Method for removing a support plate and method for processing a plate-shaped member

A method using UV curing and laser void formation on the adhesive layer allows for the removal of a support plate from a thinned wafer with minimal force and cost, addressing the challenge of wafer damage and material expense in existing methods.

JP7868967B2Active Publication Date: 2026-06-02DISCO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DISCO CORP
Filing Date
2021-12-03
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

The challenge of removing a support plate from a thinned wafer without damaging it, while avoiding the use of costly special materials in the adhesive layer, is addressed.

Method used

A method involving a curing step with ultraviolet light followed by a laser beam irradiation to form voids in the adhesive layer, allowing the support plate to be peeled off with minimal force without increasing the adhesive layer's cost.

Benefits of technology

The method effectively reduces the adhesion between the support plate and the adhesive layer using laser-formed voids, enabling the support plate to be removed with little force and without additional material costs.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a method for removing a support plate, capable of removing the support plate with small force without increasing cost required for an adhesive layer.SOLUTION: A method for removing a support plate includes: a curing step of curing a curing material of an adhesive layer by irradiating, with an ultraviolet ray from the support plate side, the adhesive layer that contains the uncured curing material that cures when irradiated with the ultraviolet ray and adheres the support plate that transmits the ultraviolet ray to a plate-like member; after the curing step, a hole forming step of irradiating the adhesive layer from the support plate side with a laser beam having a wavelength that passes through the support plate and is absorbed by the curing material, and thereby forming a plurality of holes in a surface of the adhesive layer that is in contact with the support plate; and after the hole forming step, a support plate removing step of removing the support plate from the adhesive layer adhered to the plate-like member by peeling off the support plate from the adhesive layer along the surface on which the plurality of holes is formed.SELECTED DRAWING: Figure 7
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