Thermally conductive resin composition and thermally conductive sheet using the same

JP7863419B2Active Publication Date: 2026-05-21SEKISUI CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2022-01-18
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing thermally conductive resin compositions used in semiconductor devices face challenges with heat resistance reliability, particularly when exposed to high temperatures, due to inhibition of curing by impurities in thermally conductive fillers and oxidative degradation, leading to insufficient thermal conductivity and degradation of silicone resins.

Method used

Incorporating a specific alkoxysiloxane compound and a hindered phenol antioxidant with an ester bond into an addition-reaction type silicone resin composition, along with a thermally conductive filler and an alkoxysilane compound, to enhance heat resistance and thermal conductivity.

Benefits of technology

The resulting thermally conductive resin composition exhibits improved heat resistance reliability and thermal conductivity, maintaining performance in high-temperature environments.

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Patent Text Reader

Abstract

To provide a thermally conductive resin composition having excellent heat-resistant durability and a thermally conductive sheet including the same.SOLUTION: A thermally conductive resin composition contains an addition-reactive silicone resin, a thermally conductive filler, an alkoxysilane compound, a specific alkoxy siloxane compound illustrated by a compound having the following structure, and a hindered phenolic antioxidant having an ester bond.SELECTED DRAWING: Figure 1
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