Sensors and sensor systems

Abstract

To provide a sensor and a sensor system that can improve characteristics.SOLUTION: A sensor comprises an element portion including a first base and a first element. The first element includes a first fixed member fixed to the first base, a first resistance connecting member supported by the first fixed member, a first conductive connecting member supported by the first fixed member, and a first film portion supported by the first resistance connecting member and the first conductive connecting member. A first gap is provided between the first base and the first film portion. The first film portion includes a first resistance layer and a first conductive layer. The first resistance connecting member includes a first resistance wiring electrically connected to the first resistance layer. The first conductive connecting member includes a first conductive wiring electrically connected to the first conductive layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to a sensor and a sensor system.

Background Art

[0002] For example, there is a sensor for detecting gas. In the sensor, improvement of characteristics is desired.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of the present invention provide a sensor and a sensor system capable of improving characteristics.

Means for Solving the Problems

[0005] According to an embodiment of the present invention, the sensor includes an element portion including a first substrate and a first element. The first element includes a first fixing member fixed to the first substrate, a first resistance connection member supported by the first fixing member, a first conductive connection member supported by the first fixing member, and a first film portion supported by the first resistance connection member and the first conductive connection member. A first gap is provided between the first substrate and the first film portion. The first film portion includes a first resistance layer and a first conductive layer. The first resistance connection member includes a first resistance wiring electrically connected to the first resistance layer. The first conductive connection member includes a first conductive wiring electrically connected to the first conductive layer.

Brief Description of the Drawings

[0006] [Figure 1] FIG. 1 is a schematic plan view illustrating a sensor according to the first embodiment. [Figure 2] Figures 2(a) and 2(b) are schematic cross-sectional views illustrating a sensor according to the first embodiment. [Figure 3] Figures 3(a) to 3(c) are schematic cross-sectional views illustrating a sensor according to the first embodiment. [Figure 4] Figures 4(a) and 4(b) are schematic cross-sectional views illustrating a part of the sensor according to the first embodiment. [Figure 5] Figure 5 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Modes for carrying out the invention]

[0007] The embodiments of the present invention will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. In this specification and in each figure, elements similar to those described above are denoted by the same reference numerals with respect to previously shown figures, and detailed explanations are omitted as appropriate.

[0008] (First Embodiment) Figure 1 is a schematic plan view illustrating a sensor according to the first embodiment. Figures 2(a) and 2(b) are schematic cross-sectional views illustrating a sensor according to the first embodiment. Figures 3(a) to 3(c) are schematic cross-sectional views illustrating a sensor according to the first embodiment.

[0009] Figure 2(a) is a cross-sectional view of Figure 1 taken along the line A1-A2. Figure 2(b) is a cross-sectional view of Figure 1 taken along the line A3-A4. Figure 3(a) is a cross-sectional view of Figure 1 taken along the line B1-B2. Figure 3(b) is a cross-sectional view of Figure 1 taken along the line B3-B4. Figure 3(c) is a cross-sectional view of Figure 1 taken along the line B5-B6.

[0010] As shown in Figures 1, 2(a), and 2(b), the sensor 110 according to this embodiment includes an element section 10E. The element section 10E includes a first substrate 51s and a first element 10A.

[0011] The first substrate 51s may include, for example, a silicon substrate. The first substrate 51s may include electronic circuits such as transistors.

[0012] The first element 10A includes a first fixing member 21F fixed to the first substrate 51s, a first resistive connecting member 21aC supported by the first fixing member 21F, a first conductive connecting member 21bC supported by the first fixing member 21F, and a first film portion 11F supported by the first resistive connecting member 21aC and the first conductive connecting member 21bC.

[0013] A first gap g1 is provided between the first base 51s and the first membrane portion 11F. The first direction D1 from the first base 51s to the first fixing member 21F is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. The direction perpendicular to both the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0014] The first base 51s includes a first surface 51F. The first surface 51F is aligned with the XY plane. The first fixing member 21F is fixed to the first surface 51F.

[0015] The first film portion 11F includes a first resistive layer 11a and a first conductive layer 11b. In this example, the first film portion 11F further includes a first conductive member 11c. The first conductive member 11c will be described later.

[0016] As shown in Figures 2(b) and 3(b), the first resistive connecting member 21aC includes a first resistive wiring 11aL electrically connected to the first resistive layer 11a. As shown in Figures 2(a) and 3(b), the first conductive connecting member 21bC includes a first conductive wiring 11bL electrically connected to the first conductive layer 11b.

[0017] For example, the first resistive connection member 21aC does not include the first conductive wiring 11bL. The first conductive connection member 21bC does not include the first resistive wiring 11aL. The first conductive wiring 11bL does not overlap with the first resistive wiring 11aL in the first direction D1. Thereby, electromagnetic coupling between the first conductive wiring 11bL and the first resistive wiring 11aL is suppressed. Thereby, detection with higher accuracy becomes possible.

[0018] The first electrical resistance R1 of the first resistive layer 11a changes according to the state of the detection target around the first element 10A.

[0019] As shown in FIG. 1, in the sensor 110, a control unit 70 may be provided. The control unit 70 may be included in the sensor 110. The control unit 70 may be provided separately from the sensor 110. The control unit 70 can supply a first electric power to the first conductive layer 11b and detect the first electrical resistance R1. When the first electric power is supplied, the temperature of the first film portion 11F rises. Thereby, the temperature of the first resistive layer 11a also rises.

[0020] The heat of the first film portion 11F propagates, for example, from the first film portion 11F to its surroundings. A part of the heat propagates to the first substrate 51s through the first gap g1. Another part of the heat propagates upward of the first film portion 11F.

[0021] For example, according to the state of the detection target around the first element 10A, the heat propagation (heat dissipation) changes. The detection target is, for example, a gas. For example, the thermal conductivity of the gas around the first element 10A depends on the elements (and / or molecules) contained in the gas and its concentration. The heat dissipation property changes according to the state of the detection target (type and concentration of the gas), and as a result, the first electrical resistance R1 of the first resistive layer 11a changes. By detecting the first electrical resistance R1, the state of the detection target (gas and change in gas concentration) can be detected.

[0022] Thus, in the embodiment, in a state where the temperature of the first film portion 11F has risen due to the first electric power supplied to the first conductive layer 11b, the first electrical resistance R1 changes according to the state of the detection target.

[0023] The target of detection is located in the first gap g1. The first electrical resistance R1 changes depending on the state of the target of detection between the first substrate 51s and the first film portion 11F.

[0024] In such a sensor 110, it was found that when the first resistive wiring 11aL overlaps with the first conductive wiring 11bL, the signal obtained from the first resistive layer 11a (the signal corresponding to the first electrical resistance R1) is prone to noise. For example, due to the rise in temperature, a large current is supplied to the first conductive layer 11b and the first conductive wiring 11bL. It is thought that the noise contained in the large current causes noise in the signal obtained from the first resistive layer 11a.

[0025] In this embodiment, the first resistive wiring 11aL and the first conductive wiring 11bL do not overlap with each other in the first direction D1. This suppresses coupling and noise. According to this embodiment, a sensor with improved characteristics can be provided.

[0026] In this embodiment, the first film portion 11F may further include a first conductive member 11c. The first conductive member 11c is provided between the first resistive layer 11a and the first conductive layer 11b. The provision of the first conductive member 11c makes it easier to obtain a uniform temperature distribution in the first film portion 11F, resulting in more stable detection characteristics.

[0027] In this embodiment, the potential of the first conductive member 11c may be fixed. The potential of the first conductive member 11c is fixed to, for example, the ground potential. The first conductive member 11c functions, for example, as a shield. The influence of the first conductive layer 11b on the first resistive layer 11a can be suppressed. Noise can be further suppressed.

[0028] For example, the first conductive member 11c may be electrically connected to the first substrate 51s. For example, the first substrate potential of the first substrate 51s may be substantially the same as the potential of the first conductive member 11c. External electromagnetic influences on the first resistive layer 11a can be effectively suppressed. The target can be detected with higher accuracy.

[0029] In this embodiment, for example, during the supply of the first power, the first conductive layer current flowing through the first conductive layer 11b and the first conductive wiring 11bL is large. This allows the first film portion 11F to be heated effectively. On the other hand, during the detection of the first electrical resistance R1, the first resistive layer current flowing through the first resistive layer 11a and the first resistive wiring 11aL is relatively small. For example, the first conductive layer current is larger than the first resistive layer current.

[0030] Noise is more likely to occur when the current of the first conductive layer is greater than the current of the first resistive layer. In this embodiment, even in such a state where noise is likely to occur, the noise can be effectively suppressed by ensuring that the first resistive wiring 11aL and the first conductive wiring 11bL do not overlap with each other.

[0031] For example, the current of the first conductive layer is at least twice the current of the first resistive layer. For example, the current of the first conductive layer may be at least five times the current of the first resistive layer.

[0032] As shown in Figures 2(a) and 2(b), in this example, the first resistive layer 11a is located between the first substrate 51s and the first conductive layer 11b. Electromagnetic noise from the outside to the first resistive layer 11a can be effectively suppressed by the first substrate 51s.

[0033] In this embodiment, the electrical resistance of the first conductive layer 11b may be lower than that of the first resistive layer 11a. The first conductive layer 11b allows for efficient heating.

[0034] The first conductive layer 11b may include, for example, at least one selected from the group consisting of Au, Al, Ti, TiN, and Pt. The first resistive layer 11a may include, for example, at least one selected from the group consisting of Au, Al, Ti, TiN, and Pt. The first conductive member 11c may include, for example, at least one selected from the group consisting of Au, Al, Ti, TiN, and Pt. A low electrical resistance of the first conductive member 11c can provide, for example, a high shielding effect.

[0035] As shown in Figures 1 and 3(a), a portion of the first conductive member 11c overlaps with the first conductive layer 11b and the first resistive layer 11a in the first direction D1. The other portion of the first conductive member 11c does not overlap with the first conductive layer 11b and the first resistive layer 11a in the first direction D1. For example, in a plane (XY plane) intersecting the first direction D1, at least a portion of the outer edge 11r of the first conductive member 11c lies outside the first conductive layer 11b and the first resistive layer 11a. For example, the area of ​​the first conductive member 11c is larger than the area of ​​the first conductive layer 11b and larger than the area of ​​the first resistive layer 11a. With such a first conductive member 11c, the temperature of the first film portion 11F becomes more uniform.

[0036] As shown in Figure 1, the first resistive connection member 21aC extends along the second direction D2. The second direction D2 intersects with the first direction D1 from the first base 51s to the first fixing member 21F. As shown in Figure 3(b), the width of the first resistive connection member 21aC in the third direction D3 is defined as the first resistive connection member width w21aC. The third direction D3 intersects with the plane containing the first direction D1 and the second direction D2. As shown in Figure 3(a), the width of the first film portion 11F in the third direction D3 is defined as the first film portion width w11F. The first resistive connection member width w21aC is narrower than the first film portion width w11F. This suppresses the propagation of heat from the first film portion 11F through the first resistive connection member 21aC. This makes it possible to raise the temperature of the film portion with low power consumption.

[0037] As shown in Figure 1, the first conductive connecting member 21bC extends along the second direction D2. As shown in Figure 3(b), the width of the first conductive connecting member 21bC in the third direction D3 is defined as the first conductive connecting member width w21bC. The first conductive connecting member width w21bC is narrower than the first film portion width w11F. This suppresses the propagation of heat from the first film portion 11F through the first conductive connecting member 21bC, resulting in a more stable temperature.

[0038] As shown in Figure 2(a), the first resistive connecting member 21aC may further include a first conductive member wiring 11cL electrically connected to the first conductive member 11c. The first conductive connecting member 21bC may also include a first conductive member wiring 11cL electrically connected to the first conductive member 11c. The first conductive member wiring 11cL may be provided on at least one of the first resistive connecting member 21aC and the first conductive connecting member 21bC.

[0039] As shown in Figures 1, 2(a), and 2(b), the first element 10A may further include a first other fixing member 21FA fixed to the first substrate 51s, a first other resistive connecting member 21aCA supported by the first other fixing member 21FA, and a first other conductive connecting member 21bCA supported by the first other fixing member 21FA. The first other resistive connecting member 21aCA and the first other conductive connecting member 21bCA support the first film portion 11F.

[0040] As shown in Figures 2(b) and 3(c), the first other-resistance connecting member 21aCA includes a first other-resistance wiring 11aLA that is electrically connected to the first resistance layer 11a. As shown in Figures 2(a) and 3(c), the first other-conductive connecting member 21bCA includes a first other-conductive wiring 11bLA that is electrically connected to the first conductive layer 11b.

[0041] For example, in the first direction D1, the first other-resistive wiring 11aLA does not overlap with the first other-conductive wiring 11bLA. Electromagnetic coupling between the first other-resistive wiring 11aLA and the first other-conductive wiring 11bLA is suppressed. This allows for greater noise suppression.

[0042] For example, the control unit 70 can supply first power to the first conductive layer 11b via the first conductive wiring 11bL and the first other conductive wiring 11bLA. The control unit 70 can obtain a value corresponding to the first electrical resistance R1 via the first resistive wiring 11aL and the first other resistive wiring 11aLA.

[0043] As shown in Figure 3(a), an insulating member 11i may be provided around the first resistive layer 11a. The insulating member 11i may be provided on the first resistive connection member 21aC, the first other resistive connection member 21aCA, the first conductive connection member 21bC, and the first other conductive connection member 21bCA.

[0044] In this embodiment, as shown in Figure 1, the first film portion 11F may be provided between the first resistive connecting member 21aC and the first other resistive connecting member 21aCA. For example, the first film portion 11F may be provided between the first conductive connecting member 21bC and the first other conductive connecting member 21bCA.

[0045] In the example shown in Figure 1, the direction from the first resistive connecting member 21aC to the first other resistive connecting member 21aCA is aligned with the direction from the first conductive connecting member 21bC to the first other conductive connecting member 21bCA.

[0046] In this embodiment, the direction from the first resistive connecting member 21aC to the first other resistive connecting member 21aCA may intersect with the direction from the first conductive connecting member 21bC to the first other conductive connecting member 21bCA.

[0047] In this embodiment, the direction from the first film portion 11F to the first resistive connecting member 21aC may intersect with the direction from the first film portion 11F to the first other resistive connecting member 21aCA. The direction from the first film portion 11F to the first conductive connecting member 21bC may intersect with the direction from the first film portion 11F to the first other conductive connecting member 21bCA.

[0048] Figures 4(a) and 4(b) are schematic cross-sectional views illustrating a part of the sensor according to the first embodiment. Figure 4(a) is a cross-sectional view corresponding to line B3-B4 in Figure 1. Figure 4(b) is a cross-sectional view corresponding to line B5-B6 in Figure 1. As shown in Figure 4(a), in the sensor 111 according to the embodiment, the first element 10A includes a connecting member 21cC for the first conductive member and a connecting member 21cCA for the first other conductive member. The configuration of the sensor 111 other than these may be the same as, for example, the configuration of the sensor 110.

[0049] In sensor 111, the connecting member 21cC for the first conductive member is supported by the first fixing member 21F. The connecting member 21cC for the first conductive member includes a first conductive member wiring 11cL that is electrically connected to the first conductive member 11c. The connecting member 21cCA for the first other conductive member is supported by the first other fixing member 21FA (see Figure 1). The connecting member 21cCA for the first other conductive member includes a first other conductive member wiring 11cLA that is electrically connected to the first conductive member 11c.

[0050] The wiring connected to the first resistive layer 11a, the first conductive layer 11b, and the first conductive member 11c may be provided at different connection points. Noise can also be suppressed in the sensor 111.

[0051] Figure 5 is a schematic plan view illustrating a part of the sensor according to the first embodiment. As shown in Figure 5, in the sensor 120 according to this embodiment, the element section 10E includes a second base 52s and a second element 10B, in addition to the first base 51s and the first element 10A (omitted in Figure 5) described with respect to Figure 1. In the sensor 120, the configuration of the first base 51s and the first element 10A may be the same as their configuration in the sensor 110.

[0052] In the sensor 120, the second element 10B includes a second fixing member 22F fixed to the second base 52s, a second resistive connecting member 22aC supported by the second fixing member 22F, and a second film portion 12F supported by the second resistive connecting member 22aC. A second gap g2 is provided between the second base 52s and the second film portion 12F. The second base 52s may be continuous with the first base 51s. The boundary between the second base 52s and the first base 51s may be clear or unclear.

[0053] The second film portion 12F includes a second resistive layer 12a. The control unit 70 can output a value corresponding to the difference between the second electrical resistance R2 of the second resistive layer 12a and the first electrical resistance R1 (see Figure 1). The control unit 70 includes, for example, a differential amplifier.

[0054] The second element 10B is, for example, a reference element. For example, the effects of fluctuations in ambient temperature are suppressed. Higher accuracy detection is possible.

[0055] In this example, the second film portion 12F includes a second conductive layer 12b. Power does not need to be supplied to the second conductive layer 12b. The second conductive layer 12b does not need to be used for detection. The second conductive layer 12b functions, for example, as a dummy conductive layer.

[0056] In this example, the second film portion 12F includes a second conductive member 12c. The second conductive member 12c overlaps, for example, with the second resistive layer 12a and the second conductive layer 12b. For example, the potential of the second conductive member 12c may be fixed. The second conductive member 12c equalizes the temperature of the second film portion 12F.

[0057] In this embodiment, the second conductive layer 12b and the second conductive member 12c may be omitted. Alternatively, the configuration of the second element 10B may be substantially the same as that of the first element 10A. In the first element 10A and the second element 10B, the heat capacity and other properties become substantially the same, enabling detection with higher accuracy.

[0058] In the sensor 120, the second element 10B may include a second conductive connecting member 22bC supported by a second fixed member 22F. The second conductive connecting member 22bC supports the second film portion 12F. The second element 10B may include a second other fixed member 22FA fixed to the second substrate 52s, a second other resistive connecting member 22aCA supported by the second other fixed member 22FA, and a second other conductive connecting member 22bCA supported by the second other fixed member 22FA. The second other resistive connecting member 22aCA and the second other conductive connecting member 22bCA support the second film portion 12F.

[0059] (Second Embodiment) The second embodiment relates to a sensor system. As shown in Figures 1 and 5, the sensor systems 210 and 220 according to the embodiment include sensors (sensors 110 and 120) according to the embodiment and a communication unit 75. The communication unit 75 is capable of transmitting a signal corresponding to a change in the first electrical resistance R1. According to the embodiment, low-noise sensor signals can be acquired from a remote location.

[0060] The communication unit 75 can supply signals to the outside, for example, by at least one of wired and wireless methods. The communication unit 75 may also be able to acquire control signals from the outside. The control unit 70 may be controlled by control signals from the outside.

[0061] The embodiment may include the following configuration (e.g., proposed technical details). (Composition 1) The element section comprises a first substrate and a first element, The first element is, A first fixing member fixed to the first base, A first resistor connecting member supported by the first fixing member, A first conductive connecting member supported by the first fixing member, The first resistive connecting member and the first conductive connecting member support the first film portion, Includes, A first gap is provided between the first substrate and the first membrane portion. The first film portion includes a first resistive layer and a first conductive layer. The first resistor connecting member includes a first resistor wiring that is electrically connected to the first resistor layer. The sensor includes a first conductive wiring that is electrically connected to the first conductive layer, wherein the first conductive connecting member includes a first conductive wiring.

[0062] (Configuration 2) The first resistive connecting member does not include the first conductive wiring. The sensor according to configuration 1, wherein the first conductive connecting member does not include the first resistive wiring.

[0063] (Composition 3) The first film portion further includes a first conductive member, The first conductive member is provided between the first resistive layer and the first conductive layer, as described in configuration 1 or 2.

[0064] (Composition 4) The first film portion further includes a first conductive member, The first conductive member is provided between the first resistive layer and the first conductive layer, The sensor according to configuration 1 or 2, wherein the potential of the first conductive member is fixed.

[0065] (Composition 5) The sensor according to configuration 3, wherein the first substrate potential of the first substrate is substantially the same as the potential of the first conductive member.

[0066] (Composition 6) The first element further includes a connecting member for a first conductive member supported by the first fixed member, The sensor according to any one of configurations 3 to 5, wherein the connecting member for the first conductive member includes wiring for the first conductive member that is electrically connected to the first conductive member.

[0067] (Composition 7) The sensor according to any one of configurations 3 to 5, wherein the first resistive connecting member further includes a first conductive member wiring electrically connected to the first conductive member.

[0068] (Composition 8) The sensor according to any one of configurations 3 to 5, wherein the first conductive connecting member includes a first conductive member wiring electrically connected to the first conductive member.

[0069] (Composition 9) The sensor according to any one of configurations 1 to 8, wherein the first electrical resistance of the first resistive layer changes depending on the state of the object to be detected around the first element.

[0070] (Composition 10) The sensor according to configuration 9, wherein, when the temperature of the first film portion rises due to the first power supplied to the first conductive layer, the first electrical resistance changes depending on the state of the object to be detected.

[0071] (Composition 11) The sensor according to configuration 9 or 10, wherein the first electrical resistance changes depending on the state of the object to be detected between the first substrate and the first film portion.

[0072] (Composition 12) The first resistive layer is located between the first substrate and the first conductive layer, and the sensor is as described in any one of configurations 1 to 11.

[0073] (Composition 13) The first resistor connecting member extends along a second direction intersecting the first direction from the first base to the first fixing member, The sensor according to any one of configurations 1 to 12, wherein the width of the first resistive connecting member in a third direction intersecting the plane including the first and second directions is narrower than the width of the first film portion in the third direction.

[0074] (Composition 14) The first conductive connecting member extends along the second direction, The sensor according to configuration 13, wherein the width of the first conductive connecting member in the third direction is narrower than the width of the first film portion.

[0075] (Composition 15) The first element is, A first other fixing member fixed to the first base, The first other-resistance connecting member supported by the first other-fixing member, The first other conductive connecting member supported by the first other fixing member, It further includes, The first other resistive connecting member and the first other conductive connecting member support the first film portion. The first other-resistance connecting member includes a first other-resistance wiring that is electrically connected to the first resistance layer. The sensor according to configuration 10, wherein the first non-conductive connecting member includes a first non-conductive wiring electrically connected to the first conductive layer.

[0076] (Composition 16) It further includes a control unit, The control unit is capable of supplying the first power to the first conductive layer. The control unit is capable of outputting a signal corresponding to the first electrical resistance, as described in configuration 15.

[0077] (Composition 17) The control unit is capable of supplying first power to the first conductive layer via the first conductive wiring and the first other conductive wiring. The control unit can acquire a value corresponding to the first electrical resistance via the first resistance wiring and the first other resistance wiring, and the sensor is as described in configuration 16.

[0078] (Composition 18) The sensor according to configuration 16 or 17, wherein the first conductive layer current flowing through the first conductive layer in the supply of the first power is greater than the first resistive layer current flowing through the first resistive layer in the detection of the first electrical resistance.

[0079] (Composition 19) The element portion further includes a second substrate and a second element, The second element is, A second fixing member fixed to the second base, A second resistor connecting member supported by the second fixing member, The second film portion supported by the second resistive connecting member, Includes, A second gap is provided between the second substrate and the second membrane portion. The second film portion includes a second resistive layer, The control unit is capable of outputting a value corresponding to the difference between the second electrical resistance of the second resistive layer and the first electrical resistance, as described in any one of configurations 16 to 18.

[0080] (Composition 20) A sensor described in any one of configurations 9 to 11, A communication unit capable of transmitting a signal corresponding to the change in the first electrical resistance, A sensor system equipped with [unspecified features].

[0081] According to the embodiment, a sensor and sensor system capable of improving characteristics can be provided.

[0082] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configuration of each element included in the sensor and sensor system, such as the substrate, element part, fixing member, connecting member, membrane part, and control unit, is included within the scope of the present invention as long as those skilled in the art can appropriately select from the known range to implement the present invention and obtain similar effects.

[0083] Combinations of two or more elements from any of the specific examples, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention.

[0084] Furthermore, all sensors and sensor systems that a person skilled in the art can design and implement based on the sensors and sensor systems described above as embodiments of the present invention, insofar as they encompass the gist of the present invention, also fall within the scope of the present invention.

[0085] Furthermore, within the scope of the concept of the present invention, a person skilled in the art could conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention.

[0086] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0087] 10A, 10B: First and second elements, 10E: Element section, 11F, 12F: First and second film sections, 11a, 12a: First and second resistive layers, 11aL: First resistive wiring, 11aLA: First other resistive wiring, 11b, 12b: First and second conductive layers, 11bL: First conductive wiring, 11bLA: First other conductive wiring, 11c, 12c: First and second conductive members, 11cL: First conductive member wiring, 11cLA: First other conductive member wiring, 11i: Insulating member, 11r: Outer edge, 21F, 22F: First and second fixing members, 21FA, 22FA: First and second other fixing members, 21aC, 22aC: First and second resistive connection members, 21aCA, 22aCA: First and second other resistive connection members, 21bC, 22bC: First and second conductive connection members, 21bCA, 22bCA: First and second other conductive connection members, 21cC: Connection member for first conductive member, 21cCA: Connection member for first other conductive member, 51F: First surface, 51s, 52s: First and second substrates, 70: Control unit, 75: Communication unit, 110, 111, 120: Sensors, 210, 220: Sensor system, D1~D3: First to third directions, R1, R2: First and second electrical resistances, g1, g2: First and second gaps, w11F: First film width, w21aC: First resistive connection member width, w21bC: First conductive connection member width

Claims

1. The element section comprises a first substrate and a first element, The first element is, A first fixing member fixed to the first base, A first resistor connecting member supported by the first fixing member, A first conductive connecting member supported by the first fixing member, The first resistive connecting member and the first conductive connecting member support the first film portion, Includes, A first gap is provided between the first substrate and the first membrane portion. The first film portion includes a first resistive layer and a first conductive layer. The first resistor connecting member includes a first resistor wiring that is electrically connected to the first resistor layer. The first conductive connecting member includes a first conductive wiring electrically connected to the first conductive layer. The first resistive connecting member does not include the first conductive wiring. The first conductive connecting member does not include the first resistive wiring. The first film portion further includes a first conductive member, The first conductive member is provided between the first resistive layer and the first conductive layer, The sensor further includes a first conductive member wiring that is electrically connected to the first conductive member, wherein the first resistive connecting member is a first conductive member wiring.

2. The first resistor wiring is located between the first substrate and the first conductive member wiring. The first conductive connecting member further includes another first conductive member wiring electrically connected to the first conductive member, The sensor according to claim 1, wherein the other first conductive member wiring is located between the first substrate and the first conductive wiring.

3. The sensor according to claim 2, wherein the first substrate potential of the first substrate is the same as the potential of the first conductive member.

4. The sensor according to claim 1, wherein the first electrical resistance of the first resistive layer changes depending on the state of the object to be detected around the first element.

5. The sensor according to claim 4, wherein, when the temperature of the first film portion rises due to the first power supplied to the first conductive layer, the first electrical resistance changes depending on the state of the object to be detected.

6. The sensor according to claim 2, wherein the first resistive layer is located between the first substrate and the first conductive layer.

7. The first element is, A first other fixing member fixed to the first base, The first other-resistance connecting member supported by the first other-fixing member, A first other conductive connecting member supported by the first other fixing member, It further includes, The first other resistive connecting member and the first other conductive connecting member support the first film portion. The first other-resistance connecting member includes a first other-resistance wiring that is electrically connected to the first resistance layer. The sensor according to claim 5, wherein the first non-conductive connecting member includes a first non-conductive wiring electrically connected to the first conductive layer.

8. It further includes a control unit, The control unit is capable of supplying the first power to the first conductive layer. The sensor according to claim 7, wherein the control unit is capable of outputting a signal corresponding to the first electrical resistance.

9. The sensor according to claim 4, A communication unit capable of transmitting a signal corresponding to the change in the first electrical resistance, A sensor system equipped with [unspecified features].

10. The element section comprises a first substrate and a first element, The first element is, A first fixing member fixed to the first base, A first resistor connecting member supported by the first fixing member, A first conductive connecting member supported by the first fixing member, The first resistive connecting member and the first conductive connecting member support the first film portion, Includes, A first gap is provided between the first substrate and the first membrane portion. The first film portion includes a first resistive layer and a first conductive layer. The first resistor connecting member includes a first resistor wiring that is electrically connected to the first resistor layer. The first conductive connecting member includes a first conductive wiring electrically connected to the first conductive layer. The first film portion further includes a first conductive member, The first conductive member is provided between the first resistive layer and the first conductive layer, The first element further includes a connecting member for a first conductive member supported by the first fixed member, The connecting member for the first conductive member includes wiring for the first conductive member that is electrically connected to the first conductive member. The first resistive layer is located between the first substrate and the first conductive layer. A sensor in which the first substrate potential of the first substrate is the same as the potential of the first conductive member.

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