Optical isolator and optical transmission circuit module

The optical isolator with pre-bonded isolator chips and magnets on a transparent substrate simplifies assembly and reduces costs by enabling precise mounting in a single step, addressing the complexity and space issues of existing isolators in laser modules.

JP7864675B2Active Publication Date: 2026-05-25SHIN ETSU CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SHIN ETSU CHEMICAL CO LTD
Filing Date
2023-11-08
Publication Date
2026-05-25

AI Technical Summary

Technical Problem

Existing optical isolators in laser modules with multiple optical paths require complex assembly processes due to the need for precise positioning of isolator chips and magnets, leading to increased costs and space usage.

Method used

An optical isolator with multiple optical paths, where isolator chips and magnets (if required) are pre-bonded to a transparent substrate, allowing for high-precision mounting in a single step, reducing assembly complexity and space requirements.

Benefits of technology

The solution enables high-precision mounting of isolator chips without compromising optical properties, simplifying assembly and reducing costs by eliminating the need for additional space for isolator chips and magnets.

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Abstract

To provide an optical isolator which is inserted into a laser module having a plurality of optical paths, and in which an isolator chip is not disposed in a space other than a translucent section, thus enabling the process of assembling the isolator chip to be simplified.SOLUTION: The present invention is an optical isolator with two or more optical paths, the optical isolator comprising an isolator chip in which one or more polarizers and one or more Faraday rotators are integrally joined to each other in each of the optical paths; the isolator chip and a substrate being joined and fixed together; the substrate being a translucent substrate; and light passing through the optical paths being transmitted through the isolator chip and the translucent substrate.SELECTED DRAWING: Figure 1
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