Electronic device including camera module

Abstract

An electronic device according to various embodiments of the present disclosure may include a display panel and a camera module disposed under the display panel. The display panel may include a first region having a first pixel density and overlapping the camera module, a second region having a second pixel density greater than the first pixel density, a first light reflection blocking layer disposed in the entirety or at least a portion of the first region, and a plurality of transparent wirings disposed under a first organic light emitting diode disposed in the first region. The first light reflection blocking layer may be disposed to overlap a lower portion of the first organic light emitting diode disposed in the first region. The first light reflection blocking layer may be disposed between an anode electrode of the first organic light emitting diode and the plurality of transparent wirings.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to an electronic device including a camera module, and more particularly to an electronic device including a camera module disposed on the back (e.g., below) of a display.

Background Art

[0002] Electronic devices (e.g., mobile electronic devices) are available in various sizes depending on their functions and user preferences, and may include a large touch display for wide visibility and ease of operation. An electronic device may include at least one camera module (e.g., an image sensor). For example, an electronic device may include at least one camera module disposed around the display or through at least a part of the display. Various techniques have been proposed to increase the amount of light incident on the camera module while disposing the camera module on the back (e.g., below) of the display.

[0003] The above information is provided only as background information to assist in the understanding of the present disclosure. No determination or assertion as to whether any of the above-described subject matter can be applied as prior art to the present disclosure has been made.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Electronic devices to which an Under Display Camera (UDC) is applied may include a pixel area of ​​an OLED display and a peripheral area adjacent to the pixel area. Multiple pixels capable of displaying an image may be regularly arranged in the pixel area, and multiple wirings may be arranged in the peripheral area. When an optical sensor such as a camera module is placed on the back of the OLED display, light incident into the OLED display may be reflected and incident into the camera module. When reflected light is incident into the camera module, light flare may occur. Aspects of this disclosure can solve at least the aforementioned problems and / or drawbacks and provide at least the advantages described below. Various embodiments of this disclosure can provide electronic devices including a camera module that can prevent light incident into the display panel from being incident into the camera module, thereby preventing light flare from occurring.

[0005] Additional aspects are partially described in the following description, partially evident from the description, or can be understood through the execution of the presented embodiments.

[0006] The technical problems that the present invention aims to solve are not limited to those mentioned above, and other technical problems not mentioned can be clearly understood by a person with ordinary skill in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0007] Electronic devices according to various embodiments of the present disclosure may include a display panel and a camera module disposed below the display panel. The display panel may include a first region having a first pixel density and overlapping with the camera module, a second region having a second pixel density greater than the first pixel density, a first light-blocking layer disposed over all or at least part of the first region, and a plurality of transparent wirings disposed below a first organic light-emitting diode disposed in the first region. The first light-blocking layer may be disposed so as to overlap with the bottom of the first organic light-emitting diode disposed in the first region. The first light-blocking layer may be disposed between the anode electrode of the first organic light-emitting diode and the plurality of transparent wirings.

[0008] Electronic devices according to various embodiments of the present disclosure may include a display panel and a camera module disposed below the display panel. The display panel may include a first region having a first pixel density and overlapping with the camera module, a second region having a second pixel density greater than the first pixel density, a first light-blocking layer disposed over all or at least part of the first region, a second light-blocking layer disposed over all or at least part of the second region, and a plurality of transparent wirings disposed below a first organic light-emitting diode disposed in the first region. The first light-blocking layer may be disposed to overlap with the bottom of the first organic light-emitting diode disposed in the first region. The first light-blocking layer may be disposed between the anode electrode of the first organic light-emitting diode and the plurality of transparent wirings. The second light-blocking layer may be formed to extend to at least part of the first region. [Effects of the Invention]

[0009] Electronic devices including a camera module according to various embodiments of this disclosure can prevent light incident on the display from being reflected by placing a light reflection blocking layer beneath the anode electrode in a first region of the display panel (e.g., the under-display camera region). This prevents light incident on the inside of the display panel from entering the camera module, thereby preventing the occurrence of light flare.

[0010] Other aspects, advantages, and notable features of the present invention can be made apparent to those skilled in the art from the following detailed description, which discloses various embodiments of the invention together with the accompanying drawings. [Brief explanation of the drawing]

[0011] [Figure 1] This is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure. [Figure 2a] This is a front perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 2b] This is a rear perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 3a] These are drawings showing the deployed (e.g., open) state of an electronic device according to various embodiments of the present disclosure. [Figure 3b] These are drawings showing the folded (e.g., closed) state of an electronic device according to various embodiments of the present disclosure. [Figure 4] This is a block diagram of a display module for an electronic device, based on various embodiments. [Figure 5] These drawings illustrate various embodiments of the present disclosure of display and camera modules (e.g., image sensors). [Figure 6] These drawings illustrate the morphologies of pixels arranged in a first region (e.g., an under-display camera region) and a second region (e.g., an active region) of a display according to various embodiments of the present disclosure. [Figure 7]These drawings show cross-sections of a first region (e.g., an under-display camera region) and a second region (e.g., an active region) of a display according to various embodiments of the present disclosure. [Figure 8] This diagram illustrates how light incident on a display is reflected by the anode electrode of the OLED and the bottom metal layer (e.g., BML (Bottom Metal Layer)) located beneath the TFT (thin film transistor), causing light flare in the camera module. [Figure 9] This diagram illustrates how light incident on a display is reflected by a bottom metal layer (e.g., a BML) located beneath a TFT (thin film transistor), causing a light flare in the camera module. [Figure 10] These are drawings illustrating the structure of a display panel for an electronic device according to various embodiments of the present disclosure. [Figure 11] These are drawings illustrating the structure of a display panel for an electronic device according to various embodiments of the present disclosure. [Figure 12] These are drawings illustrating the structure of a display panel for an electronic device according to various embodiments of the present disclosure. [Figure 13] This is a drawing showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure. [Figure 14] This is a drawing showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure. [Figure 15] This is a drawing showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure. [Modes for carrying out the invention]

[0012] Throughout the drawings, similar reference numbers will be understood to refer to similar parts, components, and structures.

[0013] The description after referring to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the present disclosure defined by the claims and their equivalents. Although various specific details are included herein for the purpose of assistance, these should be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications can be made to the various examples described herein without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0014] The terms and words used in the following description and claims are not limited to their documentary meanings, but are used by the inventors for the purpose of a clear and consistent understanding of the invention. Accordingly, it will be apparent to those skilled in the art that the following description of the various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the disclosure as defined by the appended claims and their equivalents.

[0015] The singular form is understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "component surface" includes reference to one or more of such surfaces.

[0016] Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure. Referring to Figure 1, in the network environment 100, the electronic device 101 can communicate with an electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or with at least one of an electronic device 104 or a server 108 through a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 can communicate with an electronic device 104 through a server 108. According to one embodiment, the electronic device 101 may include a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, coupling terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. In one embodiment, the electronic device 101 may omit at least one of these components (for example, the connecting terminal 178) or one or more other components may be added. In one embodiment, some of these components (for example, the sensor module 176, the camera module 180, or the antenna module 197) can be integrated into a single component (for example, the display module 160).

[0017] The processor 120 can, for example, control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 by performing software (e.g., program 140), and can perform a variety of data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 can store instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., central processing unit or application processor) or an auxiliary processor 123 (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor processor, or communication processor) that can be operated independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be configured to specialize in a specified function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of it.

[0018] The auxiliary processor 123 can, for example, control at least a portion of the functions or states of at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 when the main processor 121 is in an inactive (e.g., slipped) state, or together with the main processor 121 when the main processor 121 is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) can be embodied as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) can include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. Such learning can be performed, for example, on the electronic device 101 itself where the artificial intelligence model is performed, or it can be performed through a separate server (e.g., server 108). Learning algorithms can include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models can include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), deep belief network (DBN), bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but are not limited to the examples above.Artificial intelligence models may include software structures in addition to or as an alternative to hardware structures.

[0019] Memory 130 can store various data used by at least one component of the electronic device 101 (for example, the processor 120 or the sensor module 176). The data may include, for example, software (for example, a program 140) and input or output data for instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0020] The program 140 can be stored as software in memory 130 and may include, for example, OS 142, middleware 144, or application 146.

[0021] The input module 150 can receive instructions or data used by the components of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0022] The acoustic output module 155 can output an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording and playback. The receiver can be used to receive incoming phone calls. According to one embodiment, the receiver can be embodied separately from or as part of the speaker.

[0023] The display module 160 can visually provide information to an external party (e.g., a user) outside of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module 160 may include a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by said touches.

[0024] The audio module 170 can convert sound into electrical signals, or conversely, convert electrical signals into sound. In one embodiment, the audio module 170 can acquire sound through the input module 150, or output sound through the sound output module 155, or through an external electronic device (e.g., electronic device 102 (e.g., speaker or headphones)) directly or wirelessly connected to the electronic device 101.

[0025] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0026] Interface 177 can support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, or audio interface.

[0027] The connecting terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connecting terminal 178 may include, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0029] The camera module 180 can capture still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0030] The power management module 188 can manage the power supplied to the electronic device 101. According to one embodiment, the power management module 188 can be embodied, for example, as at least part of a PMIC (power management integrated circuit).

[0031] The battery 189 can supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication through the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a near-field wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module among these communication modules can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). Many types of such communication modules can be integrated into a single component (e.g., a single chip) or embodied in multiple separate components (e.g., multiple chips). The wireless communication module 192 can verify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0033] The wireless communication module 192 can support 5G networks and next-generation communication technologies beyond 4G networks, such as NR connection technology (new radio access technology). NR connection technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of many terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 can support high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates, for example. The wireless communication module 192 can support various technologies to ensure performance in high-frequency bands, such as beamforming, massive array multiplexing and multiple-output (massive MIMO (multiple-input and multiple-output)), full-dimensional multiplexing and multiplexing (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 can support a variety of requirements specified by the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to one embodiment, the wireless communication module 192 can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., 0.5 ms or less for both downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0034] The antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). In one embodiment, the antenna module 197 may include an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In such a case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 can be selected from the plurality of antennas, for example, by a communication module 190. Signals or power can be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. In one embodiment, other components (e.g., an RFIC (radio frequency integrated circuit)) can be added and formed as part of the antenna module 197, in addition to the radiator.

[0035] According to various embodiments, the antenna module 197 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band.

[0036] At least some of the aforementioned components are connected to each other through a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., instructions or data) with each other.

[0037] In one embodiment, commands or data can be transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices 102 or 104 may be the same type of device as the electronic device 101 or a different type of device. In one embodiment, all or part of the operation performed by the electronic device 101 can be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 can process the results as they are or additionally and provide them as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 can provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 may include IoT (Internet of Things) devices. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included within the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0038] The electronic devices disclosed in this document, according to various embodiments, can take on a variety of forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices disclosed in this document are not limited to the aforementioned devices.

[0039] The various embodiments and terminology used herein are not intended to limit the technical features described herein to any particular embodiment, but should be understood to include various modifications, equivalents, or substitutes of such embodiment. In describing the drawings, similar or related reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of such items unless otherwise indicated to be clearly different in the context. In this document, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one of the items listed together in the applicable phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish one component from other such components and not to limit the component in other aspects (e.g., importance or procedure). When a component (e.g., the first) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically" with another component (e.g., the second), it means that the first component can be connected to the other component directly (e.g., by wire), wirelessly, or through the third component.

[0040] The term “module,” as used in the various embodiments of this document, can include units embodied in hardware, software, or firmware, and can be used interchangeably with terms such as logic, logic block, component, or circuit. A module can be a component that is composed of an entire unit, or the smallest unit or part thereof of such component that performs one or more functions. For example, according to one embodiment, a module can be embodied in the form of an ASIC (application-specific integrated circuit).

[0041] Various embodiments of this disclosure can be embodied as software (e.g., program 140) containing one or more instruction words stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one instruction from the one or more instruction words stored in the storage medium. This allows the machine to operate to perform at least one function by the invoked at least one instruction word. The one or more instruction words may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine can be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily on the storage medium.

[0042] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. The computer program product may be traded as a commodity between sellers and buyers. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or through an application store (e.g., Play Store). TM It can be distributed online (e.g., by download or upload) through a network or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product can be temporarily stored or temporarily generated in a storage medium readable by a device such as the memory of the manufacturer's server, the application store's server, or an intermediary server.

[0043] In various embodiments, each of the aforementioned components (e.g., a module or a program) may contain one or more individuals, and some of the individuals may be separated and placed in other components. In various embodiments, one or more components or operations in the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those functions performed by the components in the multiple components prior to the integration. In various embodiments, operations performed by a module, program or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in other steps, omitted, or one or more other operations may be added.

[0044] According to one embodiment, the display module 160 shown in Figure 1 may include a flexible display configured such that the screen (e.g., display screen) can be folded or unfolded.

[0045] According to one embodiment, the display module 160 shown in Figure 1 may include a flexible display that provides a screen (e.g., a display screen) that is slidably positioned.

[0046] In one embodiment, the display module 160 shown in Figure 1 is described as including a foldable display or a flexible display, but the present invention is not limited to these. The display module 160 may also include a bar-type or plate-type display.

[0047] Figure 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 2b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0048] Referring to Figures 2a and 2b, various embodiments of the present disclosure of an electronic device 200 (for example, the electronic device 101 in Figure 1) may include a first surface (or front) 210A, a second surface (or rear) 210B, and a housing 210. A display 201 (for example, the display module 160 in Figure 1) can be placed in the space formed by the housing 210. The housing 210 may include a side surface 210C that surrounds the space between the first surface 210A and the second surface 210B. In other embodiments, the housing 210 may also refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C.

[0049] According to one embodiment, the first surface 210A can be formed by a front plate 202 (for example, a glass plate or polymer plate including various coating layers) that is at least partially substantially transparent.

[0050] According to one embodiment, the second surface 210B can be formed by a substantially opaque rear plate 211. The rear plate 211 can be formed from, for example, coated or colored glass, ceramics, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. However, it is not limited to these, and the rear plate 211 can also be formed from transparent glass.

[0051] In one embodiment, the side surface 210C is bonded to the front plate 202 and the rear plate 211 and can be formed by a side bezel structure 218 (or “side member”) containing metal and / or polymer. In one embodiment, the rear plate 211 and the side bezel structure 218 may be integrally formed and contain the same material (e.g., a metallic material such as aluminum).

[0052] In one embodiment, the front plate 202 may include two first regions 210D that curve seamlessly from the first surface 210A toward the rear plate 211. The two first regions 210D may be located at both ends of the long edge of the front plate 202.

[0053] In one embodiment, the rear plate 211 may include two second regions 210E that curve and seamlessly extend from the second surface 210B toward the front plate 202.

[0054] In one embodiment, the front plate 202 (or the rear plate 211) may include only one of the first region 210D (or the second region 210E). In one embodiment, a portion of the first region 210D or the second region 210E may not be included. In one embodiment, when viewed from the side of the electronic device 200, the side bezel structure 218 may have a first thickness (or width) on the side that does not include the first region 210D or the second region 210E, and a second thickness that is thinner than the first thickness on the side that includes the first region 210D or the second region 210E.

[0055] According to one embodiment, the electronic device 200 may include at least one of the following: a display 201 (e.g., display module 160 in Figure 1), an acoustic input device 203 (e.g., input module 150 in Figure 1), acoustic output devices 207, 214 (e.g., acoustic output module 155 in Figure 1), sensor modules 204, 219 (e.g., sensor module 176 in Figure 1), camera modules 205, 212 (e.g., camera module 180 in Figure 1), a flash 213, a key input device 217, an indicator (not shown), and connector holes 208, 209. In one embodiment, the electronic device 200 may omit at least one of its components (e.g., key input device 217) or include additional components.

[0056] In one embodiment, the display 201 (for example, the display module 160 in Figure 1) is visually visible through the upper portion of the front plate 202. In one embodiment, at least a portion of the display 201 is visible through the front plate 202 forming a first surface 210A and a first region 210D of the side 210C. The display 201 may be coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field stylus pen. In one embodiment, at least a portion of sensor modules 204, 219, and / or at least a portion of a key input device 217 may be arranged in the first region 210D and / or the second region 210E.

[0057] In one embodiment, the back of the screen display area of ​​the display 201 may include at least one of the following: a sensor module 204, a camera module 205 (e.g., an image sensor), an audio module 214, and a fingerprint sensor.

[0058] In one embodiment, the display 201 may be coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field stylus pen.

[0059] In one embodiment, at least a portion of the sensor modules 204, 219 and / or at least a portion of the key input device 217 can be arranged in the first region 210D and / or the second region 210E.

[0060] In one embodiment, the acoustic input device 203 may include a microphone. In one embodiment, the input device 203 may include a plurality of microphones arranged to detect the direction of sound. The acoustic output devices 207, 214 may include speakers. The acoustic output devices 207, 214 may include an external speaker 207 and a call receiver (e.g., an audio module 214). In one embodiment, the acoustic input device (203, e.g., a microphone), the acoustic output devices 207, 214 and the connector holes 208, 209 are located in the internal space of the electronic device 200 and can be exposed to the external environment through at least one hole formed in the housing 210. In one embodiment, the hole formed in the housing 210 can be used jointly for the acoustic input device 203 (e.g., a microphone) and the acoustic output devices 207, 214. In one embodiment, the acoustic output devices 207, 214 may include speakers (e.g., piezo speakers) that operate while the hole formed in the housing 210 is eliminated.

[0061] According to one embodiment, sensor modules 204, 219 (e.g., sensor module 176 in Figure 1) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or the external environmental state. Sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., proximity sensor) located on the first surface 210A of the housing 210 and / or a second sensor module 219 (e.g., HRM sensor) located on the second surface 210B of the housing 210 and / or a third sensor module (not shown) (e.g., fingerprint sensor). For example, the fingerprint sensor may be located on the first surface 210A (e.g., display 201) and / or the second surface 210B of the housing 210. The electronic device 200 may include at least one of sensor modules not shown, such as a gesture sensor, gyroscope, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, IR (infrared) sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor.

[0062] According to one embodiment, the camera modules 205 and 212 may include a first camera module 205 located on the first surface 210A of the electronic device 200, and a second camera module 212 located on the second surface 210B. A flash 213 may be located around the camera modules 205 and 212. The camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp.

[0063] In one embodiment, the first camera module 205 can be positioned below the display panel of the display 201 in an under-display camera (UDC) configuration. In one embodiment, two or more lenses (wide-angle and telephoto lenses) and an image sensor can be positioned on one surface of the electronic device 200. In one embodiment, multiple first camera modules 205 can be positioned on the first surface of the electronic device 200 (for example, the surface on which the screen is displayed) in an under-display camera (UDC) configuration.

[0064] In one embodiment, the key input device 217 may be located on the side surface 210C of the housing 210. In other embodiments, the electronic device 200 may not include some or all of the aforementioned key input devices 217, and the not included key input devices 217 may be embodied in other forms, such as soft keys, on the display 201. In one embodiment, the key input device 217 may be embodied using a pressure sensor included in the display 201.

[0065] In one embodiment, connector holes 208 and 209 may include a first connector hole 208 capable of accommodating a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole 209 capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device, or an earphone jack. The first connector hole 208 may include a USB (Universal Serial Bus) A-type or USB C-type port. If the first connector hole 208 supports USB C-type, the electronic device 200, for example, the electronic device 101 in Figure 1, can support USB PD (power delivery) charging.

[0066] In one embodiment, some camera modules 205 and / or some sensor modules 204 of the camera modules 205 and 212 can be positioned to be visually visible through the display 201. In another example, if camera module 205 is positioned in an under-display camera (UDC) configuration, camera module 205 may not be visually visible from the outside.

[0067] In one embodiment, the camera module 205 can be positioned overlapping the display area, and the screen can be displayed in the display area corresponding to the camera module 205. Some sensor modules 204 can also be positioned to perform their functions within the internal space of the electronic device without being visually exposed through the front plate 202.

[0068] Figure 3a is a diagram illustrating the deployed (e.g., open) state of an electronic device according to various embodiments of the present disclosure. Figure 3b is a diagram illustrating the folded (e.g., closed) state of an electronic device according to various embodiments of the present disclosure.

[0069] Referring to Figures 3a and 3b, the electronic device 300 (for example, the electronic device 101 in Figure 1) may include a housing 310 and a display 320 positioned within the space formed by the housing 310. In one embodiment, the display 320 may include a flexible display or a foldable display.

[0070] The surface on which the display 320 is positioned can be defined as the first surface or the front surface of the electronic device 300 (for example, the surface on which the screen is displayed when unfolded). The surface opposite the front surface can be defined as the second surface or the rear surface of the electronic device 300. Furthermore, the surface surrounding the space between the front surface and the rear surface can be defined as the third surface or the side surface of the electronic device 300. For example, the electronic device 300 can be folded or unfolded in a first direction (for example, the x-axis direction) with respect to a folding axis (for example, the A-axis) in mind, with the folding area 323 being folded in a first direction (for example, the x-axis direction).

[0071] In one embodiment, the housing 310 may include a first housing structure 311, a second housing structure 312 including a sensor area 324, a first rear cover 380, and a second rear cover 390. The housing 310 of the electronic device 101 is not limited to the form and combination shown in Figures 3a and 3b, and can be embodied by other shapes and combinations and / or combinations of parts. For example, in another embodiment, the first housing structure 311 and the first rear cover 380 may be formed integrally, and the second housing structure 312 and the second rear cover 390 may be formed integrally.

[0072] In one embodiment, the first housing structure 311 and the second housing structure 312 are arranged on either side of a folding axis (A) and can have an overall symmetrical shape with respect to the folding axis (A). The angle and distance between the first housing structure 311 and the second housing structure 312 can change depending on whether the state of the electronic device 300 is unfolded (e.g., first state), folded (e.g., second state), or in an intermediate state (e.g., third state).

[0073] In one embodiment, the second housing structure 312 differs from the first housing structure 311 in that it further includes the sensor region 324 on which various sensors (e.g., illuminance sensors, iris sensors, and / or image sensors) are arranged, but the other regions can have a mutually symmetrical shape.

[0074] In one embodiment, at least one sensor (e.g., a camera module, an illuminance sensor, an iris sensor, and / or an image sensor) can be placed not only in the sensor area 324 but also in the lower part of the display and / or the bezel area.

[0075] In one embodiment, the first housing structure 311 and the second housing structure 312 can together form a recess for housing the display 320. In the illustrated embodiment, the sensor area 324 allows the recess to have two or more different widths in a direction perpendicular to the folding axis (A) (e.g., the x-axis direction).

[0076] For example, the recess may have a first width (W1) between the first portion 311a of the first housing structure 311 and the first portion 312a of the second housing structure 312, which is formed at the end of the sensor area 324 of the second housing structure 312. The recess may have a second width (W2) formed by the second portion 311b of the first housing structure 311, which is parallel to the folding axis (A), and the second portion 312b of the second housing structure 312, which does not correspond to the sensor area 324 of the second housing structure 312 and is also parallel to the folding axis (A). In this case, the second width (W2) may be longer than the first width (W1). In other words, the first portion 311a of the first housing structure 311 and the first portion 312a of the second housing structure 312, which have mutually asymmetric shapes, can form the first width (W1) of the recess. The second portion 311b of the first housing structure 311 and the second portion 312b of the second housing structure 312, which have mutually symmetrical shapes, can form the second width (W2) of the recess.

[0077] In one embodiment, the first portion 312a and the second portion 312b of the second housing structure 312 may be at different distances from the folding axis (A). The width of the recess is not limited to the illustrated examples. In various embodiments, the recess may have multiple widths depending on the shape of the sensor area 324 or the asymmetrical shape of the first housing structure 311 and the second housing structure 312.

[0078] In one embodiment, at least a portion of the first housing structure 311 and the second housing structure 312 can be formed from a metallic or non-metallic material of a size and rigidity selected to support the display 320.

[0079] In one embodiment, the sensor area 324 may be formed to have a predetermined area adjacent to one corner of the second housing structure 312. However, the arrangement, shape, and size of the sensor area 324 are not limited to the illustrated examples. For example, in another embodiment, the sensor area 324 may be provided in the other corner of the second housing structure 312 or in any area between the upper and lower corners.

[0080] In one embodiment, components for performing various functions built into the electronic device 300 may be exposed to the front of the electronic device 300 through the sensor area 324 or through one or more openings provided in the sensor area 324. In various embodiments, the components may include various types of sensors. The sensors may include, for example, at least one of an illuminance sensor, a front camera (e.g., a camera module), a receiver, or a proximity sensor.

[0081] The first rear cover 380 is positioned on the rear of the electronic device on one side of the folding axis (A) and may have, for example, a substantially rectangular periphery, which may be enclosed by the first housing structure 311. Similarly, the second rear cover 390 is positioned on the rear of the electronic device on the other side of the folding axis (A) and may be enclosed by the second housing structure 312.

[0082] In the illustrated embodiment, the first rear cover 380 and the second rear cover 390 may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover 380 and the second rear cover 390 do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device 300 may include first rear cover 380 and second rear cover 390 of various shapes. In other embodiments, the first rear cover 380 may be formed integrally with the first housing structure 311, and the second rear cover 390 may be formed integrally with the second housing structure 312.

[0083] In one embodiment, the first rear cover 380, the second rear cover 390, the first housing structure 311, and the second housing structure 312 may form a space on which various components of the electronic device 300 (e.g., printed circuit boards or batteries) can be arranged. In one embodiment, one or more components may be arranged or visually exposed on the rear of the electronic device 300. For example, at least a portion of the sub-display 330 may be visually exposed through the first rear area 382 of the first rear cover 380. In another embodiment, one or more components or sensors may be visually exposed through the second rear area 392 of the second rear cover 390. In various embodiments, the sensors may include illuminance sensors, proximity sensors, and / or rear cameras.

[0084] In one embodiment, the hinge cover 313 can be positioned between the first housing structure 311 and the second housing structure 312 and configured to cover the internal components (e.g., the hinge structure). The hinge cover 313 can cover the portion where the first housing structure 311 and the second housing structure 312 come into contact due to the deployment and folding of the electronic device 300.

[0085] In one embodiment, the hinge cover 313 may be covered by a portion of the first housing structure 311 and the second housing structure 312, or exposed to the outside, depending on the state of the electronic device 101 (flat state or folded state). In one embodiment, when the electronic device 101 is in the flat state, the hinge cover 313 may be covered by the first housing structure 311 and the second housing structure 312 and not exposed. In one embodiment, when the electronic device 101 is in the folded state (for example, fully folded state), the hinge cover 313 may be exposed to the outside between the first housing structure 311 and the second housing structure 312. In one embodiment, when the first housing structure 311 and the second housing structure 312 are in an intermediate state, folded at a certain angle, the hinge cover 313 can be partially exposed to the outside between the first housing structure 311 and the second housing structure 312. However, in this case, the exposed area is smaller than when fully folded. In one embodiment, the hinge cover 313 may include a curved surface.

[0086] The display 320 can be positioned in the space formed by the housing 310. For example, the display 320 can be fixed in a recess formed by the housing 310 and can constitute most of the front surface of the electronic device 300.

[0087] Therefore, the front of the electronic device 300 can include the display 320, a portion of the first housing structure 311 adjacent to the display 320, and a portion of the second housing structure 312. The rear of the electronic device 300 can include the first rear cover 380, a portion of the first housing structure 311 adjacent to the first rear cover 380, the second rear cover 390, and a portion of the second housing structure 312 adjacent to the second rear cover 390.

[0088] The display 320 can mean a display in which at least a portion of the area can be deformed into a planar or curved surface. In one embodiment, the display 320 may include a folding area 323, a first area 321 located on one side (for example, the left side in Figure 3a) with respect to the folding area 323, and a second area 322 located on the other side (the right side in Figure 3a).

[0089] As one embodiment, the display 320 may include a top-emission or bottom-emission OLED display. The OLED display may include an LTCF (low temperature color filter) layer, window glass (e.g., ultra-thin glass (UTG) or polymer window), and an optical compensation film (e.g., OCF). Here, the polarizing film (or polarizing layer) in the LTCF layer of the OLED display can be replaced.

[0090] The regional divisions of the display 320 are illustrative, and the display 320 may also be divided into multiple regions (e.g., two or more) depending on its structure or function. In one embodiment, the region of the display 320 can be divided by a folding region 323 or folding axis (A) extending parallel to the y-axis, but in other embodiments, the region of the display 320 may also be divided based on other folding regions (e.g., a folding region parallel to the x-axis) or other folding axes (e.g., a folding axis parallel to the x-axis).

[0091] In one embodiment, the first region 321 and the second region 322 can have an overall symmetrical shape with respect to the folding region 323.

[0092] The following describes the operation of the first housing structure 311 and the second housing structure 312, and the respective areas of the display 320, depending on the state of the electronic device 300 (for example, the unfolded state and the folded state).

[0093] In one embodiment, when the electronic device 300 is in a flat state (for example, Figure 3a), the first housing structure 311 and the second housing structure 312 can be arranged to face the same direction at a 180° angle. The surfaces of the first region 321 and the second region 322 of the display 320 can form a 180° angle with each other and face the same direction (for example, the front direction of the electronic device). The folding region 323 can form the same plane as the first region 321 and the second region 322.

[0094] In one embodiment, when the electronic device 300 is in a folded state (e.g., Figure 3b), the first housing structure 311 and the second housing structure 312 can be arranged to face each other. The surfaces of the first region 321 and the second region 322 of the display 320 can face each other while forming a small angle (e.g., between 0° and 10°). The folding region 323 can consist of a curved surface having a predetermined curvature, at least in part.

[0095] In one embodiment, when the electronic device 300 is in an intermediate state (half-folded state), the first housing structure 311 and the second housing structure 312 can be arranged at a certain angle to each other. The surfaces of the first region 321 and the second region 322 of the display 320 can form an angle that is greater than in the folded state and smaller than in the unfolded state. At least a portion of the folding region 323 can consist of a curved surface with a predetermined curvature, in which case the curvature is smaller than in the folded state.

[0096] Electronic devices according to various embodiments of the present invention may include bar-type, foldable-type, rollable-type, sliding-type, wearable, tablet PC and / or notebook computer electronic devices. Electronic devices 200 according to various embodiments of the present invention are not limited to the examples described above and may include a variety of other electronic devices.

[0097] Figure 4 is a block diagram of the display module 160 of the electronic device 400 according to various embodiments.

[0098] Referring to Figure 4, the display module 160 may include a display 410 (for example, display 201 in Figure 2a, display 320 in Figure 3a) and a display driver IC 430 (hereinafter referred to as "DDI430") for controlling the display 410.

[0099] The DDI430 may include an interface module 431, memory 433 (e.g., buffer memory), an image processing module 435, and / or a mapping module 437.

[0100] According to one embodiment, the DDI 430 can receive video information, including video data or video control signals corresponding to commands for controlling the video data, from other components of the electronic device 400 (for example, electronic device 101 in Figure 1, electronic device 200 in Figure 2a, and electronic device 300 in Figure 3a) through the interface module 431.

[0101] According to one embodiment, video information can be received from a processor (e.g., processor 120 in Figure 1) (e.g., main processor 121 in Figure 1) (e.g., application processor) or an auxiliary processor (e.g., auxiliary processor 123 in Figure 1) (e.g., graphics processing unit) that operates independently of the functions of the main processor 121.

[0102] In one embodiment, the DDI 430 can communicate with the touch circuit 450 or the sensor module 176 (for example, the camera module 205 in Figure 2a, or the camera module located in the sensor area 324 in Figure 3a) through the interface module 431. The DDI 430 can also store at least a portion of the received video information in the memory 433. For example, the DDI 430 can store at least a portion of the received video information in the memory 433 on a frame-by-frame basis.

[0103] According to one embodiment, the image processing module 435 can perform pre-processing or post-processing (for example, resolution, brightness, or size adjustment) on at least a portion of the video data based on the characteristics of the video data or the characteristics of the display 410.

[0104] In one embodiment, the mapping module 437 can generate voltage or current values ​​corresponding to the video data that has been pre-processed or post-processed through the image processing module 435. In one embodiment, the generation of voltage or current values ​​can be performed, for example, based at least in part on the attributes of the pixels of the display 410 (e.g., the arrangement of pixels (RGB stripe or pentile structure)), or the size of each subpixel, or the degradation of the pixels).

[0105] In one embodiment, at least some of the pixels of the display 410 are driven based at least some of the voltage or current values ​​so that visual information (e.g., text, images, or icons) corresponding to the video data can be displayed through the display 410.

[0106] According to one embodiment, the display module 160 may further include a touch circuit 450. The touch circuit 450 may include a touch sensor 451 and a touch sensor IC 453 for controlling it.

[0107] In one embodiment, the touch sensor IC 453 can control the touch sensor 451 to detect a touch input or hovering input at a specific location on the display 410. For example, the touch sensor IC 453 can detect a touch input or hovering input by measuring a change in a signal (e.g., voltage, light intensity, resistance, or charge) at a specific location on the display 410. The touch sensor IC 453 can provide information (e.g., position, area, pressure, or time) regarding the detected touch input or hovering input to a processor (e.g., processor 120 in Figure 1).

[0108] According to one embodiment, at least a portion of the touch circuit 450 (for example, the touch sensor IC 453) can be included as part of the DDI 430 or the display 410.

[0109] According to one embodiment, at least a portion of the touch circuit 450 (e.g., touch sensor IC 453) can be included as part of other components (e.g., auxiliary processor 123) located outside the display module 160.

[0110] According to one embodiment, the display module 160 may further include a sensor module 176 and / or a control circuit for the sensor module 176. The sensor module 176 may include at least one sensor (e.g., a camera module, an illuminance sensor, a fingerprint sensor, an iris sensor, a pressure sensor, and / or an image sensor). In this case, the at least one sensor or the control circuit for it may be embedded in a part of the display module 160 (e.g., a display 410 or a DDI 430) or a part of the touch circuit 450.

[0111] According to one embodiment, if the sensor module 176 includes a camera module (e.g., an image sensor), the camera module (e.g., an image sensor) can be positioned below (e.g., downwards) the display 410 in a UDC (under display camera) manner.

[0112] According to one embodiment, if the sensor module 176 embedded in the display module 160 includes an illuminance sensor, the illuminance sensor can detect the amount of ultraviolet (UV) exposure to the display due to external light exposure.

[0113] According to one embodiment, if the sensor module 176 embedded in the display module 160 includes a biosensor (e.g., a fingerprint sensor), the biosensor can acquire biometric information (e.g., a fingerprint image) associated with touch input through a portion of the display 320.

[0114] According to one embodiment, if the sensor module 176 embedded in the display module 160 includes a pressure sensor, the pressure sensor can acquire pressure information associated with touch input through a part or all area of ​​the display 320.

[0115] According to one embodiment, the touch sensor 451 or sensor module 176 can be positioned between the pixels of the pixel layer of the display 320, or above or below the pixel layer.

[0116] In another example, the sensor module 176 may be located in the bezel area of ​​an electronic device (e.g., electronic device 101 in Figure 1).

[0117] Figure 5 is a drawing showing a display and camera module (e.g., an image sensor) according to various embodiments of the present disclosure. Figure 6 is a drawing showing the morphology of pixels arranged in a first region (e.g., an under-display camera region) and a second region (e.g., an active region) of a display according to various embodiments of the present disclosure. Figure 7 is a drawing showing cross-sections of the first region (e.g., an under-display camera region) and the second region (e.g., an active region) of a display according to various embodiments of the present disclosure. Figure 7 illustrates a cross-section along the line A1-A2 in Figure 6.

[0118] Referring to Figures 5 to 7, the electronic device 500 according to various embodiments of the present disclosure may include a display 501 and a camera module 510 (for example, the camera module 205 in Figure 2a, and the camera module located in the sensor area 324 in Figure 3a).

[0119] According to one embodiment, the display 501 may include a display panel 520, a polarizing layer 530, a window 540 (for example, an ultra-thin glass (UTG) or polymer window), and an optical compensation film 550 (OCF). The optical compensation film 550 may be positioned to correspond to the entire surface of the polarizing layer 530 and the window 540.

[0120] In one embodiment, window 540 can be made of ultra-thin glass (UTG) or a polymer window.

[0121] According to one embodiment, the camera module 510 (or image sensor) can be positioned below (e.g., downwards) the display 501 in an under-display camera (UDC) configuration. For example, the camera module 510 can be positioned below (e.g., downwards) the display panel 520 in an under-display camera (UDC) configuration.

[0122] In one embodiment, at least one camera module 510 can be placed at the bottom of the display panel 520.

[0123] In one embodiment, the display panel 520 may include a first region 611 (e.g., an under-display camera region) and a second region 612 (e.g., an active region) corresponding to the camera module 510.

[0124] In one embodiment, the first pixels 662 can be placed not only in the second region 612 (e.g., the active region) of the display panel 520 but also in a part of the first region 611 (e.g., the under-display camera region), allowing an image to be displayed. For example, the density of the first pixels 662 placed in the first region 611 may be lower than the density of the second pixels 664 placed in the second region 612.

[0125] Figure 6 illustrates, as an example, that the first region 611 (for example, the under-display camera region) is located at the upper right end of the electronic device 600. However, the position of the first region 611 (for example, the under-display camera region) is not limited to this, and it can be located at the upper center, upper left end, center, right center, left center, right bottom end, center bottom end, or left bottom end of the electronic device 500.

[0126] In one embodiment, the polarizing layer 530 can be positioned on the top of the display panel 520 (for example, in the z-axis direction). The polarizing layer 530 can polarize the incident light and output it. By polarizing the light incident on the display panel 520, the polarizing layer 530 can prevent a decrease in display quality due to light reflection.

[0127] In another embodiment, the display 501 can be configured without the polarizing layer 530.

[0128] In one embodiment, the window 540 can be placed on the display panel 520 or the polarizing layer 530 (for example, in the z-axis direction). The optical compensation film 550 can be placed on the window 540. The optical compensation film 550 can function as a protective film to protect the window 540 and as a phase difference film to prevent iridescent staining caused by the application of the polarizing layer 530.

[0129] The diagram illustrates an example where one optical compensation film 550 is placed on the window 540. However, it is not limited to this, and multiple optical compensation films can be placed on the window 540. Alternatively, one optical compensation film 550 can be placed on the window 540, and a protective layer (or coating layer) can be placed on the optical compensation film 550.

[0130] The optical compensation film 550 can have functions other than optical compensation, such as protective film or shock absorption. Therefore, from the standpoint of protective film or shock absorption, a thicker optical compensation film 550 is sometimes preferable. However, in the case of foldable phones, the thickness of the optical compensation film 550 must be considered because folding characteristics are important. In this proposal, the optical compensation film 550 can be formed to have a thickness of, for example, 20 μm to 100 μm.

[0131] A first adhesive member 525 is formed between the display panel 520 and the polarizing layer 530, allowing the display panel 520 and the polarizing layer 530 to be bonded together. A second adhesive member 535 is formed between the polarizing layer 530 and the window 540, allowing the polarizing layer 530 and the window 540 to be bonded together. A third adhesive member 545 is formed between the window 540 and the optical compensation film 550, allowing the window 540 and the optical compensation film 550 to be bonded together.

[0132] The first to third adhesive members 525, 535, and 545 may include OCA (optical clear adhesive), PSA (pressure sensitive adhesive), heat-reactive adhesive, general adhesive, or double-sided tape. The adhesive strength of the third adhesive member 545 may be lower (or weaker) than that of the first adhesive member 525 and the second adhesive member 535 in order to facilitate the removal and attachment of the optical compensation film 650 placed on the window 540.

[0133] In one embodiment, the display panel 520 and the polarizing layer 530 can be formed integrally. In another embodiment, a color filter formed of red (R), green (G), and blue (B) pigments with polarizing function can be placed on the pixels of the display panel 520, and the polarizing layer 530 can be removed. Even when a color filter with polarizing function is applied, an optical compensation film 550 can be placed on the window 540. For example, when a color filter with polarizing function is applied without a polarizing plate or polarizing film (pol-less), the display panel 520 may include a light reflection blocking layer (e.g., BPDL (black pixel define layer)) that can prevent reflection of external light. For example, a polarizing film (or polarizing plate) serves to prevent external light reflection, improve viewing angle characteristics, and improve black perception, so when a color filter with polarizing function is applied, a light reflection blocking layer (e.g., BPDL) can be applied together with the color filter to enhance the color purity of the display panel 520. In one embodiment, the polarizing layer 530 positioned on top of the display panel 520 may include an opening perforated at a location corresponding to the camera module 510 (e.g., the lens) to prevent performance degradation of the camera module 510 due to refractive index. In one embodiment, the polarizing layer 530 may be treated to be transparent at the location corresponding to the camera module 510, or the polarization properties may be removed. In one embodiment, a layer without an opening (e.g., the display panel 520) or a touch panel may include a coating that allows for index matching to minimize refractive index differences.

[0134] The display panel 520 may be an OLED (organic light-emitting diodes) panel, an LCD (liquid crystal display), or a QLED (quantum dot light-emitting diodes) panel. The display panel 520 includes multiple pixels for displaying an image, and one pixel may include multiple subpixels. In one embodiment, one pixel may consist of three subpixels (e.g., red, green, and blue). In one embodiment, one pixel may consist of four subpixels (e.g., red, green, blue, and white). In one embodiment, one pixel may be configured as an RGBG pentile scheme, including one red subpixel, two green subpixels, and one blue subpixel.

[0135] In various embodiments, the display 501 may include a control circuit (not shown). In one embodiment, the control circuit may include an FPCB (flexible printed circuit board) that electrically connects the main printed circuit board and the display panel 520, and a DDI (display driver IC, e.g., the display driver IC 430 in Figure 4) mounted on the FPCB. In one embodiment, at least one side of the display panel 520 is extended, and the DDI 430 can be placed on the extended portion in a chip-on-plastic (COP) manner.

[0136] In one embodiment, the display 501 may additionally include a touch panel (e.g., the touch circuit 450 in Figure 4). In one embodiment, the display 501 can operate as an in-cell or on-cell touch display depending on the placement of the touch panel. When operating as an in-cell, on-cell, or add-on touch display, the control circuit may also include a TDDI (touch display driver IC). In one embodiment, the display 501 may include a sensor module (e.g., the sensor module 176 in Figure 4).

[0137] In one embodiment, the portion of the entire display panel 520 excluding the first region 611 (e.g., the under-display camera region) corresponding to the camera module 510 can become the second region 612 (e.g., the active region).

[0138] Since the camera module 510 is positioned below the display panel 520 in an under-display camera (UDC) configuration, transmittance must be ensured to take into account the quality of the captured image. For this purpose, the density of the first pixels 622 located in the first region 611 (e.g., the under-display camera region) and the density of the second pixels 664 located in the second region 612 (e.g., the active region) can be formed to be different.

[0139] As one embodiment, the number of first pixels 662 placed in the first region 611 (e.g., the under-display camera region) can be reduced to 1 / 2, 1 / 3, 1 / 4, 1 / 5, or 1 / 6 of the number of second pixels 664 placed in the second region 612 (e.g., the active region). The first pixels 662 can be placed in 1 / 2, 1 / 3, 1 / 4, 1 / 5, or 1 / 6 of the total area of ​​the first region 611 (e.g., the under-display camera region), and the remaining portion can be formed as an empty region 666 (or non-pixel region) without pixels. However, the proportion of first pixels 662 placed in the first region 611 (e.g., the under-display camera region) can be changed.

[0140] As shown in Figure 7, a bottom metal layer 5201 (e.g., BML) can be positioned below (e.g., in the -z-axis direction) the first pixel 662 in the first region 611 (e.g., under-display camera region). In one embodiment, the bottom metal layer 5201 (e.g., BML) may be formed only below the first pixel 662 and not in the empty region 666 (or non-pixel region). In another embodiment, the bottom metal layer 5201 (e.g., BML) may be formed below (e.g., in the -z-axis direction) the first pixel 662 and at least a portion of the empty region 666 (or non-pixel region). In one embodiment, the bottom metal layer 5201 (e.g., BML) may be positioned below (e.g., in the -z-axis direction) a drive circuit (e.g., TFT) for driving multiple organic light-emitting elements, so as to overlap with at least a portion of the drive circuit (e.g., TFT).

[0141] Figure 6 illustrates that the first pixels 662 in the first region 611 (e.g., the under-display camera region) are arranged regularly. However, the first pixels 662 in the first region 611 (e.g., the under-display camera region) can be arranged irregularly. In one embodiment, the pixel density can differ between the central and peripheral parts of the first region 611 (e.g., the under-display camera region). For example, the central part of the first region 611 (e.g., the under-display camera region) can be formed with a higher pixel density than the peripheral part. In one embodiment, the spacing between pixels (or subpixels) in the first region 611 (e.g., the under-display camera region) can be arranged irregularly to reduce diffraction.

[0142] Figure 6 illustrates, as an example, that the first region 611 (e.g., the under-display camera region) is circular. However, it is not limited to this, and the first region 611 (e.g., the under-display camera region) can also be formed in an elliptical or polygonal shape.

[0143] In one embodiment, by arranging fewer first pixels 662 in the first region 611 (e.g., the under-display camera region) compared to the second region 612 (e.g., the active region), the first region 611 (e.g., the under-display camera region) and the second region 612 (e.g., the active region) can display different resolutions. In one embodiment, the first region 611 (e.g., the under-display camera region) can display a lower resolution than the second region 612 (e.g., the active region).

[0144] In one embodiment, a first drive circuit (e.g., a TFT) that drives a first pixel 662 located in a first region 611 (e.g., an under-display camera region) can be located in a second region 612. A second drive circuit (e.g., a TFT) that drives a second pixel 664 located in a second region 612 (e.g., an active region) can be located in the second region 612. By forming the first pixel 662 in the first region 611 (e.g., an under-display camera region) without a first drive circuit (e.g., a TFT), the light transmittance may be higher compared to the second region 612 (e.g., an active region). Figure 8 is a diagram illustrating how light incident on the display is reflected by the anode electrode of the OLED and the bottom metal layer (e.g., BML (bottom metal layer)) located beneath the TFT (thin film transistor), causing light flare in the camera module.

[0145] Referring to Figure 8, the display panel 800 may include a first substrate 811, a second substrate 812, a first insulating film 821, a second insulating film 822, a plurality of transparent wirings 830, a plurality of OLEDs 840, a plurality of TFTs 850, a pixel definition layer 860, and a plurality of bottom metal layers 870 (e.g., BML (bottom metal layer)). In one embodiment, the first substrate 811 and the second substrate 812 may be polyimide (PI). The first insulating film 821 may be an inorganic film. The second insulating film 822 may be an organic film. The pixel definition layer 860 can define the region of each pixel. For example, the pixel definition layer 860 may include organic materials such as polyacrylates resin and polyimides resin, or silica-based inorganic materials. For example, the pixel definition layer 860 may also include a light-blocking material to block light. If the pixel definition layer 860 contains a light-blocking material, it is possible to prevent the mixing of light generated by the organic light-emitting layer of one pixel with the light generated by the organic light-emitting layer of an adjacent pixel. For example, the pixel definition layer 860 contains an opaque material that blocks light.

[0146] In one embodiment, the anode electrode 841 of the OLED 840 and the TFT 850 can be electrically connected through a contact portion (CNT). To prevent light from entering the lower part of the TFT 850, a lower metal layer 870 (e.g., BML) can be placed below the TFT 850 (e.g., in the -z axis direction). The lower metal layer 870 can be placed so as to overlap the TFT 850. Figure 8 illustrates an example where the lower metal layer 870 is placed immediately below the TFT 850 (e.g., in the -z axis direction). In another example, the lower metal layer 870 can be placed on any one of the layers below the TFT 850 (e.g., in the -z axis direction).

[0147] In one embodiment, light incident on the display can be reflected by a lower structure (e.g., metal wiring or a camera module), then reflected by the anode electrode 841 of the OLED 840, and incident on the camera module (e.g., camera module 510 in Figure 5). When light reflected inside the display panel 800 is incident on the camera module (e.g., camera module 510 in Figure 5), a light flare may occur.

[0148] In one embodiment, light incident on the display can be reflected by a lower structure (e.g., metal wiring), then reflected by a lower metal layer 870 (e.g., BML (bottom metal layer)) located below the TFT 850 (e.g., in the -z axis direction), and then incident on a camera module (e.g., camera module 510 in Figure 5). When light reflected inside the display panel 800 is incident on the camera module (e.g., camera module 510 in Figure 5), a light flare may occur.

[0149] To prevent light flares from occurring in the camera module (for example, camera module 510 in Figure 5), light reflection must be blocked inside the display panel 800.

[0150] Figure 9 is a diagram illustrating how light incident on the display is reflected by a lower metal layer (e.g., a BML, or bottom metal layer) located beneath the TFT (thin film transistor), causing a light flare in the camera module.

[0151] Referring to Figure 9, the display panel 900 may include a substrate 910, multiple insulating films 920, a planarization layer 930, multiple OLEDs 940, multiple TFTs 950, a pixel definition layer 960, and multiple bottom metal layers 970 (e.g., BML (bottom metal layer)).

[0152] In one embodiment, the region of each pixel can be defined by a pixel definition layer 960. The anode electrode 941 of the OLED 940 and the TFT 950 can be electrically connected through a contact portion (CNT). A lower metal layer 970 can be placed below the TFT 950 (for example, in the -z axis direction) to prevent light from entering the lower part of the TFT 950.

[0153] In one embodiment, light incident on the display can be reflected by a lower structure (e.g., metal wiring), then reflected by a lower metal layer 970 (e.g., BML (bottom metal layer)) located below the TFT 950 (e.g., in the -z axis direction), and then incident on a camera module (e.g., camera module 510 in Figure 5). When light reflected inside the display panel 900 is incident on the camera module (e.g., camera module 510 in Figure 5), a light flare may occur.

[0154] In one embodiment, the planarization layer 930 may include multiple insulating layers (e.g., multiple insulating films). To prevent light flare from occurring in the camera module (e.g., camera module 510 in Figure 5), light reflection must be blocked inside the display panel 900.

[0155] Figure 10 is a diagram illustrating the structure of a display panel in an electronic device according to various embodiments of the present disclosure.

[0156] Referring to Figure 10, the display panel 1000 of an electronic device according to various embodiments of this disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) may include a first region 1001 (e.g., an under-display camera region) and a second region 1002 (e.g., an active region). The pixel density of the first region 1001 (e.g., an under-display camera region) and the pixel density of the second region 1002 (e.g., an active region) may be different. The display panel 1000 according to various embodiments of this disclosure may include a substrate 1010, a pixel-defining layer 1020 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)), a plurality of transparent wirings 1030, a planarization layer 1035, a plurality of insulating films 1040, a plurality of TFTs 1050, a plurality of bottom metal layers 1060 (e.g., a BML (bottom metal layer)), a plurality of OLEDs 1070, and a plurality of light-reflection-blocking layers 1080.

[0157] In one embodiment, the planarization layer 1035 may include multiple insulating layers (e.g., multiple insulating films). In another embodiment, the region of each pixel may be defined by a pixel definition layer 1020 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)). For example, the pixel definition layer 1020 may include organic materials such as polyacrylic resin or polyimides resin, or silica-based inorganic materials. For example, the pixel definition layer 1020 may also include a light-blocking material to block light. If the pixel definition layer 1020 includes a light-blocking material, it is possible to prevent mixing of light generated by the organic light-emitting layer of one pixel with light generated by the organic light-emitting layer of an adjacent pixel. For example, the pixel definition layer 1020 may include an opaque material to block light.

[0158] In one embodiment, the multiple OLEDs 1070 may include multiple first OLEDs 1071 and multiple second OLEDs 1072. Multiple first OLEDs 1071 can be arranged in a first region 1101 (e.g., an under-display camera region). Multiple second OLEDs 1072 can be arranged in a second region 1102 (e.g., an active region). For example, a first OLED 1071 may include an anode electrode 1071a, an emissive layer 1071b, and a cathode electrode 1071c. For example, a second OLED 1072 may include an anode electrode 1072a, an emissive layer 1072b, and a cathode electrode 1072c.

[0159] In one embodiment, the anode electrode 1071a of the first OLED 1071 and the TFT can be electrically connected through a contact portion (CNT). Multiple light reflection blocking layers 1080 can be placed below the anode electrode 1071a to prevent light from entering the area below the anode electrode 1071a.

[0160] In one embodiment, the anode electrode 1072a of the second OLED 1072 and the TFT 1050 can be electrically connected through a contact portion (CNT). A lower metal layer 1060 can be placed below the TFT 1050 to prevent light from entering the lower part of the TFT 1050.

[0161] In another embodiment, when a polarizing film or polarizing plate is present, the black PDL (black pixel define layer) placed in the light-emitting layer can be replaced with a pixel define layer (PDL).

[0162] As one embodiment, in order to prevent light flare from occurring in the camera module (for example, the camera module 510 in Figure 5), a plurality of light reflection blocking layers 1080 can be arranged to block the reflection of light incident on the first region 1001 of the display panel 1000 (for example, the under-display camera region).

[0163] In one embodiment, multiple light reflection blocking layers 1080 can be placed below the anode electrode 1071a of the first OLED 1071 of a pixel formed in the first region 1001 (for example, the under-display camera region).

[0164] In one embodiment, in the first region 1001 (for example, the under-display camera region), the multiple light reflection blocking layers 1080 may not be formed in the region between the first OLEDs 1171.

[0165] In one embodiment, the light-blocking layer 1080 may not be placed beneath the second OLED 1172 of a pixel formed in the second region 1002 (e.g., the active region). In another embodiment, when the light-blocking layer 1080 is formed in the first region 1001 (e.g., the under-display camera region), the light-blocking layer 1080 can also be formed in the second region 1002 (e.g., the active region). The light-blocking layer 1080 can be selectively formed in the second region 1002 (e.g., the active region).

[0166] In one embodiment, the pixel definition layer 1020 (for example, a PDL (pixel define layer) or a black PDL (black pixel define layer)) can be formed as a single layer.

[0167] In one embodiment, the light reflection blocking layer 1080 can be placed between the bottom of the OLED 1070a and the multiple transparent wirings 1030 in the first region 1001 (e.g., the under-display camera region). However, it is not limited thereto, and the light reflection blocking layer 1080 can also be placed below the multiple transparent wirings 1030 in the first region 1001 (e.g., the under-display camera region).

[0168] In one embodiment, the light-reflection-blocking layer 1080 can be positioned at the upper end, lower end, or in the middle of the planarization layer 1135. For example, the planarization layer 1135 can be formed from multiple layers, and the light-reflection-blocking layer 1080 can be formed at the top, middle, or bottom of the multiple layers.

[0169] For example, at least one light-reflection-blocking layer can be formed on multiple layers that make up the planarization layer.

[0170] For example, to block light reflection, it may be advantageous for the light-blocking layer 1080 to be positioned directly below the first OLED 1171. However, it is not limited to this, and the light-blocking layer 1080 can be located in any of the layers below the first OLED 1171 (e.g., in the -z-axis direction). The further down the light-blocking layer 1080 goes (e.g., in the -z-axis direction), the wider it can become. As another example, multiple light-blocking layers 1080 can be arranged in multiple layers.

[0171] In one embodiment, the light reflection blocking layer 1080 can be formed from the same material as the pixel definition layer 1020 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)). In another embodiment, the light reflection blocking layer 1080 can be formed from a different material than the pixel definition layer 1020 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)).

[0172] As one example, the light reflection blocking layer 1080 includes an opaque organic film and can have a reflectance of about 4% or less.

[0173] As one embodiment, in order to prevent light reflection from occurring at the anode electrode 1071a of the first OLED 1171, the light reflection blocking layer 1080 can be formed to have a width that is the same as or wider than the width of the anode electrode 1071a.

[0174] Electronic devices according to various embodiments of this disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) can prevent light incident on the display from being reflected by placing a light reflection blocking layer 1080 below the anode electrode 1071a in the first region 1001 of the display panel 1000 (e.g., the under-display camera region). This prevents light incident on the inside of the display panel 1000 from entering the camera module (e.g., camera module 510 in Figure 5), thereby preventing the occurrence of light flare. Figure 11 is a drawing showing the structure of the display panel of an electronic device according to various embodiments of this disclosure.

[0175] Referring to Figure 11, the display panel 1100 of an electronic device according to various embodiments of the present disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) may include a first region 1101 (e.g., an under-display camera region) and a second region 1102 (e.g., an active region). The pixel density of the first region 1101 (e.g., an under-display camera region) and the pixel density of the second region 1102 (e.g., an active region) may be different. A display panel 1100 according to various embodiments of this disclosure may include a substrate 1110, a pixel definition layer 1120 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)), a plurality of transparent wirings 1130, a planarization layer 1135, a plurality of insulating films 1140, a plurality of TFTs 1150, a plurality of bottom metal layers 1160 (e.g., a BML (bottom metal layer)), a plurality of OLEDs 1170, and a plurality of light-blocking layers 1180, 1190.

[0176] In one embodiment, the plurality of light-blocking layers 1180, 1190 may include a plurality of first light-blocking layers 1180 arranged in a first region 1101 (e.g., an under-display camera region) and a second light-blocking layer 1190 arranged in a second region 1102 (e.g., an active region). According to one embodiment, a portion of the second light-blocking layer 1190 arranged in the second region 1102 (e.g., an active region) may be extended to the first region 1101. For example, the second light-blocking layer 1190 may be extended to the first region 1101 and formed to overlap with the outermost anode among a plurality of anode electrodes formed in the first region 1101. For example, the second light-blocking layer 1190 may be positioned below (e.g., in the z-axis direction) the outermost anode among a plurality of anode electrodes formed in the first region 1101. In one embodiment, to prevent reflection of external light, the second light reflection blocking layer 1190 can be placed between the anode electrode 1172a of the second OLED 1172 and the source / drain 1152 of the TFT 1150.

[0177] In one embodiment, the planarization layer 1135 may include a plurality of insulating layers (for example, a plurality of insulating films).

[0178] In one embodiment, the area of ​​each pixel can be defined by a pixel definition layer 1120 (for example, a PDL (pixel define layer) or a black PDL (black pixel define layer)).

[0179] For example, the pixel definition layer 1120 may include organic materials such as polyacrylic resin or polyimide resin, or silica-based inorganic materials. For example, the pixel definition layer 1120 may also include a light-blocking material to block light. When the pixel definition layer 1120 includes a light-blocking material, it is possible to prevent the mixing of light generated by the organic light-emitting layer of one pixel with the light generated by the organic light-emitting layer of an adjacent pixel. For example, the pixel definition layer 1120 may include an opaque material to block light.

[0180] As one embodiment, the plurality of OLEDs 1170 may include a plurality of first OLEDs 1171 and a plurality of second OLEDs 1172. The plurality of first OLEDs 1171 may be arranged in a first region 1101 (e.g., an under-display camera region). The plurality of second OLEDs 1172 may be arranged in a second region 1102 (e.g., an active region). For example, the first OLED 1171 may include an anode electrode 1171a, an emissive layer 1171b, and a cathode electrode 1171c. For example, the second OLED 1172 may include an anode electrode 1172a, an emissive layer 1172b, and a cathode electrode 1172c.

[0181] In one embodiment, the anode electrode 1171a of the first OLED 1171 and the TFT 1150 can be electrically connected through a contact portion (CNT). A first light reflection blocking layer 1180 can be placed below the anode electrode 1171a to prevent light from entering the area below the TFT.

[0182] In one embodiment, the anode electrode 1172a of the second OLED 1172 and the TFT 1150 can be electrically connected through a contact portion (CNT). A lower metal layer 1160 can be placed below the TFT 1150 to prevent light from entering the lower part of the TFT 1150.

[0183] According to one embodiment, in order to prevent light flare from occurring in a camera module (for example, the camera module 510 in Figure 5), a plurality of first light-blocking layers 1180 can be arranged to block the reflection of light incident on a first region 1101 (for example, the under-display camera region) of the display panel 1100. For example, the plurality of first light-blocking layers 1180 can be arranged beneath a plurality of first OLEDs 1171 of pixels formed in the first region 1101 (for example, the under-display camera region). For example, the plurality of first light-blocking layers 1180 can be arranged beneath the anode electrode 1171a of the first OLED 1171 of pixels formed in the first region 1101 (for example, the under-display camera region) to block light reflection by the anode electrode 1171a.

[0184] In one embodiment, in the first region 1101 (for example, the under-display camera region), the multiple first light reflection blocking layers 1180 may not be formed in the region between the first OLEDs 1171.

[0185] As one embodiment, when the pixel definition layer 1120 (e.g., PDL (pixel define layer) or black PDL (black pixel define layer)) is formed in a single layer in a polarizing film or polarizing plate-less structure, multiple first light-blocking layers 1180 can be arranged between the bottom of the first OLED 1171 and multiple transparent wirings 1130 in the first region 1101 (e.g., the under-display camera region). However, the multiple first light-blocking layers 1180 can also be arranged below the multiple transparent wirings 1130 in the first region 1101 (e.g., the under-display camera region).

[0186] In one embodiment, multiple first light reflection blocking layers 1180 can be arranged at the upper end, lower end, or in the middle of multiple insulating films 1140.

[0187] In one embodiment, the multiple first light-blocking layers 1180 can be formed from the same material as the pixel-defining layer 1120 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)). In another embodiment, the multiple first light-blocking layers 1180 can be formed from a different material than the pixel-defining layer 1120 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)).

[0188] In one embodiment, the multiple first light-blocking layers 1180 include an opaque organic film and can have a reflectance of about 4% or less.

[0189] As one embodiment, in order to prevent light reflection from occurring at the anode electrode 1171a of the first OLED 1171, multiple first light reflection blocking layers 1180 can be formed to have a width equal to or wider than the width of the anode electrode 1171a.

[0190] According to one embodiment, in order to prevent light flare from occurring in a camera module (for example, camera module 510 in Figure 5), a second light reflection blocking layer 1190 can be provided to block the reflection of light incident on a second region 1102 (e.g., the active region) of the display panel 1100. For example, the second light reflection blocking layer 1190 can be provided below a plurality of second OLEDs 1172 of pixels formed in the second region 1102 (e.g., the active region). For example, the second light reflection blocking layer 1190 can be provided below the anode electrode 1172a of the second OLED 1172 of pixels formed in the second region 1102 (e.g., the active region) to block light reflection by the anode electrode 1172a. For example, the second light reflection blocking layer 1190 can be provided so as to overlap the entire bottom of the second OLED 1172 of pixels formed in the second region 1102 (e.g., the active region).

[0191] In one embodiment, when the pixel definition layer 1120 (e.g., PDL (pixel define layer) or black PDL (black pixel define layer)) is formed in a single layer in a polarizing plate-less structure, the second light-blocking layer 1190 can be positioned between the bottom of the second OLED 1172 and the TFT 1150 in the second region 1102 (e.g., the active region). In another embodiment, the second light-blocking layer 1190 can be positioned at the top, bottom, or in the middle of a plurality of insulating films 1140.

[0192] In one embodiment, the second light-blocking layer 1190 can be formed from the same material as the pixel-defining layer 1120 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)). In another embodiment, the second light-blocking layer 1190 can be formed from a different material than the pixel-defining layer 1120 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)).

[0193] As one embodiment, the second light-reflection blocking layer 1190 includes an opaque organic film and can have a reflectance of about 4% or less.

[0194] As one embodiment, in order to prevent light reflection from occurring at the anode electrode 1172a of the second OLED 1172, the second light reflection blocking layer 1190 can be formed to have a width that is the same as or wider than the width of the anode electrode 1172a.

[0195] In one embodiment, the second light reflection blocking layer 1190 can be extended and positioned not only in the second region 1102 (e.g., the active region) but also in the first region 1101 (e.g., the under-display camera region).

[0196] Electronic devices according to various embodiments of this disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) can prevent light incident on the display from being reflected by placing a first light reflection blocking layer 1180 below the anode electrode 1171a in the first region 1101 (e.g., the under-display camera region) of the display panel 1100, and a second light reflection blocking layer 1190 below the anode electrode 1172a in the second region 1102 (e.g., the active region). This prevents light incident on the interior of the display panel 1100 from being incident on the camera module (e.g., the camera module 510 in Figure 5), thereby preventing the occurrence of light flare.

[0197] Figure 12 is a drawing illustrating the structure of a display panel in an electronic device according to various embodiments of the present disclosure.

[0198] Referring to Figure 12, the display panel 1200 of an electronic device according to various embodiments of this disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) may include a first region 1201 (e.g., an under-display camera region) and a second region 1202 (e.g., an active region). The pixel density of the first region 1201 (e.g., an under-display camera region) and the pixel density of the second region 1202 (e.g., an active region) may be different. The display panel 1200 according to various embodiments of this disclosure may include a substrate 1210, a pixel definition layer 1220 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)), a plurality of transparent wirings 1230, a plurality of insulating films 1240, a plurality of TFTs 1250, a plurality of bottom metal layers 1260 (e.g., a BML (bottom metal layer)), a plurality of OLEDs 1270, and a plurality of light reflection blocking layers 1280.

[0199] In one embodiment, multiple light reflection blocking layers 1280 can be arranged in a first region 1201 (for example, an under-display camera region).

[0200] In one embodiment, the area of ​​each pixel can be defined by a pixel definition layer 1220 (for example, a PDL (pixel define layer) or a black PDL (black pixel define layer)). For example, the pixel definition layer 1220 may include organic materials such as polyacrylic resin or polyimide resin, or silica-based inorganic materials. For example, the pixel definition layer 1220 may also include a light-blocking material to block light. When the pixel definition layer 1220 includes a light-blocking material, it is possible to prevent mixing of light generated by the organic light-emitting layer of one pixel with light generated by the organic light-emitting layer of an adjacent pixel. For example, the pixel definition layer 1220 may include an opaque material that serves to block light.

[0201] In one embodiment, the multiple OLEDs 1270 may include multiple first OLEDs 1271 and multiple second OLEDs 1272. Multiple first OLEDs 1271 can be arranged in a first region 1201 (e.g., an under-display camera region). Multiple second OLEDs 1272 can be arranged in a second region 1202 (e.g., an active region). For example, a first OLED 1271 may include an anode electrode 1271a, an emissive layer 1271b, and a cathode electrode 1271c. For example, a second OLED 1272 may include an anode electrode 1272a, an emissive layer 1272b, and a cathode electrode 1272c.

[0202] In one embodiment, the anode electrodes 1271a of multiple first OLEDs 1271 and the TFT can be electrically connected through contact portions (CNTs). Multiple light reflection blocking layers 1280 can be placed beneath the multiple first OLEDs 1271 to prevent light from entering the area beneath the multiple first OLEDs 1271 formed in a first region 1201 (e.g., under-display camera region).

[0203] In one embodiment, the anode electrode 1272a of the second OLED 1272 and the TFT 1250 can be electrically connected through a contact portion (CNT). A lower metal layer 1260 can be placed below the TFT 1250 to prevent light from entering the area below the TFT 1250 formed in the second region 1202 (e.g., the active region).

[0204] In one embodiment, to prevent light flare from occurring in the camera module (for example, the camera module 510 in Figure 5), multiple light reflection blocking layers 1280 can be arranged to block the reflection of light incident on the first region 1201 of the display panel 1200 (for example, the under-display camera region). For example, the multiple light reflection blocking layers 1280 can be arranged below the first OLED 1271 of a pixel formed in the first region 1201 (for example, the under-display camera region). For example, the multiple light reflection blocking layers 1280 can be arranged below the anode electrode 1271a of the first OLED 1271 of a pixel formed in the first region 1201 (for example, the under-display camera region) to block light reflection by the anode electrode 1271a. In one embodiment, the multiple light reflection blocking layers 1280 may not be formed in the region between the first OLED 1271 in the first region 1201 (for example, the under-display camera region).

[0205] In one embodiment, when a pixel definition layer 1220 (e.g., a PDL (pixel define layer) or a black PDL (black pixel define layer)) is formed in a single layer in a polarizing plate-less structure, multiple light reflection blocking layers 1280 can be arranged beneath multiple transparent wirings 1230 in a first region 1201 (e.g., an under-display camera region).

[0206] For example, since the light reflection blocking layer 1280 is placed on the display substrate, it can be formed from a different material than the light reflection blocking layer 1080 in Figure 1, and the first light reflection blocking layer 1180 and the second light reflection blocking layer 1190 in Figure 11, and can be formed in a different location.

[0207] For example, the light reflection blocking layer 1280 can be placed below the TFT.

[0208] For example, the material of the light-reflection blocking layer 1280 may include at least one metal layer, and the materials of the light-reflection blocking layer 1080 in Figure 1, the first light-reflection blocking layer 1180 in Figure 11, and the second light-reflection blocking layer 1190 may be opaque organic materials.

[0209] For example, the anode electrode 1271a of the first OLED 1271 can be electrically connected to the contact portion (CNT). The contact portion (CNT) can be electrically connected to a plurality of transparent wirings 1230. A bridge wiring 1225 can be formed between the contact portion (CNT) and the plurality of transparent wirings 1230 to connect the contact portion (CNT) and the plurality of transparent wirings 1230.

[0210] In one embodiment, multiple light-reflection-blocking layers 1280 can be arranged at the lower end of multiple insulating films 1240. In another embodiment, layer 1215 can be provided between the insulating film 1240 and the substrate 1210.

[0211] In one embodiment, a plurality of light reflection blocking layers 1280 formed in the first region 1201 (e.g., the under-display camera region) can be formed at substantially the same height in the vertical direction (e.g., the z-axis direction) as the lower metal layer 1260 formed in the second region 1202 (e.g., the active region).

[0212] In one embodiment, the multiple light-reflection-blocking layers 1280 can be formed from the same material as the lower metal layer 1260. In another embodiment, the multiple light-reflection-blocking layers 1280 can be formed from a different material than the lower metal layer 1260.

[0213] In one embodiment, the lower metal layer 1260 can be formed from a single metal layer.

[0214] In one embodiment, the multiple light reflection blocking layers 1280 can be formed from multiple layers (for example, a configuration in which a metal layer and a non-metal layer are laminated).

[0215] As one embodiment, in order to prevent light reflection from occurring at the anode electrode 1271a of the OLED 1271, the multiple light reflection blocking layers 1280 can be formed to have a width that is the same as or wider than the width of the anode electrode 1271a.

[0216] Electronic devices according to various embodiments of this disclosure (e.g., electronic device 200 in Figure 2a, electronic device 300 in Figure 3a) can prevent light incident on the display from being reflected by placing a light reflection blocking layer 1280 below the anode electrode 1271 in the first region 1201 of the display panel 1200 (e.g., the under-display camera region). This prevents light incident on the interior of the display panel 1200 from entering the camera module (e.g., camera module 510 in Figure 5), thereby preventing the occurrence of light flare.

[0217] Figure 13 is a diagram showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure.

[0218] Referring to Figure 13, the light-blocking layer 1300 in various embodiments of this disclosure (for example, the multiple light-blocking layers 1280 in Figure 12) can be formed from multiple layers. In one embodiment, the light-blocking layer 1300 can be formed by laminating multiple layers using an LTPS (low temperature polycrystalline silicon) or LTPO (low temperature polycrystalline oxide) process for forming a TFT (for example, the TFT 1250 in Figure 12).

[0219] According to one embodiment, the light-blocking layer 1300 (for example, the multiple light-blocking layers 1280 in Figure 12) may include a substrate 1310, an oxide film 1320, a nitride film 1330, a silicon film 1340, and a metal layer 1350. For example, the light-blocking layer 1300 may include multiple layers and have a light reflectance of about 5.2%.

[0220] In one example, the oxide film 1320 may include a silicon oxide film (SiO2). For example, the oxide film 1320 can have a thickness of approximately 910 angstroms (Å).

[0221] In one embodiment, the nitride film 1330 may include a silicon nitride film (SiNx). For example, the nitride film 1330 can have a thickness of approximately 480 angstroms (Å).

[0222] In one embodiment, the silicon film 1340 may include amorphous silicon (a-Si). For example, the silicon film 1340 can have a thickness of approximately 150 angstroms (Å).

[0223] As an example, the metal layer 1350 may include titanium (Ti) or a titanium alloy. For instance, the metal layer 1350 may have a thickness of approximately 1200 angstroms (Å).

[0224] Figure 14 is a diagram showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure.

[0225] Referring to Figure 14, the light-blocking layer 1400 in various embodiments of this disclosure (for example, the multiple light-blocking layers 1280 in Figure 12) can be formed from multiple layers. In one embodiment, the light-blocking layer 1400 can be formed by laminating multiple layers using an LTPS or LTPO process for forming a TFT (for example, the TFT 1250 in Figure 12).

[0226] According to one embodiment, the light-reflecting-blocking layer 1400 (for example, the multiple light-reflecting-blocking layers 1280 in Figure 12) may include a substrate 1410, a first oxide film 1420, a nitride film 1430, a first metal layer 1440, a second oxide film 1450, and a second metal layer 1460. For example, the light-reflecting-blocking layer 1400 may include multiple layers and have a light reflectance of about 4.4%.

[0227] In one embodiment, the first oxide film 1420 may include a silicon oxide film (SiO2). For example, the first oxide film 1420 can have a thickness of approximately 1290 angstroms (Å).

[0228] In one embodiment, the nitride film 1430 may include a silicon nitride film (SiNx). For example, the nitride film 1430 can have a thickness of approximately 490 angstroms (Å).

[0229] In one embodiment, the first metal layer 1440 may include titanium (Ti) or a titanium alloy. For example, the first metal layer 1440 may have a thickness of about 110 angstroms (Å).

[0230] In one embodiment, the second oxide film 1450 may include a silicon oxide film (SiO2). For example, the second oxide film 1450 can have a thickness of approximately 910 angstroms (Å).

[0231] As an example, the second metal layer 1460 may include titanium (Ti) or a titanium alloy. For instance, the second metal layer 1460 can have a thickness of approximately 1200 angstroms (Å).

[0232] Figure 15 is a diagram showing the configuration of the light reflection blocking layer according to various embodiments of the present disclosure.

[0233] Referring to Figure 15, the light-blocking layer 1500 in various embodiments of this disclosure (for example, the multiple light-blocking layers 1280 in Figure 12) can be formed from multiple layers. In one embodiment, the light-blocking layer 1500 can be formed by laminating multiple layers using an LTPS or LTPO process that forms a TFT (for example, the TFT 1250 in Figure 12).

[0234] According to one embodiment, the light-blocking layer 1500 (for example, the multiple light-blocking layers 1280 in Figure 12) may include a substrate 1510, a first oxide film 1520, a first nitride film 1530, a second oxide film 1540, a second nitride film 1550, a first silicon film 1560, a third oxide film 1570, a second silicon film 1580, and a metal layer 1590. For example, the light-blocking layer 1500 may include multiple layers and have a light reflectance of about 5.9%.

[0235] In one embodiment, the first oxide film 1520 may include a silicon oxide film (SiO2). For example, the first oxide film 1520 can have a thickness of approximately 1690 angstroms (Å).

[0236] In one embodiment, the first nitride film 1530 may include a silicon nitride film (SiNx). For example, the first nitride film 1530 may have a thickness of approximately 1210 angstroms (Å).

[0237] In one embodiment, the second oxide film 1540 may include a silicon oxide film (SiO2). For example, the second oxide film 1540 can have a thickness of approximately 870 angstroms (Å).

[0238] In one embodiment, the second nitride film 1550 may include a silicon nitride film (SiNx). For example, the second nitride film 1550 can have a thickness of approximately 520 angstroms (Å).

[0239] In one embodiment, the first silicon film 1560 may contain amorphous silicon (a-Si). The first silicon film 1560 can have a thickness of approximately 620 angstroms (Å).

[0240] In one embodiment, the third oxide film 1570 may include a silicon oxide film (SiO2). For example, the third oxide film 1570 may have a thickness of approximately 870 angstroms (Å).

[0241] In one embodiment, the second silicon film 1580 may contain amorphous silicon (a-Si). The second silicon film 1580 can have a thickness of approximately 290 angstroms (Å).

[0242] In one embodiment, the metal layer 1590 may contain molybdenum (Mo) or a molybdenum (Mo) alloy. For example, the metal layer 1590 may have a thickness of approximately 800 angstroms (Å).

[0243] Electronic devices according to various embodiments of this disclosure (for example, electronic device 200 in Figures 2a and 2b, electronic device 300 in Figures 3a and 3b, electronic device 400 in Figure 4, electronic device 500 in Figure 5, and electronic device 600 in Figure 6) may include display panels (for example, display panel 520 in Figure 5, display panel 800 in Figure 8, display panel 900 in Figure 9, display panel 1000 in Figure 10, display panel 1100 in Figure 11, and display panel 1200 in Figure 12) and camera modules (for example, camera module 510 in Figure 5) located below the display panels 520, 800, 900, 1000, 1100, and 1200. The display panels 520, 800, 900, 1000, 1100, and 1200 have a first region that overlaps with the camera module 510 with a first pixel density (for example, the first region 611 in Figures 5 and 6, the first region 1001 in Figure 10, the first region 1101 in Figure 11, and the first region 1201 in Figure 12), a second region having a second pixel density greater than the first pixel density (for example, the second region 612 in Figures 5 and 6, the second region 1002 in Figure 10, the second region 1102 in Figure 11, and the second region 1202 in Figure 12), and the first regions 611, 1001, 1101, and 12 The first light-blocking layer (e.g., the first light-blocking layer 1180 in Figure 10, the first light-blocking layer 1180 in Figure 11, and the light-blocking layer 1280 in Figure 12) is disposed on all or at least part of 01, and a plurality of transparent wirings (e.g., transparent wiring 1030 in Figure 10, transparent wiring 1130 in Figure 11, and transparent wiring 1230 in Figure 12) is disposed beneath the first organic light-emitting diodes (e.g., the first OLED 1071 in Figure 10, the first OLED 1171 in Figure 11, and the first OLED 1271 in Figure 12) disposed in the first regions 611, 1001, 1101, and 1201. The first light-blocking layers 1180 and 1280 can be disposed so as to overlap the underside of the first organic light-emitting diodes 1071, 1171, and 1271 disposed in the first regions 611, 1001, 1101, and 1201.The first light reflection blocking layers 1180, 1280 can be placed between the anode electrodes of the first organic light-emitting diodes 1071, 1171, 1271 (for example, anode electrode 1171a in Figure 11, anode electrode 1271a in Figure 12) and the plurality of transparent wirings 1030, 1130, 1230.

[0244] According to one embodiment, the first light reflection blocking layers 1180, 1280 can be placed below the anode electrodes 1171a, 1271a of the first organic light-emitting diodes 1071, 1171, 1271.

[0245] According to one embodiment, the first light reflection blocking layers 1180, 1280 can be arranged in at least one layer located below the anode electrodes 1171a, 1271a.

[0246] According to one embodiment, the electronic devices 200, 300, 400, 500, and 600 according to various embodiments of the present disclosure may include a plurality of first drive circuits 1050, 1150, and 1250 for driving the first organic light-emitting diodes 1071, 1171, and 1271. The plurality of transparent wirings 1030, 1130, and 1230 can electrically connect the first organic light-emitting diodes 1071, 1171, and 1271 to the plurality of first drive circuits (for example, the plurality of TFTs 1050 in Figure 10, the plurality of TFTs 1150 in Figure 11, and the plurality of TFTs 1250 in Figure 12).

[0247] According to one embodiment, the first light reflection blocking layers 1180, 1280 may have the same width as the first width of the anode electrodes 1171a, 1271a, or a second width that is wider than the first width of the anode electrodes 1171a, 1271a.

[0248] According to one embodiment, the first light reflection blocking layers 1180 and 1280 can be formed with a wider width the further they are from the bottom of the anode electrodes 1171a and 1271a.

[0249] According to one embodiment, the first light reflection blocking layers 1180 and 1280 may contain an opaque organic material.

[0250] According to one embodiment, the first light-blocking layers 1180 and 1280 may include a black PDL (pixel-defining layer).

[0251] According to one embodiment, the first light-reflecting blocking layers 1180 and 1280 can have a light reflectance of 4% or less.

[0252] According to one embodiment, a second light-blocking layer (for example, the second light-blocking layer 1190 in Figure 11) may be included, which is disposed in at least a portion of the second regions 612, 1002, 1102, and 1202.

[0253] According to one embodiment, the second light reflection blocking layer 1190 can be placed below the anode electrodes 1172a, 1272a of multiple second organic light-emitting diodes (e.g., second OLED 1072 in Figure 10, second OLED 1172 in Figure 11, second OLED 1272 in Figure 12) of multiple pixels formed in the second regions 612, 1002, 1102, 1202.

[0254] According to one embodiment, the second regions 612, 1002, 1102, and 1202 may include a plurality of first drive circuits 1050, 1150, and 1250 for driving the first organic light-emitting diodes 1071, 1171, and 1271, and a plurality of second drive circuits for driving the second organic light-emitting diodes 1072, 1172, and 1272.

[0255] According to one embodiment, the second light reflection blocking layer 1190 can be placed on top of the plurality of first drive circuits 1050, 1150, 1250 and the plurality of second drive circuits.

[0256] According to one embodiment, the second light reflection blocking layer 1190 may contain an opaque organic material.

[0257] According to one embodiment, the second light-blocking layer 1190 may include a black PDL (pixel define layer).

[0258] According to one embodiment, the second light reflection blocking layer 1190 can have a light reflectance of 4% or less.

[0259] According to one embodiment, electronic devices 200, 300, 400, 500, and 600 according to various embodiments of the present disclosure may include a bottom metal layer (e.g., bottom metal layer 1260 in Figure 12) located in at least a portion of the second regions 612, 1002, 1102, and 1202. The first light-blocking layers 1180 and 1280 may be located in the first regions 611, 1001, 1101, and 1201 at substantially the same height as the bottom metal layer 1260.

[0260] According to one embodiment, the first light-reflection-blocking layers 1180, 1280 may include at least one metal layer and at least one non-metal layer.

[0261] According to one embodiment, the first light-reflecting blocking layers 1180, 1280 may include one titanium metal layer and have a reflectance of 5.2% or less, or may include multiple titanium metal layers and have a reflectance of 4.4% or less.

[0262] According to one embodiment, the first light-reflection-blocking layers 1180 and 1280 include a molybdenum metal layer and can have a reflectance of 5.9% or less.

[0263] Electronic devices according to various embodiments of this disclosure (for example, electronic device 200 in Figures 2a and 2b, electronic device 300 in Figures 3a and 3b, electronic device 400 in Figure 4, electronic device 500 in Figure 5, and electronic device 600 in Figure 6) may include display panels 520, 800, 900, 1000, 1100, and 1200, and camera modules 510 located below the display panels 520, 800, 900, 1000, 1100, and 1200. The display panels 520, 800, 900, 1000, 1100, and 1200 have a first pixel density and overlap the camera module 510, a second pixel density greater than the first pixel density (612, 1002, 1102, 1202), and all or at least a portion of the first regions 611, 1001, 1101, and 1201. The following may be included: first light-blocking layers 1180, 1280 arranged in the first region; second light-blocking layer 1190 arranged in all or at least part of the second region 612, 1002, 1102, 1202; and a plurality of transparent wirings 1030, 1130, 1230 arranged beneath the first organic light-emitting diodes 1071, 1171, 1271 arranged in the first region 611, 1001, 1101, 1201. The first light-blocking layers 1180, 1280 can be arranged to overlap with the beneath the first organic light-emitting diodes 1071, 1171, 1271 arranged in the first region 611, 1001, 1101, 1201. The first light-blocking layers 1180, 1280 can be placed between the anode electrodes 1171a, 1271a of the first organic light-emitting diodes 1071, 1171, 1271 and the plurality of transparent wirings 1030, 1130, 1230. The second light-blocking layer 1190 can be formed by extending to at least a portion of the first regions 611, 1001, 1101, 1201.

[0264] According to one embodiment, the second light reflection blocking layer 1190 can be formed to overlap with the outermost anode electrode among the plurality of anode electrodes 1171a, 1271a formed in the first regions 611, 1001, 1101, and 1201.

[0265] According to one embodiment, the second light reflection blocking layer 1190 can be formed below the outermost anode electrodes 1171a, 1271a among the multiple anode electrodes 1171a, 1271a formed in the first regions 611, 1001, 1101, and 1201.

[0266] According to one embodiment, the first light reflection blocking layers 1180 and 1280 may contain an opaque organic material.

[0267] According to one embodiment, the first light-reflecting blocking layers 1180 and 1280 can have a light reflectance of 4% or less.

[0268] According to one embodiment, the second light reflection blocking layer 1190 may contain an opaque organic material.

[0269] According to one embodiment, the second light reflection blocking layer 1190 can have a light reflectance of 4% or less.

[0270] Although the disclosure has been illustrated and described with reference to various embodiments, it will be understood by those skilled in the art that various modifications of form and details can be made without departing from the spirit and scope of the disclosure as defined by the attached claims and equivalents.

Claims

1. An electronic device including a camera module, Display panel and, The camera module is located at the bottom of the display panel, The aforementioned display panel is A first region comprising a plurality of first pixels having a first pixel density, overlapping with the camera module, A second region surrounding the first region includes a plurality of second pixels having a second pixel density greater than the first pixel density, A first light reflection blocking layer is disposed over the entire or at least part of the first region, A plurality of first drive circuits arranged in the second region and driving the first organic light-emitting diode arranged in the first region, The first organic light-emitting diode includes a plurality of transparent wires arranged below the first organic light-emitting diode and electrically connecting the first organic light-emitting diode and the plurality of first drive circuits, The first light reflection blocking layer is positioned below the first organic light-emitting diode and overlapping with the first organic light-emitting diode, and is positioned between the anode electrode of the first organic light-emitting diode and the plurality of transparent wirings, in an electronic device.

2. The first light reflection blocking layer is The electronic device according to claim 1, wherein the device is disposed in at least one layer located below the anode electrode.

3. The first light reflection blocking layer is The electronic device according to claim 1, wherein the first organic light-emitting diode has a width equal to the first width of the anode electrode, or a second width that is wider than the first width of the anode electrode of the first organic light-emitting diode.

4. The first light reflection blocking layer is The electronic device according to claim 3, wherein the width of the first organic light-emitting diode is formed to increase as it is positioned further away from the bottom of the anode electrode.

5. The first light reflection blocking layer is The electronic device according to claim 1, comprising an opaque organic material.

6. The first light reflection blocking layer is The electronic device according to claim 1, including a black PDL.

7. The first light reflection blocking layer is The electronic device according to claim 1, having a light reflectance of 4% or less.

8. The electronic device according to claim 1, further comprising a second light reflection blocking layer disposed in at least a portion of the second region.

9. The electronic device according to claim 8, wherein the second light reflection blocking layer is disposed below the anode electrodes of a plurality of second organic light-emitting diodes of a plurality of pixels formed in the second region.

10. The electronic device according to claim 8, wherein the second region includes a plurality of second drive circuits for driving a second organic light-emitting diode.

11. The electronic device according to claim 10, wherein the second light reflection blocking layer is disposed on top of the plurality of first drive circuits and the plurality of second drive circuits.

12. The second light reflection blocking layer is The electronic device according to claim 11, comprising an opaque organic material.

13. The second light reflection blocking layer is The electronic device according to claim 11, including a black PDL.

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