Electronic component handling equipment and electronic component testing equipment

Abstract

To provide an electronic component handling device with improved response and capability to prevent heater damage.SOLUTION: A handler 3 for handling a DUT 300 comprises a pusher 6 for electrically connecting the DUT 300 to a socket 2 by pressing the DUT 300 against the socket 2, the pusher 6 comprising a temperature adjustment device 7 for adjusting temperature of the DUT 300. The temperature adjustment device 7 comprises a heater unit 71 acting as a heat source, the heater unit 71 comprising a planer heater 72, a first heat transfer material 73 disposed on a first principal surface 721a of the planar heater 72 and a second heat transfer material 74 disposed on a second principal surface 721b of the planar heater 72.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic component handling device and an electronic component testing device used for testing electronic components under test (hereinafter simply referred to as "DUT" (Device Under Test)) such as semiconductor integrated circuit elements. [Background technology]

[0002] The electronic component testing apparatus is equipped with a handler for transporting the DUT (see, for example, Patent Document 1). This handler uses a contact arm to hold the DUT by suction and press it against a socket on the test head. A pusher is provided at the bottom of the contact arm of such a handler for pressing the DUT against the socket, and a heater is provided inside the pusher for controlling the temperature of the DUT. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] International Publication No. 2009 / 057203 [Overview of the project] [Problems that the invention aims to solve]

[0004] In the electronic component testing apparatus described above, ceramic heaters, which have a heating element embedded in a ceramic material, are generally used as heaters. However, because ceramic heaters have a large mass, they have a large heat capacity, which slows down the heating rate. Therefore, there is a problem that temperature control using these ceramic heaters may result in poor responsiveness.

[0005] Furthermore, a problem with such ceramic heaters is that if the heating element heats up rapidly, the ceramic may expand and deform locally, potentially damaging the heater.

[0006] The problem that this invention aims to solve is to provide an electronic component handling device and an electronic component testing device that can improve responsiveness and prevent damage to the heater. [Means for solving the problem]

[0007] [1] The electronic component handling device according to the present invention is an electronic component handling device for handling a DUT or a carrier containing the DUT, comprising a pressing device for electrically connecting the DUT and a socket by pressing the DUT or the carrier toward a socket, the pressing device comprising a temperature control device for adjusting the temperature of the DUT, the temperature control device comprising a heater unit which is a heat source, the heater unit comprising a planar heater, a first heat transfer material disposed on a first main surface which is one main surface of the planar heater, and a second heat transfer material disposed on a second main surface which is the other main surface of the planar heater.

[0008] [2] In the above invention, the first and second heat transfer materials may preferentially diffuse the heat from the planar heater in a first direction parallel to the main surface of the planar heater.

[0009] [3] In the above invention, the first and second heat transfer materials may be graphite sheets.

[0010] [4] In the above invention, the heater unit may be a sheet-like laminate having a thickness of 400 μm or less.

[0011] [5] In the above invention, the planar heater may include a first resin layer, a second resin layer laminated on the first resin layer, and a metal wiring layer sandwiched between the first and second resin layers.

[0012] [6] In the above invention, the planar heater may be a polyimide heater.

[0013] [7] In the above invention, the temperature control device further comprises a cooler unit which is a cooling source and is in contact with the heater unit, and the cooler unit may include a flow passage for circulating a refrigerant.

[0014] [8] In the above invention, the pressing device further comprises a biasing mechanism that biases the cooler unit toward the heater unit, and the cooler unit may press the heater unit by being biased by the biasing mechanism.

[0015] [9] In the above invention, the pressing device further comprises a contact plate that contacts the DUT or the carrier, the cooler unit presses the heater unit by being biased by the biasing mechanism, and the heater unit may be in contact with the contact plate by being pressed by the cooler unit.

[0016]

[10] In the above invention, the cooler unit comprises a nozzle member having an injection port for injecting a refrigerant, and a cold plate which is positioned opposite to the injection port and spaced apart from the injection port, and which is to which the refrigerant is injected from the nozzle member, wherein the flow passage includes an air gap formed between the nozzle member and the cold plate, and the refrigerant injected from the injection port may flow through the air gap after reaching the cold plate.

[0017]

[11] In the above invention, the cold plate has a first opposing surface facing the nozzle member, the nozzle member has a second opposing surface facing the cold plate, the air gap is formed between the first opposing surface and the second opposing surface, and both the first and second opposing surfaces may be planar.

[0018]

[12] In the above invention, the injection port is arranged at substantially the center of the second opposing surface, the second opposing surface includes a plurality of grooves extending radially outward from the injection port in the nozzle, and the plurality of grooves may be provided at substantially equal intervals.

[0019]

[13] In the above invention, the width of the groove may become wider as it approaches the center of the second opposing surface.

[0020]

[14] In the above invention, the second opposing surface includes a step formed outside the groove and extending annularly, and the height of the second opposing surface outside the step may be higher than the height of the second opposing surface inside the step.

[0021]

[15] In the above invention, the thickness of the air gap may be 1 mm or less.

[0022]

[16] In the above invention, the pressing device further includes a contact plate that contacts the DUT or the carrier, the heater unit contacts the contact plate, the cold plate contacts the heater unit, and the heater unit may press the contact plate.

[0023]

[17] An electronic component handling device in which the sum of the thickness of the cold plate, the thickness of the heater unit, and the thickness of the contact plate is 2 mm or less.

[0024]

[18] An electronic component test device according to the present invention is an electronic component test device for testing a DUT, and is an electronic component test device including the above electronic component handling device and a tester having a socket.

Effect of the Invention

[0025] In the electronic component handling apparatus and electronic component testing apparatus according to the present invention, the heater unit of the temperature control device has a planar heater. Because this planar heater is thin, its heat capacity is smaller than that of the ceramic heater described above. Therefore, the heating rate of the heater unit using the planar heater can be improved, thereby improving responsiveness.

[0026] Furthermore, since the first and second heat transfer materials are provided on the first and second main surfaces of the planar heater, even if the planar heater is rapidly heated, the heat can be dissipated from the planar heater by the first and second heat transfer materials. This helps to prevent damage to the planar heater. [Brief explanation of the drawing]

[0027] [Figure 1] Figure 1 is a block diagram showing an example of the configuration of an electronic component testing apparatus in an embodiment of the present invention. [Figure 2] Figure 2 is a cross-sectional view showing the state of the pusher before it adsorbs and holds the DUT in an embodiment of the present invention. [Figure 3] Figure 3 is a cross-sectional view showing the state of the pusher after adsorption and retention of the DUT in an embodiment of the present invention. [Figure 4] Figure 4(a) is an enlarged cross-sectional view of section IVa in Figure 2, and Figure 4(b) is an enlarged cross-sectional view of section IVb in Figure 3. [Figure 5] Figure 5 is a perspective view of the retainer in an embodiment of the present invention, viewed from below. [Figure 6] Figure 6 is an enlarged cross-sectional view of the contact plate and temperature control device in an embodiment of the present invention. [Figure 7] Figure 7 is an enlarged cross-sectional view of section VII in Figure 6. [Figure 8] Figure 8 is a plan view showing an example of the configuration of a heater unit according to an embodiment of the present invention. [Figure 9] Figure 9 is a perspective view from below showing a nozzle member in an embodiment of the present invention. [Modes for carrying out the invention]

[0028] Embodiments of the present invention will be described below with reference to the drawings.

[0029] Figure 1 is a block diagram showing an example of the configuration of the electronic component testing apparatus in this embodiment. Figure 2 is a cross-sectional view showing the state of the pusher before it adsorbs and holds the DUT in this embodiment, and Figure 3 is a cross-sectional view showing the state of the pusher after it adsorbs and holds the DUT. Figure 4(a) is an enlarged cross-sectional view of part IVa in Figure 2, and Figure 4(b) is an enlarged cross-sectional view of part IVb in Figure 3. Figure 5 is a perspective view of the retainer in this embodiment, viewed from below.

[0030] The electronic component testing apparatus 100 in this embodiment, shown in Figure 1, is a device for testing the electrical characteristics of a DUT 300. Specific examples of the DUT 300 to be tested include a SoC (System on a chip), a logic device, or a memory device. As shown in Figure 2, the DUT 300 in this embodiment comprises a substrate 301, an IC chip 302, a temperature detection circuit 303, a molding resin 304, and a plurality of terminals 305.

[0031] In this DUT300, an IC chip 302 and a temperature detection circuit 303 are mounted on the upper surface of the substrate 301, and these IC chip 302 and temperature detection circuit 303 are covered with molded resin 304. Furthermore, terminals 305 are provided on the lower surface of the substrate 301, which are electrically connected to the IC chip 302 and temperature detection circuit 303. These terminals 305 contact and electrically connect to the socket 2, which will be described later. In this embodiment, the temperature detection circuit 303 is described as a separate electronic component from the IC chip 302, but this is not limited to this configuration; the temperature detection circuit 303 may be included in the IC chip 302.

[0032] As shown in Figure 1, the electronic component testing apparatus 100 includes a tester 1 for testing the DUT 300, a socket 2 for electrically connecting the DUT 300 and the tester 1, and a handler 3 for transporting the DUT 300 and pressing it into the socket 2.

[0033] Tester 1 comprises a mainframe 11 and a test head 12. The mainframe 11 is connected to the test head 12 via a cable 13. The mainframe 11 sends a test signal to the DUT 300 via the test head 12 to test the DUT 300 and evaluates the DUT 300 according to the test results. The test head 12 is connected to the mainframe 11 via cable 13 and sends the test signal sent from the mainframe 11 to the DUT 300 when the DUT 300 is being tested.

[0034] As shown in Figure 3, the test head 12 is electrically connected to the DUT 300 via a socket 2. The socket 2 comprises a socket body 21 and a contact 22. The socket body 21 is fixed to the upper surface of the test head 12. The contact 22 is positioned on this socket body 21. The contact 22 is electrically connected to a load board or the like, which is positioned on the upper surface of the test head 12 (not shown in the figure), and is also electrically connected to the DUT 300 by contacting the terminal 305 of the DUT 300. In this embodiment, a pogo pin is used as the contact 22, but something other than a pogo pin may be used as the contact 22. For example, a cantilever-type probe needle, an anisotropic conductive rubber sheet, or a membrane-type contact with bumps formed on an insulating film may be used.

[0035] As shown in Figure 1, the DUT300 is pressed against the socket 2 by the handler 3. The handler 3 comprises a constant temperature bath 4, a contact arm 5, a pusher 6, and a refrigerant supply unit 9. In this embodiment, the handler 3 corresponds to an example of the "electronic component handling device" in the present invention, and the pusher 6 in this embodiment corresponds to an example of the "pressing device" in the present invention.

[0036] The constant temperature bath 4 can adjust the temperature of the internal atmosphere to a desired temperature, and can apply high or low temperatures to the DUT 300. The constant temperature bath 4 is not particularly limited, but for example, its temperature can be adjusted in the range of -55°C to +155°C. This constant temperature bath 4 houses the contact arm 5 and the pusher 6. Furthermore, the constant temperature bath 4 houses the socket 2 through an opening formed in the bottom of the constant temperature bath 4. Note that the handler 3 does not necessarily have to be equipped with a constant temperature bath 4.

[0037] The contact arm 5 is supported by a rail (not shown) provided by the handler 3. This contact arm 5 is equipped with an actuator (not shown) for horizontal movement, allowing it to move forward, backward, left, and right along the rail. In addition, this contact arm 5 is equipped with an actuator (not shown) for vertical movement, allowing it to move in the vertical direction.

[0038] A pusher 6 is positioned at the lower end of the contact arm 5. As shown in Figure 2, the pusher 6 comprises a pusher body 61, a contact plate 62, a retainer 63, a suction pad 68, a vertical guide 69, a temperature control device 7, and a biasing mechanism 8.

[0039] As shown in Figure 2, the pusher body 61 in this embodiment has a plurality (two in this example) of first suction holes 611, a first refrigerant supply hole 612, and a plurality (two in this example) of first refrigerant recovery holes 613. The first suction holes 611 are through holes that open on the lower surface of the pusher body 61, and these openings are connected to the second suction holes 67 (described later) of the retainer 63. These first suction holes 611 are connected to a vacuum pump (not shown), and the inside of the first suction holes 611 is subjected to negative pressure by this vacuum pump.

[0040] The first refrigerant supply hole 612 is also a through hole opening on the lower surface of the pusher body 61, and the supply-side cylindrical portion 772 (described later) of the refrigerant guide 77 (described later) is inserted into this first refrigerant supply hole 612. Refrigerant is supplied to this first refrigerant supply hole 612 from a refrigerant supply source 200 located outside the handler 3. The first refrigerant recovery hole 613 is also a through hole opening on the lower surface of the pusher body 61, and the recovery-side cylindrical portion 773 (described later) of the refrigerant guide 77 (described later) is inserted into this first refrigerant recovery hole 613. Refrigerant used by the temperature control device 7 is recovered into this first refrigerant recovery hole 613. The first suction hole 611, the first refrigerant supply hole 612, and the first refrigerant recovery hole 613 described above may be located in parts other than the pusher body 61.

[0041] As shown in Figure 2, the contact plate 62 is a plate with a convex shape that is bent to protrude downward. As shown in Figure 3, the contact plate 62 is a component that directly contacts the DUT 300 when the pusher 6 is holding the DUT 300. The temperature control device 7 heats or cools the DUT 300 via this contact plate 62.

[0042] The contact plate 62 can be made of a metal with an insulating coating on its surface. Specifically, for example, aluminum with an anodized coating on its surface can be used. In order to transfer heat from the temperature control device 7 to the DUT 300, it is preferable that the contact plate 62 be made of a metal material with high thermal conductivity. Furthermore, by using a metal with an insulating coating on its surface, electromagnetic noise generated from the pusher 6 can be shielded from the DUT 300, and the pusher 6 can be electrically insulated from the DUT 300. In addition, to prevent electrostatic discharge (ESD), the contact plate 62 may be electrically connected to ground, although this is not shown in the diagram.

[0043] This contact plate 62 has a contact portion 621 and a side portion 622. The contact portion 621 extends along a direction substantially parallel to the DUT 300. This contact portion 621 has a contact surface 621a that contacts the DUT 300. In the present embodiment, the contact surface 621a is the lower surface of the contact portion 621, and as shown in FIG. 3, when the pusher 6 holds the DUT 300, it contacts and presses the DUT 300. Further, the temperature adjustment device 7 applies heat to the DUT 300 through this contact surface 621a. As shown in FIG. 4(a), the thickness T1 of the contact portion 621 is not particularly limited, but can be 500 μm to 550 μm (500 μm ≤ T1 ≤ 550 μm).

[0044] As shown in FIG. 2, the width W of this contact surface 621a c is smaller than the width W of the DUT 300 as shown in the following formula (1), and is also smaller than the width W of the retainer as shown in the following formula (2). D In this way, by making the width of the contact surface 621a of the contact plate 62 small, the heat capacity of the contact portion 621 can be reduced, and the rate of temperature change of the contact portion 621 can be improved when controlling the temperature of the DUT 300 by the temperature adjustment device 7. That is, the responsiveness of temperature adjustment by the pusher 6 can be improved. R W W D >W C … (1) W R >W C … (2) However, in the above formula (1), W D is the width of the DUT 300, W C is the width of the contact surface 621a of the contact plate 62, and in the above formula (2), W R is the width of the retainer 63.

[0045] The side portion 622 of the contact plate 62 is connected to the outer peripheral end of the contact portion 621 and extends along a direction substantially perpendicular to the contact portion 621. This side portion 622 has a locking surface 622a and a side surface 622b. In this embodiment, the locking surface 622a is the lower surface of the side portion 622. This locking surface 622a is an annular inclined surface surrounding the contact surface 621a, and is inclined such that the width of the contact plate 62 increases as it moves away from the contact surface 621a. As shown in Figures 2 and 4(a), this locking surface 622a is the surface that contacts the retainer 63. The side surface 622b is a side surface connected to the upper end of the locking surface 622a and extends along a direction substantially perpendicular to the contact portion 621. This side surface 622b is always separated from the retainer 63.

[0046] The retainer 63 is a component that holds the contact plate 62. As shown in Figure 2, the retainer 63 is located on the lower surface of the pusher body 61. As shown in Figures 2 and 5, the retainer 63 in this embodiment has an annular shape and surrounds the contact plate 62. Also, as shown in Figure 2, the retainer 63 is separated from the temperature control device 7, and a space S is formed between the retainer 63 and the temperature control device 7. This space S makes it difficult for heat generated from the temperature control device 7 to be transferred to the retainer 63, thus enabling efficient temperature control of the DUT300.

[0047] As shown in Figure 5, the retainer 63 comprises a frame-shaped portion 64, a holding portion 65, and a plurality of second suction holes 67. The frame-shaped portion 64 has an annular shape. As shown in Figure 2, this frame-shaped portion 64 is fixed to the lower surface of the pusher body 61. Although not particularly limited, the frame-shaped portion 64 can be fixed to the pusher body 61 with fasteners such as bolts.

[0048] As shown in Figures 2 and 5, a holding portion 65 is formed on the lower surface of the frame-shaped portion 64 to contact and hold the contact plate 62. The holding portion 65 in this embodiment is equipped with a plurality of (four in this example) claw portions 66a to 66d (hereinafter sometimes collectively referred to as claw portions 66).

[0049] The claw portion 66 protrudes downward from the lower surface of the frame-shaped portion 64. This claw portion 66 is arranged to surround the contact plate 62 on all four sides. In this embodiment, a pair of claw portions 66a and 66b are arranged to face each other, and a pair of claw portions 66c and 66d are also arranged to face each other.

[0050] Furthermore, these claw portions 66a to 66d are spaced apart from each other and surround the contact plate 62 along the annular locking surface 622a of the contact plate 62. By holding the contact plate 62 with the claw portions 66 which are spaced apart from each other in this way, the contact area between the holding portion 65 and the contact plate 62 can be reduced, making it difficult for heat to escape from the contact plate 62 to the holding portion 65. Therefore, the temperature of the DUT300 can be controlled efficiently.

[0051] Furthermore, as shown in Figure 5, the claw portion 66 has a protruding portion 661 and an opening 662. In this embodiment, the protruding portion 661 is located at the lower part of the claw portion 66, as shown in Figure 4(a), and protrudes toward the contact plate 62. In this embodiment, the protruding portion 661 has a retaining surface 661a. This retaining surface 661a faces the locking surface 622a of the contact plate 62 and is an inclined surface substantially parallel to the locking surface 622a of the contact plate 62. When the contact plate 62 is not in contact with the DUT 300, this retaining surface 661a holds the contact plate 62 by supporting the locking surface 622a from below. At this time, the locking surface 622a of the contact plate 62 is not fixed to the retaining surface 661a of the retainer 63 by adhesive, screws, etc., and the contact plate 62 is detachably held by the retainer 63.

[0052] As shown in Figure 5, the claw portions 66a and 66b have an opening 662. This opening 662 penetrates the claw portions 66a and 66b horizontally. This opening 662 makes it difficult for heat to escape from the contact plate 62 to the claw portions 66a and 66b, and also allows for a reduction in the weight of the retainer 63.

[0053] The second suction hole 67 penetrates the frame-shaped portion 64 and the claw portions 66c and 66d. The upper end of this second suction hole 67 is connected to the first suction hole 611 of the pusher body 61. Since this second suction hole 67 is connected to a vacuum pump (not shown) via the first suction hole 611, the inside of the second suction hole 67 is under negative pressure.

[0054] As shown in Figures 3 and 4(b), a suction pad 68 is positioned at the lower end of the second suction hole 67. The suction pad 68 contacts the DUT 300, forming a space surrounded by the suction pad 68 and the DUT 300. Since this space is connected to the second suction hole 67, the DUT 300 can be held in place by suction at the lower end surfaces 66e of the claw portions 66c and 66d.

[0055] As shown in Figure 4(b), when the suction pad 68 is adsorbing the DUT 300, the contact surface 621a of the contact plate 62 is in contact with the DUT 300. At this time, since the locking surface 622a of the contact plate 62 is not fixed to the holding surface 661a of the retainer 63, the contact plate 62 is pushed upward by the DUT 300, and the contact plate 62 separates from the retainer 63. In this way, by separating the contact plate 62 from the retainer 63, it is possible to prevent heat from escaping to the retainer 63 when the temperature of the DUT 300 is controlled by the temperature control device 7. In other words, the heat capacity of the component interposed between the temperature control device 7 and the DUT 300 can be reduced, thereby improving the responsiveness of temperature control.

[0056] As shown in Figures 2 and 3, a temperature control device 7 is located inside the contact plate 62. This temperature control device 7 adjusts the temperature of the DUT 300 via the contact plate 62.

[0057] Figure 6 is an enlarged cross-sectional view of the contact plate and temperature control device in this embodiment, and Figure 7 is an enlarged cross-sectional view of part VII in Figure 6. Figure 8 is a plan view showing an example of the configuration of the heater unit in this embodiment. As shown in Figure 6, the temperature control device 7 comprises a heater unit 71 which is a heat source and a cooler unit 75 which is a cooling source.

[0058] The heater unit 71 is positioned on the contact portion 621 of the contact plate 62. The heater unit 71 is a sheet-like laminate formed by laminating a planar heater 72, a first heat transfer material 73, and a second heat transfer material 74. The thickness T2 of this heater unit 71 is not particularly limited, but is 400 μm or less (T2 ≤ 400 μm).

[0059] As shown in Figures 6 to 8, the planar heater 72 has a planar shape (sheet shape). Because such a planar heater 72 is thin, its heat capacity is smaller compared to that of a ceramic heater or the like. Therefore, the heating rate of the temperature control device 7 can be improved, thereby improving responsiveness.

[0060] As shown in Figure 6, the thickness T3 of such a planar heater 72 is not particularly limited, but can be 100 μm to 150 μm (100 μm ≤ T3 ≤ 150 μm). Furthermore, as the planar heater 72, for example, a resin film heater such as a polyimide heater or a polyester heater can be used. In particular, it is preferable to use a polyimide heater as the planar heater 72. Polyimide heaters have excellent heat resistance among heaters using resin. Moreover, since polyimide heaters are less expensive than ceramic heaters and the like, costs can be reduced.

[0061] As shown in Figure 8, the planar heater 72 has a heater section 72a and a lead section 72b. The heater section 72a is the part that heats the contact plate 62. On the other hand, the lead section 72b has a strip shape that extends from the heater section 72a and is used for connecting to a power supply to supply power to the planar heater 72.

[0062] As shown in Figures 6 and 8, the planar heater 72 includes a resin layer 721, metal wiring 724, and terminals 725 (see Figure 8). The resin layer 721 is a planar layer. As shown in Figure 7, the resin layer 721 includes a first resin layer 722 and a second resin layer 723 laminated on the first resin layer 722. The first resin layer 722 and the second resin layer 723 are not particularly limited, but are resin films and are bonded to each other via an adhesive (not shown). The first and second resin layers 722 and 723 may be bonded to each other without an adhesive. The first and second resin layers 722 and 723 are composed of resin materials such as polyimide or polyester. In particular, from the viewpoint of heat resistance, it is preferable to use polyimide as the resin material.

[0063] A metal wire 724 is sandwiched between the first and second resin layers 722 and 723. This metal wire 724 is made of a metal such as stainless steel. As shown in Figure 8, the metal wire 724 meanders in the heater section 72a and is connected to a terminal 725 at the outlet section 72b. This terminal 725 is electrically connected to the power supply mentioned above.

[0064] As shown in Figures 6 to 8, a first heat transfer material 73 is placed on the first main surface (upper surface) 721a of the planar heater 72. A second heat transfer material 74 is also placed on the second main surface (lower surface) 721b of the planar heater 72. These first and second heat transfer materials 73 and 74 are thermally conductive materials that dissipate heat generated from the planar heater 72. The thicknesses T4 and T5 of these first and second heat transfer materials 73 and 74 are not particularly limited, but can be 50 μm to 100 μm (50 μm ≤ T4, T5 ≤ 100 μm).

[0065] In such planar heaters, the metal wiring generates heat, causing a localized temperature rise near the metal wiring. This can lead to the resin layer becoming excessively hot in that area, potentially causing it to burn out. However, in the heater unit 71 of this embodiment, the first and second heat transfer materials 73 and 74 diffuse heat to areas other than the vicinity of the metal wiring 724, thereby suppressing the localized temperature rise near the metal wiring 724 and preventing the burning of the resin layer 721.

[0066] For example, a Thermal Interface Material (TIM) can be used as the first and second heat transfer materials 73 and 74. Examples of TIMs include metal foil made of aluminum or copper, graphite sheets, silicone rubber sheets with dispersed thermally conductive fillers, sheets containing carbon nanotubes (CNTs), and gels with dispersed thermally conductive fillers.

[0067] The first and second heat transfer materials 73 and 74 preferably diffuse heat from the planar heater 72 preferentially in a first direction (horizontal in this example) parallel to the first and second main surfaces 721a and 721b of the planar heater 72. A heat transfer material that preferentially diffuses heat in the first direction is a heat transfer material in which, when pressed with a predetermined pressure, the thermal conductivity in the first direction is greater than the thermal conductivity in the direction perpendicular to the first direction. As such materials, the graphite sheet described above or a sheet manufactured by bundling CNTs extending along the first direction can be used.

[0068] As shown in Figure 7, in the planar heater 72, the metal wiring 724 generates heat, so heat tends to concentrate in the first portion 73a of the first heat transfer material 73, which is located near the metal wiring 724. On the other hand, heat does not concentrate as easily in the second portion 73b of the first heat transfer material 73, which is further away from the metal wiring 724. Therefore, by using the first heat transfer material 73 which preferentially diffuses heat in the first direction, as in this embodiment, heat can be preferentially transferred from the first portion 73a to the second portion 73b, thereby suppressing excessive heating of the first portion 73a. As a result, it is possible to effectively suppress localized high temperatures in the portion of the planar heater 72 near the metal wiring 724. Similarly, for the second heat transfer material 74, it is also possible to effectively suppress localized high temperatures in the portion of the planar heater 72 near the metal wiring 724 for the same reason.

[0069] As shown in Figures 2 and 6, a cooler unit 75 is positioned on the heater unit 71. This cooler unit 75 cools the heater unit 71 while it is generating heat, adjusting its temperature to a desired temperature. Furthermore, this cooler unit 75 can also cool the DUT 300 via the heater unit 71 and the contact plate 62.

[0070] As shown in Figures 2 and 6, the cooler unit 75 comprises a cold plate 76, a refrigerant guide 77, a nozzle member 78, and a flow passage 79. The cold plate 76 is a bottomed cylindrical plate. This cold plate 76 is placed on the heater unit 71 and is a component that cools the heater unit 71 by contacting it. As for the material constituting this cold plate 76, a metal with an insulating coating formed on its surface can be used, similar to the contact plate 62 described above.

[0071] The thickness T6 of the cold plate 76 is, for example, 300 μm to 400 μm (300 μm ≤ T6 ≤ 400 μm). Also, the sum T7 of the thickness T6 of the cold plate 76, the thickness T2 of the heater unit 71, and the thickness T1 of the contact plate is 2 mm or less (T6 + T2 + T1 ≤ 1 mm). By shortening the distance between the cold plate 76 and the DUT 300 in this way, the responsiveness of temperature control can be improved.

[0072] Furthermore, the cold plate 76 has a first opposing surface 76a that faces the nozzle member 78. This first opposing surface 76a is flat.

[0073] A refrigerant guide 77 is positioned to fit into the opening at the top of the cold plate 76, and the refrigerant guide 77 seals the internal space of the cold plate 76. As shown in Figure 2, the refrigerant guide 77 is a component that guides the refrigerant supplied from the first refrigerant supply hole 612 of the pusher body 61 into the cooler unit 75, and also guides the refrigerant used for cooling to the first refrigerant recovery hole 613 of the pusher body 61.

[0074] As shown in Figures 2 and 6, the refrigerant guide 77 has a pressing portion 771, a supply-side cylindrical portion 772, and a plurality of recovery-side cylindrical portions 773. The pressing portion 771 is the main body of the refrigerant guide 77 and presses the nozzle member 78 downward.

[0075] As shown in Figures 2 and 6, the supply-side cylindrical portion 772 is positioned approximately at the center of the upper surface of the pressing portion 771. As shown in Figure 2, the supply-side cylindrical portion 772 is a cylindrical member that extends upward from the upper surface of the pressing portion 771 and is inserted into the first refrigerant supply hole 612 of the pusher body 61. Inside this supply-side cylindrical portion 772, a second refrigerant supply hole 772a is formed, which constitutes part of the flow passage 79, and this second refrigerant supply hole 772a extends to the lower surface of the pressing portion 771.

[0076] Multiple recovery-side cylindrical portions 773 are arranged on the upper surface of the pressing portion 771. As shown in Figure 2, the recovery-side cylindrical portions 773 are cylindrical members that extend upward from the upper surface of the pressing portion 771 and are inserted into the first refrigerant recovery hole 613 of the pusher body 61. Inside these recovery-side cylindrical portions 773, a second refrigerant recovery hole 773a is formed, which constitutes part of the flow passage 79, and this second refrigerant recovery hole 773a extends to the lower surface of the pressing portion 771.

[0077] As shown in Figures 2 and 6, the nozzle member 78 is interposed between the cold plate 76 and the refrigerant guide 77. This nozzle member 78 is a component that injects refrigerant onto the cold plate 76. As shown in Figure 6, this nozzle member 78 has a through hole 781, an injection port 782, and a projection 785. The through hole 781 is connected to the second refrigerant supply port 772a of the refrigerant guide 77. The through hole 781 constitutes part of the flow passage 79. The injection port 782 is formed approximately at the center of the lower end surface (second opposing surface 78a) of this through hole 781. This injection port 782 is separated from the cold plate 76 and injects the refrigerant supplied from the second refrigerant supply port 772a of the refrigerant guide 77 toward the cold plate 76.

[0078] Furthermore, the nozzle member 78 has a second opposing surface 78a that faces the first opposing surface 76a of the cold plate 76 and is separated from the first opposing surface 76a. As a result, an air gap 791 is formed between the first opposing surface 76a and the second opposing surface 78a. This air gap 791 also constitutes part of the flow passage 79, and the refrigerant injected from the injection port 782 flows through the air gap 791 after reaching the first opposing surface 76a of the cold plate 76. By allowing the refrigerant to flow through the air gap 791 on the cold plate 76, the refrigerant can be accelerated on the first opposing surface 76a, thereby improving the cooling rate. As a result, the responsiveness in temperature control can be improved.

[0079] The refrigerant that has flowed through the air gap 791 is recovered into the second refrigerant recovery hole 773a via the gap between the side of the nozzle member 78 and the cold plate 76, and the gap between the top surface of the nozzle member 78 and the refrigerant guide 77.

[0080] Figure 9 is a perspective view from below showing the nozzle member 78 in this embodiment. The second opposing surface 78a is flat. This second opposing surface 78a includes a plurality of grooves 783 (four in this example) and a step 784. The plurality of grooves 783 extend radially outward from the injection port 782 to the nozzle member 78. By providing such grooves 783, the refrigerant injected from the injection port 782 can be guided into the grooves 783 and flow radially outward.

[0081] Furthermore, the width of the groove 783 increases as it approaches the center of the second opposing surface 78a. This allows the refrigerant to flow at high speed even at the tip of the groove 783.

[0082] Furthermore, the multiple grooves 783 are arranged at approximately equal intervals along the circumferential direction of the injection nozzle 782, with the injection nozzle 782 as the center. This allows the refrigerant to flow evenly outward in the air gap 791.

[0083] A step 784 is formed on the outside of the groove 783. This step 784 has an annular shape. The second opposing surface 78a is partitioned by this step 784 and includes an outer opposing surface 78b located outside the step 784 and an inner opposing surface 78c located inside the step 784. As shown in Figure 6, the height H1 of the outer opposing surface 78b is higher than the height H2 of the inner opposing surface 78c. In other words, the thickness of the air gap 791 is larger at the outer opposing surface 78b and smaller at the inner opposing surface 78c. By providing such a step 784, the refrigerant can be accelerated at the outer circumference of the second opposing surface 78a.

[0084] Furthermore, the thickness T8 of the air gap 791 can be appropriately set according to the pressure of the supplied refrigerant, but for example, it can be 1 mm or less (T8 ≤ 1 mm). If the thickness T8 of the air gap 791 is 1 mm or less, the refrigerant flowing through the air gap 791 can be accelerated, thereby improving the cooling rate. This improves the responsiveness in temperature control.

[0085] As shown in Figures 6 and 9, a plurality of protrusions 785 are arranged on the second opposing surface 78a. These protrusions 785 are spacers interposed between the first opposing surface 76a and the second opposing surface 78a, separating the first and second opposing surfaces 76a and 78a. The tips of the protrusions 785 are in contact with the first opposing surface 76a of the cold plate 76, defining the air gap 791 described above.

[0086] As shown in Figure 2, the biasing mechanism 8 is interposed between the pusher body 61 and the refrigerant guide 77 of the temperature control device 7. This biasing mechanism 8 biases the cooler unit 75 toward the heater unit 71 by biasing the refrigerant guide 77 toward downward. In this embodiment, the biasing mechanism 8 is a spring such as a coil spring. The biasing mechanism 8 may be made of other elastic material such as rubber. Furthermore, the biasing mechanism 8 may constitute part of the gimbal structure.

[0087] The cold plate 76 of the cooler unit 75, which is biased by the biasing mechanism 8, constantly presses the heater unit 71 toward the contact plate 62. By pressing the heater unit 71 toward the contact plate 62 with the cold plate 76 in this way, the first and second heat transfer materials 73 and 74 come into close contact with the planar heater 72, thereby promoting heat dissipation from the planar heater 72 to the first and second heat transfer materials 73 and 74.

[0088] As shown in Figure 2, the vertical guide 69 is positioned outside the retainer 63. This vertical guide 69 is fixed to the lower surface of the pusher body 61 and extends downward from the lower surface of the pusher body 61. Although not particularly limited, the vertical guide 69 can be fixed to the pusher body 61 by fasteners such as bolts. As shown in Figure 3, this vertical guide 69 contacts the DUT 300 when the pusher 6 attracts and holds the DUT 300, thereby enabling the positioning of the DUT 300 relative to the pusher 6 in both the vertical and horizontal directions.

[0089] Returning to Figure 1, the refrigerant supply unit 9 supplies refrigerant to the pusher 6. This refrigerant supply unit 9 includes a connection unit 91, a valve 92, and a valve control unit 93. The connection unit 91 is connected to a refrigerant supply source 200 located outside the electronic component testing apparatus 100. The refrigerant supplied by this refrigerant supply source 200 may be compressed dry air or liquid nitrogen. When the refrigerant supply source 200 supplies compressed dry air, it may include, for example, a compressor that takes in outside air and compresses it, and a dryer that dries the compressed air. Alternatively, the refrigerant supply source 200 may be existing factory piping capable of supplying compressed dry air. When the refrigerant supply source 200 supplies liquid nitrogen, it may be, for example, a pressure vessel that stores liquid nitrogen at high pressure, or factory piping for supplying liquid nitrogen.

[0090] A valve 92 is provided downstream of the connection 91. This valve 92 adjusts the flow rate of the refrigerant supplied from the refrigerant supply source 200. The refrigerant that has passed through this valve 92 is supplied to the first refrigerant supply hole 612 of the pusher body 61, as shown in Figure 2.

[0091] As shown in Figure 1, the valve control unit 93 controls the opening and closing of the valve 92. In this embodiment, the valve control unit 93 receives the detection value from the temperature detection circuit 303 (see Figure 2) of the DUT 300 as input. The valve control unit 93 performs PID control according to the input detection value so that the temperature of the DUT 300 reaches a desired value. Note that the control method of the valve control unit 93 is not limited to PID control, and other control methods may be used.

[0092] In the electronic component testing apparatus 100 of this embodiment as described above, the heater unit 71 of the temperature control device 7 has a planar heater 72. Because this planar heater 72 is thin, the heat capacity of the planar heater 72 is smaller than that of a ceramic heater. Therefore, the heating rate of the heater unit 71 can be improved, and thus the responsiveness can be improved.

[0093] Furthermore, in the electronic component testing apparatus 100 of this embodiment, first and second heat transfer materials 73 and 74 are provided on the first and second main surfaces 721a and 721b of the planar heater 72. Therefore, even when the planar heater 72 is rapidly heated, the first and second heat transfer materials 73 and 74 can suppress localized high temperatures in the planar heater 72, and heat can be dissipated from the planar heater 72. This helps to prevent damage to the planar heater 72.

[0094] Furthermore, in the electronic component testing apparatus 100 of this embodiment, since ceramic heaters, which tend to be heavy, are not used, the weight of the pusher 6 can be reduced.

[0095] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit it. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0096] For example, in the above embodiment, the pusher 6 adsorbs and holds the DUT 300, but is not limited to this. The pusher 6 may adsorb and hold a carrier containing the DUT. Such a carrier is not particularly limited, but for example, carriers described in Japanese Patent Application Publication No. 2019-197012 and Japanese Patent Application Publication No. 2013-79860 can be used.

[0097] Furthermore, the pusher 6 may press against multiple DUT300s mounted on a test tray that contains multiple DUT300s. In this case, the handler 3 is equipped with multiple pushers 6, and each of the multiple pushers 6 presses against the multiple DUT300s mounted on the test tray. In this case, all of the pushers 6 may have the same configuration as in the embodiment described above. [Explanation of symbols]

[0098] 100... Electronic component testing equipment 1... Tester 11…Mainframe 12…Test head 13… Cable 2…Socket 21...Socket body 22... Contactor 3…Handler 4…Thermostatic bath 5… Contact Arm 6... Pusher 61... Pusher body 611...First suction port 612...First refrigerant supply port 613...First refrigerant recovery port 62... Contact plate 621... Contact area 621a…Contact surface 622... Side 622a…Latching surface 622b…side 63... Retainer 64...Frame-shaped part 65...Holding part 66(66a~66d)...Claw part 66e…Lower end surface 661...Protrusion 661a...Holding surface 662…Aperture 67...Second suction port 68…Suction pad 69…Vertical guide 7…Temperature adjustment device 71… Heater unit 72... Planar heater 72a... Heater section 72b...Drawer section 721... Resin layer 721a, 721b… First and second main surfaces 722,723…First and second resin layers 724…Metal wiring 725... Terminal 73…First heat transfer material 73a, 73b...the first and second parts 74…Second heat transfer material 75... Cooler unit 76... Cold Plate 76a...First opposing surface 77…Refrigerant Guide 771...Pressing part 772…Supply side cylindrical part 772a...Second refrigerant supply port 773...Recovery side cylindrical section 773a...Second refrigerant recovery port 78…Nozzle component 78a...Second opposing surface 78b…Outside facing surface 78c…Inner facing surface 781... Through hole 782…Injection port 783...Groove 784... Step 785...protrusion 79…Distribution path 791...Air gap 8...Biasing mechanism 9…Refrigerant supply unit 91...Connection part 92... Valve 93…Valve control unit 200…Refrigerant supply source 300...DUT 301... Circuit board 302…IC chip 303...Temperature detection circuit 304…Mold resin 305... Terminal

Claims

1. A temperature control device for adjusting the temperature of a DUT, The temperature control device is The heater unit is the heat source, The system includes a cooler unit that serves as a cooling source and is in contact with the heater unit, The aforementioned heater unit is Planar heater and, A first heat transfer material is arranged on the first main surface, which is one of the main surfaces of the planar heater, The planar heater includes a second heat transfer material disposed on the second main surface, which is the other main surface of the planar heater, The aforementioned cooler unit is A flow path for circulating the refrigerant, A nozzle member having an injection port for injecting refrigerant, It has a cold plate which is positioned opposite and separated from the aforementioned injection port, and which is into which refrigerant is injected from the nozzle member, The flow passage includes an air gap formed between the nozzle member and the cold plate. The refrigerant injected from the nozzle reaches the cold plate and then flows through the air gap. The cold plate has a first opposing surface that faces the nozzle member, The nozzle member has a second opposing surface that faces the cold plate, The air gap is formed between the first opposing surface and the second opposing surface. The first and second opposing surfaces are both planar, The nozzle is positioned approximately in the center of the second opposing surface. The second opposing surface includes a plurality of grooves extending radially outward from the nozzle opening to the nozzle member. The aforementioned multiple grooves are provided at approximately equal intervals. A temperature control device in which the width of the groove widens as it approaches the center of the second opposing surface.

2. A temperature control device according to claim 1, The first and second heat transfer materials are a temperature control device that preferentially diffuses heat from the planar heater in a first direction parallel to the main surface of the planar heater.

3. A temperature control device according to claim 2, The temperature control device is such that the first and second heat transfer materials are graphite sheets.

4. A temperature control device according to any one of claims 1 to 3, The heater unit is a temperature control device that is a sheet-like laminate having a thickness of 400 μm or less.

5. A temperature control device according to any one of claims 1 to 4, The aforementioned planar heater is, The first resin layer, A second resin layer laminated on the first resin layer, A temperature control device comprising a metal wiring layer sandwiched between the first and second resin layers.

6. A temperature control device according to claim 5, The aforementioned planar heater is a polyimide heater, which is a temperature control device.

7. A temperature control device for adjusting the temperature of a DUT, The temperature control device is The heater unit is the heat source, The system includes a cooler unit that serves as a cooling source and is in contact with the heater unit, The aforementioned heater unit is Planar heater and, A first heat transfer material is arranged on the first main surface, which is one of the main surfaces of the planar heater, The planar heater includes a second heat transfer material disposed on the second main surface, which is the other main surface of the planar heater, The aforementioned cooler unit is A flow path for circulating the refrigerant, A nozzle member having an injection port for injecting refrigerant, It has a cold plate which is positioned opposite and separated from the aforementioned injection port, and which is into which refrigerant is injected from the nozzle member, The flow passage includes an air gap formed between the nozzle member and the cold plate. The refrigerant injected from the nozzle reaches the cold plate and then flows through the air gap. The cold plate has a first opposing surface that faces the nozzle member, The nozzle member has a second opposing surface that faces the cold plate, The air gap is formed between the first opposing surface and the second opposing surface. The first and second opposing surfaces are both planar, The nozzle is positioned approximately in the center of the second opposing surface. The second opposing surface includes a plurality of grooves extending radially outward from the nozzle opening to the nozzle member. The aforementioned multiple grooves are provided at approximately equal intervals. The second opposing surface is formed on the outside of the groove and includes a step that extends in an annular shape. A temperature control device in which the height of the second opposing surface on the outside of the step is higher than the height of the second opposing surface on the inside of the step.

8. A temperature control device according to any one of claims 1 to 7, A temperature control device in which the thickness of the air gap is 1 mm or less.

9. An electronic component handling device for handling a DUT or a carrier containing the DUT, The system includes a pressing device that electrically connects the DUT or the carrier to the socket by pressing the DUT toward the socket, The pressing device is an electronic component handling device equipped with a temperature control device according to any one of claims 1 to 8.

10. An electronic component handling device according to claim 9, The pressing device further comprises a biasing mechanism that biases the cooler unit toward the heater unit. The cooler unit is an electronic component handling device that presses against the heater unit by being biased by the biasing mechanism.

11. An electronic component handling device according to claim 10, The pressing device further comprises a contact plate that contacts the DUT or the carrier. The cooler unit, being biased by the biasing mechanism, presses against the heater unit. The heater unit is in contact with the contact plate by being pressed by the cooler unit in an electronic component handling device.

12. An electronic component handling device according to any one of claims 9 to 11, The pressing device further comprises a contact plate that contacts the DUT or the carrier. The heater unit is in contact with the contact plate. The cold plate is in contact with the heater unit and presses the heater unit toward the contact plate in this electronic component handling device.

13. An electronic component handling device according to claim 12, An electronic component handling device in which the sum of the thickness of the cold plate, the thickness of the heater unit, and the thickness of the contact plate is 2 mm or less.

14. An electronic component testing apparatus for testing DUT, An electronic component handling device according to any one of claims 9 to 13, An electronic component testing apparatus equipped with a tester having a socket.

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