Manufacturing methods for electronic components
The method of curing bonding members through electrode windows with selective irradiation and pressure application addresses the challenge of curing obscured areas, achieving stable bonding and improved electrical connections.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- CANON KK
- Filing Date
- 2022-01-28
- Publication Date
- 2026-05-29
Smart Images
Figure 0007867342000001 
Figure 0007867342000002 
Figure 0007867342000003
Abstract
Description
Technical Field
[0001] The present invention relates to of a method for manufacturing electronic components to and pertains to
Background Art
[0002] Electronic components that can be incorporated into devices such as imaging devices and display devices may include an electronic substrate provided with electronic elements and a circuit board for supplying power from the outside to the electronic substrate. The electronic substrate may include an element region where the electronic elements are arranged and a peripheral region provided on the outer edge side of the element region. Connection terminals are provided in the peripheral region, and a circuit board such as a flexible printed circuit (FPC) can be electrically joined to the connection terminals. As the joining member, for example, an anisotropic conductive film (ACF) containing conductive particles, an anisotropic conductive paste (ACP), etc. can be used. A thermocompression bonding method of electrically connecting the connection terminals and the circuit board by applying pressure while heating such a joining member is known. Patent Document 1 discloses a method of electrically connecting an electrode disposed on a glass substrate and a connection electrode arranged corresponding thereto using a thermosetting resin by irradiating the thermosetting resin with laser light to cure it.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] The method of irradiating thermosetting resins with laser light is advantageous because it selectively irradiates the bonding members with laser light, thereby efficiently curing the bonding members without applying excessive heat to other components, such as electronic substrates. However, bonding members have areas covered by opaque electrodes and areas not covered by electrodes. The areas not covered by electrodes are easily cured by direct irradiation with laser light. On the other hand, the areas covered by opaque electrodes are difficult to cure because the laser light is blocked by the electrodes. Therefore, a problem with methods of irradiating bonding members with light such as laser light is that it is not possible to stably cure the areas of the bonding member covered by opaque electrodes.
[0005] One aspect of the present invention relates to a method for manufacturing electronic equipment, the manufacturing method comprising the steps of: preparing a first structure in which a first electrode is arranged on the first main surface of a first substrate; preparing a second structure in which a second electrode is arranged on the first main surface of a second substrate; and facing the first main surface of the first substrate and the first main surface of the second substrate via a bonding member. 、 The curing step includes curing the bonding member, wherein at least one of the first electrode and the second electrode has a window portion, and in the curing step, the bonding member is cured by irradiating the bonding member with light through the window portion. The bonding member includes a first portion located in a first region not sandwiched between the first electrode and the second electrode, and a second portion located in a second region sandwiched between the first electrode and the second electrode, and the curing process includes a first curing step of curing the first portion by selectively irradiating the first portion with the light, and a second curing step of curing the second portion after the first curing step of selectively irradiating the portion of the second portion in which the window portion exists with the light through the window portion. . [Means for solving the problem]
[0006] One aspect of the present invention relates to a method for manufacturing electronic equipment, the manufacturing method comprising: preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate; preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate; and curing a method in which the first main surface of the first substrate and the first main surface of the second substrate are faced each other via a bonding member, and the bonding member is cured while applying force to the first structure and the second structure so that the bonding member is pressurized, wherein at least one of the first electrode and the second electrode has a window portion, and in the curing step, the bonding member is cured by irradiating the bonding member with light through the window portion. [Effects of the Invention]
[0007] According to the present invention, a technique advantageous for effectively curing the joint members is provided. [Brief explanation of the drawing]
[0008] [Figure 1] Perspective views showing electronic components of the first to eighth embodiments. [Figure 2] Cross-sectional view of the electronic component of the first embodiment (part B in Figure 1). [Figure 3A] A diagram illustrating the manufacturing method of an electronic component according to the first embodiment. [Figure 3B] A diagram illustrating the manufacturing method of an electronic component according to the first embodiment. [Figure 3C] A diagram illustrating the manufacturing method of an electronic component according to the first embodiment. [Figure 4] A diagram illustrating the manufacturing method of an electronic component according to the first embodiment. [Figure 5A] A diagram illustrating the manufacturing method of an electronic component according to the second embodiment. [Figure 5B] A diagram illustrating the manufacturing method of an electronic component according to the second embodiment. [Figure 5C] A diagram illustrating the manufacturing method of an electronic component according to the second embodiment. [Figure 6] A diagram illustrating the manufacturing method of an electronic component according to the third embodiment. [Figure 7] A diagram showing the electronic components of the fourth embodiment. [Figure 8] A diagram showing the electronic components of the fifth embodiment. [Figure 9] A diagram showing the electronic components of the sixth embodiment. [Figure 10] A diagram showing the electronic components of the seventh embodiment. [Figure 11] A diagram showing the electronic components of the eighth embodiment. [Figure 12] A schematic diagram showing an electronic device or display device according to one embodiment. [Figure 13] A schematic diagram showing an electronic device or display device according to one embodiment. [Figure 14] A diagram showing an electronic device configured as a display device. [Figure 15] A diagram showing application examples of electronic devices.
Embodiments for Carrying Out the Invention
[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant explanations are omitted.
[0010] [First Embodiment] The electronic component 400 of the first embodiment will be described while referring to FIGS. 1 and 2. FIG. 1 is a perspective view showing the structure of the electronic component 400 of the first embodiment, and FIG. 2 is a cross-sectional view of part B viewed from the direction of arrow A in FIG. 1. The electronic component 400 may include a first structure (electronic substrate) 100, a second structure (circuit board) 200, and a joining member 300.
[0011] The first structure 100 may have a first substrate 101 made of a substrate material such as silicon or glass, and a first electrode 102 disposed on the first main surface P11 of the first substrate 101. The first main surface P11 of the first substrate 101 may include an element region on which an electronic element is disposed, and a peripheral region disposed between the element region and the edge of the first substrate 101, and the first electrode 102 may be disposed in the peripheral region. The second structure 200 may have a second substrate 201 and a second electrode 102 disposed on the first main surface P21 of the second substrate 201. The second electrode 202 is disposed opposite to the first electrode 102. Typically, the first substrate 101 has a plurality of first electrodes 102 disposed on the first main surface P11, and the second substrate 201 has a plurality of second electrodes 202 disposed on the first main surface P21. In this case, each of the multiple first electrodes 102 is faced by a corresponding second electrode 202 from among the multiple second electrodes 202. The joining member 300 is positioned between the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 so as to electrically join the first electrode 102 of the first structure 100 and the second electrode 202 of the second structure 200.
[0012] The second structure 200 may be, for example, a printed circuit board, and more specifically, a rigid substrate such as a glass epoxy substrate or a composite substrate on which a wiring pattern is printed. Alternatively, the second structure 200 may be a flexible circuit board on which a wiring pattern is formed on a flexible film such as polyimide. Alternatively, the second structure 200 may be a rigid-flexible circuit board which is a composite of a flexible film and a rigid substrate. The second structure 200 may be configured to supply power to the first substrate 101 of the first structure 100. The second structure 200 may also have the function of supplying signals to the first substrate 101 of the first structure 100, and the function of transmitting or outputting signals output from the first substrate 101 of the first structure 100 to other devices. The second electrode 202 may be provided with a window portion 202b. In other views, the second electrode 202 includes an electrode portion 202a and a window portion 202b. The window portion 202b may be an opening provided in the second electrode 202, or it may be formed by filling the opening with a transparent material. In the former case, the opening may be filled with air. The window portion may be provided in the first electrode 102 of the first structure 100, or it may be provided in both the first electrode 102 of the first structure 100 and the second electrode 202 of the second structure 200.
[0013] The bonding member 300 may include a bonding resin 301 and a plurality of conductive particles 302 dispersed within the bonding resin 301. The bonding resin 301 may be an adhesive such as a thermosetting resin, a UV-curing resin (photocuring resin), or a UV-heat-curing resin.
[0014] The method for manufacturing the electronic component 400 of the first embodiment will be described below with reference to Figures 3A-3C and Figure 4. First, as illustrated in Figure 3A, a plurality of first structures 100 are formed on the first main surface of a substrate 101W such as silicon or glass, and the plurality of first structures 100 are separated into individual pieces by dicing or the like. This prepares the individual pieces of the first structure 100. Each first structure 100 has an electronic element and a first electrode 102. The electronic element is not particularly limited, but may be at least one of, for example, an image sensor, a display element (e.g., a liquid crystal display element, an organic EL display element), and a piezoelectric element.
[0015] Next, as illustrated in Figure 3B, the second structure 200 is fabricated by forming a second electrode 202 having a window portion 202b on the first main surface of the second substrate 201. From another viewpoint, the second structure 200 is fabricated by forming a second electrode 202 having an electrode portion 202a and a window portion 202b on the first main surface of the second substrate 201. This prepares the second structure 200.
[0016] Next, as illustrated in Figure 3C, a bonding member 300 is placed in the region where the first electrode 102 and the second electrode 202 are electrically connected. The bonding member 300 may be, for example, a film-like ACF or a liquid ACP. Here, the bonding member 300 is placed on the first main surface of the second substrate 201, but it may also be placed on the first main surface of the first substrate 101. As described above, the bonding member 300 may include a bonding resin 301 and a plurality of conductive particles 302 dispersed within the bonding resin 301.
[0017] Next, a curing process illustrated in Figure 4 is performed. In the curing process, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are brought into opposition via the bonding member 300, and the bonding member 300 is cured while force is applied to the first structure 100 and the second structure 200 so that the bonding member 300 is pressurized. In the curing process, pressure may be applied to the first structure 100 and the second structure 200 by the crimping head 500 in a direction that brings the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 closer together. In addition, in the curing process, light such as laser light (hereinafter referred to as heating light) may be irradiated onto the bonding member 300 via the crimping head 500 from the direction normal to the second surface P22 of the second substrate 201 of the second structure 200 which has a window portion 202b. The crimping head 500 may be made of a material that transmits heating light, for example, glass. The heating light has a wavelength range that cures the bonding resin 301 of the bonding member 300, and the crimping head 500 is configured to transmit light in this wavelength range. The window portion 202b may be an opening filled with air or the like, or it may be made of a material that transmits heating light. The second substrate 201 is also made of a material that transmits heating light. The absorption rate of heating light by the bonding member 300 is higher than the absorption rate of heating light by the second electrode 202 having the window portion 202b. Similarly, if the first electrode 102 has a window portion, the absorption rate of heating light by the bonding member 300 is higher than the absorption rate of heating light by the first electrode 102 having a window portion.
[0018] The bonding member 300 includes a first portion located in the first region 301(a) not sandwiched between the first electrode 102 and the second electrode 202, and a second portion located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 (including the window portion 202b). The first portion of the bonding member 300 located in the first region 301(a) is irradiated with heating light via the second substrate 201, thereby raising the temperature and hardening the first portion. The second portion of the bonding member 300 located in the second region 301(b) is irradiated with heating light via the second substrate 201 and the window portion 202b, thereby raising the temperature and hardening the second portion. The portion of the second portion covered by the electrode portion 202a of the second electrode 202 is heated by the heat generated by the heating light incident through the window portion 202b, and may also be heated by the scattered light of the heating light incident through the window portion 202b.
[0019] If a window is provided in the first electrode 102 of the first structure 100, heating light is irradiated onto the bonding member 300 via the first substrate 101 of the first structure 100. More specifically, the first portion of the bonding member 300 located in the first region 301(a) is irradiated with heating light via the first substrate 101, and the second portion of the bonding member 300 located in the second region 301(b) is irradiated with heating light via the first substrate 101 and the window.
[0020] According to the first embodiment, the second portion of the joining member 300, which is located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 (including the window portion 202b), can also be cured by irradiation with heating light through the window portion. Therefore, for example, even in a region where the second electrode 202 (or the first electrode 102) is densely arranged, the joining member 300 can be stably cured. In other words, according to the first embodiment, the joining member 300 can be stably cured over the entire area regardless of the arrangement density of the second electrode 202 (or the first electrode 102).
[0021] [Second Embodiment] The electronic component 400 of the second embodiment will be described below with reference to Figures 1 and 5A-5C. Matters not mentioned as part of the second embodiment may follow those of the first embodiment. Figure 1 is a perspective view showing the structure of the electronic component 400 of the second embodiment, and Figure 5A is a cross-sectional view of part B in Figure 1, viewed from the direction of arrow A.
[0022] The electronic component 400 of the second embodiment has a larger number of conductive particles 302 arranged between the first electrode 102 and the second electrode 202 than the electronic component 400 of the first embodiment illustrated in Figure 2. The electronic component 400 of the second embodiment is more suitable for high-speed communication than the electronic component 400 of the first embodiment.
[0023] The manufacturing method for the electronic component 400 of the second embodiment will be described with reference to Figures 5B and 5C. In the first embodiment, heating light is irradiated simultaneously to the first region 301(a) and the second region 301(b), but in the second embodiment, heating light is irradiated to the first region 301(a) first, and then to the second region 301(b).
[0024] In the second embodiment as well, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are brought into opposition via the joining member 300, and the curing process is carried out while applying force to the first structure 100 and the second structure 200 so that the joining member 300 is pressurized. The curing process of the second embodiment includes a first curing process and a second curing process following the first curing process. First, in the first curing process, as schematically shown in Figure 5B, the first portion of the joining member 300 located in the first region 301(a) is selectively irradiated with heating light to increase the fluidity of the first portion, and then the first portion is cured. In the second curing process, as schematically shown in Figure 5C, the second portion is selectively irradiated with heating light through the window portion 202b to the portion of the second portion where the window portion 202b exists, and then the second portion is cured.
[0025] When the fluidity of the second portion located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 is increased, the conductive particles 302 in the second portion become movable. In the first embodiment, the fluidity in the first and second portions is increased by simultaneously irradiating the first and second portions with heating light. As a result, in the first embodiment, some of the conductive particles 302 in the second portion, which is under higher pressure due to the presence of the first electrode 102 and the second electrode 202, can move to the first portion. On the other hand, in the second embodiment, the first portion located in the first region 301(a) not sandwiched between the first electrode 102 and the second electrode 202 hardens before the second portion located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202. Therefore, according to the second embodiment, the movement of conductive particles 302 from the second portion to the first portion is suppressed. As a result, the number of conductive particles 302 in the second portion located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 can be increased compared to the first embodiment. This allows the electrical resistance between the first electrode 102 and the second electrode 202 to be lower than in the first embodiment. Therefore, the electronic component 400 of the second embodiment is more suitable for high-speed communication than the electronic component 400 of the first embodiment.
[0026] [Third Embodiment] The electronic component 400 of the third embodiment will be described below with reference to Figures 1 and 6. Matters not mentioned as part of the third embodiment may follow those of the first embodiment. Figure 1 is a perspective view showing the structure of the electronic component 400 of the third embodiment, and Figure 6 is a cross-sectional view of part B in Figure 1, viewed from the direction of arrow A.
[0027] The third embodiment differs from the first embodiment in the method of manufacturing the electronic component 400. In the third embodiment as well, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are brought into opposition via the bonding member 300, and the curing process is carried out while applying force to the first structure 100 and the second structure 200 so that the bonding member 300 is pressurized. The curing process of the third embodiment includes a first curing process and a second curing process following the first curing process. In the first curing process, heating light is irradiated onto the central part C of the bonding member 300 in the direction of electrode arrangement (a predetermined direction). In the second curing process, which is performed after the first curing process, heating light is irradiated onto the peripheral part D of the bonding member 300 in the direction of electrode arrangement. Here, the direction of electrode arrangement is the direction of arrangement of the first electrode 102, which is also the direction of arrangement of the second electrode. In Figure 6, the direction of electrode arrangement is the left-right direction. "Central region" and "periphery" are relative terms; the area outside the central region is the periphery, and the area inside the periphery is the central region.
[0028] When the joining member 300 is irradiated with heating light, the joining member 300 is heated up. For example, if the joining member 300 is a joining material containing an organic material such as an FPC, the joining member 300 expands as the temperature rises. As a result, if the entire joining member 300 is cured at once, as in the manufacturing method of the first embodiment, the alignment accuracy of the first electrode 102 and the second electrode 202 may decrease in the peripheral part D due to the expansion of the joining member 300.
[0029] In the third embodiment, a second curing step is performed to cure the peripheral part D after a first curing step to cure the central part C, so the joint member 300 is less susceptible to expansion when performing the second curing step. The third embodiment is advantageous when using a joint member with a large coefficient of linear expansion, such as FPC, or when using long electronic components that are susceptible to the effects of expansion of the joint member.
[0030] [Fourth Embodiment] The electronic component 400 of the fourth embodiment will be described below with reference to Figure 7. Matters not mentioned as part of the fourth embodiment may follow those of the first to third embodiments. The fourth embodiment provides an example of a window provided in the second electrode 202 and / or the first electrode 102. Here, a window provided in the second electrode 202 is illustrated, but a similar structure may be applied to the first electrode 102.
[0031] As illustrated in Figure 7(a), the second structure 200 may include a plurality of second electrodes 202 (electrode portions 202a) on the first main surface of the second substrate 201, and one second electrode 202 (electrode portion 202a) may be provided with one window portion 202b. The window portion 202b may be surrounded all around by the electrode portion 202a, as illustrated in Figure 7(a), or it may be partially surrounded by the electrode portion 202a, as illustrated in Figure 7(b). The window portion 202b may have a rectangular shape, as illustrated in Figures 7(a) and (b). Alternatively, the window portion 202b may have a curved shape, a circular or elliptical shape, or any other shape.
[0032] [Fifth Embodiment] The electronic component 400 of the fifth embodiment will be described below with reference to Figure 8. Matters not mentioned as part of the fifth embodiment may follow those of the first to third embodiments. The fifth embodiment provides an example of a window provided in the second electrode 202 and / or the first electrode 102. Here, a window provided in the second electrode 202 is illustrated; a similar structure may be applied to the first electrode 102.
[0033] As illustrated in Figure 8, the second structure 200 may include a plurality of second electrodes 202 (electrode portions 202a) on the first main surface of the second substrate 201, and a plurality of window portions 202b may be provided in one second electrode 202 (electrode portion 202a). Electrode portions 202a are arranged between the window portions 202b, and a bonding member containing conductive particles is arranged between the electrode portions 202a of the second electrode 202 and the first electrode 102, thereby reducing the electrical resistance between the first electrode 102 and the second electrode 202.
[0034] [Sixth Embodiment] The electronic component 400 of the sixth embodiment will be described below with reference to Figure 9. Matters not mentioned as part of the sixth embodiment may follow those of the first to third embodiments. The sixth embodiment provides an example of the arrangement of multiple window portions provided on the second electrode 202 and / or the first electrode 102. Here, a window portion provided on the second electrode 202 is illustrated; a similar structure may be applied to the first electrode 102.
[0035] As illustrated in Figure 9, in each second electrode 202, a plurality of window portions 202b are arranged along the longitudinal direction of the second electrode 202. The distance W0 from the short-side edge of each second electrode 202 to each of the plurality of window portions 202b is greater than the spacing W1 between adjacent window portions 202b. The sixth embodiment is advantageous, for example, when it is desired to arrange more conductive particles in the region of distance W0 from the end-side edge of each second electrode 202 to each of the plurality of window portions 202b than in the region of spacing W1 between adjacent window portions 202b.
[0036] [Seventh Embodiment] The electronic component 400 of the seventh embodiment will be described below with reference to Figure 10. Matters not mentioned as part of the seventh embodiment may follow those of the first to third embodiments. The seventh embodiment provides an example of the arrangement of multiple window portions provided on the second electrode 202 and / or the first electrode 102. Here, a window portion provided on the second electrode 202 is illustrated. A similar structure may be applied to the first electrode 102.
[0037] The seventh embodiment provides an example in which the centerline 202c along the longitudinal direction of each second electrode 202 (or first electrode 102) is arranged to pass through a plurality of window portions 202b. In the example shown in Figure 10(a), the plurality of window portions 202b are arranged linearly along the centerline 202c. In the example shown in Figure 10(a), the plurality of window portions 202b are arranged in a staggered pattern along the centerline 202c. Both examples are advantageous for controlling the temperature distribution formed on the joining member 300 by heating light.
[0038] [Eighth Embodiment] The eighth embodiment of the electronic component 400 will be described below with reference to Figure 11. Matters not mentioned as part of the eighth embodiment may follow those of the first to third embodiments. The eighth embodiment provides an example of the arrangement of multiple window portions provided on the second electrode 202 and / or the first electrode 102. Here, a window portion provided on the second electrode 202 is illustrated; a similar structure may be applied to the first electrode 102.
[0039] The eighth embodiment provides an example in which each second electrode 202 (or first electrode 102) is arranged in a grid pattern, as illustrated in Figure 11. Such an arrangement is advantageous for controlling the temperature distribution formed on the bonding member 300 by the heating light.
[0040] [Ninth Embodiment] The bonding members in the first to eighth embodiments may be replaced with photocurable bonding members. In this case, the light used to cure the bonding member does not need to include a wavelength range that can heat the bonding member, but only needs to include a wavelength range that can cure the bonding member by photopolymerization.
[0041] [Application Examples] Figure 12 is a schematic diagram showing an electronic device or display device according to one embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005, respectively. The touch panel 1003 and the display panel 1005 correspond to a first substrate with a first electrode provided on the first main surface, and the flexible printed circuits FPCs 1002 and 1004 correspond to a second substrate with a second electrode provided on the first main surface. Transistors are printed on the circuit board 1007. The battery 1008 does not need to be provided if the display device is not a portable device, or it may be provided in a different location even if it is a portable device.
[0042] The electronic device or display device according to this embodiment may have a color filter having red, green, and blue colors. The color filter may have the red, green, and blue colors arranged in a delta array.
[0043] The display device according to this embodiment may be used in the display unit of a mobile terminal. In that case, it may have both display and operation functions. Examples of mobile terminals include smartphones and other mobile phones, tablets, and head-mounted displays.
[0044] The electronic device or display device according to this embodiment may be used as a display unit in an imaging device having an optical unit with multiple lenses and an image sensor that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the image sensor. The display unit may be an external display unit or a display unit located inside a viewfinder. The imaging device may be a digital camera or a digital video camera.
[0045] Figure 13(a) is a schematic diagram showing an electronic device or imaging device according to one embodiment. The electronic device or imaging device 1100 may have a viewfinder 1101, a rear display 1102, an operating unit 1103, and a housing 1104. The viewfinder 1101 may have the above-mentioned electronic components. These electronic components may be, for example, a display device, which may display not only the image to be captured but also environmental information, imaging instructions, etc. Environmental information may include the intensity of ambient light, the direction of ambient light, the speed at which the subject is moving, the possibility of the subject being obscured by an obstacle, etc.
[0046] The electronic device or imaging device 1100 has an optical section (not shown). The optical section has multiple lenses that form an image on an image sensor housed in the housing 1104. The focus can be adjusted by adjusting the relative positions of the multiple lenses. This operation can also be performed automatically. The imaging device may also be understood as a photoelectric converter. The photoelectric converter may include imaging methods such as detecting the difference from the previous image, or extracting from an image that is always being recorded, rather than capturing images sequentially.
[0047] Figure 13(b) is a schematic diagram showing an example of an electronic device according to one embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type response unit. The operation unit may also be a biometric recognition unit that recognizes fingerprints to unlock or otherwise perform actions. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. Images captured by the camera function are displayed on the display unit. Examples of electronic devices include smartphones and laptop computers.
[0048] Figure 14(a) shows an electronic device configured as a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The display unit 1302 may use the light-emitting device according to this embodiment. The frame 1301 and the base 1303 that supports the display unit 1302 are also included. The base 1303 is not limited to the form shown in Figure 14(a). The lower edge of the frame 1301 may also serve as the base. Furthermore, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be between 5000 mm and 6000 mm.
[0049] Figure 14(b) is a schematic diagram showing an electronic device or display device according to one embodiment. The electronic device or display device 1310 in Figure 14(b) is configured to be foldable and is configured as a so-called foldable display device. The electronic device or display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may have light-emitting devices according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single display device without seams. The first display unit 1311 and the second display unit 1312 can be separated at a bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may together display a single image.
[0050] The electronic device or display device can be applied to a system that can be worn as a wearable device, such as smart glasses, HMDs, or smart contact lenses. The electronic device may include an imaging device capable of photoelectric conversion of visible light and a display device capable of emitting visible light.
[0051] Figure 15(a) illustrates a pair of glasses 1600 (smart glasses) representing one application example of electronic equipment. An imaging device 1602, such as a CMOS sensor or SPAD, is provided on the front surface of the lens 1601 of the glasses 1600. A display device, as described above, is provided on the back surface of the lens 1601.
[0052] The eyeglasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that provides power to the imaging device 1602 and the display device according to each embodiment. The control device 1603 also controls the operation of the imaging device 1602 and the display device. The lens 1601 has an optical system formed therein for focusing light onto the imaging device 1602.
[0053] Figure 15(b) illustrates eyeglasses 1610 (smart glasses) as one application example of electronic equipment. The eyeglasses 1610 have a control device 1612, which is equipped with an imaging device equivalent to an imaging device 1602 and a display device. The lens 1611 has an optical system formed therein for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply to provide power to the imaging device and the display device, and also controls the operation of the imaging device and the display device. The control device may have a gaze detection unit that detects the wearer's gaze. Gaze detection may use infrared light. The infrared light emitter emits infrared light towards the eyeball of the user who is gazing at the displayed image. The imaging unit, which has a photodetector, detects the reflected light from the eyeball of the emitted infrared light, thereby obtaining an image of the eyeball. By having a reduction means that reduces the light from the infrared light emitter to the display unit in planar view, the degradation of image quality is reduced.
[0054] The user's gaze towards the displayed image is detected from an image of the eyeball obtained by imaging with infrared light. Any known method can be applied to gaze detection using an image of the eyeball. For example, a gaze detection method based on the Purkinje image obtained by the reflection of the irradiated light from the cornea can be used.
[0055] More specifically, gaze detection processing is performed based on the pupil-corneal reflection method. Using the pupil-corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the pupil image and Purkinje image contained in the captured image of the eyeball, thereby detecting the user's gaze.
[0056] A display device according to one embodiment of the present invention includes an imaging device having a light-receiving element, and may control the display image of the display device based on the user's gaze information from the imaging device.
[0057] Specifically, the display device determines a first field of view that the user is fixated on, and a second field of view other than the first field of view, based on gaze information. The first and second field of view may be determined by the control device of the display device, or they may be determined by an external control device and received by the display device. Within the display area of the display device, the display resolution of the first field of view may be controlled to be higher than the display resolution of the second field of view. In other words, the resolution of the second field of view may be lower than that of the first field of view.
[0058] Furthermore, the display area has a first display area and a second display area different from the first display area, and based on gaze information, the area with higher priority is determined from the first display area and the second display area. The first and second view areas may be determined by the control device of the display device, or they may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of the areas other than the high-priority area. In other words, the resolution of areas with relatively lower priority may be lowered.
[0059] AI may be used to determine the primary field of view and high-priority areas. The AI may be a model configured to estimate the angle of gaze and the distance to the target object at the end of the line of sight from the image of the eye, using the image of the eye and the direction the eye was actually looking in that image as training data. The AI program may be installed in the display device, the imaging device, or an external device. If installed in an external device, it will be transmitted to the display device via communication.
[0060] When display control is based on visual detection, this method is preferably applicable to smart glasses that further include an imaging device for capturing images of the surrounding environment. The smart glasses can display the captured external information in real time.
[0061] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]
[0062] 100: First structure, 101: First substrate, 102: First electrode, 200: Second structure, 201: Second substrate, 202: Second electrode, 202a: Electrode part, 202b: Window part, 300: Bonding member, 301: Bonding resin, 302: Conductive particles
Claims
1. A step of preparing a first structure in which a first electrode is arranged on the first main surface of a first substrate, A step of preparing a second structure in which a second electrode is arranged on the first main surface of a second substrate, The process includes a curing step of bringing the first main surface of the first substrate and the first main surface of the second substrate facing each other via a bonding member, and curing the bonding member, At least one of the first electrode and the second electrode has a window portion, and in the curing step, the bonding member is cured by irradiating the bonding member with light through the window portion. The joining member includes a first portion located in a first region not sandwiched between the first electrode and the second electrode, and a second portion located in a second region sandwiched between the first electrode and the second electrode. The aforementioned curing step is A first curing step in which the first portion is cured by selectively irradiating the first portion with the light, The process includes, after the first curing step, a second curing step in which the second portion is cured by selectively irradiating the portion of the second portion in which the window portion exists with light through the window portion, A method for manufacturing electronic components, characterized by the following:
2. The first curing step is a step of curing the first portion after increasing the fluidity of the first portion, and the second curing step is a step of curing the second portion after the first curing step by selectively irradiating the portion of the second portion in which the window portion exists with light through the window portion to increase the fluidity of the second portion. The method for manufacturing an electronic component according to claim 1.
3. In the curing step, the first main surface of the first substrate and the first main surface of the second substrate are brought into opposition via the bonding member, and the bonding member is cured while applying force to the first structure and the second structure so that the bonding member is pressurized. A method for manufacturing an electronic component according to claim 1 or 2, characterized by the above.
4. The aforementioned window section is an opening, A method for manufacturing an electronic component according to any one of claims 1 to 3.
5. The light absorption rate by the bonding member is higher than the light absorption rate by the first electrode or the second electrode having the window portion. A method for manufacturing an electronic component according to any one of claims 1 to 4.
6. The bonding member comprises a bonding resin and a plurality of conductive particles dispersed within the bonding resin. A method for manufacturing an electronic component according to any one of claims 1 to 5.
7. By performing the second curing step after the first curing step, the movement of conductive particles in the bonding member from the second portion to the first portion is suppressed. The method for manufacturing an electronic component according to claim 6.
8. The first structure has a plurality of first electrodes, the plurality of first electrodes are arranged along a predetermined direction, The second structure has a plurality of second electrodes, the plurality of second electrodes are arranged along the predetermined direction, The aforementioned curing step is A first curing step in which the light is irradiated onto the central part of the joining member in the predetermined direction, The process includes, after the first curing step, a second curing step in which the light is irradiated onto the peripheral portion of the joining member in the predetermined direction, A method for manufacturing an electronic component according to any one of claims 1 to 7.