Photosensitive resin composition
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- AJINOMOTO CO INC
- Filing Date
- 2023-06-07
- Publication Date
- 2026-06-09
AI Technical Summary
【0009】 本発明によれば、屈曲性及び絶縁性に優れる硬化物を得ることができ、解像性に優れる感光性樹脂組成物;当該感光性樹脂組成物を用いて得られる、感光性フィルム、支持体付き感光性フィルム、プリント配線板、及び半導体装置を提供することができる。
Smart Images
Figure 0007871744000001 
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Abstract
Claims
1. (A) A resin containing an ethylenically unsaturated group and a carboxyl group, (B) Epoxy resin, (C) Photopolymerizable monomer, and (D) A photosensitive resin composition containing a photopolymerization initiator, (A) Component comprises either an acid-modified naphthalene skeleton-containing epoxy (meth)acrylate or an acid-modified bisphenol skeleton-containing epoxy (meth)acrylate, (B) Component contains an aromatic epoxy resin, A photosensitive resin composition in which any of component (A), component (B), and component (C) contains an alkylene oxide chain represented by the following formula (a) (provided that the alkylene oxide chain is included in at least component (A) and / or component (B)), and the parameter X represented by the following formula (1) is 4 or more and 25 or less. 【number】 In formula (a), each R independently represents an alkylene group having 1 to 6 carbon atoms, and q represents an integer from 2 to 100. [Math 1] In formula (1), M ＡＯ If the component containing the alkylene oxide chain is a copolymer, n represents the value shown in formula (2) below, or if the component containing the alkylene oxide chain is not a copolymer, it represents (molecular weight of the alkylene oxide chain of each compound contained in components (A) to (C)) / (molecular weight of each compound contained in components (A) to (C)). N represents the solid content (parts by mass) of all compounds contained in components (A) to (C), and n represents the solid content (parts by mass) of each compound contained in components (A) to (C). [Math 2] In formula (2), A ＡＯ A represents the molecular weight of the alkylene oxide chain of each monomer containing the alkylene oxide chain, B represents the molecular weight of each monomer containing the alkylene oxide chain, and ＡＯ ∫ represents the number of moles of each monomer containing the alkylene oxide chain, and B represents the total number of moles of all monomers contained in the copolymer.
2. The alkylene oxide chain is (A) Component and (B) component, (A) Component and (C) component, (B) Component and (C) component are included, or (A) component, (B) component and (C) component include, The photosensitive resin composition according to claim 1.
3. Furthermore, the photosensitive resin composition according to claim 1 or 2, further comprising (E) an inorganic filler.
4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the acid-modified bisphenol skeleton-containing epoxy (meth)acrylate has either a bisphenol A skeleton or a bisphenol F skeleton.
5. (B) The photosensitive resin composition according to any one of claims 1 to 4, wherein component (B) has a biphenyl skeleton.
6. The photosensitive resin composition according to any one of claims 1 to 5, wherein component (D) contains an oxime ester-based photopolymerization initiator.
7. A photosensitive film containing the photosensitive resin composition according to any one of claims 1 to 6.
8. A photosensitive film with a support, comprising a support and a photosensitive resin composition layer provided on the support, the layer comprising the photosensitive resin composition according to any one of claims 1 to 6.
9. A printed circuit board comprising an insulating layer formed from a cured product of a photosensitive resin composition according to any one of claims 1 to 6.
10. The printed circuit board according to claim 9, wherein the insulating layer is solder resist.
11. A semiconductor device comprising a printed circuit board according to claim 9 or 10.