Resin composition, cured product, laminate, method for manufacturing a cured product, method for manufacturing a laminate, method for manufacturing a semiconductor device, and semiconductor device
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJIFILM CORP
- Filing Date
- 2022-06-27
- Publication Date
- 2026-05-21
AI Technical Summary
Existing resin compositions for forming cured products in semiconductor devices face challenges in achieving excellent rectangularity of the pattern due to uneven cyclization and diffusion of amines, leading to decreased pattern solubility and adhesion.
A resin composition containing a base generator with an α,β-unsaturated ketone group that generates a tertiary amine through intramolecular cyclization, suppressing polymerization reactions and enhancing amine diffusibility, resulting in improved pattern rectangularity and adhesion.
The resin composition achieves superior rectangularity and elongation at break of the cured product, with enhanced chemical resistance and adhesion to metals, by using a base generator that forms tertiary amines with reduced solvent solubility and polymerization reactivity.
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