Electronics Assembly

Abstract

An electronics substrate spanning cell terminals of a plurality of energy storage units, the electronics substrate including at least one terminal bonding region configured as a primary path for electrical current between the electronics substrate and the cell unit terminals, at least one circuit region including at least a first conductive layer and a second non-conductive layer, and two or more electronic components disposed on the one or more electronics substrates and connected to the conductive layers in the circuit region, wherein at least a portion of the terminal bonding region and / or the circuit region have specified mechanical bending characteristics and / or combined thickness characteristics that allow at least some displacement from a predetermined geometric arrangement.

Description

Technical Field

[0001] Broadly speaking, the present invention relates to electronics assemblies related to energy storage systems, and more particularly, to devices that facilitate mechanical or thermal stress relaxation between energy storage units and assemblies incorporating such devices.

Background Art

[0002] Energy storage systems for applications such as fully electric vehicles, hybrid electric vehicles, and stationary energy storage in grid-connected or off-grid applications often include the placement of multiple energy storage cell units.

[0003] In an energy storage system including a plurality of energy storage cell units, the plurality of cell units are typically interconnected using conductive connectors such as busbars, metal tabs, or metal strips. These conductive connectors are typically made of copper or aluminum. Also, an energy storage system with multiple cell units often has individual control connectors at each cell unit terminal for purposes of battery control, such as measuring the voltage of the cell units and passing current between specific cell units to equalize the cell units. These control connectors are often composed of flexible wires that may have a conductive core and a non-conductive electrical insulator. At the same time, this conventional approach has the advantage of high conductivity between battery cells via the conductive connectors, and by providing individual conductive connectors in parallel with the flexible wires between each set of cell units, a good electrical connection to the battery cells can be achieved with low resistance and high vibration resistance. However, this busbar and strip approach has drawbacks in assembly, such as the need for additional electronics boards for electronics measurement and equalization connected to the flexible wires, and the large number of wires increases cost, assembly complexity, and the risk of damage.

[0004] A less common approach is to use electronic substrates to interconnect energy storage systems. These electronic substrates often combine both conductive and non-conductive layers, resulting in a robust structure that can provide both electrical connections between cell units and electrical connections for measurement and control of each cell unit. As a single physical component, the electronic substrate can provide electrical connections, measurement, and equilibration between multiple cell units, thus reducing complexity and making assembly quick and easy. Furthermore, a single electronic substrate can integrate electronic components required for measurement or equilibration, for example. However, this less common approach has the drawback that a single substrate connecting multiple connection points can potentially introduce mechanical stress into the substrate and degrade electrical connections if at least the connection points of multiple cell units are not perfectly aligned on a single plane. Additionally, because cell units are typically heavy, if the units are subjected to vibration, as is common in their intended applications, the movement of those units can transmit mechanical stress to the electronic substrate, potentially leading to failure of the substrate or components on it.

[0005] Another drawback of a single electronics substrate is that, during significant heating and cooling, different thermal expansions can occur between the battery and the substrate, potentially leading to mechanical stress within the substrate. Furthermore, to provide high current capability, these substrates may have two or more layers of conductive material separated by other layers, including one or more non-conductive layers, with electronic vias for electrically connecting two or more conductive layers. However, the distance between conductive layers, for example, due to non-conductive layers, limits the thermal conductivity between conductive layers both near vias and in sections without vias, which can then limit heat dissipation, and thus potentially limit the performance, such as current capability, of such substrates and electronic components mounted thereon. [Overview of the project] [Problems that the invention aims to solve]

[0006] Therefore, an object of the present invention is to mitigate or improve upon the aforementioned disadvantages of the prior art, or at least to provide a useful alternative to the public. Other objects will be obvious to those skilled in the art. [Means for solving the problem]

[0007] According to some broad embodiments, the present invention relates to an electronic assembly comprising one or more electronic substrates adapted to span between the terminals of three or more energy storage units, wherein the conductive terminals are arranged in a predetermined geometric arrangement and constitute a primary path for currents entering and leaving the energy storage units, and the one or more electronic substrates comprises at least one terminal coupling region configured as a primary path for currents between the electronic substrate and the unit terminals, and at least one circuit region comprising at least a first conductive layer and a second nonconductive layer, wherein at least a portion of the terminal coupling region and / or at least a portion of the circuit region is characterized by mechanical bending properties and / or combined thickness properties to allow at least some displacement from a predetermined geometric arrangement.

[0008] According to several broad embodiments, the present invention relates to one or more electronic substrates adapted to span between the terminals of three or more energy storage units, wherein the cell unit includes one or more electronic substrates arranged in a predetermined geometric arrangement and configured as primary paths for currents entering and leaving the energy storage units, and the one or more electronic substrates are At least one terminal coupling region configured as the primary current path between the electronics substrate and the cell unit terminal, A circuit region comprising at least a first conductive layer and a second nonconductive layer, It includes two or more electronic components that are arranged on one or more electronic substrates and connected to a conductive layer within a circuit region, This relates to an electronics assembly in which at least a portion of the terminal coupling region and / or at least a portion of the circuit region are characterized by mechanical bending properties and / or combined thickness properties such that at least some displacement from a given geometric arrangement is possible.

[0009] In some embodiments, the circuit region includes a primary current path between at least two terminal coupling regions, and at least one of the electronic components is a switch component located within the primary current path and configured to selectively bypass and reversibly disconnect any one or more storage units from a series connection.

[0010] In some embodiments, at least one of the terminal coupling regions is electrically coupled to one or more junctions between two series-connected energy storage units.

[0011] In some embodiments, at least one of the multiple energy storage units includes a charging capacity of at least 20 amp-hours.

[0012] In some embodiments, at least one of the electronic components includes an electronic circuit board on which individual components are mounted or an integrated electronic circuit element.

[0013] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further include a layer of elastically deformable material.

[0014] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further includes at least two conductive layers separated by at least one nonconductive layer, and one or more vias extending between the at least two conductive layers.

[0015] In some embodiments, at least one of the circuit regions further includes a layer substantially contiguous with at least one of the terminal coupling regions.

[0016] In some embodiments, at least one of the circuit regions further includes one or more support layers, thereby modifying the mechanical bending properties and / or combined thickness properties within the circuit region adjacent to the one or more support layers.

[0017] In some embodiments, one or more support layers are substantially continuous with at least one of the circuit regions and / or terminal coupling regions of the electronic substrate.

[0018] In some embodiments, at least one of the multiple energy storage units includes a charging capacity of at least 20 amp-hours.

[0019] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further include a layer of elastically deformable material.

[0020] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions further include at least two conductive layers separated by at least one nonconductive layer, and one or more vias extending between the at least two conductive layers.

[0021] In some embodiments, at least one of the circuit regions further includes a layer substantially contiguous with at least one of the terminal coupling regions.

[0022] In some embodiments, at least one of the circuit regions further includes one or more support layers, thereby modifying the mechanical bending properties and / or combined thickness properties within the circuit region adjacent to the one or more support layers.

[0023] In some embodiments, one or more support layers are substantially continuous with at least one of the circuit regions and / or terminal connection regions of the electronics substrate.

[0024] In some embodiments, at least one of the circuit regions includes a primary current path between the terminal connection regions of at least two energy storage units and one or more switch components disposed within the primary current path operable to selectively bypass and reversibly disconnect one or more of the energy storage units.

[0025] In some embodiments, the terminals include terminals electrically coupled to a junction between two energy storage units.

[0026] In some embodiments, the circuit region includes one or more switch components connected to a junction between serially connected storage units, the switch components configured to selectively bypass and reversibly disconnect any one or more of the storage units from the serial connection.

[0027] In some embodiments, the terminal connection region is arranged for a secure connection to the terminals of one storage unit by means of a fastener, fusion, or welding.

[0028] In some embodiments, the terminal connection region further includes a temperature sensor configured to measure the temperature of the assembly proximate to the terminals.

[0029] In some embodiments, the terminal connection region further includes a voltage sensor configured to measure the voltage of the terminals.

[0030] In some embodiments, the terminal connection region further includes a plurality of conductive segments, at least one segment configured to couple to the temperature sensor and / or the voltage sensor, and the primary current path includes one or more other segments.

[0031] In some embodiments, the support layer includes one or more slits, protrusions, openings, and / or recesses positioned between at least some of the multiple conductive segments of the terminal coupling region.

[0032] In some embodiments, one or more layers include one or more slits, protrusions, openings, and / or recesses arranged to be at least partially adjacent to the terminal coupling region.

[0033] In some embodiments, the terminal region includes a conductive pad segmented by a plurality of nonconductive regions, at least some of which include one or more slits, protrusions, openings, and / or recesses.

[0034] In some embodiments, the primary current path further includes one or more fuseable circuits arranged to connect at least one of the terminal coupling regions to at least one of the circuit region and / or other terminal coupling regions.

[0035] In some embodiments, one or more fuseable circuits include printed conductive tracks having nominally configured geometric constraints for failures exceeding approximately 1000 amperes.

[0036] In some embodiments, the electronic substrate includes polyimide or Kapton.

[0037] In some embodiments, the electronics assembly further includes a plurality of energy storage units, each having a conductive terminal configured as a primary path for current entering and leaving the unit.

[0038] In some embodiments, the electronics assembly further includes one or more restraint fastening devices that hold bolts in place when they are not fastened in relation to the electronics assembly and / or one or more energy storage units.

[0039] In some embodiments, a) The electronics assembly has a flexural modulus of less than 12 GPa at room temperature. b) The electronics assembly has a flexural modulus of approximately 6 GPa at room temperature. c) The material in one or more nonconductive layers has a flexural modulus of less than 10 GPa at room temperature. d) The material in one or more nonconductive layers has a flexural modulus of about 3 GPa at room temperature. e) The electronics assembly has a bending strength of less than 300 MPa at room temperature. f) The electronics assembly has a bending strength of approximately 150 MPa at room temperature. g) The material of one or more nonconductive layers has a bending strength of less than 300 MPa at room temperature. The bending properties of the material with one or more nonconductive layers are specified as having a bending strength of less than 150 MPa at room temperature.

[0040] In some embodiments, the combined thickness characteristics are h) One or more support layers having a thickness of approximately 1 mm, i) One or more support layers exceeding 0.4 mm, j) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of up to 0.4 mm, k) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of up to 0.2 mm, l) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of approximately 0.1 mm, m) A first non-conductive layer having a maximum thickness of 0.08 mm, and / or n) A first nonconductive layer having a maximum thickness of 0.02 mm. It is identified by [the specified method].

[0041] In some embodiments, the present invention relates to any one or more of the above statements combined with any one or more of the other statements. Other aspects of the present invention may become apparent from the following description, given only by reference to the accompanying drawings.

[0042] All applications, patents, and publications cited above and below are incorporated herein by reference, if any. The present invention also can be said to be broadly present in the parts, elements, and configurations that are individually or collectively referred to or shown in the specification of this application, as well as in any combination of any two or more such parts, elements, or features, and where a particular integer having known equivalents in the art to which the present invention relates is referred herein, such known equivalents shall be deemed incorporated herein as if they were individually described.

[0043] For those skilled in the art relating to the present invention, many modifications to the structure of the invention and significantly different embodiments and uses will be suggested in themselves without departing from the scope of the invention as defined in the appended claims. The disclosures and descriptions herein are purely illustrative and are not intended to limit in any sense.

[0044] As used herein and in the claims, the terms “and / or” mean “and” or “or,” or both. As used herein and in the claims, the term “comprising” means “consisting at least in part of.” When interpreting any statement within this specification and in the claims that contains such a term, all the configurations preceding the term in each statement must exist, but other configurations may also exist. Related terms such as “comprise” and “comprised” are interpreted similarly.

[0045] Where used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless otherwise specified. Furthermore, where used herein, the terms “includes,” “comprises,” “including,” and / or “comprising” specify the presence of a described configuration, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other configurations, integers, steps, operations, elements, components, and / or groups thereof. Where an element is referred to as “connected” or “combined” with another element, it will be understood that there may be elements that can be directly connected to or combined with the other element, or that interpose to it.

[0046] The present invention can be better understood by referring to the following drawings. The elements in the drawings are not necessarily to scale relative to one another; instead, the emphasis is on clearly illustrating the principles of the present invention. Furthermore, similar reference numerals indicate corresponding parts throughout several of the drawings. [Brief explanation of the drawing]

[0047] [Figure 1] An example of an electronics assembly attached to eight battery modules is shown. [Figure 2A] An exemplary electronics assembly attached to 24 battery modules is shown. [Figure 2B] An exemplary electronics assembly attached to 24 battery modules is shown. [Figure 3] The electronics assembly in Figure 1 is shown in more detail. [Figure 4] This is an example of an electronics assembly in which switching components are mounted on three battery modules and arranged to selectively bypass one or more of those battery modules. [Figure 5]Figures 1 and 3 show cross-sections of exemplary electronics assemblies. [Figure 6] A detailed cross-sectional view of an exemplary embodiment of an electronics assembly with different layers is shown. [Figure 7] An exemplary embodiment of an electronics assembly having conductive and non-conductive layers, as well as a heat sink element, is shown. [Figure 8] An exemplary embodiment of an electronics assembly is shown. [Figure 9] (A) shows a top isometric view of the assembly in Figure 8, and (B) shows a bottom view of the assembly. [Figure 10] A bottom view of another exemplary electronics assembly is shown. [Figure 11] Another exemplary embodiment of an electronics assembly is shown. [Figure 12] An exemplary electronics assembly, particularly a magnified view of the terminal coupling region, is shown. [Figure 13] An example of an electronic circuit for implementation in one of the described electronic assemblies is shown. [Figure 14] An exemplary electronic circuit for implementation in any of the described electronic assemblies is shown, having mechanical bending properties that allow for displacement from a predetermined geometric arrangement and / or combined thickness characteristics. [Figure 15] A top view of an exemplary embodiment of an electronics assembly in which a single electronics substrate is fitted to span across multiple cell unit terminals is shown. [Figure 16] An example of an electronic circuit for implementation in an electronic assembly is shown. [Figure 17] An isometric view of the bottom of an exemplary embodiment of an electronics assembly is shown. [Figure 18] A bottom view of another exemplary embodiment of an electronics assembly with a notch at the mounting point to the cell unit is shown. [Figure 19] This illustrates an exemplary embodiment of an electronics assembly, which is a six-layer electronics substrate laminate, with the substrates also supporting electronic components. [Modes for carrying out the invention]

[0048] Exemplary methods, apparatus, assemblies, and systems are described herein. It should be understood that the term “exemplary” is used herein to mean “serving as an example, illustration, or representation.” Any embodiment or configuration described herein as “exemplary” or “illustrative” should not necessarily be construed as being preferable or advantageous to other embodiments or configurations. More generally, the embodiments described herein are not intended to be limiting. Certain aspects of the disclosed systems and methods can be arranged and combined in a wide variety of different configurations, all of which are conceivable herein.

[0049] The present invention includes one or more electronic substrates and an assembly including an electronic substrate spanning between the terminals of a plurality of energy storage cell units. To address the aforementioned drawbacks, the electronic substrate integrates one or more configurations that facilitate the measurement of flexibility, deformability, or elasticity, such that mechanical stress, thermal stress, or thermal energy generated in the substrate itself, generated in components mounted on the substrate, and / or transmitted from the cell units to the substrate does not have a destructive effect on the substrate or the components supported by the substrate, or at least such stress or heating is mitigated.

[0050] In this specification, the terms “battery cell unit” or “cell unit” are intended to refer generally to a component that can store electric charge and may refer to individual battery cells or blocks of cells connected in parallel, or a large number of individual battery cells or blocks of parallel cells, or a mix of cells connected in series. An energy storage unit may also refer to a block of cells connected in parallel and / or in series, further including circuit components such as fuses, resistors, passive control diodes, capacitors, or inductors connected in series and / or parallel with the individual cells. The terms “energy storage unit,” “storage unit,” “battery cell unit,” or “cell unit” may also refer to non-battery energy storage elements such as fuel cells and supercapacitors.

[0051] In some embodiments, an energy storage unit can be designed to include one or more energy storage units that enable a charging capacity of at least 10Ah, 20Ah, 40Ah, 60Ah, 100Ah, 200Ah, or 400Ah ampere-hours. In some embodiments, a plurality of energy storage units may include first and second energy storage units, wherein the first energy storage unit has a charging capacity substantially greater than that of the second energy storage unit.

[0052] In a preferred embodiment, one or more electronic substrates are present, adapted to span between the terminals of three or more energy storage units. In industrial applications, the terminals of the storage units are arranged in a predetermined arrangement that best suits the packaging constraints of the application, due to variations in the size or alignment of the cell units, or other reasons such as proximity to an electrical load or cooling source. The predetermined geometric arrangement of conductive terminals constitutes the primary path for current entering and leaving the energy storage units.

[0053] Terminals will typically have a predetermined geometric arrangement, determined by the requirements of their application or purpose. For example, to optimize current coupling between units, the terminals of a unit are often arranged so that an electronics assembly in a single plane can make contact with all terminals. However, terminals may be arranged such that at least one terminal is spatially offset from one or more other terminals. For example, there may be physical constraints, such as one or more other components of an energy storage module, rack, enclosure, or other nearby parts potentially colliding with the plane of the terminals and subsequently affecting the terminal misalignment.

[0054] One or more electronic substrates have a number of terminal coupling regions intended to be attached to the terminals of a storage unit. The terminal coupling regions constitute the primary path for current between the electronic substrate and the unit terminals and are used to charge or discharge the energy storage unit as needed.

[0055] Furthermore, the electronics substrate has at least one circuit region, which is typically used to support components such as discrete components, sensors, or other electrical devices that can be usefully connected. The circuit region has at least a first conductive layer and a second non-conductive layer in several areas, and a substrate for the circuit path, in order to form a circuit path.

[0056] A preferred mounting method for electronic substrates is a printed circuit board. Circuit boards are typically composed of a laminate of layers. Any layer within the laminate can be a conductive or non-conductive layer. In some embodiments, the conductive layer may include aluminum or copper. In some embodiments, the non-conductive layer material may include polyimide, Kapton tape, polyethylene terephthalate, or polyethylene naphthalate. In some embodiments, one or more support layers may consist of a glass-reinforced epoxy laminate, such as FR4, or aluminum.

[0057] Conductive layers are typically metals such as copper or plated copper. When two or more conductive layers are used, separated by non-conductive layers, vias can be used to electrically and thermally connect those layers. Heat is often generated from electronic components attached to electronic assemblies, such as switches, diodes, fuses, or other components, and this heat can be efficiently transferred through the conductive layers and vias of the device.

[0058] To address mechanical stress, thermal stress, or thermal energy, the terminal coupling region and / or circuit region are characterized by mechanical bending properties and / or combined thickness properties to allow at least some displacement from a given geometric arrangement or to allow connections to terminals that are not precisely aligned.

[0059] Mechanical bending properties are facilitated by the circuit region or terminal region, thereby making that region relatively flexible to form a region of deformation and / or a relatively thin region. This has one or more advantages: If connection points, such as multiple cell terminals, are not perfectly aligned, the electronics substrate can bend without applying excessive stress to the substrate. • If the battery and substrate experience different thermal expansions during significant heating and cooling, the electronics substrate can bend without putting excessive stress on the substrate. • Without being confined to a specific type, a thin substrate, for example, a thin non-conductive layer with two conductive layers on either side, can have high thermal conductivity between the two conductive layers in both via and via-free areas, enabling high performance such as current capability of the substrate and the electronic components mounted on it. Bending properties

[0060] In some exemplary embodiments, one or more electronic substrates are characterized by the measurement of bends in a portion of a terminal coupling region or circuit region such that a conductive layer is made operable to allow current to flow through and after a bend, according to: a bend of 10 degrees or more with a maximum bending radius of 5 cm, a bend of 15 degrees or more with a maximum bending radius of 5 cm, a bend of 30 degrees or more with a maximum bending radius of 5 cm, or a bend of 45 degrees or more with a maximum bending radius of 5 cm.

[0061] In some exemplary embodiments, one or more electronic substrates are characterized by measuring the bending of a portion of the terminal coupling region or a portion of the circuit region according to the following (at about 20 degrees Celsius): a flexural modulus of less than 12 GPa, a flexural modulus of about 6 GPa, a flexural strength of less than 300 MPa, or a flexural strength of about 150 MPa.

[0062] In some exemplary embodiments, one or more nonconductive layers are characterized by a flexural modulus of less than 10 GPa (at about 20 degrees Celsius), a flexural modulus of about 3 GPa, a flexural strength of less than 300 MPa, or a flexural strength of about 150 MPa. Thickness characteristics

[0063] In some embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions are characterized by a combined thickness characteristic. In other embodiments, at least one of the terminal coupling regions and / or at least one of the circuit regions are characterized by a thickness characteristic of at least a specific layer. The thickness characteristic is selected to optimize or improve the thermal energy transfer behavior.

[0064] In some embodiments having two or more conductive layers separated by one or more nonconductive layers, having a relatively thin nonconductive layer between the conductive layers may allow the conductive layers to distribute thermal energy more efficiently.

[0065] In some embodiments, one or more electronic substrates include at least a first nonconductive layer and at least a first conductive layer, and the electronic substrates are characterized by a combined thickness of less than 0.4 mm, less than 0.2 mm, or about 0.1 mm.

[0066] In some embodiments, one or more electronic substrates include at least a first nonconductive layer and at least a first conductive layer, and the electronic substrates are characterized by a combination of thicknesses of about 0.05-0.4, 0.1-0.4, 0.15-0.4, 0.2-0.4, 0.25-0.4, 0.3-0.4, 0.35-0.4, 0.05-0.35, 0.05-0.3, 0.05-0.25, 0.05-0.2, 0.05-0.15, or 0.05-0.1 mm.

[0067] In some embodiments, one or more electronic substrates include at least a first nonconductive layer and at least a first conductive layer, and the electronic substrates are characterized by a combined thickness of about 0.05–0.2, 0.1–0.2, 0.15–0.2, 0.05–0.15, or 0.05–0.1 mm.

[0068] In some embodiments, the optimal bending value for one conductive layer is approximately 0.08 mm. Other values ​​are possible, but performance may be degraded if the initial value is implemented. In some embodiments, the optimal bending value for two conductive layers is approximately 0.1 mm. Other values ​​are possible, but performance may be degraded if the initial value is implemented.

[0069] In some embodiments, the thickness of the substrate containing the two conductive layers is in the range of approximately 0.05 mm to approximately 0.1 mm. It should be noted that increasing the spacing between the conductive layers reduces interlayer heat transfer, which in turn can decrease the efficiency of heat dissipation. In other words, as the non-conductive layer becomes thinner, heat dissipation performance may improve.

[0070] In some embodiments, the thickness range of the substrate, including two or more conductive layers or thicker conductive layers, is between approximately 0.05 mm and approximately 0.2 mm.

[0071] In some embodiments, the nonconductive layer has a practical minimum thickness of about 0.01 or 0.025 mm for mounting the nonconductive layer material. In some embodiments, the first nonconductive layer is characterized by a maximum thickness of 0.08 mm or 0.02 mm. In some embodiments, the optimal thickness of the nonconductive layer of the nonconductive material is either 0.0125 mm or 0.025 mm. In some embodiments, the optimal range of layer thickness is at least about 0.005 mm and 0.025 mm. In some embodiments, the nonconductive layer is between about 0.005 mm and 0.025 mm, 0.01 mm and 0.025 mm, 0.015 mm and 0.025 mm, 0.020 mm and 0.025 mm, 0.005 mm and 0.020 mm, 0.005 mm and 0.015 mm, or 0.005 mm and 0.010 mm.

[0072] For comparison, the practical thickness of FR4 PCB material is approximately 1 mm. Note that thin FR4 substrates can be manufactured with a thickness of 0.2 mm. In some embodiments, the non-conductive layer includes an FR4 or similar material layer of about 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, or 1 mm. Furthermore, in some embodiments, the non-conductive layer includes an FR4 or similar material layer of about 0.2–1.0, 0.3–1.0, 0.4–1.0, 0.5–1.0, 0.6–1.0, 0.7–1.0, 0.8–1.0, or 0.9–1.0. Furthermore, in some embodiments, the nonconductive layer includes an FR4 or similar material layer of about 0.2–0.9, 0.2–0.8, 0.2–0.7, 0.2–0.6, 0.2–0.5, 0.2–0.4, or 0.2–0.3 mm.

[0073] In some embodiments, in addition to the non-conductive and conductive layers, there may also be additional adhesive layers scattered between the other layers. In some embodiments, there may also be additional prepreg layers or other reinforcing layers scattered between the other layers. support layer

[0074] In some embodiments, certain regions of an electronic substrate are supported by one or more distinct segments, which are aligned with the point on which the segments are attached, thereby promoting further stiffness in the region of the segment adjacent to that point. Such segments are referred to herein as support layers. In effect, the support layers alter the mechanical bending properties and / or combined thickness properties in the circuit region adjacent to one or more support layers. In some embodiments, one or more support layers are characterized by a thickness of about 1 mm or greater than 0.4 mm. In some embodiments, the electronic substrate is a laminate in which some layers are arranged to span between multiple terminal coupling regions, and other layers are arranged in regions of the support substrate where increased stiffness is desired.

[0075] The additional stiffness provided by the support layer is beneficial in areas where the electronics assembly is connected to optional individual electronic components or elements, and where they are relatively sensitive to mechanical stresses in the connected electronics assembly, and therefore where additional mechanical stiffness can protect against failure or other problems.

[0076] In some embodiments, the support layer is conductive and configured to allow current to flow within the electronics assembly.

[0077] In some embodiments, the support layers include one or more slits, protrusions, openings, and / or recesses. The optimal location for the support layers is where they are positioned to surround the boundary and / or pass through the terminal coupling region, at least partially. The specific arrangement is determined by a combination of the arrangement of load paths created by the interconnected cells and clusters of cells and the local regions of thermal expansion. Terminal connection area

[0078] The terminal coupling region described above is configured to connect the electronics substrate to the terminals of the cell unit. The terminal coupling region can be attached by conventional coupling methods such as fasteners, fusion, or welding.

[0079] In some embodiments, the terminal coupling region is configured to connect to one or more sensors, such as a voltage sensor or a temperature sensor. Due to resistance losses occurring within the conductor, it is advantageous to connect the voltage sensor or sensing pair to a separate measuring connection rather than to the primary current path. Similarly, it is advantageous to position the temperature sensor to measure the temperature of the assembly adjacent to the terminal, so that the temperature best represents the temperature of the assembly in the cell unit.

[0080] In some embodiments, the terminal coupling region is divided into multiple conductive segments. The segments are arranged such that some segments constitute part of the primary current conduction path, and others are configured to connect to temperature sensors and / or voltage sensors. By isolating the segments of the terminal coupling region from the other segments, the location of the voltage sensor is improved in terms of isolation from the primary current path and the voltage offset created along that path. Exemplary embodiments discussed below illustrate the segmented terminal coupling region and its implementation. Gap composition

[0081] In some embodiments, the support layer is defined by one or more notched or recessed regions of the electronics substrate to facilitate relative displacement of the electronics substrate region on either side of the notched or recessed region. In some different embodiments, the terminal coupling region incorporates a certain form of notch. Such notches can form the aforementioned segments of the terminal coupling region in some embodiments.

[0082] In some embodiments, the support layer is defined by one or more slits, protrusions, openings, and / or recesses, which are positioned at least partially adjacent to the terminal coupling region.

[0083] In some embodiments, the terminal region is segmented by a plurality of regions having a non-conductive outermost layer, at least some of which have a conductive pad as the outermost layer, including one or more slits, protrusions, openings, and / or recesses. Other configurations

[0084] In some embodiments, the primary current path formed by the conductive layer of the electronics substrate has one or more fusible circuits arranged to connect at least one of the terminal coupling regions to at least one of the circuit region and / or other terminal coupling regions. The fusible links are intended to prevent large currents from being discharged from the cell unit, which may occur, for example, in the event of a component failure or an accident that damages an electrical component or current path. The fusible links are intended to remain intact during normal use and to become inoperable when exposed to current levels far exceeding their operating levels.

[0085] In some embodiments, at the location of the fuseable link, the conductive layer containing the link is covered by non-conductive layers positioned on both sides of the conductive layer. The non-conductive layers protect against contaminants that could adversely affect the performance of the fuseable link. The non-conductive layers provide a level of protection against the activated fuse component deviating significantly from its location to an unfavorable location.

[0086] In other embodiments, at the location of the severable link, the conductive layer containing the link is covered on only one side by a non-conductive layer. In other embodiments, the severable link is not covered on either side.

[0087] In some embodiments, the terminal coupling region can define a conductive layer having a geometrically constrained circuit path designed to cease functioning at approximately 50 amperes or more, approximately 100 amperes or more, approximately 200 amperes or more, approximately 500 amperes or more, approximately 1000 amperes or more, approximately 2000 amperes or more, and / or approximately 5000 amperes or more.

[0088] In some embodiments, the energy storage units can be designed to achieve a maximum charge or discharge current to one or more energy storage units of at least 3 amperes, 10 amperes, 30 amperes, 50 amperes, 100 amperes, 400 amperes, or different current levels.

[0089] In some embodiments, the electronics assembly supports an electronic switching component that operates selectively to allow connection or bypass of any one or more battery cell units from a series arrangement. The operation may further involve selective disconnection and reconnection, where disconnecting a battery cell from a series arrangement is performed in a reversible manner, allowing the battery cell to be selectively reconnected to the series arrangement afterward. Selective bypassing of cells from a series arrangement achieves different connection states, for example, allowing a change in the output voltage of the series arrangement. The operation of the electronic switching component is possible during charging and / or discharging of one or more battery cell units in a series arrangement.

[0090] If there are three battery cell units, the connection state can include a first state in which the first and second battery cell units are electrically connected in series and the third battery cell unit is disconnected; a second state in which the first and third battery cell units are electrically connected in series and the second battery cell unit is disconnected; and a third state in which the second and third battery cell units are electrically connected in series and the first battery cell unit is disconnected.

[0091] If there are four battery cell units, the states may include the three states described above, as well as a fourth state in which the first, second, and fourth battery cell units are electrically connected in series and the third battery cell unit is disconnected, and a fifth state in which the first, second, third, and fourth battery cell units are electrically connected in series.

[0092] By controlling the number of cell units connected in series, an electronics assembly may be able to control the resulting voltage at the output of one or more electronics assemblies.

[0093] In some embodiments, the electronics assembly supports electronic components that, in addition to connecting or bypassing any of a number of battery cell units from a series arrangement, allow individual battery cell units or groups of battery cell units to be further inverted. In one control state, such an electronics assembly may have a first output terminal having a relatively positive potential relative to a second output terminal. In a second control state, such an electronics assembly may have a first output terminal having a relatively negative voltage potential relative to the second output terminal.

[0094] In some embodiments, electronic components on an electronics assembly may operate such that multiple battery cell units are connected in series, while one or more battery cell units are connected to a resistive element for the purpose of discharging or reducing the charge of one or more of these battery cell units. In another embodiment, electronic components on an electronics assembly may operate such that multiple battery cell units are connected in series, while one or more battery cell units are connected to an energy transfer element for the purpose of transferring energy from a first cell unit to one or more other cell units, or from one or more other cell units to the first cell unit. The energy transfer element may include, for example, one or more capacitors, inductors, transformers, DC / DC converters, and / or batteries.

[0095] Figure 1 shows an example of an electronics assembly. In this example, the electronics assembly has one electronics board 200 designed to be mounted on eight battery modules 202a-202h. Each battery module in the example shown has two battery cell units connected in series. However, many other combinations of cell units are possible. This means that the positive terminal of the first cell unit in the first module 202a and the negative terminal of the second series-connected cell unit in module 202a are connected together at terminal 210a and connected to the electronics assembly at one contact 206a. The negative terminal of the first cell is connected to the electronics assembly at a separate contact 204a. The positive terminal of the second cell is also connected to the electronics assembly at a separate contact 208a.

[0096] Figures 2A and 2B show an exemplary electronics assembly with 24 battery modules 302a–302x mounted. In this example, the electronics assembly has 12 individual electronics boards 304a–304l. Each board is configured to be mounted on two battery modules. It should be understood that any number of modules or boards or battery cells within each module can be mounted according to the desired voltage, current, or capacity requirements. Each battery module consists of two battery cell units connected in series. The electronics boards include those connected to adjacent boards via electrical connectors 306a–306k that conduct current flowing through one or more cell units. The electronics boards are also connected to each other via control connectors 308a–308k and 310a–310k, enabling the sharing of encoded communication signals or physical control signals such as pulses, sine waves, or other unencoded signals that change over time.

[0097] Furthermore, the electronics assembly includes electronic components 320aa to 320xb, which are electronic circuit boards on which individual components are mounted. The electronics assembly also includes electronic components 315a to 315xb, which are switch components located in the primary current path and configured to selectively bypass and reversibly disconnect any one or more battery cell units from the series connection of the battery cell units.

[0098] Figure 3 shows the electronics assembly of Figure 1 in more detail. In this exemplary embodiment, the electronics assembly is a single electronics board composed of repeating structures intended for connection and mounting to eight battery modules. Each battery module consists of two battery cell units connected in series. The largest component of the electronics assembly may be a printed circuit board mounted according to the thickness and / or bending characteristics outlined above. The large raised square along the outside is an electronics circuit element, such as a secondary electronics circuit board with components mounted on it, or another integrated electronics circuit element, such as an FPGA or ASIC.

[0099] Each module has two sets of three small raised squares, which are optional electronic components. These electronic components can be switching components such as transistors, IGBTs, or MOSFETs that can be used to achieve connection states that allow for changes in the number of batteries connected in series with each other. For example, of the 16 battery cell units connecting the electronic assembly of this embodiment, at a particular time, the electronic components on the electronic assembly may be configured to allow 10 specific cell units to be electrically connected in series, while the remaining 6 cell units cannot be electrically connected in series with the 10 cell units. At another time, the electronic components on the electronic assembly may be configured to allow 9 cell units to be electrically connected in series, which can be a mixture of the previous 10 cell units and some of the previous 6 cell units, while the remaining 7 cell units cannot be electrically connected in series with the 9 cell units. In fact, the electronic components on the electronic assembly may be configured to enable a selected number and set of battery cell units to be connected in series, while other battery cell units connected to the electronic assembly cannot be electrically connected in series with the series-connected battery cell units, thus achieving different operating states.

[0100] Figure 4 shows an example of a battery system including an electronics assembly 100 with three battery modules (104a-f) and switching components (122-144) positioned for selective bypass of any one or more of those battery modules. Each battery module consists of two battery cell units connected in series. The electronics assembly has a predetermined geometric arrangement and / or combined thickness characteristics, and the switching components are configured as cell bypass switching electronics components. Furthermore, terminals are electrically coupled to the junction between the two energy storage units.

[0101] The battery system 100 includes a circuit module 102 for coupling multiple battery cell units 104. For illustrative purposes, the battery system 100 includes six battery cell units 104a, 104b, 104c, 104d, 104e, 104e, and 104f. However, any suitable number of battery cell units 104 can be used within the battery system 100. The battery system 100 includes battery pack terminals 101 and 103 for supplying electrical energy to an external load or receiving electrical energy from an external power source (not shown).

[0102] The circuit module 102 includes six sets of terminals 106-116 for coupling with the battery cell unit 104, each set of terminals having positive terminals 106a, 108a, 110a, 112a, 114a, 116a and corresponding negative terminals 106b, 108b, 110b, 112b, 114b, 116b. Each set of terminals 106-116 is configured to couple with the battery cell unit 104 (hereinafter referred to as the relevant battery cell unit 104). However, those skilled in the art will understand that any number of terminals and battery cell units can be used in the battery system 100 or any of the battery systems described herein without departing from the scope of the present invention.

[0103] In the battery system 100, the components of the circuit module 102 are arranged such that the positive terminals 106a, 110a, and 114a of one set of terminals are directly connected to the negative terminals 108b, 118b, and 116b of an adjacent set of terminals by conductors 118a to 118c.

[0104] The negative terminal 106b of terminal 106 of the first set is coupled to the switching assembly 120a.

[0105] The switching assembly 120a includes a first switch 122 for connecting the battery cell unit 104a to the circuit module 102 when closed, and a second switch 124 for bypassing the battery cell unit 104a when closed.

[0106] More specifically, the battery cell unit 104a is active or connected to the circuit module 102 when the first switch 122 is closed and the second switch 124 is open, and the battery cell unit 104a is inactive or bypassed from the circuit module 102 when the first switch 122 is open and the second switch 124 is closed.

[0107] Similarly, the positive terminal 108a of the second set of terminals 108 is coupled to the second switching assembly 120b. The switching assembly 120b includes a first switch 126 for connecting the battery cell unit 104b to the circuit module 102 when closed, and a second switch 128 for bypassing the battery cell unit 104b when closed. More specifically, the battery cell unit 104b is connected to the circuit module 102 when the first switch 126 is closed and the second switch 128 is open, and the battery cell unit 104b is bypassed from the circuit module 102 when the first switch 126 is open and the second switch 128 is closed.

[0108] Therefore, the current flowing through the battery cell unit 104a is controlled via switches 122 and 124. When switch 122 is closed and switch 124 is open, the current flowing between pack terminals 101 and 103 flows through switch 122 and the battery cell unit 104a. When switch 122 is open and switch 124 is closed, the current flowing between pack terminals 101 and 103 passes through switch 124 but not through the battery cell unit 104a. The other battery cell units 104b to 104f are controlled in a similar manner via their associated switch assemblies.

[0109] A circuit layout including two sets of terminals 106, 108 and associated switching assemblies 120a, 120b, respectively, forms a single circuit unit block 131a of the battery system 100. The battery system 100 includes two further circuit unit blocks 131b, 131c, arranged similarly to unit block 131a. The three circuit units 131a, 131b, and 131c are combined to form the entire system 100. However, it is understood that system 100 can include any appropriate number of unit blocks 311 to meet the energy storage requirements of a particular application at hand.

[0110] As explained, the positive terminal 106a of battery cell unit 104a is directly connected to the negative terminal 108b of battery cell unit 104b. By arranging the circuit in this way, switches 122, 124, 126, and 128 can be placed physically close to one side of battery cell units 104a and 104b without the need to extend the length of the current path between battery cell unit 104 and switches 122, 124, 126, and 128. This is advantageous as it reduces manufacturing costs, reduces the required space, and avoids energy loss caused by additional resistance and thus increased current path length.

[0111] However, in the battery system 100, the current passes through two switches 126 and 130 in order to connect the positive terminal 106a of battery cell unit 104a to the negative terminal 112b of 104d via battery cell units 104b and 104c. In this embodiment, if all six battery cell units 104a to 104f are carrying current, the current must also pass through switches 122, 126, 130, 134, 138, and 142. This corresponds to the current passing through one switch per cell unit, each having an on-resistance and associated energy loss.

[0112] The bypass switch arrangement shown in Figure 4 is illustrative, and other arrangements of cell and unit bypass switches are possible, which are configured and operable to bypass any one or more cell units. Further circuit examples are shown in U.S. Patent Publication No. 20190363311, U.S. Patent Publication No. 20200144830, and U.S. Patent No. 10573935, which are incorporated herein by reference.

[0113] Figure 5 shows a cross-section of an exemplary electronics assembly of Figures 1 and 3. The illustrated embodiment has four or more layers characterized from top to bottom by (1) a thin conductive layer (part of the flex circuit), (2) a thin nonconductive layer (part of the flex circuit), (3) a thin conductive layer (part of the flex circuit), and (4) a support layer (reinforcement). In this exemplary embodiment, the first to third layers form the electronics substrate, in particular the terminal coupling region of the substrate. The fourth layer is a support layer positioned adjacent to the region where the terminals contact the electronics substrate. (1) The thin conductive layer has the function of conducting electric current within the electronics assembly. (2) The thin nonconductive layer has the function of electrically insulating (1) the thin conductive layer and (3) the thin conductive layer at specific locations. (3) The thin conductive layer has the function of conducting electric current within the electronics assembly. (4) The thick support layer is conductive or nonconductive, or has a combination of conductive and nonconductive regions, and in some embodiments is intended to improve the mechanical rigidity of the electronics assembly. (4) If the support layer is conductive, the layer may also have the function of conducting electric current within the electronic assembly.

[0114] Figure 6 shows a detailed cross-sectional view of an exemplary embodiment of an electronics assembly with different layers. The electronics assembly has components and six layers, characterized from top to bottom in the following order: (1) a thin nonconductive layer ("PI-polyimide layer"), (2) a thin conductive layer, (3) a thin nonconductive layer ("PI layer"), (3) a thin conductive layer, (4) a thin nonconductive layer ("PI layer"), and (5) a thick support layer ("reinforcement"). The (1) thin nonconductive layer has the function of providing electrical insulation between the (2) thin conductive layer and the outside environment. The (2) thin conductive layer is configured to conduct electric current within the electronics assembly. The (3) thin nonconductive layer is configured to electrically insulate the (2) thin conductive layer and the (4) thin conductive layer region. The (4) thin conductive layer is configured to conduct electric current within the electronics assembly. The (5) thin nonconductive layer is configured to electrically insulate the (4) thin conductive layer from the surrounding environment. (6) The support layer may be conductive or non-conductive, or have a mixture of conductive and non-conductive regions, and may be configured to provide mechanical rigidity to the electronics assembly. This embodiment further includes electronic vias that form conductive vertical connections between two or more conductive layers. The vias may be numerous and / or large in size and / or dense in order to achieve a desired thermal conductivity between the two or more conductive layers, and may dissipate and effectively dissipate the thermal energy generated by any components connected to one of the conductive layers.

[0115] Figure 7 shows an exemplary embodiment of an electronics assembly having conductive and non-conductive layers, as well as a heat sink element. The heat sink element is configured to provide heat exchange between the electronics assembly and other media, such as ambient air, other gases, and / or liquid cooling systems, which may be integrated into the final application. In this embodiment, the heat sink element is made of aluminum and has no moving parts. In other embodiments, the heat sink element may be active and may include a fan or other moving parts. In some embodiments, the heat sink element may be made of other materials, such as materials suitable for high heat transfer.

[0116] In some embodiments, the heat sink element may include or be connected to heat pipes or other heat transfer devices.

[0117] In this embodiment, the support layer has a slit, and the heat sink element is connected to the electronics assembly through the slit on the opposite side of the electronic component. Alternatively, the heat sink element may be positioned on the same side as the electronic component, or on the same or opposite side of other potential heat sources.

[0118] Figure 8 shows an exemplary embodiment of an electronics assembly, Figure 9(A) shows a top isometric view of the assembly, and Figure 9(B) shows a bottom view of the assembly.

[0119] An exemplary embodiment in Figure 8 is an electronics assembly including an electronics substrate adapted to span across a plurality of terminals of an energy storage unit. The terminals are arranged in a predetermined geometric arrangement and constitute the primary path for current entering and leaving the energy storage unit. The electronics substrate includes a terminal coupling region configured as the primary path for current between the electronics substrate and the unit terminals, and a circuit region including at least a first conductive layer and a second nonconductive layer. At least a portion of the terminal coupling region and / or at least a portion of the circuit region are characterized by mechanical bending properties and / or combined thickness properties that allow at least some displacement from the predetermined geometric arrangement. The electronics substrate is a plurality of separate substrates arranged to span the geometric region defined by the unit terminals, or the separate substrates can be defined by separate sections of the substrate or by gaps between the substrates to define the substrate region between those gaps. Furthermore, one or more support layers are provided to the electronics substrate to increase the mechanical bending properties and / or combined thickness properties of the substrate in the region adjacent to the location of the support layers.

[0120] In some embodiments, the gap in the substrate spans one or more support layers. In this way, some mechanical displacement of the terminal coupling region is permitted, but the region of the substrate provided with the support layer has increased rigidity to support the application of individual components at that location on the substrate.

[0121] The electronics assembly is a double-layer electronics assembly adapted to mount on three battery cell units, each having one positive terminal and one negative terminal for connection to the electronics assembly. The electronics assembly includes one conductive layer adapted to support electronic components and a support layer that provides mechanical rigidity to the components and maintains spacing between different sections of the conductive layer. The layers of the assembly are characterized by the above-described bending measurements and / or combined thicknesses. The conductive layer of the electronics assembly is configured to conduct current within the electronics assembly and between it and the terminals. A rigid, non-conductive support layer is located beneath the conductive layer. The conductive layer has gaps that can be formed by slots or notches. The support layer is located beneath some or all of these gaps. In some embodiments, the support layer is configured to separate across different regions of the conductive layer. In some embodiments, the conductive layer has one or more gaps that one or more electronic components span.

[0122] Figure 10 shows a bottom view of another exemplary electronics assembly having conductive external regions 400a–400f including the terminal coupling region of this example. The electronics assembly is adapted to be mounted on two battery modules, each having two series battery cell units, with one positive terminal of one cell unit connected to the negative terminal of the other cell unit, and each sharing one connection point 402b, 402e to the substrate.

[0123] An exemplary embodiment includes one or more electronic substrates adapted to span across a plurality of terminals of an energy storage unit, the terminals arranged in a predetermined geometric arrangement and configured as primary paths for current entering and leaving the energy storage unit. The electronic substrate includes terminal coupling regions configured as primary paths for current between the electronic substrate and the unit terminals, and circuit regions including at least a first conductive layer and a second nonconductive layer. Furthermore, at least one of the terminal coupling regions includes a conductive segment, a segment configured as a measuring pad, and a segment configured as a primary current path.

[0124] Each of the terminal coupling regions 400a to 400f has segments 404a to 404f configured for measurement, which are electrically isolated from the other segments 402a to 402f of the terminal coupling region. In this example, the isolation is provided by the layout of the conductive layers of the electronics substrate. However, other exemplary embodiments use other methods of segmenting the terminal coupling region, for example, by providing a physical gap in the electronics substrate at the location of the terminal coupling region.

[0125] Each of the separate measurement segments 404a–404f defines a measurement pad. When not connected to a battery cell unit, the measurement pad is isolated from the other segments of the terminal coupling area. In the illustrated example, the large conductive areas 402a–402f of each terminal area are configured to allow the main current to flow between the electronics assembly and the connected battery cell unit, while the smaller conductive areas 404a–404f near each terminal can be used for voltage and / or temperature measurement.

[0126] By separating the contact regions 402a-402f through which the main current flow passes from the measurement contact regions 404a-404f, it is possible to perform more accurate measurements of cell unit voltage and / or cell unit temperature. In some embodiments, it is possible to perform two or more cell unit voltage measurements, including at least one in the region through which the main current flow 402a-402f passes and another in the region separated from the main current flow 404a-404f. A comparison of such two measurements, including while the battery cell unit is under load, can provide a measurement of contact resistance.

[0127] The terminal coupling region also includes openings 408a to 408f configured to allow fastening devices to pass through, mechanically securing the terminal coupling region and the electronics substrate to the cell terminals.

[0128] In some embodiments, the terminal coupling region has an exposed area of ​​conductive material near the terminal mounting point, which further includes vias that form a conductive vertical connection between two or more conductive layers. In some embodiments, the number of vias in the electronics assembly can be up to 1, 5, 10, 1000, or 10000, or a different number. In some embodiments, some regions are up to 1 / cm 2 , 10 / cm 2 , 100 / cm 2 , 1000 / cm 2 It may have vias of a certain density, or vias of different spatial densities.

[0129] This embodiment also shows connectors 410a to 410b configured to allow connection to other electronic boards, one or more power supplies, electrical loads, inverter circuits such as h-bridge circuits, or other circuits or external devices.

[0130] Figure 11 shows another exemplary embodiment of the electronics assembly. The assembly has a single electronics board 500 adapted to span the geometric positions of many cell terminals, which are shown here as eight battery modules, each having two series battery cell units, with one positive terminal of one cell unit connected to the negative terminal of another cell unit, sharing one connection point to the board.

[0131] The electronics assembly has a fastener retainer 510 adapted to hold fasteners used to mount the substrate in place, even when not fixed to the cell module. This has several advantages, including facilitating disassembly and reassembly of the electronics assembly into modules. The fasteners provide the additional function of substantially including, and thus limiting, the risk of external contact with exposed conductive materials, such as that associated with any part of the fastener assembly. In this embodiment, the retainer 510 is a plastic cage around the bolts, which are clipped into slits on the substrate. In other embodiments, other captive fastener devices may be used for a similar purpose.

[0132] The illustrated assembly further includes optional recesses arranged to segment the terminal coupling region, as will be further described with reference to Figures 12 to 14 below.

[0133] An exemplary embodiment in Figure 11 is an electronics assembly comprising one or more electronics substrates adapted to span across a plurality of terminals of an energy storage unit, the terminals arranged in a predetermined geometric arrangement and configured as primary paths for current entering and leaving the energy storage unit. The electronics substrates include terminal coupling regions configured as primary paths for current between the electronics substrates and the unit terminals, and circuit regions comprising at least a first conductive layer and a second nonconductive layer. Furthermore, a fastener retaining cage is adapted to align and maintain one or more fasteners with the terminal coupling regions.

[0134] Figure 12 shows an exemplary electronics assembly, particularly a magnified view of the terminal coupling region. The terminal coupling region has an opening that allows fasteners to pass through and connect the assembly to the terminals of at least one battery cell unit. In this embodiment, the fasteners, such as bolts, nuts, and / or washers used, are conductive and can conduct current between the electronics assembly and one or more battery cell units. However, in various embodiments, the fasteners can be nonconductive, and the main current is carried by contact between the conductive region between the substrate and the cell unit, or by other means such as other conductive material between them.

[0135] As in the embodiments described above, the electronics assembly has areas of metal exposed in close proximity to the opening to create low-resistance contact with adjacent battery cell unit terminals, nuts, bolts, and / or washers.

[0136] The terminal coupling region includes conductive pads segmented by the placement of physical slits on all layers of the electronics assembly. However, in various embodiments, the slits may be applied to some, but not all, layers of the electronics assembly. A first type of slit connects to a hole and extends diagonally outward. These slits can provide additional mechanical flexibility when connecting to one or more terminals of one or more battery cell units that can or cannot be adequately aligned. These slits can also create two or more areas of exposed metal that are electrically insulated from each other when not connected to a battery cell unit. One or more such areas can be used to allow main current flow between the electronics assembly and the connected battery cell unit. One or more other such areas can be used for measuring pads for voltage and / or temperature measurement. Separating the contact area through which the main current flow passes from the measuring contact area can enable more accurate measurements of voltage and temperature of the cell unit.

[0137] In some embodiments, the notch is defined by a slit positioned to create a narrowed conductive trace in the first conductive layer. The narrowed trace is intentionally weakened by this narrowed, or relatively narrowed, dimension, thereby defining the fuseable circuit described above. The fuse is ideally positioned between one or more connection points with battery cell units and one or more other connection points with one or more battery cell units, optional electronic components, a power supply, and / or an electrical load. These intentionally weak traces may be designed to react, particularly at high currents, such that one or more layers of material melt or otherwise the electrical conductivity of the trace connection is significantly or completely reduced. This allows the electronic assembly of this embodiment to integrate the function otherwise provided by the fuse component and avoid the cost of the associated component. The material of some layers, such as a non-conductive layer, may be selected to have a high melting point so as to prevent the molten conductive material from being released from the electronic substrate.

[0138] In some embodiments, the notches are positioned to reduce thermal conductivity between an electronic assembly and other areas of the electronic assembly at connection points to one or more cell units. For example, this can reduce thermal conductivity between the connection points of the battery cell units and electronic components connected to an electronic assembly that may exhibit a certain level of heating during operation. As a result, this may reduce the thermal energy transferred to the connected battery cell units, thereby potentially extending the lifespan of such battery cell units. This may also reduce the thermal energy transferred to one or more temperature sensors located at or near the battery cell unit connection points, thereby potentially allowing the temperature sensors to measure a temperature that may be more similar to the internal temperature of the battery cell units.

[0139] An exemplary embodiment in Figure 12 is an electronics assembly comprising one or more electronics substrates adapted to span across a plurality of terminals of an energy storage unit, the terminals arranged in a predetermined geometric arrangement and configured as primary paths for current entering and leaving the energy storage unit. The electronics substrate comprises terminal coupling regions configured as primary paths for current between the electronics substrate and the unit terminals, and circuit regions comprising at least a first conductive layer and a second nonconductive layer. At least one of the terminal coupling regions comprises a conductive segment, a segment configured as a measuring pad, and a segment configured as a primary current path, the conductive segment being defined by one or more notches having depth or at least a first conductive layer.

[0140] In some embodiments, the notch is configured to define the above-mentioned measure of mechanical bending properties. In some embodiments, the electronic substrate includes a heat-generating component, and the notch is positioned between the heat-generating component and the terminal coupling region to limit the transfer of thermal energy between the heat-generating component and the terminal coupling region.

[0141] Figure 13 shows an exemplary electronics circuit assembly for placement on a circuit board. The assembly has a predetermined geometric arrangement and / or combined thickness characteristics to be optimized for the placement of connected cells. The circuit also has electronic components in the form of switching components S1-S6 placed within the primary current paths of cells C1-C3. The circuit also further includes fusible circuits F1-F3. Each fusible circuit protects against short circuits in the event of failure or malfunction of one or more switching components. For example, if switch component S1 fails to short circuit and switch component S2 closes, the short circuit seen by cell unit C1 will be prevented by fusible circuit F1. In this example, the fusible circuits are connected to the bypass paths of cell unit C1.

[0142] Figure 14 shows an exemplary electronic circuit for implementation in one of the described electronic assemblies having a predetermined geometric arrangement and / or combined thickness characteristics. The assembly has terminals electrically coupled at the junction between two energy storage units. A fusible circuit F1 is connected to a terminal coupled between the junction between cell units C1 and C2. In this example, only one fusible circuit is needed to protect from a short circuit in the event of a closed-circuit failure in the switching component of either of the two cell units. For example, if switch component S1 fails to short-circuit and switch component S2 closes, the short circuit seen by cell unit C1 will be prevented by the fusible circuit F1. In another scenario, if switch component S3 fails to short-circuit and switch component S4 closes, the short circuit seen by cell unit C2 will be prevented by the fusible circuit F1. This electronic assembly may have the advantage of requiring fewer fusible circuits than an electronic assembly with one or more fusible circuits per cell unit, which may reduce component costs. This circuit may have the advantage of not including any circuits that can be interrupted in the current flow when all cell units are connected, potentially improving efficiency. Furthermore, this circuit may have the advantage of not including any circuits that can be interrupted in the current flow when all cell units are bypassed, avoiding an increase in resistance in the bypass path.

[0143] In some embodiments, which may have one, two, or more cells tightly connected in series, and switching components for selectively bypassing and reversibly disconnecting one or more cell units, there is at least one bluntable circuit for each cell unit. In some embodiments, the bluntable circuit for each cell unit is located in the bypass path of the battery cell unit, which may have the advantage of reducing losses in the electronic assembly when the battery cell units are connected in series. In other embodiments, this bluntable cell circuit is located directly in series with the battery cell unit, which may have the advantage of reducing losses in the electronic assembly when the battery cell unit is bypassed.

[0144] Figure 15 shows a top view of an exemplary embodiment of an electronics assembly in which a single electronics substrate is fitted to span across multiple cell unit terminals. In particular, five battery cell units each have one positive and one negative connection point to the electronics assembly. In this embodiment, the electronics assembly has a conductive terminal coupling region with an area (illustrated to have a circular shape, but can be square or any other shape) intended to create welded connections to one or more terminals of the battery cell units. This can be achieved, for example, by capacitive discharge resistance welding, laser welding, or ultrasonic welding, and separate tab conductors may be used further as part of the connection.

[0145] In this exemplary embodiment, the terminal coupling region is defined by slits near the connection point. In this embodiment, these slits are straight lines on three planes of the connection that pass through all layers of the electronic assembly. However, in various embodiments, the slits can be implemented as curves or entirely or partially along any number of planes, e.g., two planes. These slits function to concentrate the mechanical stresses imposed on the assembly by the movement and / or displacement of the cell unit into a region of the substrate located between the edges of the slits. That region of the substrate acts as a hinge or otherwise provides additional mechanical flexibility when connecting to the battery cell unit.

[0146] An exemplary embodiment in Figure 15 is an electronic assembly comprising one or more electronic substrates adapted to span across a plurality of terminals of an energy storage unit, the terminals arranged in a predetermined geometric arrangement and configured as primary paths for current entering and leaving the energy storage unit. The electronic substrates include terminal coupling regions configured as primary paths for current between the electronic substrate and the unit terminals, and circuit regions comprising at least a first conductive layer and a second nonconductive layer. Furthermore, at least one of the terminal coupling regions is defined by arranging one or more notches in one or more electronic substrates to define mounting regions for the terminal coupling region and the circuit region of the substrate, where the mounting regions define the mechanical bending properties and / or combined thickness properties of the substrate.

[0147] Figure 16 shows an example of an electronic circuit for implementation in any electronic assembly having a predetermined geometric arrangement and / or combined thickness characteristics, the circuit including electronic components in the form of switch components attached to four battery cell units, each having one positive terminal and one negative terminal, each connected directly or via the circuit to the electronic assembly. The switch components are operable to selectively bypass and reversibly disconnect one or more energy storage units. For example, when switch components S1, S3, S5, and S7 are closed and all other switches are open, switch components S1, S3, S5, and S7 are positioned in the primary current path, and cell units C1-C4 are electrically connected in series with each other and with the illustrated circuit output terminals. Subsequently, when switch component S1 is opened and switch component S2 is closed, switch component S2 is positioned in the primary current path, and cell unit C1 is selectively bypassed and reversibly disconnected from its series connection with the other cell units and outputs. Similarly, each of the cell units C2-C4 can be selectively bypassed and reversibly disconnected by opening and closing the corresponding switch. Multiple cell units can be selectively disconnected from the configuration at once.

[0148] Figure 17 shows an isometric bottom view of an exemplary embodiment of the bottom of an electronics assembly having one or more notches in one or more layers within the region where one or more cell units connect to the electronics assembly. These notches can be applied to layers containing relatively rigid layers. When notches are present in relatively rigid layers, this may allow the electronics assembly to have additional mechanical flexibility near the connection points to the battery cell units. This may allow the electronics assembly to connect to one or more battery cell units with connection points that may move or not be adequately aligned in one plane without generating excessive stress on the electronics assembly or any selected electronic components or elements.

[0149] The additional mechanical flexibility allows the electronics assembly to better shape the contacts of the connected cell units, potentially reducing electrical contact resistance and improving operational efficiency. It can also enable the electronics assembly to conform to the shape and contours of the battery module, including accommodating any raised or other elevated portions of the battery module that may be raised compared to the plane of the cell unit connection points. Further utilization of the mechanical flexibility of the electronics substrate can increase the surface area of ​​the electronics substrate between two fixed points by roughly forming a waveform, such as a square wave or sine wave, which can then be used to enable the integration of additional electronic components and / or increase heat dissipation. Furthermore, the additional mechanical flexibility can also dampen vibrations between the connected cell units and the electronics assembly, for example.

[0150] This embodiment may have four or more layers, which can be characterized from top to bottom in the following order: (1) a flexible conductive layer, (2) a flexible nonconductive layer, (3) a flexible conductive layer, and (4) a high-rigidity layer. In some embodiments, there may be an additional flexible nonconductive layer between (3) the flexible conductive layer and (4) the high-rigidity layer. In some embodiments, there may be an additional flexible nonconductive layer on top of (1) the flexible conductive layer.

[0151] In some embodiments, one or more flexible conductive layers may include aluminum or copper. In some embodiments, one or more flexible nonconductive layers may include polyimide, Kapton tape, polyethylene terephthalate, or polyethylene naphthalate. In some embodiments, one or more high-rigidity layers may include glass-reinforced epoxy laminate or aluminum.

[0152] Figure 18 shows a bottom view of another exemplary embodiment of an electronics assembly with notches at the mounting points to the cell units. The electronics assembly also has notches in one or more areas other than the connection points to the cell units. These areas may align at least two battery modules with adjacent planes. These notches may be applied to layers containing relatively rigid layers, such that all remaining layers within the area of ​​the notches can be relatively flexible layers. If one or more notches are in the relatively rigid layers and these notches align the two battery modules with adjacent planes, this provides the electronics assembly with additional mechanical flexibility, allowing for stress-free connection of two battery modules that may have some misalignment in one or more directions.

[0153] In some embodiments, the flexible layer is mounted with Kapton or polyimide tape and spans the assembly. The flexible layer is laminated with a relatively rigid layer of the electronic substrate to define the support area. The flexibility can be defined such that all combinations of layers present in one or more locations are defined by the mechanical bending properties described above.

[0154] Figure 19 shows an exemplary embodiment of an electronics assembly which is a six-layer electronics substrate laminate, the substrate also supporting electronic components. The layers are characterized in the following order from top to bottom: (1) a flexible, thin nonconductive layer ("PI-polyimide layer"), (2) a flexible, thin conductive layer, (3) a flexible, thin nonconductive layer ("PI layer"), (4) a support layer, (5) a flexible, thin conductive layer, and (6) a thin nonconductive layer ("solder mask").

[0155] (1) A thin non-conductive layer may have the function of providing electrical insulation between (2) a thin conductive layer and the outside environment. (2) A thin conductive layer may have the function of conducting electric current within the electronics assembly. (3) A thin non-conductive layer may have the function of providing electrical insulation between (2) a thin conductive layer and the outside environment, especially in areas where (4) a support layer is absent. (4) A support layer may be conductive or non-conductive, or have a mixture of conductive and non-conductive regions, and may have the function of providing mechanical rigidity to the electronics assembly. If the support layer is conductive, it may have the function of conducting electric current or improving heat transfer from or between (2) a thin conductive layer, (5) a conductive layer, and / or the outside environment. (5) A conductive layer may have the function of conducting electric current within the electronics assembly. (6) A non-conductive layer may have the function of providing electrical insulation between (5) a conductive layer and the environment.

[0156] In various embodiments, there may be two or more support layers. In other embodiments, there may be three, four, or more conductive layers, which may be thin or not and / or flexible or not. In some embodiments, there may be layers of adhesive material such as adhesive, resin, and / or reinforcing material such as fiberglass cloth, which may increase the adhesion between different layers.

[0157] As described above, while specific embodiments have been described herein for illustrative purposes, it will be understood that various modifications can be made without departing from the spirit and scope of the invention. Therefore, the invention is not limited except by the appended claims and the elements described therein. Furthermore, while specific embodiments of the invention are presented below in specific claim forms, various embodiments of the invention can be conceived by the inventors in any available claim form.

Claims

1. An energy storage unit equipped with connection terminals, It comprises one or more electronic substrates. An electronics assembly, The one or more electronic substrates are Terminal coupling regions arranged in a predetermined geometric arrangement and adapted to be connected to the connection terminals of the energy storage unit, A circuit region comprising at least a first conductive layer and a second nonconductive layer, Two or more electronic components arranged and connected to the conductive layer within the circuit region Equipped with, The at least one circuit region forms a primary path for current between two terminal coupling regions that form at least two energy storage units connected in series. The terminal coupling region further comprises a plurality of conductive segments, wherein there are conductive segments configured to be connected to a voltage sensor configured to measure the voltage of the terminal coupling region, and the other conductive segments form part of the primary current path. At least one of the electronic components is a switch component located in the primary path of the current between two series-connected energy storage units, and is configured to reversibly disconnect the series connection based on the voltage in the terminal coupling region. At least one of the electronic components is a switch component located in the primary path of the current, and is configured to selectively bypass the energy storage units from the series connection of two energy storage units connected in series. At least a portion of the terminal coupling region, and At least a portion of the circuit region Either or both of the following: Mechanical bending properties, or Thickness characteristics combined with mechanical bending properties Electronic assemblies characterized by...

2. The electronics assembly according to claim 1, wherein the terminal coupling region of the electronics substrate includes at least three terminal coupling regions adapted to span between the cell terminals of three or more energy storage units in the geometric arrangement.

3. The electronic assembly according to claim 1 or 2, wherein at least one of the electronic components is a DC / DC converter element.

4. The electronics assembly according to any one of claims 1 to 3, wherein at least one of the terminal coupling regions is electrically coupled to one or more junctions between two series-connected energy storage units.

5. The electronics assembly according to any one of claims 1 to 4, wherein at least one of the multiple energy storage units has a charging capacity of at least 20 ampere-hours.

6. At least one of the terminal coupling regions, and at least one of the circuit regions The electronics assembly according to any one of claims 1 to 5, wherein at least one of further comprises a layer of elastically deformable material.

7. At least one of the terminal coupling regions, and at least one of the circuit regions An electronics assembly according to any one of claims 1 to 6, wherein either or both of the above further comprises at least two conductive layers separated by at least one nonconductive layer, and one or more vias extending between the at least two conductive layers.

8. The electronics assembly according to any one of claims 1 to 7, wherein at least one of the circuit regions further comprises a layer continuous with at least one of the terminal coupling regions.

9. At least one of the circuit regions further comprises one or more support layers, thereby, within the circuit region adjacent to the one or more support layers The aforementioned mechanical bending properties, and Thickness characteristics combined with the aforementioned mechanical bending characteristics An electronics assembly according to any one of claims 1 to 8, wherein at least one of the above is modified.

10. The electronics assembly according to claim 9, wherein the one or more support layers are continuous with at least one of the circuit region and the terminal coupling region of the electronics substrate.

11. The electronics assembly according to any one of claims 1 to 10, wherein the terminal coupling region is configured to be coupled to the terminal of one storage unit by fasteners, fusion, or welding.

12. The electronics assembly according to any one of claims 1 to 11, wherein the terminal coupling region further comprises a temperature sensor configured to measure the temperature of the assembly adjacent to the terminal.

13. The support layer is disposed between at least some of the plurality of conductive segments in the terminal coupling region, one or more slit, ridge, opening, and recess An electronics assembly according to any one of claims 1 to 12, comprising at least one of the following:

14. One or more layers are arranged adjacent to the terminal coupling region. slit, Raised portion, opening, and recess An electronics assembly according to any one of claims 1 to 13, comprising at least one of the following:

15. The terminal region includes a conductive pad segmented by a plurality of non-conductive regions, and at least some of the non-conductive regions are one or more slit, ridge, opening, and recess An electronics assembly according to any one of claims 1 to 14, comprising at least one of the following:

16. The electronics assembly according to any one of claims 1 to 15, wherein the primary current path further includes one or more fuseable circuits arranged to connect at least one of the terminal coupling regions to at least one of the circuit region and other terminal coupling regions.

17. The electronics assembly according to claim 16, wherein the one or more fuseable circuits include printed conductive tracks having geometric constraints configured to break when the current exceeds 1,000 amperes.

18. The electronics assembly according to any one of claims 1 to 17, wherein the electronics substrate comprises polyimide, Kapton, polyethylene terephthalate, or polyethylene naphthalate.

19. The electronics assembly according to any one of claims 1 to 18, further comprising one or more restraining fastener structures for maintaining a bolt in a predetermined position when it is not fastened in relation to the electronics assembly and at least one of one or more energy storage units.

20. The aforementioned bending characteristics are a) The electronics assembly has a flexural modulus of less than 12 GPa at room temperature. b) The electronics assembly has a flexural modulus of 6 GPa at room temperature. c) The material in one or more nonconductive layers has a flexural modulus of less than 10 GPa at room temperature. d) The material in one or more nonconductive layers has a flexural modulus of 3 GPa at room temperature. e) The electronics assembly has a bending strength of less than 300 MPa at room temperature. f) The electronics assembly has a bending strength of 150 MPa at room temperature. g) The material of the one or more nonconductive layers has a bending strength of less than 300 MPa at room temperature, and h) The material of the one or more nonconductive layers has a bending strength of less than 150 MPa at room temperature. An electronics assembly according to any one of claims 1 to 19, specified as at least one of the following.

21. The aforementioned combined thickness characteristics are i) One or more support layers having a thickness of 1 mm, j) One or more support layers exceeding 0.4 mm, k) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of up to 0.4 mm, l) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of up to 0.2 mm, m) One or more thin non-conductive layers and one or more conductive layers having a combined thickness of 0.1 mm, n) A first non-conductive layer having a maximum thickness of 0.08 mm, and o) A first nonconductive layer having a maximum thickness of 0.02 mm An electronics assembly according to any one of claims 1 to 20, as specified by at least one of the following.

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