Power converter

Abstract

To provide a power conversion device capable of inhibiting an increase in the size of the device due to an increase in the size of a housing.SOLUTION: A power conversion device 100 comprises: a semiconductor module 1; a capacitor module 2; a control board 3 to control the power conversion of the semiconductor module; and a tabular fixing plate 4 made of an insulating resin. The power conversion device 100 also comprises a housing 5 to house the semiconductor module 1, the capacitor module 2, and the control board 3. The capacitor module 2 includes a smoothing capacitor C, and has a connection terminal 21 electrically connected to the smoothing capacitor C and a battery 300 outside the device, and a second connection terminal 22 electrically connected to the semiconductor module 1. The fixing plate 4 is located between the capacitor module 2 and the control board 3 so as to cover at least one of the first connection terminal 21 and the second connection terminal 22.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This invention relates to a power conversion device, and more particularly to a power conversion device including a semiconductor module that performs power conversion and a control board that controls the power conversion of the semiconductor module.

Background Art

[0002] Conventionally, a power conversion device including a semiconductor module that performs power conversion and a control board that controls the power conversion of the semiconductor module has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a power conversion device including a semiconductor module that performs power conversion, a control board that controls the power conversion of the semiconductor module, and a housing that houses the semiconductor module and the control board.

[0004] Here, although not explicitly stated in Patent Document 1, a conventional power conversion device as described in Patent Document 1 includes a capacitor module including a smoothing capacitor that smooths the power supplied from a power source outside the device, and may house the capacitor module in the housing together with the semiconductor module and the control board. In such a case, in order to prevent a short circuit between the terminals of the capacitor module and the control board, it is necessary to arrange the terminals of the capacitor module and the control board apart from each other in the housing.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, as described above, when the terminals of the capacitor module and the control board are spaced apart from each other, in order to prevent a short circuit between the terminals of the capacitor module and the control board, they must be spaced apart by the air insulation distance (the insulation distance when insulation is performed by air). As a result, the housing that contains the control board and the capacitor module becomes larger. Consequently, there is a problem in that the device becomes larger.

[0007] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a power conversion device that can suppress the increase in size of the device caused by the enlargement of the housing. [Means for solving the problem]

[0008] To achieve the above objective, the power conversion device according to the first aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module including a smoothing capacitor and having a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, and a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least one of the first connection terminal and the second connection terminal. Conductor wiring that is electrically connected to an external load of the device, The device is equipped with such a configuration, and the semiconductor module and capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends. The semiconductor module has a connection portion that connects the conductive wiring to the semiconductor module, and the insulating plate has a recessed interference avoidance portion that is recessed to avoid interference with the connection portion. .

[0009] In the power conversion device according to the first aspect described above, as stated above, a plate-shaped insulating plate made of insulating resin is arranged between the capacitor module and the control board so as to cover at least one of the first connection terminal and the second connection terminal. As a result, when the insulating plate is arranged between the capacitor module and the control board so as to cover the first connection terminal, the distance between the first connection terminal of the capacitor module and the control board can be reduced compared to when the first connection terminal of the capacitor module and the control board are insulated with air (insulation is performed with air). As a result, the size of the housing can be suppressed, and thus the size of the device can be suppressed as a result of the housing size. Furthermore, when the insulating plate is arranged between the capacitor module and the control board so as to cover the second connection terminal, the distance between the second connection terminal of the capacitor module and the control board can be reduced compared to when the second connection terminal of the capacitor module and the control board are insulated with air. As a result, the size of the housing can be suppressed, and thus the size of the device can be suppressed as a result of the housing size.

[0010] In the power conversion device according to the first aspect described above, preferably, the control board is positioned above the semiconductor module and the capacitor module, and the insulating plate is positioned between the first and second connection terminals and the control board so as to cover the first and second connection terminals. With this configuration, since the insulating plate is positioned between the first and second connection terminals and the control board so as to cover the first and second connection terminals and the control board, the distance between the first and second connection terminals and the control board can be reduced compared to when the first and second connection terminals and the control board are insulated with air. As a result, the size of the housing can be suppressed, and thus the overall size of the device can be prevented from increasing due to the size of the housing.

[0011] In the power conversion device according to the first aspect described above, preferably, the control board is not directly fixed to the housing but is fixed to the housing via an insulating plate. When the control board is fixed to both the housing and the insulating plate, fixing the control board becomes difficult due to the dimensional tolerances of the housing and the insulating plate, respectively. With the above configuration, the control board is fixed to the housing via the insulating plate, so when fixing it, it is only necessary to adjust to the dimensional tolerance of the insulating plate. As a result, the control board can be easily fixed to the insulating plate.

[0012] In the power conversion device according to the first aspect described above, preferably, the housing is made of metal, and the insulating plate is positioned between the first connection terminal of the capacitor module and the housing so as to cover the first connection terminal. With this configuration, since the insulating plate is positioned between the first connection terminal of the capacitor module and the housing so as to cover the first connection terminal, even if the housing is deformed by being bent inward due to an external impact, the metal housing can be prevented from coming into contact with the first connection terminal of the capacitor module. As a result, when the metal housing is deformed by being bent inward due to an external impact, a short circuit between the first connection terminal of the capacitor module and the deformed housing can be prevented.

[0013] Furthermore, in order to achieve the above objective, the power conversion device in the second aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, and a plate-shaped insulating plate made of insulating resin that is positioned between the capacitor module and the control board so as to cover at least the first connection terminal, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, the housing is made of metal and includes a side wall that surrounds the capacitor module, the first connection terminal is provided at a position facing the side wall, the insulating plate has a wall portion formed to extend along the side wall between the side wall of the housing and the first connection terminal, and is positioned to cover the first connection terminal between the first connection terminal of the capacitor module and the housing. In the power conversion device in the second aspect described above, The enclosure includes a side wall that surrounds the capacitor module, the first connection terminal is located opposite the side wall, and the insulating plate has a wall portion that extends along the side wall between the side wall of the enclosure and the first connection terminal. ThisSince the wall portion is formed to extend along the side wall of the housing between the side wall of the housing and the first connection terminal, even if the housing deforms inward due to an external impact, it is possible to prevent the metal housing from coming into contact with the first connection terminal of the capacitor module. As a result, when the metal housing deforms inward due to an external impact, it is possible to easily prevent a short circuit between the first connection terminal of the capacitor module and the deformed housing.

[0014] Furthermore, in order to achieve the above objective, the power conversion device in the third aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, and a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least the first connection terminal, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, the housing has a plurality of fastening holes for fastening and fixing the insulating plate, the capacitor module further includes a capacitor case that houses a smoothing capacitor inside, the capacitor case has a recess that is recessed inward toward the smoothing capacitor side, and at least one of the plurality of fastening holes is provided at a position corresponding to the recess of the capacitor case. In the power conversion device according to the third aspect described above, The housing has a plurality of fastening holes for fastening and securing an insulating plate, and the capacitor module further includes a capacitor case that houses a smoothing capacitor inside, the capacitor case has a recess that is recessed inward toward the smoothing capacitor side, and at least one of the plurality of fastening holes is provided at a position corresponding to the recess of the capacitor case. This Since at least one of the multiple fastening holes is provided at a position corresponding to the recess that curves inward toward the smoothing capacitor, the space provided by the recess can be utilized to provide the fastening holes. As a result, the enlargement of the housing in the direction in which the recess of the capacitor case curves can be suppressed, and thus the enlargement of the device due to the enlargement of the housing can be suppressed.

[0015] In the power conversion device according to the first aspect described above, preferably, the semiconductor module has control terminals connected to a control board, and the insulating plate is formed to extend along the control board and has openings corresponding to the control terminals, and the control terminals are connected to the control board through the openings. With this configuration, the connection path can be shortened compared to the case where wiring for connecting the control terminals of the semiconductor module and the control board is provided so as to bypass the insulating plate placed between the semiconductor module and the control board. As a result, the control terminals of the semiconductor module can be easily connected to the control board, thereby suppressing the complexity of the device configuration.

[0016] In the power conversion device according to the first aspect described above, preferably, Conductor wiring includes multiple conductor wires, The semiconductor module is provided to accommodate multiple conductor wirings and has multiple connection points that connect the multiple conductor wirings to the semiconductor module. The insulating plate is positioned between the multiple connection points and the control board so as to cover the multiple connection points. With this configuration, since the insulating plate is positioned between the multiple connection points and the control board so as to cover the multiple connection points, the distance between the multiple connection points and the control board can be reduced compared to when the connection points and the control board are insulated with air. As a result, the size of the housing can be suppressed, and thus the overall size of the device, which is caused by the size of the housing, can be suppressed.

[0017] Furthermore, in order to achieve the above objective, the power conversion device in the fourth aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least the first connection terminal, and a plurality of conductor wirings that are electrically connected to an external load, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, the semiconductor module has a plurality of connection parts that are provided corresponding to a plurality of conductor wirings and connect the plurality of conductor wirings to the semiconductor module, and the insulating plate is arranged between the plurality of connection parts and the control board so as to cover the plurality of connection parts, and in the power conversion device according to the second aspect described above, the control board is configured to be fastened and fixed to the insulating plate between the plurality of connection parts in the direction along the control board. In the power conversion device according to the fourth phase described above, as stated above, The control board is configured to be fastened and secured to an insulating plate between multiple connection points in the direction along the control board. This Unlike the case where the control board is fastened to the insulating plate at a position overlapping with any of the multiple connection points, this method prevents screws and other components used to fasten the control board from interfering with the multiple connection points. As a result, the portion of the control board that fastens to the control board can be brought closer to the semiconductor module compared to the case where the control board is fastened to the insulating plate at a position overlapping with any of the multiple connection points. This allows for a reduction in the size of the insulating plate in the direction facing the semiconductor module, thereby suppressing an increase in the size of the housing. As a result, it is possible to suppress an increase in the size of the device due to an increase in the size of the housing.

[0018] Furthermore, in order to achieve the above objective, the power conversion device in the fifth aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least the first connection terminal, and a plurality of conductor wirings that are electrically connected to an external load, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, the semiconductor module has a connection portion that connects the conductor wiring to the semiconductor module, the insulating plate has a concave interference avoidance portion that is recessed to avoid interference with the connection portion, and is arranged between the connection portion and the control board so as to cover the connection portion. The insulating plate is provided corresponding to each of the multiple connection points and has a recessed interference avoidance portion that is recessed to avoid interference with the multiple connection points. ThisSince the concave interference avoidance portion can avoid the interference of the insulating plate with respect to the plurality of connection portions, the insulating plate can be brought closer to the semiconductor module having the plurality of connection portions. As a result, the size of the housing in the direction in which the semiconductor module and the insulating plate face each other can be made smaller. Thereby, the enlargement of the housing can be further suppressed, so that the enlargement of the apparatus due to the enlargement of the housing can be further suppressed.

[0019] In the power conversion device according to the first aspect described above, preferably, The control board is directly fixed to the insulating plate. If you configure it like this When the insulating plate is disposed between the capacitor module and the control board so as to cover the first connection terminal, the distance between the first connection terminal of the capacitor module and the control board can be made smaller than when air insulation (insulation with air) is performed between the first connection terminal of the capacitor module and the control board. As a result, the enlargement of the housing can be suppressed, so that the enlargement of the apparatus due to the enlargement of the housing can be suppressed. Also, when the insulating plate is disposed between the capacitor module and the control board so as to cover the second connection terminal, the distance between the second connection terminal of the capacitor module and the control board can be made smaller than when air insulation is performed between the second connection terminal of the capacitor module and the control board. As a result, the enlargement of the housing can be suppressed, so that the enlargement of the apparatus due to the enlargement of the housing can be suppressed.

[0020] In the power conversion device according to the first aspect described above, preferably, the conductor wiring includes a plurality of conductor wirings, and semi The conductor module is provided corresponding to a plurality of conductor wirings and has a plurality of connection portions for connecting the plurality of conductor wirings and the semiconductor module, and the insulating plate is disposed between the plurality of connection portions and the control board so as to cover the plurality of connection portions. If configured in this way,When the insulating board is disposed between the capacitor module and the control board so as to cover the first connection terminal, the distance between the first connection terminal of the capacitor module and the control board can be made smaller than when insulating in air (performing insulation with air) between the first connection terminal of the capacitor module and the control board. As a result, an increase in the size of the housing can be suppressed, so an increase in the size of the apparatus due to an increase in the size of the housing can be suppressed. Also, when the insulating board is disposed between the capacitor module and the control board so as to cover the second connection terminal, the distance between the second connection terminal of the capacitor module and the control board can be made smaller than when insulating in air between the second connection terminal of the capacitor module and the control board. As a result, an increase in the size of the housing can be suppressed, so an increase in the size of the apparatus due to an increase in the size of the housing can be suppressed. Also, since the insulating board is disposed between the plurality of connection portions and the control board so as to cover the plurality of connection portions, the distance between the plurality of connection portions and the control board can be made smaller than when insulating in air between the plurality of connection portions and the control board. As a result, an increase in the size of the housing can be suppressed, so an increase in the size of the apparatus due to an increase in the size of the housing can be suppressed.

[0021] Furthermore, in order to achieve the above objective, the power conversion device in the sixth aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, and a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least the first connection terminal, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, and the control board is configured to be fastened and fixed to the insulating plate between a plurality of connection parts in the direction along the control board. The control board is configured to be fastened and fixed to the insulating board between the plurality of connection portions in a direction along the control board. This At a position overlapping any one of the plurality of connection portions, unlike the case where the control board is fastened and fixed to the insulating board, it is possible to suppress interference between a member such as a screw for fastening and fixing the control board and the plurality of connection portions. As a result, at a position overlapping any one of the plurality of connection portions, the portion where the control board is fastened can be brought closer to the semiconductor module compared to the case where the control board is fastened and fixed to the insulating board. Thereby, the size of the insulating board in the direction facing the semiconductor module can be made smaller, so an increase in the size of the housing can be suppressed. As a result, an increase in the size of the apparatus due to an increase in the size of the housing can be suppressed.

[0022] Furthermore, in order to achieve the above objective, the power conversion device in the seventh aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least the first connection terminal, and a plurality of conductor wirings electrically connected to an external load, wherein the semiconductor module and the capacitor module are arranged adjacent to each other in the direction in which the insulating plate extends, the semiconductor module has a plurality of connection parts that are provided corresponding to the plurality of conductor wirings and connect the plurality of conductor wirings to the semiconductor module, and the insulating plate is Each of the multiple connection points is provided with a recessed interference avoidance portion that is recessed to avoid interference with the multiple connection points. Furthermore, it is positioned between the multiple connection points and the control board so as to cover the multiple connection points. In the power conversion device according to the seventh aspect described above, The insulating plate is provided corresponding to each of the multiple connection points and has a recessed interference avoidance portion that is recessed to avoid interference with the multiple connection points. This Furthermore, the concave interference avoidance section prevents interference of the insulating plate with multiple connection points, allowing the insulating plate to be brought closer to the semiconductor module having multiple connection points. As a result, the size of the housing in the direction in which the semiconductor module and the insulating plate face each other can be reduced. This further suppresses the enlargement of the housing, thus reducing the overall size of the device caused by the enlargement of the housing.

[0023] A power conversion device according to the fourth aspect of this invention comprises a semiconductor module that performs power conversion, a capacitor module that includes a smoothing capacitor and has a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, a control board that controls the power conversion of the semiconductor module, a housing that houses the semiconductor module, the capacitor module, and the control board, and a plate-shaped insulating plate made of insulating resin that is arranged between the capacitor module and the control board so as to cover at least one of the first connection terminal and the second connection terminal, wherein the insulating plate is formed in a substantially H shape when viewed from a direction perpendicular to the surface of the control board. As a result, when the insulating plate is placed between the capacitor module and the control board so as to cover the first connection terminal, the distance between the first connection terminal of the capacitor module and the control board can be reduced compared to when the first connection terminal of the capacitor module and the control board are insulated with air (insulation is performed with air). As a result, the size of the housing can be suppressed, thus preventing the device from becoming larger due to the size of the housing. Furthermore, when the insulating plate is placed between the capacitor module and the control board so as to cover the second connection terminal, the distance between the second connection terminal of the capacitor module and the control board can be reduced compared to when the second connection terminal of the capacitor module and the control board are insulated with air. As a result, the size of the housing can be suppressed, thus preventing the device from becoming larger due to the size of the housing. [Effects of the Invention]

[0024] According to the present invention, as described above, it is possible to provide a power conversion device that can suppress the increase in size of the device caused by the enlargement of the housing. [Brief explanation of the drawing]

[0025] [Figure 1] This is an exploded perspective view illustrating the configuration of a power converter according to one embodiment of the present invention. [Figure 2] This is a view of the housing of a power converter according to one embodiment of the present invention, seen from above (towards the Z1 direction). [Figure 3] This is a view from above (towards Z1) of the power converter with the cover removed from the state shown in Figure 2. [Figure 4] This is a view from above (towards the Z1 direction) of the power converter with the control board removed from the state shown in Figure 3. [Figure 5] This is a view from above (towards Z1) of the power converter with the fixing plate removed from the state shown in Figure 4. [Figure 6] This is a partial cross-sectional view along the 700-700 line in Figure 3. [Figure 7]Figure 6 is a magnified view of the area around the semiconductor module. [Figure 8] This diagram shows the internal configuration of a capacitor module. [Figure 9] This is a partial cross-sectional view along the 800-800 line in Figure 2. [Figure 10] This is a partial cross-sectional view along the 900-900 line in Figure 3. [Modes for carrying out the invention]

[0026] The following describes embodiments of the present invention based on the drawings.

[0027] The configuration of the power converter 100 according to this embodiment will be described with reference to Figures 1 to 10.

[0028] (Configuration of power converter) The power converter 100 is an inverter device attached to the motor 200 that converts power supplied from an external battery 300 and supplies (outputs) the converted power to the external motor 200. The motor 200 is, for example, a motor for a vehicle such as an electric vehicle or a hybrid vehicle. In other words, the power converter 100 is a vehicle inverter device (power converter). The external motor 200 is an example of an "external load" in the claims, and the external battery 300 is an example of an "external power source" in the claims.

[0029] As shown in Figure 1, the power conversion device 100 comprises a semiconductor module 1 that performs power conversion, a capacitor module 2, a control board 3, a fixing plate 4, and a housing 5. The fixing plate 4 is an example of an "insulating plate" as defined in the claims. In this specification, one direction in the plane on which the control board 3 extends is defined as the X direction (X1 direction, X2 direction), the direction perpendicular to the X direction in the above plane is defined as the Y direction (Y1 direction, Y2 direction), and the direction perpendicular to the surface of the control board 3 is defined as the Z direction (Z1 direction, Z2 direction).

[0030] Furthermore, the power converter 100 includes a plurality of conductive wirings 6 that are electrically connected to a motor 200 located outside the device. The conductive wirings 6 are plate-shaped metal wirings. For example, the conductive wirings 6 are copper bars. In addition, there are multiple (three) conductive wirings 6, corresponding to each phase (U phase, V phase, and W phase) of the AC power supplied to the motor 200 located outside the device.

[0031] The semiconductor module 1 includes multiple switching elements. Specifically, the semiconductor module 1 is an IGBT module containing multiple IGBTs (Insulated Gate Bipolar Transistors). The semiconductor module 1 also has control terminals 11 that are connected to the control board 3.

[0032] Capacitor module 2 is a module for smoothing the power (DC power) supplied from the external battery 300 of the power converter 100. Capacitor module 2 includes a smoothing capacitor C (see Figure 6), which will be described later, and the smoothing capacitor C smooths the power (DC power) supplied from the external battery 300 of the power converter 100.

[0033] Furthermore, the capacitor module 2 has a connection terminal 21 that is electrically connected to the smoothing capacitor C and the battery 300 located outside the device. The capacitor module 2 also has a connection terminal 22 that is electrically connected to the semiconductor module 1. The connection terminal 22 is provided on the side of the capacitor module 2 where the semiconductor module 1 is located (Y2 direction side). The connection terminal 21 is provided on one side of the X direction that intersects the Y direction where the semiconductor module 1 and the capacitor module 2 are adjacent (X1 direction side). Note that the connection terminal 21 is an example of the "first connection terminal" in the claims, and the connection terminal 22 is an example of the "second connection terminal" in the claims.

[0034] Furthermore, a power line 400 is installed inside the enclosure 5 to supply power from the battery 300 to the capacitor module 2 and the semiconductor module 1. The power line 400 is connected to the connection terminal 21.

[0035] The control board 3 is configured to control the power conversion of the semiconductor module 1. Specifically, the control board 3 is configured to control the switching of the switching elements in the semiconductor module 1 via the control terminal 11. The control board 3 is a printed circuit board (PCB) on which wiring patterns are formed by conductors and electronic components are mounted. Electronic components such as transformers, capacitors, and connectors (not shown) are mounted on the control board 3.

[0036] The fixing plate 4 is a plate-shaped member formed of an insulating resin and is positioned between the capacitor module 2 and the control board 3. The fixing plate 4 is, for example, made of PPS (Polyphenylene Sulfide) resin. The fixing plate 4 is also formed to extend along the control board 3 (the surface of the control board 3). The fixing plate 4 may be made of an insulating resin other than PPS resin. For example, the fixing plate 4 may be made of an insulating resin such as PBT (Polybutylene terephthalate) resin.

[0037] Furthermore, as shown in Figure 1, the fixing plate 4 has multiple bosses 41 into which screws 72 (see Figure 3), described later, are fastened to securely fasten the control board 3. Holes are formed in the bosses 41 for fastening the screws 72, described later. The bosses 41 are formed to extend along the Z direction. In this embodiment, eight bosses 41 are provided.

[0038] The housing 5 houses the semiconductor module 1, the capacitor module 2, and the control board 3. Furthermore, the housing 5 houses the fixing plate 4 and the conductive wiring 6. The housing 5 is attached to the motor 200. In this embodiment, as shown in Figure 1, the capacitor module 2, the semiconductor module 1, and the conductive wiring 6 are arranged in this order from the Y1 direction side inside the housing 5.

[0039] Furthermore, as shown in Figure 1, the housing 5 includes a main body 51 and a cover member 52 attached to the main body 51. The main body 51 is a metal component including aluminum. The cover member 52 is a metal component including iron. In other words, the housing 5 is made of metal and is conductive. The cover member 52 is fastened and fixed to the main body 51 by a plurality (eight) of screws 71 (see Figure 2).

[0040] Furthermore, in this embodiment, as shown in Figure 3, the control board 3 is fastened and fixed to the fixing plate 4 by a plurality (eight) of screws 72. Specifically, the outer edge of the control board 3 is fastened and fixed by a plurality (six) of screws 72. In addition, the control board 3 is also fastened and fixed by a plurality (two) of screws 72 in the central part in the X direction. This prevents the control board 3 from being damaged by bending deformation in the central part of the control board 3. In this embodiment, the power converter 100 is configured such that at least one of the plurality of screws 72 is electrically connected to a fastening hole 51a of the main body 51, which will be described later, via a boss 41 (see Figure 4), thereby providing grounding for the control board 3.

[0041] Furthermore, as shown in Figure 4, the fixing plate 4 is formed in a roughly H shape when viewed from the Z1 direction. The fixing plate 4 is fastened to the main body 51 by a plurality (6) of screws 73. Of the plurality (6) of screws 73, a portion (2) is fastened to the main body 51 at a position outside (towards the X1 direction) of the multiple (8) bosses 41 of the fixing plate 4 that is located furthest towards the X1 direction. Also, a portion (3) of the plurality (6) of screws 73 is fastened to the main body 51 at a position outside (towards the X2 direction) of the multiple (8) bosses 41 of the fixing plate 4 that is located furthest towards the X2 direction. Also, a portion (2) of the plurality (6) of screws 73 is fastened to the main body 51 at a position outside (towards the Y1 direction) of the multiple (8) bosses 41 of the fixing plate 4 that is located furthest towards the Y1 direction.

[0042] Furthermore, as shown in Figure 4, the fixing plate 4 has an opening 4a provided corresponding to the control terminal 11. The control terminal 11 is connected to the control board 3 (see Figure 3) through the opening 4a.

[0043] As shown in Figure 5, there are multiple (two) connection terminals 21, corresponding to each phase (P phase and N phase) of the DC power supplied from the battery 300. In addition, there are three connection terminals 22 for each connection terminal 21, corresponding to each phase (U phase, V phase and W phase) of the AC power supplied to the motor 200. In other words, there are six connection terminals 22.

[0044] Furthermore, as shown in Figure 5, the main body portion 51 of the housing 5 has a plurality of fastening holes 51a for fastening and securing the fixing plate 4. In this embodiment, eight fastening holes 51a are provided. The fixing plate 4 is fastened and secured to the main body portion 51 of the housing 5 using the aforementioned screws 73 (see Figure 4) and the fastening holes 51a provided in the main body portion 51.

[0045] As shown in Figure 6, the control board 3 is positioned above the semiconductor module 1 and the capacitor module 2 (towards the Z1 direction). The fixing plate 4 is positioned between the connection terminals 22 and the control board 3, covering the connection terminals 22. The control board 3 is placed on the Z1 direction side of the boss 41 of the fixing plate 4 and is fastened and secured to the fixing plate 4 by screws 72.

[0046] Furthermore, as shown in Figure 6, the capacitor module 2 includes a smoothing capacitor C. The capacitor module 2 includes a capacitor case 23 that houses the smoothing capacitor C. The capacitor case 23 is made of an insulating resin. The capacitor case 23 is, for example, a component made of PPS resin similar to that of the fixing plate 4.

[0047] The capacitor case 23 is then filled with resin 24, with the smoothing capacitor C housed inside. The resin 24 is an insulating resin. For example, the resin 24 is epoxy resin.

[0048] Furthermore, as shown in Figure 7, the fixing plate 4 has a recess 4b that is recessed in the Z1 direction to avoid interference with the connection terminal 22. The fixing plate 4 also has an inclined portion 4c that slopes from the Y2 direction toward the recess 4b. The fixing plate 4 also has an interference avoidance portion 4d on the Y2 direction side of the control terminal 11. The interference avoidance portion 4d is provided adjacent to the opening 4a. A detailed explanation of the interference avoidance portion 4d will be given later.

[0049] As shown in Figure 7, the semiconductor module 1 has an input-side connection part 12 that connects the connection terminal 22 to the semiconductor module 1. The input-side connection part 12 is located on the Z1 side of the semiconductor module 1 and on the capacitor module 2 side (Y1 side). The semiconductor module 1 also has an output-side connection part 13 that connects the conductor wiring 6 to the semiconductor module 1. The output-side connection part 13 is located on the Z1 side of the semiconductor module 1 and on the conductor wiring 6 side (Y2 side).

[0050] Furthermore, as shown in Figure 7, the connection terminal 22 of the capacitor module 2 is fastened and fixed to the input side connection portion 12 of the semiconductor module 1 by a screw 74. The input side connection portion 12 is electrically connected to the switching element inside the semiconductor module 1. The input side connection portion 12 is a terminal for inputting power supplied from the battery 300 via the connection terminal 22 to the semiconductor module 1.

[0051] Furthermore, as shown in Figure 7, a conductor wire 6 is fastened and secured to the output side connection part 13 of the semiconductor module 1 by a screw 75. The output side connection part 13 is electrically connected to the switching element inside the semiconductor module 1. The output side connection part 13 is a terminal for outputting the power converted by the semiconductor module 1 via the conductor wire 6.

[0052] (Construction of the capacitor module) As shown in Figure 8, the capacitor case 23 houses multiple (five) smoothing capacitors C. The capacitor case 23 also has a recess 23a that curves inward toward the smoothing capacitors C. Specifically, when viewed from the Z1 direction, the outer edge of the recess 23a is formed to curve inward (towards the X1 direction) to match the shape of the smoothing capacitors C, which have a track shape.

[0053] As shown in Figure 8, one of the multiple fastening holes 51a is provided at a position corresponding to the recess 23a of the capacitor case 23. In this embodiment, one of the seven fastening holes 51a is provided at a position corresponding to the recess 23a. Specifically, one of the seven fastening holes 51a is provided on the inside of the recess 23a so as to face the recess 23a.

[0054] Furthermore, the connection terminals 21 and 22 of the capacitor module 2 are integrally formed from a plate-shaped conductor 20 (see Figure 8). The conductor 20 includes, for example, copper. One connection terminal 21 and three connection terminals 22 are provided for each conductor 20. In addition, as shown in Figure 9, there are two conductors 20, and they are arranged to sandwich the smoothing capacitor C housed in the capacitor case 23 in the Z direction. The two conductors 20, together with the smoothing capacitor C, are molded with insulating resin 24 inside the capacitor case 23.

[0055] (Configuration of the side walls and fixing plate walls of the enclosure) As shown in Figure 9, the housing 5 includes side walls that surround the capacitor module 2. Specifically, the main body 51 includes side walls 51b that surround the capacitor module 2. The cover member 52 includes side walls 52a that surround the capacitor module 2. Note that side walls 51b and 52a are examples of "side walls" as defined in the claims.

[0056] Furthermore, as shown in Figure 9, the connection terminal 21 is provided in a position facing the side walls 51b and 52a. Specifically, the connection terminal 21 is provided on the X2 direction side of the side walls 51b and 52a so as to face the side walls 51b and 52a in the X direction along the control board 3.

[0057] Furthermore, as shown in Figure 9, the fixing plate 4 is positioned between the connection terminal 21 and the control board 3 so as to cover the connection terminal 21. Also, the fixing plate 4 is positioned between the connection terminal 21 of the capacitor module 2 and the housing 5 so as to cover the connection terminal 21. Specifically, the fixing plate 4 has a wall portion 4e formed to extend along the side walls 51b and 52a of the housing 5 and the connection terminal 21. The wall portion 4e is formed to extend in the Z2 direction along the side wall 51b of the main body portion 51 and the side wall 52a of the cover member 52.

[0058] Furthermore, in this embodiment, as shown in Figures 9 and 10, the control board 3 is not directly fixed to the housing 5, but is fixed to the housing 5 via a fixing plate 4.

[0059] (Configuration of the interference avoidance unit) The output connection portion 13 of the semiconductor module 1 is provided to correspond to multiple conductor wirings 6. Specifically, as shown in Figure 10, there are three output connection portions 13, corresponding to three conductor wirings 6. In other words, the semiconductor module 1 has multiple (three) output connection portions 13, each corresponding to multiple (three) conductor wirings 6. As shown in Figure 10, the fixing plate 4 is positioned between the multiple output connection portions 13 and the control board 3, covering the multiple output connection portions 13. Note that the multiple output connection portions 13 are an example of the "multiple connection portions" in the claims.

[0060] Furthermore, as shown in Figure 10, the fixing plate 4 is provided corresponding to each of the multiple output-side connection parts 13 and has a recessed interference avoidance part 4d that is recessed to avoid interference with the multiple output-side connection parts 13. That is, there are three interference avoidance parts 4d, corresponding to the three output-side connection parts 13. In this embodiment, the interference avoidance part 4d is formed to be recessed in the Z1 direction to avoid the output-side connection parts 13, the conductor wiring 6, and the screws 75.

[0061] Furthermore, as shown in Figure 10, the control board 3 is configured to be fastened and fixed to the fixing plate 4 between multiple output-side connection parts 13 in the direction along the control board 3. Specifically, the control board 3 has bosses 41 between multiple output-side connection parts 13 in the X direction along the control board 3, and between multiple interference avoidance parts 4d. The control board 3 is then fastened and fixed to the fixing plate 4 using screws 72 and the bosses 41 of the fixing plate 4.

[0062] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0063] In this embodiment, a plate-shaped fixing plate 4 made of insulating resin is positioned between the capacitor module 2 and the control board 3 so as to cover the connection terminals 21 of the capacitor module 2. This allows the distance between the connection terminals 21 of the capacitor module 2 and the control board 3 to be smaller than when the connection terminals 21 of the capacitor module 2 and the control board 3 are insulated by air (insulation is performed with air). As a result, the size of the housing 5 can be suppressed, and thus the size of the power converter 100 caused by the size of the housing 5 can be suppressed. In addition, a plate-shaped fixing plate 4 made of insulating resin is positioned between the capacitor module 2 and the control board 3 so as to cover the connection terminals 22 of the capacitor module 2. This allows the distance between the connection terminals 22 of the capacitor module 2 and the control board 3 to be smaller than when the connection terminals 22 of the capacitor module 2 and the control board 3 are insulated by air. As a result, the size of the housing 5 can be suppressed, and thus the size of the power converter 100 caused by the size of the housing 5 can be suppressed.

[0064] Furthermore, in this embodiment, as described above, the control board 3 is positioned above the semiconductor module 1 and the capacitor module 2 (towards the Z1 direction), and the fixing plate 4 is positioned between the connection terminals 21 and 22 and the control board 3 so as to cover the connection terminals 21 and 22. As a result, since the fixing plate 4 is positioned between the connection terminals 21 and 22 and the control board 3 so as to cover the connection terminals 21 and 22, the distance between the connection terminals 21 and 22 and the control board 3 can be reduced compared to when the connection terminals 21 and 22 and the control board 3 are insulated by air. Consequently, the enlargement of the housing 5 can be suppressed, and thus the enlargement of the power converter 100 due to the enlargement of the housing 5 can be suppressed.

[0065] Furthermore, in this embodiment, as described above, the control board 3 is not directly fixed to the housing 5, but is fixed to the housing 5 via a fixing plate 4. If the control board 3 were to be fixed to both the housing 5 and the fixing plate 4, fixing the control board 3 would be difficult due to the dimensional tolerances of the housing 5 and the fixing plate 4, respectively. On the other hand, in this embodiment, since the control board 3 is fixed to the housing 5 via the fixing plate 4, when fixing it, it is only necessary to adjust to the dimensional tolerance of the fixing plate 4. As a result, the control board 3 can be easily fixed to the fixing plate 4.

[0066] Furthermore, in this embodiment, as described above, the housing 5 (main body 51 and cover member 52) is made of metal. The fixing plate 4 is positioned between the connection terminals 21 of the capacitor module 2 and the housing 5 so as to cover the connection terminals 21. As a result, since the fixing plate 4 is positioned between the connection terminals 21 of the capacitor module 2 and the housing 5 so as to cover the connection terminals 21, even if the housing 5 is deformed inward due to an external impact or the like, it is possible to prevent the metal housing 5 from coming into contact with the connection terminals 21 of the capacitor module 2. Consequently, even if the metal housing 5 is deformed inward due to an external impact or the like, it is possible to prevent a short circuit between the connection terminals 21 of the capacitor module 2 and the deformed housing 5.

[0067] Furthermore, in this embodiment, as described above, the housing 5 (main body portion 51 and cover member 52) includes side walls (side walls 51b and 52) that surround the capacitor module 2. The connection terminal 21 is provided at a position opposite to the side walls (side walls 51b and 52), and the fixing plate 4 has a wall portion 4e formed to extend along the side walls (side walls 51b and 52) between the side walls (side walls 51b and 52) of the housing 5 (main body portion 51 and cover member 52) and the connection terminal 21. As a result, the wall portion 4e is formed to extend along the side walls (side walls 51b and 52) of the housing 5 (main body portion 51 and cover member 52) between the side walls (side walls 51b and 52) of the housing 5 (main body portion 51 and cover member 52) and the connection terminal 21. Therefore, even if the housing 5 deforms inward due to an external impact or the like, it is possible to prevent the metal housing 5 from coming into contact with the connection terminal 21 of the capacitor module 2. Consequently, if the metal housing 5 deforms inward due to an external impact or the like, it is possible to easily prevent a short circuit between the connection terminal 21 of the capacitor module 2 and the deformed housing 5.

[0068] Furthermore, in this embodiment, as described above, the housing 5 has a plurality of fastening holes 51a for fastening and fixing the fixing plate 4. The capacitor module 2 includes a capacitor case 23 that houses a smoothing capacitor C, and the capacitor case 23 has a recess 23a that is recessed inward (towards the X1 direction) toward the smoothing capacitor C. One of the plurality of fastening holes 51a is provided at a position corresponding to the recess 23a of the capacitor case 23. As a result, one of the plurality of fastening holes 51a is provided at a position corresponding to the recess 23a that is recessed inward toward the smoothing capacitor C, so that the space provided by the recess 23a can be utilized to provide the fastening holes 51a. As a result, the enlargement of the housing 5 in the direction in which the recess 23a of the capacitor case 23 is recessed (X direction) can be suppressed, and thus the enlargement of the power converter 100 due to the enlargement of the housing 5 can be suppressed.

[0069] Furthermore, in this embodiment, as described above, the semiconductor module 1 has control terminals 11 that are connected to the control board 3. The fixing plate 4 is formed to extend along the control board 3 and has an opening 4a that corresponds to the control terminals 11. The control terminals 11 are connected to the control board 3 through the openings 4a. This makes the connection path shorter compared to the case where wiring for connecting the control terminals 11 of the semiconductor module 1 and the control board 3 is provided so as to bypass the fixing plate 4 which is placed between the semiconductor module 1 and the control board 3. As a result, the control terminals 11 of the semiconductor module 1 can be easily connected to the control board 3, thereby suppressing the complexity of the device configuration.

[0070] Furthermore, in this embodiment, as described above, the power converter 100 includes a plurality of conductive wirings 6 that are electrically connected to a motor 200 outside the device. The semiconductor module 1 is provided corresponding to the plurality of conductive wirings 6 and has a plurality of output-side connection parts 13 that connect the plurality of conductive wirings 6 to the semiconductor module 1. The fixing plate 4 is positioned between the plurality of output-side connection parts 13 and the control board 3 so as to cover the plurality of output-side connection parts 13. As a result, since the fixing plate 4 is positioned between the plurality of output-side connection parts 13 and the control board 3 so as to cover the plurality of output-side connection parts 13, the distance between the plurality of output-side connection parts 13 and the control board 3 can be reduced compared to when the plurality of output-side connection parts 13 and the control board 3 are insulated by air. As a result, the size of the housing 5 can be suppressed, and thus the size of the power converter 100 that would result from the size of the housing 5 can be suppressed.

[0071] Furthermore, in this embodiment, as described above, the control board 3 is configured to be fastened and fixed to the fixing plate 4 between the multiple output-side connection portions 13 in the X direction along the control board 3. This prevents the screws 72 that fasten and fix the control board 3 from interfering with the multiple output-side connection portions 13, unlike when the control board 3 is fastened and fixed to the fixing plate 4 at a position that overlaps with any of the multiple output-side connection portions 13. As a result, the portion (boss 41) that fastens the control board 3 can be brought closer to the semiconductor module 1 compared to when the control board 3 is fastened and fixed to the fixing plate 4 at a position that overlaps with any of the multiple output-side connection portions 13. This makes it possible to reduce the size of the fixing plate 4 in the Z direction facing the semiconductor module 1, thereby suppressing an increase in the size of the housing 5. As a result, it is possible to suppress an increase in the overall size of the power converter 100 due to an increase in the size of the housing 5.

[0072] Furthermore, in this embodiment, as described above, the fixing plate 4 is provided corresponding to each of the multiple output-side connection parts 13 and has a concave interference avoidance portion 4d that is recessed to avoid interference with the multiple output-side connection parts 13. As a result, the concave interference avoidance portion 4d prevents interference of the fixing plate 4 with the multiple output-side connection parts 13, so that the fixing plate 4 can be brought closer to the semiconductor module 1 which has the multiple output-side connection parts 13. As a result, the size of the housing 5 in the Z direction where the semiconductor module 1 and the fixing plate 4 face each other can be made smaller. This further suppresses the enlargement of the housing 5, and thus further suppresses the enlargement of the power converter 100 caused by the enlargement of the housing 5.

[0073] [Differentiation] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

[0074] For example, in the above embodiment, the fixing plate 4 (insulating plate) is shown to be positioned between the connection terminals 21 (first connection terminal) and 22 (second connection terminal) and the control board 3 so as to cover the connection terminals 21 and 22, but the present invention is not limited to this. For example, the insulating plate may be positioned to cover only one of the first connection terminal or the second connection terminal.

[0075] Furthermore, although the above embodiment shows an example in which the control board 3 is located above (towards the Z1 direction) the semiconductor module 1 and the capacitor module 2, the present invention is not limited to this. In the present invention, the control board may be located below at least one of the semiconductor module and the capacitor module.

[0076] Furthermore, although the above embodiment shows an example in which the control board 3 is not directly fixed to the housing 5 but is fixed to the housing 5 via a fixing plate 4 (insulating plate), the present invention is not limited to this. In the present invention, the control board may be fixed to both the housing and the insulating plate.

[0077] Furthermore, in the above embodiment, the housing 5 (main body portion 51 and cover member 52) is shown to be made of metal and to be conductive, but the present invention is not limited to this. In the present invention, the housing may be made of a material other than metal, such as ceramics or resin. Also, the housing may be made of a non-conductive material.

[0078] Furthermore, in the above embodiment, the fixing plate 4 (insulating plate) is shown as being positioned between the connection terminal 21 (first connection terminal) of the capacitor module 2 and the housing 5 so as to cover the connection terminal 21, but the present invention is not limited to this. In the present invention, it is not necessary to provide an insulating plate between the first connection terminal of the capacitor module and the housing.

[0079] Furthermore, although the above embodiment shows an example in which the capacitor case 23 has a recess 23a that is recessed inward toward the smoothing capacitor C side, the present invention is not limited to this. In the present invention, the capacitor case may be formed in a rectangular shape without having a recess.

[0080] Furthermore, although the above embodiment shows an example in which one of the multiple fastening holes 51a is provided at a position corresponding to the recess 23a of the capacitor case 23, the present invention is not limited to this. In the present invention, all of the multiple fastening holes may be provided at positions other than those corresponding to the recess of the capacitor case. Also, two or more fastening holes may be provided at positions corresponding to the recess of the capacitor case.

[0081] Furthermore, in the above embodiment, an example was shown in which the control terminal 11 of the semiconductor module 1 is connected to the control board 3 through an opening 4a in the fixing plate 4 (insulating plate), but the present invention is not limited to this. In the present invention, wiring for connecting the control terminal 11 of the semiconductor module 1 and the control board 3 to each other may be provided so as to bypass the insulating plate, without providing an opening in the insulating plate.

[0082] Furthermore, in the above embodiment, the fixing plate 4 (insulating plate) is shown as being positioned between the multiple output-side connection parts 13 (multiple connection parts) and the control board 3 so as to cover the multiple output-side connection parts 13, but the present invention is not limited to this. In the present invention, the insulating plate may be positioned so as to cover only the first connection terminal and the second connection terminal without covering the multiple connection parts.

[0083] Furthermore, in the above embodiment, the control board 3 is shown to be fastened and fixed to the fixing plate 4 (insulating plate) between multiple output-side connection parts 13 (multiple connection parts) in the X direction along the control board 3, but the present invention is not limited to this. In the present invention, the insulating plate and the control board may be fastened and fixed at a position that overlaps with any of the multiple connection parts.

[0084] Furthermore, in the above embodiment, the fixing plate 4 (insulating plate) is provided corresponding to each of the multiple output-side connection parts 13 (multiple connection parts) and has a recessed interference avoidance portion 4d that is recessed to avoid interference with the multiple output-side connection parts 13, but the present invention is not limited to this. In the present invention, the interference avoidance portion may be provided in common for multiple connection parts. [Explanation of Symbols]

[0085] 1. Semiconductor module 2 Capacitor Modules 3. Control board 4. Fixing plate (insulating plate) 4a opening 4d interference avoidance section 4e wall 5 cabinets 6 Conductor Wiring 11 Control terminals 13 Output side connection section 21 Connection terminal (1st connection terminal) 22 Connection terminal (second connection terminal) 23 Capacitor Case 23a Recess 51a Fastening hole 51b side wall 52a side wall 100 Power converter 200 Motor (Load) 300 Battery (Power Supply) C smoothing capacitor

Claims

1. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, a plate-shaped insulating plate made of insulating resin is provided, which is positioned to cover at least one of the first connection terminal and the second connection terminal. The device comprises conductive wiring that is electrically connected to an external load, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The semiconductor module has a connection portion that connects the conductor wiring and the semiconductor module, The power conversion device wherein the insulating plate has a recessed interference avoidance portion that is recessed to avoid interference with the connection portion.

2. The control board is positioned above the semiconductor module and the capacitor module. The power conversion device according to claim 1, wherein the insulating plate is arranged between the first connection terminal and the second connection terminal and the control board so as to cover the first connection terminal and the second connection terminal.

3. The power conversion device according to claim 1 or 2, wherein the control board is not directly fixed to the housing, but is fixed to the housing via the insulating plate.

4. The aforementioned housing is made of metal, The power conversion device according to claim 1 or 2, wherein the insulating plate is arranged between the first connection terminal of the capacitor module and the housing so as to cover the first connection terminal.

5. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, there is a plate-shaped insulating plate made of insulating resin, which is positioned to cover at least the first connection terminal, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The housing is made of metal and includes side walls that surround the capacitor module. The first connection terminal is provided at a position facing the side wall, The insulating plate has a wall portion formed to extend along the side wall between the side wall of the housing and the first connection terminal, and is positioned between the first connection terminal of the capacitor module and the housing to cover the first connection terminal, in a power conversion device.

6. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, there is a plate-shaped insulating plate made of insulating resin, which is positioned to cover at least the first connection terminal, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The housing has a plurality of fastening holes for fastening and securing the insulating plate, The capacitor module further includes a capacitor case that houses the smoothing capacitor inside, The capacitor case has a recess that is recessed inward toward the smoothing capacitor side, A power conversion device in which at least one of the plurality of fastening holes is provided at a position corresponding to the recess of the capacitor case.

7. The semiconductor module has control terminals connected to the control board, The insulating plate is formed to extend along the control board and has openings provided corresponding to the control terminals. The power conversion device according to claim 1 or 2, wherein the control terminal is connected to the control board via the opening.

8. The conductor wiring includes a plurality of the conductor wirings, The semiconductor module is provided corresponding to the plurality of conductor wirings and has a plurality of connection parts that connect the plurality of conductor wirings and the semiconductor module, The power conversion device according to claim 1 or 2, wherein the insulating plate is arranged between the plurality of connection portions and the control board so as to cover the plurality of connection portions.

9. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, a plate-shaped insulating plate made of insulating resin is provided, which is positioned to cover at least the first connection terminal. The device comprises multiple conductive wires electrically connected to an external load, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The semiconductor module is provided corresponding to the plurality of conductor wirings and has a plurality of connection parts that connect the plurality of conductor wirings and the semiconductor module. The insulating plate is positioned between the plurality of connection parts and the control board so as to cover the plurality of connection parts. The control board is configured to be fastened and fixed to the insulating plate between the plurality of connection portions in a direction along the control board, in a power conversion device.

10. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, a plate-shaped insulating plate made of insulating resin is provided, which is positioned to cover at least the first connection terminal. The device comprises multiple conductive wires electrically connected to an external load, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The semiconductor module has a connection portion that connects the conductor wiring and the semiconductor module, The insulating plate has a recessed interference avoidance portion that is recessed to avoid interference with the connection portion, and is positioned between the connection portion and the control board so as to cover the connection portion, in a power conversion device.

11. The power conversion device according to claim 1, wherein the control board is directly fixed to the insulating plate.

12. The conductor wiring includes a plurality of the conductor wirings, The semiconductor module is provided corresponding to the plurality of conductor wirings and has a plurality of connection parts that connect the plurality of conductor wirings and the semiconductor module, The power conversion device according to claim 1, wherein the insulating plate is arranged between the plurality of connection parts and the control board so as to cover the plurality of connection parts.

13. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, there is a plate-shaped insulating plate made of insulating resin, which is positioned to cover at least the first connection terminal, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The control board is configured to be fastened and fixed to the insulating plate between the plurality of connection portions in a direction along the control board, in a power conversion device.

14. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, a plate-shaped insulating plate made of insulating resin is provided, which is positioned to cover at least the first connection terminal. The device comprises multiple conductive wires electrically connected to an external load, In the direction in which the insulating plate extends, the semiconductor module and the capacitor module are arranged to be adjacent to each other. The semiconductor module is provided corresponding to the plurality of conductor wirings and has a plurality of connection parts that connect the plurality of conductor wirings and the semiconductor module. The insulating plate is provided corresponding to each of the plurality of connection parts and has a recessed interference avoidance portion that is recessed to avoid interference with the plurality of connection parts, and is positioned between the plurality of connection parts and the control board so as to cover the plurality of connection parts, in a power conversion device.

15. A semiconductor module that performs power conversion, A capacitor module having a smoothing capacitor, a first connection terminal electrically connected to the smoothing capacitor and an external power supply, and a second connection terminal electrically connected to the semiconductor module, A control board for controlling the power conversion of the semiconductor module, A housing that houses the semiconductor module, the capacitor module, and the control board, Between the capacitor module and the control board, a plate-shaped insulating plate made of insulating resin is provided, which is arranged to cover at least one of the first connection terminal and the second connection terminal. The insulating plate is formed in a substantially H-shape when viewed from a direction perpendicular to the surface of the control board, in a power conversion device.

Images