Coated parts and methods for manufacturing coated parts

Abstract

To provide a method for producing a coated component regardless of the heat resistance of an electronic component.SOLUTION: The present invention provides a method for producing a coated component by applying a coating to an electronic component. The method includes the steps for: applying a coating agent containing polyolefin to an electronic component with a siloxane-containing member so as to cover the member; and chemically bonding the siloxane and polyolefin through oxygen by emitting light of a specific wavelength to the electronic component with the coating agent applied thereto.SELECTED DRAWING: Figure 1

Description

Technical Field

[0004] ,

[0006] , , , , , ,

[0005] , , , , , ,

[0001] The present disclosure relates to a coated component obtained by coating an electronic component, a method for manufacturing the coated component, and the like.

Background Art

[0002] Patent Document 1 discloses a method for manufacturing a coated component provided with a curable coating having low sulfur gas permeability. In the manufacturing method described in this Patent Document 1, first, a composition containing a polyolefin and a siloxane is applied to an electronic component. Next, the electronic component after the composition is applied is heated to cause the composition to undergo a curing reaction. The reaction product generated by this curing reaction becomes a protective film for the electronic component, and the electronic component is coated.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the manufacturing method described in the above Patent Document 1, in order to generate a reaction product (to be attached as a coating) from a composition containing a polyolefin and a siloxane, a step of heating ( baking) the composition is required. Therefore, in this manufacturing method, depending on the heat resistance of the electronic component, it may not be possible to apply a coating.

[0005] The present disclosure has been made in view of the above problems, and an object thereof is to provide a method for manufacturing a coated component without being affected by the heat resistance of an electronic component, and the coated component.

Means for Solving the Problems

[0006] To solve the above problems, one aspect of the disclosed technology is a method for manufacturing a coated component, which comprises the steps of: applying a coating agent containing polyolefin to an electronic component having a member containing siloxane so as to cover the member; and irradiating the electronic component coated with the coating agent with light of a specific wavelength to chemically bond the siloxane and the polyolefin via oxygen. [Effects of the Invention]

[0007] According to this disclosure, coated components can be manufactured regardless of the heat resistance of the electronic component by chemically bonding the siloxane contained in the electronic component material and the polyolefin contained in the coating agent via oxygen. [Brief explanation of the drawing]

[0008] [Figure 1] Flowchart illustrating the steps of a method for manufacturing a coated component according to one embodiment of the present disclosure. [Figure 2] Conceptual diagram of the manufacturing method for coated parts. [Figure 3] Cross-sectional view of an electronic component (LED) that has been coated. [Modes for carrying out the invention]

[0009] The method for manufacturing coated components according to this disclosure involves chemically bonding a siloxane originally contained in the electronic component material with a coating agent containing polyolefin applied to the electronic component via oxygen. This makes it possible to coat electronic components using a coating agent that does not contain siloxane. Hereinafter, one embodiment of this disclosure will be described in detail with reference to the drawings.

[0010] <Embodiment> Figure 1 is a flowchart illustrating the steps of a method for manufacturing a coated component according to one embodiment of this disclosure. Figure 2 is an illustrative diagram illustrating the state of electronic components and the like at each step shown in Figure 1.

[0011] In this embodiment, an example is described in which an electronic component 200 mounted on a substrate 100 (Figure 2(a)) is made into a coated component by applying a coating treatment to the electronic component 200. Note that the substrate 100 on which the electronic component 200 is mounted is not particularly limited.

[0012] (Step S11) In step S11, one or more electronic components 200 that are to be coated are mounted on the substrate 100 (Figure 2(b)). In this embodiment, the electronic component 200 is a component that includes a siloxane-containing material. For example, as shown in Figure 3, a surface-mount LED in which a chip 220 is sealed with a material 210 such as a resin (silicone) containing a siloxane-containing phosphor can be shown as the electronic component 200.

[0013] Once the mounting of the electronic components 200 onto the substrate 100 is complete, the process proceeds to step S12.

[0014] (Process S12) In step S12, the coating agent 300 is applied to the substrate 100 so as to cover the surface of the electronic components 200 mounted on the substrate 100 (Figure 2(c)). In this embodiment, the coating agent 300 is a coating agent containing polyolefin. Figure 3 shows the state of the electronic components 200 after the coating agent 300 has been applied.

[0015] At the end of step S12, there is a gap between the siloxane-containing component 210 (silicone) of the electronic component 200 and the polyolefin-containing coating agent 300 applied on top of the component 210, and oxygen (air) is present in this gap. This image is represented by the structural formula in [Chemical Formula 1] below.

[0016] [ka]

[0017] When the application of the coating agent 300 to the substrate 100 is completed, the process proceeds to step S13.

[0018] (Step S13) In step S13, light of a specific wavelength is irradiated from the light source 400 toward the coating agent 300 applied to the substrate 100 ((c) in FIG. 2). The light of the specific wavelength generated by the light source 400 in the present embodiment is non-visible light having a wavelength of 380 nm or less. As an example, a black light can be shown as the light source 400.

[0019] When the light of this specific wavelength is irradiated toward the coating agent 300, the double bond of oxygen is cleaved by the photoelectric effect of light energy. This image is represented by the structural formula in the following [Chemical Formula 2].

[0020] [Chemical Formula]

[0021] Then, the oxygen with the double bond cleaved forms a single bond with each of the member 210 containing siloxane (silicone) and the coating agent 300 containing polyolefin. This image is represented by the structural formula in the following [Chemical Formula 3].

[0022] [Chemical Formula]

[0023] In this way, by irradiating the coating agent 300 with light of a specific wavelength from the light source 400, the siloxane contained in the member 210 and the polyolefin contained in the coating agent 300 are chemically bonded (oxygen bonding) via oxygen.

[0024] [Function and Effect] As described above, according to this disclosure, a coated component is manufactured by applying a coating agent 300 containing polyolefin to an electronic component 200 having a siloxane-containing member 210 so as to cover the member 210, and then irradiating the coated electronic component 200 with light of a specific wavelength from a light source 400, thereby chemically bonding the siloxane and polyolefin via oxygen. This manufacturing method makes it possible to manufacture a coated component regardless of the heat resistance of the electronic component 200.

[0025] Furthermore, in the coated component of this disclosure, the electronic component 200 is coated with a coating agent 300 that is oxygen-bonded to the member 210. Therefore, it is possible to prevent the silver used in the electronic component 200, such as an LED, from corroding due to sulfur-containing gases (exhaust gas, hydrogen sulfide, etc.). This makes it possible to suppress the occurrence of reduced light output or failure of the LED due to sulfur corrosion.

[0026] Furthermore, according to the method for manufacturing coated components of this disclosure, since it is only necessary to apply a coating agent 300 containing only polyolefin (and not siloxane) to the electronic component 200, it is expected that the thickness of the coating can be reduced.

[0027] Furthermore, the manufacturing method for coated components described herein eliminates the need for the conventional heating process (baking process) of the substrate 100, thus offering various benefits such as a reduction in the size of manufacturing equipment, a shortening of the manufacturing period, and a reduction in manufacturing costs. [Industrial applicability]

[0028] The technology disclosed herein can be used when it is desired to manufacture coated components regardless of the heat resistance of the electronic component. [Explanation of symbols]

[0029] 100 circuit boards 200 Electronic Components 210 components 220 chips 300 coating agent 400 light sources

Claims

1. A method for manufacturing coated components by applying a coating to electronic components, A step of applying a coating agent containing polyolefin to an electronic component that includes a siloxane-containing member, so as to cover the member, and A method for manufacturing a coated component, comprising the step of chemically bonding the siloxane and the polyolefin via oxygen by irradiating the electronic component coated with the coating agent with light of a specific wavelength.

2. The method for manufacturing a coated component according to claim 1, wherein the electronic component is an LED in which a chip is sealed with a resin containing a phosphor containing the siloxane as the material.

3. The method for manufacturing a coated component according to claim 1 or 2, wherein the light of a specific wavelength generated by the light source is invisible light with a wavelength of 380 nm or less.

4. The method for manufacturing a coated part according to claim 1 or 2, wherein the coating agent does not contain the siloxane.

5. Coated components are electronic components that have been coated, A coated component in which the siloxane in a siloxane-containing member of the electronic component and the polyolefin in a coating agent containing a polyolefin applied to cover the member are chemically bonded via oxygen.

Images