Conveying system and conveying method

Abstract

To prevent damages of a substrate due to a contact even if a deflection of the substrate occurs.SOLUTION: A conveyance system according to an embodiment, comprises: a robot; and a controller. The controller controls an operation of the robot. The robot comprises: a hand; and a lifting mechanism. The hand conveys a substrate. The lifting mechanism lifts the hand. The hand comprises a sensor capable of detecting a distance from a lower surface of the substrate held. The controller comprises: a storage part; a detection part; and a calculation part. The storage part stores mounting information containing a mounting height at a mounting position of the substrate. The detection part detects a separation height that the substrate is separated from the hand in the case where the hand is dropped from the mounting height. The calculation part calculates a deflection amount on the basis of a difference of the mounting height and the separation height.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The disclosed embodiments relate to a conveyance system and a conveyance method.

Background Art

[0002] Conventionally, a conveyance system is known that transfers substrates between a cassette that houses the substrates and a robot having a hand for transferring substrates such as wafers and panels.

[0003] For example, a technique has been proposed for detecting whether or not a robot and a wafer housed in a cassette may come into contact with each other using sensors of a wafer transfer arm or a cassette (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the above-described conventional technology, when the substrate housed in the cassette is warped, there is a possibility that the housed substrate may come into contact with the robot or a newly loaded substrate.

[0006] One aspect of the embodiment aims to provide a conveyance system and a conveyance method that can prevent damage to the substrate due to contact even when the substrate is warped.

Means for Solving the Problems

[0007] A transport system according to one embodiment comprises a robot and a controller for controlling the robot's movements. The robot includes a hand for transporting substrates and a lifting mechanism for raising and lowering the hand. The hand is equipped with a sensor capable of detecting the distance to the lower surface of the substrate it is holding. The controller comprises a storage unit, a detection unit, and a calculation unit. The storage unit stores placement information, including the placement height at the placement position of the substrate. The detection unit detects the distance height at which the substrate separates from the hand when the hand is lowered from the aforementioned placement height. The calculation unit calculates the amount of deflection of the substrate based on the difference between the placement height and the distance height. [Effects of the Invention]

[0008] According to one embodiment, a transport system and transport method can be provided that can prevent damage to the substrate due to contact, even if the substrate is deflected. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic top view illustrating the overall structure of the transport system. [Figure 2] Figure 2 is a schematic side view showing the detection range of the sensor. [Figure 3] Figure 3 is a perspective view of the robot. [Figure 4A] Figure 4A is a schematic front view of the cassette. [Figure 4B] Figure 4B is a schematic diagram of the top view of the cassette. [Figure 5] Figure 5 is an explanatory diagram of the determination process regarding whether or not a circuit board can be brought in. [Figure 6] Figure 6 is an explanatory diagram of the substrate orientation detection process. [Figure 7] Figure 7 is a top view of the transport chamber. [Figure 8] Figure 8 is a block diagram of the transport system. [Figure 9] Figure 9 is an explanatory diagram of deflection amount information. [Figure 10]Figure 10 is a flowchart showing the processing procedure for adjusting the transport height. [Modes for carrying out the invention]

[0010] The transport system and transport method disclosed herein will be described in detail below with reference to the attached drawings. However, this invention is not limited to the embodiments shown below.

[0011] Furthermore, in the embodiments described below, expressions such as "vertical," "front," "straight," and "intermediate" may be used, but it is not necessary to strictly satisfy these conditions. In other words, each of the above expressions should allow for deviations in manufacturing accuracy, installation accuracy, processing accuracy, detection accuracy, etc.

[0012] First, an overview of the transport system 1 according to the embodiment will be described using Figure 1. Figure 1 is a schematic top view showing an overview of the transport system 1. For the sake of clarity of explanation, Figure 1 shows a three-dimensional Cartesian coordinate system in which the Z-axis is positive in the vertically upward direction, the X-axis is the direction in the width direction along the front of the cassette 200 on which the substrate 500 is placed, and the Y-axis is the direction along the depth of the cassette 200. Such a Cartesian coordinate system may also be shown in other drawings used in the following explanation.

[0013] Here, the front of the cassette 200 refers to the side with an opening into which the hand 13 can be inserted. The cassette 200 also has multiple support parts extending in the direction in which the hand 13 is inserted (Y-axis direction) (see the dashed lines shown on the cassette 200). The configuration of the cassette 200 will be described later using Figures 4A and 4B. Figure 1 also shows a front view ST1 of the substrate 500 placed on the cassette 200, viewed from the front side (negative Y-axis direction).

[0014] In FIG. 1, as an example of the placement location of the substrate 500, a cassette 200 that accommodates the substrate 500 in multiple stages is illustrated. However, the placement location of the substrate 500 may be an aligner that aligns the orientation of the substrate 500 or a processing apparatus that processes the substrate 500. Examples of the arrangement of the aligner and the processing apparatus will be described later with reference to FIG. 7. Further, in the present embodiment, as the substrate 500, a panel such as a resin material substrate like glass epoxy or a glass substrate having a rectangular outer shape is shown. However, the substrate 500 may be a wafer having a circular outer shape or a thin plate of any shape and any material.

[0015] As shown in FIG. 1, the transfer system 1 includes a robot 10 and a controller 20 that controls the operation of the robot 10. The robot 10 includes a hand 13 that transfers the substrate 500 and a lifting mechanism that raises and lowers the hand 13. Here, the hand 13 includes a sensor S that can detect the distance from the lower surface of the held substrate 500. That is, the sensor S can detect the substrate 500 placed on the hand 13 or the substrate 500 above the hand 13.

[0016] Note that FIG. 1 shows a case where sensors S are provided at each branched portion of the hand 13 whose tip side is branched into two (when the number of sensors S is two), but the number of sensors S may be one. Also, when the tip side of the hand 13 branches into three or more, sensors S may be provided at each branched portion. That is, it is also possible to provide the same number of sensors S as the number of branched portions on the hand 13.

[0017] The controller 20 stores placement information including the "placement height (Z coordinate)" at the placement position (XY coordinates) of the substrate 500, and when the hand 13 is lowered from such a placement height, it detects the "separation height (Z coordinate)" at which the substrate 500 separates from the hand 13. Then, the controller 20 calculates the amount of deflection of the substrate 500 based on the difference between the placement height and the separation height. Details of the configuration of the controller 20 will be described later with reference to FIG. 8.

[0018] Specifically, as shown in the upper part of the front view ST1 in Figure 1, the hand 13 holds the circuit board 500 and inserts itself into the slots in the cassette 200 that indicate the storage stage, in order to load the circuit board 500 into them. Here, the "mounting height" in the slots of the cassette 200 is assumed to be "z1". Note that the mounting height refers to the height of the upper surface of the support part in each slot. The hand 13 is inserted into the cassette 200 at a position higher than the mounting height, and by descending from the insertion height, it places the circuit board 500 at the mounting height of each slot. Then, as shown in the lower part of the front view ST1, as the hand 13 is lowered further, the circuit board 500 deforms so as to bend, and the circuit board 500 separates from the hand 13 at a height of "z2".

[0019] Thus, the height at which the substrate separates from the hand 13 is called the "separation height," and this "separation height" is assumed to be "z2." Here, the separation height is measured by the sensor S in the hand 13. Note that the front view ST1 shows the case where the "deflection amount" of the substrate 500 is "d." In this case, the deflection amount (d) can be expressed by the equation (d = z1 - z2).

[0020] In this way, by lowering the hand 13 from the mounting height of the substrate 500, the separation height of the substrate 500 from the hand 13 is detected, and the amount of deflection of the substrate 500 is calculated from the difference between the mounting height and the detected separation height. As a result, the controller 20 can obtain the amount of deflection of the substrate 500. In this way, for example, it becomes possible to adjust the loading height of a new substrate 500 to avoid contact with a substrate 500 that has already been loaded, or to cancel the loading of a new substrate 500.

[0021] Therefore, according to the transport system 1 shown in Figure 1, even if the substrate 500 is deflected, it is possible to prevent damage to the substrate 500 due to contact between the transported substrate 500 and the hand 13 or the substrate 500 held by the hand 13. Note that the amount of deflection tends to increase as the thickness of the substrate 500 decreases, so obtaining the amount of deflection as described above is particularly useful when the thickness of the substrate 500 is thin relative to the area of ​​the main surface of the substrate 500.

[0022] Furthermore, although Figure 1 illustrates a cassette 200 that accommodates multiple substrates 500 in stages, the procedure for acquiring the amount of deflection shown in Figure 1 can also be applied to a placement location where a single substrate 500 is placed. For example, when loading a substrate into an aligner to adjust its orientation, the amount of deflection can be acquired, and when unloading the substrate 500 from the aligner, the substrate 500 can be accessed and unloaded using a hand 13 adjusted to a height corresponding to the acquired amount of deflection. This makes it possible to avoid contact between the hand 13 and the substrate 500 to be unloaded.

[0023] Next, the sensor S shown in Figure 1 will be explained using Figure 2. Figure 2 is a schematic side view showing the detection range of the sensor S. For the sake of clarity, the deformation due to deflection of the substrate 500 shown in Figure 2 has been omitted. The heights (z1 and z2) shown in Figure 2 correspond to the mounting height (z1) and detachment height (z2) shown in the front view ST1 of Figure 1, respectively. The height (z3) refers to a position lower than the detachment height (z2).

[0024] As shown in Figure 2, the sensor S is positioned lower than the upper surface 13u of the hand 13. Here, the sensor S is a limited-reflection fiber sensor having a limited detection range DA in the upward direction. A laser displacement sensor or a capacitive sensor may also be used as the sensor S.

[0025] In the case shown in Figure 2, the sensor S is capable of detecting objects within a range from the height (z3) corresponding to the top surface 13u of the hand 13 to the distance height (z2). In other words, the sensor S outputs an "ON" signal in the range from height (z3) to distance height (z2), and an "OFF" signal in the range closer than height (z3) and further than distance height (z2). Note that the height of the top surface 13u of the hand 13 includes the surface height of pads, etc., that support the substrate 500 while preventing the substrate 500 from moving laterally.

[0026] Thus, the sensor S can detect the substrate 500 when its lower surface 500d is within the range from height (z3) to separation height (z2). In other words, since the sensor S can detect when the lower surface 500d of the substrate 500 is on the upper surface 13u of the hand 13, the sensor S can also serve as a so-called load sensor (substrate presence sensor) that detects whether or not the substrate 500 is placed on the hand 13. Therefore, by using the sensor S, the number of sensors mounted on the hand 13 can be reduced.

[0027] Here, we will explain that the detection of the separation height (z2) shown in the front view ST1 of Figure 1 is performed only when the substrate 500 and the hand 13 are separated by a predetermined distance. As shown in Figure 2, if "d1" is the distance along the Z axis of the detection range DA of the sensor S, the output signal of the sensor S becomes "OFF" only when the upper surface 13u of the hand 13 and the lower surface 500d of the substrate 500 are separated by a distance of "d1". Therefore, the separation height (z2) can be expressed by the equation (z2 = z3 + d1). In this way, the separation height (z2) shown in the front view ST1 of Figure 1 can be calculated.

[0028] Next, an example of the configuration of the robot 10 shown in Figure 1 will be explained using Figure 3. Figure 3 is a perspective view of the robot 10. Note that Figure 3 corresponds to a perspective view of the robot 10 from diagonally above.

[0029] As shown in Figure 3, the robot 10 is, for example, a horizontal articulated robot having a horizontal articulated SCARA arm and a lifting mechanism. The robot 10 comprises a main body 10a, a lifting unit 10b, a first arm 11, a second arm 12, and a hand 13. The main body 10a is fixed to, for example, the floor of a transport room and incorporates a lifting mechanism for raising and lowering the lifting unit 10b.

[0030] The lifting section 10b supports the base end of the first arm 11 so as to be rotatable around the first axis A1, and moves up and down along the lifting axis A0. Alternatively, the lifting section 10b itself may be rotated around the first axis A1. Furthermore, the first axis A1 may be positioned towards the negative Y-axis direction on the upper surface of the lifting section 10b. By positioning the first axis A1 towards the negative Y-axis direction in the figure, the first arm 11 can be lengthened.

[0031] The first arm 11 supports the base end of the second arm 12 at its tip so that it can rotate around the second axis A2. The second arm 12 supports the base end of the hand 13 at its tip so that it can rotate around the third axis A3.

[0032] Thus, the robot 10 is a horizontal articulated robot including three links: a first arm 11, a second arm 12, and a hand 13. Furthermore, as described above, the robot 10 has a lifting mechanism, which allows it to access the circuit boards 500 housed in multiple stages within the cassette 200, and to obtain the amount of deflection of each housed circuit board 500 by lowering the hand 13.

[0033] The hand 13 comprises a first extension 13a, a second extension 13b, and a base 13c. The first extension 13a and the second extension 13b branch off from the base 13c and extend opposite each other at a distance. Sensors S1 and S2 are provided on the base end side (base 13c side) of the upper surface of the first extension 13a and the second extension 13b, respectively. The substrate 500 shown in Figure 1, etc., is supported by the first extension 13a and the second extension 13b. The positional relationship between sensors S1 and S2 will be described later using Figure 4B.

[0034] Next, the cassette 200 shown in Figure 1 will be explained using Figures 4A and 4B. Figure 4A is a schematic front view of the cassette 200, and Figure 4B is a schematic top view of the cassette 200. In Figure 4B, the hand 13 at the transfer position of the circuit board 500 in the cassette 200 is shown by a dashed line.

[0035] As shown in Figure 4A, the front of the cassette 200 is open, and between the top surface 201 and the bottom surface 202 inside the cassette 200, there are N (N is an integer of 2 or more) slots, each capable of accommodating a circuit board 500. Each slot is provided with a first support portion 211, a second support portion 212, and a third support portion 213, respectively, which extend in the direction along the depth of the cassette 200 (Y-axis direction).

[0036] Here, each slot supports the substrate 500 at a mounting height (s). When distinguishing the mounting height of each stage, the height of the first stage will be indicated as mounting height (s1), the height of the second stage as mounting height (s2), and the height of the Nth stage as mounting height (sN). The pitch (p) between slots is assumed to be equal.

[0037] The first support portion 211 and the second support portion 212 are provided on the side surface 205 inside the cassette 200. The third support portion 213 is provided at an intermediate position between the first support portion 211 and the second support portion 212 in the width direction (X-axis direction) of the cassette 200. In other words, the cassette 200 supports the substrate 500 at three points when viewed from the front. Although Figure 4A shows the case where there is one third support portion 213, for example, two or more third support portions 213 may be provided so that the distance between each support portion is equal.

[0038] Here, as shown in Figure 4B, the third support portion 213 is a rod-shaped (bar-shaped) member that extends from the back surface 203 to the front surface 204 of the cassette 200, and its foremost end is closer to the back surface 203 of the cassette 200 than the foremost ends of the first support portion 211 and the second support portion 212. In other words, the extension length of the third support portion 213 in the depth direction (Y-axis direction) is shorter than the extension lengths of the first support portion 211 and the second support portion 212.

[0039] Thus, if the foremost end of the third support portion 213 is short, the front side of the substrate 500 supported by the third support portion 213 may droop. Here, the sensor S is located at the base end of each extension portion of the hand 13. Therefore, the amount of deflection, taking into account the effect of such drooping, can be easily detected by the sensor S. In this embodiment, the case in which the sensor S is provided at the base end of each extension portion of the hand 13 is described, but it may also be provided at the tip end of each extension portion.

[0040] Furthermore, as shown in Figure 4B, the hand 13 includes a first extension portion 13a that can be inserted between the first support portion 211 and the third support portion 213 of the cassette 200, and a second extension portion 13b that can be inserted between the second support portion 212 and the third support portion 213. As described above, if there are two or more third support portions 213, the hand 13 may be provided with a number of extension portions that can be inserted between each support portion.

[0041] Thus, the cassette 200 includes a first support portion 211 and a second support portion 212 that support both ends of the circuit board 500 when viewed from the front of the cassette 200. The cassette 200 also includes a third support portion 213 that supports the circuit board 500 at an intermediate position between the first support portion 211 and the second support portion 212.

[0042] Furthermore, the hand 13 includes at least a first extension portion 13a that can be inserted between the first support portion 211 and the third support portion 213 of the cassette 200, and a second extension portion 13b that can be inserted between the second support portion 212 and the third support portion 213. The sensor S is provided on the base end sides of the first extension portion 13a and the second extension portion 13b of the hand 13, respectively. In other words, by providing the sensor S on the base end side of the hand 13 as a whole, the deterioration of the detection accuracy of the sensor S due to vibration of the hand 13 can be reduced.

[0043] In this way, by combining the cassette 200, which supports the substrate at three points in a front view, with the bifurcated hand 13, the sensors S on the two extensions of the hand 13 make it easier to detect the areas of the substrate 500 that are prone to bending. Furthermore, by providing the sensors S on the base end side of each extension of the hand 13, it becomes possible to reduce the deterioration of detection accuracy due to vibration of each extension compared to when the sensors S are provided on the tip side of each extension.

[0044] Furthermore, as shown in Figure 4B, when the hand 13 is in the position where the circuit board 500 is being handed over inside the cassette 200, each sensor S (sensor S1 and sensor S2) is located between the foremost end (y2) of the third support portion 213 and the foremost end (y1) of the circuit board 500 when viewed from above. In this way, by setting the mounting position of each sensor S on the hand 13 within the range described above in the depth direction (Y-axis direction) of the cassette 200, the effect of the circuit board 500 drooping due to the short length of the third support portion 213 can be easily detected by each sensor S.

[0045] Next, the process for determining whether or not the substrate 500 can be loaded based on the detected deflection amount will be explained using Figure 5. Figure 5 is an explanatory diagram of the process for determining whether or not the substrate 500 can be loaded. In Figure 5, the process of loading the substrate 500 into the first stage (top stage) of the cassette 200, detecting the deflection amount, and determining whether or not a new substrate 500 can be loaded into the second stage of the cassette 200 is shown in three phases (phases S51, S52, and S53).

[0046] As shown in phase S51 of Figure 5, the hand 13 holding the substrate 500 moves into the cassette 200 at a height higher than the placement height (s1) in order to place the substrate 500 at the placement height (s1) in the first slot of the cassette 200. Note that Figure 5 shows the case in which the hand 13 is moved into the cassette 200 at an entry height (h1) that is higher than each placement height (s) by a margin (m).

[0047] The size of the margin (m) shall be predetermined according to the thickness of the hand 13, the thickness of the circuit board 500, the vertical width of each support part in the cassette 200, etc. Although Figure 5 shows the case where the margin (m) is the same in each stage of the cassette 200, the size may be different for each slot.

[0048] As the hand 13 shown in phase S51 is lowered, the substrate 500 is placed in the first slot of the cassette 200 at a mounting height (s1), as shown in phase S52. Further lowering of the hand 13 causes the substrate 500 to deform while being supported by the slot of the cassette 200 and the hand 13. Specifically, while the substrate 500 remains supported by the hand 13, its own weight causes the space between the first support part 211 and the third support part 213, and the space between the second support part 212 and the third support part 213 of the cassette 200 to flex and deform. Then, the hand 13, having detached itself from the substrate 500, exits the cassette 200.

[0049] In phase S52, the deflection amount of the substrate 500 at the part supported by the first extension portion 13a of the hand 13 is "d2", and the deflection amount of the part supported by the second extension portion 13b is "d3". If the two deflection amounts are different, the larger value is adopted as the deflection amount (d) of the substrate 500.

[0050] Next, as shown in phase S53, the controller 20 shown in Figure 1 determines whether the hand 13 holding the new substrate can enter the cassette 200 at the entry height (h2) in the second slot. That is, based on the amount of deflection (d) of the substrate 500 placed in the first slot, it is determined whether there is a safe gap between the lower surface of the deflected substrate 500 that has already been brought in and the upper surface of the new substrate 500 held by the hand 13.

[0051] The size of the safety gap can be set in advance. If a safety gap is determined to exist, the controller 20 determines that the hand 13 can enter the second slot. Conversely, if no safety gap is determined to exist, the controller determines that entry is not possible. For reference, phase S53 shows the hand 13 that is scheduled to enter at the entry height (h2).

[0052] On the other hand, if the controller 20 determines that entry is not possible, it will stop the entry of the hand 13 into the second slot by displaying an error message. Alternatively, a new circuit board 500 may be loaded into the third slot, which is directly below the second slot. Phase S53 shows an example of a case where entry of the hand 13 is possible at the entry height (h2).

[0053] As shown in Figure 1, the robot 10 loads the circuit boards 500 into the cassette 200 in an order from the top to the bottom. The controller 20 determines whether it is possible to load a new circuit board 500 into the directly below it based on the amount of deflection of the last circuit board 500 loaded into the cassette 200. If it is determined that loading is possible, the new circuit board 500 is loaded into the directly below it. On the other hand, if it is determined that loading is not possible, the new circuit board 500 is loaded into, for example, the next lower row below the directly below it.

[0054] By loading the circuit board 500 into the cassette 200 from top to bottom, the loading process for the circuit board 500 can be carried out quickly. In addition, the amount of deflection of the circuit board 500 loaded into the layer directly above is used to determine whether it is possible to load a circuit board into the layer directly below, thus preventing damage to the circuit board 500 due to contact.

[0055] Next, the substrate orientation detection process using sensors S1 and S2 will be explained with reference to Figure 6. Figure 6 is an explanatory diagram of the substrate orientation detection process. Note that the cassette 200 shown in Figure 5 is omitted in Figure 6. Also, the deviation angle of the substrate orientation is exaggerated for the sake of clarity. Furthermore, Figure 6 shows the case where the extension direction of the hand 13 is aligned with the Y-axis direction.

[0056] As shown in Figure 6, the case where the hand 13 is moved in the positive Y-axis direction will be described. In this case, if the extension direction of the hand 13 and the orientation of the substrate are relatively misaligned, sensors S1 and S2, which are positioned so that their Y-axis coordinates are the same, will experience a timing difference in the detection of the edge 501 on the substrate 500 that is closer to the hand 13.

[0057] As shown in Figure 6, when the hand 13 is moved in the positive Y-axis direction so as to pass below the substrate 500, sensor S2 detects the edge 501 of the substrate at coordinate (y3). On the other hand, sensor S1 detects the edge 501 at a coordinate (y4) that is larger than coordinate (y3). Here, if the distance between sensor S1 and sensor S2 is "w", the relative displacement angle (θ) is expressed by the equation (θ = arctan((y4 - y3) / w)).

[0058] As described above, the controller 20 shown in Figure 1 detects the orientation of the substrate 500 relative to the hand 13 by having sensors S (sensor S1 and sensor S2), which are provided on the base end sides of the first extension section 13a and the second extension section 13b, respectively, detect the edges 501 on the substrate 500.

[0059] If it is detected that the orientation of the hand 13 and the orientation of the substrate 500 are misaligned, the hand 13 can be moved again toward the substrate 500 at an angle corrected for the misalignment angle (θ), thereby holding the substrate 500 straight in the hand 13. In the case shown in Figure 6, the hand 13 should be rotated clockwise by "θ" and then moved toward the center of edge 501 on the substrate 500.

[0060] Next, an example of the arrangement of each device in the transport room where the transport system 1 shown in Figure 1 is installed will be explained using Figure 7. Figure 7 is a top view of the transport room. As shown in Figure 7, the transport room contains the transport system 1 including the robot 10 and controller 20, a cassette 200, an aligner 300, and a processing unit 400.

[0061] Here, the transport chamber is an area enclosed by a housing (not shown), and is designed to form a clean airflow from top to bottom. The aligner 300 has a mounting table connected to a rotating shaft that rotates around the vertical Z-axis to align the orientation of the substrate 500. The processing device 400 is a device that performs various processing operations on the substrate 500 according to the manufacturing process of the substrate 500.

[0062] At least the cassette 200 and the aligner 300 are installed within the range accessible by the robot 10. In this embodiment, the robot 10 transports the substrate 500 from the cassette 200 to the aligner 300, and from the aligner 300, the substrate 500 is transported to the processing unit 400 for the next process using, for example, another transport means. Alternatively, as shown in Figure 7, the processing unit 400 may be installed within the range accessible by the robot 10, and the robot 10 may transport the substrate 500 from the aligner 300 to the processing unit 400. Also, although Figure 7 shows one cassette 200, one aligner 300, and one processing unit 400, this does not limit the number of each device. In other words, two or more of each device may be installed.

[0063] As described above, the transport system 1 detects the amount of deflection of the substrate 500 placed on the cassette 200, and similarly, the amount of deflection of the substrate 500 placed on the aligner 300 and the substrate 500 placed on the processing device 400 can also be detected using the same procedure.

[0064] Next, the configuration of the transport system 1 shown in Figure 1 will be explained using Figure 8. Figure 8 is a block diagram of the transport system 1. The transport system 1 comprises a robot 10 and a controller 20 that controls the operation of the robot 10. Since an example of the configuration of the robot 10 has already been explained using Figure 3, the following explanation will mainly focus on the configuration of the controller 20.

[0065] As shown in Figure 8, the controller 20 comprises a control unit 21 and a storage unit 22. The control unit 21 comprises an motion control unit 21a, a detection unit 21b, and a calculation unit 21c. The storage unit 22 stores teaching information 22a, placement information 22b, and deflection amount information 22c. The controller 20 is connected to the robot 10.

[0066] Here, the controller 20 includes, for example, a computer and various circuits having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), input / output ports, etc.

[0067] The computer's CPU functions as the operation control unit 21a, detection unit 21b, and calculation unit 21c of the control unit 21, for example, by reading and executing a program stored in ROM. Alternatively, at least one or all of the operation control unit 21a, detection unit 21b, and calculation unit 21c of the control unit 21 can be configured using hardware such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array).

[0068] The storage unit 22 corresponds to, for example, RAM or HDD. RAM or HDD can store teaching information 22a, placement information 22b, and deflection amount information 22c. The controller 20 may acquire the above-mentioned programs and various information via other computers or portable recording media connected by a wired or wireless network.

[0069] The motion control unit 21a controls the operation of the robot 10 based on the teaching information 22a, the placement information 22b, and the deflection amount information 22c. Specifically, the motion control unit 21a instructs the actuators corresponding to each axis of the robot 10 to transport the substrate 500 based on the teaching information 22a stored in the memory unit 22. The motion control unit 21a also improves the accuracy of the robot 10's operation by performing feedback control using the encoder values ​​of the actuators.

[0070] Furthermore, the motion control unit 21a places the substrate 500 at various placement positions based on placement information 22b, which includes the placement height at the placement position of the substrate 500. After detecting the amount of deflection of the substrate 500, the unit transports the substrate 500 at a hand height that has been corrected using deflection amount information 22c, which includes the amount of deflection.

[0071] For example, if the substrate 500 bends downward by a deflection amount (d), the substrate 500 is transported to a height obtained by subtracting the deflection amount (d) from the placement height at each placement position. Note that the deflection amount (d) may be a negative value. This is because the substrate 500 may also bend upward.

[0072] The detection unit 21b detects the distance height at which the substrate 500 separates from the hand 13 when the hand 13 is lowered from the mounting height at various mounting positions. The mounting height and distance height are obtained based on the encoder value of the actuator that drives the lifting mechanism in the robot 10 and the output of the sensor S (see Figure 2).

[0073] The detection unit 21b then outputs the detected separation height to the calculation unit 21c. The calculation unit 21c calculates the amount of deflection of the substrate 500 based on the difference between the mounting height and the separation height. The details of this calculation process have already been explained using Figure 2, so the explanation is omitted here.

[0074] The teaching information 22a is generated during the teaching phase in which the robot 10 is taught how to move, and includes information that defines the robot 10's movements, including the movement trajectory of the hand 13, as part of a "job". Alternatively, teaching information 22a generated by another computer connected via a wired or wireless network may be stored in the storage unit 22.

[0075] The mounting information 22b includes information on the mounting height of the substrate 500 in each stage of the cassette 200 as shown in Figure 1, etc. Furthermore, the mounting information 22b can also include the mounting height of the substrate 500 in the aligner 300 and the mounting height of the substrate 500 in the processing unit 400, as shown in Figure 7. By calculating the amount of deflection of the substrate 500 mounted on the aligner 300 and processing unit 400 in this way, even if the thickness and flexibility of the substrate 500 change according to the manufacturing process, the calculated deflection amount can be used in subsequent manufacturing processes.

[0076] The deflection amount information 22c is information that associates the deflection amount of each substrate 500 with each manufacturing process. As the manufacturing process of the substrate 500 progresses and a new deflection amount is calculated, the deflection amount of the corresponding substrate 500 is updated to the latest value by the calculation unit 21c.

[0077] The motion control unit 21a then adjusts the transport height in the next transport process based on the deflection amount information up to the previous process. In this way, the deflection amount is stored as deflection amount information 22c for each substrate 500 and each manufacturing process, so the stored deflection amount information 22c can be used in subsequent manufacturing processes, making it possible to more reliably prevent damage to the substrate 500 due to contact.

[0078] Next, an example of the deflection amount information 22c shown in Figure 8 will be explained using Figure 9. Figure 9 is an explanatory diagram of the deflection amount information 22c. As shown in Figure 9, the deflection amount information 22c is information that includes the following items: "substrate identification number," "manufacturing process number," and "deflection amount." The substrate identification number is a number that uniquely identifies each substrate 500 (see Figure 1). Note that the identification number may also be an identification code that includes symbols such as letters of the alphabet.

[0079] The manufacturing process number is a number that uniquely identifies the manufacturing process of substrate 500. The manufacturing process number may also be the same manufacturing process symbol as the identification number. Furthermore, the deflection amount is the deflection amount obtained in the manufacturing process corresponding to the most recent manufacturing process number.

[0080] Here, it is assumed that there is one record for each substrate identification number in the deflection amount information 22c. In other words, as the manufacturing process number increases (as the manufacturing process progresses) for a substrate 500 with a specific substrate identification number, the deflection amount in the corresponding record will be updated.

[0081] For example, if the board identification number is "1", the manufacturing process number is "5", and the deflection amount is "2". Also, if the board identification number is "11", the manufacturing process number is "2", and the deflection amount is "4", and if the board identification number is "41", the manufacturing process number is "1", and the deflection amount is "6". In this way, for each board 500, the deflection amount information 22c is updated with the deflection amount from the latest manufacturing process. Furthermore, as the manufacturing process progresses, this deflection amount is updated.

[0082] Figure 9 shows a case where the amount of deflection decreases as the manufacturing process number increases. This is because, as the substrate 500 is stacked in each manufacturing process, the thickness of the substrate 500 increases, which tends to decrease the amount of deflection. However, depending on the material of the substrate 500 and the content of the manufacturing process, the amount of deflection may increase as the manufacturing process progresses.

[0083] Next, the transport height adjustment process in each manufacturing step will be explained using Figure 10. Figure 10 is a flowchart showing the procedure for the transport height adjustment process. Figure 10 shows the procedure for adjusting the transport height in the next manufacturing step when the amount of deflection is obtained in any manufacturing step.

[0084] As shown in Figure 10, the calculation unit 21c of the controller 20 (see Figure 8) calculates the amount of deflection of the substrate 500 (see Figure 1) (step S101). The calculation unit 21c also associates the amount of deflection calculated in step 101 with the substrate identification number and the manufacturing process number (step S102). Then, the calculation unit 21c updates the deflection amount information 22c of the record associated in step S102 (step S103).

[0085] Next, in the following manufacturing process, the motion control unit 21a changes the transport height of the substrate 500 based on the latest deflection amount information 22c (step S104). In other words, the motion control unit 21a changes the height of the hand to the transport height corresponding to the latest deflection amount. Then, the robot 10 transports the substrate 500 at the changed transport height (step S105), and the process ends. Steps S101 to S105 are repeated each time the transport process progresses.

[0086] As described above, the transport system 1 according to one embodiment comprises a robot 10 and a controller 20 that controls the operation of the robot 10. The robot 10 comprises a hand 13 for transporting the substrate 500 and a lifting mechanism for raising and lowering the hand 13. The hand 13 is equipped with a sensor S capable of detecting the distance to the lower surface of the substrate 500 it is holding.

[0087] The controller 20 also includes a storage unit 22, a detection unit 21b, and a calculation unit 21c. The storage unit 22 stores placement information 22b, including the placement height at the placement position of the substrate 500. The detection unit 21b detects the distance height at which the substrate 500 separates from the hand 13 when the hand 13 is lowered from the placement height. The calculation unit 21c calculates the amount of deflection of the substrate 500 based on the difference between the placement height and the distance height.

[0088] In this way, by lowering the hand 13 from the mounting height of the substrate 500, the distance height at which the substrate 500 separates from the hand 13 is detected, and the amount of deflection of the substrate 500 can be calculated from the difference between the mounting height and the detected distance height, thereby obtaining the amount of deflection of the substrate 500. This makes it possible, for example, to adjust the loading height of a new substrate 500 or to stop loading a new substrate 500, and even if there is deflection of the substrate 500, damage to the substrate 500 due to contact can be prevented.

[0089] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0090] 1. Conveying System 10 Robots 10a Main body 10b Lifting section 11. First Arm 12. Second Arm 13 Hand 13a 1st extension section 13b 2nd extension section 13c base 20 controllers 21 Control Unit 21a Operation Control Unit 21b Detection unit 21c Calculation part 22 Memory section 22a Instructional Information 22b Installation Information 22c Deflection Information 200 cassettes 201 Top surface 202 Bottom 203 Back 204 Front 205 Side view 211 1st support part 212 Second support part 213 Third support part 300 Alaina 400 Processing Units 500 circuit boards A0 Lifting axis A1 First Axis A2 2nd axis A3 3rd axis S sensor

Claims

1. Robots and, A controller that controls the operation of the robot and Equipped with, The aforementioned robot, A hand that transports circuit boards, A lifting mechanism for raising and lowering the aforementioned hand, Equipped with, The aforementioned hand, It is equipped with a sensor capable of detecting the distance to the lower surface of the substrate being held, The aforementioned controller, A storage unit that stores placement information including the placement height at the placement position of the substrate, A detection unit that detects the distance height at which the substrate separates from the hand when the hand is lowered from the aforementioned mounting height, A calculation unit that calculates the amount of deflection of the substrate based on the difference between the mounting height and the separation height. A transport system characterized by comprising the following features.

2. The aforementioned robot, The circuit boards are loaded and unloaded from a cassette that houses the circuit boards in multiple stages. The aforementioned information is, This includes the mounting height at each stage of the aforementioned cassette. The transport system according to claim 1, characterized by the following:

3. The aforementioned substrate is It is a rectangular panel, The aforementioned cassette is The cassette comprises a first support portion and a second support portion that support both ends of the circuit board when viewed from the front, The aforementioned third support portion supports the substrate at an intermediate position between the first support portion and the second support portion when viewed from the front, Equipped with, The aforementioned hand, It comprises at least a first extension portion that can be inserted between the first support portion and the third support portion, and a second extension portion that can be inserted between the second support portion and the third support portion, The aforementioned sensor is They are provided on the base end side of the first extension and the second extension, respectively. The transport system according to claim 2, characterized by the following:

4. The third support part is, A bar extending from the back of the cassette toward the front, wherein, in a top view, its foremost end is closer to the back of the cassette than the foremost ends of the first and second support portions. The transport system according to claim 3, characterized by the following:

5. The aforementioned sensor is When the hand is in the position for transferring the circuit board inside the cassette, it is located between the foremost end of the third support and the foremost end of the circuit board when viewed from above. The transport system according to claim 4, characterized by the following:

6. The detection unit is The orientation of the substrate to be transported relative to the hand is detected by having the sensors provided on the base end sides of the first extension and the second extension detect the edge of the substrate closest to the hand. The transport system according to claim 3, characterized by the following:

7. The aforementioned robot, The circuit boards are loaded into the cassette in an order from the top to the bottom. The aforementioned controller, A determination unit determines whether or not a new circuit board can be loaded into the lower section based on the amount of deflection of the last circuit board loaded into the cassette. The transport system according to claim 2, further comprising the features described above.

8. The aforementioned sensor is It is provided on the base end side of the hand. The transport system according to claim 1, characterized by the following:

9. The detection unit is The sensor detects whether or not the substrate is being held by the hand. The transport system according to claim 1, characterized by the following:

10. The aforementioned robot, The substrate is loaded and unloaded from the aligner that adjusts the orientation of the substrate. The aforementioned information is, This includes the mounting height in the aligner. The transport system according to claim 1, characterized by the following:

11. The calculation unit described above, For each of the aforementioned substrates, deflection amount information relating the deflection amount of the substrate for each manufacturing process is stored in the storage unit. The aforementioned robot, Based on the deflection information up to the previous process, the transport height in the next transport process is adjusted. The transport system according to claim 1, characterized by the following:

12. A transport system comprising a robot and a controller for controlling the robot's movements, wherein the robot comprises a hand for transporting substrates and a lifting mechanism for raising and lowering the hand, and the hand comprises a sensor capable of detecting the distance to the lower surface of the substrate it holds, and the transport system is a transport method performed by this transport system, The system stores mounting information including the mounting height at the mounting position of the substrate, When the hand is lowered from the aforementioned mounting height, the separation height at which the substrate is separated from the hand is detected, The amount of deflection of the substrate is calculated based on the difference between the mounting height and the separation height. A conveying method characterized by including the following.

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