Wafer optical recognition device

Abstract

The present invention provides a wafer optical recognition device that can make image information captured by a camera clearer and solve the problem of reflection caused by insufficient light or an inaccurate angle of light. [Solution] The system consists of a shooting device for capturing image and text information on a semiconductor wafer, a light-emitting device equipped with multiple light-emitting components, a circuit board that recognizes the image and text information and controls the operation of the light-emitting components, and a light-refracting component that refracts the light emitted by the light-emitting components. If the shooting device cannot capture the image and text information on the semiconductor wafer clearly due to the influence of the angle, the light emitted from the light-emitting components on the light-emitting device passes through the light-refracting component, thereby enhancing or optimizing the light in the image and text information area. Furthermore, by allowing the user to change the light emission mode of the light-emitting components as needed via the circuit board, any problems related to the light of the image and text information can be solved.

Description

Technical Field

[0001] The present invention relates to a wafer optical recognition device, and in particular, it can clearly and accurately detect characters printed on a semiconductor wafer, and at the same time incorporates an AI image recognition function and an automatic learning function of images, and by utilizing light from various angles, it relates to a wafer optical recognition device that enables character recognition of a variety of semiconductor wafers.

Background Art

[0002] On the surface of a general semiconductor wafer, a number indicating the recognition information of the semiconductor wafer is printed, and this number is used in subsequent related manufacturing processes and inspection operations. For example, the main structure of Taiwan Patent No. M632730, "Wafer Number Printing Recognition Device", consists of an optical recognition component. On one side of the optical recognition component, a wafer placement unit is provided, and on one side of the wafer placement unit, an upper reflection component and a lower reflection component are provided. Thus, by placing the wafer on the wafer placement unit and reflecting the image of the upper surface of the wafer to the optical recognition component by the upper reflection component, and further reflecting the image of the lower surface of the wafer to the optical recognition component by the lower reflection component, the optical recognition component can recognize the number printed on the upper surface and the number printed on the lower surface from the images of the upper surface and the lower surface. In this way, the convenience in use is improved by being able to simultaneously read the numbers printed on the upper and lower surfaces of the wafer.

[0003] However, when using the above-mentioned wafer number printing recognition device, there are surely the following problems and drawbacks, and thus improvement is expected.

[0004] Although it has the function of printing and recognizing numbers, it cannot adjust the angle of the light beam. That is, when trying to print and recognize numbers on different semiconductor wafers with the recognition device, due to differences in the size of the wafers or differences in the positions where the numbers are printed, the recognition device cannot accurately recognize them, and the risk of misjudgment increases. Furthermore, due to reflection caused by the influence of ambient light, it may become impossible to accurately recognize. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Taiwan Patent No. M632730 Specification [Overview of the project] [Problems that the invention aims to solve]

[0006] The present invention aims to provide a wafer optical recognition device that controls the light emission modes of multiple light-emitting components using optical refractors and a circuit board, changes the light emission modes of the light-emitting components as needed, and diffuses the emitted light over a wider area by combining optical refractors, thereby making image and text information on a semiconductor wafer easier to see. In other words, it aims to provide a wafer optical recognition device that makes image information captured by an imaging device clearer and solves the problem of reflection due to insufficient light or an inaccurate angle of light. [Means for solving the problem]

[0007] To achieve the main objectives described above, the structure of the present invention comprises an imaging device for capturing image and character information on a semiconductor wafer, a light-emitting device equipped with multiple light-emitting components, a circuit board that recognizes the image and character information and controls the operation of the light-emitting components, and a light-refracting component that refracts the light emitted by the light-emitting components. If the image information captured by the imaging device of image and character information on a semiconductor wafer is not clear due to lighting problems, it can be controlled by a command from the circuit board, and the light emitted from the light-emitting components of the light-emitting device can be passed through the light-refracting component to enhance or optimize the light in the image and character information area. Furthermore, by changing the operating mode of the light-emitting components, it is possible to adjust so that the light-emitting component in the appropriate position is activated, thereby preventing problems such as insufficient light or reflection in the image and character information, and further making the image information clearer. [Effects of the Invention]

[0008] The above-described technology can solve the problems present in conventional wafer number marking recognition devices. Conventional wafer number marking recognition devices have the function of recognizing the engraved numbers, but they cannot adjust the angle of the light beam. In other words, when attempting to recognize numbers engraved on different semiconductor wafers with the recognition device, differences in size and the position of the engraved numbers can prevent the recognition device from accurately recognizing the numbers, and furthermore, the risk of misjudgment increases. Furthermore, the technology solves the problem of inaccurate recognition due to reflection caused by the influence of ambient light, thereby achieving the practical inventiveness of the above-described advantages. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of a preferred embodiment of the present invention. [Figure 2] This is a cross-sectional view of a preferred embodiment of the present invention. [Figure 3] This is an exploded view of a preferred embodiment of the present invention. [Figure 3A] This is a structural block diagram of a preferred embodiment of the present invention. [Figure 4] This is an embodiment diagram of a preferred embodiment of the present invention. [Figure 5] This is a cross-sectional view of another preferred embodiment of the present invention. [Figure 6] This is exploded view 1 of yet another preferred embodiment of the present invention. [Figure 6A] This is exploded view 2 of yet another preferred embodiment of the present invention. [Figure 7] This is a cross-sectional view of yet another preferred embodiment of the present invention. [Figure 8] This figure shows the adjustment of yet another preferred embodiment of the present invention. [Figure 9] This is an embodiment diagram of yet another preferred embodiment of the present invention. [Figure 10] This figure shows light enhancement in yet another preferred embodiment of the present invention. [Modes for carrying out the invention]

[0010] Refer to FIGS. 1 to 4. FIGS. 1 to 4 are implementation diagrams from perspective views of preferred embodiments of the present invention. As can be seen from the figures, the present invention comprises a photographing device 1, a light emitting device 2, a circuit board 3, an AI artificial intelligence chip 31, an optical refraction component 4, and a support component 51.

[0011] The photographing device 1 can photograph image and character information A1 on the semiconductor wafer A.

[0012] The light emitting device 2 is provided on one side of the photographing device 1, and the light emitting device 2 includes a plurality of light emitting components 21.

[0013] The circuit board 3 is provided on one side of the light emitting device 2 and is connected to the photographing device 1 and the light emitting device 2, so that it can acquire the video information 11 photographed by the photographing device 1, recognize the image and character information A1, and further control the operation of each of the light emitting components 21. Thereby, each of the light emitting components 21 can be operated alone or in combination with a plurality of the light emitting components 21.

[0014] The AI artificial intelligence chip 31 is provided on the circuit board 3. The AI artificial intelligence chip 31 can recognize the image and character information A1 and can learn and record the image and character information A1 in the video information 11.

[0015] The optical refraction component 4 is provided on one side of the light emitting device 2 and refracts the light emitted from each of the light emitting components 21.

[0016] The photographing device 1 and the light emitting device 2 are provided on the support component 51.

[0017] Among them, the image and character information A1 and the video information 11 are the model numbers of the semiconductor wafer A and include at least one of characters, numbers, or graphics.

[0018] Of these, the aforementioned imaging device 1 is either a camera or a radio.

[0019] In this embodiment, the light-emitting components 21 are LED lamps, and for example, eight of them are arranged in a line. Furthermore, in this embodiment, the imaging device 1 is provided at the center of each of the arranged light-emitting components 21.

[0020] Of these, the optical refraction component 4 is a convex lens.

[0021] Of these, the recognition of the aforementioned image / text information A1 is performed using Optical Character Recognition (OCR). Optical Character Recognition is a process that processes and recognizes images or videos containing text, and extracts information about the text and layout contained therein.

[0022] The circuit board 3 includes a processing module 32 that functions as an integrated circuit or IC chip, and the processing module 32 can recognize image and character information A1 and control the on / off state of the light-emitting component 21 in response to commands from the user.

[0023] To recognize image and character information A1 on semiconductor wafer A, first, semiconductor wafer A is placed in front of the imaging device 1. At this time, all light-emitting components 21 are lit to emit light 211. The light 211 is refracted and diffused as it passes through the light-refracting component 4, thereby increasing the area illuminated by the light 211. As a result, the image information 11 captured by the imaging device 1 also moves closer to the illumination range of the light 211. Therefore, for example, if all light-emitting components 21 are lit, the image and character information A1 in the image information 11 can be clearly seen, and if it is recognized correctly by the optical character recognition technology of the processing module 32, it can be seen that the image and character information A1 has been correctly recognized. On the other hand, if the image and character information A1 in the image information 11 is not recognized by the optical character recognition technology of the processing module 32 even though all light-emitting components 21 are lit, it can be seen that there is insufficient light 211 or that it is not being accurately recognized due to the effects of reflection or other factors. In this case, the user can operate the system via a computer interface or a physical control panel and send commands to the processing module 32, which then controls the light-emitting component 21 and changes its lighting mode.

[0024] Taking the reflection situation described above as an example, since the light refraction component 4 is a convex lens, refraction occurs in the light 211 emitted from the light-emitting component 21. In other words, with respect to the position where the imaging device 1 is placed, the captured video information 11 is affected by the refracted light 211, causing a reflection effect on the image / text information A1. When a reflection effect occurs, the image / text information A1 in the video information 11 becomes unclear, and the processing module 32 cannot accurately recognize the image / text information A1. Therefore, the user needs to control the operation of the light-emitting component 21 using the processing module 32. For example, each light-emitting component 21 of the present invention can be controlled individually or collectively by the processing module 32, such as lighting up only the three light-emitting components 21 in the top row of the eight light-emitting components 21, or lighting up only the three light-emitting components 21 located vertically in the left row, or lighting up only two light-emitting components 21 in the top row and only two light-emitting components 21 in the bottom row. The purpose of changing the illumination mode of the light-emitting components 21 is that if the image / text information A1 is not sufficiently illuminated even when the user illuminates the three light-emitting components 21 in the upper row, the illumination mode can be changed to illuminate only the three light-emitting components 21 located vertically in the left column. In other words, the user can freely control the on / off state of each light-emitting component 21 as needed by the processing module 32 to find the optimal angle of light 211, thereby enabling the processing module 32 to accurately recognize the image / text information A1.

[0025] Furthermore, the AI ​​artificial intelligence chip 31 can record the image / character information A1 acquired by the processing module 32 through optical character recognition each time, or it can improve the recognition speed by saving user-defined image / character information A1 (e.g., characters) in the record. In other words, by combining the processing module 32 and the AI ​​artificial intelligence chip 31, an AI-infused optical character recognition function (AI OCR) is realized. If the image / character information A1 recognized by the processing module 32 is unclear and the recognition process takes a lot of time, the AI ​​artificial intelligence chip 31 assists with recognition and matching. It reads the saved image / character information A1 record and matches it with the unclear image / character information A1. The AI ​​artificial intelligence chip 31 can improve the recognition speed by finding the most suitable image / character information A1 record through alternating matching and retrieving the image / character information A1 record.

[0026] Refer to Figure 5. Figure 5 is a cross-sectional view of another preferred embodiment of the present invention. As can be seen in the figure, a unidirectional light component 6 is provided between the light-emitting device 2 and the light-refracting component 4. In this embodiment, the imaging device 1 is located below the unidirectional light component 6; that is, the relative positional relationship between the imaging device 1 and the light-emitting device 2 is perpendicular. As shown in the figure, light from one side of the unidirectional light component 6 passes through the unidirectional light component 6 and illuminates the other side, but when light is illuminated from the other side of the unidirectional light component 6, the light does not pass from the unidirectional light component 6 to the other side. As a result, the light emitted from the light-emitting device 2 passes through the unidirectional light component 6 and the light-refracting component 4 to illuminate image and text information, and the imaging device 1 captures the image and text information by reflection effect from the other side of the unidirectional light component 6. Thus, the position of the imaging device 1 of the present invention is not limited, and the design of the unidirectional light component 6 allows for further enhancement of the resolution of image information even when the imaging device 1 is separated from the light-emitting device 2.

[0027] Refer to Figures 6 to 10. Figures 6 to 10 are exploded view 1 of yet another preferred embodiment of the present invention showing light enhancement. As can be seen from the figures, the difference between this embodiment and the other preferred embodiment described above is that one side of the imaging device 1 of this embodiment is provided with a focus adjustment component 7 for adjusting the focal length of the imaging device 1, the focus adjustment component 7 comprises an adjustment drive component 71 fixedly connected to the imaging device 1, the adjustment drive component 71 comprises a plurality of fixed parts 711 fixedly connected to the imaging device 1, a plurality of slide grooves 712 provided on one side of each fixed part 711, a drive component housing groove 713 provided between each slide groove 712, and a screw thread adjustment part 714 provided on one side of the drive component housing groove 713. Furthermore, a limiting component 72 is provided on the side of the adjustment drive component 71 away from the imaging device 1. The limiting component 72 includes a plurality of guide portions 721 that can be housed in the slide groove portion 712, and a limiting component housing groove portion 722 corresponding to the position of the housing groove portion 713 in the drive component is provided between each guide portion 721. An elastic component 73 is housed in the housing groove portion 713 of the drive component and the limiting component housing groove portion 722, and an adjustment component 74 is provided in common to the limiting component 72, the adjustment drive component 71, and the elastic component 73. The imaging device 1 and the light-emitting device 2 are provided on a support component 51, and the support component 51 and the limiting component 72 are mutually locked and connected to the outer cover body 52. ​​Furthermore, a reflective component 8 is provided on the side of the unidirectional light component 6 opposite to the light-emitting device 2 and the light-refracting component 4, and the reflective component 8 is located in the front part of the imaging device 1. Furthermore, at least one side of the optical refraction component 4 is provided with an optical enhancement light-emitting unit 91 that is electrically connected to the circuit board 3. The circuit board 3 is electrically connected to a power supply component 92, and the circuit board 3 is data-connected to a connector 93 that corresponds to a network communication protocol.

[0028] Of these, the fixing part 711 can be a screw hole, and the screw passes through the fixing part of the fixing part 711 and the imaging device 1, thereby fixing and connecting the imaging device 1 and the adjustment drive component 71 to each other.

[0029] Of these, the thread adjustment section 714 is a screw hole, and the adjustment part 74 is a screw, which allows the adjustment part 74 to be screwed into the thread adjustment section 714 and rotated.

[0030] When the drive component housing groove 713 and the limiting component housing groove 722 correspond to each other, they form a single housing space. The elastic component 73 is housed in this housing space, with one end of the elastic component 73 in contact with the bottom of the limiting component housing groove 722 and the other end in contact with the bottom of the drive component housing groove 713. As a result, the tension of the elastic component 73 causes the adjusting drive component 71 and the limiting component 72 to push against each other.

[0031] Of these components, the reflective component 8 is a type of reflector. Regarding the installation position in this embodiment, as shown in the figure, the light-emitting device 2, the unidirectional light component 6, and the light-refracting component 4 are provided on the same plane and arranged laterally. The unidirectional light component 6 and the reflective component 8 are arranged vertically, while the reflective component 8 and the imaging device 1 are arranged laterally.

[0032] Of these, the imaging device 1 and the light-emitting device 2 are mounted on the support component 51, which effectively enhances stability. For example, the imaging device 1 is more stable and less prone to shaking due to the design of the support component 51. This improves the resolution of image and text information, which in turn improves the speed at which the circuit board 3 recognizes image and text information, resulting in a significant increase in performance. The light-emitting device 2 can also output light more stably, which reduces problems such as reflections occurring in image and text information within the video information due to fluctuations in the light 211, and furthermore, insufficient light reaching image and text information located relatively close to the edges of the semiconductor wafer A.

[0033] Since the support component 51, the limiting component 72, and the outer cover body 52 are interlocked and connected to each other, the present invention can be carried without geographical limitations, thus greatly improving convenience.

[0034] Furthermore, the focus state of the adjustment imaging device 1 is used as an example.

[0035] If the focus of the imaging device 1 is misaligned, the manual tool B and the adjustment part 74 can be used in combination. When the manual tool B is rotated, the adjustment part 74 also rotates simultaneously, and the adjustment part 74 moves the thread adjustment part 714 of the focus adjustment part 7 simultaneously, causing it to rotate. At this time, the nut part of the adjustment part 74 abuts against the outer part of the limiting part 72, and the threaded part is inserted into the limiting part 72 and the adjustment drive part 71. As a result, even if the adjustment part 74 rotates, it is limited to the combination of the nut and the limiting part 72 and does not move forward. The adjustment drive part 71 moves forward or backward in accordance with the rotation of the adjustment part 74. At the same time, the elastic part 73 allows for smoother rotation even when the user rotates it. As a result, even when the imaging device 1 is out of focus, the focus can be manually adjusted with the focus adjustment part 7, maintaining the image information in an optimal state at all times, and allowing for clear viewing of image and text information.

[0036] Furthermore, we will explain the light path and the path for capturing image information.

[0037] Light 211 emitted from the light-emitting component 21 passes sequentially through the unidirectional light component 6 and the light-refracting component 4, and is irradiated onto the image and text information on the semiconductor wafer A. The image information path C acquired by the imaging device 1 reaches the imaging device 1 via the light-refracting component 4, the unidirectional light component 6, and the reflective component 8 in sequence. Briefly, because the reflective component 8 and the unidirectional light component 6 are positioned vertically, the imaging device 1 can capture the environment outside the light-refracting component 4 even when the imaging device 1 is located below the light-emitting device 2. This positional design allows for changes in the overall volume, thereby enabling the realization of a volume that meets specific needs by implementing various designs and arrangements according to the requirements of the installation environment.

[0038] Furthermore, let's discuss the lack of light.

[0039] If image and text information on semiconductor wafer A is located near the edge, and the light irradiated by the light-emitting device 2 is insufficient, or if the brightness of the original light 211 is insufficient, the processing module 32 of the circuit board 3 can control the light-enhancing light-emitting unit 91 to supplement the light irradiation. In other words, because the light-enhancing light-emitting unit 91 is installed at a specific angle, it can effectively irradiate image and text information located at the edge or with insufficient brightness, thus compensating for problems such as a narrow irradiation angle or insufficient brightness of the light-emitting device 2. Of course, in this embodiment, there is only one light-enhancing light-emitting unit 91 as an example, but if there are multiple, they can each be provided around the light-refracting component 4.

[0040] Furthermore, the power supply component 92, for example, a power socket, can supply the necessary power to the circuit board 3 via an external power source. Naturally, if there is no power supply component 92 that can provide an external power source, the circuit board can also be powered and used using the built-in battery.

[0041] Furthermore, all information acquired by the circuit board 3, including video information, is transmitted to an external device, such as a computer system, via the connector 93 connected by electrical wires, allowing the user to remotely control the device, thus achieving high convenience and practicality. Naturally, if the connector 93 is not available, a wireless transmission module can be added to the circuit board 3 to wirelessly transmit information to an external device, such as a WIFI or Bluetooth antenna.

[0042] Therefore, the key technologies that improve upon conventional technologies with the wafer optical recognition device of the present invention are as follows.

[0043] 1. By controlling the light emission modes of multiple light-emitting components 21 using the optical refractor 4 and the circuit board 3, the light emission modes of the light-emitting components 21 can be changed as needed. Furthermore, by combining the optical refractor 4, the emitted light 211 can be diffused over a wider area, thereby making the image and text information A1 on the semiconductor wafer A easier to see. In other words, the video information 11 captured by the imaging device 1 becomes clearer, and problems such as insufficient light 211 or reflection due to an inaccurate angle of light 211 do not occur.

[0044] Secondly, the Optical Character Recognition (OCR) technology of circuit board 3 achieves the advantages of rapid, clear, and stable recognition.

[0045] 3. Due to the design of the focus adjustment component 7, if the image information 11 captured by the imaging device 1 is not clear or out of focus, the focal length can be adjusted manually.

[0046] IV. The design of the adjustment drive component 71, the fixing part 711, the slide groove 712, the drive component housing groove 713, the screw thread adjustment part 714, the limiting component 72, the guide part 721, the limiting component housing groove 722, the elastic component 73, and the adjustment component 74 allows the user to rotate more smoothly, and the combination of the slide groove 712 and the guide part 721 allows for stable sliding, making it less prone to violent shaking. As a result, the video information 11 is always maintained in an optimal state, and the image and text information A1 can be seen clearly.

[0047] V. The design of the support component 51 makes the imaging device 1 more stable and less prone to shaking, thereby improving the resolution of the image and character information A1. As a result, the recognition speed of the image and character information A1 on the circuit board 3 is also increased, and the performance is greatly improved. Furthermore, the design of the outer cover body 52 not only allows the present invention to be moved without geographical limitations, but also effectively protects the internal components such as the imaging device 1, light-emitting device 2, circuit board 3, light-refracting component 4, unidirectional light component 6, reflective component 8, and light-enhancing light-emitting unit 91 from external impacts and environmental pollution.

[0048] 6. The design of the unidirectional optical component 6 allows the imaging device 1 to be separated from the light-emitting device 2, thereby effectively reducing the volume of the light-emitting device 2.

[0049] 7. By arranging the transmissive / reflective component 8 and the unidirectional light component 6 vertically, the environment outside the light refraction component 4 can be photographed even if the imaging device 1 is located below the light-emitting device 2. This positional design allows for changes in the overall volume, thereby enabling the realization of a volume that meets specific needs by implementing various designs and arrangements according to the requirements of the installation environment.

[0050] 8. The design of the AI ​​artificial intelligence chip 31 improves recognition speed.

[0051] IX. The light-enhancing light-emitting unit 91 can effectively illuminate the image / text information A1 located at the edge, thereby compensating for the narrow illumination angle of the light-emitting device 2. Furthermore, the power supply component 92 allows the circuit board 3 to be supplied with the necessary power from an external power source, enabling stable power output. In addition, the design of the connector 93 allows the user to operate it remotely, achieving high convenience and practicality. [Explanation of Symbols]

[0052] 1. Imaging device 11. Video Information 2. Light-emitting device 21 Light-emitting components 211 light 3 Circuit board 31 AI Artificial Intelligence Chips 32 Processing Modules 4. Light refraction components 51 Support parts 52 Outer cover body 6. Unidirectional optical components 7. Focus adjustment component 71 Adjustment drive parts 711 Fixed part 712 Slide groove 713 Drive component housing groove 714 Thread adjustment part 72 Restriction parts 721 Guide Section 722 Restriction component housing groove 73 Elastic components 74 Adjustment parts 8 Reflective parts 91 Light-enhancing light-emitting unit 92 Power supply components 93 Connectors A semiconductor wafer A1 Image and text information B Hand tools C Video Information Path

Claims

1. A wafer optical recognition device comprising an imaging device, a light-emitting device, a support component, a circuit board, and an optical refraction component, The imaging device captures image and character information on a semiconductor wafer, and one side of the imaging device is provided with a focus adjustment component for adjusting the focal length of the imaging device, the focus adjustment component comprises an adjustment drive component fixedly connected to the imaging device, the adjustment drive component comprises a screw thread adjustment section, an elastic component provided on the adjustment drive component, and an adjustment component drilled in the elastic component and connected to the screw thread adjustment section, The light-emitting device is provided on one side of the imaging device and comprises a plurality of light-emitting components. The aforementioned imaging device and the aforementioned light-emitting device are mounted on a support component. The circuit board is provided on one side of the light-emitting device and is connected to the imaging device and the light-emitting device, thereby acquiring video information captured by the imaging device, recognizing the image and text information, and further controlling the operation of each of the light-emitting components, so that each of the light-emitting components operates individually or in combination with others. The circuit board is electrically connected to a power supply component, and the circuit board is data-connected to a connector compatible with a network communication protocol. The wafer optical recognition device is characterized in that the optical refraction component is provided on one side of the light-emitting device and refracts the light emitted from each of the light-emitting components.

2. The adjustment drive component further comprises a plurality of fixed parts fixedly connected to the imaging device, a plurality of slide grooves provided on one side of each fixed part, and a drive component housing groove provided between each slide groove, A limiting component is provided on the side of the adjustment drive component away from the imaging device, and the limiting component comprises a plurality of guide portions housed in the slide groove, and between each of the guide portions, a limiting component housing groove is provided corresponding to the position of the drive component housing groove. The screw thread adjustment portion is provided on one side of the drive component housing groove portion, The wafer optical recognition apparatus according to claim 1, characterized in that the elastic component is housed in the drive component housing groove and the limiting component housing groove, and the adjustment component is commonly drilled in the limiting component, the adjustment drive component, and the elastic component.

3. The wafer optical recognition apparatus according to claim 2, characterized in that the support component and the limiting component are locked and connected to each other with the outer cover body.

4. The wafer optical recognition apparatus according to claim 1, characterized in that a unidirectional optical component is provided between the light-emitting device and the optical refraction component.

5. The wafer optical recognition apparatus according to claim 4, characterized in that a reflective component is provided on the side of the unidirectional optical component opposite to the light-emitting device and the optical refraction component, and the reflective component is located in front of the imaging device.

6. The wafer optical recognition apparatus according to claim 1, characterized in that the recognition of the image and character information is performed by an AI artificial intelligence chip provided on a circuit board, and the AI ​​artificial intelligence chip learns and records the image and character information in the video information.

7. The wafer optical recognition apparatus according to claim 1, characterized in that at least one side of the optical refraction component is provided with an optical enhancement light-emitting unit that is electrically connected to the circuit board.

8. A wafer optical recognition device comprising an imaging device, a light-emitting device, a circuit board, and an optical refraction component, The aforementioned imaging device captures image and text information on a semiconductor wafer. The light-emitting device is provided on one side of the imaging device and comprises a plurality of light-emitting components. The circuit board is provided on one side of the light-emitting device and is connected to the imaging device and the light-emitting device, thereby acquiring video information captured by the imaging device, recognizing the image and text information, and further controlling the operation of each of the light-emitting components, so that each of the light-emitting components operates individually or in combination with others. The light refraction component is provided on one side of the light-emitting device and refracts the light emitted from each of the light-emitting components. One side of the imaging device is provided with a focus adjustment component for adjusting the focal length of the imaging device. The wafer optical recognition device is characterized in that the focus adjustment component comprises an adjustment drive component fixedly connected to the imaging device, the adjustment drive component comprises a plurality of fixed parts fixedly connected to the imaging device, a plurality of slide grooves provided on one side of each fixed part, a drive component housing groove provided between each slide groove, and a screw thread adjustment part provided on one side of the drive component housing groove, a limiting component is provided on the side of the adjustment drive component away from the imaging device, the limiting component comprises a plurality of guide parts housed in the slide groove, a limiting component housing groove corresponding to the position of the drive component housing groove is provided between each guide part, an elastic component is housed in the drive component housing groove and the limiting component housing groove, and an adjustment component is drilled in common in the limiting component, the adjustment drive component, and the elastic component.

Images