Photosensitive composition, cured film using the same, optical filter, image display device, solid-state image sensor, and infrared sensor

Abstract

To provide a photosensitive composition that is excellent in storage stability, and can form a cured film that has little development residue and has excellent pattern shape, and has little foreign matter.SOLUTION: Provided is a photosensitive composition, which is a photosensitive composition that contains a near-infrared absorbing dye (A), a polymerizable compound (B), a photopolymerization initiator (C), and a sensitizer (D), and in which, in 100 mass% of the polymerizable compound (B), a polymerizable compound (B1) represented by the following general formula is contained by 55 mass% or more, and the photopolymerization initiator (C) does not substantially contain an oxime compound.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a photosensitive composition, a cured film using the same, an optical filter, an image display device, a solid-state image sensor, and an infrared sensor. [Background technology]

[0002] Video cameras, digital cameras, and portable devices with camera functions use solid-state image sensors (CCDs) and CMOSs ​​(complementary metal-oxide-semiconductors) to produce color images. Since the light-receiving section of these solid-state image sensors uses silicon photodiodes, which are sensitive to infrared light, it is necessary to correct the luminous sensitivity, and infrared cut filters are placed accordingly. Infrared cut filters are manufactured, for example, using compositions containing near-infrared absorbing dyes.

[0003] Traditionally, infrared cut filters have been used as flat films, but in recent years, there has been research into forming patterns in infrared cut filters using photolithography. When forming patterns using photolithography, oxime compounds have been widely used as photopolymerization initiators due to their high sensitivity. However, compositions containing near-infrared absorbing dyes easily transmit active energy rays (such as i-rays), so when exposed through a photomask, the unexposed areas around the mask are easily exposed by reflected and scattered light from the substrate, and using highly sensitive oxime compounds allows the reaction to proceed easily in the areas covered by the mask. As a result, solubility in the developer decreases, the line width of the resulting pattern becomes thicker, the pattern shape deteriorates, and development residue is generated. Furthermore, when the near-infrared absorbing dye is a pigment, it is difficult to disperse, and using highly sensitive oxime compounds can lead to problems such as poor storage stability and the formation of aggregates of the near-infrared absorbing dye.

[0004] Various efforts have been made to solve the above problems. For example, Patent Document 1 discloses a photosensitive composition comprising a phthalocyanine compound having an absorption maximum wavelength in the near-infrared region, a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. Patent Document 2 discloses a pattern-forming composition comprising an infrared-absorbing dye and a resin having a glass transition temperature of 150 to 300°C, which is excellent in suppressing developing residue and in the shape and heat resistance of the resulting pattern. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2010-160380 [Patent Document 2] International Publication No. 2019 / 058882 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, none of the compositions described in Patent Documents 1 and 2 were able to satisfy all of the requirements for storage stability, development residue, generation of foreign matter, and pattern shape at a certain level or higher.

[0007] The object of this invention is to provide a photosensitive composition that has excellent storage stability, produces little developing residue, has a superior pattern shape, and can form a cured film with few foreign substances. [Means for solving the problem]

[0008] The present invention relates to a photosensitive composition comprising a near-infrared absorbing dye (A), a polymerizable compound (B), a photopolymerization initiator (C), and a sensitizer (D), The polymerizable compound (B) contains 55% by mass or more of polymerizable compound (B1) represented by the following general formula (1) in 100% by mass of the polymerizable compound (B), The photopolymerization initiator (C) relates to a photosensitive composition that is substantially free of oxime compounds.

[0009] General formula (1) [ka]

[0010] In general formula (1), R1 independently represents either a hydrogen atom or a methyl group, and X is either a hydrogen atom or a group represented by the following general formula (2).

[0011] General formula (2) [ka]

[0012] In general formula (2), L represents a divalent linking group, and * represents a bond that connects to the oxygen atom in general formula (1). [Effects of the Invention]

[0013] According to the present invention described above, it is possible to provide a photosensitive composition that can form a cured film with excellent storage stability, low development residue, excellent pattern shape, and low levels of foreign matter. Furthermore, the present invention can provide a cured film, an optical filter, an image display device, a solid-state image sensor, and an infrared sensor. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 shows a schematic cross-sectional view of an infrared sensor equipped with the cured film of the present invention. [Modes for carrying out the invention]

[0015] The following describes in detail embodiments for carrying out the photosensitive composition of the present invention. However, the present invention is not limited to the following embodiments and can be modified and implemented within the scope of solving the problem.

[0016] In this invention, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Also, "CI" means Color Index (CI; issued by The Society of Dyers and Colourists). A polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of the compounds in this invention, for low molecular weight compounds whose molecular weight can be determined, the value is calculated or measured by ESI-MS (electrospray ionization mass spectrometry). For compounds with a molecular weight distribution, the weight-average molecular weight in polystyrene terms is measured by gel permeation chromatography using tetrahydrofuran as the solvent. A monomer is a compound that forms a resin through polymerization. A monomer is in an unreacted state, while a monomer unit is the state in which the monomer has polymerized and formed a resin.

[0017] <Photosensitive composition> One embodiment of the present invention relates to a photosensitive composition. The photosensitive composition of the present invention is a photosensitive composition comprising a near-infrared absorbing dye (A), a polymerizable compound (B), a photopolymerization initiator (C), and a sensitizer (D), The polymerizable compound (B) contains 55% by mass or more of polymerizable compound (B1) represented by the following general formula (1) in 100% by mass of the polymerizable compound (B), The photopolymerization initiator (C) is characterized by being substantially free of oxime compounds.

[0018] General formula (1) [ka]

[0019] In general formula (1), R1 independently represents either a hydrogen atom or a methyl group, and X is either a hydrogen atom or a group represented by the following general formula (2).

[0020] General formula (2) [ka]

[0021] In general formula (2), L represents a divalent linking group, and * represents a bond that connects to the oxygen atom in general formula (1).

[0022] The mechanism by which the above-described photosensitive composition can solve the problems of the present invention is not clear, but we speculate as follows.

[0023] The polymerizable compound (B1) represented by general formula (1) has hydroxyl or carboxyl groups, so the molecules are close together due to intermolecular interactions, and it is presumed that its small molecular weight makes it less susceptible to steric hindrance, and that the polymerizable unsaturated groups are close together. Therefore, it is presumed that the reaction proceeds quickly, sufficient curing occurs even without the inclusion of highly sensitive oxime compounds, and a cured film with excellent resistance to development during pattern formation is obtained, resulting in a good pattern shape. Furthermore, because it does not contain highly sensitive oxime compounds, the line width of the pattern does not increase, and storage stability is excellent. In addition, because the polymerizable compound (B1) represented by general formula (1) has hydroxyl or carboxyl groups, the unexposed areas dissolve easily in alkaline developer, resulting in less development residue. Furthermore, it is presumed that by using the sensitizer (D), the active energy rays are absorbed, and extraneous reactions are less likely to occur, resulting in less development residue and a superior pattern shape.

[0024] The components included in or potentially included in one embodiment of the photosensitive composition will be described in detail below.

[0025] [Near-infrared absorbing dye (A)] The photosensitive composition of the present invention contains a near-infrared absorbing dye (A).

[0026] The near-infrared absorbing dye (A) is a compound having maximum absorption at wavelengths of 700 to 2,000 nm, and may be a pigment (also called a near-infrared absorbing pigment) or a dye (also called a near-infrared absorbing dye). A near-infrared absorbing pigment and a near-infrared absorbing dye may also be used in combination. From the viewpoint of heat resistance, a near-infrared absorbing pigment is preferred. In the present invention, the near-infrared absorbing pigment preferably has a solubility of less than 2 g, more preferably less than 1 g, and particularly preferably 0.5 g or less in 100 g of propylene glycol monomethyl ether acetate at 25°C.

[0027] Examples of near-infrared absorbing dyes (A) include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, indigo compounds, immonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squarylium compounds, and crokonium compounds. Among these, from the viewpoint of light resistance and heat resistance, it is preferable to include one or more selected from the group consisting of naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds, with naphthalocyanine compounds and indigo compounds being more preferable. Furthermore, from the viewpoint of storage stability and suppression of foreign matter, it is preferable to include squarylium compounds and indigo compounds.

[0028] Cyanine compounds are described in International Publication No. 2006 / 006573, International Publication No. 2010 / 073857, Japanese Patent Publication No. 2013-241598, Japanese Patent Publication No. 2016-113501, Japanese Patent Publication No. 2016-113504, etc.; Phthalocyanine compounds are described in Japanese Patent Publication No. Hei 4-23868, Japanese Patent Publication No. Hei 06-192584, Japanese Patent Publication No. 2000-63691 Japanese Patent Publication No. 2014 / 208514, etc.; Naphthalocyanine compounds: Japanese Patent Publication No. 11-152414, Japanese Patent Publication No. 2000-86919, Japanese Patent Publication No. 2009-29955, Japanese Patent Publication No. 2018 / 186490, etc.; Indigo compounds: Japanese Patent Publication No. 2013-230412, etc.; Immonium compounds: Japanese Patent Publication No. 2005-3361 Japanese Patent Publication No. 50, Japanese Patent Publication No. 2007-197492, Japanese Patent Publication No. 2008-88426, etc.; for anthraquinone compounds, Japanese Patent Publication No. 62-903, Japanese Patent Publication No. 1-172458, etc.; for pyrrolopyrrole compounds, Japanese Patent Publication No. 2009-263614, Japanese Patent Publication No. 2010-90313, Japanese Patent Publication No. 2011-068731; squarylium compounds Examples of materials include those described in Japanese Patent Publication No. 2011-132361, Japanese Patent Publication No. 2016-142891, International Publication No. 2017 / 135359, International Publication No. 2018 / 225837, Japanese Patent Publication No. 2019-001987, International Publication No. 2020 / 054718, etc.; examples of croconium compounds include those described in International Publication No. 2019 / 021767, etc.

[0029] (Squallium compound) The preferred squarylium compound is one represented by the following general formula (3).

[0030] General formula (3) [ka]

[0031] In general formula (3), R 1 ~R 4 Each of these independently consists of a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, and an -OR group. 10 , -COR 11, -COOR 12 , -OCOR 13 , -NR 14 R 15 , -NHCOR 16 , -CONR 17 R 18 , -NHCONR 19 R 20 , -NHCOOR 21 , -SR 22 , -SO2R 23 , -SO2OR 24 , -NHSO2R 25 , -SO2NR 26 R 27 , -B(OR 28 )2, and -NHBR 29 R 30 represents. R 10 ~R 30 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group which may have a substituent. In addition, when R 12 of -COOR 12 is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in a salt state. Also, when R 24 of -SO2OR 24 is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may dissociate (i.e., a sulfonate group) or may be in a salt state. Further, R 1 and R 2 , R 3 and R 4 may bond to each other to form a ring.

[0032] The "substituent" includes a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, , -OR 100 , -COR 101 , -COOR 102 , -OCOR 103 , -NR 104 R 105 , -NHCOR 106 , -CONR 107 R108 ,-NHCONR 109 R 110 , -NHCOOR 111 , -SR 112 , -SO2R 113 , -SO2OR 114 , -NHSO2R 115 or -SO2NR 116 R 117 These are some examples. R 100 ~R 117 Each of these independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. Note that -COOR 102 R 102 If it is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group), and it may be in the form of a salt. Also, -SO2OR 114 R 114 If the atom is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may dissociate (i.e., a sulfonate group), and the group may be in the form of a salt.

[0033] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine. The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 12, and particularly preferably 1 to 8 carbon atoms. The alkyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkenyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkenyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkynyl group may be linear, branched, or cyclic. The number of carbon atoms in the aryl group is preferably 6 to 25, more preferably 6 to 15, and particularly preferably 6 to 10. The alkyl portion of the aralkyl group is the same as that of the alkyl group described above. The aryl portion of the aralkyl group is the same as that of the aryl group described above. The number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and particularly preferably 7 to 25. The heteroaryl group is preferably a monocyclic or fused ring, more preferably a monocyclic or fused ring with 2 to 8 fused atoms, and particularly preferably a monocyclic or fused ring with 2 to 4 fused atoms. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3. The heteroatoms constituting the ring of the heteroaryl group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The heteroaryl group is preferably a 5-membered or 6-membered ring. The number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and particularly preferably 3 to 12. Alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heteroaryl groups, and aralkyl groups may have substituents or may be unsubstituted. Examples of substituents include the "substituents" mentioned above.

[0034] From the viewpoint of light resistance and heat resistance, compounds represented by the following general formula (4) are more preferred among squarylium compounds.

[0035] General formula (4) [ka]

[0036] In general formula (4), R 5 ~R 8 Each of these independently consists of a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, and an -OR group. 50 , -COR 51 ,-COOR 52 , -OCOR 53 , -NR 54 R 55 , -NHCOR 56 ,-CONR 57 R 58 ,-NHCONR 59 R 60 , -NHCOOR 61 , -SR 62 , -SO2R 63 , -SO2OR 64 , -NHSO2R 65 or -SO2NR 66 R67 ,-B(OR 68 )2, and -NHBR 69 R 70 represents. R 50 ~R 70 each independently represents a hydrogen atom, an alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, and an aralkyl group. In addition, when R 52 of -COOR 52 is hydrogen (that is, a carboxyl group), the hydrogen atom may dissociate (that is, a carbonate group) or may be in a salt state. Also, when R 64 of -SO2OR 64 is a hydrogen atom (that is, a sulfo group), the hydrogen atom may dissociate (that is, a sulfonate group) or may be in a salt state. Further, R 5 and R 6 , R 7 ​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​

[0042] In general formula (5), R 1x and R 1y each independently represent an alkyl group, an aryl group or a heteroaryl group, and R 2 and R 3 each independently represent a hydrogen atom or a substituent, and R 2 and R 3 may be bonded to each other to form a ring, and R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR 4x R 4y or a metal atom, and R 4 is R 1x R 1y and R 3 and may be covalently or coordinately bonded to at least one selected from the group consisting of R 4x R 4y each independently represents a substituent. General formula (5) is described in JP-A-2009-263614, JP-A-2011-68731, and WO 2015 / 166873.

[0043] R 1x and R 1y each independently is preferably an aryl group or a heteroaryl group, more preferably an aryl group. Also, the alkyl group, aryl group and heteroaryl group represented by R 1x and R 1y may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 -SOR 12 -SO2R 13 and the like. R 11 to R 13 each independently represent a hydrocarbon group or a heteroaryl group. Examples of the substituent also include the substituents described in paragraphs 0020 to 0022 of JP-A-2009-263614. Among them, as the substituent, an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 -SOR 12 -SO2R 13 is preferable. R1x and R 1y The group represented by this can be an alkoxy group having a branched alkyl group, or -OCOR 11 It is preferable that the aryl group has a group represented by as a substituent. The branched alkyl group has 3 to 30 carbon atoms, and more preferably 3 to 20 carbon atoms.

[0044] R 2 and R 3 At least one of them is preferably an electron-withdrawing group, R 2 represents an electron-withdrawing group, R 3 It is more preferable that R represents a heteroaryl group. The heteroaryl group is preferably a 5-membered ring or a 6-membered ring. Furthermore, the heteroaryl group is preferably a mono-ring or a fused ring, preferably a mono-ring or a fused ring with 2 to 8 fused rings, and more preferably a mono-ring or a fused ring with 2 to 4 fused rings. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3, and more preferably 1 to 2. Examples of heteroatoms include nitrogen atoms, oxygen atoms, and sulfur atoms. It is preferable that the heteroaryl group has one or more nitrogen atoms. The two R in general formula (5) 2 The two Rs may be the same or different. Also, the two Rs in general formula (5) 3 The same or different items may be identical or different.

[0045] R 4 is a hydrogen atom, alkyl group, aryl group, heteroaryl group, or -BR 4x R 4y It is preferably a group represented by -BR, which is a hydrogen atom, an alkyl group, an aryl group, or a hydrogen atom, an alkyl group, or an alkyl group. 4x R 4y It is more preferable that the group be represented by -BR 4x R 4y It is particularly preferable that the group be represented by R. 4x R 4yThe substituents represented by are preferably halogen atoms, alkyl groups, alkoxy groups, aryl groups, or heteroaryl groups, more preferably alkyl groups, aryl groups, or heteroaryl groups, and particularly preferably aryl groups. These groups may have further substituents. The two R in general formula (5) 4 They may be the same or different.

[0046] The following are specific examples of compounds represented by general formula (5). In the following structural formulas, Me represents a methyl group and Ph represents a phenyl group. Examples of pyrrolopyrrole compounds include those described in paragraphs 0016-0058 of Japanese Patent Publication No. 2009-263614, paragraphs 0037-0052 of Japanese Patent Publication No. 2011-68731, paragraphs 0014-0027 of Japanese Patent Publication No. 2014-130343, and paragraphs 0010-0033 of International Publication No. 2015 / 166873. However, the present invention is not limited to these.

[0047] [ka]

[0048] (Naphthalocyanine compounds) The naphthalocyanine compound is preferably a compound represented by the following general formula (6).

[0049] General formula (6) [ka]

[0050] In general formula (6), X1~X8, Y lEach of ~Y8 independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfone group, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted cycloalkyl group, an optionally substituted heterocyclic group, an optionally substituted alkoxy group, an optionally substituted aryloxy group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an optionally substituted phthalimidomethyl group, or an optionally substituted sulfamoyl group. Furthermore, each of X1~X8 may independently bond to each other to form an optionally substituted aromatic ring. However, one or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 may bond to each other to form an optionally substituted aromatic ring. Z is a polymer moiety containing monomer units shown in the general formula (7) below, or a phosphorus compound moiety represented by the general formula (8) below, and * is a bond with Al.

[0051] Examples of alkyl groups that may have substituents include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, neopentyl, n-hexyl, n-octyl, stearyl, and 2-ethylhexyl groups. Examples of alkyl groups with substituents include trichloromethyl, trifluoromethyl, 2,2,2-trifluoroethyl, 2,2-dibromoethyl, 2,2,3,3-tetrafluoropropyl, 2-ethoxyethyl, 2-butoxyethyl, 2-nitropropyl, benzyl, 4-methylbenzyl, 4-tert-butylbenzyl, 4-methoxybenzyl, 4-nitrobenzyl, and 2,4-dichlorobenzyl groups.

[0052] Examples of the "aryl group" which may have substituents include a phenyl group, a naphthyl group, anthuryl group, and the like. Examples of "substituted aryl groups" include p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2-aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, and 2-aminoanthraquinonyl group.

[0053] Examples of "cycloalkyl groups" that may have substituents include cyclopentyl groups, cyclohexyl groups, adamantyl groups, and the like. Examples of "substituted cycloalkyl groups" include the 2,5-dimethylcyclopentyl group and the 4-tert-butylcyclohexyl group.

[0054] Examples of heterocyclic groups that may have substituents include pyridyl, pyrazyl, piperidino, pyranyl, morpholino, and acridinyl groups. Examples of heterocyclic groups with substituents include 3-methylpyridyl, N-methylpiperidyl, and N-methylpyrrolyl groups.

[0055] Examples of alkoxyl groups that may have substituents include linear or branched alkoxyl groups such as methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, neopentyloxy, 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy, and 2-ethylhexyloxy. Examples of "substituted alkoxyl groups" include trichloromethoxy, trifluoromethoxy, 2,2,2-trifluoroethoxy, 2,2,3,3-tetrafluoropropoxy, 2,2-ditrifluoromethylpropoxy, 2-ethoxyethoxy, 2-butoxyethoxy, 2-nitropropoxy, and benzyloxy groups.

[0056] Examples of aryloxy groups that may have substituents include phenoxy groups, naphthoxy groups, anthuryloxy groups, and so on. Examples of "substituted aryloxy groups" include p-methylphenoxy group, p-nitrophenoxy group, p-methoxyphenoxy group, 2,4-dichlorophenoxy group, pentafluorophenoxy group, and 2-methyl-4-chlorophenoxy group.

[0057] Examples of alkylthio groups that may have substituents include methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio, octylthio, decylthio, dodecylthio, and octadecylthio groups. Examples of "alkylthio groups having substituents" include methoxyethylthio groups, aminoethylthio groups, benzylaminoethylthio groups, methylcarbonylaminoethylthio groups, and phenylcarbonylaminoethylthio groups.

[0058] Examples of the arylthio group which may have substituents include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group, and the like. Examples of "substituted arylthio groups" include chlorophenylthio group, trifluoromethylphenylthio group, cyanophenylthio group, nitrophenylthio group, 2-aminophenylthio group, and 2-hydroxyphenylthio group.

[0059] Examples of substituents on the aromatic ring that may have substituents include halogen atoms, nitro groups, nitrile groups, carboxyl groups, sulfone groups, alkyl groups that may have substituents, aryl groups that may have substituents, cycloalkyl groups that may have substituents, alkoxyl groups that may have substituents, aryloxy groups that may have substituents, alkylthio groups that may have substituents, and arylthio groups that may have substituents.

[0060] General formula (7) [ka]

[0061] In general formula (7), X is -CONH-R 25 -,-COO-R 26 -, -CONH-R 27 -O-, -COO-R 28 -O- is R 25 ~R 28 R represents an alkylene or arylene group in which carbon atoms may be linked together by -O-, -CO-, -COO-, -OCO-, -CONH-, or -NHCO-. 31 * represents a hydrogen atom or a methyl group. * represents a bond with Al.

[0062] Examples of alkylene groups include methylene, ethylene, propylene, and butylene. Examples of arylene groups include phenylene, naphthylene, biphenylene, terphenylene, and anthrylene.

[0063] The monomer units represented by general formula (7) can be obtained by polymerizing monomers such as (2-(meth)acryloyloxyethyl) acid phosphate, (2-(meth)acryloyloxypropyl) acid phosphate, and (2-(meth)acryloyloxyisopropyl) acid phosphate. Furthermore, copolymerization can also be carried out using monomers other than these (hereinafter also referred to as other monomers).

[0064] Other monomers include, for example, (meth)acrylic acid esters, crotonic acid esters, vinyl esters, maleic acid diesters, fumaric acid diesters, itaconic acid diesters, (meth)acrylamides, vinyl ethers, vinyl alcohol esters, styrenes, (meth)acrylonitrile, acid group-containing monomers, thermocrosslinkable group-containing monomers, and the like.

[0065] The weight-average molecular weight of the polymerized portion is preferably 5,000 to 20,000, and more preferably 8,000 to 15,000. Having an appropriate molecular weight improves optical properties and heat resistance.

[0066] The glass transition temperature (Tg) of the polymerized portion is preferably -50 to 150°C, and more preferably 20 to 80°C. An appropriate Tg improves the optical properties.

[0067] General formula (8) [ka]

[0068] In general formula (8), R 29 and R 30 Each of these independently represents a hydroxyl group, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxy group, or an optionally substituted aryloxy group, R 29 and R 30 These elements may bond to each other to form a ring. * represents a bond with Al.

[0069] The "alkyl group" in the optionally substituted alkyl group, the "aryl group" in the optionally substituted aryl group, the "alkoxyl group" in the optionally substituted alkoxyl group, and the "aryloxy group" in the optionally substituted aryloxy group are the same as those exemplified in the explanation of general formula (6) above.

[0070] General formula (8) is R from the viewpoint of dispersion and color characteristics. 29 and R 30 At least one of them is preferably an aryl group which may have a substituent or an aryloxy group which may have a substituent, R 29 and R 30 Both are more preferably aryl groups or aryloxy groups, R 29 and R 30 In both cases, a phenyl group or a phenoxy group is more preferable.

[0071] The following are specific examples of compounds represented by general formula (6). However, the present invention is not limited to these examples.

[0072] [ka] JPEG0007855914000015.jpg74130

[0073] [ka] JPEG0007855914000017.jpg77137 JPEG0007855914000018.jpg70136

[0074] The compound represented by general formula (6) preferably contains compounds in which two or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 are bonded to each other to form an aromatic ring which may have substituents, and more preferably contains compounds in which three or more are bonded to each other to form an aromatic ring which may have substituents, from the viewpoint of light resistance and heat resistance. Furthermore, from the viewpoint of storage stability and suppression of foreign matter, it is preferable to use two or more compounds in combination that have different numbers of aromatic rings, where X1 and X2, X3 and X4, X5 and X6, or X7 and X8 may be bonded to each other and have substituents.

[0075] (Indigo compound) The indigo compound is preferably a compound represented by the following general formula (9) or a compound represented by the general formula (10).

[0076] [ka]

[0077] In general formulas (9) and (10), X1 to X 40Each of these independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxyl group, an optionally substituted aryloxy group, an optionally substituted arylalkyl group, an optionally substituted cycloalkyl group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an amino group, an optionally substituted alkylamino group, an optionally substituted arylamino group, a cyano group, a halogen atom, a nitro group, a hydroxyl group, -SO3H; -COOH; and monovalent to trivalent metal salts of these acidic groups; or alkylammonium salts. M represents a metal atom.

[0078] Examples of alkyl groups that may have substituents include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, neopentyl, n-hexyl, n-octyl, stearyl, and 2-ethylhexyl groups. Examples of alkyl groups with substituents include trichloromethyl, trifluoromethyl, 2,2,2-trifluoroethyl, 2,2-dibromoethyl, 2,2,3,3-tetrafluoropropyl, 2-ethoxyethyl, 2-butoxyethyl, 2-nitropropyl, benzyl, 4-methylbenzyl, 4-tert-butylbenzyl, 4-methoxybenzyl, 4-nitrobenzyl, and 2,4-dichlorobenzyl groups.

[0079] Examples of the "aryl group" which may have substituents include a phenyl group, a naphthyl group, anthuryl group, and the like. Examples of "substituted aryl groups" include p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2-aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, and 2-aminoanthraquinonyl group.

[0080] Examples of alkoxyl groups that may have substituents include linear or branched alkoxyl groups such as methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, neopentyloxy, 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy, and 2-ethylhexyloxy. Examples of "substituted alkoxyl groups" include trichloromethoxy, trifluoromethoxy, 2,2,2-trifluoroethoxy, 2,2,3,3-tetrafluoropropoxy, 2,2-ditrifluoromethylpropoxy, 2-ethoxyethoxy, 2-butoxyethoxy, 2-nitropropoxy, and benzyloxy groups.

[0081] Examples of "aryloxy groups" that may have substituents include phenoxy, naphthoxy, and anthuryloxy groups, while examples of "substituted aryloxy groups" include p-methylphenoxy, p-nitrophenoxy, p-methoxyphenoxy, 2,4-dichlorophenoxy, pentafluorophenoxy, and 2-methyl-4-chlorophenoxy groups.

[0082] Examples of "arylalkyl groups that may have substituents" include benzyl group, 2-phenylpropanyl group, styryl group, diphenylmethyl group, triphenylmethyl group, and the like.

[0083] Examples of "cyclic alkyl groups" that may have substituents include cyclopentyl groups, cyclohexyl groups, and adamantyl groups. Examples of "substituted cycloalkyl groups" include 2,5-dimethylcyclopentyl groups and 4-tert-butylcyclohexyl groups.

[0084] Examples of alkylthio groups that may have substituents include methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio, octylthio, decylthio, dodecylthio, and octadecylthio groups. Examples of "alkylthio groups having substituents" include methoxyethylthio groups, aminoethylthio groups, benzylaminoethylthio groups, methylcarbonylaminoethylthio groups, and phenylcarbonylaminoethylthio groups.

[0085] Examples of the arylthio group which may have substituents include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group, and the like. Examples of "substituted arylthio groups" include chlorophenylthio group, trifluoromethylphenylthio group, cyanophenylthio group, nitrophenylthio group, 2-aminophenylthio group, and 2-hydroxyphenylthio group.

[0086] Examples of alkylamino groups that may have substituents include methylamino group, ethylamino group, propylamino group, butylamino group, pentylamino group, hexylamino group, heptylamino group, octylamino group, nonylamino group, decylamino group, dodecylamino group, octadecylamino group, isopropylamino group, isobutylamino group, isopentylamino group, sec-butylamino group, tert-butylamino group, sec-pentylamino group, tert-pentylamino group, tert-octylamino group, neopentylamino group, cyclopropylamino group, cyclobutylamino group, cyclopentylamino group, cyclohexylamino group, cycloheptylamino group, cyclooctylamino group, cyclododecylamino group, 1-adamantamino group, 2-adamantamino group, and the like.

[0087] Examples of "arylamino groups" that may have substituents include anilino group, 1-naphthylamino group, 2-naphthylamino group, o-toluidino group, m-toluidino group, p-toluidino group, 2-biphenylamino group, 3-biphenylamino group, 4-biphenylamino group, 1-fluoreneamino group, 2-fluoreneamino group, 2-thiazoleamino group, and p-terphenylamino group.

[0088] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine.

[0089] Examples of acidic groups include -SO3H and -COOH. Examples of monovalent to trivalent metal salts of these acidic groups include sodium salts, potassium salts, magnesium salts, calcium salts, iron salts, and aluminum salts. Examples of alkylammonium salts of acidic groups include ammonium salts of long-chain monoalkylamines such as octylamine, laurylamine, and stearylamine, and quaternary alkylammonium salts such as palmityltrimethylammonium, lauryltrimethylammonium, dilauryldimethylammonium, and distearyldimethylammonium salts.

[0090] Of the substituents listed above, X1 to X 40 Preferred substituents include hydrogen atoms, methyl groups, methoxy groups, fluorine atoms, chlorine atoms, bromine atoms, and -SO3H.

[0091] M represents a metal atom. Examples of metal atoms include Zn, Co, Ni, Ru, Pt, Mn, Sn, Ti, and Ba. Among these, divalent metal atoms are preferred, and Zn, Co, and Ni are more preferred.

[0092] The following are specific examples of compounds represented by general formula (9) or general formula (10). However, the present invention is not limited to these examples.

[0093] [ka]

[0094] [ka]

[0095] [ka]

[0096] [ka]

[0097] Near-infrared absorbing dyes (A) can be used alone or in combination of two or more. When using two or more in combination, it is preferable to use at least two compounds with different maximum absorption wavelengths. This broadens the waveform of the absorption spectrum compared to using a single near-infrared absorbing dye (A), allowing for absorption of near-infrared light across a wider wavelength range.

[0098] From the viewpoint of near-infrared absorption, the content of the near-infrared absorbing dye (A) is preferably 0.5 to 70% by mass, and more preferably 1 to 50% by mass, of 100% by mass of the non-volatile content of the photosensitive composition.

[0099] [Polymerizable compound (B)] (Polymerizable compound represented by general formula (1) (B1)) The photosensitive composition of the present invention contains a polymerizable compound (B), and of 100% by mass of polymerizable compound (B), it contains 55% by mass or more of a polymerizable compound (B1) represented by the following general formula (1).

[0100] General formula (1) [ka]

[0101] In general formula (1), R1 independently represents either a hydrogen atom or a methyl group, and X is either a hydrogen atom or a group represented by the following general formula (2).

[0102] General formula (2) [ka]

[0103] In general formula (2), L represents a divalent linking group, and * represents a bond that connects to the oxygen atom in general formula (1).

[0104] There are no particular limitations on the method for producing the polymerizable compound (B1) represented by general formula (1), and known methods can be used. For example, a polymerizable compound in general formula (1) in which X is a hydrogen atom can be produced by heating and stirring (meth)acrylic acid and pentaerythritol in the presence of an acidic catalyst. Examples of acidic catalysts include sulfuric acid, p-toluenesulfonic acid, and methanesulfonic acid. The reaction temperature can be set as appropriate, but a preferred reaction temperature is 70 to 140°C.

[0105] In the reaction, it is preferable to use an organic solvent with low solubility in water, which is produced in the esterification reaction, and to promote dehydration by azeotropic distillation of the water. Examples of organic solvents include toluene, benzene, xylene, hexane, methyl ethyl ketone, and cyclohexanone. Furthermore, it is preferable to remove the organic solvent by vacuum distillation after the reaction.

[0106] Furthermore, polymerizable compounds in which X is the group represented by general formula (2) in general formula (1) can be produced, for example, by reacting a polymerizable compound in which X is a hydrogen atom, obtained by the reaction of (meth)acrylic acid and pentaerythritol, with an acid anhydride in the presence of a catalyst at 60 to 110°C for 1 to 20 hours. In general formula (2), L is a divalent linking group, specifically the residue obtained by removing the carboxyl group from the acid anhydride. Examples of acid anhydrides include succinic anhydride, dodecenyl succinic anhydride, octenyl succinic anhydride, maleic anhydride, glutamic anhydride, itaconic anhydride, phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetramethylene maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, and pyromellitic anhydride. Among these, succinic anhydride, octenyl succinic anhydride, maleic anhydride, and phthalic anhydride are preferred, with succinic anhydride and octenyl succinic anhydride being more preferred. Examples of catalysts include N,N-dimethylbenzylamine, triethylamine, tributylamine, triethylenediamine, and benzyltrimethylammonium chloride.

[0107] From the viewpoint of pattern shape, the content of polymerizable compound (B1) represented by general formula (1) is preferably 65% ​​by mass or more out of 100% by mass of polymerizable compound (B).

[0108] Of the polymerizable compounds (B1) represented by general formula (1), compounds in which X is a group represented by general formula (2) are more preferred from the viewpoint of developing residue and pattern shape.

[0109] The following are specific examples of polymerizable compounds (B1) represented by general formula (1). However, the present invention is not limited to these examples.

[0110] [ka]

[0111] [ka]

[0112] (Other polymerizable compounds (B2)) Polymerizable compound (B) may contain polymerizable compound (B2) other than polymerizable compound (B1) represented by general formula (1) (hereinafter also referred to as other polymerizable compound (B2)).

[0113] Other polymerizable compounds (B2) are not particularly limited and known compounds can be used. For example, methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, β-carboxyethyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate. )Acrylate, ethoxylated bisphenol A di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethyloxy)phenyl]fluorene, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, isocyanuric acid EO-modified di(meth)acrylate Examples include acrylic acid esters and methacrylic acid esters such as methylated melamine (meth)acrylate, isocyanuric acid EO modified tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecanyl(meth)acrylate, methylolated melamine (meth)acrylate, epoxy(meth)acrylate, urethane(meth)acrylate, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-vinylformamide, and acrylonitrile.

[0114] Other polymerizable compounds (B2) can be used alone or in combination of two or more.

[0115] [Photopolymerization initiator (C)] The photosensitive composition of the present invention contains a photopolymerization initiator (C).

[0116] The photopolymerization initiator (C) used in the present invention is not particularly limited as long as it does not substantially contain oxime compounds, and known ones can be used. "Substantially contained" means that it contains 0.1% by mass or less, preferably 0.05% by mass or less, and more preferably 0.01% by mass or less, of 100% by mass of the photopolymerization initiator (C).

[0117] Examples of compounds other than oxime compounds include alkylphenone compounds such as 4-phenoxydichloroacetophenone, 4-t-butyldichloroacetophenone, diethoxyacetophenone, 2-hydroxy-2-methylphenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 1-(9,9-dibutyl-9H-fluoren-2-yl)-2-methyl-2-morpholin-4-ylpropan-1-one; Triazine compounds such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-bromophenyl))4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o,p-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(m-methoxyphenyl)biidazole, 2,2' Biimidazole compounds such as -bis(o,o'-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-nitrophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-methylphenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(o-trifluorophenyl)-4,4',5,5'-tetraphenylbiimidazole; Examples include quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; carbazole compounds; and titanocene compounds. Other examples include compounds described in Japanese Patent Publication No. 2019-507108 and Japanese Patent Publication No. 2019-528331. Among these, from the viewpoint of pattern shape, it is preferable to include at least one selected from the group consisting of alkylphenone compounds, acylphosphine oxide compounds, and biimidazole compounds, and it is more preferable to include alkylphenone compounds.

[0118] The photopolymerization initiator (C) can be used alone or in combination of two or more types.

[0119] The content of the photopolymerization initiator (C) is preferably 1 to 20 parts by mass, and more preferably 3 to 15 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A), from the viewpoint of development residue and pattern shape.

[0120] [Sensitizer (D)] The photosensitive composition of the present invention contains a sensitizer (D).

[0121] The sensitizer (D) is, for example, unsaturated ketones such as chalcone compounds and dibenzalacetone, 1,2-diketone compounds such as benzyl and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, polymethine dyes such as oxonol compounds, acridine compounds, azine compounds, thiaidine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. Examples include squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyradinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxaliloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyririum compounds, thiopyrillium compounds, tetraphylline compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospilopyran compounds, metal arene complexes, organoruthenium complexes, or benzophenone compounds. Among these, benzophenone compounds (D1) or thioxanthone compounds (D2) are preferred from the viewpoint of development residue and pattern shape, and benzophenone compounds (D1) are more preferred.

[0122] (Benzophenone compound (D1)) Examples of benzophenone compounds (D1) include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 2-aminobenzophenone. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0123] (Thioxanthone compound (D2)) Examples of thioxanthone compounds (D2) include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, and 1-chloro-4-propoxythioxanthone. Among these, 2,4-diethylthioxanthone is preferred.

[0124] The sensitizer (D) can be used alone or in combination of two or more types.

[0125] From the viewpoint of developing residue and pattern shape, the content of the sensitizer (D) is preferably 150 to 400 parts by mass, and more preferably 200 to 300 parts by mass, per 100 parts by mass of the photopolymerization initiator (C).

[0126] [Binder resin (E)] From the viewpoint of pattern shape, the photosensitive composition of the present invention preferably contains a binder resin (E).

[0127] The binder resin (E) is not particularly limited, and any known resin can be used. Examples include (meth)acrylic resin, styrene resin, epoxy resin, urethane resin, polycarbonate resin, polyester resin, polyether resin, polyimide resin, polyamide-imide resin, and cyclic olefin resin.

[0128] The binder resin (E) preferably has acidic groups from the viewpoint of developing residue and pattern shape. Examples of acidic groups include carboxyl groups, phosphate groups, sulfo groups, and phenolic hydroxyl groups. Among these, carboxyl groups are preferred.

[0129] The binder resin (E) is preferably a resin having acidic groups in its side chains. Specifically, examples include alkali-soluble phenolic resins such as acrylic acid copolymers, methacrylic acid copolymers, maleic acid copolymers, partially esterified maleic acid copolymers, and novolac resins, as well as resins obtained by adding acid anhydrides to resins having hydroxyl groups. Among these, copolymers of (meth)acrylic acid and other monomers copolymerizable with it are preferred. Other monomers copolymerizable with (meth)acrylic acid include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, isobornyl (meth)acrylate, phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, adamantyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyl (meth)acrylate. (Meth)acrylates such as phenoxydiethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, ethylene oxide (EO) modified cresol acrylate, n-nonylphenoxypolyethylene glycol acrylate, phenoxyethyl acrylate, ethoxylated phenyl acrylate, EO-modified (meth)acrylate of phenol, EO-modified (meth)acrylate of paracumylphenol or propylene oxide (PO) modified (meth)acrylate, EO-modified (meth)acrylate of nonylphenol, PO-modified (meth)acrylate of nonylphenol, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 3,4-epoxycyclohexyl (meth)acrylate; (meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; Styrene, or styrene compounds such as α-methylstyrene; Vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; Vinyl acetate or vinyl propionate, and other fatty acid vinyl compounds; Cyclohexylmaleimide, phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimideethane, 1,6-bismaleimidehexane, 3-maleimidepropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidediphenylmethane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichloro N-substituted maleimides such as N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimide benzoate, N-succinimidyl-3-maleimide propionate, N-succinimidyl-4-maleimide butyrate, N-succinimidyl-6-maleimide hexanoate, N-[4-(2-benzoimidazolyl)phenyl]maleimide, and 9-maleimidacridine; Examples include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, and di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate. These monomers can be used individually or in combination of two or more.

[0130] From the viewpoint of pattern shape, the binder resin (E) more preferably has polymerizable unsaturated groups. Examples of polymerizable unsaturated groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups. The polymerizable unsaturated groups may be protected with a heat-release compound (blocking agent). A method for introducing polymerizable unsaturated groups is, for example, a method of reacting a compound (modified compound) having functional groups that can bond to acid groups, hydroxyl groups, epoxy groups, etc. of the resin (precursor) and polymerizable unsaturated groups. Examples of compounds having functional groups and polymerizable unsaturated groups include glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, or 1,1-bis[methacryloyloxy]ethyl isocyanate, (meth)acrylic acid, crotonic acid, o-, m-, p-vinylbenzoic acid, malonic acid-2-[[[[(2-methyl-1-oxo-2-propenyl)oxyethyl]amino]carbonyl]-1,3-diethyl ester, etc.

[0131] In the binder resin (E), when introducing polymerizable unsaturated groups, the hydroxyl groups generated by the reaction of the acidic groups of the resin (precursor) with functional groups and a compound having polymerizable unsaturated groups (modified compound) can also be further reacted with a polybasic acid anhydride (modified compound). Examples of polybasic acid anhydrides include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and maleic anhydride.

[0132] The glass transition temperature of the binder resin (E) is preferably -10 to 140°C, more preferably 0 to 120°C, and particularly preferably 10 to 100°C, from the viewpoint of developing residue and pattern shape.

[0133] The glass transition temperature (hereinafter also referred to as Tg) can be measured using a measured Tg obtained through actual measurement. Specifically, the measured Tg can be the value obtained by differential scanning calorimetry (DSC). However, if measurement is difficult due to resin decomposition or other reasons, the calculated Tg obtained by the following formula shall be applied. 1 / Tg=W1 / Tg1+W2 / Tg2+······+W n / Tg n Here, the resins to be calculated are W1 to W n Assuming that n monomer components up to W are copolymerized, n Tg is the mass fraction of the nth monomer. n is the glass transition temperature (absolute temperature) of the homopolymer of the nth monomer. The glass transition temperature values ​​for each monomer homopolymer (hereinafter also called homopolymer) are those shown in "Polymer Handbook, Third edition, John Wiley & Sons, 1989" edited by Brandrup, J. Immergut, EH.

[0134] The weight-average molecular weight (Mw) of the binder resin (E) is preferably 2,000 to 50,000, and more preferably 3,000 to 40,000, from the viewpoint of developing residue and pattern shape.

[0135] The acid value of the binder resin (E) is preferably 40 to 200 mg KOH / g, and more preferably 50 to 180 mg KOH / g, from the viewpoint of developing residue and pattern shape.

[0136] Binder resin (E) can be used alone or in combination of two or more types.

[0137] The content of the binder resin (E) is preferably 5 to 500 parts by mass, and more preferably 10 to 400 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0138] [Coloring agent (F)] The photosensitive composition of the present invention may contain a coloring agent (F).

[0139] The coloring agent (F) may be either a pigment or a dye, and can be used in combination.

[0140] (Pigment) The pigment is preferably a compound classified as a pigment in the color index. Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1,63:2,64,64:1,68,69,81,81:1,81:2,81:3,81:4,83,88,90:1,101,101:1,104,108,108:1,109,112,113,114,122,123,144,146,147,149,151,166,168,169,170,172,173,174,175,176,177,178,179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, Examples include pigments 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, pigments described in Japanese Patent Publication No. 2014-134712, pigments described in Japanese Patent Publication No. 6368844, and the like. Among these, from the viewpoint of heat resistance, light resistance, and transmittance, CI Pigment Red 48:1,122,177,224,242,269,254,291,295,296, the pigment described in Japanese Patent Publication No. 2014-134712, and the pigment described in Japanese Patent Publication No. 6368844 are preferred, and CI Pigment Red 177,254,291,295,296, the pigment described in Japanese Patent Publication No. 2014-134712, and the pigment described in Japanese Patent Publication No. 6368844 are even more preferred.

[0141] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0142] Yellow pigments include, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77,81,83,93,94,95,97,98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,126,127,128,129,138,139,147,150,151,152, 1 53,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,192,193,194,196,198,199,21 Examples of pigments include those described in 3,214,231,233, Japanese Patent Publication No. 2012-226110, Japanese Patent Publication No. 2014-12838, Japanese Patent Publication No. 2016-180100, Japanese Patent Publication No. 2017-171912, Japanese Patent Publication No. 2017-171913, and Japanese Patent Publication No. 2017-171914. Among these, the pigments described in CI Pigment Yellow 138,139,150,185,231,233, Japanese Patent Publication No. 2012-226110, and Japanese Patent Publication No. 2014-12838 are preferred.

[0143] Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63. Among these, CI Pigment Green 36, 58, 59, 62, and 63 are preferred.

[0144] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0145] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, CI Pigment Violet 19 and 23 are preferred.

[0146] Examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, and 31. Alternatively, black may be achieved using at least two pigments selected from red, yellow, blue, green, and purple pigments.

[0147] Examples of inorganic pigments include titanium dioxide, barium sulfate, zinc oxide, lead sulfate, lead yellow, zinc yellow, red iron(III) oxide, cadmium red, ultramarine, Prussian blue, chromium oxide green, cobalt green, amber, and synthetic iron black.

[0148] (dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, and sulfur dyes. Derivatives of these dyes, as well as lake pigments (dyes obtained by lake formation), are also examples.

[0149] Acid dyes preferably have acidic groups such as sulfonic acid or carboxylic acid. Salt compounds are also preferred, which are salts of acid dyes with nitrogen-containing compounds such as quaternary ammonium salts, tertiary amines, secondary amines, or primary amines. Salt compounds are also preferred, which are salts of resin components having these functional groups with acid dyes. Furthermore, by sulfonamidating the salt compounds to sulfonamide compounds, it is easy to obtain photosensitive compositions with excellent resistance (lightfastness, solvent resistance). Furthermore, salt-forming compounds of acid dyes and compounds containing an onium base are also preferred due to their excellent resistance (light resistance and solvent resistance). The compound containing the onium base is preferably a resin having a cationic group.

[0150] Basic dyes can be used as is, but salt-forming compounds that form salts with organic acids, perchloric acid, or their metal salts are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in salt-forming compounds of basic dyes, preferred anionic components that act as counterions are salt-forming compounds obtained by salting with organic sulfonic acids, organic sulfuric acids, fluorine-containing phosphorus anionic compounds, fluorine-containing boron anionic compounds, cyano-containing nitrogen anionic compounds, anionic compounds having a conjugate base of an organic acid having a halogenated hydrocarbon group, and acid dyes. Note that the resistance of the salt-forming compound is further improved if it contains polymerizable unsaturated groups in its molecule.

[0151] The chemical structures of dyes include, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), and azite dyes. Examples of dye structures derived from dyes selected from chloromethic acid dyes, polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0152] Among these, from the viewpoint of color characteristics such as hue, color separation, and color unevenness, a pigment structure derived from a pigment selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a pigment structure derived from a pigment selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyromethene dyes, and phthalocyanine dyes is more preferred.

[0153] The coloring agent (F) can be used alone or in combination of two or more types.

[0154] The content of the coloring agent (F) is preferably 10% by mass or less of the non-volatile content of the photosensitive composition by 100% by mass.

[0155] (Pigment refinement) Organic pigments are preferably used after being finely milled. The milling method is not particularly limited, and for example, wet milling, dry milling, or dissolution milling can all be used. Among these, salt milling by the kneader method, which is a type of wet milling, is preferred. The average primary particle size of the finely milled pigment, as determined by TEM (transmission electron microscopy), is preferably 5 to 90 nm. However, from the viewpoint of dispersibility and contrast ratio, an average primary particle size of 10 to 70 nm is more preferable.

[0156] A resin may be added to the salt milling process as needed. The type of resin is not particularly limited and includes natural resins, modified natural resins, synthetic resins, and synthetic resins modified with natural resins. Among these, it is preferable that the resin is solid at room temperature, insoluble in water, and partially soluble in the organic solvent. The amount of resin added is preferably 2 to 200 parts by mass per 100 parts by mass of pigment.

[0157] [Dispersion resin (G)] The photosensitive composition of the present invention may contain a dispersion resin (G).

[0158] The dispersion resin (G) is preferably a resin having an adsorption group that has a high affinity for the near-infrared absorbing dye (A). The adsorption group preferably has one or more basic groups and acidic groups.

[0159] Basic groups include, for example, primary amino groups, secondary amino groups, tertiary amino groups, quaternary ammonium bases, and nitrogen-containing heterocycles and other groups containing nitrogen atoms.

[0160] Examples of acidic groups include carboxyl groups, phosphate groups, and sulfonic acid groups.

[0161] Examples of the resin types of the dispersed resin (G) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial)amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl group-containing polycarboxylic acid esters, and modified products thereof, amides and salts thereof formed by the reaction of poly(lower alkyleneimines) with polyesters having free carboxyl groups, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyester systems, modified polyacrylate systems, ethylene oxide / propylene oxide adduct compounds, and phosphate ester systems.

[0162] Examples of the structure of the dispersed resin (G) include random structures, block structures, graft structures, comb structures, and star structures. Among these, block structures or comb structures are preferred from the viewpoint of dispersion stability.

[0163] Commercially available dispersion resins (G) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, 2164, or Anti-Terra-U203, 204, or BYK-P from BYK-Chemie Japan. SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000, manufactured by Lubrizol Japan, including models such as 104, P104S, 220S, Lactimon, Lactimon-WS, or Bykumen. ,76500 etc., BASF Japan's EFKA-46,47,48,452,4008,4009,4010,4015,4020,4047,4050,4055,4060,4080,4400,4401,4402,4403,4406,4408,4300,4310,4320,4330,4340,450,451,453,4540,4550,4560,4800,5010,5065,5066,5070,7500,7554,1101,120,150,1501,1502,1503 etc., Ajisu Examples of resins include PA111, PB711, PB821, PB822, PB824, etc., as described in Japanese Patent Publication No. 2008-029901, Japanese Patent Publication No. 2009-155406, Japanese Patent Publication No. 2010-185934, Japanese Patent Publication No. 2011-157416, International Publication No. 2008 / 007776, Japanese Patent Publication No. 2008-029901, Japanese Patent Publication No. 2009-155406, Japanese Patent Publication No. 2010-185934, Japanese Patent Publication No. 2011-157416, Japanese Patent Publication No. 2009-251481, Japanese Patent Publication No. 2007-23195, Japanese Patent Publication No. 1996-143651, etc.

[0164] The dispersion resin (G) can be used alone or in combination of two or more types.

[0165] From the viewpoint of storage stability, the content of the dispersion resin (G) is preferably 3 to 200 parts by mass, and more preferably 5 to 100 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0166] [Dye derivative (H)] The photosensitive composition of the present invention may contain a dye derivative (H).

[0167] The dye derivative (H) is not particularly limited and includes dye derivatives having acidic groups, basic groups, neutral groups, etc., in the organic dye residue. Examples of dye derivatives (H) include compounds having acidic substituents such as sulfo groups, carboxyl groups, and phosphate groups, as well as amine salts thereof, compounds having basic substituents such as sulfonamide groups or tertiary amino groups at the terminal, and compounds having neutral substituents such as phenyl groups or phthalimidoalkyl groups. Examples of organic dyes include pyrrolopyrrole compounds, anthraquinone compounds, quinacridone compounds, dioxazine compounds, perinone compounds, perylene compounds, thiaidine indigo compounds, triazine compounds, benzimidazolone compounds, indole compounds such as benzoisoindole, isoindoline compounds, isoindolinone compounds, quinophthalone compounds, naphthol compounds, surene compounds, metal complex compounds, azo compounds such as azo, disazo, and polyazo, and squarylium compounds.

[0168] Specifically, as pyrrolopyrrole dye derivatives, see Japanese Patent Publication No. 2001-220520, International Publication No. 2009 / 081930, International Publication No. 2011 / 052617, International Publication No. 2012 / 102399, Japanese Patent Publication No. 2017-156397, International Publication No. 2017 / 146092; as phthalocyanine dye derivatives, see Japanese Patent Publication No. 2007-226161, International Publication No. 2016 / 163351, Japanese Patent Publication No. 2017-165820, and Japanese Patent No. 5753266. As anthraquinone-based dye derivatives, see Japanese Patent Publication No. 63-264674, Japanese Patent Publication No. 09-272812, Japanese Patent Publication No. 10-245501, Japanese Patent Publication No. 10-265697, Japanese Patent Publication No. 2007-079094, International Publication No. 2009 / 025325. As quinacridone-based dye derivatives, see Japanese Patent Publication No. 48-54128, Japanese Patent Publication No. 03-9961, Japanese Patent Publication No. 2000-273383. As dioxazine-based dye derivatives, see Japanese Patent Publication No. 2011-16266. As for thiaidine indigo-based dye derivatives, see Japanese Patent Publication No. 2007-314785; as for triazine-based dye derivatives, see Japanese Patent Publication No. 61-246261, Japanese Patent Publication No. 11-199796, Japanese Patent Publication No. 2003-165922, Japanese Patent Publication No. 2003-168208, Japanese Patent Publication No. 2004-217842, Japanese Patent Publication No. 2007-314681; as for benzoisoindole-based dye derivatives, see Japanese Patent Publication No. 2009-57478; as for quinophthalone-based dye derivatives, Examples of naphthol-based dye derivatives include those described in Japanese Patent Publication No. 2003-167112, Japanese Patent Publication No. 2006-291194, Japanese Patent Publication No. 2008-31281, and Japanese Patent Publication No. 2012-226110. Examples of naphthol-based dye derivatives include those described in Japanese Patent Publication No. 2012-208329 and Japanese Patent Publication No. 2014-5439. Examples of azo-based dye derivatives include those described in Japanese Patent Publication No. 2001-172520 and Japanese Patent Publication No. 2012-172092. Examples of squarylium-based dye derivatives include the compounds described in International Publication No. 2018 / 230387. Examples of acidic substituents include those described in Japanese Patent Publication No. 2004-307854, and examples of basic substituents include those described in Japanese Patent Publication Nos. 2002-201377, 2003-171594, 2005-181383, and 2005-213404. Note that these documents may refer to dye derivatives as derivatives, pigment derivatives, dispersants, pigment dispersants, or simply compounds; however, compounds having substituents such as acidic groups, basic groups, or neutral groups on the aforementioned organic dye residues are synonymous with dye derivatives.

[0169] The dye derivative (H) can be used alone or in combination of two or more types.

[0170] [Thermosetting compound (I)] The photosensitive composition of the present invention may contain a thermosetting compound (I). This allows the thermosetting compound (I) to react during the heating process, increasing the crosslinking density and thus improving heat resistance.

[0171] Thermosetting compound (I) may be a low molecular weight compound or a high molecular weight compound such as a resin. Examples of thermosetting compound (I) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

[0172] (Epoxy compound (I1)) Epoxy compounds (I1) include, for example, polycondensates of bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnolbornene, tetrahydroindene, divinylbenzene) and phenols. Examples include polymers of phenols (such as divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.), polycondensates of phenols and ketones (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (such as benzenedimethanol, α,α,α',α'-benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (such as α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine epoxy resins, and glycidyl ester epoxy resins obtained by glycidylating alcohols, etc.

[0173] Commercially available products include, for example, Epicoat 807, 815, 825, 827, 828, 190P, 191P manufactured by Yuka Shell Epoxy Co., Ltd., TECHMORE VG3101L manufactured by Mitsui Chemicals, Inc., EPPN-201, 501H, 502H manufactured by Nippon Kayaku Co., Ltd., EOCN-102S, 103S, 104S, 1020 manufactured by Japan Epoxy Resins Co., Ltd., Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154, Celloxide 2021, EHPE-3150 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S, etc. manufactured by Nissan Chemical Industries, Ltd.

[0174] The content of the epoxy compound (I1) is preferably 0.5 to 50% by mass, more preferably 1 to 40% by mass, in 100% by mass of the non-volatile content of the photosensitive composition.

[0175] (Oxetane compound (I2)) The oxetane compound (I2) is a known compound having an oxetane group. Examples of the oxetane compound include monofunctional oxetane compounds, difunctional oxetane compounds, and trifunctional or higher oxetane compounds.

[0176] Examples of the monofunctional oxetane compound include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, and the like.

[0177] Commercially available products include, for example, OXE-10, 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., OXT-101, 212 manufactured by Toagosei Co., Ltd., and the like.

[0178] Examples of bifunctional oxetane compounds include 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3- Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycos(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl(3-ethyl- Examples include 3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, and EO-modified bisphenol F (3-ethyl-3-oxetanylmethyl) ether.

[0179] Examples of commercially available products include OXBP and OXTP manufactured by Ube Industries, and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0180] Examples of oxetane compounds with three or more functionalities include pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and caprolactone-modified dipenta Examples include erythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropanetetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing oxetane groups (for example, the oxetane-modified phenol novolac resin described in Japanese Patent No. 3783462), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the aforementioned OXE-30.

[0181] The content of oxetane compound (I2) is preferably 0.5 to 50% by mass, and more preferably 1 to 40% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0182] Melamine compounds are compounds having a melamine ring structure. Methylol-type and ether-type melamine compounds are preferred, and melamine compounds with an average of 5.0 or more methylol groups and / or ether groups per melamine ring are more preferred. Having a moderate number of methylol groups and / or ether groups makes it easier to obtain adequate heat resistance.

[0183] Examples of commercially available products include Nikarac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417, and MX-410 from Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, and 370 from Nippon Cytec Industries Co., Ltd.

[0184] Among these, Nikalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MX-45 from Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 300, 301, 303, 350 from Nippon Cytec Industries Co., Ltd. are preferred in that they can increase the crosslinking density, as they have an average of 5.0 or more methylol groups and / or ether groups per melamine ring.

[0185] Thermosetting compound (I) can be used alone or in combination of two or more types.

[0186] [Hardening agent (hardening accelerator)] The photosensitive composition of the present invention may be used in combination with a curing agent (curing accelerator) to assist in the curing of the thermosetting compound (I). Examples of curing agents include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, etc. Examples of curing agents include amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivatives, bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, Examples include 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc., phosphorus compounds (e.g., triphenylphosphine), S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine isocyanuric acid adduct, etc.).

[0187] The hardening agent can be used alone or in combination of two or more types.

[0188] The curing agent content is preferably 0.01 to 15 parts by mass per 100 parts by mass of thermosetting compound (I).

[0189] [Thiol-based chain transfer agent (J)] The photosensitive composition of the present invention may contain a thiol-based chain transfer agent (J). When used in combination with a photopolymerization initiator (C), the thiol-based chain transfer agent (J) generates thiyl radicals that are less susceptible to polymerization inhibition by oxygen during radical polymerization after light irradiation, thereby improving the photosensitivity of the photosensitive composition.

[0190] The thiol-based chain transfer agent (J) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), and more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0191] Polyfunctional thiols include, for example, hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, and pentaerythritol. Examples include lithritol tetrakisthiopropionate, tris(2-hydroxyethyl) isocyanurate trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Preferably, examples include ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol tetrakisthiopropionate.

[0192] Thiol-based chain transfer agents (J) can be used alone or in combination of two or more types.

[0193] The content of the thiol-based chain transfer agent (J) is preferably 1 to 10 parts by mass, and more preferably 2 to 8 parts by mass, per 100 parts by mass of the nonvolatile content of the photosensitive composition. Including an appropriate amount improves photosensitivity and makes it less likely for wrinkles to form on the surface of the cured film.

[0194] [Polymerization inhibitor (K)] The photosensitive composition of the present invention may contain a polymerization inhibitor (K).

[0195] The polymerization inhibitor (K) is, for example, catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-t-butylcatechol, 3-t-butylcatechol, 4-t-butylcatechol, 3,5-di-t-butylcatechol and other alkylcatechol compounds, 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, 4-t-butylresorcinol and other alkylresorcinol compounds, methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone and other alkylhydroquinone compounds, tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, tribenzylphosphine and other phosphine compounds, trioctylphosphine oxide, triphenylphosphine oxide and other phosphine oxide compounds, triphenylphosphite, trisnonylphenylphosphite and other phosphite compounds, pyrogallol, phloroglucin and the like.

[0196] The content of the polymerization inhibitor (K) is preferably 0.01 to 0.4% by mass in 100% by mass of the nonvolatile content of the photosensitive composition.

[0197] [Ultraviolet absorber (L)] The photosensitive composition of the present invention can contain an ultraviolet absorber (L).

[0198] The ultraviolet absorber (L) is an organic compound that has ultraviolet absorption function, and examples include benzotriazole organic compounds, triazine organic compounds, benzophenone organic compounds, salicylate organic compounds, cyanoacrylate organic compounds, and salicylate organic compounds.

[0199] Benzotriazole organic compounds include, for example, 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, and 2-[2-hydroxy-3,5-bis(α, [α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 5% by mass of 2-methoxy-1-methylethyl acetate and 95% by mass of benzenepropanoic acid, a mixture of 3-(2H-benzotriazole2-yl)-(1,1-dimethylethyl)-4-hydroxy,C7-9 side chain and linear alkyl ester, 2-(2H-benzotriazole2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazole2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl Reaction product of 3-(3-(2H-benzotriazole2-yl)-5-t-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300, 2-(2H-benzotriazole2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazole2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazole2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazole2-yl)-6-t-butyl Examples include 4-methylphenol, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole2-yl)phenyl]propionate, and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole2-yl)phenyl]propionate.

[0200] Examples of commercially available products include TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, and 1130 from BASF Japan; ADEKA LA-29, LA-31RG, LA-32, and LA-36 from ADEKA Corporation; KEMISORB 71, 73, 74, 79, and 279 from Chemipro Chemical Co., Ltd.; and RUVA-93 from Otsuka Chemical Co., Ltd.

[0201] Triazine-based organic compounds include, for example, 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, and the reaction of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidic acid ester. Products include 2,4-bis"2-hydroxy-4-butoxyphenyl"-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine.

[0202] Examples of commercially available products include KEMISORB 102 from Chemipro Chemical Co., Ltd., TINUVIN 400, 405, 460, 477, 479, and 1577ED from BASF Japan, ADEKA LA-46 and LA-F70 from ADEKA Corporation, and CYASORB UV-1164 from Sun Chemical Co., Ltd.

[0203] Examples of benzophenone-based organic compounds include 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone 5-sulfonic acid 3-hydrobenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2,2'-di-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, and 2-hydroxy-4-methoxy-2'-carboxybenzophenone.

[0204] Examples of commercially available products include KEMISORB 10, 11, 11S, 12, and 111 from Chemipro Chemical Co., Ltd., SEESORB 101 and 107 from Cipro Chemical Co., Ltd., ADEKA Stab 1413 from ADEKA Corporation, and UV-12 from Sun Chemical Co., Ltd.

[0205] Examples of salicylic acid ester organic compounds include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate.

[0206] The amount of ultraviolet absorber (L) is preferably 5 to 70% by mass of the total mass of photopolymerization initiator (D) and ultraviolet absorber (L).

[0207] [Antioxidant (M)] The photosensitive composition of the present invention may contain an antioxidant (M). The antioxidant (M) prevents the photopolymerization initiator (C) and thermosetting compound (I) in the photosensitive composition from yellowing due to oxidation during thermal curing or ITO annealing. In particular, when the concentration of the near-infrared absorbing dye (A) in the photosensitive composition is high, the content of the polymerizable compound (B) decreases relatively, and if this is addressed by increasing the amount of the photopolymerization initiator (C) or by adding a thermosetting compound, the cured film is prone to yellowing. Therefore, by including an antioxidant (M), yellowing of the cured film due to oxidation during the heating process is prevented. The antioxidant (M) is preferably a compound that does not contain halogen atoms.

[0208] Antioxidants (M) include, for example, hindered phenol, hindered amine, phosphorus, sulfur, and hydroxylamine compounds. Among these, hindered phenol antioxidants, hindered amine antioxidants, phosphorus antioxidants, and sulfur antioxidants are preferred.

[0209] Hindered phenol antioxidants, for example, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), stearyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5] Undecane, 1,3,5-Tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-Tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-Methylenebis(6-t-butyl-4-ethylphenol), 2,2'-Thiodiethylbis-(3,5-di -t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), i-octyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4 ,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediolbis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, Examples include 2,2'-thio-bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethylphenol), 2,2'-methylene-bis-(6-(1-methylcyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methylcyclohexyl)-phenol.

[0210] Examples of commercially available products include ADEKA's ADEKA stub AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, AO-330; Chemipro's KEMINOX 101, 179, 76, 9425; BASF Japan's IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, 565; and Sun Chemical's Cyanox CY-1790, CY-2777.

[0211] Hindered amine antioxidants include, for example, tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidine-4-yl)carbonate, and 1,2,2,6,6-pentamethyl-4-piperidyl. Tamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensate of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1- Ester of piperidineethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazine-2-yl]-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester of decandioate, reaction product of 1,1-dimethylethyl hydroperoxide and octane, bis(1,2,2,6,6-pentamethyl-4-pyriperidyl)[[3,5-bi (1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonatemethyl 1,2,2,6,6-pentamethyl-4-pyriperidyl sebacate, poly[[6-morpholino-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 2,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid ester, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,Examples include 6-hexamethylenediamine and 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide.

[0212] Examples of commercially available products include ADEKA's ADEKA Stab LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, LA-502XP; KAMISTAB29, 62, 77, 94 from Chemipro Chemical; Tinuvin111FDL, 123, 144, 249, 292, 5100 from BASF Japan; and SiaSove UV-3346, UV-3529, UV-3853 from Sun Chemical.

[0213] Phosphorus-based antioxidants include, for example, di(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-t-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-t-butylphenyl) phosphite, tris(nonylphenyl) phosphite, tetra(C12~C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, and diphenyl mono (2-ethylhexyl) phosphite, diphenylisodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenyldiphosphonate, tris(tridecyl) phosphite, phenylisooctyl phosphite, phenylisodecyl phosphite, phenyldi(tridecyl) phosphite, diphenylisooctyl phosphite, diphenyltridecyl phosphite, 4,4'-isopropylide Diphenolalkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-t-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl Examples include 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-t-butylphenyl) phosphite, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)benzene, and ethylbis(2,4-di-t-butyl-6-methylphenyl) phosphite.

[0214] Examples of commercially available products include ADEKA's ADEKA Stub PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, TPP; BASF Japan's IRGAFOS168; and Clariant Chemicals' Hostanox P-EPQ.

[0215] Examples of sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol.

[0216] Examples of commercially available products include ADEKA's ADEKA stub AO-412S and AO-503, and KEMINOXPLS from Chemipro Chemical Co., Ltd.

[0217] Antioxidants (M) can be used alone or in combination of two or more types.

[0218] The antioxidant (M) content is preferably 0.5 to 5.0% by mass of 100% by mass of the nonvolatile content of the photosensitive composition.

[0219] [Leveling agent (N)] The photosensitive composition of the present invention may contain a leveling agent (N). This further improves the wettability and drying properties to the substrate during coating. Examples of leveling agents (N) include silicone-based surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

[0220] Examples of silicone-based surfactants include linear polymers composed of siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0221] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, 3570 from Bic Chemie, and FZ-7002, 211 from Toray Dow Corning. Examples include 0, 2122, 2123, 2191, 5609, and Shin-Etsu Chemical Co., Ltd.'s X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341, etc.

[0222] Examples of fluorinated surfactants include surfactants or leveling agents having fluorocarbon chains.

[0223] Examples of commercially available products include Surflon S-242, 243, 420, 611, 651, and 386 from AGC Seimi Chemical; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, and 576, as well as R-40-LM, R-41, RS-72-K, and DS-21 from DIC; FC-4430 and 4432 from Sumitomo 3M; EF-PP31N09, EF-PP33G1, and EF-PP32C1 from Mitsubishi Materials Electronic Chemicals; and Futergent 602A from Neos.

[0224] Nonionic surfactants include, for example, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myristelle ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylenedistyrenated phenyl ether, polyoxyethylene tribenzylphenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, sorbitan tristearate Examples include sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitan tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkylimidazoline, etc.

[0225] Commercially available products include, for example, Kao's Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, L S-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodor SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW- L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amit 102, Examples include 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA's Adekapluronic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R, and Kyoeisha Chemical's (meth)acrylic acid-based (co)polymer Polyflow-No.75, No.90, No.95.

[0226] Cationic surfactants include, for example, alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride, and their ethylene oxide adducts.

[0227] Examples of commercially available products include Acetamine 24, Cotamin 24P, 60W, and 86P Concentrate, all manufactured by Kao Corporation.

[0228] Examples of anionic surfactants include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine styrene-acrylic acid copolymer, and polyoxyethylene alkyl ether phosphate esters.

[0229] Examples of commercially available products include Neos's Futergent 100 and 150, and ADEKA's Adeka Hope YES-25, Adeka Call TS-230E, PS-440E, and EC-8600.

[0230] Examples of amphoteric surfactants include alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetic acid betaine, and alkylamine oxides such as lauryldimethylamine oxide.

[0231] Examples of commercially available products include Anchitol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, ​​and 20N, manufactured by Kao Corporation.

[0232] Leveling agent (N) can be used alone or in combination of two or more types.

[0233] The leveling agent (N) content is preferably 0.001 to 2.0% by mass, and more preferably 0.005 to 1.0% by mass, based on 100% by mass of the non-volatile content of the photosensitive composition. Including an appropriate amount further improves the balance between the coating properties and adhesion of the photosensitive composition.

[0234] [Storage stabilizer (O)] The photosensitive composition of the present invention may contain a storage stabilizer (O). This stabilizes the viscosity of the photosensitive composition over time. Examples of storage stabilizers (O) include benzyltrimethyl chloride, quaternary ammonium chlorides such as diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as t-butylpyrocatechol, tetraethylphosphine, and tetraphenyl, and phosphates.

[0235] The storage stabilizer (O) content is preferably 0.1 to 10 parts by mass per 100 parts by mass of near-infrared absorbing dye (A).

[0236] [Adhesion enhancer (P)] The photosensitive composition of the present invention may contain an adhesion enhancer (P). This improves the adhesion between the cured film and the substrate. It also makes it easier to form narrow patterns using photolithography.

[0237] Adhesion enhancer (P) is, for example, a silane coupling agent. Examples of silane coupling agents include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane; (meth)acryloxysilanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane; epoxy silanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; and N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane and N-2-(aminoethyl) Silane coupling agents include aminosilanes such as -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and hydrochloride salts of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; mercaptos such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryls such as p-styryltrimethoxysilane; ureidos such as 3-ureidopropyltriethoxysilane; sulfides such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanates such as 3-isocyanatetopropyltriethoxysilane.

[0238] Adhesion enhancers (P) can be used alone or in combination of two or more types.

[0239] The content of the adhesion enhancer (P) is preferably 0.01 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0240] [Organic solvent (Q)] The photosensitive composition of the present invention may contain an organic solvent (Q).

[0241] Organic solvent (Q) is, for example, 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy- 3-Methylbutylacetate, 3-Methoxybutanol, 3-Methoxybutylacetate, 4-Heptanone, m-Xylene, m-Diethylbenzene, m-Dichlorobenzene, N,N-Dimethylacetamide, N,N-Dimethylformamide, n-Butyl alcohol, n-Butylbenzene, n-Propylacetate, N-Methylpyrrolidone, o-Xylene, o-Chloritolene, o-Diethylbenzene, o-Dichlorobenzene, p-Chloritolene, p-Diethylbenzene, sec-Butylbenzene, tert-Butylbenzene, γ-Butyl Lactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Examples include dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, dibasic acid esters, and the like. Among these, from the viewpoint of pigment dispersibility and alkali-soluble resin solubility, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate, alcohols such as benzyl alcohol and diacetone alcohol, and ketones such as cyclohexanone are preferred.

[0242] Organic solvent (Q) can be used alone or in combination of two or more types.

[0243] [Method for producing a photosensitive composition] The photosensitive composition of the present invention can be produced by manufacturing a dispersion by adding, for example, a near-infrared absorbing dye (A), a dispersion resin (G), and an organic solvent (Q) and performing a dispersion treatment. Subsequently, a polymerizable compound (B), a photopolymerization initiator (C), a sensitizer (D), and a binder (E) can be added to the dispersion and mixed. The timing of adding each material is arbitrary. Furthermore, the dispersion process can be performed multiple times.

[0244] Examples of distributed processing machines include two-roll mills, three-roll mills, ball mills, horizontal sand mills, vertical sand mills, annular bead mills, or attritors.

[0245] The average dispersed particle size (secondary particle size) of the near-infrared absorbing dye (A) in the dispersion is preferably 30 to 200 nm, and more preferably 40 to 200 nm. Having an appropriate particle size makes it easier to obtain a photosensitive composition with high dispersion stability.

[0246] The method for measuring the average dispersed particle diameter (secondary particle diameter) uses, for example, Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power-spectrum method), with particle permeability set to absorption mode, particle shape to non-spherical, and D50 particle diameter as the average diameter. The diluent solvent used for measurement is the same organic solvent used for dispersion, and it is preferable to measure immediately after sample preparation of ultrasonically treated samples to obtain results with less variation.

[0247] The photosensitive composition is preferably subjected to centrifugation, sintering filter filtration or membrane filter filtration to remove coarse particles of 5 μm or larger, preferably 1 μm or larger, more preferably 0.5 μm or larger, and any mixed dust. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0248] <Cured film> The cured film of the present invention is obtained by curing a film formed using the photosensitive composition of the present invention through a process such as exposure. The cured film is preferably a film with a pattern formed on it, but it may also be a flat film.

[0249] [Method for manufacturing hardened film] The method for manufacturing a cured film is not particularly limited, and for example, it can be manufactured by a step of applying a photosensitive composition to a substrate to form a layer of the composition (1), exposing the layer in a patterned manner through a mask (2), alkaline developing the unexposed areas to form a patterned cured film (3), and heat-treating the pattern (post-bake) (4).

[0250] The method for manufacturing the cured film will be described in detail below. (Process (1)) Step (1) of forming a layer of composition involves applying the photosensitive composition onto a substrate by methods such as rotary coating, roll coating, slit coating, casting coating, or inkjet coating, and then drying (pre-baking) it at a temperature of 50 to 120°C for 10 to 120 seconds using an oven, hot plate, etc., if necessary. Examples of the substrate include glass substrates and silicon substrates. For example, an image sensor such as a CCD or CMOS may be formed on the surface of the silicon substrate. In addition, a primer layer may be provided on the substrate as needed to improve adhesion with the upper layer, prevent diffusion of materials, and flatten the substrate surface. The layer thickness is preferably 0.05 to 10.0 μm after drying, and more preferably 0.3 to 5 μm.

[0251] (Process (2)) In the exposure process, the layer obtained in step (1) is exposed to a specific pattern through a mask using an exposure device such as a stepper. This results in a cured film. Examples of radiation used for exposure include ultraviolet rays such as g-rays, h-rays, and i-rays. Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). Furthermore, exposure may be performed by continuously irradiating with light, or by repeatedly irradiating and pausing with light in short cycles (e.g., milliseconds or less) (pulsed exposure).

[0252] (Step (3)) The cured film obtained in step (2) is subjected to alkaline development, which causes the unexposed portion of the composition to dissolve in the alkaline aqueous solution, leaving only the cured portion and resulting in a patterned cured film. Examples of developing solutions include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. The developer concentration is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11-13, and more preferably 11.5-12.5. Using a moderate pH suppresses pattern roughness and peeling, and improves the residual film rate after development.

[0253] Development methods include, for example, the dip method, spray method, and paddle method. The development temperature is preferably 15 to 40°C. After alkaline development, it is preferable to wash with pure water.

[0254] (Step (4)) The heat treatment (post-bake) involves thoroughly curing the patterned hardened film obtained in step (3) by heating. The heating temperature for post-bake is preferably 80 to 300°C. The heating time is preferably 2 minutes to 1 hour, and more preferably 3 minutes to 30 minutes. When a substrate made of a material with low heat resistance is used, or when a substrate having an organic electroluminescent element as a light source is used, the temperature is preferably 150°C or lower, and more preferably 130°C or lower.

[0255] <Optical filters> The cured film of the present invention can be used in optical filters. Examples of optical filters include infrared cut filters and infrared transmission filters. The optical filters of the present invention can be manufactured in the same manner as the cured film described above.

[0256] <Image display device> The cured film of the present invention can be used in an image display device. The form in which it is used in an image display device is not particularly limited, but it can be used in combination with a color filter containing a coloring agent.

[0257] When the cured film of the present invention and a color filter are used in combination, it is preferable that the color filter is positioned on the optical path of the cured film of the present invention. For example, the cured film of the present invention and the color filter can be laminated and used as a laminate. In the laminate, the cured film and the color filter may or may not be adjacent in the thickness direction. If the cured film and the color filter of the present invention are not adjacent, the cured film of the present invention may be formed on a substrate other than the substrate on which the color filter is formed. In addition, other components (for example, microlenses or planarization films) may be present between the cured film and the color filter of the present invention.

[0258] Examples of image display devices include liquid crystal displays and organic EL displays. For definitions of image display devices and details of various image display devices, see, for example, "Electronic Display Devices" (by Akio Sasaki, Kogyo Chosakai Co., Ltd., published in 1990) and "Display Devices" (by Junsho Ibuki, Sangyo Tosho Co., Ltd., published in 1989).

[0259] <Solid-state image sensor> The cured film of the present invention can be used in solid-state image sensors. The form in which it is used in solid-state image sensors is not particularly limited, but for example, a substrate may have a plurality of photodiodes constituting the light-receiving area of ​​a solid-state image sensor (CCD image sensor, CMOS image sensor, or organic CMOS image sensor, etc.), and a transfer electrode made of polysilicon or the like, a light-shielding film made of tungsten or the like with an opening only for the light-receiving portion of the photodiode on the photodiode and the transfer electrode, a device protection film made of silicon nitride or the like formed on the light-shielding film so as to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiode, and the cured film of the present invention on the device protection film. Furthermore, a configuration may have a light-gathering means (e.g., a microlens, etc.) on the device protection film and beneath the cured film of the present invention.

[0260] <Infrared sensor> The cured film of the present invention can be used in infrared sensors. The form in which it is used in infrared sensors is not particularly limited. Figure 1 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor equipped with the cured film of the present invention. The infrared sensor shown in Figure 1 comprises a 100 and a solid-state image sensor 110.

[0261] The imaging area on the solid-state image sensor 110 is formed by combining an infrared cut filter 111 and a color filter 112.

[0262] The infrared cut filter 111 can be formed using the photosensitive composition of the present invention, and transmits light in the visible light region (e.g., light with a wavelength of 400 to 700 nm) and blocks light in the infrared region (e.g., light with a wavelength of 800 to 1,300 nm).

[0263] The color filter 112 is a color filter in which pixels that transmit and absorb light of specific wavelengths in the visible light region are formed. For example, a color filter in which red (R), green (G), and blue (B) pixels are formed is used.

[0264] Between the infrared transmission filter 113 and the solid-state image sensor 110, a resin film 114 is placed that can transmit light of wavelengths that have passed through the infrared transmission filter 113.

[0265] The infrared transmission filter 113 is a filter that has visible light shielding properties and transmits infrared rays of a specific wavelength. Preferably, the infrared transmission filter 113 shields light with wavelengths of 400 to 830 nm and transmits light with wavelengths of 900 to 1,300 nm.

[0266] A microlens 115 is positioned on the incident light h side of the color filter 112 and the infrared transmission filter 113. A planarization film 116 is formed to cover the microlens 115.

[0267] In the configuration shown in Figure 1, a resin film 114 is arranged, but an infrared transmission filter 113 may be formed instead of the resin film 114.

[0268] This infrared sensor can simultaneously capture image information, enabling motion sensing and other applications that recognize moving objects. Furthermore, because it can acquire distance information, it can capture images containing 3D data. In addition, this infrared sensor can also be used as a biometric authentication sensor.

[0269] Furthermore, the cured film of the present invention can also be used in applications such as micro-LEDs (Light Emitting Diodes) and micro-OLEDs (Organic Light Emitting Diodes). While not particularly limited, it is preferably used in optical filters for micro-LEDs and micro-OLEDs. Examples of micro-LEDs and micro-OLEDs are described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

[0270] Furthermore, the cured film of the present invention can also be used in applications such as quantum dot displays. While not particularly limited, it is preferably used in optical filters used in quantum dot displays. [Examples]

[0271] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" refers to "parts by mass" and "%" refers to "percentage by mass". Furthermore, in this invention, non-volatile content or non-volatile content concentration refers to the mass residue after standing in an oven at 230°C for 30 minutes.

[0272] Prior to the examples, each measurement method will be described.

[0273] The weight-average molecular weight (Mw), number-average molecular weight (Mn), acid value (mgKOH / g), amine value (mgKOH / g), and glass transition temperature (Tg) of the resin are measured as follows.

[0274] (Average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with a radioisotope detector. An HLC-8220GPC (Tosoh Corporation) was used, with two separation columns connected in series. Both columns were packed with two TSK-GEL SUPER HZM-N columns. Measurements were performed at an oven temperature of 40°C, using tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1% by mass of the above eluent, and 20 microliters were injected. Molecular weights are expressed on a polystyrene basis.

[0275] (Acid value of resin) 0.5 to 1 g of resin solution was mixed with 80 ml of acetone and 10 ml of water and stirred to dissolve uniformly. A 0.1 mol / L aqueous KOH solution was used as the titrant, and the solution was titrated using an automatic titrator ("COM-555," manufactured by Hiranuma Sangyo Co., Ltd.) to measure the acid value (mg KOH / g). The acid value per unit of non-volatile content of the resin was then calculated from the acid value of the resin solution and the concentration of non-volatile content of the resin solution.

[0276] (Amine value of resin) The amine value of the resin is calculated by converting the total amine value (mgKOH / g), which was measured according to the ASTM D 2074 method, into a non-volatile content value.

[0277] (Glass transition temperature) The glass transition temperature of the resin was measured using a differential scanning thermal analyzer. 5 mg of the sample was weighed into a sample pan and heated from -20 to 200°C at a heating rate of 10°C / min under a nitrogen atmosphere.

[0278] <Manufacturing of near-infrared absorbing dye (A)> (Near-infrared absorbing dye (A-1)) 400 parts toluene, 40.0 parts 1,8-diaminonaphthalene, 32.2 parts 3,5-dimethylcyclohexanone, and 0.087 parts p-toluenesulfonic acid monohydrate were mixed and heated and stirred under a nitrogen atmosphere under reflux for 3 hours. Water produced during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was complete, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization in a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts toluene and 160 parts n-butanol, and 13.8 parts 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated and stirred under a nitrogen atmosphere under reflux for 8 hours. Water produced during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was complete, the solvent was distilled, and 200 parts of hexane were added to the resulting reaction mixture while stirring. The resulting dark brown precipitate was filtered off, and then washed sequentially with hexane, ethanol, and acetone. The mixture was dried under reduced pressure to obtain a near-infrared absorbing dye (A-1) represented by the following chemical formula (16). Fifty parts of the obtained near-infrared absorbing dye (A-1), 500 parts of sodium chloride, and 60 parts of diethylene glycol were placed in a stainless steel gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 60°C for 12 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour while heating to approximately 80°C to form a slurry. After filtering and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried overnight at 80°C and then pulverized to obtain finely ground near-infrared absorbing dye (A-1).

[0279] Chemical formula (16) [ka]

[0280] (Near-infrared absorbing dye (A-2)) 400 parts toluene, 40.0 parts 1,8-diaminonaphthalene, 50.1 parts 2-hydroxy-9-fluorenone, and 0.087 parts p-toluenesulfonic acid monohydrate were mixed and heated and stirred under a nitrogen atmosphere under reflux for 3 hours. Water produced during the reaction was removed from the system by azeotropic distillation. After the reaction was complete, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization in a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts toluene and 160 parts n-butanol, and 13.8 parts 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated and stirred under a nitrogen atmosphere under reflux for 8 hours. Water produced during the reaction was removed from the system by azeotropic distillation. After the reaction was complete, the solvent was distilled, and 200 parts hexane was added to the resulting reaction mixture while stirring. After filtering off the obtained dark brown precipitate, the material was sequentially washed with hexane, ethanol, and acetone, and dried under reduced pressure to obtain a near-infrared absorbing dye (A-2) represented by the following chemical formula (17). A miniaturized near-infrared absorbing dye (A-2) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0281] Chemical formula (17) [ka]

[0282] (Near-infrared absorbing dye (A-3)) In a reaction vessel, 178 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 40 parts of anhydrous aluminum chloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution was cooled to 30°C while stirring, and then injected with stirring into a mixed solvent consisting of 5,000 parts methanol and 10,000 parts water to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts methanol and 4,000 parts water, and dried to obtain compound a. Next, 10 parts of compound a were added to 100 parts of concentrated sulfuric acid in a reaction vessel under ice bath conditions, and the mixture was stirred for 1 hour. Subsequently, 1,000 parts of this sulfuric acid solution were poured into 3°C cold water, and the resulting precipitate was filtered, washed with water, washed with a 2.5% sodium hydroxide aqueous solution, washed with water, and dried to obtain compound b. 5 parts diphenyl phosphate was added to 200 parts N-methylpyrrolidone and thoroughly mixed, then heated to 50°C. 10 parts compound b was added little by little to this solution, and the mixture was stirred at 90°C for 120 minutes. The endpoint of the reaction was confirmed, for example, by dropping the reaction solution onto filter paper until the bleeding stopped. Subsequently, 2,000 parts of deionized water were added to this reaction solution, and the resulting precipitate was filtered, washed with water, and dried to obtain the near-infrared absorbing dye (A-3) represented by the following chemical formula (18). A miniaturized near-infrared absorbing dye (A-3) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0283] Chemical formula (18) [ka]

[0284] (Near-infrared absorbing dye (A-4)) In accordance with International Publication No. 2019 / 058882, a near-infrared absorbing dye (A-4) represented by the following chemical formula (19) was obtained. A miniaturized near-infrared absorbing dye (A-4) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0285] Chemical formula (19) [ka]

[0286] (Near-infrared absorbing dye (A-5)) In a reaction vessel, 26 parts phthalonitrile, 143 parts 2,3-dicyanonaphthalene, 890 parts n-amyl alcohol, 137 parts DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 34 parts aluminum trichloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution, which was cooled to 30°C while stirring, was poured into a mixed solvent consisting of 5,000 parts methanol and 10,000 parts deionized water while stirring to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts methanol and 4,000 parts deionized water, and dried to obtain compound c. Next, 140 parts of compound c were added to 1,500 parts of concentrated sulfuric acid in a reaction vessel under ice bath conditions, and the mixture was stirred for 1 hour. Subsequently, 1,000 parts of 3°C cold water were poured into this sulfuric acid solution, and the resulting precipitate was filtered, washed with water, washed with a 2.5% sodium hydroxide aqueous solution, washed with water, dried, and compound d was obtained. 5 parts diphenyl phosphate was added to 200 parts N-methylpyrrolidone and thoroughly mixed, then heated to 50°C. 10 parts compound d was added little by little to this solution, and the mixture was stirred at 90°C for 120 minutes. The endpoint of the reaction was identified, for example, by dropping the reaction solution onto filter paper until the bleeding stopped. Subsequently, 2,000 parts of deionized water were added to this reaction solution, and the resulting precipitate was filtered, washed with water, and dried to obtain a near-infrared absorbing dye (A-5), which is a mixture of compounds represented by the following chemical formula (20) (mass ratio: n1:n2:n3:n4 = 7:19:59:15). A miniaturized near-infrared absorbing dye (A-5) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0287] Chemical formula (20) [ka]

[0288] (Near-infrared absorbing dye (A-6)) In a reaction vessel, 10.7 parts of aniline, 120 parts of bromobenzene, and 25.7 parts of diazabicyclooctane were added and stirred. Then, 95.2 parts of a 1 mol / 1 toluene solution of titanium tetrachloride were added dropwise. After the dropwise addition, 10.0 parts of indigo were added and the mixture was refluxed for 10 hours. After the reaction was complete, methanol was added, the mixture was filtered, and a green powder was obtained. This was separated from the green powder with dichloromethane and water, and the organic layer was concentrated to obtain 14.6 parts of compound e. In a reaction vessel, 13.5 parts of compound e, 9.0 parts of bis(2,4-pentanedionato)zinc(II), and 120 parts of tetrahydrofuran were mixed and stirred, and the mixture was heated and stirred at 40°C for 5 hours. The reaction solution was cooled to 30°C while stirring, and then poured into 500 parts of methanol while stirring to obtain a blue slurry. This slurry was filtered, washed with 500 parts of methanol, washed with 500 parts of water, and dried to obtain a near-infrared absorbing dye (A-6), which is a mixture of compounds represented by the following chemical formula (21) (mass ratio: dimer:trimer:tetramer = 81:17:2). A miniaturized near-infrared absorbing dye (A-6) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0289] Chemical formula (21) [ka]

[0290] <Manufacturing of binder resin (E)> (Binder resin (E-1) solution) In a separable flask equipped with a thermometer, condenser, nitrogen gas inlet tube, monomer dropper tube, chain transfer agent dropper tube, and stirrer, 100 parts of propylene glycol monomethyl ether acetate (hereinafter also referred to as PGMAc) were charged, the reaction vessel was purged with nitrogen, and the temperature was raised to 90°C while stirring. Dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate (hereinafter also referred to as MD) was added through the monomer dropper tube. A mixture of 10 parts of (u), 40 parts of methacrylic acid (hereinafter also called MAA), 48.5 parts of lauryl methacrylate (hereinafter also called LMA), 1.5 parts of methyl methacrylate (hereinafter also called MMA), 2 parts of t-butyl peroxy-2-ethylhexanoate and 29 parts of PGMAc as polymerization initiators, and a mixture of 5.5 parts of n-dodecanethiol and 33 parts of PGMAc were added dropwise over 2 hours from a chain transfer agent dropping tube. After the dropwise addition was complete, the temperature was raised to 110°C 1 hour later, and the mixture was reacted for 3 hours thereafter to obtain a precursor resin. After cooling to room temperature, the mixture was replaced with an oxygen / nitrogen mixture of 5 / 95. Next, 41.3 parts of glycidyl methacrylate (hereinafter also referred to as GMA), 0.05 parts of 6-t-butyl-2,4-xylenol, and 0.4 parts of triethylamine were added as the modification compound, and the mixture was reacted at 110°C for 9 hours to introduce polymerizable unsaturated groups. After cooling to room temperature, approximately 2 parts of the resin solution were sampled and heated and dried at 180°C for 20 minutes to measure the non-volatile content. PGMAc was then added to prepare the binder resin (E-1) solution so that the non-volatile content was 20% by mass. The glass transition temperature (Tg) was 8°C, and the weight-average molecular weight (Mw) was 13,400.

[0291] (Binder resin (E-2)~(E-5) solution) By varying the types and amounts of monomers and modified compounds, binder resin solutions (E-2) to (E-5) listed in Table 1, with a non-volatile content of 20% by mass, were obtained.

[0292] [Table 1]

[0293] The symbols listed in Table 1 are as follows: MD: Dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate BzMI:N-benzylmaleimide IBXMA: Isobornyl methacrylate DCPMA: Dicyclopentanyl methacrylate BzMA: Benzyl methacrylate CHMA: Cyclohexyl methacrylate 2-EHA: 2-ethylhexyl acrylate GMA: Glycidyl methacrylate LMA: Lauryl methacrylate BMA: Butyl methacrylate MMA: Methyl methacrylate AA: Acrylic acid MAA: Methacrylic acid THPA: Tetrahydrophthalic anhydride

[0294] <Manufacturing of Dispersed Resin (G)> (Dispersion resin (G-1) solution) In a reactor equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 40 parts methyl methacrylate, 10 parts n-butyl methacrylate, and 13.2 parts tetramethylethylenediamine as catalyst were charged, and the mixture was stirred at 50°C for 1 hour while flowing nitrogen, and the system was purged with nitrogen. Next, 9.3 parts ethyl bromoisobutyrate as initiator, 5.6 parts cuprous chloride as catalyst, and 100 parts PGMAc were charged, and the temperature was raised to 110°C under a nitrogen atmosphere to start polymerization of the first block (block B). After 4 hours of polymerization, the polymerization solution was sampled and the non-volatile content was measured, and it was confirmed that the polymerization conversion rate was 98% or higher based on the non-volatile content. Next, 50 parts PGMAc, 40 parts dimethylaminoethyl methacrylate and 10 parts methacryloyloxyethyl benzyldimethylammonium chloride as monomers for the second block (block A) were added to this reactor, and the reaction was continued by stirring while maintaining 110°C and a nitrogen atmosphere. Two hours after the start of the reaction, the polymerization solution was sampled and its non-volatile content was measured. Based on the non-volatile content, it was confirmed that the polymerization conversion rate of the second block (block A) was 98% or higher, and the reaction solution was cooled to room temperature to stop the polymerization. GPC measurement results showed that the polymer had a mass-average molecular weight of 20,000, a molecular weight distribution Mw / Mn of 1.4, and a reaction conversion rate of 98.5%. In this way, a dispersion resin (G-1) with an amine value of 169.8 mgKOH / g per non-volatile content was obtained. After cooling to room temperature, approximately 2 g was sampled and heated and dried at 180°C for 20 minutes, and the non-volatile content was measured. PGMAc was added to prepare a dispersion resin (G-1) solution so that the non-volatile content was 30% by mass.

[0295] <Dispersion manufacturing> (Dispersion 1) After stirring and mixing the following raw materials until uniform, the mixture was dispersed for 3 hours using an Eiger mill (Eiger Japan's "Mini Model M-250 MKII") with a 0.5 mm diameter zirconia bead, and then filtered through a 1.0 μm pore size filter to prepare dispersion 1. The organic solvent (Q-1) is PGMAc. Near-infrared absorbing dye (A-1): 15.0 parts Dispersion resin (G-1) solution: 20.0 parts Organic solvent (Q-1): 65.0 parts

[0296] (Dispersion 2~6) Dispersions 2-6 were prepared in the same manner as dispersion 1, except that the raw materials and quantities listed in Table 2 were changed.

[0297] [Table 2]

[0298] <Manufacturing of photosensitive compositions> [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and filtered through a filter with a pore size of 1.0 μm to obtain photosensitive composition 1. Dispersion 1: 10.0 parts Dispersion 3: 25.0 parts Binder resin (E-3) solution: 30.0 parts Polymerizable compound (B1-1) represented by general formula (1): 3.85 parts Other polymerizable compounds (B2-2): 3.15 parts Photopolymerization initiator (C-2): 0.5 parts Benzophenone compound (D1-1): 1.0 part Leveling agent (N): 1.0 part Organic solvent (Q): 25.5 parts

[0299] [Examples 2-34, Comparative Examples 1-6] (Photosensitive compositions 2-39) Photosensitive compositions 2 to 39 were prepared in the same manner as in Example 1, except that the raw materials and quantities of photosensitive composition 1 in Example 1 were changed to those listed in Tables 3-1 to 3-4.

[0300] [Table 3-1]

[0301] [Table 3-2]

[0302] [Table 3-3]

[0303] [Table 3-4]

[0304] The raw materials listed in Tables 3-1 to 3-4 are as follows:

[0305] [Polymerizable compound (B)] (Polymerizable compound represented by general formula (1) (B1)) B1-1: Compound represented by the above chemical formula (11) B1-2: Compound represented by the above chemical formula (12) B1-3: Compound represented by the above chemical formula (15)

[0306] (Other polymerizable compounds (B2)) B2-1: Compound represented by the following chemical formula B2-2: Compound represented by the following chemical formula B2-3: Compound represented by the following chemical formula B2-4: Compound represented by the following chemical formula B2-5: Compound represented by the following chemical formula

[0307] [ka]

[0308] [Photopolymerization initiator (C)] C-1: Omnirad 369 (manufactured by IGM Resins, alkylphenone compound) C-2: Omnirad 907 (manufactured by IGM Resins, alkylphenone compound) C-3: Omnirad 184 (manufactured by IGM Resins, alkylphenone compound) C-4: Omnirad TPO (manufactured by IGM Resins, an acylphosphine oxide compound) C-5: B-CIM (manufactured by Hodogaya Chemical Co., Ltd., a biimidazole compound) C-6:1-(9,9-dibutyl-9H-fluoren-2-yl)-2-methyl-2-morpholin-4-yl-propan-1-one (alkylphenone compound) C-7: IRGACURE OXE-01 (manufactured by BASF Japan, oxime compound) C-8: IRGACURE OXE-02 (manufactured by BASF Japan, oxime compound)

[0309] [Sensitizer (D)] (Benzophenone compound (D1)) D1-1: 4,4'-Bis(diethylamino)benzophenone (Thioxanthone compound (D2)) D2-1: 2,4-Diethylthioxanthone

[0310] [Leveling agent (N)] N-1: BYK-330 (manufactured by Big Chemie Co., Ltd.) N-2: Megafuck F-551 (manufactured by DIC Corporation) As described above, (N-1) and (N-2) were mixed in 1 part each and dissolved in 98 parts PGMAc to form a mixed solution which was used as the leveling agent (N).

[0311] [Organic solvent (Q)] Q-1: Propylene glycol monomethyl ether acetate 30 parts Q-2: Cyclohexanone 30 parts Q-3: 3-Ethoxypropionate 10 parts Q-4: Propylene glycol monomethyl ether 10 parts Q-5: Cyclohexanol acetate 10 parts Q-6: Dipropylene glycol methyl ether acetate 10 parts The above (Q-1) to (Q-6) were mixed in the above-mentioned parts by mass to obtain organic solvent (Q).

[0312] <Evaluation of photosensitive compositions> The obtained photosensitive compositions 1 to 39 (Examples 1 to 33, Comparative Examples 1 to 6) were evaluated for storage stability, development residue, aggregated foreign matter, and pattern shape using the methods described below. The evaluation results are shown in Table 4.

[0313] [Storage stability evaluation] The obtained photosensitive compositions were placed in sealed containers and stored at 40°C for one week. The rate of change in viscosity before and after storage was calculated and evaluated using the following formula. Viscosity was measured using an E-type viscometer (ELD-type viscometer manufactured by Toki Sangyo Co., Ltd.) at 25°C and a rotation speed of 50 rpm. The evaluation criteria are as follows, with a score of 2 or higher indicating practical usability. [Percentage change in viscosity over time] = |([Initial viscosity] - [Viscosity over time]) / [Initial viscosity]| × 100 3: Those with a change rate of less than 5% 2: Those with a change rate of 5% or more but less than 10% 1: Those with a change rate of 10% or more

[0314] [Developing residue evaluation] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) using a spin coater to a dry film thickness of 2.0 μm, and dried on a hot plate at 70°C for 1 minute. Then, an illuminance of 30 mW / cm² was used with an ultra-high pressure mercury lamp. 2 40 mJ / cm² 2 The substrate was then exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling the substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, and air-dried. The resulting substrate was post-baked in a clean oven at 230°C for 20 minutes to form a stripe pattern on the substrate. The obtained substrates were observed using a microscope, and the amount of residue remaining in the unexposed areas was evaluated by image binarization. The evaluation criteria are as follows, with a score of 2 or higher indicating practical usability. 3: Development residue is less than 1.5% of the unexposed area. 2: Development residue is between 1.5% and less than 3% of the unexposed area. 1: Development residue covers 3% or more of the unexposed area.

[0315] [Pattern shape evaluation (1): Linearity] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) by spin coating to a dry film thickness of 2.0 μm, and dried on a hot plate at 70°C for 1 minute. After cooling the substrate to room temperature, it was illuminated at 30 mW / cm² using a high-pressure mercury lamp through a 100 μm wide stripe pattern photomask. 2 40 mJ / cm² 2 The substrate was exposed to light. Subsequently, this substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, air-dried, and heated in a clean oven at 230°C for 20 minutes to obtain a substrate for pattern shape evaluation. The obtained pattern shape evaluation substrate was evaluated by measuring the maximum and minimum line widths of 10 stripe patterns using a Nikon ECLIPSE LV100POL Model optical microscope and calculating the average. The evaluation criteria are as follows, with a score of 3 or higher indicating practical usability. 5: The difference between the maximum and minimum line widths is less than 0.5 μm. 4: The difference between the maximum and minimum line widths is 0.5 μm or more, and less than 1.0 μm. 3: The difference between the maximum and minimum line widths is 1.0 μm or more, and less than 1.5 μm. 2: The difference between the maximum and minimum line widths is 1.5 μm or more, and less than 2.0 μm. 1: The difference between the maximum and minimum line widths is 2.0 μm or more.

[0316] [Pattern Shape Evaluation (2): Cross-sectional Shape] Using a scanning electron microscope (Hitachi High-Tech Corporation's "S-3000H"), the cross-sectional shape of the pattern was confirmed on the substrate created in pattern shape evaluation (1). The evaluation was performed by acquiring SEM images of the cross-section of a 100 μm wide stripe pattern and measuring the taper angle between the substrate and the edge of the pattern cross-section. The evaluation criteria are as follows, with a score of 3 or higher considered practical. 5: Taper angle of 30 degrees or more and less than 50 degrees 4: Taper angle 50 degrees or more and less than 60 degrees 3: Taper angle less than 30 degrees or 60 degrees or more but less than 70 degrees 2: Taper angle 70 degrees or more and less than 90 degrees 1: Taper angle of 90 degrees or more

[0317] [Evaluation of aggregated foreign matter] Using a scanning electron microscope (Hitachi High-Tech Corporation's "S-3000H"), the surface of the pattern was observed on the substrate created in pattern shape evaluation (1). The particle size of 50 aggregates was measured, and the average value was calculated to determine the average particle size. The evaluation criteria are as follows, with a score of 3 or higher indicating practical usability. 5: The average particle size of the aggregate is less than 100 nm. 4: The average particle size of the aggregate is between 100 nm and 300 nm. 3: The average particle size of the aggregate is between 300 nm and 500 nm. 2: The average particle size of the aggregate is between 500 nm and 1,000 nm. 1: The average particle size of the aggregate is 1,000 nm or larger.

[0318] [Table 4] [Explanation of symbols]

[0319] 100 Infrared Sensors 110 Solid-state image sensor 111 Infrared Cut Filter 112 Color Filters 113 Infrared transmission filter 114 Resin film 115 Microlenses 116 Flat membrane

Claims

1. A photosensitive composition comprising a near-infrared absorbing dye (A), a polymerizable compound (B), a photopolymerization initiator (C), a sensitizer (D), and a binder resin (E), The near-infrared absorbing dye (A) comprises at least one selected from the group consisting of naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds. The polymerizable compound (B) contains 55% by mass or more of polymerizable compound (B1) represented by the following general formula (1) in 100% by mass, The photopolymerization initiator (C) comprises at least one selected from the group consisting of alkylphenone compounds, acylphosphine oxide compounds, and biimidazole compounds. The sensitizer (D) comprises a benzophenone compound (D1), The benzophenone compound (D1) includes 4,4'-bis(diethylamino)benzophenone, The photopolymerization initiator (C) is a photosensitive composition that is substantially free of oxime compounds. General formula (1) 【Chemistry 1】 (In general formula (1), R １ Each of these independently represents either a hydrogen atom or a methyl group, and X is either a hydrogen atom or a group represented by the following general formula (2). General formula (2) 【Chemistry 2】 (In general formula (2), L represents a divalent linking group, and * represents a bond that connects to the oxygen atom in general formula (1).)

2. The photosensitive composition according to claim 1, wherein the content of the sensitizer (D) is 150 to 400 parts by mass per 100 parts by mass of the photopolymerization initiator (C).

3. A cured film obtained by curing the photosensitive composition according to claim 1 or 2.

4. An optical filter having the cured film described in claim 3.

5. An image display device having the cured film according to claim 3.

6. A solid-state image sensor having the cured film described in claim 3.

7. An infrared sensor having a cured film as described in claim 3.

Images