electronic machinery

Abstract

To provide an electronic device in which a partition wall capable of obtaining an appropriate air flow can be easily assembled to a board.SOLUTION: An electronic device 10 comprises: two fans 30; a mother board 25 that is provided between the respective fans 30 so as to radiate heat by receiving air flows of the respective fans 30 and has positioning holes 25f to 25h; and a first partition wall 60 and a second partition wall 61 that are provided on the front and rear of a center section 25C in the mother board 25 and blocks a space with a casing so as to extend over between the two fans. The first partition wall 60 and the second partition wall 61 have stiff materials 63, 67 fixed to a surface of the mother board 25, and elastic materials 64, 68 that are fixed to the stiff materials 63, 67 and are compressed elastically with the casing. The stiff material 67 in the second partition wall 61 has projections 67a to 67c penetrating positioning holes 25f to 25h, and the stiff material 63 in the first partition wall 60 has fitting sections 63a to 63c into which the projections 67a to 67c are fitted.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an electronic device having a fan and a substrate.

Background Art

[0002] An electronic device such as a notebook PC is equipped with a cooling module for cooling heat-generating components such as a CPU. This type of cooling module includes a heat transport device such as a heat pipe that absorbs and transports the heat generated by the CPU and other components, and a heat sink and a fan that discharge the heat transported by the heat transport device to the outside of the housing. In the electronic device described in Patent Document 1, fans are provided on the left and right, and a substrate on which the CPU is mounted is provided between them. The fan is provided with a sponge partition for regulating the air flow direction. This partition acts to guide the air flow of the fan to the exhaust ports at both rear left and right ends. Sometimes, the fan is provided with guides or the like for attaching the partition to an appropriate position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] It is considered that the cooling efficiency can be further improved if the air flows not only through the exhaust ports at both left and right ends but also over the upper and lower surfaces of the substrate provided between the two fans and then flows out through the exhaust port at the rear center. In such a configuration, it is desirable to provide the partition across between the two fans on the front and back sides of the substrate so that the air flows properly toward the exhaust port at the rear center. Since the substrate is slightly longer in the left-right direction and has no guides or the like, it is difficult to attach the partition to the substrate.

[0005] The present invention has been made in view of the above-mentioned problems, and aims to provide an electronic device that allows for easy assembly of a partition wall to a substrate so as to provide an appropriate airflow. [Means for solving the problem]

[0006] To solve the above-mentioned problems and achieve the objective, an electronic device according to an aspect of the present invention is an electronic device having a flat housing, comprising: at least one fan; a substrate having through holes and arranged to receive airflow discharged from the fan for heat dissipation; and a first partition wall and a second partition wall provided on the front and back of the substrate to define a space for receiving airflow discharged from the fan and to close the space between the substrate and the flat housing, wherein the first partition wall and the second partition wall each comprise a rigid material fixed to the surface of the substrate and an elastic material fixed to the rigid material and elastically compressed between them and the flat housing, the rigid material in the second partition wall having a projection that penetrates the through hole, and the rigid material in the first partition wall having a fitting portion into which the projection fits. [Effects of the Invention]

[0007] According to the above embodiment of the present invention, a partition wall that provides an appropriate airflow can be easily assembled to the substrate. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the enclosure. [Figure 3] Figure 3 is a perspective view of the rear edge of the housing, seen from the bottom. [Figure 4] Figure 4 is an enlarged cross-sectional view of a portion of the enclosure. [Figure 5] Figure 5 is an exploded perspective view of the motherboard, first partition, and second partition. [Figure 6] Figure 6 is a plan view of the portion of the motherboard that includes the first partition wall. [Figure 7] Figure 7 is a schematic cross-sectional view of the motherboard, the first partition, and the second partition. [Modes for carrying out the invention]

[0009] Embodiments of the electronic device according to the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to these embodiments.

[0010] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be something other than a notebook PC, such as a tablet PC, smartphone, or portable game console.

[0011] The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The enclosure 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface 12a of the enclosure 12. Hereinafter, the enclosure 12 and each component mounted thereon will be described using the operator's posture when operating the keyboard device 18 as the reference point, with the width direction (left and right) of the enclosure 12 being referred to as the X1 and X2 directions, the depth direction (front and back) of the enclosure 12 being referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the enclosure 12 being referred to as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. These directions are defined for the convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 can be composed of a plate-shaped member 20 that forms the top surface 12a, a cover member 21 that forms the bottom surface 12b, and vertical wall members 22 that form the four perimeter sides 12c. The plate-shaped member 20 has a large rectangular opening 20a in which the keyboard device 18 is placed. The area around the opening 20a forms a bezel 20b that surrounds the keyboard device 18. The cover member 21 is formed in the shape of a plate (see Figure 3). The vertical wall members 22 stand upright between the four perimeter edges of the plate-shaped member 20 and the four perimeter edges of the cover member 21, forming a frame shape as a whole.

[0014] The hinge 14 is installed in a concave hinge arrangement groove 12d formed on the rear edge of the housing 12, connecting the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a, which serves as the axis of rotation, is supported at both ends in the longitudinal direction of the hinge housing 14b (see Figure 4). In this embodiment, the hinge 14 is configured in a so-called single-bar shape, with the hinge housing 14b extending along the longitudinal direction of the hinge arrangement groove 12d. The hinge 14 rotates together with the lid 11 and descends diagonally backward (see Figure 4). The hinge 14 is a structure that increases the rotation angle of the lid 11 in this way, a so-called drop-down structure. The structure of the hinge 14 may be other than that described above.

[0015] Figure 2 is a schematic plan view showing the internal structure of the housing 12. Figure 2 is a view of the inside of the housing 12 from above after removing the plate-shaped member 20.

[0016] As shown in Figure 2, the enclosure 12 houses a cooling module 24, a motherboard (circuit board) 25, and a battery device 26. Various other electronic and mechanical components are also installed inside the enclosure 12.

[0017] The motherboard 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is located near the Y2 side of the enclosure 12 and extends in the X direction. The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is located near the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of this embodiment implements a CPU (Central Processing Unit) 25a, a GPU (Graphics Processing Unit) 25b, a memory 25c, two SSDs (Solid State Drives) 25d, etc. In addition to these, the motherboard 25 can also implement various electronic components, such as a communication module. The CPU 25a, the GPU 25b, and the memory 25c are implemented between two fans 30, 30 described later on the motherboard 25. This part is also called the central part 25C. The central part 25C is slightly longer in the X direction. The two SSDs 25d are each implemented in a form that extends in the X direction adjacent to the Y1 side of the fan 30.

[0019] For the motherboard 25, for example, the upper surface (the first surface 25A) serves as the mounting surface for the CPU 25a, etc., and the lower surface (the second surface 25B) serves as the mounting surface for the housing 12.

[0020] The CPU 25a is a heat-generating component with the largest amount of heat generation among the electronic components mounted in the housing 12. The cooling module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it outside the housing 12. The cooling module 24 of this embodiment is configured to cool the GPU 25b, etc. together with the CPU 25a.

[0021] As shown in FIG. 2, the cooling module 24 of this embodiment includes a metal plate 27, a heat pipe 28, a pair of heat sinks 29, 29, and a pair of fans 30, 30.

[0022] The metal plate 27 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 27 is a copper plate. The metal plate 27 extends in the X direction between the left and right fans 30, 30. As a result, the metal plate 27 covers the central part 25C of the motherboard 25, which is located between the left and right fans 30, 30, and the CPU 25a mounted on the central part 25C, from the first surface 25A side (Z1 side). The metal plate 27 functions as a heat diffusion member that absorbs and diffuses heat from the CPU 25a, etc. The metal plate 27 is connected to the surface of the CPU 25a. Between the metal plate 27 and the CPU 25a, for example, thermal conductive grease and a copper block that is approximately the same size as the outer shape of the CPU 25a are interposed.

[0023] The heat pipe 28 is a pipe-shaped heat transport device. The heat pipe 28 is constructed by flattening a metal pipe to form an elliptical cross-section, and sealing a working fluid in the sealed space inside. Examples of working fluids include water, alternative refrigerants, acetone, or butane. The heat pipe 28 is fixed at its longitudinal center to the back surface of the metal plate 27 that connects to the CPU 25a. Both ends of the heat pipe 28 are fixed to the Z1 side surface (upper 29a) of the left and right heat sinks 29, respectively (see Figure 4). The longitudinal center of each heat pipe 28 overlaps with the CPU 25a in the Z direction. This allows the heat pipe 28 to efficiently receive heat from the CPU 25a transferred to the metal plate 27 and transport it to the heat sinks 29 at both ends with high efficiency.

[0024] The heatsink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands upright in the Z direction on a predetermined base plate and extends in the Y direction. Gaps are formed between adjacent fins of the heatsink 29 through which air supplied from the fan 30 passes. The heatsink 29 is made of a metal with high thermal conductivity, such as aluminum or copper. The heatsink 29 is positioned opposite the Y2 side surface 30a (discharge port 34a) of the fan 30.

[0025] A pair of fans 30, 30 are arranged side by side in the X direction, straddling the central portion 25C of the motherboard 25 and the metal plate 27 between them, and facing each other. Each fan 30 has an outlet 34a on its Y2 side 30a. The outlet 34a is close to and opposite the heatsink 29 behind it. Each fan 30 may also have an outlet 34b on its opposite side 30b. The outlets 34b, 34b of the left and right fans 30 face each other with the central portion 25C in between. Each fan 30 may have an intake port 35 on the lower surface 30d on the Z2 side of its upper and lower surfaces 30c, 30d facing the Z direction. In this embodiment, the upper surface 30c on the Z1 side of the fan 30 abuts against the lower surface 18a of the keyboard device 18 (see Figure 4).

[0026] Fan 30 is a centrifugal fan in which an impeller 30e housed inside the housing is rotated by a motor (see Figure 4). This allows fan 30 to draw in air from the intake port 35 and discharge it from the outlets 34a and 34b.

[0027] Figure 3 is a perspective view of the rear edge of the housing 12, seen from the bottom surface 12b side. Figure 4 is a partially enlarged cross-sectional view of the housing 12. Figure 4 is a schematic side cross-sectional view of the rear edge and surrounding area of ​​the housing 12.

[0028] As shown in Figures 2 to 4, the Y2 side edge of the housing 12 is provided with a hinge placement groove 12d recessed toward the Y1 side. The hinge placement groove 12d can be composed of a notch 20c formed in the plate-shaped member 20 and a rear wall 22A formed in a part of the vertical wall member 22 on the Y2 side. The notch 20c is a recess formed by cutting out the rear edge of the plate-shaped member 20 toward the Y1 side. Reference numeral 36 denotes a frame member. The heat sink 29 is positioned inside the housing 12 between the rear wall 22A and the discharge port 34a.

[0029] As shown in Figures 2 and 3, in the electronic device 10 of this embodiment, each vent 41 can be divided into three regions A1 to A3 in the X direction. The vents 41 belonging to regions A1 and A2 at both the left and right ends are discharged from the outlet 34a of the fan 30, and the air that has passed through the left and right heat sinks 29 is discharged to the outside of the housing 12. The vent 41 belonging to the central region A3 (hereinafter also referred to as vent 41C) is discharged from the outlet 34b of the fan 30, and the air that has passed through the surface of the central metal plate 27 and the surface and back of the central part 25C of the motherboard 25 is discharged to the outside of the housing 12. In other words, the central part 25C is provided to dissipate heat by receiving airflow from the two fans 30.

[0030] The ventilation opening 41 penetrates the rear wall 22A in the plate thickness direction (Y direction). The ventilation opening 41 is divided vertically by a horizontal bar-shaped partition wall 45 that extends in the X direction.

[0031] The ventilation opening 41 is divided into multiple sections 41a in the X direction by multiple support columns (second support columns) 44b arranged along the longitudinal direction (X direction) of the rear wall 22A. The support columns 44b are rods that extend along the upright direction (Z direction) of the rear wall 22A. For example, the ventilation opening 41 belonging to regions A1 and A2 is divided into five sections 41a, and the ventilation opening 41C is divided into four sections 41a (see Figure 3). Needless to say, the number of sections 41a of the ventilation opening 41 is not limited to these. The ventilation openings 41 belonging to regions A1 and A2 are located immediately behind the heat sink 29 and face the heat sink 29. The ventilation opening 41C is located immediately behind the Y2 side edge of the central section 25C.

[0032] As shown in Figures 3 and 4, the housing 12 has a bottom ventilation opening 52 that opens into the bottom surface 12b. The bottom ventilation opening 52 is an opening for introducing air from outside the housing 12 into the intake port 35 of the fan 30. The bottom ventilation opening 52 can be configured, for example, to extend in the Y direction, with multiple narrow, slit-shaped openings arranged in the X direction.

[0033] In the electronic device 10, heat generated by heat-generating elements such as the CPU 25a is transferred to and diffused by the metal plate 27, and efficiently transported to the left and right heatsinks 29 by the heat pipes 28. The left and right fans 30 draw in outside air (cold air) from the bottom vent 52 into the intake port 35 and discharge it from the outlet ports 34a and 34b.

[0034] The air discharged from the outlets 34a of the left and right fans 30 passes through the heatsink 29 and is cooled. The cooled air (warm air) is then discharged outside the housing 12 through the vents 41 belonging to regions A1 and A2.

[0035] The air discharged from the outlets 34b of the left and right fans 30 flows along the surface of the metal plate 27, cooling the metal plate 27 and the heat pipes 28, and at the same time directly cooling the central section 25C and the electronic components mounted around the CPU 25a and GPU 25b mounted therein. The cooled air (warm air) is discharged outside the enclosure 12 through the vent 41C.

[0036] Next, a partition wall structure 57 that appropriately guides the air discharged from the discharge port 34b of the fan 30 to the vent port 41C will be described. The partition wall structure 57 includes front and back fan partition walls 58, a first partition wall 60, and a second partition wall 61, and means for fixing them.

[0037] Each fan 30 is provided with a fan partition 58 on both its upper and lower surfaces. The fan partition 58 has a T-shape, consisting of a vertical partition 58a extending along the Y direction on the side facing the central part 25C of the motherboard 25, and a horizontal partition 58b extending along the X direction on the side facing the heatsink 29. The vertical partition 58a and the horizontal partition 58b may be separate components. The vertical partition 58a restricts the air discharged from the outlet 34b to flow toward the central part 25C. The horizontal partition 58b restricts the air discharged from the outlet 34a to flow toward the heatsink 29. The fan partition 58 is made of, for example, a material formed from sponge or rubber in a strip shape. The fan partition 58, and the first partition 60 and second partition 61 described below, do not need to completely block the passage of air, but have a moderate degree of airtightness that restricts the direction of airflow by providing a certain degree of airflow resistance.

[0038] Figure 5 is an exploded perspective view of the motherboard 25, the first partition wall 60, and the second partition wall 61. Figure 6 is a plan view of the portion of the motherboard 25 including the first partition wall 60. Figure 7 is a schematic cross-sectional view of the motherboard 25, the first partition wall 60, and the second partition wall 61. Figure 7 shows the location where the projection 67b fits into the positioning hole (through hole) 25g and the mating portion 63b, but the same applies to the location where the projection 67a fits into the positioning hole 25f and the mating portion 63a, and the location where the projection 67c fits into the positioning hole 25h and the mating portion 63c.

[0039] In order for the air discharged from the outlets 34b of the left and right fans 30 to flow properly into the vents 41C, the vertical partition wall 58a restricts the flow in the X direction to prevent it from flowing improperly. Furthermore, a first partition wall 60 and a second partition wall 61 are provided to prevent it from flowing improperly in the Y1 direction. In other words, the first partition wall 60 and the second partition wall 61 define the space that receives the airflow discharged from the fans 30.

[0040] The first partition wall 60 and the second partition wall 61 are provided so as to span between the two fans 30 and substantially along the edge 25e on the Y1 side so as not to restrict the component mounting area in the central part 25C of the motherboard 25. The first partition wall 60 is provided on the first surface 25A of the motherboard 25, and the second partition wall 61 is provided on the second surface 25B. Basically, the fan partition wall 58, the first partition wall 60, and the second partition wall 61 are strip-shaped and of equal width. The partition walls 58, 60, and 61 are moderately thin, for example, about 4 mm, to the extent that airtightness and strength can be ensured. The partition walls 58, 60, and 61 are lightweight and inexpensive.

[0041] The X1-side end 60a of the first bulkhead 60 is inclined, and the X2-side end 60b is crank-shaped, so as to avoid the SSDs 25d. The two SSDs 25d are located in positions where they are not exposed to airflow from the discharge port 34b, but separate heat dissipation measures such as the installation of heat sinks have been taken. The Y2 side of ends 60a and 60b is in contact with, or nearly in contact with, the end of the vertical bulkhead 58a on the first surface 25A side. The central part 60c between ends 60a and 60b of the first bulkhead 60 extends long in the X direction.

[0042] The X1-side end 61a and the X2-side end 61b of the second bulkhead 61 extend briefly in the Y direction, with the Y2 side in contact with or substantially in contact with the end of the longitudinal bulkhead 58a on the second surface 25B side. The central portion 61c between the ends 61a and 61b of the second bulkhead 60 extends long in the X direction, with both ends perpendicular to the ends 61a and 61b. The central portion 60c of the first bulkhead 60 overlaps with the central portion 61c of the second bulkhead 61 along its entire length.

[0043] The motherboard 25 has three small positioning holes 25f, 25g, and 25h formed therein as positioning means for the first partition wall 60 and the second partition wall 61. The positioning holes 25f, 25g, and 25h are through holes. Positioning hole 25f is located near the Y1 and X2 ends of the fan 30 on the X1 side. Positioning hole 25g is located approximately in the left-right center of the central part 25C, near the Y1 end. Positioning hole 25h is located near the Y1 and X1 ends of the fan 30 on the X2 side. Positioning hole 25g is located approximately midway between positioning holes 25f and 25h. On the first surface 25A, a silkscreen mark 62 is printed in the area including the positioning holes 25f, 25g, and 25h where the first partition wall 60 will be placed. Although not shown in the illustration, a similar mark is printed on the second surface 25B where the second partition wall 61 will be placed.

[0044] The first partition wall 60 has a two-layer structure consisting of a rigid material 63 and an elastic material 64, which are bonded together by adhesive tape 65. The rigid material 63 has three mating portions 63a, 63b, and 63c formed on the Z1 side facing the motherboard 25. The mating portions 63a, 63b, and 63c are bottomed holes that open to the Z1 side and are formed at positions corresponding to the positioning holes 25f, 25g, and 25h. The rigid material 63 is fixed to the position of the mark 62 on the motherboard 25 by adhesive tape 66. The adhesive tape 66 has three holes 66a, 66b, and 66c formed at positions corresponding to the mating portions 63a, 63b, and 63c.

[0045] The second partition wall 61 has a two-layer structure consisting of a rigid resin material 67 and an elastic resin material 68, which are bonded together by adhesive tape 69. The rigid resin material 67 has three protrusions 67a, 67b, and 67c formed on the Z2 side facing the motherboard 25. The rigid resin material 67 is fixed to the motherboard 25 by adhesive tape 70. The adhesive tape 70 has three holes 70a, 70b, and 70c formed in positions corresponding to the protrusions 67a, 67b, and 67c.

[0046] The projections 67a, 67b, and 67c protrude toward the Z2 side and are formed at positions corresponding to the positioning holes 25f, 25g, and 25h. They pass through the positioning holes 25f, 25g, and 25h and fit into the fitting portions 63a, 63b, and 63c. The projections 67a, 67b, and 67c fit to a depth appropriate for positioning relative to the fitting portions 63a, 63b, and 63c, but are of a length that does not reach the bottom.

[0047] The positioning holes 25f~25h, fitting portions 63a~63c, holes 66a~66c, 70a~70c, and projections 67a~67c are circular, for example, with a diameter of about 2 mm. The rigid materials 63 and 67 are made of a moderately hard and insulating material such as resin. The rigid materials 63 and 67 are made of a material that is more rigid than the elastic materials 64 and 68, and may have a certain degree of flexibility. The rigid materials 63 and 67 can also be called hard materials. The elastic materials 64 and 68 are made of an elastically compressible material such as sponge or rubber. The elastic material 64 is compressed between the rigid material 63 and the cover member 21, and the elastic material 68 is compressed between the rigid material 67 and the keyboard device 18. As a result, the space between the first surface 25A and the second surface 25B of the motherboard 25 and the cover member 21 and keyboard unit 18 that constitute part of the chassis is sealed, and the component mounting area in the central part 25C, such as the CPU 25a, GPU 25b, and memory 25c, is airtightly separated from the area of ​​the battery unit 26 on the Y1 side, defining the airflow path of the air discharged from the exhaust ports 34b of the left and right fans 30, and obtaining an airflow that flows properly to the vent 41C.

[0048] The gap distance d1 between the first surface 25A of the motherboard 25 and the cover member 21 is longer than the gap distance d2 between the second surface 25B of the motherboard 25 and the keyboard unit 18. Correspondingly, the thickness T1 of the rigid material 63 in the first partition wall 60 is thicker than the thickness of the rigid material 67 in the second partition wall 61.

[0049] Since the rigid material 63 is thicker than the rigid material 67, the impact of strength reduction due to the formation of the mating portions 63a to 63c is minimal. Furthermore, because the mating portions 63a to 63c are bottomed holes, the strength reduction of the rigid material 63 in these areas is suppressed compared to the case of through holes, and there is no discontinuity in the adhesion between the rigid material 63 and the elastic material 64 in these areas. However, depending on the conditions, the mating portions 63a to 63c may be through holes.

[0050] The first partition wall 60 and the second partition wall 61 are provided so as to cross the central portion 25C that is relatively long in the X direction. However, since the elastic members 64 and 68 are fixed to the rigid members 63 and 67, their shapes are stable, and even without a guide portion other than the mark 62, it is easy to align them at a predetermined position.

[0051] The first partition wall 60 and the second partition wall 61 are used as positioning means that also serve as the positioning holes 25f to 25h of the mother board 25. Therefore, the number of the positioning holes 25f to 25h is basically half of that in the case where dedicated positioning portions are provided for the first partition wall 60 and the second partition wall 61 respectively. Also, only the protrusions 67a to 67c of the second partition wall 61 are fitted into the positioning holes 25f to 25h, and there is no fitting for the first partition wall 60 with respect to the positioning holes 25f to 25h. Thus, the operation is clear and it can be easily assembled to the mother board 25.

[0052] The first partition wall 60 and the second partition wall 61 slightly press the mother board 25 when the elastic members 64 and 68 are compressed. However, since their long central portions 60c and 61c overlap, they are balanced, and almost no bending force or torsional force acts on the mother board 25. Since the magnitudes of the gap distances d1 and d2 vary depending on the model, when d1 < d2, T1 < T2, and the fitting portions 63a to 63c and the protrusions 67a to 67c may be reversed.

[0053] In the above embodiment, two fans 30 are provided, and the first partition wall 60 and the second partition wall 61 are provided so as to span between the two fans 30. However, at least one fan 30 is provided, and the first partition wall 60 and the second partition wall 61 may be provided on the front and back of the mother board 25 in order to define a space for receiving the air flow discharged from the fan 30. For example, when only one of the two fans 30 in the above embodiment is provided, the first partition wall 60 and the second partition wall 61 may be L-shaped spanning between the end of the fan 30 and the end of the vent 41C.

[0054] The present invention is not limited to the above-described embodiments, and it is needless to say that it can be freely changed without departing from the gist of the present invention. [Explanation of symbols]

[0055] 10 Electronic equipment 11 Lid 12 cabinets 18. Keyboard unit (enclosure) 21 Cover component (housing) 25 Motherboard (circuit board) 25C center part (board) 25f, 25g, 25h Positioning holes (through holes) 30 Fans 34a,34b Discharge port 41,41C Ventilation holes 52 Bottom vents 57 Bulkhead structure 58 Fan bulkhead 60 1st bulkhead 61 2nd bulkhead 62 Landmarks 63,67 Rigid material 63a, 63b, 63c fitting part 64, 68 Elastic material 65, 66, 69, 70 Adhesive Tape 67a,67b,67c protrusion

Claims

1. Electronic equipment having a flat housing, At least one fan, The substrate is positioned to receive the airflow discharged from the aforementioned fan and dissipate heat, and has through holes. In order to define the space that receives the airflow discharged from the fan, a first partition wall and a second partition wall are provided on the front and back of the substrate to close the space between it and the flat housing, It has, The first partition and the second partition are, A rigid material fixed to the surface of the substrate, An elastic material fixed to the rigid material and elastically compressed between it and the flat housing, It has, The rigid material in the second partition wall has a projection that penetrates the through hole, The rigid material in the first partition wall has a fitting portion into which the projection fits. An electronic device characterized by the following features.

2. In the electronic device described in claim 1, Two of the aforementioned fans are provided. The circuit board is provided between the two fans. The first and second partitions are provided so as to span between the two fans. An electronic device characterized by the following features.

3. In the electronic device described in claim 1, The rigid material in the first partition wall is thicker than the rigid material in the second partition wall. An electronic device characterized by the following features.

4. In the electronic device described in claim 1, The fitting portion has a bottomed hole. An electronic device characterized by the following features.

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