Multilayer electronic components

Abstract

To provide a laminated electronic component capable of improving the moisture resistance reliability while suppressing the occurrence of cracks in the laminated electronic component.SOLUTION: A laminated electronic component in an embodiment includes: a dielectric layer; a capacity forming part in which internal electrodes are arranged alternately in a first direction; a body including a cover placed on the top and bottom in the first direction of the capacity forming part; and a pair of external electrodes placed on the body. The cover includes multiple dielectric crystal grains and multiple pores. Defining the number of dielectric crystal grains and pores included in the cover as Gn and Pn respectively, Gn / Pn is more than 10 and less than 30.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multi-layered ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount. Recently, as electronic device components have become smaller, the demand for smaller and higher-capacitance multilayer ceramic capacitors has been increasing.

[0004] Generally, the manufacturing method for multilayer ceramic capacitors involves creating ceramic green sheets and printing a conductive paste onto them to form internal electrode films. Dozens to hundreds of these ceramic green sheets with internal electrode films are stacked to create a green ceramic laminate. This laminate is then compressed at high temperature and pressure to create a hard green ceramic laminate, which is then cut to produce green chips. Finally, the green chips are calcined, fired, and polished to form external electrodes, completing the multilayer ceramic capacitor.

[0005] Generally, internal electrodes made of metal are more prone to contraction and expansion than ceramic materials, and the stress caused by this difference in thermal expansion coefficients can act on the ceramic laminate, potentially causing cracks.

[0006] Multilayer ceramic capacitors (MLCs) are used mounted on a circuit board, with the external electrodes of the MLCs electrically connected to conductive lands formed on the circuit board via soldering. When MLCs are soldered to a circuit board, or when a circuit board on which an MLC is mounted is cut, thermal shock and shear stress are applied to the MLCs. Such thermal shock and shear stress can cause cracks to form in MLC chip capacitors.

[0007] Recently, with the miniaturization and increased capacitance of multilayer ceramic capacitors, attempts have been made to thin and multilayer the ceramic layers. However, this thinning and multilayering has led to an increase in the frequency of crack occurrence, and the need for improvements in these areas is growing. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] One of the several objectives of the present invention is to suppress crack formation in multilayer electronic components.

[0009] One of the several objectives of the present invention is to improve the moisture resistance reliability of multilayer electronic components.

[0010] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] A stacked electronic component according to one embodiment of the present invention includes a capacitance forming section in which dielectric layers and internal electrodes are alternately arranged in a first direction, a main body including cover sections arranged at the upper and lower parts of the capacitance forming section in the first direction, and external electrodes arranged on the main body, wherein the cover section includes a plurality of dielectric crystal grains and a plurality of pores, and when the number of dielectric crystal grains and pores included in the cover section is Gn and Pn, respectively, Gn / Pn is greater than 10 and less than 30. [Effects of the Invention]

[0012] One of the several effects of the present invention is that cracks in multilayer electronic components are suppressed by controlling the ratio of dielectric crystal grains and pores in the cover portion.

[0013] One of the several effects of this invention is improved moisture resistance reliability.

[0014] However, the diverse yet significant advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] This is a cross-sectional view along the line I-I' in Figure 1. [Figure 3] This is a cross-sectional view along the line II-II' in Figure 1. [Figure 4] This is an enlarged view of region K in Figure 2. [Figure 5] This figure shows a modified example of the present invention, corresponding to a cross-sectional view along the line II-II' in Figure 1. [Figure 6] This is a diagram illustrating the process of preparing the material for a ceramic green sheet used for pore formation. [Figure 7]This is a diagram for explaining that pores are formed by subjecting a ceramic green sheet for pore formation to a pre-firing and sintering process. [Figure 8a] This is a photograph of a cross-section of the cover part of the comparative example taken with a scanning electron microscope (SEM). [Figure 8b] This is a diagram for explaining a method of measuring dielectric crystal grains and pores in the comparative example. [Figure 8c] This is a diagram for explaining a method of measuring dielectric crystal grains and pores in the comparative example. [Figure 9a] This is a photograph of a cross-section of the cover part of the inventive example taken with a scanning electron microscope (SEM). [Figure 9b] This is a diagram for explaining a method of measuring dielectric crystal grains and pores in the inventive example. [Figure 9c] This is a diagram for explaining a method of measuring dielectric crystal grains and pores in the inventive example.

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the technical field. Therefore, the shape and size of elements in the drawings may be enlarged, reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0017] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each illustrated component are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components with the same function within the scope of the same idea can be described using the same reference numerals. Moreover, throughout the specification, "including" a component means that other components may be included, rather than excluding them, unless otherwise stated to the contrary.

[0018] In drawings, the first direction can be defined as the lamination direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0019] Multilayer electronic components Figure 1 is a schematic perspective view showing a stacked electronic component according to one embodiment of the present invention; Figure 2 is a cross-sectional view along the line I-I' in Figure 1; Figure 3 is a cross-sectional view along the line II-II' in Figure 1; Figure 4 is an enlarged view of region K in Figure 2; and Figure 5 is a diagram showing a modified example of the present invention corresponding to the cross-sectional view along the line II-II' in Figure 1.

[0020] The following describes in detail a stacked electronic component according to one embodiment of the present invention with reference to Figures 1 to 5.

[0021] A stacked electronic component 100 according to one embodiment of the present invention includes a main body 110 which includes a dielectric layer 111 and a capacitance forming section A in which internal electrodes 121 and 122 are alternately arranged in a first direction, cover sections 112 and 113 arranged at the upper and lower parts of the capacitance forming section in the first direction, and external electrodes 131 and 132 arranged on the main body, wherein the cover section includes a plurality of dielectric crystal grains G and a plurality of pores P, and when the number of dielectric crystal grains and pores included in the cover section is Gn and Pn, respectively, Gn / Pn is greater than 10 and less than 30.

[0022] The main body 110 can be formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122.

[0023] There is no particular limitation on the specific shape of the main body 110. However, as shown in the drawings, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Also, the main body 110 can have a substantially hexahedron shape although it is not a hexahedron with perfect straight lines due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process.

[0024] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first and second surfaces 1 and 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first and second surfaces 1 and 2, are connected to the third and fourth surfaces 3 and 4, and face each other in a third direction.

[0025] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0026] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. The ceramic powder can be, for example, BaTiO3, (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, etc.

[0027] The material used to form the dielectric layer 111 can be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc., can be added according to the purpose of the present invention.

[0028] The main body 110 may include a capacitance forming section A which includes a first internal electrode 121 and a second internal electrode 122 disposed inside the main body 110 and arranged facing each other with a dielectric layer 111 in between, and cover sections 112 and 113 formed on the upper and lower parts of the capacitance forming section A in a first direction.

[0029] Furthermore, the capacitance forming portion A is a part that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0030] On the other hand, the dielectric layer 111 of the capacitance-forming portion A may contain pores, and it is preferable for the porosity to be 1% or less in terms of ensuring capacitance. Here, the porosity can be measured by observing the dielectric layer located in the center of the first and second directions in cross-sections cut from the center of the third direction of the sample chip in the first and second directions using an SEM.

[0031] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion A in the first direction, and a lower cover portion 113 positioned below the volume-forming portion A in the first direction.

[0032] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion A, respectively, and can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0033] Furthermore, according to one embodiment of the present invention, the cover portions 112 and 113 may include a plurality of dielectric crystal grains G and a plurality of pores P. The inclusion of a plurality of pores P can suppress crack generation and propagation due to external forces.

[0034] Furthermore, when the number of dielectric crystal grains G and pores P contained in the cover portions 112 and 113 are denoted as Gn and Pn, respectively, the ratio Gn / Pn can be greater than 10 and less than 30.

[0035] If the Gn / Pn ratio is 10 or less, the proportion of porosalpodium (P) is too high, which can act as a pathway for moisture penetration and reduce the reliability of moisture resistance. Therefore, it is preferable for the Gn / Pn ratio to be greater than 10, and more preferably 12 or greater.

[0036] On the other hand, if the Gn / Pn ratio is 30 or higher, the proportion of porosaltic P is too small, which may result in insufficient suppression of crack formation and propagation by porosaltic P. Therefore, it is preferable that the Gn / Pn ratio be less than 30, and more preferably 29 or lower.

[0037] In one embodiment, when the average size of dielectric crystal grains G is Gs and the average size of pores P is Ps, Ps / Gs can be less than 3.

[0038] When the Ps / Gs ratio is 3 or higher, the size of the pores P becomes too large, which can facilitate moisture penetration and reduce the reliability of moisture resistance. Therefore, it is preferable that the Ps / Gs ratio be less than 3, and more preferably 2.9 or lower.

[0039] There is no particular need to limit the lower limit of Ps / Gs. However, to further improve the effect of suppressing crack generation and propagation by porosaltic P, it may be 2.1 or higher.

[0040] By satisfying the numerical ranges of Gn / Pn and Ps / Gs shown in this invention, crack initiation and propagation can be suppressed, and moisture resistance reliability can be improved. Therefore, the thickness of the upper and lower cover portions 113 and 114 is not particularly limited. However, if the cover portions 113 and 114 are too thin, the crack propagation suppression effect may be insufficient, and if they are too thick, the capacity per unit volume may decrease. Therefore, the thickness of the upper and lower cover portions may be 15 μm or more and 30 μm or less.

[0041] Furthermore, there is no need to specifically limit the average size Gs of dielectric crystal grains and the average size Ps of pores.

[0042] However, as an example of an unrestricted range, the average size Gs of the dielectric crystal grains may be between 150 nm and 390 nm. Also, the average size Ps of the pores may be between 110 nm and 310 nm.

[0043] The cover portions 112 and 113 do not necessarily have to include internal electrodes and may contain ceramic material. For example, they may contain barium titanate (BaTiO3) based ceramic material.

[0044] On the other hand, there is no particular limit to the method for controlling the number and size of dielectric crystal grains and pores in the cover portions 112 and 113. As a preferred example, the cover portions 112 and 113 can be formed using a ceramic green sheet for pore formation containing a volatile substance.

[0045] Figure 6 illustrates the process of preparing the material for the ceramic green sheet used for pore formation. Figure 7 illustrates the process of forming pores in the ceramic green sheet by performing calcination and sintering steps.

[0046] Referring more specifically to Figures 6 and 7, the material for the ceramic green sheet for pore formation can be prepared by mixing BaTiO311, then adding metal nitrate 12, and mixing BaTiO311 again. This allows the metal nitrate 12 to surround the BaTiO311. Subsequently, barium source 13 can be added and mixed. The barium source 13 can react with the metal nitrate 12 to form barium nitrate 14. After adjusting the amounts of metal nitrate 12 and barium source 13 and firing, the number and size of pores can be adjusted.

[0047] In this case, the metal nitrate 12 may contain one or more of Mg, Mn, Al, Dy, Tb, V, Zr, and Y, and the barium source 13 may contain one or more of Ba(OH)2, BaCO3, and BaCl2.

[0048] When the ceramic green sheet for pore formation undergoes a burn-out process, the metal nitrate 12 component volatilizes, leaving behind barium nitrate 14 and BaTiO311. Subsequently, during the sintering process, the BaTiO311 is sintered to form dielectric crystal grains G, and the barium nitrate 14 volatilizes to form pores P.

[0049] Another method for controlling the number and size of dielectric crystal grains and pores involves using a ceramic green sheet for pore formation containing a mixture of BaTiO311 and a polymer blend. In this case, the polymer blend refers to a mixture of different organic materials. The number and size of pores after firing can be adjusted by controlling the amount and mixing ratio of the polymer blend.

[0050] Furthermore, the polymer blend may contain PVB (Poly vinyl butyral) and polyacrylate series organic materials.

[0051] In one embodiment, side margin portions 114 and 115 can be arranged on the fifth and sixth surfaces of the main body 110.

[0052] To miniaturize and increase the capacitance of multilayer electronic components, it is necessary to maximize the effective area of ​​the internal electrodes (increase the effective volume fraction required to achieve the capacitance). To achieve this, the internal electrodes 121 and 122 are designed to contact both end faces of the capacitance forming section A in the third direction, and by designing without margins, the area of ​​the internal electrodes in the width direction is maximized. Side margin sections 114 and 115 can be placed on the fifth and sixth surfaces to improve the capacitance per unit volume and suppress the step in the width direction caused by the internal electrodes. To suppress the step caused by the internal electrodes 121 and 122, the side margin sections 114 and 115 can be formed by cutting the internal electrodes 121 and 122 after lamination so that they contact both end faces of the capacitance forming section A in the third direction, and then laminating a single dielectric layer or two or more dielectric layers in the third direction on both end faces (end surfaces) of the capacitance forming section A in the third direction.

[0053] The side margin portions 114 and 115 may include a first side margin portion 114 and a second side margin portion 115 located on the fifth surface 5 of the main body 110. In other words, the margin portions 114 and 115 can be located on both end surfaces in the third direction of the volume forming portion A.

[0054] The side margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0055] The internal electrodes 121 and 122 may include a first internal electrode 121 that contacts both end faces and the third face of the capacitance forming portion A in the third direction, and a second internal electrode 122 that contacts both end faces and the fourth face of the capacitance forming portion A in the third direction.

[0056] In this case, when the number of dielectric crystal grains and pores contained in the side margin portions 114 and 115 are Gn1 and Pn1, respectively, Gn1 / Pn1 may be greater than 10 and less than 30.

[0057] If the Gn1 / Pn1 ratio is 10 or less, the proportion of pores is too high, which can act as pathways for moisture penetration and reduce the reliability of moisture resistance. Therefore, it is preferable for the Gn1 / Pn1 ratio to be greater than 10, and more preferably 12 or more.

[0058] On the other hand, if the Gn1 / Pn1 ratio is 30 or higher, the proportion of stomata is too small, which may result in insufficient suppression of crack generation and propagation by stomata P. Therefore, it is preferable that the Gn1 / Pn1 ratio is less than 30, and more preferably 29 or less.

[0059] Furthermore, when the average sizes of dielectric crystal grains and pores contained in the side margin portions 114 and 115 are Gs1 and Ps1, respectively, Ps1 / Gs1 may be less than 3.

[0060] If Ps1 / Gs1 is 3 or higher, the pore size becomes too large, which can facilitate moisture penetration and reduce the reliability of moisture resistance. Therefore, it is preferable that Ps1 / Gs1 be less than 3, and more preferably 2.9 or lower.

[0061] There is no particular need to limit the lower limit of Ps1 / Gs1. However, to further improve the effect of suppressing crack generation and propagation by stomata, it can be 2.1 or higher.

[0062] The internal electrodes 121 and 122 can be arranged alternately with the dielectric layer 111.

[0063] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can contact the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0064] Referring to Figure 3, the first internal electrode 121 is separated from the fourth surface 4 and in contact with the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and can contact the fourth surface 4. Furthermore, the first internal electrode 121 can contact the third, fifth, and sixth surfaces 3, 5, and 6, and the second internal electrode 122 can contact the fourth, fifth, and sixth surfaces 4, 5, and 6.

[0065] In this configuration, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0066] The internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0067] The external electrodes 131 and 132 are positioned on the third surface 3 and the fourth surface 4 of the main body 110.

[0068] The external electrodes 131 and 132 are arranged on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and may include first and second external electrodes 131 and 132 connected to first and second internal electrodes 121 and 122, respectively. The internal electrodes 121 and 122 include a first internal electrode 121 that contacts the first external electrode 131 and a second internal electrode 122 that contacts the second external electrode 132, and both ends of the first and second internal electrodes 121 and 122 in the third direction may contact the side margin portions 114 and 115.

[0069] Referring to Figure 1, the external electrodes 131 and 132 can be positioned to cover both end faces of the side margin portions 114 and 115 in the second direction.

[0070] In this embodiment, a structure is described in which the stacked electronic component 100 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the shape of the internal electrodes 121 and 122 or for other purposes.

[0071] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties and structural stability. Furthermore, they may have a multilayer structure.

[0072] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a placed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0073] To give a more specific example of electrode layers 131a and 132a, the electrode layers 131a and 132a can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0074] Furthermore, the electrode layers 131a and 132a can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. Alternatively, the electrode layers 131a and 132a can be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0075] While materials with excellent electrical conductivity can be used as the conductive metal in the electrode layers 131a and 132a, there are no particular limitations. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0076] The plating layers 131b and 132b play a role in improving the mounting characteristics. The types of plating layers 131b and 132b are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may also be formed in multiple layers.

[0077] To give a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may be formed in a manner in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or in a manner in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed. Furthermore, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0078] (Embodiment) Sample chips were prepared that satisfy Table 1 below, where the ratio of dielectric crystal grains to the number of pores in the cover (Gn / Pn) and the ratio of the average size of pores to the average size of dielectric crystal grains in the cover (Ps / Gs) are both the same.

[0079] The crack suppression effect and moisture resistance reliability of the above sample chips were evaluated and are shown in Table 1.

[0080] Crack evaluation was performed by observing the sample chips under an optical microscope while polishing them after firing, after they were embedded in the epoxy mold. Cracks found in the active, cover interface, and peripheral areas were judged as NG (Not Good).

[0081] For humidity resistance reliability testing, the sample chip was subjected to an electric field with a guaranteed voltage ratio of 1.5 Vr for 12 hours at 85°C and 85% relative humidity. If the insulation resistance dropped by more than 4 orders of magnitude from the initial resistance, it was judged as NG (Not Good).

[0082] The number and size of pores and crystal grains in the cover portion were measured by analyzing images scanned at 50k magnification using a ZEISS SEM in cross-sections cut from the center of the third direction in the first and second directions of the sample chip. The pellet diameter (ferret diameter) of the pores and crystal grains was measured from the scanned images using Zootos particle size measurement software, and this was determined as the size of the pores and crystal grains.

[0083] Figure 8a is a SEM image of the cross-section of the cover of test number 3, and Figures 8b and 8c are images of the dielectric crystal grains and pores analyzed by Zootos, respectively. Figure 9a is a SEM image of the cross-section of the cover of test number 7, and Figures 9b and 9c are images of the dielectric crystal grains and pores analyzed by Zootos, respectively.

[0084] [Table 1]

[0085] In the cases of test numbers 1-4, the Gn / Pn ratio was 32 or higher, indicating insufficient crack suppression.

[0086] In the case of test numbers 5 to 7, the Gn / Pn ratio satisfies the present invention's requirement of being greater than 10 but less than 30, demonstrating excellent crack suppression and superior moisture resistance reliability.

[0087] In the case of test number 8, the crack suppression effect was excellent, but the Gn / Pn ratio was 10 or less, resulting in poor moisture resistance reliability.

[0088] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention. [Explanation of Symbols]

[0089] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Side margin section 121, 122 Internal electrode 131, 132 External electrode 131a Electrode layer 132b Plating layer

Claims

1. A main body including a capacitance forming section in which dielectric layers and internal electrodes are alternately arranged in a first direction, and cover sections arranged above and below the capacitance forming section in the first direction, The main body includes an external electrode, The cover portion includes a plurality of dielectric crystal grains and a plurality of pores, When the number of dielectric crystal grains and pores contained in the cover portion are Gn and Pn, respectively, the ratio of Gn / Pn is 12 or more and 29 or less. A multilayer electronic component in which, when the average size of the dielectric crystal grains contained in the cover portion is Gs and the average size of the pores is Ps, Ps / Gs is 2.1 or more and 2.9 or less.

2. The main body includes first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction. Side margins are provided on the fifth and sixth surfaces of the main body. The stacked electronic component according to claim 1, wherein the number of dielectric crystal grains and pores contained in the side margin portion are Gn1 and Pn1, respectively, and Gn1 / Pn1 is greater than 10 and less than 30.

3. The stacked electronic component according to claim 2, wherein when the average sizes of dielectric crystal grains and pores contained in the side margin portion are Gs1 and Ps1, respectively, Ps1 / Gs1 is less than 3.

4. When the average size of the dielectric crystal grains contained in the cover portion is Gs and the average size of the pores is Ps, The stacked electronic component according to claim 3, wherein the Gn / Pn and Gn1 / Pn1 are between 12 and 29, and the Ps / Gs and Ps1 / Gs1 are between 2.1 and 2.

9.

5. The external electrode includes a first external electrode positioned on the third surface and a second external electrode positioned on the fourth surface, and the internal electrode includes a first internal electrode in contact with the first external electrode and a second internal electrode in contact with the second external electrode. The stacked electronic component according to any one of claims 2 to 4, wherein both ends of the first and second internal electrodes in the third direction are in contact with the side margin portion.

6. The multilayer electronic component according to any one of claims 1 to 5, wherein the Gs is 150 nm or more and 390 nm or less.

7. The stacked electronic component according to any one of claims 1 to 6, wherein the Ps is 110 nm or more and 310 nm or less.

8. The cover portion includes an upper cover portion positioned above the first direction of the volume forming portion and a lower cover portion positioned below the first direction of the volume forming portion. The stacked electronic component according to any one of claims 1 to 7, wherein the thickness of the upper and lower cover portions is 15 μm or more and 30 μm or less.

9. The laminated electronic component according to any one of claims 1 to 8, wherein the cover portion is formed using a ceramic green sheet for pore formation containing barium nitrate or a polymer blend.

10. The laminated electronic component according to any one of claims 1 to 9, wherein the porosity of the dielectric layer included in the capacitance forming portion is 1% or less.

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