Multi-node server

Abstract

To provide a multi-node server that can be rapidly replaced with another computing node.SOLUTION: A multi-node server includes a server case, a main circuit board, a power adaptor circuit board, and a signal adaptor module. The main circuit board has a first node area and a second node area. The power adaptor circuit board is disposed vertically on the main circuit board. The first side of the power adaptor circuit board has a first power input connector and a second power input connector. The second side of the power adaptor circuit board has a first power output connector facing the first node area and a second power input connector facing the second node area. The signal adaptor module has a signal adaptor circuit board, a first signal connector, and a second signal connector. The signal adaptor circuit board is parallel to the main circuit board. The signal adaptor circuit board electrically connects the first signal connector to the second signal connector.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multi-node server, and particularly to a server having two or more nodes.

Background Art

[0002] Conventionally, general server forms include single-node servers and multi-node servers. A "node" refers to a basic unit that stores and processes data within a data structure. Types of "nodes" include, for example, "computing nodes" responsible for computing processes, "storage nodes" for storing data, "network nodes" that connect different nodes to each other and connect the entire computing cluster to the outside, and "control nodes" for users to manage the entire computing cluster.

[0003] Compared with single-node servers, multi-node servers have replaceability and expandability in function allocation. Currently, general multi-node servers are mainly composed of central processing unit (CPU) computing nodes, and each CPU computing node can be designed according to various requirements by combining different access interfaces (I / O Ports), data storage hardware (Storage Disk), add-on cards, etc.

[0004] When there is a demand for deep computing using artificial intelligence (AI), one of the nodes can be replaced with a computing node equipped with a graphics processing unit (GPU). Similarly, when high-density data storage is required, one of the nodes can be replaced with a storage node equipped with multiple storage disk slots. While existing single nodes allow for rapid replacement, each node performs computing independently and lacks signal connectivity between nodes. To implement the two different functionalities described above, it is necessary to connect signals from one of the nodes to the CPU computing node. Generally, signal lines are used to connect these signals, but limitations in signal line length and cable management prevent rapid replacement in single-node systems.

[0005] Therefore, overcoming the aforementioned shortcomings through improvements in structural design, in order to enable multi-node servers to be quickly replaced by other computing nodes, is a challenge that needs to be addressed in this field. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] The technical problem that this invention aims to solve is to provide a multi-node server that can rapidly replace nodes, in response to the shortcomings of the prior art. [Means for solving the problem]

[0007] To solve the above technical problems, one technical means employed by the present invention is to provide a multi-node server, which includes a server case, a main circuit board, a power adapter circuit board, and a signal adapter module. The main circuit board is installed inside the server case and has a first node area and a second node area. The power adapter circuit board is installed perpendicularly on the main circuit board and has a first power input connector and a second power input connector on a first side surface of the power adapter circuit board. The second side surface of the power adapter circuit board has a first power output connector and a second power input connector, the second side surface facing the first side surface, the first power output connector facing the first node area, and the second power output connector facing the second node area. The signal adapter module includes a signal adapter circuit board, a first signal connector, and a second signal connector, and the signal adapter circuit board is installed along a direction parallel to the main circuit board. The signal adapter circuit board electrically connects the first signal connector and the second signal connector.

[0008] The advantage of the multi-node server in this embodiment lies in the fact that, by combining a vertical power adapter circuit board (Power deliver board) and a horizontal high-speed signal adapter circuit board (Signal transfer board), the maximum rack density can be achieved in a 1U dual-node system configuration. This allows for the rapid replacement of single nodes without increasing the length of the server case.

[0009] To further understand the features and technical content of the invention, please refer to the detailed description of the present invention and the accompanying drawings below. However, the accompanying drawings provided are for reference and illustrative purposes only and are not intended to limit the scope of the claims of the present invention. [Brief explanation of the drawing]

[0010] [Figure 1]This is a three-dimensional exploded view showing the multi-node server of the present invention. [Figure 2] This is an exploded view showing the vertical integrated circuit substrate module of the present invention. [Figure 3] A three-dimensional assembly diagram showing the vertical integrated circuit substrate module of the present invention. [Figure 4] Another three-dimensional composite diagram showing the vertical integrated circuit substrate module of the present invention. [Figure 5] This is a top view showing the multi-node server of the present invention. [Figure 6] This is a schematic diagram showing the heat dissipation airflow of the multi-node server of the present invention. [Modes for carrying out the invention]

[0011] Referring to Figures 1 to 5, an embodiment of the present invention provides a multi-node server 100, which includes a server case 10, a main circuit board 20, a power adapter circuit board 30, and a signal adapter module 40. The main circuit board 20 is installed inside the server case 10 and includes at least two node areas, namely a first node area A1 and a second node area A2, but the present invention is not limited thereto. For example, one of the node areas may house a central processing unit (CPU) computing node, and the other node area may house a graphics processing unit (GPU) computing node or a storage node. The power adapter circuit board 30 and the signal adapter module 40 can be called vertical integrated circuit board modules.

[0012] As shown in Figures 1 to 3, the power adapter circuit board 30 is mounted vertically on the main circuit board 20. The power adapter circuit board 30 has opposing first and second sides, the first side facing the power supply (P1, P2) and the second side facing the opposite side of the power supply (P1, P2), i.e., the node area (A1, A2). The first side of the power adapter circuit board 30 is provided with a first power input connector 31A and a second power input connector 31B.

[0013] A first power output connector 32A and a second power output connector 32B are provided on the second side of the power adapter circuit board 30. The first power output connector 32A faces the first node area A1, and the second power output connector 32B faces the second node area A2.

[0014] The power input connector 31A faces away from the first node area A1 and is positioned to receive power from the first power supply P1. The first power input connector 31A is connected to the first power output connector 32A and the second power output connector 32B via the plate body 32 of the power adapter circuit board 30, supplying power to the first node device N1 and the second node device N2 (see Figure 6). The second power input connector 31B faces away from the second node area A2 and is positioned to receive power from the second power supply P2. Similarly, the second power input connector 31B is connected to the first power output connector 32A and the second power output connector 32B via the plate body 32 of the power adapter circuit board 30, supplying power to the first node device N1 and the second node device N2 (see Figure 6). In embodiments of the present invention, a single power supply (either the first power supply P1 or the second power supply P2) can simultaneously supply power to the first node device N1 and the second node device N2.

[0015] As shown in Figures 2 and 3, the structure of this embodiment has the advantage of promoting the flow of heat dissipation airflow. Specifically, an intermediate fixing portion 320, a first side fixing portion 321, and a second side fixing portion 322 are formed on the upper edge of the power adapter circuit board 30. The intermediate fixing portion 320 is located between the first side fixing portion 321 and the second side fixing portion 322, and as a result, ventilation grooves 323 are formed on both sides of the intermediate fixing portion 320, thereby enabling the heat dissipation airflow to flow horizontally.

[0016] As shown in Figure 1, the method for fixing the power adapter circuit board 30 in this embodiment is to provide a fixing frame 50. The fixing frame 50 is mounted laterally on the server case 10 and provides a suspension fixing function. The fixing frame 50 has a horizontal frame 51, a pair of side frames 52, and a vertical frame 53. The pair of side frames 52 are connected to both ends of the horizontal frame 51 and are fixed to the side walls 12 on both sides of the server case 10. The vertical frame 53 is located between the side walls 12 on both sides and can contact and be fixed to the main circuit board 20.

[0017] Referring to Figures 2 to 4, the first side fixing portion 321 and the second side fixing portion 322 of the power adapter circuit board 30 each have assembly fixing holes 3220, allowing them to be fixed to the horizontal frame 51 (see Figure 1). In addition, the intermediate fixing portion 320 of the power adapter circuit board 30 can be fixed to the vertical frame 53.

[0018] The signal adapter module 40 includes a signal adapter circuit board 41, at least one first signal connector 42A, and at least one second signal connector 42B. The signal adapter circuit board 41 is arranged parallel to the main circuit board 20. The signal adapter circuit board 41 electrically connects the first signal connector 42A and the second signal connector 42B. The advantage of this arrangement in this embodiment is that no wiring is required to connect the two nodes, thus eliminating constraints on wiring length and eliminating the need for cable management. The first signal connector 42A and the second signal connector 42B of the signal adapter circuit board 41 allow the first node device N1 and the second node device N2 to be quickly attached and detached, thereby enabling rapid replacement.

[0019] As shown in Figures 2 to 4, specifically, the signal adapter circuit board 41 has an intermediate segment 411, a first adapter segment 412A, and a second adapter segment 412B. The intermediate segment 411 is connected between the first adapter segment 412A and the second adapter segment 412B. The width of the intermediate segment 411 is smaller than the widths of the first adapter segment 412A and the second adapter segment 412B. The signal adapter circuit board 41 further includes a ventilation recess 413, which is concavely formed between the first adapter segment 412A and the second adapter segment 412B. As a result, the signal adapter circuit board 41 has a substantially U-shape. The width and position of the ventilation recess 413 correspond to the first power input connector 31A and the second power input connector 31B, thereby helping the heat dissipation airflow to flow vertically.

[0020] Referring to Figures 1 and 6, the signal adapter circuit board 41 is installed elevated above the main circuit board 20. As shown in Figures 2 and 3, the first signal connector 42A is installed on the bottom surface of the first adapter segment 412A, and the second signal connector 42B is installed on the bottom surface of the second adapter segment 412B. In this embodiment, the signal adapter circuit board 41 is elevated using the first signal connector 42A and the second signal connector 42B, and this structure also has the effect of promoting the flow of heat dissipation air. Furthermore, the first signal connector 42A has an engagement end face 422, and the second signal connector 42B also has an engagement end face 422. The engagement end face 422 of the first signal connector 42A faces the first node area A1, and the engagement end face 422 of the second signal connector 42B faces the second node area A2. Specifically, the signal connector has a roughly L-shaped signal terminal 421, one end of which is connected upward to the signal adapter circuit board 41, and the other end is bent and faces the node area.

[0021] As shown in FIGS. 2, 3, and 5, in this embodiment, the length of the power adapter circuit board 30 is shorter than the length of the signal adapter circuit board 41. Specifically, the power adapter circuit board 30 is located between the first signal connector 42A and the second signal connector 42B. On the second side surface of the power adapter circuit board 30 in this embodiment, a first identification connector 33A and a second identification connector 33B are further provided. Referring also to FIG. 5 (the fixed frame 50 is omitted), the first identification connector 33A is connected to the first identification plug N13 of the first node device N1, and the second identification connector 33B is connected to the second identification plug N23 of the second node device N2. The identification connector can identify which device the connected node is, for example, whether it is a CPU computing node, a GPU computing node, or a storage node.

[0022] As shown in FIGS. 2 and 3, on the second side surface of the power adapter circuit board 30, a first alignment device 34A and a second alignment device 34B are further provided. The first alignment device 34A and the second alignment device 34B of this embodiment are cylindrical, and the first node device N1 and the second node device N2 can be accurately engaged with the power adapter circuit board 30. Referring also to FIG. 5, the first alignment device 34A is connected to the first alignment plug N14 of the first node device N1, and the second alignment device 34B is connected to the second alignment plug N24 of the second node device N2.

[0023] As shown in FIG. 3, the first identification connector 33A is located between the first alignment device 34A and the first power input connector 31A, and the second identification connector 33B is located between the second alignment device 34B and the second power input connector 31B.

[0024] As shown in Figures 1 and 6, the multi-node server of this embodiment further includes an air guide cover (air baffle) 60, which is installed outside the first power input connector 31A and the second power input connector 31B. The air guide cover 60 includes an arc-shaped section 61, a pair of side shrouds 62, and a top shroud 63. The pair of side shrouds 62 are each connected to both sides of the arc-shaped section 61 and are positioned outside the heat dissipation inlets of the power supplies (P1, P2). The top shroud 63 is positioned on the top surface of the arc-shaped section 61, and both ends of the top shroud 63 are fixed to the pair of side shrouds 62.

[0025] As shown in Figure 1, in this embodiment, vents 142 and 143 can be formed in the top shell 14 of the server case 10, which roughly correspond to the positions of the external airflows W21 and W31 shown in Figure 6. The external airflow W31 is bent by the air guide cover 60 to form an independent central cooling airflow W32, which directly cools the power supply (P1, P2) and improves the cooling efficiency of the system. On the other hand, the external airflows W21 on both sides directly cool the first node area A1 and the second node area A2, and are guided by the air guide cover 60 and the side wall 12 to form independent lateral cooling airflows W22.

[0026] [Beneficial effects of the embodiment] The advantage of the multi-node server according to this embodiment is that by combining a vertical power adapter circuit board (Power deliver board) and a horizontal signal adapter circuit board (Signal transfer board) capable of high-speed transmission, it is possible to achieve maximum rack density in a 1U dual-node system configuration. Single nodes can be quickly replaced without increasing the length of the server case.

[0027] In this embodiment, the power adapter circuit board and the signal adapter circuit board are divided into two boards. The vertical power adapter circuit board reduces the occupied area and secures space for heat dissipation airflow. On the other hand, the horizontal signal adapter circuit board has less impact on heat dissipation airflow and has superior overall heat dissipation performance. Furthermore, the high-speed signal portion is not affected by power supply interference, resulting in more stable system performance.

[0028] When power supply and signal connection functions are integrated onto the same circuit board, supplying both power and a high-speed signal source on the same board increases the board area, hindering heat dissipation airflow. The structural arrangement of the present invention can solve these problems.

[0029] The information disclosed above represents only preferred embodiments of the present invention and does not limit the scope of the claims. Therefore, all equivalent technical modifications made based on the specifications and accompanying drawings of the present invention are included within the scope of the claims. [Explanation of Symbols]

[0030] 100: Multi-node server 10: Server Case 12: Side wall 14: Top Shell 142, 143: Ventilation holes 20: Main circuit board 30: Power adapter circuit board 32: Plate 320: Intermediate fixing part 321: First side fixing part 322: Second side fixing part 323: Ventilation groove 31A: First power input connector 31B: Second power input connector 32A: First power output connector 32B: Second power output connector 33A: First identification connector 33B: Second identification connector 34A: First alignment device 34B: Second alignment device 40: Signal adapter module 41: Signal adapter circuit board 411: Intermediate segment 412A: First adapter segment 412B: Second adapter segment 413: Ventilated recess 42A: First signal connector 421: Signal terminal 422: Engaged end face 42B: Second signal connector 50: Fixed frame 51: Horizontal frame 52: Side frame 53: Vertical Frame 60: Air guide cover 61: Arc part 62: Side Shroud 63: Top Shroud A1: First node area A2: Second node area N1: First node device N13: First identification plug N14: First alignment plug N2: Second node device N23: Second identification plug N24: Second alignment plug P1: First power supply P2: Second power supply

Claims

1. Server case and A main circuit board installed inside the server case, having a first node area and a second node area, A power adapter circuit board is mounted vertically on the main circuit board, and has a first power input connector and a second power input connector on its first side surface, and a first power output connector facing the first node area and a second power output connector facing the second node area on its second side surface opposite to the first side surface, A signal adapter module including a first signal connector, a second signal connector, and a signal adapter circuit board installed in a direction parallel to the main circuit board and electrically connecting the first signal connector and the second signal connector, A multi-node server characterized by having the following features.

2. The multinode server according to claim 1, wherein the signal adapter circuit board has an intermediate segment, a first adapter segment and a second adapter segment, the intermediate segment connects the first adapter segment and the second adapter segment, the width of the intermediate segment is narrower than the width of the first adapter segment and the second adapter segment, and forms a ventilation recess, the width of the ventilation recess corresponds to the first power input connector and the second power input connector.

3. The multi-node server according to claim 2, wherein the signal adapter circuit board is installed elevated above the main circuit board, the first signal connector is installed on the bottom surface of the first adapter segment, and the second signal connector is installed on the bottom surface of the second adapter segment.

4. The multi-node server according to claim 3, wherein the first signal connector has a first engagement end face, the second signal connector has a second engagement end face, the first engagement end face faces the first node area, and the second engagement end face faces the second node area.

5. The multi-node server according to claim 1, wherein the power adapter circuit board is located between the first signal connector and the second signal connector.

6. The multi-node server according to claim 1, wherein the first power input connector is positioned facing away from the first node area and connected to the first power supply, and the second power input connector is positioned facing away from the second node area and connected to the second power supply.

7. The multi-node server according to claim 1, wherein the second side surface of the power adapter circuit board is further provided with a first identification connector and a second identification connector.

8. The multi-node server according to claim 7, wherein a first alignment device and a second alignment device are further provided on the second side surface of the power adapter circuit board.

9. The multi-node server according to claim 8, wherein the first identification connector is located between the first alignment device and the first power input connector, and the second identification connector is located between the second alignment device and the second power input connector.

10. The multi-node server according to claim 1, wherein an intermediate fixing portion, a first side fixing portion, and a second side fixing portion are formed on the upper edge of the power adapter circuit board, the intermediate fixing portion is located between the first side fixing portion and the second side fixing portion, and ventilation grooves are formed on both sides of the intermediate fixing portion.

11. The multinode server according to claim 1, further comprising an air guide cover, the air guide cover being installed outside the first power input connector and the second power input connector, the air guide cover including an arc-shaped portion and a pair of side shrouds, the pair of side shrouds each connected to both sides of the arc-shaped portion.

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