Light-emitting device

Abstract

To reduce a sense of separation in display, of a display device, and to reduce the power consumption of the display device.SOLUTION: A light-emitting device includes a flexible display part, and the display part includes a bent part and the bent part is in an area other than the center of the display part. When the display part is bent at the bent part, a first area of the display part cannot be visually recognized from outside, and a second area thereof can be visually recognized. A translucent area may be also provided, and when the display part is bent at the bent part, portion of the display part may be visually recognized from outside.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a product, a method, or a method of manufacturing; or to a process, a machine , relating to manufacture or composition of matter. In particular The present invention relates to, for example, semiconductor devices, display devices, light-emitting devices, lighting devices, energy storage devices, and the like. The present invention relates to a driving method or a method for manufacturing the same. In particular, one aspect of the present invention relates to a display device, an electric The present invention relates to sub-devices or methods for manufacturing them. In particular, one aspect of the present invention relates to electroluminescent Utilizing the phenomenon of electroluminescence (hereinafter also referred to as EL) The present invention relates to display devices, electronic devices, or methods for manufacturing them. [Background technology]

[0002] In recent years, display devices have been expected to have applications in a variety of fields, and diversification is required. For example, For display devices used in portable devices, etc., they must be small, thin, and lightweight. These are some of the requirements. On the other hand, it is desirable for display devices to have large screens (wide display area). Occasionally, there is also a demand for reducing the area of ​​the display device other than the display area (so-called narrow bezel design). Yes, they are.

[0003] Furthermore, light-emitting elements (also referred to as EL elements) that utilize the EL phenomenon can be easily made thin and lightweight. Features include the ability to respond quickly to input signals and the ability to be driven using a DC low-voltage power supply. It possesses [certain properties], and its application to display devices is being considered.

[0004] For example, Patent Document 1 describes the front panel and the main body, which are foldable and connected. A portable communication device having a display is disclosed on the side. The front panel and the main body By configuring the display so that one side of each display touches each other when unfolded, This portable communication device achieves both a larger screen for gameplay and a smaller, lighter design. ru. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2000-184026 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, each display has a non-display area surrounding the display area, as shown in Patent Document 1 In this configuration, a non-display area exists at the junction of the two displays and in its vicinity. The wider the display area, the more a single image displayed using multiple displays can be viewed. To the viewer, it appears as if the elements are separated (or, to put it another way, the display gives a sense of separation).

[0007] Therefore, one aspect of the present invention provides a display device or electronic device in which the sense of separation of the display is suppressed. One objective is to achieve the following. Alternatively, one aspect of the present invention relates to a small display device or electronic device. One objective is to provide a device. Alternatively, one aspect of the present invention is a lightweight display device or One objective of this invention is to provide electronic devices. Alternatively, one aspect of this invention is a narrow-bezel device. One objective is to provide a display device or electronic device. Alternatively, one aspect of the present invention is to break One objective is to provide a display device or electronic device that is less prone to damage. One of the objectives is to provide a display device or electronic device with reduced power consumption. Alternatively, one object of the present invention is to provide a novel display device or electronic device .

[0008] Note that the description of these problems does not preclude the existence of other problems. One aspect of the present invention does not necessarily have to solve all of these problems. Other problems will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract these other problems from the description in the specification, drawings, claims, etc.

Means for Solving the Problems

[0009] One aspect of the present invention has a flexible display unit. The display unit has a bent portion. The bent portion is located in a region other than the center of the display unit. The display unit may have a plurality of bent portions . When the display unit has a plurality of bent portions, at least one of the bent portions is located in a region other than the center of the display unit .

[0010] Also, one aspect of the present invention has a flexible display unit and a light-transmissive region. When the display unit is bent, a part of the display unit can be visually recognized from the outside through the light-transmissive region. The light-transmissive region may have an opening or may have a configuration having a light-transmissive member, and may have other functions. For example, it may have functions such as a touch panel , a keyboard, etc.

[0011] Also, one aspect of the present invention has a housing, a flexible display unit, and a winding unit. The display unit is connected to the winding unit, and the winding unit has a function of winding and storing a part of the display unit

[0012] . ​​​​Furthermore, one aspect of the present invention has a flexible display unit. The display unit has a first region and a second region It has the area of ​​the first area. Even when the first area is stored in a way that it cannot be seen from the outside, The second area is visible from the outside. Therefore, the second area can be used as a sub-display. It is possible to do so.

[0013] In the above configuration, a method for concealing the first area of ​​the display unit so that it cannot be seen from the outside is: The first area may be rolled up or folded. It could also be stored inside the body.

[0014] Furthermore, in each of the above configurations, the second area of ​​the display unit has functions other than those of a sub-display. It may also have other functions. For example, it may have functions such as a touch panel or keyboard. That's fine.

[0015] Furthermore, in each of the above configurations, the second region is exposed on the surface by a translucent material. Even if it is protected from being exposed,

[0016] The display unit only needs to be flexible, for example, it may have an electroluminescent element. It can also be constructed with transistors. Transistors are silicon It may be a transistor using semiconductors, or it may be a transistor using oxide semiconductors. Good. As an oxide semiconductor, an oxide containing one of indium, gallium, or zinc, etc. You can use it. [Effects of the Invention]

[0017] In one aspect of the present invention, a display device or electronic device can be provided in which the sense of separation of the display is suppressed. Alternatively, in one aspect of the present invention, a compact display device or electronic device can be provided. In one aspect of the invention, a lightweight display device or electronic device can be provided. Or, one aspect of the invention In one embodiment, a display device or electronic device with a narrow bezel can be provided. Or, in one embodiment of the present invention This can provide a display device or electronic device that is less prone to damage. Alternatively, in one aspect of the present invention, A display device or electronic device with reduced power consumption can be provided. Or, in one aspect of the present invention, This allows us to provide novel display devices or electronic devices.

[0018] Furthermore, the description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. Furthermore, other effects are... This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings Furthermore, it is possible to extract other effects from the descriptions in the claims and other documents. [Brief explanation of the drawing]

[0019] [Figure 1] A diagram showing an example of an electronic device. [Figure 2] A diagram showing an example of an electronic device. [Figure 3] A diagram showing an example of an electronic device. [Figure 4] A diagram showing an example of an electronic device. [Figure 5] A diagram showing an example of an electronic device. [Figure 6] A diagram showing an example of an electronic device. [Figure 7] A diagram showing an example of an electronic device. [Figure 8] A diagram showing an example of an electronic device. [Figure 9] A diagram showing an example of a display device. [Figure 10] A diagram showing an example of a display device. [Figure 11] A diagram showing an example of a display device. [Figure 12] A diagram showing an example of a display device. [Figure 13] A diagram showing an example of a display device. [Figure 14] A diagram showing an example of a display device. [Figure 15] A diagram showing an example of a display device. [Figure 16] A diagram showing an example of a display device. [Figure 17] A diagram showing an example of a display device. [Figure 18] A diagram showing an example of an electronic device. [Figure 19] A diagram showing an example of an electronic device. [Figure 20] A diagram showing an example of an electronic device. [Modes for carrying out the invention]

[0020] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0021] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0022] Furthermore, the position, size, and scope of each component shown in the drawings, etc., are for ease of understanding. The position, size, and range of the edges may not be shown. Therefore, the disclosed invention is not necessarily However, this is not limited to the location, size, and scope disclosed in drawings, etc.

[0023] (Embodiment 1) In this embodiment, Figures 1 and 2 are used to describe an electronic device to which one aspect of the present invention is applied. I will explain.

[0024] Examples of electronic devices include television equipment (also known as televisions or television receivers). (u) Computers, digital cameras, digital video cameras, digital photo frames , mobile phones (also called mobile phones or mobile phone devices), portable game consoles, personal digital assistants, sound Examples include sound reproduction devices and large-scale game machines such as pachinko machines.

[0025] These electronic devices, in addition to the display shown below, also have operation buttons, external connection ports, and speakers. It may also be equipped with a microphone, etc. Furthermore, a touch panel or sensor may be provided on the display unit. Furthermore, information can be entered by touching or holding a finger over the display. The buttons allow you to turn the power on and off, change the type of image displayed on the screen, and adjust the volume. It is also possible to switch between these options.

[0026] The electronic device of this embodiment has a highly flexible display unit. The electronic device of this embodiment has a highly flexible display unit. The display unit, which is highly flexible, can be bent to allow it to be folded. Electronic device of this embodiment It offers excellent portability when folded and a seamless, wide display area when unfolded. This provides excellent readability in the display.

[0027] Furthermore, when the electronic device of this embodiment is not in use, the display unit can be bent so that the display surface faces inward. This helps to prevent scratches and dirt from getting on the display surface.

[0028] The following describes a foldable electronic device having a highly flexible region and a less flexible region. Let's explain using a container as an example. Areas with high flexibility can be bent and flexed. This is the curved section (hereinafter also referred to as the bent section).

[0029] In the electronic device of this embodiment, the highly flexible region can be bent inward or outward. It can be bent.

[0030] In this specification, the case in which the display surface of the display unit is bent inward is referred to as "inward bending". When a part is bent so that the display surface faces outward, it is referred to as "outward bending." Also, electronic devices and displays In a device, the display surface refers to the surface on which the user views the display.

[0031] Figures 1(A) and 2(A) are plan views of the electronic device with the display unit unfolded. Figure 1(B) is a plan view of the electronic device with the display unit folded. Figure 1(C) is a plan view of Figure 1 (B) is an example of a side view of the electronic device when the display unit shown is folded, viewed from the direction of the arrow. Yes. Figures 2(B) and 2(C) show the electronic device shown in Figure 2(A) viewed from the direction of the arrow. This is an example of a side view, and Figure 2(D) is a cross-sectional view between the dashed line A and B in Figure 2(A). This is one example.

[0032] The electronic device shown in Figure 1(A) has a highly flexible region E1, a less flexible region E2, and a flexible region It has a region E3 with low flexibility, and the regions with high flexibility and low flexibility are each band-shaped (striped). It is provided in this embodiment. Multiple highly flexible regions and multiple less flexible regions An example is shown where the regions are parallel to each other, but the regions do not necessarily have to be arranged parallel to each other.

[0033] In the electronic device shown in Figure 1, the highly flexible region E1 is located in an area other than the center of the display. Therefore, the width of the less flexible region E2 is smaller than the width of the less flexible region E3 (E3 >E2). Furthermore, the configuration is not limited to that shown in Figure 1, and the width of the less flexible region E2 is A configuration where the width of the less flexible region E3 is greater than that of E2 (E2 > E3) is also acceptable.

[0034] In the electronic device shown in Figure 1, the portion included in the highly flexible region E1 of the display unit is a bent portion. It can function as follows. The electronic device shown in Figure 1(A) is folded in the highly flexible region E1. When bent, as shown in Figure 1(B), a portion of the display located in the less flexible region E3 is It overlaps with the less flexible region E2, but other parts do not overlap with the less flexible region E2 and are exposed. In other words, when folded, part of the display is not visible from the outside, while other parts are not visible. It can be seen. Therefore, even when folded, the display part is visible. A portion of it can be used as a sub-display. The sub-display shows the time. It can also include features to display incoming messages such as emails and phone calls.

[0035] By using a portion of the display unit as a sub-display, a separate sub-display can be installed. This eliminates the need for manual labor. Therefore, it is possible to simplify the manufacturing process and reduce costs.

[0036] Furthermore, by using a portion of the display unit as a sub-display, some information can be obtained. Therefore, it becomes unnecessary to use the entire display area. Consequently, compared to when the entire display area is used, The power consumption of the display unit can be reduced. In other words, it can be folded and is not visible to the user. By hiding areas that are not present, the power consumption of electronic devices can be reduced.

[0037] In the case of a display device having a main display and a sub-display independently, the manufacturing process From the perspective of simplification and cost reduction, a sub-display is more efficient than a main display. The resolution is often low. On the other hand, in one aspect of the present invention, a part of the main display is sub It can be used as a secondary display. Therefore, when using a secondary display... It can also display content with the same level of detail as the main display.

[0038] Therefore, in one embodiment of the present invention, it is preferable to use a high-resolution display device for the display unit. i. By applying one aspect of the present invention, the main components configured by this high-definition display device A portion of the display area can be used as a sub-display. This increases the manufacturing process and costs. You can obtain a high-definition sub-display without spending a fortune.

[0039] The electronic device of this embodiment has a flexible display unit. The display unit is flexible. Various display devices can be used. For example, an EL element (organic EL elements including materials and inorganic materials, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs) Color LEDs (green LEDs, blue LEDs, etc.), transistors (transistors that emit light according to the current) ZISTA, electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light Valves (GLV), plasma displays (PDP), MEMS (microelectronics) Display elements using mechanical systems, digital micromirror devices (DMD) ), DMS (Digital Micro Shutter), Interference Modulation (IMOD) element, shutter - MEMS display elements using the - method, optical interference method MEMS display elements, electrowetting A small number of elements such as piezoelectric ceramic displays and display elements using carbon nanotubes. It possesses at least one. In addition to these, it also has contrast due to electrical or magnetic effects. The display medium may have a change in brightness, reflectance, transmittance, etc., and may use an electron emission element. Examples of such display devices include field emission displays (FEDs) or SEDs. Surface-conduction electrostatic display (SED) Examples include n-emitter displays. Also, displays using liquid crystal elements. Examples of devices include liquid crystal displays (transmissive liquid crystal displays, semi-transmissive liquid crystal displays) (i) Reflective liquid crystal displays, direct-view liquid crystal displays, projection liquid crystal displays, etc. Examples include electronic inks, electronically operated powder fluids, or electrophoretic elements. Examples of display devices include electronic paper. (Note: Semitransmissive liquid crystal displays...) When realizing a reflective liquid crystal display, some or all of the pixel electrodes are reflective. The goal is to have it function as a radiation electrode. For example, part or all of the pixel electrodes. However, it is sufficient to have aluminum, silver, etc. Furthermore, in that case, the reflecting electrode It is also possible to install memory circuits such as SRAM below. This further reduces power consumption. The force can be reduced.

[0040] In particular, display devices using organic EL elements have high flexibility and impact resistance, and can be made thin and lightweight. This is preferable because it allows for the use of organic EL elements in the display unit. Therefore, for example, it can be bent with a radius of curvature of 1 mm or more and 100 mm or less, It can be suitably used in electronic devices that are folded one or more times by bending inward or outward.

[0041] In this embodiment, the highly flexible region E1 in the electronic device is at least flexible It is sufficient to have a display device. In Figure 1, the highly flexible region E1 is the display device It has a mounting 11. Furthermore, as shown in Figure 2(D), the display device 11 has a display area 11a and It may have a non-display area 11b. For example, an organic EL element may be used as the display device 11. Using a display device allows for high flexibility and impact resistance, as well as thinness and lightness, making it preferable. It's nice.

[0042] Areas E2 and E3 in electronic devices with low flexibility are at least flexible display The device consists of a support that is less flexible than the display device, stacked on top of each other.

[0043] The electronic equipment shown in Figures 1 and 2(A), (B), and (D) consists of support 15a and support 1 It has 5b. Supports 15a and 15b have lower flexibility than the display device 11. Support 1 5a and 15b are spaced apart from each other.

[0044] The support is provided on at least one side of the display device, either on the display surface side or the side opposite to the display surface. However, as shown in Figures 1 and 2, the support 15a is placed on the display surface side of the display device 11, Having a support 15b on the opposite side of the surface allows the display device to be sandwiched between the pair of supports. This is preferable because it increases the mechanical strength of areas with low flexibility, making electronic devices less prone to damage.

[0045] Furthermore, instead of supports 15a and 15b, support 15 shown in Figure 2(C) is used. A display device 11 may be placed between the 5s.

[0046] If the display device 11 has a support on only one side, either the display surface side or the side opposite the display surface, This is preferable as it allows for the thinning or weight reduction of electronic devices. For example, without using the support 15a. Alternatively, the electronic device may have only the support 15b.

[0047] The highly flexible region E1, and the less flexible regions E2 and E3 are more flexible than the display device and the support. It is preferable to have a highly flexible protective layer layered on top of it. This improves the flexibility of the electronic device. The region E1, which has high flexibility and mechanical strength, is a region that makes electronic equipment more resistant to breakage. It can be made less susceptible to damage. Even in areas with high flexibility, electronic devices can be affected by external forces, etc. The shape can be designed to make it less prone to breaking.

[0048] In Figure 1, the display device 11 is protected by a protective layer 13 on the side opposite to the display surface. Yes, they are.

[0049] The thickness of the display device 11, the supports 15a and 15b, and the protective layer 13 is, for example, In this case, a configuration in which the support is the thickest and the display device is the thinnest is preferred. Also, the display device 11, support The flexibility of the body 15a and the protective layer 13, for example, the flexibility of the supports 15a and 15b A configuration with the lowest stress and the highest flexibility of the display device 11 is preferred. As a result, the difference in flexibility between the highly flexible region E1 and the less flexible regions E2 and E3 is large. This makes it possible to create a structure that can be reliably bent in a highly flexible region. This suppresses bending in the less flexible region E2 or E3, improving the reliability of electronic devices. It can improve functionality. Furthermore, it can prevent a decline in the design aesthetics of electronic devices when they are folded. It can be controlled.

[0050] If the display device 11 has protective layers on both the display surface side and the side opposite the display surface, then the pair of protective layers Therefore, since the display device can be held in place, the mechanical strength of the electronic device is increased, and the electronic device is less likely to break. This makes it less likely to occur, which is desirable.

[0051] For example, as shown in Figure 2(B), in the less flexible regions E2 and E3, a pair of protective layers 13a and 13b are located between a pair of supports 15a and 15b, and the display device 11 is a pair of protectors It is preferable that it be located between layers 13a and 13b.

[0052] Alternatively, as shown in Figure 2(C), in the less flexible regions E2 and E3, a pair of protective layers 13a and 13b are located between the support 15, and the display device 11 is a pair of protective layers 13a and 13b It is preferable that it be located between these two points.

[0053] If the protective layer is present only on either the display surface side or the side opposite the display surface, It is preferable to make the sub-device thinner or lighter. For example, by using a protective layer 13a Alternatively, the electronic device may have only the protective layer 13b.

[0054] Furthermore, if the protective layer 13a on the display surface side of the display device is a light-shielding film, then the non-display area of ​​the display device will be exposed. This suppresses the illumination of light. As a result, the drive circuit included in the non-display area This is preferable because it can suppress photodegradation of transistors and other components.

[0055] As shown in Figure 2(D), the opening of the protective layer 13a provided on the display surface side of the display device 11 is It overlaps with the display area 11a of the display device. Also, a non-display area 11 surrounds the display area 11a in a frame shape. b and the protective layer 13a are arranged to overlap. On the opposite side of the display surface of the display device 11 The provided protective layer 13b overlaps with the display area 11a and the non-display area 11b. Layer 13b is wider than protective layer 13a so as to be in contact with the surface of the display device 11 opposite to the display surface. Within the range, and particularly preferably so as to be in contact with the entire surface opposite to the display surface of the display device 11. This allows for more reliable protection of the display device and enhances the reliability of electronic devices. ru.

[0056] The protective layer or support can be formed using plastic, metal, alloy, rubber, etc. By using materials such as rubber, a lightweight and durable protective layer or support can be obtained. Preferred. For example, silicone rubber as a protective layer, stainless steel or aluminum as a support. You should use "mu".

[0057] Furthermore, it is preferable to use materials with high toughness for the protective layer and support. This provides impact resistance. This enables the creation of electronic devices that are highly durable and resistant to damage. For example, organic resins and thin metal materials. By using materials and alloys, it is possible to create lightweight and durable electronic devices. For similar reasons, it is preferable to use a highly tough material for the substrate that makes up the display device. .

[0058] The protective layer and support located on the display surface side are light-transmitting when they do not overlap with the display area of ​​the display device. Gender is irrelevant. The protective layer or support located on the display surface side overlaps with at least a portion of the display area. In such cases, it is preferable to use a material that transmits the display from the display device. The light transmittance of the protective layer or support located on the opposite side of the surface is not a concern.

[0059] When bonding any two of the following: a protective layer, a support, or a display device, various adhesives can be used. This can be achieved, for example, with two-component resins that harden at room temperature, photocurable resins, and heat-curable resins. Resins such as curable resins can be used. Alternatively, sheet-type adhesives may be used. Also, screws that penetrate two or more of the protective layer, support, or display device, or pins that clamp them together. Alternatively, clips or similar devices may be used to secure each component of the electronic device.

[0060] The electronic device of this embodiment determines whether or not a highly flexible region is bent. It may have a sensor, such as a switch, MEMS pressure sensor, or pressure sensor. It can be constructed using the following:

[0061] The protective layer 13 may be provided in multiple locations. As an example, see Figure 18(A) An example is shown where two protective layers 13 are provided. In this case, as shown in Figure 18(B)... The display device 11 can be made visible by bending it in a specific way. Also, see Figure 18. The folding method shown in (C) allows the display device 11 to be hidden. This allows for better protection of the display device 11. By changing the folding point in this way... This allows for the implementation of multiple functions.

[0062] Furthermore, if the display device is completely fixed by a protective layer or support, when bending the electronic device, The display device may be pulled and damaged. Also, when deploying electronic devices... This can cause the display device to contract, potentially damaging it. It is preferable that the sub-device is not completely fixed to the display device by a protective layer or support. As a result, when folding or unfolding electronic devices, the display device slides, The position of the display device relative to the protective layer or support changes. As a result, force is applied to the display device, and the surface This can prevent damage to the display device.

[0063] This embodiment can be combined with other embodiments as appropriate.

[0064] (Embodiment 2) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figure 3.

[0065] The electronic device shown in Figure 3 is an electronic device that has a light-transmitting region 17. The region having light-transmitting properties is formed using a translucent material.

[0066] The electronic device shown in Figure 3 has a highly flexible region E1, a less flexible region E2, and a less flexible region Region E3, region E4 including a translucent region 17, and a highly flexible region at the center of the electronic device. It has region E1, that is, it has the width of region E2 which is less flexible and region 17 which is translucent. The total width of region E4 is approximately the same as the width of region E3, which has low flexibility.

[0067] In the electronic device shown in Figure 3, the portion of the display device 11 included in the highly flexible region E1 can bend. It can function as a curved section. The electronic device shown in Figure 3(A) can be used in the highly flexible region E1. When folded, as shown in Figure 3(B), the translucent region 17 and the display area of ​​the display section are separated. Area 11a overlaps. Therefore, the user can use a light-transmitting part of the display area 11a of the display unit. It can be seen through region 17. Therefore, with the electronic device folded Even if present, a portion of the display area that can be seen through the light-transmitting area 17 is a sub-display. It can be used as such.

[0068] As shown in Figure 3(B), when the electronic device is folded, the display section is translucent. It is protected by a component. Therefore, the display surface can be prevented from being exposed. Therefore, it can mitigate external impacts to the display surface and prevent scratches and stains.

[0069] The light-transmitting region 17 has an opening or a configuration having a light-transmitting member. It would be good to have it. In the case of a configuration with a light-transmitting material, the surface of the display part should not be exposed. It is preferable because it is protected. Also, the light-transmitting region 17 may have other functions. i. For example, it may have functions such as a touch panel or keyboard. Translucent area If area 17 has functions such as a touch panel or keyboard, it can be used as a sub-display. It is also possible to display buttons, a keyboard, and other elements on a portion of the functional display area.

[0070] Furthermore, the shape of the translucent region 17 is not particularly limited. Figure 3 shows the case where it is roughly rectangular. As shown, it may be round or polygonal. Also, supports 15a and 15b It is formed from a translucent material, and the entire region with low flexibility is shaped to be translucent. It is permissible.

[0071] Furthermore, the translucent regions 17 can be arranged in various sizes. For example, An example of an electronic device in which the area of ​​the light-transmitting region 17 is smaller than in the case of Figure 3 is shown in Figure 3. This is shown in Figures 19(A), 19(B), and 19(C). The translucent region 17 is small. Therefore, in region E4 which includes the light-transmitting region 17, for example, an operation button 31 or an image Sensors such as the 32 can be placed on the surface.

[0072] Alternatively, a new configuration may be obtained by combining the configuration shown in one drawing with the configuration shown in another drawing. It may also be an electronic device. For example, an example of combining Figure 1 and Figure 3 is shown in Figure 20(A ), shown in Figures 20(B) and 20(C).

[0073] This embodiment can be combined with other embodiments as appropriate.

[0074] (Embodiment 3) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figures 4 to 6. This embodiment describes an electronic device that has multiple highly flexible regions.

[0075] By providing multiple highly flexible regions, it becomes possible to fold the material multiple times. Therefore, If the display area is the same size, it is better to be able to fold it multiple times rather than just once. Being able to fold it makes it more compact and more portable. An electronic device can be obtained. Also, if the electronic device is the same size when folded, The display section that can be folded more times will have a larger display when unfolded. As it becomes the display part, it is possible to obtain electronic devices with superior visibility.

[0076] Figures 4 to 6 show an example of an electronic device with multiple highly flexible regions. In Figure 4, An example is shown in which four highly flexible regions E1 are provided. The electronic device shown in Figure 4(A) is shown in Figure 4(C). As shown, by bending it in the highly flexible region E1, it can be folded into a screen shape. This can be done. At this time, as shown in Figure 4(B), only a part of the display unit is visible to the user. This can be visually observed. The electronic device shown in Figure 4(A) has a width of approximately the low-flexibility region E2. Because they are the same (approximately equal), by folding, the width can be made approximately equal to that of E2. It can be reduced to about one-fifth of its width when unfolded.

[0077] Figure 5 also shows an example in which three highly flexible regions E1 are provided. The electronic device shown in Figure 5(A) By bending it in the highly flexible region E1, a screen-like structure can be formed as shown in Figure 5(C). It can be folded into a shape. As a result, in the state shown in Figure 5(B), it has light-transmitting properties. A portion of the display unit can be viewed through the area 17.

[0078] The number of highly flexible regions is not particularly limited; it may be two, five or more, or any other number.

[0079] Furthermore, Figures 4 and 5 show examples of folding it into a screen-like shape, but the folding method is also screen-like. It is not limited to this. It may be folded in various ways.

[0080] Furthermore, the number of times it can be bent is not particularly limited. In a device, it is not always necessary to fold the electronic device using all highly flexible regions E1. No. For example, the electronic device shown in Figure 6(A) has seven highly flexible regions E1. Figure 6 (B) is an example of bending once in an arbitrary highly flexible region E1, as shown in Figure 6(C). Figure 6(D) shows an example where the display device 11 is folded once to conceal it, while Figure 6(D) shows an example where it is folded four times. This is an example.

[0081] By providing multiple highly flexible regions E1 in an electronic device, any highly flexible region E In step 1, the electronic device becomes foldable. Therefore, in the folded state It becomes possible to shape electronic devices into desired shapes. Also, the size when folded. It becomes possible to adjust the size to your desired dimensions. In other words, the size and shape of the bag or pocket you want to store it in. Electronic devices can be folded to fit their shape.

[0082] By providing multiple highly flexible regions E1, when the electronic device is folded, The size of the externally exposed display unit, or the position in which the display unit is exposed, can be adjusted. Therefore, it becomes possible to set a sub-display of the user's desired size. By providing multiple highly flexible regions E1, a sub-display can be configured in the desired arrangement. This becomes possible. For example, right-handed and left-handed users may have different preferences for the secondary display they prefer to use. Although the arrangement differs, by providing multiple highly flexible areas E1, it is easier for right-handed people to use. We can also accommodate requests for layouts that are easy to use for left-handed people, such as a convenient layout for easy use.

[0083] By providing multiple highly flexible regions E1, the bending point can be changed. Therefore, the damage caused by bending can be dispersed, improving the reliability of electronic devices. It can be done.

[0084] In Figures 4 to 6, the widths of multiple less flexible regions are approximately the same (approximately uniform). As shown in Figure 1, the widths of the less flexible regions may differ. Furthermore, although Figure 6 shows an example without a translucent region, a translucent region can be provided. That's fine.

[0085] This embodiment can be combined with other embodiments as appropriate.

[0086] (Embodiment 4) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figure 7. In terms of form, we will describe an electronic device that has a large area of ​​high flexibility. By providing a wide area, it becomes possible to fold the area at a desired position within the highly flexible region. It is possible.

[0087] Figure 7 shows the case where the width of the highly flexible region E1 is wider than that of the less flexible region E2. To indicate a vessel.

[0088] Figure 7(A) is a plan view of the electronic device in its unfolded state, and Figure 7(B) is a plan view of the device folded multiple times. This is a plan view of the folded state. Figure 7(C) shows the state after multiple folds, but Figure 7(B) This is a plan view of a case where the number of folds is less than that shown in Figure 7(D), and Figure 7(D) shows the case with 1 fold. This is a plan view of the folded state.

[0089] As shown in Figure 7, the electronic device has a wide area of ​​high flexibility E1, therefore the area of ​​high flexibility E1 can be folded at any position. Therefore, the folding position and the folding You can freely set the number of folds. You can freely set the folding position and the number of folds. By doing so, the size and placement of a portion of the display area visible to the user when folded can be adjusted. It can be freely configured. Furthermore, the shape and size when folded can also be freely configured. It is possible.

[0090] Furthermore, by providing a wide area of ​​high flexibility E1, the bending point can be changed. Because it can be bent, the damage inflicted on electronic devices can be dispersed. This can improve the reliability of electronic devices.

[0091] Figure 7 shows an example without a translucent region, but it is also possible to include a translucent region. stomach.

[0092] This embodiment can be combined with other embodiments as appropriate.

[0093] (Embodiment 5) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figure 8. Embodiments 1 to 4 describe a form in which the display unit is folded, but this embodiment Now, let's explain the form in which the display unit is rolled up.

[0094] The electronic device shown in this embodiment has a display unit and a winding unit. The display unit is flexible. The winding unit winds up a portion of the display unit (the first region 11c). It has a storage function (reel).

[0095] The electronic device shown in Figure 8 has a housing 10, a display device 11, a winding section 16, and a fixing section 19. Furthermore, an operation button 21 may be provided. The display device 11 has a first area 11c and a second area It has a region 11d. In addition, a member 20 is provided at the end of the second region 11d, and the display part A member 18 may be provided at the boundary between the first region 11c and the second region 11d.

[0096] Figure 8(A) is a perspective view of the display unit in its unfolded state, and Figure 8(B) shows a part of the display unit (the first Figure 8(C) is a perspective view of the rolled-up state of region 11c), and Figure 8(C) shows the second region 11d of the display unit. This is a side view showing the casing wrapped around the outside of the enclosure.

[0097] When the display unit is to be stored, as shown in Figure 8(B), the winding unit 16 will retract the display unit. A portion (the first region 11c) is rolled up and stored. The portion that was not stored (the second region 11c) d) is wrapped around the outside of the housing 10 and secured with the fixing part 19, as shown in Figure 8(C). Even when the display unit is retracted and in a highly portable state, the display unit is located on the outside of the housing 10. A portion of it (the second area 11d) is visible to the user. In other words, as a sub-display It can be used.

[0098] As shown in Figure 8, the boundary separating the first area 11c and the second area 11d of the display unit is as follows: A member 18 can be provided. The member 18 has a second region 11d that is wound around the winding section 16. It has a function to prevent it from being taken. Note that member 18 does not need to be provided. In this case, there is no boundary between the first region 11c and the second region 11d, resulting in a table with excellent visibility. This allows for a display unit where the sense of separation between the display elements is suppressed.

[0099] Furthermore, as shown in Figure 8, the fixing portion 19 wraps the second region 11d around the outside of the housing 10. When this happens, it is sufficient that it has the function of fixing the second region 11d, and the length of the second region 11d The length that can be fixed can be adjusted accordingly. Also, the fixing part 19 can be positioned at any desired location. The function may also be incorporated to secure the electronic device shown in this embodiment to a pocket, etc. The fixing part 19 may also be provided with a function to secure it in place.

[0100] It is preferable to provide member 20 at the end of the display section (the end of the second region 11d). Member 20 Having this feature makes it easier to fix the device using the fixing part 19.

[0101] As shown in this embodiment, by providing a winding section, the display section bends. This can suppress damage. It also prevents the display from being bent at a sharp angle. This allows for improved reliability of the display unit.

[0102] This embodiment can be combined with other embodiments as appropriate.

[0103] (Embodiment 6) In this embodiment, a display panel that can be used in the display unit of a display device according to one aspect of the present invention. An example is shown. In this embodiment, as an example of a display panel, a flexible display panel using an organic EL element is shown. The present invention describes a light-emitting device having properties, but is not limited to this embodiment.

[0104] <Configuration Example 1-1> Figure 9(A) shows a plan view of the light-emitting device, and Figure 9(B) shows the dashed line X1-Y1 in Figure 9(A). A cross-sectional view is shown. The light-emitting device shown in Figure 9(B) uses a top emission method with a painted design. It is a type N-shaped light-emitting device.

[0105] The light-emitting device shown in Figure 9(A) consists of a light-emitting unit 491, a drive circuit unit 493, and an FPC (Flexible Printed Circuit). It has a Printed Circuit (495). Light-emitting section 491 and drive circuit section The organic EL elements and transistors included in 493 are on flexible substrate 420, flexible substrate 428, and sealed by adhesive layer 407.

[0106] The light-emitting device shown in Figure 9(B) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a transistor Zistor 455, insulating layer 463, insulating layer 465, insulating layer 405, organic EL element 450 (bottom) electrode 401, EL layer 402, and upper electrode 403), adhesive layer 407, flexible substrate 428, and has a conductive layer 457. The flexible substrate 428, adhesive layer 407, and upper electrode 403 are flexible. It transmits visible light.

[0107] In the light-emitting section 491 of the light-emitting device shown in Figure 9(B), via the adhesive layer 422 and the insulating layer 424 A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420. The EL element 450 has a lower electrode 401 on the insulating layer 465 and an EL layer 4 on the lower electrode 401. It has 02 and an upper electrode 403 on the EL layer 402. The lower electrode 401 is a transistor It is electrically connected to the source or drain electrode of 455. The lower electrode 401 is visible light It is preferable that it reflects light. The end of the lower electrode 401 is covered with an insulating layer 405.

[0108] The drive circuit section 493 has multiple transistors. In Figure 9(B), the drive circuit section 493 is This shows one of the transistors it possesses.

[0109] The conductive layer 457 receives external signals (video signal, clock signal, etc.) from the drive circuit section 493. It is electrically connected to an external input terminal that transmits a signal (such as a reset signal or a power signal) or electric potential. This example shows the FPC495 being provided as an external input terminal.

[0110] To prevent an increase in the number of manufacturing steps, the conductive layer 457 is the same as the electrodes and wiring used in the light-emitting section and drive circuit section. It is preferable to manufacture it using one material and the same process. Here, the conductive layer 457 is transient This shows an example where the source and drain electrodes of the sta were fabricated using the same materials and process.

[0111] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. Furthermore, the insulating layer 465 has a planarization function to reduce surface irregularities caused by transistors. It is preferable to select an insulating film having a specific properties.

[0112] <Configuration Example 1-2> Figure 9(A) shows a plan view of the light-emitting device, and Figure 9(C) shows the dashed line X1-Y1 in Figure 9(A). A cross-sectional view is shown. The light-emitting device shown in Figure 9(C) uses a bottom emission with a color filter method. It is a cushion-type light-emitting device.

[0113] The light-emitting device shown in Figure 9(C) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a transistor Distor 454, transistor 455, insulating layer 463, colored layer 432, insulating layer 465, conductive Layer 435, insulating layer 467, insulating layer 405, organic EL element 450 (lower electrode 401, EL layer) 402, and upper electrode 403), adhesive layer 407, flexible substrate 428, and conductive layer 457 It has: Flexible substrate 420, adhesive layer 422, insulating layer 424, insulating layer 463, insulating layer 465 The insulating layer 467 and the lower electrode 401 transmit visible light.

[0114] In the light-emitting section 491 of the light-emitting device shown in Figure 9(C), via the adhesive layer 422 and the insulating layer 424 A switching transistor 454 and a current control transistor are placed on the flexible substrate 420. 455 and an organic EL element 450 are provided. The organic EL element 450 has an insulating layer 46 7 The lower electrode 401 on the lower electrode 401, the EL layer 402 on the lower electrode 401, and the upper electrode on the EL layer 402 It has an electrode 403. The lower electrode 401 is connected to the transistor 455 via the conductive layer 435. It is electrically connected to the - electrode or drain electrode. The end of the lower electrode 401 is insulated by the insulating layer 40 It is covered with 5. The upper electrode 403 preferably reflects visible light. Also, the light-emitting device It has a colored layer 432 on an insulating layer 463 that overlaps with the organic EL element 450.

[0115] The drive circuit section 493 has multiple transistors. In Figure 9(C), the drive circuit section 493 is This shows two of the transistors it possesses.

[0116] The conductive layer 457 has an external input terminal that transmits external signals and potentials to the drive circuit section 493 and an electrical Connect them electrically. Here, we show an example where an FPC495 is provided as an external input terminal. Furthermore, this example shows that the conductive layer 457 was fabricated using the same material and process as the conductive layer 435. This indicates.

[0117] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. Furthermore, insulating layers 465 and 467 reduce surface irregularities caused by transistors and wiring. Therefore, it is preferable to select an insulating film that has a planarization function.

[0118] <Configuration Example 1-3> Figure 9(A) shows a plan view of the light-emitting device, and Figure 10(A) shows the dashed line X1-Y in Figure 9(A). A cross-sectional view of section 1 is shown. The light-emitting device shown in Figure 10(A) uses a color filter method. It is an emission-type light-emitting device.

[0119] The light-emitting device shown in Figure 10(A) consists of a flexible substrate 420, an adhesive layer 422, an insulating layer 424, and a tra Insulator 455, insulating layer 463, insulating layer 465, insulating layer 405, insulating layer 496, organic EL Element 450 (lower electrode 401, EL layer 402, and upper electrode 403), adhesive layer 407, shielding Light layer 431, coloring layer 432, overcoat 453, insulating layer 226, adhesive layer 426, flexible It has a flexible substrate 428 and a conductive layer 457. Flexible substrate 428, adhesive layer 426, insulating layer 2 26. The adhesive layer 407 and the upper electrode 403 transmit visible light.

[0120] In the light-emitting section 491 of the light-emitting device shown in Figure 10(A), via the adhesive layer 422 and the insulating layer 424 A transistor 455 and an organic EL element 450 are provided on the flexible substrate 420. The organic EL element 450 consists of a lower electrode 401 on an insulating layer 465 and an EL layer on the lower electrode 401. It has a 402 and an upper electrode 403 on the EL layer 402. The lower electrode 401 is a transient It is electrically connected to the source or drain electrode of 455. The end of the lower electrode 401. It is covered with an insulating layer 405. On top of the insulating layer 405, there is an insulating layer 496. Insulating layer 4 By providing 96, the distance between the flexible substrate 420 and the flexible substrate 428 can be adjusted. The lower electrode 401 preferably reflects visible light. The light-emitting device also has an adhesive layer 40 It has a colored layer 432 that overlaps with the organic EL element 450 via 7, and is insulated via an adhesive layer 407. It has a light-shielding layer 431 that overlaps with layer 405.

[0121] The drive circuit section 493 has multiple transistors. In Figure 10(A), the drive circuit section 493 This shows one of the transistors that it possesses.

[0122] The conductive layer 457 has an external input terminal that transmits external signals and potentials to the drive circuit section 493 and an electrical Connect them electrically. Here, we show an example where an FPC495 is provided as an external input terminal. Furthermore, here, the conductive layer 457 is connected to the source electrode and drain electrode of the transistor 455. An example is shown that was manufactured using the same materials and process. The connector 497 on the insulating layer 226 is made of the insulating layer Provided in 226, overcoat 453, adhesive layer 407, insulating layer 465, and insulating layer 463 It is connected to the conductive layer 457 through an opening. Also, the connector 497 is connected to the FPC 495. They are connected. The FPC 495 and the conductive layer 457 are electrically connected via the connector 497.

[0123] <Configuration Example 1-4> Figure 11(A) shows a plan view of the light-emitting device, and the dashed line G1-G2 in Figure 11(A) A cross-sectional view is shown in Figure 11(B). Furthermore, as a modified example, a cross-sectional view of the light-emitting device is shown in Figure 10(B). show.

[0124] The light-emitting device shown in Figures 10(B) and 11(B) consists of an element layer 1301, an adhesive layer 1305, and a flexible element. It has a flexible substrate 1303. The element layer 1301 consists of a flexible substrate 1401, an adhesive layer 1403, and an insulating layer. Edge layer 1405, multiple transistors, conductive layer 1357, insulating layer 1407, insulating layer 1409 Multiple light-emitting elements, insulating layer 1411, adhesive layer 1413, overcoat 1461, light-shielding layer It has 1457 and an insulating layer 1455.

[0125] Figure 11(B) shows an example in which a colored layer 1459 is provided in superimposed on each light-emitting element. A colored layer 1459 is provided in a position that overlaps with element 1430, and a position that overlaps with insulating layer 1411. A light-shielding layer 1457 is provided. The colored layer 1459 and the light-shielding layer 1457 are overcoated. It is covered with 1461. There is an adhesive layer between the light-emitting element 1430 and the overcoat 1461. It is filled with 413. Furthermore, a colored layer may be provided on top of all light-emitting elements. Alternatively, as shown in Figure 10(B), a colored layer may be provided overlapping with some of the light-emitting elements. For example, if one pixel is composed of four subpixels: red, blue, green, and white, then white For subpixels of color, a colored layer is not required. This reduces the amount of light absorbed by the colored layer. Because it is reduced, the power consumption of the light-emitting device can be reduced. Also, different for each sub-pixel A light-emitting element that emits a specific color may be fabricated. A light-emitting element that emits a different color for each sub-pixel may be fabricated. When manufacturing, it is not necessary to provide a colored layer.

[0126] The conductive layer 1357 is electrically connected to the FPC 1308 via the connector 1415. Figure 11 As shown in (B), a conductive layer 1357 is provided between the flexible substrate 1401 and the flexible substrate 1303. If provided, the connector 14 is provided in the openings in the flexible substrate 1303, adhesive layer 1305, etc. 15 should be placed. As shown in Figure 10(B), the flexible substrate 1303 and the conductive layer 135 If 7 does not overlap, it is provided on the insulating layer 1407 or insulating layer 1409 on the flexible substrate 1401. The connector 1415 can be placed in the girder opening.

[0127] The light-emitting element 1430 has a lower electrode 1431, an EL layer 1433, and an upper electrode 1435. The lower electrode 1431 is electrically connected to the source electrode or drain electrode of transistor 1440. It connects to the lower electrode 1431. The end of the lower electrode 1431 is covered with an insulating layer 1411. Light-emitting element 14 30 is a top emission structure. The upper electrode 1435 is translucent, and the EL layer 143 It transmits the light emitted by 3.

[0128] The light-emitting device has multiple transistors in the light extraction section 1304 and the drive circuit section 1306. Transistor 1440 is provided on insulating layer 1405. Insulating layer 1405 and The flexible substrate 1401 is bonded by an adhesive layer 1403. Also, an insulating layer 145 5 and the flexible substrate 1303 are bonded together by an adhesive layer 1305. Insulating layer 1405 If an insulating film with high gas barrier properties is used in the insulating layer 1455, the light-emitting element 1430 and transient It is possible to suppress the intrusion of impurities such as moisture and oxygen into the stage 1440, which is preferable because the reliability of the light-emitting device is high. This is preferable because it improves the reliability.

[0129] In Configuration Examples 1-4, an insulating layer 1405, a transistor 1440, and a light-emitting element 1430 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 1405, the transistor 1440, and the light-emitting element 1430 are transferred onto the flexible substrate 1 401 using the adhesive layer 1403, thereby showing a light-emitting device that can be fabricated. Also, in Configuration Examples 1-4, an insulating layer 1455, a coloring layer 1459, and a light-shielding layer 1457 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 1455, the coloring layer 1459, and the light-shielding layer 1457 are transferred onto the flexible substrate 1303 using the adhesive layer 1305, thereby showing a light-emitting device that can be fabricated. When a material (such as resin) with high moisture permeability and low heat resistance is used for the substrate, high temperature cannot be applied to the substrate in the fabrication process, so there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In the method for fabricating a light-emitting device according to one aspect of the present invention, since transistors and the like can be fabricated on a fabrication substrate with high heat resistance, transistors with high reliability and insulating films with sufficiently high gas barrier properties can be formed. Then, by transferring them onto a flexible substrate, a light-emitting device with high reliability can be fabricated. Thereby, in one aspect of the present invention, a lightweight or thin-type and highly reliable light-emitting device can be realized. Details of the fabrication method will be described later.

[0130] When a material (such as resin) with high moisture permeability and low heat resistance is used for the substrate, high temperature cannot be applied to the substrate in the fabrication process, so there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In the method for fabricating a light-emitting device according to one aspect of the present invention, since transistors and the like can be fabricated on a fabrication substrate with high heat resistance, transistors with high reliability and insulating films with sufficiently high gas barrier properties can be formed. Then, by transferring them onto a flexible substrate, a light-emitting device with high reliability can be fabricated. Thereby, in one aspect of the present invention, a lightweight or thin-type and highly reliable light-emitting device can be realized. Details of the fabrication method will be described later. It is preferable to use a material with high toughness for each of the flexible substrate 1303 and the flexible substrate 1401. This can realize a display device with excellent impact resistance and low breakage probability. For example This can realize a display device with excellent impact resistance and low breakage probability. For example a highly reliable light-emitting device can be fabricated. Details of the fabrication method will be described later.

[0131] It is preferable to use a material with high toughness for each of the flexible substrate 1303 and the flexible substrate 1401. This can realize a display device with excellent impact resistance and low breakage probability. For example If the flexible substrate 1303 is an organic resin substrate and the flexible substrate 1401 is a substrate using a thin metal material or an alloy material, compared with the case where a glass substrate is used for the substrate, it is lightweight and a light-emitting device that is difficult to break can be realized.

[0132] Since the metal material or alloy material has high thermal conductivity and can easily conduct heat throughout the substrate, local temperature rise of the light-emitting device can be suppressed, which is preferable. The thickness of the substrate using the metal material or alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

[0133] In addition, when a material with a high heat emissivity is used for the flexible substrate 1401, it is possible to suppress the surface temperature of the light-emitting device from becoming high and suppress the destruction and reliability degradation of the light-emitting device. For example, the flexible substrate 1401 may have a laminated structure of a metal substrate and a layer with a high heat emissivity (for example, a metal oxide or a ceramic material can be used for this).

[0134] <Example of material> Next, materials and the like that can be used for the light-emitting device will be described. Note that descriptions of the configurations described above in this embodiment will be omitted.

[0135] The element layer 1301 includes at least a light-emitting element. As the light-emitting element, an element that can emit light spontaneously can be used, and elements whose luminance is controlled by current or voltage are included in this category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, etc. can be used .

[0136] The element layer 1301 may further include a transistor for driving the light-emitting element, a touch sensor, etc.

[0137] The structure of the transistors in the light-emitting device is not particularly limited. For example, staggered transistors It can be a standard transistor, or an inverse staggered transistor. Also, a top-gate type or The transistor structure may be any bottom-gate type. The material used is not particularly limited; for example, silicon, germanium, oxide semiconductors, etc., can be used. good.

[0138] The state of the semiconductor material used in transistors is not particularly limited, including amorphous semiconductors and crystalline semiconductors. Semiconductors having properties (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or those with a crystalline region in part) Any of the semiconductors (that possess) may be used. In particular, if a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0139] Here, it is preferable to use a polycrystalline semiconductor for the transistor. For example, polycrystalline silicon It is preferable to use materials such as condensate. Polycrystalline silicon is formed at a lower temperature compared to single-crystal silicon. Furthermore, it offers higher field-effect mobility and greater reliability compared to amorphous silicon. By applying polycrystalline semiconductors like this to pixels, the aperture ratio of the pixels can be improved. Furthermore, even when pixels have extremely high resolution, the gate drive circuit and source drive circuit This makes it possible to form pixels on the same substrate, reducing the number of components that make up electronic devices. It is possible.

[0140] Alternatively, it is preferable to use an oxide semiconductor for the transistor. For example, silicon It is preferable to use an oxide semiconductor with a larger band gap than silicon. When using a semiconductor material with a wide dog-ear gap and a low carrier density, it is preferable because the current in the OFF state of the transistor can be reduced. This is preferable because it can reduce the current in the OFF state of the transistor.

[0141] For example, the oxide semiconductor preferably contains at least indium (In) or zinc (Zn). More preferably, it contains an oxide represented by In-M-Zn-based oxide (M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf).

[0142] For example, as the oxide semiconductor, indium oxide, tin oxide, zinc oxide, In-Zn-based oxide, Sn-Zn-based oxide, Al-Zn-based oxide, Zn-Mg-based oxide, Sn-Mg-based oxide, In-Mg-based oxide, In-Ga-based oxide, In-Ga-Zn-based oxide (also denoted as IGZO), In-Al-Zn-based oxide, In-Sn-Zn-based oxide, Sn-Ga-Zn-based oxide, Al-Ga-Zn-based oxide, Sn-Al-Zn-based oxide, In-Hf-Zn-based oxide, In-Zr-Zn-based oxide, In-Ti-Zn-based oxide, In-Sc-Zn-based oxide, In-Y-Zn-based oxide, In-La-Zn-based oxide, In-Ce-Zn-based oxide, In-Pr-Zn-based oxide, In-Nd-Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn-based oxide, In-Gd-Zn-based oxide, In-Tb-Zn-based oxide, In-Dy-Zn-based oxide, In-Ho-Zn-based oxide, In-Er-Zn-based oxide, In-Tm-Zn-based oxide, In-Yb-Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-Hf-Ga-Zn-based oxide, In-Al-Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In- In-Tm-Zn-based oxide, In-Yb-Zn-based oxide, In-Lu-Zn-based oxide, In- -Sn-Ga-Zn-based oxide, In-Hf-Ga-Zn-based oxide, In-Al-Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In- In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In- -Hf-Al-Zn oxides can be used.

[0143] Here, an In-Ga-Zn oxide is an oxide that has In, Ga, and Zn as its main components. This means that the ratio of In, Ga, and Zn is not important. Also, other than In, Ga, and Zn... It may contain metallic elements.

[0144] Oxide semiconductor films are divided into single-crystal oxide semiconductor films and other non-single-crystal oxide semiconductor films. It can be removed. Non-single-crystal oxide semiconductor films are CAAC-OS (C Axis Aligne d Crystalline Oxide Semiconductor) membrane, polycrystalline acid This refers to oxide semiconductor films, microcrystalline oxide semiconductor films, amorphous oxide semiconductor films, etc. (Note: CAA) C-OS films are a type of oxide semiconductor film having multiple c-axis oriented crystalline regions. CAAC-OS membrane is CANC(C-Axis Alingned nanocrysta) It can also be called an oxide semiconductor film having ls).

[0145] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. Alternatively, an oxide oriented perpendicular to the upper surface of the semiconductor layer and without grain boundaries between adjacent crystalline portions. It is preferable to use a monocrystalline semiconductor film. Such oxide semiconductors do not have grain boundaries. , the stress when a flexible device formed by applying one aspect of the present invention is bent This suppresses the occurrence of cracks in the oxide semiconductor film. Therefore, it has flexibility. Furthermore, such oxide semiconductors are suitably used in devices such as display devices that are used in a curved manner. It is possible.

[0146] Furthermore, by using such materials as semiconductor layers, fluctuations in electrical properties are suppressed, and reliability This enables the creation of high-performance transistors.

[0147] Furthermore, its low off-current allows the charge stored in the capacitor via the transistor to be released over a long period of time. It is possible to hold it in this way. By applying such transistors to pixels, each table It also becomes possible to stop the drive circuit while maintaining the brightness of the image displayed in the display area. As a result, it becomes possible to create electronic devices with extremely reduced power consumption.

[0148] The light-emitting element of the light-emitting device has a pair of electrodes (lower electrode 1431 and upper electrode 1435) and and has an EL layer 1433 provided between the pair of electrodes. One of the pair of electrodes is an anode and One side functions as the cathode, and the other side functions as the cathode.

[0149] The light-emitting element has a top emission structure, a bottom emission structure, and a dual emission structure. Any of the structures is acceptable. The electrode on the side that extracts light uses a conductive film that transmits visible light. It is also preferable to use a conductive film that reflects visible light on the electrode that does not extract light. It seems so.

[0150] Conductive films that transmit visible light include, for example, indium oxide and indium tin oxide (ITO:I). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or This refers to metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example) For example, titanium nitride and the like can also be used by forming them thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive layer. For example, silver and magnesium. Using a laminated film of this alloy and ITO is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0151] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, Lantha It may also contain added elements such as cellulose, neodymium, or germanium. Aluminum alloys such as aluminum alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing um (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, silver It can be formed using an alloy containing silver, such as a magnesium alloy. Gold is preferred because of its high heat resistance. Furthermore, the metal film or metal in contact with the aluminum alloy film. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for films and metal oxide films include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO Multilayer films, such as a silver-magnesium alloy and an ITO multilayer film, can be used.

[0152] The electrodes can be formed using methods such as vapor deposition or sputtering. Formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0153] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower and upper electrodes, the EL layer Holes are injected from the anode side, and electrons are injected from the cathode side. The injected electrons and holes are EL. The layers recombine, causing the light-emitting material in the EL layer to emit light.

[0154] The EL layer has at least an emissive layer. The EL layer has layers other than the emissive layer, such as a highly hole-injection layer. Materials with high hole transport properties, hole-blocking materials, materials with high electron transport properties, electron injection properties Substances with high electron transport or bipolar substances (substances with high electron transport and hole transport properties), etc. It may have further layers.

[0155] The EL layer can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic compounds It may also include. The layers constituting the EL layer 1433 are each deposited by a vapor deposition method (vacuum deposition method). It can be formed by methods such as transfer, printing, inkjet, and coating (including).

[0156] The light-emitting element is preferably provided between a pair of highly gas-barrier insulating films. This prevents impurities such as water from entering the light-emitting element, thus reducing the reliability of the light-emitting device. This can suppress it.

[0157] Examples of insulating films with high gas barrier properties include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing elements, and films containing nitrogen and aluminum, such as aluminum nitride films. Alternatively, silicon oxide films, silicon oxide-nitride films, aluminum oxide films, etc., may be used.

[0158] For example, the water vapor transmission rate of a highly gas-barrier insulating film is 1 × 10⁻⁶ -5 [g / m 2 ·day Hereinafter, preferably 1×10 -6 [g / m 2 ·day] or less, more preferably 1×10 - 7 [g / m 2 ·day] or less, even more preferably 1×10 -8 [g / m 2 ·day] or less is adopted.

[0159] For the flexible substrate, a material having flexibility is used. For example, an organic resin or glass having a thickness with a certain degree of flexibility can be used. Further, for the substrate on the side where light emission in the light-emitting device is extracted, a material that transmits visible light is used. When the flexible substrate does not need to transmit visible light , a metal substrate or the like can also be used.

[0160] Since the specific gravity of an organic resin is smaller than that of glass, when an organic resin is used as the flexible substrate, the light-emitting device can be made lighter than in the case of using glass, which is preferable. [[ID=...]]

[0161] Examples of the material having flexibility and translucency include polyester resins such as polyethylene terephthalate (PET ), polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin , polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, poly styrene resin, polyamideimide resin, polyvinyl chloride resin, and the like. In particular, it is preferable to use a material with a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin , PET, etc. can be preferably used. Further, a substrate in which a fibrous body is impregnated with a resin (also called a prepreg ), or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used. It can also be done this way.

[0162] When a flexible and light-transmitting material contains fibers, the fibers are organic compounds or High-strength fibers made of inorganic compounds are used. Specifically, high-strength fibers refer to fibers with a tensile modulus or Young's modulus. This refers to fibers with high density, and typical examples include polyvinyl alcohol-based fibers and polyester. Polyamide fibers, polyethylene fibers, aramid fibers, poly(p-phenylene) fibers Examples include benzobisoxazole fibers, glass fibers, or carbon fibers. Examples include glass fibers using E-glass, S-glass, D-glass, Q-glass, etc. These are used in the form of woven or nonwoven fabrics, and the structure is formed by impregnating the fibrous material with resin and curing the resin. The fabricated material may be used as a flexible substrate. The flexible substrate may be a structure made of fibers and resin. Using this method is preferable because it improves reliability against fracture due to bending or localized pressure.

[0163] To improve the efficiency of light extraction, a higher refractive index is preferable for flexible and light-transmitting materials. For example, by dispersing an inorganic filler with a high refractive index in an organic resin, the organic resin This makes it possible to create substrates with a higher refractive index than substrates made of only these materials. In particular, for small particles with a diameter of 40 nm or less. Using inorganic fillers is preferable because it does not compromise optical transparency.

[0164] The thickness of the metal substrate is preferably between 10 μm and 200 μm in order to obtain flexibility and bendability. It is preferable that the thickness is between 20 μm and 50 μm. Because metal substrates have high thermal conductivity, The heat generated by the light emission of the light-emitting element can be effectively dissipated.

[0165] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, nickel Preferably, use a metal alloy such as a kerl, aluminum alloy, or stainless steel. It is possible.

[0166] As a flexible substrate, the layer using the above material protects the surface of the device from scratches and other damage. A layer (for example, a silicon nitride layer) or a layer of material that can distribute pressure (for example, aramic It may also be constructed by laminating with a resin layer, etc. Furthermore, it may be a functional element (special) that is affected by moisture, etc. In order to suppress the reduction in lifespan of organic EL elements, etc., an insulating film with low water permeability, as described below, is provided. It's okay to be there.

[0167] Flexible substrates can also be used by stacking multiple layers. In particular, a configuration having a glass layer This improves the barrier properties against water and oxygen, resulting in a more reliable light-emitting device. ru.

[0168] For example, a flexible material in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the organic EL element. A substrate can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less. Preferably, the thickness is 25 μm or more and 100 μm or less. Glass layers of this thickness are susceptible to water and oxygen It can simultaneously achieve high barrier properties and flexibility. Furthermore, the thickness of the organic resin layer is as follows: The particle size should be between 10 μm and 200 μm, preferably between 20 μm and 50 μm. By placing the organic resin layer outside the glass layer, cracks and fractures in the glass layer are suppressed. This allows for improved mechanical strength. Such composite materials of glass and organic resins... By applying this to a substrate, it is possible to create an extremely reliable and flexible light-emitting device. can.

[0169] The adhesive layer can be a light-curing adhesive such as UV-curing type, a reaction-curing adhesive, a thermosetting adhesive, or Various types of curing adhesives, such as gas-type adhesives, can be used. These adhesives include epoxy Silicone resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin , PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA ( Examples include ethylene vinyl acetate resin. In particular, epoxy resins have low moisture permeability. The material is preferable. A two-part resin may also be used. Alternatively, an adhesive sheet or the like may be used. That's good too.

[0170] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (oxidation This method uses substances that adsorb moisture through chemical adsorption, such as calcium or barium oxide. It is possible to absorb moisture through physical adsorption, such as with zeolite or silica gel. A desiccant may be used. If a desiccant is included, impurities such as moisture may penetrate the functional element. This is preferable because it can suppress the ingress of harmful substances and improve the reliability of the light-emitting device.

[0171] Furthermore, by mixing a filler or light scattering material with a high refractive index into the above resin, a light-emitting element can be created. The light extraction efficiency can be improved. For example, titanium dioxide, barium oxide, and ze Olite, zirconium, and the like can be used.

[0172] Insulating layers 424, 226, 1405, and 1455 use inorganic insulating materials. It is possible to do so. In particular, when using the aforementioned insulating film with high gas barrier properties, reliable emission This is preferable because it allows for the realization of an optical device. Furthermore, a high gas barrier is provided between the adhesive layer and the upper electrode. An insulating film may be formed.

[0173] The insulating layers 463 and 1407 suppress the diffusion of impurities into the semiconductor constituting the transistor. It has a controlling effect. The insulating layer 463 and insulating layer 1407 are silicon oxide film and silicon oxide film. Inorganic insulating films such as silicon dioxide films and aluminum oxide films can be used.

[0174] Insulating layers 465, 467, and 1409 are, respectively, transistor-induced causes, etc. To reduce surface irregularities, it is preferable to select an insulating film that has a planarizing function. For example, For example, organic materials such as polyimide, acrylic, and benzocyclobutene resins can be used. In addition to the above organic materials, low-dielectric constant materials (low-k materials) can also be used. It is possible to stack multiple insulating films or inorganic insulating films formed from these materials.

[0175] The insulating layer 405 and insulating layer 1411 are provided to cover the ends of the lower electrode. 5. The insulating layers 496 and 1411 shall be made of resin or an inorganic insulating material. This can be done. Examples of resins include polyimide resin, polyamide resin, acrylic resin, and Roxane resin, epoxy resin, or phenolic resin can be used. In particular, insulating Since the fabrication of layer 405, insulating layer 496, and insulating layer 1411 is facilitated, negative-type photosensitive resin Alternatively, it is preferable to use a positive-type photosensitive resin.

[0176] The method for forming the insulating layer 405, insulating layer 496, and insulating layer 1411 is not particularly limited, however Trisography, sputtering, vapor deposition, droplet ejection (inkjet, etc.), printing ( Screen printing, offset printing, etc., can be used.

[0177] The conductive layers of transistor electrodes and wiring are made of molybdenum, titanium, chromium, and tannins, respectively. Metal materials such as tungsten, aluminum, copper, neodymium, scandium, etc. These elements can be used to form a single layer or a laminate using an alloy material. Each conductive layer may be formed using a conductive metal oxide. Examples of these materials include indium oxide (In2O3, etc.), tin oxide (SnO2, etc.), and zinc oxide (Zn O), ITO, indium zinc oxide (In2O3-ZnO, etc.), or metal oxides thereof. Materials containing silicon oxide can be used.

[0178] The connecting body is a paste-like or sheet-like material made by mixing metal particles into a thermosetting resin. Using a material, an anisotropic conductive material can be used by thermocompression bonding. For example, nickel particles coated with gold, or two or more metals arranged in layers. It is preferable to use particles.

[0179] A colored layer is a colored layer that transmits light in a specific wavelength range. For example, it transmits light in the red wavelength range. A color filter that transmits red (R) light, and a color filter that transmits green (G) light in the green wavelength range. Use filters, such as a blue (B) color filter that transmits light in the blue wavelength range. Each colored layer can be created using various materials through printing, inkjet, and photolithography. They are formed at the desired locations using etching methods such as the roughing method.

[0180] The light-shielding layer is placed between adjacent colored layers. The light-shielding layer is located between adjacent organic EL elements. This blocks light and suppresses color mixing between adjacent organic EL elements. Here, the edges of the colored layer By providing it so as to overlap with the light-shielding layer, light leakage can be suppressed. Therefore, materials that block light emission from organic EL elements can be used, such as metal materials or A black matrix can be formed using a resin material containing pigments or dyes. If placed in areas other than the light-emitting section, such as the drive circuit section, it can lead to unintended light leakage due to guided light, etc. This is preferable because it can suppress [the problem].

[0181] Furthermore, an overcoat may be provided to cover the colored layer and the light-shielding layer. This prevents impurities contained in the colored layer from diffusing into the organic EL element. The overcoat is made of a material that transmits light emitted from the organic EL element, such as nitride. Inorganic insulating films such as silicon dioxide films and silicon oxide films, and organic insulating films such as acrylic films and polyimide films. This can be used, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used.

[0182] Furthermore, when applying the adhesive layer material onto the colored layer and light-shielding layer, the overcoat material is It is preferable to use a material with high wettability for the adhesive layer material. For example, overcoat As shown in Figure 10(A), oxide conductive films such as ITO films, and films with light-transmitting properties. It is preferable to use a thin metal film such as an Ag film.

[0183] <Example of manufacturing method> Next, a method for fabricating a light-emitting device will be illustrated using Figures 12 and 13. Here, we will show Configuration Example 1- We will explain using the light-emitting device with the configuration shown in 4 (Figure 11(B)) as an example.

[0184] First, a release layer 1503 is formed on the fabricated substrate 1501, and an insulating layer 140 is placed on the release layer 1503. 5 is formed. Next, multiple transistors, conductive layer 1357, insulating layer 1405, insulating layer 1407, an insulating layer 1409, multiple light-emitting elements, and an insulating layer 1411 are formed. The insulating layers 1409 and 1407 are opened so that the electrical layer 1357 is exposed (Figure 1). 2(A)).

[0185] Furthermore, a release layer 1507 is formed on the fabricated substrate 1505, and an insulating layer 145 is placed on the release layer 1507. 5 is formed. Next, a light-shielding layer 1457, a coloring layer 1459, and an overlay are applied to the insulating layer 1455. - Forming coat 1461 (Figure 12(B)).

[0186] The fabricated substrates 1501 and 1505 are a glass substrate, a quartz substrate, and a glass substrate, respectively. Substrates such as fire substrates, ceramic substrates, and metal substrates can be used.

[0187] Furthermore, examples of glass substrates include aluminosilicate glass and aluminoborosilicate glass. Glass materials such as lath and barium borosilicate glass can be used. Subsequent heat treatment When temperatures are high, it is best to use materials with a strain point of 730°C or higher. In addition, crystallized glass... You can use things like S.

[0188] When a glass substrate is used for the above-mentioned fabricated substrate, a silicon oxide film is placed between the fabricated substrate and the release layer. When insulating films such as silicon oxide nitride films, silicon nitride films, and silicon oxide nitride films are formed, This is preferable because it prevents contamination from the lath substrate.

[0189] The release layer 1503 and the release layer 1507 are tungsten, molybdenum, and tungsten, respectively. Tan, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium Elements selected from um, palladium, osmium, iridium, and silicon, containing said elements It consists of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystalline structure of the layer containing the condensate may be amorphous, microcrystalline, or polycrystalline.

[0190] The release layer can be formed by sputtering, plasma CVD, coating, printing, or other methods. The coating method includes spin coating, droplet dispensing, and dispensing.

[0191] If the delamination layer has a single-layer structure, it may consist of a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or acid. A layer containing nitride, a layer containing molybdenum oxide or nitride, or tungsten A layer containing an oxide or oxidized nitride of a mixture of molybdenum may be formed. A mixture of tungsten and molybdenum is equivalent to, for example, an alloy of tungsten and molybdenum. do.

[0192] Furthermore, the release layer has a laminated structure consisting of a tungsten-containing layer and a tungsten oxide-containing layer. When forming it, a layer containing tungsten is formed, and an insulating film made of oxide is formed on top of it. By forming this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. The formation of this can be utilized. Alternatively, the surface of the tungsten-containing layer can be subjected to thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozonated water and other highly oxidizing solvents A layer containing tungsten oxide may be formed by liquid treatment or other methods. Plasma treatment may also be performed. The processing and heat treatment can be performed using oxygen, nitrogen, nitrous oxide alone, or a mixture of these gases with other gases. This may be carried out under a gaseous atmosphere. The surface condition of the peeled layer is obtained by the plasma treatment or heat treatment described above. By changing this, it is possible to control the adhesion between the release layer and the insulating film that is formed later. ru.

[0193] Each insulating layer is formed using methods such as sputtering, plasma CVD, coating, or printing. It is possible to achieve, for example, by plasma CVD, a film deposition temperature of 250°C to 400°C. By forming it as described below, a dense film with extremely high gas barrier properties can be obtained.

[0194] Subsequently, the surface of the fabricated substrate 1505 on which the colored layer 1459 etc. is provided or the fabricated substrate 1501 A material that will become the adhesive layer 1413 is applied to the surface on which the optical element 1430 etc. is provided, and the adhesive layer 1413 The surfaces are bonded together via (Figure 12(C)).

[0195] Then, the fabricated substrate 1501 is peeled off, and the exposed insulating layer 1405 and the flexible substrate 1401 are separated. The materials are bonded together using the adhesive layer 1403. Then, the fabricated substrate 1505 is peeled off, and the exposed insulation Layer 1455 and the flexible substrate 1303 are bonded together using the adhesive layer 1305. Figure 13(A In this configuration, the flexible substrate 1303 does not overlap with the conductive layer 1357, but the conductive layer 135 7 and the flexible substrate 1303 may overlap.

[0196] In one aspect of the present invention, various peeling methods can be applied to the fabricated substrate. For example, peeling If a layer containing a metal oxide film is formed on the side in contact with the layer to be exfoliated as an abscission layer, then the metal oxide film... The film can be weakened by crystallization, allowing the layer to be peeled off from the fabricated substrate. An amorphous silicon film containing hydrogen was formed as a release layer between the highly thermal fabricated substrate and the layer to be released. In this case, the amorphous silicon film is removed by laser irradiation or etching, thus preventing peeling. The layer can be peeled off from the fabricated substrate. Furthermore, as the peeling layer, gold is used on the side in contact with the layer to be peeled. A layer containing a metal oxide film is formed, the metal oxide film is weakened by crystallization, and further, one of the peeling layers After removing the part by etching with a solution or fluorine gas such as NF3, BrF3, or ClF3 Furthermore, it can be exfoliated in weakened metal oxide films. In addition, nitrogen can be used as the exfoliation layer. , films containing oxygen, hydrogen, etc. (for example, amorphous silicon films containing hydrogen, hydrogen-containing alloy films, oxygen-containing films) Using an alloy film, etc., the delamination layer is irradiated with laser light to remove nitrogen, oxygen and hydrogen contained within the delamination layer. A method may be used in which the substance is released as a gas to promote the separation of the layer to be peeled and the substrate. The fabricated substrate on which the delamination layer has formed is mechanically removed or treated with a solution such as NF3, BrF3, ClF3, etc. Methods such as etching with fluoride gas can be used to remove the peeled layer. It is not necessary to provide it.

[0197] Furthermore, by combining multiple of the above peeling methods, the peeling process can be carried out more easily. In other words, irradiation with laser light, etching of the stripping layer with gas or solution, sharp knife or metal After mechanical removal using tools such as a squeegee to make the peeled layer and the layer to be peeled easier to separate, Detachment can also be performed using physical force (such as machinery).

[0198] Furthermore, even if the layer to be peeled off is removed from the fabricated substrate by permeating a liquid into the interface between the peeling layer and the layer to be peeled, Good. Also, when peeling, you may apply a liquid while peeling. Static electricity generated during peeling , adversely affecting the functional elements contained in the peeled layer (semiconductor elements being destroyed by static electricity) It can suppress (such as being sprayed). The liquid may also be sprayed in the form of a mist or vapor. For example, pure water or organic solvents can be used, and the solution can be neutral, alkaline, or acidic. You may also use liquids or aqueous solutions containing dissolved salts.

[0199] As an alternative peeling method, if the peeling layer is formed with tungsten, ammonia water and peracid It is preferable to perform the stripping process while etching the stripping layer with a mixed solution of hydrogenated water.

[0200] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be necessary. For example, glass is used as the fabrication substrate, and polyimide, polyester, and poly are placed in contact with the glass. It forms organic resins such as olefins, polyamides, polycarbonates, or acrylics. Furthermore, the adhesion between the fabricated substrate and the organic resin is improved by laser irradiation or heat treatment. Then, insulating films, transistors, etc. are formed on the organic resin. After that, the laser irradiation is performed more than the previous one. Perform laser irradiation at a high energy density, or perform heat treatment at a higher temperature than the previous heat treatment. By doing this, the substrate can be peeled off at the interface between the fabricated substrate and the organic resin. Alternatively, the substrate and the organic resin may be separated by permeating the interface with a liquid.

[0201] In this method, insulating films, transistors, etc. are formed on organic resins with low heat resistance, High temperatures cannot be applied to the substrate during the process. Here, a transistor using an oxide semiconductor is used. Since high-temperature manufacturing processes are not required, it can be suitably formed on organic resins.

[0202] Furthermore, the organic resin may be used as a substrate constituting the light-emitting device, or the organic resin may be removed. Alternatively, another substrate may be bonded to the exposed surface of the peeled-off layer using an adhesive.

[0203] Alternatively, a metal layer is placed between the fabricated substrate and the organic resin, and an electric current is passed through the metal layer. The material may be heated, and peeling may be performed at the interface between the metal layer and the organic resin.

[0204] Finally, the conductive layer 1357 is exposed by opening the insulating layer 1455 and the adhesive layer 1413. (Figure 13(B)). Note that in the case where the flexible substrate 1303 overlaps with the conductive layer 1357. This also opens the flexible substrate 1303 and the adhesive layer 1305 (Figure 13(C)). The means of opening is No particular limitations; for example, laser ablation, etching, ion beam sputtering. A ring method or similar technique can be used. Alternatively, the film on the conductive layer 1357 can be cut using a sharp blade or similar tool. You can also insert a slit and use physical force to peel off a portion of the membrane.

[0205] Based on the above, a light-emitting device can be manufactured.

[0206] Furthermore, in this specification, etc., a pixel having an active element (active element, nonlinear element) Using an active matrix system or a passive matrix system in which pixels do not have active elements. It is possible.

[0207] In the active matrix system, the active elements include not only transistors, but also various other components. Active elements can be used. For example, MIM (Metal Insulator M It is also possible to use etal, or TFD (Thin Film Diode), etc. Yes, these elements have fewer manufacturing steps, which reduces manufacturing costs or improves yield. This can be achieved. In addition, because these elements are small in size, the aperture ratio can be improved. This allows for lower power consumption and higher brightness.

[0208] In the passive matrix method, active elements are not used, resulting in fewer manufacturing steps and lower manufacturing costs. This can reduce emissions and improve yield. Also, because no active elements are used, the aperture ratio can be reduced. This can improve performance, leading to lower power consumption or higher brightness.

[0209] This embodiment can be combined with other embodiments as appropriate.

[0210] (Embodiment 7) In this embodiment, the configuration of the foldable touch panel is shown in Figures 14 to 17. I will explain this further. For details on the materials of each layer, please refer to Embodiment 6. In this embodiment, a touch panel using an organic EL element is given as an example, but it is not limited to this. i. In one aspect of the present invention, for example, a touch panel using other elements as illustrated in Embodiment 6 It is possible to create a lure.

[0211] <Configuration Example 2-1> Figure 14(A) is a top view of the touch panel. Figure 14(B) is the same as Figure 14(A) but with a dashed line A. -This is a cross-sectional view between B and the dashed line C and D. Figure 14(C) is a cross-sectional view of Figure 14(A) between the dashed line E This is a cross-sectional view between -F.

[0212] As shown in Figure 14(A), the touch panel 390 has a display unit 301.

[0213] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixels 308 are It is possible to detect fingers or other objects touching the display unit 301. This allows the imaging pixels 308 to be used This allows for the configuration of a touch sensor.

[0214] Pixel 302 comprises multiple sub-pixels (e.g., sub-pixel 302R), and the sub-pixels include light-emitting elements and It is equipped with a pixel circuit that can supply power to drive the optical elements.

[0215] The pixel circuit can supply selection signals and image signals. It is electrically connected to the wiring.

[0216] Furthermore, the touch panel 390 can supply a selection signal to the pixel 302 via a scan line drive cycle. A line 303g(1) and an image signal line drive circuit that can supply image signals to pixels 302. It is equipped with 303s(1).

[0217] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0218] The imaging pixel circuit has wiring that can supply control signals and power supply potential. It is electrically connected to the wiring.

[0219] As a control signal, for example, it is possible to select the imaging pixel circuit that reads out the recorded imaging signal. A signal that can be used, a signal that can initialize the imaging pixel circuit, and a signal that the imaging pixel circuit can detect light. Examples include signals that can determine the timing of an action.

[0220] The touch panel 390 can supply control signals to the image pixel 308 via the image pixel drive cycle. It includes a line 303g(2) and an imaging signal line drive circuit 303s(2) for reading out the imaging signal.

[0221] As shown in Figure 14(B), the touch panel 390 is connected to the substrate 510 and facing the substrate 510. It has a substrate 570.

[0222] Flexible materials can be suitably used for substrates 510 and 570.

[0223] Materials with suppressed impurity permeation can be suitably used for substrates 510 and 570. For example, if the water vapor transmission rate is 10 -5 g / m 2 • Less than 10 days, preferably 10 -6 g / m 2 Materials with a lifespan of less than or equal to 1 day can be suitably used.

[0224] Materials with approximately equal coefficients of thermal expansion can be suitably used for substrates 510 and 570. For example, the coefficient of thermal expansion is 1 × 10⁻⁶. -3 / K or less, preferably 5 × 10 -5 / K or lower, more preferred Or 1 x 10 -5 Materials with a temperature of / K or lower can be suitably used.

[0225] The substrate 510 consists of a flexible substrate 510b, an insulating layer 510a that prevents the diffusion of impurities to the light-emitting element, And a laminated structure in which an adhesive layer 510c is attached to bond the flexible substrate 510b and the insulating layer 510a. It is a layered structure.

[0226] The substrate 570 consists of a flexible substrate 570b, an insulating layer 570a that prevents the diffusion of impurities to the light-emitting element, The laminate consists of a flexible substrate 570b and an adhesive layer 570c that bonds the insulating layer 570a together. .

[0227] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Mid, polycarbonate or acrylic, urethane, epoxy or siloxane bonds Materials containing resins and other similar substances can be used as the adhesive layer.

[0228] The sealing layer 560 bonds the substrate 570 and the substrate 510 together. The sealing layer 560 is larger than the air. It has a high refractive index. The pixel circuit and light-emitting element (for example, the first light-emitting element 350R) are on the substrate 5 It is located between 10 and circuit board 570.

[0229] Pixel 302 has sub-pixels 302R, 302G, and 302B (Figure 14) C)). Additionally, sub-pixel 302R is equipped with a light-emitting module 380R, and sub-pixel 302G emits light. It is equipped with module 380G, and the sub-pixel 302B is equipped with light-emitting module 380B.

[0230] For example, the sub-pixel 302R supplies power to the first light-emitting element 350R and the first light-emitting element 350R. The pixel circuit includes a transistor 302t that can be supplied (Figure 14(B)). Furthermore, the light-emitting module 380R includes the first light-emitting element 350R and an optical element (for example, a colored layer 3 It is equipped with 67R.

[0231] The light-emitting element 350R consists of a first lower electrode 351R, an upper electrode 352, and an upper electrode 351R. It has an EL layer 353 between the electrodes 352 (Figure 14(C)).

[0232] The EL layer 353 consists of light-emitting unit 353a, light-emitting unit 353b, and light-emitting unit 35 An intermediate layer 354 is provided between 3a and the light-emitting unit 353b.

[0233] The light-emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer is specific Any material that transmits light having a certain wavelength is acceptable, for example, light exhibiting red, green, or blue light. A material that selectively transmits light can be used. Alternatively, the light emitted by the light-emitting element can be transmitted as is. A transparent region may be provided. Furthermore, each light-emitting element may emit a different color. In that case, a colored layer may or may not be provided.

[0234] For example, the light-emitting module 380R has a sealing layer in contact with the light-emitting element 350R and the colored layer 367R. It has 560.

[0235] The colored layer 367R is located in a position that overlaps with the light-emitting element 350R. Some of the light emitted by passes through the sealing layer 560 and the coloring layer 367R, as shown by the arrows in the figure. It is emitted to the outside of the sea urchin light-emitting module 380R.

[0236] The touch panel 390 has a light-shielding layer 367BM on the substrate 570. The light-shielding layer 367BM is It is provided so as to surround the colored layer (for example, colored layer 367R).

[0237] The touch panel 390 is equipped with an anti-reflective layer 367p in a position that overlaps the display unit 301. For example, a circular polarizing plate can be used as the protective layer 367p.

[0238] The touch panel 390 is equipped with an insulating layer 321. The insulating layer 321 is equipped with transistor 302t It covers. The insulating layer 321 is a layer for flattening the irregularities caused by the pixel circuit. It can be used. Furthermore, it can suppress the diffusion of impurities into transistors such as transistor 302t. An insulating layer, which consists of multiple layers, can be applied to the insulating layer 321.

[0239] The touch panel 390 has light-emitting elements (e.g., light-emitting elements 350R) on the insulating layer 321. .

[0240] The touch panel 390 has a partition wall 328 that overlaps the end of the lower electrode 351R on the insulating layer 321. It has. In addition, a spacer 329 that controls the distance between substrate 510 and substrate 570 is provided by the partition wall 328 To possess above.

[0241] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the drive circuit can be formed on the same substrate using the same process as the pixel circuit. (Figure 14) As shown in B), the transistor 303t has a second gate 304 on the insulating layer 321 It may be so. The second gate 304 is electrically connected to the gate of transistor 303t. They may be, or different potentials may be applied to them. Also, if necessary, The gate 304 of transistor 2 may be provided on transistor 308t, transistor 302t, etc.

[0242] The imaging pixel 308 detects the photoelectric conversion element 308p and the light irradiated onto the photoelectric conversion element 308p. It is equipped with an imaging pixel circuit for detection. The imaging pixel circuit also includes a transistor 308t. nothing.

[0243] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0244] The touch panel 390 is equipped with wiring 311 that can supply signals, and terminal 319 is provided. It is located on line 311. Furthermore, it can supply signals such as image signals and synchronization signals. FPC309(1) is electrically connected to terminal 319. A printed circuit board (PWB) may be attached to it.

[0245] Transistors formed in the same process are referred to as transistor 302t, transistor 303t, and It can be applied to transistors such as the 308t transistor.

[0246] In addition, various components of the touch panel, including the gate, source, and drain of the transistor. Materials that can be used for wiring and electrodes include aluminum, titanium, chromium, and nickel. Kel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Metals such as these, or alloys with these as the main component, are used in a single-layer or layered structure. A single-layer structure of an aluminum film containing silicon, and a double-layer structure of an aluminum film laminated on a titanium film. Layered structure, two-layer structure with an aluminum film laminated on a tungsten film, copper-magnesium-a A two-layer structure in which a copper film is laminated on a luminium alloy film, a two-layer structure in which a copper film is laminated on a titanium film, A two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or a titanium nitride film, and the titanium An aluminum film or copper film is laminated on top of a film or titanium nitride film, and then titanium is laid on top of that. A three-layer structure forming a film or titanium nitride film, a molybdenum film or molybdenum nitride film, and its mo An aluminum film or copper film is laminated on top of a ribdenum film or molybdenum nitride film, and further... There are also three-layer structures, such as one in which a molybdenum film or molybdenum nitride film is formed on top of it. Transparent conductive materials containing zinc, tin oxide, or zinc oxide may be used. Also, materials containing manganese may be used. Using copper is preferable because it enhances the controllability of the shape through etching.

[0247] <Configuration Example 2-2> Figures 15(A) and (B) are perspective views of the touch panel 505. For clarity, representative images are shown. The following shows the typical components. Figure 16(A) is a cross-section between the dashed line G3 and G4 shown in Figure 15(A). This is a diagram.

[0248] The touch panel 505 includes a display unit 501 and a touch sensor 595 (Figure 15(B)). Furthermore, the touch panel 505 has substrates 510, 570, and 590. Substrates 510, 570, and 590 are all flexible.

[0249] The display unit 501 consists of a substrate 510, a plurality of pixels on the substrate 510, and a signal supply to those pixels. It has multiple wirings 511 that can be connected. The multiple wirings 511 are located on the outer periphery of the substrate 510. It is routed in this way, and a part of it forms terminal 519. Terminal 519 is FPC509(1) It is electrically connected to it.

[0250] The circuit board 590 includes a touch sensor 595 and multiple devices that are electrically connected to the touch sensor 595. It is equipped with wiring 598. Multiple wirings 598 are routed around the outer periphery of the circuit board 590, and some of them are This constitutes a terminal. This terminal is then electrically connected to FPC509(2). In Figure 15(B), for clarity, the back side of substrate 590 (the side facing substrate 510) is shown. The electrodes and wiring of the touch sensor 595 are shown with solid lines.

[0251] For example, a capacitive touch sensor can be used as the touch sensor 595. Methods include surface capacitance and projected capacitance.

[0252] Projected capacitance systems are mainly categorized into self-capacitance systems and mutual-capacitance systems, based on differences in their driving methods. There is a mutual capacitance method, which is preferable because it enables simultaneous multi-point detection.

[0253] In the following section, we will discuss the case where a projected capacitive touch sensor is applied, as shown in Figure 15(B). I will use it to explain.

[0254] Furthermore, various sensors capable of detecting proximity or contact with objects such as fingers can be applied. It is possible.

[0255] The projected capacitive touch sensor 595 has a first electrode 591 and a second electrode 592. The first electrode 591 is electrically connected to one of the multiple wires 598, and the second electrode 5 92 is electrically connected to one of the other wires 598.

[0256] The second electrode 592 is arranged repeatedly in one direction, as shown in Figures 15(A) and (B). It has a shape in which multiple quadrilaterals are connected at their corners.

[0257] The first electrode 591 is quadrilateral, and is shaped in a direction intersecting the direction in which the second electrode 592 extends. They are arranged in a repeating pattern.

[0258] The wiring 594 electrically connects the two first electrodes 591 that sandwich one of the second electrodes 592. At this time, the area of ​​the intersection between the second electrode 592 and the wiring 594 is made as small as possible. This shape is preferable. This reduces the area of ​​the region where electrodes are not provided, and improves transmittance. This reduces the unevenness in brightness of the light transmitted through the touch sensor 595. It is possible.

[0259] Furthermore, the shapes of the first electrode 591 and the second electrode 592 are not limited to these, and various shapes can be taken. For example, multiple strip-shaped first electrodes are arranged so that there are as few gaps as possible, and insulation is provided. Multiple strip-shaped second electrodes are arranged across the layer so as to intersect with the first electrode. The two contacting second electrodes may be configured to be spaced apart. Furthermore, two adjacent second electrodes If a dummy electrode electrically insulated from the two electrodes is placed between them, the transmittance will be different. This is preferable because it reduces the area of ​​the region.

[0260] The touch sensor 595 consists of a substrate 590 and first electrodes 59 arranged in a staggered pattern on the substrate 590. The insulating layer 593 covering the first and second electrodes 592, the first electrode 591, and the second electrode 592 It also includes wiring 594 that electrically connects adjacent first electrodes 591.

[0261] As shown in Figure 15(B), the adhesive layer 597 overlaps the touch sensor 595 with the display unit 501. As shown, substrate 590 is bonded to substrate 570.

[0262] The first electrode 591 and the second electrode 592 are formed using a light-transmitting conductive material. Examples of light-transmitting conductive materials include indium oxide, indium tin oxide, and indium Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium can be used. Yes, it is possible. Furthermore, a film containing graphene can also be used. A film containing graphene is, for example... A film containing graphene oxide, which has been formed in a film-like structure, can be formed by reduction. Methods include applying heat, among others.

[0263] After depositing a light-transmitting conductive material onto a substrate 590 by sputtering, a photo Various patterning techniques, such as lithography, are used to remove unwanted parts and create the first electrode. 591 and the second electrode 592 can be formed.

[0264] Furthermore, the materials used for the insulating layer 593 include, for example, resins such as acrylic and epoxy, and In addition to resins containing roxane bonds, silicon oxide, silicon oxide nitride, aluminum oxide, etc. Any inorganic insulating material can be used.

[0265] Furthermore, an opening reaching the first electrode 591 is provided in the insulating layer 593, and the wiring 594 is adjacent to it. The first electrode 591 is electrically connected. The light-transmitting conductive material controls the aperture ratio of the touch panel. Because it can be increased, it can be suitably used in the wiring 594. Also, the first electrode 5 Materials with higher conductivity than electrodes 91 and 592 can reduce electrical resistance, thus reducing the wiring 59 It can be suitably used in 4.

[0266] Each of the second electrodes 592 extends in one direction, and multiple second electrodes 592 are arranged in a striped pattern. It is located at [location].

[0267] The wiring 594 is provided intersecting with one of the second electrodes 592.

[0268] A pair of first electrodes 591 are provided flanking one of the second electrodes 592, and a pair of wires 594 are provided. The first electrode 591 is electrically connected.

[0269] Furthermore, the multiple first electrodes 591 are not necessarily arranged in a direction perpendicular to one of the second electrodes 592. It does not need to be placed there.

[0270] One wire 598 is electrically connected to either the first electrode 591 or the second electrode 592. Part of the 598 functions as a terminal. Wiring 598 can be made of, for example, aluminum, gold. Platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper Alternatively, a metallic material such as palladium, or an alloy material containing such a metallic material, can be used.

[0271] Furthermore, an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0272] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0273] The connecting layer 599 can be any anisotropic conductive film (ACF: Anisotropic Conductive film, or anisotropic conductive paste (ACP: Anisotropic Conductive Film) You can use pic (Practical Conductive Paste), etc.

[0274] The adhesive layer 597 is translucent. For example, a thermosetting resin or an ultraviolet curing resin can be used. Specifically, this can be done using acrylic, urethane, epoxy, or resins having siloxane bonds. Resins such as fats can be used.

[0275] The display unit 501 comprises multiple pixels arranged in a matrix. The pixels are display elements and display It is equipped with a pixel circuit that drives the elements.

[0276] In this embodiment, we will discuss the case where an organic EL element that emits white light is applied as a display element. I will explain, but the display elements are not limited to these.

[0277] For example, if each sub-pixel emits a different color of light, an organic EL element with different emission colors can be used as a sub-pixel. It may be applied to each element individually. In that case, a colored layer does not need to be provided.

[0278] Substrates 510, 570, and 560 can be configured in the same way as in Configuration Example 2-1. .

[0279] Each pixel includes a sub-pixel 502R, which in turn includes a light-emitting module 580R.

[0280] The sub-pixel 502R supplies power to the first light-emitting element 550R and the first light-emitting element 550R. It includes a pixel circuit containing a transistor 502t that can do this. Also, a light-emitting module 5 80R comprises a first light-emitting element 550R and an optical element (e.g., a colored layer 567R).

[0281] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

[0282] The light-emitting module 580R has a first colored layer 567R in the direction from which light is extracted.

[0283] Furthermore, if the sealing layer 560 is provided on the side from which light is extracted, the sealing layer 560 is the first The optical element 550R is in contact with the first colored layer 567R.

[0284] The first colored layer 567R is positioned to overlap with the first light-emitting element 550R. This results in light emission. A portion of the light emitted by element 550R passes through the first colored layer 567R and is directed in the direction of the arrow shown in the figure. It is emitted to the outside of the 580R light-emitting module.

[0285] The display unit 501 has a light-shielding layer 567BM in the direction from which light is emitted. The light-shielding layer 567BM is It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0286] The display unit 501 is provided with an anti-reflective layer 567p in a position that overlaps with the pixels. For example, a circular polarizer can be used.

[0287] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. It is used. Furthermore, the insulating film 521 is used as a layer to flatten the irregularities caused by the pixel circuit. This is possible. Furthermore, a laminated film containing a layer that can suppress the diffusion of impurities can be applied to the insulating film 521. This makes it possible to improve the reliability of transistors such as the 502t due to impurity diffusion. The decline can be suppressed.

[0288] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on the insulating film 521. .

[0289] The display unit 501 has a partition wall 528 on the insulating film 521 that overlaps the end of the first lower electrode. Furthermore, a spacer is provided on the partition wall 528 to control the distance between substrate 510 and substrate 570.

[0290] The scan line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. The drive circuit can be formed on the same substrate using the same process as the pixel circuit.

[0291] The display unit 501 is equipped with wiring 511 that can supply signals, and terminal 519 is connected to wiring 51 It is provided in 1. Furthermore, it is possible to supply signals such as image signals and synchronization signals to the FP. C509(1) is electrically connected to terminal 519.

[0292] Note that a printed circuit board (PWB) may be attached to FPC509(1). .

[0293] The display unit 501 has wiring such as scan lines, signal lines and power lines. The various conductive films described above It can be used for wiring.

[0294] Furthermore, various transistors can be applied to the display unit 501. (Bottom-gate type transistor) The configuration when applied to the display unit 501 is shown in Figures 16(A) and (B).

[0295] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., is shown in Figure 16(A). This can be applied to transistors 502t and 503t.

[0296] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. This is applied to transistors 502t and 503t shown in Figure 16(B). It is possible.

[0297] Furthermore, the configuration when a top-gate type transistor is applied to the display unit 501 is shown in Figure 16. This is illustrated in C).

[0298] For example, a single-crystal silicon film transposed from a polycrystalline silicon or single-crystal silicon substrate, etc. The semiconductor layer containing the transistor 502t and transistor 50 shown in Figure 16(C) It can be applied to 3t vehicles.

[0299] <Configuration Example 2-3> Figure 17 is a cross-sectional view of the touch panel 505B. The touch panel described in this embodiment 505B is a display unit 5 that displays the supplied image information on the side where the transistor is located. The configuration example includes the presence of 01 and the fact that the touch sensor is provided on the display unit's circuit board 510 side. This is different from the 2-2 touch panel 505. Here, we will explain the different configuration in detail. Where applicable, refer to the above explanation for the structure that can be used.

[0300] The first colored layer 567R is located in a position that overlaps with the first light-emitting element 550R. Also, see Figure 17(A The light-emitting element 550R shown in the diagram emits light towards the side where the transistor 502t is located. As a result, some of the light emitted by the light-emitting element 550R passes through the first colored layer 567R, The light is emitted to the outside of the light-emitting module 580R in the direction of the arrow shown in the diagram.

[0301] The display unit 501 has a light-shielding layer 567BM in the direction from which light is emitted. The light-shielding layer 567BM is It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0302] The touch sensor 595 is located on the circuit board 510 side of the display unit 501 (Figure 17(A)). .

[0303] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 59 Glue together 5.

[0304] Furthermore, various transistors can be applied to the display unit 501. (Bottom-gate type transistor) The configuration when applied to the display unit 501 is shown in Figures 17(A) and (B).

[0305] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., is shown in Figure 17(A). This can be applied to transistors 502t and 503t.

[0306] For example, a semiconductor layer containing polycrystalline silicon, etc., is used in the transistor 50 shown in Figure 17(B). It can be applied to 2t and transistor 503t.

[0307] Furthermore, the configuration when a top-gate type transistor is applied to the display unit 501 is shown in Figure 17. This is illustrated in C).

[0308] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film, etc., is shown in Figure 17. This can be applied to transistors 502t and 503t shown in figure C). .

[0309] This embodiment can be combined with other embodiments as appropriate. [Explanation of symbols]

[0310] 10 cabinets 11 Display device 11a Display area 11b Hidden area 11c First region 11d Second area 13 Protective layer 13a Protective layer 13b Protective layer 15 Support 15a Support 15b Support 16 Winding section 17 Translucent regions 18 components 19 Fixed part 20 components 21 Operation buttons 31 Operation buttons 32 Image Sensors 226 Insulating layer 301 Display section 302 pixels 302B subpixels 302G sub-pixels 302R sub-pixel 302t transistor 303c capacity 303g(1) Scan line drive circuit 303g(2) Image Pixel Driving Circuit 303s(1) Image signal line driving circuit 303s(2) Imaging signal line drive circuit 303t transistor Gate 304 308 image pixels 308p Photoelectric element 308t transistor 309 FPC 311 Wiring 319 terminals 321 Insulating layer 328 Bulkhead 329 Spacer 350R light-emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a Light-emitting unit 353b Light-emitting unit 354 Middle Class 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light-Emitting Module 380G Light-Emitting Module 380R Light-Emitting Module 390 Touch Panel 401 Lower electrode 402 EL layer 403 Upper electrode 405 Insulating layer 407 Adhesive layer 420 Flexible substrate 422 Adhesive layer 424 Insulating layer 426 Adhesive layer 428 Flexible substrate 431 Light blocking layer 432 Colored layer 435 Conductive layer 450 Organic EL elements 453 Overcoat 454 transistors 455 transistors 457 Conductive layer 463 Insulating layer 465 Insulating layer 467 Insulating layer 491 Light-emitting part 493 Drive Circuit Section 495 FPC 496 Insulating layer 497 Connectors 501 Display section 502R sub-pixel 502t transistor 503c capacity 503g scan line drive circuit 503t transistor 505 Touch Panel 505B Touch Panel 509 FPC 510 circuit board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminals 521 Insulating film 528 Bulkhead 550R luminescent element 560 Sealing layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 circuit boards 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light-Emitting Module 590 circuit boards 591 First electrode 592 Second electrode 593 Insulating layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connectivity Layer 1301 Element Layer 1303 Flexible substrate 1304 copies 1305 Adhesive layer 1306 Drive Circuit Section 1308 FPC 1357 Conductive layer 1401 Flexible substrate 1403 Adhesive layer 1405 Insulating layer 1407 Insulating layer 1409 Insulating layer 1411 Insulating layer 1413 Adhesive layer 1415 Connector 1430 Light-emitting element 1431 Lower electrode 1433 EL layer 1435 Upper electrode 1440 transistors 1455 Insulating layer 1457 Light blocking layer 1459 Colored layer 1461 Overcoat 1501 Fabricated substrate 1503 Exfoliation layer 1505 Fabricated substrate 1507 Exfoliation layer

Claims

1. The display panel has a display area and a non-display area surrounding the display area provided on its display surface. A light-emitting device that can be folded with the display surface of the display panel facing inward, A first support and a second support are arranged opposite to the surface of the display panel that is not the display surface, and are spaced apart from each other. A third support and a fourth support are arranged opposite to the non-display area on the display surface of the display panel and spaced apart from each other, A protective layer having a region disposed between the display panel and the third support, and a region disposed between the display panel and the fourth support, The display panel has a first portion that overlaps with the first support, a second portion that overlaps with the second support, and a third portion that is located between the first portion and the second portion and is foldable. The first support is fixed in position relative to the first part, The second support is fixed in position relative to the second portion. The first support has an overlap with the third support via the first portion, The second support has an overlap with the fourth support via the second portion, The third portion has an area that does not overlap with either the third support or the fourth support. The protective layer overlaps with the non-display area in the third portion, and does not overlap with the display area. The protective layer has a region that does not overlap with the third support and the fourth support. Light-emitting device.

2. In claim 1, The protective layer has rubber, Light-emitting device.

3. In claim 1 or claim 2, The protective layer has higher flexibility compared to the third and fourth supports. Light-emitting device.

4. The display panel has a display area and a non-display area surrounding the display area provided on its display surface. A light-emitting device that can be folded with the display surface of the display panel facing inward, A first support and a second support are arranged opposite to the surface of the display panel that is not the display surface, and are spaced apart from each other. A first protective layer having a region disposed between the display panel and the first support, and a region disposed between the display panel and the second support, A third support and a fourth support are arranged opposite to the non-display area on the display surface of the display panel and spaced apart from each other, A second protective layer having a region positioned between the display panel and the third support, and a region positioned between the display panel and the fourth support, The display panel has a first portion that overlaps with the first support, a second portion that overlaps with the second support, and a third portion that is located between the first portion and the second portion and is foldable. The first support is fixed in position relative to the first part, The second support is fixed in position relative to the second portion. The first support has an overlap with the third support via the first portion, The second support has an overlap with the fourth support via the second portion, The third portion has an area that does not overlap with either the third support or the fourth support. The first protective layer has overlaps with each of the first portion, the second portion and the third portion. The second protective layer overlaps with the non-display area present in the third portion, and does not overlap with the display area. The second protective layer has a region that does not overlap with the third support and the fourth support. Light-emitting device.

5. In claim 4, The first protective layer has a metal, Light-emitting device.

6. In claim 4 or claim 5, The aforementioned second protective layer has rubber, Light-emitting device.

7. In any one of claims 4 to 6, The second protective layer has higher flexibility compared to the third and fourth supports. Light-emitting device.

8. In any one of claims 4 to 7, The first support has a region fixed to the first portion via the first protective layer, The second support has a region fixed to the second portion via the first protective layer. Light-emitting device.

9. In any one of claims 1 to 8, When the light-emitting device is bent, the radius of curvature of the third portion is 1 mm or more and 100 mm or less. Light-emitting device.

10. In any one of claims 1 to 9, The first support and the second support are made of metal. Light-emitting device.

11. In any one of claims 1 to 10, The substrate of the display panel is made of polyamide-imide resin, polyimide resin, or PET. Light-emitting device.

12. In any one of claims 1 to 11, The third support and the fourth support do not overlap with the display area of ​​the display panel. Light-emitting device.

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