Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin molding device and a resin molding manufacturing method that can improve the molding quality of resin.SOLUTION: A resin molding device according to the present invention includes a first mold in which a substrate on which an electronic element is mounted can be placed, a second mold that forms a cavity between the first mold and the second mold, a transfer mechanism that supplies a resin material to the cavity by a plunger, and a control unit that controls the moving speed of the plunger on the basis of the volume value of the space in the cavity that can be filled with a resin material when the substrate is placed in the cavity.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing resin molded products. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a resin molded product by housing a substrate on which a chip is mounted in a cavity, and filling this cavity with resin by moving a plunger of a transfer mechanism. Specifically, the resin filling speed in the cavity is indirectly controlled by adjusting the plunger's upward movement speed according to the resin filling rate in the cavity, based on the relationship between the resin filling rate in the cavity and the upward position of the plunger. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-148957 [Overview of the project] [Problems that the invention aims to solve]

[0004] By the way, even if the plunger's movement speed is the same, the resin filling speed (filling time) within the cavity can change substantially if the number of chips mounted on the substrate changes, as follows. (1) The required amount of resin filling changes depending on the number of chips on the substrate. Therefore, if the plunger's movement speed is kept the same regardless of the number of chips, the resin filling speed will change. (2) If the plunger movement speed is kept the same regardless of the number of chips, the resin filling time for substrates with a large number of chips will be shortened. In other words, the resin filling speed in the cavity will be faster.

[0005] Thus, if the resin filling speed within the cavity differs, the molding quality will not be consistent. For example, if the resin filling speed is too fast, the wire may flow or the tip may shift. On the other hand, if the resin filling speed is too slow, part of the resin may harden, resulting in incomplete filling.

[0006] The present invention has been made to solve the above problems and aims to provide a resin molding apparatus and a method for manufacturing resin molded products that can improve the molding quality of resins. [Means for solving the problem]

[0007] The resin molding apparatus according to the present invention comprises a first mold on which a substrate with a semiconductor chip mounted on it can be placed, a second mold that forms a cavity between itself and the first mold, a transfer mechanism that supplies resin material to the cavity by a plunger, and a control unit that controls the movement speed of the plunger based on the volume value of the space in the cavity that can be filled with resin material when the substrate is placed in the cavity.

[0008] A method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product in a resin molding apparatus comprising: a first mold on which a substrate with a semiconductor chip mounted on it can be placed; a second mold forming a cavity between itself and the first mold; and a transfer mechanism that supplies resin material to the cavity by a plunger, the method comprising: placing the substrate in the first mold; clamping the second mold and the first mold together; and supplying the resin material to the cavity by moving the plunger, wherein in the step of supplying the resin material to the cavity, the movement speed of the plunger is controlled based on the volume value of the space in the cavity that can be filled with resin material. [Effects of the Invention]

[0009] According to the present invention, the molding quality of resin can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] It is a plan view showing a schematic configuration of a resin molding apparatus according to an embodiment of the present invention. [Figure 2] It is a cross-sectional view of a resin molding module provided in the resin molding apparatus of FIG. 1. [Figure 3] It is a plan view of the lower mold of the resin molding module of FIG. 2 as viewed from the mold surface side (above). [Figure 4] It is a plan view of the upper mold of the resin molding module of FIG. 2 as viewed from the mold surface side (below). [Figure 5] It is a plan view showing a connecting groove for connecting the caul parts. [Figure 6] It is a plan view showing an example in which the caul parts are connected via a cavity. [Figure 7] It is a partial cross-sectional view of the resin molding module of FIG. 2. [Figure 8] It is a model of a cavity used to calculate the moving speed of the plunger. [Figure 9] It is an example of the filling speed of the resin. [Figure 10] It is a flowchart showing the flow of resin molding. [Figure 11] It is a partial cross-sectional view of the resin molding module of FIG. 2. [Figure 12] It is another example of a model of a cavity used to calculate the moving speed of the plunger.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, a resin molding apparatus and a method for manufacturing a resin molded product according to an embodiment of the present invention will be described with reference to the drawings. Hereinafter, for the sake of convenience of explanation, the description will be made according to the directions shown in each figure, but the present invention is not specified by these directions, and for example, the orientation can be changed according to the mode of the implemented product. Further, hereinafter, the case where the lower mold is used as the first type of the present invention and the upper mold is used as the second type of the present invention will be described on the premise.

[0012] Figure 1 is a plan view showing the schematic configuration of a resin molding apparatus according to this embodiment. This resin molding apparatus 1 is a device that encapsulates electronic elements such as semiconductor chips (hereinafter simply referred to as "chip 2a") on a substrate with resin to manufacture a resin molded product. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using the transfer molding method.

[0013] <1. Overview of resin molding equipment> As shown in Figure 1, the resin molding apparatus 1 comprises a supply module 10, two resin molding modules 20, and a discharge module 30, arranged from left to right in that order. Each component is detachable and interchangeable with respect to the other components.

[0014] <1-1. Supply Module> The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which the chip 2a is mounted, and a resin tablet T to the resin molding module 20. In this embodiment, a lead frame is exemplified as substrate 2, but various other substrates (glass epoxy substrates, ceramic substrates, resin substrates, metal substrates, etc.) can also be used. The supply module 10 mainly comprises a frame delivery unit 11, a frame measurement unit 12, a frame supply unit 13, a resin delivery unit 14, a resin measurement unit 15, a resin supply unit 16, a loader 17, and a control unit 18.

[0015] The frame delivery unit 11 sends the unsealed substrate 2, housed in an in-magazine unit (not shown), to the frame measurement unit 12. The frame measurement unit 12 measures the volume of the chip 2a mounted on the substrate 2. Details of the frame measurement unit 12 will be described later. After the frame measurement unit 12 has finished measuring the volume of the chip 2a, the substrate 2 is sent to the frame supply unit 13. The frame supply unit 13 receives the substrate 2 from the frame measurement unit 12, aligns the received substrate 2 appropriately, and hands it over to the loader 17.

[0016] The resin dispensing unit 14 receives the resin tablet T from the stocker (not shown) and sends the resin tablet T to the resin measuring unit 15. The resin measuring unit 15 measures the weight (volume) of the resin tablet T. Details of the resin measuring unit 15 will be described later. After the weight measurement is completed in the resin measuring unit 15, the resin tablet T is sent to the resin supply unit 16. The resin supply unit 16 receives the resin tablet T from the resin measuring unit 15, aligns the received resin tablet T appropriately, and hands it over to the loader 17.

[0017] The loader 17 transports the substrate 2 and resin tablet T received from the frame supply unit 13 and the resin supply unit 16 to the resin molding module 20.

[0018] The control unit 18 controls the operation of each module 10, 20, and 30 of the resin molding apparatus 1. In this embodiment, an example is shown in which the control unit 18 is provided in the supply module 10, but it is also possible to provide the control unit 18 in other modules. Furthermore, it is possible to provide multiple control units 18. For example, it is possible to provide a control unit 18 for each module or each apparatus and individually control the operation of each module, etc., while coordinating their operation with each other.

[0019] <1-2. Resin Molding Module> Each of the two resin molding modules 20 resin-encapsulates the chip 2a mounted on the substrate 2. By performing resin encapsulation of the substrate 2 in parallel using the two resin molding modules 20, the manufacturing efficiency of the resin molded product can be improved. As described later, the resin molding module 20 has a lower mold 110 and an upper mold 140, and uses molten resin material to resin-encapsulate the chip 2a mounted on the substrate 2. The detailed configuration of the resin molding module 20 will be described later.

[0020] <1-3. Export Module> The unloading module 30 receives the resin-sealed substrate 2 from the resin molding module 20 and unloads it. The unloading module 30 mainly comprises an unloader 31 and a substrate housing section 32.

[0021] The unloader 31 holds the resin-sealed substrate 2 and transports it to the substrate housing section 32. The substrate housing section 32 houses the resin-sealed substrate 2.

[0022] <2. Detailed Configuration of the Resin Molding Module> Next, the configuration of the resin molding module 20 will be explained in detail with reference to Figures 2 to 4. Figure 2 is a cross-sectional view of the resin molding module, Figure 3 is a schematic plan view showing the configuration of the lower mold as seen from the mold surface side (above), and Figure 4 is a schematic bottom view showing the configuration of the upper mold as seen from the mold surface side (below).

[0023] As shown in Figure 2, the resin molding module 20 mainly comprises a lower mold mounting section 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold mounting section 130, an upper mold 140, a disc spring 150, an upper mold cavity adjustment mechanism 160, an air vent opening / closing mechanism 170, a transfer mechanism 180, and a mold clamping mechanism 190. Each part will be described below.

[0024] <2-1. Lower mold installation section> The lower mold mounting section 100 is the part on which the lower mold 110 is installed. The lower mold mounting section 100 mainly comprises a lower mold movable base section 101 and a lower mold mounting section 102. The lower mold movable base section 101 constitutes the lower part of the lower mold mounting section 100. The lower mold mounting section 102 is the part on which the lower mold 110 is attached and is provided on the upper part of the lower mold movable base section 101.

[0025] <2-2. Lower mold> The lower mold 110 constitutes the lower part of the molding die. The lower mold 110 mainly comprises lower mold side blocks 111, pot blocks 112, lower mold cavity blocks 113, lower mold pillars 114, and lower mold elastic members 115. In this embodiment, as shown in Figure 3, a pot block 112 is positioned in the center of the lower mold 110, and lower mold cavity blocks 113 are positioned on either side of the pot block 112. Further to the left and right of each lower mold cavity block 113, lower mold side blocks 111 are positioned.

[0026] Each lower mold side block 111 constitutes the outer periphery of the lower mold 110 and is provided on the upper surface of the lower mold mounting portion 102. The pot block 112 is the part that houses the resin tablets T supplied from the supply module 10. The pot block 112 has multiple through holes (pots) formed therein for housing the resin tablets T. The pot block 112 is also provided on the upper surface of the lower mold mounting portion 102.

[0027] The lower mold cavity block 113 is the area on which the substrate 2 is placed. The lower mold cavity block 113 is positioned between the lower mold side block 111 and the pot block 112. The lower mold cavity block 113 is movable relative to the lower mold side block 111 and the pot block 112 in the vertical direction.

[0028] The lower mold pillar 114 is a member that extends downward from the lower mold cavity block 113. The upper end of the lower mold pillar 114 is fixed to the lower part of the lower mold cavity block 113. In this embodiment, multiple lower mold pillars 114 are provided.

[0029] The lower mold elastic member 115 is a member that applies an upward elastic force to each lower mold cavity block 113. Each lower mold elastic member 115 can be formed from, for example, a compression coil spring. Each lower mold elastic member 115 is positioned between the lower mold cavity block 113 and the lower mold mounting portion 102. Due to the biasing force of the lower mold elastic member 115, an upward force is always applied to the lower mold cavity block 113.

[0030] <2-3. Lower mold cavity adjustment mechanism> The lower mold cavity adjustment mechanism 120 has the function of adjusting the position of the lower mold cavity block 113. The lower mold cavity adjustment mechanism 120 mainly comprises a lower mold first wedge-shaped member 121, a lower mold second wedge-shaped member 122, and a lower mold wedge-shaped member drive unit 123.

[0031] The lower mold first wedge-shaped member 121 and the lower mold second wedge-shaped member 122 are a pair of members with tapered portions formed on their opposing surfaces. The lower mold second wedge-shaped member 122 is positioned above the lower mold first wedge-shaped member 121. The lower mold second wedge-shaped member 122 is also positioned below the lower mold pillar 114. The lower end of the lower mold pillar 114 contacts the lower mold second wedge-shaped member 122, restricting the downward movement of the lower mold cavity block 113. This sets the position of the lower mold cavity block 113.

[0032] The lower wedge-shaped member drive unit 123 has the function of moving the lower first wedge-shaped member 121 in the horizontal direction (left-right direction). The lower wedge-shaped member drive unit 123 is formed by, for example, a servo motor or an air cylinder. The lower wedge-shaped member drive unit 123 is connected to the lower first wedge-shaped member 121 via a known power transmission member. When the lower wedge-shaped member drive unit 123 is driven, the lower first wedge-shaped member 121 can be moved arbitrarily in the left-right direction.

[0033] With the above configuration, the lower mold cavity adjustment mechanism 120 can adjust the position of the lower mold cavity block 113. Specifically, when the lower mold wedge member drive unit 123 is driven to move the lower mold first wedge member 121 in the left-right direction, the lower mold second wedge member 122, which is in contact with the lower mold first wedge member 121, is displaced up and down along the tapered portion. As a result, the position of the set lower mold pillar 114 is displaced, and the position of the lower mold cavity block 113 can be adjusted.

[0034] <2-4. Upper mold installation section> The upper mold mounting section 130 is the part on which the upper mold 140 is installed. The upper mold mounting section 130 mainly comprises an upper mold fixing base section 131, an upper mold mounting section 132, and a heater plate 133.

[0035] The upper mold fixing base portion 131 constitutes the upper part of the upper mold installation portion 130. The upper mold mounting portion 132 is the part to which the upper mold 140 is attached, and is provided below the upper mold fixing base portion 131. The upper mold mounting portion 132 can be formed by combining multiple members. For example, the upper mold mounting portion 132 is fitted with a support portion 132a that supports the upper mold 140 (upper mold base portion 141), which will be described later, from below. The heater plate 133 has the function of heating the upper mold 140 and is provided on the bottom surface of the upper mold mounting portion 132.

[0036] <2-5. Upper mold> The upper mold 140 constitutes the upper part of the molding die. The upper mold 140 mainly comprises an upper mold base 141, upper mold side blocks 142, upper mold cavity blocks 143, upper mold supports 145, and upper mold pillars 146. In this embodiment, as shown in Figure 4, a cal block 144 is positioned in the center of the upper mold 140, with upper mold cavity blocks 143 positioned to its left and right. The upper mold side blocks 142 are positioned to surround the upper mold cavity blocks 143 and the cal block 144.

[0037] The upper mold base portion 141 is a plate-shaped member that supports the upper mold side block 142. The outer circumference of the upper mold base portion 141 is supported from below by the support portion 132a described above. This allows the upper mold base portion 141 to move vertically relative to the upper mold mounting portion 130.

[0038] The upper mold side block 142 is provided on the lower surface of the upper mold base portion 141 and constitutes the side surface of the cavity C formed by the upper mold 140. The upper mold side block 142 is formed in a frame shape, thereby creating an opening at a position corresponding to the resin molded product (cavity C). In addition, an air vent groove 142a is formed in the upper mold side block 142.

[0039] The air vent groove 142a is provided to discharge air from inside the cavity C to the outside. The air vent groove 142a is formed at an appropriate position on the lower surface of the upper mold side block 142.

[0040] The upper mold cavity block 143 constitutes the upper surface of the cavity C formed by the upper mold 140. The upper mold cavity block 143 is located inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142) and is movable relative to the upper mold side block 142 in the vertical direction.

[0041] The cal block 144 is positioned opposite the pot block 112 of the lower mold 110 and constitutes the side surface of the cavity C formed by the upper mold 140. As shown in Figure 4, groove-shaped cal portions 144a and runner portions 144b are formed on the lower surface of the cal block 144 to guide the resin material into the cavity C. In Figures 2 and 4, the through hole (pot) of the pot block 112 is schematically shown to communicate with the cavity C, which will be described later, via the cal portion 144a and runner portion 144b, in order to easily understand the flow of resin.

[0042] The upper mold support 145 restricts the upward movement of the upper mold 140 by contacting the upper mold mounting section 130, thereby defining the position of the upper mold 140. The upper mold support 145 is fixed at multiple positions on the upper surface of the upper mold base section 141.

[0043] The upper mold pillar 146 is a member that extends upward from the upper mold cavity block 143. The lower end of the upper mold pillar 146 is fixed to the upper part of the upper mold cavity block 143 and extends upward through the upper mold base portion 141. Figure 2 shows the state in which the release film F is adsorbed onto the lower surface of the upper mold 140 (the surface that forms the cavity C).

[0044] <2-6. Disc springs> The disc spring 150 is a component that applies a downward force to the upper mold 140. The disc spring 150 is positioned between the lower surface of the upper mold mounting portion 130 (heater plate 133) and the upper surface of the upper mold 140 (upper mold base portion 141). Due to the biasing force of the disc spring 150, the upper mold 140 is always subjected to a force that moves away from the upper mold mounting portion 130 (downward).

[0045] <2-7. Upper Cavity Adjustment Mechanism> The upper cavity adjustment mechanism 160 has the function of adjusting the position of the upper cavity block 143. The upper cavity adjustment mechanism 160 comprises an upper cavity block holding member 161, an upper cavity block drive unit 162, a regulating member 163, an upper elastic member 164, an upper first wedge-shaped member 165, an upper second wedge-shaped member 166, and an upper wedge-shaped member drive unit 167.

[0046] The upper cavity block holding member 161 is a member that holds the upper cavity block 143 via the upper pillar 146. The upper cavity block holding member 161 is formed in the shape of a hollow frame when viewed from the front. The upper cavity block holding member 161 can be formed by combining multiple members (such as upper and lower plate-shaped members and multiple cylindrical members connecting the upper and lower plate-shaped members). The upper cavity block holding member 161 is positioned to penetrate the upper mold fixing base portion 131 vertically. The upper cavity block holding member 161 is also provided to be movable vertically relative to the upper mold fixing base portion 131. The upper end of the upper pillar 146 is fixed to the lower surface of the upper cavity block holding member 161. As a result, the upper cavity block holding member 161 can hold the upper cavity block 143 via the upper pillar 146.

[0047] The upper cavity block drive unit 162 moves the upper cavity block holding member 161 in the vertical direction (up and down direction). The upper cavity block drive unit 162 is formed by, for example, a servo motor or an air cylinder. The upper cavity block drive unit 162 is provided on the upper part of the upper cavity block holding member 161. By driving the upper cavity block drive unit 162, the upper cavity block holding member 161 (and consequently the upper cavity block 143) can be moved arbitrarily in the vertical direction relative to the upper mold installation part 130.

[0048] The restricting member 163 restricts the movement of the upper mold cavity block holding member 161 by contacting the upper mold cavity block holding member 161. The restricting member 163 can be formed by combining multiple members (such as plate-shaped members). The restricting member 163 includes an upper portion that straddles the upper mold cavity block holding member 161 from left to right, and a central portion that is positioned inside the upper mold cavity block holding member 161. The central portion of the restricting member 163 is positioned so as to be able to contact the lower part (bottom) of the upper mold cavity block holding member 161 from above. By contacting the lower part of the upper mold cavity block holding member 161 from above, the restricting member 163 can restrict the upward movement of the upper mold cavity block holding member 161. This allows the depth of the cavity C to be defined.

[0049] The upper elastic member 164 applies an upward force to the restricting member 163. The upper elastic member 164 can be formed, for example, from a compression coil spring. The upper elastic member 164 is positioned between the restricting member 163 and the upper mounting portion 132, and the biasing force of the upper elastic member 164 constantly applies an upward force to the restricting member 163.

[0050] The upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are a pair of members with tapered portions formed on their opposing surfaces. The upper mold second wedge-shaped member 166 is positioned below the upper mold first wedge-shaped member 165. The upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are positioned inside the upper mold cavity block holding member 161. More specifically, the upper mold first wedge-shaped member 165 and the upper mold second wedge-shaped member 166 are positioned between the upper mold fixing base portion 131 and the regulating member 163. The upper mold second wedge-shaped member 166 is fixed to the upper surface of the regulating member 163.

[0051] The upper wedge-shaped member drive unit 167 has the function of moving the upper first wedge-shaped member 165 in the horizontal direction (left-right direction). The upper wedge-shaped member drive unit 167 can be formed by, for example, a servo motor or an air cylinder. The upper wedge-shaped member drive unit 167 is connected to the upper first wedge-shaped member 165 via an appropriate power transmission member. By driving the upper wedge-shaped member drive unit 167, the upper wedge-shaped member drive unit 167 can be moved arbitrarily in the left-right direction.

[0052] With the above configuration, the upper cavity adjustment mechanism 160 can adjust the position of the upper cavity block 143. Specifically, when the upper cavity block drive unit 162 is driven to move the upper cavity block holding member 161 downward, a gap is created between the regulating member 163 and the lower part of the upper cavity block holding member 161. That is, the regulating member 163 can move up and down using this gap. In this state, when the upper wedge-shaped member drive unit 167 is driven to move the upper first wedge-shaped member 165 in the left-right direction, the upper second wedge-shaped member 166, which is in contact with the upper first wedge-shaped member 165, is displaced up and down along the tapered portion. In addition, the regulating member 163 is also displaced up and down together with the upper second wedge-shaped member 166. After adjusting the restricting member 163 to a predetermined position, the upper mold cavity block drive unit 162 is driven again to move the upper mold cavity block holding member 161 upward until it contacts the restricting member 163. By displacing the restricting member 163 vertically in this way, the position where the upward movement of the upper mold cavity block holding member 161 is restricted is shifted, thereby allowing the position of the upper mold cavity block 143 to be adjusted.

[0053] <2-8. Air vent opening and closing mechanism> The air vent opening / closing mechanism 170 has the function of opening and closing the air vent groove 142a that connects the cavity C to the outside. The air vent opening / closing mechanism 170 mainly comprises an air vent pin 171 and an air vent drive unit 172.

[0054] The air vent pin 171 closes the air vent groove 142a. More specifically, the air vent pin 171 is provided so as to be vertically movable in a through hole in the upper mold side block 142 that communicates with the air vent groove 142a.

[0055] The air vent drive unit 172 moves the air vent pin 171 in the vertical direction. The air vent drive unit 172 can be formed by, for example, a servo motor or an air cylinder. The air vent drive unit 172 is connected to the air vent pin 171 via an appropriate power transmission member. By driving the air vent drive unit 172, the air vent pin 171 can be moved arbitrarily in the vertical direction. For example, by moving the air vent pin 171 downward, the air vent groove 142a can be closed.

[0056] <2-9. Transfer Mechanism> The transfer mechanism 180 has the function of supplying resin material to cavity C. The transfer mechanism 180 mainly comprises a transfer drive unit 181, a plunger 182, and a plunger load measuring unit 183.

[0057] The transfer drive unit 181 is a drive source that moves the plunger 182, which will be described later, in the vertical direction (up and down direction). The transfer drive unit 181 can be formed by, for example, a servo motor or an air cylinder. The transfer drive unit 181 is provided on the lower mold movable base 101 below the pot block 112.

[0058] The plunger 182 is a component for supplying molten resin material to the cavity C. Therefore, the plunger 182 is capable of moving up and down within the pot block 112. The resin material is formed by melting the resin tablet T contained in the pot block 112.

[0059] The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 is the force with which the transfer drive unit 181 pushes the plunger 182. The plunger load measuring unit 183 can be formed by, for example, a load cell. The plunger load measuring unit 183 is provided between the transfer drive unit 181 and the plunger 182.

[0060] <2-10. Clamping Mechanism> The mold clamping mechanism 190 has the function of raising the lower mold 110 and clamping the lower mold 110 and the upper mold 140 together. The mold clamping mechanism 190 mainly comprises a fixed platen 191, a support column 192, a drive mechanism 193, and a clamp load measuring unit 194.

[0061] The fixed plate 191 is installed on the ground (installation surface) and is the part that supports other components. The lower mold 110 (lower mold installation part 100) is positioned on the upper part of the fixed plate 191 via a drive mechanism 193, which will be described later.

[0062] The support column 192 is a member that supports the upper mold 140 (upper mold installation section 130). The support column 192 extends upward from the fixing plate 191, and the upper mold fixing base section 131 of the upper mold installation section 130 is fixed to the upper part of the support column 192. As a result, the upper mold 140 (upper mold installation section 130) is positioned above the lower mold 110 (lower mold installation section 100).

[0063] The drive mechanism 193 has the function of moving the lower die 110 (lower die mounting section 100) in the vertical direction (up and down direction). The drive mechanism 193 can be formed by a drive source such as a servo motor and an appropriate power transmission mechanism. The drive mechanism 193 is positioned between the fixed platen 191 and the lower die mounting section 100. By driving the drive mechanism 193, the lower die mounting section 100 can be moved (raised and lowered) arbitrarily in the vertical direction. For example, by raising the lower die 110 toward the upper die 140 with the drive mechanism 193, the mold can be clamped. Also, by lowering the lower die 110 away from the upper die 140 with the drive mechanism 193, the mold can be opened.

[0064] The clamp load measuring unit 194 has the function of measuring the force (clamp load) applied when the lower mold 110 and the upper mold 140 are clamped together by the mold clamping mechanism 190, and is provided on the support column 192. The clamp load measuring unit 194 can be formed by, for example, a load cell or strain gauge, and can measure the clamp load based on the load applied to the support column 192.

[0065] Figure 2 shows the state after the substrate 2 and resin tablet T have been transported to the mold, and the lower mold 110 and upper mold 140 have been clamped together.

[0066] <3. Overview of the operation of the resin molding machine> Next, we will explain the operation of the resin molding apparatus configured as described above (method of manufacturing resin molded products) with reference to Figures 1 and 2.

[0067] In the supply module 10, the frame delivery unit 11 sends the substrate 2 housed in the in-magazine unit (and not shown) to the frame measurement unit 12. The frame measurement unit 12 measures the volume of the chips 2a on the received substrate 2 and then sends the substrate 2 to the frame supply unit 13. The frame supply unit 13 aligns the received substrate 2 appropriately and hands it over to the loader 17.

[0068] Furthermore, the resin delivery unit 14 sends the resin tablets T received from the stocker (not shown) to the resin measurement unit 15. The resin measurement unit 15 measures the weight of the received resin tablets T and then sends the resin tablets T to the resin supply unit 16. The resin supply unit 16 transfers the required number of received resin tablets T to the loader 17. The loader 17 transports the received substrate 2 and resin tablets T to the mold of the resin molding module 20.

[0069] In the resin molding module 20, the mold clamping mechanism 190 clamps the mold. Then, the resin tablet T is heated and melted by the heating section (not shown) of the mold, and the resulting molten resin is used to resin-seal the substrate 2. After resin sealing is complete, the mold clamping mechanism 190 opens the mold. Subsequently, the resin-sealed substrate 2 is released from the mold. Details of the operation of the resin molding module 20 will be described later.

[0070] Subsequently, the unloader 31 unloads the substrate 2 from the mold and places it in the substrate housing section 32 of the unloading module 30. At this time, any unnecessary parts of the resin-molded substrate 2 (such as excess resin, runners, etc.) are removed as appropriate. In this way, a resin-sealed substrate 2 (resin-molded product) is manufactured.

[0071] <4. Operation of the resin molding module> The operation of the resin molding module 20 will be described in detail below. In this embodiment, when resin molding is performed in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). This will be explained with reference to Figures 7 and 8. Figure 7 is a partial cross-sectional view of the resin molding module, and Figure 8 is a diagram illustrating the modeling of the cavity.

[0072] Prior to determining the resin moldability, the control unit 18 calculates and sets the following items. (1) Volume of resin tablet T The specific gravity of the resin tablet T to be used is input to the control unit 18, and the volume of the resin tablet T is calculated from the weight of the resin tablet T measured based on this input. Specifically, the following examples can be given.

[0073] The volume of the resin tablet T is measured in the resin measuring unit 15 of the supply module 10, as described above. The resin measuring unit 15 can measure the volume of the resin tablet T using any measuring instrument. An example of the resin measuring unit 15 is a weighing scale that measures the weight of the resin tablet T. The volume of the resin tablet T is calculated from the weight of the resin tablet T measured by the weighing scale and the specific gravity of the resin tablet T. The method for measuring the volume of the resin tablet T is not particularly limited, and it is possible to measure it using various other instruments. For example, it is possible to use various types of three-dimensional scanners, laser volumetric meters using laser light, etc.

[0074] (2) Volume of tip 2a The volume of the chip 2a on the substrate 2 is measured by the frame measurement unit 12 of the supply module 10, as described above. The frame measurement unit 12 can measure the volume of the chip 2a on the substrate 2 using any measuring instrument. An example of the frame measurement unit 12 is a volume meter for measuring the volume of the chip 2a on the substrate 2. The volume meter is a laser volume meter that measures the shape (and therefore the volume) of the chip 2a by detecting the distance to the chip 2a on the substrate 2 using laser light. The method for measuring the volume of the chip 2a is not particularly limited, and it is possible to measure it using various other instruments. For example, it is possible to use various types of three-dimensional scanners.

[0075] (3) The volume of cavity C, the resin filling rate, and the position of the plunger. The volume of cavity C is calculated based on the dimensions of each part (upper mold side block 142, upper mold cavity block 143, pot block 112, cal block 144, etc.) that are stored in advance, and the vertical position of the upper mold cavity block 143. The vertical position of the upper mold cavity block 143 can be determined based on the amount of drive of the upper mold wedge-shaped member drive unit 167, etc. Based on the calculated volume of cavity C and the measured volumes of the resin tablet T and tip 2a, the control unit 18 can calculate what percentage of the volume of cavity C is filled with molten resin material (resin filling rate) at which point the plunger 182 has risen.

[0076] In this embodiment, as shown in Figure 7, the control unit 18 calculates the positions of the plunger 182 where the resin filling rate of the cavity C is 0%, 25%, 50%, 75%, and 100% (hereinafter referred to as positions T0, T25, T50, T75, and T100, respectively). The distance represented by T100-T0 corresponds to L in this invention.

[0077] The position T0 of the plunger 182 is determined based on the volume calculated from the weight of the resin tablet T, as described above. That is, if the volume of the resin tablet T is large, the position T0 is set lower, and if the volume is small, it is set higher. Also, the position T100 of the plunger 182 is the position where the resin filling is completed, and is therefore set based on the volume of the cavity C calculated as described above.

[0078] Furthermore, the control unit 18 is pre-programmed with the position information described above. In this embodiment, five positions (T0, T25, T50, T75, and T100) are set, but the coordinates and number of these positions can be appropriately set according to the molded product being manufactured. The same applies to Fn and Vn, which will be described later.

[0079] (4) Determination of resin filling speed In this embodiment, the movement speed of the plunger 182 is adjusted according to the resin filling rate. This makes it possible to suppress occurrences such as incomplete filling of the resin material.

[0080] In this embodiment, as shown in Figure 7, there are four sections A1 to A4 between T0 and T100, and the resin filling rate (F1 to F4; collectively referred to as Fn) within the cavity C is determined in these four sections A1 to A4. Such resin filling rates Fn can be determined in advance by experiments or numerical analysis. For example, such resin filling rates Fn can be determined by determining the presence or absence of wire flow and chip shift based on the resin flow rate using a test chip-mounted substrate, based on experiments or numerical analysis, or by determining it empirically. Alternatively, the resin filling rate can be determined from the viewpoint of the curing characteristics of the resin used.

[0081] (5) Calculation of the plunger's movement speed In this embodiment, the travel speed of the plunger 182 is calculated as follows. This will be explained with reference to Figure 8.

[0082] In this embodiment, the cavity is represented by a simple rectangular parallelepiped model as shown in Figure 8. That is, this model assumes that the resin is uniformly filled into the cavity C as shown in Figure 8(b) from the initial state shown in Figure 8(a). In this cavity C, the length from the pod side (the side closer to the plunger 182) to the air vent side (the side further away from the plunger 182) is denoted as W (the length in the direction in which the resin material flows within the cavity C). Then, since it can be assumed that the time it takes for the plunger 182 to move is the same as the time it takes for the resin to flow within the cavity C, if the resin filling rate F is determined, the moving speed V of the plunger 182 can be calculated using the following equation (1). V = F × (T100 - T0) / W (1)

[0083] In this embodiment, as described above, the resin filling speed is set in four sections A1 to A4, so the movement speed Vn (n=4) in each section A1 to A4 can be calculated as shown in the following equations (2) to (5). V1 = F1 × (T100 - T0) / W (2) V2 = F2 × (T100 - T0) / W (3) V3 = F3 × (T100 - T0) / W (4) V4 = F4 × (T100 - T0) / W (5) In other words, in this embodiment, the movement speed of the plunger 182 is different in the four sections A1 to A4. Furthermore, equations (1) to (5) can sometimes be combined and expressed in the following equation (6). Vn = Fn × (T100 - T0) / W (6) Equations (2) to (5) can also be rewritten as equations (7) to (10) below. V1 = F1 × (T25 - T0) / (W25 - W0) (7) V2=F2×(T50-T25) / (W50-W25) (8) V3=F3×(T75-T50) / (W75-W50) (9) V4=F4×(T100-T75) / (W100-W75) (10) Here, W0 is the position of the pod-side end of cavity C, W100 is the position of the air vent-side end of cavity C, and W25, W50, and W75 are the positions where the resin filling speed within the cavity switches to F2, F3, and F4, respectively.

[0084] Figure 9 shows an example of the plunger's movement speed Vn. In the example in Figure 9, the movement speed Vn decreases as the plunger 182 rises. Furthermore, the rate of change of the movement speed Vn decreases as the plunger 182 rises. In other words, in this example, the movement speeds V1 to V4 of the plunger are decreased as the resin filling into the cavity C progresses. Since the viscosity of the resin decreases over time, it is thought that increasing the resin filling rate under such circumstances could cause the resin to break apart, resulting in gaps, i.e., unfilled areas or voids. Therefore, in the example in Figure 9, the movement speed of the plunger 182 is reduced as time progresses. However, this is just one example and can be modified as appropriate. Also, the numerical values ​​shown on the vertical axis of Figure 9 are included to show an example of the rate of change of movement speed and do not represent a specific speed.

[0085] (6) Flow of resin molding Next, the resin molding process will be explained with reference to the flowchart shown in Figure 10. First, as described above, the resin filling rate Fn corresponding to a predetermined resin filling rate in the cavity C is determined (step S1). Following this, as described above, the plunger movement speed Vn is calculated (step S2).

[0086] Next, the volumes of the resin tablet T and the chip 2a are obtained (step S3).

[0087] Next, the substrate 2 and the resin tablet T are transported to the molds of the resin molding module 20. Specifically, the substrate 2 is placed on the lower mold 110, and the resin tablet T is placed inside the pot of the pot block 112. Following this, the lower mold 110 and the upper mold 140 are clamped together by the clamping mechanism 190 (step S4). Specifically, the lower mold 110 is raised by the clamping mechanism 190, and the lower mold 110 comes into contact with the upper mold 140 from below. This closes the cavity C. At this time, as shown in Figure 11, the upper mold 140 rises to a position where the upper mold support 145 comes into contact with the upper mold mounting section 130 (heater plate 133).

[0088] Next, the plunger 182 is raised (step S5). First, the plunger 182 is raised from position T0 to position T25 at the speed V1 described above. Then, when the position of the plunger 182 reaches position T25 (the position where the resin filling rate is 25%) (YES in step S6), the movement speed of the plunger 182 is adjusted (step S7). That is, the movement speed of the plunger 182 is changed to the movement speed V2 for the next movement section (positions T25 to T50). In this way, the movement speed of the plunger 182 is changed each time the movement section is changed (step S7), and when the position of the plunger 182 reaches position T100 (the position where the resin filling rate is 100%) (YES in step S8), the plunger 182 is stopped.

[0089] Next, the plunger 182 is lowered (step S10). Then, the mold clamping mechanism 190 opens the lower mold 110 and the upper mold 140 (step S11). After that, the substrate 2, which has been resin molded (resin sealed), is discharged from the mold. The discharged substrate 2 is transported to the discharge module 30.

[0090] <5. Features> According to this embodiment, the following effects can be obtained. (1) Regardless of the number of chips 2a on the substrate 2, if the movement speed of the plunger 182 is kept the same, the rate at which the resin material fills the cavity C changes. For example, in substrate 2 with a large number of chips 2a, the resin material filling time will be shorter. In other words, the rate at which the resin fills the cavity C will be faster. When the rate at which the resin fills the cavity C is different in this way, there is a problem that the quality of the molded product will not be consistent. For example, if the resin filling rate is too fast, the wire may flow or the chips may shift. On the other hand, if the resin filling rate is too slow, some of the resin may harden and leave some areas unfilled.

[0091] Therefore, in this embodiment, the volume of the space in cavity C that can be filled with resin material is calculated based on the volume of the chip 2a, and an appropriate filling speed of the resin material flowing through cavity C is set in advance based on this volume value. In other words, a resin filling speed suitable for the calculated volume of cavity C is set in advance. Then, the movement speed of the plunger 182 is set so that the resin material flows through cavity C at the set filling speed. As a result, the quality of resin molding can be improved. In particular, quality can be maintained or improved when there are constraints on the resin filling time from the standpoint of the curing characteristics of the resin.

[0092] (2) In this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured volume of the resin tablet T and the chip 2a of the substrate 2. Therefore, the resin filling rate of the cavity C can be accurately determined regardless of variations in the volume of each resin tablet T.

[0093] (3) By adjusting the movement speed of the plunger 182 according to the resin filling rate, as shown in V1 to V4, the occurrence of unfilled resin material can be suppressed. Specifically, the resin material flowing in the cavity C flows through areas that are relatively easy to flow (for example, areas of the substrate 2 where the chip 2a is not provided) and areas that are relatively difficult to flow (for example, areas of the substrate 2 where the chip 2a is provided). Therefore, it is sometimes desirable to adjust the flow rate in order to improve the circulation of the resin. Thus, by adjusting the movement speed of the plunger 182 according to the resin filling rate as described above, the circulation of the resin can be improved.

[0094] <6. Variation> Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.

[0095] <6-1> In the above embodiment, the plunger's movement speed is calculated using the model shown in Figure 8 and equations (1) to (5) (or equations (7) to (10)), but the embodiment is not limited to this. For example, consider a case where the cavity has the shape shown in Figure 12. This cavity C has three regions: the region where the tip 2a is located (tip region B), the pod-side region where the resin is injected and reaches tip region B (resin injection region A), and the air vent-side region where excess resin flows to prevent unfilled areas in tip region B (flow cavity region C).

[0096] In the cavity model shown in Figure 12, the tip region B is formed in the shape of a rectangular parallelepiped, while the resin injection region A and the flow cavity region C are formed in the shape of a triangular prism (with a right-angled triangle in the longitudinal cross-section). The lengths in the direction in which the resin is filled in the resin injection region A, tip region B, and flow cavity region C are each defined as X. A ,X B ,X CIt is defined as such (these may also be denoted as WA, WB, and WC).

[0097] In this model, the position and speed of the plunger in each region can be set as follows. (1) The position of the plunger corresponding to the resin injection region A T0~T0+(T100-T0)*X A / (2X B +X A +X C ) Since chip 2a is not placed in this region, the moving speed of plunger 182 can be arbitrary.

[0098] (2) The position of the plunger corresponding to the chip region B T0+(T100-T0)*X A / (2X B +X A +X C )~T0+(T100-T0)*(X A +2X B ) / (2X B +X A +X C ) The moving speed (constant speed) VB of the plunger in this region is as follows. VB=2FB*(T100-T0) / (2X B +X A +X C ) However, FB is the resin filling speed in the chip region B

[0099] (3) The position of the plunger corresponding to the flow cavity region C T0+(T100-T0)*(X A +2X B ) / (2X B +X A +X C )~T100 The moving speed of the plunger can be any speed such that the moving speed becomes 0 when the plunger reaches the position T100.

[0100] Furthermore, immediately after the plunger 182 begins to rise, it is necessary to extrude the resin that fills the runner section; therefore, the initial position of the plunger 182 is below position T0 (the position where the resin filling rate in the cavity is 0%). Also, the movement speed of the plunger 182 from this initial position to position T0 can be any value because the resin is not yet flowing through the tip region B.

[0101] The above model can be used when the resin injection area A and flow cavity area C, where no chips are placed, cannot be ignored during resin filling.

[0102] The setting of the plunger's movement speed described above is just one example, and various modifications are possible. In other words, the optimal resin filling rate within the cavity should be set based on the volume of space in which the resin material can be filled, and the movement speed of the plunger 182 should be set accordingly.

[0103] <6-2> As shown in Figure 1, when there is one plunger 182 and multiple cavities C (two in Figure 1), the volume value of the space in each cavity C that can be filled with resin material is calculated, and these are averaged to set the average volume value. Based on this average volume value, the resin filling speed and the plunger movement speed can then be set.

[0104] <6-3> In the above embodiment, the movement speed of the plunger 182 is adjusted according to the resin filling rate, but it is not necessarily required to set multiple movement speeds for the plunger; a constant speed can be set between positions T0 and T100. In other words, the resin filling speed can also be kept constant.

[0105] <6-4> In the above embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured volume of the resin tablet T and the chip 2a of the substrate 2. However, calculated values ​​can also be used instead of measured values.

[0106] <6-5> The resin molding apparatus shown in the above embodiment is just one example, and various modifications are possible as long as it is a resin molding apparatus that fills the cavity with resin using a plunger 182 and can appropriately change the movement speed of the plunger 182. In addition, in the above embodiment, the substrate 2 on which the chip 2a is mounted is placed in the lower mold 110 as the first mold, but the substrate 2 may also be placed in the upper mold 140 and resin molding performed. That is, the first mold of the present invention can be the upper mold 140 and the second mold can be the lower mold 110.

[0107] Several embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Accordingly, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0108] (Note) With regard to the embodiments described above, the following additional information is disclosed. Note 1. Type 1, which can accommodate a substrate on which electronic components are mounted, A second type that forms a cavity between itself and the first type, A transfer mechanism that supplies resin material to the cavity by a plunger, With the substrate placed in the cavity, a control unit controls the movement speed of the plunger based on the volume of the space in the cavity that can be filled with resin material, A resin molding apparatus equipped with the following features.

[0109] Note 2. The resin material is formed by melting a solid resin material placed in the resin molding apparatus. The control unit, Based on the weight value of the solid resin material, the initial position T0 of the plunger is set. Based on the volume value, the end position T100 of the plunger is set. Based on the volume value of the cavity, the filling rate of the resin material flowing through the cavity is set. The movement speed of the plunger is controlled based on the filling speed. The resin molding apparatus described in Appendix 1.

[0110] Note 3. The length in the cavity in the direction in which the resin material is injected is W, Based on the volume value, the filling rate of the resin material in the cavity is calculated as F. Let L be the distance the plunger travels from the initial position T0 to the terminal position T100. In this case, the moving speed V of the plunger is calculated by the following formula (1), as described in Appendix 2 of the resin molding apparatus. V = F × L / W (1)

[0111] Note 4. The resin material is formed by melting a solid resin material placed in the resin molding apparatus. The control unit, Based on the weight value of the solid resin material, the initial position T0 of the plunger is set. Based on the volume value, the end position T100 of the plunger is set. The movement range of the plunger corresponding to filling the element region in the cavity where the electronic element is arranged with the resin material is set between position T0 and position T100. Based on the volume value of the element region of the cavity, the filling rate of the resin material flowing through the element region of the cavity is set. Based on the filling rate in the element region, the movement speed of the plunger is controlled. The resin molding apparatus described in Appendix 1.

[0112] Note 5. The length in the direction in which the resin material is injected in the element region of the cavity is WB, In the direction in which the resin is injected, the lengths of the upstream and downstream sides of the element region of the cavity are defined as WA and WC, respectively. Based on the aforementioned transfer time, the filling rate of the resin material in the element region of the cavity is calculated as FB, The travel distance of the plunger in the aforementioned travel section is LB, In this case, the moving speed VB of the plunger in the moving section is calculated by the following formula (2), as described in Appendix 4 of the resin molding apparatus. VB = 2FB × LB / (2WB + WA + WC) (2)

[0113] Note 6. When the plunger reaches a position corresponding to a predetermined resin filling rate in the cavity, the control unit adjusts the movement speed of the plunger. A resin molding apparatus as described in any of the appendices 1 to 5.

[0114] Note 7. Type 1, which can accommodate a substrate on which semiconductor chips are mounted, A second type that forms a cavity between itself and the first type, A transfer mechanism that supplies resin material to the cavity by a plunger, A method for manufacturing a resin molded product in a resin molding apparatus equipped with, The steps include placing the substrate in the first type, The steps include clamping the second type and the first type together, The steps include: supplying the resin material to the cavity by moving the plunger; Equipped with, In the step of supplying the resin material to the cavity, the movement speed of the plunger is controlled based on the volume value of the space in the cavity that can be filled with the resin material. A method for manufacturing resin molded products. [Explanation of Symbols]

[0115] C Cavity 182 Plunger 2 Package substrates 2a chip

Claims

1. A resin molding apparatus, Type 1, which can accommodate a substrate on which electronic components are mounted, A second type that forms a cavity between itself and the first type, A transfer mechanism that supplies resin material to the cavity by a plunger, With the substrate placed in the cavity, a control unit controls the movement speed of the plunger based on the volume of the space in the cavity that can be filled with resin material, Equipped with, The resin material is formed by melting a solid resin material placed in the resin molding apparatus. The control unit, Based on the weight value of the solid resin material, the initial position T0 of the plunger is set. Based on the volume value, the end position T100 of the plunger is set. Based on the volume value of the cavity, the filling rate of the resin material flowing through the cavity is set. Based on the filling rate, the movement speed of the plunger is controlled. Resin molding equipment.

2. The length in the cavity in the direction in which the resin material is injected is W, Based on the volume value, the filling rate of the resin material in the cavity is calculated as F. Let L be the distance the plunger travels from the initial position T0 to the terminal position T100. In this case, the moving speed V of the plunger is calculated by the following formula (1), as described in claim 1, for the resin molding apparatus. V=F×L / W (1)

3. A resin molding apparatus, Type 1, which can accommodate a substrate on which electronic components are mounted, A second type that forms a cavity between itself and the first type, A transfer mechanism that supplies resin material to the cavity by a plunger, With the substrate placed in the cavity, a control unit controls the movement speed of the plunger based on the volume of the space in the cavity that can be filled with resin material, Equipped with, The resin material is formed by melting a solid resin material placed in the resin molding apparatus. The control unit, Based on the weight value of the solid resin material, the initial position T0 of the plunger is set. Based on the volume value, the end position T100 of the plunger is set. The movement section of the plunger corresponding to filling the element region in the cavity where the electronic element is arranged with the resin material is set between position T0 and position T100. Based on the volume value of the element region of the cavity, the filling rate of the resin material flowing through the element region of the cavity is set. Based on the filling rate in the element region, the movement speed of the plunger is controlled. Resin molding equipment.

4. The control unit adjusts the movement speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate in the cavity. The resin molding apparatus according to claim 1.

5. The first type allows for the placement of a substrate with semiconductor chips mounted on it, A second type that forms a cavity between itself and the first type, A transfer mechanism that supplies resin material to the cavity by a plunger, A method for manufacturing a resin molded product in a resin molding apparatus equipped with, The steps include placing the substrate in the first type, The steps include clamping the second type and the first type together, The steps include: supplying the resin material to the cavity by moving the plunger; Equipped with, The resin material is formed by melting a solid resin material placed in the resin molding apparatus. In the step of supplying the resin material to the cavity, Based on the weight value of the solid resin material, the initial position T0 of the plunger is set. Based on the volume value of the space in the cavity that can be filled with resin material, the end position T100 of the plunger is set. Based on the volume value, the filling rate of the resin material flowing through the cavity is set. Based on the filling rate, the movement speed of the plunger is controlled. A method for manufacturing resin molded products.

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