Cutting device and method for manufacturing cut products

Abstract

Reduce the time required for the cutting process. [Solution] The cutting device includes a camera that moves along the table without stopping and individually photographs multiple first marks attached to an object to be cut on the table, a signal output unit that outputs a pulse signal corresponding to the distance the camera moves, a counter that counts the number of pulses in the pulse signal, and a control unit. During initial setup, the camera, while stationary relative to the table, individually photographs multiple second marks attached to a plate on the table and generates a first image. While moving along the table without stopping, when the count value counted by the counter matches one of the multiple set values, the camera individually photographs multiple second marks attached to the plate on the table and generates a second image. The control unit changes the multiple set values ​​according to the amount of displacement of the second marks in the first and second images.

Description

[Technical Field]

[0001] The present invention relates to a cutting device and a method for manufacturing cut products. [Background technology]

[0002] Patent Document 1 discloses a cutting apparatus that cuts a sealed substrate in two mutually orthogonal directions to form individual pieces. The sealed substrate has multiple alignment marks, and the cutting table on which the sealed substrate is placed has a reference mark. The apparatus then moves a camera in one direction relative to the sealed substrate and images each alignment mark, and based on the captured alignment marks and reference mark, alignment is performed between the sealed substrate and the cutting mechanism in one direction and in a direction orthogonal to the other direction. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-152993 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] In Patent Document 1, a camera is moved along the direction of the alignment marks applied to the object to be cut (a sealed substrate), and each mark is photographed individually. Conventionally, in this type of cutting apparatus, each mark has been photographed by the camera while it is temporarily stopped above each mark. However, as the number of marks to be photographed increases, the cumulative time spent stopping for photography becomes longer, which in turn increases the time required for the cutting process and the cycle time for manufacturing the cut products.

[0005] The object of the present invention is to provide a cutting device that enables a reduction in the time required for the cutting process, and a method for manufacturing cut products using the same. [Means for solving the problem]

[0006] A cutting apparatus according to a certain aspect of the present invention comprises a shooting mechanism, a cutting mechanism, and a control unit. The shooting mechanism comprises a table, a camera, a signal output unit, and a counter. A cutting object marked with a plurality of first marks is placed on the table. The camera moves relative to the table without stopping and individually photographs the plurality of first marks marked on the cutting object on the table. The signal output unit outputs a pulse signal by generating pulses with a number of pulses corresponding to the relative movement distance of the camera while the camera is moving relative to the table. The counter counts the number of pulses in the pulse signal output from the signal output unit. The camera is configured to take a photograph when the count value counted by the counter matches one of a plurality of set values. The control unit determines the cutting position of the cutting object based on the images of the plurality of first marks taken by the camera. The cutting mechanism cuts the cutting object on the table according to the cutting position. During initial setup, when a plurality of set values ​​are adjusted before photographing the plurality of first marks, a plate marked with a plurality of second marks is placed on the table. During initial setup, the camera generates a first image by individually photographing multiple secondary marks attached to plates on the table while stationary relative to the table. Also during initial setup, the camera generates a second image by individually photographing multiple secondary marks attached to plates on the table while moving without stationary relative to the table, when the count value of the counter matches one of several set values. Also during initial setup, the control unit changes several set values ​​according to the amount of displacement of the secondary marks in the first and second images.

[0007] A method for manufacturing a cut product according to another aspect of the present invention includes manufacturing a cut product using the above-described cutting apparatus. [Effects of the Invention]

[0008] According to the present invention, the time required for the cutting process can be shortened. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view showing a cutting device according to one embodiment. [Figure 2] This is a plan view of an object to be cut (package substrate) according to one embodiment. [Figure 3] This is a block diagram schematically showing the hardware configuration of a computer according to one embodiment. [Figure 4] A side view showing the configuration around a cutting table according to one embodiment. [Figure 5] This is a block diagram showing the configuration of a shooting mechanism according to one embodiment. [Figure 6] This is a comparison diagram of the first pulse signal and the second pulse signal. [Figure 7] This figure shows an example of an image taken by a camera. [Figure 8] This is a comparison diagram of the first and second pulse signals when a delay occurs in signal transmission. [Figure 9] A flowchart illustrating the process for adjusting the counter setting value during initial setup according to one embodiment. [Figure 10] This is a plan view of an adjustment plate according to one embodiment. [Figure 11] This figure illustrates the amount of displacement in the position of the second mark in the first and second images. [Figure 12] This figure shows an example of the settings before and after adjustment. [Figure 13A] A diagram illustrating the first and second methods for calculating the adjustment amount for the counter's set value. [Figure 13B] A diagram illustrating a third method for calculating the adjustment amount for the counter's set value. [Figure 13C] A diagram illustrating a fourth method for calculating the adjustment amount for the counter's setting value. [Modes for carrying out the invention]

[0010] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding.

[0011] [1. Structure] <1-1. Overall configuration of the cutting device> Figure 1 is a schematic plan view of a cutting device 1 according to this embodiment. The cutting device 1 is configured to cut a package substrate (an example of an object to be cut) into multiple electronic components (an example of cut parts). In a package substrate, a substrate on which a semiconductor chip is fixed is resin-sealed. An example of a substrate on which a semiconductor chip is fixed is a lead frame. Note that the object to be cut does not necessarily have to be a package substrate; for example, it may be a substrate that is not resin-sealed (including a wafer). Also, the object to be cut may be a substrate on which a semiconductor chip is not fixed. In this case, the cut parts may be, for example, a substrate on which wiring is printed.

[0012] Examples of package substrates include SOP (Small Outline Package) substrates, BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates. The package substrate may be one in which leads protrude outward from the resin-sealed portion, or it may be one in which leads do not protrude from the resin-sealed portion.

[0013] In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 separates the package substrate P1 into multiple electronic components P2. Figure 2 is a plan view of the package substrate P1. In this example, the package substrate P1 is a semiconductor chip fixedly supported on a lead frame F1 and encapsulated in resin. In this embodiment, both sides of the package substrate P1 are molded, and one of these sides is referred to as the first molded surface, and the other side is referred to as the second molded surface (the surface visible in Figure 2). Note that the object to be cut may be a package substrate P1 in which only one side is molded. In this case, for example, the aforementioned first molded surface corresponds to the unmolded surface.

[0014] In this example, the lead frame F1 is roughly rectangular in shape. The lead frame F1 has two ends F11 and F12 that extend in the longitudinal direction, and a central part F13 that also extends in the longitudinal direction, roughly midway between the two ends F11 and F12. No semiconductor chips are mounted on the two ends F11, F12, and the central part F13, and they are not resin-sealed. The area between the ends F11 and the central part F13 is sealed with resin, and the area between the ends F12 and the central part F13 is also sealed with resin. Multiple first marks M1 are provided on the two ends F11, F12, and the central part F13. The first marks M1 are marks for determining the cutting position of the package substrate P1, and are sometimes called alignment marks. In each of the two ends F11, F12, and the central part F13, the first marks M1 are arranged at equal intervals from end to end along the longitudinal direction. The first mark M1 is typically a mark of a predetermined shape formed on the lead frame F1, but is not limited to this, and may also be a design of a predetermined shape printed on the lead frame F1. In the example in Figure 2, the first mark M1 is a cross-shaped mark.

[0015] As shown in Figure 1, the cutting device 1 includes a cutting module B1 and an inspection / storage module B2. The cutting module B1 is configured to produce multiple electronic components P2 by cutting a package substrate P1. The inspection / storage module B2 is configured to inspect each of the produced electronic components P2 and then store them in a tray. In the cutting device 1, each module is detachable and interchangeable with respect to the other modules.

[0016] The cutting module B1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5 (an example of a table), a cutting mechanism 6, and a transport unit 7.

[0017] The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing them out one by one from a magazine 30 that contains multiple package substrates P1. At this time, the package substrates P1 are positioned with the second molded surface facing upwards.

[0018] The positioning unit 4 positions the package substrate P1, which has been extruded from the substrate supply unit 3, by placing it on the rail unit 4a. After that, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P1 to be cut. In this example, a cutting device 1 with a twin-table configuration having two cutting tables 5 is shown. The cutting table 5 includes a holding member 5a and a rotating mechanism 5b. The package substrate P1, transported by the positioning unit 4, is placed on the holding member 5a. At this time, the holding member 5a holds the package substrate P1 by suction from below. The rotating mechanism 5b is connected to the holding member 5a below it and rotates the holding member 5a in the horizontal plane about the Z axis in the figure. Below the rotating mechanism 5b is a moving mechanism 50. The moving mechanism 50 moves the holding member 5a together with the rotating mechanism 5b along the Y axis in the figure.

[0020] The cutting mechanism 6 cuts the package substrate P1 on the cutting table 5, thereby separating the package substrate P1 into multiple electronic components P2. In this example, a twin-configuration cutting device 1 having two cutting mechanisms 6 is shown. The cutting mechanisms 6 are movable along the X and Z axes in the figure. The cutting device 1 may also be a single-configuration having one cutting mechanism 6.

[0021] The cutting mechanism 6 includes a blade 6a, a rotating shaft 6c extending along the X-axis, and a spindle portion 6d that rotates the rotating shaft 6c. The blade 6a is, for example, a disc-shaped blade with a cutting edge on its outer circumference. The central portion of the blade 6a is connected to the end of the rotating shaft 6c. In the cutting mechanism 6, the spindle portion 6d rotates the rotating shaft 6c at high speed, thereby causing the blade 6a to rotate around the rotating shaft 6c at high speed. As a result, the blade 6a can cut the package substrate P1, separating the package substrate P1 into multiple electronic components P2. Note that the cutting mechanism 6 is not limited to a configuration having a blade; for example, it may have a laser device that cuts the package substrate P1 by irradiating it with laser light.

[0022] The cutting mechanism 6 is equipped with nozzles for cutting fluid, cooling water, and cleaning water (none of which are shown). The cutting fluid nozzles spray cutting fluid towards the high-speed rotating blade 6a. The cooling water nozzles spray cooling water. The cleaning water nozzles spray cleaning water to wash away cutting debris, etc. If the cutting mechanism 6 has a laser device, cooling water is not required.

[0023] After the cutting table 5 picks up the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 2 to confirm its position. At this time, the first position confirmation camera 2 confirms the positions of multiple first marks M1 attached to the package substrate P1 on the cutting table 5. The position information of the multiple first marks M1 is used to determine the cutting line (cutting position) of the package substrate P1. The control unit 71 determines the cutting line of the package substrate P1 based on the images of the multiple first marks M1 taken by the first position confirmation camera 2. The cutting mechanism 6 cuts the package substrate P1 on the cutting table 5 according to the cutting line determined according to the positions of the multiple first marks M1.

[0024] After confirmation by the first position confirmation camera 2, the cutting table 5 moves along the Y-axis in the figure toward the cutting mechanism 6. After the cutting table 5 moves below the cutting mechanism 6, the cutting table 5 and the cutting mechanism 6 are aligned, and then the package substrate P1 is cut by moving the cutting table 5 and the cutting mechanism 6 relative to each other. Each time the package substrate P1 is cut by the blade 6a of the cutting mechanism 6, the package substrate P1 is photographed by the second position confirmation camera 8 attached to the cutting mechanism 6. Based on the captured image, the second position confirmation camera 8 confirms, for example, the cut position and the cut width of the package substrate P1.

[0025] After the cutting of the package substrate P1 is complete, the cutting table 5 moves away from the cutting mechanism 6 along the Y-axis in the figure, while holding the multiple individual electronic components P2. During this movement process, the first cleaner 21 cleans and dries the upper surfaces (second mold surfaces) of the multiple electronic components P2. This cleaning may be performed, for example, by directly spraying cleaning water onto the upper surfaces of the electronic components P2, or by supplying cleaning water to the upper surfaces of the electronic components P2 via a brush or the like. In the cutting device 1, there are two first cleaners 21 arranged in the X-axis direction in the figure, but the number of first cleaners 21 is not limited to this.

[0026] The transport unit 7 picks up the multiple electronic components P2 held on the cutting table 5 from above and transports the multiple electronic components P2 to the flipper 11 of the inspection and storage module B2. During this transport process, the second cleaner 22 cleans and dries the underside (first molded surface) of the multiple electronic components P2. This cleaning may be performed, for example, by directly spraying cleaning water onto the underside of the electronic components P2, or by supplying cleaning water to the underside of the electronic components P2 via a brush or the like.

[0027] The inspection and storage module B2 mainly includes a flipper 11, a first optical inspection camera 12, a second optical inspection camera 13, an index table 14, a transfer unit 15, a tray for good products 16a, and a tray for defective products 16b. The first optical inspection camera 12 may be provided in the cutting module B1.

[0028] The flipper 11 receives multiple electronic components P2 from the transport unit 7 for optical inspection of the multiple electronic components P2 and holds the received multiple electronic components P2. The flipper 11 is movable along the X-axis in the figure. The flipper 11 can also be inverted vertically. The flipper is provided with a holding member that holds the multiple electronic components P2 by attracting them.

[0029] The first optical inspection camera 12 and the second optical inspection camera 13 each capture images of the first and second molded surfaces of multiple electronic components P2, respectively. Based on the images generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections (visual inspections) of the appearance of the multiple electronic components P2 are performed. Examples of visual inspections include inspection of the size of the electronic components P2, inspection of the size of the terminals, and inspection of the distance between adjacent terminals. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is positioned near the flipper 11 to capture images upwards.

[0030] The transport unit 7 stops moving along the X-axis above the first optical inspection camera 12. With the transport unit 7 stopped moving along the X-axis, the first optical inspection camera 12 photographs the first molded surfaces of the multiple electronic components P2 held from above by the transport unit 7 from below. Subsequently, the transport unit 7 places the multiple electronic components P2 on the holding member of the flipper 11. After the holding member has attracted the multiple electronic components P2, the flipper 11 inverts upside down. Then, the flipper 11 moves above the second optical inspection camera 13, and the second molded surfaces of the multiple electronic components P2 held from above by the holding member are photographed from below by the second optical inspection camera 13.

[0031] Referring again to Figure 1, the index table 14 contains multiple inspected electronic components P2. The index table 14 is movable along the Y-axis in the figure. The flipper 11 places the multiple inspected electronic components P2 into the index table 14.

[0032] The transfer unit 15 holds the multiple electronic components P2 arranged on the index table 14 from above and transfers them to trays. Each electronic component P2 is sorted into "good" or "defective" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. Each of the good component trays 16a and the defective component trays 16b is movable along the Y axis. Based on the sorting results, the transfer unit 15 transfers each electronic component P2 to either the good component tray 16a or the defective component tray 16b. That is, good components are stored in the good component tray 16a, and defective components are stored in the defective component tray 16b. When each of the good component trays 16a and the defective component trays 16b is filled with electronic components P2, it is replaced with a new tray.

[0033] The cutting device 1 further includes a computer 70 and a monitor 75. The monitor 75 is configured to display an image. The monitor 75 is comprised of a display device such as a liquid crystal monitor or an organic EL (Electro-Luminescence) monitor.

[0034] The computer 70 controls, for example, the operation of each part of the cutting module B1 and the inspection / storage module B2. The computer 70 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting table 5, moving mechanism 50, first position confirmation camera 2, cutting mechanism 6, second position confirmation camera 8, transport unit 7, flipper 11, first optical inspection camera 12, second optical inspection camera 13, index table 14, transfer unit 15, good product tray 16a, defective product tray 16b, and monitor 75.

[0035] <1-2. Computer Configuration> Figure 3 is a schematic diagram showing the hardware configuration of computer 70. As shown in Figure 3, computer 70 includes a control unit 71, an input / output interface (I / F) 72, a reception unit 73, and a storage unit 74, and each component is electrically connected via a bus.

[0036] The control unit 71 includes a CPU (Central Processing Unit) 71a, RAM (Random Access Memory) 71b, and ROM (Read Only Memory) 71c, etc. The control unit 71 is configured to control each component included in the cutting device 1 according to information processing.

[0037] The input / output interface 72 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output interface 72 is used to transmit data from the computer 70 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 70. The reception unit 73 is configured to receive instructions from the user. The reception unit 73 consists of, for example, some or all of a touch panel, keyboard, mouse, and microphone.

[0038] The memory unit 74 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The memory unit 74 stores, for example, a control program 74a. Various functions of the cutting device 1 are realized when the control program 74a is executed by the control unit 71. The control unit 71 loads the control program 74a into the RAM 71b and controls each component by having the CPU 71a interpret and execute it.

[0039] <1-3. Configuration around the cutting table> Figure 4 is a side view showing the configuration around the cutting table 5. As already mentioned, the package substrate P1 is placed on the holding member 5a included in the cutting table 5. The holding member 5a is connected to the rotation mechanism 5b. The moving mechanism 50 is positioned below the cutting table 5 and moves the cutting table 5 along the Y axis.

[0040] The moving mechanism 50 includes a guide 51, a slider 52, and a motor 53 (drive source). The guide 51 extends in the Y-axis direction. The slider 52 is mounted on the guide 51 so as to be movable along the guide 51 in the Y-axis direction. The motor 53 drives the slider 52 to move along the guide 51 in the Y-axis direction. A cutting table 5 is connected to the upper surface of the slider 52, and the cutting table 5 moves together with the slider 52. Therefore, the motor 53 can move the cutting table 5 in the Y-axis direction. For example, the motor 53 may be implemented as a servo motor, and the guide 51 may be implemented as a ball screw connected to the output shaft of the servo motor and rotated by the servo motor. In this case, the slider 52 is moved in the Y-axis direction by the servo motor rotating the guide 51 around its axis while preventing the slider 52 from rotating around the axis of the guide 51.

[0041] A detection head 61 (an example of a signal output unit) is fixed to the underside of the slider 52, and the detection head 61 moves together with the slider 52. Therefore, when the motor 53 moves the cutting table 5 in the Y-axis direction, the detection head 61 also moves by the same amount in the Y-axis direction. A scale 62 is positioned below the detection head 61. The scale 62 extends in the Y-axis direction and has markings in the Y-axis direction. The detection head 61 and the scale 62 constitute a linear scale (also called a linear encoder) 60.

[0042] The scale 62 has a plurality of through holes 62a arranged along the Y-axis. The through holes 62a are formed repeatedly at a constant pitch (interval) p1. Here, the pitch p1 is specifically the distance between the left ends of two adjacent through holes 62a in Figure 4. The detection head 61 includes a light emitter and a light receiver. The light emitter emits light downwards continuously or at minute time intervals while the detection head 61 is driven by the motor 53 to move along the Y-axis. The light from the light emitter is reflected by the portion of the scale 62 between the through holes 62a when the detection head 61 is directly above that portion and is received by the light receiver. On the other hand, the light from the light emitter passes through the scale 62 when the detection head 61 is directly above the through holes 62a and is not received by the light receiver. The detection head 61 outputs a high-level voltage as a pulse signal during the light-receiving period when the photodetector is receiving light, and a low-level voltage lower than the high-level voltage during the non-light-receiving period when the photodetector is not receiving light. Therefore, when the detection head 61 moves in the Y-axis direction, since multiple through-holes 62a are arranged along the Y-axis direction, the detection head 61 repeatedly outputs pulses that constitute the pulse signal. The number of pulses in the pulse signal generated in this way indicates the distance the detection head 61 moves along the scale 62, i.e., the distance the cutting table 5 moves in the Y-axis direction. The number of pulses in the pulse signal output from the detection head 61 is equal to the number of voltage rises (switching from low-level voltage to high-level voltage) or voltage falls (switching from high-level voltage to low-level voltage). When the detection head 61 moves by 1 pitch p1 in the Y-axis direction, one pulse is output. Therefore, if the number of pulses in the pulse signal output from the detection head 61 is n1, it means that the cutting table 5 has moved by a distance of n1*p1. "*" indicates multiplication. In this example, the linear scale 60 is shown as an optical configuration, but it is not limited to this, and may also be configured as a magnetic or electromagnetic induction type, for example. Furthermore, the detection head 61 may output a low-level voltage during the light-receiving period and a high-level voltage during the non-light-receiving period.

[0043] <1-4. Configuration of the imaging mechanism> Figure 5 is a block diagram showing the configuration of the imaging mechanism 100 included in the cutting device 1. The imaging mechanism 100 includes the first position confirmation camera 2 described above, a computer 70, a detection head 61, and a motor 53. Hereinafter, the first position confirmation camera 2 will be abbreviated and simply referred to as camera 2.

[0044] Camera 2 is positioned above the cutting table 5 and photographs from above the multiple first marks M1 attached to the package substrate P1 placed on the cutting table 5. The package substrate P1 often undergoes deformation such as warping, stretching, or shrinking due to its shape and material. For example, a thin plate-shaped lead frame F1 with many openings is prone to significant deformation. When the package substrate P1 deforms, the position where the cutting mechanism 6 should cut the package substrate P1 (cutting line) deviates from the design cut line (cutting line of an undeformed package substrate P1). Therefore, it is important for the control unit 71 to grasp the state of deformation and determine the correct cutting line according to the state of deformation. Camera 2 individually photographs the multiple first marks M1 attached to the package substrate P1 in order to grasp the state of deformation of the package substrate P1. The control unit 71 grasps the state of deformation of the package substrate P1 and determines the cutting line by confirming the position of each first mark M1 based on each captured image.

[0045] Camera 2 photographs multiple first marks M1 in an on-the-fly manner. On-the-fly photography means that the camera photographs while moving without stopping relative to the subject. Hereafter, this type of photography will be referred to as on-the-fly photography. In this embodiment, camera 2 first moves to a starting point Sp (located in the lower right of Figure 2) which is on the extension of the end F11 of the package substrate P1. Next, camera 2 moves from there along the end F11 of the package substrate P1 in the longitudinal direction without stopping (see arrow A1 in Figure 2) and photographs multiple first marks M1 arranged on the end F11 in sequence. Subsequently, camera 2 moves in the short direction relative to the package substrate P1 (see arrow A2 in Figure 2) and proceeds to another starting point Sp (located in the upper center of Figure 2) which is on the extension of the central part F13. Next, camera 2 moves along the central part F13 of the package substrate P1 without stopping in the longitudinal direction (see arrow A3 in Figure 2), sequentially photographing the multiple first marks M1 arranged in the central part F13. Next, camera 2 moves along the package substrate P1 in the short direction (see arrow A4 in Figure 2), and proceeds to another starting point Sp (located in the lower left in Figure 2) on the extension of the end F12. Next, camera 2 moves along the end F12 of the package substrate P1 without stopping in the longitudinal direction (see arrow A5 in Figure 2), sequentially photographing the multiple first marks M1 arranged in the end F12. The starting points Sp are predetermined, and in this embodiment, there are three for one package substrate P1.

[0046] Conventionally, when photographing alignment marks such as the first mark M1, the camera is controlled to pause above each mark, take a picture in that position, and then move to the next mark. However, as the number of marks to be photographed increases, the cumulative time spent stopping for photography becomes longer. Consequently, the cutting process takes longer, increasing the cycle time for manufacturing the cut products. In this embodiment, on-the-fly photography is performed. As a result, there is no need to stop the camera for photography, and the total time required for photography is shortened. Therefore, even if there are many first marks M1, the time required for the cutting process of the package substrate P1, which is the object to be cut, can be shortened.

[0047] In this embodiment, the longitudinal movement of the camera 2 relative to the package substrate P1 (see arrows A1, A3, A5) is achieved by the Y-axis movement of the cutting table 5 on which the package substrate P1 is placed. That is, the control unit 71 controls the motor 53 to move the cutting table 5 in the Y-axis direction, thereby moving the camera 2 relatively to the package substrate P1 in the longitudinal direction (Y-axis direction). As a result, the camera 2 moves along the paths shown by arrows A1, A3, A5 without stopping relative to the cutting table 5, and individually photographs the multiple first marks M1 applied to the package substrate P1 on the cutting table 5. On the other hand, the short-axis movement of the camera 2 relative to the package substrate P1 (see arrows A2, A4) is achieved by the control unit 71 controlling a movement mechanism (not shown) to move the camera 2 in the X-axis direction. The movement of the camera 2 in the X-axis direction can be controlled, for example, using a linear encoder.

[0048] Camera 2 is configured to take pictures with a short exposure time to prevent blurring of on-the-fly images. Preferably, camera 2 is controlled so that the shooting is completed before it moves a distance equivalent to one pixel of the image being captured. Furthermore, it is preferable to use a strong light source such as a strobe to enable shooting with a short exposure time.

[0049] As shown in Figure 5, the imaging mechanism 100 further includes a frequency divider 81 and a counter 82. The frequency divider 81 divides the pulse signal output from the detection head 61 and outputs a pulse signal in a lower frequency band. The counter 82 counts the number of pulses in the pulse signal divided by the frequency divider 81. Hereinafter, the pulse signal output from the detection head 61 and input to the frequency divider 81 will be called the first pulse signal, and the pulse signal output from the frequency divider 81 and input to the counter 82 will be called the second pulse signal. The frequency divider 81 converts the first pulse signal into the second pulse signal. If the frequency division ratio is a1 (an integer of 2 or more), the frequency divider 81 generates the second pulse signal by raising or lowering the output voltage once each time it detects the rising or falling edge of the input voltage of the first pulse signal a1 times. Figure 6 is a comparison diagram of the first pulse signal and the second pulse signal. As shown in the figure, the frequency divider 81 generates and outputs one pulse of the second pulse signal each time a1 pulses of the first pulse signal are input. Therefore, the counter 82 counts the number of pulses n1 (= a1 * n2) of the first pulse signal output from the detection head 61, with a1 pulses as one unit, by counting the number of pulses n2 of the second pulse signal output from the frequency divider 81. Note that Figure 6 shows an example where a1 = 4 for simplicity of explanation, but in reality, the value of the frequency division ratio a1 can be set to a value of the order of hundreds, thousands, or more.

[0050] The control unit 71 controls the motor 53 to move the camera 2 in the Y-axis direction relative to the cutting table 5. During this time, the detection head 61 generates pulses with a number of pulses corresponding to the relative Y-axis movement distance of the camera 2 relative to the cutting table 5, and outputs a first pulse signal. The frequency divider 81 generates a second pulse signal by dividing the first pulse signal by the division ratio a1, and the counter 82 counts the number of pulses n2 (=n1 / a1) of the second pulse signal. " / " indicates division. The counter 82 determines that the count value it has counted (the number of pulses n2 of the second pulse signal) is equal to one of several set values ​​C. m If it matches one of the ones inside, a shooting command is sent to camera 2. m is an integer greater than or equal to 1, and indicates the order of shooting, C mis the set value corresponding to the m-th shooting. The count value counted by the counter 82 is reset to 0 each time the camera 2 moves to each movement start point Sp. Set value C m (Set of set values C1, C2, ···) is set for each straight line when the camera 2 moves in the Y-axis direction with respect to the package substrate P1 (that is, for each path of arrows A1, A3, A5).

[0051] When the camera 2 receives a shooting command from the counter 82, it immediately performs shooting. That is, the camera 2 is configured to perform the m-th shooting when the count value counted by the counter 82 becomes the set value C m That is, the camera 2 moves from the movement start point Sp (when m = 1) or the previous shooting position (when m ≥ 2) with respect to the cutting table 5 by a distance of (C m − C m―1 ) * a1 * p1 in the Y-axis direction and is configured to perform the m-th shooting. However, C0 = 0. The distance (C m − C m―1 ) * a1 * p1 corresponds to the distance d0 from the movement start point Sp of the camera 2 to the first mark M1 shot for the first time (see Fig. 2) when m = 1. The distance (C m − C m―1 ) * a1 * p1 corresponds to the distance d1 from the first mark M1 shot for the (m - 1)-th time to the first mark M1 shot for the m-th time (see Fig. 2) when m ≥ 2. In this embodiment, since the first marks M1 are arranged at equal intervals along the longitudinal direction of the package substrate P1, the distance d1 is constant.

[0052] After the camera 2 moves the distance d0 from the movement start point Sp to the first mark M1 shot for the first time with respect to the cutting table 5, it performs the first shooting without stopping. Thereafter, each time the camera 2 moves the distance d1 to the next first mark M1, it performs shooting without stopping. To achieve this, the set value C that determines the timing of the m-th shooting mHowever, these are set in advance according to the distances d0 and d1. Specifically, the user registers the specifications of the package substrate P1 to be cut in advance in the computer 70. The registration of the specifications of the package substrate P1 may be performed separately from the registration of the specifications of the adjustment plate 9 (step S1 described later), but if the registration items are common, they may be performed together. In this embodiment, the registration items at this time include the distances d0 and d1. When the user inputs the values ​​of d0 and d1, the control unit 71 sets the set value C m The set value C is calculated based on the following equations (1) and (2). The control unit 71 then sets the calculated set value C. m The set of setting values ​​C1, C2, ... is set in the memory of counter 82. Alternatively, the user may directly input the values ​​of C1, C2, ... individually, instead of or in addition to inputting the values ​​of d0 and d1 as part of the specifications of the package board P1. Or, a list of multiple sets of C1, C2, ... corresponding to multiple types of objects to be cut may be stored in the memory unit 74 in advance, and the user may select an appropriate one from this list as part of the specifications of the package board P1. If m=1, C m =d0 / (a1*p1)···(1) If m ≥ 2, C m =d1 / (a1*p1)+C m―1 ...(2)

[0053] As described above, while camera 2 moves along the Y-axis without stopping relative to the cutting table 5, the count value counted by counter 82 reaches the set value C mWhen this happens, the mth image is taken. In this way, camera 2 individually photographs each of the multiple first marks M1. The images taken by camera 2 are immediately transmitted from camera 2 to computer 70 after taking the images. Figure 7 shows an example of an image taken by camera 2. This image has a pre-set reference position E11 (for example, the center of the image) where the first mark M1 will be visible if the package substrate P1 is not deformed from its reference shape. The control unit 71 performs image processing (matching processing, etc.) on each image taken by camera 2 to identify the position E12 of the first mark M1 in each image and calculates the amount of deviation of the identified position E12 from the reference position E11 (for example, the amount of deviation in the X-axis direction and the Y-axis direction). Based on the amount of deviation calculated for all first marks M1, the control unit 71 identifies the amount of deformation of the package substrate P1 and determines the cutting line. The amount of deviation of the first mark M1 at position E12 from the reference position E11 can be calculated in units of distance by, for example, identifying the number of pixels corresponding to the deviation in the image, and then multiplying the number of pixels by a predetermined coefficient b (μm / pix). The predetermined coefficient b is set in advance according to the performance (resolution, etc.) and settings (focal length, etc.) of camera 2.

[0054] In this embodiment, camera 2 is controlled to start accelerating from a starting point Sp relative to the cutting table 5, and to continue moving at a constant speed v once it reaches a predetermined speed v. The periods of the first and second pulse signals gradually shorten during acceleration and become constant when the constant speed v is reached (see Figure 6). If camera 2 is not moving at a constant speed relative to the cutting table 5, for example, the speed of camera 2 will vary before and after passing / photographing each first mark M1, which can complicate the control of processes related to on-the-fly photography. Therefore, in this embodiment, from the viewpoint of simplifying the control of processes related to on-the-fly photography, camera 2 is controlled to photograph each first mark M1 individually while moving at a constant speed relative to the cutting table 5. As a way to achieve this, for example, the distance d0 can be set to be sufficiently long so that acceleration is completed by the time camera 2 reaches the first mark M1 that is photographed for the first time from the starting point Sp. Alternatively, if the distance d0 is set to be shorter than this, the camera 2 may be controlled not to photograph the first mark M1 until it moves at a constant speed v relative to the cutting table 5 (or, even if it is photographed, the image will not be used in the process of understanding the deformation state of the package substrate P1 and determining the cutting line). The control unit 71 can monitor and control the speed of the camera 2 relative to the cutting table 5 based on the rotational speed information of the motor 53.

[0055] [2. Adjusting the counter settings] As described above, multiple first marks M1 are photographed to understand the deformation state of the package substrate P1 and to determine the cutting line. To achieve this objective, multiple first marks M1 must be photographed precisely at the moment when the position E12 of the first marks M1 aligns with the reference position E11, provided there is no deformation in the package substrate P1. Otherwise, the amount of deviation of the position E12 of the first marks M1 from the reference position E11 in the captured image will reflect not only the effect of deformation but also the effect of timing discrepancies in the photography. The above setting value C m This needs to be pre-configured so that the shooting takes place precisely at this timing.

[0056] Incidentally, before camera 2 takes an image, the signal is transmitted sequentially from the detection head 61 to the frequency divider 81, from the frequency divider 81 to the counter 82, and from the counter 82 to the camera 2. At this time, various hardware-dependent delays related to signal transmission can occur, such as processing delays within the equipment and propagation delays between equipment due to cable length. In particular, the delay amount from when the first pulse signal is input to the frequency divider 81 until the frequency divider 81 outputs the second pulse signal is large. Also, for example, if there are multiple frequency dividers 81, there will be individual differences in the amount of delay. Figure 8 is a comparison diagram of the first and second pulse signals when a delay occurs in signal transmission. Figure 8 shows the delay that occurred between the output of the detection head 61 and the input to the counter 82. In addition, although not shown in Figure 8, delays may also occur in the counter 82 and camera 2. Equations (1) and (2) above are set to the ideal value C in the case where there is no delay in signal transmission. m This is the formula for finding the set value C. m If on-the-fly shooting is performed without adjusting after calculating based on the above equations (1) and (2), the camera 2 will have passed the intended shooting position by a distance equivalent to the signal transmission delay time before taking the picture. In this embodiment, in order to eliminate such errors, the signal transmission delay time is taken into consideration, and the set value C m The frequency divider 81 is pre-calibrated. The frequency divider 81 may perform processing other than frequency division on the first pulse signal. If the frequency divider 81 performs processing other than frequency division, the delay between the input of the first pulse signal to the frequency divider 81 and the output of the second pulse signal may become even larger.

[0057] The following describes the setting value C of counter 82, referring to Figure 9. m This section explains the initial setup process for adjusting (calibrating) the system. Initial setup, in this context, refers to setting multiple setting values ​​C before photographing multiple first mark M1s. mThis refers to the process of adjusting the (set of setting values ​​C1, C2, ...). Initial settings are adjusted, for example, when the cutting device 1 is manufactured, when hardware components included in the cutting device 1 (especially components included in the imaging mechanism 100) are changed / repaired / replaced, when the type of object to be cut is changed, etc., setting value C m This is performed as needed in various situations where adjustment is required. First, in step S1, the setting value C before adjustment is set. m The settings are configured. The control unit 71 receives input from the user for predetermined registration items (including the values ​​of d0 and d1) related to the specifications of the adjustment plate 9.

[0058] Figure 10 is a plan view of the adjustment plate 9. The adjustment plate 9 is roughly rectangular in shape, and its outline roughly coincides with that of the lead frame F1 included in the package substrate P1. However, the adjustment plate 9 differs from that of the lead frame F1 in thickness and material, and is constructed to prevent deformation such as warping, stretching, or shrinking. The adjustment plate 9 has two ends 91 and 92 that extend in the longitudinal direction, and a central part 93 that also extends in the longitudinal direction, roughly midway between the two ends 91 and 92. The two ends 91 and 92 and the central part 93 are configured to overlap the two ends F11, F12 and the central part F13 of the package substrate P1, respectively, when the adjustment plate 9 and the package substrate P1 are superimposed with their outlines aligned. Multiple second marks M2 are provided on the two ends 91 and 92 and the central part 93. At both ends 91, 92 and the central part 93, the second marks M2 are arranged at equal intervals from end to end along the longitudinal direction. The second marks M2, like the first marks M1, are typically markings of a predetermined shape formed on the adjustment plate 9, but are not limited to this, and may be patterns of a predetermined shape printed on the adjustment plate 9. In the example of Figure 10, the second marks M2 are cross-shaped markings, like the first marks M1. In this embodiment, the second marks M2 are arranged in the same way as the first marks M1 so that they overlap the first marks M1 when the adjustment plate 9 and the package substrate P1 are superimposed with their outlines aligned. That is, in this embodiment, the arrangement of the first marks M1 and the second marks M2 is configured to coincide. When multiple second marks M2 are applied to a plate as described above, this plate can be used as the adjustment plate 9. Therefore, for example, one of the multiple package substrates P1 cut by the cutting device 1 (however, limited to those that are not substantially deformed) can be used as the adjustment plate 9.

[0059] The pre-adjustment setting value C is set in step S1. mThis is a setting value for determining the timing of the imaging of the second mark M2 in the subsequent steps S3 and S4. Furthermore, the distances d0 and d1 related to the adjustment plate 9, input in step S1, are defined in the same way as the package substrate P1 (see Figure 10). That is, d0 corresponds to the distance d0 from the camera 2's starting point Sp to the second mark M2 that is first imaged, and d1 corresponds to the distance from the previously imaged second mark M2 to the next imaged second mark M2. The control unit 71 sets the setting value C based on the values ​​of d0 and d1 input by the user and the above-described equations (1) and (2). m (Setting values ​​C1, C2, ...) are calculated, and the calculated setting value C m Store this value in the memory of counter 82. Setting value C m This is set for each path of arrows A1, A3, and A5. Step S1 is executed only if the specifications of the adjustment plate 9 have not been registered; if they have already been registered, it can be skipped.

[0060] In the following step S2, the user places an adjustment plate 9 (an example of a plate) in place of the package substrate P1 at the position where the package substrate P1 is set on the cutting table 5. More specifically, the adjustment plate 9 is placed on the holding member 5a of the cutting table 5.

[0061] In the following step S3, the control unit 71 controls the motor 53 to move the camera 2 in the Y-axis direction relative to the cutting table 5 (more precisely, along the paths of arrows A1, A3, and A5). During this time, the control unit 71 also causes the camera 2 to sequentially photograph the multiple second marks M2 attached to the adjustment plate 9 on the cutting table 5. This photography is not on-the-fly, but is performed with the camera 2 stopped relative to the cutting table 5 above each of the second marks M2 that are the subjects. The control unit 71 directly acquires the first pulse signal output from the detection head 61 without passing it through the frequency divider 81 (i.e., acquires it in a manner that minimizes signal transmission delay) and monitors it. As shown in Figure 5, the detection head 61 is also configured to output the first pulse signal to the computer 70. The control unit 71 counts the number of pulses n1 of the first pulse signal directly acquired from the detection head 61 and controls the camera 2 to stop above the second marks M2 based on that count value.

[0062] More specifically, the control unit 71 first positions the camera 2 at the starting point Sp. Then, it drives the motor 53 to move the camera 2 in the Y-axis direction relative to the cutting table 5. The control unit 71 counts the number of pulses n1 of the first pulse signal and calculates the count value a1*C m When this happens (i.e., when camera 2 has moved above the second mark M2), the motor 53 is stopped, and camera 2 is stopped relative to the cutting table 5. In this state, the control unit 71 issues a shooting command to camera 2, either via the counter 82 or directly, to take the mth photograph of the second mark M2. Upon receiving the shooting command, camera 2 immediately takes a photograph and produces the first image I1 m This generates the first image I1 captured by camera 2. m The first image I1 is transmitted from camera 2 to computer 70 immediately after capture. The control unit 71 receives the first image I1 from camera 2. mUpon receiving the signal, the motor 53 is driven to resume the movement of the camera 2 in the Y-axis direction relative to the cutting table 5. The control unit 71 causes the camera 2 to repeatedly perform the above-described movement, stopping, and capturing until all of the second marks M2 have been captured. In step S3, the above process is performed for each path of arrows A1, A3, and A5. The count value of the number of pulses n1 of the first pulse signal counted by the control unit 71 is reset to 0 each time the camera 2 is positioned at each movement start point Sp.

[0063] In step S3, as described above, camera 2 is stopped relative to the cutting table 5 and individually photographs multiple second marks M2 attached to the adjustment plate 9 on the cutting table 5. This results in multiple photographs and multiple first images I1 m This is generated. Each first image I1 m In principle, one second mark M2 is captured in each image. (First image I1) m The camera 2 is captured with its movement relative to the cutting table 5 stopped, based on the number of pulses n1 of the first pulse signal directly acquired by the control unit 71 from the detection head 61. Therefore, the first image I1 m The position of the second mark M2 as seen in the image remains almost constant from a predetermined reference position (for example, the center of the image).

[0064] In this embodiment, step S3 is performed repeatedly multiple times. That is, camera 2 repeats the movement along the path of arrows A1 to A5 I1 times (I1 is an integer of 2 or more; for example, I1=3), and during that time, for each of the multiple second marks M2 (for each second mark M2), the first image I1 m Each image is taken individually. This is to eliminate the effects of variations between each shot and to improve the accuracy of the adjustment (calibration) performed in step S5.

[0065] In the following step S4, the control unit 71 causes the camera 2 to sequentially photograph the multiple second marks M2 attached to the adjustment plate 9 on the cutting table 5 in an on-the-fly manner. That is, the control unit 71 controls the motor 53 to move the camera 2 in the Y-axis direction relative to the cutting table 5 (more precisely, along the paths of arrows A1, A3, A5) without stopping, causing the camera 2 to sequentially photograph the multiple second marks M2. In step S4, the shooting command to the camera 2 is set by the count value counted by the counter 82, which is one of the multiple set values ​​C set in step S1. m Each time it matches any of the inside, it is taken from counter 82.

[0066] More specifically, the control unit 71 first positions the camera 2 at the starting point Sp. Then, it drives the motor 53 to move the camera 2 in the Y-axis direction relative to the cutting table 5. Meanwhile, the counter 82 sets the count value it has counted to the set value C. m When this happens, a shooting command is issued to camera 2 to take the mth photograph of the second mark M2. While the counter 82 has issued the shooting command and camera 2 is taking the photograph, the control unit 71 continues to move camera 2 in the Y-axis direction relative to the cutting table 5 without stopping the motor 53. Upon receiving the shooting command, camera 2 immediately takes the photograph and produces the second image I2 m This generates the second image I2 captured by camera 2. m The image is transmitted from camera 2 to computer 70 immediately after it is taken. Counter 82 causes camera 2 to repeatedly take pictures while it is moving until all of the second marks M2 have been photographed. In step S4, the above process is performed for each path of arrows A1, A3, and A5. The count value counted by counter 82 is reset to 0 each time camera 2 is positioned at each starting point Sp.

[0067] In step S4, as described above, camera 2 moves relative to the cutting table 5 without stopping, and the count value counted by counter 82 is set to one of several set values ​​C. mIf one of them matches, multiple second marks M2 attached to the adjustment plate 9 on the cutting table 5 are photographed individually. This results in multiple photographs and multiple second images I2. m This is generated. Each second image I2 m In principle, one second mark M2 can be captured in each image. Second image I2 m The second image I2 is captured while moving camera 2 relative to the cutting table 5 without stopping, based on the count value counted by counter 82. m The position of the second mark in the image is prone to shifting from a predetermined reference position (for example, the center of the image). This shift is generally due to a delay in signal transmission.

[0068] In step S4, camera 2 is moved along the same path and at the same speed as when the first mark M1 attached to the package substrate P1 was photographed on the fly. Therefore, in step S4 as well, camera 2 is controlled to photograph the second mark M2 individually while moving at a constant speed v relative to the cutting table 5. In this case, for example, the speed of camera 2 is stabilized before and after passing / photographing the second mark M2, making it easier to control the processing related to on-the-fly photography.

[0069] In this embodiment, step S4 is also executed multiple times. That is, camera 2 repeats the movement along the path of arrows A1 to A5 I2 times (I2 is an integer of 2 or more; for example, I2=3), and during that time, for each of the multiple second marks M2 (for each second mark M2), the second image I2 m Two images are taken of each subject. This is also to eliminate the effects of variations between shots and to improve the accuracy of the adjustment (calibration) performed in step S5.

[0070] In the following step S5, the control unit 71 processes the first image I1 acquired in step S3. m , and the second image I2 obtained in step S4 m The amount of displacement D of the second mark M2 inside. m Depending on the setting value C mChange the first image I1. m and second image I2 m These are images of the m-th second mark M2 from the starting point Sp, among a plurality of second marks M2 arranged along the Y-axis. Figure 11 shows the first image I1. m and second image I2 m The amount of displacement D of the second mark M2 inside. m This is a diagram explaining the concept.

[0071] More specifically, the control unit 71 controls the first image I1 for each of the multiple second marks M2 (for m=1,2,...). m The amount of deviation D1 of the position of the second mark M2 from a predetermined reference position within the middle. m Similarly, the control unit 71 calculates the second image I2 for each of the multiple second marks M2 (for m=1,2,...). m The amount of deviation D2 of the position of the second mark M2 from a predetermined reference position within the middle. m Calculate the displacement D1 for each of the multiple second marks M2 (for m=1,2,...). m D2 m The difference between the two is the amount of deviation D m It is calculated as follows. Note that the displacement amount D2 m Normally, the displacement amount D1 m Because it is more significantly affected by the delay in signal transmission, the amount of deviation D1 m It is larger than that.

[0072] As described above, for one second mark M2, see the first image I1 m One image was taken for each of the two images, and the second image is I2 m Two images are taken for each of the two second marks M2. Therefore, the control unit 71 controls the first image I1 taken for the same second mark M2. m For each of them, the displacement amount D1 m The calculated displacement amount D1 of I1 is calculated. m The control unit 71 calculates a representative value (e.g., mean, median, etc.) of the two second images I2 taken for the same second mark M2. m For each of them, the displacement amount D2m Calculate I2 deviation amounts D2 m and calculate a representative value (e.g., average value, median value, etc.) of the calculated D2. Then, the control unit 71 calculates the difference between such representative values as the deviation amount D m . Therefore, the deviation amount D m is calculated based on a plurality of first images I1 m and a plurality of second images I2 m for one second mark M2. By calculating the representative values as described above for the deviation amount D1 m and the deviation amount D2 m , it is possible to eliminate the influence of variations for each shooting and cancel the influence of disturbances and the like.

[0073] The deviation amounts D1 m , D2 m , D m can be calculated in units of distance, for example, by specifying the deviation width in the image in terms of the number of pixels and then multiplying the number of pixels by a predetermined coefficient b (μm / pix). The predetermined coefficient b is preset according to the performance (resolution, etc.) and settings (focal length, etc.) of the camera 2.

[0074] The control unit 71 converts the calculated deviation amount D m (μm) into the number of pulses N m (pieces) of the second pulse signal. As described above, the on-the-fly shooting is performed while the camera 2 is moving at a constant speed v (μm / μs) with respect to the cutting table 5. The control unit 71 uses the preset value of v (μm / μs) to calculate the delay time T m = D m / v (μs) that causes the deviation amount D m . The second image I2 m is taken after the camera 2 has passed a distance D m (μm) corresponding to the delay time T m (μs). Therefore, the camera 2 has a delay time T mIt needs to be adjusted to perform shooting earlier by the amount of (μs). Here, the moving distance with respect to the cutting table 5 of the camera 2 corresponding to one cycle of the second pulse signal is a1*p1 (μm) (a1 is the division ratio of the divider 81, p1 is the pitch of the scale 62). Therefore, the delay time T m The adjustment amount N m of the number of pulses of the second pulse signal corresponding to m is N m =(T m *v) / (a1*p1)=D m / (a1*p1) (pieces) is calculated. The control unit 71 subtracts the adjustment amount N m of the number of pulses of the second pulse signal from the pre-adjustment setting value C m set in step S1 to calculate the post-adjustment setting value C m . Then, the calculated post-adjustment setting value C m is set in the memory of the counter 82 as the setting value C m that determines the timing of the on-the-fly shooting of the first mark M1. The post-adjustment setting value C m calculated in step S5 may be saved separately from the pre-adjustment setting value C m set in step S1 in the memory of the counter 82, or may be saved by overwriting. FIG. 12 shows an example of the setting values C m before and after adjustment. Note that the numerical values in FIG. 12 are examples for simplicity of explanation, and in reality, the value of C

[0075] The deviation amount D m counted in pixel numbers is taken as G m (pix), and the distance corresponding to one pixel is taken as L (μm / pix). In this case, D m =L*G m . Therefore, N m =D m / (a1*p1)={L / (a1*p1)}*G m . L / (a1*p1) is a constant. Therefore, by registering this value in advance, the adjustment amount N m can be obtained from the deviation amount G m counted in pixel numbers.It can also be calculated immediately.

[0076] Adjustment amount N m The method for calculating is not limited to the two methods described above. For example, in addition to the first and second methods already mentioned, the third to fifth methods shown below are also possible. In the first to third methods, the control unit 71 sets a plurality of set values ​​C m Adjustment amount N m Calculate each individually.

[0077] In the first method (see Figure 13A), for each second mark M2, the above formula N m =( T m *v) / (a1*p1)=D m Adjustment amount N according to / (a1*p1) m These are calculated individually. In the second method (see Figure 13A), for each second mark M2, the above formula N is used. m ={L / (a1*p1)}*G m According to this, adjustment amount N m These are calculated individually. Then, in the first and second methods, this is used to determine the final adjustment amount N. m Let's assume that.

[0078] In the third method (see Figure 13B), multiple adjustment amounts N are calculated individually for multiple second marks M2 using the first or second method. m The provisional adjustment amount N m Let's assume that... And then, multiple hypothetical adjustment amounts N m Based on the value of, a provisional adjustment amount N m An approximate line is calculated that approximates the distribution of the values. Then, the values ​​of the points corresponding to multiple second marks M2 on the approximate line are calculated individually, and these values ​​are used to determine the final adjustment amount N. m The approximate line can be calculated, for example, using the least squares method or the RANSAC (Random Sample Consensus) method. When using the RANSAC method, the approximate line can be calculated while excluding outliers, thus canceling out the influence of outliers.

[0079] Incidentally, the inventors have verified that the signal transmission delay time T that occurs during on-the-fly imagingm It was found that although it varies due to individual differences in hardware components, it remains almost constant along the time axis if the hardware components are not replaced. Therefore, while moving at a constant speed v (μm / μs), the delay time T m Adjustment amount N for the pulse number of the second pulse signal corresponding to this. m This can be kept almost constant. Therefore, the control unit 71 sets the set value C for the multiple second marks M2. m Common adjustment amount N m You can also change only that. Here, the setting value C m Common adjustment amount N m The multiple second mark M2s that are modified may be all second mark M2s, or two or more second mark M2s that are included in all second mark M2s. The fourth and fifth methods are examples of how to achieve this.

[0080] In the fourth method (see Figure 13C), multiple adjustment amounts N are calculated individually for multiple second marks M2 using the first or second method. m The provisional adjustment amount N m Let's assume that... And then, multiple hypothetical adjustment amounts N m Calculate a representative value (e.g., mean, median) for the value of M2. Then, use this representative value to determine a common final adjustment amount N for multiple second marks M2. m In the fourth method, for example, a common adjustment amount N m This can be set for each straight line along which camera 2 moves in the Y-axis direction relative to the package substrate P1 (i.e., for each path of arrows A1, A3, A5), for each forward path (movement path in the positive Y-axis direction), or for each return path (movement path in the negative Y-axis direction).

[0081] In the fifth method, multiple adjustment amounts N are calculated individually for multiple second marks M2 using the first or second method. m The provisional adjustment amount N m Let's assume that... And then, multiple hypothetical adjustment amounts N mAfter removing outliers from the values, a representative value (e.g., mean, median, etc.) is calculated. Outliers can be removed according to the RANSAC method. Then, this representative value is used as a common final adjustment amount N for multiple second marks M2. m In the fifth method, as in the fourth method, for example, a common adjustment amount N m This can be set for each straight line in which camera 2 moves in the Y-axis direction relative to the package substrate P1, for each forward or return path.

[0082] The final adjustment amount N calculated using the above method. m The result may not necessarily be an integer. In that case, it can be converted to an integer by truncating or rounding the decimal part.

[0083] The control unit 71 may output an error sign to the monitor 75 if a predetermined abnormality is detected during initial setup. The user can see the error sign, interrupt or cancel the initial setup, and take the necessary action. Examples of predetermined abnormalities, their causes, and countermeasures are as follows. Preferably, the error sign includes information on the nature of the abnormality, its cause, and how to deal with it, so that the user can easily respond to the abnormality.

[0084] (Example 1) Image I1 where the second mark M2 cannot be detected. m Or second image I2 m This exists. In this case, possible causes include the second mark M2 attached to the adjustment plate 9 being inappropriate, the second mark M2 not being registered correctly, or the focus of camera 2 being off. In this case, the setting value C m Since it cannot be adjusted, the user checks the condition of the relevant parts of the device (including adjustment plate 9) and readjusts them.

[0085] (Example 2) Multiple images of the same Mark M2 (Image 2) m The amount of deviation D1 calculated for each of these mThe variation (for example, the difference between the maximum and minimum values) is greater than the standard value. In this case, possible causes include improper registration of the second mark M2, or camera 2 being out of focus. In this case, the setting value C m Since it cannot be adjusted, the user checks the condition of the relevant parts of the device and readjusts them.

[0086] (Example 3) Multiple images of the same second mark M2, I2. m The amount of deviation D2 calculated for each of these m The variation (for example, the difference between the maximum and minimum values) is greater than the reference value. In this case, the set value C m Since it cannot be adjusted, the user checks the condition of the relevant parts of the device and readjusts them.

[0087] (Example 4) The amount of deviation D calculated for each of the multiple second marks M2 m The value is greater than the standard value. In this case, the user should check the condition of the relevant parts of the device and readjust them.

[0088] (Example 5) Adjustment amount N by the third method m When calculating the value, the slope of the calculated approximate line is greater than the reference value. In this case, the set value C m Since it cannot be adjusted, the user checks the condition of the relevant parts of the device and readjusts them.

[0089] Once step S5 is completed, the initial setup shown in Figure 9 is finished.

[0090] [3. Features] As described above, in this embodiment, camera 2 performs on-the-fly imaging. Therefore, the movement and stopping of camera 2 for imaging is omitted, and the time required for the cutting process of the package substrate P1 can be shortened. On the other hand, if on-the-fly imaging is performed without considering the delay time of signal transmission, the camera may have passed the position that it originally wanted to photograph by a distance equivalent to the delay time before taking the photograph. In this regard, in this embodiment, during initial setup, the second image I2 is captured on the fly. m The position of the second mark M2 inside is shown in the first image I1. m Setting value C determines the timing of on-the-fly shooting so that it aligns with the position of the second mark M2 inside. m This is adjusted. Image 1 m This image was captured when camera 2 was stationary relative to the cutting table 5. This allows for accurate on-the-fly imaging by adjusting the timing of on-the-fly imaging to account for the signal transmission delay. Furthermore, the adjustment process for the on-the-fly imaging timing is automated as shown in Figure 9, making it simple and quick to perform. This also facilitates periodic calibration of the on-the-fly imaging timing.

[0091] [4. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0092] <4-1> In the above embodiment, when the camera 2 takes a picture, the motor 53 moves the cutting table 5 in the Y-axis direction, so that the camera 2 moves relative to the cutting table 5 in the Y-axis direction. However, in order to move the camera 2 relative to the cutting table 5 in the Y-axis direction, a movement mechanism for moving the camera 2 in the Y-axis direction may be provided, so that the camera 2 is moved in the Y-axis direction instead of the cutting table 5, or both the camera 2 and the cutting table 5 may be moved in the Y-axis direction.

[0093] <4-2> In the above embodiment, the frequency divider 81 may be omitted. In this case, the counter 82 counts the number of pulses of the first pulse signal output from the detection head 61 one by one (i.e., one pulse of the first pulse signal as one unit). However, when the frequency divider 81 is provided, it is preferable in that a counter 82 with a lower frequency bandwidth (i.e., lower responsiveness) of detectable pulse signals can be selected.

[0094] <4-3> In the above embodiment, the first mark M1 and the second mark M2 were arranged so that they overlapped when the package substrate P1 and the adjustment plate 9 were superimposed with their outlines aligned. However, the arrangement of the first mark M1 and the second mark M2 may be different. For example, the second mark M2 may be arranged at a narrower or wider interval than the first mark M1. Alternatively, the first mark M1 and the second mark M2 may be arranged so that they do not overlap at all when the adjustment plate 9 and the package substrate P1 are superimposed with their outlines aligned.

[0095] Adjustment amount N m When using the first or second method described above to calculate the adjustment amount N, the arrangement of the first mark M1 and the second mark M2 must be the same. On the other hand, when using the third to fifth methods, the arrangement of the first mark M1 and the second mark M2 may be different. However, when using the third method and the arrangement of the first mark M1 and the second mark M2 is different, for example, the horizontal axis of the graph of the approximation line in Figure 13B is converted to distance, and the values ​​of the points corresponding to multiple first marks M1 on the approximation line are calculated individually, and these values ​​are used as the final adjustment amount N. m Let's assume that.

[0096] Furthermore, if the arrangement of the first mark M1 and the second mark M2 is changed by employing the third to fifth methods, step S5 is performed as follows: That is, the pre-adjustment setting value C for the adjustment plate 9 set in step S1. m Instead, the pre-adjustment setting value C was set for the package substrate P1. m Adjustment amount Nm By subtracting this, the adjusted setting value C m Calculate the adjusted setting value C. m This is the setting value C that determines the timing of on-the-fly shooting for the first mark M1. m This is then set in the memory of counter 82.

[0097] <4-4> In the above embodiment, the functions of computer 70 may be implemented by multiple computers. For example, a computer that receives images from camera 2 and performs image processing to calculate the amount of displacement of marks M1 and M2 based on the received images may be independent of the computer that performs other functions of the cutting device 1.

[0098] <4-5> In the above embodiment, step S3 may be performed after step S4.

[0099] <4-6> In the above embodiment, the speed of camera 2 moving relative to the cutting table 5 while individually photographing multiple second marks M2 is not limited to a constant speed. This speed may vary (accelerate or decelerate) as long as camera 2 can photograph the second marks M2 and a delay time can be set individually for multiple second marks M2. In this case, the speed of camera 2 moving relative to the cutting table 5 while individually photographing multiple first marks M1 also varies, similar to the speed of camera 2 while individually photographing multiple second marks M2. That is, camera 2 may individually photograph the first marks M1 and the second marks M2 while moving while accelerating or decelerating relative to the cutting table 5.

[0100] <4-7> In the above embodiment, the configuration of the cutting device 1 may not include the inspection and storage module B2. In this case, after the second cleaner 22 cleans and dries the lower surfaces of the multiple electronic components P2, the transport unit 7 drops the multiple electronic components P2 into, for example, a storage box (not shown) with an open top. If the cutting mechanism 6 has a laser device instead of a blade 6a, it is not necessary to use water such as cutting water and cooling water when cutting the package substrate P1. In this case, the cleaning and drying performed by the first cleaner 21 and the second cleaner 22 may be omitted. In this configuration, the multiple electronic components P2 obtained by cutting the package substrate P1 with the laser device are directly stored in the storage box.

[0101] <4-8> In the above embodiment, there was only one camera 2 for checking the first mark M1 on the package substrate P1 and the second mark M2 on the adjustment plate 9, but multiple cameras 2 may be used. In this case, multiple cameras 2 may be used to photograph the first marks M1 on multiple package substrates P1 placed on multiple cutting tables 5 in parallel. Similarly, in this case, multiple cameras 2 may be used to photograph the second marks M2 on multiple adjustment plates 9 placed on multiple cutting tables 5 in parallel. In this case, the number of cameras 2 and the number of cutting tables 5 may be the same or different. For example, the same number of cutting tables 5 and cameras 2 may be used, or two cameras 2 may be used for three cutting tables 5.

[0102] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0103] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0104] [5. Addendum] <Technology 1> (composition) A cutting device comprising an imaging mechanism, a cutting mechanism, and a control unit, The shooting mechanism is, A table on which objects to be cut, each marked with a first mark, A camera that moves without stopping relative to the table, and individually photographs multiple first marks placed on the object to be cut on the table, A signal output unit outputs a pulse signal by generating pulses with a number of pulses corresponding to the relative movement distance of the camera while the camera is moving relative to the table. A counter that counts the number of pulses in the pulse signal output from the signal output unit. Equipped with, The camera is configured to take a picture when the count value counted by the counter matches one of several set values. The control unit determines the cutting position of the object to be cut based on images of multiple first marks captured by the camera. The cutting mechanism cuts the object to be cut on the table according to the cutting position. During the initial setup, when adjusting multiple settings before photographing multiple first marks, plates with multiple second marks are placed on the table. During initial setup, The camera, while stationary relative to the table, generates a first image by individually photographing multiple second marks attached to a plate on the table. The camera moves relative to the table without stopping, and when the count value counted by the counter matches one of several set values, it generates a second image by individually photographing multiple second marks attached to the plate on the table. The control unit changes several setting values ​​according to the amount of displacement of the second mark in the first and second images. Cutting device.

[0105] (Effects, etc.) In this cutting device, the camera performs on-the-fly photography. Therefore, the camera's movement and stopping for photography are eliminated, shortening the cutting process time. On the other hand, if on-the-fly photography is performed without considering the signal transmission delay time, the camera may pass the intended shooting position by a distance equivalent to the delay time before taking the picture. In this cutting device, however, the timing of on-the-fly photography is adjusted (set value adjustment) in advance, taking the signal transmission delay time into consideration, so accurate on-the-fly photography can be performed.

[0106] <Technology 2> (composition) A frequency divider that divides the pulse signal output from the signal output section. Furthermore, The counter counts the number of pulses in the pulse signal divided by the frequency divider. The cutting device described in Technical 1. (Effects, etc.) In this cutting device, the counter counts the number of pulses in the lower frequency band pulse signal generated by the frequency divider. Therefore, even counters with low responsiveness can be used. On the other hand, frequency dividers tend to cause delays in signal transmission. However, in this cutting device, the on-the-fly imaging timing (adjustment of the set value) is adjusted during initial setup, taking into account the delay time of signal transmission, so the effects of delay are suppressed.

[0107] <Technology 3> The camera moves at a constant speed relative to the table, and photographs the first and second marks individually. A cutting device as described in Technology 1 or 2.

[0108] (Effects, etc.) This cutting device facilitates the control of processes related to on-the-fly photography of the first and second marks.

[0109] <Technology 4> During initial setup, The camera takes multiple images of both the first and second images for each second mark. The control unit changes the setting value to be modified according to the amount of displacement calculated based on multiple first images and multiple second images. A cutting device as described in any of Technology 1 to 3.

[0110] (Effects, etc.) In this cutting device, the calculation of the deviation amount for adjusting the timing of on-the-fly photography (adjusting the set value) eliminates the influence of variations between individual shots and cancels out the effects of disturbances, etc. <Technology 5> During initial setup, The control unit modifies each of the two or more setting values ​​included in the above-mentioned set values ​​by a common adjustment amount. A cutting device as described in any of Technology 1 to 3.

[0111] (Effects, etc.) In this cutting device, the process of adjusting the timing of on-the-fly photography (adjusting the setting value) becomes simpler.

[0112] <Technology 6> During initial setup, The control unit calculates the adjustment amount for multiple set values ​​individually. A cutting device as described in any of the technologies 1 to 4.

[0113] (Effects, etc.) This cutting device allows for precise adjustment of the timing of on-the-fly photography (adjustment of setting values).

[0114] <Technology 7> A method for manufacturing a cut product, comprising manufacturing a cut product using a cutting device described in any of the technologies described in 1 to 6.

[0115] (Effects, etc.) In this method of manufacturing cut products, the camera performs on-the-fly photography. Therefore, the camera's movement and stopping for photography are eliminated, shortening the cutting process time. Furthermore, the timing of on-the-fly photography is adjusted (set value adjustment) during initial setup, taking into account the signal transmission delay, allowing for highly accurate on-the-fly photography. [Explanation of Symbols]

[0116] 1 Cutting device, 2 First position confirmation camera, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 6 Cutting mechanism, 6a Blade, 6c Rotation axis, 6d Spindle unit, 7 Transport unit, 8 Second position confirmation camera, 9 Adjustment plate, 11 Flipper, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Index table, 15 Transfer unit, 16a Tray for good products, 16b Tray for defective products, 21 First cleaner, 22 Second cleaner, 30 Magazine, 50 Moving mechanism, 51 Guide, 52 Slider, 53 Motor, 60 Linear scale, 61 Detection head, 62 Scale, 62a Through hole, 70 Computer, 71 Control unit, 74 Memory unit, 75 Monitor, 81 Frequency divider, 82 Counter, 91,92 End section, 93 Center section, 100 Imaging mechanism, A1~A5 Arrows (path), B1 Cutting module, B2 Inspection / storage module, C m Set value, D1 m Amount of displacement, D2 m Amount of displacement, D mAmount of deviation, E11 Reference position, E12 Position of the first mark, F1 Lead frame, F11, F12 End, F13 Center, G m The amount of displacement counted in pixels, I1 m Image 1, I2 m Second image, L1 distance corresponding to pixel, M1 first mark, M2 second mark, N m Pulse number adjustment amount, P1 Package substrate, P2 Electronic component, Sp Starting point of movement, T m Delay time, a1 frequency division ratio, b coefficient, d0 distance, d1 distance, n1 number of pulses in the first pulse signal, n2 number of pulses in the second pulse signal, p1 pitch, v constant speed

Claims

1. A cutting device comprising an imaging mechanism, a cutting mechanism, and a control unit, The aforementioned imaging mechanism is A table on which objects to be cut, each marked with a first mark, A camera that moves without stopping relative to the table and individually photographs the plurality of first marks applied to the object to be cut on the table, A signal output unit outputs a pulse signal by generating pulses with a number of pulses corresponding to the relative movement distance of the camera while the camera is moving relative to the table. A counter that counts the number of pulses in the pulse signal output from the signal output unit. Equipped with, The camera is configured to take a picture when the count value counted by the counter matches one of several set values. The control unit determines the cutting position of the object to be cut based on the images of the plurality of first marks captured by the camera. The cutting mechanism cuts the object to be cut on the table according to the cutting position, During the initial setup, when adjusting the multiple setting values ​​before photographing the multiple first marks, a plate with multiple second marks is placed on the table. During the initial setup described above, The camera generates a first image by individually photographing the plurality of second marks attached to the plate on the table while it is stationary relative to the table. The camera moves relative to the table without stopping, and when the count value counted by the counter matches one of the plurality of set values, it generates a second image by individually photographing the plurality of second marks attached to the plate on the table. The control unit changes the plurality of setting values ​​according to the amount of displacement of the position of the second mark in the first image and the second image. Cutting device.

2. A frequency divider that divides the pulse signal output from the signal output unit. Furthermore, The counter counts the number of pulses in the pulse signal divided by the frequency divider. The cutting device according to claim 1.

3. The camera moves at a constant speed relative to the table and individually photographs the first mark and the second mark. The cutting device according to claim 1.

4. During the initial setup described above, The camera takes multiple images of the first image and the second image for each of the second marks. The control unit changes the setting value to be changed according to the amount of displacement calculated based on the plurality of first images and the plurality of second images. The cutting device according to claim 1.

5. During the initial setup described above, The control unit changes each of the two or more setting values ​​included in the plurality of setting values ​​by a common adjustment amount. The cutting device according to claim 1.

6. During the initial setup described above, The control unit calculates the adjustment amount for each of the multiple set values ​​individually. The cutting device according to claim 1.

7. A method for manufacturing a cut product, comprising manufacturing a cut product using the cutting apparatus described in claims 1 to 6.

Images