Thermal flow sensor with a heat-conducting frame element in the shape of a printed circuit board (PCB)
The PCB-based thermal flow sensor addresses thermal unpredictability and space constraints by enhancing conductivity and simplifying assembly, resulting in faster stabilization and improved accuracy.
JP7869194B2Active Publication Date: 2026-06-02ベルキンビーブイ
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ベルキンビーブイ
- Filing Date
- 2021-07-22
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
Existing thermal flow sensors face challenges with unpredictable thermal behavior, significant 'delay effect' at low flow rates, require excessive assembly steps, and occupy too much space due to complex manufacturing processes.
Method used
A thermal flow sensor utilizing a heat conduction frame element in the form of a printed circuit board (PCB) that provides improved thermal conductivity, reduces assembly steps, and optimizes space usage.
Benefits of technology
The PCB-based thermal flow sensor achieves faster temperature stabilization, higher accuracy, and reduced manufacturing time with fewer assembly errors, while minimizing space requirements.
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Smart Images
Figure 0007869194000001 
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Abstract
The present invention relates to a thermal flow sensor (1) for a flow meter. The thermal flow sensor (1) comprises a main channel portion (3b), a sensor tube (4), and a thermally conductive frame element (13). The main channel portion (3b) comprises a main channel (3) for a medium whose flow rate is to be determined. The sensor tube (4) comprises a first tube portion (5) with an inlet (6) fluidly connected to the main channel (3), a second tube portion (8) with an outlet (9) fluidly connected to the main channel (3) on the opposite side of the inlet (6), a sensing portion (11) connected to the first tube portion (5) and the second tube portion (8) so that the fluid flows from the inlet (6) to the outlet (9) through the sensor tube (4), and at least two sensing heating elements (12) for measuring a temperature or power difference within the sensor tube (4) to determine the flow rate. A thermally conductive frame element (13) contacts the first tube portion (5), the second tube portion (8) and the main channel portion (3b) to equalize the temperature gradient across the first tube portion (5), the second tube portion (8) and the main channel portion (3b). The thermally conductive frame element 13 is a printed circuit board (PCB) 14.
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