Optical isolator and optical transmission circuit module
The optical isolator with pre-bonded isolator chips and magnets on a transparent substrate simplifies assembly and reduces costs by enabling precise mounting in a single step, addressing the complexity and space issues of existing isolators in laser modules.
Patent Information
- Application Number
- JP2023191101
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-11-08
- Publication Date
- 2026-05-25
- Estimated Expiration
- 2043-11-08
AI Technical Summary
Existing optical isolators in laser modules with multiple optical paths require complex assembly processes due to the need for precise positioning of isolator chips and magnets, leading to increased costs and space usage.
An optical isolator with multiple optical paths, where isolator chips and magnets (if required) are pre-bonded to a transparent substrate, allowing for high-precision mounting in a single step, reducing assembly complexity and space requirements.
The solution enables high-precision mounting of isolator chips without compromising optical properties, simplifying assembly and reducing costs by eliminating the need for additional space for isolator chips and magnets.
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Abstract
Citation Information
Patent Citations
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