device

Abstract

To provide a device, equipped with three or more circuit members overlapping one another, whose height can be reduced.SOLUTION: A device 10 comprises a first circuit member 40, a second circuit member 50, and a third circuit member 60. The first circuit member 40 has: a first main part 41 in which a main electrode 422 is formed; and a first flexible substrate 46 in which a first collective electrode part 47 is formed. The second circuit member 50 has: a second main part 51 in which a second conductive pattern is formed; and a second flexible substrate 56 in which a second collective electrode part 57 is formed. The third circuit member 60 has: a third main part 61 in which a third conductive pattern is formed; and a third flexible substrate 66 in which a third collective electrode part 67 is formed. The first collective electrode part 47, the second collective electrode part 57, and the third collective electrode part 67 overlap one another in the vertical direction. The first main part 41, the second main part 51, and the third main part 61 are separated from one another when viewed along the vertical direction.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a device including three or more circuit members overlapping each other.

Background Art

[0002] For example, Patent Document 1 discloses this type of device.

[0003] Referring to FIG. 19, Patent Document 1 discloses a laminated circuit board (device) 90 including four circuit boards (circuit members) 92 and three insulating sheets 94. The circuit members 92 overlap each other with the insulating sheets 94 interposed therebetween. Each of the circuit members 92 has a wiring layer 922 made of a conductor formed thereon. Each of the wiring layers 922 is provided with various elements 924 such as capacitors and electrodes 926. Each of the electrodes 926 has a through hole 928 formed therein. The through holes 928 are at the same position as each other in the horizontal plane and are filled with solder 98. The electrodes 926 are connected to each other by the solder 98, whereby the wiring layers 922 of the circuit members 92 are electrically connected to each other. According to Patent Document 1, a device 90 including a plurality of circuit members 92 electrically connected to each other can be obtained.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Each of the circuit members 92 of Patent Document 1 includes various elements 924. Therefore, when the circuit members 92 are stacked to form the device 90, the height of the device 90 tends to increase.

[0006] Therefore, the present invention aims to provide a device comprising three or more overlapping circuit members that can be made low-profile. [Means for solving the problem]

[0007] The present invention provides, as a first device, A device comprising a first circuit member, a second circuit member, and at least one third circuit member, The first circuit member comprises a first main part and a first flexible substrate, and has first wiring formed on it. The first main part and the first flexible substrate are connected to each other. The first main part has a first main function part for realizing the function of the first circuit member, The first flexible substrate has a first concentrated electrode portion, Two or more first electrodes are formed on the first concentrated electrode portion. The first wiring connects at least one of the first electrodes to the first main function unit. The second circuit member comprises a second main part and a second flexible substrate, and has second wiring formed on it. The second main part and the second flexible substrate are connected to each other. The second main part has a second main function part for realizing the function of the second circuit member, The second flexible substrate has a second integrated electrode section, Two or more second electrodes are formed in the aforementioned second concentrated electrode portion. The second wiring connects at least one of the second electrodes to the second main function unit. The third circuit member comprises a third main part and a third flexible substrate, and has a third wiring formed on it. The third main part and the third flexible substrate are connected to each other. The third main part has a third main functional part for realizing the function of the third circuit member, The third flexible substrate has a third integrated electrode portion, Two or more third electrodes are formed on the aforementioned third concentrated electrode portion. The third wiring connects at least one of the third electrodes to the third main function unit. The first concentrated electrode section, the second concentrated electrode section, and the third concentrated electrode section overlap each other in the vertical direction. The third concentrated electrode portion is located between the first concentrated electrode portion and the second concentrated electrode portion in the vertical direction. Each of the first electrodes is exposed upwards. Each of the aforementioned second electrodes is exposed downwards. Each of the third electrodes has an upper end surface exposed upward and a lower end surface exposed downward, and the upper end surface and the lower end surface are electrically connected to each other. At least one of the first electrodes and at least one of the second electrodes are connected to each other via one of the third electrodes. The first main part, the second main part, and the third main part are separated from each other when viewed along the vertical direction. We provide devices.

[0008] The present invention provides a second device, which is the first device, A predetermined number of the first electrodes are formed on the first concentrated electrode portion. A second predetermined number of the second electrodes are formed on the second concentrated electrode portion. A third predetermined number of the third electrodes are formed on the third concentrated electrode portion. The first predetermined number, the second predetermined number, and the third predetermined number are all the same. The first electrode is arranged according to a predetermined electrode arrangement, the second electrode is arranged according to the predetermined electrode arrangement, and the third electrode is arranged according to the predetermined electrode arrangement. The first electrode is connected to the second electrode via the third electrode. We provide devices.

[0009] As a third device, the present invention provides a first or second device, The device includes a first sealing member and a second sealing member, A sealed space is formed in the device, The sealed space is at least partially surrounded by the first sealing member and the second sealing member and is blocked from the outside of the device, Each of the first circuit member, the second circuit member, and the third circuit member is at least partially sealed inside the sealed space, At least one of the at least one first electrode and the at least one second electrode is pressed against one of the third electrodes and connected to each other. A device is provided.

[0010] As a fourth device, the present invention provides a third device, The first sealing member is based on a first film made of a film and includes a conductive portion made of a conductor, The sealed space is surrounded by the first sealing member and the second sealing member, Each of the first circuit member, the second circuit member, and the third circuit member is sealed inside the sealed space, At least one of the first main functional portion, the second main functional portion, and the third main functional portion includes a main electrode, The conductive portion is in contact with the main electrode inside the sealed space and is partially exposed outside the device. A device is provided.

[0011] As a fifth device, the present invention provides a third device, The first sealing member is based on a first film made of a film and includes a frame-shaped film made of a film, An opening is formed in the first film, The edge of the opening forms a closed circuit. The aforementioned frame-shaped film has a closed-circuit shape, At least one of the first main function section, the second main function section, and the third main function section includes a main electrode. At least one of the first main part, the second main part, and the third main part comprises an exposed portion and a sealed portion. The main electrode is provided in the exposed portion, The exposed portion and the sealed portion face the first film. The sealing portion surrounds the exposed portion all around, The frame-shaped film has a film sealing portion and a circuit sealing portion. The film sealing portion is fixed to the first film so as to surround the opening all around. The circuit sealing portion is fixed to the sealing portion so as to surround the exposed portion all around. The sealed space, excluding the exposed portion, is surrounded by the first sealing member and the second sealing member. The exposed portion is exposed to the outside of the sealed space, Each of the first, second, and third circuit members is sealed inside the sealed space, except for the exposed portion. We provide devices.

[0012] The present invention relates to a sixth device, which is a third device, The first sealing member comprises a first film made of a film as a base, and also comprises a conductive gel. At least one of the first main function section, the second main function section, and the third main function section includes a main electrode. The conductive gel is in contact with the main electrode inside the sealed space and is partially exposed to the outside of the device. We provide devices. [Effects of the Invention]

[0013] According to the present invention, the first main function section, the second main function section, and the third main function section can be electrically connected to each other via the first integrated electrode section, the second integrated electrode section, and the third integrated electrode section, which overlap each other. For example, each of the first main function section, the second main function section, and the third main function section can be provided with various elements such as an integrated circuit (IC) chip, and a main electrode that can be connected to the outside of the device can be provided. That is, the device of the present invention can be used as an electronic device comprising three or more electronic circuits that are connected to each other.

[0014] According to the present invention, the first, second, and third integrated electrode sections, which overlap each other, are each made of a flexible substrate. By reducing the thickness of the flexible substrate, the height of the overlapping sections can be reduced. Furthermore, the first, second, and third main sections, on which the first, second, and third main functional sections are formed, do not overlap each other in the vertical direction. Therefore, even when various elements such as IC chips are provided in each of the first, second, and third main functional sections, the overall height of the device remains almost unchanged. As can be understood from the above description, the present invention provides a device comprising three or more overlapping circuit members that can be made low-profile. [Brief explanation of the drawing]

[0015] [Figure 1] This is a perspective view showing a device according to an embodiment of the present invention. The positions of the second and third main function units are indicated by dashed lines. [Figure 2] This is a top view of the device shown in Figure 1. The positions of the second and third main function units are indicated by dashed lines. [Figure 3] Figure 2 is an end view showing the aggregated electrode section of the device along the line III-III. A portion of the device (the area enclosed by the dashed line) is shown in magnified detail. [Figure 4] Figure 1 is an exploded perspective view showing the device. The positions of the second and third main functional units are indicated by dashed lines. [Figure 5]Figure 4 is a top view showing the first circuit component of the device. Hidden first wiring is shown with dashed lines. The boundaries of the exposed and sealed parts are shown with dotted lines. [Figure 6] Figure 4 is a top view showing the second circuit component of the device. Hidden second wiring is shown with dashed lines. The position of the second main function is shown with a dashed line. [Figure 7] This is a top view showing one of the two third circuit components of the device in Figure 4. Hidden third wiring is shown with a dashed line. The position of the third main function is shown with a dashed line. [Figure 8] This is a top view showing one of the two third circuit components of the device in Figure 4. Hidden third wiring is shown with a dashed line. The location of the third main function is shown with a dashed line. [Figure 9] This is a perspective view showing a first modified example of the device in Figure 1. The outlines of hidden circuit structures are drawn with dashed lines. [Figure 10] Figure 9 is an exploded perspective view showing the device. A portion of the first film (outlined by a dashed line) and a portion of the second film (outlined by a dashed line) are shown in magnified detail. The air valve is open. [Figure 11] Figure 10 is an exploded perspective view showing the air valve. A portion of the first film is depicted with dashed lines. [Figure 12] Figure 9 is a schematic end view of the device along the line XII-XII. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. A side view of the vacuuming equipment is depicted. [Figure 13] This is a perspective view showing a second modified example of the device in Figure 1. The contours of the hidden circuit structures are drawn with dashed lines. The contours of the hidden edges of the opening of the first film are drawn with dotted lines. [Figure 14] Figure 13 is an exploded perspective view showing the first sealing member of the device. The boundary between one of the frame-shaped film sealing portions and the circuit sealing portion is drawn with a dashed line. The air valve is open. [Figure 15]Figure 13 is a schematic end view of the device along the line XV-XV. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 16] This is a perspective view showing a third modified example of the device in Figure 1. The outlines of hidden circuit structures are drawn with dashed lines. [Figure 17] Figure 16 is an exploded perspective view showing the first sealing member of the device. The air valve is open. [Figure 18] Figure 16 is a schematic end view of the device along the line XVIII-XVIII. This figure is intended to schematically represent the internal structure of the device, and the size and arrangement of each component do not correspond to the actual size and arrangement. [Figure 19] This is a cross-sectional view showing the device described in Patent Document 1. [Modes for carrying out the invention]

[0016] Referring to Figure 1, the device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can operate independently without being physically attached to other electronic devices (not shown). For example, the device 10 can be attached near the heart of a subject while housed inside a sheet-like member described later. The device 10 attached in this manner measures the subject's electrocardiogram and heart rate and transmits the measurement results to other electronic devices. That is, the device 10 can be used as an electronic device that measures biological information such as electrocardiograms. However, the present invention is not limited thereto and can be applied to devices with various functions. For example, the device 10 may be used independently without being housed in the sheet-like member described above.

[0017] As shown in Figures 1 and 2, the device 10 of this embodiment includes a circuit structure 12. The circuit structure 12 is a component that enables the device 10 to function as an electronic device. The device 10 of this embodiment includes only the circuit structure 12. However, the present invention is not limited thereto, and the device 10 may include other components (for example, the sheet-like component described above) in addition to the circuit structure 12.

[0018] As shown in Figures 1 and 4, the circuit structure 12 of this embodiment comprises a first circuit member 40, a second circuit member 50, and two third circuit members 60. The third circuit member 60 includes a third circuit member 602 and a third circuit member 604. That is, the device 10 comprises the first circuit member 40, the second circuit member 50, the third circuit member 602, and the third circuit member 604. The second circuit member 50, the third circuit member 604, the third circuit member 602, and the first circuit member 40 are stacked in this order from top to bottom in the vertical direction to form a single circuit structure 12. In this embodiment, the vertical direction is the Z direction. Up is the +Z direction, and down is the -Z direction.

[0019] As described above, the circuit structure 12 of this embodiment comprises four overlapping circuit members (a first circuit member 40, a second circuit member 50, and two third circuit members 60). In other words, the electronic functions of the circuit structure 12 are divided into four parts and implemented in each of the four circuit members. However, the present invention is not limited thereto. For example, the circuit structure 12 may further comprise other circuit members or electronic components in addition to the four circuit members described above. On the other hand, the circuit structure 12 may comprise only one of the third circuit member 602 and the third circuit member 604. That is, the device 10 only needs to comprise the first circuit member 40, the second circuit member 50, and at least one third circuit member 60.

[0020] The following describes each circuit component of the device 10 in this embodiment.

[0021] Referring to Figures 4 and 5, the first circuit member 40 of this embodiment has the following structure.

[0022] The first circuit member 40 comprises three first main parts 41 and one first flexible substrate 44. The first main parts 41 are rigid (i.e., rigid and resistant to bending) circuit boards. The first flexible substrate 44 is a flexible circuit board that is thin and pliable. Each of the first main parts 41 and the first flexible substrate 44 extends parallel to a horizontal plane (XY plane) perpendicular to the vertical direction.

[0023] Each of the first main parts 41 and the first flexible substrate 44 are connected to each other in a horizontal direction perpendicular to the vertical direction. More specifically, the first flexible substrate 44 has one first aggregate electrode part 46 and three first connecting parts 48, each corresponding to the first main part 41. The first connecting parts 48 are connected to the first aggregate electrode part 46 in the horizontal direction and extend radially from the first aggregate electrode part 46 in the XY plane. In other words, the first connecting parts 48 extend parallel to the XY plane along different directions from the first aggregate electrode part 46. Each of the first main parts 41 is connected to the corresponding first connecting part 48 in the horizontal direction.

[0024] The first circuit member 40 of this embodiment has the basic structure described above. Each of the first main parts 41 is a separate component from the first flexible substrate 44. Each of the first aggregate electrode part 46 and the first connecting part 48 is a part of a single first flexible substrate 44. However, the present invention is not limited thereto. For example, the number of first main parts 41 may be one or two, or four or more. The first main parts 41 may be part of a flexible circuit board. Each of the first connecting parts 48 may be a rigid circuit board separate from the first flexible substrate 44. The first connecting parts 48 may be provided as needed. For example, when the device 10 is used as a wearable device that fits curved surfaces such as the human body, it is preferable to provide flexible first connecting parts 48.

[0025] The first circuit member 40 of this embodiment functions as a receiving device that receives electrical signals (hereinafter referred to as "biological signals") resulting from the electrocardiogram of the subject. Each of the first main parts 41 has a first main function part 42 for realizing the functions of the first circuit member 40 described above. More specifically, the first main function part 42 of this embodiment includes a main electrode 422 made of a conductor such as Ag. Each of the main electrodes 422 is a part for receiving biological signals from the chest of the subject. Each of the main electrodes 422 is exposed upwards.

[0026] Each of the first main function units 42 in this embodiment includes only one main electrode 422. That is, the first circuit member 40 in this embodiment has three main electrodes 422. However, the present invention is not limited thereto. For example, each of the first main function units 42 may include an electronic circuit for amplifying the biological signal received by the main electrode 422. That is, each of the first main function units 42 may include various elements such as an IC (integrated circuit) chip, a capacitor, and an inductor in addition to the main electrode 422. The number of main electrodes 422 in the first circuit member 40 may be one or two, or it may be four or more.

[0027] The function of the first circuit member 40 of the present invention is not limited to this embodiment. The structure of each of the first main functional units 42 can be varied in various ways depending on the function of the first circuit member 40. For example, each of the first main functional units 42 may include various elements such as IC chips instead of the main electrode 422.

[0028] In this embodiment, the first aggregation electrode section 46 is a relay section for transmitting the biological signal received by the main electrode 422 to the third circuit member 604. The first aggregation electrode section 46 has a first predetermined number of first electrodes 462 formed thereon. In this embodiment, the first predetermined number is 16. The first electrodes 462 are arranged in a 4x4 grid. That is, the first electrodes 462 form a 4x4 grid array. However, the present invention is not limited thereto. For example, the number of first electrodes 462 may be 2. That is, the first aggregation electrode section 46 only needs to have 2 or more first electrodes 462 formed thereon.

[0029] The first main functional unit 42 is connected to the first flexible substrate 44. The first flexible substrate 44 has a three-layer structure consisting of an upper insulating layer (not shown), a wiring layer (not shown), and a lower insulating layer (not shown). The wiring layer is located between the upper insulating layer and the lower insulating layer in the vertical direction. The wiring layer includes first wiring 49. That is, the first circuit member 40 has first wiring 49 formed on it.

[0030] The first wiring 49 of this embodiment includes three conductive patterns, each corresponding to a main electrode 422. Each conductive pattern of the first wiring 49 connects one of the first electrodes 462 to the corresponding main electrode 422. The biosignals obtained by each of the main electrodes 422 are transmitted to the first electrode 462 via the corresponding conductive pattern. The first wiring 49 of this embodiment has the structure described above. However, the structure of the first wiring 49 of the present invention is not particularly limited, as long as the first wiring 49 connects at least one of the first electrodes 462 to the first main function unit 42. Furthermore, the layer structure of the first flexible substrate 44 of the present invention is not particularly limited.

[0031] Referring to Figures 4 and 7, the third circuit member 602 of the third circuit member 60 in this embodiment has the following structure.

[0032] The third circuit member 602 comprises one third main portion 61 and one third flexible substrate 64. The third main portion 61 is a rigid circuit board. The third flexible substrate 64 is a flexible circuit board that is thin and pliable. Both the third main portion 61 and the third flexible substrate 64 extend parallel to the XY plane.

[0033] The third main section 61 and the third flexible substrate 64 are connected to each other in a horizontal direction perpendicular to the vertical direction. Specifically, the third flexible substrate 64 has one third aggregate electrode section 66 and one third connecting section 68. The third connecting section 68 is connected to the third aggregate electrode section 66 in the horizontal direction and extends horizontally from the third aggregate electrode section 66. The third main section 61 is connected to the third connecting section 68 in the horizontal direction.

[0034] The third circuit member 602 of this embodiment has the basic structure described above. The third main part 61 is a separate component from the third flexible substrate 64. The third aggregate electrode part 66 and the third connecting part 68 are each part of a single third flexible substrate 64. However, the present invention is not limited thereto. For example, the number of third main parts 61 may be two or more. The third main part 61 may be part of a flexible circuit board. The third connecting part 68 may be a rigid circuit board separate from the third flexible substrate 64. The third connecting part 68 may be provided as needed. For example, when the device 10 is used as a wearable device, it is preferable to provide a flexible third connecting part 68.

[0035] The third circuit member 602 in this embodiment functions as a power supply device that supplies power to other circuit members (the second circuit member 50 and the third circuit member 604). The third main unit 61 has a third main function unit 62 for realizing the functions of the third circuit member 602 described above. For example, the third main function unit 62 includes a power storage circuit that receives and stores power from an external source in a contactless manner, and a power supply circuit that supplies the stored power to other circuit boards. That is, the third main function unit 62 includes various elements such as IC chips.

[0036] The third main function unit 62 in this embodiment includes an element but does not include an electrode that contacts the outside. However, the present invention is not limited thereto. For example, the third main function unit 62 may further include an electrode for receiving power from the outside in a contact manner. The number of third main function units 62 in the third circuit member 602 may be two or more. Furthermore, the function of the third circuit member 602 of the present invention is not limited to this embodiment. The structure of the third main function unit 62 can be modified in various ways depending on the function of the third circuit member 602. For example, the third main function unit 62 may include a main electrode 422 instead of an element.

[0037] The third aggregate electrode section 66 in this embodiment is a relay section for transmitting power to other circuit boards. The third aggregate electrode section 66 has a third predetermined number of third electrodes 662 formed thereon. In this embodiment, the third predetermined number is 16. The third electrodes 662 are arranged in a 4x4 grid. That is, the third electrodes 662 form a 4x4 grid array. However, the present invention is not limited thereto. For example, the number of third electrodes 662 may be 2. That is, the third aggregate electrode section 66 only needs to have 2 or more third electrodes 662 formed thereon.

[0038] The third main functional unit 62 is connected to the third flexible substrate 64. The third flexible substrate 64 has a three-layer structure consisting of an upper insulating layer (not shown), a wiring layer (not shown), and a lower insulating layer (not shown). The wiring layer is located between the upper insulating layer and the lower insulating layer in the vertical direction. The wiring layer includes a third wiring 69. That is, the third wiring 69 is formed on the third circuit member 602.

[0039] The third wiring 69 of this embodiment includes two conductive patterns for transmitting power. Each conductive pattern of the third wiring 69 connects one of the third electrodes 662 to the third main function unit 62. The third wiring 69 of this embodiment has the structure described above. However, the structure of the third wiring 69 of the present invention is not particularly limited as long as the third wiring 69 connects at least one of the third electrodes 662 to the third main function unit 62. Furthermore, the layer structure of the third flexible substrate 64 of the present invention is not particularly limited.

[0040] Referring to Figures 4 and 8, the third circuit member 604 of the third circuit member 60 in this embodiment has the following structure.

[0041] The third circuit member 604 comprises one third main portion 61 and one third flexible substrate 64. The third main portion 61 is a rigid circuit board. The third flexible substrate 64 is a flexible circuit board that is thin and pliable. Both the third main portion 61 and the third flexible substrate 64 extend parallel to the XY plane.

[0042] The third main section 61 and the third flexible substrate 64 are connected to each other in a horizontal direction perpendicular to the vertical direction. Specifically, the third flexible substrate 64 has one third aggregate electrode section 66 and one third connecting section 68. The third connecting section 68 is connected to the third aggregate electrode section 66 in the horizontal direction and extends horizontally from the third aggregate electrode section 66. The third main section 61 is connected to the third connecting section 68 in the horizontal direction.

[0043] The third circuit member 604 of this embodiment has the basic structure described above. The third main part 61 is a separate component from the third flexible substrate 64. The third aggregate electrode part 66 and the third connecting part 68 are each part of a single third flexible substrate 64. However, the present invention is not limited thereto. For example, the number of third main parts 61 may be two or more. The third main part 61 may be part of a flexible circuit board. The third connecting part 68 may be a rigid circuit board separate from the third flexible substrate 64. The third connecting part 68 may be provided as needed. For example, when the device 10 is used as a wearable device, it is preferable to provide a flexible third connecting part 68.

[0044] In this embodiment, the third circuit member 604 operates using power supplied by the third circuit member 602 and functions as a sensor that measures an electrocardiogram based on the biosignals acquired by the first circuit member 40. The third main unit 61 has a third main function unit 62 for realizing the functions of the third circuit member 604 described above. For example, the third main function unit 62 includes a sensor circuit consisting of various elements. That is, the third main function unit 62 includes various elements such as IC chips.

[0045] The third main function unit 62 in this embodiment includes an element but does not include an electrode that comes into contact with the outside. However, the present invention is not limited thereto. For example, the third main function unit 62 may further include a main electrode 422 for directly receiving biological signals. The number of third main function units 62 in the third circuit member 604 may be two or more. Furthermore, the function of the third circuit member 604 of the present invention is not limited to this embodiment. The structure of the third main function unit 62 can be modified in various ways depending on the function of the third circuit member 604. For example, the third main function unit 62 may include a main electrode 422 instead of an element.

[0046] The third aggregate electrode section 66 in this embodiment is a relay section for receiving biological signals and power and transmitting measurement results. The third aggregate electrode section 66 has a third predetermined number of third electrodes 662 formed thereon. In this embodiment, the third predetermined number is 16. The third electrodes 662 are arranged in a 4x4 grid. That is, the third electrodes 662 form a 4x4 grid array. However, the present invention is not limited thereto. For example, the number of third electrodes 662 may be 2. That is, the third aggregate electrode section 66 only needs to have 2 or more third electrodes 662 formed thereon.

[0047] The third main functional unit 62 is connected to the third flexible substrate 64. The third flexible substrate 64 has a three-layer structure consisting of an upper insulating layer (not shown), a wiring layer (not shown), and a lower insulating layer (not shown). The wiring layer is located between the upper insulating layer and the lower insulating layer in the vertical direction. The wiring layer includes the third wiring 69. That is, the third wiring 69 is formed on the third circuit member 604.

[0048] The third wiring 69 of this embodiment includes seven conductive patterns for transmitting biosignals, measurement results, and power. Each conductive pattern of the third wiring 69 connects one of the third electrodes 662 to the third main function unit 62. The third wiring 69 of this embodiment has the structure described above. However, the structure of the third wiring 69 of the present invention is not particularly limited as long as the third wiring 69 connects at least one of the third electrodes 662 to the third main function unit 62. Furthermore, the layer structure of the third flexible substrate 64 of the present invention is not particularly limited.

[0049] Referring to Figures 4 and 6, the second circuit member 50 of this embodiment has the following structure.

[0050] The second circuit member 50 comprises one second main portion 51 and one second flexible substrate 54. The second main portion 51 is a rigid circuit board. The second flexible substrate 54 is a flexible circuit board that is thin and pliable. Both the second main portion 51 and the second flexible substrate 54 extend parallel to the XY plane.

[0051] The second main section 51 and the second flexible substrate 54 are connected to each other in a horizontal direction perpendicular to the vertical direction. Specifically, the second flexible substrate 54 has one second aggregate electrode section 56 and one second connecting section 58. The second connecting section 58 is connected to the second aggregate electrode section 56 in the horizontal direction and extends horizontally from the second aggregate electrode section 56. The second main section 51 is connected to the second connecting section 58 in the horizontal direction.

[0052] The second circuit member 50 of this embodiment has the basic structure described above. The second main part 51 is a separate component from the second flexible substrate 54. The second aggregate electrode part 56 and the second connecting part 58 are each part of a single second flexible substrate 54. However, the present invention is not limited thereto. For example, the number of second main parts 51 may be two or more. The second main part 51 may be part of a flexible circuit board. The second connecting part 58 may be a rigid circuit board separate from the second flexible substrate 54. The second connecting part 58 may be provided as needed. For example, when the device 10 is used as a wearable device, a flexible 2nd connection part 58 It is preferable to provide this.

[0053] In this embodiment, the second circuit member 50 operates using power supplied by the third circuit member 602 and functions as a transmitting device that wirelessly transmits the electrocardiogram measurement results measured by the third circuit member 604 to other electronic devices (not shown). The second main unit 51 has a second main function unit 52 for realizing the functions of the second circuit member 50 described above. For example, the second main function unit 52 includes an MCU (microcontroller unit) and a BLE (Bluetooth Low Energy) unit. That is, the second main function unit 52 includes various elements such as IC chips.

[0054] The second main function unit 52 in this embodiment includes an element but does not include an electrode that contacts the outside. However, the present invention is not limited thereto. For example, the second main function unit 52 may further include an electrode for transmitting measurement results to the outside via a wire. The number of second main function units 52 in the second circuit member 50 may be two or more. Furthermore, the function of the second circuit member 50 of the present invention is not limited to this embodiment. The structure of the second main function unit 52 can be modified in various ways depending on the function of the second circuit member 50. For example, the second main function unit 52 may include a main electrode 422 instead of an element.

[0055] The second aggregate electrode section 56 in this embodiment is a relay section for receiving measurement results and power. A second predetermined number of second electrodes 562 are formed on the second aggregate electrode section 56. In this embodiment, the second predetermined number is 16. The second electrodes 562 are arranged in a 4x4 grid. That is, the second electrodes 562 This forms a 4x4 grid array. However, the present invention is not limited to this. For example, the number of second electrodes 562 may be 2. That is, the second concentrated electrode section 56 only needs to have 2 or more second electrodes 562 formed thereon.

[0056] The second main function unit 52 is connected to the second flexible substrate 54. The second flexible substrate 54 has a three-layer structure consisting of an upper insulating layer (not shown), a wiring layer (not shown), and a lower insulating layer (not shown). The wiring layer is located between the upper insulating layer and the lower insulating layer in the vertical direction. The wiring layer includes a second wiring 59. That is, the second wiring 59 is formed on the second circuit member 50.

[0057] The second wiring 59 in this embodiment includes four conductive patterns for transmitting measurement results and power. Each conductive pattern of the second wiring 59 connects one of the second electrodes 562 to the second main function unit 52. The second wiring 59 in this embodiment has the structure described above. However, the structure of the second wiring 59 in the present invention is not particularly limited as long as the second wiring 59 connects at least one of the second electrodes 562 to the second main function unit 52. Furthermore, the layer structure of the second flexible substrate 54 in the present invention is not particularly limited.

[0058] Referring to Figure 1, the device 10 of this embodiment is an assembly of the four circuit components described above and functions as a single electronic circuit for measuring biological signals. However, the present invention is not limited thereto. For example, the device 10 is not limited to measuring biological signals and can be used for various applications. The device 10 may also include two or more independent electrical circuits. The number of circuit components and the structure of each circuit component may depend on the application of the device 10. According to this embodiment, the design flexibility of the device 10 is improved.

[0059] For example, instead of the first main portion 41 of the first circuit member 40, the main electrode 422 may be provided in either the second main portion 51 of the second circuit member 50 or the third main portion 61 of the third circuit member 60. In this case, an element may be provided in the first main portion 41. That is, at least one of the first main function portion 42, the second main function portion 52, and the third main function portion 62 may include the main electrode 422, and at least one of the first main function portion 42, the second main function portion 52, and the third main function portion 62 may include an element.

[0060] Referring to Figure 2 in conjunction with Figure 3, the first aggregate electrode portion 46 of the first circuit member 40, the second aggregate electrode portion 56 of the second circuit member 50, and the third aggregate electrode portion 66 of the third circuit member 60 are stacked on top of each other in the vertical direction, thereby assembling the device 10. That is, the first aggregate electrode portion 46, the second aggregate electrode portion 56, and the third aggregate electrode portion 66 are stacked on top of each other in the vertical direction. For example, when the device 10 is used without being housed inside a sheet-like member, as described later, the first aggregate electrode portion 46, the second aggregate electrode portion 56, and the third aggregate electrode portion 66 may be fixed to each other by a fixing member such as an adhesive.

[0061] According to this embodiment, the entirety of the first aggregate electrode section 46, the entirety of the second aggregate electrode section 56, and the entirety of the third aggregate electrode section 66 completely overlap in the vertical direction, thereby forming a single aggregate electrode section 13. The aggregate electrode section 13 functions as a signal relay section of the circuit structure 12.

[0062] The first, second, and third concentrated electrode portions 46, 56, and 66 of this embodiment have the same regular polygonal shape in the XY plane, making them easy to align in the XY plane. However, the present invention is not limited thereto. For example, the first, second, and third concentrated electrode portions 46, 56, and 66 may have a circular shape in the XY plane, or they may have different shapes. The first, second, and third concentrated electrode portions 46, 56, and 66 may partially overlap in the vertical direction. That is, the first, second, and third concentrated electrode portions 46, 56, and 66 only need to partially overlap in the vertical direction.

[0063] Referring to Figure 3, the first aggregated electrode section 46 is located at the bottom layer of the aggregated electrode section 13. The second aggregated electrode section 56 is located at the top layer of the aggregated electrode section 13. The two third aggregated electrode sections 66 are located vertically between the first aggregated electrode section 46 and the second aggregated electrode section 56. According to this embodiment, the third aggregated electrode section 66 of the third circuit member 604 is located above the third aggregated electrode section 66 of the third circuit member 602. However, the present invention is not limited thereto. The vertical positional relationship between two or more third aggregated electrode sections 66 is not particularly limited.

[0064] Each of the first electrodes 462 of the first concentrated electrode section 46 is exposed upward. Each of the second electrodes 562 of the second concentrated electrode section 56 is exposed downward. Each of the second electrodes 562 in this embodiment is also exposed upward. Each of the third electrodes 662 of the third concentrated electrode section 66 has an upper end surface 666 exposed upward and a lower end surface 668 exposed downward, and the upper end surface 666 and the lower end surface 668 are electrically connected to each other.

[0065] Referring to Figure 3 in conjunction with Figure 4, the first predetermined number (number of first electrodes 462), the second predetermined number (number of second electrodes 562), and the third predetermined number (number of third electrodes 662) in this embodiment are the same. According to this embodiment, the first electrodes 462 are arranged according to a predetermined electrode arrangement (4x4 grid arrangement), the second electrodes 562 are arranged according to this predetermined electrode arrangement, and each third electrode 662 of the third aggregate electrode section 66 is arranged according to this predetermined electrode arrangement. The first electrodes 462 are connected to the second electrodes 562 via the third electrodes 662 of the two third aggregate electrode sections 66.

[0066] Referring to Figure 3 in conjunction with Figure 2, in this embodiment, each of the first electrodes 462, together with the two third electrodes 662 and one second electrode 562 located directly above it, forms one connecting electrode 132. That is, in this embodiment, 16 connecting electrodes 132 are formed, arranged in a 4x4 grid. In each of the connecting electrodes 132, the upper end surface and the lower end surface are electrically connected to each other. The first main function unit 42, the second main function unit 52, and the third main function unit 62 are electrically connected to each other via the first wiring 49 (see Figure 5), the second wiring 59 (see Figure 6), the third wiring 69 (see Figures 7 and 8), and the connecting electrodes 132.

[0067] According to this embodiment, the first main function unit 42, the second main function unit 52, and the third main function unit 62 can be electrically connected to each other via the connecting electrode 132. Each of the first main function unit 42, the second main function unit 52, and the third main function unit 62 can be provided with an electronic circuit including various elements such as IC chips, and a main electrode 422 that can be connected to the outside of the device 10 can be provided. In other words, the device 10 of this embodiment can be used as an electronic device having three or more electronic circuits that are connected to each other.

[0068] In this embodiment, the connecting electrodes 132 include unused electrodes that are not used for electrical connection with the first main function unit 42, the second main function unit 52, and the third main function unit 62. For example, the four connecting electrodes 132 located in the center of a 4x4 grid arrangement are unused electrodes. Such unused electrodes do not need to be formed. More specifically, the unused first electrode 462, second electrode 562, and third electrode 662 do not need to be formed. On the other hand, from the viewpoint of easily and universally forming the first electrode 462, second electrode 562, and third electrode 662, unused electrodes may be formed as in this embodiment. That is, at least one first electrode 462 and at least one second electrode 562 only need to be connected to each other via one of the third electrodes 662.

[0069] Referring to Figure 3, each of the first electrodes 462 in this embodiment is gold flash plated and protrudes upward beyond the upper surface of the first concentrated electrode portion 46. Similarly, each of the third electrodes 662 in this embodiment protrudes downward beyond the lower surface of the third concentrated electrode portion 66 and also protrudes upward beyond the upper surface of the third concentrated electrode portion 66. Each of the second electrodes 562 in this embodiment protrudes downward beyond the lower surface of the second concentrated electrode portion 56 and also protrudes upward beyond the upper surface of the second concentrated electrode portion 56. According to the above structure, each of the first electrodes 462 can be reliably connected to a predetermined second electrode 562 via a predetermined third electrode 662. However, the present invention is not limited thereto. For example, the upper end of each of the second electrodes 562 may be located below the upper surface of the second concentrated electrode portion 56.

[0070] According to this embodiment, the first, second, and third integrated electrode sections 46, 56, and 66, which overlap each other, are each made of a flexible circuit board. By reducing the thickness of the flexible circuit board, the height of the overlapping portions can be reduced.

[0071] Referring to Figure 2, the first main section 41, the second main section 52, and the third main section 62, each formed on the first main section 42, the second main section 52, and the third main section 62, are connected to the first connecting section 48, the second connecting section 58, and the third connecting section 68, respectively, which extend radially from the aggregate electrode section 13 in different directions, and are separated from each other when viewed along the vertical direction. In other words, the first main section 41, the second main section 51, and the third main section 61 do not overlap each other in the vertical direction. Therefore, even if various elements such as IC chips are provided on each of the first main section 42, the second main section 52, and the third main section 62, the overall height of the device 10 remains almost unchanged.

[0072] As can be understood from the above description, according to this embodiment, a device 10 can be provided that has three or more overlapping circuit members and is capable of being made low-profile. Furthermore, since the connecting electrodes 132 between the first main function section 42, the second main function section 52, and the third main function section 62 are concentrated in the middle part of the device 10 in the XY plane, the size of the device 10 in the XY plane can be reduced while providing various circuit members.

[0073] The circuit structure 12 of the present invention may be used as a single device 10, as described above. Alternatively, the circuit structure 12 may be used housed inside a flexible sheet-like member or a rigid protective member, as shown in the modified examples below.

[0074] Referring to Figures 9 and 10, the device 10A according to the first modification includes a sealing member 14A in addition to the circuit structure 12. The circuit structure 12 has the structure already described and is deformable in various ways as already described. The sealing member 14A houses the entire circuit structure 12 inside and protects the circuit structure 12 from the external environment. That is, the circuit structure 12 is sealed inside the sealing member 14A.

[0075] In this modified example, the sealing member 14A is a flexible sheet-like member. The sealing member 14A comprises a first sealing member 20A and a second sealing member 30A. That is, in addition to the circuit structure 12, the device 10A comprises the first sealing member 20A and the second sealing member 30A. In this modified example, the device 10A comprises only the circuit structure 12, the first sealing member 20A and the second sealing member 30A. However, the present invention is not limited thereto, and the device 10A may further comprise other members.

[0076] Referring to Figure 10, the first sealing member 20A of this modified example is formed on a base of a first film 22A, which is an insulating film. In other words, the first sealing member 20A is provided on a base of a first film 22A made of film. The first film 22A of this modified example is a thin, circular sheet and is flexible. The first film 22A extends parallel to the XY plane. The first film 22A has a periphery 229A in the XY plane. However, the present invention is not limited to this modified example. For example, the first film 22A may have a rectangular shape. The first sealing member 20A may also be provided with a base of a rigid protective member (not shown) made of an insulator instead of the first film 22A.

[0077] Referring to Figures 9 and 12, the first film 22A has an outer surface 232A and an inner surface 234A. The outer surface 232A is the top surface of the first film 22A. The inner surface 234A is the bottom surface of the first film 22A.

[0078] Referring to Figure 10, the second sealing member 30A in this modified example is formed on a base of a second film 32A, which is an insulating film. In other words, the second sealing member 30A is provided with a second film 32A, which is made of film, as its base. The second film 32A in this modified example is a thin, circular sheet and is flexible. The second film 32A extends parallel to the XY plane. The second film 32A has a periphery 329A in the XY plane. However, the present invention is not limited to this modified example. For example, the second film 32A may have a rectangular shape. The second sealing member 30A may be provided with a rigid protective member (not shown) made of an insulator as its base instead of the second film 32A. However, if one of the first sealing member 20A and the second sealing member 30A is provided with a rigid member as its base, it is preferable that the other is provided with a flexible insulating film as its base.

[0079] Referring to Figure 9 in conjunction with Figure 10, the first film 22A and the second film 32A in this modified example are superimposed on each other such that the positions of the periphery 229A and the periphery 329A in the XY plane coincide with each other. However, the present invention is not limited thereto. For example, the size of the first film 22A and the size of the second film 32A in the XY plane may be different from each other.

[0080] Referring to Figure 10, in this modified example, the first film 22A and the second film 32A each comprise two layers: a molten layer 146 that melts upon heating and a non-molten layer 148 that does not melt upon heating. For example, the molten layer 146 is made of polyethylene, and the non-molten layer 148 is made of nylon. The molten layer 146 of the first film 22A is located below the non-molten layer 148. The molten layer 146 of the second film 32A is located above the non-molten layer 148.

[0081] The above-described structure allows the two molten layers 146 to be heat-welded to each other while maintaining the non-melted layer 148 of the first film 22A and the second film 32A. That is, the first film 22A and the second film 32A can be fixed to each other by heat welding. However, the present invention is not limited thereto, and each of the first film 22A and the second film 32A may have a structure corresponding to the manufacturing method of the device 10A. For example, the first film 22A and the second film 32A may be fixed to each other by a fixing member such as an adhesive. In this case, each of the first film 22A and the second film 32A may have only one layer of the non-melted layer 148. On the other hand, each of the first film 22A and the second film 32A may have three or more layers.

[0082] The first film 22A has three openings 244A and a valve opening 248A formed therein. Each of the openings 244A in this modified example has a rectangular shape in the XY plane and penetrates the first film 22A in the vertical direction. The valve opening 248A in this modified example has a small circular shape in the XY plane and penetrates the first film 22A in the vertical direction. Each of these openings 244A and valve opening 248A can be formed by methods such as laser irradiation. However, the present invention is not limited thereto. For example, the shape and size of each of the openings 244A and valve opening 248A in the XY plane are not particularly limited.

[0083] In this modified example, the first sealing member 20A includes, in addition to the first film 22A, three conductive portions 246A made of a conductor such as metal, and an air valve 28A.

[0084] The conductive portion 246A in this modified example is formed, for example, as follows: First, three openings 244A are formed in the first film 22A. Next, conductive paste is filled into the openings 244A from one side of the first film 22A using a suitable mask and doctor blade. Next, the openings 244A are heated to cure the conductive paste. Next, conductive paste is filled into the openings 244A from the other side of the openings 244A using a suitable mask and doctor blade. Next, the first film 22A is heated to cure the conductive paste. Through the two heating steps described above, three conductive portions 246A are formed from the conductive paste.

[0085] In this modified example, the conductive portion 246A is formed as described above and completely seals the opening 244A. However, the present invention is not limited thereto. For example, the conductive portion 246A may be formed by a plating method or by an inkjet method. The conductive portion 246A may also be formed by laminating a metal foil to the outer surface 232A or inner surface 234A of the first film 22A so as to cover the entire opening 244A. The conductive portion 246A may partially protrude downward.

[0086] Each conductive portion 246A is provided corresponding to an opening 244A. Furthermore, each opening 244A is provided corresponding to a main electrode 422. That is, the number of conductive portions 246A is the same as the number of openings 244A, and the number of openings 244A is the same as the number of main electrodes 422.

[0087] Referring to Figure 11 in conjunction with Figure 10, the air valve 28A of this modified example comprises a shielding portion 282A made of a thin insulating film and a base portion 286A made of an insulator. A through hole 288A is formed in the base portion 286A. The through hole 288A penetrates the base portion 286A in the vertical direction. Five valves 284A and five notches 285A corresponding to each valve 284A are formed in the shielding portion 282A. Each of the notches 285A penetrates the shielding portion 282A in the vertical direction. The valves 284A and notches 285A are located inside the outer circumference of the shielding portion 282A in the XY plane.

[0088] Referring to Figure 11 in conjunction with Figure 9, the shielding portion 282A is bonded and fixed to the upper surface of the base portion 286A. In particular, the outer circumference of the shielding portion 282A in the XY plane is firmly in contact with the upper surface of the base portion 286A all around. On the other hand, the inner side of the outer circumference of the shielding portion 282A in the XY plane can be separated from the upper surface of the base portion 286A. That is, an air passage can be formed between each of the notches 285A and the through holes 288A. The lower surface of the base portion 286A is bonded and fixed to the first film 22A such that the through holes 288A connect to the valve opening 248A of the first film 22A.

[0089] The air valve 28A can transition between an open state where each of the valves 284A is away from its corresponding notch 285A (see Figure 11) and a closed state where each of the valves 284A completely blocks its corresponding notch 285A (see Figure 9). When the air valve 28A is in the open state, an air passage is formed between the inside and outside of the device 10A via the air valve 28A. On the other hand, when the air valve 28A is in the closed state, the inside of the device 10A is completely isolated from the outside of the device 10A.

[0090] The modified device 10A is manufactured through four steps: a preparation step, a placement step, a sealing step, and a vacuuming step. However, the present invention is not limited thereto, and the manufacturing method of device 10A can be modified as needed. An example of the manufacturing method of the modified device 10A will be described below.

[0091] Referring to Figure 10, first, in the preparation step, the first sealing member 20A, the second sealing member 30A, and the circuit structure 12 are prepared. At this time, the first circuit member 40, the second circuit member 50, and the third circuit member 60 of the circuit structure 12 are not fixed to each other.

[0092] Next, in the arrangement step, the first sealing member 20A, the circuit structure 12, and the second sealing member 30A are stacked on top of each other in the vertical direction, from top to bottom. At this time, the circuit structure 12 is arranged so that a single concentrated electrode section 13 (see Figure 1) is formed. Also, the three conductive sections 246A and the three main electrodes 422 are arranged so that they face each other in the vertical direction. Furthermore, the first film 22A and the second film 32A are arranged so that the two molten layers 146 face each other in the vertical direction.

[0093] Next, in the sealing process, the first film 22A and the second film 32A are subjected to heat sealing. Specifically, the portions of the two molten layers 146 located on the outer periphery of the first film 22A and the second film 32A in the XY plane are welded to each other by heat sealing. Referring to Figure 12, as a result of heat sealing, a device 10A having a sealed portion 15 is formed. The internal space of the device 10A is surrounded by the first sealing member 20A and the second sealing member 30A, and is isolated from the outside of the device 10A except for the air valve 28A.

[0094] As described above, the first film 22A and the second film 32A in this modified example are connected to each other by thermal sealing. However, the present invention is not limited thereto. For example, the first film 22A and the second film 32A can be connected by various methods such as high frequency, ultrasound, laser, and adhesive.

[0095] Next, in the vacuuming process, the inside of the device 10A is evacuated. In this modified example, the air inside the device 10A is removed using the instrument 80 and the air valve 28A. The instrument 80 in this modified example is a syringe-type piston pump. The instrument 80 comprises a syringe 82 and a plunger 84. The lower end of the syringe 82 has an annular shape in the XY plane that corresponds to the outer circumference of the shielding portion 282A of the air valve 28A.

[0096] In the vacuuming process, first, the lower end of the syringe 82 is pressed against the upper surface of the shielding portion 282A. Next, the plunger 84 is pulled upward. At this time, the air valve 28A opens, and an air passage is formed between the inside of the device 10A and the inside of the syringe 82. The air inside the device 10A is drawn into the syringe 82 through the passage hole 288A and the notch 285A (see Figure 11) of the air valve 28A. As a result, the air pressure inside the device 10A gradually decreases. When the air pressure inside the device 10A becomes a low pressure close to a vacuum, the vacuuming by the instrument 80 is stopped. At this time, the device 10A is being manufactured.

[0097] When the vacuum is stopped, valve 284A (see Figure 11) of air valve 28A closes notch 285A (see Figure 11) due to the pressure difference between the air pressure inside device 10A and atmospheric pressure, and air valve 28A becomes closed. As a result, the air pressure inside device 10A is maintained at low pressure. That is, a sealed space 18 with low pressure, isolated from the outside, is formed inside device 10A.

[0098] During vacuuming, a contact portion 16 and an inner portion 17 are formed in the device 10A. The contact portion 16 is the area where the first film 22A and the second film 32A are in close contact with each other. The inner portion 17 is the area in the device 10A that houses the circuit structure 12. The contact portion 16 shown in Figure 12 is formed inside the seal portion 15 in the XY plane. The inner portion 17 shown in Figure 12 is formed inside the contact portion 16 in the XY plane. In addition, in this modified example, a seal mark (not shown) is formed in the seal portion 15, which is the mark left by the welding of the first film 22A and the second film 32A to each other by heating. However, the present invention is not limited thereto. For example, the seal mark may be an adhesive mark.

[0099] In this modified example, the sealing portion 15 surrounds the contact portion 16 and the inner portion 17 around the entire circumference in the XY plane. Furthermore, in this modified example, the contact portion 16 surrounds the inner portion 17 around the entire circumference in the XY plane. The sealed space 18 is surrounded by the inner portion 17. However, the present invention is not limited thereto. For example, the contact portion 16 may be formed in the necessary locations depending on the manufacturing method of the device 10A. For example, the contact portion 16 may be partially formed or not formed at all.

[0100] As described above, the sealed space 18 is surrounded by the first sealing member 20A and the second sealing member 30A, and is isolated from the outside of the device 10A. In this modified example, the first film 22A and the second film 32A are connected to each other without any gaps at the seal portion 15. In addition, the contact portion 16 is located inside the seal portion 15 in the XY plane, blocking the flow of air between the inside and outside of the sealed space 18. That is, the air pressure inside the sealed space 18 is maintained at a low pressure, which is lower than atmospheric pressure.

[0101] Each of the first circuit member 40, the second circuit member 50, and the third circuit member 60 is sealed inside the sealed space 18, which is maintained at the low pressure described above. As a result, deterioration due to oxidation of metal members can be reduced. In addition, a contact force is generated between each of the conductive parts 246A and the corresponding main electrode 422 due to the pressure difference between the inside and outside of the sealed space 18. The conductive parts 246A and the main electrode 422 are pressed against each other by this contact force, thereby ensuring that contact between the conductive parts 246A and the main electrode 422 is reliably maintained without the use of fixing members such as adhesives.

[0102] Referring to Figure 12 in conjunction with Figure 3, the first, second, and third electrode portions 46, 56, and 66 of the electrode portion 13 are pressed against each other and fixed together by similar contact forces. At this time, at least one first electrode 462 and at least one second electrode 562 are pressed against one of the third electrodes 662 and connected to each other. According to this modified example, contact between the first electrode 462, second electrode 562, and third electrode 662 is reliably maintained without using fixing members such as adhesives.

[0103] Referring to Figure 12, the lower surface of each conductive portion 246A is located inside the sealed space 18 and in contact with the corresponding main electrode 422. On the other hand, the upper surface of each conductive portion 246A is located outside the device 10A. In other words, each conductive portion 246A is in contact with the corresponding main electrode 422 inside the sealed space 18 and is partially exposed to the outside of the device 10A.

[0104] If the conductive portion 246A and the main electrode 422 are not provided, the electronic circuit formed in the circuit structure 12 needs to acquire the subject's biological signals without contacting the subject (i.e., in a non-contact manner). However, it is difficult to accurately acquire weak biological signals in a non-contact manner. On the other hand, according to this modified example, biological signals can be reliably acquired by bringing the conductive portion 246A into contact with the subject's skin. In particular, according to this modified example, biological signals resulting from the subject's electrocardiogram can be reliably acquired by bringing the three conductive portions 246A into contact with the subject's chest.

[0105] To summarize the above explanation, in the modified device 10A, the first sealing member 20A and the second sealing member 30A are stacked so as to be in contact with each other, with the circuit structure 12 in between. In this modified device, the first sealing member 20A and the second sealing member 30A are each formed on a film base. Furthermore, by reducing the size (thickness) of the circuit structure 12 in the vertical direction as described above, the overall thickness of the device 10A can be made extremely thin. In other words, this modified device provides a device 10A that can be made thinner.

[0106] According to this modified example, by cutting off the seal portion 15, the first circuit member 40, the second circuit member 50, and the third circuit member 60 can each be easily removed from the sealed space 18. In other words, according to this modified example, the components can be easily separated, collected, and reused.

[0107] Preferably, the first sealing member 20A and the second sealing member 30A each have various barrier properties such as oxygen barrier properties and water vapor barrier properties. More specifically, it is preferable that the first film 22A and the second film 32A each have a layer made of a material with high barrier properties (high barrier material).

[0108] According to this modified example, vacuuming can be easily performed using a simple device 80. Vacuuming with device 80 can be performed repeatedly. For example, even if the air pressure in the sealed space 18 rises when using device 10A, vacuuming can be performed again using device 80. As a result, the contact force described above can be maintained. However, the present invention is not limited thereto, and the manufacturing method of device 10A can be modified as needed. For example, the structure of device 80 is not particularly limited as long as it can perform vacuuming.

[0109] Vacuuming using the apparatus 80 as shown in this modified example is preferable from the viewpoint of easily manufacturing the device 10A and maintaining the sealed space 18. However, in vacuuming using the apparatus 80, the contact portion between the first film 22A and the second film 32A may be formed not only at the contact portion 16 but also inside the sealed space 18. In this case, the air passage inside the device 10A may be blocked by the contact portion, which may prevent the sealed space 18 from being sufficiently depressurized. To solve this problem, the second film 32A may be embossed to ensure that the air passage is maintained. Alternatively, instead of embossing the second film 32A, an embossed additional film (not shown) may be placed between the first film 22A and the second film 32A.

[0110] Instead of the illustrated apparatus 80, a commercially available tabletop vacuum packaging machine (not shown) may be used for sealing and vacuuming. Furthermore, the components of device 10A may be placed in a vacuum chamber (not shown) and vacuumed while heat sealing is performed. In this case, it is not necessary to emboss the second film 32A. Also, it is not necessary to provide an additional embossed film (not shown).

[0111] Comparing Figure 13 with Figure 9, the device 10B according to the second modification has the same circuit structure 12 and second sealing member 30A as device 10A. On the other hand, device 10B has a first sealing member 20B that is different from the first sealing member 20A of device 10A. That is, device 10B has a sealing member 14B consisting of the first sealing member 20A and the first sealing member 20B.

[0112] Comparing Figure 14 with Figure 10, the first sealing member 20B, like the first sealing member 20A, is based on a first film 22B made of film. Three openings 244B are formed in the first film 22B. The edges 245B of each opening 244B in the XY plane form a closed circuit. More specifically, each opening 244B has a smaller rectangular shape than opening 244A in the XY plane. However, each opening 244B does not have a portion that closes the opening 244B, such as a conductive portion 246A. Except for the differences described above, the first film 22B has the same structure as the first film 22A. For example, the three openings 244B are provided corresponding to the three main electrodes 422. That is, the number of openings 244B is not limited to three, but can be the same as the number of main electrodes 422.

[0113] The first sealing member 20B includes, in addition to the first film 22B, the same air valve 28A as the first sealing member 20A, and three frame-shaped films 26B made of film.

[0114] Referring to Figure 14, each of the frame-shaped films 26B has a closed-loop shape. More specifically, each of the frame-shaped films 26B is a thin sheet in the shape of a rectangular frame and is flexible. The outer edge of each of the frame-shaped films 26B in the XY plane has a rectangular shape. A central hole 266B is formed in each of the frame-shaped films 26B. Each of the central holes 266B has a rectangular shape in the XY plane and penetrates the frame-shaped film 26B in the Z direction. Each of the frame-shaped films 26B in this modified example has the structure described above. 。 However, the structure of each frame-shaped film 26B is not particularly limited, as long as each frame-shaped film 26B has a seamless frame shape. For example, each frame-shaped film 26B may have a circular frame shape.

[0115] Each frame-shaped film 26B has a film sealing portion 262B and a circuit sealing portion 264B. In this modified example, the circuit sealing portion 264B is a rectangular frame-shaped portion located around the central hole 266B. The circuit sealing portion 264B surrounds the central hole 266B all around in the XY plane. In this modified example, the film sealing portion 262B is a rectangular frame-shaped portion located around the circuit sealing portion 264B. The film sealing portion 262B surrounds the circuit sealing portion 264B all around in the XY plane. In this modified example, there is no visible boundary between the film sealing portion 262B and the circuit sealing portion 264B. However, the present invention is not limited thereto, and a visible boundary may be formed between the film sealing portion 262B and the circuit sealing portion 264B.

[0116] Each of the frame-shaped films 26B in this modified example is made of ultraviolet-curing tape. More specifically, each of the frame-shaped films 26B contains a pressure-sensitive adhesive that adheres to other members when pressed against them, and an ultraviolet-curing agent that hardens when irradiated with ultraviolet light. That is, each of the film sealing portion 262B and the circuit sealing portion 264B contains a pressure-sensitive adhesive and an ultraviolet-curing agent. For example, when the film sealing portion 262B is pressed against another member, the frame-shaped film 26B adheres to the other member. Subsequently, when the frame-shaped film 26B is irradiated with ultraviolet light, the frame-shaped film 26B hardens and is fixed to the other member.

[0117] Each of the frame-shaped films 26B in this modified example has a lower layer and an upper layer. The lower layer is made of a resin containing a pressure-sensitive adhesive and an ultraviolet curing agent. The upper layer is made of a resin that does not contain either a pressure-sensitive adhesive or an ultraviolet curing agent. That is, the lower surfaces of the film sealing portion 262B and the circuit sealing portion 264B can be adhered to and fixed to other members. On the other hand, the upper surfaces of the film sealing portion 262B and the circuit sealing portion 264B cannot be adhered to other members by simply pressing them together. However, the present invention is not limited thereto. For example, the resin of the upper layer of the frame-shaped film 26B may also contain a pressure-sensitive adhesive and an ultraviolet curing agent in addition to the resin of the lower layer.

[0118] The three frame-shaped films 26B are provided corresponding to the three openings 244B of the first film 22B. That is, the number of frame-shaped films 26B is not limited to three, but can be the same as the number of openings 244B. The size of each opening 244B in the XY plane is smaller than the size of the corresponding frame-shaped film 26B in the XY plane, and larger than the size of the central hole 266B of the corresponding frame-shaped film 26B in the XY plane.

[0119] Referring to Figure 13 in conjunction with Figure 14, each frame-shaped film 26B is positioned on the outer surface 232A of the first film 22B such that the corresponding opening 244B is located inside the outer edge of the frame-shaped film 26B in the XY plane and outside the central hole 266B. In other words, each frame-shaped film 26B is positioned on the outer surface 232A so as to cover the entire circumference of the edge 245B of the corresponding opening 244B. The film sealing portion 262B of each frame-shaped film 26B positioned as described above is adhered to the outer surface 232A. The film sealing portion 262B is located around the opening 244B in the XY plane and seals the edge 245B of the opening 244B around its entire circumference in the XY plane.

[0120] In this modified example, the film sealing portion 262B can be fixed to the outer surface 232A by ultraviolet irradiation after being adhered to the outer surface 232A. That is, the frame-shaped film 26B can be fixed to the outer surface 232A of the first film 22B by the pressure-sensitive adhesive and ultraviolet curing agent contained in the film sealing portion 262B. However, the present invention is not limited thereto. For example, the frame-shaped film 26B may be fixed to the outer surface 232A of the first film 22B by a fixing member such as an adhesive separate from the frame-shaped film 26B. Also, if the frame-shaped film 26B can be fixed to other members by pressure-sensitive adhesive alone, the frame-shaped film 26B does not need to contain an ultraviolet curing agent. That is, the frame-shaped film 26B may be just an adhesive tape.

[0121] The frame-shaped film 26B may be bonded to the inner surface 234A (see Figure 15) of the first film 22B and then fixed in place. In this case, the opening 244B may be located inside the central hole 266B in the XY plane. Alternatively, a molten layer may be provided on the upper layer of the frame-shaped film 26B and heat-sealed to the first film 22B.

[0122] According to this modified example, when the film sealing portion 262B is adhered to the outer surface 232A, the circuit sealing portion 264B is located inside the opening 244B in the XY plane. In other words, of the frame-shaped film 26B, the portion adhered to the outer surface 232A is the film sealing portion 262B, and the portion located inside the opening 244B in the XY plane and not adhered to the outer surface 232A is the circuit sealing portion 264B. However, the present invention is not limited thereto. For example, when the frame-shaped film 26B is adhered to the inner surface 234A (see Figure 15) of the first film 22B, the portion of the upper surface of the frame-shaped film 26B that is adhered to the inner surface 234A is the film sealing portion 262B, and the lower surface of the frame-shaped film 26B is the circuit sealing portion 264B.

[0123] Referring to Figure 5, each of the first main parts 41 of the first circuit member 40 has an exposed portion 424 and a sealed portion 426. The exposed portion 424 and the sealed portion 426 are each part of the upper surface of the first main part 41. Each exposed portion 424 of the first main part 41 surrounds the main electrode 422 all around in the XY plane. In other words, the main electrode 422 is provided in each exposed portion 424. Each sealed portion 426 of the first main part 41 surrounds the exposed portion 424 all around in the XY plane.

[0124] According to this modified example, there is no visible boundary between the exposed portion 424 and the sealed portion 426. Furthermore, there is no visible boundary on the outer periphery of the sealed portion 426 in the XY plane. However, the present invention is not limited thereto. For example, a visible boundary may be formed between the exposed portion 424 and the sealed portion 426.

[0125] Referring to Figure 5 in conjunction with Figure 4, the exposed portion 424 and the sealed portion 426 in this modified example are provided on the first main portion 41. However, the present invention is not limited thereto. For example, when the main electrode 422 is provided on the second main portion 51 of the second circuit member 50, the exposed portion 424 and the sealed portion 426 are part of the upper surface of the second main portion 51. That is, at least one of the first main portion 41, the second main portion 51, and the third main portion 61 may have an exposed portion 424 and a sealed portion 426. The number of exposed portions 424 is the same as the number of main electrodes 422, and the number of sealed portions 426 is the same as the number of exposed portions 424.

[0126] Referring to Figure 15, device 10B can be manufactured using the same manufacturing method as device 10A (see Figure 12). However, the frame-shaped film 26B is fixed to the first film 22B and the sealing portion 426 before the vacuuming process. Specifically, each film sealing portion 262B of the frame-shaped film 26B is fixed to the first film 22B so as to surround the opening 244B around its entire circumference. Each circuit sealing portion 264B of the frame-shaped film 26B is fixed to the sealing portion 426 so as to surround the exposed portion 424 around its entire circumference. As a result, the air passage through the opening 244B is blocked.

[0127] In this modified example, the film sealing portion 262B and the circuit sealing portion 264B are fixed by a pressure-sensitive adhesive and an ultraviolet curing agent. However, the present invention is not limited thereto. For example, the circuit sealing portion 264B may be fixed to the sealing portion 426 by a fixing member such as an adhesive separate from the frame-shaped film 26B. Furthermore, the shapes of the exposed portion 424 and the sealing portion 426 are not particularly limited, as long as the frame-shaped film 26B can be fixed to the first film 22B and the sealing portion 426 in such a way that it blocks the passage of air.

[0128] As a result of the vacuuming process, a sealed space 18 similar to that of device 10A is formed in device 10B. The sealed space 18 is surrounded by the first sealing member 20B and the second sealing member 30A, except for the exposed portion 424, and is isolated from the outside of device 10B. The air pressure inside the sealed space 18 is maintained at a low pressure, lower than atmospheric pressure.

[0129] Device 10B, formed as described above, functions similarly to device 10A (see Figure 12). For example, the contact force resulting from the pressure difference between the inside and outside of the sealed space 18 ensures that contact between the first electrode 462 (see Figure 3), the second electrode 562 (see Figure 3), and the third electrode 662 (see Figure 3) is reliably maintained without the use of fixing members such as adhesives.

[0130] Referring to Figures 13 and 15, in the assembled device 10B, the exposed portion 424 and the sealed portion 426 face the first film 22B in the vertical direction. Each of the sealed portions 426 is located directly below the circuit sealed portion 264B of the frame-shaped film 26B. On the other hand, each of the exposed portions 424 is located in the middle of the opening 244B in the XY plane and is exposed upward from the central hole 266B of the frame-shaped film 26B. In other words, the exposed portion 424 is the part of the first circuit member 40 (see Figure 4) that is exposed from the central hole 266B.

[0131] As described above, the exposed portion 424 is exposed to the outside of the sealed space 18. On the other hand, the first circuit member 40, the second circuit member 50, and the third circuit member 60, each except for the exposed portion 424, are sealed inside the sealed space 18 maintained at the low pressure described above. In other words, except for the exposed portion 424, no part of the circuit structure 12 is located outside the device 10B.

[0132] Device 10B can be used in the same way as device 10A (see Figure 12). For example, by bringing the main electrode 422 located at the exposed portion 424 into contact with the subject's skin, biological signals can be reliably acquired. The main electrode 422 may be in direct contact with the subject's skin, or it may be indirectly in contact with the subject's skin via a soft conductor such as a conductive gel. That is, device 10B may further include a conductive gel covering the frame-shaped film 26B.

[0133] Comparing Figure 16 with Figure 13, the device 10C according to the third modification has the same circuit structure 12 and second sealing member 30A as device 10B. On the other hand, device 10C has a first sealing member 20C that is different from the first sealing member 20B of device 10B. That is, device 10C has a first sealing member 20C and Second sealing member 30A It includes a sealing member 14C consisting of the above.

[0134] Comparing Figure 17 with Figure 14, the first sealing member 20C, like the first sealing member 20B, is based on a first film 22B made of film and is equipped with an air valve 28A. On the other hand, the first sealing member 20C has three conductive gels 26C corresponding to the three openings 244B of the first film 22B, instead of a frame-shaped film 26B.

[0135] Referring to Figures 16 and 18 in conjunction with Figures 13 and 15, device 10C is manufactured using the same manufacturing method as device 10B. However, the conductive gel 26C is adhered to and fixed to the first film 22B without the use of fixing members such as adhesive tape (not shown). Specifically, each conductive gel 26C is fixed to the first film 22B so as to completely close the corresponding opening 244B. Referring to Figure 18, each conductive gel 26C in this modified example is fixed to the outer surface 232A of the first film 22B. However, the present invention is not limited thereto. For example, each conductive gel 26C may be fixed to the inner surface 234A of the first film 22B.

[0136] Except for the differences mentioned above, device 10C has a similar structure to device 10B and functions similarly to device 10B. For example, the conductive gel 26C is in contact with the main electrode 422 inside the sealed space 18 and is partially exposed to the outside of device 10C. By bringing the soft conductive gel 26C into contact with the subject's skin, biosignals can be reliably acquired. Due to the contact force resulting from the pressure difference between the inside and outside of the sealed space 18, contact between the conductive gel 26C and the main electrode 422 is reliably maintained without the use of fixing materials such as adhesives. Similarly, due to the same contact force, contact between the first electrode 462 (see Figure 3), the second electrode 562 (see Figure 3), and the third electrode 662 (see Figure 3) is reliably maintained without the use of fixing materials such as adhesives.

[0137] Referring to Figures 12, 15, and 18, according to the first to third modifications, the sealed space 18 is at least partially surrounded by the first sealing member and the second sealing member. Each of the first circuit member 40, the second circuit member 50, and the third circuit member 60 is at least partially sealed inside the sealed space 18.

[0138] The first to third variations can be further modified in various ways. For example, referring to Figure 9, the periphery 229A of the first film 22A and the periphery 329A of the second film 32A may be partially connected to each other. In other words, the first film 22A and the second film 32A may each be part of a single sheet-like member.

[0139] Referring to Figures 1, 9, 13, and 16, the devices of the embodiments and modifications described above have shapes that do not injure the skin of the subject. For example, the corners of the circuit structure 12 are chamfered in an arc shape. The sealing members 14A, 14B, and 14C (sheet-like members) have a circular shape.

[0140] However, the present invention is not limited thereto. For example, the sheet-like member may have a rectangular shape in the XY plane. In this case, the air valve 28A may be located near a predetermined side of the sheet-like member. Alternatively, a fastener that can be opened and closed may be provided between the predetermined side and the air valve 28A. After closing the fastener and creating a vacuum, the first film 22A and the second film 32A may be heat-sealed at a predetermined position between the air valve 28A and the circuit structure 12. After heat-sealing, the portion where the air valve 28A is provided may be cut out. That is, each of the devices 10A, 10B, and 10C does not necessarily have to be equipped with an air valve 28A. [Explanation of Symbols]

[0141] 10, 10A, 10B, 10C devices 12 Circuit structure 13. Integrated electrode section 132 Connecting electrodes 14A, 14B, 14C Sealing member 146 Molten layer 148 Non-melted layer 15. Seal part 16 Contact area 17 Inside 18 Sealed space 20A, 20B, 20C 1st sealing member 22A, 22B First film 229A Periphery 232A External surface 234A Inside surface 244A,244B opening 245B Edge 246A Continuity part 248A Valve opening 26B Frame-shaped film 262B Film sealing section 264B Circuit sealing part 266B Center hole 26C conductive gel 28A Air valve 282A Shielding part 284A valve 285A Notch 286A base 288A Passing hole 30A 2nd sealing member 32A Second film 329A Periphery 40 First circuit component 41 First Main Section 42 1st main function section 422 Main electrode 424 Exposed part 426 Sealing part 44. First Flexible Circuit Board 46 First concentrated electrode section 462 1st electrode 48 1st connection part 49 1st wiring 50 Second circuit component 51 Second Main Section 52 2nd main function section 54. Second Flexible Circuit Board 56 Second concentrated electrode section 562 2nd electrode 58 2nd connection part 59 2nd wiring 60, 602, 604 Third circuit component 61 Third Main Section 62 3rd main function section 64 Third Flexible Circuit Board 66 Third concentrated electrode section 662 3rd electrode 666 Top surface 668 Lower end surface 68 Third connection part 69 3rd wiring 80 devices 82 syringes 84 Plungers

Claims

1. A device comprising a first circuit member, a second circuit member, and at least one third circuit member, The first circuit member comprises a first main part and a first flexible substrate, and has first wiring formed on it. The first main part and the first flexible substrate are connected to each other. The first main part has a first main function part for realizing the function of the first circuit member, The first flexible substrate has a first concentrated electrode portion, Two or more first electrodes are formed on the first concentrated electrode portion. The first wiring connects at least one of the first electrodes to the first main function unit. The second circuit member comprises a second main part and a second flexible substrate, and has second wiring formed on it. The second main part and the second flexible substrate are connected to each other. The second main part has a second main function part for realizing the function of the second circuit member, The second flexible substrate has a second integrated electrode section, Two or more second electrodes are formed on the aforementioned second concentrated electrode portion. The second wiring connects at least one of the second electrodes to the second main function unit. The third circuit member comprises a third main part and a third flexible substrate, and has a third wiring formed on it. The third main part and the third flexible substrate are connected to each other. The third main part has a third main functional part for realizing the function of the third circuit member, The third flexible substrate has a third integrated electrode section, Two or more third electrodes are formed on the aforementioned third concentrated electrode portion. The third wiring connects at least one of the third electrodes to the third main function unit. The first concentrated electrode section, the second concentrated electrode section, and the third concentrated electrode section overlap each other in the vertical direction. The third concentrated electrode portion is located between the first concentrated electrode portion and the second concentrated electrode portion in the vertical direction. Each of the first electrodes is exposed upwards. Each of the second electrodes is exposed downwards. Each of the third electrodes has an upper end surface exposed upward and a lower end surface exposed downward, and the upper end surface and the lower end surface are electrically connected to each other. At least one of the first electrodes and at least one of the second electrodes are connected to each other via one of the third electrodes. The first main part, the second main part, and the third main part are separated from each other when viewed along the vertical direction. The device comprises a first sealing member and a second sealing member. The aforementioned device has a sealed space formed within it. The sealed space is at least partially surrounded by the first sealing member and the second sealing member, and is isolated from the outside of the device. Each of the first circuit member, the second circuit member, and the third circuit member is at least partially sealed inside the sealed space. At least one of the first electrodes and at least one of the second electrodes are pressed against and connected to one of the third electrodes. device.

2. The device according to claim 1, The first sealing member comprises a first film made of a film as a base, and also comprises a conductive portion made of a conductor. The sealed space is surrounded by the first sealing member and the second sealing member, Each of the first circuit member, the second circuit member, and the third circuit member is sealed inside the sealed space. At least one of the first main function section, the second main function section, and the third main function section includes a main electrode. The conductive portion is in contact with the main electrode inside the sealed space and is partially exposed to the outside of the device. device.

3. The device according to claim 1, The first sealing member comprises a first film made of film as a base, and also comprises a frame-shaped film made of film. The first film described above has an opening formed therein. The edge of the opening forms a closed circuit. The aforementioned frame-shaped film has a closed-circuit shape, At least one of the first main function section, the second main function section, and the third main function section includes a main electrode. At least one of the first main part, the second main part, and the third main part comprises an exposed portion and a sealed portion. The main electrode is provided in the exposed portion, The exposed portion and the sealed portion face the first film. The sealing portion surrounds the exposed portion all around, The frame-shaped film has a film sealing portion and a circuit sealing portion. The film sealing portion is fixed to the first film so as to surround the opening all around. The circuit sealing portion is fixed to the sealing portion so as to surround the exposed portion all around. The sealed space, excluding the exposed portion, is surrounded by the first sealing member and the second sealing member. The exposed portion is exposed to the outside of the sealed space, Each of the first circuit member, the second circuit member, and the third circuit member is sealed inside the sealed space, except for the exposed portion. device.

4. The device according to claim 1, The first sealing member comprises a first film made of a film as a base, and also comprises a conductive gel. At least one of the first main function section, the second main function section, and the third main function section includes a main electrode. The conductive gel is in contact with the main electrode inside the sealed space and is partially exposed to the outside of the device. device.

5. A device according to any one of claims 1 to 4, A first predetermined number of the first electrodes are formed on the first concentrated electrode portion. A second predetermined number of the second electrodes are formed on the second concentrated electrode portion. A third predetermined number of the third electrodes are formed on the third concentrated electrode portion. The first predetermined number, the second predetermined number, and the third predetermined number are all the same. The first electrode is arranged according to a predetermined electrode arrangement, the second electrode is arranged according to the predetermined electrode arrangement, and the third electrode is arranged according to the predetermined electrode arrangement. The first electrode is connected to the second electrode via the third electrode. device.

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