Light-emitting device

Abstract

To provide a light-emitting device of which an outgoing position of light emitted from a plurality of light-emitting elements is mounted with high accuracy.SOLUTION: A light-emitting device comprises: a lens member that has a lens surface; a plurality of light-emitting elements containing a first light-emitting element that includes a light-emitting peak to a first wavelength from a first light-emitting point and a second light-emitting element that includes a light-emitting peak from a second light-emitting point arranged to a position where is far from the lens member from a first flat surface passing through the first light-emitting point in a plan surface that is vertical to an optical shaft of the lens surface to a second wavelength that is different from the first wavelength; and a submount in which the plurality of light-emitting elements is arranged. An outer edge of an upper surface of the submount passes a first flat surface, a second flat surface passing through the second light-emitting point that is a plan surface vertical to the optical shaft of the lens surface, and a point is inside an area that is surrounded by a first straight line passing through the first light-emitting point in parallel to the optical shaft of the lens surface, and a second straight line passing through the second light-emitting point in parallel to the optical shaft of the lens surface, and is far from the lens member from the first flat surface, and is near from the lens member from the second surface. A first light and a second light pass the lens surface.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] Conventionally, there is a light-emitting device in which a plurality of components are mounted in a package. Examples of the plurality of components include, for example, a plurality of light-emitting elements. Further, for example, in addition to the light-emitting element, a Zener diode, a thermistor, a photodiode, or the like can be mentioned.

[0003] For example, Patent Document 1 discloses a light-emitting device including a submount, a plurality of laser diodes disposed on the upper surface of the submount, and a single collimator lens that collimates laser light emitted from each of the plurality of laser diodes. By mounting a plurality of light-emitting elements in a package, a small-sized light-emitting device can be realized.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Provided is a light-emitting device in which the emission positions of light emitted from a plurality of light-emitting elements are accurately mounted.

Means for Solving the Problems

[0006] In exemplary and non-limiting embodiments, the light-emitting device of the present disclosure comprises: a lens member having at least one lens surface; a plurality of light-emitting elements including: a first light-emitting element that emits first light having an emission peak at a first wavelength from a first light-emitting point; a second light-emitting element that emits second light having an emission peak at a second wavelength different from the first wavelength from a second light-emitting point located in a plane perpendicular to the optical axis of the at least one lens surface and further from the lens member than a first plane passing through the first light-emitting point; and a submount having an upper surface on which the plurality of light-emitting elements are arranged side by side. The outer edge of the upper surface of the submount, when viewed from above in the direction normal to the upper surface of the submount, passes through a point further from the lens member than the first plane and closer to the lens member than the second plane, within the region enclosed by the first plane, the second plane perpendicular to the optical axis of the at least one lens surface and passing through the second light-emitting point, the first straight line parallel to the optical axis of the at least one lens surface and passing through the first light-emitting point, and the second straight line parallel to the optical axis of the at least one lens surface and passing through the second light-emitting point, and the first light and the second light pass through the at least one lens surface. [Effects of the Invention]

[0007] The light-emitting device described herein provides a light-emitting device in which the emission positions of light emitted from multiple light-emitting elements are precisely implemented. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of the light-emitting device according to this embodiment. [Figure 2] Figure 2 is a top view of the light-emitting device according to this embodiment, with the package cap removed. [Figure 3] Figure 3 is a top view of the substrate of the light-emitting device according to this embodiment. [Figure 4] Figure 4 is a cross-sectional view of the light-emitting device along the line IV-IV in Figure 1. [Figure 5] Figure 5 is an enlarged top view of the inside of the package of the light-emitting device according to this embodiment. [Figure 6] Figure 6 is a magnified view of the top surface of the submount in which three light-emitting elements are arranged. [Figure 7] Figure 7 is a plan view enlarged from the side where the light-emitting surfaces of the three light-emitting elements are located. [Figure 8] Figure 8 is a magnified view of the top surface of a submount in which two light-emitting elements are arranged. [Figure 9] Figure 9 is a plan view enlarged from the side where the light-emitting surfaces of the two light-emitting elements are located. [Figure 10] Figure 10 is a schematic diagram showing how a plate-shaped submount substrate is cut diagonally. [Figure 11A] Figure 11A is a top view of the submount 30_1 according to this embodiment. [Figure 11B] Figure 11B is a perspective view of the submount 30_2 according to this embodiment. [Figure 11C] Figure 11C is a top view of the submount 30_3 according to this embodiment. [Figure 12] Figure 12 is a top view of a modified light-emitting device according to this embodiment, with the package cap removed. [Modes for carrying out the invention]

[0009] In this specification and in the claims, polygons such as triangles and quadrilaterals are not limited to polygons in a mathematically strict sense, but also include shapes in which the corners of a polygon have been rounded, chamfered, or otherwise modified. Furthermore, shapes in which modifications have been made not only to the corners (ends of the sides) of a polygon, but also to the middle part of the sides, are also referred to as polygons. In other words, shapes that retain the shape of a polygon as a base but have been partially modified are included in the "polygons" described in this specification and in the claims.

[0010] This applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same applies when dealing with each side that forms such a shape. In other words, even if a corner or middle part of a side is processed, the processed part is still included in the definition of "side." When distinguishing a polygon or side without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0011] In this specification or in the claims, when there are multiple elements identified by a certain name, and each element is to be expressed in a distinct manner, an ordinal number such as "first" or "second" may be added to the beginning of each element. For example, if the claim states that "a light-emitting element is arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "1st" and "2nd" are simply used to distinguish between two light-emitting elements. The order of these ordinal numbers has no special meaning. Element names with the same ordinal number may not refer to the same element in the specification and the claims. For example, if elements are described in the specification as "1st light-emitting element," "2nd light-emitting element," and "3rd light-emitting element," then "1st light-emitting element" and "2nd light-emitting element" in the claims may correspond to "1st light-emitting element" and "3rd light-emitting element" in the specification. Also, if the term "1st light-emitting element" is used in claim 1 of the claims, but the term "2nd light-emitting element" is not, the invention of claim 1 may be limited to having one light-emitting element, and that light-emitting element may be the "2nd light-emitting element" or "3rd light-emitting element," not limited to the "1st light-emitting element" in the specification.

[0012] In this specification or claims, terms indicating a specific direction or position (for example, "upper", "lower", "right", "left", "front", "rear", and other terms including these terms) may be used. These terms are merely used for ease of understanding of the relative direction or position in the referenced drawings. As long as the relative direction or positional relationship indicated by terms such as "upper", "lower", etc. in the referenced drawings is the same, in drawings other than the present disclosure, actual products, manufacturing apparatuses, etc., they do not have to be arranged in the same way as in the referenced drawings.

[0013] The dimensions, dimensional ratios, shapes, arrangement intervals, etc. of the elements or members shown in the drawings may be exaggerated for ease of understanding. Also, in order to avoid making the drawings overly complex, the illustration of some elements may be omitted.

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments embody the technical idea of the present invention but do not limit the present invention. The numerical values, shapes, materials, steps, the order of those steps, etc. shown in the description of the embodiments are merely examples, and various modifications are possible as long as there is no technical contradiction. In the following description, elements specified by the same name and reference numeral are the same or similar elements, and duplicate descriptions of those elements may be omitted.

[0015] The light-emitting device 100 according to this embodiment will be described. FIGS. 1 to 5 are drawings for explaining an exemplary form of the light-emitting device 100. FIG. 1 is a perspective view of the light-emitting device 100 according to this embodiment. FIG. 2 is a top view of the light-emitting device 100 with the cap 16 of the package 10 removed. FIG. 3 is a top view of the substrate 90. FIG. 4 is a cross-sectional view taken along the IV-IV cross-sectional line in FIG. 1. FIG. 5 is an enlarged top view of the inside of the package 10. In FIGS. 4 and 5, the laser light LB emitted from the light-emitting element 20 is indicated by a dotted arrow. For convenience of explanation, 1D and 2D arrows in a two-dimensional plane are shown in the attached drawings. The 2D arrow indicates a direction parallel to the direction in which the optical axis L of the lens member 80 extends, and the 1D arrow indicates a direction orthogonal to the direction of the 2D arrow.

[0016] The light-emitting device 100 according to this embodiment includes a plurality of components including a package 10, a plurality of light-emitting elements 20, one or more submounts 30, one or more protection elements 60A, a temperature measurement element 60B, one or more wirings 70, a lens member 80, and a substrate 90.

[0017] In the example of the illustrated light-emitting device 100, three light-emitting elements 20, one submount 30, three protection elements 60A, a temperature measurement element 60B, and a plurality of wirings 70 are arranged in the internal space of the package 10. Further, the emitted light from the three light-emitting elements 20 is respectively collimated by the lens member 80 after being emitted laterally to the outside from the package 10.

[0018] First, each component will be described.

[0019] (Package 10) Package 10 has a base portion 11 that includes a mounting surface 11M, and a side wall portion 12 that surrounds the mounting surface 11M. The mounting surface 11M of the base portion 11 is the area where other components are arranged. Package 10 also has a substrate 15 and a cap 16 fixed to the substrate 15. The substrate 15 has the base portion 11, and the cap 16 has the side wall portion 12. Hereafter, to distinguish between the substrate 15 and the substrate 90, they may be referred to as the first substrate 15 and the second substrate 90, respectively.

[0020] In the illustrated example, the cap 16 includes a top portion (lid portion) that faces the mounting surface 11M with other components arranged on the mounting surface 11M in between, and a side portion (frame portion) that surrounds the other components arranged on the mounting surface 11M. The side portion of the cap 16 includes a side wall portion 12. Note that the side wall portion 12 does not have to be configured as part of the cap 16. For example, the package 10 can be replaced with a package composed of one member in which the base portion 11 and the side wall portion 12 are integrated, and another member having a top portion.

[0021] In a top view from the direction normal to the mounting surface 11M of the base 11, the outside of the base 11 and the cap 16 The shapes are all rectangular. However, these outlines do not all have to be rectangular; they may be polygons other than quadrilaterals, or shapes that include curves, bends, or irregularities in part or in whole.

[0022] The base 11 has one or more upper surfaces. One or more upper surfaces of the base 11 include a mounting surface 11M. One or more upper surfaces of the base 11 include an upper surface having a peripheral region 11P that surrounds one or more components arranged on the mounting surface 11M. In the illustrated example of the light-emitting device 100, the mounting surface 11M and the upper surface having the peripheral region 11P are the same. Note that the mounting surface 11M and the peripheral region 11P do not have to be on the same plane; for example, the mounting surface 11M and the peripheral region 11P may be on different upper surfaces with a difference in height.

[0023] The peripheral region 11P is the region to which the cap 16 is joined. In a top view, the peripheral region 11P is provided between the outer shape of the base 11 and the arrangement area for arranging multiple components on the mounting surface 11M. In the illustrated example of the light-emitting device 100, in a top view, the arrangement area on the mounting surface 11M is approximately rectangular, and the peripheral region 11P is provided in a rectangular ring shape surrounding the arrangement area. The lower surface of the side portion of the cap 16 is joined to the upper surface of the peripheral region 11P. A metal film for joining with the cap 16 may be provided in the peripheral region 11P.

[0024] As illustrated in Figure 4, the package 10 has a translucent region 13, which is a light-transmitting region. The package 10 also has a light-extracting surface 10A that includes the translucent region 13. This light-extracting surface 10A is included in one of the one or more outer surfaces of the side wall portion 12 of the package 10. Translucency means that the transmittance of the main light incident thereon is 80% or more.

[0025] Package 10 may have light-transmitting properties in areas other than the light-transmitting region 13 on one or more outer surfaces. Package 10 may also have non-light-transmitting areas (areas that do not have light-transmitting properties) in part. The entire side wall portion 12 of package 10 does not need to be light-transmitting. In the illustrated example, package 10 has four outer surfaces corresponding to a rectangle, and all four surfaces are light-transmitting, but there is only one light-extracting surface 10A.

[0026] The cap 16 may be formed entirely of a translucent material, or only its side portions may be formed of a translucent material. A portion including the light extraction surface 10A may be formed from a first translucent material, and the remaining portion may be formed from a second translucent material or an opaque material.

[0027] The cap 16 may be formed with the top and side portions integrated into one. For example, it is possible to manufacture a cap 16 having a desired shape, such as a box shape, from a translucent material such as glass, plastic, or quartz using processing techniques such as molding or etching. The cap 16 may also be formed by joining a top portion (lid portion) and a side portion (frame portion) that are formed separately using different materials as the main materials. For example, the top portion may be made primarily of single-crystal or polycrystalline silicon, and the side portion may be made primarily of glass. The cap 16 may have dimensions such as a height of 0.6 mm or more and 2.5 mm or less, and a side length of 1.2 mm or more and 8 mm or less in a top view of a rectangular outer shape. Alternatively, for example, it may have dimensions such as a height of 2 mm or less, and a side length of 4 mm or less in a top view of a rectangular outer shape.

[0028] In the illustrated example of the light-emitting device 100, the light extraction surface 10A is perpendicular to the direction in which the mounting surface 11M expands. Here, perpendicularity includes a difference of ±5 degrees. Furthermore, the light extraction surface 10A does not need to be perpendicular to the direction in which the mounting surface 11M of the base 11 expands; it may be inclined.

[0029] Multiple wiring regions 14 are provided on the mounting surface 11M. In Figure 5, all wiring regions 14 Instead of assigning symbols, all wiring regions 14 are given the same hatching. Multiple wiring regions 14 can be electrically connected to wiring regions provided on the underside of the base 11 via via holes passing through the interior of the base 11. The wiring regions electrically connected to the wiring regions 14 are not limited to the underside of the base 11, but can be provided on other outer surfaces (top or outer sides) of the base 11, outside the placement area of ​​the mounting surface 11M. Multiple wiring regions 14 may be formed from a conductive material such as metal and may be patterned films or layers.

[0030] The multiple wiring regions 14 may include, in a top view, one or more wiring regions 14 provided on one side of the mounting surface 11M arrangement region with the central region in between, and one or more wiring regions 14 provided on the other side in the opposite direction.

[0031] Furthermore, the multiple wiring regions 14 may include multiple wiring regions 14 arranged side by side with spacing in one direction when viewed from above, and multiple wiring regions 14 arranged side by side with spacing in a direction perpendicular to the aforementioned direction.

[0032] Furthermore, the multiple wiring regions 14 may include multiple sets of wiring regions 14, where two wiring regions 14 that form a pair constitute one set. The two wiring regions 14 that make up one set are electrically connected to one component and are used to receive power from outside the package 10. In the example in Figure 5, the pair of wiring regions 14 electrically connected to the protective element 60A are arranged in the direction of the 2D arrow, and the pair of wiring regions 14 electrically connected to the temperature measuring element 60B are arranged in the direction of the 1D arrow perpendicular to the 2D direction.

[0033] Furthermore, the multiple wiring regions 14 may include one or more sets of wiring regions 14 arranged side by side in one direction when viewed from above, and one or more sets of wiring regions 14 arranged side by side in a direction perpendicular to that direction.

[0034] Furthermore, in a top view, the mounting surface 11M may have one or more sets of wiring areas 14 arranged in a single direction on one side with the central area in between, and one or more sets of wiring areas 14 arranged in a direction perpendicular to that single direction.

[0035] The first substrate 15 can be formed using ceramic as the main material. Examples of ceramics used in the first substrate 15 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0036] In this embodiment, the first substrate 15 may be formed from, for example, a ceramic substrate having a plurality of metal vias inside. Preferably, the first substrate 15 contains a material with better heat dissipation properties than ceramic (a material with high thermal conductivity) in the portion that is in thermal contact with the heat-generating components. Examples of such materials may include copper, aluminum, iron, copper-molybdenum, copper-tungsten, and copper-diamond composite materials.

[0037] (Light-emitting element 20) An example of the light-emitting element 20 is a semiconductor laser element. The light-emitting element 20 may have a rectangular shape when viewed from above. If the light-emitting element 20 is an end-face emission type semiconductor laser element, the side that intersects with one of the two shorter sides of this rectangle is the light-emitting end face (light-emitting surface 21). In this example, the top and bottom surfaces of the light-emitting element 20 have a larger area than the light-emitting surface 21.

[0038] In this embodiment, the light-emitting element 20 is a single emitter having one emitter. However, the light-emitting element 20 may also be a multi-emitter having two or more emitters. If the light-emitting element 20 is a semiconductor laser element having multiple emitters, one common electrode is provided on either the upper or lower surface of the light-emitting element 20, and electrodes corresponding to each emitter are provided on the other surface. It is possible.

[0039] The light emitted from the light-emitting surface 21 of the light-emitting element 20 is divergent light with a broad spread. However, it does not have to be divergent light. When a semiconductor laser element is used for the light-emitting element 20, the divergent light (laser light) emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 21. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface.

[0040] Light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the FFP's light intensity distribution, will be called light traveling along the optical axis. The optical path of light traveling along the optical axis will be called the optical axis of that light. Furthermore, in the FFP's light intensity distribution, 1 / e of the peak intensity value.2 Light with the above intensity will be referred to as "main portion" light.

[0041] In the elliptical shape of the FFP (First-Function Plane) of light emitted from the light-emitting element 20, which is a semiconductor laser element, the direction of the minor axis of the ellipse is defined as the direction parallel to the FFP, and the direction of the major axis is defined as the direction perpendicular to the FFP. Multiple layers, including the active layer, that constitute the semiconductor laser element are stacked in the direction perpendicular to the FFP.

[0042] Based on the light intensity distribution of the FFP, the angle corresponding to the full width at half maximum of the light intensity distribution is defined as the light divergence angle of the semiconductor laser element. The light divergence angle in the direction perpendicular to the FFP is called the vertical divergence angle, and the light divergence angle in the direction parallel to the FFP is called the parallel divergence angle.

[0043] As the light-emitting element 20, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used. Alternatively, a semiconductor laser element that emits other types of light may be used.

[0044] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0045] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those containing InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0046] (Submount 30) An example of the shape of the submount 30 in this embodiment is a hexahedron. The submount 30 has an upper surface 30M on which other components may be placed, and a lower surface located opposite the upper surface 30M. The upper surface 30M and the lower surface can each function as a joining surface. The distance between the upper surface 30M and the lower surface, i.e., the thickness of the submount, is shorter than the distance between the other two opposing surfaces. In a top view of the submount 30M, taken from the direction normal to the upper surface 30M, the shape of the outer edge of the upper surface 30M of the submount 30 is, for example, a parallelogram. However, as will be described later, the shape of the outer edge is not limited to a parallelogram. The submount 30 can be formed using, for example, aluminum nitride or silicon carbide. A metal film for joining is provided on the joining surface, which is either the upper surface 30M or the lower surface.

[0047] Multiple wiring areas are electrically connected to other components on the upper surface 30M of the submount 30. Area 31 is provided. In Figure 5, instead of labeling all wiring areas 31 with a reference numeral, all wiring areas 31 are given the same hatching.

[0048] (Protection element 60A) The protection element 60A is a circuit element designed to prevent excessive current from flowing through a specific element (e.g., the light-emitting element 20) and causing it to be damaged. A typical example of the protection element 60A is a constant voltage diode such as a Zener diode. A Si diode can be used as the Zener diode.

[0049] (Temperature measuring element 60B) The temperature measuring element 60B is an element used as a temperature sensor to measure the ambient temperature. For example, a thermistor can be used as the temperature measuring element 60B.

[0050] (Wiring 70) The wiring 70 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion for joining to other components. The wiring 70 is, for example, a metal wire. Examples of metals include gold, aluminum, silver, and copper.

[0051] (Lens component 80) The lens member 80 is formed having at least one lens surface, that is, one or more lens surfaces. The lens member 80 collimates incident light. For example, one or more lens surfaces are designed to receive light diverging from the focal point, convert the diverging light into collimated light by refraction, and emit it from the lens member 80. The lens surface is spherical or aspherical. Lens surfaces are formed on the surface of the lens member 80 on the light incident side and / or on the light exit side. Optical films, such as anti-reflective films or protective films, may be provided on the surface of the lens member 80 on the light incident side and / or on the light exit side. In the example of the lens member 80 shown in Figure 2, a concave lens surface 80A is formed on the light incident side and a convex lens surface 80B is formed on the light exit side. Note that multiple lens surfaces may be formed on the surface on the light incident side, and the lens member 80 can have one or more lens surfaces formed on the surface on the light incident side. Furthermore, multiple lens surfaces may be formed on the light-emitting surface, and the lens member 80 may have one or more lens surfaces formed on the light-emitting surface.

[0052] The lens member 80 may be formed from a light-transmitting material, such as glass or plastic. The shape of the portion of the lens member 80 that does not transmit light is arbitrary, but it is preferable that it has a shape that can be fixed to other components. In the example of the lens member 80 shown in Figure 2, the lens member 80 has its optical axis L parallel to its bottom surface. The bottom surface of the lens member 80 also has a flat region which can function as a bonding region.

[0053] (Second board 90) In the example shown in Figure 3, the second substrate 90 has a plurality of wiring regions 96. In Figure 3, similar hatching is shown in the wiring regions 96 provided on the second substrate 90. The wiring regions 96 of the second substrate 90 are electrically connected to wiring regions provided on the lower surface of the second substrate 90. The wiring regions electrically connected to the wiring regions 96 are not limited to the lower surface of the second substrate 90, but can be provided on other outer surfaces (top surface and outer side surface) of the second substrate 90.

[0054] The second substrate 90 can be formed using ceramic as the main material. Examples of ceramics used in the second substrate 90 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0055] The second substrate 90 preferably includes a portion formed from a material with better heat dissipation properties than ceramic (a material with high thermal conductivity). In the example of the second substrate 90 shown in Figure 3, the second substrate 90 has a heat conductive member 97 embedded inside. This heat conductive member 97 fills an opening that penetrates from the top surface to the bottom surface of the second substrate 90. The heat conductive member 97 is provided in a region facing the bottom surface of the first substrate 15. The heat conductive member 97 can be formed from, for example, copper, aluminum, iron, copper molybdenum, copper tungsten, or a copper-diamond composite material. The shape of the heat conductive member 97 is arbitrary. In the example of the second substrate 90 shown in Figure 3, the heat conductive member 97 is located in a central region sandwiched between groups of wiring regions 96 arranged in two groups, upper and lower, in Figure 3.

[0056] The second substrate 90 has a structure that supports the components of the light-emitting device 100 and can be electrically connected to the electronic components included in these components. The second substrate 90 may also support elements other than the components of the light-emitting device 100, such as electronic components or optical components.

[0057] (Light-emitting device 100) Next, the light-emitting device 100 will be described.

[0058] In the 100 examples of light-emitting devices described below, each of the multiple light-emitting elements 20 is an end-face emission type semiconductor laser element (laser diode).

[0059] In the light-emitting device 100, the multiple light-emitting elements 20 are arranged inside the package 10. The multiple light-emitting elements 20 are arranged on the mounting surface 11M of the first substrate 15 and surrounded by the side wall portion 12 of the package 10. Each light-emitting element 20 is arranged on the mounting surface 11M via a submount 30.

[0060] Multiple light-emitting elements 20 are arranged so that their emission end faces face the light extraction surface 10A of the package 10. Furthermore, the multiple light-emitting elements 20 are arranged in the central region of the mounting surface 11M. Also, in a top view, one or more wiring regions 14, located on one side of this central region and on the opposite side, do not overlap with the optical path of the light emitted from the light-emitting elements 20 toward the light extraction surface 10A.

[0061] In the light-emitting device 100, one or more protective elements 60A are arranged inside the package 10. One or more protective elements 60A are arranged on the mounting surface 11M. The protective elements 60A are positioned on one or two wiring regions 14. The protective elements 60A are also electrically connected to two wiring regions 14. In the illustrated example of the light-emitting device 100, the protective elements 60A are positioned on each wiring region 14 so as to straddle the two wiring regions 14.

[0062] Furthermore, the protective element 60A is positioned closer to the peripheral region 11P of the package 10 than to the submount 30. Therefore, the distance from the protective element 60A to the side wall portion 12 is shorter than the distance from the protective element 60A to the submount 30.

[0063] The protective element 60A is provided to protect the light-emitting element 20. In the light-emitting device 100, one protective element is provided for each light-emitting element 20. In other words, the same number of protective elements 60A as there are light-emitting elements 20 are provided.

[0064] In the example shown in Figure 5, three protective elements 60A, each corresponding to one of the three light-emitting elements 20, are arranged on the mounting surface 11M of the base 11. More specifically, the protective elements 60A are mounted on a pair of wiring regions 14 provided on the mounting surface 11M of the base 11. The anode of the protective element 60A is electrically connected to one of the pair of wiring regions 14, and the cathode of the protective element 60A is electrically connected to the other of the pair of wiring regions 14.

[0065] One of the p-side and n-side electrodes of the light-emitting element 20 is electrically connected to a wiring region 31 provided on the upper surface 30M of the submount 30. One end of a wire 70 is joined to the wiring region 31, and the other end of the wire 70 is joined to one of a pair of wiring regions 14 provided on the mounting surface 11M of the base 11. Another end of another wire 70 is joined to the other of the p-side and n-side electrodes of the light-emitting element 20, and the other end of another wire 70 is joined to the other of a pair of wiring regions 14 provided on the mounting surface 11M of the base 11. According to this example of electrical connection, the protective element 60A can be connected in parallel to the light-emitting element 20.

[0066] The distance from the point where the wiring 70 for electrically connecting the light-emitting element 20 is joined to the wiring region 14 to the light-emitting element 20 is shorter than the distance from the protective element 60A, which is electrically connected to the wiring region 14, to the light-emitting element 20. Also, in a top view, the distance from the outer edge of the wiring region 14 to the protective element 60A placed in the wiring region 14 is shorter than the distance from the outer edge of the wiring region 14 to the wiring 70 joined to the wiring region 14. In this way, the protective element 60A can be placed closer to the side wall portion 12, and the package 10 can be made smaller.

[0067] The structure of the submount 30 and the arrangement of the multiple light-emitting elements 20 in this embodiment will be described in more detail with reference to Figures 6 to 11C.

[0068] Figure 6 is an enlarged view of the upper surface 30M of the submount 30 on which the three light-emitting elements 20 are arranged. Figure 7 is a plan view of the outer edge of the submount 30 on the side where the light-emitting surfaces 21 of each of the three light-emitting elements 20 are located.

[0069] In the illustrated example, the multiple light-emitting elements 20 are arranged side by side so that their respective light-emitting surfaces 21 face the same direction. The multiple light-emitting elements 20 can also be arranged side by side so that their respective light-emitting surfaces 21 are parallel. The light emitted from each light-emitting surface 21 of the multiple light-emitting elements 20 travels toward the side of the package 10 having the light-extracting surface 10A. However, the respective light-emitting surfaces 21 of the multiple light-emitting elements 20 do not need to be parallel.

[0070] In the illustrated example, the multiple light-emitting elements 20 include three semiconductor laser elements 20A, 20B, and 20C, each having a different emission peak wavelength. The emission peak wavelength of semiconductor laser element 20A is shorter than that of semiconductor laser element 20B, and the emission peak wavelength of semiconductor laser element 20B is shorter than that of semiconductor laser element 20C. Semiconductor laser element 20A emits first light having an emission peak at a first wavelength from an emission point 22A located on the light-emitting surface. Semiconductor laser element 20B emits second light having an emission peak at a second wavelength different from the first wavelength from an emission point 22B located on the light-emitting surface. Semiconductor laser element 20C emits third light having an emission peak at a third wavelength different from the first and second wavelengths from an emission point 22C located on the light-emitting surface.

[0071] In this embodiment, the first light is blue light, the second light is green light, and the third light is red light. In other words, semiconductor laser element 20A emits blue light, semiconductor laser element 20B emits green light, and semiconductor laser element 20C emits red light. In this embodiment, when viewed from above, the semiconductor laser element 20C that emits red light has a longer length in the optical axis direction of at least one lens surface of the lens member 80 compared to semiconductor laser element 20B that emits green light or semiconductor laser element 20A that emits blue light. The optical axis of one lens surface in the lens member 80 may coincide with the optical axis L of the lens member 80. The output of the laser light can be adjusted by adjusting the length, but the relationship of lengths is not limited to this example. The configuration in which the three light-emitting elements 20 are composed of three colors of light, RGB, can be used, for example, for color image display applications. The color of the light emitted by each light-emitting element 20 is However, this is not limited to this, and depending on the application, it is not limited to visible light.

[0072] In the illustrated example, in a top view from the normal direction of the upper surface 30M of the submount 30, the distance w1 between light-emitting points 22A and 22B in the direction of the 1D arrow is, for example, 100 μm or more and 150 μm or less, and the distance w2 between light-emitting points 22B and 22C is, for example, 100 μm or more and 150 μm or less. The smaller the distance between the light-emitting points, the smaller the shape of the submount 30 can be in the 1D direction, and the light-emitting device 100 can be made smaller. For the sake of clarity, the light-emitting points are shown as elliptical shapes near the center of the light-emitting surface in the direction of the 1D arrow, but the disclosure is not limited thereto. The light-emitting points may be shifted in the direction of the 1D arrow with respect to the center of the light-emitting surface in a top view.

[0073] Here, we define several hypothetical planes and lines. The plane perpendicular to the optical axis L of at least one lens surface of the lens member 80 and passing through the light-emitting point 22A of the semiconductor laser element 20A is called the first plane. The plane perpendicular to the optical axis L of this lens surface and passing through the light-emitting point 22B of the semiconductor laser element 20B is called the second plane. The plane perpendicular to the optical axis L of this lens surface and passing through the light-emitting point 22C of the semiconductor laser element 20C is called the third plane. The line parallel to the optical axis L of this lens surface and passing through the light-emitting point 22A of the semiconductor laser element 20A is called the first line. The line parallel to the optical axis L of this lens surface and passing through the light-emitting point 22B of the semiconductor laser element 20B is called the second line. The line parallel to the optical axis L of this lens surface and passing through the light-emitting point 22C of the semiconductor laser element 20C is called the third line.

[0074] In Figures 6 and 7, the first to third planes are shown in a top view by dashed lines m1, m2, and m3, respectively. Similarly, the first to third lines are shown by dashed lines n1, n2, and n3, respectively. Hereafter, the first to third planes will be referred to as planes m1, m2, and m3, respectively, and the first to third lines will be referred to as lines n1, n2, and n3, respectively.

[0075] The light-emitting point 22B of the semiconductor laser element 20B is positioned further from the lens member 80 than plane m1. The light-emitting point 22C of the semiconductor laser element 20C is positioned further from the lens member 80 than plane m2. Thus, in the optical axis L direction of the lens surface, the light-emitting point 22B of the semiconductor laser element 20B is set back relative to the light-emitting point 22A of the semiconductor laser element 20A, and the light-emitting point 22C of the semiconductor laser element 20C is set back relative to the light-emitting point 22B of the semiconductor laser element 20B. The amount of shift of the light-emitting points can be appropriately adjusted by the emission peak wavelength of the light-emitting element, the distance between two adjacent light-emitting points, and the optical properties of the lens member 80, including the refractive index. In this embodiment, the amount of shift of the light-emitting point 22C of the semiconductor laser element 20C relative to the light-emitting point 22A of the semiconductor laser element 20A in the optical axis L direction of the lens surface, that is, the distance d1 between plane m1 and plane m3, can be, for example, 50 μm or more and 100 μm or less. When adjusting light from the perspective of optical control, such as reducing chromatic aberration or adjusting the optical path length of each light, adjustment by shifting the light-emitting point can be performed without requiring new optical components, thus contributing to a reduction in the number of parts.

[0076] In the light-emitting device 100, a submount 30 to which multiple light-emitting elements 20 are joined is located inside the package 10. The submount 30 is joined to the light-emitting elements 20 at one bonding surface, i.e., the top surface 30M. It is also joined to the mounting surface 11M at the other bonding surface on the opposite side.

[0077] The submount 30 has an upper surface 30M on which multiple light-emitting elements 20 are arranged in a row. In the illustrated example, the shape of the upper surface 30M of the submount 30 is a parallelogram. Of the two pairs of parallel sides that make up this parallelogram, one pair of parallel sides is parallel to the optical axis L of at least one lens surface of the lens member 80. In this embodiment, the height w3 of the parallelogram of the upper surface 30M is about 500 μm. In the direction of the optical axis L (direction of the arrow in 2D) The distance d2 from vertex P1 to P2 of the parallelogram can be between 50 μm and 100 μm.

[0078] As illustrated in Figure 7, the outer edge 30B of the upper surface 30M of the submount 30 passes through a point inside the region s1 enclosed by planes m1, m2, line n1, and line n2 in a top view taken from the direction normal to the upper surface 30M of the submount 30, which is further from the lens member 80 than plane m1 and closer to the lens member 80 than plane m2. Furthermore, the outer edge 30B of the upper surface 30M of the submount 30 passes through a point inside the region s2 enclosed by planes m2, m3, line n2, and line n3 in a top view, which is further from the lens member 80 than plane m2 and closer to the lens member 80 than plane m3.

[0079] The submount 30 has an upper surface 30M and a side surface 30A that intersects with the upper surface 30M. The side surface 30A is the end face of the submount 30 on the side where the light-emitting point of the light-emitting element 20 is located. The semiconductor laser element 20A is positioned such that the light-emitting point 22A protrudes from the outer edge 30B located at the boundary between the upper surface 30M and the side surface 30A of the submount 30. The semiconductor laser element 20B is positioned such that the light-emitting point 22B protrudes from the outer edge 30B. The semiconductor laser element 20C is positioned such that the light-emitting point 22C protrudes from the outer edge 30B.

[0080] Three semiconductor laser elements 20A, 20B, and 20C are arranged on the submount 30 such that three light-emitting points 22A, 22B, and 22C are aligned along one of the four sides of the parallelogram on the top surface 30M. In a top view, the optical axis direction (arrow direction of 2D) of at least one lens surface of the lens member 80 intersects the direction in which the outer edge 30B of the submount 30 extends at an angle other than 90°. In other words, the side surface 30A of the submount 30 forms an angle other than 90° with respect to the inner surface of the side wall portion 12 of the package 10. In this embodiment, this inclination angle with respect to the arrow direction of 1D can be determined based on the amount of shift of the light-emitting points described above and the distance between two adjacent light-emitting elements. This inclination angle can be adjusted, for example, to a range of more than 5° and less than or equal to 20°. Even if the amount of shift of the light-emitting points is the same, increasing the inclination angle makes it possible to reduce the distance between two adjacent light-emitting elements, that is, the distance between two light-emitting points.

[0081] The first light (blue light) emitted from the light-emitting point 22A of the semiconductor laser element 20A, the second light (green light) emitted from the light-emitting point 22B of the semiconductor laser element 20B, and the third light (red light) emitted from the light-emitting point 22C of the semiconductor laser element 20C each pass through at least one lens surface of the lens member 80. In addition, the first light, the second light, and the third light pass through one lens surface of the lens member 80. At least one lens surface of the lens member 80 collimates the first, second, and third light.

[0082] At least one of the first, second, and third beams of light has light traveling along the optical axis L of one of the lens surfaces of the lens member 80, while the remaining beams do not have light traveling along the optical axis L of this lens surface. In the illustrated example, of the first, second, and third beams of light passing through one of the lens surfaces of the lens member 80, the second beam has light traveling along the optical axis L of this lens surface, while the first and third beams do not have light traveling along the optical axis L of this lens surface. Furthermore, the distance from the emission point 22A of the first beam to the optical axis L of this lens surface and the distance from the emission point 22C of the third beam to the optical axis L of this lens surface may be the same.

[0083] In this embodiment, the number of light-emitting elements 20 is not limited to three, but may be two or four or more. Figure 8 is an enlarged view of the upper surface 30M of a submount 30 on which two light-emitting elements 20 are arranged. Figure 9 is a plan view of the outer edge of the submount 30 on the side where the light-emitting surfaces 21 of each of the two light-emitting elements 20 are located.

[0084] In the illustrated example, the multiple light-emitting elements 20 include two semiconductor laser elements 20A and 20B with different emission peak wavelengths. The emission peak wavelength of semiconductor laser element 20A is shorter than the emission peak wavelength of semiconductor laser element 20B. In the illustrated example, semiconductor laser element 20A emits blue light, and semiconductor laser element 20B emits green light. Other combinations include, for example, semiconductor laser element 20A emits blue light and semiconductor laser element 20B emits red light, or semiconductor laser element 20A emits green light and semiconductor laser element 20B emits red light.

[0085] In the illustrated example, when viewed from above, the distance w1 between the two light-emitting points 22A and 22B in a direction perpendicular to the optical axis L direction (direction of the arrow in 2D) of at least one lens surface (direction of the arrow in 1D) is, for example, 100 μm or more and 150 μm or less.

[0086] The light-emitting point 22B of the semiconductor laser element 20B is positioned further from the lens member 80 than the plane m1. In the optical axis L direction of the lens surface, the light-emitting point 22B of the semiconductor laser element 20B is recessed relative to the light-emitting point 22A of the semiconductor laser element 20A. In the illustrated example, the amount of shift of the light-emitting point 22B of the semiconductor laser element 20B relative to the light-emitting point 22A of the semiconductor laser element 20A in the optical axis L direction of the lens surface, that is, the distance d1 between the plane m1 and the plane m2, is, for example, 50 μm or more and 100 μm or less.

[0087] As illustrated in Figure 9, the outer edge 30B of the upper surface 30M of the submount 30 passes through a point that is further from the lens member 80 than plane m1 and closer to the lens member 80 than plane m2, inside the region s1 enclosed by planes m1, m2, line n1, and line n2, when viewed from above in the direction normal to the upper surface 30M of the submount 30, and is further from the lens member 80 than plane m1.

[0088] The semiconductor laser element 20A is positioned such that its light-emitting point 22A protrudes from the outer edge 30B located at the boundary between the upper surface 30M and the side surface 30A of the submount 30. The semiconductor laser element 20B is positioned such that its light-emitting point 22B protrudes from the outer edge 30B.

[0089] Two semiconductor laser elements 20A and 20B are arranged on the submount 30 such that two light-emitting points 22A and 22B are aligned along one of the four sides of the parallelogram on the upper surface 30M. In a top view, the optical axis L direction of at least one lens surface of the lens member 80 intersects the direction in which the outer edge 30B extends at an angle other than 90°. In this embodiment, this inclination angle with respect to the direction of the arrow 1D can be determined based on the amount of shift of the light-emitting points described above and the distance between two adjacent light-emitting elements. This inclination angle can be adjusted, for example, to a range of more than 5° and less than or equal to 20°.

[0090] The first light (blue light) emitted from the light-emitting point 22A of the semiconductor laser element 20A and the second light (green light) emitted from the light-emitting point 22B of the semiconductor laser element 20B each pass through one lens surface of the lens member 80. The one lens surface of the lens member 80 collimates the first light and the second light.

[0091] Neither the first light nor the second light has any light traveling along the optical axis L of at least one lens surface of the lens member 80. However, at least one of the first light and the second light may have light traveling along the optical axis L of at least one lens surface of the lens member 80. In the illustrated example, neither the first light nor the second light passing through one lens surface of the lens member 80 has any light traveling along the optical axis L of this lens surface.

[0092] When optical control such as collimation is performed by incidenting multiple light sources of different wavelengths onto a lens surface, chromatic aberration problems may occur. Chromatic aberration refers to axial chromatic aberration, where the image formation position of the light in the optical axis direction differs depending on the wavelength of the light. As in the light-emitting device 100, multiple Chromatic aberration can be reduced by shifting and adjusting the light-emitting point of the light-emitting element 20.

[0093] According to the submount structure and arrangement of multiple light-emitting elements of this embodiment, the ratio of the distance d2 from vertex P1 to P2 of the parallelogram to the height w3 of the parallelogram, i.e., the tilt angle, can be adjusted according to the amount by which the light-emitting points of the light-emitting elements protrude, while taking into account the distance between two light-emitting elements. In this way, by shaping the submount 30 according to the shift of the light-emitting points, it is possible to suppress the vignetting of divergent light caused by the submount, where some of the divergent light hits the upper surface of the submount. According to the light-emitting device 100 of this embodiment, a light-emitting device is realized in which the emission positions of the light emitted from multiple light-emitting elements are precisely implemented.

[0094] Submounts can be manufactured by dividing a plate-shaped submount substrate into multiple parts. Multiple submounts with the same shape can be obtained from a single submount substrate. Figure 10 is a schematic top view showing the cutting lines when cutting a plate-shaped submount substrate 99. As shown in Figure 10, by cutting the plate-shaped submount substrate 99 in a direction parallel to the edge of the submount substrate and in a direction diagonally intersecting that direction, it is possible to obtain multiple submounts, each with a parallelogram shape on its top surface. Cutting can be done, for example, by laser processing. With this method, the parts to be used as submounts are densely arranged within the submount substrate and are separated by straight cutting lines. Adopting submounts with a parallelogram shape on their top surface is also advantageous in terms of ease of manufacturing.

[0095] Referring to Figures 11A to 11C, several other structural examples of the submount in this embodiment will be described. Figure 11A is a top view of submount 30_1. Figure 11B is a perspective view of submount 30_2. Figure 11C is a top view of submount 30_3.

[0096] The shape of the submount in this disclosure does not necessarily have to be a parallelogram. Various shapes can be adopted depending on the package mounting conditions, as long as, in a top view, the optical axis L direction of at least one lens surface of the lens member 80 and the direction in which the outer edge 30B of the submount extends intersect at an angle other than 90°.

[0097] In the example shown in Figure 11A, only the edge (or outer edge 30B) at the boundary between the top surface 30M and the side surface 30A of the submount 30_1 is inclined, while the opposite edge 30E is not inclined. The shape of the top surface 30M of the submount 30 can be trapezoidal.

[0098] In the example in Figure 11B, only the edge (or outer edge 30B) at the boundary between the upper surface 30M and the side surface 30A of the submount 30_2 is inclined, while the opposite edge is not inclined. The difference between the example in Figure 11A and the example in Figure 11B is that the submount 30_2 has a stepped structure 30D on the side where the light-emitting point of the light-emitting element is located. The stepped structure 30D has the side surface 30A on its inner surface. Thus, the end face of the submount on the side where the light-emitting point of the light-emitting element is located does not necessarily have to be flat. It is sufficient to form the stepped structure 30D to the extent that some of the divergent light hits the upper surface of the submount, that is, to suppress vignetting of the divergent light caused by the submount, thereby securing a triangular prism-shaped space below the light-emitting point of the light-emitting element.

[0099] In the example shown in Figure 11C, the shape of the upper surface 30M of the submount 30_3 is generally rectangular. However, in a top view, one side of the rectangle, which is part of the outer edge of the submount 30 on the side where the light-emitting point of the light-emitting element is located, has a recess. This recess forms two recesses 30F on the side surface 30A of the submount 30. The recesses 30F are grooves that extend in the thickness direction of the submount 30. The depth of the recesses 30F in the optical axis direction of the light emitted from the light-emitting surface 21 is This is adjusted according to the shift amount of the light-emitting element described above. Thus, instead of adopting a parallelogram shape in a top view, a recess 30F may be provided on the side surface 30A of the submount 30. This structure can also suppress vignetting of the laser beam caused by the protruding light-emitting point.

[0100] Refer again to Figures 1 through 5.

[0101] Multiple light-emitting elements 20 emit light laterally. Multiple light-emitting elements 20 emit divergent light from the light-emitting surface 21 toward the outer surface of the package 10 that has the light-extraction surface 10A, which is one or more outer surfaces of the package 10. The light traveling along the optical axis emitted from the light-emitting surface 21 travels parallel to the mounting surface 11M. The light emitted from the light-emitting elements 20 passes through the side wall portion 12 of the package 10 and is emitted laterally from the light-transmitting region 13. The outer shape of the package 10 increases as the number of components arranged on the mounting surface 11M increases, but the expansion of the outer shape can be suppressed more on the sides than on the top. If the outer shape can be made smaller on the sides than on the top, the size of the surface on which the light-extraction surface 10A is provided can be suppressed by emitting light from the side.

[0102] In the light-emitting device 100, the temperature measuring element 60B is located inside the package 10. The temperature measuring element 60B is located on the mounting surface 11M. The temperature measuring element 60B is positioned on the wiring area 14. The temperature measuring element 60B is also electrically connected to two wiring areas 14. The temperature measuring element 60B is positioned for the purpose of measuring the temperature of the light-emitting element 20.

[0103] The distance from the temperature measuring element 60B to the light-emitting element 20 is shorter than the distance from the protective element 60A to the light-emitting element 20. By positioning the temperature measuring element 60B closer to the light-emitting element 20, the accuracy of temperature measurement of the light-emitting element 20 can be improved.

[0104] When the protective element 60A is electrically connected to a set of wiring regions 14 arranged in one direction, the temperature measuring element 60B is electrically connected to a set of wiring regions 14 arranged in a direction perpendicular to this one direction.

[0105] Multiple sets of wiring regions 14, to which multiple protective elements 60A are electrically connected, are arranged in the same direction. In addition, in one set of wiring regions 14 to which protective elements 60A are electrically connected, the two wiring regions 14 are arranged such that, when viewed from above, their distances from the submount 30 are approximately equal.

[0106] On the other hand, in one set of wiring regions 14 to which the temperature measuring element 60B is electrically connected, the two wiring regions 14 are at different distances from the submount 30 when viewed from above, and this difference is greater than or equal to the width of the temperature measuring element 60B.

[0107] Wiring 70 for electrical connection to the light-emitting element 20 is connected to the wiring region 14 to which the protective element 60A is electrically connected, while wiring 70 for electrical connection to the light-emitting element 20 is not connected to the wiring region 14 to which the temperature measuring element 60B is electrically connected. Taking this into consideration, the orientation of the wiring regions 14 is changed accordingly.

[0108] In the light-emitting device 100, the wiring 70 connects the wiring area 14 of the package 10 and the light-emitting element 20 on the side of the light-emitting element 20 (the side including the side opposite to the light-emitting element 21) with a straight line parallel to the light-emitting surface 21 of the light-emitting element 20 as the boundary when viewed from above. This makes it easier to avoid the wiring 70 interfering with the optical path of the light.

[0109] In the light-emitting device 100, a sealed, closed space is created inside the package 10. Furthermore, by joining the first substrate 15 and the cap 16 under a predetermined atmosphere, a hermetically sealed closed space is created inside the package 10. By hermetically sealing the space in which the light-emitting element 20 is arranged, quality degradation due to dust collection can be suppressed. Note that if the entire light-emitting device 100 is used in an environment or atmosphere where there is no need to worry about quality degradation due to dust collection or moisture in the air, the cap 16 is unnecessary. For example, if the entire light-emitting device 100 is sealed by an enclosure, it is not necessary to cover the light-emitting element 20 with the cap 16.

[0110] In the light-emitting device 100, the package 10 is mounted on the second substrate 90. The first substrate 15 of the package 10 is also mounted on the second substrate 90. Various electronic components arranged on the mounting surface 11M can be electrically connected to an external circuit of the light-emitting device 100 via multiple wiring regions 14 of the first substrate 15 and multiple wiring regions 96 of the second substrate 90.

[0111] In the light-emitting device 100, the lens member 80 is mounted on the second substrate 90. However, the lens member 80 may be mounted on the first substrate 15 of the illustrated light-emitting device 100, for example, if it is the same size as the second substrate 90. The lens member 80 is located outside the package 10 and is not surrounded by the side wall portion 12. This allows the size of the package 10 to be reduced.

[0112] The lower surface of the lens member 80 is lower than the mounting surface 11M. By joining the lower surface of the lens member 80 to the upper surface of the second substrate 90, the lower surface of the lens member 80 can be positioned lower than the mounting surface 11M. With this arrangement, light emitted from the package 10 can be incident on the lens member 80 at a position lower than the plane including the mounting surface 11M.

[0113] Light emitted from multiple light-emitting elements 20 and then emitted from the light-transmitting region 13 to the outside of the package 10 is incident on the lens member 80. The lens member also collimates the incident light before emitting it.

[0114] The central axis of the light extracted from the light extraction surface 10A is oriented in the direction in which the mounting surface 11M of the base 11 expands. In the lens member 80, the optical axis L of the lens surface from which light is emitted and the central axis of the light extracted from the light extraction surface 10A are at the same height from the mounting surface 11M of the base 11.

[0115] The central axis of the light extracted from the light extraction surface 10A is perpendicular to the light extraction surface 10A. The optical axis L of the lens surface from which light is emitted in the lens member 80 is also perpendicular to the light extraction surface 10A. Here, perpendicularity includes a difference of ±5 degrees. Furthermore, the central axis of the light does not necessarily have to be perpendicular to the light extraction surface 10A.

[0116] In the illustrated example of the light-emitting device 100, multiple light-emitting elements 20 are arranged inside the package 10. Light emitted from the multiple light-emitting elements 20 and exiting the package 10 from the translucent region 13 is incident on one lens surface of the lens member 80 on the light-incident side and exits from one lens surface on the light-exit side. The light exiting from the one lens surface is collimated by the lens member 80. In the illustrated example of the light-emitting device 100, light emitted from three light-emitting elements 20 and exiting the package 10 from the translucent region 13 is incident on the lens surface of the lens member 80 on the light-incident side, and each is collimated and exits from the lens surface on the light-exit side. By collimating and controlling the light from multiple light-emitting elements 20 with a single lens surface, the lens member 80 can be made smaller than if each light-emitting element 20 had a separate lens surface. This can contribute to miniaturization of the light-emitting device 100.

[0117] In the example shown in Figure 2, when viewed from above, the outer edge of the submount 30 on the side where the light-emitting point of the light-emitting element 20 is located approaches the side wall 12 of the package 10 from the top to the bottom of the drawing. A submount 30 is placed inside the package 10. The three light-emitting elements 20 are arranged on the submount 30 from top to bottom in the order of, for example, RGB. However, conversely, as shown in Figure 12, the submount 30 is placed inside the package 10 such that, in a top view, the outer edge of the submount 30 on the side where the light-emitting points of the light-emitting elements 20 are located moves away from the side wall portion 12 of the package 10 from top to bottom in the drawing. In this case, the three light-emitting elements 20 are arranged on the submount 30 from top to bottom in the order of, for example, BGR. Naturally, such configuration examples are also within the scope of this disclosure.

[0118] In this embodiment, an example has been described in which semiconductor laser element 20A emits blue light, semiconductor laser element 20B emits green light, and semiconductor laser element 20C emits red light, but the disclosure is not limited thereto. For example, semiconductor laser element 20A may emit red light, semiconductor laser element 20B may emit green light, and semiconductor laser element 20C may emit blue light. In this case, the order of arrangement of the RGB semiconductor laser elements is reversed from the example described above, and among the three light-emitting points 22A, 22B, and 22C, the light-emitting point 22A of semiconductor laser element 20A, which emits red light, is positioned to protrude the most, that is, to be closest to the side wall 12. By combining such an arrangement with an achromatic lens, it is possible to reduce chromatic aberration. An achromatic lens has a structure in which multiple lenses with different optical properties are bonded together and is generally used to correct chromatic aberration. For example, if red laser light diverges more significantly in the thickness direction of the submount compared to blue or green laser light, the red laser light is more likely to hit parts of the substrate 90 or lens member 80 other than the lens surface than the blue or green laser light.

[0119] By making the light-emitting point of the red semiconductor laser element protrude as far as possible, vignetting of the laser light can be effectively suppressed, but this protrusion causes chromatic aberration. By utilizing an achromatic lens designed to correct this chromatic aberration, it is possible to suppress vignetting of red laser light while reducing chromatic aberration.

[0120] While embodiments of the present invention have been described above, the light-emitting device according to the present invention is not strictly limited to the light-emitting devices of the embodiments. In other words, the present invention is not limited to the external form and structure of the light-emitting device disclosed in the embodiments. For example, it may be a light-emitting device without protective elements. Furthermore, it can be applied without requiring all components to be provided in sufficient quantities. For example, if some of the components of the light-emitting device disclosed in the embodiments are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, or change of material, and the invention described in the claims is then specified to be applicable. [Industrial applicability]

[0121] Each embodiment of the light-emitting device can be used in head-mounted displays, projectors, lighting, displays, and the like. [Explanation of Symbols]

[0122] 10: Package 10A: Light extraction surface 11: Base 11M: Mounting surface 11P: Peripheral area 12: Side wall section 13: Translucent area 14: Wiring area 15: Circuit board (first circuit board) 16: Cap 20: Light-emitting element 30, 30_1, 30_2, 30_3: Submount 30A: Side 30B: Outer edge 30M:Top surface 31: Wiring area 60A: Protective element 60B: Temperature measuring element 70: Wiring 80: Lens component 90: Circuit board (second circuit board) 96: Wiring area 97: Heat conductive material 100: Light-emitting device

Claims

1. Top surface and, A first set of wiring regions, consisting of a first wiring region and a second wiring region arranged side by side on the upper surface in a first direction, A second set of wiring regions, consisting of a third wiring region and a fourth wiring region, arranged on the top surface in a second direction which is perpendicular to the first direction when viewed from above, An arrangement area on the upper surface, located away in the second direction from both the wiring area of ​​the first set and the wiring area of ​​the second set, where the light-emitting elements are arranged, Equipped with, A circuit board in which the wiring regions of the first set and the wiring regions of the second set are arranged side by side in the first direction.

2. In the second direction, at least a portion of the wiring area of ​​the first set faces at least a portion of the arrangement area, The substrate according to claim 1, wherein in the second direction, at least a portion of the wiring area of ​​the second set and at least a portion of the arrangement area face each other.

3. With respect to the second direction, the width of the first wiring region is the same as the width of the second wiring region. With respect to the second direction, the width of the third wiring region is greater than the width of the fourth wiring region, according to claim 1 or 2.

4. In a top view, the shape of the third wiring region is a rectangle in which the width in the first direction is greater than the width in the second direction. The substrate according to any one of claims 1 to 3, wherein, in a top view, the shape of the fourth wiring region is a rectangle in which the width in the first direction is greater than the width in the second direction.

5. The wiring area of ​​the first set is a wiring area where the first electronic component is arranged and for electrical connection to the first electronic component. The wiring area of ​​the second set is a wiring area where the second electronic component is placed and for electrical connection to the second electronic component. The substrate according to any one of claims 1 to 4, wherein the first electronic component and the second electronic component are different electronic components.

6. The substrate according to claim 5, wherein, in a top view, the first electronic component and the second electronic component have different external dimensions.

7. The substrate according to claim 6, wherein the first wiring region and the second wiring region each have a region where wiring for electrically connecting the light-emitting element to the wiring region of the first set is joined.

8. The substrate according to claim 7, wherein no wiring is connected to the wiring region of the second set for electrically connecting the light-emitting element to the wiring region of the second set.

9. The first electronic component is a protective element, The substrate according to any one of claims 5 to 8, wherein the second electronic component is a temperature measuring element.

10. The substrate according to claim 9, wherein the distance from the temperature measuring element to the placement area is shorter than the distance from the protective element to the placement area.

11. A substrate comprising: an upper surface having a placement area; a first set of wiring areas consisting of a first wiring area and a second wiring area arranged side by side on the upper surface in a first direction; and a second set of wiring areas consisting of a third wiring area and a fourth wiring area arranged side by side on the upper surface in a second direction which is perpendicular to the first direction when viewed from above; A light-emitting element arranged in the aforementioned arrangement region, A first electronic component is placed in the wiring area of ​​the first set and electrically connected to the wiring area of ​​the first set, A second electronic component is located in the wiring area of ​​the second set and is electrically connected to the wiring area of ​​the second set, Equipped with, The wiring area of ​​the first set and the wiring area of ​​the second set are arranged side by side in the first direction. A light-emitting device in which the wiring area of ​​the first set and the wiring area of ​​the second set are provided at a position away from the arrangement area in the second direction.

12. The first wiring region and the second wiring region each have a region where wiring is connected to electrically connect the light-emitting element to the wiring region of the first set. The light-emitting device according to claim 11, wherein no wiring is connected to the wiring area of ​​the second set for electrically connecting the light-emitting element to the wiring area of ​​the second set.

13. The first electronic component is arranged in the first wiring region and the second wiring region. The light-emitting device according to claim 11 or 12, wherein the second electronic component is located in the third wiring region and is not located in the fourth wiring region.

14. In the second direction, at least a portion of the wiring area of ​​the first set faces at least a portion of the arrangement area, The light-emitting device according to any one of claims 11 to 13, wherein in the second direction, at least a portion of the wiring area of ​​the second set faces at least a portion of the arrangement area.

15. The first electronic component is a protective element, The second electronic component is a temperature measuring element, The light-emitting device according to any one of claims 11 to 14, wherein the distance from the temperature measuring element to the placement area is shorter than the distance from the protective element to the placement area.

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