Film deposition apparatus, method for manufacturing electrode foil for electrolytic capacitors, and method for manufacturing electrolytic capacitors

Abstract

The film forming device disclosed herein is a film forming device 100 that forms a film, using a gas-phase method, on a metal foil 200 having a porous section 202 on a main surface thereof, the device comprising: a film forming region 102 in which a film is formed on a metal foil 200; conveyance bodies 114-116 which are provided downstream from the film forming region 102 and which reel the metal foil 200 from the film forming region 102; and a control unit 120 which controls the stress added to the metal foil 200 by the conveyance bodies 114-116 to be 21 N / mm2 or less. It is thereby possible to provide a film forming device that is less prone to cause defects in a metal foil on which a film is formed.

Description

[Technical Field]

[0001] This disclosure relates to a film deposition apparatus, a method for manufacturing electrode foil for electrolytic capacitors, and a method for manufacturing electrolytic capacitors. [Background technology]

[0002] Conventionally, a method of manufacturing electrode foil for electrolytic capacitors is known in which metal foil is anodized in a chemical conversion solution. For example, Patent Document 1 proposes a method for manufacturing electrode foil for electrolytic capacitors in which aluminum etched foil is anodized, characterized in that when performing a second anodization on the electrode foil which has been anodized and dried, the electrode foil is immersed in an acidic solution before the second anodization is performed.

[0003] On the other hand, a film deposition apparatus that forms a film on a substrate using atomic layer deposition (ALD) is known (for example, Patent Document 2). The film deposition apparatus of Patent Document 2 comprises a first roller for feeding out the substrate before film formation, a second roller for winding up the substrate after film formation, and a support structure for supporting the substrate as it is transported from the first roller to the second roller. The film deposition apparatus of Patent Document 1 further comprises a web interposed between the substrate and the support structure, thereby preventing direct contact between the substrate and the support structure. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2007-184301 [Patent Document 2] U.S. Patent No. 10214813 [Overview of the project] [Problems that the invention aims to solve]

[0005] In film deposition apparatuses that form a film on a metal foil having a porous main surface using a vapor phase method, defects such as cracks and voids are prone to occur in the metal foil. In particular, defects such as cracks and voids are likely to occur in the metal foil from the latter half of film formation until the metal foil is wound up. In conventional methods of anodic oxidation of metal foil in a chemical conversion solution, it is possible to repair defects such as voids and cracks, as shown in Patent Document 1. On the other hand, when forming a film on metal foil using a vapor phase method, it is difficult to repair such defects. In this context, one of the objectives of this disclosure is to provide a film deposition apparatus that is less prone to defects occurring in the metal foil to be coated. [Means for solving the problem]

[0006] One aspect of this disclosure relates to a film deposition apparatus for forming a film on a metal foil having a porous portion on its main surface by a vapor phase method. The film deposition apparatus includes a film deposition region on which the film is formed on the metal foil, a transporter provided downstream of the film deposition region and for drawing the metal foil out of the film deposition region, and a stress applied to the metal foil from the transporter by 21 N / mm². 2 The system comprises the following control unit and: [Effects of the Invention]

[0007] According to this disclosure, a film deposition apparatus can be obtained that is less likely to cause defects in the metal foil to be deposited.

[0008] Novel features of the present invention are described in the appended claims, but the present invention, both in terms of structure and content, will be better understood by the following detailed description in conjunction with the drawings, together with other objects and features of the present application. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic front view showing the film deposition apparatus of Embodiment 1. [Figure 2] This is a schematic front view showing the fourth roller and the metal foil. [Figure 3] This is a schematic front view showing the film deposition apparatus of Embodiment 2. [Modes for carrying out the invention]

[0010] An example of an embodiment of the film deposition apparatus relating to this disclosure will be described below. However, this disclosure is not limited to the examples described below. In the following description, specific numerical values ​​and materials may be given as examples, but other numerical values ​​and materials may be applied as long as the effects of this disclosure are obtained.

[0011] (Film forming equipment) The film deposition apparatus according to this disclosure comprises a film deposition area, a transport body, and a control unit. These will be described below.

[0012] (film formation area) In the film-forming region, a film is formed on a metal foil having a porous portion on its main surface by a vapor phase method. The porous portion may be provided on only one main surface or on both main surfaces. The film is formed, for example, while the metal foil having a porous portion on its main surface is continuously conveyed through the film-forming region in a roll-to-roll manner. The film-forming region may include a first supply zone to which a first gas is supplied, a first exhaust zone to which the first gas is purged, a second supply zone to which a second gas is supplied, and a second exhaust zone to which the second gas is purged. However, the configuration of the film-forming region is not limited to this.

[0013] The metal foil may contain a first metal. The type of the first metal is not particularly limited. The first metal may be a valve metal such as aluminum, tantalum, or niobium, or an alloy containing a valve metal, as it facilitates film formation. The thickness of the metal foil is not particularly limited, but may be, for example, 10 μm to 300 μm, and particularly 15 μm to 250 μm. The purity of the metal foil is not particularly limited, but may be, for example, 99% to 99.99%.

[0014] The first gas may contain a second metal. The first gas may contain a precursor containing the second metal in a gaseous state. The type of the second metal is not particularly limited. Examples of the second metal include aluminum, tantalum, niobium, silicon, titanium, zirconium, hafnium, and the like. These may be used alone or in combination of two or more. The first gas preferably contains an inert gas such as nitrogen or argon as a carrier gas.

[0015] The second gas may contain an inert gas and an oxidizing agent. The inert gas may be, for example, nitrogen or argon. The oxidizing agent may be, for example, water, oxygen, ozone, hydrogen peroxide, or carbon dioxide. A plasma gas may be used as the second gas. As the plasma, oxygen, nitrogen, ozone, carbon dioxide, or a combination of two or more of these gases may be used.

[0016] (Carrier) The carrier is provided downstream of the film forming region and draws out the metal foil from the film forming region. The carrier may be, for example, a conveying roller provided with a motor. Such a conveying roller may be a winding roller for winding up the metal foil after film formation, or may be a roller other than the winding roller located upstream of the winding roller. However, the configuration of the carrier is not limited to these.

[0017] (Control unit) The control unit controls the stress applied to the metal foil from the carrier to be 21 N / mm 2 or less. The control unit may control a plurality of carriers, or may control only the carrier applying the maximum stress. The stress applied to the metal foil may be maximum at the contact portion with the winding roller or in the vicinity thereof depending on the control mode of the control unit, or may be maximum at other locations. The maximum stress applied to the metal foil is 21 N / mm 2By controlling as described below, it becomes difficult for defects to occur in the metal foil to be film-formed. The control unit may control the stress applied from the carrier to the metal foil, for example, by controlling the power of the carrier. Alternatively, the control unit may control the stress applied from the carrier to the metal foil by controlling the position of the carrier. Note that the mode of control by the control unit is not limited to these.

[0018] Here, during film formation, since a film-forming material such as a first gas or a second gas is sprayed onto the metal foil to form a film, if the stress (or tension) applied to the metal foil is too low, the metal foil may sway or bend during film formation, and the position of the metal foil may become unstable. When the first gas is sprayed onto the metal foil together with the carrier gas, the position control of the metal foil becomes even more important. Since the control of the positional relationship between the film-forming material and the metal foil may affect the film quality of the film, it is preferable to increase the stress of the carrier in the vicinity of the film formation region or immediately after film formation to 21 N / mm 2 within the following range to suppress the swaying of the metal foil caused by film formation.

[0019] In this specification, "stress" refers to the value obtained by dividing the tension (unit: N) applied from the carrier to the metal foil by the cross-sectional area of the metal foil (unit: mm 2 ). That is, when referring to "stress" in this specification, it means the overall average stress value on the cross section, not the local maximum stress value on an arbitrary cross section of the metal foil. And the "maximum stress" mentioned in the previous paragraph refers to the maximum average stress value when the average stress value changes in the length direction of the metal foil.

[0020] As described above, according to the present disclosure, a film-forming apparatus in which defects are unlikely to occur in the metal foil or film to be film-formed can be obtained. In particular, according to the present disclosure, it is possible to effectively prevent defects from occurring in the metal foil from the latter half of film formation until winding of the metal foil.

[0021] Furthermore, increasing the surface area of ​​the porous portion or making the porous portion thicker in order to improve the capacitance of the electrode foil promotes the occurrence of cracks and voids during film formation, making it difficult to mechanically transport the electrode foil during film formation. In contrast, according to this disclosure, in addition to reducing the likelihood of defects occurring in the metal foil to be film-formed, it is possible to provide high-performance and stable quality electrode foil by stably transporting the metal foil.

[0022] Furthermore, in electrode foils after the coating has been formed, cracks and voids are less likely to occur in the coating, making it possible to provide high-performance electrode foils with stable quality.

[0023] The thickness of the porous portion may be 5 μm or more, or 20 μm or more. The former is suitable when the metal foil is used as a cathode foil, while the latter is suitable when the metal foil is used as an anode foil. Even when the metal foil has such a relatively thick porous portion, the film deposition apparatus of this disclosure makes it less likely for defects to occur in the metal foil.

[0024] The metal foil may have a core portion continuous with the porous portion, and the thickness of the core portion may be 10 μm or more. Even when the metal foil has such a relatively thick core portion, the film deposition apparatus of this disclosure makes it possible to reduce the likelihood of defects occurring in the metal foil.

[0025] The film may contain a dielectric material. The dielectric material may include, for example, Al2O3, Ta2O5, Nb2O5, SiO2, ZrO2, or HfO2, either individually or in combination of two or more. However, the type of dielectric material is not limited to these.

[0026] The film thickness may be 2 nm or more. Furthermore, the film thickness may be 7 nm or more. The latter is particularly suitable when the electrode foil is used as an anode foil.

[0027] The conveying body is preferably a cylindrical or cylindrical roller. In this disclosure, for example, a drum-shaped roller in which the diameter of a part of a cylindrical or cylindrical roller is changed, a cylindrical or cylindrical roller with longitudinal or transverse grooves, and a helical roller in which grooves are made diagonally are also interpreted as a cylindrical or cylindrical roller. Furthermore, an air turn roller in which the cylindrical or cylindrical roller and the metal foil do not come into contact is also interpreted as a cylindrical or cylindrical roller. The diameter of the roller is preferably 30 mm or more. The diameter of the roller may be 50 mm or more depending on the thickness of the film to be deposited. For example, if the thickness of the film to be deposited is 7 nm or more, the diameter of the roller is preferably 50 mm or more. The diameter of the roller may be 70 mm or more depending on the installation location. For example, a roller installed downstream of the film-depositing area, such as a winding roller, is preferably 70 mm or more in diameter.

[0028] The vapor phase method may be atomic layer deposition. Furthermore, the vapor phase method may be any other vapor phase method, such as physical vapor deposition or chemical vapor deposition.

[0029] (Manufacturing method for electrode foil for electrolytic capacitors) The method for manufacturing electrode foil for electrolytic capacitors according to this disclosure comprises the steps of preparing a metal foil having a porous portion on its main surface, and forming a film on the metal foil using the above-described film-forming apparatus. This makes it possible to obtain electrode foil for electrolytic capacitors with fewer defects in the film.

[0030] (Manufacturing method for electrolytic capacitors) The method for manufacturing electrode foil for electrolytic capacitors according to this disclosure comprises the steps of: preparing a metal foil having a porous portion on its main surface; forming a film on the metal foil using the above-described film-forming apparatus to obtain electrode foil; and forming a solid electrolyte layer covering at least a portion of the film. This makes it possible to obtain an electrolytic capacitor with electrode foil having fewer defects in the film.

[0031] Hereinafter, an example of a film deposition apparatus according to this disclosure will be specifically described with reference to the drawings. The components of the example film deposition apparatus described below can be the components described above. The components of the example film deposition apparatus described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above embodiments. Among the components of the example film deposition apparatus described below, components that are not essential to the film deposition apparatus according to this disclosure may be omitted. Note that the figures shown below are schematic and do not accurately reflect the actual shape and number of components.

[0032] Embodiment 1 The film deposition apparatus 100 of Embodiment 1 and a method for manufacturing an electrolytic capacitor using it will be described below.

[0033] (Film forming equipment) As shown in Figure 1, the film deposition apparatus 100 is a roll-to-roll type film deposition apparatus. The film deposition apparatus 100 comprises a chamber 101, first to sixth rollers 111 to 116, and a control unit 120.

[0034] A film deposition region 102 is formed inside the chamber 101. The film deposition region 102 includes a first supply zone SZ1, a first exhaust zone EZ1, a second supply zone SZ2, and a second exhaust zone EZ2. The zones are arranged in this order so as to separate the chamber 101 in a direction intersecting the transport direction. The number and arrangement of the supply and exhaust zones can be designed arbitrarily.

[0035] The first supply zone SZ1 is supplied with the first gas G1 via the first supply port 103. The first exhaust zone EZ1 is supplied with an inert gas G3 (e.g., nitrogen gas) via the third supply port 105, and the first gas G1 is exhausted via the first exhaust port 106. The second supply zone SZ2 is supplied with the second gas G2 via the second supply port 104. The second exhaust zone EZ2 is supplied with an inert gas G3 via the third supply port 105, and the second gas G2 is exhausted via the second exhaust port 107.

[0036] The first roller 111 is a supply roller that supplies the metal foil 200 to be deposited. The first roller 111 is located outside the chamber 101. The metal foil 200 supplied from the first roller 111 before deposition is transported to the deposition area 102 via the second roller 112 and the third roller 113, which are located inside the chamber 101.

[0037] In the film formation region 102, a film is formed on a metal foil 200 (see Figure 2) having a porous portion 202 on its main surface 201 by atomic layer deposition. Here, the metal foil 200 may have a core portion 203 continuous with the porous portion 202. The porous portion 202 is formed on the main surface 201 of the metal foil 200, for example, by etching. The core portion 203 is, for example, an unetched region. The thickness T1 of the porous portion 202 is preferably 5 μm or more, and more preferably 20 μm or more. The thickness T2 of the core portion 203 is preferably 10 μm or more, and more preferably 15 μm or more when the metal foil 200 is used in a wound capacitor.

[0038] Specifically, in the first supply zone SZ1, the first gas G1 comes into contact with both main surfaces 201 of the metal foil 200, causing molecules containing the second metal to adhere to both main surfaces 201. Subsequently, in the first exhaust zone EZ1, the first gas G1 is exhausted.

[0039] Next, in the second supply zone SZ2, the second gas G2 comes into contact with both main surfaces 201 of the metal foil 200, generating oxides of the second metal adhering to both main surfaces 201. As a result, a film (dielectric layer) containing oxides of the second metal is formed on both main surfaces 201 of the metal foil 200. The thickness of the film is preferably 2 nm or more. Subsequently, the second gas G2 is exhausted in the second exhaust zone EZ2.

[0040] After film formation, the metal foil 200 is pulled out of the film formation region 102 by the fourth to sixth rollers 114 to 116 located downstream of the film formation region 102. The metal foil 200 after film formation is wound onto the sixth roller 116 located outside the chamber 101, via the fourth roller 114 located inside the chamber 101 and the fifth roller 115 located outside the chamber 101. The sixth roller 116 is a winding roller that winds up the metal foil 200 after film formation. The fourth to sixth rollers 114 to 116 are each examples of conveying bodies.

[0041] The shapes of the first to sixth rollers 111 to 116 are not particularly limited, but may be drum-shaped, helical, etc. The material of the first to sixth rollers 111 to 116 may be resin or rubber. The types of the first to sixth rollers 111 to 116 may be the same or different.

[0042] The control unit 120 controls the stress applied to the metal foil 200 from the 4th to 6th rollers 114 to 116 to 21 N / mm². 2 The following control is performed. The control unit 120 in this embodiment controls the stress by controlling the drive torque of the motor (not shown) provided by the sixth roller 116. The control unit 120 includes a computing device and a storage device that stores a program executable by the computing device.

[0043] The control unit 120 controls the stress applied to the metal foil 200 from the 4th to 6th rollers 114 to 116 to 12 N / mm². 2 It is preferable to control the stress to 7 N / mm². 2 It is even more preferable to control it as follows:

[0044] The diameters of the first to sixth rollers 111 to 116 are preferably 30 mm or more. For example, if the thickness of the porous portion 202 is 20 μm or more, the diameters of each roller 111 to 116 are preferably 50 mm or more. Also, for example, if the thickness of the coating is 7 nm or more, the diameters of each roller 111 to 116 are preferably 50 mm or more. The diameters of each roller 111 to 116 are preferably larger towards the winding side (downstream side). For example, the diameter of the sixth roller 116, which is a winding roller, is preferably 70 mm or more. This is because if the thickness of the porous portion 202 is 20 μm or more, the amount of coating formed on the porous portion 202 increases, and if the roller diameter is too small, defects such as cracks and voids are more likely to occur.

[0045] (Manufacturing method for electrolytic capacitors) The method for manufacturing an electrolytic capacitor according to this embodiment (the first method for manufacturing an electrolytic capacitor) comprises a preparation step, a film formation step, an electrolyte layer formation step, a capacitor element formation step, and a sealing step.

[0046] In the preparation step, a metal foil 200 having a porous portion 202 on its main surface 201 is prepared.

[0047] In the film formation process, a film (dielectric layer) is formed on the metal foil 200 using the film formation apparatus 100 of this embodiment. This yields electrode foil (anodic foil) for electrolytic capacitors.

[0048] In the electrolyte layer formation step, a solid electrolyte layer is formed that covers at least a portion of the film on the anode foil. Here, the solid electrolyte layer contains a conductive polymer and may optionally contain dopants and additives.

[0049] In the capacitor element formation process, a cathode layer (such as a carbon layer or silver paste layer) is formed to cover at least a portion of the solid electrolyte layer to obtain a capacitor element.

[0050] In the sealing process, the capacitor element is sealed with a sealing material, such as epoxy resin, so that a portion of each of the anode and cathode terminals electrically connected to the capacitor element is exposed.

[0051] As described above, electrolytic capacitors (solid electrolytic capacitors) can be manufactured through several known processes.

[0052] Since the dielectric layer of the anode foil in this disclosure has few defects such as cracks, the increase in leakage current of the electrolytic capacitor can be suppressed even when a solid electrolyte layer is formed on the dielectric layer. Furthermore, even if a load is placed on the dielectric layer due to the physical load generated when forming the sealing member, the increase in leakage current can be suppressed.

[0053] Another method for manufacturing an electrolytic capacitor (a second method for manufacturing an electrolytic capacitor) comprises a preparation step, a film formation step, a capacitor element formation step, an electrolyte formation step, and a sealing step.

[0054] The preparation and film formation steps are the same as those for the manufacturing method of the first electrolytic capacitor described above.

[0055] In the capacitor element formation process, electrode foils (anode foil), separators, and cathode foils are laminated together, and then the capacitor element is formed by winding these together.

[0056] In the electrolyte layer formation process, the capacitor element is impregnated with an electrolyte. A liquid electrolyte or a solid electrolyte can be used as the electrolyte.

[0057] In the sealing process, the capacitor element is housed in a case made of metal or other material, and the anode and cathode terminals are exposed before being sealed with a sealing material such as rubber.

[0058] Through the above steps, a second electrolytic capacitor can be manufactured.

[0059] Even in such cases, since the dielectric layer of the anode foil of this disclosure has few defects such as cracks, even when an electrolyte is impregnated into the capacitor element and the electrolyte (especially a solid electrolyte) comes into contact with the dielectric layer, the increase in leakage current of the electrolytic capacitor can be suppressed. Furthermore, since the dielectric layer of the anode foil of this embodiment has few defects, it is less likely to cause deeper cracks in the dielectric layer when forming it by winding the capacitor element, and the increase in leakage current can be suppressed.

[0060] Furthermore, another method for manufacturing an electrolytic capacitor (a third method for manufacturing an electrolytic capacitor) comprises a preparation step, a film formation step, a capacitor element formation step, an electrolyte formation step, and a sealing step.

[0061] Except for the film formation step and the capacitor element formation step, the manufacturing method is the same as that for the second electrolytic capacitor described above.

[0062] In the film formation process, a film (dielectric layer or conductive layer) is formed on the metal foil 200 using the film formation apparatus 100 of this embodiment. This yields electrode foil (cathode foil) for electrolytic capacitors.

[0063] In the capacitor element formation process, an anode foil, a separator, and an electrode foil (cathode foil) are laminated together, and then the resulting layers are wound to form a capacitor element.

[0064] Through the above steps, a third electrolytic capacitor can be manufactured.

[0065] Even in such cases, the cathode foil of this disclosure has few defects such as cracks in the dielectric layer or conductive layer, so it can suppress the delamination of the dielectric layer or conductive layer from the metal foil and the increase in equivalent series resistance. This effect can be further enhanced when a solid electrolyte such as a conductive polymer is formed on the dielectric layer or electrode layer.

[0066] When forming a film on the cathode, it is preferable to form a thin and uniform film. When using the technology of the present disclosure for the cathode, it becomes possible to uniformly form a thinner film than in the case of forming a film by a liquid-phase anodic oxidation method, and since there are fewer defects, it becomes possible to manufacture a capacitor with a higher capacitance and less leakage current.

[0067] In addition to the above electrolytic capacitor, the electrode foil of the present disclosure can be used for electrode foils of various electrolytic capacitors, such as an electrolytic capacitor having a structure in which an anode foil and a cathode foil are laminated.

[0068] 《Embodiment 2》 The film forming apparatus 100 of Embodiment 2 will be described. The control target of the control unit 120 in this embodiment is different from that in Embodiment 1 above. Hereinafter, the differences from Embodiment 1 above will be mainly described.

[0069] As shown in FIG. 3, the control unit 120 controls the stress applied to the metal foil 200 from each of the third roller 113, the fourth roller 114, and the sixth roller 116 to be 21 N / mm 2 as described below. The control unit 120 in this embodiment controls the stress by controlling the drive torque of a motor (not shown) provided in each of the third roller 113, the fourth roller 114, and the sixth roller 116.

[0070] Here, it is preferable that the control unit 120 controls the rollers 113, 114, 116 so that the stress applied to the metal foil 200 from these rollers increases in the order of the fourth roller 114, the third roller 113, and the sixth roller 116. In this case, the stress applied to the metal foil 200 from the fourth roller 114 becomes the maximum stress, and this is controlled to be 21 N / mm 2 as described below. Thereby, while suppressing the metal foil 200 from loosening in the film forming region 102, the stress applied to the metal foil 200 can be suppressed to the minimum necessary.

[0071] In this embodiment, within the film-forming region 102, the metal foil 200 may vibrate due to the first gas or second gas being blown onto it via the first supply port 103, the second supply port 104, the third supply port 105, the first exhaust port 106, and the second exhaust port 107, or due to the flow of these gases. Therefore, to suppress such vibration, an appropriate roller (not shown) may be added between the third roller 113 and the fourth roller 114.

[0072] In particular, when the metal foil 200 having a porous portion 202 passes through the film deposition region 102 and film deposition is completed, a much larger and denser film is formed on the porous portion 202 compared to a flat substrate. When this metal foil 200 is used in an electrolytic capacitor, it is preferable to minimize the stress on the completed film to prevent the generation of cracks and voids as much as possible. For example, the stress applied to the metal foil 200 from the fourth roller 114 is set to 21 N / mm² to prevent the metal foil 200 from shaking during film deposition. 2 The following controls are applied, and the stress applied from the sixth roller 116 to the metal foil 200 after film formation is complete is set to 12 N / mm² to wind the generated film with as little stress as possible. 2 The following control measures can be considered.

[0073] Although the present invention has been described in relation to preferred embodiments at present, such disclosure should not be interpreted restrictively. Various modifications and alterations will undoubtedly become apparent to those skilled in the art in the field to which the invention pertains by reading the above disclosure. Accordingly, the appended claims should be interpreted as encompassing all modifications and alterations without departing from the true spirit and scope of the invention. [Industrial applicability]

[0074] This disclosure can be used in a film deposition apparatus, a method for manufacturing electrode foil for electrolytic capacitors, and a method for manufacturing electrolytic capacitors. [Explanation of symbols]

[0075] 100: Film deposition equipment 101: Chamber 102: Film formation area SZ1: Supply Zone 1 SZ2: Second Supply Zone EZ1: First exhaust zone EZ2: 2 exhaust zones 103: 1st supply port 104:Second supply port 105: 3rd supply port 106: First exhaust port 107: Second exhaust port 111: First Laura 112: Second Laura 113: Third Laura 114: Fourth roller (conveyor) 115: Fifth roller (conveyor) 116: 6th roller (conveyor) 120: Control Unit 200: Metal foil 201: Main surface 202: Porous part 203: Core G1: First gas G2: Second gas G3: Inert gas T1: Thickness of the porous portion T2: Core thickness

Claims

1. A film deposition apparatus for forming a film on a metal foil having a porous portion on its main surface by a vapor phase method, The metal foil comprises a film-forming region on which the film is formed, A transporter is provided downstream of the film-forming region to pull the metal foil out of the film-forming region, The stress applied to the metal foil from the transporter is 21 N / mm². ２ The control unit that controls the following, Equipped with, The conveying body includes a plurality of rollers, The plurality of rollers include a first roller that is positioned closest to the film-forming region among the plurality of rollers, and a second roller that is a winding roller. The thickness of the porous portion is 20 μm or more. The thickness of the aforementioned film is 7 nm or more. The diameter of the aforementioned multiple rollers is 50 mm or more. The diameter of the second roller is 70 mm or more. A film deposition apparatus wherein the stress applied to the metal foil from the first roller is greater than the stress applied to the metal foil from the second roller, and is also greater than the stress applied to the metal foil from a third roller located upstream of the film deposition region.

2. The metal foil has a core portion that is continuous with the porous portion, The film-forming apparatus according to claim 1, wherein the thickness of the core portion is 10 μm or more.

3. The film deposition apparatus according to claim 1 or 2, wherein the film comprises a dielectric.

4. The film-forming apparatus according to any one of claims 1 to 3, wherein the conveying body is a cylindrical or cylindrical roller.

5. The film deposition apparatus according to any one of claims 1 to 4, wherein the vapor phase method is an atomic layer deposition method.

6. A step of preparing a metal foil having a porous portion on its main surface, A step of forming a film on the metal foil using the film-forming apparatus described in any one of claims 1 to 5, A method for manufacturing electrode foil for electrolytic capacitors, comprising the above.

7. A step of preparing a metal foil having a porous portion on its main surface, A step of forming a film on the metal foil using the film-forming apparatus described in any one of claims 1 to 5 to obtain an electrode foil, A step of forming a solid electrolyte layer that covers at least a portion of the aforementioned film, A method for manufacturing electrolytic capacitors.

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