Component mounting device

Abstract

To provide a component mounting device that can simplify the procedure for positioning an electronic component at a target position.SOLUTION: On the basis of pattern design information, a mounting nozzle can hold an electronic component provided with multiple patterns on a pattern surface. A camera images the pattern surface of the electronic component, and it is possible to control the mounting nozzle and a movement mechanism of the mounting nozzle. Positional relationship information 34 that shows the positional relationship based on pattern design information between the position of a registration pattern representative point identified from at least one registration pattern selected from the multiple patterns provided on the pattern surface and the position of the positioning reference point which becomes the reference for positioning when mounting the electronic component on a component mounting spot is stored. In addition, an image obtained by imaging the pattern surface of the electronic component by the camera is acquired. The image is analyzed to determine the position of the registration pattern representative point. The positioning reference point is determined from the position of the registration pattern representative point and the positional relationship information, and the electronic component is mounted at the target position.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a component mounting device Place .

Background Art

[0002] When mounting an electronic component on a substrate, an image recognition method is known (Patent Document 1) in which a detection pattern such as an electronic component or a substrate mark is imaged in order to accurately mount it at a predetermined position and the position is recognized. In this image recognition method, the detection pattern is imaged, and the center position of the detection pattern is detected by performing matching between a reference pattern registered in advance and the detection pattern. Based on the center position of the detection pattern, the electronic component is mounted at a predetermined mounting position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When positioning an electronic component at a target position, a reference point (positioning reference point) of the electronic component to be aligned with the target position is set based on a plurality of patterns provided on the electronic component. The shape and position of this pattern are defined by pattern design information. The position of the positioning reference point is also defined based on the pattern design information.

[0005] The center position of the detected pattern, determined by image recognition of an electronic component, does not necessarily coincide with the position of the positioning reference point. Even if the center position of the detected pattern is positioned at the target position, the positioning reference point will not coincide with the target position. To make the positioning reference point coincide with the target position, the center position of the detected pattern is experimentally positioned at the target position and the component is mounted. In this state, the mounting position of the electronic component is measured. The amount of deviation between the measured mounting position and the target mounting position roughly corresponds to the amount of deviation between the center position of the detected pattern and the positioning reference point. Therefore, the amount of deviation between the center position of the detected pattern and the positioning reference point can be determined from the amount of deviation between the measured mounting position and the target mounting position. When actually mounting the electronic component, the positioning of the electronic component is performed in a way that compensates for the amount of deviation between the center position of the detected pattern and the positioning reference point.

[0006] Thus, determining the amount of deviation between the center position of the detected pattern and the position of the positioning reference point requires a complicated procedure of experimentally mounting electronic components and measuring their positions. The objective of the present invention is to simplify the procedure for positioning electronic components at the target position and to improve the alignment accuracy of component mounting equipment. Place It is about providing. [Means for solving the problem]

[0007] According to one aspect of the present invention, Based on pattern design information, a mounting nozzle capable of holding an electronic component with multiple patterns provided on its patterned surface, A camera capable of photographing the pattern surface of the aforementioned electronic component, A moving mechanism that allows the mounted nozzle to be moved between the location photographed by the camera and the location where the component is mounted, A control device capable of controlling the mounted nozzle and the moving mechanism, The camera used to capture the image image A display device that shows, From among the multiple patterns of the image displayed on the display device, at least one pattern is selected by user operation. Registration Pattern The input device to be selected as Equipped with, The control device is At least one selected from a plurality of patterns provided on the pattern surface The aforementioned A function to store positional relationship information indicating the positional relationship between the position of a representative point of a registered pattern identified from the registered pattern and the position of a positioning reference point that serves as the reference for positioning when the electronic component is mounted in the component mounting location, based on the pattern design information. The patterned surface of the electronic component was photographed with the camera. The aforementioned The function to acquire images, The function includes analyzing the aforementioned image to determine the position of the registered pattern representative point, The function involves positioning the positioning reference point, determined from the position of the registered pattern representative point obtained by analyzing the aforementioned image and the positional relationship information, at the target position of the component mounting location to mount the electronic component, and then mounting the electronic component. A function to display the image captured by the camera on the display device, A function to store the pattern selected by operating the input device as the registered pattern. It has, The control device is The system stores frequently occurring patterns among the multiple patterns provided on the aforementioned pattern surface. In a function that displays the image captured by the camera on the display device, a component mounting device is provided that displays the image on the display device in a manner that allows frequently occurring patterns to be distinguished and recognized from other patterns. [Effects of the Invention]

[0010] Since the positional relationship information between the registered pattern representative point and the position of the positioning reference point, which serves as the reference for positioning, is obtained based on the pattern design information, the positioning reference point can be positioned at the target location and the electronic component can be mounted without experimentally mounting the electronic component and measuring the positional deviation. As a result, the procedure for positioning the electronic component at the target location is simplified, and the alignment accuracy can be improved.

Brief Description of the Drawings

[0011] [Figure 1] FIG. 1 is a schematic view of a component mounting device according to the first embodiment. [Figure 2] FIG. 2 is a diagram showing the relationship between a plurality of coordinate systems. [Figure 3] FIG. 3 is a flowchart showing a procedure for obtaining position relationship information. [Figure 4] FIGS. 4A, 4B, and 4C are diagrams showing the design arrangements of a plurality of patterns on the pattern surface of an electronic component. [Figure 5] FIG. 5 is a flowchart showing the procedure by which the component mounting device according to the first embodiment mounts components. [Figure 6] FIGS. 6A and 6B are diagrams showing the pattern surface of an electronic component adsorbed by a mounting nozzle. [Figure 7] FIG. 7 is a diagram of the pattern surface of an electronic component to be handled by a component mounting device according to the second embodiment. [Figure 8] FIG. 8 is a diagram of the pattern surface of an electronic component to be handled by a component mounting device according to the third embodiment. [Figure 9] FIG. 9 is a diagram of the pattern surface of an electronic component to be handled by a component mounting device according to a modification of the third embodiment. [Figure 10] FIG. 10 is a schematic front view of a part of a component mounting device according to the fourth embodiment.

Modes for Carrying Out the Invention

[0012] [First Embodiment] The component mounting device according to the first embodiment will be described with reference to FIGS. 1 to 6B. FIG. 1 is a schematic view of a component mounting device 10 according to the first embodiment. The component mounting device 10 picks up an electronic component 40 from a component supply location 20 and positions and mounts it at a target position on a substrate 29 disposed at a component mounting location 27.

[0013] An XYZ Cartesian coordinate system is defined with the positive direction of the Z axis being vertically upward. The moving mechanism 15 includes an X-direction moving mechanism 15X, a Y-direction moving mechanism 15Y, and a Z-direction moving mechanism 15Z. The Y-direction moving mechanism 15Y includes a guide rail parallel to the Y direction and moves the X-direction moving mechanism 15X in the Y direction under the control of the control device 30. The X-direction moving mechanism 15X includes a guide rail parallel to the X direction and moves the Z-direction moving mechanism 15Z in the X direction under the control of the control device 30. The Z-direction moving mechanism 15Z moves (raises and lowers) the mounted nozzle 11 in the Z direction under the control of the control device 30. In other words, the moving mechanism 15 moves the mounted nozzle 11 between the component supply location 20, the location photographed by the camera 25, and the component mounting location 27 by moving the mounted nozzle 11 in the X, Y, and Z directions.

[0014] Next, the operation of the component mounting device 10 at the component supply location 20 will be described. Multiple electronic components 40, which are separated into individual pieces by dicing a wafer 21 attached to a dicing tape 22, are supplied to a component supply location 20. Each electronic component 40 has multiple patterns 41, such as external connection terminals like pads, on one side, which is the patterned surface. The side opposite to the patterned surface (hereinafter referred to as the back surface) is attached to the dicing tape 22, and the patterned surface of the electronic component 40 is exposed.

[0015] The electronic component 40 is pushed upward from below with a needle-shaped, elongated jig called a needle, and each pattern surface of the electronic component 40 is sucked up by the inversion nozzle 12, causing the electronic component 40 to be attracted to the inversion nozzle 12. By inverting the inversion nozzle 12, the back surface of the electronic component 40 is turned upward. In this state, the mounting nozzle 11 sucks up the back surface of the electronic component 40, and by stopping the suction by the inversion nozzle 12, the electronic component 40 is attracted to the mounting nozzle 11. With the electronic component 40 attracted to the mounting nozzle 11, the pattern surface of the electronic component 40 is facing downward (negative direction of the Z axis). These operations are performed under the control of the control device 30.

[0016] Electronic components 40 may be supplied to the component supply location 20 using an electronic component tray or a parts feeder (automatic parts supply device). When supplying electronic components 40 using an electronic component tray, the electronic components 40 contained in the electronic component tray are sucked up by the reversing nozzle 12 without using a needle. When supplying electronic components 40 using a parts feeder, the electronic components 40, which are arranged so that the pattern side faces downward, are sucked up by the mounting nozzle 11 without going through the reversing nozzle 12.

[0017] Next, the operation of the component mounting device 10 at the position of camera 25 will be described. Camera 25 is fixed facing upwards (positive Z-axis direction). With the mounted nozzle 11 adsorbing the electronic component 40, the electronic component 40 is placed within the field of view of camera 25. Camera 25 captures the patterned surface of the electronic component 40. The captured image is input to the control device 30.

[0018] Next, the operation of the component mounting device 10 at the component mounting location 27 will be described. A stage 28 is located at the component mounting location 27, and the substrate 29 on which the electronic components 40 are to be mounted is held on the stage 28. Multiple target positions on the component mounting surface of the substrate 29 are defined for mounting the electronic components 40. For example, positioning marks are formed on the component mounting surface of the substrate 29, and the target positions are defined as relative positions to the positioning marks.

[0019] For example, the electronic component 40 is bonded to the substrate 29 by an adhesive layer provided on the component mounting surface of the substrate 29, with the patterned surface having multiple patterns 41 facing the substrate 29. Next, an example of the process after mounting multiple electronic components 40 on the substrate 29 will be described.

[0020] For example, after bonding multiple electronic components 40 to the component mounting surface of a substrate 29, a semiconductor substrate with a circuit pattern formed on it can be placed on top of the multiple electronic components 40, thereby transferring the multiple electronic components 40 from the substrate 29 to the semiconductor substrate. Since the multiple electronic components 40 are positioned and bonded to the substrate 29, positioning the substrate 29 and the semiconductor substrate will position and fix the multiple electronic components 40 to the semiconductor substrate.

[0021] In addition, positioning marks or patterns may be formed at each of the multiple target positions on the component mounting surface of the substrate 29. For example, an external connection terminal with solder applied to it may be provided on the pattern surface of the electronic component 40, and the electronic component 40 may be fixed to the substrate 29 by placing the external connection terminal on a land provided on the component mounting surface of the substrate 29 and performing a solder reflow process.

[0022] The control device 30 controls the mounting nozzle 11, the reversing nozzle 12, the moving mechanism 15, and the stage 28. The display device 31 displays various information as images or characters under the control of the control device 30. Various information necessary for the component mounting process is input from the input device 32. For example, a liquid crystal display or an organic EL display can be used as the display device 31. For example, a mouse, touch panel, touchpad, other pointing devices, or a keyboard can be used as the input device 32.

[0023] Next, with reference to Figure 2, the meaning of "position" as used in this specification will be explained. Figure 2 shows the relationships between multiple coordinate systems. For the component mounting device 10, an XYZ Cartesian coordinate system is defined as shown in Figure 1. An xy Cartesian coordinate system is defined on the pattern surface of the electronic component 40 attracted to the mounting nozzle 11, with the position of the mounting nozzle 11 as the reference point. The xy Cartesian coordinate system moves relative to the XYZ Cartesian coordinate system as the mounting nozzle 11 moves.

[0024] In addition to the xy Cartesian coordinate system, a uv Cartesian coordinate system is defined on the pattern surface of the electronic component 40. The uv Cartesian coordinate system is used in pattern design information that defines the shape and position of multiple patterns provided on the pattern surface. In other words, the uv Cartesian coordinate system is fixed with respect to the electronic component 40. When the adsorption position of the electronic component 40 by the mounting nozzle 11 changes, the relative positional relationship between the xy coordinates and the uv coordinates changes.

[0025] A positioning reference point 46 is defined on the pattern surface of the electronic component 40 to position it at the target location of the component mounting area 27 (Figure 1). For example, the overall geometric center of multiple patterns defined on the pattern surface can be used as the positioning reference point 46. The uv coordinates of the positioning reference point 46 are determined during pattern design. To position the electronic component 40 at the target location of the component mounting area 27 (Figure 1), the xy coordinates of the positioning reference point 46 must be determined.

[0026] Next, with reference to Figures 3 to 4C, the positional relationship information stored in the control device 30 of the component mounting device 10 (Figure 1) according to the first embodiment will be described. Figure 3 is a flowchart showing the procedure for obtaining positional relationship information. Of the multiple steps shown in Figure 3, steps SA1, SA2, SA3, SA5, and SA8 enclosed in thick lines are executed under the control of the control device 30 (Figure 1). The processing of steps SA4, SA6, and SA7 enclosed in thin lines is performed by the user. Figures 4A, 4B, and 4C show the design arrangement of multiple patterns on the pattern surface of the electronic component 40.

[0027] First, the electronic component 40 is picked up from the component supply location 20 by the mounting nozzle 11. The electronic component 40, which is held in place by the mounting nozzle 11, is moved into the field of view of the camera 25, and the patterned surface of the electronic component 40 is photographed. The control device 30 acquires an image of the patterned surface from the camera 25 (step SA2) and displays the acquired image on the display device 31 (step SA3).

[0028] For example, the shape and position of multiple patterns 41 are defined on the pattern surface of the electronic component 40, as shown in Figure 4A. Multiple patterns are formed on the pattern surface of the electronic component 40 as shown in Figure 4A. The multiple patterns 41 include, for example, regular polygons, circles, and elongated strip shapes.

[0029] The user looks at the display device 31 and selects two patterns from the multiple patterns 41 (step SA4). The patterns selected by the user are called registered patterns. For example, as shown in Figure 4A, two registered patterns, the first registered pattern 41A and the second registered pattern 41B, are selected.

[0030] It is preferable to select two registration patterns that are as far apart as possible from each other, with the geometric center of the pattern surface in between. Furthermore, it is preferable to select registration patterns with shapes that allow for highly accurate determination of the position of their geometric center by performing image analysis of the pattern, such as circles or regular polygons.

[0031] Furthermore, as shown in Figure 4B, the user specifies a first pattern match area 42A containing a first registered pattern 41A and several other patterns 41, and a second pattern match area 42B containing a second registered pattern 41B and several other patterns 41 (step SA4). It is preferable to specify areas with distinctive patterns in terms of arrangement and shape as the first pattern match area 42A and the second pattern match area 42B. The control device 30 stores the registered patterns (for example, position information of the registered patterns) and stores the figures consisting of the patterns in the first pattern match area 42A and the second pattern match area 42B as templates for pattern matching (step SA5).

[0032] After determining the first registered pattern 41A and the second registered pattern 41B, the user calculates the position of the registered pattern representative point 45 (Figure 4C) using the pattern design information 50 (step SA6). Next, the method for calculating the position of the registered pattern representative point 45 will be explained with reference to Figure 4C.

[0033] As shown in Figure 4C, the center positions (uv coordinates) of the first registered pattern 41A and the second registered pattern 41B are calculated from the pattern design information 50 (Figure 3). The midpoint of the line segment with these two center positions as its endpoints is adopted as the registered pattern representative point 45. The position (uv coordinates) of the registered pattern representative point 45 is calculated from the center positions of the first registered pattern 41A and the second registered pattern 41B. The position (uv coordinates) of the positioning reference point 46, which serves as the reference when positioning the electronic component 40 to the target position in the component mounting location 27, is predetermined. As an example, the center of the pattern surface of the electronic component 40 is adopted as the positioning reference point 46.

[0034] The user calculates the positional relationship between the registered pattern representative point 45 and the positioning reference point 46 based on the pattern design information 50 (step SA7). The information representing the positional relationship between the registered pattern representative point 45 and the positioning reference point 46 is referred to as positional relationship information 34. As an example, positional relationship information 34 is defined by the offset amount OFS in the u-axis direction and the v-axis direction from the position of the registered pattern representative point 45 to the position of the positioning reference point 46.

[0035] The user inputs the obtained positional relationship information 34 into the input device 32 (Figure 1). The control device 30 acquires the positional relationship information 34 input into the input device 32 and stores it in memory (step SA8).

[0036] Next, the procedure for the component mounting device 10 according to the first embodiment to mount components will be described with reference to the drawings from Figures 5 to 6B. Figure 5 is a flowchart showing the procedure for the component mounting device 10 according to the first embodiment to mount components. Each step shown in Figure 5 is performed under the control of the control device 30 (Figure 1). Figures 6A and 6B show the patterned surface of the electronic component 40 that has been attracted by the mounting nozzle 11.

[0037] First, the mounted nozzle 11 (Figure 1) picks up the electronic component 40 from the component supply location 20 (step SB1). The control device 30 moves the electronic component 40 picked up by the mounted nozzle 11 into the field of view of the camera 25 (Figure 1) and acquires an image of the pattern surface of the electronic component 40 (step SB2). Next, the control device 30 performs image analysis to determine the position of the registered pattern representative point 45 (step SB3).

[0038] Referring to Figure 6A, an example of the procedure in step SB3 is described. An electronic component 40 is adsorbed onto the mounting nozzle 11. Pattern matching is performed using the template of the first pattern match area 42A to detect the first pattern match area 42A. This allows for rough position detection of the first registered pattern 41A. Once the first pattern match area 42A is detected, the first registered pattern 41A within it is detected. Once the first registered pattern 41A is detected, the position (x and y coordinates) of its center point is determined by analyzing the image of the first registered pattern 41A. Similarly, the position (x and y coordinates) of the center point of the second registered pattern 41B is determined.

[0039] The midpoint of the line segment connecting the center point of the first registration pattern 41A and the center point of the second registration pattern 41B is adopted as the representative registration pattern point 45. The position (x and y coordinates) of the representative registration pattern point 45 is calculated from the positions of the center points of the first registration pattern 41A and the second registration pattern 41B.

[0040] Next, the position (x and y coordinates) of the positioning reference point 46 is calculated based on the position of the registered pattern representative point 45 and the positional relationship information 34 (step SB4).

[0041] Referring to Figure 6B, an example of the procedure in step SB4 is described. The positional relationship information 34 includes the offset amount OFS from the position of the registered pattern representative point 45 to the position of the positioning reference point 46. The position of the positioning reference point 46 can be calculated using the position of the registered pattern representative point 45 and the offset amount OFS.

[0042] Once the position of the positioning reference point 46 is determined, the control device 30 positions the positioning reference point 46 at the target position of the component mounting location 27 (Figure 1) and mounts the electronic component 40 onto the substrate 29 (step SB5).

[0043] Next, we will describe the excellent effects of the first embodiment. In the conventional method, the electronic component 40 is experimentally mounted on the substrate 29 in order to determine the amount of deviation between the center position of the pattern to be detected on the pattern surface of the electronic component 40 and the position of the positioning reference point. Then, by measuring the positional relationship between the position of the experimentally mounted electronic component 40 and the actual target position, the positional relationship between the registered pattern representative point 45 and the positioning reference point 46 is determined.

[0044] In contrast, in the first embodiment, positional relationship information 34, which shows the positional relationship between the position of the registered pattern representative point 45 (Figure 4C) and the position of the positioning reference point 46 (Figure 4C), is calculated using pattern design information 50 (Figure 3) (step SA7). Therefore, positional relationship information 34 can be obtained without performing the complicated procedure of experimentally mounting the electronic component 40 onto the substrate 29.

[0045] Furthermore, in the method of experimentally mounting the electronic component 40 onto the substrate 29, mechanical variations in mounting position and variations associated with measuring the mounting position are included in the positional relationship information. In particular, if no pattern is formed on the back surface of the electronic component 40, the position of the electronic component 40 is measured by analyzing an image of its outer shape. The outer shape of the electronic component 40 also includes variations in position during dicing. As a result, various errors are included in the positional relationship information. If errors are included in the positional relationship information 34, the mounting position accuracy of the electronic component 40 will decrease.

[0046] In contrast, in the first embodiment, positional relationship information 34 is obtained using pattern design information 50 (Figure 3), which improves the accuracy of the positional relationship information 34. As a result, the mounting position accuracy of the electronic component 40 can be improved.

[0047] Next, a modified example of the first embodiment will be described. In the first embodiment, when the electronic component 40 is picked up by the mounting nozzle 11, the positioning in the rotational direction around an axis parallel to the Z direction (Figure 1) is not mentioned. In this modified example, the case in which the rotational positioning is not completed when the electronic component 40 is picked up by the mounting nozzle 11 is described. In this case, it is preferable to provide the mounting nozzle 11 with a mechanism for aligning the rotational position of the electronic component 40. The control device 30 determines the rotational position from the center position of the first registration pattern 41A and the center position of the second registration pattern 41B shown in Figure 6A. After that, it is preferable to rotate the electronic component 40 so that the determined rotational position matches the target position.

[0048] Furthermore, the control device 30 stores frequently occurring patterns 41 from among the multiple patterns 41 provided on the pattern surface of the electronic component 40. For example, circular or regular polygonal patterns may be used as frequently occurring patterns. Circular and regular polygonal patterns result in smaller errors in determining the center position through image analysis. When the control device 30 displays the image of the pattern surface of the electronic component 40 on the display device 31 in step SA3 (Figure 3), it is preferable to display the frequently occurring patterns in a way that allows them to be distinguished and recognized from other patterns. For example, frequently occurring patterns may be highlighted compared to other patterns.

[0049] In step SA4 (Figure 3), the user selects a registration pattern from among the frequently occurring patterns. Because frequently occurring patterns can be recognized as distinct from other patterns, the user can easily perform the registration process for registration patterns.

[0050] [Second Example] Next, a component mounting device according to the second embodiment will be described with reference to Figure 7. The following description will omit explanations of components common to the component mounting device according to the first embodiment, which was described with reference to Figures 1 through 6B.

[0051] Figure 7 is a diagram of the pattern surface of the electronic component 40 to be handled by the component mounting device according to the second embodiment. In the first embodiment (Figure 6A), two registered patterns, a first registered pattern 41A and a second registered pattern 41B, are registered. In contrast, in the second embodiment, only one first registered pattern 41A is registered. To detect the first registered pattern 41A, for example, a characteristic pattern match area including the first registered pattern 41A is defined. The position of this pattern match area is detected, and then the first registered pattern 41A within the pattern match area is detected. The registered pattern representative point 45 is determined based on the position of one first registered pattern 41A. For example, the center point of the first registered pattern 41A is adopted as the registered pattern representative point 45. Similar to the first embodiment, the offset amount OFS from the registered pattern representative point 45 to the positioning reference point 46 is defined as positional relationship information 34 (Figures 3 and 5).

[0052] Next, we will describe the excellent effects of the second embodiment. In the second embodiment, as in the first embodiment, positional relationship information 34 can be acquired without performing the complicated procedure of experimentally mounting the electronic component 40 onto the substrate 29 (Figure 1). Furthermore, as in the first embodiment, the accuracy of the positional relationship information 34 can be improved, thereby improving the mounting position accuracy of the electronic component 40.

[0053] In the second embodiment, the position of the representative point 45 of the registered pattern is determined from the image analysis results of one first registered pattern 41A. Therefore, compared to the first embodiment, in which the position of the representative point 45 of the registered pattern is determined from the image analysis results of two patterns, the first registered pattern 41A and the second registered pattern 41B, the position accuracy is slightly inferior. However, since it is not necessary to perform image analysis of two registered patterns, the excellent effect of shortening the processing time is obtained. It is advisable to decide whether to use one or two registered patterns by comparing the required position accuracy with the need to shorten the processing time. In addition, three or more registered patterns may be used to improve position accuracy.

[0054] [Third Embodiment] Next, a component mounting device according to the third embodiment will be described with reference to Figure 8. The following description will omit explanations of components common to the component mounting device according to the first embodiment, which was described with reference to Figures 1 to 6B.

[0055] Figure 8 is a diagram of the pattern surface of the electronic component 40 to be handled by the component mounting device according to the third embodiment. In the first embodiment (Figures 4C and 6A), the first registered pattern 41A is detected in the first pattern match area 42A, and the second registered pattern 41B is detected in the second pattern match area 42B, and the position of the registered pattern representative point 45 is determined based on the detected positions. In contrast, in the third embodiment, the position of the registered pattern representative point 45 is calculated by detecting the first pattern match area 42A and the second pattern match area 42B without detecting the first registered pattern 41A and the second registered pattern 41B.

[0056] For example, the positional relationship between the first pattern match area 42A and the first registered pattern 41A, and the positional relationship between the second pattern match area 42B and the second registered pattern 41B are pre-registered. The positions of the first registered pattern 41A and the second registered pattern 41B can be calculated from the detection results of the first pattern match area 42A and the second pattern match area 42B and the pre-registered positional relationships.

[0057] In the third embodiment, in step SB3 (Figure 5), the position of the first pattern match area 42A is determined from the results of pattern matching using the template of the first pattern match area 42A. Similarly, the position of the second pattern match area 42B is determined.

[0058] Once the positions of the first pattern match area 42A and the second pattern match area 42B are determined, the positions of the first registered pattern 41A and the second registered pattern 41B are calculated using the previously registered positional relationships. From the positions of the first registered pattern 41A and the second registered pattern 41B, the position (x and y coordinates) of the registered pattern representative point 45 is calculated. Then, similar to the first embodiment (Figure 5), the position (x and y coordinates) of the positioning reference point 46 is calculated from the position of the registered pattern representative point 45 and the positional relationship information 34.

[0059] Next, we will describe the excellent effects of the third embodiment. In the third embodiment, as in the first embodiment, positional relationship information 34 can be acquired without performing the complicated procedure of experimentally mounting the electronic component 40 onto the substrate 29 (Figure 1). Furthermore, as in the first embodiment, the accuracy of the positional relationship information 34 can be improved, thereby improving the mounting position accuracy of the electronic component 40.

[0060] In the first embodiment (Figure 6A), after detecting the first pattern match area 42A, the center position of the first registered pattern 41A is determined by performing image analysis of the first registered pattern 41A. In contrast, in the third embodiment, after detecting the first pattern match area 42A and the second pattern match area 42B, the positions of the first registered pattern 41A and the second registered pattern 41B are calculated without performing image analysis of the first registered pattern 41A and the second registered pattern 41B. This provides the excellent effect of reducing the calculation time when mounting the electronic component 40.

[0061] Next, a modified example of the third embodiment will be described with reference to Figure 9. Figure 9 is a diagram of the pattern surface of the electronic component 40 to be handled by the component mounting device according to the modified example of the third embodiment.

[0062] In the third embodiment (Figure 8), the position of the registered pattern representative point 45 is determined using two pattern match areas, the first pattern match area 42A and the second pattern match area 42B. In contrast, in the modified example shown in Figure 9, the position of the registered pattern representative point 45 is determined using only one first pattern match area 42A. The geometric center 42AC of the first pattern match area 42A is adopted as the registered pattern representative point 45.

[0063] As shown in the modified example of the third embodiment in Figure 9, the position of the registered pattern representative point 45 may be determined based on only one first pattern match area 42A.

[0064] [Fourth embodiment] Next, a component mounting device according to the fourth embodiment will be described with reference to Figure 10. The following description will omit explanations of components common to the component mounting device according to the first embodiment, which was described with reference to Figures 1 through 6B.

[0065] Figure 10 is a schematic front view of a part of the component mounting device according to the fourth embodiment. In the first embodiment (Figure 1), after the mounting nozzle 11 picks up the electronic component 40 at the component supply location 20, the X-direction movement mechanism 15X is operated to move the electronic component 40 into the field of view of the camera 25. In contrast, in the fourth embodiment, the X-direction movement mechanism 15X is not involved in the operation of moving the electronic component 40 picked up by the mounting nozzle 11 into the field of view of the camera 25.

[0066] As shown in Figure 10, the nozzle support member 16 is supported by the X-direction movement mechanism 15X so as to be movable in the X direction. A rotating member 18 is rotatably supported at the lower end of the nozzle support member 16 via a rotating mechanism 15R. The rotational axis of the rotating member 18 is inclined with respect to the Z-axis direction. Multiple mounted nozzles 11 are each attached to the rotating member 18 via the Z-direction movement mechanism 15Z.

[0067] A camera 25 is fixed to the nozzle support member 16. When the rotating member 18 is rotated, each of the multiple mounting nozzles 11 performs a circular motion, moving from a position facing the wafer 21 at the component supply location 20, through a position facing the camera 25, and returning to a position facing the wafer 21. When the Z-direction movement mechanism 15Z is operated while the mounting nozzle 11 is facing the wafer 21, the mounting nozzle 11 moves in the Z direction, and the electronic component 40 can be picked up.

[0068] After picking up the electronic component 40, the rotation mechanism 15R is operated to bring the picked-up electronic component 40 into the field of view of the camera 25. At this time, it is not necessary to operate the X-direction movement mechanism 15X. After all of the mounting nozzles 11 have picked up the electronic component 40, the X-direction movement mechanism 15X is operated to move the nozzle support member 16 to the component mounting location 27 (Figure 1). At this stage, the patterned surfaces of the electronic components 40 that have passed through the field of view of the camera 25 due to the operation of the rotation mechanism 15R have been photographed, while the patterned surfaces of the remaining electronic components 40 have not yet been photographed.

[0069] After moving the nozzle support member 16 to the component mounting location 27, the rotation mechanism 15R is operated to rotate the rotation member 18 by a certain angle, and the Z-direction movement mechanism 15Z is operated to raise and lower the mounting nozzle 11. By repeating these operations, the electronic component 40 is mounted on the substrate 29 (Figure 1) at the component mounting location 27. During the mounting of the electronic component 40, the operation of the rotation mechanism 15R causes the electronic component 40, whose pattern surface has not yet been photographed, to pass within the field of view of the camera 25, and the pattern surface is photographed.

[0070] Next, we will describe the excellent effects of the fourth embodiment. In the fourth embodiment, as in the first embodiment, the procedure for mounting the electronic components 40 can be simplified and the mounting position accuracy of the electronic components 40 can be improved. Furthermore, in the fourth embodiment, during the period when one mounting nozzle 11 is picking up an electronic component 40, or during the period when an electronic component 40 picked up by one mounting nozzle 11 is being mounted on the substrate 29, an image of the pattern surface of an electronic component 40 picked up by another mounting nozzle 11 can be acquired. This makes it possible to increase the throughput of the electronic component mounting process.

[0071] The embodiments described above are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Similar effects and benefits from similar configurations in multiple embodiments will not be mentioned sequentially for each embodiment. Furthermore, the present invention is not limited to the embodiments described above. For example, it will be obvious to those skilled in the art that various modifications, improvements, and combinations are possible.

[0072] Based on the embodiments described herein, the following inventions are disclosed. <1> Based on pattern design information, a mounting nozzle capable of holding an electronic component with multiple patterns provided on its patterned surface, A camera capable of photographing the pattern surface of the aforementioned electronic component, A moving mechanism that allows the mounted nozzle to be moved between the location photographed by the camera and the location where the component is mounted, A control device capable of controlling the mounted nozzle and the moving mechanism Equipped with, The control device is A function for storing positional relationship information that indicates the positional relationship based on the pattern design information between the position of a registered pattern representative point identified from at least one registered pattern selected from a plurality of patterns provided on the pattern surface, and the position of a positioning reference point that serves as a reference for positioning when the electronic component is mounted at the component mounting location. A function to acquire an image of the patterned surface of the electronic component captured by the camera, The function includes analyzing the aforementioned image to determine the position of the registered pattern representative point, The function involves positioning the positioning reference point, determined from the position of the registered pattern representative point obtained by analyzing the aforementioned image and the positional relationship information, at the target position of the component mounting location to mount the electronic component. A component mounting device having the following features.

[0073] <2> Multiple patterns are registered as the aforementioned registration patterns. The representative point of the registered pattern is the geometric center of the plurality of registered patterns. <1> The component mounting device described above.

[0074] <3> A template for the pattern matching area, including the aforementioned registered pattern, is stored. The control device performs pattern matching processing on the image captured by the camera using the template, and determines the position of the registered pattern representative point based on the pattern matching result. <1> or <2> The component mounting device described above.

[0075] <4> A display device that displays the image captured by the aforementioned camera, An input device that selects at least one pattern from a plurality of patterns of the image displayed on the display device as the registered pattern by user operation. Furthermore, The control device further, A function to display the image captured by the camera on the display device, A function to store the pattern selected by operating the input device as the registered pattern. has <1> ~ <3> A component mounting device as described in any one of the following.

[0076] <5> The control device is The system stores frequently occurring patterns among the multiple patterns provided on the aforementioned pattern surface. In the function of displaying the images captured by the camera on the display device, frequently occurring patterns are displayed on the display device in a manner that allows them to be distinguished and recognized from other patterns. <4> The component mounting device described above.

[0077] <6> Positional relationship information is obtained in advance, which shows the positional relationship between the position of a registered pattern representative point, which is identified from at least one registered pattern selected from a plurality of patterns provided on the pattern surface of an electronic component based on pattern design information, and the position of a positioning reference point, which is the reference for positioning when the electronic component is mounted in the component mounting location, based on the pattern design information. The aforementioned electronic component is held by a mounting nozzle, An image of the patterned surface of the electronic component held in the mounting nozzle is acquired. By analyzing the aforementioned image, the position of the registered pattern representative point is determined. A component mounting method comprising mounting an electronic component by aligning the positioning reference point, which is determined from the position of the registered pattern representative point obtained by analyzing the aforementioned image and the positional relationship information, with the target position of the component mounting location.

[0078] <7> Multiple patterns are registered as the aforementioned registration patterns. The representative point of the registered pattern is the geometric center of the plurality of registered patterns. <6> The component mounting method described above.

[0079] <8> When determining the position of the registered pattern representative point, a pattern matching process is performed on the acquired image using a pre-prepared template, and the position of the registered pattern representative point is determined based on the result of the pattern matching. <6> or <7> The component mounting method described above.

[0080] <9> The user selects at least one pattern from the multiple patterns on the pattern surface as the registered pattern. Using the pattern design information, the positional relationship information between the position of the registered pattern representative point obtained by analyzing the image and the position of the positioning reference point is determined. <6> ~ <8> The component mounting method described in one of the following.

[0081] <10> By acquiring an image of the patterned surface of an electronic component with multiple patterns formed on it, The aforementioned image is displayed, and the user is instructed to select a registered pattern from the multiple patterns, and to specify a pattern matching area that includes some of the multiple patterns. The system stores information identifying the registered pattern selected by the user, and information identifying the pattern matching area specified by the user. Based on pattern design information defining the shapes and positions of multiple patterns on the pattern surface, and information identifying the registered pattern, the position of the representative point of the registered pattern is calculated. Based on the pattern design information, the positional relationship between the positioning reference point, which serves as the positioning reference for aligning the electronic component to the target position where it should be mounted, and the position of the registered pattern representative point is calculated. A method for acquiring positional relationship information, which acquires and stores positional relationship information between the positioning reference point and the registered pattern representative point. [Explanation of Symbols]

[0082] 10. Component mounting device 11. Mounted nozzles 12 Reversing nozzle 15 Moving mechanism 15R Rotation Mechanism 15X X direction movement mechanism 15Y Y direction movement mechanism 15Z Z direction movement mechanism 16 Nozzle support member 18 Rotating member 20 Parts supply locations 21 wafers 22 Dicing Tapes 25 Cameras 27. Component mounting locations 28 stages 29 circuit boards 30 Control device 31 Display device 32 Input devices 34. Location information 40 Electronic Components 41 patterns 41A First Registration Pattern 41B Second Registration Pattern 42A First Pattern Match Area 42AC Geometric Center 42B Second Pattern Match Area 42BC Geometric Center 45 Representative points for registered patterns 46 Positioning reference point 50 Pattern Design Information

Claims

1. Based on pattern design information, a mounting nozzle capable of holding an electronic component with multiple patterns provided on its patterned surface, A camera capable of photographing the pattern surface of the aforementioned electronic component, A moving mechanism that allows the mounted nozzle to be moved between the location photographed by the camera and the location where the component is mounted, A control device capable of controlling the mounted nozzle and the moving mechanism, A display device that displays images captured by the aforementioned camera, An input device that selects at least one pattern from a plurality of patterns of the image displayed on the display device as a registered pattern by user operation. Equipped with, The control device is A function for storing positional relationship information, which indicates the positional relationship based on the pattern design information, between the position of a registered pattern representative point identified from at least one registered pattern selected from a plurality of patterns provided on the pattern surface, and the position of a positioning reference point that serves as a reference for positioning when the electronic component is mounted at the component mounting location. A function to acquire the image of the patterned surface of the electronic component captured by the camera, The function includes analyzing the aforementioned image to determine the position of the registered pattern representative point, The function involves positioning the positioning reference point, determined from the position of the registered pattern representative point obtained by analyzing the aforementioned image and the positional relationship information, at the target position of the component mounting location to mount the electronic component, and then mounting the electronic component. A function to display the image captured by the camera on the display device, A function to store the pattern selected by operating the input device as the registered pattern. It has, The control device is The system stores frequently occurring patterns among the multiple patterns provided on the aforementioned pattern surface. A component mounting device that displays images captured by the camera on the display device in a manner that allows frequently occurring patterns to be distinguished and recognized from other patterns.

2. Multiple patterns are registered as the aforementioned registration patterns. The component mounting device according to claim 1, wherein the representative point of the registered pattern is the geometric center of a plurality of the registered patterns.

Images