member 20.

[0073] Figure 12 is a schematic side view showing the internal configuration of the liquid discharge head 8 according to Modification 5. The liquid discharge head 8 shown in Figure 12 differs from the liquid discharge head 8 shown in Figure 3 in the structure of the relay substrate 40. As shown in Figure 12, the relay substrate 40 and the support substrate 30 are located on the discharge member 20, and the height of the relay substrate 40 from the first surface 20a of the discharge member 20 is greater than that of the support substrate 30. In other words, the thickness of the relay substrate 40 is greater than that of the support substrate 30. By increasing the thickness of the relay substrate 40 in this way, the strength of the relay substrate 40 can be improved. Furthermore, when installing the liquid supply member on the support substrate 30, the relay substrate 40 can be used as a buffer to mitigate the load applied from the liquid supply member to the support substrate 30.

[0074] Figure 13 is a schematic side view showing the internal structure of the liquid dispensing head 8 according to Modification 6. The liquid dispensing head 8 shown in Figure 13 differs from the liquid dispensing head 8 shown in Figure 3 in that the relay substrate 40 (see Figure 6) and the support substrate 30 are integrated. In other words, the relay substrate 40 and the support substrate 30 may be formed from the same material. In the example of the liquid dispensing head 8 according to Modification 6, the support substrate 30, which has the function of the relay substrate 40, is located on the dispensing member 20. By integrating the relay substrate 40 and the support substrate 30 in this way, the gap between the relay substrate 40 and the support substrate 30 is eliminated, which promotes miniaturization of the liquid dispensing head 8.

[0075] Figure 14 is a schematic side view showing the internal configuration of the liquid discharge head 8 according to Modification 7. The liquid discharge head 8 shown in Figure 14 differs from the liquid discharge head 8 shown in Figure 13 in that the drive IC 60 is located on the lower surface of the support substrate 30 (i.e., the surface facing the discharge member 20). By positioning the drive IC 60 on the lower surface of the support substrate 30 in this way, the wiring length between the drive IC 60 and the discharge member 20 can be shortened, thereby reducing the resistance loss between the drive IC 60 and the discharge member 20. Furthermore, the possibility of disconnection between the drive IC 60 and the discharge member 20 can be reduced, thereby improving the connection reliability between the drive IC 60 and the discharge member 20.

[0076] In Figure 14, the drive IC 60 may be located on the upper surface of the support substrate 30 (i.e., the surface opposite to the surface facing the discharge member 20). By positioning the drive IC 60 on the upper surface of the support substrate 30 in this way, the drive IC 60 can be protected from the liquid discharged from the discharge member 20.

[0077] Furthermore, in Figure 14, the drive IC 60 may be formed from a low-temperature polysilicon (LTPS) film. This allows for miniaturization of the drive IC 60.

[0078] <Other variations> In the above-described embodiment, an example was shown in which the relay substrate 40 is positioned at two locations on the first surface 20a of the discharge member 20, flanking the support substrate 30. However, the position of the relay substrate 40 is not limited to this. For example, as shown in Figure 15, the relay substrate 40 may be positioned to surround the support substrate 30 on the first surface 20a of the discharge member 20. That is, the shape of the relay substrate 40 may be a rectangular frame shape surrounding the support substrate 30 on the first surface 20a of the discharge member 20. This can improve the strength of the relay substrate 40. Figure 15 is a schematic plan view showing an example of the position of the relay substrate 40. In Figure 15, the discharge member 20, support substrate 30, and relay substrate 40 are shown as viewed from the first surface 20a side.

[0079] As described above, the liquid discharge head according to the embodiment (for example, liquid discharge head 8) comprises a discharge member (for example, discharge member 20), a flexible substrate (for example, flexible substrate 50), and a relay substrate (for example, relay substrate 40). The discharge member has a plurality of nozzles for discharging liquid (for example, discharge holes 22), a plurality of elements (for example, displacement elements 23) that discharge liquid from the plurality of nozzles, and a plurality of terminals (for example, terminals 24) electrically connected to each of the plurality of elements. The flexible substrate has a plurality of signal lines (for example, signal lines 51) corresponding to the plurality of terminals. The relay substrate electrically connects the discharge member and the flexible substrate. The relay substrate has a plurality of first pads (for example, first pads 41), a plurality of second pads (for example, second pads 42), and a plurality of wirings (for example, wirings 43). The plurality of first pads are joined to a plurality of terminals of the discharge member. The plurality of second pads are joined to a plurality of signal lines of the flexible substrate. The plurality of wirings connect the plurality of first pads and the plurality of second pads. The area of ​​each of the multiple second pads is larger than the area of ​​each of the multiple first pads. As a result, according to the liquid discharge head of the embodiment, the reliability of the connection between the discharge member and the flexible substrate can be improved.

[0080] Furthermore, the multiple second pads may be positioned in multiple regions (for example, region 421) aligned along a first direction extending from one end to the other end of the relay substrate on the discharge member side, such that they are not adjacent to each other in a second direction intersecting the first direction. This allows the liquid discharge head according to the embodiment to have a larger area for the second pads.

[0081] Furthermore, the relay board may have multiple wirings with larger spacing between them at the other end connected to the multiple second pads than at the one end connected to the multiple first pads. This allows the liquid discharge head according to the embodiment to have a larger area for the second pads.

[0082] Furthermore, the relay substrate may have a first surface (e.g., a bottom surface) facing the dispensing member and a second surface (e.g., a top surface) located opposite the first surface. Multiple first pads, multiple second pads, and multiple wirings may be located on the first surface. As a result, according to the liquid dispensing head of the embodiment, the length of the multiple wirings can be minimized, and the electrical resistance in the relay substrate can be reduced.

[0083] Furthermore, the liquid dispensing head may further include a drive IC (e.g., drive IC 60) that controls the driving of the dispensing member. The drive IC may be located on the first surface. As a result, according to the liquid dispensing head of this embodiment, resistance loss between the drive IC and the dispensing member can be reduced. In addition, the connection reliability between the drive IC and the dispensing member can be improved.

[0084] Furthermore, the relay substrate may have a first surface facing the discharge member, a second surface located opposite the first surface, and a side surface connecting the first and second surfaces. Multiple first pads may be located on the first surface. Multiple second pads may be located on the second surface. Multiple wiring may be routed through the side surface to the first and second surfaces, or may be located through the first and second surfaces. As a result, with the liquid discharge head according to this embodiment, even if the width of the relay substrate from one end to the other on the discharge member side is reduced, interference between the discharge member and the flexible substrate is avoided, thereby promoting miniaturization of the liquid discharge head.

[0085] Furthermore, the multiple second pads may be positioned so as to overlap with the multiple first pads in a plan view. As a result, according to the embodiment of the liquid discharge head, the width from one end to the other on the discharge member side of the relay substrate can be minimized, further promoting miniaturization of the liquid discharge head.

[0086] Furthermore, the liquid dispensing head may further include a drive IC (e.g., drive IC 60) that controls the driving of the dispensing member. The drive IC may be located on the second surface. This allows the liquid dispensing head according to the embodiment to protect the drive IC from the liquid dispensed from the dispensing member.

[0087] Furthermore, the liquid discharge head may further include a support substrate (e.g., support substrate 30) located above the discharge member and having a channel (e.g., channel 31) through which the liquid supplied to the discharge member flows. This allows the liquid discharge head according to the embodiment to supply liquid to the discharge member while reinforcing the discharge member with the support substrate.

[0088] Furthermore, the relay substrate may be positioned above the discharge member. The relay substrate may also be lower in height from the discharge member than the support substrate. As a result, with the liquid discharge head according to this embodiment, the possibility of interference between the relay substrate and the liquid supply member when the liquid supply member is installed on the support substrate can be reduced, thereby improving the flexibility of the layout of the liquid supply member.

[0089] Furthermore, the relay substrate may be positioned above the discharge member. The relay substrate may also be higher than the support substrate in relation to the discharge member. This allows for improved strength of the relay substrate according to the liquid discharge head of this embodiment. Additionally, when installing the liquid supply member on the support substrate, the relay substrate can be used as a buffer to mitigate the load applied from the liquid supply member to the support substrate.

[0090] Furthermore, the relay substrate and the support substrate may be integrated. As a result, with the liquid dispensing head according to this embodiment, the gap between the relay substrate and the support substrate is eliminated, which promotes miniaturization of the liquid dispensing head.

[0091] Furthermore, the support substrate may have a first surface (e.g., a bottom surface) facing the dispensing member and a second surface (e.g., a top surface) located opposite the first surface. The liquid dispensing head may further include a drive IC that controls the driving of the dispensing member. The drive IC may be located on the first surface or the second surface. As a result, according to the liquid dispensing head of this embodiment, resistance loss between the drive IC and the dispensing member can be reduced. Connection reliability between the drive IC and the dispensing member can also be improved. In addition, the drive IC can be protected from the liquid dispensed from the dispensing member.

[0092] Furthermore, the drive IC may be formed from a low-temperature polysilicon film. This allows for miniaturization of the drive IC according to the liquid discharge head of this embodiment.

[0093] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and equivalents. [Explanation of Symbols]

[0094] 1. Printer 8 liquid dispensing heads 14 Control Unit 20 Discharge member 21 Pressurized chamber 22 Discharge hole 23 Displacement element 24 terminals 30 Support boards 31 Flow channels 40 Intermediate board 41 First pad 42 Second pad 43 Wiring 50 Flexible circuit boards 51 Signal Line 60 drive ICs 421 area

Claims

1. A discharge member having a discharge hole and an element for discharging liquid from the discharge hole, A first wiring board electrically connected to the discharge member, A second wiring board electrically connected to the first wiring board, The electronic components mounted on the second wiring board, Equipped with, The first wiring board is, A first connection portion connected to the discharge member, The second connection part connected to the second wiring board, Wiring connecting the first connection part and the second connection part, It has, The first connection portion and the second connection portion are located on the same plane of the first wiring board. The electronic component is located between the second wiring board and the discharge member when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole. Liquid dispensing head.

2. A discharge member having a discharge hole and an element for discharging liquid from the discharge hole, A first wiring board electrically connected to the discharge member, A second wiring board electrically connected to the first wiring board, Equipped with, The first wiring board is, A first connection portion connected to the discharge member, The second connection part connected to the second wiring board, Wiring connecting the first connection part and the second connection part, It has, The first connection portion and the second connection portion are located on the same plane of the first wiring board. The surface of the second wiring board that connects to the second connection portion includes a portion that extends in a direction intersecting with the surface of the discharge member having the discharge hole. Liquid dispensing head.

3. A discharge member having a discharge hole and an element for discharging liquid from the discharge hole, A first wiring board electrically connected to the discharge member, A second wiring board electrically connected to the first wiring board, The electronic components mounted on the second wiring board, Equipped with, The first wiring board is, A first connection portion connected to the discharge member, The second connection part connected to the second wiring board, Wiring connecting the first connection part and the second connection part, It has, The first connecting portion, when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole, does not overlap with the element. The electronic component is located between the second wiring board and the ejection member when viewed from the vertical direction. Liquid dispensing head.

4. A discharge member having a discharge hole and an element for discharging liquid from the discharge hole, A first wiring board electrically connected to the discharge member, A second wiring board electrically connected to the first wiring board, Equipped with, The first wiring board is, A first connection portion connected to the discharge member, The second connection part connected to the second wiring board, Wiring connecting the first connection part and the second connection part, It has, The first connecting portion, when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole, does not overlap with the element. The surface of the second wiring board that connects to the second connection portion includes a portion that extends in a direction intersecting with the surface of the discharge member having the discharge hole. Liquid dispensing head.

5. The first wiring board, when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole, does not overlap with the element. The liquid dispensing head according to claim 3 or 4.

6. The discharge member has a first end region and a second end region, The element is located between the first end region and the second end region when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole. The first connection portion is connected to the first end region. The liquid dispensing head according to claim 3 or 4.

7. The first connection portion has a plurality of first pads, The second connection portion has a plurality of second pads, The area of ​​any second pad among the plurality of second pads is larger than the area of ​​any first pad among the plurality of first pads. A liquid dispensing head according to any one of claims 1 to 4.

8. The second wiring board further comprises electronic components mounted on it, The discharge member further has a discharge surface having the discharge hole, The height of the electronic component from the ejection surface is greater than the height of the first wiring board from the ejection surface. A liquid dispensing head according to any one of claims 1 to 4.

9. When viewed from a direction perpendicular to the surface of the ejection member having the ejection hole, the electronic component overlaps the first wiring board. A liquid dispensing head according to claim 1 or 3.

10. The second wiring board further comprises electronic components mounted on it, The electronic component is mounted on one of the two sides of the second wiring board, the side that is connected to the first wiring board. A liquid dispensing head according to any one of claims 1 to 4.

11. The electronic component is such that, when viewed from a direction perpendicular to the surface of the discharge member having the discharge hole, it does not overlap with the discharge member. The liquid dispensing head according to claim 10.

12. The first connection portion has a plurality of first pads, The second connection portion has a plurality of second pads, The plurality of second pads are arranged in a plurality of regions aligned along a first direction from one end to the other end of the first wiring board on the discharge member side, and are positioned so as not to be adjacent to each other in a second direction intersecting the first direction. A liquid dispensing head according to any one of claims 1 to 4.

13. The first connection portion has a plurality of first pads, The second connection portion has a plurality of second pads, The wiring has multiple wires connecting the plurality of first pads and the plurality of second pads, The first wiring board has a greater spacing between the wirings connected to the plurality of second pads than the spacing between the wirings connected to the plurality of first pads. A liquid dispensing head according to any one of claims 1 to 4.

14. The system further comprises a support substrate located above the discharge member and having a channel through which the liquid supplied to the discharge member flows. A liquid dispensing head according to any one of claims 1 to 4.

15. The second wiring board further comprises electronic components mounted on it, The discharge member further has a discharge surface having the discharge hole, The height of the electronic component from the ejection surface is greater than the height of the support substrate from the ejection surface. The liquid dispensing head according to claim 14.

16. A recording device comprising a liquid dispensing head according to any one of claims 1 to 4.

Images