Hardening components

Abstract

The present application relates to a curable composition and its use. The curable composition of the present application can be applied to a product that generates heat during operation or retention, and can provide a curable composition that can be used as a material capable of treating the heat. The curable composition of the present application can be applied to a product in which a plurality of heat-generating elements are integrated, and can efficiently treat the heat generated from the elements while maintaining the temperature of the product uniform. In addition, the curable composition of the present application can be applied to such a product, and even if abnormal heat generation, explosion, or fire occurs in any of the plurality of elements, the effect of such heat generation, explosion, or fire on other adjacent elements can be prevented or minimized. The curable composition of the present application can further perform the above-mentioned functions stably for a long period of time.

Description

[Technical Field]

[0001] Mutual citation with related applications This application claims priority rights under Korean Patent Application No. 10-2021-0134137 dated October 8, 2021, and Republic of Korea Patent Application No. 10-2022-0128214 dated October 6, 2022, and all content disclosed in the documents of said Korean patent applications is incorporated herein by reference.

[0002] Technical field This application relates to a curable composition and its uses. [Background technology]

[0003] The importance of technologies for managing the heat generated by products is increasing. One common method of heat management is to use materials with excellent thermal conductivity to dissipate the heat generated from the product to the outside, or to use cooling media to eliminate the generated heat.

[0004] In products composed of multiple heat-generating elements (heat-generating components), managing heat is a challenging problem.

[0005] For example, battery modules and battery packs contain multiple battery cells or multiple battery modules, which are located relatively close to each other. Therefore, heat generated in one battery cell or battery module can affect other adjacent components, potentially causing problems such as chain reactions or explosions.

[0006] Therefore, in such products, it is necessary to ensure that heat, explosions, or fires generated from any element do not affect other adjacent elements.

[0007] Furthermore, depending on the product, it may be necessary to maintain a uniform temperature throughout the driving or holding process. Therefore, in products composed of multiple heating elements as described above, there is a need for technology that can maintain a uniform temperature throughout the product during the driving or holding process, and that can handle abnormal heat generation, explosions, or fires generated from any heating element without spreading them to other elements as much as possible. [Overview of the project] [Problems that the invention aims to solve]

[0008] This application relates to a curable composition and its applications. The curable composition of this application may be applied to a product that generates heat during a driving or holding process and can be used as a material capable of handling such heat. The curable composition of this application may be applied to a product in which multiple heat-generating elements are integrated and can efficiently handle the heat generated from the elements while maintaining a uniform temperature of the product. Furthermore, the curable composition of this application may be applied to such a product and can prevent or minimize the impact of abnormal heat generation, explosion, or ignition on other adjacent elements even if abnormal heat generation, explosion, or ignition occurs in one of the multiple elements. The curable composition of this application can further perform the above functions stably over a long period of time. The application may further provide a cured body formed by such a curable composition, or the curable composition, or applications for the cured body. [Means for solving the problem]

[0009] Unless otherwise specified, the physical properties mentioned herein that are affected by temperature are those measured at room temperature.

[0010] In this specification, the term "room temperature" means the natural temperature without heating or deheating, and refers to any temperature within the range of approximately 10°C to 30°C, for example, approximately 15°C, 18°C, 20°C, 23°C, or 25°C. Unless otherwise specified in this specification, the unit of temperature is °C.

[0011] In this specification, if pressure affects the results of any physical properties mentioned, unless otherwise specified, those properties are those measured at atmospheric pressure. The term "atmospheric pressure" refers to the natural pressure that is not pressurized or depressurized, and is usually considered to be around 1 atmosphere (approximately 700-800 mmHg).

[0012] In this specification, if humidity affects the results of any physical property mentioned herein, unless otherwise specified, such physical property is the one measured at normal temperature and pressure with unadjusted humidity.

[0013] This application relates to a curable composition. The term "curable composition" refers to a composition that can be cured. Curing is the phenomenon in which a composition solidifies through physical and / or chemical reactions.

[0014] The curable composition may be energy ray curable, moisture curable, thermosetting, or room temperature curable, or it may be a hybrid curing type to which two or more of the curing methods are applied.

[0015] In the case of energy-ray curing, the composition can be cured by irradiating it with energy rays such as ultraviolet light; in the case of moisture-curing, by holding the composition under appropriate humidity; in the case of thermosetting, by applying appropriate heat to the composition; or in the case of room-temperature curing, by holding the curable composition at room temperature. In the case of hybrid curing, two or more of the above methods may be applied simultaneously or in stages to cure the curable composition. For example, the curable composition of this application may be at least of the room-temperature curing type. For example, the curable composition of this application may be cured while held at room temperature without irradiation with separate energy rays and application of heat.

[0016] The curable composition of this application may be a one-component curable composition or a two-component curable composition. A one-component curable composition is a composition that is stored with the components necessary for curing already mixed, while a two-component curable composition is a composition that is stored with the components necessary for curing physically separated. A two-component curable composition usually includes a so-called main component part and a curing agent part, and the main component and curing agent part are mixed for curing. If the curable composition of this application is a two-component curable composition, the curable composition may be the main component part or the curing agent part of the two-component curable composition, or a mixture of the main component and the curing agent part.

[0017] The curable composition may form a cured body that exhibits latent heat within a predetermined temperature range. Latent heat is typically defined as the amount of heat required for a substance to undergo a phase transition without a change in temperature. However, the cured body of this application does not necessarily have to undergo a phase transition overall when it exhibits latent heat. The latent heat of the cured body of this application may be generated during the phase transition process of at least a portion of the cured body or components contained in the cured body.

[0018] In this application, the fact that the cured body exhibits latent heat within a predetermined temperature range means that the cured body exhibits an endothermic peak within a predetermined temperature range in DSC (Differential Scanning Calorimeter) analysis performed in the manner described in the examples below. The process by which the cured body exhibits the latent heat in this application is an isothermal process. Therefore, the cured body can be applied to a heat-generating product to control the heat while maintaining a uniform temperature of the product, thereby minimizing or preventing the impact of abnormal heat generation, explosion, and / or ignition from one product on other adjacent products.

[0019] The lower limit of the latent heat exhibited by the cured body may be approximately 15 J / g, 20 J / g, 25 J / g, 30 J / g, 35 J / g, 40 J / g, 45 J / g, 50 J / g, 55 J / g, 60 J / g, 65 J / g, 70 J / g, 75 J / g, 80 J / g, 85 J / g, or 90 J / g, and the upper limit may be approximately 200 J / g, 195 J / g, 190 J / g, 185 J / g, 180 J / g, 175 J / g, 170 J / g, 16 The latent heat exhibited by the cured body may be approximately 5 J / g, 160 J / g, 155 J / g, 150 J / g, 145 J / g, 140 J / g, 135 J / g, 130 J / g, 125 J / g, 120 J / g, 115 J / g, 110 J / g, 105 J / g, 100 J / g, 95 J / g, 90 J / g, 85 J / g, 80 J / g, 75 J / g, 70 J / g, 65 J / g, 60 J / g, 55 J / g, 50 J / g, 45 J / g, or 40 J / g. The latent heat exhibited by the cured body may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above. Cured materials exhibiting such latent heat can provide excellent thermal control in a variety of applications, and can particularly stably control heat in battery modules and battery packs.

[0020] The temperature range in which the cured body exhibits the latent heat may be controlled.

[0021] In this specification, the latent heat interval is the temperature interval exhibiting the latent heat, and is the range from the temperature at the left on-set inflection point of the endothermic peak to the temperature at the right on-set inflection point of the endothermic peak in the DSC (Differential Scanning Calorimeter) analysis of the examples described later, in which the endothermic peak is confirmed. In this specification, the temperature at the left on-set inflection point of the endothermic peak is sometimes called the on-set temperature, and the temperature at the right on-set inflection point of the endothermic peak is sometimes called the offset temperature.

[0022] In the endothermic section of the DSC analysis, one or more endothermic peaks can be observed. Even when multiple endothermic peaks are observed, the latent heat section is defined as the range from the temperature at the inflection point of the first endothermic peak (latent heat section start temperature or onset temperature) to the temperature at the inflection point of the last endothermic peak (latent heat section end temperature or offset).

[0023] The concepts of latent heat, latent heat interval, onset temperature, and offset temperature described above also apply to phase transition materials.

[0024] The lower limit of the temperature in the latent heat interval may be around 0°C, 5°C, 10°C, 15°C, 20°C, 25°C, 27°C, or 30°C, and the upper limit may be around 80°C, 78°C, 76°C, 74°C, 72°C, 70°C, 68°C, 66°C, 64°C, 62°C, 60°C, 58°C, 56°C, 54°C, 52°C, 50°C, 48°C, 46°C, 44°C, 42°C, or 40°C. The latent heat interval may be above or below any of the lower limits mentioned above, while being below or within the range of any of the upper limits mentioned above.

[0025] The cured body may have an adjustable temperature range over which it exhibits latent heat, i.e., a latent heat range. The width of the latent heat range is the value obtained by subtracting the latent heat range start temperature (the onset temperature) from the latent heat range end temperature (the offset temperature). The lower limit of the latent heat range may be around 9°C, 9.5°C, 10°C, 12°C, 14°C, 15°C, 16°C, 18°C, or 19°C, and the upper limit may be around 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C, or 15°C. The width of the latent heat range of the latent heat exhibited by the cured body may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while remaining within the range of less than or equal to any of the upper limits mentioned above.

[0026] In one example, the onset temperature of the latent heat interval in which the cured body exhibits the latent heat may be adjusted. In this case, the definition of the onset temperature is as described above. The lower limit of the interval range in which the onset temperature exists may be around 10°C, 12°C, 14°C, 16°C, 18°C, 20°C, 22°C, 24°C, 26°C, or 28°C, and the upper limit may be around 60°C, 58°C, 56°C, 54°C, 52°C, 50°C, 48°C, 46°C, 44°C, 42°C, 40°C, 38°C, 36°C, 34°C, 32°C, 30°C, 28°C, or 26°C. The onset temperature may be above or below any of the lower limits mentioned above, while being below or below any of the upper limits mentioned above.

[0027] In one example, the offset temperature of the latent heat interval in which the cured body exhibits the latent heat may be adjusted. In this case, the definition of the offset temperature is as described above. The lower limit of the interval range in which the offset temperature exists may be around 30°C, 32°C, 34°C, 36°C, 38°C, 40°C, 42°C, 44°C, 46°C, 48°C, or 50°C, and the upper limit may be around 80°C, 78°C, 56°C, 74°C, 72°C, 70°C, 68°C, 66°C, 64°C, 62°C, 60°C, 58°C, 56°C, 54°C, 52°C, 50°C, 48°C, 46°C, or 44°C. The offset temperature may be greater than or equal to any of the lower limits described above, but less than or equal to any of the upper limits described above.

[0028] A cured body with the aforementioned latent heat properties can be applied to various heat-generating products, enabling them to operate stably and uniformly within a given temperature range. Furthermore, the cured body can be applied to products containing multiple heat-generating elements arranged relatively adjacent to each other, maintaining a uniform temperature throughout the product and minimizing or preventing the impact of abnormal heat generation, ignition, and / or explosion in one element on other elements. In particular, a cured body exhibiting these latent heat properties can be applied to products where the operating temperature must be maintained within a range of approximately 15°C to 60°C (e.g., secondary battery cells or battery modules or battery packs containing multiple cells) to efficiently control heat.

[0029] The cured body of this application can stably maintain the aforementioned latent heat properties for a long period of time. In one example, the curable composition may contain a so-called phase change material (PCM) in order for the cured body to exhibit the aforementioned latent heat properties. As the phase change material, a substance that absorbs heat while undergoing a phase transition from solid to liquid may be used, but such a substance may disappear from the cured body because it transitions to the liquid phase while exhibiting latent heat. Therefore, in such a case, the aforementioned latent heat properties may disappear over time. In this application, through the selection of the curable resin components that form the cured body, the adjustment of the degree of crosslinking, the adjustment of the type and proportion of the phase change material, and / or the method of manufacturing the curable composition, the phase change material in the cured body does not disappear from the cured body even after transitioning to the liquid phase, and therefore, the aforementioned latent heat properties can be stably maintained for a long period of time.

[0030] For example, the cured body of this application may have ΔW in the following formula 1 controlled to be within a predetermined range.

[0031] [Formula 1] △W = 100 × (W f -W i ) / W i

[0032] In Equation 1, ΔW is the weight change rate (in %) of the cured body, Wf is the weight of the cured body measured after holding it at 80°C for 24 hours, and Wi is the weight of the cured body before holding it at 80°C for 24 hours. The specific method for measuring ΔW in Equation 1 is described in the Examples section. Also, in Equation 1, the weight (W f and W i The units of these terms are not restricted, as long as the same units apply to each other.

[0033] The upper limit of the weight change rate (ΔW) may be approximately 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1.5%, 1%, or 0.5%. The weight change rate may be less than or equal to any of the upper limits mentioned above. The lower limit of the weight change rate (ΔW) is not particularly limited, as a smaller value means that the phase transition material is stably retained within the cured body. The lower limit of the weight change rate (ΔW) may be, for example, approximately 0% or 0.5%. The weight change rate (ΔW) may be greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0034] In this application, the aforementioned latent heat properties or weight change properties can be achieved using a phase transition material without applying a so-called composite material. Phase transition materials exhibit endothermic properties that allow for heat control, but their thermal conductivity usually decreases. Therefore, it is not easy to transfer the heat that needs to be processed to the phase transition material. For this reason, composite materials are known that combine a phase transition material with a material with high thermal conductivity, such as graphite or carbon fiber. Such materials can solve the problem of low thermal conductivity, which is a disadvantage of phase transition materials, to some extent, but they are disadvantageous from the viewpoint of weight reduction because they increase the density or specific gravity of the material. However, in this application, the problem of reduced thermal control efficiency due to low thermal conductivity, which is a disadvantage of phase transition materials, can be solved without using the composite phase transition material by selecting the curable resin component that forms the cured body, adjusting the degree of crosslinking, adjusting the type and proportion of the phase transition material, and / or adjusting the manufacturing method of the curable composition, thereby enabling the provision of a lightweight material.

[0035] In this application, the aforementioned latent heat properties or weight change properties can be achieved even when using a so-called unencapsulated phase transition material, i.e., a non-encapsulated phase transition material, as the phase transition material. That is, phase transition materials often transition to a liquid state during the phase transition process, and the phase transition material that has transitioned to a liquid state can easily leak out of the cured body. Therefore, in order to prevent leakage of the phase transition material, a phase transition material is usually used in which the phase transition material is encapsulated with a material that does not become a liquid state. However, in such cases, since the phase transition material is encapsulated with a material that is not a phase transition material, it is not easy to stably ensure the performance of the phase transition material. In this application, as will be described later, the aforementioned weight change properties can be exhibited even when a non-encapsulated phase transition material is used as the phase transition material by controlling the matrix of the cured body.

[0036] In one example, the curable composition may contain an unencapsulated phase transition material as the phase transition material. The lower limit of the content of the unencapsulated phase transition material based on the weight of the total phase transition material present in the curable composition or the cured body may be about 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt% or 95 wt%, and the upper limit thereof may be about 100 wt%, 99 wt%, 98 wt%, 97 wt%, 96 wt% or 95 wt%. The content of the unencapsulated phase transition material may exceed any of the lower limits described above or be more than that, or while exceeding any of the lower limits described above or being more than that, it may be within the range less than or equal to any of the upper limits described above.

[0037] In one example, the cured body may have a density within a predetermined range. Such a density may be controlled in consideration of the possibility of providing a lightweight material. For example, the lower limit of the density is 0.5 g / cm 3 , 0.55 g / cm 3 , 0.6 g / cm 3 , 0.65 g / cm 3 [[ID= twelfth]], 0.7 g / cm 3 , 0.75 g / cm 3 , 0.8 g / cm 3 , 0.85 g / cm 3 , 0.9 g / cm 3 , 0.95 g / cm 3 , 1 g / cm 3 , 1.05 g / cm 3 , 1.1 g / cm 3 or 1.15 g / cm 3 or so, and the upper limit thereof is 2 g / cm 3 , 1.8 g / cm 3 , 1.6 g / cm 3 , 1.5 g / cm 3 , 1.45 g / cm 3 , 1.4 g / cm 3 , 1.35 g / cm 3 , 1.3 g / cm 3 , 1.25 g / cm 3 , 1.2 g / cm3 , 1.15 g / cm³ 3 , 1.1 g / cm³ 3 1.05 g / cm³ 3 , 1 g / cm³ 3 Or 0.95 g / cm³ 3 It may be to a certain extent. The density of the hardened body may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0038] The hardness of the cured body in this application may be adjusted. The hardness of the cured body is affected by the degree of crosslinking. Generally, the denser the crosslinking, the higher the hardness, and conversely, the lower the degree of crosslinking, the lower the measured hardness. In this application, the degree of crosslinking of the cured body can be adjusted so that an appropriate hardness is shown, taking into account the retention efficiency of the phase transition material held within the cured body. If the degree of crosslinking is too low and the hardness is too low, the phase transition material may not be properly retained inside the cured body, and conversely, if the degree of crosslinking is too high and the hardness is too high, the performance of the phase transition material may not be properly expressed.

[0039] For example, the lower limit of the hardness of the hardened body may be approximately 20, 25, 30, 35, 40, 45, 50, 55, 60, 70, or 80 on the Shore OO hardness scale, or approximately 10, 15, 20, 25, 30, 35, 40, or 50 on the Shore A hardness scale, and the upper limit may be approximately 90, 85, 80, 75, 70, 65, or 60 on the Shore OO hardness scale, or approximately 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, or 20 on the Shore A hardness scale. The hardness of the hardened body may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while remaining within the range of less than or equal to any of the upper limits mentioned above.

[0040] The hardness of the cured body is determined in relation to the molecular weight and degree of crosslinking of the curable resin component. In this application, the molecular weight of the curable resin component forming the cured body and the degree of crosslinking of that resin component are controlled to exhibit a hardness within the aforementioned range, thereby providing a network that can stably hold the phase transition material. Furthermore, a hardness within the aforementioned range allows the cured body to stably fill spaces with complex shapes, and can also improve vibration resistance and impact resistance.

[0041] The curable composition of this application may contain a curable resin component. The term "curable resin component" includes not only components that are themselves so-called resin components, but also components that can form resin components after the curing reaction. Therefore, the curable resin component may be a monomolecular, oligomeric, or polymeric compound.

[0042] In this application, the curable resin component may be a component whose weight-average molecular weight (Mw) is within a predetermined range. The weight-average molecular weight of the curable resin component, along with the crosslinking structure, affects the retention of the phase transition material. That is, even under the same or similar degree of crosslinking, if the weight-average molecular weight of the curable resin component linking the crosslinking structure is too low, leakage of the phase transition material may still occur, so it is necessary to ensure an appropriate level of weight-average molecular weight. For example, the lower limit of the weight-average molecular weight of the curable resin component may be around 9,000 g / mol, 10,000 g / mol, 15,000 g / mol, 20,000 g / mol, or 25,000 g / mol, and the upper limit may be 1,000,000 g / mol, 900,000 g / mol, 800,000 g / mol, 700,000 g / mol, or 600,000 g / mol. The weight-average molecular weight may be approximately 1 / mol, 500,000 g / mol, 400,000 g / mol, 300,000 g / mol, 200,000 g / mol, 100,000 g / mol, 90,000 g / mol, 80,000 g / mol, 70,000 g / mol, 60,000 g / mol, 50,000 g / mol, 40,000 g / mol, or 30,000 g / mol. A curable resin component having such molecular weight characteristics can form a network of cured materials that can stably retain phase transition materials internally. In particular, a silicone resin component may be effectively applied as the resin component having the aforementioned molecular weight characteristics. The weight-average molecular weight may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0043] The type of curable resin component is not particularly limited. For example, the curable resin component may include a polyurethane component, a silicone resin component, an acrylic resin component, or an epoxy resin component. The polyurethane component, silicone resin component, acrylic resin component, or epoxy resin component may be polyurethane, silicone resin, acrylic resin, or epoxy resin, or a component that forms the polyurethane, silicone resin, acrylic resin, or epoxy resin through a curing reaction. There are no particular limitations on the specific types of applicable curable resin components, and any known polyurethane component, silicone resin component, acrylic resin component, or epoxy resin component exhibiting the molecular weight characteristics and / or hardness characteristics described above may be selected and used. The hardness of the final cured product may be controlled by controlling the degree of crosslinking of such resin components.

[0044] For example, if the curable resin component is a silicone resin component, the component may be an addition-curing type silicone resin component that includes (1) a polyorganosiloxane containing two or more alkenyl groups in the molecule and (2) a polyorganosiloxane containing two or more silicon-bonded hydrogen atoms in the molecule. The compound can form a cured product by an addition reaction in the presence of a catalyst, such as a platinum catalyst.

[0045] The polyorganosiloxane (1) contains at least two alkenyl groups. Specific examples of alkenyl groups include vinyl, allyl, butenyl, pentenyl, hexenyl, or heptenyl groups, of which vinyl is commonly used, but is not limited to vinyl. The bonding positions of the aforementioned alkenyl groups in the polyorganosiloxane (1) are not particularly limited. For example, the alkenyl groups may be bonded to the ends of the molecular chain and / or to the side chains of the molecular chain. Furthermore, in the polyorganosiloxane (1) mentioned above, examples of substituents that may be included in addition to the aforementioned alkenyls include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl or phenethyl groups; halogen-substituted alkyl groups such as chloromethyl, 3-chloropropyl, or 3,3,3-trifluoropropyl groups. Of these, methyl or phenyl groups are usually used, but the invention is not limited to these.

[0046] The molecular structure of the polyorganosiloxane described in (1) above is not particularly limited and may have any shape, such as linear, branched, cyclic, networked, or linear with a partial branching structure. Typically, among the above molecular structures, those having a linear molecular structure are applied, but the invention is not limited thereto.

[0047] More specific examples of the polyorganosiloxanes in (1) above include: dimethylsiloxane-methylvinylsiloxane copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, methylvinylpolysiloxane with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylpolysiloxane with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane copolymer with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, R 1 2SiO 2 / 2 Siloxane units and R 1 2R 2 SiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 2R 2 SiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 R 2 SiO 2 / 2 Siloxane units and R 1 SiO 3 / 2 Siloxane units or R represented by 2 SiO 3 / 2 Examples include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by and mixtures of two or more of the above. In the above, R 1This refers to hydrocarbon groups other than alkenyl groups, specifically alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl or phenethyl groups; halogen-substituted alkyl groups such as chloromethyl, 3-chloropropyl, or 3,3,3-trifluoropropyl groups. In addition, R in the above is also used. 2 This refers to an alkenyl group, specifically a vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, or heptenyl group.

[0048] In the addition-curing silicone composition, (2) polyorganosiloxane can play a role in crosslinking the (1) polyorganosiloxane. In the (2) polyorganosiloxane, the bonding position of the hydrogen atoms is not particularly limited, and for example, they may be bonded to the ends and / or side chains of the molecular chain. Furthermore, in the (2) polyorganosiloxane, the types of substituents that may be included in addition to the silicon-bonded hydrogen atoms are not particularly limited, and examples include alkyl groups, aryl groups, aralkyl groups, or halogen-substituted alkyl groups as mentioned for the (1) polyorganosiloxane, of which methyl groups or phenyl groups are usually applied, but are not limited thereto.

[0049] The molecular structure of the polyorganosiloxane described in (2) above is not particularly limited and may be any shape, such as linear, branched, cyclic, networked, or linear with a partial branching structure. Among the molecular structures described above, those having a linear molecular structure are usually applied, but the invention is not limited thereto.

[0050] More specific examples of the polyorganosiloxanes in (2) above include methylhydrogenpolysiloxane with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylhydrogen copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylhydrogensiloxane-methylphenylsiloxane copolymer with trimethylsiloxanoic acid groups sealed at both ends of the molecular chain, methylphenylpolysiloxane with dimethylhydrogensiloxane groups sealed at both ends of the molecular chain, R 1 3SiO 1 / 2 Siloxane units and R 1 2HSiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 2HSiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 HSiO 2 / 2 Siloxane units and R 1 SiO 3 / 2 Siloxane units or HSiO represented by 3 / 2 Examples include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by and mixtures of two or more of the above. In the above, R 1 The group is a hydrocarbon group other than an alkenyl group, and specifically may be an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group or heptyl group, an aryl group such as a phenyl group, tolyl group, xylyl group or naphthyl group, an aralkyl group such as a benzyl group or phenethyl group, a halogen-substituted alkyl group such as a chloromethyl group, 3-chloropropyl group or 3,3,3-trifluoropropyl group, etc.

[0051] The content of the polyorganosiloxane in (2) is not particularly limited, as long as it is included in an amount sufficient for proper curing to occur. For example, the polyorganosiloxane in (2) may be included in an amount such that there are 0.5 to 10 silicon-bonded hydrogen atoms for each alkenyl group contained in the polyorganosiloxane in (1) mentioned above. Sufficient curing can be performed within this range to ensure heat resistance.

[0052] The addition-curing silicone resin component may further contain platinum or a platinum compound as a catalyst for curing. The specific type of platinum or platinum compound is not particularly limited. The proportion of the catalyst should also be adjusted to a level that allows for appropriate curing.

[0053] In other examples, the silicone resin component is a condensation-curable silicone resin component and may include, for example, (a) an alkoxy group-containing siloxane polymer and (b) a hydroxyl group-containing siloxane polymer.

[0054] The (a) siloxane polymer may be, for example, a compound represented by the following chemical formula 1.

[0055] R 1 a R 2 b SiO c (OR 3 ) d (chemical 1)

[0056] In chemical formula 1, R 1 and R 2 Each of these independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, and R 3 R represents an alkyl group. 1 , R 2 and R 3 If there are multiple instances of each, they may be identical or different from one another. a and b each independently represent numbers greater than or equal to 0 and less than 1. a+b represents a number greater than 0 and less than 2. c represents a number greater than 0 and less than 2. d represents a number greater than 0 and less than 4. a+b+c×2+d is 4.

[0057] In the definition of Formula 1, the monovalent hydrocarbon may be, for example, an alkyl group having 1 to 8 carbon atoms, a phenyl group, a benzyl group, or a tolyl group, in which case the alkyl group having 1 to 8 carbon atoms may be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or an octyl group. Furthermore, in the definition of Formula 1, the monovalent hydrocarbon group may be substituted with known substituents such as a halogen, an amino group, a mercapto group, an isocyanate group, a glycidyl group, a glycidoxy group, or a ureido group.

[0058] In the definition of formula 1, R 3 Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, or butyl groups. Among alkyl groups, methyl or ethyl groups are commonly used, but the application is not limited to these.

[0059] Branched or tertiarily crosslinked siloxane polymers from the polymer of Formula 1 may be used. Furthermore, this (a) siloxane polymer may retain hydroxyl groups to the extent that it does not impair the purpose, specifically to the extent that it does not inhibit the de-alcoholization reaction.

[0060] The (a) siloxane polymer may be produced, for example, by hydrolysis and condensation of a polyfunctional alkoxysilane or polyfunctional chlorosilane. An average technician in this field can easily select an appropriate polyfunctional alkoxysilane or chlorosilane depending on the desired (a) siloxane polymer, and can also easily control the conditions of the hydrolysis and condensation reaction using it. On the other hand, when producing the (a) siloxane polymer, an appropriate monofunctional alkoxysilane may be used in combination, depending on the purpose.

[0061] As the siloxane polymer (a) mentioned above, commercially available organosiloxane polymers such as Shin-Etsu Silicone's X40-9220 or X40-9225, or GE Tray Silicone's XR31-B1410, XR31-B0270 or XR31-B2733 may be used.

[0062] As the (b) hydroxyl group-containing siloxane polymer included in the condensation-curable silicone composition, for example, a compound represented by the following chemical formula 2 may be used.

[0063] [ka]

[0064] In chemical formula 2, R4 and R5 each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group. If there are multiple R4 and R5, they may be the same or different from each other, and n represents an integer between 5 and 2,000.

[0065] In the definition of Formula 2, specific types of monovalent hydrocarbon groups include, for example, the same hydrocarbon groups as in the case of Formula 1.

[0066] The (b) siloxane polymer may be produced, for example, by hydrolysis and condensation of dialkoxysilane and / or dichlorosilane. An average technician in the field can easily select an appropriate dialkoxysilane or dichlorosilane depending on the desired (b) siloxane polymer, and can also easily control the conditions of the hydrolysis and condensation reaction using it. As the (b) siloxane polymer, commercially available bifunctional organosiloxane polymers such as XC96-723, YF-3800, and YF-3804 from GE Traysilicone may be used.

[0067] The aforementioned addition-curing or condensation-curing silicone compositions are examples of silicone resin components applicable to this application.

[0068] In other examples, when the curable resin component is a polyurethane component, the component may include at least a polyol and a polyisocyanate. In the above, the polyol is a compound containing at least two hydroxyl groups, and the polyisocyanate is a compound containing at least two isocyanate groups. These compounds may each be monomolecular, oligomeric, or polymeric compounds.

[0069] There are no major restrictions on the types of polyols that can be applied; for example, known polyether polyols or polyester polyols may be used. Known polyether polyols include polyalkylene glycols such as polypropylene glycol or polyethylene glycol, where the number of carbon atoms in the alkylene glycol portion is 1-20, 1-16, 1-12, 1-8, or 1-4, as well as ethylene oxide / propylene oxide copolymer polyols, PTME (poly(tetramethylene glycol)), PHMG (poly(hexamethylene ether glycol)), and others. Known polyester polyols include those synthesized from a dibasic acid and glycol, such as polyester polyols containing the dibasic acid unit and glycol unit, or polycaprolactone polyols (obtained from ring-opening polymerization of cyclic lactones). In addition to the polyols mentioned above, carbonate polyols, vegetable polyols such as castor oil, and hydrocarbon polyols such as HTPB (Hydroxyl-terminated polybutadiene) and HTPIB (Hydroxyl-terminated polyisobutylene) are also known.

[0070] In this application, an appropriate type may be selected and used from among the known polyols described above.

[0071] The aforementioned polyisocyanate may also be selected and used from among known aromatic or aliphatic polyisocyanate compounds.

[0072] In the curable composition, the lower limit of the content of the curable resin component may be approximately 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, or 80% by weight, based on the total weight of the curable composition, and the upper limit may be approximately 95% by weight, 90% by weight, 85% by weight, 80% by weight, 75% by weight, 70% by weight, 65% by weight, 60% by weight, or 55% by weight, but less than 100% by weight. The content may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above. The above content is based on the total weight of the curable composition, provided that if the curable composition contains a filler and / or a solvent, it is a percentage based on the total weight of the curable composition excluding the filler and / or solvent.

[0073] The curable composition may contain a so-called phase-change material (PCM) in order to ensure the latent heat properties described above. A phase-change material is a substance that absorbs or releases heat during a phase transition process, as is well known. The phase transition process is an isothermal process.

[0074] The phase transition of the aforementioned phase transition material, whether endothermic or exothermic, may be a phase transition from solid to solid, solid to liquid, solid to gas, or liquid to gas. The aforementioned phase transition reactions (solid → solid, solid → liquid, solid → gas, liquid → gas) may also be endothermic reactions. While substances that undergo a phase transition from solid to liquid are advantageous in terms of efficiency, such substances become liquid after the phase transition and are therefore difficult to retain within the cured body. However, the cured body of this application exhibits the aforementioned weight change rate, and therefore, a substance that undergoes a phase transition from solid to liquid may be used. Accordingly, the phase transition material applied in this application may be a substance in which a phase transition occurs between a solid phase and a liquid phase, and the phase transition reaction from the solid phase to the liquid phase may be an endothermic reaction.

[0075] The phase transition material to which this application applies may have a melting point within a predetermined range. For example, the lower limit of the melting point may be around 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and the upper limit may be around 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, or 40°C. The melting point may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0076] To ensure appropriate temperature control characteristics, the lower limit of the content of the phase transition material having the aforementioned melting point among all phase transition materials contained in the curable composition of this application may be approximately 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, or 95% by weight, and the upper limit may be approximately 100% by weight, 99% by weight, 98% by weight, 97% by weight, 96% by weight, or 95% by weight. The content may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0077] In other examples, the curable composition may contain only phase transition materials having a melting point within the specified range as the phase transition material.

[0078] As the phase transition material, one that exhibits a predetermined range of latent heat within a predetermined temperature range may be used.

[0079] For example, the lower limit of the latent heat exhibited by the phase transition material may be around 100 J / g, 110 J / g, 120 J / g, 130 J / g, 140 J / g, 150 J / g, 160 J / g, 170 J / g, or 180 J / g, and the upper limit may be around 400 J / g, 380 J / g, 360 J / g, 340 J / g, 320 J / g, 300 J / g, 280 J / g, 260 J / g, 240 J / g, 220 J / g, 200 J / g, 180 J / g, or 160 J / g. The latent heat may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above while being less than or equal to any of the upper limits mentioned above.

[0080] The lower limit of the temperature range (temperature interval) in which the phase transition material exhibits the latent heat may be approximately 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and the upper limit may be approximately 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, or 40°C. The temperature range in which the latent heat exhibits may be above or below any of the lower limits mentioned above, below or below any of the upper limits mentioned above, or above or below any of the lower limits mentioned above, while being within the range of below or below any of the upper limits mentioned above.

[0081] To ensure appropriate temperature control characteristics, the lower limit of the content of the phase transition material having the aforementioned latent heat characteristics among all phase transition materials contained in the curable composition of this application may be approximately 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, or 95% by weight, and the upper limit may be approximately 100% by weight, 99% by weight, 98% by weight, 97% by weight, 96% by weight, or 95% by weight. The content may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0082] In other examples, the curable composition may contain only the phase transition material having the latent heat properties described above as the phase transition material.

[0083] A desired cured body can be formed by applying the aforementioned phase transition material.

[0084] As the phase transition material, any known substance exhibiting the aforementioned properties may be used. Known phase transition materials include inorganic substances, organic substances, and eutectic substances. Among such substances, organic phase transition materials may be used as substances possessing the aforementioned latent heat properties.

[0085] Known organic phase transition materials include fatty acids, polyalcohols, ketones, D-lactic acid, and paraffin-based substances. In this application, one or more of these substances may be used.

[0086] Examples of fatty acids include formic acid, n-octanoic acid, lauric acid or palmitic acid, and stearic acid. Examples of alcohol-based phase transition substances include glycerin, polyethylene glycol (PEG), xylitol or erythritol. Examples of ketone-based phase transition substances include 2-pentadecanone or 4-heptadecanone.

[0087] As the phase change material, a paraffinic substance may be used. Known paraffinic phase change materials include n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-henicosane, n-docosane, n-tricosane, n-pentacosane, n-hexacosane, n-heptacosane, n-octacosane, n-nonacosane, n-triacontane, n-hentriacontane, n-dotriacontane, n-triatriacontane or other higher paraffins (Paraffin C 16 ~C 18 、Paraffin C 13 ~C 24 、RT 35 HC、Paraffin C 16 ~C 28 、Paraffin C 20 ~C 33 、Paraffin C 22 ~C 45 、Paraffin C 22 ~C 50 、Paraffin natural wax811, Paraffin natural wax106, etc.).

[0088] In this application, an appropriate type may be selected from the above-known paraffinic substances for use.

[0089] To achieve the appropriate effect, this application may use paraffin as the phase transition material, having a melting point within the aforementioned range and having 5 or more carbon atoms. In other examples, the number of carbon atoms in the paraffin may be in the range of 5 to 40 or 10 to 30. Such paraffin may be an alkane having carbon atoms.

[0090] In one example, at least one of the following may be used as the paraffinic substance: n-nonadecane, n-docosane, n-eicosane, n-heneicosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, lauric acid, and myristic acid.

[0091] In order to embody appropriate properties, two or more of the aforementioned types may be used as phase transition materials in this application.

[0092] In one example, the curable composition may include first and second phase transition materials of different types as phase transition materials.

[0093] For example, the curable composition may include, as a phase transition material, a first phase transition material having a melting point above 40°C and a second phase transition material having a melting point of 40°C or less.

[0094] The lower limit of the melting point of the first phase transition material may be around 40°C, 41°C, 42°C, 43°C, or 44°C, and the upper limit may be around 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, or 45°C. The melting point of the first phase transition material may be above or below any of the lower limits mentioned above, below or below any of the upper limits mentioned above, or above or below any of the lower limits mentioned above, while being below or below any of the upper limits mentioned above.

[0095] The upper limit of the melting point of the second phase transition material may be 40°C, 39°C, 38°C, or about 37.5°C, and the lower limit may be about 25°C, 30°C, or 35°C. The melting point of the second phase transition material may be above or below any of the lower limits mentioned above, below or below any of the upper limits mentioned above, or above or below any of the lower limits mentioned above, while remaining within the range of below or below any of the upper limits mentioned above.

[0096] The lower limit of the difference in melting points between the first phase transition material and the second phase transition material may be around 1°C, 2°C, 3°C, 4°C, 5°C, 6°C, 7°C, or 8°C, and the upper limit may be around 20°C, 19°C, 18°C, 17°C, 16°C, 15°C, 14°C, 13°C, 12°C, 11°C, 10°C, 9°C, or 8°C. The difference in melting points is the value obtained by subtracting the melting point of the second phase transition material from the melting point of the first phase transition material. The difference in melting points may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0097] The first and second phase transition materials can each exhibit latent heat within a predetermined range. For example, the lower limit of the latent heat of the first and second phase transition materials may be around 100 J / g, 110 J / g, 120 J / g, 130 J / g, 140 J / g, 150 J / g, 160 J / g, 170 J / g, or 180 J / g, and the upper limit may be around 400 J / g, 380 J / g, 360 J / g, 340 J / g, 320 J / g, 300 J / g, 280 J / g, 260 J / g, 240 J / g, 220 J / g, 200 J / g, 180 J / g, or 160 J / g. The latent heat may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above, while remaining within the range of less than or equal to any of the upper limits mentioned above.

[0098] The first and second phase transition materials may be selected such that the latent heats of the first and second phase transition materials are different from each other, and the absolute value of the difference between them falls within a predetermined range. The difference in latent heats is calculated using the following formula 2, where A is the latent heat of the material with the larger latent heat among the first and second phase transition materials, and B is the latent heat of the material with the smaller latent heat.

[0099] [Formula 2] Latent heat difference = 100 × (AB) / B

[0100] The upper limit of the absolute value of the difference in latent heat may be approximately 100%, 95%, 90%, 85%, 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, 30%, 25%, 20%, or 15%, and the lower limit may be approximately 0%, 5%, or 10%. The absolute value of the difference in latent heat may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0101] By selecting a phase transition material that satisfies these characteristics, the desired cured material can be formed more effectively.

[0102] To ensure appropriate properties, the first and second phase transition materials may be selected such that the first phase transition material has a higher onset temperature than the second phase transition material.

[0103] In this case, the lower limit of the absolute value of the onset temperature difference may be around 1°C, 2°C, 3°C, 4°C, 5°C, 6°C, 7°C, 8°C, or 9°C, and the upper limit may be around 20°C, 19°C, 18°C, 17°C, 16°C, 15°C, 14°C, 13°C, 12°C, 11°C, or 10°C. The absolute value of the onset temperature difference may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above while being less than or equal to any of the upper limits mentioned above.

[0104] In the above, the lower limit of the onset temperature of the first phase transition material may be around 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, or 40°C, and the upper limit may be around 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, or 45°C. The onset temperature may be above or below any of the lower limits mentioned above, below or below any of the upper limits mentioned above, or above or below any of the lower limits mentioned above, while being below or below any of the upper limits mentioned above.

[0105] In the above, the latent heat interval of the first phase transition material (the difference between the offset temperature and the onset temperature) may be narrower than the latent heat interval of the second phase transition material (the difference between the offset temperature and the onset temperature).

[0106] In the above-described case, the lower limit of the absolute value of the difference between the latent heat interval of the first phase transition material and the latent heat interval of the second phase transition material may be approximately 0.4°C, 0.6°C, 0.8°C, 1°C, 1.1°C, 1.2°C, 1.3°C, 1.4°C, 1.5°C, 1.6°C, or 1.7°C, and the upper limit may be approximately 10°C, 9°C, 8°C, 7°C, 6°C, 5°C, 4°C, 3°C, or 2°C. The absolute value may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0107] In the above-mentioned case, the lower limit of the latent heat interval of the first phase transition material may be approximately 0.5°C, 1°C, 1.5°C, 2°C, 2.5°C, 3°C, 3.5°C, 4°C, 4.5°C, 5°C, or 5.5°C, and the upper limit may be approximately 20°C, 18°C, 16°C, 14°C, 12°C, 10°C, 8°C, or 6°C. The latent heat interval of the first phase transition material may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above while being less than or equal to any of the upper limits mentioned above.

[0108] In the above, the first phase transition material may have a high latent heat relative to the second phase transition material. For example, the lower limit of the latent heat of the first phase transition material may be around 100 J / g, 110 J / g, 120 J / g, 130 J / g, 140 J / g, 150 J / g, 160 J / g, 170 J / g, or 180 J / g, and the upper limit may be around 400 J / g, 380 J / g, 360 J / g, 340 J / g, 320 J / g, 300 J / g, 280 J / g, 260 J / g, 240 J / g, 220 J / g, 200 J / g, 180 J / g, or 160 J / g. The latent heat may be greater than or exceeding any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or exceeding any of the lower limits mentioned above, while remaining within the range of less than or equal to any of the upper limits mentioned above.

[0109] In the state described above, the first and second phase transition materials may have the absolute value of the difference (equation 2) described above.

[0110] That is, the upper limit of the absolute value of the difference in latent heat between the first and second phase transition materials may be approximately 100%, 95%, 90%, 85%, 80%, 75%, 70%, 65%, 60%, 55%, 50%, 45%, 40%, 35%, 30%, 25%, 20%, or 15%, and the lower limit may be approximately 0%, 5%, or 10%. The absolute value of the difference in latent heat may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0111] As described above, by selecting the first and second phase transition materials, stable temperature control performance can be ensured within a desired temperature range. For example, if the temperature rises gradually or rapidly due to abnormal heat generation or ignition of the product, the material with the lower onset temperature among the first and second phase transition materials will act sequentially with the other materials, and the desired effect can be achieved through their respective latent heat properties.

[0112] To ensure appropriate temperature control characteristics, the lower limit of the total content of the first and second phase transition materials in the total phase transition materials contained in the curable composition of this application may be approximately 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, or 95% by weight, and the upper limit may be approximately 100% by weight, 99% by weight, 98% by weight, 97% by weight, 96% by weight, or 95% by weight. The content may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0113] As for the content of the phase transition material in the curable composition, the lower limit of the content of the phase transition material per 100 parts by weight of the curable resin component may be approximately 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, or 30 parts by weight, and the upper limit may be approximately 75, 74, 73, 72, 71, 70, 69, 68, 67, 66, 65, 6 The amounts may be approximately 4 parts by weight, 63 parts by weight, 62 parts by weight, 61 parts by weight, 60 parts by weight, 59 parts by weight, 58 parts by weight, 57 parts by weight, 56 parts by weight, 55 parts by weight, 54 parts by weight, 53 parts by weight, 52 parts by weight, 51 parts by weight, 50 parts by weight, 49 parts by weight, 48 parts by weight, 47 parts by weight, 46 parts by weight, 45 parts by weight, 44 parts by weight, 43 parts by weight, 42 parts by weight, 41 parts by weight, 40 parts by weight, 39 parts by weight, 38 parts by weight, 37 parts by weight, 36 parts by weight, 35 parts by weight, 34 parts by weight, 33 parts by weight, or 32 parts by weight. The amounts may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0114] When the first and second phase transition materials are applied as phase transition materials, the lower limit of the content of the second phase transition material relative to 100 parts by weight of the first phase transition material is 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 11 parts by weight, 12 parts by weight, 13 parts by weight, 14 parts by weight, 15 parts by weight, 16 parts by weight, 17 parts by weight, 18 parts by weight, 19 parts by weight, 20 parts by weight, 21 parts by weight, 22 parts by weight, 23 parts by weight, 24 parts by weight, 25 parts by weight, The amount may be approximately 26, 27, 28, 29, 30, 31, 32, 33, or 34 parts by weight, and the upper limit may be approximately 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, 20, or 15 parts by weight. The content may be greater than or equal to any of the lower limits mentioned above, less than or equal to any of the upper limits mentioned above, or greater than or equal to any of the lower limits mentioned above, while being less than or equal to any of the upper limits mentioned above.

[0115] The curable composition may optionally include fillers, such as thermally conductive fillers, as additional components. These fillers complement the low thermal conductivity of the phase transition material.

[0116] The thermally conductive filler is not particularly limited and may include, but is not limited to, inorganic fillers such as aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium hydroxide (Ca(OH)2), bohemite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si3N4), silicon carbide (SiC), zinc oxide (ZnO), or beryllium oxide (BeO). One or more of the above fillers may be selected. When aiming to form a low-density cured body, a filler with a low specific gravity (e.g., aluminum hydroxide) may be selected from the above filler components.

[0117] The form of the filler is not particularly limited, and for example, spherical, needle-shaped, plate-shaped, or other amorphous fillers may be used.

[0118] In one example, the filler may be one with an average particle size in the range of 10 μm to 200 μm. The average particle size is the D50 particle size measured by the method described in the examples below. The desired effect can be more efficiently ensured by applying a filler of such particle size.

[0119] The particle size of the filler may, in other examples, be 15 μm or more, 20 μm or more, 25 μm or more, 30 μm or more, 35 μm or more, or 40 μm or more, or approximately 180 μm or less, 160 μm or less, 140 μm or less, 120 μm or less, 100 μm or less, 80 μm or less, 60 μm or less, or 50 μm or less.

[0120] The content of the thermally conductive filler in the curable composition is adjusted according to the purpose. For example, in the curable composition, the thermally conductive filler may be included in an amount of about 200 parts by weight or less per 100 parts by weight of the curable resin component. In other examples, the ratio may be 195 parts by weight or less, 190 parts by weight or less, 185 parts by weight or less, 180 parts by weight or less, 175 parts by weight or less, 170 parts by weight or less, 165 parts by weight or less, 160 parts by weight or less, 155 parts by weight or less, 150 parts by weight or less, 145 parts by weight or less, 140 parts by weight or less, 135 parts by weight or less, 130 parts by weight or less, 125 parts by weight or less, 120 parts by weight or less, 115 parts by weight or less, 110 parts by weight or less, 105 parts by weight or less, 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 8 It may be 5 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, or 40 parts by weight or less, or it may be 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, or 75 parts by weight or more.

[0121] The curable composition may further contain, as an optional additional component, a hollow filler from the viewpoint of weight reduction.

[0122] The application of the aforementioned hollow filler can contribute to weight reduction.

[0123] For example, the filler may have a D50 particle size (average particle size) in the range of 10 μm to 100 μm. In other examples, the D50 particle size may be 12 μm or more, 14 μm or more, 16 μm or more, 18 μm or more, 20 μm or more, 22 μm or more, 24 μm or more, 26 μm or more, 28 μm or more, 30 μm or more, 32 μm or more, 34 μm or more, 36 μm or more, 38 μm or more, 40 μm or more, 42 μm or more, 44 μm or more, 46 μm or more, 48 μm or more, 50 μm or more, 52 μm or more, 54 μm or more, 5 It may be 6 μm or larger, 58 μm or larger, or approximately 98 μm or smaller, 96 μm or smaller, 94 μm or smaller, 92 μm or smaller, 90 μm or larger, 88 μm or smaller, 86 μm or smaller, 84 μm or smaller, 82 μm or smaller, 80 μm or smaller, 78 μm or smaller, 76 μm or smaller, 74 μm or smaller, 72 μm or smaller, 70 μm or smaller, 68 μm or smaller, 66 μm or smaller, 64 μm or smaller, 62 μm or smaller, or 60 μm or smaller.

[0124] The hollow filler may have a density in the range of approximately 0.05 to 1 g / ml. In other examples, the density may be 0.01 g / ml or more, 0.15 g / ml or more, 0.2 g / ml or more, 0.25 g / ml or more, 0.3 g / ml or more, 0.35 g / ml or more, 0.4 g / ml or more, 0.45 g / ml or more, 0.5 g / ml or more, 0.55 g / ml or more, or 0.6 g / ml or more, or 0.95 g / ml or less, 0.9 g / ml or less, or 0.85 g / ml. g / ml or less, 0.8g / ml or less, 0.75g / ml or less, 0.7g / ml or less, 0.65g / ml or less, 0.6g / ml or less, 0.55g / ml or less, 0.5g / ml or less, 0. It may be about 45g / ml or less, 0.4g / ml or less, 0.35g / ml or less, 0.3g / ml or less, 0.25g / ml or less, 0.2g / ml or less, or 0.15g / ml or less.

[0125] As for the hollow filler, there are no particular limitations, and various types can be used as long as they have the aforementioned particle size and / or density and can be uniformly mixed with the curable polyorganosiloxane component.

[0126] For example, known organic fillers, inorganic fillers, or mixed inorganic fillers may be used as hollow fillers. Even when hollow fillers are applied, organic particles consisting of organic matter for the cell (shell) portion, inorganic particles consisting of inorganic matter, and / or mixed inorganic particles consisting of inorganic substances may be used. Examples of such particles include, but are not limited to, acrylic particles such as PMMA (poly(methyl methacrylate)), epoxy particles, nylon particles, styrene particles, and / or copolymer particles of styrene / vinyl monomer, as well as inorganic particles such as silica particles, alumina particles, indium oxide particles, tin oxide particles, zirconium oxide particles, zinc oxide particles, and / or titania particles.

[0127] In one example, the hollow filler may be particles whose cell portion is made of soda-lime material (soda-lime filler), particles whose cell portion is made of soda-lime borosilicate material (soda-lime borosilicate filler), cenosphere filler, or other silica particles.

[0128] If the aforementioned hollow filler is included, there are no particular restrictions on its proportion, and it may be selected in an appropriate proportion within a range that allows for the desired weight reduction without impairing the physical properties of the cured body.

[0129] The curable composition may further contain other necessary components in addition to the above components. For example, the curable composition may further contain additional additives as needed, such as catalysts, pigments or dyes, dispersants, thixotropy imparters, flame retardants, etc.

[0130] Such a curable composition may be a solvent-based composition, an aqueous composition, or a solvent-free composition, and may preferably be a solvent-free composition.

[0131] The curable composition may be a one-component composition or a two-component composition, as described above, and may be a main component or a curing agent part of a two-component composition, or a mixture of the main component and the curing agent part.

[0132] Furthermore, when the curable composition is a two-component composition, there are no particular restrictions on the proportion of other components besides the curable resin component within the main component and curing agent parts. For example, the phase transition substance and / or filler may be included in both the main component and the curing agent part, or they may be included separately in the main component and the curing agent part.

[0133] The curable composition of this application is suitable for a variety of applications and may be used in particular as a material to control the heat of heat-generating products.

[0134] In one example, a method for producing the curable composition may be selected to satisfy the aforementioned latent heat properties, weight change rate, density, and / or hardness properties.

[0135] For example, the curable composition may be manufactured by mixing the phase transition material with a curable resin component while the phase transition material is molten. Through such steps, the desired curable composition can be provided more effectively.

[0136] Therefore, the method for producing the curable composition may include a step of mixing the molten phase transition material with the curable resin component, and more specifically, it may include a step of melting the phase transition material and a step of mixing the molten phase transition material with the curable resin component.

[0137] The method for melting the phase transition material is not particularly limited; for example, the phase transition material can be held and melted at a temperature above its melting point.

[0138] In one example, the holding temperature of the phase transition material may be 10°C to 100°C or more higher than the melting point of the phase transition material. In other examples, the temperature may be 15°C or more, 20°C or more, 25°C or more or 30°C or more higher than the melting point of the phase transition material, and / or a low temperature of 95°C or less, 90°C or less, 85°C or less, 80°C or less, 75°C or less, 70°C or less, 65°C or less, 60°C or less, 55°C or less, 50°C or less, 45°C or less, 40°C or less, 35°C or less or 30°C or less than the melting point of the phase transition material.

[0139] A curable composition with desired properties can be efficiently produced by mixing a phase transition material melted within such a temperature range with a curable resin component. The temperature at which the melted phase transition material and the curable resin component are mixed may be within the same temperature range as the temperature at which the phase transition material was melted, or it may be a lower temperature.

[0140] In one example, the mixing may be carried out at a temperature high enough to reach 100°C or more relative to the melting point of the phase transition material. In other examples, the temperature may be 15°C or more, 20°C or more, 25°C or more or 30°C or more higher than the melting point of the phase transition material, or it may be a low temperature such as 95°C or less, 90°C or less, 85°C or less, 80°C or less, 75°C or less, 70°C or less, 65°C or less, 60°C or less, 55°C or less, 50°C or less, 45°C or less, 40°C or less, 35°C or less or 30°C or less relative to the melting point of the phase transition material.

[0141] This application further relates to a cured body of the curable composition described above. There are no restrictions on the method of curing the curable composition to obtain a cured body, and an appropriate curing method may be applied depending on the type of curable composition. For example, in the case of energy ray curing, a method of irradiating the composition with energy rays such as ultraviolet light may be used; in the case of moisture curing, a method of holding the composition under appropriate humidity may be used; in the case of thermosetting, a method of applying appropriate heat to the composition may be used; in the case of room temperature curing, a method of holding the composition at room temperature may be used; and in the case of hybrid curing, a method of applying two or more curing methods may be used. As described above, in appropriate examples, the curable composition may be of room temperature curing type.

[0142] This application further relates to a product comprising the composition or a cured version thereof. The curable composition or a cured version thereof may be usefully applied as a material for controlling the heat of a heat-generating component, heat-generating element, or heat-generating product. Accordingly, the product may include a heat-generating component, heat-generating element, or heat-generating product. The terms heat-generating component, element, or product mean a component, element, or product that generates heat during use, and the type is not particularly limited. Typical heat-generating components, elements, or products include a variety of electrical / electronic products, such as battery cells, battery modules, or battery packs.

[0143] The product of this application may include, for example, the heat-generating component, element, or product and the curable composition (or the two-component composition) or its cured form located adjacent to the heat-generating component, element, or product. In such cases, as described above, the heat-generating component, element, or product may be a component, element, or product whose appropriate operating temperature is in the range of approximately 15°C to 60°C. That is, the curable composition of this application is placed adjacent to the heat-generating component, element, or product and is useful for uniformly maintaining the operating temperature of the product within the aforementioned range.

[0144] The specific method of constructing the product of this application is not particularly limited, and when the curable composition or two-component composition or its cured product of this application is applied as a heat dissipation material, the product may be constructed in various known ways.

[0145] In one example, the curable composition may be used as a potting material when constructing a battery module or battery pack. The potting material may be a material that covers at least some or all of the multiple unit battery cells in the battery module or battery pack while in contact with them. The curable composition or its cured form according to this application can control the heat generated from the battery cells of the battery module or pack when applied as the potting material, can prevent chain ignition or explosion, and can maintain a uniform operating temperature of the module, pack, or battery cells. Furthermore, this application can provide a curable composition that has excellent potting efficiency due to the control of viscosity and thixotropy to appropriate levels before curing, and forms a stable potting structure without the generation of unwanted bubbles after curing. This application can provide a curable composition that exhibits low density after curing, and can provide a battery module or pack that is lightweight relative to its volume while providing high output. Furthermore, this application can provide a curable composition that also has excellent required physical properties, including insulation.

[0146] In this case, as a battery-related technology, the curable composition may be applied as a heat dissipation material for battery modules and battery packs, or as a heat dissipation material for vehicle OBCs (On-Board Chargers). Therefore, this application may further relate to a battery module, battery pack, or on-board charger (OBC) that includes the curable composition or its cured form as a heat dissipation material. The application location and method of the curable composition or cured form in the battery module, battery pack, or on-board charger are not particularly limited, and known methods may be applied. Furthermore, the curable composition of this application is not limited to the above-mentioned applications and may be effectively applied to various applications requiring excellent heat dissipation characteristics, storage stability, and adhesive strength.

[0147] In other examples of this application, the application may relate to electronic equipment or devices having a cured body of the curable composition.

[0148] The types of electronic equipment or devices are not particularly limited and include, for example, vehicle AVN (audio video navigation), OBC (On Board Charger) modules for electric vehicles, LED modules or IC chips and computers or mobile devices containing them.

[0149] The cured body of the curable composition can dissipate heat within the equipment or device, and may provide durability against impact and insulation properties.

[0150] The curable composition may, in one example, be used as a battery potting material.

[0151] This application further relates to a battery module to which the potting material is applied. Such a battery module can exhibit high output while being lightweight for the same volume, and the heat generated in the battery cells is properly controlled, preventing problems such as chain ignition.

[0152] The battery module may, in one example, include a substrate, a plurality of battery cells arranged on the substrate, and the curable composition or its cured product covering at least a portion or all of the plurality of battery cells.

[0153] In the above structure, the curable composition or its cured product (potting material) may, in one example, cover the battery cells while in contact with the entire surface of the plurality of battery cells (excluding the surface of the battery cells that are in contact with the substrate side) (structure in Figure 1), or it may only be in contact with the upper part of the plurality of battery cells (structure in Figure 2).

[0154] Figures 1 and 2 are schematic diagrams of the structure of the battery module as described above, showing a structure including a substrate 10, battery cells 20, and the potting material (30, the curable composition or its cured product). The battery module may further include an adhesive material 40 for fixing the battery cells 20 to the substrate 10, and in one example, the adhesive material 40 may be configured to be thermally conductive.

[0155] As long as the curable composition or its cured product is applied as a potting material, the specific configuration of the battery module, such as the battery cells, substrates, and / or adhesive materials, is not particularly limited, and known materials may be used.

[0156] For example, known pouch-type, prismatic, or cylindrical battery cells may be used as the battery cells, and known materials may also be used as the substrate and adhesive material.

[0157] The method for manufacturing the battery module is not particularly limited. For example, it may be formed by injecting the curable composition onto a plurality of battery cells formed on a substrate and curing it as needed.

[0158] The curable composition of this application has appropriate viscosity and thixotropy, so it can efficiently fill the spaces between very closely spaced battery cells, and after forming the potting material, it can exhibit desired heat insulation and heat shielding properties.

[0159] For example, products such as battery modules and battery packs may be manufactured by a method that includes the steps of holding the curable composition at an appropriate temperature and melting it, and applying the curable composition melted in the first step to a heat-generating component.

[0160] The temperature at which the curable composition is melted can be determined according to the specific application. For example, if the heat-generating product is the aforementioned battery cell, battery module, or battery pack, the lower limit of the temperature at the melting stage may be around 40°C or 50°C, and the upper limit may be around 80°C or 70°C. The temperature may be above or below any of the lower limits mentioned above, below or below any of the upper limits mentioned above, or above or below any of the lower limits mentioned above, while being below or below any of the upper limits mentioned above. If the temperature is too low, the fluidity of the curable composition may decrease, or the curing rate of the curable composition after melting may be too fast, making application difficult. If the temperature is too high, damage may occur to the heat-generating product, or a phase transition material with relatively low density in the curable composition may migrate to the surface, resulting in a non-uniform cured body.

[0161] There are no particular limitations on the method of applying the molten curable composition to the heat-generating component, and the curable composition may be applied through known potting processes or other processes.

[0162] Furthermore, if necessary, a step of curing the curable composition may be performed after the above application, in which case an appropriate curing method may be selected depending on the type of curable composition. [Effects of the Invention]

[0163] This application may provide a curable composition and its applications. The curable composition of this application may be applied to a product that generates heat during a driving or holding process and can be used as a material capable of handling said heat. The curable composition of this application may be applied to a product in which multiple heat-generating elements are integrated and can efficiently handle the heat generated from the elements while maintaining a uniform temperature of the product. Furthermore, the curable composition of this application, when applied to such a product, can prevent or minimize the impact of such heat generation, explosion, or ignition on other adjacent elements even if abnormal heat generation, explosion, or ignition occurs in one of the multiple elements. The curable composition of this application may further perform the above functions stably over a long period of time. This application may further provide a cured body formed by such a curable composition or a curable composition or an application for said cured body. [Brief explanation of the drawing]

[0164] [Figure 1] Figure 1 is a schematic diagram of an exemplary battery module of this application. [Figure 2] Figure 2 is a schematic diagram of an exemplary battery module of this application. [Figure 3] Figure 3 shows the DSC analysis results for the cured product of Example 1. [Figure 4] Figure 4 shows the DSC analysis results for the cured product of Example 2. [Figure 5] Figure 5 shows the DSC analysis results for the cured product of Example 3. [Modes for carrying out the invention]

[0165] The present application will be described in detail below through the examples provided, but the scope of this application is not limited by the examples described below.

[0166] 1. Latent heat measurement The latent heat was evaluated using the following method. Approximately 3-5 mg of sample was loaded into a DSC (Differential Scanning Calorimeter) equipped with a Q200 model from TA Instrument Co., Ltd. The temperature range for latent heat evaluation of the equipment was set to -20°C to 200°C. The endothermic section was measured while increasing the temperature at a rate of approximately 10°C / min, and the latent heat (unit: J / g) was calculated by integrating the endothermic peak observed in the endothermic section. The temperature at the inflection point at the left onset of the endothermic peak was defined as the latent heat section start temperature (onset temperature), and the temperature at the inflection point at the right onset was defined as the latent heat section end temperature (offset temperature). The width of the latent heat section was the value obtained by subtracting the onset temperature from the offset temperature.

[0167] When measuring the latent heat of the phase transition material, the phase transition material was used as the sample.

[0168] For latent heat measurement of the cured body, the sample was prepared by curing a curable composition. Specifically, the main component and curing agent part of the curable composition were mixed in a 1:1 volume ratio to prepare a mixture. This mixture was left in an 80°C chamber for about 1 hour, then applied to an aluminum dish to a thickness of about 10 mm using an injector, and held at room temperature (about 25°C) for 24 hours to produce a cured body.

[0169] On the other hand, in the above, the melting point of the phase transition material was defined as the temperature at the peak of the endothermic peak.

[0170] 2. Temperature control performance test The main component and hardener part of the curable composition were mixed in a 1:1 volume ratio and held in an 80°C chamber for about 1 hour. Next, the mixture was applied to an aluminum dish to a thickness of about 10 mm using an injector and allowed to cure at room temperature (about 25°C) for about 24 hours. The cured body was cut into squares with a width and length of 3 cm each to produce test pieces. A K-type thermocouple (OMEGA) was attached to a hot plate (AS ONE, NDK-1A-F model), and the test pieces were placed on top of it and secured with tape. Next, the temperature of the hot plate was increased from 35°C at a rate of about 5.45°C / min, and the temperature was measured 11 minutes after the start of the temperature increase (temperature data logger: FLUKE IR thermometers 566 model).

[0171] 3.Hardness measurement The main component and hardener part of the curable composition were mixed in a 1:1 volume ratio and held in an 80°C chamber for about 1 hour. Next, the mixture was applied to an aluminum dish to a thickness of about 10 mm using an injector, and then allowed to cure at room temperature (about 25°C) for about 24 hours. The hardness of the cured body was measured according to the ASTMD2240 standard. An ASKER Durometer was used for hardness measurement. An initial hardness was measured by applying a load of about 1.5 kg to the surface of a flat sample, and the hardness was evaluated by confirming the stabilized measurement value after 15 seconds. Shore A or Shore OO hardness was measured.

[0172] 4. Measurement of density The density of the cured body was confirmed using a gas pycnometer equipment (model name: BELPYCNO, manufacturer: Microtrac BEL) in accordance with ASTM D792 standard. Using the said equipment, the density measurement value at room temperature by injecting helium gas can be confirmed. The cured body was prepared by mixing the main agent and the curing agent parts produced in the examples or comparative examples in a volume ratio of 1:1, holding them in a chamber at 80 °C for about 1 hour, then applying the mixture with an injector to an aluminum dish to a thickness of about 10 mm, and then holding and curing at room temperature (about 25 °C) for about 24 hours.

[0173] 5.GPC (Gel Permeation Chromatograph) The molecular weight characteristics of the material were measured using GPC (Gel permeation chromatography). The material to be analyzed was placed in a 5 mL vial and diluted with toluene to a concentration of about 5 mg / mL. Then, the calibration standard sample and the material to be analyzed were filtered through a syringe filter (pore size: 0.45 μm) and then measured. The analysis program used ChemStation of Agilent technologies. The weight average molecular weight (Mw) or the number average molecular weight (Mn) was obtained by comparing the elution time of the sample with the calibration curve. The measurement conditions of GPC are as follows.

[0174] <GPC measurement conditions> Equipment: 1200 series of Agilent technologies Columns: Two PLgel mixed B columns from Polymer laboratories were used Solvent: Toluene Column temperature: 40 °C Sample concentration: 5 mg / mL, 10 μL injection Standard sample: Polystyrene (Mp: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)

[0175] 6. Particle Size Analysis of Filler The particle size of the filler was measured using MASTERSIZER 3000 equipment of Marven in accordance with ISO-13320, and Ethanol was used as the solvent during the measurement. As the particle size of the filler, the D50 particle size was measured and taken as the average particle size. The D50 particle size is the particle size at the 50% volume-based cumulative value of the particle size distribution (median diameter). The particle size distribution is determined on a volume basis, and in the cumulative curve with the total volume as 100%, it is the particle diameter at the point where the cumulative value becomes 50%.

[0176] 7. Weight Change (△W) The main part and the curing agent part of the curable composition were mixed at a volume ratio of 1:1 to produce a mixture. The mixture was held in a chamber at 80°C for about 1 hour and then applied to an aluminum dish with an injector to a thickness of about 10 mm. The applied mixture was held at room temperature (about 25°C) for 24 hours to cure and produce a cured body. The cured body was cut into squares with a horizontal and vertical length of 1 cm each to produce specimens (weight: W i , unit: g). The specimens were placed on filter paper and held in a chamber at about 80°C for about 24 hours and then taken out, and the weight of the specimens again (weight: W f , unit: g) was measured. The weight measured in the above process was substituted into the following formula A to measure the weight change rate (△W). The weight change rates were measured for 4 specimens formed from the same curable composition, and the average values are shown in Tables 1 and 2 below.

[0177] [Formula A] △W = 100×(W f - W i ) / W i

[0178] Example 1. Manufacturing of the main ingredient A silicone resin component (Lord's CoolTherm SC-6705) was used as the curable resin component. The main component part was prepared by mixing the main component of the silicone resin component with a phase transition material. Docosane (n-docosane) and eicosane (n-eicosane) were used as the phase transition material. DSC analysis revealed that docosane had a melting point of approximately 44°C and a latent heat of approximately 170 J / g, while eicosane had a melting point of approximately 36°C and a latent heat of approximately 152 J / g. Furthermore, the onset temperature of docosane was approximately 41.53°C, and the offset temperature was approximately 46.99°C. The onset temperature of eicosane was approximately 31.79°C, and the offset temperature was approximately 38.96°C. Therefore, the latent heat interval of docosane (the value obtained by subtracting the onset temperature from the offset temperature) was approximately 5.46°C, and the latent heat interval of eicosane was approximately 7.17°C. The weight-average molecular weight (Mw) of the silicone resin component was approximately 28,000 g / mol. During the mixing process, the mixing ratio was 76.1:17.9:6 by weight (main component:n-docosane:n-eicosane). In the production of the main component part, the phase transition material was first held at a temperature of approximately 80°C for 1 hour to completely melt it, and the molten phase transition material was mixed with the main component and stirred at 380 rpm for 30 minutes to produce the main component part. The mixing of the phase transition material and the main component was carried out at a temperature of approximately 80°C.

[0179] Manufacturing of the hardening agent part A curing agent part was prepared by mixing a silicone resin component (Lord Co., Ltd., CoolTherm SC-6705) with a phase transition material. The same phase transition material used in the preparation of the main component part was used. The mixing ratio was 76.1:17.9:6 by weight (curing agent:n-docosane:n-eicosane). In the preparation of the curing agent part, the phase transition material was first held at a temperature of approximately 80°C for 1 hour to completely melt it. The molten phase transition material was then mixed with the main component and stirred at 380 rpm for 30 minutes to prepare the main component part. The mixing of the phase transition material and curing agent was performed at a temperature of approximately 80°C.

[0180] curable composition A curable composition was prepared by preparing the main component and the curing agent in a volume ratio of 1:1. The curable composition is a room-temperature curing type and can be cured by holding it at room temperature for about 12 hours or more. Figure 3 shows the results of DSC analysis performed on the cured body.

[0181] Example 2. Except for the fact that aluminum hydroxide filler (ATH) with an average particle size (D50 particle size) of approximately 50 μm was further added during the manufacturing of the main component and curing agent parts, and the weight ratio of the main component part when it was added was approximately 48.7:11.4:3.9:36 (main component:n-docosane:n-eicosane:ATH), and the weight ratio of the curing agent part when it was added was approximately 48.7:11.4:3.9:36 (curing agent:n-docosane:n-eicosane:ATH), the main component part, curing agent part, and curable composition were manufactured in the same manner as in Example 1. Figure 4 shows the results of DSC analysis performed on the cured product.

[0182] Example 3. Except for the fact that aluminum hydroxide filler (ATH) with an average particle size (D50 particle size) of approximately 50 μm was further added during the manufacturing of the main component and curing agent parts, and the weight ratio of the main component part when it was added was approximately 48.7:13.4:1.9:36 (main component:n-docosane:n-eicosane:ATH), and the weight ratio of the curing agent part when it was added was approximately 48.7:13.4:1.9:36 (curing agent:n-docosane:n-eicosane:ATH), the main component part, curing agent part, and curable composition were manufactured in the same manner as in Example 1. Figure 5 shows the results of DSC analysis performed on the cured product.

[0183] Comparative Example 1. Except for using only n-docosane as a phase transition material during the production of the main component and curing agent parts, and further incorporating aluminum hydroxide filler (ATH) with an average particle size (D50 particle size) of approximately 50 μm, the main component part, curing agent part, and curable composition were produced in the same manner as in Example 1, with the main component part being formulated in a weight ratio of approximately 50.8:15.9:33.3 (main component:n-docosane:ATH) and the curing agent part being formulated in a weight ratio of approximately 50.8:15.9:33.3 (curing agent:n-docosane:ATH).

[0184] Comparative Example 2. Except for using only one type of n-eicosane as a phase transition substance during the production of the main component and curing agent parts, and setting the mixing ratio of the main component part to approximately 76:24 by weight (main component: n-eicosane) and the mixing ratio of the curing agent part to approximately 76:24 by weight (curing agent: n-eicosane) during the formulation of the main component part, curing agent part, and curable composition in the same manner as in Example 1.

[0185] Comparative Example 3. Except for setting the mixing ratio of the main component part to approximately 76.1:22.4:1.5 by weight (main component:n-docosane:n-eicosane) and the mixing ratio of the curing agent part to approximately 76.1:22.4:1.5 by weight (curing agent:n-docosane:n-eicosane), the main component part, curing agent part, and curable composition were manufactured in the same manner as in Example 1.

[0186] Comparative Example 4. Manufacturing of the main ingredient A silicone resin component (Lord, CoolTherm SC-6705) was used as the curable resin component. The main component part was prepared by blending the main component of the silicone resin component with a phase transition material and aluminum hydroxide filler (ATH) with an average particle size (D50 particle size) of about 50 μm. The phase transition material used was the same docosane (n-docosane) and paraffin (OCI) as used in Example 1. DSC analysis of the paraffin (OCI) showed a melting point of about 62°C, a latent heat of about 170 J / g, an onset temperature of about 45.89°C, and an offset temperature of about 67.44°C. The mixing ratio at the time of mixing was 48.6:11.4:4:36 by weight (main component:n-docosane:paraffin (OCI):ATH). Mixing was carried out in the same manner as in Example 1.

[0187] Manufacturing of the hardening agent part A curing agent component was prepared by mixing a silicone resin component (Lord, CoolTherm SC-6705), a phase transition material, and an aluminum hydroxide filler. The same phase transition material and aluminum filler used in the preparation of the main component component were used. The mixing ratio was 48.6:11.4:4:36 by weight (curing agent:n-docosane:paraffin(OCI):ATH). The mixing was carried out in the same manner as in Example 1.

[0188] curable composition A curable composition was prepared by preparing the main component and the curing agent in a volume ratio of 1:1. The curable composition is a room-temperature curing type and can be cured by holding it at room temperature for about 12 hours or more. Figure 3 shows the results of DSC analysis performed on the cured body.

[0189] Comparative Example 5. Manufacturing of the main ingredient A silicone resin component (Lord, CoolTherm SC-6705) was used as the curable resin component. The main component part was prepared by compounding the main component of the silicone resin component with a phase transition material and aluminum hydroxide filler (ATH) with an average particle size (D50 particle size) of about 50 μm. As the phase transition material, paraffin (OCI) used in Comparative Example 4 and a second paraffin (Junsei) different from the aforementioned paraffin were used. In DSC analysis, the paraffin (Junsei) had a melting point of about 28°C, a latent heat of about 175 J / g, an onset temperature of about 27.28°C, and an offset temperature of about 29.15°C. At the time of mixing, the weight ratio was 48.6:7.7:7.7:36 (main component: paraffin (OCI): paraffin (Junsei): ATH). The mixing was carried out in the same manner as in Example 1.

[0190] Manufacturing of the hardening agent part A curing agent part was prepared by mixing a silicone resin component (Lord, CoolTherm SC-6705), a phase transition material, and an aluminum hydroxide filler. The same phase transition material and aluminum filler used in the preparation of the main component part were used. The mixing ratio was 48.6:7.7:7.7:36 by weight (main component:paraffin (OCI):paraffin (Junsei):ATH). The mixing was carried out in the same manner as in Example 1.

[0191] curable composition A curable composition was prepared by preparing the main component and the curing agent in a volume ratio of 1:1. The curable composition is a room-temperature curing type and can be cured by holding it at room temperature for about 12 hours or more. Figure 3 shows the results of DSC analysis performed on the cured body.

[0192] The evaluation results for the above-mentioned examples and comparative examples are summarized in Tables 1 and 2 below.

[0193] [Table 1]

[0194] [Table 2]

Claims

1. It contains a curable resin component and a phase transition material, The phase transition material comprises a first phase transition material having a melting point above 40°C and a second phase transition material having a melting point of 40°C or less. The curable resin component is a silicone resin component with a weight-average molecular weight of 9,000 g / mol or more. The difference in melting points between the first phase transition material and the second phase transition material is within the range of 1°C to 20°C. The second phase transition material is contained in an amount of 10 to 50 parts by weight per 100 parts by weight of the first phase transition material. The first phase transition material and the second phase transition material are paraffin-based materials having 10 to 30 carbon atoms. A curable composition, A cured body exhibiting a latent heat of 30 J / g or more is formed within a temperature range of 0°C to 60°C. A curable composition in which the latent heat interval of the cured body is 9°C or higher.

2. The curable composition according to claim 1, wherein the latent heat interval of the cured body is in the range of 9°C to 20°C.

3. The hardened body has a density of 0.7 g / cm³. ３ ~1.5 g / cm ３ A curable composition according to claim 1, which is within the range of [specify range].

4. The curable composition according to claim 1, wherein the cured body has a Shore OO hardness in the range of 20 to 90 or a Shore A hardness in the range of 10 to 90.

5. The curable composition according to claim 1, wherein the first phase transition material has a higher onset temperature than the second phase transition material, and the absolute value of the difference in onset temperatures is in the range of 5°C to 20°C.

6. The curable composition according to claim 1, wherein the latent heat interval of the first phase transition material is narrower than that of the second phase transition material.

7. The curable composition according to claim 6, wherein the absolute value of the difference between the latent heat interval of the first phase transition material and the latent heat interval of the second phase transition material is greater than 1°C and 10°C or less.

8. The curable composition according to claim 1, wherein the first phase transition material has a high latent heat relative to the second phase transition material.

9. The curable composition according to claim 8, wherein the absolute value of the difference between the latent heat of the first phase transition material and the latent heat of the second phase transition material is 100% or less.

10. The curable composition according to claim 1, comprising 20 to 75 parts by weight of a phase transition substance per 100 parts by weight of a curable resin component.

11. Aluminum hydroxide (Al(OH)) ３ ), magnesium hydroxide (Mg(OH) ２ ), calcium hydroxide (Ca(OH) ２ ), bohemite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN, aluminum nitride), boron nitride (BN, boron nitride), silicon nitride (Si ３ N ４ The curable composition according to claim 1, further comprising at least one filler selected from the group consisting of silicon nitride, silicon carbide (SiC), zinc oxide (ZnO), and beryllium oxide (BeO).

12. A method for producing a curable composition according to any one of claims 1 to 11, comprising the step of mixing a molten phase transition material with a curable resin component.

13. A cured body of a curable composition according to any one of claims 1 to 11.

14. A product comprising a heat-generating component and a curable composition according to claim 1, located adjacent to the heat-generating component.

15. A product comprising a heat-generating component and a cured body according to claim 13, which is located adjacent to the heat-generating component.

Images