Antenna equipment and automated test equipment

Abstract

The present invention describes an antenna device. The antenna device includes a printed circuit board (PCB) with an opening, and at least two probes are disposed on or within the printed circuit board so as to be orthogonal to each other. The antenna device includes a cavity between a portion of the PCB carrying the probes and a waveguide back-short, forming a dual-polarized waveguide between the portion of the PCB carrying the probes and the waveguide back-short. The opening in the printed circuit board is disposed in a central region around a central axis of the cavity, and the cavity has a depth of one-quarter wavelength (λ / 4) plus an integer multiple of one-half wavelength. The present invention provides an antenna design for use in a socket for OTA testing using automatic test equipment providing wideband.

Description

[Technical Field]

[0001] Embodiments of the present invention relate to over-the-air (OTA) testing of antenna modules, and more particularly to the use of an antenna device integrated into a socket for over-the-air (OTA) testing of an antenna in a package module.

[0002] Embodiments of the present invention relate to an antenna device.

[0003] Embodiments of the present invention relate to automated testing equipment.

[0004] Embodiments of the present invention can be used for applications such as 5G, 6G, WiGig, and millimeter-wave radar, as well as for OTA testing for far-field and near-radiation fields.

[0005] In one embodiment, the embodiments of the present invention can be applied to providing an optimized concept for OTA testing using automated testing equipment. [Background technology]

[0006] Numerous antenna devices are currently known.

[0007] Using socket-based antenna devices for over-the-air (OTA) testing and measurement can present several challenges. The requirements for OTA testing and measurement applications differ from those for antenna-in-package (AiP) antenna arrays. Therefore, simply copying the antenna topology used in AiP antenna arrays, such as those found in 5G modules, will not yield any advantages.

[0008] The key requirements for OTA applications are as follows: 1. In OTA applications, the measuring antenna is often a single antenna, not an array. Therefore, the size of the antenna is not important. 2. Antenna gain is not important because it is used in the near-field radiation and the entire measurement setup is calibrated. 3. It is desirable, and in some cases even most important, that the equipment has a wide bandwidth that covers all the frequencies to be tested.

[0009] From the above perspective, it is desirable to create an antenna design for use (or usable) within a socket for OTA testing using automated test equipment that provides a wide bandwidth. [Overview of the project] [Problems that the invention aims to solve]

[0010] One embodiment of the present invention provides for creating an antenna device, such as an OTA socket measurement antenna device, such as a broadband antenna device. The antenna device comprises a printed circuit board (PCB) having an opening (e.g., a substantially square hole), and at least two, for example, orthogonal, for example, pin-shaped probes are arranged on or within the printed circuit board so as to be orthogonal to each other in order to couple, for example, two orthogonal modes of a waveguide. The antenna device comprises a cavity, such as a back short cavity, for example having a rectangular, square, or circular cross-section, and is located between a portion of the PCB on which the probes are mounted, such as an opening cutout or multiple layers of the PCB on which the probes are mounted, and a waveguide back short, the waveguide back short may be formed, for example, by a metal base plate, or for example, by a single layer of a multilayer PCB. The cavity forms a waveguide (preferably a dual-polarization waveguide), such as a rectangular hollow waveguide, or a square hollow waveguide, or a circular hollow waveguide, between the portion of the PCB on which the probes are mounted and the waveguide back short. The openings in the printed circuit board are located in the central region around the central axis of the cavity. The cavity has a depth of 1 / 4 wavelength, for example, λ / 4 of the guide wavelength of the waveguide formed by the cavity, plus an integer multiple of 1 / 2 wavelength, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0011] It should be noted that technically reasonable tolerances should be considered. For example, the acceptable tolerance for a dimension (e.g., with respect to the depth of a cavity) may be ±1 / 16 of the wavelength or ±1 / 8 of the wavelength.

[0012] It should be noted that, as the embodiment creates a very wideband device, the wavelength naturally changes as it shifts from the center frequency to the edge of the band. In some cases, this change may exceed the specified tolerance of 1 / 16 for the physical length of the back short.

[0013] This embodiment of the present invention is based on the finding that a wideband antenna operating frequency range can be obtained in an antenna device by providing a quarter-wavelength distance between the probe and the back short plate. Furthermore, this embodiment is based on the finding that an antenna structure with good characteristics can be realized when the antenna has the above-mentioned waveguide transition section having a back short. It has been found that a waveguide back short having a quarter-wavelength is advantageous for good or proper operation.

[0014] Therefore, there is no need to change the antenna to cover different frequency bands, minimizing implementation costs.

[0015] Furthermore, the described antenna geometry has been shown to be suitable for coupling with one or more antennas of a device under test (DUT) in automated test equipment. For example, a cavity between a printed circuit board and a back short may provide good matching and may help to efficiently couple to the near-field radiation of the DUT antenna. Additionally, cavities have been shown to improve the broadband characteristics of the antenna structure.

[0016] According to one embodiment, the probe is positioned in or on the printed circuit board within a region of the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide back short, such that the probe couples with the electromagnetic modes of the cavity. Such a probe arrangement is configured to excite the principal orthogonal modes of the waveguide, for example, inside an aperture cutout. However, this geometric shape may allow coupling to other modes of the waveguide, such as the evanescent modes coupled to the near-radiation field of the DUT antenna.

[0017] According to one embodiment, the probes form at least one orthogonal pair of probes, and at least two orthogonal modes of the waveguide, for example (TE 10 and TE 01 It is configured to excite ). This allows testing of devices that receive or transmit using different polarizations or circular polarization.

[0018] According to one embodiment, the probe is connected to at least two microstrip lines formed on or within the printed circuit board in a region of the printed circuit board that is not adjacent to the cavity between the printed circuit board and the waveguide back short, and the microstrip lines form a power supply network for the probe, which is connected to a port, for example, via a transmission line. Such a concept enables cost-effective implementation because, for example, both the probe and power supply can be realized on a single printed circuit board. Appropriate impedance of the power supply line, or impedance matching function, can be achieved by an appropriate geometric layout (or design) (or impedance) of the power supply line.

[0019] According to one embodiment, the probe's feeding network is connected to each differential port via each differential line transition section. Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and helps to widen the operating bandwidth. The feeding network can be connected to a differential line transition section having, for example, a 100Ω differential interface. This provides versatility in integrating the antenna circuit into the transmit / receive chain components on the same board.

[0020] According to one embodiment, a power supply network of one or more probes having a first direction and a power supply network of one or more probes having a second direction orthogonal to the first direction, for example, an orthogonal pair of first probes and an orthogonal pair of second probes, are arranged on different layers of the printed circuit board, for example, on opposite layers, with a ground layer in between, so that the ground layer shields the different power supply networks even in areas where the different power supply networks intersect in a projected view onto the PCB plane. Arranging the probe power supply networks on opposite layers of the PCB simplifies wiring and provides high insulation. Furthermore, it simplifies the PCB process by eliminating the need for blind vias and embedded vias. Moreover, the manufacture of multilayer printed circuit boards is a standard technology today, enabling cost-effective solutions with good characteristics. Furthermore, the use of multilayer PCBs simultaneously enables quasi-three-dimensional molding of probes using multilayers.

[0021] According to one embodiment, the antenna device comprises four probes, the four probes arranged in two orthogonal pairs, and positioned within an area of ​​the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide back short, and for example, the probes are positioned to couple with the modes of the cavity and the main orthogonal mode TE of the waveguide. 10 and TE 01 The probe is configured to excite the mode. However, the probe may (optionally) be coupled to other modes of the waveguide, which may be advantageous under near-field conditions.

[0022] According to one embodiment, the four probes are connected to respective microstrip lines within or on the printed circuit board in a region of the printed circuit board that is not adjacent to the cavity between the printed circuit board and the waveguide short. Two probes having a first direction, for example, two collinear probes, are coupled to a first differential port, for example, using respective microstrip lines and / or using two differential transmission lines. Two probes having a second direction, two other collinear probes, are coupled to a second differential port, for example, using respective microstrip lines and / or using two differential transmission lines. Differential feeding helps provide symmetry to the antenna circuit, increase decoupling between orthogonal arms, and broaden the operating bandwidth.

[0023] According to one embodiment, the printed circuit board comprises at least three layers, preferably four layers. Thus, so-called "thick probes" (using multiple layers of the printed circuit board that can be connected using vias, for example) may be created. As a result, for example, good (e.g., broadband) coupling between the probe and the electromagnetic field in the waveguide can be achieved with less effort. For example, it has been found that increasing the thickness of the probe along a direction perpendicular to the PCB broadens the operating bandwidth. Also, using multiple PCB layers helps improve matching and broadband characteristics.

[0024] According to one embodiment, the printed circuit board is disposed (e.g., mounted) on the surface of a metal base plate, for example, its upper surface, and the cavity is formed in the metal base plate, for example, the upper portion of the metal base plate. For example, the metal base plate also forms the waveguide short. Thus, miniaturization of the antenna device is achieved. Also, fabrication is relatively simple and, for example, milling technology may be used.

[0025] According to one embodiment, the printed circuit board is a multilayer printed circuit board having, for example, five or more layers, for example, eight or more layers, for example, a thick printed circuit board, and the waveguide back short is mounted using one layer of the printed circuit board as a PCB layer, for example, a metal layer, and / or the cavity boundary, for example, the side wall boundary is mounted using vias that penetrate the multilayer printed circuit board, for example, using plated through-via holes that can penetrate multiple layers of the PCB. Through-holes inside the aperture cutout can be provided to widen the antenna bandwidth. Such an approach makes it possible to cost-effectively manufacture the antenna structure using PCB manufacturing technology. Using such an approach, it has been found that the properties of such a structure are sufficiently good for many test requirements, even if the cavity properties (e.g., cavity walls) are not optimal.

[0026] According to one embodiment, the cavity has a width of half a wavelength (λ / 2). Such dimensions have been shown to result in good characteristics for the antenna structure.

[0027] According to one embodiment, the probe has a length equal to the depth of the cavity, within a tolerance of 1 / 16 wavelength. It has been recognized that such dimensions result in particularly good antenna characteristics.

[0028] According to one embodiment, the probe penetrates multiple layers of the PCB connected through one or more probe vias. This is recognized as improving the broadband performance of the antenna structure while enabling implementation at a reasonable cost.

[0029] According to one embodiment, the antenna device further comprises an upper metal plate, and an additional waveguide portion is formed on the upper metal plate, with the additional waveguide portion being an extension of the waveguide formed by the cavity. The additional waveguide portion increases the antenna bandwidth.

[0030] According to one embodiment, the printed circuit board is placed between a metal base plate and an upper metal plate. Thus, two waveguides are provided. Furthermore, using such a layout (or design), the power supply structure can be easily manufactured, for example, by milling grooves in the metal base plate or the upper metal plate along the power supply traces on the printed circuit board.

[0031] According to one embodiment, the differential transmission line is provided with a shield in contact with it. Improved insulation is provided. Such a shield can be provided, for example, using a metal base plate and / or an upper metal plate.

[0032] According to one embodiment, the antenna device comprises one or more external connections, for example, a blindmate waveguide connection, wherein the first external connection, for example, the first waveguide connection, is coupled to one or more probes having a first direction, and / or the second external connection, for example, the second waveguide connection, is coupled to one or more probes having a second direction that may be orthogonal to the first direction. Thus, improved wiring and insulation are provided. Using such connections, the antenna device can be coupled, for example, to one or more signal sources and / or one or more signal receivers of an automated test instrument. Thus, the antenna device may be coupled, for example, to the test head of an automated test instrument using one or more external connectors.

[0033] According to one embodiment, one or more external connection points are waveguide connection points. Waveguide connection points are recognized to have particularly low wear and are therefore suitable for high-volume testing in which antenna devices are frequently connected to and disconnected from automated test equipment.

[0034] According to one embodiment, one or more external connections are blindmate connections, for example, blindmate waveguide connections. A blindmate waveguide connection can be used, for example, to connect a millimeter-wave signal from a measuring antenna to a measuring instrument of an automated test device. The blindmate function of the external connector enables rapid connection and disconnection controlled, for example, by a robotic handler. This allows for high test throughput.

[0035] According to one embodiment, one or more external connection points are aligned in the same direction as the main radiation direction of the antenna device, for example, and are in contact in the same direction as the main radiation direction. Therefore, the antenna device can be positioned on the "top surface" of the device under test, which may be located in a test socket placed on a DUT board, for example, and can return signals in a direction toward the DUT board (for example, toward the opening of the DUT port where the high-frequency connection point is located).

[0036] According to one embodiment, the antenna device includes an electromagnetically transparent cover that covers the waveguide. Thus, the waveguide can be protected, and the cover may also serve to push the device under test into a desired position (e.g., a test socket).

[0037] According to one embodiment, the cover is configured to allow the passage of electromagnetic radiation from the waveguide toward the device under test or vice versa, while pushing the device under test into its position, for example, the test socket. Thus, the antenna device can (at least partially) take over the function of the pusher, which helps reduce costs and accelerate the replacement of the device under test.

[0038] One embodiment of the present invention provides for creating an automated test apparatus (ATE). The automated test apparatus comprises an antenna device as described in any one of the claims, and is configured to use the antenna device to test a device under test, such as a wireless device under test, such as an antenna-in-package device under test.

[0039] The automated test equipment according to this embodiment is based on similar considerations as the antenna device described above. Furthermore, this disclosed embodiment may be optionally supplemented individually or in combination with any other features, functions, and details disclosed herein in relation to the antenna device.

[0040] One embodiment of the present invention provides for creating an automated test apparatus. The automated test apparatus comprises a socket for the device under test and one or more high-frequency connectors, such as a waveguide connector, for establishing a high-frequency connection with, for example, an antenna device, the one or more high-frequency connectors being positioned next to the test socket.

[0041] The automated test equipment according to this embodiment is based on similar considerations as the antenna device described above. Furthermore, this disclosed embodiment may be optionally supplemented individually or in combination with any other features, functions, and details disclosed herein in relation to the antenna device.

[0042] According to one embodiment, the test socket and one or more high-frequency connectors are arranged such that one or more external connection parts of the antenna device mate with one or more high-frequency connectors, and when one or more external connection parts of the antenna device mate with one or more high-frequency connectors, the cover of the antenna device is arranged to push the device under test into the device under test socket.

[0043] Antenna devices and automated test equipment may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein (the entire document). [Brief explanation of the drawing]

[0044] Preferred embodiments of the present invention will be described below with reference to the following drawings. [Figure 1] This figure shows an antenna device according to one embodiment. [Figure 2A]This diagram shows an antenna device according to one embodiment in a disassembled state. [Figure 2B] This figure shows the antenna device of Figure 2A according to one embodiment in an assembled state. [Figure 2C] This is a cross-sectional view showing the antenna device of Figure 2A according to one embodiment in an assembled state. [Figure 3A] This figure shows an antenna device according to one embodiment in an assembled state. [Figure 3B] This figure shows an antenna device according to one embodiment in an assembled state without the upper metal plate. [Figure 3C] This figure schematically shows the antenna device shown in Figure 2A according to one embodiment. [Figure 4A] This figure shows an antenna device according to one embodiment. [Figure 4B] This is a rear view showing the antenna device according to one embodiment of Figure 4A. [Figure 4C] This is an enlarged cross-sectional view showing an antenna device according to one embodiment of Figure 4A. [Figure 4D] This is an enlarged cross-sectional view schematically showing the antenna device of Figure 4A according to one embodiment. [Figure 5A] This figure shows an antenna device according to one embodiment. [Figure 5B] This figure shows the antenna device shown in Figure 5A inside the housing according to one embodiment. [Figure 5C] Figure 5B shows the antenna device according to one embodiment in a disassembled state. [Figure 5D] This figure shows the antenna device of Figure 5A according to one embodiment in a disassembled state. [Figure 6A] This figure shows the antenna simulation results of an antenna device according to one embodiment. [Figure 6B] This figure shows the antenna simulation results of an antenna device according to one embodiment. [Figure 7A] This is a diagram showing an automated testing device according to one embodiment. [Figure 7B] This is a diagram showing an automated testing device according to one embodiment. [Modes for carrying out the invention]

[0045] Figure 1 shows an antenna device 100 according to one embodiment. The antenna device 100 comprises a printed circuit board (PCB) 110 having an opening 111, and at least two probes 112 arranged within the printed circuit board so as to be orthogonal to each other. The opening 111 is, for example, a substantially square hole. Although two orthogonal probes 112 are shown in Figure 1, in this embodiment, four probes forming two orthogonal pairs can be arranged on the printed circuit board 110.

[0046] The antenna device 100 includes a back short 120, which may be formed, for example, by a metal base plate, or, for example, by a single layer of a multilayer PCB.

[0047] The antenna device 100 includes a cavity 130 between a portion of the PCB 110 on which the probe 112 is mounted (e.g., an aperture cutout) or multiple layers of the PCB 110 on which the probe 112 is mounted and a back short 120. The cavity 130 may have, for example, a rectangular or square cross-section. The cavity 130 forms a waveguide between the portion of the printed circuit board 110 on which the probe 112 is mounted and the back short 120 (e.g., a waveguide back short 120). The opening 111 of the printed circuit board 110 is located in the central region around the central axis of the cavity 130. The cavity 130 has a depth of λ / 4, which is an integer multiple of 1 / 2 wavelength (e.g., the guide wavelength of the waveguide formed by the cavity), where the integer is equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0048] The probe 112 is positioned on (or within) the printed circuit board 110 in a region 113 of the printed circuit board 110 adjacent to the cavity 130, such that the probe 112 is coupled to the mode of the cavity 130.

[0049] The probes 112 are configured to form an orthogonal pair and excite at least two orthogonal modes of the waveguide.

[0050] The probe 112 is connected to at least two microstrip lines 114 formed on or within the printed circuit board 110 in a region 115 of the printed circuit board 110 that is not adjacent to the cavity 130. The microstrip lines 114 form the power supply network of the probe and are connected to ports, for example, via transmission lines. In one embodiment, the power supply network of the probe 112 can be connected to each differential port, for example, via each differential line transition section.

[0051] The power supply networks of one or more probes 1121 having a first direction and the power supply networks of one or more probes 1122 having a second direction orthogonal to the first direction are arranged on different layers of the printed circuit board 110, for example, on opposite layers, with a ground layer in between, for example, so that the ground layer shields the different power supply networks.

[0052] However, it should be noted that the antenna device 100 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0053] Figures 2A to 2C show an antenna device 200 according to one embodiment.

[0054] Figure 2A shows the antenna device 200 in a disassembled state. As shown in Figure 2A, the antenna device 200 includes a printed circuit board (PCB) 210 having an opening 211 and four probes 212 arranged in two orthogonal pairs. The opening 211 is a roughly square hole. The opening 211 is a through-hole for widening the antenna's bandwidth.

[0055] The antenna device 200 includes a back short 220. The back short 220 is formed by a metal base plate. The printed circuit board 210 is positioned (e.g., mounted) on the upper surface of the metal base plate, and the cavity 230 is formed in the upper portion of the metal base plate, which also forms the waveguide back short 220. The cavity 230 has a shape that substantially corresponds to the opening 211.

[0056] Therefore, the antenna device 200 includes a cavity 230 between a portion of the PCB 210 on which the probe 212 is mounted (i.e., an aperture cutout) and the back short 220. The cavity 230 is shown to have a square cross-section. However, the cavity 230 may have, for example, a rectangular, circular, or elliptical cross-section. The cavity 230 forms a waveguide between the portion of the PCB 210 on which the probe 212 is mounted and the waveguide back short 220. The opening 211 of the printed circuit board 210 is located in the central region around the central axis of the cavity 230. The cavity 230 has a depth of λ / 4, which is an integer multiple of 1 / 2 wavelength (e.g., the guide wavelength of the waveguide formed by the cavity), where the integer is equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0057] The probes 212 are arranged in two orthogonal pairs, and they are positioned on the printed circuit board 210 in a region 213 of the printed circuit board 210 adjacent to the cavity 230 between the printed circuit board 210 and the waveguide back short 220, so that the probes couple to the electromagnetic modes of the cavity, the main orthogonal modes TE of the waveguide 10 and TE 01 It is configured to excite.

[0058] The four probes 212 are connected to their respective microstrip lines 214 on the printed circuit board 210 within a region 215 of the printed circuit board 210 that is not adjacent to the cavity 230. Two probes 2121 have a first direction and represent two collinear probes. The two probes 2121 are coupled to a first differential port 2171 using their respective microstrip lines 2141 and a differential line 2161. Two probes 2122 have a second direction and represent two other collinear probes. The two probes 2122 are coupled to a second differential port 2172 using their respective microstrip lines 2142 and a different differential line 2162. The first direction is orthogonal to the second direction. Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and widens the operating bandwidth. The differential transmission lines may have, for example, shields touching them.

[0059] The metal base plate 220 includes portions configured to accommodate the microstrip line 2142 and the differential line 2162, for example, channels 229 formed in the upper portion of the metal base plate 220 corresponding to the microstrip line 2142 and the differential transmission line 2162. The metal base plate 220 also includes cutouts corresponding to the second differential port 2172, for example, cutouts that are open upwards.

[0060] The power supply networks for two probes 2121 having a first direction and the power supply networks for two probes 2122 having a second direction orthogonal to the first direction are arranged on opposite layers of the printed circuit board 210, with, for example, a ground layer in between, so that the ground layer shields the different power supply networks. Arranging the power supply networks on opposite layers of the printed circuit board 210 simplifies wiring and provides high insulation. This eliminates the need for blind vias and embedded vias, thus simplifying the PCB process. The power supply networks are connected to differential lines 216 having a 100Ω differential interface. This provides versatility in integrating the antenna circuit into the transmit / receive chain components on the same board.

[0061] The cavity 230 has a width of half a wavelength λ / 2. The probe 212 preferably has an electrical length equal to (at least approximately) the depth of the cavity, and is, for example, within a tolerance of 1 / 16 wavelength. For example, the probe length may depend on the specific dielectric material of the PCB. For example, when using an alumina substrate, the probe length will be shorter (for example, shorter than the depth of the cavity). However, for example, the electrical length (i.e., length in wavelength) can be considered to be approximately the same even for different materials.

[0062] The antenna device 200 further comprises an upper metal plate 240, the upper metal plate 240 having an additional waveguide portion 250 formed thereon, the additional waveguide portion 250 being an extension of the waveguide formed by the cavity 230.

[0063] The upper metal plate may include channels formed at the bottom of the upper metal plate 240 corresponding to, for example, the microstrip line 2141 and the differential line 2161. The upper metal plate 240 may also include cutouts, for example, a cutout that opens downwards, such as the cutout 241 shown in Figure 2B corresponding to the first differential port 2171.

[0064] The printed circuit board 210 is placed between the metal base plate 220 and the upper metal plate 240. As shown in the following figure, the printed circuit board 210 is sandwiched between the metal base plate 220 and the upper metal plate 240.

[0065] The antenna device may include, for example, one or more external connections (e.g., a blindmate waveguide connection), where the first external connection (e.g., a first waveguide connection) is coupled to one or more probes having a first direction, and / or the second external connection (e.g., a second waveguide connection) is coupled to one or more probes having a second direction that may be perpendicular to the first direction.

[0066] One or more external connections may be, for example, waveguide connections.

[0067] One or more external connections may be, for example, blindmate connections or blindmate waveguide connections.

[0068] One or more external connection points may be aligned in the same direction as the main radiation direction, for example, so as to contact the antenna device 200 in the same direction as the main radiation direction.

[0069] Figure 2B shows the antenna device of Figure 2A in an assembled state according to one embodiment. As shown in Figure 2B, the PCB 210 is placed between the metal base plate 220 and the upper metal plate 240. The PCB 210 is sandwiched between the metal base plate 220 and the upper metal plate 240.

[0070] The cavity 230 and the corresponding waveguide are not visible in Figure 2B because the cavity 230 is located above the waveguide back short 220 and is enclosed by the PCB 210 and the upper plate 240. An additional waveguide portion 250 is shown to be formed in the upper metal plate 240.

[0071] The cutouts 241 are formed at the bottom of the upper metal plate 240, one on each of the two corresponding sides of the upper metal plate 240. The cutouts 241 are positioned above each microstrip line 2141 located in the upper portion of the printed circuit board 210, within a region 215 of the printed circuit board 210 that is not adjacent to the cavity 230. The cutouts have a substantially rectangular shape.

[0072] Figure 2C is a cross-sectional view of the assembled state of the antenna device 200 according to one embodiment.

[0073] As shown in Figure 2C, the printed circuit board 210 comprises multiple layers. The printed circuit board 210 may comprise at least three layers, preferably four. The probe 212 utilizes multiple PCB layers connected via probe vias 218, for example, by penetrating or passing through multiple PCB layers.

[0074] The cavity 230 is shown in Figure 2C to be located above the waveguide back short 220 between the waveguide back short 220 and the PCB 210. An additional cutout 221 is located in the upper portion of the waveguide back short 220. The additional cutout 221 may have a depth that is, for example, at least twice as small (or exactly twice as small) as the depth of the cavity 230. However, it should be noted that there are no strict requirements for the depth of the cutout. For example, it is desirable (but not necessarily) that it not be so small as to affect the transmission line impedance. The additional cutout 221 is formed to accommodate each microstrip line 2142 and two other differential transmission lines 2162 that couple probe 2122 to the second differential port 2172.

[0075] The cavity 230 may have, for example, a square cross-section. The cavity 230 forms a waveguide between the portion of the printed circuit board 210 on which the probe 212 is mounted and the waveguide back short 220. The opening 211 of the printed circuit board 210 is located in the central region around the central axis of the cavity 230. The cavity 230 has a depth of λ / 4 (for example, the guide wavelength of the waveguide formed by the cavity) plus an integer multiple of 1 / 2 wavelength, where the integer may be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0076] However, it should be noted that the antenna device 200 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0077] Figures 3A to 3C show an antenna device 300 according to one embodiment.

[0078] Figure 3A shows the assembled antenna device 300. As shown in Figure 3A, the antenna device 300 comprises a printed circuit board (PCB) 310 having an opening 311 and four probes 312 arranged in two orthogonal pairs. The opening 311 is shown as a substantially square hole. However, the opening 311 may have, for example, a substantially rectangular hole, a substantially elliptical hole, or a substantially circular hole. The corners of the square are shown rounded. The opening 311 is a through-hole for widening the antenna bandwidth.

[0079] The antenna device 300 includes a back short 320. The back short 320 is formed by a metal base plate. The printed circuit board 310 may correspond to the printed circuit board 210 and is positioned (e.g., mounted) on the upper surface of the metal base plate, with a cavity (not shown) formed in the upper part of the metal base plate, and the metal base plate also forms the waveguide back short 320.

[0080] The antenna device 300 further comprises an upper metal plate 340, the upper metal plate 340 having an additional waveguide portion 350 formed therein, the additional waveguide portion 350 being an extension of the waveguide formed by a cavity (not shown).

[0081] The printed circuit board 310 is placed between the metal base plate 320 and the upper metal plate 340, for example, sandwiched between them.

[0082] The four probes 312 are connected to their respective microstrip lines on the printed circuit board 310 (not visible below the upper metal plate 340) within a region 315 of the printed circuit board 310 that is not adjacent to the cavity. Two probes 3121 have a first direction and represent two collinear probes. The two probes 3121 are coupled to a first port (e.g., in the form of a coaxial connector 3601) using a microstrip line 3171 (which may partially extend below the upper metal plate 340), a differential line 3161 (not visible below the upper metal plate 340), and another microstrip line 3141, and a balun 319 (not shown in Figure 3A) may be present between the microstrip line 3171 and the differential line 3161. Two probes 3122 have a second direction and represent two other collinear probes. The two probes 3122 are coupled to a second port (e.g., in the form of a coaxial connector 3602) using a microstrip line, (e.g., two) differential lines (not shown), and each microstrip line (not shown), and a balun (not shown) may be present between the microstrip line and the differential line. The first direction is orthogonal to the second direction. Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and widens the operating bandwidth. The differential transmission line may have, for example, a shield in contact with it.

[0083] PCB310 is shown to extend beyond the size of the metal base plate 320 and the upper metal plate 340. The sizes of the metal plate 320 and PCB310 can be different, and the ratio between them is arbitrary. This depends on the mechanism, not the operation of the device.

[0084] Two coaxial connectors 360 are attached to the PCB 310. The first coaxial connector 3601 is positioned to connect the first microstrip line 3171 to the measuring instrument. The second coaxial connector 3602 is positioned to connect the second microstrip line (not shown) to the measuring instrument.

[0085] Figure 3B shows the antenna device 300 in an assembled state without the upper metal plate 340. As shown in Figure 3B, the printed circuit board (PCB) 310 includes an opening 311 and four probes 312 arranged in two orthogonal pairs.

[0086] The four probes 312 are connected to their respective microstrip lines 314 on the printed circuit board 310 within a region 315 of the printed circuit board 310 that is not adjacent to the cavity 330. Two probes 3121 have a first direction and represent two collinear probes. The two probes 3121 are coupled to a first differential port 3181 using their respective microstrip lines 3141 and a differential line 3161. Two probes 3122 have a second direction and represent two other collinear probes. The two probes 3122 are coupled to a second differential port (not shown) using their respective microstrip lines (not shown) and another differential line (not shown). The first direction is orthogonal to the second direction. Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and widens the operating bandwidth. The differential transmission lines may have, for example, shields touching them.

[0087] The first differential port 3181 is connected to the microstrip line 3171 via the balun 319. The microstrip line 3171 is connected to the first coaxial connector 3601, which connects the first differential port 3181 to the corresponding measuring instrument.

[0088] The second coaxial connector 3602 is positioned upside down relative to the first coaxial connector 3601 in order to connect the second differential port located on the bottom surface of the PCB 310 to the corresponding measuring instrument.

[0089] The first and second coaxial connectors 360 are attached (e.g., fixed) to the corresponding sides of the PCB 310 by screws 362. The first and second coaxial connectors 360 are mounted upside down to each other and positioned, for example, in planes rotated 180 degrees relative to each other.

[0090] Multiple plated through-holes 390 form the sidewalls of the back short 320 and, correspondingly, the sidewalls of the cavity 330.

[0091] The cavity sidewalls or waveguide sidewalls of the cavity 330, for example, the sidewall boundaries, are mounted using vias 390 that penetrate the multilayer printed circuit board 310, such as plated through-via holes that can penetrate multiple layers of the printed circuit board 310.

[0092] Multiple, for example, plated, through-via holes 391 form a shield, for example, a root, for each microstrip line.

[0093] Figure 3C shows a schematic representation of the antenna device 300. Figure 3C shows only the PCB 310 (top view) and coaxial connector 360 of the antenna device 300.

[0094] As shown in Figure 3C, the antenna device 300 includes a printed circuit board (PCB) 310 having an aperture 311 and four probes 312 arranged in two orthogonal pairs.

[0095] The probes 312 are arranged in two orthogonal pairs and are positioned on the printed circuit board 310 in a region 313 of the printed circuit board 310 adjacent to the cavity 330 between the printed circuit board 310 and the waveguide back short 320, so that the probes couple with the electromagnetic modes of the cavity.

[0096] The four probes 312 are connected to their respective microstrip lines 314 on the printed circuit board 310 within a region 315 of the printed circuit board 310 that is not adjacent to the cavity 330. Two probes 3121 are connected to the first differential port 3181 using their respective microstrip lines 3141 and differential line 3161. Two probes 3122 have a second orientation and represent two other collinear probes.

[0097] It should be noted that the differential line portion 316 (for example, comprising a differential line 3161 having two conductors, where the first conductor of the two conductors is coupled to the first microstrip line 3141 and the second conductor of the two conductors is coupled to the second microstrip line 3141) is bounded (for example, between) the balun 319 and the coupling point of the pair of microstrip power supply lines 3141.

[0098] The power supply networks for two probes 3121 having a first direction and the power supply networks for two probes 3122 having a second direction orthogonal to the first direction are arranged on opposite layers of the printed circuit board 310, with, for example, a ground layer sandwiched between them, so that the ground layer shields the different power supply networks. By arranging the power supply networks on opposite layers of the PCB 310, wiring is made easier and high insulation is achieved. This eliminates the need for blind vias and embedded vias, thus simplifying the PCB process.

[0099] Multiple plated through-via holes 390 form the sidewalls of the back short 320, and correspondingly form the sidewalls of the cavity 330.

[0100] The boundaries of the cavity 330, for example, the side wall boundaries, are mounted using vias 390 that penetrate the multilayer printed circuit board 310, for example, using plated through-via holes that can penetrate multiple layers of the printed circuit board 310.

[0101] Multiple, for example, plated, through-via holes 391 form a shield for each microstrip line.

[0102] However, it should be noted that the antenna device 300 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0103] Figures 4A to 4D show an antenna device 400 according to one embodiment.

[0104] As shown in Figure 4A, the antenna device 400 includes a printed circuit board (PCB) 410 having an opening 411 and four probes 412 arranged in two orthogonal pairs. The opening 411 is a substantially square hole. The opening 411 is a through-hole for widening the antenna's bandwidth.

[0105] The antenna device 400 includes a back short 420 (not shown in Figure 4A).

[0106] The printed circuit board 410 is, for example, a thick, multilayer printed circuit board. The printed circuit board 410 has five or more layers, preferably eight or more layers. The waveguide back short 420 is mounted using one layer of the printed circuit board, for example, a metal layer, as the PCB layer. The bottom layer of the PCB functions as the metal back short 420.

[0107] PCB410 has the following thickness:

number

[0108] The antenna device 400 thus includes a cavity 430 between a portion of the PCB 410 on which the probe 412 is mounted, i.e., an aperture cutout, and a back short 420. The cavity 430 may have, for example, a square cross-section. The cavity 430 forms a waveguide between the portion of the printed circuit board 410 on which the probe 412 is mounted and the waveguide back short 420. The aperture 411 of the printed circuit board 410 is located in the central region around the central axis of the cavity 430. The cavity 430 has a wavelength of 1 / 4 wavelength (e.g., the guide wavelength in the waveguide formed by the cavity) λ / 4 in the PCB substrate material √ε r The depth is obtained by dividing by a certain value and adding an integer multiple of half a wavelength, where the integer can be equal to or greater than 0, and the wavelength is set to the center frequency of the device.

[0109] The boundaries of the cavity 430, for example, the side wall boundaries, are mounted using vias 490 that penetrate the multilayer printed circuit board 410, for example, using plated through-via holes that can penetrate multiple layers of the printed circuit board 410.

[0110] As can be seen further in Figures 4A to 4D, the multiple plated through-via holes 490 form the sidewalls of the back short 420 and, correspondingly, the sidewalls of the cavity 430.

[0111] The boundaries of the cavity 430, for example, the side wall boundaries, are mounted using vias 490 that penetrate the multilayer printed circuit board 410, for example, using plated through-via holes that can penetrate multiple layers of the printed circuit board 410.

[0112] As seen in Figures 4A, 4C, and 4D, multiple, for example, plated through-via holes 491 form a shield for each microstrip line.

[0113] As shown in FIGS. 4A, 4C, and 4D, the probes 412 are arranged in two orthogonal pairs, which are arranged on the printed circuit board 410 within the region 413 adjacent to the cavity 430 between the printed circuit board 410 and the waveguide backshort 420 so that the probes couple to the modes of the cavity, and the main orthogonal modes TE 10 and TE 01 are configured to be excited.

[0114] The four probes 412 are connected to respective microstrip lines 414 on the printed circuit board 410 within the region 415 of the printed circuit board 410 that is not adjacent to the cavity 430. Two of the probes 4121 have a first direction and represent two collinear probes. The two probes 4121 are coupled to the first differential port 4181 using their respective microstrip lines 4141 and a differential line 4161. Two of the probes 4122 have a second direction and represent two other collinear probes. The two probes 4122 are coupled to a second differential port (not shown) using their respective microstrip lines (not shown) and another differential line (not shown). The first direction is orthogonal to the second direction. Differential feeding provides symmetry to the antenna circuit, increases the decoupling between the orthogonal arms, and broadens the operating bandwidth. The differential transmission line may, for example, be provided with a shield in contact therewith.

[0115] As shown in Figure 4C, the probe 412 utilizes multiple PCB layers of a thick PCB connected via probe vias 419, for example, penetrating or passing through multiple PCB layers. The probe 412 connects the upper layers of the PCB layers. The probe 412 utilizes, for example, at least three PCB layers, for example, at least three upper PCB layers connected via probe vias 419. For example, not all PCB layers are utilized by the probe 412. In some implementation examples, the probe 412 may utilize, for example, fewer than half of the PCB layers. However, it should be noted that the desired (or required) number of layers in the probe depends, for example, the required antenna bandwidth. The probe utilizes at least one or two metal layers. The probe does not necessarily utilize the upper layers, and (for example, the layers utilized) can be hidden inside the inner layers.

[0116] Figure 4D shows that probe 412 is formed as a multilayer probe.

[0117] However, it should be noted that the antenna device 400 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0118] Figures 5A to 5D show an antenna device 500 and / or a part thereof according to one embodiment.

[0119] Figure 5A shows a printed circuit board (PCB) 510 having an opening 511 and four probes 512 arranged in two orthogonal pairs. The opening 511 is a substantially square hole. The opening 511 is a through-hole for widening the antenna bandwidth. Although the opening 511 is shown as a substantially square hole, the opening 511 may be, for example, a substantially rectangular hole, a substantially circular hole, or a substantially elliptical hole, and the opening may have a cross shape or an X shape. However, holes of other shapes can also be used.

[0120] The four probes 512 are connected to their respective microstrip lines 514 on the printed circuit board 510 within a region 515 of the printed circuit board 510 that is not adjacent to the cavity 530. Two probes 5121 have a first direction and represent two collinear probes. The two probes 5121 are coupled to a first (e.g., differential) waveguide transition section 5941 using their respective microstrip lines 5141 and a differential line 5161. Two probes 5122 have a second direction and represent two other collinear probes. The two probes 5122 are coupled to a second (e.g., differential) waveguide transition section (not shown) using their respective microstrip lines (not shown) and another differential line (not shown). The first direction is orthogonal to the second direction. Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and widens the operating bandwidth. The differential transition line may have, for example, a shield in contact with it.

[0121] Figure 5B shows the antenna device 500 in its assembled state, for example, housed in a metal housing 560, or in a state ready for immediate use.

[0122] The back short of the antenna 500 is formed, for example, by a metal base plate (e.g., plate 570 or plate 580) or by a layer of a printed circuit board (e.g., the bottom layer). The printed circuit board 510 is, for example, positioned (e.g., mounted) on the upper surface of the metal base plate 570, and a cavity (not shown) is formed in the upper part of the metal base plate 570, and the metal base plate 570 also forms a waveguide back short 520.

[0123] A separate component of the metal housing is shown in Figure 5C. The upper layer 568 of the metal base plate is shown to have mounting holes 528 for screws, which are configured to fasten the components of the metal housing together.

[0124] An additional waveguide section is formed in the upper metal plate 568, and this additional waveguide section is an extension of the waveguide formed by the cavity (not shown).

[0125] The printed circuit board 510 is positioned between the upper metal plate 568 and the intermediate metal plate 570 in the assembled state of the antenna 500, for example, being sandwiched between them.

[0126] In addition to the upper metal plate 568, the metal housing further comprises two metal layers 570 (for example, designated as an intermediate metal layer) and 580 (for example, designated as a lower metal layer), each having (respectively) central portions 571, 581 and two pairs of (respectively) peripheral portions 572, 573, 582, 583. For example, the central portions 571, 581 of the two metal layers 570, 580 correspond to a shape approximating the form of the PCB 510 (for example, a roughly rectangular or quadratic shape) and the form of the upper metal plate 568. For example, the first peripheral portions 572, 582 of the two metal layers 570, 580 correspond to extending diagonally from two opposing sides of the central portions 571, 581 to form a metal plate. For example, the second peripheral portions 573, 583 of the two metal layers 570, 580 correspond to and diagonally extend from the first peripheral portions 572, 582 to form a metal plate. The second peripheral portions 573, 583 are arranged, for example, parallel to the central portions 571, 581, and for example, the sides of the second peripheral portions 573, 583 are parallel to the corresponding sides of the central portions 571, 581. One metal layer 570 has mounting holes 574 for attaching the upper metal plate 568 to the intermediate metal plate 570 and the lower metal layer 580. The metal layers may have alignment means, for example, alignment pins or alignment holes. The other (lower) metal layer 580 has two waveguide structures 575, 576 for first and second polarization. For example, both metal layers 570 and 580 are provided with mounting holes 578 and 588 for fixing the antenna 500 within the metal housing, and mounting holes for attaching the antenna 500 within the metal housing 560 to a corresponding test stand or test equipment.

[0127] Figure 5D shows the assembled state of the antenna device 500, for example, inside the metal housing 560 and mounted on the test stand 580a. The test stand has an upper part 583a and a lower part 584a. The lower part 584a stands on a stable base 585a and is attached to the stable base 585a with screws 586a. The components of the metal housing 560 are fixed to the test stand 580a using, for example, metal fasteners 581a. The metal fasteners 581a generally have an N-shape. The metal fasteners 581a hold the second peripheral components 573, 583 (or the entire antenna device 500) in the hollow notch 582a of the test stand 580a. The hollow notch 582a has a shape corresponding to the metal housing 560. The metal fasteners 581a are attached to the upper part 583a of the test stand 580a using screws 587a, for example, each of the metal fasteners 581a is attached with four screws 587a.

[0128] The first and second coaxial connectors 590a and 591a are attached to the waveguide transition sections 592a and 593a, establishing electromagnetic coupling with the waveguide structures 575 and 576. Thus, the coaxial connectors are effectively coupled to the antenna by the waveguide transition sections 592a and 593a, the waveguide structures 575 and 576, and the transmission line wiring on the printed circuit board 510 (e.g., waveguide coupling structure 5941, differential line 5161, and microstrip line 5141). Therefore, the first coaxial connector 590a is associated with the first polarization, and the second coaxial connector 591a is associated with the second polarization.

[0129] However, it should be noted that the antenna device 500 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0130] Figures 6A and 6B show the antenna simulation results of an antenna device according to one embodiment. Antenna devices 100, 200, 300, 400, and 500, shown in correspondence with Figures 1, 2, 3, 4, and 5, can all exhibit performance similar to that shown in Figures 6A and 6B.

[0131] Figure 6A shows the 3D antenna radiation pattern and the antenna radiation patterns in the plane E (electric field plane) and plane H (magnetic field plane) at frequencies F1=24.25GHz, F2=29.5GHz, F3=37GHz, and F4=40GHz.

[0132] Figure 6B shows a graph of the frequency dependence of the antenna boresite gain and antenna reflection coefficient.

[0133] As can be seen from Figures 6A and 6B, the electrical performance of the antenna device according to one embodiment can be characterized as follows. 1.10 dBRL considerations for a 22-43 GHz operating frequency band (65%) 2. The insertion loss of the antenna circuit ranges from 0.75 to 1.35 dB across the frequency band (Megtron6-based board). 3. The antenna gain is 6 to 9.5 dBi across the bandwidth. 4. Port-to-port leakage is less than -80dB across bandwidth. 5. Discrimination of cross-polarization components in the far-field should be 55 dB or higher across the bandwidth.

[0134] At the same time, the mechanical performance of the antenna device according to this embodiment can be characterized as follows. 1. The antenna circuit occupies only a 2 × 2λ0 region within the PCB. Here, λ0 is calculated with a center frequency of 32.5 GHz. 2. The antenna PCB utilizes at least three layers, and the process does not require blind vias or embedded vias.

[0135] Figures 7A and 7B show an automated test apparatus having an antenna device 700.

[0136] The automated test equipment includes an antenna device 700. The automated test equipment is configured to use the antenna device 700 to test the device under test 792, for example, a wireless device under test, for example, an antenna-in-package device under test.

[0137] The automated test equipment includes a blindmate connector 793 and mounts the device under test 792 within an electrical socket. Figure 7A shows two blindmate connectors 793. However, the automated test equipment may include one or more blindmate connectors 793. The blindmate connector 793 can be, for example, a high-frequency connector, such as a waveguide connector, similar to the one shown in Figure 7A. The blindmate connector 793 is configured to establish a high-frequency connection with, for example, an antenna device 700. The connector 793 is located next to the test socket.

[0138] An antenna device 700, for example, an OTA measurement antenna, is housed in a metal housing and secured to a socket cover 790. A pusher 791 is attached to the antenna device 700. The pusher 791 is made of a radio-permeable material. The pusher 791 is provided to push the device under test 792 into the electrical socket. In some embodiments, the pusher 791 may also function as a cover for the antenna device 700.

[0139] When the socket cover 790 is installed on the automated testing equipment, the first and second (preferably blindmate) waveguide connectors 794 interconnect with the blindmate waveguide 793. The blindmate waveguide 793 connects the millimeter-wave signal of the measuring antenna to the ATE measuring equipment.

[0140] The antenna device 700 preferably includes two external connection parts 794, which are waveguide connection parts. Although two external connection parts 794 are shown in Figure 7A, the antenna device 700 may include one or more external connection parts 794.

[0141] The test socket 792 and connector 793 are positioned such that the external connection portion 794 of the antenna device 700 mates with the connector 793, and that when the connection portion 794 of the antenna device 700 mates with the connector 793, the pusher 791 of the antenna device 700 pushes the device under test 792 into the device under test socket.

[0142] Figure 7B shows the antenna device 700 fixed to the automated testing equipment.

[0143] However, it should be noted that the automated testing equipment 700 may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein.

[0144] (Another embodiment and aspect) The following describes other aspects and embodiments of the present invention, which can be used individually or in combination with other embodiments disclosed herein.

[0145] Furthermore, the embodiments disclosed in this section may be optionally supplemented individually or in combination with other features, functions, and details disclosed herein.

[0146] The following describes antenna layouts (or designs) used to integrate antenna-in-package (AiP) modules for over-the-air (OTA) testing into sockets for applications such as 5G.

[0147] This can be used in far-field and near-field OTA testing in embodiments of the present invention.

[0148] The antenna layout (or design) according to the embodiment of the present invention is optimized for use in sockets for OTA testing using automated test equipment. Because the requirements for OTA test measurement applications differ from known antenna layouts (or designs) for AiP antenna arrays, it has been found advantageous to use a different antenna technology than that used in AiP antenna arrays such as 5G modules. - For OTA applications, the size of the antenna is not important because the measuring antenna is a single antenna element (not an antenna array). - Antenna gain is not important because it is used in the near-radiation field (closer to the DUT, unlike the base station in a real OTA scenario); what matters is having a wide bandwidth that covers all the frequencies to be tested.

[0149] The following describes the fundamental concepts behind the embodiments of the present invention.

[0150] Antenna design (or antenna layout)

[0151] The antenna design (or antenna layout) shown in Figures 2A to 2C comprises a dual-polarization waveguide (230), a waveguide back short (220), and a PCB (210). Two orthogonal pairs of differentially fed microstrip probes (212) are connected to the waveguide's primary orthogonal mode (TE 10 and TE 01 It is positioned within the opening cutout region (211) to excite the ).

[0152] Differential feeding provides symmetry to the antenna circuit, increases decoupling between orthogonal arms, and helps to widen the operating bandwidth.

[0153] The probe's power supply network is placed on the opposite layer of the PCB due to its ease of wiring and high isolation. This eliminates the need for blind vias and embedded vias, simplifying the PCB process. The power supply network is connected to a differential line or differential line transition section (216) with a 100Ω differential interface. This provides versatility in integrating the antenna circuit into the transmit / receive chain components on the same board.

[0154] Finally, the probe utilizes multiple PCB layers ("thick probe") connected via probe vias (218), with through-holes (211) inside the aperture cutout to widen the antenna bandwidth. According to one aspect of the present invention, another possibility for utilizing magnetic interaction in testing is to add new circuitry to DFT components for structural testing, creating new possibilities with dynamic magnetic fields by induction intervening, for example, in SCAN testing. Complex logic has the disadvantage that the scan chain must be loaded frequently to achieve sufficiently high test coverage (should be 99% or more for high-quality products). However, while it is easy to reach most of the circuit area, the chain must always be fully loaded, and therefore, additional test options in complex areas have a significant impact on test time and test cost.

[0155] The simulation results for the antenna are shown in Figures 6A and 6B.

[0156] Electrical performance Operating frequency band: 22-43GHz (65%), considering 10dBRL. Antenna circuit insertion loss: 0.75 to 1.35 dB across frequency band (Megtron6-based board) Antenna gain: 6 to 9.5 dBi across the bandwidth Port-to-port leak: Less than -80dB across bandwidth Discrimination of cross-polarization components in the far-field: greater than 55 dB across the bandwidth. mechanical performance The antenna circuit occupies only a 2 x 2λ0 area within the PCB (λ0 is calculated using a center frequency of 32.5 GHz). The antenna PCB uses at least three layers, and the process does not require blind vias or embedded vias.

[0157] The prototype of the OTA antenna is shown in Figures 5A to 5D.

[0158] The antenna integration within the ATE socket is shown in Figures 7A and 7B.

[0159] Furthermore, it should be noted that embodiments and procedures may be used as described in this section and may be optionally supplemented individually or in combination with any of the features, functions, and details disclosed herein (the entire document).

[0160] However, features, functions, and details described in other chapters may also be optionally incorporated into embodiments of the present invention.

[0161] Furthermore, the embodiments described in the above chapters can be used individually and may be supplemented by any of the features, functions, and details described in other chapters.

[0162] Furthermore, it should be noted that the individual embodiments described herein can be used individually or in combination. Therefore, details can be added to each of the individual embodiments without adding details to another of the embodiments.

[0163] In particular, embodiments are also described in the claims. Embodiments described in the claims may be optionally supplemented individually or in combination with any of the features, functions, and details described herein.

[0164] Furthermore, all features and functions described herein can be implemented in hardware or software, or using a combination of hardware and software, as described in the "Alternative Implementation Examples" section.

[0165] (Alternative implementation example) While some embodiments are described in the context of apparatus, it is clear that these embodiments also represent descriptions of corresponding methods, where blocks or devices correspond to method steps or features of method steps. Similarly, embodiments described in the context of method steps also represent descriptions of corresponding blocks or items, or features of corresponding apparatus. Some or all of the method steps may be performed by (or using) hardware devices such as, for example, a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, one or more of the most important method steps may be performed by such devices.

[0166] Depending on specific implementation requirements, embodiments of the present invention can be implemented in hardware or software. Implementation can be carried out using a digital storage medium, such as a floppy disk, DVD, Blu-ray, CD, ROM, PROM, EPROM, EEPROM, or FLASH memory, which has electronically readable control signals stored therein and cooperates (or can cooperate) with a programmable computer system to perform each method. Therefore, the digital storage medium may be computer-readable.

[0167] Some embodiments of the present invention include a data carrier having an electronically readable control signal, which can cooperate with a programmable computer system so that one of the methods described herein is performed.

[0168] Generally, embodiments of the present invention can be implemented as a computer program product having program code, the program code being operable to perform one of the methods when the computer program product is executed on a computer. The program code may be stored, for example, on a machine-readable carrier.

[0169] Other embodiments include a computer program stored on a machine-readable carrier for performing one of the methods described herein.

[0170] Therefore, in other words, one embodiment of the method of the present invention is a computer program having program code for performing one of the methods of the present invention when the computer program is executed on a computer.

[0171] Accordingly, another embodiment of the method of the present invention is a data carrier (or digital storage medium, or computer-readable medium) on which a computer program for performing one of the methods described herein is recorded. The data carrier, digital storage medium, or recording medium is typically tangible and / or non-temporary.

[0172] Therefore, another embodiment of the method of the present invention is a data stream or sequence of signals representing a computer program for performing one of the methods described herein. The data stream or sequence of signals may be configured to be transmitted over a data communication connection, such as the Internet.

[0173] Another embodiment comprises processing means, such as a computer or a programmable logic device, configured or adapted to perform one of the methods described herein.

[0174] Another embodiment comprises a computer on which a computer program for performing one of the methods described herein is installed.

[0175] Another embodiment of the present invention comprises an apparatus or system configured to transfer (e.g., electronically or optically) a computer program for performing one of the methods described herein to a receiver. The receiver may be, for example, a computer, a mobile device, a memory device, etc. The apparatus or system may include, for example, a file server for transferring the computer program to the receiver.

[0176] In some embodiments, a programmable logic device (e.g., a field-programmable gate array) may be used to perform some or all of the functions of the method herein. In some embodiments, the field-programmable gate array may cooperate with a microprocessor to perform one of the methods herein. Generally, the method is preferably performed by any hardware device.

[0177] The apparatus described herein may be implemented using hardware devices, or using a computer, or using a combination of hardware devices and a computer.

[0178] The apparatus described herein, or any component of the apparatus described herein, may be implemented at least partially in hardware and / or software.

[0179] The methods described herein may be performed using hardware devices, or using a computer, or using a combination of hardware devices and a computer.

[0180] Any component of the methods or apparatus described herein may be performed at least partially by hardware and / or software.

[0181] The embodiments described herein are merely illustrative of the principles of the present invention. Modifications and variations of the arrangements and details described herein will be apparent to those skilled in the art. Therefore, the invention is intended to be limited only by the following claims and not by any specific details presented in the description and commentary of the embodiments herein.

Claims

1. A printed circuit board having an opening, At least two probes are arranged on the printed circuit board so as to be orthogonal to each other. A cavity is provided between a portion of the printed circuit board on which the probe is mounted and the waveguide back short. The cavity forms a dual-polarized waveguide between the portion of the printed circuit board on which the probe is mounted and the waveguide back short. The opening of the printed circuit board is located in the central region around the central axis of the cavity, The cavity has a depth of 1 / 4 wavelength plus an integer multiple of 1 / 2 wavelength, within a tolerance of ±1 / 16 wavelength. The cavity has a width of 1 / 2 wavelength, The aforementioned wavelength is the guide wavelength in the dual-polarization waveguide that corresponds to the center frequency of the operating frequency band of the antenna device. Antenna device.

2. A printed circuit board comprising an opening, At least two probes are arranged on the printed circuit board so as to be orthogonal to each other. A cavity is provided between a portion of the printed circuit board on which the probe is mounted and the waveguide back short. The cavity forms a dual-polarized waveguide between the portion of the printed circuit board on which the probe is mounted and the waveguide back short. The opening of the printed circuit board is located in the central region around the central axis of the cavity, The cavity has a depth of 1 / 4 wavelength plus an integer multiple of 1 / 2 wavelength, within a tolerance of ±1 / 16 wavelength. The probe has a length equal to the depth of the cavity, within a tolerance of 1 / 16 wavelength. The aforementioned wavelength is the guide wavelength in the dual-polarization waveguide that corresponds to the center frequency of the operating frequency band of the antenna device. Antenna device.

3. A printed circuit board comprising an opening, The four probes are arranged on the printed circuit board in two orthogonal pairs. A cavity is provided between a portion of the printed circuit board on which the probe is mounted and the waveguide back short. The cavity forms a dual-polarized waveguide between the portion of the printed circuit board on which the probe is mounted and the waveguide back short. The opening of the printed circuit board is located in the central region around the central axis of the cavity, The cavity has a depth of 1 / 4 wavelength plus an integer multiple of 1 / 2 wavelength, within a tolerance of ±1 / 16 wavelength. The aforementioned wavelength is the guide wavelength in the dual-polarization waveguide that corresponds to the center frequency of the operating frequency band of the antenna device. The four probes are connected to the respective microstrip lines formed on the printed circuit board within a region of the printed circuit board that is not adjacent to the cavity between the printed circuit board and the waveguide back short. Two probes having a first direction are coupled to a first differential port. Two probes having a second direction are coupled to a second differential port. Antenna device.

4. The probe is positioned on the printed circuit board within a region of the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide back short. The antenna device according to claim 1 or 2.

5. The probe is configured to form at least one orthogonal pair of probes and to excite at least two orthogonal modes of the dual-polarization waveguide. The antenna device according to claim 1 or 2.

6. The probe is connected to at least two microstrip lines formed on the printed circuit board within a region of the printed circuit board that is not adjacent to the cavity between the printed circuit board and the waveguide back short, and the microstrip lines form a power supply network for the probe. The antenna device according to claim 1 or 2.

7. The power supply network of the probe is connected to each differential port via each differential line transition section. The antenna device according to claim 6.

8. The power supply network for one or more probes having a first direction and the power supply network for one or more probes having a second direction orthogonal to the first direction are arranged on different layers of the printed circuit board. The antenna device according to claim 1 or 2.

9. The at least two probes comprise four probes arranged in two orthogonal pairs, the four probes being located in a region of the printed circuit board adjacent to the cavity between the printed circuit board and the waveguide back short, and the TE being the primary orthogonal mode of the dual-polarized waveguide. １０ and TE ０１ It is configured to excite, The antenna device according to claim 1 or 2.

10. The printed circuit board comprises at least three layers. The antenna device according to any one of claims 1 to 3.

11. The printed circuit board is placed on the surface of a metal base plate. The cavity is formed in the metal base plate, The antenna device according to any one of claims 1 to 3.

12. The aforementioned printed circuit board is a multilayer printed circuit board, and, The waveguide back short is mounted using one layer of the printed circuit board, and / or The boundary of the cavity is mounted using vias that penetrate the multilayer printed circuit board. The antenna device according to any one of claims 1 to 3.

13. The probe penetrates multiple layers of the printed circuit board, which are connected through one or more probe vias. The antenna device according to any one of claims 1 to 3.

14. The device further comprises an upper metal plate, the upper metal plate having an additional waveguide portion formed thereon, the additional waveguide portion being an extension of the dual-polarization waveguide formed by the cavity. The antenna device according to claim 11.

15. The printed circuit board is positioned between the metal base plate and the upper metal plate. The antenna device according to claim 14.

16. The differential line transition section is provided with a shield in contact with it. The antenna device according to claim 7.

17. The antenna device comprises one or more external connection parts, The first external connection is coupled to one or more probes having a first direction, and / or The second external connection is coupled to one or more probes having a second direction. The antenna device according to any one of claims 1 to 3.

18. The one or more external connection parts mentioned above are waveguide connection parts. The antenna device according to claim 17.

19. The one or more external connection parts mentioned above are blindmate connection parts. The antenna device according to claim 17.

20. The one or more external connection parts are aligned in the same direction as the main radiation direction of the antenna device. The antenna device according to claim 17.

21. The antenna device includes a wireless-transparent cover that covers the dual-polarization waveguide. The antenna device according to any one of claims 1 to 3.

22. The wireless-permeable cover is configured to allow electromagnetic radiation to pass through from the dual-polarization waveguide toward the device under test, or vice versa, while pressing the device under test into the device under test position. The antenna device according to claim 21.

23. An automated testing equipment (ATE), The aforementioned automated testing equipment comprises the antenna device described in any one of claims 1 to 3. The automated testing equipment is configured to test the device under test using the antenna device. Automated testing equipment.

24. The automatic test equipment comprises a device socket and one or more high-frequency connectors, The one or more high-frequency connectors are positioned next to the socket of the device under test. The automated testing apparatus according to claim 23.

25. The device socket under test and one or more high-frequency connectors are: One or more external connection points of the antenna device are arranged to mate with one or more high-frequency connectors, When the one or more external connection parts of the antenna device are mated with the one or more high-frequency connectors, the cover of the antenna device is positioned to push the device under test into the device under test socket. The automated testing apparatus according to claim 24.

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